Sealing type frequency converter structure with heat dissipation function
By designing a multi-path heat dissipation structure and buffer system in the sealed frequency converter, the problems of difficult heat dissipation and poor vibration resistance are solved, achieving efficient heat dissipation and vibration buffering, and extending the service life of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GOLDBELL ELECTRIC DRIVES & CONTROLS SHENZHEN CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-05-05
AI Technical Summary
Existing sealed frequency converters have difficulty dissipating heat and have poor shock resistance in industrial environments, which affects the stability and service life of the equipment.
It adopts a combination structure of longitudinal plate, heat dissipation sleeve plate, side heat dissipation plate and heat dissipation fins, combined with the circulation of heat dissipation liquid in the buffer bag to form a multi-path heat dissipation system, and absorbs vibration through the design of buffer spring and elastic V-shaped clamp to protect internal components.
It significantly improves the heat dissipation efficiency of the sealed frequency converter, enhances its shock resistance, and extends the service life of the equipment.
Smart Images

Figure CN224205496U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of frequency converters, and in particular to a sealed frequency converter structure that also takes into account heat dissipation. Background Technology
[0002] With the continuous improvement of industrial automation, frequency converters are being used more and more widely in industrial production. In some special industrial environments, such as dusty mines or chemical workshops with corrosive gases, frequency converters need to have good sealing performance to prevent external pollutants from entering the equipment and affecting its normal operation and service life. However, while traditional sealed frequency converters achieve good sealing, they often face the problem of heat dissipation difficulties.
[0003] Existing hermetic frequency converters typically enhance heat dissipation by adding heat sink fins and installing cooling fans. However, adding heat sink fins increases the size of the equipment, and in a sealed environment, air convection is limited, resulting in limited improvement in heat dissipation. While installing cooling fans can accelerate airflow, the rotating parts of the fan are prone to dust accumulation and damage, and they also introduce additional vibration and noise, affecting the stability and reliability of the frequency converter. Furthermore, in industrial environments, equipment inevitably suffers from vibration and shock, and existing frequency converter structures are insufficient in terms of shock resistance. Vibration may cause internal components to loosen, reducing the service life of the equipment. Therefore, how to design a frequency converter structure that can ensure good sealing performance while effectively dissipating heat and resisting shock has become an urgent technical problem to be solved in this field. Utility Model Content
[0004] The purpose of this application is to solve the problems of poor heat dissipation and poor shock resistance of existing sealed frequency converters. Compared with the prior art, it provides a sealed frequency converter structure that takes into account heat dissipation. It includes a frequency converter housing and a heat-conducting substrate fixed to the back of the frequency converter housing. The heat-conducting substrate has a plurality of equally spaced longitudinal plates on the side away from the frequency converter housing. The heat-conducting substrate also has a mounting substrate on the side away from the frequency converter housing. A heat dissipation sleeve plate corresponding to the longitudinal plates is fixed on one side of the mounting substrate. A mounting cavity is provided between the bottoms of the plurality of heat dissipation sleeve plates. A guide groove is provided on the heat dissipation sleeve plate. One end of the longitudinal plate extends through the guide groove into the mounting cavity and is fixed with a horizontal pressure plate.
[0005] A buffer bladder is sandwiched between the horizontal pressure plate and the mounting base plate. Buffer pads are fixed on both the upper and lower sides of the buffer bladder, and several buffer springs are evenly distributed and fixed between the two sets of buffer pads.
[0006] Furthermore, side heat dissipation plates are fixed on both sides of the mounting base plate, and a number of heat dissipation fins are evenly distributed on one side of the side heat dissipation plate.
[0007] Furthermore, the top of each side heat sink is provided with an angle plate, the angle plate includes several horizontal plates arranged at equal intervals, adjacent horizontal plates are slidably connected to each other by guide rails, an elastic pull strap is fixed between adjacent horizontal plates, and an elastic V-shaped clip is fixed between the sides of adjacent horizontal plates.
[0008] The top of the angle plate is fixed with two sets of symmetrically arranged sliders. The heat-conducting substrate is provided with limiting grooves that cooperate with the sliders. The bottom of the angle plate is provided with a flexible connecting part. The angle plate as a whole is flexibly connected to the top of the side heat sink through the flexible connecting part.
[0009] Furthermore, the elastic V-shaped clamp and the buffer bladder are connected by a connecting pipe, and the buffer bladder is filled with heat dissipation liquid.
[0010] Furthermore, the elastic strap has an elastic force that drives two adjacent sets of horizontal plates to move closer together, and the two ends of the elastic V-shaped clip are sealed with an elastic sealing film.
[0011] Compared to existing technologies, the advantages of this application are:
[0012] This application combines a longitudinal plate, a heat dissipation sleeve plate, a side heat dissipation plate, and heat dissipation fins to form a multi-path heat dissipation structure, increasing the heat dissipation area. Combined with the circulating flow of the heat dissipation fluid in the buffer bladder, it significantly improves heat dissipation efficiency and solves the problem of heat dissipation difficulties in sealed frequency converters. The buffer structure composed of buffer springs and buffer pads, as well as the flexible connection of the angle plate and the elastic design of the elastic V-shaped clamp, can effectively absorb and buffer vibrations during equipment operation, protect the internal components of the frequency converter, and extend the service life of the equipment. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the front structure of this application;
[0014] Figure 2 This is a schematic diagram of the rear structure of this application;
[0015] Figure 3 This is a schematic diagram of the exploded structure of this application;
[0016] Figure 4 This is a cross-sectional structural diagram of this application;
[0017] Figure 5 for Figure 4 A magnified structural diagram of part A in the middle.
[0018] Explanation of the labels in the diagram:
[0019] 1. Inverter housing; 2. Heat-conducting base plate; 21. Limiting groove; 22. Longitudinal plate; 23. Horizontal pressure plate; 3. Mounting base plate; 31. Side heat dissipation plate; 311. Heat dissipation fins; 32. Heat dissipation sleeve plate; 321. Guide groove; 33. Mounting cavity; 4. Buffer bag; 41. Buffer pad; 42. Buffer spring; 5. Angle plate; 501. Elastic sealing film; 51. Slider; 52. Horizontal plate; 53. Elastic pull strip; 54. Elastic V-shaped clamp; 55. Flexible connection part; 6. Connecting pipe. Detailed Implementation
[0020] The embodiments will be described clearly and completely with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments in this application without creative effort are within the scope of protection of this application.
[0021] Example:
[0022] This utility model provides a sealed inverter structure that also considers heat dissipation. Please refer to [link / reference]. Figures 1-5 The device includes an inverter housing 1 and a heat-conducting substrate 2 fixed to the back of the inverter housing 1. The heat-conducting substrate 2 has several equally spaced longitudinal plates 22 on the side away from the inverter housing 1. The heat-conducting substrate 2 also has a mounting substrate 3 on the side away from the inverter housing 1. A heat dissipation sleeve plate 32 corresponding to the longitudinal plates 22 is fixed on one side of the mounting substrate 3. A mounting cavity 33 is provided between the bottoms of the several heat dissipation sleeve plates 32. A guide groove 321 is provided on the heat dissipation sleeve plate 32. One end of the longitudinal plate 22 extends through the guide groove 321 into the mounting cavity 33 and is fixed with a horizontal pressure plate 23.
[0023] A buffer bladder 4 is sandwiched between the horizontal pressure plate 23 and the mounting base plate 3. Buffer pads 41 are fixed on both the upper and lower sides of the buffer bladder 4. Several buffer springs 42 are fixed at equal intervals between the two sets of buffer pads 41.
[0024] Furthermore, side heat sinks 31 are fixed on both sides of the mounting base plate 3, and a number of heat sink fins 311 are evenly distributed on one side of the side heat sink 31.
[0025] Furthermore, the top of each side heat sink 31 is provided with an angle plate 5, which includes several horizontal plates 52 arranged at equal intervals. Adjacent horizontal plates 52 are slidably connected to each other by guide rails. Elastic pull straps 53 are also fixed between adjacent horizontal plates 52. Elastic V-shaped clips 54 are fixed between the sides of adjacent horizontal plates 52. Two sets of symmetrically arranged sliders 51 are fixed on the top of the angle plate 5. The heat-conducting substrate 2 is provided with a limiting groove 21 that cooperates with the sliders 51. The bottom of the angle plate 5 is provided with a flexible connecting part 55. The angle plate 5 is flexibly connected to the top of the side heat sink 31 through the flexible connecting part 55.
[0026] Furthermore, the elastic V-shaped clip 54 and the buffer bladder 4 are connected by a connecting pipe 6, and the buffer bladder 4 is filled with heat dissipation fluid. The elastic pull strap 53 has an elastic force that drives two adjacent sets of horizontal plates 52 to move closer together, and both ends of the elastic V-shaped clip 54 are sealed by an elastic sealing film 501.
[0027] The heat generated when the frequency converter is working is first transferred to the heat-conducting substrate 2 through the frequency converter housing 1, and the longitudinal plate 22 on the heat-conducting substrate 2 conducts the heat to the heat dissipation sleeve 32. The longitudinal plate 22 can be displaced to a certain extent within the mounting cavity 33. When the equipment is vibrated, the longitudinal plate 22 drives the horizontal pressure plate 23 to squeeze the buffer bladder 4. The heat dissipation fluid in the buffer bladder 4 is squeezed and flows to the elastic V-clamp 54 through the connecting pipe 6. At the same time, when the equipment is vibrated, as the inverter housing 1 approaches the mounting base plate 3, the angle plate 5 is squeezed. The vertical angle of the angle plate 5 is changed by the cooperation of the slider 51 and the limiting groove 21, and the distance of the horizontal plate 52 is extended. At this time, the V-shaped chamber angle of the elastic V-clamp 54 becomes larger, absorbing the heat dissipation fluid squeezed out from the buffer bladder 4, and dissipating heat for the entire elastic V-clamp 54. Similarly, when the inverter housing 1 moves away from the mounting base plate 3, the buffer bladder 4 returns to its original position. When the elastic V-clamp 54 slides on the horizontal plate 52, it further squeezes the heat dissipation fluid, causing the heat dissipation fluid to circulate between the buffer bladder 4 and the elastic V-clamp 54, thereby transferring heat to a wider area.
[0028] Meanwhile, the heat dissipation fins 311 on the side heat dissipation plate 31 increase the contact area with air, accelerating heat dissipation. The angle plate 5 can be adjusted according to the actual vibration of the equipment. Through the cooperation of the elastic pull strap 53 and the guide rail, the elastic V-shaped clamp 54 deforms when the horizontal plate 52 slides, further assisting the circulation of the coolant. Furthermore, the unfolding of the angle plate 5 can increase the heat dissipation area, and the retraction can save space. The buffer spring 42 and the buffer pad 41 play a buffering role when the equipment is subjected to vibration, reducing the impact of vibration on the internal components of the frequency converter and improving the vibration resistance of the equipment.
[0029] This application forms a multi-path heat dissipation structure by combining the longitudinal plate 22, the heat dissipation sleeve plate 32, the side heat dissipation plate 31, and the heat dissipation fins 311, thereby increasing the heat dissipation area. Combined with the circulation of the heat dissipation fluid in the buffer bladder 4, the heat dissipation efficiency is significantly improved, solving the problem of heat dissipation difficulties in sealed frequency converters. The buffer structure composed of the buffer spring 42 and the buffer pad 41, as well as the flexible connection of the angle plate 5 and the elastic design of the elastic V-shaped clamp 54, can effectively absorb and buffer the vibration during equipment operation, protect the internal components of the frequency converter, and extend the service life of the equipment.
[0030] The above description is only the best implementation method adopted in this application in combination with current practical needs, but the scope of protection of this application is not limited thereto.
Claims
1. A sealed inverter structure that also considers heat dissipation, comprising an inverter housing (1) and a heat-conducting substrate (2) fixed to the back of the inverter housing (1), characterized in that, The heat-conducting substrate (2) has several longitudinal plates (22) evenly distributed on the side away from the inverter housing (1). The heat-conducting substrate (2) also has a mounting substrate (3) on the side away from the inverter housing (1). A heat dissipation sleeve plate (32) corresponding to the longitudinal plate (22) is fixed on one side of the mounting substrate (3). A mounting cavity (33) is provided between the bottoms of the heat dissipation sleeve plates (32). A guide groove (321) is provided on the heat dissipation sleeve plate (32). One end of the longitudinal plate (22) extends through the guide groove (321) into the mounting cavity (33) and is fixed with a horizontal pressure plate (23). A buffer bladder (4) is sandwiched between the horizontal pressure plate (23) and the mounting base plate (3). Buffer pads (41) are fixed on both the upper and lower sides of the buffer bladder (4). Several buffer springs (42) are fixed at equal intervals between the two sets of buffer pads (41).
2. The sealed frequency converter structure that also considers heat dissipation according to claim 1, characterized in that, Both sides of the mounting base plate (3) are fixed with side heat sinks (31), and a number of heat sink fins (311) are evenly distributed on one side of the side heat sink (31).
3. The sealed frequency converter structure that also considers heat dissipation according to claim 2, characterized in that, The top of each side heat sink (31) is provided with an angle plate (5). The angle plate (5) includes several horizontal plates (52) arranged at equal intervals. The adjacent horizontal plates (52) are connected to each other by a guide rail. An elastic pull strap (53) is also fixed between the adjacent horizontal plates (52). An elastic V-shaped clip (54) is fixed between the sides of the adjacent horizontal plates (52). The top of the angle plate (5) is fixed with two sets of symmetrically arranged sliders (51). The heat-conducting substrate (2) is provided with a limiting groove (21) that cooperates with the sliders (51). The bottom of the angle plate (5) is provided with a flexible connecting part (55). The angle plate (5) is flexibly connected to the top of the side heat sink (31) through the flexible connecting part (55).
4. The sealed frequency converter structure that also considers heat dissipation according to claim 3, characterized in that, The elastic V-shaped clip (54) and the buffer bladder (4) are connected by a connecting pipe (6), and the buffer bladder (4) is filled with heat dissipation liquid.
5. The sealed frequency converter structure that also considers heat dissipation according to claim 3, characterized in that, The elastic pull strap (53) has an elastic force that drives two adjacent sets of horizontal plates (52) to move closer together, and the two ends of the elastic V-shaped clip (54) are sealed by an elastic sealing film (501).