Wafer cell transfer equipment for vertical furnaces

Abstract

This application provides a wafer cassette transfer device for a vertical furnace, comprising: a support platform for receiving wafer cassettes transported by an overhead crane; a telescopic arm including a first robotic arm and a second robotic arm rotatably connected, the extension length and angle of which are adjusted in the telescopic direction of the support platform, and retracting vertically into the space below the support platform when the support platform is extended; the lifting end of the first robotic arm is connected to a lifting mechanism, which drives the telescopic arm to move up and down in the lifting direction to lift the wafer cassette from the support platform; the clamping end of the second robotic arm is provided with a clamping mechanism to clamp the wafer cassette placed on the support platform; and a wafer cassette detection mechanism is located at the front end of the support platform along the extension direction and extends into the periphery of the target position inside the vertical furnace. The telescopic design of the telescopic arm reduces the floor space required, improves safety through sensors, and is applicable to different types of wafer cassettes, improving transmission efficiency and offering strong adaptability.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a wafer cell transport device for a vertical furnace. Background Technology

[0002] In semiconductor wafer manufacturing, wafer cassette handling is a critical step. Traditionally, wafer cassettes need to be moved from one location to another, especially from the wafer storage area to a vertical furnace for further processing. In actual production, vertical furnaces are typically used for high-temperature wafer processing and are designed with side openings for inserting or removing wafer cassettes. Traditional handling relies on manual operation, with workers moving the wafer cassettes from the storage area to the side opening of the vertical furnace. During this process, operators need to manually align the wafer cassette with the furnace opening and carefully place it inside. While this method is simple, it has several problems. First, manual handling is inefficient and prone to errors, leading to wafer cassette damage or improper furnace operation. Second, long-term reliance on manual handling increases the workload of workers and can easily create production bottlenecks during large-scale production.

[0003] With the development of automation technology, overhead crane systems have been gradually introduced into such material handling tasks to improve efficiency and safety. Replacing manual handling with overhead crane systems not only reduces human error but also effectively improves production efficiency. However, how to apply overhead crane systems to wafer cassette handling without changing the existing vertical furnace design, and ensure precise operation within a limited space, remains a pressing technical problem to be solved.

[0004] Therefore, how to introduce the overhead crane system into the wafer cell transport of the vertical furnace while keeping the existing vertical furnace structure unchanged has become a technical problem that the industry urgently needs to overcome. Utility Model Content

[0005] The purpose of this application is to solve the problem in the prior art that it is impossible to introduce a crane system into the wafer cell transfer of a vertical furnace while keeping the existing vertical furnace structure unchanged. Therefore, this application provides a wafer cell transfer device for a vertical furnace that can introduce a crane system into the wafer cell transfer of a vertical furnace.

[0006] This application provides a wafer cell transfer device for a vertical furnace, including:

[0007] The support platform is used to receive the wafer cassettes delivered by the overhead crane and can be extended to make room for the telescopic arm.

[0008] The telescopic arm includes a first mechanical arm and a second mechanical arm that are rotatably connected. The first mechanical arm and the second mechanical arm adjust the extension length and extension angle in the telescopic direction of the support platform. When the support platform is in the extended state, the first mechanical arm and the second mechanical arm retract into the space below the support platform by overlapping vertically. The first connecting end of the first mechanical arm is rotatably connected to the second connecting end of the second mechanical arm.

[0009] The lifting end of the first robotic arm is connected to the lifting mechanism. The lifting mechanism drives the telescopic arm to lift in the lifting direction, lifting the wafer box from the carrier platform. The lifting direction is perpendicular to the telescopic direction.

[0010] The second robotic arm is equipped with a gripping mechanism at its gripping end to grip the wafer cassette placed on the support platform.

[0011] The wafer box inspection mechanism is located at the front end of the support platform along the telescopic direction and extends into the periphery of the target position inside the vertical furnace.

[0012] In some embodiments, the support platform includes: a fixed plate and a telescopic plate;

[0013] The telescopic plate is slidably mounted on the fixed plate;

[0014] The end of the fixed plate closest to the vertical furnace is connected to the wafer box inspection mechanism, and the end of the fixed plate furthest from the vertical furnace is slidably connected to the telescopic plate via a sliding assembly.

[0015] In some embodiments, a limiting block is provided on the telescopic plate; the limiting block is provided along the edge of the telescopic plate.

[0016] In some embodiments, a first sensor is provided on the telescopic plate to detect whether the wafer cassette is correctly leveled.

[0017] In some embodiments, a second sensor is provided on the telescopic plate for detecting whether a wafer cassette is placed on the telescopic plate.

[0018] In some embodiments, the telescopic plate is equipped with a barcode scanning module for scanning electronic tags on the wafer cassette.

[0019] In some embodiments, the clamping mechanism includes two side clamping components symmetrically arranged along the extension direction, and the line connecting the two side clamping components is perpendicular to the extension direction.

[0020] In some embodiments, the clamping mechanism further includes: two bottom support members and two sliders;

[0021] Two bottom support components are fixedly connected to the corresponding side clamping components to support the ear portion of the wafer cassette;

[0022] Two sliding members drive the corresponding side clamping components to extend and retract along the line connecting them.

[0023] In some embodiments, the side clamping component employs a triangular clamping structure.

[0024] In some embodiments, the clamping mechanism further includes: a fixing member;

[0025] The fixing component is equipped with two slide rails, one upper and one lower, and each slide rail is equipped with two sliders;

[0026] Each slider is fixedly connected to the sliders on the same side of the upper and lower slide rails;

[0027] Between the two slide rails at both ends of the fixed component, a drive wheel and a driven wheel are respectively installed, and a transmission belt is installed between the drive wheel and the driven wheel;

[0028] Each sliding component has an intermediate component fixedly mounted on it, and the end of the intermediate component is fixed to the transmission belt.

[0029] In some embodiments, the wafer cassette inspection mechanism includes: a first inspection element and a second inspection element;

[0030] The length of the first inspection piece is greater than that of the second inspection piece;

[0031] Three first detection elements are respectively set on both sides and in the middle of the target position, and two second detection elements are respectively set between the two first detection elements.

[0032] In some embodiments, sensors are provided on the first detection element and the second detection element.

[0033] This application provides a wafer cassette transfer device for a vertical furnace, employing a modular telescopic arm structure to adapt to various handling scenarios, particularly suitable for confined spaces. Combined with an intelligent sensor system, it achieves high-precision handling, avoiding collisions and misoperations. A telescopic support platform is designed to enhance adaptability to different types of wafer cassettes. Space utilization is optimized: compared to traditional robotic arms, this application can complete wafer cassette transfer tasks within limited space, improving the flexibility of equipment layout. Intelligent control and sensor systems optimize the motion trajectory, reducing handling time and improving production efficiency. Real-time monitoring of the wafer cassette status prevents drops or misoperations during transfer, improving the stability of the production process. It is adaptable to various wafer cassette types and production environments, improving the equipment's versatility. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of the wafer cassette transport device of the vertical furnace according to an embodiment of this application;

[0035] Figure 2 This is a schematic diagram of the structure of the carrier platform of the wafer transmission device according to an embodiment of this application;

[0036] Figure 3 This is a schematic diagram of the telescopic arm of the wafer cassette transport device according to an embodiment of this application;

[0037] Figure 4 This is a schematic diagram of the clamping mechanism of the telescopic arm according to an embodiment of this application;

[0038] Figure 5 A schematic diagram of the telescopic clamping mechanism according to an embodiment of this application;

[0039] Figure 6 This is a schematic diagram of the wafer cassette inspection mechanism according to an embodiment of this application;

[0040] Explanation of reference numerals in the attached figures:

[0041] 1: Vertical furnace;

[0042] 2: Wafer box transmission equipment;

[0043] 21: Support platform;

[0044] 210: Fixed plate; 211: Telescopic plate; 212: Sliding assembly; 213: Gear set; 214: Belt; 215: Limiting block; 216: First sensor; 217: Second sensor; 218: Barcode scanning module;

[0045] 22: Telescopic boom;

[0046] 220: First robotic arm; 221: Second robotic arm; 222: Gripping mechanism; 2220: Side gripping component; 2221: Bottom support component; 2222: Sliding component; 2223: Fixing component; 2224: Intermediate component;

[0047] a: First connecting end; b: Second connecting end; c: Lifting end; d: Clamping end; e: Slide rail; f: Slider; g: Drive wheel; h: Driven wheel; i: Transmission belt; j: Protrusion;

[0048] 23: Lifting mechanism;

[0049] 24: Wafer box inspection agency;

[0050] 240: First inspection piece; 241: Second inspection piece;

[0051] 3: Wafer box;

[0052] 30: Ears;

[0053] 4: Pulleys;

[0054] 5: Base plate. Detailed Implementation

[0055] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application will be presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0056] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0057] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0058] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0059] In the description of this application, it should be understood that "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form of connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). "Coupled through..." can be understood as electrical conduction through indirect coupling. Indirect coupling can be understood as contactless coupling. Those skilled in the art will understand that coupling refers to the phenomenon where there is a close cooperation and mutual influence between the inputs and outputs of two or more circuit elements or electrical networks, and energy is transferred from one side to the other through interaction. To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0060] In the wafer manufacturing industry, overhead crane systems are common material handling equipment, widely used to move wafer cascades from one location on the production line to another. Most current overhead crane systems have a relatively traditional design, requiring a large operating space and maintaining a safe distance from surrounding equipment during transport to avoid collisions. Especially in space-constrained production environments, traditional handling devices often cannot meet the demands for efficient and safe handling. Excessive equipment size can lead to wasted space and increased complexity of the production environment; furthermore, due to the size and structure of the equipment, collisions with other equipment or personnel are more likely during operation, creating safety hazards.

[0061] Furthermore, as wafer manufacturing processes become increasingly precise and complex, the demands for handling accuracy and efficiency are also rising. While existing technologies improve handling accuracy and safety, they often fail to adequately consider how to optimize equipment space utilization, especially in confined or complex production environments. Therefore, it is necessary to design a handling device that is more adaptable to the needs of modern production and can effectively solve the problems existing in current systems.

[0062] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the wafer cell transport device of the vertical furnace according to an embodiment of this application. Figure 1 As shown, it includes: a vertical furnace 1 and a wafer transfer device 2. The wafer transfer device 2 is equipped with pulleys 4 at the four corners of its bottom, which can enable the wafer transfer device 2 to move freely. After the position is determined, the base plate 5 is lowered to contact the ground so that the four pulleys 4 are just not in contact with the ground or are off the ground. The wafer transfer device 2 is then brought close to the corresponding vertical furnace 1 and can be fixedly connected to the vertical furnace 1.

[0063] like Figure 1As shown, this application embodiment provides a wafer cassette transfer device for a vertical furnace. The wafer cassette transfer device 2 is close to the vertical furnace 1, receives the wafer cassette 3 transported by the overhead crane, and transports the wafer cassette 3 to the target position inside the vertical furnace 1.

[0064] This application embodiment focuses on the collaborative operation of the telescopic arm and the support platform to design an efficient and safe transmission device within a limited space. The core of this application lies in designing a device capable of efficiently and safely transporting wafer cassettes within confined spaces. Through the coordinated operation of the telescopic arm and the support platform, precise transport of the wafer cassette from the overhead crane to its target location within the vertical furnace is achieved. The telescopic arm adopts a modular design, allowing for adjustments to its length and angle according to actual needs, ensuring the transport task is completed within a minimal space. Furthermore, a certain distance is maintained between the support platform 21 and the vertical furnace 1 to prevent collisions between the wafer cassette 3 and the vertical furnace 1 when placing it on the support platform 21, thus improving safety.

[0065] Figure 2 This is a schematic diagram of the structure of the carrier platform 21 of the wafer transmission device according to an embodiment of this application, as shown below. Figure 2 As shown, the wafer box transfer device 2 includes: a support platform 21 for receiving the wafer box 3 transferred by the overhead crane, and is retractable to make room for the telescopic arm 22.

[0066] Specifically, the support platform 21 includes a fixed plate 210 and a telescopic plate 211. The telescopic plate 211 is mounted on the fixed plate 210 and can slide relative to the fixed plate. The end of the fixed plate 210 near the vertical furnace 1 is connected to the wafer cassette inspection mechanism 24, and the end of the fixed plate 210 away from the vertical furnace 1 is slidably connected to the telescopic plate 211 via a sliding assembly 212 (not shown in the figure). The telescopic plate 211 is extended and retracted by a motor-driven gear set 213, which drives the belt 214 and the sliding assembly 212. The extension and retraction action is achieved by the motor-driven belt 214 and the sliding assembly 212, ensuring precise control.

[0067] In this embodiment, the telescopic plate 211 can slide onto the fixed plate 210, that is, the telescopic plate 211 is folded above the fixed plate 211, making up the space occupied by the telescopic plate 211 before it is retracted, so that the telescopic arm 22 can extend and rise and fall freely.

[0068] Furthermore, a limiting block 215 is provided on the telescopic plate 211 to limit the placement position of the wafer cassette 3, ensuring that the wafer cassette 3 is in an accurate positioning state before transfer. The limiting block 215 is set along the edge of the telescopic plate 211 and works in conjunction with the sensor that detects the placement status of the wafer cassette to ensure that the wafer cassette 3 is correctly placed before the handling operation can be carried out.

[0069] Specifically, such as Figure 2As shown, two limiting blocks 215 can be set on each edge of the telescopic plate 211 to limit the placement position of the wafer box 3 during the process of the crane placing the wafer box 3 on the carrier platform 21, so as to ensure that the wafer box 3 is in the accurate position before transmission.

[0070] Furthermore, the telescopic plate 211 is equipped with a first sensor 216 for detecting whether the wafer cassette 3 is correctly leveled, and issuing an adjustment or warning signal if the wafer cassette 3 is not leveled. The telescopic plate 211 is also equipped with a second sensor 217 for detecting whether the wafer cassette 3 is placed on the telescopic plate 211, and triggering the telescopic arm 22 to perform a transfer operation after detecting that the wafer cassette 3 is placed. The telescopic plate 211 is also equipped with a barcode scanning module 218 for scanning the electronic tag on the wafer cassette 3 to identify its unique identification information.

[0071] In this embodiment, the type of the first sensor 216 is not limited; it is mainly used to detect whether the wafer cassette 3 is correctly leveled. Figure 2 As shown, the first sensor 216 can be placed at the diagonal position of the telescopic plate 211 to better detect whether the wafer cassette 3 is correctly flat.

[0072] Specifically, the support platform 21 serves as the basic platform for the wafer cassette transfer device 2, responsible for receiving and stably placing the wafer cassette 3. It has a telescopic function, allowing the platform position to be adjusted according to the operational needs of the telescopic arm 22, creating sufficient space for the telescopic arm 22 to operate. The design of the support platform 21 ensures efficient operation of the device even in confined spaces.

[0073] Figure 3 This is a schematic diagram of the telescopic arm of the wafer cassette transmission device according to an embodiment of this application. Figure 4 This is a schematic diagram of the clamping mechanism of the telescopic arm according to an embodiment of this application. Figure 5 This is a schematic diagram of the telescopic structure of the clamping mechanism according to an embodiment of this application, as shown below. Figures 3-5As shown, the telescopic arm 22 includes a first robotic arm 220 and a second robotic arm 221 rotatably connected. The first robotic arm 220 and the second robotic arm 221 adjust their extension length and extension angle in the telescopic direction of the support platform 21 to achieve telescopic movement. When the support platform 21 is in the extended state, the first robotic arm 220 and the second robotic arm 221 retract vertically into the space below the support platform 21. The first connecting end a of the first robotic arm 220 and the second connecting end b of the second robotic arm 221 are rotatably connected. The lifting end c of the first robotic arm 220 is connected to the lifting mechanism 23, which drives the telescopic arm 22 to move up and down in the lifting direction to lift the wafer cassette 3 from the support platform 21. The lifting direction is perpendicular to the telescopic direction. The clamping end d of the second robotic arm 221 is provided with a clamping mechanism 222 to clamp the wafer cassette 3 placed on the support platform 21.

[0074] The clamping mechanism 222 includes two side clamping components 2220 symmetrically arranged along the extension direction. The line connecting the two side clamping components 2220 is perpendicular to the extension direction to ensure stable clamping of the wafer cassette 3 during transport. The clamping mechanism 222 also includes: two bottom support components 2221 and two sliding members 2222; the two side clamping components 2220 are used to clamp the wafer cassette 3 from the side; the two bottom support components 2221 are respectively fixedly connected to the corresponding side clamping components 2220 to support the ear 30 portion of the wafer cassette 3; the two sliding members 2222 respectively drive the corresponding side clamping components 2220 to extend and retract along their connecting direction to clamp or release the wafer cassette 3.

[0075] Specifically, a protrusion j is provided on the bottom support component 2221 to cooperate with the limiting groove on the wafer box 3 to achieve alignment and clamping of the wafer box 3, so that the wafer box 3 will not move back and forth during the transmission process, thus improving stability.

[0076] In this embodiment, the side clamping component 2220 is a triangular clamping component with a triangular clamping structure design, which stably supports the ear 30 part of the wafer cassette 3 and prevents the wafer cassette 3 from tilting or falling during transmission.

[0077] Furthermore, the clamping mechanism 222 also includes: a fixing member 2223; the fixing member 2223 is provided with two upper and lower slide rails e, and each slide rail e is provided with two sliders f; each slider 2222 is fixedly connected to the sliders f on the same side of the two upper and lower slide rails e, so as to drive the slider 2222 to slide on the slide rail e, thereby driving the corresponding side clamping component 2220 to extend and retract along the connecting line direction; between the two slide rails e at both ends of the fixing member 2223, a driving wheel g and a driven wheel h are respectively provided, and a transmission belt i is provided between the driving wheel g and the driven wheel h; each slider 2222 is fixedly provided with an intermediate member 2224, the end of the intermediate member 2224 is fixed to the transmission belt i, so as to drive the corresponding slider 2222 to slide on the slide rail e, thereby driving the corresponding side clamping component 2220 to extend and retract along the connecting line direction, so as to clamp or release the wafer cassette 3.

[0078] Figure 6 This is a schematic diagram of the wafer cassette inspection mechanism according to an embodiment of this application, as shown below. Figure 6 As shown, the wafer cell detection mechanism 24 is set at the front end of the support platform 21 along the telescopic direction and extends into the periphery of the target position inside the vertical furnace 1 to detect whether there is a wafer cell 3 at the target position.

[0079] Specifically, the wafer cell inspection mechanism 24 includes: a first inspection element 240 and a second inspection element 241; the length of the first inspection element 240 is greater than that of the second inspection element 241; three first inspection elements 240 are respectively disposed on both sides and in the middle of the target position, and two second inspection elements 241 are respectively disposed between the two first inspection elements 240. Sensors are provided on the first inspection elements 240 and the second inspection elements 241 for detecting whether there is a wafer cell 3 at the target position.

[0080] In this embodiment, the type of sensor is not limited, and it is used to detect whether there is a wafer cell 3 at the target position inside the vertical furnace 1.

[0081] In this embodiment, through the cooperation of the support platform 21, the telescopic arm 22 and the sensor, when a wafer cassette 3 is placed on the support platform 21, after the wafer cassette detection mechanism 24 detects that no wafer cassette 3 is placed at the target position, the support platform 21 is controlled to retract to make room for the telescopic arm 22. The lifting mechanism 23 drives the telescopic arm 22 to rise, so that the clamping mechanism of the telescopic arm 22 clamps the wafer cassette and lifts it from the support platform 21. The wafer cassette is then transferred to the vertical furnace 1 along the telescopic direction and placed at the target position through the extension of the telescopic arm 22.

[0082] When the telescopic arm 22 is not in use, the lifting mechanism 23 drives the telescopic arm 22 to retract from the vertical furnace 1 and descend to the space below the support platform 21. Furthermore, the first robotic arm 220 and the second robotic arm 221 are folded to reduce the space occupied, making the wafer box transfer equipment 2 suitable for space-constrained production environments and enabling it to operate efficiently within the available space.

[0083] In the embodiments of this application, such as Figures 1-6 As shown, two support platforms 21 are arranged side by side, and the two support platforms 21 can be controlled by a lifting mechanism 23 and a telescopic arm 22. The position of the two support platforms 21 can be switched through the slide rail at the bottom of the wafer box transfer device 2.

[0084] This application provides a wafer cassette transfer device for a vertical furnace, employing a modular telescopic arm structure to adapt to various handling scenarios, particularly suitable for confined spaces. Combined with an intelligent sensor system, it achieves high-precision handling, avoiding collisions and misoperations. A telescopic support platform is designed to enhance adaptability to different types of wafer cassettes. Space utilization is optimized: compared to traditional robotic arms, this application can complete wafer cassette transfer tasks within limited space, improving the flexibility of equipment layout. Intelligent control and sensor systems optimize the motion trajectory, reducing handling time and improving production efficiency. Real-time monitoring of the wafer cassette status prevents drops or misoperations during transfer, improving the stability of the production process. It is adaptable to various wafer cassette types and production environments, improving the equipment's versatility.

[0085] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A wafer boat transfer apparatus for a vertical furnace, characterized by, include: The support platform is used to receive the wafer cassettes delivered by the overhead crane and can be extended to make room for the telescopic arm. The telescopic arm includes a first mechanical arm and a second mechanical arm that are rotatably connected. The first mechanical arm and the second mechanical arm adjust the extension length and extension angle in the telescopic direction of the support platform. When the support platform is in the extended state, the first mechanical arm and the second mechanical arm overlap and retract into the space below the support platform. The first connecting end of the first mechanical arm is rotatably connected to the second connecting end of the second mechanical arm. The lifting end of the first robotic arm is connected to a lifting mechanism, which drives the telescopic arm to lift in the lifting direction to lift the wafer cassette from the support platform. The lifting direction is perpendicular to the telescopic direction. The second robotic arm is equipped with a clamping mechanism at its clamping end to clamp the wafer cassette placed on the support platform; The wafer cell inspection mechanism is located at the front end of the support platform along the telescopic direction and extends into the periphery of the target position inside the vertical furnace.

2. The wafer cell transfer device for a vertical furnace according to claim 1, characterized in that, The support platform includes: a fixed plate and a telescopic plate; The telescopic plate is slidably mounted on the fixed plate; The end of the fixed plate closest to the vertical furnace is connected to the wafer box inspection mechanism, and the end of the fixed plate furthest from the vertical furnace is slidably connected to the telescopic plate via a sliding assembly.

3. The wafer cell transfer device for a vertical furnace according to claim 2, characterized in that, A limiting block is provided on the telescopic plate; the limiting block is arranged along the edge of the telescopic plate.

4. The wafer cell transfer device for a vertical furnace according to claim 2, characterized in that, The telescopic plate is equipped with a first sensor for detecting whether the wafer cassette is correctly leveled.

5. The wafer cell transfer device for a vertical furnace according to claim 2, characterized in that, The telescopic plate is equipped with a second sensor for detecting whether the wafer cassette is placed on the telescopic plate.

6. The wafer cell transfer device for a vertical furnace according to claim 2, characterized in that, The telescopic plate is equipped with a barcode scanning module for scanning the electronic tags on the wafer box.

7. The wafer cell transfer device for a vertical furnace according to claim 1, characterized in that, The clamping mechanism includes two side clamping components symmetrically arranged along the telescopic direction, and the line connecting the two side clamping components is perpendicular to the telescopic direction.

8. The wafer cell transfer device for a vertical furnace according to claim 7, characterized in that, The clamping mechanism further includes: two bottom support components and two sliding components; The two bottom support components are respectively fixedly connected to the corresponding side clamping components to support the ear portion of the wafer cassette; The two sliding members respectively drive the corresponding side clamping components to extend and retract along the direction of their connection.

9. The wafer cell transfer device for a vertical furnace according to claim 8, characterized in that, The side clamping component adopts a triangular clamping structure.

10. The wafer cell transfer device for a vertical furnace according to claim 8, characterized in that, The clamping mechanism further includes: a fixing element; The fixing component is provided with two upper and lower slide rails, and each slide rail is provided with two sliders; Each of the aforementioned sliders is fixedly connected to the sliders located on the same side of the upper and lower slide rails; Between the two slide rails at both ends of the fixing member, a drive wheel and a driven wheel are respectively provided, and a transmission belt is provided between the drive wheel and the driven wheel; Each of the sliding members is fixedly provided with an intermediate member, the end of which is fixed to the transmission belt.

11. The wafer cell transfer device for a vertical furnace according to claim 1, characterized in that, The wafer cassette inspection mechanism includes: a first inspection component and a second inspection component; The length of the first detection element is greater than that of the second detection element; The three first detection elements are respectively disposed on both sides and in the middle of the target position, and the two second detection elements are respectively disposed between the two first detection elements.

12. The wafer cell transfer device for a vertical furnace according to claim 11, characterized in that, Sensors are provided on the first detection element and the second detection element.

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