Carrier tape with electronic components and method for its production

Abstract

The invention relates to a carrier tape (1) with at least one strip-shaped layer (2) made of a flat material, with electronic components (12) arranged next to one another in the longitudinal direction (4) of the carrier tape (1). One embodiment of the carrier tape (1) has two strip-shaped layers (2) made of a flat material, such as paper, arranged one above the other, extending in the longitudinal direction (4) of the carrier tape (1). One of the two layers (2) arranged one above the other has a smaller width (6) than the other of the two layers (2) arranged one above the other. The electronic components (12) are arranged in particular between the two layers (2) and protrude below one layer (2). The invention further relates to a method for producing a carrier tape (1) with electronic components (12), comprising: arranging the electronic components (12) lying next to one another in the longitudinal direction (4) on at least one layer (2).One embodiment of the method comprises: superimposing two layers (2) of a sheet-like material, wherein one layer (2a) has a smaller width (6) transversely to the longitudinal direction (4) than the other layer (2b); arranging the electronic components (12) between the two layers (2), wherein a portion (58) of the electronic components (12) protrudes below the layer (2a) of smaller width (6b).

Description

[0001] The present invention relates to a carrier tape with electronic components having at least one strip-shaped layer of a planar material extending in the longitudinal direction of the carrier tape, and to a method for manufacturing a carrier tape with electronic components.

[0002] Small electronic components and parts, such as contacts, are increasingly being mass-produced and installed. Having multiple components available on a single production line is therefore advantageous and is conventionally achieved through reels or blister packs. Reels typically use copper, but this results in higher material costs. Blister packs or trays generate plastic waste. They also require significant space, are comparatively expensive to produce, and are often more complex to automate.

[0003] The invention is therefore based on the objective of providing a carrier tape that is cost-effective and easy to produce.

[0004] The present invention solves this problem by means of a carrier tape with electronic components having at least one strip-shaped layer extending in the longitudinal direction of the carrier tape made of a planar material, wherein the electronic components are arranged side by side in the longitudinal direction of the carrier tape on the at least one layer.

[0005] The invention further solves this problem by a method for producing such a carrier tape with electronic components. The method comprises arranging the electronic components longitudinally side by side on at least one layer.

[0006] This solution allows for good adaptability, as carrier tapes made of flat material can be easily printed, embossed or manufactured in various shapes and sizes; consequently, the solution also allows for versatile use and easy reusability, which contributes to the reduction of waste and environmental pollution.

[0007] The invention can be further improved by the following embodiments, each of which is advantageous in itself and can be combined in any way. The following features can each be used to further develop a device as well as the method, regardless of whether a feature is described in connection with a method or a device. For example, a device can be configured to perform a method step, and a method can perform the function of a device feature.

[0008] Preferably, the carrier strip can have a second, strip-shaped layer made of a planar material extending in the longitudinal direction of the carrier strip, which is arranged over the other strip-shaped layer.

[0009] One of the two stacked layers can have a narrower width perpendicular to the longitudinal direction than the other. The electronic components can be arranged side by side between the two layers along the longitudinal direction of the carrier strip, with a portion of the electronic components protruding from beneath one of the layers.

[0010] A planar material refers to a material that forms a wider surface and is flattened, such as paper, plastic, metal products, textile products or other fibrous materials.

[0011] In the embodiment of the carrier tape with two layers, the layers preferably consist of the same material or sheet material. Preferably, the material is paper. In other words, the sheet material used to manufacture the carrier tape, or at least one layer of the carrier tape, can be paper. Paper is defined as a sheet material consisting primarily of plant fibers and is classified as paper, cardboard, or paperboard depending on its density or thickness. The appropriate material can be selected depending on the need for greater flexibility and / or greater stability. Due to the thin nature of the carrier tape, it can be wound onto a reel and used as a reel. A core, for example, a cardboard tube, can be used in the center to wind the carrier tape around this core.This type of coiling allows for compact and space-saving storage as well as efficient transport of the electronic components. The electronic components can lie side by side, particularly along the length of the carrier strip.

[0012] Alternatively, the carrier tape can be folded transversely to its longitudinal direction at a specific length—for example, but not exclusively, at the midpoint of the tape. This facilitates further processing and transport, thus eliminating the need for additional material. The carrier tape can be folded such that some of the electronic components are directly opposite the other part of the components defined by the fold, meaning that each component rests directly on another component located on the opposite side of the fold. Preferably, the components in a first folded section of the carrier tape lie within a region or space in which the electronic components in a second section of the carrier tape are spaced apart from one another. Preferably, the distance between the components is then chosen to be the same as the width of a component.The distance may depend on the handling or further processing and may need to be adjusted accordingly.

[0013] The at least one layer of the carrier tape preferably rests against a flat side of the electronic component. This at least one layer can have a variable width. Material can be saved by making the width of the at least one layer smaller than the length of the components in the width direction of the carrier tape. In the two-layer embodiment, the two layers of the carrier tape preferably rest against one flat side of the electronic component each, preferably against two opposite flat sides of the thinner or flatter part of the electronic component. This allows the entire carrier tape with the electronic components to be used efficiently and in a space-saving manner. While one layer rests against one side of a component, preferably the flat and / or thin side of the component, the second layer rests against the opposite side of the component.This creates a sandwich arrangement, which better protects the components from damage during transport.

[0014] The components can rest on the wider layer and / or protrude beyond the narrower layer in the direction of the wider layer's overhang. The narrower layer can thus at least partially cover the components to facilitate placement and removal.

[0015] The components are preferably placed in identical orientation on a single layer or, alternatively, between layers. Consistent orientation, requiring minimal correction, simplifies and accelerates further processing of the components and allows for automation. For example, the components can then be picked and processed by pick-and-place machines.

[0016] At least in one area between two adjacent electronic components, the carrier tape or the two layers of the carrier tape can be connected, in particular, the two layers can be bonded together. The two layers can be connected via a connecting element, such as a thread or at least a rivet.

[0017] The two layers can be clinched, glued, hot-stitched and / or riveted together at least in an area located between two adjacent electronic components.

[0018] Clinching describes a process for joining components and / or materials without the use of an additional material. The connection is created by plastic deformation of the two overlapping materials and / or components, enabling a fast and efficient joint. The two layers can be placed on top of each other and deformed by pressure in such a way that the two layers are joined by a form-fit and / or force-fit connection.

[0019] For bonding, adhesive tape or adhesive strips can be used, for example. The two layers of the backing tape can be joined together using double-sided adhesive tape. The two layers of the backing tape can only be bonded together in the open areas between the components. Alternatively, the use of a different adhesive, such as a liquid adhesive, would also be conceivable.

[0020] In another embodiment, the adhesive tape can be applied to the outside of the two layers of the carrier tape. Preferably, the adhesive tape is applied around a common edge, in particular the longitudinal common edge of the two layers, and rests against one flat side of each layer. In this embodiment, the adhesive tape can act as a hinge and allow the two layers of the carrier tape to be opened and closed more easily, for example, to facilitate the positioning or insertion of components between the two layers. In an alternative embodiment, the adhesive tape is applied to at least one short side of the carrier tape to join the two layers together, for example, at the two ends of the carrier tape.

[0021] The layers can be joined together without touching the component, for example by clamping them. The components are advantageously spaced apart for this purpose. At least one rivet is then placed in the open space between two components. Preferably, two rivets are used between two components. After riveting, the rivets can connect the two layers so tightly in the designated open space that the component is sufficiently secured by this clamping, thus preventing accidental dislodging during transport. The layers can be riveted together, for example, using pressure rivets. Other possibilities include using staples in the space between two components, nailing, or fastening with, for example, a stapler.Furthermore, the two layers can be stapled together without staples by hooking the folded edges of the two layers together to hold them together.

[0022] The two layers can also be fixed by hot riveting and joined together in a manner similar to riveting. The layers can have pre-drilled holes or recesses for the rivets and / or plastic inserts. Preferably, the holes or recesses are located between the components to avoid damaging the components themselves.

[0023] The electronic components can be sewn, clinched, glued, hot-stitched, and / or riveted to at least one layer. The plastic insert and / or rivet is either inserted into position by the component itself or by one or more layers through the component. Preferably, the component already has a pre-existing hole for this purpose. In a further embodiment, the components are located between the two layers, and the fastening component extends through both layers and the respective component. Preferably, the holes of the respective layer and the component are aligned.

[0024] When applying adhesive tape, the tape can be chosen to be long enough that sections of the tape are attached to the electronic components, while other sections of the same tape adhere to at least one layer of the backing tape. Preferably, the tape adheres to at least one layer of the backing tape on the two opposite longitudinal sides of a component in the longitudinal direction. The adhesive strip can be a removable adhesive, particularly one that leaves no residue, to avoid altering or damaging the electronic components.

[0025] The adhesive tape can also be applied between a layer of the backing tape and a component. Particularly when using double-sided adhesive tape or a liquid adhesive, this allows both the electrical components to be attached to at least one layer and the layers to be bonded to each other.

[0026] The two layers can additionally or alternatively be sewn together, at least in certain areas. Here too, the backing tape can have pre-made holes or cutouts through which at least one thread can be pulled and / or passed. Advantageously, the thread can also pass through the component or sew the components directly to one layer. For example, existing holes in the components, used and / or required during manufacturing or further processing, can be used for this purpose.

[0027] The two layers can be sewn together in such a way that the components between the layers are also held in place by the thread. This allows the two layers to be pulled closer together by the thread, thus securing the electronic components between them. Another embodiment involves threading the thread into at least one strip-shaped layer on at least two opposite sides of a component, for example, the two long sides, and wrapping the component around it so that it is held in place by the thread, particularly when there are no holes in the component itself that can be used for sewing. In this way, each component can be sewn to at least one layer. For example, several holes can be placed on at least one strip-shaped layer of the carrier tape around the outer contour of the component to attach the component to at least one layer and to thread the thread through on opposite sides of the component.The component can be partially covered and held in place by a thread. The thread then presses the component into position. The degree of fixation can be adjusted during sewing. If the thread is pulled taut during sewing, the components are held more firmly to the backing tape than if the thread is held relatively loosely.

[0028] Preferably, the electronic components are sewn together with at least one layer. A fabric thread, such as a wool thread and / or a synthetic thread, such as a nylon and / or polyester thread, in particular a filament thread, can be used, where filament describes a fiber of practically unlimited length, and the filament thread can therefore be a thread made of continuous material of practically unlimited length, which has high tensile strength and can be antistatic.

[0029] At least one hole can be present in the component itself; preferably, two holes are present in a component to sew the components to the carrier tape. A hole of approximately the same diameter can be added to at least one layer, preferably two layers, at the same level as the holes and recesses of the respective component, to facilitate precise sewing. The holes can be created, for example, by piercing the carrier tape or the at least one layer with the needle during sewing.

[0030] A stitched thread can extend lengthwise along the carrier tape, spanning multiple electronic components. The thread is then stitched along the entire length of the carrier tape to the two layers and / or at least one layer and the electronic components. This allows for the use of a continuous thread. The seam then extends over the electronic components and the spaces between them along the entire length of the carrier tape. Using a continuous thread facilitates the removal of individual components and the subsequent disposal of the carrier tape and thread. In an alternative design, individual shorter threads are used for each component to ensure independence between the individual components, for example, when removing individual components. This prevents one component from being affected by the removal of another.

[0031] At least one layer can have an embossed pattern in which the electronic components are placed. Embossing is the shaping of a physical object with raised areas and / or depressions, and the resulting texture. For example, an embossing process can create two opposing raised areas, the distance between which corresponds to the width of a component along the longitudinal direction of the carrier strip. The raised areas or boundaries extend in the width direction of the carrier strip. Additionally, at least one raised area can have tabs or locking lugs that point towards the component located within the raised areas and partially extend beyond the component within the raised areas.In another embodiment, a further embossing and elevation can be present on the short side of the component, extending in the longitudinal direction of the carrier strip and corresponding approximately to the width of the inserted component in the longitudinal direction, in order to prevent the component from falling out transversely to the longitudinal direction of the carrier strip.

[0032] The embossing can be designed to complement the outer contour of the electronic components. For this purpose, a die or embossing tool can be specifically manufactured and used for embossing the outer contour of an electronic component. For example, this embossing die can be 3D-printed and have the complementary outer contour of the component. Alternatively, the embossing die can have a recess for a component, an identical prototype of the electronic component, or a part with the same outer contour as the component, which can be inserted into it and thus used as an embossing die. In this way, the outer contour of the component can be embossed into the carrier strip, and the component can be inserted and held in place by the resulting shape. This shape is preferably a recess.

[0033] Furthermore, it is possible that the component is held between two or more protrusions or boundaries created by embossing the component's outer contour, and that the two protrusions are sufficiently spaced longitudinally to accommodate the component. In another embodiment, the embossing die imprints the aforementioned approximately cuboid or linear protrusions—which correspond at least to the component's width in the width direction and are spaced longitudinally at a distance corresponding to the component's width in the length direction—on at least one layer.

[0034] According to a further embodiment, at least one additional electronic component of the plurality of electronic components can be located on the opposite side of the layer. In this way, two components can be directly opposite each other and separated only by the carrier strip or a layer of the carrier strip. However, the components located on opposite sides of the carrier strip can also be arranged offset from one another, so that a component on the other side of the layer is positioned between two components on one side. This is particularly advantageous in combination with the embossing, where the recess on one side of the layer can form the boundary for holding the component on the other side of the layer. In this way, the layer or the carrier strip can be used optimally and in a space-saving manner along its entire length.

[0035] The components can be completely covered by the two layers of the backing tape. Alternatively, the components can be covered by an adhesive strip on one side and a layer of the backing tape on the other.

[0036] The two layers can be separate parts which, as described above, are joined together by various methods such as clinching, sewing, riveting, gluing, or hot-stitching. One of the longitudinal edges of one layer can then align with one of the longitudinal edges of the other layer. The two longitudinal edges of the two layers then lie on top of each other. Advantageously, the two layers terminate at a common plane that extends parallel to the longitudinal direction and is perpendicular to the width direction of the carrier strip, and the edges preferably lie in the same plane. This has the advantage of simplified manufacturing and alignment of the electronic components to ensure identical or similar alignment.

[0037] Similarly, one of the two layers can be formed by a fold—or equivalently, a doubling—of the carrier tape. In this embodiment, the two folded layers are monolithically connected, particularly via a fold. The fold can be created by means of a fold, and the two layers can be connected to each other. In another embodiment, the fold can form a positive connection between the two layers. The fold eliminates the need for additional fastening methods and materials.

[0038] The process for manufacturing the carrier tape can include the following steps: laying two layers of a planar material on top of each other, wherein one of the two layers has a narrower width perpendicular to the longitudinal direction than the other layer; arranging the electronic components side by side in the longitudinal direction between the two layers, wherein a section of the electronic components protrudes from under the narrower layer.

[0039] The process step of arranging the electronic components between the two layers includes inserting the electronic components between the two layers or placing the two layers on top of each other with the electronic components in between.

[0040] Furthermore, the method can include: connecting the electronic components with at least one layer. In one embodiment, the method includes connecting the two layers together.

[0041] Furthermore, the process, particularly when designing the carrier tape with two layers, can include the combined process step of joining the two layers to each other and the electronic components to at least one layer. In particular, the two layers can be joined in the area where they are arranged one above the other, for example, additionally or instead of folding.

[0042] The process step of connecting the electronic components with at least one layer and / or the two layers together comprises at least one of the following process steps: Sewing the two layers together; Sewing the electronic components together with at least one layer; Bonding the two layers together; Bonding of the electronic components with at least one layer; Riveting the two layers together; Riveting the electronic component with at least one layer; Hot-welding the two layers together; Hot riveting of the electronic components with at least one layer; Clinching of the two layers together; Clinching the electronic component with at least one layer.

[0043] The process step of layering the two layers can be created by folding a starting strip. One layer can then form a fold. During folding, the two layers are joined at one edge. Layering the two layers involves placing two separate layers on top of each other, which can then be clinched, riveted, glued, or sewn together.

[0044] The invention is described below by way of example with reference to the drawings. In the drawings, the same reference numerals are always used for elements that correspond to each other with respect to function and / or structure. According to the above description, a feature of the exemplary embodiment can be omitted if the technical effect associated with this feature is not important in a particular application. Conversely, according to the above description, a feature not yet present in the exemplary embodiment can also be added if the technical effect of the feature to be added is important in a particular application.

[0045] They show Fig. 1. A representation of a design of the carrier tape; Fig. 2 a representation of a design of the carrier tape with electronic components and individual threads; Fig. 3. A representation of a design of the carrier tape with electronic components and threads; Fig. 4 a side view of a design of the carrier tape with electronic components; Fig. 5 a schematic representation of a design of the carrier tape with electronic components with a continuous thread; Fig. 6. A representation of a design of the carrier tape with electronic components using an adhesive tape; Fig. 7 a side view of a design of the carrier tape with electronic components using an adhesive tape; Fig. 8 a representation of a design of the carrier tape with electronic components with rivets; Fig. 9 a representation of a design with hot riveting of the carrier strip with electronic components; Fig. 10 a representation of a design of the carrier tape with only one layer; Fig. 11 a representation of a design of the carrier band with embossing; Fig. 12 a schematic view of the inside of the embossing; Fig. 13 a schematic view of the outside of the embossing; Fig. 14 a top view of the embossing; and Fig. 15 a representation of a design of the rolled-up carrier tape.

[0046] The carrier band 1 indicates in Fig. 1 Two strip-shaped layers 2 are formed, extending in the longitudinal direction 4 of the carrier strip 1 and lying one on top of the other. The width 6a of layer 2a, that is, the dimension of layer 2 perpendicular to the longitudinal direction 4, is less than the width 6b of the other layer 2b.

[0047] The carrier strip 1 can consist of a sheet material, such as paper. Thus, the carrier strip 1 can be made of paper, cardboard, or carton of varying thicknesses. Alternatively, the carrier strip 1 can be made of, for example, plastic, metal products, textile products, or other fibrous materials. Preferably, the two layers 2 consist of the same material. In an alternative embodiment, the two layers 2 consist of different materials. In the exemplary embodiment in Fig. 1 The carrier tape 1 is designed such that one layer - or also, fold or doubling - 2a is folded over the other layer 2b.

[0048] In one embodiment, the carrier strip 1 consists of only one layer 2 made of a planar material, which in Fig. Figure 10 is shown and described in more detail below. The following explanations and the associated advantages for the design of the carrier tape 1 with two layers 2 apply – where applicable – equally to a carrier tape with only one layer 2.

[0049] The carrier strip 1 has a material thickness of 8, the dimensions of which are significantly smaller than the length 10 and also significantly smaller than the width 6 of the carrier strip 1. The material thickness 8 can be variably adapted for different applications and, for example, chosen to be thicker for greater stability.

[0050] The carrier strip 1 can have a specific length 10 and be long enough to accommodate several components 12 ( Fig. 2) can be arranged side by side. The length 10 can also be selected such that the entire carrier tape 1, including the electronic components 12, can be rolled up, as also in Fig. 14 is shown.

[0051] In the example shown in Fig. 1. At least one layer 2 has holes or recesses 14 through which, for example, the two layers 2 can be connected to each other. The holes 14 can also be used for fastening the electrical components 12.

[0052] The holes 14 can be spaced apart from each other, preferably they are spaced apart by a distance 16 which is approximately the width 18 ( Fig. 2) of a component 12. In the width direction 20, the carrier strip 1 can also have holes 14. In this illustration, the carrier strip 1 has at least two holes 14 on a line parallel to the width direction 20, spaced apart from each other by a distance 22. The distance 22 can correspond to an existing hole pattern on the component 12 or at least at the level of a part of the component 12, preferably a flatter part 24 ( Fig. 2) of component 12 and, for example, have a distance 22a between them. In longitudinal direction 4, several such pairs of holes 26 can be arranged next to each other and each be spaced apart from the other by a distance 16, which corresponds to the width 18 of a component 12. A smaller distance 16a can be chosen between two components 12 to save space or to fully utilize the space on the carrier strip 1.

[0053] Fig. Figure 2 shows an embodiment of the carrier strip 1 with several electronic components 12 arranged side by side, wherein the electronic components 12 all have the same alignment 28 and orientation, and the longitudinal side 30 of a component 12 is approximately parallel to the width direction 20 of the carrier strip 1. One layer 2b of the carrier strip 1 is preferably as wide as, or slightly wider than, the length 32 of the electronic component 12 extending in the width direction 20. The other layer 2a is preferably folded over the flat side 34 of the electronic component 12 and can be folded as shown in Figure 2. Fig. 2 shows abutment 36 of the electronic component 12, which may have a greater thickness 38a than the thickness 38b of the flat part 24 over which layer 2a is folded and which layer 2a covers. In this way, the carrier strip 1 can be kept as flat as possible in the dimension perpendicular to the longitudinal direction 4. Since the components 12 project over layer 2a with a smaller width 6a, the components can be more easily removed or placed between the layers 2.

[0054] In this embodiment, the electronic components 12 are each attached to the two layers 2 by two short threads 40. Each electronic component 12 can have two opposing tabs 42. The two tabs 42 can project in the longitudinal direction 4 of the carrier tape 1 from the two longitudinal sides 30 of the electronic component 12. A pair of holes 26 can be located on the end faces 44 of a tab 42 that point in the width direction 20. A thread 40 can be passed through these holes, sewing the upper layer 2a to the lower layer 2b, thus advantageously securing the component 12 to the respective tab 42. Preferably, the two layers 2 have identical pairs of holes 26 to facilitate sewing. Of course, components 12 without tabs 42 or projections can also be sewn.

[0055] In Fig. Figure 3 shows an embodiment of the carrier tape 1 with several electronic components 12, wherein the electronic components 12 are fixed with several individual threads 40. In the illustrated example, each thread 40 passes through both the layers 2 and the component 12 itself. For this purpose, the component 12 can have holes 46 ( Fig. 5) possess. This reduces the number of threads needed.

[0056] Between the components 12, the carrier strip 1 can have further holes 14 for fixing the two layers 2 together. Preferably, the holes 14 as well as the pair of holes 26 ( Fig. 1) Arranged parallel to the width direction 20 on a line 48, they have a distance 22b between them, which can be smaller than the distance 22a between the pair of holes 26. The distance 22, 22b can be variable and adapted to the respective connection method. Thus, the distance 22b can also be equal to the distance 22a. The diameter 50 of the hole 14 can also be varied depending on the connection method.

[0057] The electronic components 12 can advantageously be placed between the two layers 2, so that the holes 46 of the component 12 are directly below the holes 14 of the carrier strip 1.

[0058] This ensures that the orientation 28 of the components 12 is the same or similar for all components 12.

[0059] In this embodiment, the thread 40 is threaded into the hole 14, which is closer to the fold or crease 52 of the carrier tape 1, and, for example, on the underside 54 ( Fig. 4) through the hole 14 of the pair of holes 26, which is furthest from the fold 52. On one side, for example the top 56, both ends of the thread 40 can be tied together, thus attaching the component 12 to the two layers 2. Similarly, the thread 40 can be knotted on the underside 54 of the carrier strip 1, for example, to secure the component 12. This process can then be carried out individually for each component 12 on the carrier strip 1.

[0060] In Fig. Figure 4 shows a side view of a further embodiment of the carrier strip 1 with at least one electronic component 12. In this illustration, the carrier strip 1 has a fold 52 with layers 2 that abut the component 12. The electronic component 12 can, in particular, have a thinner or flatter part 24 against which the carrier strip 1 conforms, or against which the two layers 2 of the carrier strip 1 conform at their respective flat sides 34. The flatter part 24 is particularly well covered. The remaining part 58, which can be seamlessly abutted the flatter part 24 in the width direction 20, is, in this example, thicker and only abuts a layer 2 on one side 34a.

[0061] The width 6b of layer 2b can be slightly longer than the length 32 of component 12. In this configuration, layer 2a is not directly adjacent to the shoulder 36 of component 12 and is spaced away from the shoulder 36.

[0062] The thread 40 can pass through the flatter part 24 of component 12 as well as through the two layers 2 to connect carrier tape 1 and component 2.

[0063] In Fig. Figure 5 shows an alternative stitching arrangement. In this example as well, the electronic components 12 lie side by side on layer 2b, while the other layer 2a rests on the opposite flat side 34 of component 12 and partially covers component 12 (the covered part of component 12 is shown here with a dashed line). As shown here, the electronic components 12 can have holes 46 that are congruent with holes 14 in at least one layer 2; for example, the holes 46 of component 12 lie directly below the holes 14 of layer 2a with the smaller width 6a.

[0064] Advantageously, the other layer 2b can also have congruent holes 14 below the holes 46 of the component 12. A continuous thread 40 can then be threaded through these holes 14, extending longitudinally 4 along the entire carrier strip 1 and spanning several components 12 and the spaces 60 between them. This allows the electronic components 12 to be attached to the carrier strip 1 with only one thread 40, saving material and simplifying the separation of the carrier strip 1 and the thread 40.

[0065] In Fig. Figure 6 shows an embodiment of the carrier tape 1 with an adhesive strip 62. In the illustrated example, the carrier tape 1 has a region or space 60 in which two electronic components 12 are spaced apart from each other. The adhesive strip 62 can extend longitudinally 4 from one end 64a of the carrier tape 1 to the other end 64b of the carrier tape 1. In a further embodiment, the adhesive strip 62 can bond one layer 2 to the other layer 2, particularly in the region 60. The adhesive tape 62 can be double-sided for this purpose.

[0066] The electronic components 12 can be held to at least one layer 2 of the carrier tape 1 exclusively by the adhesive strip 62. The use of a liquid adhesive or a single-sided adhesive tape 62 is also conceivable. Preferably, the adhesive can be completely and tracelessly removed from the component 12 so as not to negatively affect the quality of the component 12. In the embodiment with only one layer 2, the components 12 can be arranged between the layer 2 and an adhesive strip 62. Alternatively, at least one adhesive strip 62 or adhesive is located between the layer 2 and the at least one component 12 and bonds the at least one component 12 to the layer 2.

[0067] In Fig. Figure 7 shows a side view of an embodiment with the adhesive strip 62, wherein the adhesive strip 62 can be located between the component 12 and the position 2b of the carrier tape 1 with the greater width 6b.

[0068] In this representation, the two layers 2 are not connected to each other. The two edges 66 of the layers 2 can be aligned with each other and, for example, connected by the adhesive strip 62. Advantageously, the two edges 66 extend in the longitudinal direction 4 and can both lie on the same parallel to the longitudinal direction 4. In particular, the edge 66a of layer 2a with the smaller width 6a can lie in the same plane 67 ( Fig. 6) like the edge 66b of position 2b. The plane 67 extends in the longitudinal direction 4 and is perpendicular to the lateral direction 20 of the support strip 1.

[0069] The electronic component 12 can be inserted between the two layers 2 with its flat side 34 facing the carrier strip 1. Advantageously, the electronic component 12 also adheres to at least one of the two layers 2. Alternatively or cumulatively, the two layers 2 are joined to each other by a fold 52 ( Fig. 4) connected and the adhesive strip 62 can primarily serve to fasten the components 12. The adhesive strip 62 can connect both the components 12 and the two layers 2 to each other for increased stability and security, particularly in the configuration with the fold 52 of the carrier strip 1.

[0070] In Fig. Figure 8 shows an embodiment of the carrier strip 1 with electronic components 12, which is riveted together. The two layers 2 can be riveted together. The layers 2 can be riveted together in the area 60 where the two electronic components 12 are spaced apart. For this purpose, for example, staples 68 or press rivets 68 can be used. The staples 68 can be pressed in parallel to the width direction 20, so that only one staple 68 is required. At least two rivets 68 per space 60 can also be used to connect the layers 2 together and to fix the components 12 by clamping them to both longitudinal sides 30 of the component 12.

[0071] In this embodiment, the components 12 are not touched and / or damaged by the rivet 68. Preferably, at least one layer 2 has holes 14 for orientation between two components 12 and / or markings 70 in the form of lines to ensure the correct spacing 72. Other riveting methods include nailing or fastening with, for example, a stapler. Another embodiment can feature a stapleless fastening of the two layers 2 together. In this case, instead of a staple, folded edges and / or parts of the layers 2 are hooked or interwoven to hold the two layers 2 together.

[0072] In a further embodiment, the components 12 can be riveted to the layer 2 and / or attached to the layer 2 with rivets or staples 68. For example, a staple 68, having a length greater than the width 18 of the component 12 in the longitudinal direction 4 of the carrier strip 1, can be placed parallel to the longitudinal direction 4 directly above the component 12 and pressed through the layer 2 to each of two sides of the component 12, preferably opposite each other in the longitudinal direction 4, in order to attach the component 12 to the layer 2.

[0073] Fig. Figure 9 represents an embodiment with hot-stitching of the two layers 2 of the carrier strip 1. Advantageously, the carrier strip 1 has at least one, preferably two, holes 14 in the width direction 20 with a diameter 50 for inserting the plastic inserts 74. Here, too, the layer 2 can have markings 70 to ensure correct positioning of the components 12 before hot-stitching. The two layers 2 can be hot-stitched together by inserting the respective plastic insert 74 into the hole 14 and deforming it in the hole 14 by applying force and heat. The components 12 can remain unaffected by the hot-stitching. Preferably, two plastic inserts 74 are used per area 60. Alternatively, the components 12 can be hot-stitched to the layer 2.

[0074] In a further embodiment, the two layers 2 can be joined to each other without any additional material, for example by clinching. Pressure can then be applied to the two layers 2, for example in the area 60 between the components 12, in order to deform the two layers 2 in this area 60 and, for example, to connect them in a form-fit manner. At least one component 12 can be clinched to at least one layer 2.

[0075] In Fig. Figure 10 shows an embodiment of the carrier strip 1 with only one layer 2. The components 12 are arranged side by side on layer 2 of the carrier strip 1 and attached to layer 2 of the carrier strip 1. The carrier strip 1 can be configured to have a width 6 that corresponds approximately to the length 32 of component 12, which facilitates easier arrangement and manufacture of the carrier strip 1.

[0076] In an alternative embodiment, the carrier strip 1 can have a narrower width 6 than the length 32 of the component 12. For example, the carrier strip 1, in particular layer 2 of the carrier strip 2, can have a width 6 that is just wide enough to ensure secure attachment of the components 12 to layer 2, resulting in a compact carrier strip 1 that saves both material and space.

[0077] The components 12 can be attached to layer 2 with threads 40, analogous to the embodiments already mentioned. Each thread 40 can be guided through at least one hole 14, preferably through a pair of holes 26, in layer 2 and wound around a tab 42 of the component 12. By pulling the thread taut, the component 12 is drawn to layer 2 and fixed there. Alternatively, a thread 40 can be guided both through the component 12, for example through a hole 46 in the component, and through layer 2. Layer 2 does not necessarily have to have a hole 14 from the outset. The at least one hole 14 can, for example, be created by a needle during threading. Alternatively, a longer thread 40, as in the embodiment shown, can be used. Fig. 5, through the carrier tape 1 and the components 12, in order to fix the components 12.

[0078] In Fig. Figure 11 shows position 2 in an embodiment with embossing 76. Position 2 can have at least two projections 78 that extend towards both longitudinal sides 30 of an electronic component 12, preferably with a distance 80 corresponding to the width 18 of the component 12, so that the electronic component 12 fits between these two boundaries 78 and is held in place by them. An advantageous embodiment provides tabs or locking lugs 82 in the embossing 76 to further secure the component 12 inserted therein.

[0079] Furthermore, an additional boundary 78 can be embossed on the end face 84 of component 12 to prevent component 12 from falling out in the width direction 20. After inserting component 12 into the embossing 76, component 12 and layer 2, or, in the case of a two-layer 2 version, component 12 and the two layers 2, can be additionally joined together by clinching, hot welding, sewing, or riveting.

[0080] In Fig. Figure 12 shows an example of the inside of an embossing 76, for example on the underside 54 of the carrier strip 1, which corresponds to the outer contour 86 of the component 12. This allows a component 12 to be inserted into the resulting recess 88. This recess 88 can also advantageously have at least one opening 90, which points away from at least one longitudinal side 30 of the component 12, in order to facilitate, for example, easier removal of the component 12 from the recess 88.

[0081] In Fig. 13 is an embodiment of the inside made of Fig. The opposite side, for example the top 56 of the carrier strip 1, is shown. The two protrusions 78, which on the other, inner side 54 are pockets or recesses 88 for two electronic components 12, can form boundaries 78 for another electronic component 12 on this outer side 56. The at least one recess 90 on the inner side 54 can now serve on this outer side 56 as an additional retaining clip or tab 82 for the electronic component 12.

[0082] In Fig. Figure 14 is a top view of an embodiment of the embossing 76 from Fig. 12 and Fig. Figure 13 illustrates this. Advantageously, the electronic component 12 is located on one side, for example on the top 56, between the protrusions 78 of two electronic components 12 on the other side, correspondingly the bottom 54. In the illustrated example, the indentations 76 or the recesses 88 of the two electronic components 12 on, for example, the bottom 54, serve as a boundary 78 for at least one other component 12 on the other side, the top 56.

[0083] Fig.Figure 15 shows an embodiment of the carrier tape 1 with electronic components 12, which is wound up. This illustration features a core 92, such as a cardboard tube, around which the carrier tape 1 is wound. The components 12 can be attached to one side, for example, the top 56 of the carrier tape 1, by one of the connection methods mentioned above. For example, the components 12 are sewn to the carrier tape 1 with thread 40. The components 12 can be fixed to a single layer 2 of the carrier tape 1 or, alternatively, arranged between two layers 2.

[0084] The carrier strip 1 can then be rolled around the core 92 with the components 12 pointing towards the core 92. The core 92 can have two walls 94 against which the carrier strip 1 can rest on its longer sides. Reference sign 1 carrier strap 2, 2a, 2b Location 4 Longitudinal direction of the carrier belt 6, 6a, 6b Width of the carrier tape 8 Material thickness of the carrier tape 10 Length of the carrier strap 12 components 14 holes / recesses 16, 16a Distance holes in longitudinal direction 18 Width of a component 20. Width direction of the carrier tape 22, 22a, 22b Spacing of holes in the width direction 24 flatter part of the component 26 pairs of holes 28 Alignment of the component 30 Long side of the component 32 Length of the component 34, 34a flat side of the component Section 36 of the component 38, 38a, 38b Thickness of the component 40 threads 42 tab 44, 44a, 44b Front side of the flap 46 holes in the component 48 parallel lines 50 diameter hole 52 Folding the carrier tape 54 Underside of the carrier tape 56 Top side of the carrier strap 58 thicker part of the component 60 Space between two components 62 Adhesive tape, adhesive strips 64, 64a, 64b End of the carrier tape 66, 66a, 66b Edge of the strip-shaped layer 67 Plane perpendicular to the latitude direction 68 staples, rivets 70 Mark 72 Spacing 74 plastic insert 76 minting 78 Survey, limitation 80 Distance 82 Tab, locking tab of the embossing 84 Front face of the component 86 Outer contour component 88 In-depth study 90 recess 92 core 94 Wall

Claims

[1] Carrier tape (1) with electronic components (12), with at least one strip-shaped layer (2) extending in the longitudinal direction (4) of the carrier strip (1) made of a planar material, wherein the electronic components (12) are arranged side by side in the longitudinal direction of the carrier tape (1) on at least one layer (2). [2] Carrier band (1) according to claim 1, with a second strip-shaped layer (2) extending in the longitudinal direction (4) of the carrier strip (1) made of a planar material, which is arranged over the other strip-shaped layer (2), wherein one of the two superimposed layers (2) has a narrower width (6) perpendicular to the longitudinal direction (4) than the other of the two superimposed layers (2), wherein the electronic components (12) are arranged side by side in the longitudinal direction (4) of the carrier strip (1) between the two layers (2), and wherein a section (58) of the electronic components (12) protrudes from under one layer (2). [3] Carrier tape (1) according to claim 1 or 2, wherein the planar material is a paper material. [4] Carrier tape (1) according to claim 2 or 3, wherein the two layers (2) are clinched, glued, hot-stitched and / or riveted together at least in an area (60) located between two adjacent electronic components (12). [5] Carrier tape (1) according to one of claims 2 to 4, wherein the two layers (2) are sewn together at least in areas. [6] Carrier tape (1) according to one of claims 1 to 5, wherein at least one layer (2) has an embossing (76) in which at least one electronic component (12) is located. [7] Carrier tape (1) according to any one of claims 1 to 6, wherein the electronic components (12) are sewn, clinched, glued, hot-stitched and / or riveted to the at least one layer (2). [8] Carrier tape (1) according to one of claims 1 to 7, wherein a sewn thread (40) extends in the longitudinal direction (4) of the carrier tape (12) over several electronic components (12). [9] Carrier tape (1) according to any one of claims 2 to 8, wherein the two layers (2) are separate parts. [10] Carrier tape (1) according to any one of claims 2 to 8, wherein at least one of the two layers (2) is formed by a fold (2a) of a fold (52) of the carrier tape (1). [11] Carrier tape (1) according to any one of claims 2 to 10, wherein the two layers (2) are connected to each other by means of a fold (52). [12] Method for manufacturing a carrier tape (1) with electronic components (12), comprising: - Arranging the electronic components (12) in a longitudinal direction (4) lying next to each other on at least one layer (2). [13] The method of claim 12, further comprising: - Laying two layers (2) of a planar material on top of each other, wherein one of the two layers (2a) has a smaller width (6) perpendicular to the longitudinal direction (4) than the other layer (2b); - Arranging the electronic components (12) longitudinally (4) side by side between the two layers (2), wherein a section (58) of the electronic components (12) protrudes below the layer (2a) of smaller width (6b). [14] Method according to one of claims 12 or 13, further comprising: - Connecting the electronic components (12) with at least one layer (2). [15] Method according to claim 14, wherein the method step of connecting the electronic components (12) with at least one layer (2) comprises at least one of the following method steps: - Sewing the two layers (2) together; - Sewing the electronic components (12) together with at least one layer (2); - Bonding the two layers (2) together; - Bonding the electronic components (12) with at least one layer (2); - Riveting the two layers (2) together; - Riveting the electronic components (12) with at least one layer (2); - Hot-stitching the two layers (2) together; - Hot riveting of the electronic components (12) with at least one layer (2); - Clinching of the two layers (2) together; - Clinching the electronic components (12) with at least one layer (2).

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