Integrated miniaturized air-cooled heat dissipation electronic cabinet

Abstract

This utility model relates to an integrated miniaturized air-cooled electronic chassis, including a chassis with a cubic structure open at both the front and rear ends. A front cover assembly and a rear cover assembly are respectively installed on the front and rear open surfaces, and electromagnetic shielding strips are provided in the installation gaps between the chassis and the front and rear cover assemblies. A circuit module is installed inside the chassis, and curved heat dissipation fins are installed on the top and bottom. An air inlet is provided at the rear corresponding to the heat dissipation fins. Air outlets are provided on the top and bottom of the front cover assembly. A fan assembly is installed on the rear cover assembly. This application utilizes the fan assembly, rear cover assembly, chassis, heat dissipation fins, and front cover assembly to form an effective air-cooled heat dissipation channel, which can quickly dissipate the heat generated by the circuit modules inside the chassis, greatly improving the chassis's heat dissipation efficiency. Simultaneously, the electromagnetic shielding strips effectively reduce electromagnetic interference, improve the stability of the electronic equipment inside the chassis, and ensure that the chassis can operate normally in complex electromagnetic environments.

Description

Technical Field

[0001] This utility model relates to the field of electronic chassis technology, specifically to an integrated miniaturized air-cooled electronic chassis. Background Technology

[0002] Navigation products and optoelectronic products are increasingly used in various applications, with most operating in complex environments such as shipborne, airborne, and vehicle-mounted systems. Navigation products and optoelectronic products generally consist of multiple components, including the main unit and an electronic enclosure. The electronic enclosure can operate independently or be integrated into a higher-level system as a standard module.

[0003] Electronic enclosures typically operate in complex electromagnetic environments and usually contain standard-sized circuit modules. These circuit modules generate significant heat, and existing electronic enclosures often experience malfunctions in their circuit modules due to poor heat dissipation or electromagnetic interference. Utility Model Content

[0004] This utility model addresses the technical problems existing in the prior art by providing an integrated miniaturized air-cooled electronic chassis.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: An integrated miniaturized air-cooled electronic chassis includes a chassis body; the chassis body has a cubic structure with openings at both the front and rear ends, with a front cover assembly and a rear cover assembly respectively installed on the front and rear openings, and electromagnetic shielding strips are provided in the installation gaps between the chassis body and the front and rear cover assemblies; a circuit module is installed inside the chassis body, and curved heat dissipation fins are installed on the top and bottom, with an air inlet at the rear corresponding to the heat dissipation fins; air outlets are opened on the top and bottom of the front cover assembly corresponding to the heat dissipation fins; a fan assembly is installed on the rear cover assembly.

[0006] The beneficial effects of this utility model are: The fan assembly, rear cover assembly, chassis, heat dissipation fins, and front cover assembly work together to form an effective air-cooling heat dissipation channel, which can quickly dissipate the heat generated by the circuit modules inside the chassis, ensuring that the circuit modules operate within a suitable temperature range. This greatly improves the heat dissipation efficiency of the heat-generating circuit modules inside the chassis, thereby improving the reliability and service life of the equipment. Moreover, electromagnetic shielding strips are installed between the chassis and the front and rear cover assemblies, so that all the space inside the chassis is in an electromagnetic shielding environment, which can effectively reduce electromagnetic interference, improve the stability of the electronic equipment inside the chassis, and ensure that the circuit modules inside the chassis can work normally in a complex electromagnetic environment.

[0007] Furthermore, the enclosure is welded together from an upper slot plate, a lower slot plate, a left side plate, a right side plate, and a central upright plate. The circuit module is installed between the upper and lower slot plates. Both the upper and lower slot plates have a first groove on their outer sides for mounting heat dissipation fins, and each has an air inlet at its rear end. The enclosure structure is simple and easy to manufacture; the first groove ensures a more stable connection between the heat dissipation fins and the enclosure, facilitating heat conduction; the air inlet allows air to directly enter the enclosure and exchange heat with the heat dissipation fins, improving heat dissipation efficiency.

[0008] Furthermore, both the upper and lower slot plates have a second groove on their inner surfaces for mounting the circuit module, which can better fix the circuit module and prevent it from shaking inside the chassis. At the same time, it can make the circuit module contact the slot plate more tightly, which is beneficial to the heat dissipation of the circuit module and the stability of the electrical connection. The space can accommodate standard 3U, 6U or other sizes of circuit modules.

[0009] Furthermore, the upper slot plate and the lower slot plate are respectively fixedly connected to the outside of the top cover plate and the bottom cover plate. The two can protect the heat dissipation fins and the internal structure of the chassis and prevent foreign objects from entering. They can also form an air duct together with the heat dissipation fins.

[0010] Furthermore, both the left and right side panels are equipped with heat dissipation grooves, which further increases the heat dissipation area of ​​the chassis. This helps the heat inside the chassis to be dissipated into the external environment through the side panels, assisting in air cooling and improving the overall heat dissipation effect.

[0011] Furthermore, guide rails are installed on the outer surfaces of both the left and right side panels, which facilitates the installation, disassembly, and maintenance of the chassis on the cabinets or other equipment of the upper-level system, improving the convenience and flexibility of chassis installation, and also making the chassis more stable after installation.

[0012] Furthermore, the front cover assembly includes a front panel with a handle fixedly mounted on it, and an external mechanical mounting interface provided on the surface of the front panel. The handle facilitates the handling and movement of the chassis, improving ease of use; the mechanical mounting interface allows for convenient mechanical connection of the chassis to other equipment or components, meeting different installation and usage requirements and enhancing the chassis's versatility.

[0013] Furthermore, the rear cover assembly includes a rear panel with connectors and air inlet vents. The connectors facilitate electrical connections between the internal circuit modules and external circuits, enabling signal transmission and power supply. The air inlet vents, which can be used with a fan assembly, provide a cool air inlet to the chassis, forming an important part of the air-cooled heat dissipation duct and ensuring the required airflow for heat dissipation.

[0014] Furthermore, the fan assembly includes a fan, which is fixedly mounted on the rear panel via a duct cover and connected to an air inlet. A fan shroud is fixed to the outside of the fan on the duct cover, and a shielding mesh is fixed to the opening at the rear of the fan shroud. Electromagnetic shielding strips are installed at the seams between the duct cover, the rear panel, and the fan shroud. The fan provides the necessary airflow for heat dissipation of the circuit modules inside the electronic chassis. The fan shroud and shielding mesh protect the fan, preventing debris from entering the fan and chassis, thus affecting the normal operation of the fan and the circuit modules inside the chassis. The fan shroud also guides airflow, concentrating it more effectively inside the chassis. The electromagnetic shielding strips further enhance the electromagnetic shielding performance of the chassis, reducing electromagnetic interference generated during fan operation. Attached Figure Description

[0015] Figure 1 This is an exploded view of the structure of an embodiment of the present utility model; Figure 2 This is a schematic diagram of the box structure according to an embodiment of the present utility model; Figure 3 This is a schematic diagram of the front cover assembly structure according to an embodiment of the present utility model; Figure 4 This is a schematic diagram showing the connection between the rear cover assembly and the fan assembly in an embodiment of the present utility model; The attached diagram lists the components represented by each number as follows: 1. Cabinet; 11. Upper slot plate; 12. Lower slot plate; 13. Left side plate; 14. Right side plate; 15. Vertical plate; 16. Heat dissipation fins; 17. Top cover plate; 18. Bottom cover plate; 19. Air inlet; 2. Rear cover assembly; 21. Rear panel; 22. Connector; 3. Front cover assembly; 31. Front panel; 32. Handle; 33. Air outlet; 4. Circuit module; 5. Electromagnetic shielding strip; 6. Guide rail; 7. Fan assembly; 71. Fan; 72. Air duct cover; 73. Fan cover; 74. Shielding mesh. Detailed Implementation

[0016] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0017] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0018] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this technology based on the specific circumstances.

[0019] In the description of this application, spatial relation terms such as "below," "under," "below," "below," "above," "over," etc., are used herein to describe the relationship between one element or feature shown in the figures and other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figures is flipped, an element or feature described as "below" or "under" or "below" of other elements or features will be oriented "above" other elements or features. Therefore, the exemplary terms "below" and "under" can include both upper and lower orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein are interpreted accordingly.

[0020] In the description of this application, the term "for example" is used to mean "used as an example, illustration, or description." Any embodiment described as "for example" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to implement and use the present invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the present invention can be implemented without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of the present invention with unnecessary detail. Therefore, the present invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0021] Example 1 like Figures 1 to 4 As shown, this embodiment provides an integrated miniaturized air-cooled electronic chassis, including a chassis 1, a rear cover assembly 2, a front cover assembly 3, a circuit module 4, a fan assembly 7, and an electromagnetic shielding strip 5. The chassis 1 has a cubic structure with openings at both the front and rear ends. The front cover assembly 3 and the rear cover assembly 2 are detachably bolted to the front and rear openings, respectively, and electromagnetic shielding strips 5 are provided in the installation gaps between the chassis 1 and the front and rear cover assemblies 3 and 2. The circuit module 4 is installed inside the chassis 1. Heat dissipation fins 16 are installed at the top and bottom of the chassis 1, and an air inlet 19 is provided at the rear of the chassis 1 corresponding to the heat dissipation fins 16. Air outlets 33 are provided at the top and bottom of the front cover assembly 3 corresponding to the heat dissipation fins 16. The fan assembly 7 is installed on the rear cover assembly 2. Specifically: The enclosure 1 is composed of an upper slot plate 11, a lower slot plate 12, a left side plate 13, a right side plate 14, and a central upright plate 15. It has a simple structure, is easy to process and manufacture, and has openings at the front and rear, which facilitates the installation and maintenance of the internal circuit module 4.

[0022] In this embodiment, both the upper slot plate 11 and the lower slot plate 12 have a first groove on their outer sides for mounting the heat dissipation fins 16. This first groove ensures a more stable connection between the heat dissipation fins 16 and the chassis 1, facilitating heat conduction. The inner surfaces of both the upper slot plate 11 and the lower slot plate 12 have a second groove for mounting the circuit module 4. This second groove better secures the circuit module 4 between the upper slot plate 11 and the lower slot plate 12, preventing it from moving within the chassis. It also ensures a tighter contact between the circuit module 4 and the slot plate, improving heat dissipation and electrical connection stability. Furthermore, it facilitates the insertion and removal of the circuit module 4, and allows the chassis 1 to accommodate standard 3U, 6U, or other sizes of circuit modules 4. Both the upper slot plate 11 and the lower slot plate 12 have air inlets 19 at their rear ends, allowing air to directly enter the chassis and exchange heat with the heat dissipation fins 16, improving heat dissipation efficiency. The upper slot plate 11 and the lower slot plate 12 are respectively fixedly connected to the top cover plate 17 and the bottom cover plate 18. The two can protect the heat dissipation fins and the internal structure of the chassis and prevent foreign objects from entering. They can also form an air duct together with the heat dissipation fins.

[0023] In this embodiment, both the left side panel 13 and the right side panel 14 are provided with a large number of heat dissipation slots, which further increases the heat dissipation area of ​​the chassis and helps the heat inside the chassis to be dissipated to the external environment through the side panels, assisting in air cooling and improving the overall heat dissipation effect.

[0024] In this embodiment, the heat dissipation fin 16 is a curved heat dissipation fin with a large number of bending and curved surface features, which greatly increases the heat dissipation area.

[0025] The front cover assembly 3 includes a front panel 31 and a handle 32. Air vents 33 are provided at both the top and bottom of the front panel 31. The size and position of the air vents 33 are consistent with the size and position of the heat dissipation fins 16 on the chassis 1, ensuring that all air passing through the heat dissipation fins 16 exits directly from the front panel 31, maximizing ventilation efficiency. The surface of the front panel 31 is provided with bosses and threaded holes for mounting the handle 32, facilitating the handling and movement of the chassis and improving ease of use. The surface of the front panel 31 also has external mechanical mounting interfaces, allowing for convenient mechanical connection of the chassis to other equipment or components, meeting different installation and usage requirements and enhancing the chassis's versatility.

[0026] The rear cover assembly 2 includes a rear panel 21 and connectors 22. The rear panel 21 has air inlet holes and mounting holes on its surface. The connectors 22 are fixedly mounted on the rear panel 21 through the mounting holes, facilitating electrical connection between the internal circuit module 4 and external circuits, enabling information exchange with other devices. The air inlet holes can cooperate with the fan assembly 7 to provide a cold air inlet to the chassis, forming an important part of the air-cooled heat dissipation duct and ensuring the airflow required for heat dissipation.

[0027] The fan assembly 7 includes a fan 71, a duct cover 72, a fan shroud 73, and a shielding mesh 74. The duct cover 72 is fixedly installed on the rear panel 21 through mounting holes. The surface of the duct cover 72 is designed with bosses and threaded holes for fixing the fan 71 and the fan shroud 73. The fan 71 is connected to the air inlet hole on the rear panel 21. A fan shroud is fixedly installed on the outside of the fan 71, and a shielding mesh 74 is fixed at the opening at the rear of the fan shroud. Electromagnetic shielding strips 5 are installed at the joints between the duct cover 72 and the rear panel 21 and the fan shroud. The airflow generated by the fan 71 can smoothly enter the chassis through the air inlet vents, providing the necessary airflow for heat dissipation of the circuit module 4 inside the electronic chassis. The fan cover and shielding mesh 74 can protect the fan 71, preventing debris from entering the fan 71 and the chassis, affecting the normal operation of the fan 71 and the operation of the circuit module 4 inside the chassis, and providing a relatively enclosed working environment for the fan 71. At the same time, the fan cover can also guide the airflow, making the airflow more concentrated into the chassis. The electromagnetic shielding strip 5 can further enhance the electromagnetic shielding performance of the chassis and reduce the electromagnetic interference generated by the fan 71 during operation.

[0028] The working principle of the above structure: During installation, the upper slot plate 11, lower slot plate 12, left side plate 13, right side plate 14, and upright plate 15 are welded together to form the main body of the enclosure 1. The heat dissipation fins 16 are fixed to the first grooves of the upper slot plate 11 and lower slot plate 12 by vacuum brazing. The top cover plate 17 is welded and fixed to the upper slot plate 11, and the bottom cover plate 18 is welded and fixed to the lower slot plate 12. Then, the circuit module 4 is vertically installed in the second grooves of the upper slot plate 11 and lower slot plate 12, with the surface of the circuit module 4, which generates more heat, attached to the upright plate 15. The fan 71 and fan cover 73 are then installed on the rear panel 21 through the air duct cover 72. The front panel 31 and rear panel 21 are respectively installed on the front and rear openings of the enclosure 1 with bolts. Electromagnetic shielding strips 5 are installed at the joints between the enclosure 1 and the front panel 31, the enclosure 1 and the rear panel 21, the rear panel 21 and the air duct cover 72, and the air duct cover 72 and the fan cover 73.

[0029] During operation, the heat from circuit module 4 is conducted to heat dissipation fins 16 through the upper slot plate 11, lower slot plate 12, and vertical plate 15. Simultaneously, fan 71, acting as an airflow power source, provides the necessary airflow for cooling circuit module 4. Fan 71 blows air into the upper slot plate 11 and lower slot plate 12 through air inlet 19. The airflow passes through the ventilation and heat dissipation channels formed by the slot plates (upper slot plate 11, lower slot plate 12), heat dissipation fins 16, and cover plates (top cover plate 17, bottom cover plate 18), and conducts the heat out through air outlet 33, thus completing the cooling of the chassis. Meanwhile, the electromagnetic shielding strip 5 completely shields the chassis from external electromagnetic interference, ensuring that circuit module 4 inside the chassis can operate normally in complex electromagnetic environments.

[0030] Example 2 It is basically the same as Example 1, except that: Guide rails 6 are installed on both sides of the enclosure 1 (i.e., the outer surfaces of the left side panel 13 and the right side panel 14), allowing the electronic enclosure to move back and forth. This design facilitates the installation, disassembly, and maintenance of the enclosure on the racks or other equipment of the upper-level system, improving the convenience and flexibility of enclosure installation, while also making the enclosure more stable after installation.

[0031] While embodiments or examples of this disclosure have been described with reference to the accompanying drawings, it should be understood that the above embodiments are merely exemplary embodiments or examples, and the scope of this utility model is not limited by these embodiments or examples, but only by the granted claims and their equivalents. Various elements in the embodiments or examples may be omitted or replaced by their equivalents. Furthermore, the steps may be performed in a different order than that described in this disclosure. Further, various elements in the embodiments or examples may be combined in various ways. Importantly, as the technology evolves, many elements described herein can be replaced by equivalents that appear after this disclosure.

Claims

1. An integrated miniaturized air-cooled electronic chassis, characterized in that, Including the enclosure; The box body is a cubic structure with openings at both the front and rear ends. A front cover assembly and a rear cover assembly are respectively installed on the front and rear opening surfaces, and electromagnetic shielding strips are provided in the installation gaps between the box body and the front and rear cover assemblies. The box is equipped with a circuit module, curved heat dissipation fins on the top and bottom, and an air inlet at the rear corresponding to the heat dissipation fins. The front cover assembly has air vents at the top and bottom positions corresponding to the heat dissipation fins. A fan assembly is mounted on the rear cover assembly.

2. The integrated miniaturized air-cooled heat dissipation electronic chassis according to claim 1, characterized in that, The enclosure is welded together from an upper slot plate, a lower slot plate, a left side plate, a right side plate, and a central upright plate. The circuit module is installed between the upper slot plate and the lower slot plate. The outer sides of both the upper and lower slot plates are provided with a first groove for installing heat dissipation fins, and the rear ends are provided with air inlets.

3. The integrated miniaturized air-cooled heat dissipation electronic chassis according to claim 2, characterized in that, Both the upper and lower slot plates have a second groove on their inner surfaces for mounting circuit modules.

4. The integrated miniaturized air-cooled heat dissipation electronic chassis according to claim 2, characterized in that, The upper slot plate and the lower slot plate are respectively fixedly connected to the outside of the top cover plate and the bottom cover plate.

5. The integrated miniaturized air-cooled heat dissipation electronic chassis according to claim 2, characterized in that, Both the left and right side panels are provided with heat dissipation grooves.

6. The integrated miniaturized air-cooled heat dissipation electronic chassis according to claim 2, characterized in that, Guide rails are installed on the outer surfaces of both the left and right side plates.

7. The integrated miniaturized air-cooled heat dissipation electronic chassis according to claim 1, characterized in that, The front cover assembly includes a front panel, on which a handle is fixedly mounted, and on the surface of the front panel are external mechanical mounting interfaces.

8. The integrated miniaturized air-cooled heat dissipation electronic chassis according to claim 1, characterized in that, The rear cover assembly includes a rear panel, on which connectors and air inlet holes are provided.

9. The integrated miniaturized air-cooled heat dissipation electronic chassis according to claim 1, characterized in that, The fan assembly includes a fan, which is fixedly installed on the rear panel via a duct cover and connected to an air inlet. A fan cover is fixed on the outside of the fan on the duct cover, and a shielding mesh is fixed at the opening at the rear of the fan cover. Electromagnetic shielding strips are installed at the joints between the duct cover, the rear panel, and the fan cover.

Images