Support structure of opposite vertical type SSR optocoupler

Abstract

The utility model relates to the technical field of SSR optocouplers, in particular to a support structure of a vertical SSR optocoupler. Through the symmetrical design of the PT support and the IR support and the opposite distribution of the PT base island and the IR base island, the direct light path alignment of the light emitting diode and the bidirectional photosensitive silicon controlled rectifier is realized, the light transmission efficiency is obviously improved, the L-shaped output pin extends to the end part of the adjacent pin, and the PT base island is arranged, so that the bidirectional silicon controlled rectifier and the photosensitive silicon controlled rectifier are respectively arranged on different base islands, and the light transmission efficiency is improved. The risk that insulating glue overflows to the photosensitive silicon controlled rectifier chip is avoided, the short circuit probability is reduced, meanwhile, the discrete base island layout optimizes a conductive path, the number of conductive wires is reduced to the minimum, the gold wire material cost and quality hidden dangers such as wire collapse and wire breakage in the wire welding process are reduced, and the production yield and the product reliability are improved; the technical problems that after an existing SSR optocoupler support structure is packaged into an SSR optocoupler, the light transmission efficiency is low, glue is prone to overflowing to form a short circuit, and the number of electric leads is large are solved.

Description

Technical Field

[0001] This utility model relates to the field of SSR optocoupler technology, and in particular to a support structure for a vertical SSR optocoupler. Background Technology

[0002] Relay circuits are mainly used in the home appliance and industrial equipment markets. In home appliances, they are commonly used in air conditioners, microwave ovens, washing machines, personal hygiene systems, refrigerators, fan heaters, induction heating cookers, and water heaters. Their main function is to drive the load and control the load switch. Conventional designs typically use bidirectional thyristor optocouplers to drive bidirectional thyristors to control the load. The circuit also includes several electronic components such as resistors and capacitors. Therefore, this circuit needs to be composed of a relatively large number of electronic components, thus occupying a large PCB area. Furthermore, the relatively large number of electronic components increases the probability of the circuit malfunctioning.

[0003] For example, in the patent document with application number 202411881794.7 and patent name "Planar SSR Optocoupler," although this design solves the aforementioned problems in optocoupler applications, this structure has certain quality risks during the optocoupler packaging process, specifically as follows: 1. Low light transmission efficiency: Due to this planar packaging structure, the light emitted by the LED usually needs to be refracted through the LENS to the light-receiving area. This process causes a significant loss of light intensity and increases the turn-on current of the photosensitive thyristor; 2. The amount of insulating adhesive in the thyristor is difficult to control during the manufacturing process, which can easily cause adhesive overflow onto the bidirectional photosensitive thyristor chip, resulting in a short circuit; 3. Too many conductive lines can easily cause quality risks. Since conductive lines are usually handled by wire bonding machines, the process is difficult to control, and the process can easily cause wire collapse, affecting product quality. On this basis, the fewer conductive lines, the fewer quality risks. At the same time, since conductive lines are usually made of gold, the more gold wires there are, the higher the cost. Therefore, it is necessary to improve the SSR optocoupler and the corresponding bracket structure. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a support structure for a vertical SSR optocoupler, which solves the technical problems of low optical transmission efficiency, easy glue overflow leading to short circuits, and a large number of conductive lines in existing SSR optocoupler support structures after being packaged into SSR optocouplers.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a support structure for a opposed SSR optocoupler, including a PT support and an IR support;

[0006] The PT support includes two symmetrically arranged PT side rails, and several PT connecting ribs are arranged between the two PT side rails. Several sets of PT pins are provided on the PT connecting ribs. Each set of PT pins includes three output pins arranged in parallel. The output pin on one side is L-shaped and extends to the end of the output pin on the other side. The L-shaped output pin end and the middle output pin end are respectively provided with PT base islands for mounting bidirectional thyristors and bidirectional photosensitive thyristors.

[0007] The IR support includes two symmetrically arranged IR side rails, and several IR connecting ribs are arranged between the two IR side rails. Several sets of IR pins are provided on the IR connecting ribs. Each set of IR pins includes several parallel input pins, and one of the input pins is provided with an IR base island that is distributed opposite to the PT base island.

[0008] Preferably, the projection of the IR base island onto the plane where the PT base island is located overlaps with the PT base island located on the middle output pin.

[0009] Preferably, the L-shaped output pin is provided with a solder portion extending toward the PT base island located in the middle of the output pin.

[0010] Preferably, several of the output pins and input pins are provided with positioning holes.

[0011] Preferably, limiting portions are provided on both sides of the output pin located in the middle.

[0012] By employing the above technical solution, this utility model provides a support structure for a opposed SSR optocoupler, which has at least the following beneficial effects:

[0013] 1. This utility model achieves direct optical path alignment between the light-emitting diode and the bidirectional photosensitive thyristor through the symmetrical design of the PT bracket and IR bracket and the opposing distribution of the PT base island and IR base island. This eliminates the light intensity loss caused by lens refraction in the traditional planar structure, significantly improving the light transmission efficiency. The L-shaped output pin extends to the end of the adjacent pin and is set with a PT base island, so that the bidirectional thyristor and the photosensitive thyristor are placed on different base islands. This avoids the risk of insulating glue overflowing to the photosensitive thyristor chip and reduces the probability of short circuit. At the same time, the discrete base island layout optimizes the conductive path, reduces the number of conductive lines to a minimum, reduces the cost of gold wire materials and the quality risks such as wire collapse and breakage in the wire bonding process, and improves production yield and product reliability.

[0014] 2. This utility model ensures that the light from the LED is perpendicularly projected onto the surface of the photosensitive thyristor by overlapping the projection of the IR base island on the PT base island plane with the PT base island of the middle output pin. This shortens the optical path and increases the light reception ratio. This design reduces the turn-on current requirement of the photosensitive thyristor, enhances the response speed and accuracy of load control, and is suitable for high-frequency electrical appliances and industrial equipment. In addition, the base island alignment design simplifies the packaging process, reduces manual calibration errors, improves batch production consistency, and avoids performance fluctuations caused by optical path misalignment, ensuring stable operation of the optocoupler under complex working conditions.

[0015] 3. This invention utilizes positioning holes on the output and input pins, along with mechanical anchoring through encapsulation colloid filling, to effectively prevent pin displacement or detachment during vibration or temperature changes, thus enhancing the support structure's resistance to mechanical stress and environmental adaptability. Limiting portions are added to both sides of the middle output pin, which, combined with the constraint force after the colloid cures, ensure the pin maintains a stable position during encapsulation and use, preventing connection failure due to external forces. This dual fixing mechanism significantly enhances the long-term reliability of the optocoupler in high-temperature, high-humidity, or vibration environments, extending product lifespan. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0017] Figure 1 This is a schematic diagram of the PT bracket of this utility model;

[0018] Figure 2 This is a schematic diagram of the IR bracket of this utility model;

[0019] Figure 3 This utility model Figure 1 Enlarged view of point A in the middle;

[0020] Figure 4 This utility model Figure 2 Enlarged view of point B in the middle;

[0021] Figure 5 This is a schematic diagram showing the positions of the PT bracket and IR bracket during the packaging of this utility model.

[0022] In the diagram: 1. PT bracket; 11. PT side rail; 12. PT connecting rib; 13. PT pin; 131. Output pin; 132. PT base island; 133. Welding part; 134. Limiting part; 2. IR bracket; 21. IR side rail; 22. IR connecting rib; 23. IR pin; 231. Input pin; 232. IR base island; 3. Positioning hole. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] This application addresses the technical problems of existing SSR optocoupler support structures, such as low optical transmission efficiency, easy glue overflow leading to short circuits, and a large number of conductive lines after encapsulation into an SSR optocoupler. It provides a support structure for a vertical SSR optocoupler, such as... Figures 1-5 As shown, the device includes a PT bracket 1 and an IR bracket 2. The PT bracket 1 includes two symmetrically arranged PT side rails 11, and several PT connecting ribs 12 are arranged between the two PT side rails 11. Several sets of PT pins 13 are provided on the PT connecting ribs 12. Each set of PT pins 13 includes three output pins 131 arranged in parallel. The output pin 131 on one side is L-shaped and extends to the end of the output pin 131 on the other side. PT base islands 132 are provided on the end of the L-shaped output pin 131 and the end of the output pin 131 in the middle, respectively, for mounting bidirectional thyristors and bidirectional photosensitive thyristors. The bidirectional thyristors and bidirectional photosensitive thyristors are mounted on different PT base islands 132. After dispensing, there is no risk of adhesive overflow onto the bidirectional photosensitive thyristors, causing a short circuit. In addition, the number of conductive wires after wire bonding is greatly reduced, which can greatly reduce the cost of conductive wires and reduce the probability of risks during production. Furthermore, the PT base islands 132 arranged in this way can minimize the length of the conductive wires used, reducing the cost of conductive wires and the risk of wire breakage.

[0025] The IR bracket 2 includes two symmetrically arranged IR side rails 21, and several IR connecting ribs 22 are arranged between the two IR side rails 21. Several sets of IR pins 23 are provided on the IR connecting ribs 22. Each set of IR pins 23 includes several parallelly arranged input pins 231. One of the input pins 231 is provided with an IR base island 232 that is opposite to the PT base island 132. When a light-emitting diode is installed on the IR base island 232, the light emitted by the light-emitting diode is directly received by the bidirectional photosensitive thyristor. Compared with the planar structure, the light transmission efficiency is higher.

[0026] In order to enable the light emitted by the LED to be received more efficiently by the bidirectional photosensitive thyristor, the projection of the IR base island 232 on the plane of the PT base island 132 is made to overlap with the PT base island 132 on the output pin 131 in the middle. This allows the vertical projection of the LED on the output pin 131 to be located on the bidirectional photosensitive thyristor after packaging, and the distance between the LED and the bidirectional photosensitive thyristor to be closer. This enables the bidirectional photosensitive thyristor to receive a larger proportion of the light emitted by the LED, thereby improving the light transmission efficiency.

[0027] In order to further reduce the length of the conductive line between the L-shaped output pin 131 and the PT base island 132 on the middle output pin 131, a solder part 133 extending toward the PT base island 132 on the middle output pin 131 is provided on the L-shaped output pin 131, thereby further reducing costs and reducing the risk of conductive line breakage.

[0028] To improve the stability of each pin in the packaged product, positioning holes 3 are provided on several important output pins 131 and input pins 231, so that the encapsulant can enter into the positioning holes 3 during packaging, thereby achieving relative fixation of the position of each pin.

[0029] Since there are a large number of conductive lines on the output pin 131 located in the middle, ensuring the stability of the output pin 131 is beneficial to improving the overall stability of the packaged product. Therefore, limiting parts 134 are provided on both sides of the output pin 131 located in the middle. Through the interaction force between the limiting parts 134 and the encapsulated colloid, the pin will not slide outward.

[0030] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A support structure for a opposed SSR optocoupler, comprising a PT support (1) and an IR support (2), characterized in that: The PT bracket (1) includes two symmetrically arranged PT side rails (11), and a number of PT connecting ribs (12) are arranged between the two PT side rails (11). A number of PT pins (13) are provided on the PT connecting ribs (12). Each group of PT pins (13) includes three output pins (131) arranged in parallel. The output pin (131) on one side is L-shaped and extends to the end of the output pin (131) on the other side. The end of the L-shaped output pin (131) and the end of the output pin (131) in the middle are provided with PT base islands (132) on which bidirectional thyristors and bidirectional photosensitive thyristors are respectively installed. The IR support (2) includes two symmetrically arranged IR side rails (21), and a number of IR connecting ribs (22) are arranged between the two IR side rails (21). The IR connecting ribs (22) are provided with a number of IR pins (23). Each group of IR pins (23) includes a number of parallelly arranged input pins (231). One of the input pins (231) is provided with an IR base island (232) that is opposite to the PT base island (132).

2. The support structure for a opposed SSR optocoupler according to claim 1, characterized in that: The projection of the IR base island (232) onto the plane where the PT base island (132) is located overlaps with the PT base island (132) on the output pin (131) located in the middle.

3. The support structure for a opposed SSR optocoupler according to claim 1, characterized in that: The L-shaped output pin (131) is provided with a solder portion (133) extending toward the PT base island (132) located on the middle output pin (131).

4. The support structure for a opposed SSR optocoupler according to claim 1, characterized in that: Positioning holes (3) are provided on several of the output pins (131) and input pins (231).

5. The support structure for a opposed SSR optocoupler according to claim 1, characterized in that: Limiting portions (134) are provided on both sides of the output pin (131) located in the middle.

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