Cooling device of semiconductor wafer cutting machine

Abstract

The utility model discloses a cooling device of a semiconductor wafer cutting machine, relates to the technical field of semiconductor wafer cutting machines, and aims to solve the problem of overload caused by overheat of elements due to long-time operation of existing semiconductor wafer cutting equipment under the condition of long-time use. The cutting cavity is installed in the front end of the semiconductor wafer cutting machine body, a laser cutting mechanism is arranged in the cutting cavity, a connecting pipe fitting is arranged on the lower end face of the laser cutting mechanism, a cutting end is arranged on the lower end face of the connecting pipe fitting, and an overturning baffle plate is arranged at the lower end of the cutting end. The overturning baffle plate is rotationally connected with the cutting end through a first rotating center shaft, the cooling water pipe is installed on the outer wall of the cutting end by a circle, and the cooling water pipe is connected with a semiconductor wafer cutting machine body pipeline through a conveying pipeline.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer dicing machine technology, specifically to a cooling device for a semiconductor wafer dicing machine. Background Technology

[0002] In semiconductor device fabrication, silicon wafers are used as substrate materials to fabricate integrated circuit chips on the wafer surface. In these devices, functional chips are distributed in a lattice pattern across the entire silicon wafer surface. Before packaging the chips, they need to be cut and separated from the wafer to become independent devices. Currently, commonly used laser cutting methods select infrared light that is transparent or semi-transparent to silicon, focusing it inside the wafer to form a modification layer. By guiding the propagation of cracks in the modification layer, non-destructive cutting of the silicon wafer can be performed, i.e., laser stealth cutting.

[0003] For example, the Chinese authorized patent, CN218638835U, entitled "(A Laser Cutting Machine for Semiconductor Wafer Processing)," includes: a base; a laser cutting mechanism for laser cutting semiconductor wafers, the laser cutting mechanism being mounted on the top of the base; and a clamping mechanism including a motor, a horizontal block, and a clamp, the motor being mounted on one side of the base, a transmission rod being rotatably connected inside the horizontal block, and the output shaft of the motor being connected to the transmission rod. In use, when performing oblique cutting on the semiconductor wafer, the motor drives the transmission rod to rotate, the transmission rod drives a second gear to rotate via a first gear, and the second gear drives the clamp to rotate via a connecting rod, thereby adjusting the tilt angle of the clamp. This facilitates oblique angle cutting of the semiconductor wafer and allows for uniform adjustment of the clamp tilt angle, making it convenient to use and providing higher cutting precision.

[0004] However, existing semiconductor wafer dicing equipment can cause components to overheat and overload during prolonged use, thus failing to meet current requirements. Therefore, we propose a cooling device for semiconductor wafer dicing machines. Utility Model Content

[0005] The purpose of this invention is to provide a cooling device for a semiconductor wafer dicing machine to solve the problem mentioned in the background art that existing semiconductor wafer dicing equipment will overheat due to prolonged operation, resulting in overload.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a cooling device for a semiconductor wafer dicing machine, comprising: a semiconductor wafer dicing machine body, an acrylic plate disposed on the upper part of the front end face of the semiconductor wafer dicing machine body, a shielding door plate disposed on the front end face of the acrylic plate, the shielding door plate being flipped and connected to the acrylic plate via a rotating shaft, and an operating table disposed on the front end face of the semiconductor wafer dicing machine body;

[0007] Also includes:

[0008] A cutting cavity is installed inside the front end of the semiconductor wafer dicing machine body. A laser cutting mechanism is provided inside the cutting cavity. A connecting pipe is provided on the lower end face of the laser cutting mechanism. A cutting end is provided on the lower end face of the connecting pipe. A flip-blocking plate is provided at the lower end of the cutting end. The flip-blocking plate is rotatably connected to the cutting end through a first rotation center axis.

[0009] A cooling water pipe is installed around the outer wall of the cutting end, and the cooling water pipe is connected to the main pipe of the semiconductor wafer dicing machine through a delivery pipe.

[0010] Preferably, a water mist spray head is provided on the upper part of the inner wall of the cutting cavity, and two water mist spray heads are provided. The two water mist spray heads are respectively installed on both sides of the laser cutting mechanism, and a duct output end is provided on the lower side of the inner wall of the cutting cavity.

[0011] Preferably, a sealing plate is provided on the end face of the duct output end, and one side of the sealing plate is rotatably connected to the duct output end through a second rotation center shaft.

[0012] Preferably, a placement groove is provided at the lower part of the cutting cavity, a reserved groove is provided at the middle position of the inner wall of the cutting cavity, a first connecting rod is provided on the rear end face of the laser cutting mechanism, a connecting end is provided at the rear end of the first connecting rod, and a sealing cover is provided on both the upper and lower sides of the first connecting rod, and the side of the sealing cover is fixedly connected to the inner wall of the reserved groove.

[0013] Preferably, a hydraulic telescopic rod is provided at the lower end of the connecting end, a hydraulic mechanism is provided at the lower end of the hydraulic telescopic rod, a moving rail is provided below the hydraulic mechanism, a pulley is provided inside the moving rail, a second connecting rod is provided on the lower end face of the hydraulic mechanism, and a servo motor is provided on the outside of one side of the second connecting rod. The servo motor can drive the pulley to move back and forth on the moving rail, and the servo motor moves back and forth synchronously with the inner wall rail of the semiconductor wafer dicing machine body.

[0014] Preferably, the lower part of the front end face of the semiconductor wafer dicing machine body is provided with a flip-up door panel, and there are two flip-up door panels. A heat dissipation hole is provided on one side of the semiconductor wafer dicing machine body, and there are several heat dissipation holes.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. This utility model, through the setting of cooling water pipe, conveying pipe, water mist spraying end, air duct output end and sealing plate, allows cooling water to be conveyed to the cooling water pipe 500 through the conveying pipe 501 when the cutting end 402 is in use. The water flows around the cutting end 402 and is returned through the other end of the pipe. After the cutting operation is completed, the condensed water is atomized and sprayed out through the water mist spraying end 600 and adsorbed on the outer wall of the internal component. Then the blower mechanism is turned on and output from one end of the air duct output end 700 to blow open the sealing plate 701, so that the air evaporates the atomized water droplets, thereby removing the heat generated during the internal operation and reducing the phenomenon of thermal overload. This effectively avoids the problem of overheating of components and overload caused by long-term operation of existing semiconductor wafer cutting equipment. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a side view of the internal structure of the present invention;

[0019] Figure 3 This is a frontal view of the internal structure of the semiconductor wafer dicing machine of this utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the duct output end of this utility model when in use;

[0021] Figure 5 This is a partial enlarged view of point A of this utility model;

[0022] In the diagram: 100, main body of the semiconductor wafer dicing machine; 1001, acrylic plate; 1002, placement slot; 1003, reserved slot; 1004, sealing cover; 101, shielding door panel; 102, rotating shaft; 103, operating table; 104, flipping door panel; 105, heat dissipation hole; 106, moving rail; 200, cutting cavity; 300, hydraulic mechanism; 301, hydraulic telescopic rod; 302, connecting end; 30 3. First connecting rod body; 304. Second connecting rod body; 305. Servo motor; 306. Pulley; 400. Laser cutting mechanism; 401. Connecting pipe; 402. Cutting end; 403. Flipping baffle plate; 404. First rotating central shaft; 500. Cooling water pipe; 501. Conveying pipe; 600. Water mist spray end; 700. Air duct output end; 701. Sealing plate; 702. Second rotating central shaft. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] In the description of this utility model, it should be noted that the terms "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0025] Example 1

[0026] Please see Figure 1-5 The present invention provides an embodiment of a cooling device for a semiconductor wafer dicing machine, comprising: a semiconductor wafer dicing machine body 100, an acrylic plate 1001 disposed on the upper part of the front end face of the semiconductor wafer dicing machine body 100, a shielding door 101 disposed on the front end face of the acrylic plate 1001, the shielding door 101 being flipped and connected to the acrylic plate 1001 via a rotating shaft 102, and an operating table 103 disposed on the front end face of the semiconductor wafer dicing machine body 100;

[0027] Also includes:

[0028] A cutting cavity 200 is installed inside the front end of the semiconductor wafer dicing machine body 100. A laser cutting mechanism 400 is provided inside the cutting cavity 200. A connecting pipe 401 is provided on the lower end face of the laser cutting mechanism 400. A cutting end 402 is provided on the lower end face of the connecting pipe 401. A flipping baffle 403 is provided at the lower end of the cutting end 402. The flipping baffle 403 is rotatably connected to the cutting end 402 through a first rotation center shaft 404.

[0029] Cooling water pipe 500 is installed around the outer wall of the cutting end 402. Cooling water pipe 500 is connected to the semiconductor wafer dicing machine body 100 via conveying pipe 501.

[0030] When the cutting end 402 is in use, the set delivery pipe 501 can deliver cooling water to the cooling water pipe 500, which flows around the cutting end 402 and is returned by the pipe at the other end. After the cutting operation is completed, the condensate is atomized and sprayed out through the water mist spray end 600, adsorbed on the outer wall of the internal component. Then the blower mechanism is turned on, and the air is output from one end of the set air duct output end 700 to blow open the sealing plate 701, so that the air will evaporate the atomized water droplets, thereby removing the heat generated during the internal operation and reducing the phenomenon of heat overload.

[0031] Example 2

[0032] Please see Figure 2 and Figure 3 A water mist spray head 600 is provided on the upper part of the inner wall of the cutting cavity 200, and there are two water mist spray heads 600. The two water mist spray heads 600 are respectively installed on both sides of the laser cutting mechanism 400. A duct output end 700 is provided on the lower side of the inner wall of the cutting cavity 200.

[0033] Please see Figure 2 , Figure 3 and Figure 4 A sealing plate 701 is provided on the end face of the duct output end 700. One side of the sealing plate 701 is rotatably connected to the duct output end 700 through the second rotation center shaft 702.

[0034] Please see Figure 2 and Figure 3 A placement groove 1002 is provided at the bottom of the cutting cavity 200, and a reserved groove 1003 is provided at the middle position of the inner wall of the cutting cavity 200. A first connecting rod 303 is provided on the rear end face of the laser cutting mechanism 400, and a connecting end 302 is provided at the rear end of the first connecting rod 303. A sealing cover 1004 is provided on both the upper and lower sides of the first connecting rod 303, and the side of the sealing cover 1004 is fixedly connected to the inner wall of the reserved groove 1003.

[0035] Please see Figure 2 and Figure 5 A hydraulic telescopic rod 301 is provided at the lower end of the connecting end 302. A hydraulic mechanism 300 is provided at the lower end of the hydraulic telescopic rod 301. A moving rail 106 is provided below the hydraulic mechanism 300. A pulley 306 is provided inside the moving rail 106. A second connecting rod 304 is provided on the lower end face of the hydraulic mechanism 300. A servo motor 305 is provided on the outside of one side of the second connecting rod 304. The servo motor 305 can drive the pulley 306 to move back and forth on the moving rail 106. The servo motor 305 moves back and forth synchronously with the inner wall track of the semiconductor wafer dicing machine body 100.

[0036] Please see Figure 1 The lower part of the front end face of the semiconductor wafer dicing machine body 100 is provided with a flip door panel 104, and there are two flip door panels 104. A heat dissipation hole 105 is provided on one side of the semiconductor wafer dicing machine body 100, and there are several heat dissipation holes 105.

[0037] Working principle: When in use, the shielding door panel 101 is flipped open, and the object is placed in the placement slot 1002. This activates the servo motor 305, and the rotating pulley 306 drives the hydraulic mechanism 300 to move back and forth. At the same time, the hydraulic telescopic rod 301 is activated to adjust the height. When the cutting end 402 is in use, the set delivery pipe 501 can deliver cooling water to the cooling water pipe 500, which flows around the cutting end 402 and is returned by the pipe at the other end. After the cutting operation is completed, the condensate is atomized and sprayed out through the water mist spray end 600, adsorbed on the outer wall of the internal components. Then, the blower mechanism is activated, and the air is output from one end of the set air duct output end 700 to blow open the sealing plate 701, so that the air evaporates the atomized water droplets, thereby removing the heat generated during the internal operation and reducing the phenomenon of heat overload.

[0038] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the displayed or discussed mutual couplings, direct couplings, or communication connections may be through some communication interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

[0039] Finally, it should be noted that the above-described embodiments are merely specific implementations of the present invention, used to illustrate the technical solutions of the present invention, and not to limit it. The scope of protection of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments within the technical scope disclosed in the present invention, or make equivalent substitutions for some of the technical features; and these modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A cooling device for a semiconductor wafer dicing machine, comprising a semiconductor wafer dicing machine body (100), wherein an acrylic plate (1001) is disposed on the upper part of the front end face of the semiconductor wafer dicing machine body (100), a shielding door (101) is disposed on the front end face of the acrylic plate (1001), the shielding door (101) is flipped and connected to the acrylic plate (1001) via a rotating shaft (102), and an operating table (103) is disposed on the front end face of the semiconductor wafer dicing machine body (100). Its features are: Also includes: A cutting cavity (200) is installed inside the front end of the semiconductor wafer dicing machine body (100). A laser cutting mechanism (400) is provided inside the cutting cavity (200). A connecting pipe (401) is provided on the lower end face of the laser cutting mechanism (400). A cutting end (402) is provided on the lower end face of the connecting pipe (401). A flip-blocking plate (403) is provided on the lower end of the cutting end (402). The flip-blocking plate (403) is rotatably connected to the cutting end (402) through a first rotation center shaft (404). A cooling water pipe (500) is installed around the outer wall of the cutting end (402), and the cooling water pipe (500) is connected to the semiconductor wafer dicing machine body (100) via a delivery pipe (501).

2. The cooling device for a semiconductor wafer dicing machine according to claim 1, characterized in that: A water mist spray head (600) is provided on the upper part of the inner wall of the cutting cavity (200), and there are two water mist spray heads (600). The two water mist spray heads (600) are respectively installed on both sides of the laser cutting mechanism (400). A duct output end (700) is provided on the lower side of the inner wall of the cutting cavity (200).

3. The cooling device for a semiconductor wafer dicing machine according to claim 2, characterized in that: A sealing plate (701) is provided on the end face of the duct output end (700), and one side of the sealing plate (701) is rotatably connected to the duct output end (700) through a second rotation center shaft (702).

4. The cooling device for a semiconductor wafer dicing machine according to claim 1, characterized in that: A placement groove (1002) is provided at the bottom inside the cutting cavity (200), and a reserved groove (1003) is provided at the middle position of the inner wall of the cutting cavity (200). A first connecting rod (303) is provided on the rear end face of the laser cutting mechanism (400), and a connecting end (302) is provided at the rear end of the first connecting rod (303). A sealing cover (1004) is provided on both the upper and lower sides of the first connecting rod (303), and the side of the sealing cover (1004) is fixedly connected to the inner wall of the reserved groove (1003) in a circle.

5. The cooling device for a semiconductor wafer dicing machine according to claim 4, characterized in that: The lower end of the connecting end (302) is provided with a hydraulic telescopic rod (301), the lower end of the hydraulic telescopic rod (301) is provided with a hydraulic mechanism (300), a moving rail (106) is provided below the hydraulic mechanism (300), a pulley (306) is provided inside the moving rail (106), a second connecting rod body (304) is provided on the lower end face of the hydraulic mechanism (300), a servo motor (305) is provided on the outside of one side of the second connecting rod body (304), the servo motor (305) can drive the pulley (306) to move back and forth on the moving rail (106), and the servo motor (305) moves back and forth synchronously with the inner wall track of the semiconductor wafer dicing machine body (100).

6. The cooling device for a semiconductor wafer dicing machine according to claim 1, characterized in that: The lower part of the front end face of the semiconductor wafer dicing machine body (100) is provided with a flip door plate (104), and there are two flip door plates (104). A heat dissipation hole (105) is provided on one side of the semiconductor wafer dicing machine body (100), and there are several heat dissipation holes (105).

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