Flash evaporation equipment

Abstract

The utility model relates to the technical field of semiconductors or photovoltaics, in particular to flash evaporation equipment and flash evaporation equipment, and aims to solve the problems that the flash evaporation equipment is large in occupied area and low in productivity. The flash evaporation equipment comprises a process cavity and a self-cleaning device. Attachments are formed on the inner wall of the process cavity in the process. The self-cleaning device is arranged in the technological cavity and used for cleaning attachments formed on the inner wall of the technological cavity in the technological process, automatic cleaning of the attachments and self-cleaning of the flash evaporation equipment are achieved, and the automation level of the flash evaporation equipment is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor or photovoltaic technology, and in particular to a flash evaporation device. Background Technology

[0002] In the semiconductor and photovoltaic industries, flash evaporation is one of the processes for thin film preparation and interface treatment. For example, flash evaporation can be used to prepare perovskite thin films and to perform surface treatment on perovskite thin films to form a passivation layer. As one implementation of flash evaporation, after the substrate undergoes coating, inkjet printing, or spin coating processes, a solution is applied to the substrate surface. The substrate then enters a flash evaporation device for flash evaporation. The flash evaporation device vaporizes the solvent in the solution, causing the solute to precipitate and crystallize uniformly on the substrate surface, thereby forming a thin film.

[0003] However, the vaporized solvent continues to condense on the inner wall of the flash evaporator, and the condensed droplets may drip onto the substrate, disrupting the uniformity of the film. Therefore, the inner cavity of the flash evaporator needs to be cleaned regularly. However, cleaning the inner cavity of the flash evaporator is done manually. Utility Model Content

[0004] In view of this, embodiments of this application provide a flash evaporation device to solve the problem that the inner cavity of the flash evaporation device can only be cleaned manually.

[0005] One embodiment of this application provides a flash evaporation apparatus, comprising: a process chamber having a process compartment configured to accommodate at least one substrate, wherein an adhering substance is formed on the inner wall of the process chamber during the process; and a self-cleaning device disposed in the process chamber for cleaning the adhering substance.

[0006] In some implementations, the self-cleaning device includes: a heating component disposed in the process chamber for heating the process chamber to vaporize the deposits; and an extraction component disposed in the process chamber and connected to the process chamber for extracting the vaporized deposits from the process chamber.

[0007] In some implementations, the flash evaporation equipment further includes a filter device, which is disposed between the extraction assembly and the process chamber and is connected to both the extraction assembly and the process chamber, for filtering the gas extracted from the process chamber.

[0008] In some implementations, there are multiple process chambers arranged sequentially along the substrate transport direction; the flash evaporation equipment also includes: multiple valves arranged between adjacent process chambers to cut off or connect adjacent process chambers, and valves arranged between the process chambers and the outside to cut off or connect the process chambers to the outside; and a transport device arranged adjacent to the process chambers for transporting the substrate between the multiple process chambers along the transport direction.

[0009] In some implementations, the flash evaporation equipment further includes: a loading platform located on one side of the multiple process chambers in the opposite direction to the transport direction; an atmosphere protection device located on the loading platform for outputting a protective gas to isolate the atmosphere from the solution-containing surface of the substrate; wherein the transport device is also used to transport the substrate on the loading platform to the process chamber.

[0010] In some implementations, the flash evaporation equipment further includes: a feeding chamber, disposed between the feeding platform and the process chamber, with valves provided between the feeding platform and the feeding chamber, and between the feeding chamber and the process chamber, to allow the feeding chamber to be connected to or disconnected from the feeding platform and / or the process chamber; a feeding extraction device, disposed in and connected to the feeding chamber, for extracting air from the feeding chamber; wherein, the transport device is also used to transport the substrate on the feeding platform to the feeding chamber; and / or, a discharging chamber, disposed on one side of the multiple process chambers along the transport direction, with valves provided between the discharging chamber and the process chamber, and between the discharging chamber and the outside, to allow the discharging chamber to be connected to or disconnected from the process chamber and / or the outside; an extraction or blowing device, disposed in and connected to the discharging chamber, for extracting or blowing air from the discharging chamber; wherein, the transport device is also used to transport the substrate to the discharging chamber.

[0011] In some implementations, the flash evaporation equipment also includes: a carrier plate for carrying multiple substrates; wherein the transport device is also used to transport the carrier plate between multiple process chambers along the transport direction.

[0012] In some implementations, the carrier plate has a limiting part for limiting the substrate; and / or, the carrier plate has multiple carrier areas for placing the substrate, the multiple carrier areas are spaced apart, and there are gaps between the carrier areas; the carrier plate also has multiple through-holes to allow gas to pass through the carrier plate, the through-holes being located in the carrier areas and / or the gaps.

[0013] In some implementations, when the diversion hole is located in the substrate area, the carrier plate also has multiple support portions located in the substrate area to support the substrate so that gas passes through the gap between the substrate and the carrier plate and the diversion hole.

[0014] In some implementations, at least a portion of the inner wall of the process cavity has an anti-corrosion protective film, the material of which is one of polytetrafluoroethylene, aluminum, polypropylene, polymethyl methacrylate, polyetherketone, and polyetheretherketone.

[0015] The flash evaporation equipment provided in this embodiment includes a process chamber and a self-cleaning device. The self-cleaning device is disposed in the process chamber and is used to clean the deposits formed on the inner wall of the process chamber during the process, realizing automatic cleaning of the deposits and self-cleaning of the flash evaporation equipment, thereby improving the automation level of the flash evaporation equipment. Attached Figure Description

[0016] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1 The diagram shown is a structural schematic of a flash evaporation device provided in an embodiment of this application.

[0018] Figure 2 The image shown is a top view of a flash evaporation device provided in an embodiment of this application.

[0019] Figure 3 The diagram shown is a structural schematic of a flash evaporation device provided in another embodiment of this application.

[0020] Figure 4 The image shown is an embodiment provided by this application. Figure 3 Cross-sectional view of the flash evaporator along line AA.

[0021] Figure 5 The diagram shown is a structural schematic of a flash evaporation device provided in another embodiment of this application.

[0022] Figure 6 The image shown is a top view of a flash evaporation device provided in another embodiment of this application.

[0023] Figure 7 The diagram shown is a structural schematic of an application scenario suitable for a carrier board provided by an embodiment of this application.

[0024] Figure 8 The image shown is an embodiment provided by this application. Figure 7 The image shown is a top view of an application scenario suitable for carrier boards.

[0025] Figure 9 The image shown is an embodiment provided by this application. Figure 7 The left view shown is for an application scenario suitable for a carrier board.

[0026] Figure label:

[0027] 10. Flash evaporation equipment; 11. Process chamber; 110. Process chamber; 111. Opening; 112. Process chamber body; 113. Chamber door; 12. Self-cleaning device; 120. Heating assembly; 121. Vacuum assembly; 13. Crystallization device; 130. Crystallization vacuum assembly; 14. Filter device; 15. Flow equalization device; 16. Valve; 17. Conveying device; 170. Synchronous pulley; 171. Driven pulley; 172. Connecting shaft; 18. Loading platform; 19. Atmosphere protection device; 20. Substrate; 21. Loading chamber; 22. Loading vacuum device; 23. Unloading chamber; 24. Vacuum blowing device; 25. Carrier plate; 250. Guide bar; 251. Limiting part; 252. Carrier area; 253. Interval area; 254. Diverter hole; 255. Support part; 256. Carrier plate body; X, Conveying direction. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] Figure 1 The diagram shown is a structural schematic of a flash evaporation device provided in an embodiment of this application.

[0030] like Figure 1 As shown, the flash evaporation equipment 10 includes a process chamber 11 and a self-cleaning device 12. The process chamber 11 has a process cavity 110 configured to accommodate at least one substrate. During the process, deposits form on the inner wall of the process chamber 11. The self-cleaning device 12 is disposed in the process chamber 11 for cleaning the deposits.

[0031] The flash evaporation equipment 10 can be any equipment capable of performing a flash evaporation process. The flash evaporation equipment 10 can also be used to perform other processes besides flash evaporation. Exemplarily, the substrate can include at least one of a silicon wafer, a solar cell, a silicon wafer, and a glass plate. Exemplarily, the adhering substance can be a liquid. Exemplarily, the adhering substance can be an organic substance.

[0032] The self-cleaning device 12 is disposed in the process chamber 11 to achieve self-cleaning of the inner wall of the process chamber 11. The self-cleaning device 12 can be any device capable of cleaning adhering substances. Exemplarily, the self-cleaning device 12 can be used to discharge adhering substances from the process chamber 110. For example, the self-cleaning device 12 can be used to collect adhering substances and discharge adhering substances from the process chamber 110.

[0033] In one implementation of this embodiment, the self-cleaning device 12 includes a drive assembly, a collector connected to the drive assembly, and a drainer disposed in the process chamber 11. The collector can be used to collect deposits formed on the inner wall of the process chamber 11. The drive assembly can be used to drive the collector to move along the inner wall of the process chamber 11 to collect the deposits, and can also be used to drive the collector to the drainer and drive the collector to discharge or pour the collected deposits into the drainer. The drainer can be used to discharge the deposits from the process chamber 110. With this configuration, the chamber door of the process chamber 11 does not need to be opened during the collection and discharge of deposits, thus avoiding contamination of the process chamber 110.

[0034] Exemplarily, the collector can be scoop-shaped or shovel-shaped to collect adhering materials into the collector using its edges. Exemplarily, the drive assembly can include one or more combinations of the following drive structures: conveyor belt, gear set, sprocket chain, lead screw guide, power cylinder, motor, and crank-slider. For example, the drive assembly can be a robotic arm. Exemplarily, the drainer can include a drain pipe and two port valves. One end of the drain pipe can communicate with the process chamber 110, and the other end can communicate with the outside. Port valves are respectively provided at both ends of the drain pipe. When it is necessary to receive adhering materials, the port valve controlling the connection between the drain pipe and the process chamber 110 is opened. When it is necessary to discharge adhering materials, the port valve controlling the connection between the drain pipe and the process chamber 110 can be closed, and the port valve controlling the connection between the drain pipe and the outside is opened. By providing two port valves, the vacuum in the process chamber 110 can be prevented, thus accelerating the production pace.

[0035] The flash evaporation equipment 10 provided in this embodiment includes a process chamber 11 and a self-cleaning device 12. The self-cleaning device 12 is disposed in the process chamber 11 and is used to clean the deposits formed on the inner wall of the process chamber 11 during the process. This realizes automatic cleaning of the deposits and self-cleaning of the flash evaporation equipment 10, thereby improving the automation level of the flash evaporation equipment 10.

[0036] In some embodiments, the self-cleaning device 12 is used to vaporize the adhering material and discharge the vaporized adhering material from the process chamber 110. Exemplarily, the self-cleaning device 12 may include a vacuum assembly 121 disposed in the process chamber 11. The vacuum assembly 121 reduces the gas pressure in the process chamber 110, thereby lowering the boiling point of the adhering material, accelerating its evaporation or causing it to boil, and discharging the vaporized adhering material from the process chamber 110.

[0037] Figure 2 The image shown is a top view of a flash evaporation device provided in an embodiment of this application.

[0038] In some embodiments, such as Figure 1 and Figure 2As shown, the self-cleaning device 12 includes a heating assembly 120 and an extraction assembly 121. The heating assembly 120 is disposed in the process chamber 11 and is used to heat the process chamber 110 to vaporize the deposits. The extraction assembly 121 is disposed in the process chamber 11 and communicates with the process chamber 110, and is used to extract the vaporized deposits from the process chamber 110.

[0039] Exemplarily, the heating assembly 120 may be disposed in the process chamber 110 for dissipating heat. Exemplarily, the heating assembly 120 may include a heating chamber and a heating wire disposed in the heating chamber. Exemplarily, the heating assembly 120 may also include a heating plate. Exemplarily, the vaporization of the deposit may include the evaporation of the deposit or the boiling of the deposit.

[0040] Exemplarily, the number of pumping assemblies 121 can be one or more. Pumping assembly 121 may include a vacuum pump. In one implementation, such as... Figure 1 As shown, the vacuum assembly 121 and the heating assembly 120 can be disposed on the same side. Exemplarily, the vacuum assembly 121 and the heating assembly 120 are disposed at the top of the process chamber 11. In another implementation, the vacuum assembly 121 and the heating assembly 120 can be disposed opposite to each other. Exemplarily, the vacuum assembly 121 can be disposed at the bottom of the process chamber 11, and the heating assembly 120 can be disposed at the top of the process chamber 11.

[0041] In some applications, the process chamber 110 may not contain a substrate, in which case the self-cleaning device 12 can be activated. The heating component 120 heats the process chamber 110, causing the deposits to vaporize. The vacuum component 121 then removes the vaporized deposits from the process chamber 110. Exemplarily, the heating component 120 and the vacuum component 121 can be activated simultaneously. This allows the vacuum component 121 to reduce the air pressure in the process chamber 110, lower the boiling point of the deposits, accelerate vaporization, improve cleaning efficiency, and speed up production.

[0042] For example, the self-cleaning device 12 is used to clean the deposits during the maintenance or shutdown phase of the process chamber 11.

[0043] The flash evaporation equipment 10 provided in this embodiment includes a self-cleaning device 12 comprising a heating component 120 and an extraction component 121. The heating component 120 heats the process chamber 110 to vaporize the deposits, and the extraction component 121 extracts the vaporized deposits from the process chamber 110. This configuration allows for automatic cleaning of deposits without opening the process chamber 110, and is simple in structure and easy to implement.

[0044] In some embodiments, the flash evaporation apparatus 10 further includes a crystallization promoting device 13. The crystallization promoting device 13 is disposed in the process chamber 11 and can be used to vaporize the solvent in the solution on the substrate surface, causing the solute in the solution to crystallize. Exemplarily, the crystallization promoting device 13 can promote the vaporization of the solvent in the solution by heating, vacuuming, or a combination of heating and vacuuming.

[0045] In some implementations, the crystallization device 13 can promote solvent vaporization in the solution by vacuuming. Compared to heating, vacuuming makes the gas pressure in the process chamber 110 more uniform, resulting in a more uniform thin film formed on the substrate. In one implementation, the evacuation assembly 121 can be used as the crystallization device 13 to evacuate the process chamber 110 during the process stage. In another implementation, the crystallization device 13 can include a crystallization evacuation assembly 130. Exemplarily, the ultimate pressure of the evacuation assembly 121 can be higher than that of the crystallization evacuation assembly 130. This configuration can reduce the cost of the self-cleaning device 12. The crystallization evacuation assembly 130 operates during the process stage, while the evacuation assembly 121 can operate outside the process stage. Figure 1 As shown, in this embodiment, the evacuation component 121 is used as a crystallization device 13 to evacuate the process chamber 110 during the process stage.

[0046] For example, the heating assembly 120 is disposed at the top of the process chamber 11, and the crystallization device 13 may be disposed at the top or bottom of the process chamber 11.

[0047] Figure 3 The diagram shown is a structural schematic of a flash evaporation device provided in an embodiment of this application. Figure 4 The image shown is an embodiment provided by this application. Figure 3 Cross-sectional view of the flash evaporator along line AA.

[0048] like Figure 3 and Figure 4 As shown, the flash evaporation equipment 10 also includes a filter device 14. The filter device 14 is disposed between the extraction assembly 121 and the process chamber 110, and communicates with both the extraction assembly 121 and the process chamber 110, filtering the gas extracted from the process chamber 110. This arrangement prevents the extraction assembly 121 from being corroded by vaporized deposits, thus extending the service life of the extraction assembly 121.

[0049] For example, the filter device 14 contains purification particles capable of purifying vaporized deposits. The purification particles can react chemically or physically with the vaporized deposits to filter the extracted gas.

[0050] For example, the filter device 14 may also be disposed between the crystallization-promoting gas extraction component 130 and the process chamber 110, and communicate with the crystallization-promoting gas extraction component 130 and the process chamber 110 to filter the gas extracted by the crystallization-promoting gas extraction component 130 in the process chamber 110.

[0051] In some embodiments, the flash evaporation device 10 further includes a flow equalization device 15. The flow equalization device 15 is disposed at the extraction end of the extraction assembly 121, and the extraction assembly 121 is connected to the process chamber 110 through the flow equalization device 15. This arrangement can reduce the resistance and turbulence of gas during the extraction process, improve the extraction efficiency when removing vaporized deposits, and help reduce extraction time, energy consumption, and cost.

[0052] For example, the flow equalization device 15 includes a flow equalization cavity. A plurality of flow equalization holes are evenly distributed on the flow equalization cavity. The flow equalization holes are in communication with both the air extraction assembly 121 and the process chamber 110.

[0053] In some embodiments, the flow equalization device 15 may also be disposed at the extraction end of the crystallization-promoting extraction assembly 130, which is connected to the process chamber 110 via the flow equalization device 15. This arrangement facilitates the maintenance of uniform gas pressure in the process chamber 110 during the flash evaporation process, which is beneficial for increasing the uniformity of the film formed on the substrate.

[0054] Figure 5 The diagram shown is a structural schematic of a flash evaporation device provided in another embodiment of this application. Figure 6 The image shown is a top view of a flash evaporation device provided in another embodiment of this application.

[0055] like Figure 5 and Figure 6 As shown, there are multiple process chambers 11, which are arranged sequentially along the substrate transport direction X. The flash evaporation equipment 10 also includes multiple valves 16 and a transport device 17.

[0056] Valves 16 can be installed between adjacent process chambers 11 to cut off or connect adjacent process chambers 110, or between a process chamber 11 and the outside to cut off or connect a process chamber 110 to the outside. This arrangement allows each process chamber 110 to form a sealed space. A transport device 17 is installed adjacent to the process chambers 11 and is used to transport the substrate between multiple process chambers 110 along the transport direction X.

[0057] The processes performed in different process chambers 11 can be the same or different processes. For example, at least one of the multiple process chambers 11 is used for a flash evaporation process. For example, each process chamber 11 may be equipped with a self-cleaning device 12 and a crystallization promoting device 13. For example, at least one of the multiple process chambers 11 may also be used for processes other than flash evaporation.

[0058] For example, the transport device 17 may include a plurality of rollers for transporting the substrate by rotation. For example, the transport device 17 may also include a conveyor belt, such as a metal mesh belt, for transporting the substrate.

[0059] For example, the process chamber 11 has openings 111 on opposite sides along the transport direction X. A valve 16 can be used to open or close the openings 111. A transport device 17 can transport the substrate into or out of the process chamber 110 through the openings 111.

[0060] In some applications, the valve 16 in the first process chamber 11, in the opposite direction of transport direction X, is opened to allow the substrate to enter the first process chamber 11. Then, the valve 16 in the first process chamber 11, in the opposite direction of transport direction X, is closed, and the substrate undergoes a flash evaporation process in the first process chamber 11. In the first process chamber 11, the crystallization-promoting degassing assembly 130 maintains the gas pressure in the process chamber 110 at a first pressure. After the process in the first process chamber 11 is completed, the valve 16 in the first process chamber 11, in the transport direction X, is opened, and the transport device 17 transports the substrate to the second process chamber 11. Then, the valve 16 in the first process chamber 11, in the transport direction X, is closed, and the substrate undergoes a flash evaporation process in the second process chamber 11. In the second process chamber 11, the crystallization-promoting degassing assembly 130 maintains the gas pressure in the process chamber 110 at a second pressure. The second pressure can be lower than the first pressure. This achieves a continuous flash evaporation process. For example, along the transport direction X, the air pressure corresponding to the process chamber 110 decreases sequentially.

[0061] The flash evaporation equipment 10 provided in this embodiment also includes multiple valves 16 and a transport device 17. The valves 16 control the connection or disconnection between adjacent process chambers 110 and the outside world, so that each process chamber 110 can be processed independently without affecting each other, and multiple process chambers 110 can be processed simultaneously. The transport device 17 transports the substrate between multiple process chambers 110 along the transport direction X, and can also make the substrate continuously undergo flash evaporation or multiple processes in multiple process chambers 110 in sequence, thereby improving production efficiency.

[0062] Furthermore, while one process chamber 110 is self-cleaning, the substrate can still be processed in other process chambers, further improving production efficiency.

[0063] In some embodiments, the flash evaporation apparatus 10 further includes a loading platform 18 and an atmosphere protection device 19. The loading platform 18 is disposed on one side of the plurality of process chambers 11 in the opposite direction to the transport direction X. The atmosphere protection device 19 is disposed on the loading platform 18 and is used to output a protective gas to isolate the atmosphere from the solution-containing surface of the substrate. The transport device 17 is also used to transport the substrate on the loading platform 18 to the process chamber 110.

[0064] Specifically, the transport device 17 is also adjacent to the loading platform 18. Exemplarily, the loading platform 18 can be an open structure, such as an open platform or an open chamber, for substrate loading.

[0065] Exemplarily, the atmosphere protection device 19 is capable of providing a protective gas, such as an inert gas (e.g., nitrogen). The atmosphere protection device 19 has a gas outlet. The gas outlet faces the loading platform 18. The protective gas is output from the gas outlet. Exemplarily, the atmosphere protection device 19 may include a nitrogen cylinder.

[0066] The flash evaporation equipment 10 provided in this embodiment also includes a loading platform 18 and an atmosphere protection device 19. The transport device 17 is also used to transport the substrate on the loading platform 18 to the process chamber 110. This arrangement facilitates the automated loading of the substrate. Furthermore, when the substrate is located on the loading platform 18 but has not entered the process chamber 110, the atmosphere protection device 19 can also protect the surface of the substrate with solution, preventing the surface from being contaminated or oxidized by the atmosphere.

[0067] In some embodiments, such as Figure 5 As shown, the flash evaporation equipment 10 also includes a feeding chamber 21 and a feeding extraction device 22. The feeding chamber 21 is located between the feeding platform 18 and the process chamber 11. A valve 16 is provided between the feeding platform 18 and the feeding chamber 21 to allow the feeding chamber 21 to communicate or not communicate with the feeding platform 18. A valve 16 is also provided between the feeding chamber 21 and the process chamber 11 to allow the feeding chamber 21 to communicate or not communicate with the process chamber 110. The feeding extraction device 22 is located in and communicates with the feeding chamber 21 for extracting air from the feeding chamber 21. The transport device 17 is also used to transport the substrate on the feeding platform 18 to the feeding chamber 21.

[0068] Specifically, the transport device 17 is also arranged adjacent to the loading chamber 21. By setting up the loading chamber 21 and the loading exhaust device 22, the process chamber 110 can be isolated from the outside. When the substrate enters the loading chamber 21, the loading exhaust device 22 can extract the gas in the loading chamber 21 away from the loading chamber 21 to avoid external air contamination of the process chamber 110.

[0069] In some applications, valve 16 between the loading platform 18 and the loading chamber 21 is opened to allow the substrate to be transported into the loading chamber 21. When valve 16 is open, the air pressure in the loading chamber 21 is equal to that in the outside. Then, the loading vacuum device 22 evacuates the gas from the loading chamber 21. After evacuation, valve 16 between the loading chamber 21 and the process chamber 11 is opened, and the substrate is transported into the process chamber 110. When valve 16 is open, the air pressure in the loading chamber 21 is equal to that in the process chamber 11.

[0070] For example, the structure of the feeding chamber 21 can be referred to Figure 3 and Figure 4 The loading chamber 21 can also be equipped with a crystallization-promoting device 13 and a self-cleaning device 12. This configuration allows for the first flash evaporation process (also known as a primary flash evaporation process) of the substrate. The ultimate pressure of the suction assembly 121 and / or the crystallization-promoting suction assembly 130 corresponding to the loading chamber 21 can be higher than the ultimate pressure of the suction assembly 121 and / or the crystallization-promoting suction assembly 130 corresponding to the process chamber 110. This configuration can avoid external air contamination of the process chamber 110 and can also achieve the first flash evaporation process using a lower-cost structure. For example, the suction assembly 121 and / or the crystallization-promoting suction assembly 130 can serve as the loading suction device 22.

[0071] In some embodiments, such as Figure 5 As shown, the flash evaporation equipment 10 also includes a feeding chamber 23 and an air extraction and blowing device 24. The feeding chamber 23 is located on one side of the plurality of process chambers 11 along the transport direction X. A valve 16 is provided between the feeding chamber 23 and the process chamber 11 to allow the feeding chamber 23 to communicate or not communicate with the process chamber 110. A valve 16 may also be provided between the feeding chamber 23 and the outside world to allow the feeding chamber 23 to communicate or not communicate with the outside world of the process chamber 110. The air extraction and blowing device 24 is located in and communicates with the feeding chamber 23 and is used to extract air from the feeding chamber 23. The transport device 17 is also used to transport the substrate to the feeding chamber 23.

[0072] In some applications, the suction and blowing device 24 evacuates air from the feeding chamber 23, making the air pressure in the feeding chamber 23 equal to the air pressure in the adjacent process chamber 110. Then, the valve 16 between the feeding chamber 23 and the process chamber 11 opens, and the substrate is transported to the feeding chamber 23. The suction and blowing device 24 blows air into the feeding chamber 23, making the air pressure in the feeding chamber 23 equal to the external air pressure. Then, the valve 16 between the feeding chamber 23 and the outside opens, and the substrate is removed from the feeding chamber 23.

[0073] Specifically, the transport device 17 is also arranged adjacent to the unloading chamber 23. By setting up the unloading chamber 23 and the air extraction and blowing device 24, the process chamber 110 can be isolated from the outside world, and the substrate can be removed from the flash evaporation equipment 10 through the unloading chamber 23, thus avoiding external air contamination of the process chamber 110.

[0074] In some embodiments, the vacuum assembly 121 may have a blowing function. The crystallization-promoting vacuum assembly 130 may also have a blowing function. This arrangement allows for pressure control of the corresponding chambers.

[0075] Figure 7 The diagram shown is a structural schematic of an application scenario suitable for a carrier board provided by an embodiment of this application. Figure 8 The image shown is an embodiment provided by this application. Figure 7 The image shown is a top view of an application scenario suitable for carrier boards. Figure 9 The image shown is an embodiment provided by this application. Figure 7 The left view shown is for an application scenario suitable for a carrier board.

[0076] like Figures 6 to 9 As shown, the flash evaporation apparatus 10 also includes a carrier plate 25. The carrier plate 25 is used to support multiple substrates 20. The transport device 17 is also used to transport the carrier plate 25 between multiple process chambers 110 along the transport direction X.

[0077] Specifically, the process chamber 110 is also used to accommodate one or more carrier plates 25. Exemplarily, when the carrier plate 25 is transported by the transport device 17, the carrier plate 25 is in a horizontal state. The flash evaporation device 10 can be a plate-type device or a horizontal device. Exemplarily, the heating assembly 120 can be located above the carrier plate 25, and the suction end of the suction assembly 121 can be located below the carrier plate 25. Exemplarily, both the heating assembly 120 and the suction end of the suction assembly 121 can be located above the carrier plate 25. Exemplarily, the flash evaporation device 10 can be a plate-type device or a horizontal device, and the process chamber 11 includes a process chamber body 112 and a chamber door 113. The chamber door 113 is openable and closable on the top of the process chamber body 112. The chamber door 113 and the process chamber body 112 enclose the process chamber 110.

[0078] Exemplarily, the carrier plate 25 may be plate-shaped. Exemplarily, the material of the carrier plate 25 may be metal. Exemplarily, the transport device 17 may include a plurality of synchronous pulleys 170, a plurality of driven pulleys 171, and a plurality of connecting shafts 172. The connecting shafts 172 are rotatably spaced along the transport direction X in the process cavity 11. One or more synchronous pulleys 170 are provided at one end of the connecting shaft 172 away from the process cavity 11, and the other end of the connecting shaft 172 passes through the process cavity 11 into the process chamber 110 and is provided with a driven pulley 171. One or more synchronous pulleys 170, driven pulleys 171, and the connecting shaft 172 are coaxially arranged. The process cavity 11 has a plurality of connecting shafts 172 rotatably spaced along both sides perpendicular to the transport direction X. The carrier plate 25 contacts the driven pulleys 171 on both sides perpendicular to the transport direction X. The driven wheel 171 is rotated by the synchronous pulley 170, thereby causing the driven wheel 171 to move the carrier plate 25 along the transport direction X. Exemplarily, the transport device 17 may also include a motor and a synchronous belt to drive multiple synchronous pulleys 170 to rotate synchronously.

[0079] For example, the carrier plate 25 has guide bars 250 on opposite sides perpendicular to the transport direction X. The two guide bars 250 are respectively disposed on two rows of driven wheels 171 perpendicular to the transport direction X in the process chamber 110. Since the guide bars 250 extend along the transport direction X and cooperate with the driven wheels 171, they can prevent the carrier plate 25 from shifting or tilting during movement, ensuring that the carrier plate 25 moves smoothly and linearly, increasing the stability of the carrier plate 25 during movement. For example, the driven wheels 171 drive the carrier plate 25 to move through friction.

[0080] The flash evaporation equipment 10 provided in this embodiment also includes a carrier plate 25, which can carry multiple substrates 20, enabling the simultaneous and stable transportation of multiple substrates 20 and meeting the market's demand for large-capacity flash evaporation equipment 10.

[0081] In some embodiments, such as Figures 7 to 9 As shown, the carrier plate 25 has a limiting portion 251, which is used to limit the substrate 20. By providing the limiting portion 251, the substrate 20 can be prevented from shaking significantly during transportation or processing, and damage caused by the substrates 20 colliding with each other can be prevented. Exemplarily, the limiting portion 251 may include one or more limiting posts.

[0082] In some embodiments, such as Figures 7 to 9As shown, the carrier plate 25 has multiple substrate areas 252 for mounting the substrate 20. The multiple substrate areas 252 are spaced apart, with gaps 253 between them. The carrier plate 25 also has multiple through-holes 254 to allow gas to pass through it. The through-holes 254 can be located in either the substrate areas 252 or in the gaps 253.

[0083] Specifically, the diversion hole 254 penetrates the carrier plate 25 along its thickness direction. Exemplarily, the area enclosed by the limiting portion 251 defines the sheet region 252. Exemplarily, the limiting portion 251 is disposed at the edge of one or more sheet regions 252.

[0084] By providing multiple diversion holes 254, the gas in the chamber containing the carrier plate 25 can flow smoothly when the chamber is evacuated. During the flash evaporation process, the solvent in the solution vaporizes and can pass through the carrier plate 25 via the diversion holes 254, which is beneficial for the uniform distribution of gas pressure and improves the uniformity of the film formed on the substrate 20. When the self-cleaning device 12 cleans the deposits, the vaporized deposits can pass smoothly through the carrier plate 15 and be extracted from the chamber.

[0085] In this embodiment, the flow diversion holes 254 are evenly distributed in the substrate area 252 and the interval area 253.

[0086] In some embodiments, when the diversion hole 254 is provided in the substrate region 252, the carrier plate 25 also has a plurality of support portions 255. The support portions 255 are provided in the substrate region 252 to support the substrate 20 so that gas passes through the gap between the substrate 20 and the carrier plate 25 and the diversion hole 254.

[0087] Since the diversion hole 254 is provided in the substrate area 252, when the substrate 20 is supported by the carrier plate 25, the substrate 20 may close the diversion hole 254. By providing the support part 255 in the substrate area 252, a gap can be made between the substrate 20 and the diversion hole 254, and the gas flows to or out of the diversion hole 254 through the gap.

[0088] Exemplarily, the carrier plate 25 includes a carrier plate body 256 and a limiting portion 251. The limiting portion 251 is disposed on the side of the carrier plate body 256 for supporting the substrate 20. Exemplarily, a diversion hole 254 penetrates through the carrier plate body 256. Exemplarily, a support portion 255 may be disposed on the side of the carrier plate body 256 for supporting the substrate 20 to space the carrier plate body 256 and the substrate 20, so that the substrate 20 does not adhere tightly to the carrier plate body 256.

[0089] For example, the support portion 255 may be a support column. Along the thickness direction of the carrier plate 25, the size of the support portion 255 is smaller than the size of the limiting portion 251.

[0090] In some embodiments, at least a portion of the inner wall of the process chamber 11 has an anti-corrosion protective film. The material of the anti-corrosion protective film is one of polytetrafluoroethylene, aluminum, polypropylene, polymethyl methacrylate, polyetherketone, and polyetheretherketone. By providing an anti-corrosion protective film, at least a portion of the inner wall of the process chamber 11 can be protected from corrosion, for example, by solvents or deposits in the vaporized solution, thus extending the service life of the flash evaporation equipment 10.

[0091] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “featuring,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0092] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0093] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0094] The above description has been given for illustrative and descriptive purposes. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A flash evaporation apparatus, characterized by, include: A process cavity having a process chamber configured to accommodate at least one substrate, wherein an adhering substance is formed on the inner wall of the process cavity during the process; A self-cleaning device is installed in the process chamber to clean the attached substances.

2. The flash evaporation equipment according to claim 1, characterized in that, The self-cleaning device includes: A heating component is disposed in the process chamber and is used to heat the process chamber to vaporize the deposits; An extraction assembly is disposed in the process cavity and communicates with the process chamber, and is used to extract the vaporized deposits from the process chamber.

3. The flash apparatus according to claim 2, wherein Also includes: A filtration device is disposed between the air extraction assembly and the process chamber, and is connected to both the air extraction assembly and the process chamber, for filtering the gas extracted from the process chamber.

4. The flash evaporation equipment according to any one of claims 1 to 3, characterized in that, The number of process cavities is multiple, and the multiple process cavities are arranged sequentially along the transport direction of the substrate; The flash evaporation equipment also includes: Multiple valves are disposed between adjacent process chambers to cut off or connect adjacent process chambers, and are also disposed between the process chamber and the outside to cut off or connect the process chamber to the outside; A transport device, disposed adjacent to the process chamber, is used to transport the substrate between the plurality of process chambers along the transport direction.

5. The flash evaporation equipment according to claim 4, characterized in that, Also includes: A loading platform is located on one side of the plurality of process chambers in the opposite direction to the transport direction; An atmosphere protection device is installed on the loading platform to output protective gas to isolate the atmosphere from the surface of the substrate that has a solution. The transport device is also used to transport the substrate on the loading platform to the process chamber.

6. The flash apparatus according to claim 5, wherein Also includes: A feeding chamber is disposed between the feeding platform and the process chamber. The valve is provided between the feeding platform and the feeding chamber, and between the feeding chamber and the process chamber, so that the feeding chamber may be connected to or not connected to the feeding platform and / or the process chamber. A feeding and degassing device is installed in and communicates with the feeding chamber, and is used to degas the feeding chamber. The transport device is further configured to transport the substrate on the loading platform to the loading cavity; and / or, A feeding chamber is provided on one side of the plurality of process chambers along the transport direction. The valve is provided between the feeding chamber and the process chamber and between the feeding chamber and the outside, so that the feeding chamber may be connected to or not connected to the process chamber and / or the outside. An air extraction and blowing device is provided in and connected to the feeding chamber, and is used to extract or blow air into the feeding chamber. The transport device is also used to transport the substrate to the unloading chamber.

7. The flash evaporation apparatus of claim 4, wherein, Also includes: Carrier plate, used to support multiple substrates; The transport device is also used to transport the carrier plate between the plurality of process chambers along the transport direction.

8. The flash evaporation equipment according to claim 7, characterized in that, The carrier plate has a limiting portion, which is used to limit the position of the substrate; and / or, The carrier plate has multiple carrier areas for mounting the substrate. The multiple carrier areas are spaced apart, with gaps between them. The carrier plate also has multiple flow-diverting holes that penetrate the carrier plate to allow gas to pass through it. The flow-diverting holes are located in the carrier areas and / or the gaps.

9. The flash evaporation equipment according to claim 8, characterized in that, When the diversion hole is located in the substrate area, the carrier plate also has a plurality of support portions located in the substrate area for supporting the substrate so that the gas passes through the gap between the substrate and the carrier plate and the diversion hole.

10. The flash evaporation apparatus according to any one of claims 1 to 3, characterized by At least a portion of the inner wall of the process chamber has an anti-corrosion protective film, the material of which is one of polytetrafluoroethylene, aluminum, polypropylene, polymethyl methacrylate, polyetherketone, and polyetheretherketone.

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