Lens driving mechanism

Abstract

The utility model belongs to the technical field of optical element driving, and specifically relates to a lens driving mechanism comprising a pedestal provided with an avoiding groove used for avoiding an OIS sensing chip; the frame is suspended above the base, and the frame is arranged to be capable of moving in the first direction or the second direction relative to the base; the circuit board is stacked on the top surface of the base and located below the frame, an OIS capacitor structure is arranged between the circuit board and the frame, an OIS sensing chip connected with the OIS capacitor structure is arranged at the bottom end of the circuit board, and the OIS sensing chip is located in the receding groove. According to the utility model, under the condition that a capacitor structure is adopted between the circuit board and the frame to replace a position sensor design in the prior art, the OIS sensing chip is embedded in the avoiding groove of the base, so that the thickness between the circuit board and the base is reduced, and the overall thickness of the lens driving mechanism is further reduced.

Description

Lens drive mechanism Technical Field

[0001] This utility model belongs to the field of optical element driving technology, specifically relating to a lens driving mechanism. Background Technology

[0002] In recent years, with the development of technology, many electronic devices now have the function of taking pictures or recording videos. The use of these electronic devices is becoming more and more common, and they are developing towards a more convenient and thinner design to provide users with more choices.

[0003] In practice, in order to adapt to various shooting scenarios, the lens needs to be constantly focused. In existing technologies, a lens drive mechanism is generally used to drive the lens to move along the optical axis to adjust the focal length.

[0004] In the prior art, the lens drive mechanism includes a frame, a carrier, an upper spring, a lower spring, and a base. The carrier, equipped with a coil, is movably mounted within the frame and is used to mount the lens. The upper spring is elastic and connects to the top of both the frame and the carrier. Similarly, the lower spring is elastic and connects to the bottom of both the carrier and the frame. The upper and lower springs movably connect the carrier within the frame. The frame is movably mounted above the base via multiple suspension wires and can move along a direction perpendicular to the optical axis of the lens to prevent lens shake. The carrier, mounted within the frame, can move along the optical axis of the lens to adjust the lens focal length.

[0005] However, to precisely control the movement of the carrier or frame, it is also necessary to sense the specific position of the carrier and frame in real time. In existing technologies, Hall effect sensors are generally used to sense the position of the carrier or frame. However, Hall effect sensors are relatively large, which affects the slim design of the lens drive mechanism, and the detection results are unstable, failing to meet market demands. Therefore, how to achieve three-axis motion while simultaneously achieving a slim design of the lens drive mechanism is one of the issues that needs attention. Summary of the Invention

[0006] The present invention addresses the aforementioned technical problems by providing a lens driving mechanism.

[0007] A lens driving mechanism, the lens driving mechanism comprising:

[0008] A base, wherein the base is provided with a clearance groove for avoiding the OIS sensing chip;

[0009] A frame, which is suspended above the base, is configured to move relative to the base in a first direction or a second direction;

[0010] A circuit board is stacked on the top surface of the base and located below the frame. An OIS capacitor structure is provided between the circuit board and the frame. An OIS sensing chip connected to the OIS capacitor structure is provided at the bottom of the circuit board. The OIS sensing chip is located in the clearance groove.

[0011] Optionally, the base area below the clearance groove is a clearance groove area without an internal circuit structure.

[0012] Optionally, the lens driving mechanism further includes:

[0013] A carrier located within the frame and configured to move relative to the frame in a third direction;

[0014] Four upper springs are respectively connected around the top of the frame and the top of the carrier. The four upper springs are connected by upper spring cut-off portions that are cut off after installation, so that the four upper springs form a four-corner spring structure.

[0015] Optionally, a receiving groove is provided on one side of the top surface of the frame, and AF sensing plates are provided on the two opposite side walls of the receiving groove;

[0016] The lens driving mechanism also includes:

[0017] A carrier is located within the frame and is configured to move relative to the frame in a third direction. The carrier contains a built-in metal, on which an AF electrode plate is disposed. The AF electrode plate extends out of one side of the carrier and is bent and inserted between two AF sensing plates in the receiving groove. The AF electrode plate and the two AF sensing plates form an AF capacitor structure.

[0018] Optionally, the frame has an internal metal frame, which is connected to the two AF sensing plates respectively.

[0019] Optionally, a power-conducting protective plate is also provided within the frame, and the power-conducting protective plate is disposed on the outside of the two AF sensing plates.

[0020] Optionally, the frame is further provided with an AF sensing chip, which is electrically connected to the two AF sensing plates respectively, and the AF sensing chip is used to monitor the capacitance value of the first capacitor structure.

[0021] Optionally, an X-axis electrode plate and a Y-axis electrode plate are respectively disposed within the frame and are located on the bottom surface of the frame;

[0022] The circuit board is provided with an X-axis sensing plate and a Y-axis sensing plate, which are respectively arranged corresponding to the X-axis electrode plate and the Y-axis electrode plate to form the OIS capacitor structure. The OIS sensing chip is electrically connected to the X-axis sensing plate and the Y-axis sensing plate respectively.

[0023] Optionally, the circuit board further includes a substrate, with the X-axis sensing plate and the Y-axis sensing plate disposed at the top of the substrate, and the OIS sensing chip disposed at the bottom of the substrate.

[0024] Optionally, the circuit board is provided with a plurality of OIS coils, and the frame is provided with a plurality of magnets. Each magnet is arranged opposite to a corresponding OIS coil, and after the OIS coil is energized, the frame can move relative to the base in a first direction or a second direction.

[0025] Several of the OIS coils are arranged around or away from the substrate.

[0026] Optionally, the base is provided with a built-in power circuit, and the bottom of the circuit board is provided with one or more power points. The circuit board is electrically connected to the built-in power circuit through the power points, and transmits the current provided by the built-in power circuit to the X-axis sensing plate, the Y-axis sensing plate, and the OIS coil through the power points.

[0027] Optionally, the frame is provided with a frame-in-metal structure, which is connected to the X-axis electrode plate and the Y-axis electrode plate respectively.

[0028] Optionally, the frame is provided with a frame-integrated metal, which is respectively connected to the two AF sensing plates, the X-axis electrode plate, and the Y-axis electrode plate.

[0029] Optionally, the lens driving mechanism further includes:

[0030] A plurality of upper springs are respectively connected between the top end of the frame and the top end of the carrier, wherein three of the upper springs are independently electrically connected to the built-in metal of the carrier, the built-in metal of the frame, and the electrically conductive protective plate.

[0031] Several energized rods extend in a third direction and their bottom ends are connected to the base and electrically connected to the base's built-in power lines. The top end of each energized rod is connected to a corresponding upper spring. The frame and the carrier are suspended above the base by the several energized rods. The current provided by the base's built-in power lines is transmitted through three independent upper springs to the AF electrode plate, the frame's built-in metal, and the energized protective plate, respectively.

[0032] Beneficial effects: This utility model has at least one or more of the following advantages:

[0033] 1. In this utility model, a capacitor structure is used between the circuit board and the frame to replace the position sensor design in the prior art. The OIS sensing chip is embedded in the clearance groove of the base, which reduces the thickness between the circuit board and the base, thereby further reducing the overall thickness of the lens drive mechanism.

[0034] 2. This utility model provides an avoidance groove area without any circuit structure in the area below the avoidance groove. It can perfectly avoid the position of the avoidance groove, avoid the avoidance groove from affecting the internal power circuit of the base, reduce the design thickness of the base, and further reduce the overall thickness of the lens drive mechanism.

[0035] 3. The four upper springs of this utility model are four-corner spring structures. In order to facilitate installation, the upper spring cut-off parts are connected between the four corner springs. After installation, the middle upper spring cut-off part can be cut off, and the final lens drive mechanism retains four upper springs.

[0036] 4. This utility model uses a capacitor structure to replace the traditional Hall sensor to detect the three-axis motion position of the carrier, and the AF capacitor structure of this utility model has high accuracy and can ensure the stability of the detection.

[0037] 5. This utility model utilizes an upper spring design for the resetting operation of the carrier. The upper spring is connected to the base via energized rods, and several energized rods completely support the frame and carrier, suspending them in mid-air to reduce friction during OIS actuation.

[0038] Meanwhile, the upper spring is also used to connect the energized pole to the carrier and transmit current, to connect the energized pole to the frame's built-in metal and transmit current, and to connect the energized pole to the energized protective plate and transmit current.

[0039] Meanwhile, after OIS is activated, the elasticity of the energized rod can achieve a certain reset effect. Attached Figure Description

[0040] Figure 1 is an assembly diagram of this utility model;

[0041] Figure 2 is a cross-sectional view AA of Figure 1;

[0042] Figure 3 is an exploded view of Figure 1;

[0043] Figure 4 is a further exploded view of Figure 3;

[0044] Figure 5 is a further exploded view of Figure 4;

[0045] Figure 6 is an exploded view of the base and circuit board of this utility model;

[0046] Figure 7 is a schematic diagram of Figure 6 from another angle;

[0047] Figure 8 is a schematic diagram of the internal structure of the base of this utility model;

[0048] Figure 9 is a schematic diagram of the internal structure of the circuit board of this utility model;

[0049] Figure 10 is a schematic diagram of the structure of the four corner springs of this utility model before they are cut off;

[0050] Figure 11 is a structural schematic diagram of the frame and carrier of this utility model;

[0051] Figure 12 is an exploded view of Figure 11;

[0052] Figure 13 is a schematic diagram of the internal structure of the present invention as shown in Figure 11;

[0053] Figure 14 is a partial structural schematic diagram of Figure 13;

[0054] Figure 15 is a partial structural schematic diagram of Figure 14. Detailed Implementation

[0055] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings to provide a clearer understanding of the purpose, features, and advantages of the present invention. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the present invention, but are merely illustrative of the essential spirit of the technical solution of the present invention.

[0056] In the following description, certain specific details are set forth for the purpose of illustrating various disclosed embodiments in order to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the art will recognize that embodiments may be practiced without one or more of these specific details. In other instances, well-known apparatuses, structures, and techniques associated with this application may not have been shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0057] Throughout this specification, references to "an embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, the appearance of "in an embodiment" or "an embodiment" in various places throughout the specification does not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic may be combined in any manner in one or more embodiments.

[0058] In the following description, in order to clearly demonstrate the structure and working method of this utility model, a number of directional terms will be used. However, terms such as "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", and "down" should be understood as convenient terms and not as limiting terms.

[0059] In the following description, the first direction is defined as the X-axis, the second direction as the Y-axis, and the third direction as the Z-axis, which is the optical axis. The optical axis represents the direction of light propagation within an optical element; it is an abstract concept and does not refer to a physical axis.

[0060] Referring to Figures 1 to 15, this utility model provides a lens driving mechanism, mainly including a housing 1, a frame 2, a carrier 3, a circuit board 4, a base 5, an upper spring 6, a lower spring 7, and multiple power-conducting rods 8. The housing 1 and the base 5 are fastened together to form a hollow cavity. The circuit board 4 is stacked on the top surface of the base 5 and connected to the base 5.

[0061] Referring to Figure 9, the circuit board 4 is provided with several OIS coils 45. Referring to Figure 12, the frame 2 includes several magnets 27. Under the action of the OIS coils 45 and the magnets 27, the frame 2 and the carrier 3 disposed therein will move relative to the base 5 in the hollow cavity along the X-axis and Y-axis directions.

[0062] Referring to Figure 12, an AF coil 33 is provided on the outside of the carrier 3. Under the action of the AF coil 33 and the magnet 27, the carrier 3 will move relative to the frame 2 in the Z-axis direction. The lens is installed inside the carrier 3. When the carrier 3 moves, it can drive the lens to move along its optical axis. When the frame 2 moves, it can drive the carrier 3 and the lens on it to move in the X-axis and Y-axis directions, thereby realizing the three-axis movement operation of the lens.

[0063] Frame 2 is a ring extending around the Z-axis and positioned above circuit board 4. Frame 2 has magnet mounting slots for mounting magnets, with magnet 27 corresponding to the AF coil 33 wound around the outside of carrier 3. An upper spring 6 connects the top of frame 2 to the top of carrier 3, and a lower spring 7 connects the bottom of frame 2 to the bottom of carrier 3. Both upper and lower springs are elastic; after carrier 3 moves, upper and lower springs 6 and 7 can drive carrier 3 to reset.

[0064] The base 5 has a built-in power line 52, which is electrically connected to the circuit board 4 and can supply power to the OIS coil 45 in the circuit board 4.

[0065] Referring to the embodiment shown in Figure 8, four energized rods 8 extend along the Z-axis and are connected at their bottom ends to the base 5, and are electrically connected to the built-in power line 52 within the base 5. The top ends of each energized rod 8 are connected to corresponding upper spring plates 6, and one of the upper spring plates 6 is also connected to the AF coil 33 of the carrier 3 to transmit current. The four energized rods 8 completely support the frame 2 and the carrier 3, making them suspended above the base 5 to reduce the friction when the frame 2 is driven. At the same time, after the frame 2 is driven, the elasticity of the energized rods 8 can play a certain role in resetting.

[0066] During the drive operation, the current on the base 5 is transmitted to the circuit board 4 and the power rod 8. After the circuit board 4 is powered on, it supplies power to the OIS coil 45. The power rod 8 transmits the current to the upper spring 6, and then to the AF coil 33 on the outer periphery of the carrier 3 via the upper spring 6, thereby realizing the power supply operation of the OIS coil 45 and the AF coil 33.

[0067] Referring to Figure 5, the base 5 is provided with a clearance groove 51 for avoiding the OIS sensing chip. The circuit board 4 is stacked on the top surface of the base 5 and located below the frame 2. An OIS capacitor structure is provided between the circuit board 4 and the frame 2. Referring to Figure 7, the bottom end of the circuit board 4 is provided with an OIS sensing chip 41 connected to the OIS capacitor structure. The OIS sensing chip 41 is located in the clearance groove 51.

[0068] In this invention, a capacitor structure is used between the circuit board 4 and the frame 2 to replace the position sensor design in the prior art. The OIS sensing chip 41 is embedded in the clearance groove 51 of the base 5, which reduces the thickness between the circuit board 4 and the base 5, thereby further reducing the overall thickness of the lens drive mechanism.

[0069] In one embodiment, referring to FIG8, the base 5 area below the clearance groove 51 is a clearance groove area 511 without internal circuit structure.

[0070] Typically, a built-in power line 52 is installed inside the base 5. Circuit pins extending from the base 5 are provided on this built-in power line 52 to connect to external circuits. The built-in power line 52 supplies power and signals to various electrical components in the lens drive mechanism, such as coils. This invention provides a clearance groove area 511 below the clearance groove 51, which does not contain any circuit structure. This area perfectly avoids the clearance groove 51 from affecting the built-in power line 52, reducing the design thickness of the base 5 and further reducing the overall thickness of the lens drive mechanism.

[0071] In one embodiment, referring to FIG10, the lens driving mechanism further includes four upper springs 6, which are respectively connected around the top of the frame 2 and the top of the carrier 3. The four upper springs 6 are connected by upper spring cut-off portions 61 that are cut off after installation, so that the four upper springs 6 form a four-corner spring structure.

[0072] In other words, for ease of installation, the spring-cut portion 61 remains connected between the four upper springs 6 during installation. After all four upper springs 6 are installed, the middle upper spring-cut portion 61 is cut off, leaving only the four upper springs 6 in the final lens drive mechanism.

[0073] In one embodiment, a capacitor structure is used in the Z-axis direction to replace the position sensor design in the prior art, and the specific design is as follows:

[0074] Referring to Figures 12 to 15, a receiving groove 21 is provided on the top surface of one side of the frame 2, and AF sensing plates 22 are provided on the two opposite side walls of the receiving groove 21. A carrier-embedded metal 31 is provided inside the carrier 3, and an AF electrode plate 32 is provided on the carrier-embedded metal 31. The AF electrode plate 32 extends out of one side of the carrier 3 and is bent and inserted between the two AF sensing plates 22 in the receiving groove 21. The AF electrode plate 32 and the two AF sensing plates 22 form an AF capacitor structure.

[0075] In this embodiment, when the two AF sensing plates 22 and the AF electrode plate 32 are energized, and the carrier 3 moves along the Z-axis, the relative area between the AF electrode plate 32 and the AF sensing plate 22 changes, that is, the capacitance value of the AF capacitor structure changes. Based on this change, the Z-axis movement position of the carrier 3 can be determined, thus achieving the effect of a Z-axis position sensor.

[0076] In this embodiment, by inserting an AF electrode plate 32 between two AF sensing plates 22, the sensing accuracy of the AF capacitor structure can be increased. When the frame 2 or carrier 3 is squeezed and deformed, the AF electrode plate 32 will not leave the sensing range of the AF sensing plate 22, so that its sensing capacitance effect is not affected.

[0077] In one embodiment, referring to Figures 13 to 15, the frame 2 is provided with a frame-in-metal 23, which is connected to two AF sensing plates 22 respectively.

[0078] The frame-embedded metal 23 is preferably integrally formed with the two AF sensing plates 22, and both are embedded inside the frame 2 by injection molding, which can ensure the connection strength between the AF sensing plate 22 and the frame-embedded metal 23.

[0079] In one embodiment, referring to FIG13, a power-conducting protective plate 24 is also provided inside the frame 2, and the power-conducting protective plate 24 is disposed on the outside of the two AF sensing plates 22.

[0080] In this embodiment, an energized protective plate 24 is provided on the outside of the two AF sensing plates 22. After the energized protective plate 24 is energized, it plays a role in fixing the potential and preventing the change of electric field when the frame 2 performs OIS operation from affecting the sensing signal in the AF direction, thereby improving the sensing accuracy of the AF direction capacitor structure.

[0081] In one embodiment, an AF sensing chip is also provided in the frame 2. The AF sensing chip is electrically connected to two AF sensing plates 22 respectively. The AF sensing chip is used to monitor the capacitance value of the first capacitor structure.

[0082] In this embodiment, the capacitance value of the formed AF capacitor structure is detected by the AF sensing chip, thereby determining the movement position of the lens in the Z-axis direction.

[0083] In one embodiment, a capacitor structure is used to replace the position sensor design in the prior art in the X and Y axis directions, and the specific design is as follows:

[0084] Referring to Figure 15, an X-axis electrode plate 25 and a Y-axis electrode plate 26 are respectively disposed within the frame 2, and the X-axis electrode plate 25 and the Y-axis electrode plate 26 are respectively located on the bottom surface of the frame 2. Referring to Figure 9, an X-axis sensing plate 42 and a Y-axis sensing plate 43 are disposed within the circuit board 4. The X-axis sensing plate 42 is disposed corresponding to the X-axis electrode plate 25 to form a first OIS capacitor structure, and the Y-axis sensing plate 43 is disposed corresponding to the Y-axis electrode plate 26 to form a second OIS capacitor structure. The OIS sensing chip 41 is electrically connected to the X-axis sensing plate 42 and the Y-axis sensing plate 43 respectively.

[0085] In this embodiment, when the X-axis sensing plate 42, Y-axis sensing plate 43, X-axis electrode plate 25, and Y-axis electrode plate 26 are energized, and the frame 2 moves along the X-axis or Y-axis, the relative area between the X-axis sensing plate 42 and the X-axis electrode plate 25 or the relative area between the Y-axis sensing plate 43 and the Y-axis electrode plate 26 changes. That is, the capacitance value of the first OIS capacitor structure or the capacitance value of the second OIS capacitor structure will change. Based on this change, the X-axis and Y-axis moving positions of the frame 2 and the carrier 3 can be determined, thus achieving the effect of an X-axis and Y-axis position sensor.

[0086] In this embodiment, the capacitance value of the formed OIS capacitor structure is detected by the OIS sensing chip 41, thereby determining the movement position of the lens in the X and Y axis directions.

[0087] In one embodiment, referring to FIG9, the circuit board 4 also includes a substrate 44, an X-axis sensing plate 42 and a Y-axis sensing plate 43 are disposed at the top of the substrate 44, and an OIS sensing chip 41 is disposed at the bottom of the substrate 44.

[0088] In one embodiment, a plurality of OIS coils 45 are arranged around a substrate 44. Referring to FIG9, three OIS coils 45 are disposed within the circuit board 4. The three OIS coils 45 and the substrate 44 form a rectangular frame structure, so that the positions of the X-axis sensing plate 42 and the Y-axis sensing plate 43 on the substrate 44 avoid the positions of the OIS coils 45 in the circuit board 4. This avoids the sensing plates affecting the Lorentz force between the OIS coils and the magnets, and also avoids the sensing plates occupying the mounting space of the OIS coils on the circuit board 4, thus reducing the thickness of the circuit board 4.

[0089] In another embodiment, the substrate 44 is disposed away from the plurality of OIS coils 45.

[0090] In one embodiment, referring to FIG8, the base 5 is provided with a built-in power line 52. Referring to FIG7, the bottom end of the circuit board 4 is provided with one or more power points 46. The circuit board 4 is electrically connected to the built-in power line 52 through the power points 46, and transmits the current provided by the built-in power line 52 to the X-axis sensing plate 42, the Y-axis sensing plate 43, and the OIS coil 45 through the power points 46.

[0091] In one embodiment, circuit board 4 is an FPC board.

[0092] In one embodiment, referring to FIG15, the frame 2 is provided with a frame-in-metal 23, which is connected to the X-axis electrode plate 25 and the Y-axis electrode plate 26 respectively.

[0093] The frame-embedded metal 23 is preferably integrally formed with the X-axis electrode 25 and the Y-axis electrode 26, and is embedded inside the frame 2 by injection molding, which can ensure the connection strength between the X-axis electrode 25, the Y-axis electrode 26 and the frame-embedded metal 23.

[0094] In one embodiment, the frame 2 is provided with a frame-integrated metal 23, which is connected to two AF sensing plates 22, an X-axis electrode plate 25, and a Y-axis electrode plate 26 respectively.

[0095] The frame-embedded metal 23 is preferably integrally formed with the two AF sensing plates 22, the X-axis electrode plate 25, and the Y-axis electrode plate 26, and is embedded inside the frame 2 by injection molding, which can ensure the connection strength between the two AF sensing plates 22, the X-axis electrode plate 25, the Y-axis electrode plate 26 and the frame-embedded metal 23.

[0096] In one embodiment, the power supply for the carrier-embedded metal 31, the frame-embedded metal 23, and the power-conducting protective plate 24 is still achieved through the upper spring 6 and the power-conducting rod 8. By supplying power to the carrier-embedded metal 31, the AF electrode plate 32 is powered. By supplying power to the frame-embedded metal 23, the two AF sensing plates 22, the X-axis electrode plate 25, and the Y-axis electrode plate 26 are powered.

[0097] Specifically, four upper spring plates 6 are respectively connected between the top of the frame 2 and the top of the carrier 3, with three upper spring plates 6 being independently electrically connected to the carrier's built-in metal 31, the frame's built-in metal 23, and the electrically conductive protective plate 24. The bottom ends of the four energized rods 8 are respectively electrically connected to the base's built-in energized circuit 52, and the top ends of the four energized rods 8 are respectively connected to a corresponding upper spring plate 6. The current provided by the base's built-in energized circuit 52 is transmitted through the three energized rods 8 to the carrier's built-in metal 31, the frame's built-in metal 23, and the electrically conductive protective plate 24 via the three independent upper spring plates 6.

[0098] The preferred embodiments of this utility model have been described in detail above. However, it should be understood that after reading the above teachings, those skilled in the art can make various alterations or modifications to this utility model. These equivalent forms also fall within the scope defined by the appended claims.

Claims

1. A lens driving mechanism, characterized in that, The lens driving mechanism includes: a base with a clearance groove for avoiding an OIS sensor chip; a frame suspended above the base, the frame being movable relative to the base in a first direction or a second direction; and a circuit board stacked on the top surface of the base and located below the frame, an OIS capacitor structure being disposed between the circuit board and the frame, and an OIS sensor chip connected to the OIS capacitor structure being disposed at the bottom end of the circuit board, the OIS sensor chip being located in the clearance groove.

2. The lens driving mechanism as described in claim 1, characterized in that, The base area below the clearance groove is a clearance groove area without internal circuitry.

3. The lens driving mechanism as described in claim 1, characterized in that, The lens driving mechanism further includes: a carrier located within the frame and configured to move relative to the frame in a third direction; and four upper springs connected around the perimeter between the top of the frame and the top of the carrier, with cut-off portions of the upper springs being connected between the four upper springs after installation, so that the four upper springs form a four-corner spring structure.

4. The lens driving mechanism as described in claim 1, characterized in that, The frame has a receiving groove on one side of its top surface, and AF sensing plates are provided on the two opposite side walls of the receiving groove. The lens driving mechanism also includes a carrier, which is located inside the frame and is configured to move relative to the frame in a third direction. The carrier has a built-in metal, and an AF electrode plate is provided on the built-in metal. The AF electrode plate extends out of one side of the carrier and is bent and inserted between the two AF sensing plates in the receiving groove. The AF electrode plate and the two AF sensing plates form an AF capacitor structure.

5. The lens driving mechanism as described in claim 4, characterized in that, The frame contains a built-in metal element, which is connected to the two AF sensing plates respectively; and / or, the frame also contains a power-conducting protective plate, which is located on the outside of the two AF sensing plates; and / or, the frame also contains an AF sensing chip, which is electrically connected to the two AF sensing plates respectively, and the AF sensing chip is used to monitor the capacitance value of the first capacitor structure.

6. The lens driving mechanism as described in any one of claims 1 to 5, characterized in that, The frame is provided with X-axis electrode plates and Y-axis electrode plates respectively located on the bottom surface of the frame; the circuit board is provided with X-axis sensing plate and Y-axis sensing plate respectively and is arranged corresponding to the X-axis electrode plates and Y-axis electrode plates to form the OIS capacitor structure; the OIS sensing chip is electrically connected to the X-axis sensing plate and Y-axis sensing plate respectively.

7. The lens driving mechanism as described in claim 6, characterized in that, The circuit board also includes a substrate, with the X-axis sensing plate and the Y-axis sensing plate disposed at the top of the substrate, and the OIS sensing chip disposed at the bottom of the substrate; the circuit board contains a plurality of OIS coils, and the frame is provided with a plurality of magnets, each magnet being disposed opposite to a corresponding OIS coil, and after the OIS coil is energized, the frame can move relative to the base in a first direction or a second direction; the plurality of OIS coils are disposed around or away from the substrate; and / or, the frame is provided with frame-embedded metal, which is respectively connected to the X-axis electrode plate and the Y-axis electrode plate.

8. The lens driving mechanism as described in claim 7, characterized in that, The base is provided with a built-in power circuit, and the bottom of the circuit board is provided with one or more power points. The circuit board is electrically connected to the built-in power circuit through the power points, and transmits the current provided by the built-in power circuit to the X-axis sensing plate, the Y-axis sensing plate, and the OIS coil through the power points.

9. The lens driving mechanism as described in claim 4, characterized in that, The frame contains X-axis and Y-axis electrode plates, which are located on the bottom surface of the frame. The circuit board contains X-axis and Y-axis sensing plates, which are respectively positioned opposite the X-axis and Y-axis electrode plates to form the OIS capacitor structure. The OIS sensing chip is electrically connected to the X-axis and Y-axis sensing plates. A power-conducting protective plate is also provided within the frame, located outside the two AF sensing plates. The frame contains an internal metal frame, which connects to the two AF sensing plates, the X-axis electrode plate, and the Y-axis electrode plate.

10. The lens driving mechanism as described in claim 9, characterized in that, The lens driving mechanism further includes: a plurality of upper springs, which are respectively connected between the top of the frame and the top of the carrier, wherein three of the upper springs are independently electrically connected to the built-in metal of the carrier, the built-in metal of the frame, and the power-conducting protective plate; and a plurality of power-conducting rods, which extend in a third direction and whose bottom ends are connected to the base and electrically connected to the built-in power-conducting circuit in the base, with the top of each power-conducting rod connected to a corresponding upper spring. The frame and the carrier are suspended above the base by the plurality of power-conducting rods, and the current provided by the built-in power-conducting circuit in the base is transmitted to the AF electrode plate, the built-in metal of the frame, and the power-conducting protective plate by the three power-conducting rods through the three independent upper springs.

Images