DEVICE AND METHOD FOR PRODUCEING A LAYER OF MATERIAL PROVIDED IN A FLOWABLE STATE ON AN OPTOELECTRONIC LIGHTING DEVICE

Abstract

Device for producing a layer of a material (55) provided in a flowable state on an optoelectronic lighting device (31), comprising: a, in particular plate-like, limiting device (51), a holding device (63) for holding the limiting device (51) at a certain distance (A) above the lighting device (31) for forming the layer between the limiting device (51) and the lighting device (31), and a limiting element (23) with a bottom surface (25) and at least one lateral surface (27), wherein the limiting element (23) is designed and can be temporarily arranged on a carrier top surface (35) of the lighting device (31),that the underside (25) of the limiting element (23) contacts a first area (47) of the carrier top (35) and the lateral surface (27) and / or an edge (61) between the underside (25) and the lateral surface (27) delimits the first area (47) from a second area (49) of the carrier top (35) adjacent to the first area (47), wherein an underside (67) of the limiting device (51), which faces the lighting device (31), when the limiting device (51) is arranged at a distance above the lighting device (31), has at least in one area of ​​its underside (67) a structuring (69) to form a structure (71) complementary to the structuring (69) on the top (75) of the layer to be produced from the flowable material (55), wherein the holding device (63) has at least one rigid spacer,wherein the spacer is arranged on the limiting device (51) and an end of the spacer located away from the limiting device (51) can be brought into contact with the lighting device (31), and wherein the limiting element (23) is at least partially made of a deformable and / or elastic material.

Description

The present invention relates to a device and to a method for producing a layer of a material provided in a flowable state on an optoelectronic lighting device.In the case of optoelectronic lighting devices, it can be provided that a material provided in the flowable state is applied, in particular for forming a layer, to at least one specific region of a surface of the optoelectronic lighting device.The present invention is therefore based on the object of creating a possibility with which a layer of a material provided in the flowable state can be formed in a simple manner on a surface of an optoelectronic lighting device.The object is achieved by a device having the features of claim 1. Preferred embodiments and developments of the invention are specified in the dependent claims.An apparatus according to the invention for producing a layer of a material provided in a flowable state on an optoelectronic lighting device comprises a, in particular plate-like, delimiting device, and a holding device for holding the delimiting device at a specific distance above the lighting device for forming the layer between the delimiting device and the lighting device.The layer to be produced can be formed in the spatial region between a surface of the lighting device and the delimiting device arranged above it, from flowable material, such as silicone or epoxy resin, which is brought into the spatial region from above. The delimiting device can be removed again after the material has cured. It is also possible to perform a pre-curing, for example for shape stabilization, using the limiting device, while the curing can take place without the limiting device.Since the delimiting device can be arranged at a fixed distance from the surface of the lighting device, a precisely defined layer thickness results, at least in regions. Structures on the upper side of the layer can also be realized, as will be explained below. The limiting device is preferably designed in the manner of a plate. It can be regarded as a type of upper base plate, on the underside of which, for example, a delimiting element can also be arranged, which forms a wall and can be used as a lateral delimitation for the layer to be formed.A point contact between the delimiting device and the lighting device or the carrier top side can also be realized by means of the holding device.As mentioned, the layer formed can have, at least in one region, a defined height or thickness which corresponds to the distance of the delimiting device from the surface of the lighting device if the device is arranged above the lighting device as intended for producing the layer. Thus, for example, a certain potting height for the originally flowable material can be achieved by means of the device according to the invention. The device according to the invention can be used in particular to realize layers over optoelectronic semiconductor components of the lighting device which have a specific thickness or have a specific structure on their upper side. Such a layer can positively influence the emission properties of the semiconductor components, for example in relation to the color locus distribution. If the layer is formed over the emission surface of an optoelectronic semiconductor component, for example, its height can be determined relatively accurately. As a result, for example, a relatively narrow color locus distribution can be ensured in the production of white LEDs.The delimiting device can have at least one opening which runs through from its upper side to its lower side, in particular for introducing the material into the spatial region between the delimiting device and the lighting device.The holding device can have at least one spacer. Preferably, the spacer is arranged on the delimiting device and / or an end of the spacer remote from the delimiting device can be brought into contact with the lighting device.An underside of the delimiting device, which faces the lighting device when the delimiting device is arranged at the distance above the lighting device, can have a structuring at least in a region of its underside, in particular for forming a structure complementary to the structuring on the upper side of the layer of the flowable material.An underside and / or another surface side of the delimiting device can have an anti-stick coating. The limiting device can thereby be removed more easily.Preferably, the delimiting device is arranged at the distance above the lighting device, the region of the underside lies above a light-emitting region of an optoelectronic semiconductor component, and the structuring is furthermore formed in such a way that an optical element can be formed in the layer above the light-emitting region. The optical element can be a lens.An underside of the delimiting device, which faces the lighting device when the delimiting device is arranged as intended at the distance above the lighting device, can have a first region, which has a first distance from the upper side of the lighting device, and at least one second region, which has a second distance from the upper side of the lighting device, which differs from the first distance. A layer can thus be formed from the flowable material, which has different heights in different regions. This is advantageous, for example, if potting layers of different thicknesses are to be formed over adjacent optoelectronic semiconductor components, such as LEDs. As a result, for example, different conversion degrees or color locations can be realized with a converter volume potting. For example, adjacent LEDs can be coated with a potting compound in such a way that "cold" white light is emitted above one LED and "warm" white light is emitted above the other LED.In one variant, sedimentation can take place after the volume potting. This can be forced naturally or, for example, in a centrifuge. Due to initially different fill level heights above a chip, different thicknesses of a sedimented phosphorus layer also result. A subsequent grinding process in silicone as a clear component over the settled phosphor can achieve a uniform component thickness over the substrate. A material other than a clear component is also possible, for example epoxy resin.It can be provided that the flowable material does not cover a first region of the lighting device, in particular a carrier top side of the lighting device, and covers a second region of the lighting device adjoining the first region. The delimiting device can be dimensioned such that it at least substantially covers the second region. The entire second region can thus be provided with a layer which can have a defined height or can have different, defined heights in different regions and / or can have a defined structure in a region of its upper side.The device can have a delimiting element with an underside and at least one lateral surface, wherein, in particular for protecting the first region from the flowable material, the delimiting element is designed and can be temporarily arranged on the lighting device, in particular on the carrier upper side, in such a way that the underside of the delimiting element contacts the first region and the lateral surface and / or an edge between the underside and the lateral surface delimits the first region with respect to the second region.The device according to the invention can thus likewise have a delimiting element which can be brought with the underside on the surface of the lighting device, which is in particular the carrier top side. The underside can rest on the surface, and the delimiting device can be dimensioned such that the lateral surface and / or the edge delimits the first region from the second region. The flowable material can then be applied to the second region, wherein the delimiting device prevents the flowable material from reaching the first region from the second region, e.g. due to the effect of the so-called "bleeding", and thus unintentionally wets the first region. After the material has cured, the delimiting device can be removed. The delimiting device can thus serve as a kind of dam, which protects the first region of the surface of the lighting device from the material. However, the "dam" is only temporarily provided, since the delimiting device is removed after curing.The delimiting element can be arranged or arrangeable on the delimiting device, in particular on the lower side thereof. The limiting element can in particular be firmly connected to the limiting device.The edge can have a course which at least approximately corresponds to a boundary line between the first region and the second region. As a result, the first region can be delimited relatively accurately from the second region and, in particular, even slight wetting of the first region can be avoided.The lateral surface of the delimiting element is preferably closed in a circumferential direction, in particular running parallel to the underside. The lateral surface can therefore form a continuous, closed partition wall over its entire circumference.The underside and / or the edge of the delimiting element can be brought into contact over its entire length with the lighting device, in particular its carrier top side. As a result, a flow of the material from the second region to the first region can be prevented along the entire boundary line between the first region and the second region.The underside and / or the edge and / or the lateral surface of the delimiting element can have a coating, in particular to prevent or limit a flow of the material along the delimiting element itself.The lateral surface may include a stop. The stop means at the lateral surface may define a maximum fill height for the material.The delimiting element can be formed at least partially from a deformable and / or elastic material. The limiting element can thereby be pressed onto the surface of the lighting device in an improved manner. This results in an improved seal between the two regions on the surface of the lighting device or the carrier top side.The lateral surface of the delimiting element can extend, in particular in a straight line, at an angle of at least approximately 90 degrees to the underside or extend upwards and outwards away from the underside. The lateral surface can also extend curved, in particular concave or convex, upwards and outwards. Viewed in a plane perpendicular to the underside, the delimiting element can have a rectangular, square or triangular cross section. Other cross-sectional shapes are also possible. The edge between the underside and the lateral surface can be rounded. The shape and the course of the lateral surface are reflected in the shape and in the course of a side surface of the layer formed from the flowable material that forms on the lateral surface.The delimiting element can be designed in the form of a frame-like structure which surrounds an inner region, wherein, preferably, the inner region is dimensioned such that at least one optoelectronic semiconductor component, in particular an LED chip, can be accommodated therein, wherein, furthermore preferably, the lateral surface is the surface side of the frame-like structure facing the inner region or the surface side of the frame-like structure facing away from the inner region. The delimiting device thus allows the formation of a layer of the originally flowable material around the semiconductor component. Depending on the dimensioning of the delimiting device, the layer can have a distance from the semiconductor component or be flush with it.The delimiting element can be designed in particular in the form of a punch, the underside of which has at least approximately the size and / or shape of the first region. The first region on the surface of the lighting device can thus be covered with the delimiting element, so that the environment of the covered first region can be covered with flowable material without the first region being wetted.Temporarily used components, such as in particular the delimiting element or the delimiting device, can have a poorly adhering surface or an anti-adhesion coating. A later demolding can thereby be facilitated.The invention also relates to a method for producing at least one layer on an optoelectronic lighting device, having the steps:providing a carrier on the top side of which at least one optoelectronic semiconductor component, in particular an LED chip, is arranged,temporary placement on the carrier of an apparatus according to one of the preceding claims such that the delimiting device is arranged above the upper side of the carrier at the defined distance, in order to form the layer between the delimiting device and the upper side of the carrier,applying flowable material to the carrier in the space region between the carrier and the delimiting device, andremoving the device after the flowable material is cured.The device can be fixed, in particular tightened, or pressed, onto the carrier.Exemplary embodiments of the invention are explained in more detail below with reference to the attached drawings. They show, in each case schematically, FIGS. 1 to 3 show a respective cross-sectional view of a variant of a temporary delimiting device or of an optoelectronic lighting device, wherein the application of flowable material is illustrated, FIGS. 4 to 6 show a respective cross-sectional view of a further variant of a temporary delimiting device or of an optoelectronic lighting device, wherein the application of flowable material is illustrated, FIGS. 7 to 9 show a respective cross-sectional view of yet another variant of a temporary delimiting device or of an optoelectronic lighting device, wherein the application of flowable material is illustrated, FIGS. 10 to 12 show a respective cross-sectional view of yet another variant of a temporary delimiting device or of an optoelectronic lighting device, wherein the application of flowable material is illustrated, and wherein additionally different variants of a delimiting device are shown, and FIGS. 13 to 15 show a respective cross-sectional view of yet another variant of a temporary delimiting device or an optoelectronic lighting device with a carrier, wherein the application of flowable material is illustrated, and wherein in addition yet another variant of a delimiting device for forming a material layer is shown.The device 21 shown in FIGS. 1 to 3 comprises a delimiting element 23 with a bottom side 25 and at least one lateral surface 27. the delimiting element 23 has an at least approximately rectangular cross section and is preferably formed from a soft, deformable material. In a circumferential direction U running perpendicular to the plane of the drawing, the delimiting element 23 is fully closed. The delimiting element 23 thus forms, as seen along its circumferential direction U, a frame which can be rectangular or square or also annular, for example. The lateral surface 27 is also completely closed, as viewed along the circumferential direction U. The lateral surface 27 therefore forms a wall which surrounds an inner region 29 surrounded by the frame-like delimiting element 23.The limiting device 21 also has an upper, stiff limiting device 51, which is designed in the form of a base plate, on the underside of which the limiting element 23 is arranged. The base plate 51 has at least one opening which is continuous from its upper side to its lower side and via which the inner region 29 is accessible. As a result, at least one flowable material 55, in particular in the form of a layer, can be applied to a plate-like carrier 33 of an optoelectronic lighting device 31.The carrier 33 comprises a substrate 39 and a metallization layer 37, which may be divided into individual partial regions which are electrically separated from one another. The layer 37 can therefore also not be arranged on the entire upper side 35 of the carrier 33, but rather only on a partial region and therefore have, for example, individual contact regions which are separate from one another for the electrical contacting.At least one optoelectronic semiconductor component 41 is also arranged on the top side 35 of the carrier 33, which component can be an LED chip, for example. A light-emitting region is formed on the upper side of the semiconductor component 41, which is covered by an optional, in particular transparent, material layer 43. The semiconductor component 41 can be electrically connected to the metallization layer 37 via at least one bonding wire 45.In the lighting device 31, it is provided that at least one layer of at least one material 55 processed in the flowable state is applied to the upper side 35 of the carrier 33. In this case, the material 55 should not cover a first region 47 on the carrier top side 35 and cover a second region 49 on the carrier surface 35 adjoining the first region 47. The terms "carrier top side" or "carrier surface" are to be understood broadly and are in particular also intended to encompass surface regions of elements or devices which are arranged on the carrier 33. To distinguish the first region 47 from the second region 49, vertically extending dashed lines are drawn in FIG. 1. The boundary line G between the two regions 47, 49 furthermore extends in the plane of the carrier top side 35.The material 55 is processed in the flowable state and is applied in particular to the carrier top side 35. It then cures, for example in a thermal process. For application of the material 55 in the flowable state to the upper side 35 of the carrier 33, the delimiting device 21 is used. This is temporarily arranged on the top side 35 and removed again after curing or precure. For this purpose, the lateral surface 27 can be produced, for example, from a material having poor adhesion or poor wettability.In the delimiting device 21, the underside 23 and / or the lateral surface 25 and / or an optionally rounded edge 61 between the underside 23 and the lateral surface 25 is / are designed and dimensioned such that the delimiting device 21, when the underside 23 rests on the carrier surface 35, delimits the first region 47 with respect to the second region 49. In particular, the edge 61 running between the underside 25 and the lateral surface 27 has a course along the circumferential direction U which corresponds at least approximately to the boundary line G between the first region 47 and the second region 49 when the underside 25 rests on the carrier surface 35. The edge 61 can be brought into contact with the carrier top side 35 over its entire course along the boundary line G. The edge 61 and the lateral surface 27 can thus form a lateral boundary for the material 55 applied to the second region 49 by means of an application device 53, as illustrated in particular in FIG. 2. The application device 53 can act like a type of dispenser which delivers the flowable material 55 via a downwardly directed nozzle, so that the flowable material 55 can be applied to the surface 35 from above (cf. FIG. 2 ).The delimiting device 21 can be arranged temporarily on the carrier surface 35, in a manner comparable to a stamp, or can be pressed onto the carrier surface 35 with a force F indicated in FIG. 2. The delimiting device 21 can therefore also be regarded as a type of stamping tool. The force F can be generated, for example, by the limiting device 21 being tensioned on the carrier surface 35 or being pressed onto the carrier surface 35 by means of a corresponding device.By pressing on the delimiting device 21, the region between the edge 61 and the surface 35 can be particularly well sealed and thus a flow of the material 55 over the boundary line G and onto the first region 47 can be prevented. The sealing effect can be further improved by configuring the delimiting element 23 from a soft, deformable material. Furthermore, a coating can be provided on the lateral surface 27, the underside 25 and / or the edge 61 which brings about a better seal.As FIG. 2 also shows, the material 55 can be filled to a desired level laterally next to the wall formed by the lateral surface 27 of the delimiting element 23. For this purpose, a stop device 57 can be arranged on the lateral surface 27. This can comprise a plurality of stop elements which project from the lateral surface 27 offset with respect to one another at a specific distance from the underside 25 and as seen in the circumferential direction U. Alternatively, the stop device 57 can also be designed as a circumferential collar which projects from the lateral surface 27. The stop device 57 can prevent the material applied by means of the application device 53 from exceeding the height level of the stop device 57 (cf. FIG. 2 ). At least in the region of the lateral surface 27, a maximum fill height for the flowable material 55 can thus be reached or ensured by means of the stop device 57. The stopper 57 may have a surface made of a weakly adhering material. This makes it possible to facilitate the removal of the limiting device 21.After the material 55 has cured, the delimiting device 21 can be removed again, as FIG. 3 shows. It is also possible for the delimiting device 21 to be partially cured, for example for shape stabilization, whereas the material 55 can cure without the delimiting device 21. This results in a distinct delimitation between the uncovered first region 47 and the second region 49 covered with material 55. A flow, also referred to as "bleeding", of the still flowable material 55 into the first region 47 could thus be avoided by the use of the delimitation device 21. A permanently arranged dam, which could possibly also prevent such "bleeding", could be saved.The limiting device 21 described with reference to FIGS. 4 to 6, in contrast to the limiting device of FIGS. 1 and 2, has a continuous base plate 51, and the limiting element 23 has a triangular cross-sectional area. In addition, the lateral surface 27 is located on the outside. In the device 21 according to FIGS. 4 to 6, it is therefore provided that the delimiting element 23, when brought with its underside 25 into contact with the upper side 35 of the carrier 33, covers a first region 47 of the carrier upper side 35 and thus separates it from the adjoining outer, second region 49.Due to the triangular cross-sectional shape of the delimiting element 23, the underside 25 coincides with the edge 61 running around in the circumferential direction U. This is placed on the top side 35 or, as described above, is pressed onto the top side 35 with a force F. This makes it possible to achieve an effective seal and to avoid "bleeding" of the flowable material 55. A coating can further improve the sealing effect.The semiconductor component 41 may be a light-emitting chip having a light exit region on its lateral surface. The chip can be, in particular, an LED designed as a volume emitter.The flowable material 55 can in turn be applied to the second region 49 by means of an application device 53, as shown in FIG. 2. The lateral surface 27 running obliquely upwards and outwards results in a corresponding bevel 59 on the surface side of the layer formed by the material 55 facing the semiconductor component 41 (cf. FIG. 6 ). Due to this chamfer 59, the material 55 has a defined shape of the flank opposite the light exit region. This can bring about improved beam shaping and thus improved coupling-out efficiency. This is illustrated in FIG. 6 by arrows P exemplarily showing the light path of the light emitted from the semiconductor device 41.The delimiting device 21 described with reference to FIGS. 7 to 9 has a delimiting element 23 attached to the base plate 51 which, in contrast to the delimiting elements described above, does not have a frame-like structure but is at least approximately in the form of an ellipsoidal, ball- or egg-shaped structure.The underside 25 of the delimiting element 23 can be applied to the upper side of the material layer 43, as shown in FIG. 8. The underside 25 is dimensioned such that it can at least approximately cover an emission surface of the semiconductor component 41 and thus protect a defined first region 47 on the upper side 35 of the carrier 33 from material applied in a flowable state. Material layers 55 a, 55 bformed over the adjoining second region 49 can thus delimit the edge of the emission surface. Thereby, improved contrast in the light emitted from the semiconductor device 41 can be achieved.The underside 25 with the edge 61 running circumferentially in the direction of rotation U can in turn be pressed onto the first region 47 with a force F, as described above. This makes it possible to achieve an effective seal and to avoid "bleeding" of flowable material onto the first region 47. A coating can further improve the sealing effect.As already mentioned, in the lighting device 31 according to FIGS. 7 to 9, it is provided that two layers 55 a, 55 bmade of different materials, which are applied in a flowable state by means of the device 53, are applied to the second region 49 of the upper side 35. The lateral surface 27 of the delimiting element 23 forms a delimiting wall for the material layers 55 a, 55 bcirculatory in the circumferential direction U of the delimiting element 23. These can be formed as far as this boundary wall. As a result of the shape thereof, as FIG. 9 shows, a type of crater can be formed laterally above the material layer 43 by the material layers 55 a, 55 b, in particular at sufficiently high potting heights. The crater can improve the beam quality of the light emitted from the semiconductor device 41.The delimiting device 21 of FIGS. 7 and 8 can in turn be regarded as a type of stamp which is temporarily arranged for forming the layers 55 a, 55 band for protecting the first region 47 on the upper side of the layer 43. The restriction device 21 is also applicable for use with screen printed layers.FIGS. 10 to 12 show a temporary delimiting device 21 or an optoelectronic lighting device 31, respectively. the device 21 is also suitable for producing at least one defined layer from the material 55 provided in the flowable state. For this purpose, the device 21 has a delimiting device in the form of the delimiting plate 51 and a holding device 63 for holding the delimiting plate 51 at a specific distance A above the upper side 35 of the carrier 33 when the device 21 rests on the upper side 35 as intended. The holding device 63 can be designed in the form of one or more, for example rod-shaped, spacers which are arranged on the delimiting plate 51 and whose end remote from the delimiting plate 51 lies at a distance A below the delimiting plate 51. The holding device 63 is preferably designed to be rigid, so that it can strike the upper side 35 when the device 21 is pressed onto the upper side 35.On the lower side of the limiting plate 51, a limiting element 23 is furthermore arranged, as described above. For the use of the device for producing the at least one layer 55 with a specific height, however, the delimiting element can only be seen as an optional device.The delimiting plate 51 has openings 73 which pass through from its upper side 65 to its lower side 67 and are in particular provided for introducing the material for forming the material layer 55 between the delimiting plate 51 and the carrier upper side 35.As shown in FIG. 11, the device 21 can be brought into contact with the upper side 35 of the carrier 33. FIG. 11 shows two different embodiments of the delimiting plate 51; in the upper part of FIG. 11 (cf. FIG. 11 a), the delimiting plate 51 is formed with a flat top side 65 and with a flat bottom side 67. Thus, from material provided in the flowable state, which is applied via the application device 53 and through one of the openings 73, a layer 55 can be formed, which has a defined height H with respect to the carrier top side 35 or a defined height h 1 with respect to the top side of the semiconductor components 41, which can be LED chips, for example.By using the delimiting plate 51 to produce the layer 55 according to FIG. 11 a, the height h 1 above the semiconductor components 51 is defined, cf. FIG. 12 a. The material layer thickness over the emitting component can thus be adjusted precisely. This can reduce variations in the color locus distribution.In the lower part of FIG. 11 (cf. FIG. 11 b), the delimiting plate 51 is indeed likewise formed with a flat upper side 65. However, the underside 67 has a structuring 69, which is provided for forming a complementary structure 71 on the upper side 75 of the layer 55, as FIG. 12 b shows. In particular, an optical element 77, in particular a lens, can be formed above the light-emitting region of the semiconductor components 41 in each case.As is further illustrated by way of example in FIG. 10, the underside 67 of the delimiting device 51 can also consist of a region with a structuring 69 and of a planar region.In the example described with reference to FIGS. 13 to 15, a device 21 is used in which the underside 67 of the limiting plate 51 is of stepped design. The bottom side 67 therefore has at least a first region 79 which has a first distance h1to the top side of the one semiconductor component 41 and a second region 81 which has a second distance h2to the top side of the adjacent, second semiconductor component 41 when the device 21 is arranged on the carrier surface 35. Thus, as FIGS. 14 and 15 illustrate, a material layer 55 may be formed in which the layer heights h 1, h 2 above the adjacent semiconductor devices 41 are different. This allows different color locations to be realized in the semiconductor components 41. This may be used, for example, to realize multiple color location coordinates in a "package.".

Claims

Device for producing a layer of a material (55) provided in a flowable state on an optoelectronic lighting device (31), comprising: a, in particular plate-like, delimiting device (51), a holding device (63) for holding the delimiting device (51) at a specific distance (A) above the lighting device (31) for forming the layer between the delimiting device (51) and the lighting device (31), and a delimiting element (23) having an underside (25) and at least one lateral surface (27), wherein the delimiting element (23) is formed in this way and can be temporarily arranged in this way on a carrier upper side (35) of the lighting device (31), the underside (25) of the delimiting element (23) contacts a first region (47) of the carrier top side (35) and the lateral surface (27) and / or an edge (61) between the underside (25) and the lateral surface (27) delimits the first region (47) with respect to a second region (49) of the carrier top side (35) adjoining the first region (47), wherein an underside (67) of the delimiting device (51), which underside faces the lighting device (31) when the delimiting device (51) is arranged at the distance above the lighting device (31), has, at least in a region of its underside (67), a structuring (69) for forming a structure (71) complementary to the structuring (69) on the upper side (75) of the layer of the flowable material (55) to be produced, wherein the holding device (63) has at least one rigid spacer, wherein the spacer is arranged on the limiting device (51) and an end of the spacer remote from the limiting device (51) can be brought into contact with the lighting device (31), and wherein the limiting element (23) is at least partially formed from a deformable and / or elastic material.Device according to claim 1, characterised in that the delimiting device (51) has at least one opening (73) which extends through from its upper side (65) to its lower side (67), in particular for introducing the material into the spatial region between the delimiting device (51) and the lighting device (31).Device according to one of the preceding claims, characterized in that, when the delimiting device (51) is arranged above the lighting device (31), the region of the underside (67) lies above a light-emitting region of an optoelectronic semiconductor component (41), and the structuring (69) is formed in such a way that an optical element (77) can be formed in the layer to be produced above the light-emitting region.Device according to one of the preceding claims, characterized in that a bottom side (67) of the delimiting device (51), which faces the lighting device (31) when the delimiting device (51) is arranged above the lighting device (31), has at least one first region which has a first distance (h1) from the top side (35) of the lighting device (31) and has at least one second region which has a second distance (h2) from the top side (35) of the lighting device (31), which is different from the first distance (h1).Device according to one of the preceding claims, characterized in that it is provided that the material (55) does not cover the first region (47) of the lighting device (31), in particular a carrier top side (35) of the lighting device (31), and covers the second region (49) of the lighting device (31) adjoining the first region (47), and that the delimiting device (51) is dimensioned such that it at least substantially covers the second region (49).Device according to one of the preceding claims, characterized in that the delimiting element (23) is arranged or can be arranged on the delimiting device (51), in particular on its underside (67).Device according to one of the preceding claims, characterized in that the edge (61) has a course which corresponds at least approximately to a boundary line (G) between the first region (47) and the second region (49).Device according to one of the preceding claims, characterized in that the lateral surface (27) of the limiting element (23) is closed in a circumferential direction (U) which runs in particular parallel to the underside (25) of the limiting element (23).Device according to one of the preceding claims, characterized in that the underside (25) and / or the edge (61) of the delimiting element (23) can be brought into contact with the lighting device (31), in particular its carrier upper side (35), over its entire length.Device according to one of the preceding claims, characterized in that the underside (25) and / or the edge (61) and / or the lateral surface (27) of the delimiting element (23) has a coating and / or at least one stop device (57), in particular stop lines or stop elements, in particular for preventing or delimiting a flow of the material.Device according to one of the preceding claims, characterized in that the delimiting element (23) is at least partially formed from a poorly wettable material.Device according to one of the preceding claims, characterized in that the lateral surface (27) of the delimiting element (23) runs, in particular in a straight line, at an angle of at least approximately 90 degrees to the underside (25) or away from the underside (25) upwards and outwards.Device according to one of the preceding claims, characterized in that, as seen in a plane perpendicular to the underside (25), the delimiting element (23) has a rectangular, square, triangular, n-cornered or circular cross section.Device according to one of the preceding claims, characterized in that the delimiting element (23) is designed in the form of a frame-like structure which surrounds an inner region (29), wherein, preferably, the inner region (29) is dimensioned such that at least one optoelectronic semiconductor component (41), in particular an LED chip, can be accommodated therein, wherein, furthermore preferably, the lateral surface (27) is the surface side of the frame-like structure facing the inner region (29) or the surface side of the frame-like structure facing away from the inner region (29).Method for producing at least one layer on an optoelectronic lighting device (31), comprising the steps of: providing a carrier (33), on the top side (35) of which at least one optoelectronic semiconductor component (41), in particular an LED chip, is arranged, temporarily arranged on the carrier (33) by a device according to one of the preceding claims in such a way that the delimiting device (51) is arranged at the specific distance above the top side (35) of the carrier (33), in order to form the layer between the delimiting device (51) and the top side (35) of the carrier (31), applying flowable material to the carrier (33) in at least part of the spatial region between the carrier (33) and the delimiting device (51), and removing the device after the flowable material has cured.

Images