Micro LED backboard with high heat dissipation and display panel

Abstract

The utility model discloses a high heat dissipation Micro LED backplane and a display panel, relates to the display device field, the Micro LED backplane comprises a substrate, one surface of the substrate is provided with a drive circuit layer, the drive circuit layer is provided with a pad, an LED chip is welded on the pad, the surface of the drive circuit layer is covered with an insulation layer, the surface of the insulation layer is provided with an insulation sealing layer wrapping the pad, and the insulation sealing layer is provided with a plurality of LED chips. A first heat dissipation layer is arranged between the insulating layer and the insulating sealing layer, and the first heat dissipation layer avoids the welding part of the bonding pad and the driving circuit layer; according to the utility model, the first heat dissipation layer can effectively transfer heat dissipated when the LED chip works, and has a remarkable protection effect on the lower driving circuit layer, so that the conductive performance of the driving circuit layer is ensured, the brightness of the LED chip can be maintained, the light emitting effect of the LED chip is ensured, the heat dissipation effect of the Micro LED is effectively improved, and the service life of the Micro LED is prolonged. The environment tolerance of the display panel is improved, the performance of the Micro LED panel is improved, and the service life of the Micro LED panel is prolonged.

Description

A high-heat-dissipation Micro LED backplate and display panel Technical Field

[0001] This utility model relates to the field of display device technology, and in particular to a high heat dissipation Micro LED backplate and display panel. Background Technology

[0002] As the next-generation display technology, Micro LED has attracted increased investment from various companies in the display industry, including backplane technology development, LED chip development, and mass transfer integration development, in order to achieve breakthroughs in product luminous efficacy, environmental reliability, and industrial production.

[0003] In existing Micro LED display panels, Micro LED chips are soldered onto a TFT driving backplane using solder. The driving backplane includes a semiconductor driving circuit layer formed by photolithography, chemical vapor deposition, physical vapor deposition, and dry / wet etching. The topmost layer is a matrix of pads connecting the LED chips. In order to achieve interlayer insulation, an insulating layer is also provided on the upper surface of the TFT driving backplane.

[0004] Currently, Micro LED technology faces numerous challenges that need to be overcome, with heat dissipation being a major hurdle. In Micro LED panels, LED chips generate a significant amount of heat during electroluminescence, and the encapsulation materials on the chip surface are primarily epoxy resins, which have poor heat dissipation. Furthermore, the luminous efficiency (electro-optical conversion efficiency) of Micro LEDs decreases with increasing temperature, leading to a drop in brightness. Simultaneously, rising temperatures also cause aging of the backplane driving circuitry and cracking of the encapsulating adhesive (epoxy resin), severely impacting the environmental tolerance of the display panel. Heat generation is a crucial factor restricting the commercialization of Micro LEDs.

[0005] Patent application number 202122326750.6 discloses a Micro LED display panel, including a driving circuit layer, multiple Micro LED chips, and a heat-conducting layer. The heat-conducting layer is disposed on one side of the driving circuit layer. The multiple Micro LED chips are arranged at equal intervals on the side of the heat-conducting layer away from the driving circuit layer. The heat-conducting layer has protrusions that fill the gaps between the multiple Micro LED chips. This design allows the heat generated by the Micro LED chips during operation to be quickly conducted away by the heat-conducting layer. Furthermore, the heat-conducting layer surrounds the Micro LED chips, and due to its good thermal conductivity, it also dissipates the heat generated by the Micro LED chips from all sides, increasing the heat dissipation area of ​​the Micro LED chips and improving the thermal conductivity of the Micro LED display panel, thereby extending its lifespan. However, the heat-conducting layer surrounding the Micro LED chips affects the luminous effect of the LED chips, and the driving circuit layer is not properly insulated, affecting its conductivity. Therefore, this invention discloses a high-heat-dissipation Micro LED backplate and display panel to solve these problems. Summary of the Invention

[0006] Therefore, it is necessary to address the aforementioned technical problems by providing a high-heat-dissipation Micro LED backplane and display panel. The backplane surface is encapsulated with an insulating sealant, and a first heat dissipation layer is placed between the insulating sealant and the insulating layer. This first heat dissipation layer effectively transfers the heat dissipated by the LED chip during operation, while also providing significant protection to the underlying driving circuit layer. This ensures the conductivity of the driving circuit layer, maintains the brightness of the LED chip, guarantees its luminous effect, effectively improves the heat dissipation of the Micro LED, enhances the environmental tolerance of the display panel, improves the performance of the Micro LED panel, and extends its lifespan.

[0007] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0008] A high heat dissipation Micro LED backplane includes a substrate, a driving circuit layer on one surface of the substrate, pads on the driving circuit layer, LED chips soldered on the pads, an insulating layer covering the surface of the driving circuit layer, an insulating sealing layer covering the pads on the surface of the insulating layer, and a first heat dissipation layer between the insulating layer and the insulating sealing layer, the first heat dissipation layer avoiding the soldering part between the pads and the driving circuit layer.

[0009] In a preferred embodiment of the high heat dissipation Micro LED backplate provided by this utility model, the first heat dissipation layer is an aluminum nitride or diamond film.

[0010] In a preferred embodiment of the high heat dissipation Micro LED backplate provided by this utility model, the first heat dissipation layer is prepared by PVD or CVD.

[0011] In a preferred embodiment of the high heat dissipation Micro LED backplate provided by this utility model, a second heat dissipation layer is provided on a surface of the substrate away from the driving circuit layer, and the first heat dissipation layer and the second heat dissipation layer are connected by heat-conducting pillars, which are located in the non-displayable area of ​​the substrate.

[0012] In a preferred embodiment of the high heat dissipation Micro LED backplate provided by this utility model, the insulating sealing layer is a distributed Bragg mirror layer.

[0013] In a preferred embodiment of the high heat dissipation Micro LED backplate provided by this utility model, the substrate is a transparent substrate or an opaque substrate.

[0014] In a preferred embodiment of the high heat dissipation Micro LED backplate provided by this utility model, the substrate is a metal-based opaque substrate, and the substrate is a diamond-copper composite substrate.

[0015] In a preferred embodiment of the high heat dissipation Micro LED backplate provided by this utility model, a thermoelectric cooling module is provided on the surface of the substrate away from the driving circuit layer, the heat-absorbing surface of the thermoelectric cooling module is attached to the substrate, and the circuit of the thermoelectric cooling module is integrated in the driving circuit layer.

[0016] As a preferred embodiment of the high heat dissipation Micro LED backplate provided by this utility model, it further includes a temperature sensor, which is embedded in the surface of the first heat dissipation layer.

[0017] A display panel comprising the aforementioned high-heat-dissipation Micro LED backplate.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The high heat dissipation Micro LED backplate provided by this utility model encapsulates the surface of the backplate with an insulating seal layer and sets a first heat dissipation layer between the insulating seal layer and the insulating layer. The first heat dissipation layer can effectively transfer the heat dissipated by the LED chip during operation, and at the same time has a significant protective effect on the underlying driving circuit layer, ensuring the conductivity of the driving circuit layer, maintaining the brightness of the LED chip, ensuring the light emission effect of the LED chip, effectively improving the heat dissipation effect of Micro LED, improving the environmental tolerance of the display panel, improving the performance of Micro LED panel, and extending the service life of Micro LED panel. Attached Figure Description

[0020] To more clearly illustrate the solutions in this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 is a schematic diagram of the structure of the high heat dissipation Micro LED backplate provided by this utility model;

[0022] Figure 2 is a schematic diagram of the structure of Embodiment 3 of the high heat dissipation Micro LED backplate provided by this utility model;

[0023] Figure 3 is a schematic diagram of the front side of the substrate in Embodiment 3 of the high heat dissipation Micro LED backplate provided by this utility model;

[0024] Figure 4 is a schematic diagram of the back side of a substrate in Embodiment 3 of the high heat dissipation Micro LED backplate provided by this utility model;

[0025] Figure 5 is a schematic diagram of another back side of the substrate in Embodiment 3 of the high heat dissipation Micro LED backplate provided by this utility model.

[0026] The markings in the diagram are explained as follows:

[0027] 1. Substrate; 2. LED chip; 3. Driver circuit layer; 4. Pad; 5. Insulating layer; 6. Insulating seal layer; 7. First heat dissipation layer; 8. Second heat dissipation layer; 9. Heat-conducting pillar; 10. Thermoelectric cooling module; 11. Temperature sensor. Detailed Implementation

[0028] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0029] As mentioned in the background section, Micro LED technology currently faces numerous challenges that need to be overcome, with heat dissipation being a major hurdle. In Micro LED panels, LED chips generate significant heat during electroluminescence, and the encapsulation materials on the chip surface, primarily epoxy resin, have poor heat dissipation. Furthermore, the luminous efficiency (electro-optical conversion efficiency) of Micro LEDs decreases with increasing temperature, leading to reduced brightness. Simultaneously, rising temperatures also cause aging of the backplane driving circuit characteristics and cracking of the encapsulating adhesive (epoxy resin), severely impacting the environmental tolerance of the display panel. Micro LED heat generation is a significant factor restricting its commercialization. In existing Micro LED panels, the thermally conductive layer surrounding the Micro LED chip affects the chip's luminous efficacy, and the driving circuit layer lacks proper insulation and sealing, impacting its conductivity.

[0030] To solve this technical problem, this utility model provides a high heat dissipation Micro LED backplate and display panel, which are applied in the field of display devices.

[0031] Specifically, please refer to Figure 1. The high heat dissipation Micro LED backplate includes a substrate 1. A driving circuit layer 3 is provided on one surface of the substrate 1. A pad 4 is provided on the driving circuit layer 3. The LED chip 2 is soldered on the pad 4. An insulating layer 5 covers the surface of the driving circuit layer 3. An insulating sealing layer 6 is provided on the surface of the insulating layer 5 to wrap the pad 4. A first heat dissipation layer 7 is provided between the insulating layer 5 and the insulating sealing layer 6. The first heat dissipation layer 7 avoids the soldering part between the pad 4 and the driving circuit layer 3.

[0032] Specifically, the display panel includes the aforementioned high-heat-dissipation Micro LED backplate.

[0033] The high heat dissipation Micro LED backplate provided by this utility model encapsulates the surface of the backplate with an insulating sealing layer 6, and sets a first heat dissipation layer 7 between the insulating sealing layer 6 and the insulating layer 5. The first heat dissipation layer 7 can effectively transfer the heat dissipated by the LED chip 2 when it is working, and at the same time has a significant protective effect on the underlying driving circuit layer 3, ensuring the conductivity of the driving circuit layer 3, maintaining the brightness of the LED chip 2, ensuring the light emission effect of the LED chip 2, effectively improving the heat dissipation effect of MicroLED, improving the environmental tolerance of the display panel, improving the performance of MicroLED panel, and increasing the service life of MicroLED panel.

[0034] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0035] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0037] Example 1

[0038] Please refer to Figure 1. A high-heat-dissipation Micro LED backplane is provided, which includes a substrate 1. A driving circuit layer 3 is provided on one surface of the substrate 1. A pad 4 is provided on the driving circuit layer 3. An LED chip 2 is soldered onto the pad 4. The size of the LED chip 2 in the Micro LED pixel array is ≤10μm, and the pixel density is ≥2000PPI. Of course, the TFT backplane also includes an active layer, a gate insulating layer 5, a gate layer, an interlayer dielectric layer, a source-drain layer, and a planarization layer, etc. This part is a conventional technology and can be fabricated using conventional methods. It will not be described in detail in this example. The LED chip 2 is bonded to the pad 4 of the semiconductor driving circuit layer 3 by mass transfer technology. The driving circuit layer 3 drives the LED chip 2 to light up to achieve the display effect. The surface of the driving circuit layer 3 is covered by an insulating layer 5, which wraps and covers the driving circuit layer 3. The top surface of the pad 4 exposes the insulating layer 5. An insulating sealing layer 6 is provided on the surface of the insulating layer 5 to wrap the pad 4. A first heat dissipation layer 7 is provided between the sealing layers 6. The first heat dissipation layer 7 avoids the soldering part between the pad 4 and the driving circuit layer 3. The first heat dissipation layer 7 is made of a material with good thermal conductivity and insulation effect. In this example, the material of the first heat dissipation layer 7 is aluminum nitride or diamond film. In this example, aluminum nitride ceramic is used for the first heat dissipation layer 7, but it is not limited to these two. The first heat dissipation layer 7 is prepared by PVD or CVD method. PVD, or physical vapor deposition, is a coating technology that converts solid materials into gaseous state through physical methods in a vacuum environment and then deposits them onto the surface of the target object to form a thin film. In the vacuum chamber, aluminum nitride or diamond is vaporized by heating or sputtering and condensed on the surface of the substrate 1 to form a uniform and dense thin film. CVD, or Chemical Vapor Deposition, is a technique that deposits solid films by chemically reacting gaseous precursors on the surface of a substrate. A gaseous compound containing aluminum nitride or diamond is introduced into the reaction chamber. Under the excitation of energy such as high temperature or plasma, the gaseous material decomposes or reacts on the surface of the substrate to generate solid products. The solid material generated by the reaction gradually accumulates on the surface of the substrate to form a dense and uniform film.

[0039] A second heat dissipation layer 8 is provided on the surface of the substrate 1 opposite to the driving circuit layer 3. The second heat dissipation layer 8 is a graphite sheet, a graphene composite layer, a thermally conductive silicone sheet, or thermally conductive grease. In this example, a thermally conductive silicone sheet is selected. The graphene layer is grown by chemical vapor deposition (CVD) and attached to the surface of the substrate 1. The first heat dissipation layer 7 and the second heat dissipation layer 8 are connected by thermally conductive pillars 9. The thermally conductive pillars 9 are located in the non-display area of ​​the substrate 1 and do not affect the display effect of the panel. The thermally conductive pillars 9 are prepared by drilling holes around the non-display area of ​​the substrate 1 and injecting thermally conductive material into the holes to solidify and form the thermally conductive pillars 9. The material of the thermally conductive pillars 9 is high thermal conductivity grease or aluminum-silicon alloy. The thermally conductive pillars 9 are used to transfer the heat in the first heat dissipation layer 7 to the second heat dissipation layer 8, thereby quickly dissipating the heat. At the same time, the second heat dissipation layer 8 can also dissipate heat from the back of the substrate 1, further improving the heat dissipation performance.

[0040] Furthermore, substrate 1 can be a transparent substrate or an opaque substrate. The transparent substrate is made of transparent glass, and the resulting Micro LED display panel is completely transparent. It can be used in vehicle displays, transparent screen display cabinets, transparent information screens, VR devices, etc. The opaque substrate is made of metal substrate material, and the resulting Micro LED display panel can only emit light from one side. It can be used in central control screens, large displays, electronic screens, etc. in central control rooms.

[0041] Example 2

[0042] The high heat dissipation Micro LED backplane provided in Example 1 is further optimized. Specifically, as shown in Figure 1, the original encapsulating adhesive (epoxy resin) of the insulating sealant 6 is replaced with a distributed Bragg reflector layer. The distributed Bragg reflector layer has a multi-layer structure. The distributed Bragg reflector layer performs interlayer insulation of the substrate 1 and reflects the light emitted by the LED chip 2. Through the high reflectivity of the multi-layer distributed Bragg reflector layer, the light emitted by the LED chip 2 and directed towards the backplane is reflected out for utilization, effectively improving the heat dissipation of the Micro LED backplane. To improve LED light utilization and cooling effect, the distributed Bragg reflector layer employs alternating layers of different dielectric structures. The number of layers can be periodically designed according to the wavelengths of the RGB light emitted by the LED chip 2, achieving different wavelength light reflection effects. Furthermore, the dielectric structure layer material of the distributed Bragg reflector layer is not limited to at least two of SiO2, TiO2, AlGaAs, AlGaInN, and AlOy. Specifically, the distributed Bragg reflector layer consists of alternating deposition of low-refractive-index (refractive-index ≤ 1.5) dielectric structure layers and high-refractive-index (refractive-index ≥ 2.0) dielectric structure layers, with the low-refractive-index dielectric structure layers located in... The top and bottom layers of the Bragg reflector layer 7 are as follows: the low-refractive-index dielectric structure layer material is at least one of SiO2 and AlOy, and the high-refractive-index dielectric structure layer material is at least one of TiO2, AlGaAs, and AlGaInN. In this example, the low-refractive-index dielectric structure layer material is SiO2, and the high-refractive-index dielectric structure layer material is TiO2. The thickness of a single dielectric structure layer is determined according to the wavelength of the light to be reflected. In this example, the thickness of a single dielectric structure layer is 1 / 4 of the wavelength of the reflected light. The thickness of the SiO2 dielectric structure layer is 50 nm, and the thickness of the TiO2 dielectric structure layer is 30 nm. A total of 10 layers are alternately arranged. The fabrication methods of the distributed Bragg reflector layer include, but are not limited to, atomic layer deposition, evaporation, CVD, etc. In this example, atomic layer deposition is used to alternately grow the dielectric structure layers of SiO2 and TiO2.

[0043] Example 3

[0044] The high heat dissipation Micro LED backplane provided in Embodiment 2 is further optimized. Specifically, as shown in Figures 2-5, the substrate 1 is a metal-based opaque substrate. Further, in this example, the substrate 1 is a diamond-copper composite substrate, which has good thermal conductivity and can quickly dissipate heat. A thermoelectric cooling module 10 is provided on the surface of the substrate 1 away from the driving circuit layer 3. The heat-absorbing surface of the thermoelectric cooling module 10 is bonded to the substrate. The circuit of the thermoelectric cooling module 10 is integrated into the driving circuit layer 3. When using a metal-based opaque substrate, the display device does not need to display the entire image. When the thermoelectric cooling module 10 is bonded to the back of the substrate 1, it can fully cover the image. The thermoelectric cooling module 10, in conjunction with the second heat dissipation layer 8, can quickly dissipate heat from the Micro LED backplane. The heat emitted by the LED chip 2 in the LED backplane is dissipated, further improving heat dissipation performance. The thermoelectric cooling module 10 is a semiconductor cooling module, which consists of two longitudinally arranged semiconductor materials sandwiched between a copper substrate. When energized, electrons move in one material, while holes move in the other, causing heat to move. Applying the "Peltier effect," one side of the substrate 1 absorbs heat and the other side releases heat depending on the direction of the current, enabling switching between hot and cold sides. Additionally, the "Seebeck effect" can be used to induce current flow by setting a temperature difference between the two sides of the semiconductor cooling module. The driving circuit of the thermoelectric cooling module 10 is embedded in the flexible PCB of the backplane, and the power supply lines share the same wiring layer as the Micro LED pixel driving lines, reducing additional wiring space. A temperature sensor 11 is also embedded on the surface of the first heat dissipation layer. The signal lines of the temperature sensor 11 are also integrated into the driving circuit layer to avoid obstructing the display screen. Multiple temperature sensors 11 can be arranged in a matrix on the surface of the substrate 1, allowing for temperature monitoring at various locations on the surface of the substrate 1.

[0045] Of course, the thermoelectric cooling module 10 can also be applied to a transparent substrate. In this case, the thermoelectric cooling module 10 needs to avoid the display area and be located in the non-display area of ​​the back panel, so as not to affect the display of the screen in the display area. At the same time, the thermoelectric cooling module 10 can also be located in the non-display area on the front of the substrate 1, that is, the thermoelectric cooling module 10 is placed on the surface of the insulating sealing layer 6.

[0046] Example 4

[0047] This embodiment provides a display panel, which includes the high heat dissipation Micro LED backplate described in Embodiments 1 to 3. This display panel is used in vehicle displays, transparent screen display cabinets, transparent information screens, VR devices, central control screens, large displays, electronic screens, etc.

[0048] The working principle of the high heat dissipation Micro LED backplate provided by this utility model is as follows: After the Micro LED backplate is prepared, a first heat dissipation layer 7 is deposited on its upper surface, and then sealed by an insulating sealing layer 6. The first heat dissipation layer 7 is used to transfer the heat dissipated by the LED chip 2 during operation, and at the same time, it has a significant protective effect on the lower driving circuit layer 3. Meanwhile, a second heat dissipation layer 8 is deposited on the other surface of the substrate 1, and the heat from the first heat dissipation layer 7 is introduced into the second heat dissipation layer 8 by a heat-conducting pillar 9, thereby accelerating heat dissipation, improving the cooling effect of the Micro LED display panel, ensuring the conductivity of the driving circuit layer 3, maintaining the brightness of the LED chip 2, ensuring the light-emitting effect of the LED chip 2, effectively improving the heat dissipation effect of the Micro LED, improving the environmental tolerance of the display panel, improving the performance of the Micro LED panel, and increasing the service life of the Micro LED panel.

[0049] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0050] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A high-heat-dissipation Micro LED backplane, comprising a substrate, a driving circuit layer being provided on one surface of the substrate, pads being provided on the driving circuit layer, and LED chips being soldered onto the pads, characterized in that, The surface of the driving circuit layer is covered with an insulating layer, and the surface of the insulating layer is provided with an insulating seal layer that wraps around the pads. A first heat dissipation layer is provided between the insulating layer and the insulating seal layer, and the first heat dissipation layer avoids the soldering part between the pads and the driving circuit layer.

2. The high heat dissipation Micro LED backplate according to claim 1, characterized in that, The first heat dissipation layer is an aluminum nitride or diamond film.

3. The high heat dissipation Micro LED backplate according to claim 2, characterized in that, The first heat dissipation layer is prepared by PVD or CVD.

4. The high heat dissipation Micro LED backplate according to claim 1, characterized in that, The substrate has a second heat dissipation layer on one surface away from the driving circuit layer. The first heat dissipation layer and the second heat dissipation layer are connected by heat-conducting pillars, which are located in the non-displayable area of ​​the substrate.

5. A high-heat-dissipation Micro LED backplate according to claim 1, characterized in that, The insulating sealing layer is a distributed Bragg reflector layer.

6. A high-heat-dissipation Micro LED backplate according to claim 1, characterized in that, The substrate can be a transparent substrate or an opaque substrate.

7. A high-heat-dissipation Micro LED backplate according to claim 6, characterized in that, The substrate is a diamond-copper composite substrate.

8. A high-heat-dissipation Micro LED backplate according to claim 1, characterized in that, A thermoelectric cooling module is provided on one surface of the substrate away from the driving circuit layer. The heat-absorbing surface of the thermoelectric cooling module is attached to the substrate, and the circuit of the thermoelectric cooling module is integrated in the driving circuit layer.

9. A high-heat-dissipation Micro LED backplate according to claim 8, characterized in that, It also includes a temperature sensor embedded in the surface of the first heat dissipation layer.

10. A display panel, characterized in that, Including the high heat dissipation MicroLED backplate as described in any one of claims 1-9.

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