Multi-pin heat dissipation bridge rectifier
By using a multi-pin heat dissipation bridge rectifier structure, combined with the base island and chip combination design and Z-shaped pins, the heat dissipation bottleneck problem of traditional bridge rectifiers is solved, achieving efficient heat dissipation, reducing junction temperature, and making it suitable for scenarios such as TV power supplies.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YANGZHOU YANGJIE ELECTRONIC TECH CO LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-05-05
AI Technical Summary
The thermal performance bottleneck of traditional plug-in bridge rectifiers limits their development in small and medium power rectification scenarios. Existing technologies increase cost and size by adding heat sinks, and cannot improve thermal performance while controlling cost and size.
The multi-pin heat dissipation bridge rectifier structure is adopted. Through the combination of four base islands and chips, combined with Z-shaped pins and perforated structure, the heat dissipation path and area are increased, thereby improving heat dissipation efficiency.
While maintaining the same product size and cost, the heat dissipation performance has been significantly improved and the junction temperature has been reduced, meeting the demands of the power supply market.
Smart Images
Figure CN224205649U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to semiconductor devices, and more particularly to an improvement in the structure of a multi-pin heat dissipation bridge rectifier. Background Technology
[0002] A traditional through-hole bridge rectifier is a rectifier module that integrates four discrete rectifier diodes (or integrated chips) onto a single leadframe using a through-hole packaging process. It employs discrete diode chips soldered to the leadframe, with the chips directly mounted on the island. Electrical connection to the PCB is achieved through the leadframe. Utilizing the unidirectional conductivity of the diodes, the input alternating current (alternating positive and negative half-cycles) is converted into pulsating direct current (unidirectional pulses).
[0003] Traditional plug-in bridge rectifiers, through structural integration and mature manufacturing processes, have become an "economical" solution for small and medium power rectification scenarios. However, their heat dissipation performance bottleneck has consistently constrained their development. To address this bottleneck, current technologies typically connect heat sinks to the outside of the bridge rectifier's plastic casing to increase heat dissipation efficiency. This approach not only makes the bridge rectifier more bulky but also increases costs. Therefore, improving the heat dissipation performance of bridge rectifiers while controlling cost and size is a crucial technical problem that needs to be solved in this project. Utility Model Content
[0004] To address the above problems, this invention provides a multi-pin heat dissipation bridge rectifier with a compact structure that improves heat dissipation performance while controlling cost and size.
[0005] The technical solution of this utility model is:
[0006] Multi-pin thermal bridge rectifier, including those with spacing settings:
[0007] The positive electrode island has a first chip and a second chip encapsulated in a plastic package on its surface, and positive electrode pin one and positive electrode pin two extending from the plastic package at its ends;
[0008] AC base island one, located on the side of the positive base island, has a third chip encapsulated in the plastic package on its surface, and an AC pin one extending from the plastic package at its end;
[0009] AC base island two is located on one side of the positive base island and the AC base island, and its surface is provided with a fourth chip encapsulated in the plastic package; its end is provided with AC pin two and AC pin three extending from the plastic package;
[0010] The negative electrode base island is located on both sides of the AC base island and has negative electrode pins extending from the plastic package.
[0011] The first chip is electrically connected to AC base island one; the second chip is electrically connected to AC base island two; one end of the fourth chip is electrically connected to the third chip, and the other end is electrically connected to the negative base island;
[0012] The widths of the positive pin 1 and the positive pin 2 are both greater than the width of the negative pin.
[0013] Specifically, the width of AC pin one is not less than the width of positive pin one.
[0014] Specifically, the positive pin one is located on the adjacent side of the positive pin two.
[0015] Specifically, the AC pin one is located on the opposite side of the positive pin two.
[0016] Specifically, the positive pin 2 and the negative pin are located on the same side of the molding compound.
[0017] Specifically, the AC pin three is located on the opposite side of the positive pin one.
[0018] Specifically, the positive electrode island is provided with multiple holes located on the side of the first chip and / or the second chip.
[0019] Specifically, the negative electrode island is provided with rectangular holes.
[0020] Specifically, the width of the AC pin three is not less than the width of the negative pin.
[0021] Specifically, the positive pin 1, positive pin 2, and AC pin 1 extend out of the encapsulation body in Z-shaped structures.
[0022] Specifically, the AC pin 2, AC pin 3 and negative pin extend out of the encapsulation body in a Z-shaped structure.
[0023] This utility model uses four base islands, chips, and jumper wires to form a rectifier bridge circuit; positive pin one and positive pin two are connected to the PCB board; there are two chips on the conducting circuit and the positive base island, which generate a lot of heat. Originally, the heat was dissipated through the molding compound, but the effect was small. The heat dissipation path is increased by the exposed pin layout design; the two adjacent chips on the AC base island are close together and generate a lot of heat. The heat dissipation capacity is also increased by enlarging the pin design, which effectively improves the heat dissipation performance and manufacturing cost of the product. Attached Figure Description
[0024] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;
[0025] Figure 2 This is a schematic diagram of the three-dimensional structure of the base island distribution;
[0026] Figure 3 This is a schematic diagram of the pin distribution structure;
[0027] Figure 4 This is a schematic diagram of the three-dimensional structure after plastic sealing;
[0028] Figure 5 This is a thermal simulation test diagram of the product in this case;
[0029] Figure 6 These are thermal simulation test diagrams of existing JD products;
[0030] In the diagram, 100 is the positive base island, 110 is the first chip, 120 is the second chip, 130 is positive pin one, and 140 is positive pin two.
[0031] 200 is AC base station one, 210 is the third chip, and 220 is AC pin one.
[0032] 300 is AC base island two, 310 is the fourth chip, 320 is AC pin two, and 330 is AC pin three.
[0033] 400 is the negative base island, 410 is the negative lead, and 420 is a rectangular hole.
[0034] 500 is a plastic encapsulated form. Detailed Implementation
[0035] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0036] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," "right," "vertical," "horizontal," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0037] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0038] The following is for reference. Figure 1-5 Describe this utility model;
[0039] Multi-pin thermal bridge rectifier, including those with spacing settings:
[0040] The positive base island 100 has a first chip 110 and a second chip 120 encapsulated in a plastic package 500 on its surface. The end has a positive pin 130 and a positive pin 140 extending from the plastic package 500 and connecting to the PCB board. The conducting circuit and the positive base island 100 have two chips, which generate a lot of heat. Originally, the heat was dissipated through the plastic package, but the effect was small. The heat dissipation path is increased by the exposed pin layout design.
[0041] AC base island 200 is located on the side of the positive base island 100. A third chip 210 is provided on its surface and encapsulated in the plastic package 500. An AC pin 220 is provided at its end and extends from the plastic package 500. The two adjacent chips of AC base island 200 are close together and have high heat. The heat dissipation capacity is increased by enlarging the pin design.
[0042] AC base island 2 300 is located on the side of the positive base island 100 and AC base island 1 200, and its surface is provided with a fourth chip 310 encapsulated in the plastic package 500; its ends are provided with AC pin 2 320 and AC pin 330 extending from the plastic package 500.
[0043] The negative electrode base island 400 is located on the side of the AC base island 300 and is provided with a negative electrode pin 410 extending from the plastic encapsulation body 500.
[0044] The first chip 110 is electrically connected to AC base island 200 via jumper 1; the second chip 120 is electrically connected to AC base island 300 via jumper 2; one end of the fourth chip 310 is electrically connected to the third chip 210, and the other end is electrically connected to the negative base island 400.
[0045] The widths of the positive pin 130 and the positive pin 2 140 are greater than the width of the negative pin 410.
[0046] The width of the AC pin 330 is not less than the width of the negative pin 410.
[0047] The width of AC pin 220 is not less than the width of positive pin 130.
[0048] The positive pin 130 is located on the adjacent side of the positive pin 140.
[0049] The AC pin 220 is located on the opposite side of the positive pin 140. That is, the positive pin 130, the positive pin 140, and the AC pin 220 are located on different sides of the molding compound 100, which disperses the heat dissipation area and improves heat dissipation efficiency.
[0050] The positive pin 140 and the negative pin 410 are located on the same side of the molding compound 500.
[0051] The AC pin 330 is located on the opposite side of the positive pin 130.
[0052] This project improves the heat dissipation capability of the surface-mount bridge rectifier by improving the layout of the base island and the structure of the pins, and adopts a multi-pin heat dissipation method, while keeping the product size unchanged, thus meeting the needs of the power supply market.
[0053] The positive electrode island 100 is provided with a plurality of holes located on the side of the first chip 110 and / or the second chip 120.
[0054] The negative electrode base island 400 is provided with a rectangular hole 420.
[0055] The aforementioned perforations and rectangular holes 420 are locking holes, mainly to reinforce the hardness of the plastic sealant body while reducing the stress of the cutting ribs.
[0056] The positive pin 130, positive pin 140, and AC pin 220 extend out of the encapsulation body 500 in Z-shaped structures.
[0057] The AC pin 2 (320), AC pin 3 (330), and negative pin 410 extend out of the molding compound 500 in Z-shaped structures. This Z-shaped design reduces stress while increasing the heat dissipation area.
[0058] This application is primarily used on the back of a television power supply, converting electricity from the national grid into the DC power required by the television. It also complies with safety regulations. The multiple exposed pins enhance heat dissipation, ensuring the television's back cover temperature does not exceed 65°C. Testing has shown that... Figure 5 As shown, in this case, without the need for a heatsink, taking a frame thickness of 0.4mm as an example, the junction temperature is below 100 degrees Celsius, compared to... Figure 6Compared to existing JD products with similar structures, JD products have a maximum junction temperature of 112.4 degrees Celsius.
[0059] Regarding the information disclosed in this case, the following points need to be clarified:
[0060] 1. The accompanying drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case; other structures can refer to the general design.
[0061] 2. Where there is no conflict, the embodiments and features disclosed in this case can be combined with each other to obtain new embodiments;
[0062] The above are merely specific embodiments disclosed in this case, but the scope of protection of this disclosure is not limited thereto. The scope of protection disclosed in this case shall be determined by the scope of protection of the claims.
Claims
1. A multi-pin heat dissipation bridge rectifier, characterized in that, Including interval settings: The positive base island (100) has a first chip (110) and a second chip (120) encapsulated in a plastic package (500) on its surface, and positive pin one (130) and positive pin two (140) extending from the plastic package (500) at its end. AC base island one (200) is located on the side of the positive base island (100), and a third chip (210) is provided on the surface encapsulated in the plastic package (500), and an AC pin one (220) is provided at the end extending from the plastic package (500). AC base island two (300) is located on the side of the positive base island (100) and AC base island one (200), and its surface is provided with a fourth chip (310) encased in the plastic package (500); its end is provided with AC pin two (320) and AC pin three (330) extending from the plastic package (500). The negative electrode base island (400) is located on the side of the AC base island two (300) and has a negative electrode pin (410) extending from the plastic encapsulation (500). The first chip (110) is electrically connected to AC base island one (200); the second chip (120) is electrically connected to AC base island two (300); one end of the fourth chip (310) is electrically connected to the third chip (210), and the other end is electrically connected to the negative base island (400); The widths of the positive pin 1 (130) and the positive pin 2 (140) are greater than the width of the negative pin (410).
2. The multi-pin heat dissipation bridge stack according to claim 1, characterized in that, The width of AC pin 1 (220) is not less than the width of positive pin 1 (130).
3. The multi-pin heat dissipation bridge stack according to claim 1, characterized in that, The AC pin 1 (220) is located on the opposite side of the positive pin 2 (140).
4. The multi-pin heat dissipation bridge stack according to claim 1, characterized in that, The positive pin 2 (140) and the negative pin (410) are located on the same side of the encapsulation (500).
5. The multi-pin heat dissipation bridge stack according to claim 1, characterized in that, The AC pin three (330) is located on the opposite side of the positive pin one (130).
6. The multi-pin heat dissipation bridge stack according to claim 1, characterized in that, The positive electrode island (100) is provided with a plurality of holes located on the side of the first chip (110) and / or the second chip (120).
7. The multi-pin heat dissipation bridge stack according to claim 1, characterized in that, The negative electrode base island (400) is provided with a rectangular hole (420).
8. The multi-pin heat dissipation bridge stack according to claim 1, characterized in that, The width of the AC pin 3 (330) is not less than the width of the negative pin (410).
9. The multi-pin heat dissipation bridge stack according to claim 1, characterized in that, The positive pin 1 (130), positive pin 2 (140), and AC pin 1 (220) extending out of the encapsulation body (500) are respectively in a Z-shaped structure.
10. The multi-pin heat dissipation bridge stack according to claim 1, characterized in that, The AC pin 2 (320), AC pin 3 (330) and negative pin (410) extending out of the encapsulation body (500) are respectively in Z-shaped structures.