A circuit board with good heat dissipation

Abstract

This utility model discloses a circuit board with good heat dissipation effect, which includes a circuit board body. Heat-conducting plates are provided on both sides of the circuit board body. Multiple heat sinks are provided on one side of each heat-conducting plate in an equidistant arrangement. A sliding groove is formed on the top of the heat-conducting plate. A heat-conducting cover is slidably connected to the inner wall of the sliding groove. A slot is formed on the outer circumference of the heat-conducting cover. A locking pin is threadedly connected to the inner circumference of the slot. A circular groove is formed on the inner wall of the sliding groove. The inner circumference of the circular groove matches the outer circumference of the locking pin. A nut is welded to one side of the locking pin, and a nut is threadedly connected to the outer circumference of the locking pin. This circuit board with good heat dissipation effect, through the heat-conducting plates and heat-conducting cover, effectively protects the performance of the electronic components on the circuit board body. Furthermore, the protective plate and other structures provide good protection for the circuit board body.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a circuit board with good heat dissipation. Background Technology

[0002] A circuit board, also known as a circuit board, is mainly composed of pads, vias, mounting holes, wires, components, connectors, fillers, and electrical boundaries. Circuit boards make circuits miniaturized and more intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. After long-term use, circuit boards are prone to generating heat, so a circuit board with good heat dissipation is needed.

[0003] The prior art patent document CN211909292U provides a rigid circuit board with good heat dissipation, including a circuit board body and a unit circuit board body. The circuit board body further includes the unit circuit board body. Both the upper and lower surfaces of the unit circuit board body are provided with a frame area, and through holes are provided at the four corner edges of the frame area on the upper surface of the unit circuit board body. This utility model provides a screw, a fixing bracket, and a fixing block. By providing through holes on the unit circuit board body, the through holes limit the fixing block, and the limiting block limits the screw. This can avoid the loss of parts caused by the use of screws and nuts, and prevent loosening between the four single-layer circuit boards, making the unit circuit board body more stable. By providing an elastic gasket between the limiting block and the fixing block, the unit circuit board body is protected, extending the service life of the circuit board body.

[0004] Although the device has many beneficial effects, it still has the following problems: the excessive covering of the circuit board body may generate excess heat; secondly, the design of the elastic gasket alone provides weak protection for the overall device. Utility Model Content

[0005] The purpose of this section is to outline some aspects of the embodiments of this utility model and to briefly introduce some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be used to limit the scope of this utility model.

[0006] 1. Technical problems to be solved:

[0007] To address the issues mentioned above, such as excessive surface covering of the circuit board body potentially generating excess heat and the weak overall protection of the device provided by relying solely on elastic gaskets, this utility model is proposed.

[0008] Therefore, the purpose of this utility model is to provide a circuit board with good heat dissipation, aiming to solve the problem of excessive heat generation due to excessive surface covering of the circuit board body and to achieve the goal of weak protection for the overall device.

[0009] 2. Technical Solution:

[0010] To solve the above-mentioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution:

[0011] A circuit board with good heat dissipation includes a circuit board body, with heat-conducting plates on both sides of the circuit board body. Multiple heat sinks distributed at equal intervals are provided on one side of each heat-conducting plate. A sliding groove is formed on the top of the heat-conducting plate, and a heat-conducting cover is slidably connected to the inner wall of the sliding groove. A slot is formed on the outer circumference of the heat-conducting cover, and a locking pin is threadedly connected to the inner circumference of the slot. A circular groove is formed on the inner wall of the sliding groove, and the inner circumference of the circular groove matches the outer circumference of the locking pin. A nut is welded to one side of the locking pin, and a nut is threadedly connected to the outer circumference of the locking pin. This design, with the locking pin threadedly connecting the slot and the circular groove, facilitates the stable fixing of the heat-conducting cover to the top of the heat-conducting plate. The design of the heat-conducting cover also helps protect the electronic components on the top of the circuit board body and the circuit board body itself from contamination by impurities.

[0012] As a preferred embodiment of the present invention, the heat-conducting cover has multiple grooves distributed at equal intervals on its surface. The inner wall of the grooves is connected to a grid by bolts. The grid structure design helps to reduce the possibility of external dust falling onto the surface of the circuit board.

[0013] As a preferred embodiment of the circuit board with good heat dissipation of this utility model, there are multiple locking pins, and the locking pins are symmetrically distributed.

[0014] As a preferred embodiment of the present invention, the circuit board with good heat dissipation is provided with protective plates at the top and bottom of the circuit board body. The protective plates are provided with a first protective layer inside, a second protective layer is pressed onto one side of the first protective layer, and a third protective layer is pressed onto one side of the second protective layer.

[0015] As a preferred embodiment of the circuit board with good heat dissipation of this utility model, the material of the first protective layer is PE protective film, the material of the second protective layer is graphene coating, and the material of the third protective layer is solder resist ink layer.

[0016] As a preferred embodiment of the circuit board with good heat dissipation of this utility model, the thickness of the third protective layer is 0.05mm, the thickness of the second protective layer is 0.06mm, and the thickness of the first protective layer is 0.15mm.

[0017] 3. Beneficial effects:

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] This type of circuit board with good heat dissipation has heat-conducting plates and heat sinks on both sides of the circuit board body, which increases the heat dissipation area of ​​the circuit board body. This makes it easier to protect the electronic performance of the electronic components of the circuit board body. The structure design of the detachable heat-conducting cover allows the staff to install the heat-conducting cover according to the external ambient temperature, which makes it easier to protect the performance of the electronic components of the circuit board body.

[0020] This type of circuit board with good heat dissipation, through the cooperation of various structures inside the protective plate, can provide good protection for the circuit board body, thereby contributing to a certain extent to the overall service life of the maintenance device. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0022] Figure 1 This is a schematic diagram of the overall structure of a circuit board with good heat dissipation according to the present invention.

[0023] Figure 2 This is an exploded view of the overall structure of a circuit board with good heat dissipation according to the present invention.

[0024] Figure 3 This utility model provides a circuit board with good heat dissipation. Figure 2 A schematic diagram of the structure of section A in the middle;

[0025] Figure 4 This utility model provides a circuit board with good heat dissipation. Figure 2 A schematic diagram of the structure of section B in the middle.

[0026] The following are the labels in the diagram: 1. Circuit board body; 2. Heat-conducting cover; 3. Protective plate; 4. Groove; 5. Grid; 6. Heat-conducting plate; 7. Heat sink; 8. Slide; 9. Circular groove; 10. Pin; 11. Nut; 12. Nut; 13. Hole / groove; 14. Protective layer one; 15. Protective layer two; 16. Protective layer three. Detailed Implementation

[0027] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0028] This utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not be construed as limiting the scope of protection of this utility model. In actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0029] The orientation or positional relationship indicated in the terminology is based on the orientation or positional relationship shown in the accompanying drawings and is only for the convenience of describing the present invention and simplifying the description. It is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0030] The term "connection method" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] The embodiments of this utility model will now be described in further detail with reference to the accompanying drawings.

[0032] This utility model provides an overall structural diagram of an embodiment of a circuit board with good heat dissipation, including:

[0033] Please see Figures 1-4 This utility model provides a technical solution:

[0034] A circuit board with good heat dissipation includes a circuit board body 1. Heat-conducting plates 6 are provided on both sides of the circuit board body 1. Multiple heat sinks 7 are equidistantly distributed on one side of each heat-conducting plate 6. A sliding groove 8 is formed on the top of the heat-conducting plate 6. A heat-conducting cover 2 is slidably connected to the inner wall of the sliding groove 8. A slot 13 is formed on the outer circumference of the heat-conducting cover 2. A locking pin 10 is threadedly connected to the inner circumference of the slot 13. A circular groove 9 is formed on the inner wall of the sliding groove 8. The inner circumference of the circular groove 9 matches the outer circumference of the locking pin 10. A screw is welded to one side of the locking pin 10. The outer circumferential wall of the cap 11 and the locking pin 10 is threaded with a nut 12. The circuit board body 1 is provided with heat-conducting plates 6 and heat sinks 7 on both sides. Since the material of the protective plate 3 itself has a certain degree of heat storage function, the heat of the circuit board body 1 is easily transferred to the interior of the heat sink 7 through the heat-conducting plate 6 made of aluminum alloy and the heat sink 7 made of copper alloy, which increases the heat dissipation area of ​​the circuit board body 1. At the same time, in conjunction with the structure of the heat-conducting cover 2, it is easier to protect the electronic components and electronic performance of the circuit board body 1.

[0035] It is worth noting that, in order to achieve better heat conduction for the circuit board body 1, the surface of the heat conduction cover 2 is provided with multiple grooves 4 that are evenly distributed. The inner wall of the grooves 4 is connected to a grid 5 by bolts. Through the structural design of the grooves 4 and the grid 5, it is easy to cooperate with the heat conduction plate 6 to achieve better heat conduction for the circuit board body 1.

[0036] Next, in order to better fix the heat-conducting cover 2, there are multiple locking pins 10, which are symmetrically distributed. The structure of multiple symmetrically distributed locking pins 10 facilitates better fixation of the heat-conducting cover 2.

[0037] Meanwhile, in order to provide better protection for the circuit board body 1, the circuit board body 1 is provided with protective plates 3 at the top and bottom. The protective plate 3 has a protective layer 14 inside, a protective layer 15 is pressed on one side of the protective layer 14, and a protective layer 16 is pressed on one side of the protective layer 15. Through the internal structural design of the protective plate 3, the circuit board body 1 can be better protected.

[0038] It is worth noting that, in order to better protect the circuit board body 1 in multiple ways, the protective layer 14 is made of PE protective film, the protective layer 2 15 is made of graphene coating, and the protective layer 3 16 is made of solder resist ink. The structure of the protective layer 14, which is made of PE protective film, helps to delay the aging rate of the circuit board body 1 under high temperature conditions. The structure of the protective layer 2 15, which is made of graphene coating, helps to improve the corrosion resistance and wear resistance of the device. The structure of the protective layer 3 16, which is made of solder resist ink, helps to reduce short circuits and improve the safety of the device during use.

[0039] Finally, in order to reduce the impact on heat dissipation of the circuit board body 1, specifically, the thickness of the third protective layer 16 is 0.05mm, the thickness of the second protective layer 15 is 0.06mm, and the thickness of the first protective layer 14 is 0.15mm. Through the thinner structural design, the device as a whole can be made lighter and thinner, thereby reducing the impact on heat dissipation of the circuit board body 1.

[0040] In addition, the circuits, electronic components and modules involved in this utility model are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this utility model does not involve any improvement to the internal structure and method.

[0041] Combination Figures 1-4 The circuit board with good heat dissipation in this embodiment is used in the following specific process:

[0042] 1: When using this type of circuit board with good heat dissipation, the staff can simply move the device to a suitable position.

[0043] 2: When the device requires better heat dissipation, the heat conduction plate 6 and heat sink 7 on both sides of the circuit board body 1 can increase the heat dissipation area of ​​the circuit board body 1, thereby better protecting the electronic performance of the electronic components of the circuit board body 1. When the temperature felt by the staff is high, the staff can install the heat sink cover on the top of the heat sink through the sliding connection of the slide groove 8. At this time, the nut 11 can drive the locking pin 10 to be threaded into the round groove 9 and the hole groove 13, and fixed by the threaded connection of the nut 12. This facilitates the use of the detachable heat conduction cover 2 structure design, thereby better protecting the performance of the electronic components of the circuit board body 1.

[0044] 3: When the device requires better protection, this type of circuit board with good heat dissipation, through the cooperation between the protective layer 14 of PE protective film, the protective layer 15 of graphene coating and the protective layer 16 of solder resist ink inside the protective plate 3, can provide better protection for the circuit board body 1, thereby contributing to a better service life of the overall device.

[0045] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A circuit board with good heat dissipation effect, characterized in that, The circuit board includes a circuit board body (1), and heat-conducting plates (6) are provided on both sides of the circuit board body (1). Multiple heat sinks (7) are provided on one side of the heat-conducting plate (6) in an equidistant distribution. A sliding groove (8) is provided on the top of the heat-conducting plate (6). A heat-conducting cover (2) is slidably connected to the inner wall of the sliding groove (8). A hole (13) is provided on the outer circumference of the heat-conducting cover (2). A locking pin (10) is threadedly connected to the inner circumference of the hole (13). A circular groove (9) is provided on the inner wall of the sliding groove (8). The inner circumference of the circular groove (9) matches the outer circumference of the locking pin (10). A nut (11) is welded to one side of the locking pin (10). A nut (12) is threadedly connected to the outer circumference of the locking pin (10).

2. The circuit board of claim 1, wherein, The surface of the heat-conducting cover (2) is provided with a plurality of grooves (4) that are equally distributed, and the inner wall of the grooves (4) is connected with a grid (5) by bolts.

3. The circuit board with good heat dissipation effect according to claim 1, characterized in that, There are multiple locking pins (10), and the locking pins (10) are symmetrically distributed.

4. The circuit board with good heat dissipation effect according to claim 1, characterized in that, The circuit board body (1) is provided with protective plates (3) at the top and bottom. The protective plate (3) is provided with a first protective layer (14) inside. A second protective layer (15) is pressed onto one side of the first protective layer (14), and a third protective layer (16) is pressed onto one side of the second protective layer (15).

5. The circuit board with good heat dissipation effect according to claim 4, characterized in that, The material of the first protective layer (14) is a PE protective film, the material of the second protective layer (15) is a graphene coating, and the material of the third protective layer (16) is a solder resist ink layer.

6. The circuit board with good heat dissipation effect according to claim 4, characterized in that, The thickness of the third protective layer (16) is 0.05 mm, the thickness of the second protective layer (15) is 0.06 mm, and the thickness of the first protective layer (14) is 0.15 mm.

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