A pressure sensor

Abstract

This utility model relates to a sensor. A pressure sensor includes a housing, one end of which is connected to a connector housing. Pins are provided inside the connector housing. A cavity is provided inside the housing, and a PCB board is mounted within the cavity. An integrated chip, consisting of a pressure sensing element and an interface chip, is located on one side of the PCB board. The integrated chip is sealed and fixed to the housing with adhesive. A pressure channel is formed inside the other end of the housing, and one end of the pressure channel is connected to the integrated chip. This utility model provides a pressure sensor with low cost, fewer processes, and high product accuracy; it solves the technical problems of existing pressure sensors, such as complex construction, high cost, and poor accuracy.

Description

Technical Field

[0001] This utility model relates to a sensor, and more particularly to a pressure sensor. Background Technology

[0002] Pressure sensors are among the most commonly used sensors in industrial practice, widely applied in various industrial automation environments, including water conservancy and hydropower, railway transportation, intelligent buildings, production automation, aerospace, military, petrochemicals, oil wells, power, shipbuilding, machine tools, pipelines, and many other industries. A pressure sensor is a device or apparatus that can sense pressure signals and convert them into usable electrical output signals according to certain rules.

[0003] Currently, most pressure sensor applications in the industry use a ceramic sensing element and a conditioning chip to convert pressure signals into electrical signals, with internal sealing achieved using silicone sealing rings. However, this structure has many components, resulting in high cost, and the ceramic sensing element is highly susceptible to temperature fluctuations, leading to poor accuracy. Summary of the Invention

[0004] This invention provides a pressure sensor with low cost, fewer processes, and high product accuracy; it solves the technical problems of existing pressure sensors that have many components, high cost, and poor accuracy.

[0005] The above-mentioned technical problem of this utility model is solved by the following technical solution: A pressure sensor includes a housing, one end of which is connected to a connector housing. Pins are provided inside the connector housing. A cavity is provided inside the housing, and a PCB board is installed within the cavity. An integrated chip is provided on one side of the PCB board. The integrated chip is an integration of a pressure sensing element and an interface chip. The integrated chip is sealed and fixed to the housing with adhesive. A pressure channel is formed inside the other end of the housing, and one end of the pressure channel is connected to the integrated chip. The integrated chip is directly sealed to the housing with adhesive, reducing the number of parts, simplifying the assembly process, improving product accuracy, and reducing costs. The medium is transmitted to the integrated chip through the pressure channel on the housing. The pressure signal is converted into an electrical signal through conditioning calculations, and the electrical signal is transmitted to the ECU terminal through the pins. It is unaffected by the detected medium and can detect pressure signals from different media, thus having a wide range of applications.

[0006] Preferably, the pressure sensing element is a MEMS sensor, and the interface chip is an ASIC interface chip. The integrated MEMS sensor and ASIC interface chip reduce the problem of poor accuracy caused by the large temperature influence on ceramic sensing elements in traditional pressure sensors.

[0007] Preferably, the other side of the PCB board is connected to the pin end via a spring. The connection structure utilizes the spring's elasticity for stable connection and simplifies assembly.

[0008] Preferably, the other side of the PCB board is also provided with a grounding spring, through which a grounding contact is connected, and the grounding contact abuts against the connector housing. This achieves grounding of the electrical connection and ensures the stability of the electrical connection.

[0009] Preferably, the other end of the housing is connected to the medium storage cylinder, and the housing and the medium storage cylinder are connected by threads, with a sealing ring provided between the housing and the medium storage cylinder.

[0010] Therefore, the pressure sensor of this invention has the following advantages: it uses an integrated MEMS sensor and ASIC interface chip instead of the traditional ceramic sensing element + conditioning chip method; and it uses adhesive to bond the shell instead of a silicone sealing ring, reducing the number of parts, simplifying the assembly process, and improving product accuracy. It is also unaffected by the detection medium, can detect pressure signals from different media, has a wide range of applications, and high accuracy. The simplified assembly process reduces the defect rate and saves costs. Attached Figure Description

[0011] Figure 1 This is a 3D diagram of a pressure sensor.

[0012] Figure 2 yes Figure 1 Mid-section view. Detailed Implementation

[0013] The technical solution of the utility model will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0014] Example:

[0015] like Figure 1 and 2 As shown, a pressure sensor includes a housing 10, with a connector housing 1 connected to one end of the housing 10. Pins 2 are installed inside the connector housing 1. A cavity is formed inside the housing 10, and a PCB board 4 is installed inside the cavity. Four conductive pads are formed on the end face of the PCB board 4 facing the connector. One end of a spring 3 is abutted on the conductive pad. The other end of three of the springs 3 is connected to the pins, and the other end of the remaining spring 3 is connected to a grounding spring 9, which abuts against the connector housing 1.

[0016] An integrated chip 5 is mounted on the other side of the PCB board 4. The integrated chip 5 is composed of a pressure-sensing MEMS sensor and an ASIC interface chip. The integrated chip 5 is fixed to the inner wall of the housing 10 by adhesive 6, replacing the original silicone sealing ring.

[0017] At the other end of the housing 10 is a threaded connecting shell 8, which is integrally formed with the housing 10. The threaded connecting shell connects to the media storage cylinder. A pressure channel 11 is formed in the center of the connecting shell 8, with its end located above the integrated chip. A sealing ring 7 is provided between the connecting shell and the media storage cylinder.

[0018] The medium is transmitted to the integrated chip through the pressure channel on the connecting housing. The pressure signal is converted into an electrical signal through conditioning calculations, and the electrical signal is transmitted to the ECU through springs and pins.

[0019] The specific embodiments described herein are merely illustrative of the concept of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to replace them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A pressure sensor, comprising a housing, one end of which is connected to a connector housing, pins being provided inside the connector housing, a cavity being provided inside the housing, and a PCB board being mounted inside the cavity, characterized in that: An integrated chip is provided on one side of the PCB board. The integrated chip is composed of a pressure sensing element and an interface chip. The integrated chip is sealed and fixed to the housing with glue. A pressure channel is provided inside the other end of the housing, and one end of the pressure channel is connected to the integrated chip.

2. A pressure sensor according to claim 1, characterized in that: The pressure sensing element is a MEMS sensor, and the interface chip is an ASIC interface chip.

3. A pressure sensor according to claim 1 or 2, characterized in that: The other side of the PCB board is connected to one end with pins via a spring.

4. A pressure sensor according to claim 1 or 2, characterized in that: The other side of the PCB board is also provided with a grounding spring, and a grounding spring is connected to the grounding spring, which abuts against the connector housing.

5. A pressure sensor according to claim 1 or 2, characterized in that: The other end of the housing is connected to the medium storage cylinder, and the housing and the medium storage cylinder are connected by threads, with a sealing ring provided between the housing and the medium storage cylinder.

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