A heat dissipation device, power module and inverter

Abstract

The utility model discloses a heat dissipation device, power module and inverter, wherein, heat dissipation device includes: connecting plate, including at least one first accommodating groove, insulating heat conducting layer, insulating heat conducting layer is located in the bottom wall of first accommodating groove, and insulating heat conducting layer includes second accommodating groove, phase change material layer, phase change material layer is located in second accommodating groove, and the side wall of first accommodating groove, phase change material layer and insulating heat conducting layer form accommodating space together, and phase change material layer and insulating heat conducting layer form the bottom wall of accommodating space together, and the bottom wall of accommodating space is used for bearing circuit board and is set up with the adhesion of circuit board. In the utility model, circuit board can be directly connected with heat dissipation device, need not through brazing, sintering or direct pressure such as the mode and heat dissipation device connection, need not relying on special equipment can realize the connection of circuit board and heat dissipation device, has lower cost.

Description

Technical Field

[0001] This utility model relates to the field of cooling technology, and in particular to a heat dissipation device, a power module, and an inverter. Background Technology

[0002] In inverters, the heat dissipation requirements of the PCB board for high-power heat-generating components are significant. These high-power heat-generating components include, but are not limited to, insulated-gate bipolar transistors (IGBTs), metal-oxide-semiconductor field-effect transistors (MOSFETs), transformers, and other components. Currently, heat dissipation devices are typically designed to dissipate heat from the printed circuit board (PCB).

[0003] In the existing technology, PCBs are connected to heat dissipation devices by means of soldering, sintering or direct lamination, but the aforementioned connection methods generally have problems such as reliance on special equipment and high cost. Utility Model Content

[0004] The purpose of this invention is to solve the problem of high cost in existing PCB and heat dissipation device connection schemes. This invention provides a heat dissipation device where the PCB can be directly connected to the heat dissipation device without the need for soldering, sintering, or direct lamination. This connection between the PCB and the heat dissipation device can be achieved without relying on specialized equipment, resulting in lower costs.

[0005] To solve the above-mentioned technical problems, an embodiment of this utility model discloses a heat dissipation device, comprising:

[0006] The connecting plate includes at least one first receiving groove for receiving a circuit board;

[0007] An insulating and thermally conductive layer is disposed on the bottom wall of the first receiving groove, and the insulating and thermally conductive layer includes a second receiving groove;

[0008] A phase change material layer is disposed in the second receiving groove. The sidewall of the first receiving groove, the phase change material layer, and the insulating and thermally conductive layer together form a receiving space. The phase change material layer and the insulating and thermally conductive layer together form the bottom wall of the receiving space, which is used to support the circuit board and be attached to the circuit board.

[0009] The above technical solution includes an insulating and thermally conductive layer and a phase change material (PCM) layer within the first accommodating groove. The sidewalls of the first accommodating groove, the PCM layer, and the insulating and thermally conductive layer together form an accommodating space. The PCM layer and the insulating and thermally conductive layer together form the bottom wall of the accommodating space, used to support and adhere to the circuit board. The sidewalls of the first accommodating groove, the insulating and thermally conductive layer, and the PCM layer together fix the circuit board, preventing it from moving horizontally. The adhesive properties of the insulating and thermally conductive layer and the PCM layer also serve to connect the circuit board, eliminating the need for specialized equipment for soldering, sintering, or direct pressing to connect the circuit board and the heat dissipation device. When the circuit board is operating, the electronic components generate heat. On one hand, the insulating and thermally conductive layer improves the heat conduction and dissipation efficiency of the circuit board. On the other hand, heat conduction causes the temperature of the PCM layer to reach or exceed the phase change temperature point of the PCM material, causing it to become liquid. This liquid absorbs heat and makes more efficient contact with the heat dissipation surface of the circuit board, further improving the heat conduction and dissipation performance of the circuit board.

[0010] Therefore, the heat dissipation device provided in this application can achieve the connection between the circuit board and the heat dissipation device at a lower cost while meeting heat dissipation requirements (e.g., the total thermal resistance from the power component junction to the coolant of the heat dissipation device should be less than 0.5) and reliability requirements (e.g., passing 1000 temperature shock cycle tests).

[0011] According to another specific embodiment of the present invention, a heat dissipation device is disclosed, wherein the thermal conductivity of the phase change material layer is not less than a first value.

[0012] Using the above technical solution, phase change materials with a thermal conductivity greater than or equal to the first value (e.g., 50 W / m·K) (e.g., phase change alloys with high metal particle filling or graphene composite phase change materials) can significantly reduce interfacial thermal resistance and quickly conduct heat to the heat dissipation device.

[0013] According to another specific embodiment of the present invention, a heat dissipation device is disclosed, wherein the phase change temperature of the phase change material layer is not greater than a first temperature. When the phase change temperature is not greater than the first temperature, the phase change material layer is solid, and when the phase change temperature is greater than the first temperature, the phase change material layer is liquid.

[0014] Using the above technical solution, the phase change material layer's phase change temperature is a first temperature (e.g., 70°C). When the circuit board is working, heat conduction causes the phase change material layer's temperature to reach or exceed the first temperature, causing the phase change material to become liquid. While absorbing heat, it also makes more efficient contact with the circuit board's heat dissipation surface through the liquid state, further improving the circuit board's thermal conductivity and heat dissipation performance. When the circuit board is not working or the temperature drops below the first temperature, the liquid phase change material reverts to a solid state, providing support and connection for the circuit board.

[0015] According to another specific embodiment of the present invention, a heat dissipation device is disclosed, wherein the phase change material layer includes a solid-liquid composite metal, and the solid-liquid composite metal is capable of switching between the solid state and the liquid state.

[0016] According to another specific embodiment of the present invention, a heat dissipation device is disclosed, wherein the connecting plate includes a first connecting hole, the insulating heat-conducting layer includes a second connecting hole, and the first connecting hole and the second connecting hole are arranged opposite to each other along a first direction for a connector to pass through, so that the connecting plate is detachably connected to the circuit board.

[0017] Using the above technical solution, the connecting plate includes a first connecting hole, the insulating and heat-conducting layer includes a second connecting hole, and the connector (e.g., bolt) can pass through the first and second connecting holes, so that the circuit board can be more firmly connected to the heat dissipation device, and the circuit board, phase change material layer and insulating and heat-conducting layer are tightly bonded together, thereby improving the heat conduction efficiency.

[0018] According to another specific embodiment of the present invention, a heat dissipation device is disclosed, wherein the insulating thermally conductive layer includes thermally conductive gel or thermally conductive silicone.

[0019] According to another specific embodiment of the present invention, a heat dissipation device is disclosed, including heat dissipation fins. Along a first direction, the heat dissipation fins are disposed on the side of the connecting plate facing away from the first receiving groove, for dividing the water cooling channel into multiple cooling areas.

[0020] Using the above technical solution, heat dissipation fins are also provided on the side of the connecting plate facing away from the first receiving groove, which are used to divide the water cooling channel of the power module into multiple cooling areas to improve the cooling efficiency of transferring the heat of the circuit board to the water cooling channel.

[0021] This utility model also discloses a power module, the power module comprising:

[0022] The heat dissipation device in any of the above embodiments;

[0023] A circuit board is disposed in the first receiving groove, and the circuit board is bonded to the phase change material layer and the insulating and thermally conductive layer;

[0024] A water-cooling channel is provided along a first direction on the side of the connecting plate facing away from the first receiving groove, and the heat dissipation fins of the connecting plate are provided inside the water-cooling channel.

[0025] Using the above technical solution, the circuit board is connected to the heat dissipation device through the first accommodating groove, the phase change material layer, and the insulating and thermally conductive layer, eliminating the need for specialized equipment for brazing, sintering, or direct pressing. When the circuit board is operating, the electronic components generate heat. On one hand, the insulating and thermally conductive layer improves the heat conduction and dissipation efficiency of the circuit board. On the other hand, heat conduction causes the temperature of the phase change material layer to reach or exceed the phase change temperature point of the phase change material, causing it to become liquid. This liquid absorbs heat and makes more efficient contact with the heat dissipation surface of the circuit board, further improving the circuit board's heat conduction and dissipation performance. Furthermore, the power module also includes a water-cooling channel located on the side of the connecting plate opposite to the first accommodating groove. The heat dissipation fins of the connecting plate are located within the water-cooling channel, further dissipating the heat generated by the circuit board during operation.

[0026] Therefore, the heat dissipation device provided in this application can achieve the connection between the circuit board and the heat dissipation device at a lower cost while meeting the heat dissipation and reliability requirements.

[0027] The present invention also discloses an inverter, wherein the power module includes at least the power module described in any of the above embodiments. Attached Figure Description

[0028] Figure 1 A schematic block diagram of the inverter provided in an embodiment of this application is shown.

[0029] Figure 2 A perspective view of the heat dissipation device provided in an embodiment of this application is shown.

[0030] Figure 3 An exploded view of the heat dissipation device provided in an embodiment of this application is shown.

[0031] Figure 4 A schematic diagram of the accommodating space of the heat dissipation device provided in an embodiment of this application is shown.

[0032] Figure 5 A schematic diagram of the circuit board of the power module provided in an embodiment of this application is shown.

[0033] Figure 6 A top view of the heat dissipation device provided in an embodiment of this application is shown without a circuit board.

[0034] Figure 7 A top view of the connecting plate of the heat dissipation device provided in an embodiment of this application is shown.

[0035] Figure 8 A side view of the heat dissipation device provided in an embodiment of this application is shown. Detailed Implementation

[0036] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Although the description of this utility model will be presented in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this embodiment. On the contrary, the purpose of describing the utility model in conjunction with the embodiments is to cover other options or modifications that may be derived based on the claims of this utility model. To provide a deep understanding of this utility model, many specific details will be included in the following description. This utility model may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this utility model, some specific details will be omitted in the description. It should be noted that, without conflict, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0037] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0038] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0039] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0040] In the description of this embodiment, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0041] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0042] In some embodiments, circuit boards are connected to heat dissipation devices via brazing, sintering, or direct lamination. However, current connection processes all have problems: for example, traditional brazing processes are limited by the inherent characteristics of lead-free solder systems, where most conventional materials (such as SnAgCu alloys) have excessively high homologous temperatures (reaching 0.6 times the melting point at room temperature). Homologous temperature refers to the temperature at which all components of the solder completely dissolve and form a homogeneous solution during heating. Due to the high homologous temperature, solder joints undergo creep deformation under long-term static loads (such as device weight or mechanical vibration), or fatigue cracks are induced by repeated plastic strain accumulation during thermal cycling. Especially in applications with large solder areas, fatigue cracks can still rapidly develop at the interface even under low-frequency thermal cycling conditions, making it difficult for products to meet the yield requirements for reliability testing in a wide temperature range of -40°C to 125°C, or -40°C to 150°C.

[0043] In addition, large-area silver sintering or copper sintering technology has high raw material costs and special equipment investment, which significantly increases the economic threshold for industrial application. Furthermore, for the scheme of directly pressing circuit boards and heat dissipation devices with insulating and thermally conductive materials, stringent requirements are placed on the comprehensive performance of the interface materials, which must simultaneously meet multiple characteristic indicators such as high thermal conductivity, excellent insulation, and long-term thermal stability.

[0044] Brazing, sintering, or direct lamination share common technical challenges: First, they require specialized precision equipment to implement the connection process; second, they necessitate extensive Design of Experiments (DOE) to validate the optimal combination of materials and equipment process parameters; and third, they place high demands on the material properties and surface quality of the connection interface between the circuit board and the heat dissipation device, such as the systematic control of key indicators like surface roughness and flatness, which significantly increases the technical threshold and manufacturing cost of the process implementation.

[0045] Based on this, see Figure 1 The applicant provides an inverter comprising a power module, an electromagnetic shielding plate, a drive board, etc., wherein, exemplarily, the electromagnetic shielding plate is disposed between the power module and the drive board. Exemplarily, the power module includes a heat dissipation device, a circuit board, and a water-cooling channel. The heat dissipation device is disposed between the circuit board and the water-cooling channel.

[0046] In some embodiments, see Figure 2 , Figure 3The heat dissipation device includes a connecting plate 10, an insulating and thermally conductive layer 20, and a phase change material layer 30. The connecting plate 10 includes at least one first receiving slot 11 for receiving a circuit board 40. Exemplarily, the connecting plate 10 includes three first receiving slots 11, each first receiving slot 11 for supporting one circuit board 40. It is understood that the number of first receiving slots 11 is not limited in this embodiment; for example, it can be two, four, five, six, seven, etc. Exemplarily, the three first receiving slots 11 are interconnected; it is understood that the three first receiving slots 11 can also be independently arranged, and this embodiment does not limit this.

[0047] In some embodiments, see Figure 2 , Figure 3 , Figure 4 An insulating and thermally conductive layer 20 is disposed on the bottom wall 111 of the first receiving groove 11, and the insulating and thermally conductive layer 20 includes a second receiving groove 21. A phase change material layer 30 is disposed on the second receiving groove 21. The side wall 112 of the first receiving groove 11, the phase change material layer 30 and the insulating and thermally conductive layer 20 together form a receiving space 50. The phase change material layer 30 and the insulating and thermally conductive layer 20 together form the bottom wall 51 of the receiving space 50, which is used to support the circuit board 40 and be attached to the circuit board 40. For example, the second receiving groove 21 penetrates the insulating and heat-conducting layer 20, the phase change material layer 30 is disposed on the bottom wall 111 of the first receiving groove 11, the side wall 301 of the phase change material layer 30 is attached to the side wall 211 of the second receiving groove 21, the phase change material layer 30 and the insulating and heat-conducting layer 20 are at the same height in the first direction Z, that is, the phase change material layer 30 and the insulating and heat-conducting layer 20 are flush in the first direction Z, the side wall 401 of the circuit board 40 is attached to the side wall 112 of the first receiving groove 11, and the heat dissipation surface of the circuit board 40 is attached to the phase change material layer 30 and the insulating and heat-conducting layer 20.

[0048] In some embodiments, see Figure 3 , Figure 4 , Figure 5 The circuit board 40 includes a solder resist layer 41 and a copper foil layer 42. A second receiving groove 21 is located in the middle of the insulating and thermally conductive layer 20, allowing the bottommost thermally conductive copper foil layer 42 of the circuit board 40 to be bonded to the phase change material layer 30. Exemplarily, the copper foil layer 42 is rectangular, and correspondingly, the phase change material layer 30 is cuboid. This application does not limit the shapes of the copper foil layer 42 and the phase change material layer 30; for example, the copper foil layer 42 can be circular, and the phase change material layer 30 can be cylindrical.

[0049] Using the above technical solution, an insulating and thermally conductive layer 20 and a phase change material layer 30 are provided in the first receiving groove 11. The sidewall 112 of the first receiving groove 11, the phase change material layer 30, and the insulating and thermally conductive layer 20 together form a receiving space 50. The phase change material layer and the insulating and thermally conductive layer 20 together form the bottom wall 51 of the receiving space 50, which is used to support the circuit board 40 and fit it in contact with the circuit board 40. The sidewall 112 of the first receiving groove 11, the insulating and thermally conductive layer 20, and the phase change material layer 30 can work together to fix the circuit board 40, so that the circuit board 40 cannot move in the horizontal direction. The adhesiveness of the insulating and thermally conductive layer 20 and the phase change material layer 30 can also play a role in connecting the circuit board 40, without relying on special equipment for brazing, sintering, or direct pressing to connect the circuit board 40 and the heat dissipation device. When the circuit board 40 is working, the electronic components generate heat. On the one hand, the insulating and thermally conductive layer 20 can improve the heat conduction and heat dissipation efficiency of the circuit board 40. On the other hand, heat conduction will cause the temperature of the phase change material layer 30 to reach or exceed the phase change temperature point of the phase change material. Therefore, the phase change material will become liquid. While absorbing heat, it will also make more full contact with the heat dissipation surface of the circuit board 40 through the liquid state, further improving the heat conduction and heat dissipation performance of the circuit board 40.

[0050] Therefore, the heat dissipation device provided in this application can achieve the connection between the circuit board 40 and the heat dissipation device at a lower cost while meeting heat dissipation requirements (e.g., the total thermal resistance from the power component junction to the coolant of the heat dissipation device should be less than 0.5) and reliability requirements (e.g., passing 1000 temperature shock cycle tests), and does not require high requirements for surface roughness, flatness, etc.

[0051] In some embodiments, see Figure 5 , Figure 6 , Figure 7 and combined Figure 4 The connecting plate 10 includes a first connecting hole 12, and the insulating and heat-conducting layer 20 includes a second connecting hole 22. Along the first direction Z, the first connecting hole 12 and the second connecting hole 22 are arranged opposite to each other for the connector 60 to pass through, so that the connecting plate 10 and the circuit board 40 can be detachably connected. Exemplarily, the circuit board 40 is provided with a third connecting hole 402. Along the first direction Z, the first connecting hole 12, the second connecting hole 22, and the third connecting hole 402 are arranged opposite to each other. The connector 60 passes through the third connecting hole 402, the second connecting hole 22, and the first connecting hole 12 in sequence, so that the circuit board 40 can be more securely connected to the heat dissipation device, and the circuit board 40, phase change material layer 30, and insulating and heat-conducting layer 20 are tightly bonded, improving heat conduction efficiency. Exemplarily, the connector 60 includes a bolt. It is understood that the embodiments of this application do not limit the type of connector 60; for example, it can also be a screw.

[0052] In some embodiments, see Figure 6 , Figure 7 , Figure 8 and combined Figure 3 The heat dissipation device includes heat dissipation fins 70. Along the first direction Z, the heat dissipation fins 70 are disposed on the side of the connecting plate 10 facing away from the first receiving groove 11, and are used to divide the water cooling channel into multiple cooling areas. This application embodiment does not limit the number of heat dissipation fins 70, for example, it can be 20, 30, 40, 50, 60, 75, etc. Exemplarily, along the first direction Z, the water cooling channel is disposed on the side of the connecting plate 10 facing away from the first receiving groove 11, and the heat dissipation fins 70 of the connecting plate 10 are disposed within the water cooling channel. The heat generated when the circuit board 40 is working can be conducted to the water cooling channel through the heat dissipation fins 70 and carried away by the coolant.

[0053] In some embodiments, the thermal conductivity of the phase change material layer 30 is not less than a first value. Thermal conductivity is a physical quantity that measures a material's ability to conduct heat; it represents the amount of heat passing through a unit area of ​​the material per unit time under a unit temperature gradient. Exemplarily, the first value is between 45 W / m·K and 55 W / m·K. For example, a phase change material with a thermal conductivity greater than or equal to 50 W / m·K (e.g., a phase change alloy with high metal particle filling or a graphene composite phase change material) can significantly reduce interfacial thermal resistance and quickly conduct heat to the heat dissipation device. It is understood that the embodiments of this application do not limit the range of the first value; for example, the thermal conductivity of the phase change material layer 30 may be not less than 45 W / m·K, 46.5 W / m·K, 52 W / m·K, 55 W / m·K, 60 W / m·K, etc.

[0054] In some embodiments, the phase change material layer 30 includes a sheet-like phase change material. It is understood that the shape of the phase change material layer 30 is not limited in the embodiments of this application; for example, it may be block-shaped.

[0055] In some embodiments, the phase change material layer 30 includes a solid-liquid composite metal capable of switching between solid and liquid states. Solid-liquid phase change materials are materials that reversibly undergo solid-liquid transitions under temperature changes. During the phase transition process, they achieve efficient energy storage and release by absorbing or releasing latent heat. This application does not limit the material type of the phase change material layer 30; for example, it can also be a hydrated salt (such as sodium sulfate decahydrate), polyethylene glycol, etc.

[0056] For example, the phase change material layer 30 has a phase change temperature not greater than a first temperature (e.g., 70°C). When the phase change temperature is not greater than the first temperature, the phase change material layer 30 is solid; when the phase change temperature is greater than the first temperature, the phase change material layer 30 is liquid. It is understood that the embodiments of this application do not limit the value of the first temperature; for example, it can be 40°C, 55°C, 60°C, 70.1°C, 71°C, etc.

[0057] In some embodiments, the insulating and thermally conductive layer 20 includes thermally conductive gel or thermally conductive silicone. Both thermally conductive gel and thermally conductive silicone have excellent insulation, high-temperature resistance, and shock absorption effects. This application does not limit the material type of the insulating and thermally conductive layer 20; for example, it can also be graphene-reinforced silicone.

[0058] For example, the applicant combines Figure 2 , Figure 3 , Figure 5 This document describes the assembly process of the heat dissipation device provided in the embodiments of this application and the changes in the phase change material during operation.

[0059] During assembly, the three sheet-like phase change materials are first placed on the bottom walls 111 of the three first receiving slots 11, and then insulating thermally conductive gel or insulating thermally conductive silicone pads are placed around them. At this time, a receiving space 50 can be obtained in each first receiving slot 11. Then the circuit board 40 is placed in it and fixed with connectors 60 (such as bolts) so that the bottom heat-conducting metal copper foil of the circuit board 40 is in contact with the phase change material layer 30.

[0060] When the circuit board 40 is working, the components on the circuit board 40 generate heat, which is conducted to the copper foil layer 42 of the circuit board 40, quickly raising the temperature to or exceeding the phase change temperature point of the phase change material. At this point, the phase change material becomes liquid, allowing for more efficient contact with the heat dissipation surface of the circuit board 40 and improving heat absorption efficiency. When the circuit board 40 is not working, or when the temperature of the circuit board 40 drops below the phase change temperature point, the liquid phase change material reverts to a solid state, providing support and fixation for the circuit board 40.

[0061] Although the present invention has been illustrated and described with reference to certain preferred embodiments, those skilled in the art should understand that the above description is a further detailed explanation of the present invention in conjunction with specific embodiments, and should not be construed as limiting the specific implementation of the present invention to these descriptions. Those skilled in the art can make various changes in form and detail, including some simple deductions or substitutions, without departing from the spirit and scope of the present invention.

Claims

1. A heat dissipation device, characterized in that, include: The connecting plate includes at least one first receiving groove; An insulating and thermally conductive layer is disposed on the bottom wall of the first receiving groove, and the insulating and thermally conductive layer includes a second receiving groove; A phase change material layer is disposed in the second receiving groove. The sidewall of the first receiving groove, the phase change material layer, and the insulating and thermally conductive layer together form a receiving space. The phase change material layer and the insulating and thermally conductive layer together form the bottom wall of the receiving space. The bottom wall of the receiving space is used to support the circuit board and is attached to the circuit board.

2. The heat dissipation device as described in claim 1, characterized in that, The thermal conductivity of the phase change material layer is not less than a first value.

3. The heat dissipation device as described in claim 1, characterized in that, The phase change material layer includes sheet-like phase change material.

4. The heat dissipation device according to any one of claims 1-3, characterized in that, The phase change material layer has a phase change temperature that is not greater than a first temperature. When the phase change temperature is not greater than the first temperature, the phase change material layer is solid. When the phase change temperature is greater than the first temperature, the phase change material layer is liquid.

5. The heat dissipation device as described in claim 4, characterized in that, The phase change material layer includes a solid-liquid composite metal that can switch between a solid state and a liquid state.

6. The heat dissipation device according to any one of claims 1-3, characterized in that, The connecting plate includes a first connecting hole, and the insulating and thermally conductive layer includes a second connecting hole. Along a first direction, the first connecting hole and the second connecting hole are arranged opposite to each other for a connector to pass through, so that the connecting plate can be detachably connected to the circuit board.

7. The heat dissipation device according to any one of claims 1-3, characterized in that, The insulating and thermally conductive layer includes thermally conductive gel or thermally conductive silicone.

8. The heat dissipation device according to any one of claims 1-3, characterized in that, Includes heat dissipation fins, which are disposed on the side of the connecting plate opposite to the first receiving groove along a first direction, and are used to divide the water cooling channel into multiple cooling zones.

9. A power module, characterized in that, include: The heat dissipation device as described in any one of claims 1-8; A circuit board is disposed in the first receiving groove, and the circuit board is bonded to the phase change material layer and the insulating and thermally conductive layer; A water-cooling channel is provided along a first direction on the side of the connecting plate facing away from the first receiving groove, and the heat dissipation fins of the connecting plate are provided inside the water-cooling channel.

10. An inverter, characterized in that, Includes the power module as described in claim 9.

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