Reflective device and semiconductor process equipment

Abstract

This application discloses a reflective device and semiconductor process equipment, relating to the field of semiconductor equipment technology. The reflective device includes an outer cylinder and an inner cylinder disposed within the outer cylinder. A reflective layer is disposed on the inner wall of the outer cylinder, and a transmission groove is disposed on the outer wall of the inner cylinder. A wafer is disposed inside the inner cylinder. Light emitted from a light source enters the outer cylinder, is reflected by the reflective layer, and transmitted through the transmission groove before entering the inner cylinder to heat the wafer. This reflective device ensures that light can enter the inner cylinder to heat the wafer by providing a transmission groove on the inner cylinder, while using protrusions on the outer cylinder to block some light, preventing excessive light from entering the inner cylinder and causing localized overheating, thereby reducing cylinder deformation and improving device stability.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a reflective device and semiconductor process equipment. Background Technology

[0002] After photoresist is coated on a wafer, a rapid thermal processing process is often required. This involves rapidly irradiating the wafer with an incoherent light source (such as a halogen lamp or an infrared lamp) to heat it to a temperature of 50-150°C, and then quickly cooling it to cure the photoresist.

[0003] However, in existing technologies, the reflective cavity and flange are prone to deformation under uneven heating. This deformation of the reflective cavity and flange will further cause the reflective cylinder to deform as well, ultimately adversely affecting the reflection effect of light emitted from incoherent light sources. Utility Model Content

[0004] The purpose of this application is to provide a reflective device and semiconductor process equipment. By setting a transmission groove on the inner cylinder, light can be allowed to enter the inner cylinder to heat the wafer. At the same time, the protrusions on the outer cylinder are used to block part of the light to avoid excessive light in the inner cylinder, which would cause local overheating. This reduces cylinder deformation and improves device stability.

[0005] The embodiments of this application are implemented as follows: A first aspect of this application provides a reflective device, including an outer cylinder and an inner cylinder disposed within the outer cylinder. A reflective layer is provided on the inner wall of the outer cylinder, and a transmission groove is provided on the outer wall of the inner cylinder. A wafer is disposed inside the inner cylinder. Light emitted from a light source enters the outer cylinder, is reflected by the reflective layer, and transmitted through the transmission groove before entering the inner cylinder to heat the wafer. A protrusion is also provided on the inner wall of the outer cylinder to block some of the light from entering the inner cylinder after transmission through the transmission groove. This reflective device ensures that light can enter the inner cylinder to heat the wafer by providing a transmission groove on the inner cylinder, while simultaneously using the protrusion on the outer cylinder to block some light, preventing excessive light from causing localized overheating within the inner cylinder, thereby reducing cylinder deformation and improving device stability.

[0006] As one possible implementation, the surface of the bump is provided with a light-absorbing layer; or, the surface of the bump is provided with a microstructure.

[0007] In one possible implementation, the number of protrusions is multiple, and the multiple protrusions are evenly distributed along the inner wall of the outer cylinder.

[0008] In one possible implementation, the number of the transmission grooves is multiple, and the multiple transmission grooves are evenly distributed along the outer wall of the inner cylinder.

[0009] As one possible implementation, the outer cylinder and the inner cylinder are fitted with a clearance.

[0010] As one possible implementation, it also includes a cover that covers the top of the outer cylinder, and the light source is disposed on the bottom surface of the cover.

[0011] As one possible implementation, a flange is also included, through which the cover is fixedly disposed on the top of the outer cylinder.

[0012] As one possible implementation, it also includes a stage, which is disposed at the bottom of the inner cylinder, and the wafer is placed on the top surface of the stage.

[0013] As one possible implementation method, the light source is an incoherent light source.

[0014] A second aspect of this application provides a semiconductor process apparatus, including the aforementioned reflective device. This reflective device ensures that light can enter the inner cylinder to heat the wafer by providing a transmission groove on the inner cylinder, while simultaneously using protrusions on the outer cylinder to block some light, thus preventing excessive light from causing localized overheating within the inner cylinder, thereby reducing cylinder deformation and improving apparatus stability.

[0015] The beneficial effects of the embodiments of this application include: The reflective device includes an outer cylinder and an inner cylinder housed within the outer cylinder. A reflective layer is provided on the inner wall of the outer cylinder, and a transmission groove is provided on the outer wall of the inner cylinder. A wafer is housed inside the inner cylinder. Light emitted from a light source enters the outer cylinder, is reflected by the reflective layer, and transmitted through the transmission groove before entering the inner cylinder to heat the wafer. A protrusion is also provided on the inner wall of the outer cylinder to block some of the light from entering the inner cylinder after transmission through the transmission groove. The reflective device provided in this application firstly ensures stable light entry into the inner cylinder to heat the wafer through the transmission groove, and secondly, blocks some light through the protrusion to prevent excessive light from entering the inner cylinder and causing localized overheating, resulting in more uniform wafer heating and meeting the temperature accuracy requirements during wafer heating. By reasonably controlling the total amount of light entering the inner cylinder, the reflective device provided in this application can ensure both wafer heating efficiency and maintain the overall temperature stability of the device, reducing problems such as heating interruptions or wafer damage caused by temperature fluctuations, thus ensuring reliable performance during long-term operation. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is one of the structural schematic diagrams of the reflection device provided in the embodiments of this application; Figure 2 This is a second schematic diagram of the structure of the reflective device provided in the embodiments of this application; Figure 3 This is a schematic diagram of the outer cylinder provided in an embodiment of this application; Figure 4 This is a schematic diagram of the inner cylinder provided in an embodiment of this application.

[0018] Icons: 100-Reflecting device; 10-Outer cylinder; 11-Reflective layer; 12-Protrusion; 20-Inner cylinder; 21-Transmission groove; 30-Cover; 40-Flange. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0020] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "horizontal," "vertical," etc., do not indicate that the component must be absolutely horizontal or suspended, but can be slightly tilted. The terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0021] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] Please refer to the reference. Figures 1 to 4 This application provides a reflective device 100, including an outer cylinder 10 and an inner cylinder 20 disposed within the outer cylinder 10. A reflective layer 11 is disposed on the inner wall of the outer cylinder 10, and a transmission groove 21 is disposed on the outer wall of the inner cylinder 20. A wafer is disposed inside the inner cylinder 20. Light emitted from a light source enters the outer cylinder 10, is reflected by the reflective layer 11, and transmitted through the transmission groove 21 before entering the inner cylinder 20 to heat the wafer. A protrusion 12 is also disposed on the inner wall of the outer cylinder 10 to block some light from entering the inner cylinder 20 after transmission through the transmission groove 21. This reflective device 100 ensures that light can enter the inner cylinder 20 to heat the wafer by providing the transmission groove 21 on the inner cylinder 20, while simultaneously using the protrusion 12 on the outer cylinder 10 to block some light, preventing excessive light from causing localized overheating in the inner cylinder 20, thereby reducing cylinder deformation and improving device stability.

[0023] It should be noted that the reflective device 100 includes an outer cylinder 10 and an inner cylinder 20. The inner cylinder 20 is disposed inside the outer cylinder 10, or in other words, the outer cylinder 10 is fitted over the inner cylinder 20, and the interior of the inner cylinder 20 is used to place the wafer. A reflective layer 11 is provided on the inner wall of the outer cylinder 10, and a transmission groove 21 is provided on the outer wall of the inner cylinder 20; a protrusion 12 is also provided on the inner wall of the outer cylinder 10. Regarding the material of the reflective layer 11 and the shape of the transmission groove 21 and the protrusion 12, those skilled in the art should be able to make reasonable selections and designs according to actual needs, and no specific limitations are made here.

[0024] In actual operation, the light emitted by the light source first enters the interior of the outer cylinder 10. After being reflected by the reflective layer 11 on the inner wall of the outer cylinder 10, part of the light will be directed to the transmission groove 21 on the outer wall of the inner cylinder 20. After being transmitted through the transmission groove 21, it will successfully enter the interior of the inner cylinder 20 and finally act on the wafer to achieve heating.

[0025] During the above process, the protrusions 12 on the inner wall of the outer cylinder 10 will block the light. When the light reflected by the reflective layer 11 shines into the transmission groove 21, the protrusions 12 will block part of the light, preventing this part of the light from entering the inner cylinder 20 through the transmission groove 21, thereby effectively controlling the total amount of light entering the inner cylinder 20.

[0026] In this application, firstly, the transmission groove 21 ensures that light can stably enter the inner cylinder 20 to heat the wafer. Secondly, the bump 12 blocks part of the light to avoid excessive light entering the inner cylinder 20 and causing local overheating, so that the wafer is heated more evenly and meets the temperature accuracy requirements during the wafer heating process.

[0027] In existing technologies, excessive light within the reflective cavity can easily lead to localized overheating, causing the reflective cylinder to deform due to uneven thermal expansion and contraction. In this application, the blocking effect of the protrusion 12 reduces the probability of localized high temperatures, effectively minimizing the possibility of cylinder deformation and extending the device's service life.

[0028] The reflective device 100 provided in this application can ensure the heating efficiency of the wafer and maintain the overall temperature stability of the device by reasonably controlling the total amount of light entering the inner cylinder 20, thereby reducing problems such as heating interruption or wafer damage caused by temperature fluctuations, so as to maintain reliable performance of the device during long-term operation.

[0029] As one possible implementation, the surface of the bump 12 is provided with a light-absorbing layer; or, the surface of the bump 12 is provided with a microstructure.

[0030] It should be noted that in some embodiments, the surface of the protrusion 12 is provided with a light-absorbing layer, which can absorb part of the light blocked by the protrusion 12 and convert the light energy into heat energy (or consume it in other ways), so as to prevent the blocked light from being reflected and then shining back into the transmission groove 21.

[0031] In other embodiments, the surface of the bump 12 is provided with microstructures (such as tiny protrusions, grooves or facets). When some of the light blocked by the bump 12 shines on the surface of the microstructure, diffuse reflection or scattering will occur, causing the light to be dispersed in multiple directions and unable to be concentrated on the transmission groove 21, thereby reducing the total amount of light entering the inner cylinder 20.

[0032] The light-absorbing layer directly absorbs light, and the microstructure disperses light through scattering. Both designs prevent light blocked by the bumps 12 from being reflected into the inner cylinder 20. Compared to simply relying on the physical shielding of the bumps 12, the total amount of light can be controlled more thoroughly, preventing local overheating of the inner cylinder 20. Both designs can more precisely adjust the distribution of light entering the inner cylinder 20, reduce local energy accumulation caused by light reflection, make the wafer heat up more evenly, further reduce the risk of deformation of the inner cylinder 20 and outer cylinder 10 due to uneven temperature, extend the service life of the device, and improve operational stability.

[0033] As one possible implementation method, such as Figure 1 and Figure 3 As shown, there are multiple protrusions 12, which are evenly distributed along the inner wall of the outer cylinder 10.

[0034] It should be noted that the multiple protrusions 12 are arranged at the same interval on the inner wall of the outer cylinder 10 with the axis of the outer cylinder 10 as the center, forming a circumferential distribution structure. This distribution method ensures that the circumferential position of each protrusion 12 is relatively balanced and corresponds to the transmission groove 21 on the inner cylinder 20. That is, the light area blocked by each protrusion 12 can evenly cover different parts of the transmission groove 21.

[0035] When the light emitted by the light source is reflected by the reflective layer 11 on the inner wall of the outer cylinder 10, the light that is directed toward the transmission groove 21 will be blocked by a plurality of evenly distributed protrusions 12. Each protrusion 12 intercepts part of the light in its corresponding area, making the distribution of light entering the inner cylinder 20 more even in the circumferential direction, and avoiding excessive light in a certain area due to the absence of a local protrusion 12.

[0036] Multiple bumps 12 are evenly distributed, which can block the light rays directed towards the transmission groove 21 in an all-round and balanced manner, preventing overheating in local areas of the inner cylinder 20 due to excessive light, making the internal temperature distribution of the inner cylinder 20 more uniform, and further reducing the deformation of the cylinder caused by excessive temperature difference. The evenly distributed bumps 12 can accurately match the light blocking range according to the distribution characteristics of the transmission groove 21. The amount of light blocked by each bump 12 is relatively consistent, which makes it easy to accurately control the total amount of light entering the inner cylinder 20 by adjusting the number or size of the bumps 12, so as to meet the temperature conditions required for heating different wafers. Multiple bumps 12 are evenly distributed on the inner wall of the outer cylinder 10, which can disperse the stress effect of the bumps 12 on the cylinder, avoid deformation caused by uneven local stress on the outer cylinder 10 due to the excessive size or concentrated distribution of a single bump 12, extend the service life of the outer cylinder 10, and ensure the overall stability of the device operation.

[0037] As one possible implementation method, such as Figure 1 and Figure 4 As shown, there are multiple transmission grooves 21, which are evenly distributed along the outer wall of the inner cylinder 20.

[0038] It should be noted that the multiple transmission slots 21 are arranged at equal intervals on the outer wall of the inner cylinder 20 with the axis of the inner cylinder 20 as the center, forming a ring-shaped distribution structure. In this distribution, the position of each transmission slot 21 corresponds to the protrusions 12 evenly distributed on the inner wall of the outer cylinder 10, that is, each protrusion 12 can block part of the light rays that are directed toward one or several adjacent transmission slots 21. When the light emitted by the light source is reflected by the reflective layer 11 on the inner wall of the outer cylinder 10, it will be directed in various directions of the inner cylinder 20. Multiple evenly distributed transmission slots 21 can receive the reflected light from different directions, allowing the light to enter the interior of the inner cylinder 20 through the transmission slots 21 and heat the wafer from all directions. At the same time, multiple bumps 12 on the outer cylinder 10 will block part of the light directed at each transmission slot 21, preventing too much light from entering a single transmission slot 21.

[0039] Multiple transmission slots 21 are evenly distributed along the outer wall of the inner cylinder 20, allowing reflected light to enter the inner cylinder 20 uniformly from all directions. This ensures that the amount of light received by each part of the wafer is approximately the same, resulting in more uniform heating and improved heating effect. The evenly distributed transmission slots 21 correspond one-to-one with the evenly distributed bumps 12. The bumps 12 can precisely block part of the light from each transmission slot 21, preventing excessive light from entering the transmission slot 21 in one direction and causing local overheating of the inner cylinder 20, further improving the accuracy of light control. The multiple evenly distributed transmission slots 21 increase the channels for light to enter the inner cylinder 20. Even if some transmission slots 21 are slightly blocked, the remaining transmission slots 21 can still ensure sufficient light to enter, enabling the device to adapt to different light irradiation angles and enhancing the versatility and reliability of the device.

[0040] As one possible implementation, the outer cylinder 10 and the inner cylinder 20 are fitted with a clearance.

[0041] It should be noted that the inner diameter of the outer cylinder 10 is slightly larger than the outer diameter of the inner cylinder 20, and there is a certain gap between them. The inner cylinder 20 can be stably placed inside the outer cylinder 10 without being tightly fitted to the inner wall of the outer cylinder 10. This gap provides space for the propagation of light between the outer cylinder 10 and the inner cylinder 20, and also provides a buffer for thermal expansion and contraction caused by temperature changes.

[0042] It should be understood that the reflective layer 11 and protrusion 12 on the inner wall of the outer cylinder 10, and the transmission groove 21 on the outer wall of the inner cylinder 20, are all located within the gap between them. After being reflected by the reflective layer 11, light can propagate in the gap and be directed towards the transmission groove 21. The protrusion 12 also plays a role in blocking light in the gap. The gap fit ensures that the function of these components is not affected by the mutual compression of the cylinders.

[0043] The clearance fit avoids direct contact between the outer cylinder 10 and the inner cylinder 20, preventing the reflective layer 11, transmission groove 21, or protrusion 12 from being blocked due to the fit. This ensures that light can propagate, reflect, and transmit normally within the space between them, guaranteeing a stable amount of light entering the inner cylinder 20, thereby stabilizing the heating effect on the wafer. During the heating process, both the outer cylinder 10 and the inner cylinder 20 will expand due to the increase in temperature. The buffer space provided by the clearance fit can prevent the two from squeezing each other due to expansion, which would lead to increased deformation. This reduces the impact of cylinder deformation on the device structure and component positions, and further reduces the deviation of the light propagation path caused by deformation.

[0044] The clearance fit allows the inner cylinder 20 to be easily inserted into or removed from the outer cylinder 10, simplifying the assembly process. This fit also reduces operational difficulty and improves the ease of use of the device when it is necessary to replace the wafer in the inner cylinder 20 or maintain components such as the reflective layer 11 and the transmission channel 21.

[0045] As one possible implementation method, such as Figure 1 and Figure 2 As shown, the reflective device 100 also includes a cover 30, which covers the top of the outer cylinder 10, and the light source is located on the bottom surface of the cover 30.

[0046] It should be noted that the cover 30 is placed on top of the outer cylinder 10 to close the top opening of the outer cylinder 10, forming a relatively enclosed space. The light source is installed on the bottom surface of the cover 30, that is, the light source is installed on the side of the cover 30 facing the outer cylinder 10, and the light emitted by the light source can directly enter the outer cylinder 10 downwards.

[0047] After the cover 30 is closed, the light source is positioned above the outer cylinder 10. The light emitted from the light source enters the interior of the outer cylinder 10 downwards and illuminates the reflective layer 11 on the inner wall of the outer cylinder 10. After being reflected by the reflective layer 11, the light is directed towards the transmission groove 21 and then enters the inner cylinder 20 through the transmission groove 21 to heat the wafer. At the same time, the protrusions 12 on the inner wall of the outer cylinder 10 can block some of the light, controlling the amount of light entering the inner cylinder 20.

[0048] The cover 30 places the light source on its bottom surface, allowing the light emitted by the light source to be directly and concentratedly incident into the outer cylinder 10, reducing light diffusion loss to the outside and improving light utilization, thereby enhancing the heating efficiency of the wafer. The cover 30 covers the top of the outer cylinder 10, providing a stable mounting base for the light source, preventing the light source from shifting due to external vibrations and other factors, ensuring that the light can be stably incident into the predetermined area inside the outer cylinder 10, ensuring the stability of the reflection and transmission process, and thus making the wafer heating more uniform. The cover 30 covers the top of the outer cylinder 10, which can reduce air convection inside and outside the outer cylinder 10, reduce the rate of heat loss to the outside, and help maintain the temperature environment inside the outer cylinder 10 and inner cylinder 20. At the same time, it can also prevent external dust and other impurities from entering the outer cylinder 10 and inner cylinder 20, reducing contamination of the reflective layer 11, transmission groove 21 and wafer, and improving the reliability of the device.

[0049] As one possible implementation method, such as Figure 1 and Figure 2 As shown, the reflector 100 also includes a flange 40, and the cover 30 is fixedly mounted on the top of the outer cylinder 10 via the flange 40.

[0050] It should be noted that the flange 40, as a connecting component, is connected to the bottom of the cover 30 and the top of the outer cylinder 10, respectively, so that the cover 30 is firmly fixed to the top of the outer cylinder 10 through the flange 40. This connection method forms a stable rigid connection, ensuring that the cover 30 will not undergo relative displacement with the outer cylinder 10 during the operation of the device.

[0051] After the cover 30 is fixed by the flange 40, the position of the light source on its bottom surface remains stable, and its relative positional relationship with components such as the reflective layer 11 on the inner wall of the outer cylinder 10 and the transmission groove 21 of the inner cylinder 20 remains constant. After the light is emitted from the light source, it can enter the reflective layer 11 along a predetermined path, and after being reflected by the reflective layer 11 and transmitted through the transmission groove 21, it enters the inner cylinder 20. The protrusion 12 can also continuously and stably play a role in blocking light.

[0052] The flange 40 connection makes the cover 30 and the outer cylinder 10 more secure. Even if the device is subjected to external vibration or internal temperature changes that cause slight deformation of the components, the cover 30 will not loosen or shift, ensuring the stability of the light source position and thus ensuring the consistency of the light propagation path and reducing the problem of uneven heating caused by the offset of the light source.

[0053] Compared to a simple cover, the flange 40 connection can further improve the sealing performance between the cover 30 and the outer cylinder 10 through sealing elements (such as sealing rings), reduce the loss of heat inside the outer cylinder 10 and the intrusion of external impurities, better maintain the isolation between the internal and external environments, and provide stable temperature conditions for wafer heating.

[0054] The flange 40 connection can use detachable fasteners such as bolts. When it is necessary to open the cover 30 to replace the wafer, inspect the light source, or clean the inside of the outer cylinder 10, the flange 40 can be easily disassembled to complete the operation. After the operation is completed, it can be quickly re-fixed, taking into account both structural stability and maintenance convenience.

[0055] As one possible implementation, the reflective device 100 also includes a stage (not shown in the figure), which is disposed at the bottom of the inner cylinder 20, and the wafer is placed on the top surface of the stage.

[0056] It should be noted that the stage is located at the bottom of the inner cylinder 20 and is fixed to the inner wall or bottom structure of the inner cylinder 20, forming a stable support structure. The wafer is placed on the top surface of the stage, which positions it inside the inner cylinder 20. The stage supports the wafer, placing it in a suitable position inside the inner cylinder 20, ensuring that the light entering the inner cylinder 20 through the transmission groove 21 can evenly illuminate the wafer. When the light heats the wafer, the stage provides stable support for the wafer, preventing displacement or shaking during the heating process.

[0057] The stage fixes the wafer at a specific position at the bottom of the inner cylinder 20, preventing the wafer from shifting due to factors such as device vibration, light impact, or internal airflow. This ensures that the light can always accurately illuminate the wafer, guaranteeing the uniformity and stability of heating and reducing heating problems caused by wafer displacement. The stage also supports and isolates the wafer, preventing it from directly contacting the bottom of the inner cylinder 20 and reducing the direct impact of temperature fluctuations at the bottom of the inner cylinder 20 on the wafer. The stage can be made of a material with high temperature resistance and suitable thermal conductivity, which can both support the wafer and buffer temperature changes to a certain extent, protecting the wafer from damage.

[0058] The top surface of the stage can be designed to match the shape of the wafer, facilitating rapid wafer placement and precise positioning, thus improving wafer change efficiency. When removing a heated wafer, the stage also provides a convenient point of leverage, reducing the risk of damage to the wafer during handling.

[0059] As one possible implementation method, the light source is an incoherent light source.

[0060] It should be noted that the light source is located on the bottom surface of the cover 30, and the emitted light is incident downwards into the outer cylinder 10. After being reflected by the reflective layer 11 on the inner wall of the outer cylinder 10 and transmitted through the transmission groove 21 of the inner cylinder 20, it enters the inner cylinder 20 and acts on the wafer on the stage to achieve heating. Based on this, the light source can be designed as an incoherent light source. Since the light emitted by the incoherent light source has no fixed relationship in frequency, phase, and vibration direction, it will not produce interference. Therefore, it can avoid local overheating or underheating of the wafer surface due to light interference, ensuring more uniform heating of the wafer and improving heating quality. Since the propagation of light from an incoherent light source does not need to consider phase matching issues, the reflection and transmission process of light by the reflective layer 11 of the outer cylinder 10 and the transmission groove 21 of the inner cylinder 20 is easier to control. Even if there is slight scattering of light during propagation, it will not amplify the local light intensity due to interference, reducing the impact of light fluctuations on the heating effect.

[0061] This application also provides a semiconductor process apparatus, including the aforementioned reflective device 100. Since the structure and beneficial effects of the reflective device 100 have been described in detail in the foregoing embodiments, they will not be repeated here.

[0062] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0063] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A reflecting device, characterized by The device includes an outer cylinder and an inner cylinder disposed within the outer cylinder. A reflective layer is disposed on the inner wall of the outer cylinder, and a transmission groove is disposed on the outer wall of the inner cylinder. A wafer is disposed inside the inner cylinder. Light emitted from a light source enters the outer cylinder, is reflected by the reflective layer, and is transmitted through the transmission groove before entering the inner cylinder to heat the wafer. A protrusion is also disposed on the inner wall of the outer cylinder to block some of the light from entering the inner cylinder after being transmitted through the transmission groove.

2. The reflecting device according to claim 1, characterized in that The surface of the bump is provided with a light-absorbing layer; or, the surface of the bump is provided with a microstructure.

3. The reflecting device of claim 1, wherein The number of protrusions is multiple, and the multiple protrusions are evenly distributed along the inner wall of the outer cylinder.

4. The reflecting device of claim 1, wherein The number of transmission grooves is multiple, and the multiple transmission grooves are evenly distributed along the outer wall of the inner cylinder.

5. The reflective device of claim 1, wherein, The outer cylinder and the inner cylinder are fitted with a clearance.

6. The reflective device of claim 1, wherein, It also includes a cover that fits over the top of the outer cylinder, and the light source is disposed on the bottom surface of the cover.

7. The reflecting device of claim 6, wherein It also includes a flange, through which the cover is fixedly mounted on the top of the outer cylinder.

8. The reflective device of claim 1, wherein, It also includes a stage, which is disposed at the bottom of the inner cylinder, and the wafer is placed on the top surface of the stage.

9. The reflecting device according to any one of claims 1 to 8, characterized in that, The light source is an incoherent light source.

10. A semiconductor process apparatus, characterized in that, Includes the reflective device as described in any one of claims 1 to 9.

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