Heat dissipation suite and air pump thereof

Abstract

The utility model relates to the technical field of air pump accessories, in particular to a heat dissipation suite and an air pump thereof.The heat dissipation suite comprises a heat dissipation sleeve, a containing cavity used for containing the air pump is formed in the heat dissipation sleeve, one end of the heat dissipation sleeve is of a closed structure, an opening is formed in the other end of the heat dissipation sleeve, and a heat dissipation air channel is formed in the inner wall of the heat dissipation sleeve; the heat dissipation air channel extends from the closed end of the heat dissipation sleeve to the open end of the heat dissipation sleeve. The contradiction between noise suppression and heat dissipation enhancement of small and medium-sized air pumps in the prior art is effectively solved.

Description

Technical Field

[0001] This application relates to the field of air pump accessories technology, and in particular to a heat dissipation kit and its air pump. Background Technology

[0002] Miniature air pumps, with their compact size and integrated fan blade heat dissipation structure, have significant application value in space-constrained scenarios such as microelectronic devices and portable instruments. However, this type of air pump has two inherent drawbacks during operation: 1. Significant noise pollution: The airflow turbulence and air shearing effect generated by the exposed fan blades at high speeds can cause high-frequency howling, especially in the cavity of enclosed equipment, which can easily lead to resonance, severely limiting its application in noise-sensitive environments (such as medical equipment and baby products); 2. Limited heat dissipation efficiency: The miniaturized design results in a severely insufficient heat dissipation surface area, and the heat exchange efficiency relying solely on forced convection of the fan blades is approaching the physical limit. Especially under continuous high load conditions, the air pump's temperature rise curve is steep, leading to the risk of magnet demagnetization and reduced lifespan of electronic components.

[0003] Current industry-standard improvement solutions include adding metal heat sinks, which can increase the heat conduction area, but the enclosed structure obstructs the airflow path, thus weakening the active heat dissipation capability of the fan blades and failing to solve the high-frequency noise problem.

[0004] The aforementioned solutions fail to synergistically resolve the contradiction between noise suppression and enhanced heat dissipation: noise reduction measures often come at the cost of sacrificing heat dissipation efficiency, while designs that enhance heat dissipation amplify noise radiation. Therefore, an innovative structure is urgently needed that can simultaneously improve the heat dissipation performance and noise characteristics of the air pump while maintaining the advantages of miniaturization. Utility Model Content

[0005] This application provides a heat dissipation kit and its air pump to at least resolve the contradiction between noise suppression and heat dissipation enhancement in small air pumps in the related art.

[0006] To achieve the above objectives, this application provides a heat dissipation kit, including a heat dissipation sleeve, wherein a receiving cavity for accommodating an air pump is formed inside the heat dissipation sleeve, one end of the heat dissipation sleeve is a closed structure and the other end is provided with an opening, and a heat dissipation air channel is formed on the inner wall of the heat dissipation sleeve, the heat dissipation air channel extending from the closed end of the heat dissipation sleeve to the open end of the heat dissipation sleeve.

[0007] In some embodiments, the heat dissipation duct has a spiral structure, extending from the closed end of the heat dissipation sleeve to the open end of the heat dissipation sleeve.

[0008] In some embodiments, the heat dissipation ducts are open structures inside the heat dissipation sleeve.

[0009] In some embodiments, the heat dissipation air passage is a groove-like structure that is coiled on the inner wall of the heat dissipation sleeve and recessed relative to the inner wall of the heat dissipation sleeve, and the inner wall of the heat dissipation sleeve is in contact with the surface of the air pump housed in the heat dissipation sleeve.

[0010] In some embodiments, the heat dissipation duct is provided with a baffle plate inclined against the airflow direction along its width, and the baffle plate is equidistantly distributed on the heat dissipation duct.

[0011] In some embodiments, the outer surface of the heat sink is provided with heat dissipation protrusions corresponding to the location of the heat dissipation air passage.

[0012] In some embodiments, the heat dissipation bumps are arranged in a pyramid-shaped array.

[0013] In some embodiments, the heat sink sleeve is provided with a heat-conducting sleeve for fitting onto the air pump.

[0014] In some embodiments, the surface of the heat-conducting sleeve is formed with heat dissipation fins that protrude toward the heat dissipation sleeve.

[0015] This application also provides an air pump, including a heat dissipation kit as described in any of the above claims, the heat dissipation kit being fitted or integrated onto the air pump and guiding the airflow generated by the air pump through the air pump body.

[0016] Based on the above, the advantages of this application's technical solution compared to the prior art are:

[0017] 1. A spiral cooling channel is formed on the inner wall of the heat sink. The cooling channel guides the airflow generated by the air pump fan blades, so that the airflow flows out after circulating around the air pump surface, thereby achieving active directional air cooling of the air pump. In addition, the heat sink is made of silicone material, which can effectively reduce the noise of the air pump.

[0018] 2. A heat-conducting sleeve is provided inside the heat sink, which can be fitted onto the air pump. Heat dissipation fins are formed on the heat-conducting sleeve, which can further conduct the heat of the air pump to the heat sink.

[0019] 3. The surface of the heat sink has a pyramid array of heat dissipation bumps, which further enhances the heat dissipation effect of the heat sink;

[0020] 4. A baffle plate is installed inside the heat dissipation duct to reverse the airflow direction, thereby achieving noise reduction by disrupting the airflow. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0022] Figure 1 This is a schematic diagram of the heat sink and air pump assembly according to an embodiment of this application;

[0023] Figure 2 This is an exploded view of an embodiment of this application;

[0024] Figure 3 This is a cross-sectional view of the heat sink, heat conduction sleeve, and air pump assembly according to an embodiment of this application;

[0025] Figure 4 This is a cross-sectional view of the heat sink according to an embodiment of this application;

[0026] Figure 5 This is a schematic diagram of the heat sink structure according to an embodiment of this application;

[0027] Figure 6 This is a schematic diagram of the tilted state of the spoiler in the heat dissipation air duct according to an embodiment of this application.

[0028] Explanation of reference numerals in the attached drawings: 1. Heat sink sleeve; 1.1. Closed end; 1.2. Open end; 1.3. Air inlet; 1.4. Heat dissipation air passage; 2. Air pump; 3. Air inlet; 3.1. Baffle plate; 5. Heat dissipation protrusion; 6. Heat conduction sleeve; 6.1. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this application clearer, the application is described and illustrated below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the application. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application without inventive effort are within the scope of protection of this application. Furthermore, it is understood that although the efforts made in such a development process may be complex and lengthy, for those skilled in the art related to the content disclosed in this application, modifications to design, manufacturing, or production based on the technical content disclosed in this application are merely conventional technical means and should not be construed as insufficient disclosure of the content of this application.

[0030] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0031] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms “a,” “an,” “an,” “the,” and similar words used in this application do not indicate quantity limitation and may indicate singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms “connected,” “linked,” “coupled,” and similar words used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Multiple” used in this application means two or more. “And / or” describes the relationship between related objects, indicating that three relationships may exist; for example, “A and / or B” can represent: A alone, A and B simultaneously, and B alone. The terms “first,” “second,” “third,” etc., used in this application are merely to distinguish similar objects and do not represent a specific ordering of the objects.

[0032] This application provides a heat dissipation kit, including a heat dissipation sleeve, which has a cavity for accommodating an air pump inside. One end of the heat dissipation sleeve is closed and the other end is open. A heat dissipation channel is formed on the inner wall of the heat dissipation sleeve, which extends from the closed end of the heat dissipation sleeve to the open end of the heat dissipation sleeve.

[0033] This application also provides an air pump, including the above-mentioned heat dissipation kit, which is sleeved or integrated on the air pump and guides the airflow generated by the air pump through the air pump body.

[0034] Implementation, for example Figures 1-6 As shown, a heat dissipation kit includes a heat dissipation sleeve 1, which is made of high-elasticity silicone with a thermal conductivity ≥3.0W / (m·k) and a Shore hardness of 40~60A. It can tightly cover the surface of the air pump 3 and has good thermal conductivity, while also having shock absorption and noise reduction performance of more than 6dB.

[0035] Specifically, the heat sink 1 has an internal cavity for housing the air pump 3. One end of the heat sink 1 is closed, and the other end has an opening for installing the air pump 3. A set of spiral heat dissipation channels 2 is formed on the inner wall of the heat sink 1. The heat dissipation channels 2 have an open structure inside the heat sink 1. Specifically, the heat dissipation channels 2 are groove-like structures that spiral on the inner wall of the heat sink 1 and are recessed relative to the inner wall of the heat sink 1.

[0036] Specifically, the heat dissipation air duct 2 is not limited to one set; it can also be multiple sets working together.

[0037] Specifically, the cooling duct 2 extends spirally from the closed end 1.1 of the heat sink 1 to the open end 1.2 of the heat sink 1. When the air pump 3 is installed inside the heat sink 1, the inner wall of the heat sink 1 is in contact with the surface of the air pump 3 housed within the heat sink 1, and the grooved cooling duct 2 creates a gas flow channel between the heat sink 1 and the surface of the air pump 3. The airflow blown out by the turbine blades of the air pump 3 spirals around the air pump 3 along the cooling duct 2 and is blown out at the open end 1.2 of the heat sink 1. Due to the grooved structure of the cooling duct 2, the gas flows over the surface of the air pump 3 during circulation, and the circulation of cold air helps to achieve a uniform temperature across the entire surface of the air pump 3.

[0038] Furthermore, the heat sink 1 has an air inlet 1.3 that mates with the air inlet 3.1 of the air pump 3. The heat dissipation channel 2 extends to the edge of the opening end 1.2 to facilitate airflow from the edge of the opening end 1.2, thereby achieving sufficient heat dissipation.

[0039] Furthermore, horizontally placed and inclined baffles 4 are provided along the width of the heat dissipation duct 2, and the baffles 4 are evenly distributed on the heat dissipation duct 2. The baffles 4 are inclined in the opposite direction to the airflow direction. For example, if the airflow is from direction a to direction b, then the a end of the baffle 4 is closer to the bottom surface of the groove of the air duct than the b end, so that the baffle 4 resists the airflow. The baffles 4 on the heat dissipation duct 2 can disrupt the airflow and thus achieve the effect of noise reduction.

[0040] Specifically, in this embodiment, the spoiler 4 is an inclined spoiler.

[0041] Furthermore, heat dissipation protrusions 5 are distributed along the heat dissipation channel 2 on the outer surface of the heat dissipation sleeve 1. The heat dissipation protrusions 5 can expand the heat dissipation area while filling the thin-walled area, thereby enhancing the stability of the heat dissipation sleeve 1. The heat dissipation protrusions 5 are arranged in a pyramid-shaped array with a height of 0.6 mm corresponding to the position of the heat dissipation channel 2.

[0042] Furthermore, a heat-conducting sleeve 6 is provided inside the heat sink 1 for mounting on the air pump 3. The heat-conducting sleeve 6 is mounted on the end of the air pump 3 near the opening end 1.2. The heat-conducting sleeve 6 is located between the air pump 3 and the heat sink 1. The outer wall of the heat-conducting sleeve 6 has heat dissipation fins 6.1 that protrude toward the heat sink 1 at equal intervals along the circumferential direction. The heat dissipation fins 6.1 extend along the opening direction of the heat-conducting sleeve 6.

[0043] Specifically, the heat dissipation fins 6.1 have a fin density of 30 fins / cm and are seamlessly bonded to the heat dissipation sleeve 1 via vacuum sintering, achieving a contact thermal resistance of ≤0.05K·m² / W. Airflow through the gaps in the heat dissipation fins 6.1 creates turbulence, increasing the convective heat transfer coefficient to 120W / (m²・K), thus fully realizing the heat dissipation and heat conduction functions.

[0044] Furthermore, the heat sink 1 is provided with one or more protruding fixing parts 1.4 on its exterior. Specifically, four fixing parts 1.4 can be provided, which effectively enhances the durability of the structure, prevents the heat sink 1 from falling off due to friction and collision, and extends the service life of the equipment.

[0045] Furthermore, this application also provides an air pump, including the aforementioned heat dissipation kit, which is sleeved or integrated into the housing of the air pump 3 and guides the airflow generated by the air pump 3 through the main body of the air pump 3 to dissipate heat from the air pump 3.

[0046] Those skilled in the art should understand that the technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments have been described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A heat dissipation kit, characterized in that: The device includes a heat sink, which has an internal cavity for housing an air pump. One end of the heat sink is closed and the other end is open. The inner wall of the heat sink has a heat dissipation channel that extends from the closed end to the open end of the heat sink.

2. The heat dissipation kit according to claim 1, characterized in that: The heat dissipation duct has a spiral structure, extending from the closed end of the heat dissipation sleeve to the open end of the heat dissipation sleeve.

3. A heat dissipation kit according to claim 1, characterized in that: The heat dissipation duct has an open structure inside the heat dissipation sleeve.

4. A heat dissipation kit according to claim 3, characterized in that: The heat dissipation air passage is a groove-like structure that is coiled on the inner wall of the heat dissipation sleeve and recessed relative to the inner wall of the heat dissipation sleeve. The inner wall of the heat dissipation sleeve is in contact with the surface of the air pump housed in the heat dissipation sleeve.

5. A heat dissipation kit according to claim 4, characterized in that: The heat dissipation duct is provided with a baffle plate inclined against the airflow direction along its width, and the baffle plate is equidistantly distributed on the heat dissipation duct.

6. A heat dissipation kit according to claim 1, characterized in that: The outer surface of the heat sink is provided with heat dissipation protrusions corresponding to the positions of the heat dissipation air channels.

7. A heat dissipation kit according to claim 6, characterized in that: The heat dissipation bumps are arranged in a pyramid-shaped array.

8. A heat dissipation kit according to claim 1, characterized in that: The heat dissipation sleeve has a heat-conducting sleeve inside for fitting onto the air pump.

9. A heat dissipation kit according to claim 8, characterized in that: The surface of the heat-conducting sleeve is formed with heat dissipation fins that protrude toward the heat dissipation sleeve.

10. An air pump, characterized in that: Includes a heat dissipation kit as described in any one of claims 1 to 9, wherein the heat dissipation kit is fitted onto or integrated on the air pump and guides the airflow generated by the air pump through the air pump body.

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