Clamping jig and chip mounting equipment
By using magnetically attached movable components to fix semiconductor devices to a mounting plate, the problems of unstable fixation and large space occupation are solved, enabling stable processing and efficient production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHUHAI SILICON COOL TECH CO LTD
- Filing Date
- 2025-05-07
- Publication Date
- 2026-05-05
AI Technical Summary
Existing fixtures are prone to damaging semiconductor devices or occupying too much space when fixing them, and the fixing effect is not good, which affects the yield and production efficiency.
Semiconductor devices are fixed by a movable component that is attracted by magnetic parts and a mounting plate. The movable component is fixed by abutting against the side wall of the device, avoiding the need for electronic control devices and reducing space occupation.
This achieves stable fixation of semiconductor devices during processing, avoids damage, simplifies the structure, and improves production efficiency.
Smart Images
Figure CN224205622U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor device processing technology, and in particular to a clamping fixture and chip mounting equipment. Background Technology
[0002] With the development of semiconductor technology, chip mounting technology has emerged. This process involves placing chip-shaped semiconductor devices, such as wafers, into designated positions on a fixture. The semiconductor devices are fed along with the fixture, and then processed by fixed-position nozzles or suction cups, achieving automated production and improving efficiency.
[0003] In related technologies, fixtures have slots for placing semiconductor devices. The semiconductor devices are placed within these slots and simply secured to prevent them from shifting or falling off during processing. Some fixtures use pre-fixing devices (such as pressure plates) pressed against the surface edges of the semiconductor devices to secure them and ensure stability during processing; these pre-fixing devices are typically adjusted and fixed electrically. Some fixtures do not have pre-fixing devices; the semiconductor devices are placed directly inside the slots, and the inner walls of the slots constrain the devices.
[0004] However, methods that rely solely on slots to restrict semiconductor devices without pre-fixing devices are less effective, making them prone to shifting or falling during movement or processing. Furthermore, using pre-fixing devices pressed against the edges of semiconductor devices makes it difficult to control the pressure applied. Since the main functions of semiconductor devices are achieved through their top and bottom surfaces, pressing the top surface can easily damage the device, leading to a lower yield. Additionally, pre-fixing devices typically use electrical control, requiring additional circuitry and resulting in a more complex internal structure and larger space requirement for the fixture. Utility Model Content
[0005] Therefore, it is necessary to provide a clamping fixture and chip mounting equipment that is less likely to damage semiconductor devices and occupies less space, in order to address the problems of easily damaging semiconductor devices and the large space occupied by the fixtures mentioned above.
[0006] On the one hand, this application provides a clamping fixture, which includes:
[0007] The mounting plate includes a mounting part and a connecting part, wherein the mounting part has a mounting slot for placing semiconductor devices;
[0008] A movable component is provided at the connecting portion and is capable of moving along a first direction to approach or move away from the semiconductor device placed in the mounting slot. When the movable component moves to a predetermined position, the movable component is used to abut against the sidewall of the semiconductor device to confine the semiconductor device in the mounting slot.
[0009] A first magnetic component and a second magnetic component are provided. The first magnetic component is disposed on the mounting plate, and the second magnetic component is disposed on the movable component. When the movable component moves to the predetermined position, the first magnetic component and the second magnetic component attract each other to fix the relative position of the movable component and the mounting plate.
[0010] In some embodiments, the movable component includes a movable plate and a spring post. The movable plate is movably connected to the connecting portion and is movable relative to the mounting plate in the first direction. One end of the spring post is connected to the movable plate, and when the movable component moves to a predetermined position, the other end of the spring post is used to abut against the sidewall of the semiconductor device.
[0011] In some embodiments, the mounting portion and the connecting portion are located on the same side of the mounting plate, the mounting portion has a first side and a second side opposite to each other in the first direction, and the mounting groove extends through the mounting portion along the first direction;
[0012] It also includes a positioning baffle, the sidewall of which abuts against the first side; when the movable component moves to the predetermined position, the movable baffle abuts against the second side.
[0013] In some embodiments, multiple mounting slots are provided, and the multiple mounting slots are arranged side by side.
[0014] In some embodiments, the connecting portion has a sliding groove, the movable plate is disposed in the sliding groove, and the movable plate has a first surface and a second surface facing away from each other in the thickness direction. The first surface is flush with the surface of the mounting portion having the mounting groove.
[0015] In some embodiments, the connecting portion is provided with a guide rail arranged along the first direction, and the movable plate is slidably connected to the guide rail.
[0016] In some embodiments, the second magnetic element includes a magnetic plate disposed on the side of the movable plate opposite to the mounting portion.
[0017] In some embodiments, a push-pull groove is provided on the side of the movable plate opposite to the mounting part, and the magnetic plate and the inner wall of the push-pull groove form a push-pull hole.
[0018] In some embodiments, the bottom wall of the mounting groove is provided with vacuum suction holes.
[0019] On the other hand, this application also provides a chip mounting device, which includes the clamping fixture as described above.
[0020] The aforementioned clamping fixture has a mounting groove on the side of the mounting plate for placing and positioning the semiconductor device. A movable component is located at the connecting part and moves towards or away from the semiconductor device. When the movable component moves to a predetermined position, it abuts against the side of the semiconductor device. Since the main functions of the semiconductor device are realized by its upper and lower surfaces, the above arrangement can fix the semiconductor device by the movable component without damaging its upper and lower surfaces, and without obstructing the upper and lower surfaces of the semiconductor device for easy processing. When the movable component abuts against the side of the semiconductor device (i.e., the movable component is in a predetermined position), the first magnetic element and the second magnetic element engage, fixing the relative position of the movable component and the mounting plate. This fixes the movable component so that it remains against the side wall of the semiconductor device, thereby confining the semiconductor device within the mounting groove. Compared to pre-fixing devices in related technologies, which are generally fixed via electrical control and require additional circuitry, this application uses the first and second magnetic elements to fix the movable component without requiring additional circuitry, effectively reducing the size of the clamping fixture. When it is necessary to separate the first and second magnetic elements, only a slightly larger force needs to be applied along the sliding direction of the sliding plate, making the operation simple and quick. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the structure of a clamping fixture according to one embodiment of the present application.
[0022] Figure 2 This is a top view of one embodiment of a clamping fixture according to this application.
[0023] Figure 3 This is a schematic diagram of the structure of a clamping fixture after removing the movable component, according to one embodiment of the present application.
[0024] Figure 4 This is a schematic diagram of the structure of the movable component in an embodiment of a clamping fixture according to this application.
[0025] In the figure, 100 is the mounting plate; 110 is the mounting part; 111 is the mounting groove; 112 is the vacuum suction hole; 120 is the connecting part; 121 is the sliding groove; 122 is the guide rail; 130 is the positioning pin; 200 is the movable component; 210 is the movable plate; 211 is the push-pull groove; 212 is the positioning groove; 220 is the spring column; 300 is the first magnetic component; 400 is the second magnetic component; 410 is the magnetic plate; 500 is the semiconductor device; and 600 is the positioning baffle. Detailed Implementation
[0026] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0027] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0028] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0029] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0030] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0031] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.
[0032] See Figure 1 and Figure 3 , Figure 1 A schematic diagram of the clamping fixture in one embodiment of this application is shown. Figure 3This diagram illustrates the structure of a clamping fixture according to an embodiment of this application after the removal of the movable component 200. The clamping fixture provided in one embodiment of this application includes a mounting plate 100, a movable component 200, a first magnetic element 300, and a second magnetic element 400. The mounting plate 100 includes a mounting portion 110 and a connecting portion 120. The mounting portion 110 has a mounting groove 111 for placing a semiconductor device 500. The movable component 200 is disposed on the connecting portion 120 and is movable along a first direction to approach or move away from the semiconductor device 500 placed in the mounting groove 111. When the movable component 200 moves to a predetermined position, it abuts against the sidewall of the semiconductor device 500 to confine the semiconductor device 500 within the mounting groove 111. A first magnetic element 300 and a second magnetic element 400 are provided. The first magnetic element 300 is provided on the mounting plate 100, and the second magnetic element 400 is provided on the movable component 200. When the movable component 200 moves to a predetermined position, the first magnetic element 300 and the second magnetic element 400 are attracted to each other so that the relative positions of the movable component 200 and the mounting plate 100 are fixed.
[0033] See Figure 1 and Figure 3 Preferably, the mounting portion 110 has a mounting groove 111, the shape of which is set according to the shape of the semiconductor device 500 to improve the adaptability of the clamping fixture. The semiconductor device 500 is placed in the mounting groove 111, and the inner sidewall of the mounting groove 111 can provide a certain limit for the semiconductor device 500 and provide positioning when placing the semiconductor device 500, so as to facilitate the placement of the semiconductor device on the clamping fixture. The movable component 200 is connected to the connecting portion 120. The movable component 200 moves along the first direction to approach or move away from the semiconductor device 500 in the mounting groove 111. When the movable component 200 moves towards the semiconductor device 500 to a predetermined position, the movable component 200 can abut against the sidewall of the semiconductor device. At this time, the first magnetic element 300 and the second magnetic element 400 are attracted, so that the relative movement between the movable component 200 and the mounting plate 100 is not easy. The movement of the semiconductor device 500 is thus restricted by the inner wall of the movable component 200 and the mounting groove 111 to stabilize the semiconductor device 500.
[0034] It should be noted that the aforementioned predetermined position is located on the connecting portion 120 near the mounting groove 111 to ensure that when the movable component 200 moves to the predetermined position, it can abut against the side wall of the semiconductor device 500 located in the mounting groove 111. Furthermore, since the movable component 200 moves on the connecting portion 120 to approach or move away from the semiconductor device 500 located in the mounting groove 111, there are a distal position (where the movable component 200 is furthest from the semiconductor device 500) and a proximal position (where the movable component 200 is closest to the semiconductor device 500) on the connecting portion 120. The proximal position is the aforementioned predetermined position. The first direction extends from the distal position to the predetermined position. The trajectory of the movable component 200 can be a straight line or a curve, i.e., the first direction can be a straight line or a curve.
[0035] In use, the semiconductor device 500 is placed in the mounting slot 111. At this time, the movable component 200 is located at the distal end, not obstructing the movement of the semiconductor device 500. After the semiconductor device 500 is stably placed in the mounting slot 111, the movable component 200 moves from the distal end to a predetermined position along a first direction. When the movable component 200 moves to the predetermined position, it abuts against the side wall of the semiconductor device 500, and the remaining side walls of the semiconductor device 500 abut against the inner side wall of the mounting slot 111. When the movable component 200 moves to the predetermined position, the second magnetic element 400 provided on the movable component 200 and the first magnetic element 300 provided on the mounting plate 100 are attracted to fix the movable component 200 in the position of the connecting part 120. The mounting slot 111 cooperates with the movable component 200 to clamp the semiconductor device 500. After the semiconductor device 500 is processed, only a slightly larger force is needed to move the movable component 200 from the predetermined position to the far position to release the restriction of the movable component 200 on the semiconductor device 500, making it easy to remove the semiconductor device 500 from the mounting slot 111.
[0036] With the above configuration, the movable component 200 abuts against the side wall of the semiconductor device 500, and in conjunction with the mounting slot 111, the semiconductor device 500 is fixed, ensuring that the semiconductor device 500 can move with the clamping fixture, is not prone to shifting or falling off during automated processing, and is not easily damaged on the upper and lower surfaces of the semiconductor device 500 that perform its main functions. By setting the first magnetic component 300 and the second magnetic component 400, the movable component 200 can be fixed in a predetermined position, stably fixing the semiconductor device 500. There is no need to set circuits in the movable component 200 or the mounting plate 100, which can effectively reduce the size of the clamping fixture, and the installation and removal of the semiconductor device 500 is simple and quick.
[0037] In some embodiments, the movable component 200 includes a movable plate 210 and a spring post 220. The movable plate 210 is movably connected to the connecting portion 120 and is capable of moving relative to the mounting plate 100 in a first direction. One end of the spring post 220 is connected to the movable plate 210, and when the movable component 200 moves to a predetermined position, the other end of the spring post 220 is used to abut against the sidewall of the semiconductor device 500.
[0038] See Figure 1 and Figure 4 Preferably, the movable plate 210 moves in a straight line to approach or move away from the semiconductor device 500 in the mounting groove 111. When the spring post 220 abuts against the side wall of the semiconductor device 500, the spring post 220 is compressed and contracted by the movable plate 210 and the semiconductor device 500 to compress and fix the semiconductor device 500 in the mounting groove 111. By setting the spring post 220, while providing a limit for the semiconductor device 500, the retractable nature of the spring post 220 prevents excessive force on the side wall of the semiconductor device 500 from causing damage.
[0039] Furthermore, in other embodiments, the movable plate 210 is rotatably connected to the connecting portion 120, or the connecting portion 120 is a curved surface, allowing the movable plate 210 to move along the curve to approach or move away from the semiconductor device 500 within the mounting groove 111. This achieves the same technical effect.
[0040] In some embodiments, the mounting portion 110 and the connecting portion 120 are located on the same side of the mounting plate 100, the mounting portion 110 has a first side and a second side opposite to each other in a first direction, and the mounting groove 111 passes through the mounting portion 110 in a first direction.
[0041] It also includes a positioning baffle 600, the sidewall of which abuts against the first side; when the movable component 200 moves to the predetermined position, the movable plate 210 abuts against the second side.
[0042] See Figure 1 , Figure 2 and Figure 3Preferably, the connecting portion 120 and the mounting portion 110 are located on the same side of the mounting plate 100, and both the connecting portion 120 and the mounting portion 110 are planar, with the movement trajectory of the movable component 200 being a straight line. As shown in the figure, the mounting groove 111 passes through the mounting portion 110, and the first side and the second side are connected through the mounting groove 111. The positioning baffle 600 abuts against the first side, and the semiconductor device 500 is placed in the mounting groove 111. When the movable component 200 moves to a predetermined position, the movable plate 210 abuts against the second side, and the spring post 220 abuts against one side wall of the semiconductor device 500. The opposite side wall of the side wall where the semiconductor device 500 abuts against the spring post 220 abuts against the positioning baffle 600, thereby fixing the semiconductor device 500 in the mounting groove 111. The above arrangement mainly provides pressure through the positioning baffle 600 and the spring post 220 to ensure the fixation of the semiconductor device 500. The inner side wall of the mounting groove 111 is mainly used to provide positioning and limiting when placing the semiconductor device 500. By setting the positioning baffle 600, it is easy to replace when the positioning baffle 600 is worn or damaged. At the same time, the material of the semiconductor device 500 that needs to be fixed can also be replaced, so as to avoid damage to the semiconductor device 500 due to the material of the positioning baffle 600 being too soft or too hard.
[0043] In some embodiments, multiple mounting slots 111 are provided, and the multiple mounting slots 111 are arranged side by side.
[0044] See Figure 1 , Figure 2 and Figure 3 Preferably, multiple mounting slots 111 are arranged side by side, and multiple spring posts 220 are provided on the movable plate 210 corresponding to the multiple mounting slots 111. When the movable component 200 moves to the predetermined position, the movable plate 210 abuts against the second side of the mounting part 110, and the multiple spring posts 220 abut against the semiconductor device 500 in their respective mounting slots 111 to fix the multiple semiconductor devices 500. The multiple semiconductor devices 500 move with this clamping fixture and are processed, which can improve the processing production efficiency.
[0045] In some embodiments, the connecting part 120 has a sliding groove 121, the movable plate 210 is disposed in the sliding groove 121, and the movable plate 210 has a first surface and a second surface opposite to each other in the thickness direction. The first surface is flush with the surface of the mounting part 110 that has the mounting groove 111.
[0046] See Figure 1 , Figure 2 and Figure 3Preferably, the movable plate 210 moves within the sliding groove 121, and the upper surface of the movable plate 210 is the first surface. The upper surface of the movable plate 210 is flush with the surface of the mounting part 110 where the mounting groove 111 is provided. Through the above arrangement, it can be ensured that the movable plate 210 does not protrude relative to the mounting part 110, further reducing the volume of this clamping fixture and reducing space occupation. During the semiconductor device 500 processing, the movable plate 210 is less likely to block the movement of processing devices such as nozzles or suction cups.
[0047] See Figure 3 and Figure 4 Furthermore, the connecting part 120 is also provided with a positioning pin 130, which is fixed to the bottom wall of the sliding groove 121. The movable plate 210 is provided with a positioning groove 212 on the side facing the bottom wall of the sliding groove 121. The positioning groove 212 is provided corresponding to the positioning pin 130 and extends along the first direction. The two inner sidewalls of the positioning groove 212 that are opposite each other in the first direction are respectively referred to as the first end face and the second end face, wherein the first end face is close to the mounting part 110 and the second end face is far away from the mounting part 110. The positioning pin 130 is inserted into the positioning groove 212. When the movable plate 210 moves, the positioning pin 130 moves relative to the movable plate 210 along the length direction of the positioning groove 212. When the positioning pin 130 abuts against the first end face, the movable component 200 is located at the far end position. When the positioning pin 130 abuts against the second end face, the movable component 200 is located at the near end position (predetermined position). By setting the positioning pin 130 and the positioning groove 212, the moving direction of the movable plate 210 can be limited, and the movement trajectory of the movable plate 210 can be avoided from deviating.
[0048] In some embodiments, the connecting portion 120 is provided with a guide rail 122 arranged along a first direction, and the movable plate 210 is slidably connected to the guide rail 122.
[0049] See Figure 1 and Figure 3 Preferably, the guide rail 122 is disposed in the sliding groove 121, and the movable plate 210 is slidably connected to the guide rail 122 and slides along the length direction of the guide rail 122 to approach or move away from the semiconductor device 500 in the mounting groove 111. During the use of this clamping fixture, if the movable plate 210 shifts in the first direction, the spring post 220 will not be able to align with the semiconductor device 500 in the mounting groove 111, and the spring post 220 will not be able to properly abut against the semiconductor device 500. By setting the guide rail 122 to limit the movement trajectory of the movable plate 210, it is possible to prevent the movable plate 210 from shifting in the first direction, which would cause the spring post 220 to fail to properly abut against the semiconductor device 500.
[0050] In some embodiments, the second magnetic element 400 includes a magnetic plate 410 disposed on the side of the movable plate 210 opposite to the mounting portion 110.
[0051] See Figure 1 , Figure 3 and Figure 4 Preferably, the second magnetic element 400 is set as a plate-shaped magnetic plate 410, so that the magnetic plate 410 has a large magnetic attraction area. By setting multiple first magnetic elements on the mounting plate 100 or increasing the magnetic attraction area of the first magnetic elements, the first magnetic element 300 and the magnetic plate 410 can be attracted more stably, and the stability of the movable plate 210 when it is in the predetermined position can be improved.
[0052] In some embodiments, the movable plate 210 has a push-pull groove 211 on the side opposite to the mounting part 110, and the magnetic plate 410 and the inner wall of the push-pull groove 211 form a push-pull hole.
[0053] See Figure 1 and Figure 4 Preferably, the movable plate 210 has a push-pull groove 211 on the side away from the mounting part 110, and the magnetic plate 410 is provided on the side of the movable plate 210 away from the mounting part 110. The magnetic plate 410 and the inner wall of the push-pull groove 211 form a push-pull hole. When in use, the user can hold the magnetic plate 410 to push and pull the movable plate 210. The user's fingers are placed in the push-pull groove 211 for easy push-pull operation.
[0054] See Figure 3 and Figure 4 Furthermore, the magnetic plate 410 extends a certain distance along the thickness direction of the movable plate 210, and the side of the mounting plate 100 is provided with a clearance position. The first magnetic element can be a neodymium magnet and is provided on the side wall of the clearance position. When the movable plate 210 abuts against the second side of the mounting part 110, the magnetic plate 410 provided on the side of the movable plate 210 away from the mounting part 110 is located in the clearance position. At this time, the magnetic plate 410 and the first magnetic element 300 are attracted to each other, so that the magnetic plate 410 abuts against the side wall of the clearance position, providing a limit for the movable plate 210 to fix the relative position of the movable plate 210 and the mounting plate 100.
[0055] In some embodiments, the bottom wall of the mounting groove 111 is provided with a vacuum suction hole 112.
[0056] See Figure 1 , Figure 2 and Figure 3 Preferably, the bottom wall of the mounting groove 111 is provided with a vacuum suction hole. When the semiconductor device 500 is placed in the mounting groove 111, negative pressure can be provided through the vacuum suction hole 112 to ensure that the semiconductor device 500 is stably placed in the mounting groove 111. During the processing of the semiconductor device 500, the vacuum suction hole 112 maintains negative pressure, which can improve the stability of the semiconductor device 500 and prevent the semiconductor device 500 from shifting or falling off when in contact with the processing device.
[0057] On the other hand, this application also provides a chip mounting device, which includes the clamping fixture as described above.
[0058] Preferably, the chip mounting equipment also includes processing devices such as suction cups and nozzles. The clamping fixture moves to a preset position and cooperates with the processing device to complete the processing of the semiconductor device 500. The above operations are existing technology and will not be described in detail here.
[0059] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0060] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A clamping fixture, characterized in that, include: The mounting plate includes a mounting part and a connecting part, wherein the mounting part has a mounting slot for placing semiconductor devices; A movable component is provided at the connecting portion and is capable of moving along a first direction to approach or move away from the semiconductor device placed in the mounting slot. When the movable component moves to a predetermined position, the movable component is used to abut against the sidewall of the semiconductor device to confine the semiconductor device in the mounting slot. A first magnetic component and a second magnetic component are provided. The first magnetic component is disposed on the mounting plate, and the second magnetic component is disposed on the movable component. When the movable component moves to the predetermined position, the first magnetic component and the second magnetic component attract each other to fix the relative position of the movable component and the mounting plate.
2. The clamping fixture according to claim 1, characterized in that, The movable component includes a movable plate and a spring column. The movable plate is movably connected to the connecting part and can move relative to the mounting plate in the first direction. One end of the spring column is connected to the movable plate, and when the movable component moves to a predetermined position, the other end of the spring column is used to abut against the sidewall of the semiconductor device.
3. The clamping fixture according to claim 2, characterized in that, The mounting portion and the connecting portion are located on the same side of the mounting plate. The mounting portion has a first side and a second side facing away from each other in the first direction. The mounting groove passes through the mounting portion along the first direction. It also includes a positioning baffle, the sidewall of which abuts against the first side; when the movable component moves to the predetermined position, the movable baffle abuts against the second side.
4. The clamping fixture according to claim 3, characterized in that, The mounting slots are provided in multiple ways, and the multiple mounting slots are arranged side by side.
5. The clamping fixture according to claim 2, characterized in that, The connecting part has a sliding groove, the movable plate is disposed in the sliding groove, and the movable plate has a first surface and a second surface facing away from each other in the thickness direction. The first surface is flush with the surface of the mounting part where the mounting groove is provided.
6. The clamping fixture according to claim 5, characterized in that, The connecting part is provided with a guide rail arranged along the first direction, and the movable plate is slidably connected to the guide rail.
7. The clamping fixture according to claim 2, characterized in that, The second magnetic component includes a magnetic plate disposed on the side of the movable plate opposite to the mounting portion.
8. The clamping fixture according to claim 7, characterized in that, The movable plate has a push-pull groove on the side opposite to the mounting part, and the magnetic plate and the inner wall of the push-pull groove form a push-pull hole.
9. The clamping fixture according to claim 1, characterized in that, The bottom wall of the mounting groove is provided with vacuum suction holes.
10. A chip mounting device, characterized in that, Includes the clamping fixture as described in any one of claims 1-9.