Electric connection assembly and electronic equipment

Abstract

The utility model provides an electric connection assembly and electronic equipment, the electric connection assembly comprises a circuit board, a first shielding assembly, a heat dissipation module and a second shielding assembly, and the circuit board is provided with an electronic element; the first shielding assembly is connected with the circuit board and surrounds the electronic element; the heat dissipation modules are arranged on the side, away from the circuit board, of the first shielding assembly at intervals. The second shielding assembly is arranged between the first shielding assembly and the heat dissipation module, the second shielding assembly, the first shielding assembly and the heat dissipation module jointly define a heat dissipation air channel, and the second shielding assembly comprises a plurality of conductive connecting pieces connected with the first shielding assembly and the heat dissipation module. Every two adjacent conductive connecting pieces are spaced to form a first opening of the heat dissipation air channel. The first opening of the heat dissipation air channel can be formed between every two adjacent conductive connecting pieces, equivalently, the number of the openings of the heat dissipation air channel is increased, exchange of air inside and outside the heat dissipation air channel can be accelerated, and more air can participate in heat dissipation.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to an electrical connection component and an electronic device. Background Technology

[0002] Electronic devices are widely used in all aspects of life and work. As their internal integration increases and the power of functional modules increases, heat dissipation has become a key factor restricting the improvement of their performance.

[0003] To improve heat transfer efficiency, the heat dissipation module, conductive foam, and shielding frame within electronic devices can be enclosed to form a heat dissipation duct with openings. Heat generated by electronic components within the shielding frame can be expelled through the airflow within the duct. However, while this method of cooling through a duct and fan alleviates the heat dissipation problem to some extent, the limited opening size of the duct restricts the amount of air entering, making it difficult to further improve the thermal design power of the electronic device. Utility Model Content

[0004] This application provides an electrical connection component and an electronic device. By optimizing the heat dissipation structure of the electronic device, more air can participate in heat dissipation, thereby improving the thermal design power of the electronic device.

[0005] In a first aspect, an electrical connection component is provided, comprising:

[0006] A circuit board, wherein electronic components are disposed on the circuit board;

[0007] A first shielding assembly is connected to the circuit board and surrounds the electronic component;

[0008] A heat dissipation module is provided at intervals on the side of the first shielding component away from the circuit board, and at least a portion of the heat dissipation module is positioned opposite the electronic component.

[0009] The second shielding component is disposed between the first shielding component and the heat dissipation module, and together with the first shielding component and the heat dissipation module, they enclose a heat dissipation duct. The second shielding component includes conductive connectors that are respectively connected to the first shielding component and the heat dissipation module. Multiple conductive connectors are provided, and two adjacent conductive connectors are spaced apart to form a first opening of the heat dissipation duct.

[0010] It should be noted that the circuit board may have one or more electronic components. For example, the electronic components may be system-on-a-chip, metal-oxide-semiconductor field-effect transistors, power integrated circuits, central processing units, memory, microcontrollers, flash memory, gravity sensors, etc.

[0011] The second shielding component of the electrical connection assembly provided in this application embodiment includes multiple conductive connectors spaced apart. A first opening of a heat dissipation duct can be formed between two adjacent conductive connectors. This effectively increases the number of openings in the heat dissipation duct, thereby increasing the equivalent opening size of the heat dissipation duct. Air inside the heat dissipation duct can flow out more easily, and external air can also flow into the heat dissipation duct more easily. This can accelerate the exchange of air inside and outside the heat dissipation duct, allowing more air to participate in heat dissipation, which helps to improve the heat dissipation performance of the electrical connection assembly and improve the thermal design power of the electronic device. In addition, during the assembly of the electrical connection assembly, the size of the first opening can be controlled by adjusting the spacing between two adjacent conductive connectors to reduce the impact of the first opening on the electromagnetic noise shielding effect, thereby ensuring the performance of the electronic device.

[0012] In some embodiments, a fan that works with electrical connection components can be provided in the electronic device. The fan can face a portion of the first opening of the heat dissipation duct. In this case, the first opening facing the fan can serve as an inlet, and the remaining first openings can serve as outlets. When the fan is started, it can cause air to flow quickly from the inlet into the heat dissipation duct, and the hot air in the heat dissipation duct can also flow quickly from the outlet under the action of the airflow.

[0013] In one possible implementation, the conductive connector is arched, one of the first shielding component and the heat dissipation module abuts against the middle of the conductive connector, and the other of the first shielding component and the heat dissipation module is connected to two sides of the conductive connector, with the two sides spaced apart to form a second opening of the heat dissipation duct.

[0014] In some embodiments, the middle portion of the conductive connector abuts against the heat dissipation module, and the two sides of the conductive connector are connected to the first shielding component; in other embodiments, the middle portion of the conductive connector abuts against the first shielding component, and the two sides of the conductive connector are connected to the heat dissipation module; in still other embodiments, the middle portion of a portion of the conductive connector abuts against the heat dissipation module, and the two sides of that portion of the conductive connector are connected to the first shielding component, while the middle portion of another portion of the conductive connector abuts against the first shielding component, and the two sides of that portion of the conductive connector are connected to the heat dissipation module.

[0015] By designing the conductive connector in an arched shape, when it is connected to the first shielding component and the heat dissipation module, the area between the two sides of the conductive connector can form a second opening in the heat dissipation channel. This increases the number of openings in the heat dissipation channel, effectively increasing its size and accelerating air exchange. This allows more air to participate in heat dissipation, improving the heat dissipation performance of the electrical connection component and reducing the thermal design power of the electronic device. Furthermore, the arched shape provides the conductive connector with some elasticity, facilitating assembly and reducing the difficulty of assembling the electrical connection component.

[0016] In one possible implementation, the conductive connector further includes a ball head disposed on the edge, the edge being connected to the first shielding component or the heat dissipation module via the ball head.

[0017] It should be noted that the ball head can be spherical or hemispherical, and the ball head can be fixed to the first shielding component or heat dissipation module by spot welding.

[0018] Understandably, the ball head has a spherical surface. When the surface of the first shielding component or heat dissipation module is tilted, the ball head can always be in contact with the first shielding component or heat dissipation module and maintain connection, so that the assembly between the first shielding component, the heat dissipation module and the second shielding component can meet the requirements and ensure the shielding effect against electromagnetic noise generated by electronic components.

[0019] In some embodiments, the ball head may be made of stainless steel plated with gold / passivated copper.

[0020] In one possible implementation, the distance between the two sides of the same conductive connector is L1, where L1 ≤ 5 mm.

[0021] For example, the value range of L1 can be 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, or 5mm.

[0022] It should be noted that in this embodiment, multiple conductive connectors are provided. The sizes of the conductive connectors can be the same or different. That is, the distance between the two sides of the same conductive connector can be equal or unequal. For example, in some embodiments, the distance between the two sides of all conductive connectors can be 1mm, 3mm or 5mm. In other embodiments, the distance between the two sides of some conductive connectors can be 2mm, the distance between the two sides of another part of conductive connectors can be 3mm, and the distance between the two sides of yet another part of conductive connectors can be 5mm.

[0023] Understandably, the higher the frequency of an electromagnetic signal, the shorter its wavelength, requiring a denser shielding structure. In related technologies, high-frequency electromagnetic signals are typically WiFi signals. For example, the WiFi 2.4GHz band has a frequency range of 2400MHz to 2483.5MHz and a wavelength of approximately 12.5cm, which can pass through an aperture structure with a maximum diameter of 12.5mm. The WiFi 5GHz band has a frequency range of 5150MHz to 5850MHz and a wavelength of approximately 5.2cm, which can also pass through an aperture structure with a maximum diameter of 5.2mm. Setting the distance between the two sides of the same conductive connector to no more than 5mm can shield most of the electromagnetic noise, meeting the shielding requirements for electromagnetic noise in the WiFi 2.4GHz and WiFi 5GHz bands, and helping to improve the communication stability of electronic devices.

[0024] In some embodiments, the distance L1 between the two sides of the same conductive connector can also be set to no more than 4mm, that is, L1≤4mm.

[0025] In related technologies, the frequency range of WiFi 6GHz is 5925MHz~7125MHz, its shortest wavelength is 4.21cm, and the maximum aperture that it can pass through is 4.21mm. The distance L1 between the two sides of the same conductive connector is no more than 4mm, which can meet the shielding requirements for electromagnetic noise in the WiFi 6GHz band.

[0026] In some embodiments, the conductive connector can be fixedly connected to one of the first shielding component and the heat dissipation module, and the conductive connector abuts against the other of the first shielding component and the heat dissipation module. For example, both sides of the conductive connector can be fixedly connected to the first shielding component, and the middle part of the conductive connector abuts against the heat dissipation module; or both sides of the conductive connector abut against the first shielding component, and the middle part of the conductive connector is fixedly connected to the heat dissipation module. The heat dissipation module can be connected to the mounting structure within the electronic device to maintain the positional relationship between the heat dissipation module and the first shielding component, the second shielding component, the circuit board, and the electronic components. In other embodiments, both sides of the conductive connector can be fixedly connected to the heat dissipation module, and the middle part of the conductive connector abuts against the first shielding component. That is, the middle part of the conductive connector may not be fixedly connected to the first shielding component; or both sides of the conductive connector abut against the heat dissipation module, and the middle part of the conductive connector is fixedly connected to the first shielding component. The heat dissipation module can be connected to the mounting structure within the electronic device to maintain the positional relationship between the heat dissipation module and the first shielding component, the second shielding component, the circuit board, and the electronic components. Conductive connectors can be fixed by welding or by gluing.

[0027] In one possible implementation, the distance between two adjacent conductive connectors is L2, where L2 ≤ 5 mm.

[0028] For example, the value of L2 can be 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, or 5mm.

[0029] It should be noted that in this embodiment, multiple conductive connectors are provided. The spacing between two adjacent conductive connectors can be equal or unequal. For example, in some embodiments, the adjacent distance of all conductive connectors can be 1mm, 3mm or 5mm. In other embodiments, the adjacent distance of some conductive connectors can be 2mm, the adjacent distance of another part of conductive connectors can be 3mm, and the adjacent distance of yet another part of conductive connectors can be 5mm.

[0030] Understandably, the higher the frequency of an electromagnetic signal, the shorter its wavelength, requiring a denser shielding structure. In related technologies, high-frequency electromagnetic signals are typically WiFi signals. For example, the WiFi 2.4GHz band has a frequency range of 2400MHz to 2483.5MHz and a wavelength of approximately 12.5cm, which can pass through an aperture structure with a maximum diameter of 12.5mm. The WiFi 5GHz band has a frequency range of 5150MHz to 5850MHz and a wavelength of approximately 5.2cm, which can also pass through an aperture structure with a maximum diameter of 5.2mm. Setting the distance between two adjacent conductive connectors to no more than 5mm can shield most electromagnetic noise, meeting the shielding requirements for electromagnetic noise in the WiFi 2.4GHz and WiFi 5GHz bands, and helping to improve the communication stability of electronic devices.

[0031] In some embodiments, the distance L2 between two adjacent conductive connectors can also be set to no more than 4mm, that is, L2≤4mm.

[0032] In related technologies, the frequency range of WiFi 6GHz is 5925MHz~7125MHz, its shortest wavelength is 4.21cm, and its maximum aperture is 4.21mm. The distance L2 between the two sides of the same conductive connector is no more than 4mm, which can meet the shielding requirements for electromagnetic noise in the WiFi 6GHz band.

[0033] In one possible implementation, the conductive connector is a metal component, and the surface impedance of the conductive connector is Z, where 0 < Z ≤ 0.1 ohm.

[0034] Surface impedance refers to the ability of a material surface per unit area to impede current. The lower the surface impedance, the better the conductivity of the material surface and the easier it is to weld. Setting the surface impedance of the conductive connector to no more than 0.1 ohms makes the welding of the conductive connector easier. The conductive connector can be welded to the first shielding component or heat dissipation module. This can ensure the connection stability of the conductive connector and reduce the risk of the conductive connector shifting or falling off during subsequent assembly.

[0035] In some embodiments, the conductive connector may be made of stainless steel plated with nickel as a whole.

[0036] In some embodiments, the two sides of the conductive connector can be fixed by spot welding. For example, the two sides of the conductive connector can be spot welded to a first shielding component or a heat dissipation module, while the middle portion of the conductive connector abuts against the corresponding heat dissipation module or the first shielding component. In other embodiments, the middle portion of the conductive connector can be welded to a heat dissipation module or a first shielding component, while the middle portion of the conductive connector abuts against the corresponding first shielding component or heat dissipation module.

[0037] It should be noted that the ball head is part of the conductive connector, and the ball head also needs to meet the requirement that the surface impedance is not higher than 0.1 ohm.

[0038] In some embodiments, the ball head may be made of stainless steel plated with gold / passivated copper.

[0039] In some embodiments, after the electrical connection components are assembled, the heat dissipation module and the conductive connector abut against each other. The edge and center of the conductive connector can undergo elastic deformation to provide elastic force, ensuring contact stability between the heat dissipation module and the conductive connector. In some embodiments, the interaction force between the heat dissipation module and the conductive connector is 0.8N.

[0040] In one possible implementation, the first shielding assembly includes a plurality of shielding strips connected to the circuit board, the plurality of shielding strips being arranged sequentially to surround the electronic component, with adjacent shielding strips spaced apart to form a third opening in the heat dissipation duct.

[0041] Multiple shielding strips connected to the circuit board are provided, and each shielding strip can be installed independently, which reduces the assembly difficulty of the first shielding component and the circuit board 1. A third opening is set between two adjacent shielding strips to form a heat dissipation channel, and air can flow into or out of the heat dissipation channel from the third opening, which can further improve the heat dissipation performance of the electrical connection component.

[0042] In this embodiment, the thickness of the shielding strip is 1.5mm, meaning the distance between the side of the shielding strip facing away from the circuit board and the circuit board is 1.5mm, and the distance between the shielding strip and the heat dissipation module is 0.8mm. Thus, the distance between the circuit board and the heat dissipation module is 2.3mm. When the first opening and the third opening are connected, the height of the opening formed by the combination of the first and third openings is 2.3mm. In this case, the shielding effect against electromagnetic noise can be ensured by reasonably limiting the width of the first and third openings. For example, the width of the first and third openings can be reasonably limited so that the maximum size of the opening formed by the connection of the first and third openings is less than or equal to 5mm.

[0043] In one possible implementation, the shielding strip is provided with heat dissipation holes that communicate with the heat dissipation duct.

[0044] It should be noted that the cross-sectional shape of the heat dissipation hole can be circular, elliptical, semi-circular, triangular, square, or polygonal. When there are multiple heat dissipation holes, the cross-sectional shape of all the heat dissipation holes can be the same or different.

[0045] With the shielding strip positioned at the heat dissipation holes connecting to the heat dissipation duct, air can flow into or out of the heat dissipation duct through these holes. This effectively increases the number of openings in the heat dissipation duct, thereby increasing its equivalent opening size. Air inside the heat dissipation duct can flow out more easily, and external air can also flow into it more easily. This accelerates the exchange of air inside and outside the heat dissipation duct, allowing more air to participate in heat dissipation, which helps improve the heat dissipation performance of electrical connection components and enhances the thermal design power of electronic devices.

[0046] In one possible implementation, the diameter of the heat dissipation hole is D, where 0.7mm ≤ D ≤ 0.9mm.

[0047] For example, the value of D can be 0.7mm, 0.72mm, 0.74mm, 0.76mm, 0.78mm, 0.8mm, 0.82mm, 0.84mm, 0.86mm, 0.88mm, or 0.9mm.

[0048] Understandably, the smaller the diameter of the heat dissipation hole, the more difficult it is for air to flow inside the hole. Setting the diameter of the heat dissipation hole to no less than 0.7mm can reduce the air flow resistance inside the heat dissipation hole and help accelerate the exchange speed of air inside and outside the heat dissipation duct. On the other hand, the larger the diameter of the heat dissipation hole, the greater its impact on the strength of the shielding strip, and the weaker the shielding strip. Setting the diameter of the heat dissipation hole to no more than 0.9mm can reduce the impact of the heat dissipation hole on the strength of the shielding strip, ensure the overall strength of the shielding strip, thereby reducing the deformation of the shielding strip during the assembly process and helping to improve the assembly accuracy.

[0049] In this embodiment of the application, the diameter D of the heat dissipation hole can be 0.8 mm.

[0050] Furthermore, the heat dissipation hole and the second opening can be considered as a single opening. For example, when the diameter D of the heat dissipation hole is 0.8 mm and the distance L1 between the two sides of the same conductive connector is 0.8 mm, the heat dissipation hole and the second opening can be considered as an opening with a height of 1.6 mm. Compared with the electrical connection components shown in the related art, the electrical connection component of this application embodiment has more openings, which helps to accelerate the exchange speed of air inside and outside the heat dissipation duct.

[0051] In one possible implementation, multiple heat dissipation holes are provided, and the distance between two adjacent heat dissipation holes on the same shielding strip is L3, where 1mm≤L3≤4mm.

[0052] For example, the value of L3 can be 1mm, 1.5mm, 2mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, 2.5mm, 2.6mm, 2.7mm, 2.8mm, 2.9mm, 3mm, 3.1mm, 3.2mm, 3.3mm, 3.4mm, 3.5mm, or 4mm.

[0053] Understandably, the larger the spacing between the heat dissipation holes, the greater their impact on the strength of the shielding strip, resulting in a weaker shielding strip. Setting the distance between two adjacent heat dissipation holes to no less than 1mm can reduce the impact of the heat dissipation holes on the strength of the shielding strip, ensuring the overall strength of the shielding strip, thereby reducing deformation of the shielding strip during assembly and helping to improve assembly accuracy. On the other hand, the larger the distance between the heat dissipation holes, the fewer heat dissipation holes will be set on the shielding strip, and the slower the exchange speed of air inside and outside the heat dissipation duct will be. Setting the distance between two adjacent heat dissipation holes to no less than 4mm, while keeping the length of the shielding strip unchanged, can increase the number of heat dissipation holes, which helps to accelerate the exchange speed of air inside and outside the heat dissipation duct.

[0054] In this embodiment of the application, the distance between two adjacent heat dissipation holes can be 3mm.

[0055] In a second aspect, an electronic device is provided, including a housing, wherein the aforementioned electrical connection components are disposed within the housing.

[0056] Since a first opening of a heat dissipation duct can be formed between two adjacent conductive connectors of the electrical connection component in any of the above embodiments, it is equivalent to increasing the number of openings of the heat dissipation duct, thereby increasing the equivalent opening size of the heat dissipation duct. Air inside the heat dissipation duct can flow out more easily, and external air can also flow into the heat dissipation duct more easily. This can accelerate the exchange of air inside and outside the heat dissipation duct, allowing more air to participate in heat dissipation. Therefore, electronic devices containing this electrical connection component can have a higher thermal design power.

[0057] In some embodiments, a fan that works in conjunction with the electrical connection components may also be provided inside the housing. The fan may be directly facing a portion of the first opening of the heat dissipation duct. Thus, the first opening facing the fan can serve as an inlet, and the remaining first openings can serve as outlets. When the fan is started, it can cause air to flow rapidly into the heat dissipation duct from the inlet, and the hot air in the heat dissipation duct can also flow rapidly out from the outlet under the influence of the airflow. Attached Figure Description

[0058] Figure 1 This is a structural cross-sectional schematic diagram of the electrical connection components of the related technology.

[0059] Figure 2 This is a three-dimensional schematic diagram of a partial structure of an electrical connection component in a related technology. Figure 1 (Hidden heat dissipation module)

[0060] Figure 3 This is a schematic diagram of the heat dissipation module and conductive foam of the related technology.

[0061] Figure 4 This is a three-dimensional schematic diagram of a partial structure of an electrical connection component in a related technology. Figure 2 (Hidden heat dissipation module)

[0062] Figure 5 This is a cross-sectional view of the structure of an electrical connection assembly provided in an embodiment of this application.

[0063] Figure 6 This is a three-dimensional schematic diagram of the electrical connection component provided in the embodiments of this application.

[0064] Figure 7 yes Figure 6 Another perspective view of the electrical connection components shown (with the heat dissipation module hidden).

[0065] Figure 8 yes Figure 7 Another perspective schematic diagram of the electrical connection assembly shown.

[0066] Figure 9 yes Figure 7 Another perspective schematic diagram of the electrical connection assembly shown.

[0067] Figure 10 This is a comparison chart of noise isolation.

[0068] Figure 11 This is a cross-sectional view of the structure of an electrical connection assembly provided in another embodiment of this application.

[0069] Figure 12 This is a cross-sectional view of the structure of an electrical connection component provided in another embodiment of this application.

[0070] Figure 13 This is a schematic diagram of the structure of a conductive connector provided in an embodiment of this application.

[0071] Figure 14 This is a schematic diagram of the structure of a conductive connector provided in another embodiment of this application.

[0072] Figure 15 This is a schematic diagram of the structure of a conductive connector provided in another embodiment of this application.

[0073] Figures 1 to 4 The attached figure labels are:

[0074] 1' Circuit board; 11' Electronic components; 2' Heat dissipation module; 3' Thermal conductive medium; 4' Shielding frame; 5' Conductive foam; 6' Heat dissipation duct; 7' Notch;

[0075] Figures 5 to 15 The attached figure labels are:

[0076] 1. Circuit board; 11. Electronic components; 111. SOC; 112. MOS; 113. Power IC; 2. Heat dissipation module; 3. Thermal conductive medium; 4. First shielding assembly; 41. Shielding strip; 411. Heat dissipation hole; 5. Second shielding assembly; 51. Conductive connector; 511. Ball head; 512. First plane; 513. Edge; 514. Center; 6. Heat dissipation duct; 61. First opening; 62. Second opening; 63. Third opening. Detailed Implementation

[0077] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0078] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0079] In the description of this application, it should be understood that the terms "upper", "lower", "side", "front", "rear", etc., indicate the orientation or positional relationship based on the installation orientation or positional relationship, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0080] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0081] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0082] In today's era of rapid technological advancement, electronic devices are widely used in all aspects of people's lives and work. From everyday smartphones and tablets to professional servers and high-performance computers, these electronic devices are becoming increasingly powerful and their performance is constantly improving. However, with the increasing integration of electronic devices and the gradual increase in the operating power of functional modules, heat dissipation has become one of the key factors restricting further improvements in the performance of electronic devices.

[0083] Figure 1 This is a structural cross-sectional schematic diagram of the electrical connection components of the related technology; Figure 2 This is a three-dimensional schematic diagram of a partial structure of an electrical connection component in a related technology. Figure 1 (Hidden heat dissipation module 2'); Figure 3 This is a schematic diagram of the heat dissipation module 2' and conductive foam 5' of the related technology. (Refer to...) Figure 1 and Figure 2The electrical connection components of the related electronic devices mainly include a heat dissipation module 2', a circuit board 1', and electronic components 11 disposed on the circuit board 1'. The heat generated by the electronic components 11' can be transferred to the heat dissipation module 2' for cooling. Of course, a thermally conductive medium 3' (such as silicone grease) can also be disposed on the surface of the electronic components 11' to further improve heat dissipation performance. In addition, the electrical connection components also include a shielding frame 4' covering the periphery of the electronic components 11' to shield the electromagnetic noise generated by the electronic components 11' during operation. The shielding frame 4' can be mounted on the circuit board 1', and the heat dissipation module 2' can be bonded to the shielding frame 4' via conductive foam 5', as shown in the figure. Figure 3 The conductive foam 5' can be spaced apart so that the heat dissipation module 2', conductive foam 5', and shielding frame 4' can be enclosed to form a heat dissipation duct 6' with an opening. An additional fan can also be installed inside the electronic device. When the fan inside the electronic device operates, the heat generated by the electronic component 11' can be exhausted through the flowing air. Figure 3 The arrows in the diagram indicate the direction of airflow.

[0084] This method of heat dissipation through the cooling duct 6' in conjunction with a fan alleviates the heat dissipation problem of electronic devices to some extent. However, in practical applications, this solution still has obvious shortcomings. Due to the compact internal space layout of electronic devices, the opening size of the cooling duct 6' is limited, restricting the amount of air entering the cooling duct 6'. The heat generated by the electronic components 11' is difficult to dissipate in time, easily causing the temperature of the electronic device to rise. This design is not conducive to improving the thermal design power of the electronic device.

[0085] Figure 4 This is a three-dimensional schematic diagram of a partial structure of an electrical connection component in a related technology. Figure 2 (Hidden heat dissipation module 2'). See reference. Figure 4 In some technologies, a portion of the shielding frame 4' and conductive foam 5' can be removed to form a gap 7' that connects to the heat dissipation duct 6', allowing air to flow into or out of the duct 6'. However, while this arrangement can improve the heat dissipation performance of electronic devices to some extent, electromagnetic noise generated by electronic components 11' can easily leak out through this gap 7', failing to meet the requirements for electromagnetic noise shielding.

[0086] Based on this, embodiments of this application provide an electrical connection component and an electronic device, which optimizes the heat dissipation structure of the electronic device to allow more air to participate in heat dissipation and improve the thermal design power of the electronic device.

[0087] This application first provides an electronic device, which may be, for example, a mobile phone, tablet computer, laptop computer, television, in-vehicle equipment, wearable device, personal digital assistant (PDA), point of sale (POS), video surveillance equipment, or other electronic products with communication functions. The mobile phone may be, for example, a conventional candybar phone or a foldable phone, such as a small vertical folding phone, a left-right inward folding phone, or a left-right outward folding phone. Wearable devices may be, for example, smart bracelets, smartwatches, wireless headphones, augmented reality (AR) glasses, AR headsets, virtual reality (VR) glasses, or VR headsets.

[0088] Electrical connection components in electronic devices are key parts used to achieve the transmission of electrical signals or power between circuits, devices, or components. Their function is to ensure reliable electrical connections while supporting signal transmission, power supply, or data exchange. Electrical connection components can include circuit boards and electronic components mounted on the circuit boards. Examples of such electronic components include displays, central processing units (CPUs), and memory. The CPU, as the core of the computer system's computation and control, is the final execution unit for information processing and program execution. The CPU can be connected to the display, camera, and memory respectively, enabling the display to show images captured by the camera and the memory to store the captured images.

[0089] Figure 5 This is a schematic cross-sectional view of the structure of an electrical connection assembly provided in an embodiment of this application; Figure 6 This is a three-dimensional schematic diagram of the electrical connection component provided in the embodiments of this application.

[0090] Reference Figure 5 and Figure 6 This application provides an electrical connection assembly, including a circuit board 1, a first shielding assembly 4, a heat dissipation module 2, and a second shielding assembly 5. The circuit board 1 is provided with electronic components 11. The first shielding assembly 4 is connected to the circuit board 1 and surrounds the electronic components 11. The heat dissipation module 2 is spaced apart on the side of the first shielding assembly 4 away from the circuit board 1, and at least a portion of the heat dissipation module 2 is positioned opposite to the electronic components 11. The second shielding assembly 5 is disposed between the first shielding assembly 4 and the heat dissipation module 2 and together with the first shielding assembly 4 and the heat dissipation module 2 to form a heat dissipation channel 6. The second shielding assembly 5 includes conductive connectors 51 that are respectively connected to the first shielding assembly 4 and the heat dissipation module 2. Multiple conductive connectors 51 are provided, and two adjacent conductive connectors 51 are spaced apart to form a first opening 61 in the heat dissipation channel 6.

[0091] It should be noted that the circuit board 1 may have one electronic component 11 or multiple electronic components 11. For example, the electronic component 11 may be a system on a chip (SOC), a metal-oxide-semiconductor field-effect transistor (MOS), a power integrated circuit (IC), a CPU, a memory, a microcontroller, flash memory, a gravity sensor, etc.

[0092] It should be noted that electronic component 11 typically generates heat when powered on. When current flows through electronic component 11, due to the resistance of electronic component 11, the current does work and is converted into heat energy. Even wires with low resistance will generate a certain amount of heat when current flows through them, and this heat will accumulate as the current increases and the time extends. In addition, electronic component 11 may also contain semiconductor devices. During data processing, signal transmission, and logic operations, complex electron migration and charge transfer processes occur inside the semiconductor devices. During these processes, electrons collide with the crystal lattice, causing some electrical energy to be converted into heat energy. Moreover, the higher the operating frequency of the semiconductor device and the larger the amount of data processed, the more heat is generated. For example, when a CPU performs high-intensity computing tasks, its internal transistors will rapidly turn on and off, and a large number of electrons will flow within them, generating a lot of heat and causing the CPU temperature to rise. In summary, electronic component 11 generates a certain amount of heat during operation.

[0093] It should be noted that some electronic components 11 may generate electromagnetic noise that affects the operation of electronic devices. For example, a SOC integrates multiple high-frequency modules such as a CPU, graphics processing unit (GPU), baseband, and power management. These modules may generate high-frequency electromagnetic noise during operation. When the antenna of an electronic device receives external signals, the high-frequency electromagnetic noise will be superimposed on the useful electromagnetic wave signal. If the noise intensity is large, it will reduce the signal-to-noise ratio of the received electromagnetic wave signal, resulting in a decrease in signal quality. For example, when a mobile phone receives wireless communication signals, the high-frequency electromagnetic noise generated by the chip inside the phone may cause distortion and bit errors in the received signal, affecting call quality or the accuracy of data transmission. Therefore, a shielding structure can be set to shield these electromagnetic noises, reducing or eliminating the interference of noise on useful electromagnetic wave signals. In this embodiment, the heat dissipation module 2 can be a metal part, and the first shielding component 4, the second shielding component 5, and the heat dissipation module 2 can be combined to form a shielding structure.

[0094] It should be noted that the shielding structure can have holes. When the size of the holes meets preset conditions, it will not affect the shielding effect of the shielding structure on electromagnetic noise. According to the principle of the cutoff waveguide effect, the holes in the shielding structure have a cutoff frequency f. When the frequency of the electromagnetic wave is lower than f, the electromagnetic wave will be significantly attenuated or even completely blocked by the shielding structure, while electromagnetic waves with frequencies higher than f can pass through the shielding structure. In the embodiments of this application, the spacing between the multiple conductive connectors 51 of the second shielding component 5 can be controlled to ensure the shielding effect of the second shielding component 5 on electromagnetic waves.

[0095] It should be noted that the conductive connector 51 can be a metal part or a composite material part, such as conductive foam, conductive plastic (plastic with added carbon fiber, metal fiber or carbon nanotube), conductive rubber (rubber substrate filled with metal particles), etc.

[0096] It should be noted that when multiple electronic components 11 are arranged on the circuit board 1, at least some of the electronic components 11 can share a single heat dissipation module 2, or a heat dissipation module 2 can be arranged for each electronic component 11. Common forms of heat dissipation modules 2 include air-cooled heat dissipation modules, water-cooled heat dissipation modules, heat pipe heat dissipation modules, vapor chamber heat dissipation modules, liquid cooling plate heat dissipation modules, and natural heat dissipation modules. Among them, air-cooled heat dissipation modules are usually composed of cooling fans, heat dissipation fins, and heat dissipation bases. The cooling fans generate airflow, which allows air to flow over the heat dissipation fins and carry away heat. Water-cooled heat dissipation modules generally include water blocks, water pumps, water tanks, radiators, and cooling fans. The water blocks contact the heat-generating components, transferring heat to the circulating coolant. Driven by the water pump, the coolant flows through the radiator, where the cooling fans dissipate heat, allowing the coolant to cool down before returning to the water blocks, thus completing the cycle. The heat pipe cooling module consists of heat pipes, heat dissipation fins, and a heat dissipation base. The working fluid inside the heat pipe absorbs heat in the evaporation section and evaporates into a gaseous state. Under the pressure difference within the heat pipe, the gaseous working fluid flows to the condensation section, releases heat, and re-condenses into a liquid state. The liquid working fluid then flows back to the evaporation section through structures such as a wick, thus achieving efficient heat transfer. Finally, the heat is dissipated into the air by the heat dissipation fins. The vapor chamber cooling module mainly consists of a vapor chamber. In some embodiments, the vapor chamber may be used in conjunction with a cooling fan or heat dissipation fins. The vapor chamber contains a vacuum chamber with a special thermally conductive medium and capillary structures. When one side of the vapor chamber is heated, the thermally conductive medium evaporates to form vapor. The vapor rapidly diffuses into a lower-temperature area within the vacuum chamber and condenses into a liquid. The liquid flows back to the heated area through the capillary structures, continuing to evaporate and dissipate heat, thereby achieving rapid and uniform heat dissipation. The liquid-cooled plate heat dissipation module includes a liquid-cooled plate, a coolant circulation system, etc. The coolant flows inside the liquid-cooled plate, absorbs heat, and then carries the heat to an external heat dissipation device through the circulation system. The natural heat dissipation module mainly relies on the device's own casing or heat sink structure. It uses heat conduction to transfer heat from inside the device to the casing or heat sink, and then dissipates the heat to the surrounding environment through natural convection and thermal radiation. The appropriate type of heat dissipation module 2 can be selected according to the type of electronic component 11 to ensure effective heat dissipation for the electronic component 11, allowing it to operate at a suitable temperature. A thermally conductive medium 3 (such as silicone grease) can also be applied to the surface of the electronic component 11 to further improve the heat dissipation performance of the electrical connection components.

[0097] The second shielding component 5 of the electrical connection assembly provided in this application embodiment includes a plurality of conductive connectors 51, which are spaced apart. A first opening 61 of a heat dissipation duct 6 can be formed between two adjacent conductive connectors 51. This is equivalent to increasing the number of openings in the heat dissipation duct 6, thereby increasing the equivalent opening size of the heat dissipation duct 6. Air inside the heat dissipation duct 6 can flow out more easily, and external air can also flow into the heat dissipation duct 6 more easily. This can accelerate the exchange of air inside and outside the heat dissipation duct 6, allowing more air to participate in heat dissipation, which helps to improve the heat dissipation performance of the electrical connection assembly and improve the thermal design power (TDP) of the electronic device. In addition, during the assembly of the electrical connection assembly, the size of the first opening 61 can be controlled by adjusting the spacing between two adjacent conductive connectors 51 to reduce the impact of the first opening 61 on the electromagnetic noise shielding effect, thereby ensuring the performance of the electronic device.

[0098] In some embodiments, a fan that works with electrical connection components can be provided in the electronic device. The fan can face a portion of the first opening 61 of the heat dissipation duct 6. In this case, the first opening 61 facing the fan can serve as an inlet, and the remaining first openings 61 can serve as outlets. When the fan is started, it can cause air to flow quickly into the heat dissipation duct 6 from the inlet, and the hot air in the heat dissipation duct 6 can also flow quickly out from the outlet under the action of the airflow.

[0099] Figure 7 yes Figure 6 Another perspective view of the electrical connection components shown (with heat dissipation module 2 hidden); Figure 8 yes Figure 7 Another perspective view of the electrical connection assembly shown; Figure 9 yes Figure 7 A schematic diagram of the electrical connection assembly from another perspective. (Refer to...) Figures 7 to 9 In some embodiments, the distance between two adjacent conductive connectors 51 is L2, where L2 ≤ 5 mm.

[0100] For example, the value of L2 can be 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, or 5mm.

[0101] It should be noted that in this embodiment, multiple conductive connectors 51 are provided. The spacing between two adjacent conductive connectors 51 can be equal or unequal. For example, in some embodiments, the adjacent distance of all conductive connectors 51 can be 1mm, 3mm or 5mm. In other embodiments, the adjacent distance of some conductive connectors 51 can be 2mm, the adjacent distance of another part of conductive connectors 51 can be 3mm, and the adjacent distance of yet another part of conductive connectors 51 can be 5mm.

[0102] Understandably, the higher the frequency of an electromagnetic signal, the shorter its wavelength, requiring a denser shielding structure. In related technologies, high-frequency electromagnetic signals are typically WiFi signals. For example, the WiFi 2.4GHz band has a frequency range of 2400MHz to 2483.5MHz and a wavelength of approximately 12.5cm, which can pass through an aperture structure with a maximum diameter of 12.5mm. The WiFi 5GHz band has a frequency range of 5150MHz to 5850MHz and a wavelength of approximately 5.2cm, which can also pass through an aperture structure with a maximum diameter of 5.2mm. Setting the distance between two adjacent conductive connectors 51 to no more than 5mm can shield most of the electromagnetic noise, meeting the shielding requirements for electromagnetic noise in the WiFi 2.4GHz and WiFi 5GHz bands, and helping to improve the communication stability of electronic devices.

[0103] In some embodiments, the distance L2 between two adjacent conductive connectors 51 can also be set to no more than 4mm, that is, L2≤4mm.

[0104] In related technologies, the frequency range of WiFi 6GHz is 5925MHz~7125MHz, its shortest wavelength is 4.21cm, and the maximum aperture that it can pass through is 4.21mm. The distance L2 between the two sides 513 of the same conductive connector 51 is no more than 4mm, which can meet the shielding requirements for electromagnetic noise in the WiFi 6GHz band.

[0105] Figure 10 This is a comparison chart of noise isolation levels. In some embodiments, increasing the distance between two adjacent conductive connectors 51 may reduce the shielding effect against electromagnetic noise. Figure 10 Curve A in the figure illustrates the relevant technology. Figure 2 The shielding effectiveness of the electrical connection assembly shown is against electromagnetic noise. Figure 10 Curve B in the figure illustrates the relevant technology. Figure 4 The shielding effectiveness of the electrical connection assembly shown against electromagnetic noise ( Figure 4 The notch length is 8mm. Figure 10 Curve C in the figure illustrates the embodiment of this application. Figure 7 The shielding effectiveness of the electrical connection assembly against electromagnetic noise (L2 = 5mm) is shown. Figure 10 Curve D in the diagram shows that... Figure 7 Based on the electrical connection assembly shown, the shielding effectiveness against electromagnetic noise is improved by increasing the spacing between two adjacent conductive connectors 51 to 8mm. As can be seen from the figure, curve C shows good electromagnetic noise shielding effectiveness, which meets the electromagnetic noise shielding design requirements of electronic devices.

[0106] Figure 11This is a cross-sectional view of the structure of an electrical connection assembly provided in another embodiment of this application; Figure 12 This is a cross-sectional view of the structure of an electrical connection assembly provided in another embodiment of this application; Figure 13 This is a schematic diagram of the structure of a conductive connector 51 provided in one embodiment of this application. (Refer to...) Figure 5 , Figures 11 to 13 In some embodiments, the conductive connector 51 is arched, with one of the first shielding component 4 and the heat dissipation module 2 abutting against the middle portion 514 of the conductive connector 51, and the other of the first shielding component 4 and the heat dissipation module 2 connected to both sides 513 of the conductive connector 51. The two sides 513 are spaced apart to form second openings 62 of the heat dissipation duct 6. For example, refer to Figure 5 In some embodiments, the middle portion 514 of the conductive connector 51 abuts against the heat dissipation module 2, and the two side portions 513 of the conductive connector 51 are connected to the first shielding assembly 4; see reference. Figure 11 In other embodiments, the middle portion 514 of the conductive connector 51 may abut against the first shielding component 4, and the two side portions 513 of the conductive connector 51 may be connected to the heat dissipation module 2; see reference. Figure 12 In some embodiments, the middle portion 514 of a portion of the conductive connector 51 may abut against the heat dissipation module 2, and the two sides 513 of that portion of the conductive connector 51 may be connected to the first shielding component 4. The middle portion 514 of another portion of the conductive connector 51 may abut against the first shielding component 4, and the two sides 513 of that portion of the conductive connector 51 may be connected to the heat dissipation module 2.

[0107] By designing the conductive connector 51 as an arch, when the conductive connector 51 is connected to the first shielding component 4 and the heat dissipation module 2, the area between the two sides 513 of the conductive connector 51 can form a second opening 62 of the heat dissipation duct 6, increasing the number of openings in the heat dissipation duct 6. This is equivalent to further increasing the effective opening size of the heat dissipation duct 6, further accelerating the exchange of air inside and outside the heat dissipation duct 6, allowing more air to participate in heat dissipation, which helps improve the heat dissipation performance of the electrical connection component and increase the TDP of the electronic device. In addition, by designing the conductive connector 51 as an arch, the conductive connector 51 has a certain degree of elasticity, which facilitates the assembly of the electrical connection component, thereby reducing the difficulty of assembling the electrical connection component.

[0108] Reference Figure 7 and Figure 8 The distance between the two sides 513 of the same conductive connector 51 is L1, and L1 ≤ 5mm. For example, the value of L1 can be 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, or 5mm.

[0109] It should be noted that in this embodiment, multiple conductive connectors 51 are provided. The size of the conductive connectors 51 can be the same or different. That is, the distance between the two sides 513 of the same conductive connector 51 can be equal or unequal. For example, in some embodiments, the distance between the two sides 513 of all conductive connectors 51 can be 1mm, 3mm or 5mm. In other embodiments, the distance between the two sides 513 of some conductive connectors 51 can be 2mm, the distance between the two sides 513 of another part of conductive connectors 51 can be 3mm, and the distance between the two sides 513 of yet another part of conductive connectors 51 can be 5mm.

[0110] Understandably, the higher the frequency of an electromagnetic signal, the shorter its wavelength, requiring a denser shielding structure material. In related technologies, high-frequency electromagnetic signals are typically WiFi signals. For example, the WiFi 2.4GHz band has a frequency range of 2400MHz to 2483.5MHz and a wavelength of approximately 12.5cm, which can pass through an aperture structure with a maximum diameter of 12.5mm. The WiFi 5GHz band has a frequency range of 5150MHz to 5850MHz and a wavelength of approximately 5.2cm, which can also pass through an aperture structure with a maximum diameter of 5.2mm. Setting the distance between the two sides 513 of the same conductive connector 51 to no more than 5mm can shield most of the electromagnetic noise, meeting the shielding requirements for electromagnetic noise in the WiFi 2.4GHz and WiFi 5GHz bands, and helping to improve the communication stability of electronic devices.

[0111] In some embodiments, the distance L1 between the two sides 513 of the same conductive connector 51 can also be set to no more than 4mm, that is, L1≤4mm.

[0112] In related technologies, the frequency range of WiFi 6GHz is 5925MHz~7125MHz, its shortest wavelength is 4.21cm, and the maximum aperture that it can pass through is 4.21mm. The distance L1 between the two sides 513 of the same conductive connector 51 is no more than 4mm, which can meet the shielding requirements for electromagnetic noise in the WiFi 6GHz band.

[0113] In some embodiments, the conductive connector 51 may be fixedly connected to one of the first shielding component 4 and the heat dissipation module 2, and the conductive connector 51 may abut against the other of the first shielding component 4 and the heat dissipation module 2. For example, refer to Figure 5The two sides 513 of the conductive connector 51 can be fixedly connected to the first shielding component 4, and the middle part 514 of the conductive connector 51 abuts against the heat dissipation module 2. Alternatively, the two sides 513 of the conductive connector 51 abut against the first shielding component 4, and the middle part 514 of the conductive connector 51 is fixedly connected to the heat dissipation module 2. The heat dissipation module 2 can be connected to the mounting structure inside the electronic device to maintain the positional relationship between the heat dissipation module 2 and the first shielding component 4, the second shielding component 5, the circuit board 1, and the electronic components 11. (Refer to...) Figure 11 In other embodiments, the two sides 513 of the conductive connector 51 can be fixedly connected to the heat dissipation module 2, and the middle part 514 of the conductive connector 51 abuts against the first shielding component 4. That is, the middle part 514 of the conductive connector 51 may not be fixedly connected to the first shielding component 4, or the two sides 513 of the conductive connector 51 abut against the heat dissipation module 2, and the middle part 514 of the conductive connector 51 is fixedly connected to the first shielding component 4. The heat dissipation module 2 can be connected to the mounting structure inside the electronic device to maintain the positional relationship between the heat dissipation module 2 and the first shielding component 4, the second shielding component 5, the circuit board 1, and the electronic components 11. The conductive connector 51 can be fixed by welding or by adhesive bonding.

[0114] In some embodiments, the conductive connector 51 is a metal part, and the surface impedance of the conductive connector 51 is Z, where 0 < Z ≤ 0.1 ohm.

[0115] Surface impedance refers to the ability of a material surface per unit area to impede current. The lower the surface impedance, the better the conductivity of the material surface and the easier it is to weld. By setting the surface impedance of the conductive connector 51 to no more than 0.1 ohms, the welding difficulty of the conductive connector 51 is low. The conductive connector 51 can be welded to the first shielding component 4 or the heat dissipation module 2. In this way, the connection stability of the conductive connector 51 can be guaranteed, and the risk of the conductive connector 51 shifting position or falling off during subsequent assembly can be reduced.

[0116] In some embodiments, the conductive connector 51 may be made of stainless steel plated with nickel as a whole.

[0117] In some embodiments, the two sides 513 of the conductive connector 51 can be fixed by spot welding. For example, the two sides 513 of the conductive connector 51 can be spot welded to the first shielding component 4 or to the heat dissipation module 2, while the middle portion 514 of the conductive connector 51 abuts against the corresponding heat dissipation module 2 or the first shielding component 4. In other embodiments, the middle portion 514 of the conductive connector 51 can be welded to the heat dissipation module 2 or to the first shielding component 4, while the middle portion 514 of the conductive connector 51 abuts against the corresponding first shielding component 4 or the heat dissipation module 2.

[0118] Figure 14This is a schematic diagram of the structure of the conductive connector 51 provided in another embodiment of this application; Figure 15 This is a schematic diagram of the structure of the conductive connector 51 provided in another embodiment of this application. (Refer to...) Figure 14 and Figure 15 In some embodiments, the conductive connector 51 further includes a ball head 511 disposed on the edge 513, and the edge 513 is connected to the first shielding component 4 or the heat dissipation module 2 through the ball head 511.

[0119] It should be noted that the ball head 511 can be spherical or hemispherical. Figure 14 The ball head 511 shown is spherical. Figure 15 The ball head 511 shown is semi-circular. The ball head 511 can be fixed to the first shielding component 4 or the heat dissipation module 2 by spot welding.

[0120] It should be noted that the ball head 511 is part of the conductive connector 51, and the ball head 511 also needs to meet the requirement that the surface impedance is not higher than 0.1 ohm.

[0121] It is understandable that the surface of the ball head 511 is spherical. When the surface of the first shielding component 4 or the heat dissipation module 2 is tilted, the ball head 511 can always be in contact with the first shielding component 4 or the heat dissipation module 2 and maintain connection, so that the assembly between the first shielding component 4, the heat dissipation module 2 and the second shielding component 5 can meet the requirements and ensure the shielding effect on the electromagnetic noise generated by the electronic component 11.

[0122] In some embodiments, the ball head 511 may be made of stainless steel plated with gold / passivated copper.

[0123] Reference Figures 13 to 15 The middle part 514 of the conductive connector 51 has a first plane 512. When the edge part 513 of the conductive connector 51 is welded to the first shielding component 4, the first plane 512 can fit with the heat dissipation module 2. When the edge part 513 of the conductive connector 51 is connected to the heat dissipation module 2, the first plane 512 can fit with the first shielding component 4.

[0124] In some embodiments, after the electrical connection components are assembled, the heat dissipation module 2 and the conductive connector 51 abut against each other. Elastic deformation can occur between the edge 513 and the center 514 of the conductive connector 51 to provide elastic force, ensuring the contact stability between the heat dissipation module 2 and the conductive connector 51. In some embodiments, the interaction force between the heat dissipation module 2 and the conductive connector 51 is 0.8N.

[0125] Reference Figures 7 to 9The first shielding component 4 includes a plurality of shielding strips 41 connected to the circuit board 1. The plurality of shielding strips 41 are arranged in sequence to surround the electronic component 11, and adjacent shielding strips 41 are spaced apart to form a third opening 63 of the heat dissipation channel 6.

[0126] Multiple shielding strips 41 connected to the circuit board 1 are provided, and each shielding strip 41 can be installed independently, which can reduce the assembly difficulty of the first shielding component 4 and the circuit board 1. The third opening 63 of the heat dissipation air duct 6 is formed by setting two adjacent shielding strips 41 at intervals, and air can flow into or out of the heat dissipation air duct 6 from the third opening 63, which can further improve the heat dissipation performance of the electrical connection component.

[0127] In this embodiment, the thickness of the shielding strip 41 is 1.5mm, meaning the distance between the side of the shielding strip 41 facing away from the circuit board 1 and the circuit board 1 is 1.5mm. The distance between the shielding strip 41 and the heat dissipation module 2 is 0.8mm. Thus, the distance between the circuit board 1 and the heat dissipation module 2 is 2.3mm. When the first opening 61 and the third opening 63 are connected, the height of the opening formed by the combination of the first opening 61 and the third opening 63 is 2.3mm. At this time, the shielding effect against electromagnetic noise can be ensured by reasonably limiting the width of the first opening 61 and the third opening 63. For example, the width of the first opening 61 and the third opening 63 can be reasonably limited so that the maximum size of the opening formed by the connection of the first opening 61 and the third opening 63 is less than or equal to 5mm.

[0128] Reference Figures 6 to 9 The shielding strip 41 is provided with heat dissipation holes 411 that are connected to the heat dissipation duct 6.

[0129] It should be noted that the cross-sectional shape of the heat dissipation hole 411 can be circular, elliptical, semi-circular, triangular, square or polygonal. When there are multiple heat dissipation holes 411, the cross-sectional shape of all heat dissipation holes 411 can be the same or different.

[0130] With the shielding strip 41 connected to the heat dissipation hole 411 of the heat dissipation duct 6, air can flow into or out of the heat dissipation duct 6 through the heat dissipation hole 411. This is equivalent to increasing the number of openings in the heat dissipation duct 6, thereby increasing the equivalent opening size of the heat dissipation duct 6. Air inside the heat dissipation duct 6 can flow out more easily, and external air can also flow into the heat dissipation duct 6 more easily. This can accelerate the exchange of air inside and outside the heat dissipation duct 6, allowing more air to participate in heat dissipation, which helps to improve the heat dissipation performance of electrical connection components and increase the TDP of electronic devices.

[0131] In some embodiments, the diameter of the heat dissipation hole 411 is D, where 0.7mm≤D≤0.9mm.

[0132] For example, the value of D can be 0.7mm, 0.72mm, 0.74mm, 0.76mm, 0.78mm, 0.8mm, 0.82mm, 0.84mm, 0.86mm, 0.88mm, or 0.9mm.

[0133] Understandably, the smaller the diameter of the heat dissipation hole 411, the more difficult it is for air to flow inside the hole. Setting the diameter of the heat dissipation hole 411 to be no less than 0.7mm can reduce the air flow resistance inside the heat dissipation hole 411 and help accelerate the exchange speed of air inside and outside the heat dissipation duct 6. On the other hand, the larger the diameter of the heat dissipation hole 411, the greater its impact on the strength of the shielding strip 41, and the weaker the strength of the shielding strip 41. Setting the diameter of the heat dissipation hole 411 to be no more than 0.9mm can reduce the impact of the heat dissipation hole 411 on the strength of the shielding strip 41, ensure the overall strength of the shielding strip 41, thereby reducing the deformation of the shielding strip 41 during the assembly process and helping to improve the assembly accuracy.

[0134] In this embodiment of the application, the diameter D of the heat dissipation hole 411 can be 0.8 mm.

[0135] Furthermore, the heat dissipation hole 411 and the second opening 62 can be equivalent to a single opening. For example, when the diameter D of the heat dissipation hole 411 is 0.8 mm and the distance L1 between the two sides 513 of the same conductive connector 51 is 0.8 mm, the heat dissipation hole 411 and the second opening 62 can be equivalent to an opening with a height of 1.6 mm. Compared to related technologies... Figure 2 The electrical connection components shown Figure 6 The electrical connection assembly shown in this embodiment of the application has more openings, which helps to accelerate the exchange of air inside and outside the heat dissipation duct 6.

[0136] Reference Figure 8 Multiple heat dissipation holes 411 are provided. The distance between two adjacent heat dissipation holes 411 on the same shielding strip 41 is L3, where 1mm≤L3≤4mm.

[0137] For example, the value of L3 can be 1mm, 1.5mm, 2mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, 2.5mm, 2.6mm, 2.7mm, 2.8mm, 2.9mm, 3mm, 3.1mm, 3.2mm, 3.3mm, 3.4mm, 3.5mm, or 4mm.

[0138] It is understandable that the larger the spacing between the heat dissipation holes 411, the greater its impact on the strength of the shielding strip 41, and the weaker the strength of the shielding strip 41. Setting the distance between two adjacent heat dissipation holes 411 to not less than 1mm can reduce the impact of the heat dissipation holes 411 on the strength of the shielding strip 41, ensure the overall strength of the shielding strip 41, thereby reducing the deformation of the shielding strip 41 during the assembly process and helping to improve the assembly accuracy. On the other hand, the larger the distance between the heat dissipation holes 411, the fewer heat dissipation holes 411 will be set on the shielding strip 41, and the slower the exchange speed of air inside and outside the heat dissipation duct 6 will be. Setting the distance between two adjacent heat dissipation holes 411 to not less than 4mm, while keeping the length of the shielding strip 41 unchanged, can increase the number of heat dissipation holes 411, which helps to accelerate the exchange speed of air inside and outside the heat dissipation duct 6.

[0139] In this embodiment of the application, the distance between two adjacent heat dissipation holes 411 can be 3mm.

[0140] This application provides an electronic device, including a housing, within which an electrical connection component as described in any of the above embodiments is disposed.

[0141] Since a first opening 61 of a heat dissipation duct 6 can be formed between two adjacent conductive connectors 51 in any of the above embodiments, it is equivalent to increasing the number of openings in the heat dissipation duct 6, thereby increasing the equivalent opening size of the heat dissipation duct 6. Air inside the heat dissipation duct 6 can flow out more easily, and external air can also flow into the heat dissipation duct 6 more easily. This can accelerate the exchange of air inside and outside the heat dissipation duct 6, allowing more air to participate in heat dissipation. Therefore, electronic devices containing this electrical connection component can have higher thermal design power.

[0142] In some embodiments, a fan that works in conjunction with the electrical connection components may also be provided inside the housing. The fan may be directly facing a portion of the first opening 61 of the heat dissipation duct 6. Thus, the first opening 61 facing the fan can serve as an inlet, and the remaining first openings 61 can serve as outlets. When the fan is started, it can cause air to flow quickly into the heat dissipation duct 6 from the inlet, and the hot air in the heat dissipation duct 6 can also flow quickly out from the outlet under the influence of the airflow.

[0143] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electrical connection assembly, characterized in that, include: A circuit board, wherein electronic components are disposed on the circuit board; A first shielding assembly is connected to the circuit board and surrounds the electronic component; A heat dissipation module is provided at intervals on the side of the first shielding component away from the circuit board, and at least a portion of the heat dissipation module is positioned opposite the electronic component. The second shielding component is disposed between the first shielding component and the heat dissipation module, and together with the first shielding component and the heat dissipation module, they enclose a heat dissipation duct. The second shielding component includes conductive connectors that are respectively connected to the first shielding component and the heat dissipation module. Multiple conductive connectors are provided, and two adjacent conductive connectors are spaced apart to form a first opening of the heat dissipation duct.

2. The electrical connection assembly according to claim 1, characterized in that, The conductive connector is arched, with one of the first shielding component and the heat dissipation module abutting against the middle of the conductive connector, and the other of the first shielding component and the heat dissipation module connected to two sides of the conductive connector, with the two sides spaced apart to form a second opening of the heat dissipation duct.

3. The electrical connection assembly according to claim 2, characterized in that, The conductive connector further includes a ball head disposed on the edge, and the edge is connected to the first shielding component or the heat dissipation module through the ball head.

4. The electrical connection assembly according to claim 2 or 3, characterized in that, The distance between the two sides of the same conductive connector is L1, where L1 ≤ 5 mm.

5. The electrical connection assembly according to any one of claims 1-4, characterized in that, The distance between two adjacent conductive connectors is L2, where L2 ≤ 5 mm.

6. The electrical connection assembly according to any one of claims 1-5, characterized in that, The conductive connector is a metal part, and the surface impedance of the conductive connector is Z, 0 < Z ≤ 0.1 ohm.

7. The electrical connection assembly according to any one of claims 1-6, characterized in that, The first shielding assembly includes a plurality of shielding strips connected to the circuit board. The plurality of shielding strips are arranged in sequence to surround the electronic component, and adjacent shielding strips are spaced apart to form a third opening in the heat dissipation channel.

8. The electrical connection assembly according to claim 7, characterized in that, The shielding strip is provided with heat dissipation holes that communicate with the heat dissipation duct.

9. The electrical connection assembly according to claim 8, characterized in that, The diameter of the heat dissipation hole is D, where 0.7mm ≤ D ≤ 0.9mm.

10. The electrical connection assembly according to claim 8 or 9, characterized in that, The heat dissipation holes are provided in multiple ways, and the distance between two adjacent heat dissipation holes on the same shielding strip is L3, where 1mm≤L3≤4mm.

11. An electronic device, comprising a housing, characterized in that, An electrical connection assembly is provided inside the housing, and the electrical connection assembly is the electrical connection assembly according to any one of claims 1-10.

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