Elastic property mounting substrate

Abstract

To provide an elastic property mounting substrate with thermal reliability.SOLUTION: An elastic property mounting substrate (100) comprises: an elastic property base material (1); a first elastic property wiring (2) provided onto the elastic property base material; a first electron component (3) that is mounted onto the elastic property base material (1), and is connected to the first elastic property wiring (2); a second elastic property wiring (4) that is provided on the elastic property base material (1); and a first insulation layer (6). The first elastic property wiring (2) includes a component connection part (5) connected to the first electron component (3). One part of the second elastic property wiring (4) is overlapped with the first electron component (3) or the component connection part (5) in view of a thickness direction of the elastic property base material (1).SELECTED DRAWING: Figure 2B

Description

[Technical field]

[0001] The present invention relates to a stretchable mounting substrate. [Background technology]

[0002] Conventionally, a stretchable mounting substrate in which electronic components connected to stretchable wiring are mounted on a stretchable substrate is widely known. For example, a substrate described in Patent Document 1 includes stretchable wiring formed on a stretchable substrate and electronic components mounted on the stretchable substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6518451 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, stretchable mounting boards mounted with electronic components that generate heat during use are sometimes used. In such mounting boards, it is necessary to dissipate the heat generated by the electronic components in order to improve the thermal reliability of the mounting board. However, in the structure described in Patent Document 1, when the stretchable wiring and the electronic components reach a thermal equilibrium state, heat is difficult to transfer, so there is a risk that sufficient heat cannot be dissipated relative to the amount of heat generated by the electronic components. This tendency is particularly noticeable when there is a covering portion that covers the electronic components. [Means for solving the problem]

[0005] The present invention provides a stretchable mounting substrate comprising: a stretchable substrate; a first stretchable wiring provided on the stretchable substrate; a first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring; and a stretchable heat dissipation member provided on the stretchable substrate, wherein the first stretchable wiring has a component connection part connected to the first electronic component, and the stretchable heat dissipation member has a part overlapping with the electronic component or the component connection part when viewed in the thickness direction of the stretchable substrate.

[0006] The present invention also provides a stretchable mounting substrate comprising: a stretchable substrate; a first stretchable wiring provided on the stretchable substrate; a first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring; a stretchable heat dissipation member provided on the stretchable substrate; and a sealing layer that seals the first electronic component, wherein the first stretchable wiring has a component connection part that is connected to the first electronic component, and at least a portion of the stretchable heat dissipation member overlaps with the sealing layer when viewed in the thickness direction of the stretchable substrate. Effect of the Invention

[0007] The stretchable mounting board according to one aspect of the present invention can obtain a sufficient heat dissipation effect for electronic components, and therefore, a stretchable mounting board with high thermal reliability can be provided. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a top view of the stretchable mounting substrate according to the first embodiment. [Figure 2A] FIG. 2A is a partial top view of a stretchable mounting substrate according to the first embodiment. [Figure 2B] FIG. 2B is a partial cross-sectional view (cross-sectional view taken along line AA in the top view) of the stretchable mounting board according to the first embodiment. [Figure 3A] FIG. 3A is a partial top view of a stretchable mounting substrate according to a first modified example of the first embodiment. [Figure 3B] FIG. 3B is a partial cross-sectional view (cross-sectional view taken along line BB in the top view) of the stretchable mounting board according to the first modified example of the first embodiment. [Figure 4A] FIG. 4A is a partial top view of a stretchable mounting substrate according to a second modified example of the first embodiment. [Figure 4B] FIG. 4B is a partial cross-sectional view (cross-sectional view taken along line CC in the top view) of the stretchable mounting board according to the second modified example of the first embodiment. [Figure 5A] FIG. 5A is a partial top view of a stretchable mounting substrate according to a third modified example of the first embodiment. [Figure 5B]FIG. 5B is a partial cross-sectional view (cross-sectional view taken along line DD in the top view) of the stretchable mounting board according to the third modified example of the first embodiment. [Figure 6A] FIG. 6A is a partial top view of a stretchable mounting substrate according to a fourth modified example of the first embodiment. [Figure 6B] FIG. 6B is a partial cross-sectional view (cross-sectional view taken along line EE in the top view) of the stretchable mounting board according to the fourth modified example of the first embodiment. [Figure 7] FIG. 7 is a partial top view of a stretchable mounting board according to a fifth modified example of the first embodiment. [Figure 8] FIG. 8 is a partial top view of a stretchable mounting board according to a sixth modified example of the first embodiment. [Figure 9] FIG. 9 is a partial cross-sectional view of the stretchable mounting board according to the second embodiment. [Figure 10A] FIG. 10A is a partial top view of the stretchable mounting substrate according to the third embodiment. [Figure 10B] FIG. 10B is a partial cross-sectional view (cross-sectional view taken along line FF in the top view) of the stretchable mounting board according to the third embodiment. [Figure 11] FIG. 11 is a partial top view of a stretchable mounting board according to a first modified example of the third embodiment. [Figure 12A] FIG. 12A is a partial top view of the stretchable mounting substrate according to the fourth embodiment. [Figure 12B] FIG. 12B is a partial cross-sectional view (cross-sectional view taken along line GG in the top view) of the stretchable mounting board according to the fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. Note that the embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, arrangements and connection forms of the components shown in the following embodiments are merely examples and are not intended to limit the present invention. Among the components in the following embodiments, components that are not described in the independent claims are described as optional components. In addition, the size or size ratio of the components shown in the drawings is not necessarily strict. In addition, in each figure, the same reference numerals are given to substantially the same configurations, and duplicated descriptions may be omitted or simplified. Each embodiment is an example, and partial replacement or combination of the configurations shown in different embodiments is possible. In each embodiment, the differences from the points described before that embodiment are mainly described.

[0010] [First embodiment] With reference to FIG. 1, FIG. 2A, and FIG. 2B, the structure of a stretchable mounting board 100 in which electronic components are mounted on a stretchable base material will be described. As shown in FIG. 1, the stretchable mounting board 100 has a shape including a rectangular main part on the left side and a convex secondary part on the right side in a plan view. The shape of the stretchable mounting board 100 is not limited to that shown in FIG. 1, and may be, for example, a circular shape or a rectangular shape. In addition, in FIG. 1, the stretch direction assumed when the stretchable mounting board 100 is used is indicated by a double-headed arrow X. Note that this stretch direction arrow does not mean that the stretchable mounting board 100 stretches only in this direction, and the stretchable mounting board 100 may stretch in other directions. In addition, in FIG. 2B, the area in which the first electronic component 3 or the component connection part 5 is arranged is indicated by a mounting area Z indicated by a double-headed arrow. Note that the mounting area Z indicated by a double-headed arrow is merely an example and may be of any size. This stretchable mounting substrate 100 is attached to a curved biological surface such as the human body with its upper or lower main surface as an attachment surface, and is used as a thin and stretchable wearable device.

[0011] The stretchable mounting substrate 100 shown in FIG. 1, FIG. 2A, and FIG. 2B includes a stretchable substrate 1, a first stretchable wiring 2 provided on the stretchable substrate 1, a first electronic component 3 mounted on the stretchable substrate 1 and connected to the first stretchable wiring 2, a second stretchable wiring 4 provided on the stretchable substrate 1, and a first insulating layer 6 provided on the stretchable substrate 1. The first stretchable wiring 2 has a component connection part 5 connected to the first electronic component 3, and the second stretchable wiring 4 overlaps with the first electronic component 3 or the component connection part 5 in a plan view, that is, when viewed from the thickness direction of the stretchable substrate 1. In addition, in the top view of FIG. 1 and the top view of FIG. 2A, the first stretchable wiring 2, the second stretchable wiring 4, the first insulating layer 6, and the joint part 10 are shown by hatching for convenience. The same applies to the following top views.

[0012] The second elastic wire 4 corresponds to the elastic heat dissipation member in the present disclosure.

[0013] With the above-mentioned configuration, the portion of the second stretchable wiring 4 that overlaps with the first electronic component 3 and the component connection portion 5 when viewed from the thickness direction of the stretchable substrate 1 functions as a heat absorption portion. The heat absorbed by the heat absorption portion spreads throughout the second stretchable wiring 4. That is, the heat generated from the first electronic component 3 can be absorbed by the heat absorption portion and released via the second stretchable wiring 4 that extends in a direction away from the first electronic component 3. Therefore, with the above-mentioned configuration, a stretchable mounting board with high thermal reliability can be provided.

[0014] In this specification, thermal reliability refers to the occurrence rate of malfunction or failure due to heat generation during use of electronic components. In other words, the higher the thermal reliability, the lower the possibility of malfunction or failure occurring in a stretchable mounting substrate including electronic components, and the lower the thermal reliability, the higher the possibility of malfunction or failure occurring.

[0015] The stretchable substrate 1 is a sheet-like or film-like stretchable substrate, and is made of, for example, a resin material having stretchability. Examples of the resin material include thermoplastic polyurethane. The thickness of the stretchable substrate 1 is not particularly limited, but from the viewpoint of not inhibiting the stretching of the surface of the living body when attached to the living body, it is preferably 1 mm or less, more preferably 100 μm or less, and even more preferably 1 μm or less. In addition, the thickness of the stretchable substrate 1 is preferably 0.1 μm or more.

[0016] The first elastic wiring 2 refers to the elastic wiring that is directly connected to the first electronic component 3 among the elastic wirings that are routed in a predetermined pattern on the main surface of the elastic substrate 1 and the main surface of the first insulating layer 6. The first elastic wiring 2 contains conductive particles and a resin. For example, a mixture of metal powder such as Ag, Cu, Ni, etc. as the conductive particles and an elastomer resin such as a silicone resin can be mentioned. The average particle size of the conductive particles is not particularly limited, but is preferably 0.01 μm or more and 10 μm or less. In addition, the shape of the conductive particles is preferably spherical.

[0017] The thickness of the first elastic wire 2 is not particularly limited, but is preferably 100 μm or less, and more preferably 50 μm or less. The thickness of the first elastic wire 2 is preferably 0.01 μm or more. The line width of the first elastic wire 2 is not particularly limited, but is preferably 0.1 μm or more, and more preferably 10 mm or less. The number of elastic wires included in the first elastic wire 2 is not particularly limited.

[0018] The first electronic component 3 is mounted on the stretchable substrate 1. Examples of the first electronic component 3 include an acceleration sensor and a temperature sensor. The first electronic component 3 is not particularly limited, and may be an amplifier (op-amp, transistor, etc.), a chip capacitor, a chip resistor, an LED, a semiconductor IC, a chip inductor, etc. The first electronic component 3 has an external electrode 13, and the external electrode 13 is electrically connected to the component connection part 5 of the first stretchable wiring 2 via the joint part 10. From the viewpoint of greatly improving the thermal reliability of the electronic component, and therefore the thermal reliability of the stretchable mounting substrate 100, the first electronic component 3 is preferably a heat-generating electronic component such as an active element, but may also be a passive element.

[0019] The first electronic component 3 is connected to the first elastic wiring 2 via a joint 10. Examples of materials constituting the joint 10 include solder and conductive adhesive, but the materials may not be the above-mentioned materials. The joint 10 is a so-called fillet, and is not limited to the shape shown in FIG. 1, and may be, for example, a semicircular shape. In addition, the arrangement of the first electronic component 3 is not limited to the arrangement shown in FIG. 1, and may be arranged anywhere on the elastic substrate 1.

[0020] The second elastic wiring 4 is routed in a predetermined pattern on the main surface of the elastic substrate 1, and contains conductive particles and resin. For example, a mixture of metal powder such as Ag, Cu, Ni, etc. as conductive particles and an elastomer resin such as silicone resin can be used. The average particle size of the conductive particles is not particularly limited, but is preferably 0.01 μm or more and 10 μm or less. In addition, the shape of the conductive particles is preferably spherical.

[0021] The thickness of the second elastic wire 4 is not particularly limited, but is preferably 100 μm or less, and more preferably 50 μm or less. The thickness of the second elastic wire 4 is preferably 0.01 μm or more. The line width of the second elastic wire 4 is not particularly limited, but is preferably 0.1 μm or more, and more preferably 10 mm or less. The number of elastic wires included in the second elastic wire 4 is not particularly limited. The second elastic wire 4 is not directly electrically connected to the first electronic component 3.

[0022] The first elastic wire 2 and the second elastic wire 4 may each contain conductive particles having the same average particle size, or may contain different conductive particles. Similarly, the width and thickness of the elastic wires may be the same or different. It is preferable that the line width of the second elastic wire 4 is wider than that of the first elastic wire 2, since this can improve heat dissipation.

[0023] In addition, the elastic heat dissipation member in the present disclosure is not limited to elastic wiring, and may be, for example, a patterned elastic heat dissipation pattern. In other words, it may be a pattern that is not connected to electronic components or wiring and has a function specialized for heat dissipation. The shape of the elastic heat dissipation member other than the elastic wiring is not particularly limited, and it is sufficient that a part of it overlaps with the first electronic component or the component connection part when viewed from the thickness direction of the elastic base material.

[0024] Furthermore, the first stretchable wiring 2 and the second stretchable wiring 4 may be connected to each other in a region that does not overlap with the first electronic component 3 and the component connection portion 5 when viewed from the thickness direction of the stretchable substrate 1. The first stretchable wiring 2 and the second stretchable wiring 4 are extended in the same direction so as to be parallel and overlap at least in the vicinity of the first electronic component 3, and heat can be efficiently transferred from the first stretchable wiring 2 to the second stretchable wiring 4.

[0025] The component connection part 5 is a part that functions as a land or pad for mounting electronic components, and refers to a part of the first stretchable wiring 2 that overlaps with the joint 10 when viewed from the thickness direction of the stretchable substrate 1. The joint 10 may include a region that does not overlap with the first stretchable wiring 2 when viewed from the thickness direction of the stretchable substrate 1, or may entirely overlap with the first stretchable wiring 2.

[0026] The first insulating layer 6 is preferably made of a resin material or a mixture of a resin material and an inorganic material. Examples of the resin material include urethane-based, styrene-based, olefin-based, silicone-based, fluorine-based, nitrile rubber, latex rubber, vinyl chloride, ester-based, amide-based and other elastomer-based resins, epoxy, phenolic, acrylic, polyester, imide-based, rosin, cellulose, polyethylene terephthalate-based, polyethylene naphthalate-based, and polycarbonate-based resins.

[0027] In the thickness direction of the stretchable substrate 1, a first insulating layer 6 is disposed between the first electronic component 3 and the second stretchable wiring 4. By disposing the first insulating layer 6 in this manner, efficient heat dissipation from the first electronic component 3 to the second stretchable wiring 4 is possible. As shown in FIG. 1, the first insulating layer 6 may be disposed only in the region where the first stretchable wiring 2 and the second stretchable wiring 4 overlap, or may be disposed so as to overlap the entire substrate.

[0028] The closer the distance between the first electronic component 3 and the second elastic wire 4, the more efficiently the second elastic wire 4 can absorb the heat generated from the first electronic component 3. However, if the distance between the first electronic component 3 and the second elastic wire 4 is short in the thickness direction of the elastic substrate 1, the possibility of a short circuit due to contact between the two increases. By disposing the first insulating layer 6 between the first elastic wire 2 and the second elastic wire 4 as shown in Figures 2A and 2B, the distance between the first electronic component 3 and the second elastic wire 4 can be sufficiently close while reducing the possibility of a short circuit. Therefore, the second elastic wire 4 can efficiently absorb the heat generated from the first electronic component 3.

[0029] As shown in FIG. 2A and FIG. 2B, the stretchable mounting board 100 according to the first embodiment has a second stretchable wiring 4 provided on a stretchable base material 1, and a component connection part 5 provided on the upper side of the second stretchable wiring 4 via a first insulating layer 6. By adopting the above-mentioned configuration, a stretchable mounting board with high thermal reliability can be provided. Note that the up-down direction in this specification is defined as the stretchable base material 1 in FIG. 2A and FIG. 2B being the "lower side" and the first electronic component 3 being the "upper side", but it does not have to match the actual up-down direction during use.

[0030] The above effects will be described in more detail. It is generally known that the resistance of a stretchable wire increases and the thermal conductivity decreases when the wire is stretched. In other words, the heat dissipation performance of the first stretchable wire 2 and the second stretchable wire 4 decreases when the wire is stretched. Therefore, when the stretchable mounting substrate 100 is deformed, such as stretched or bent, it is preferable that the first stretchable wire 2 and the second stretchable wire 4 do not stretch uniformly. For this reason, it is preferable that the first stretchable wire 2 and the component connection portion 5 and the second stretchable wire 4 are provided in different layers in the vicinity of the electronic component.

[0031] By configuring the first stretchable wiring 2 and the second stretchable wiring 4 so that they do not stretch uniformly, even if the thermal conductivity of one of the stretchable wirings decreases, the decrease in the thermal conductivity of the other stretchable wiring can be suppressed, making it possible to provide a stretchable mounting substrate with higher thermal reliability.

[0032] The component connection portion 5 and the second elastic wire 4 are provided at different distances from the elastic base material. This prevents the first elastic wire 2 and the second elastic wire 4 from stretching uniformly when the elastic mounting board 100 is flexed or bent. Therefore, even when the elastic mounting board 100 is flexed, heat can be sufficiently dissipated from the vicinity of the first electronic component 3.

[0033] As shown in FIG. 1, the first stretchable wiring 2 and the second stretchable wiring 4 are connected to a connector 12. That is, the stretchable wiring board 11 can be connected to another device via the connector 12. The first stretchable wiring 2 is connected to an electronic component 11A different from the first electronic component 3, and the second stretchable wiring 4 is connected to an electronic component 11B. When the first stretchable wiring 2 is connected to a plurality of electronic components, a stretchable heat dissipation member may be disposed on each of the plurality of electronic components, or, as shown in FIG. 1, a stretchable heat dissipation member may be disposed only on the first electronic component 3. When a plurality of stretchable heat dissipation members are disposed, the respective stretchable heat dissipation members may be different members or the same member. When the same heat dissipation member is used, each of them may be formed integrally or may be separate.

[0034] The first elastic wiring 2 and the second elastic wiring 4 are not limited to the arrangement shown in FIG. 1, and may be arranged in any manner on the elastic substrate 11. The number of each is not particularly limited. The type of the other electronic component 11 is not particularly limited, and may be the same as or different from the first electronic component 3. The number of electronic components 11 is not particularly limited. The arrangement position and number of connectors 12 are not particularly limited. The electronic components 11A, 11B and the connector 12 are not essential components of the present disclosure.

[0035] [First Modification of the First Embodiment] A first modified example of the first embodiment will be described with reference to Figures 3A and 3B. The stretchable mounting board 100A according to the first modified example of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the first stretchable wire 2 and the second stretchable wire 4. As shown in Figure 3A, in a region overlapping with the first electronic component 3 in a planar view, the extension direction (Y direction) of the first stretchable wire 2 and the extension direction (X direction) of the second stretchable wire 4 intersect.

[0036] By adopting the above-mentioned configuration, it is possible to suppress the decrease in heat dissipation when the stretchable mounting substrate 100A expands and contracts. Specifically, when the stretchable mounting substrate 100A expands and contracts in the direction of the double-headed arrow Y shown in FIG. 3A, the resistance of the first stretchable wiring 2 increases and the thermal conductivity decreases due to the expansion and contraction. In other words, there is a risk of the heat dissipation performance decreasing.

[0037] However, since the second elastic wire 4 extends in the Y direction, that is, in a direction perpendicular to the first elastic wire 2 when viewed from the first electronic component 3, the amount of expansion and contraction in the Y direction is smaller than that of the first elastic wire 2. In other words, since the decrease in thermal conductivity is also suppressed, a state with high thermal reliability can be maintained even when the elastic mounting board 100A expands and contracts.

[0038] Similarly, when the stretchable mounting substrate 100A expands and contracts in a direction (Y direction) parallel to the extension direction of the second stretchable wire 4, the thermal conductivity of the second stretchable wire 4 decreases, but the decrease in the thermal conductivity of the first stretchable wire 2 can be suppressed. That is, the extension direction of the first stretchable wire and the extension direction of the second stretchable wire intersect at least in the vicinity of the first electronic component, so that the stretchable mounting substrate 100A can maintain a state of high thermal reliability regardless of the direction in which it expands and contracts. Note that the vicinity of the electronic component refers to a region that is 1 mm or less away from the electronic component in a plan view.

[0039] The second stretchable wire 4 has an intersection with the extension direction of the first stretchable wire 2 when viewed from the thickness direction of the stretchable substrate 1, and it is more preferable that the intersection overlaps with the first electronic component 3 or the joint 10 when viewed from the thickness direction of the stretchable substrate 1. By arranging the second stretchable wire 4 in this way, it is possible to further improve the thermal reliability of the stretchable mounting board 100A.

[0040] The first elastic wire 2 and the second elastic wire 4 do not have to extend in one direction over the entire length of the wire. Specifically, as shown in FIG. 3A and FIG. 3B, the first elastic wire 2 may have a region extending in a direction perpendicular to the extension direction of the second elastic wire 4 and a region extending parallel to the second elastic wire 4. In such a case, since the influence of the extension direction in the region close to the first electronic component 3 is large, it is sufficient that the extension direction in the vicinity of the component connection part 5 in the first elastic wire 2 and the extension direction of the second elastic wire 4 intersect. In addition, the second elastic wire 4 may have a region extending in a branched manner in multiple directions. In this case, since the influence of the extension direction in the region close to the first electronic component 3 is large, it is sufficient that the extension direction in the vicinity of the component connection part 5 in the first elastic wire 2 and the extension direction of the second elastic wire 4 intersect.

[0041] The extension direction of the first elastic wire 2 and the extension direction of the second elastic wire 4 are not limited to the arrangement shown in FIG. 3A and FIG. 3B. As described above, if the extension direction of each wire is different, the decrease in thermal conductivity for a specific extension direction is different. For example, when the elastic mounting substrate is stretched in the X direction, the thermal conductivity of the wire extending in the X direction is greatly decreased, and the decrease in the thermal conductivity of the wire extending in the Y direction is small. In other words, the larger the angle between the extension direction of the elastic mounting substrate and the extension direction of the wire, the more the decrease in thermal conductivity is suppressed. In addition, the "angle" in this specification refers to the smaller of the two angles formed at the intersection. That is, it is a maximum of 90 degrees.

[0042] Therefore, when the first stretchable wire 2 and the second stretchable wire 4 cross, the decrease in the thermal conductivity of the second stretchable wire 4 is suppressed for expansion and contraction that greatly reduces the thermal conductivity of the first stretchable wire 2. At this time, the larger the angle between the first stretchable wire 2 and the second stretchable wire 4, the more the decrease in the thermal conductivity of the second stretchable wire 4 is suppressed. For expansion and contraction that greatly reduces the thermal conductivity of the second stretchable wire 4, the decrease in the thermal conductivity of the first stretchable wire 2 is suppressed. That is, by arranging the extension direction of the first stretchable wire 2 and the extension direction of the second stretchable wire 4 to cross at least in the vicinity of the first electronic component 3, and more specifically, by arranging them to cross in the area overlapping with the first electronic component 3 in a planar view, the decrease in thermal conductivity can be suppressed regardless of the direction in which the stretchable mounting substrate 100A expands and contracts. In addition, the larger the angle between the extension direction of the first stretchable wire 2 and the extension direction of the second stretchable wire 4, the more preferable, and it is more preferable that they are perpendicular to each other.

[0043] In addition, when a plurality of second elastic wires 4 are provided, the extension directions of the second elastic wires 4 may be different. By arranging the second elastic wires 4 in this way, it is possible to suppress the decrease in the thermal conductivity of the entire second elastic wire 4. When expansion and contraction in all directions is expected, the extension directions of the plurality of second elastic wires 4 are different from each other, so that the decrease in the thermal conductivity of the second elastic wire 4 when it is expanded and contracted in a specific direction can be suppressed. On the other hand, when the expected expansion and contraction direction is determined to be one, it is effective to arrange the plurality of second elastic wires 4 so as to be perpendicular to that direction. Since the decrease in the thermal conductivity of the second elastic wire 4 can be greatly suppressed in a specific expansion and contraction direction, it is possible to provide a stretchable mounting substrate 100A with higher thermal reliability.

[0044] [Second Modification of the First Embodiment] A second modified example of the first embodiment will be described with reference to Figures 4A and 4B. The stretchable mounting board 100B according to the second modified example of the first embodiment is different from the stretchable mounting board 100 according to the first embodiment in the arrangement of the first stretchable wire 2 and the second stretchable wire 4. Specifically, as shown in Figures 4A and 4B, in the thickness direction of the stretchable substrate 1, the second stretchable wire 4 is arranged on the upper side of the electronic component.

[0045] That is, similarly to the first embodiment, the component connection portion 5 and the second stretchable wire 4 are provided at different distances from the stretchable substrate 1. By arranging in this manner, as described above, even when the stretchable mounting board 100B is bent, heat can be sufficiently dissipated from the vicinity of the first electronic component 3. In addition, this arrangement is suitable when using electronic components that require high heat dissipation, since the first stretchable wire 2 is responsible for heat dissipation from the lower surface side of the first electronic component 3, and the second stretchable wire 4 is responsible for heat dissipation from the upper surface side.

[0046] The stretchable mounting board 100B is not limited to the arrangement shown in Figures 4A and 4B. In Figures 4A and 4B, the second stretchable wiring 4 is arranged so as to overlap the first electronic component 3 when viewed from the thickness direction of the stretchable substrate 1, but may be arranged so as to overlap the joint 10. In addition, the number and extension direction of the second stretchable wiring 4 are not limited.

[0047] [Third Modification of the First Embodiment] A third modified example of the first embodiment will be described with reference to Figures 5A and 5B. A stretchable mounting board 100C according to the third modified example of the first embodiment differs from the first embodiment in the configuration of the first stretchable wire 2. Specifically, as shown in Figures 5A and 5B, the number of first stretchable wires 2 and the number of second stretchable wires 4 in the vicinity of the first electronic component 3 are different.

[0048] 5A and 5B, the first elastic wire 2 is composed of three elastic wires connected to the first electronic component 3A, and the second elastic wire 4 is composed of two elastic wires. That is, the wiring density of the first elastic wire 2 provided on the upper side of the first insulating layer 6 is greater than the wiring density of the second elastic wire 4 provided on the lower side of the first insulating layer 6.

[0049] It is assumed that the stretchable mounting substrate 100C is used by bending, for example, so that the second stretchable wiring 4 is on the inside and the first stretchable wiring 2 is on the outside. If the stretchable substrate 1 is made of a member of uniform thickness, the amount of stretching increases the farther from the center of bending in the thickness direction of the stretchable substrate 1 when bending. In other words, there is a portion where the amount of stretching changes, and this portion may become the starting point of breakage. By adopting the above-mentioned configuration, in the stretchable mounting substrate 100C, the portion farther from the stretchable substrate 1 is less likely to stretch, so the amount of stretching approaches uniformity when bending. Therefore, breakage when bending can be suppressed.

[0050] In this specification, the magnitude of the wiring density can be compared by the magnitude of the wiring cross-sectional area in a specific region. That is, the wiring density of the first elastic wiring 2 provided on the upper side of the first insulating layer 6 is greater than the wiring density of the second elastic wiring 4 provided on the lower side of the first insulating layer 6, which can be rephrased as the cross-sectional area of ​​the first elastic wiring 2 is greater than the cross-sectional area of ​​the second elastic wiring 4. As shown in this embodiment, when there are a plurality of first elastic wirings 2 and second elastic wirings 4, the totals of their cross-sectional areas are to be compared.

[0051] The number of the first elastic wires 2 and the number of the second elastic wires 4 may be the same. In that case, the cross-sectional area can be changed by changing the width or thickness of each elastic wire. The above methods may be combined to change the cross-sectional area. In addition, since the ease of stretching the wiring is determined by the total cross-sectional area, the cross-sectional area and the number of each elastic wire included in the first elastic wire 2 and the second elastic wire 4 are not particularly limited.

[0052] Furthermore, the cross-sectional areas of the respective elastic wires included in the first elastic wire 2 may be the same or different. The same applies to the second elastic wire 4. Furthermore, when viewed from the thickness direction of the elastic substrate 1, the first elastic wire 2 and the second elastic wire 4 are not limited to the arrangements shown in Figures 5A and 5B, and may be partially overlapped or completely overlapped.

[0053] The cross-sectional area of ​​the elastic wiring refers to any cross section perpendicular to the extension direction of the elastic wiring. As shown in FIG. 2A and FIG. 2B, it is preferable to compare the cross-sectional areas of the region where the first elastic wiring 2 and the second elastic wiring 4 overlap in the thickness direction of the elastic substrate 1, but when the first elastic wiring 2 and the second elastic wiring 4 do not overlap, it is preferable to compare in the region near the electronic component. Note that, as shown in FIG. 5A and FIG. 5B, when a specific cross section is a cross section perpendicular to the extension direction of the elastic wiring included in the first elastic wiring 2 and the second elastic wiring 4, it is more preferable to compare the part.

[0054] The stretching directions of the respective stretchable wires included in the first stretchable wire 2 may be different. In that case, the totals of the cross-sectional areas perpendicular to the respective stretching directions are compared. The same applies to the second stretchable wire 4. In addition, it is preferable that the stretching direction of the first stretchable wire 2 and the stretching direction of the second stretchable wire 4 are parallel to each other at least in the vicinity of the first electronic component 3.

[0055] As described above, when the stretchable substrate 1 is bent so that the second stretchable wiring 4 is on the inside and the first stretchable wiring 2 is on the outside, by arranging the first stretchable wiring 2 and the second stretchable wiring 4 so that they are parallel to each other and so that the wiring density of the first stretchable wiring 2 farther from the stretchable substrate 1 is higher than the wiring density of the second stretchable wiring 4 closer to the stretchable substrate 1, the amount of stretch near the electronic component when bent in such a direction can be made closer to uniform.

[0056] As in the first modified example of the first embodiment, the first elastic wire 2 and the second elastic wire 4 may each have regions with different extension directions.

[0057] In addition, as shown in FIG. 5A and FIG. 5B, when the second elastic wiring 4 is provided on the elastic substrate 1 and the component connection part 5 is provided on the upper side of the second elastic wiring 4 via the first insulating layer 6, it is preferable to select the function of each wiring so that the current density of the first elastic wiring 2 is greater than the current density of the second elastic wiring 4. The current density of the elastic wiring is the value obtained by dividing the current flowing through the elastic wiring by the cross-sectional area of ​​the elastic wiring. In other words, the higher the current density, the more heat the elastic wiring will generate. With this configuration, the second elastic wiring 4 is more likely to transfer heat than the first elastic wiring 2, so that heat can be dissipated from the first electronic component 3 to the second elastic wiring 4 more efficiently.

[0058] [Fourth Modification of the First Embodiment] A fourth modified example of the first embodiment will be described with reference to Figures 6A and 6B. A stretchable mounting board 100D according to the fourth modified example of the first embodiment is different from the stretchable mounting board 100 according to the first embodiment in the arrangement of the second stretchable wiring 4. Specifically, the second stretchable wiring 4 does not overlap the first electronic component 3 when viewed from the thickness direction of the stretchable substrate 1, but overlaps the component connection portion 5.

[0059] As described above, the closer the distance between the second stretchable wiring 4 and the first electronic component 3, the more efficiently heat can be dissipated from the first electronic component 3. Therefore, from the viewpoint of heat dissipation, it is preferable that the area of ​​the stretchable heat dissipation member in the vicinity of the first electronic component 3 is large, and it is more preferable that the stretchable heat dissipation member overlaps the entire first electronic component 3 when viewed from the thickness direction of the stretchable substrate 1. However, increasing the area of ​​the stretchable heat dissipation member reduces the stretch performance of the stretchable mounting board 100D.

[0060] That is, in order to enhance the heat dissipation performance from the first electronic component 3 while suppressing the deterioration of the stretchability of the stretchable mounting board 100D, it is preferable to arrange the second stretchable wiring 4 so that the part of the first electronic component 3 from which heat is most desired to be dissipated overlaps with the part of the first electronic component 3 when viewed from the thickness direction of the stretchable substrate 1. By arranging as shown in Fig. 6A and Fig. 6B, heat can be efficiently dissipated from the region of the first electronic component 3 close to the component connection portion 5.

[0061] The second elastic wire 4 is not limited to the arrangement shown in Figures 6A and 6B. In Figures 6A and 6B, the second elastic wire 4 is arranged so as to overlap all of the component connection parts 5 when viewed from the thickness direction of the elastic substrate 1, but it is sufficient that the second elastic wire 4 overlaps at least one of the component connection parts 5. In addition, the extension direction of the second elastic wire 4 does not have to be perpendicular to the extension direction of the first elastic wire 2 as shown in Figures 6A and 6B.

[0062] [Fifth Modification of the First Embodiment] A fifth modified example of the first embodiment will be described with reference to Fig. 7. A stretchable mounting board 100E according to the fifth modified example of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the second stretchable wiring 4. Specifically, the second stretchable wiring 4 does not overlap the component connection portion 5 when viewed from the thickness direction of the stretchable substrate 1, but overlaps the first electronic component 3.

[0063] As described above, the closer the distance between the first electronic component 3 and the second elastic wire 4, the more efficient the heat dissipation. By arranging the second elastic wire 4 as described above, heat can be efficiently dissipated from the center of the first electronic component 3. In general, when an electronic component generates heat, the heat is most likely to be generated from the center of the component. Therefore, by arranging as shown in FIG. 7, heat dissipation from the first electronic component 3 can be more efficiently performed while suppressing an increase in the area of ​​the second elastic wire 4.

[0064] The second elastic wire 4 is not limited to the arrangement shown in Fig. 7. For example, the second elastic wire 4 may be arranged so that the extension direction of the second elastic wire 4 and the extension direction of the first elastic wire 2 are perpendicular to each other. Furthermore, the number of elastic wires included in the second elastic wire 4 is not particularly limited.

[0065] [Sixth Modification of the First Embodiment] A sixth modified example of the first embodiment will be described with reference to FIG. 8. The stretchable mounting board 100F according to the sixth modified example of the first embodiment is different from the stretchable mounting board 100 according to the first embodiment in the arrangement of the first stretchable wire 2 and the second stretchable wire 4. Specifically, the first stretchable wire 2 has a different extension direction at the boundary of the connection with the first electronic component 3, and the second stretchable wire 4 has a different extension direction like the first stretchable wire 2. Note that, for clarity, FIG. 8 illustrates only the electrode 13 connected to the first stretchable wire 2 of the first electronic component 3B.

[0066] As shown in Fig. 8, the extension direction of the first elastic wire 2 may be changed on either side of the first electronic component 3B. In other words, the routing direction of the first elastic wire 2 can be changed to an optimal shape for the arrangement and shape of the first electronic component. Similarly, the extension direction of the second elastic wire 4 may be changed so as to coincide with the extension direction of the first elastic wire 2.

[0067] The sixth modified example of the first embodiment is not limited to the arrangement shown in Fig. 8. For example, the second elastic wire 4 may extend in one direction near the component. When viewed from the thickness direction of the elastic substrate 1, the first elastic wire 2 and the second elastic wire 4 may be arranged to overlap each other.

[0068] 8, when the first stretchable wire 2 extends in a plurality of directions in the vicinity of the first electronic component 3, the second stretchable wire 4 preferably extends in a direction different from any of the directions in which the first stretchable wire 2 extends in a region overlapping with the first electronic component 3 or the component connection portion 5 as viewed from the thickness direction of the stretchable substrate 1. By arranging in this manner, when the first stretchable wire 2 undergoes stretching that reduces its thermal conductivity, it is possible to suppress a reduction in the thermal conductivity of the second stretchable wire 4.

[0069] [Second embodiment] The second embodiment will be described with reference to Fig. 9. The stretchable mounting board 101 according to the second embodiment further includes a second insulating layer 7, compared to the stretchable mounting board 100 according to the first embodiment.

[0070] A second insulating layer 7 is further provided between the second stretchable wire 4 and the stretchable substrate 1 in a region where the second stretchable wire 4 and the first electronic component or the component connection portion overlap when viewed in the thickness direction of the stretchable substrate 1. By disposing the second insulating layer 7 in this manner, it is possible to reduce the stretching of the second stretchable wire 4 when the stretchable mounting board 101 is bent, and to suppress a decrease in the thermal conductivity of the second stretchable wire 4.

[0071] The second insulating layer 7 is preferably made of a resin material or a mixture of a resin material and an inorganic material. Examples of the resin material include urethane-based, styrene-based, olefin-based, silicone-based, fluorine-based, nitrile rubber, latex rubber, vinyl chloride, ester-based, amide-based and other elastomer-based resins, epoxy, phenolic, acrylic, polyester, imide-based, rosin, cellulose, polyethylene terephthalate-based, polyethylene naphthalate-based, and polycarbonate-based resins.

[0072] The second insulating layer 7 may be made of the same material as the first insulating layer 6, or may be made of a different material. In addition, when the second insulating layer 7 and the first insulating layer 6 are made of the same material, the two may be integrated together.

[0073] The second insulating layer 7 is disposed between the second elastic wiring 4 and the elastic substrate 1 in the region where the second elastic wiring 4 and the first electronic component or component connection part overlap when viewed from the thickness direction of the elastic substrate 1, so that the position of the second elastic wiring 4 in the thickness direction of the elastic substrate 1 can be adjusted. When the elastic mounting board 101 bends and vibrates in the vertical direction, there are parts where the displacement is large and parts where it is small depending on the position in the thickness direction. Specifically, the part where the displacement amount is the largest corresponds to the antinode in the vibration, and the part where the displacement amount is the smallest corresponds to the node in the vibration. That is, by disposing the second insulating layer 7, the second elastic wiring 4 can be brought closer to the part where the displacement amount is the smallest in the thickness direction.

[0074] In this case, the position where the amount of displacement is smallest is not limited to simply the center of the thickness, but changes depending on the Young's modulus of each component. The second insulating layer 7 may be disposed between the entire second elastic wire 4 and the elastic substrate 1. Also, as shown in FIG. 9, a part of the second insulating layer 7 may be disposed between the elastic substrate 1 and the first elastic wire 2. Also, the second insulating layer 7 may be disposed over the entire elastic substrate 1.

[0075] [Third embodiment] The third embodiment will be described with reference to Fig. 10A and Fig. 10B. The stretchable mounting substrate 102 according to the third embodiment further includes a sealing layer 8, in comparison with the stretchable mounting substrate 100 according to the first embodiment. In the top view of Fig. 10A, the first insulating layer 6 inside the sealing layer 8 is omitted, and the sealing layer 8 is indicated by hatching. As shown in Fig. 10B, the first insulating layer 6 may be disposed only inside the sealing layer 8, or may be extended to the outside of the sealing layer 8 to cover the entire first stretchable wiring 2.

[0076] The sealing layer 8 seals the first electronic component 3 to protect the first electronic component 3 from external forces. There are no particular limitations on the material of which the sealing layer 8 is made, and examples of the material include elastomer resins such as polyvinyl chloride, polyethylene, polystyrene, polycarbonate, polyvinylidene fluoride, polyimide, liquid crystal polymer, polytetrafluoroethylene, phenolic resin, epoxy resin, urethane resin, acrylic resin, silicone resin, and styrene-butadiene resin.

[0077] By providing the sealing layer 8, the first electronic component 3 can be protected from external forces, but the diffusion of heat from the vicinity of the component is suppressed. When the sealing layer 8 is provided, the second elastic wire 4 is provided so as to overlap partially with the sealing layer 8 in the thickness direction of the stretchable substrate 1, and the second elastic wire 4 is routed to the outside of the sealing layer 8, so that heat can be dissipated from the first electronic component 3.

[0078] That is, the stretchable mounting board 102 according to the third embodiment includes a stretchable substrate 1, a first stretchable wiring 2 provided on the stretchable substrate 1, a first electronic component 3 mounted on the stretchable substrate 1 and connected to the first stretchable wiring 2, a second stretchable wiring 4 provided on the stretchable substrate 1, and a sealing layer 8 that seals the first electronic component 3, the first stretchable wiring 2 having a component connection part 5 connected to the first electronic component 3, and the second stretchable wiring 4 having a part overlapping with the sealing layer 8 when viewed from the thickness direction of the stretchable substrate 1. The second stretchable wiring 4 corresponds to the stretchable heat dissipation member in the present disclosure.

[0079] By using the above-mentioned structure, heat inside the sealing layer 8 moves to the area of ​​the second elastic wiring 4 that overlaps with the sealing layer 8 when viewed in the thickness direction of the elastic substrate 1, and is further diffused to the remaining area of ​​the second elastic wiring 4, i.e., the outer area of ​​the sealing layer 8, thereby allowing the heat trapped inside the sealing layer 8 to escape.

[0080] The size of sealing layer 8 only needs to be larger than first electronic component 3. There are also no particular limitations on the shape, and when viewed in the thickness direction of stretchable substrate 1, it may be rectangular or circular.

[0081] 10A and 10B, a part of the second stretchable wire 4 is disposed inside the sealing layer 8. By disposing the second stretchable wire 4 inside the sealing layer 8, the distance between the first electronic component 3 and the second stretchable wire 4 as viewed from the thickness direction of the stretchable substrate 1 can be reduced. That is, heat can be dissipated from the sealing layer 8 more efficiently. 10A and 10B, the second stretchable wire 4 is disposed inside the sealing layer 8, and the first stretchable wire 2 is disposed at the interface between the sealing layer 8 and the stretchable substrate 1. In FIG.

[0082] 10A and 10B, for example, the second stretchable wire 4 may be disposed below the first stretchable wire 2 as in the first embodiment. The second stretchable wire 4 is preferably disposed in the vicinity of the first electronic component 3. The arrangement of the first electronic component, the first stretchable wire, the second stretchable wire, and the first insulating layer may be the same as in the first embodiment.

[0083] [First Modification of the Third Embodiment] A first modified example of the third embodiment will be described with reference to Fig. 11. A stretchable mounting board 102A according to the first modified example of the third embodiment is different from the stretchable mounting board 102 according to the third embodiment in the arrangement of the second stretchable wiring 4.

[0084] As shown in FIG. 11, the extension direction of the first elastic wire 2 and the extension direction of the second elastic wire 4 may be parallel. The second elastic wire 4 is provided so as to overlap the first electronic component 3 when viewed from the thickness direction of the elastic substrate 1. In FIG. 11, the first insulating layer 6 is omitted, but as in the first embodiment, by disposing the first insulating layer between the first elastic wire and the second elastic wire, the first insulating layer 6 can suppress short-circuiting between the first elastic wire and the second elastic wire, so that the distance between the first electronic component 3 and the second elastic wire 4 in the thickness direction of the elastic substrate 1 can be reduced. That is, heat can be dissipated efficiently.

[0085] The arrangement of the first elastic wire 2 and the second elastic wire 4 is not limited to the arrangement shown in Fig. 10A and Fig. 10B. By adopting the arrangements shown as the respective modified examples of the first embodiment, the above-mentioned effects can be achieved.

[0086] [Fourth embodiment] The fourth embodiment will be described with reference to FIG. 12A and FIG. 12B. The stretchable mounting board 103 according to the fourth embodiment is different from the stretchable mounting board 100 according to the first embodiment in that it includes a second electronic component 9. In the description of FIG. 12A and FIG. 12B, for clarification, different reference symbols are used for each part of the first stretchable wiring and the second stretchable wiring, but this does not indicate that they are different stretchable wirings. Specifically, in the description up to the third embodiment, the same reference symbols are used before and after connection to the electronic component, but in the fourth embodiment, different reference symbols are used. In addition, in the description up to the third embodiment, when there are multiple first stretchable wirings 2 or second stretchable wirings 4, all of them are given the same reference symbols, but in the fourth embodiment, different reference symbols are used.

[0087] The stretchable mounting substrate 103 further includes a second electronic component 9. The second electronic component 9 is connected to the second stretchable wiring 4. The second electronic component 9 is sealed by a sealing layer 8. Specific examples of the second electronic component 9 include an acceleration sensor and a temperature sensor. The second electronic component 9 is not particularly limited, and may be an amplifier (op-amp, transistor, etc.), a chip capacitor, a chip resistor, an LED, a semiconductor IC, a chip inductor, etc. In addition, the second electronic component 9 may be the same component as the first electronic components 3B and 3C, or may be different. In addition, like the first electronic components 3B and 3C, the second electronic component 9 is preferably an active element, but may also be a passive element.

[0088] As shown in the top view of FIG. 12A, the first elastic wirings 2A and 2B are connected to the first electronic components 3B and 3C, and the second elastic wirings 4A, 4B, 4C, and 4D are connected to the second electronic component 9. As shown in the cross-sectional view of FIG. 12B, the second elastic wirings 4A and 4B function as elastic heat dissipation members of the first electronic component 3B. Similarly, the second elastic wirings 4C and 4D function as elastic heat dissipation members of the first electronic component 3C. In addition, the mounting area of ​​the first electronic component 3B is indicated by Z1, and the mounting area of ​​the first electronic component 3C is indicated by Z2. In addition, when a plurality of first electronic components are provided in this way, a common second elastic wiring 4 may be disposed in each first electronic component, or a different second elastic wiring 4 may be provided in each first electronic component. Alternatively, elastic heat dissipation members having different functions such as wiring patterns and heat dissipation patterns may be provided in each of the plurality of first electronic components. Needless to say, a plurality of first electronic components 3 may be provided in embodiments other than the fourth embodiment as well.

[0089] On the other hand, the second electronic component 9 to which the second elastic wiring 4 is connected may also generate heat during use. That is, the second electronic component 9 also needs to dissipate heat, but since the second elastic wiring 4 corresponds to the first elastic wiring 2 in the first electronic components 3B and 3C, there is a risk that heat dissipation will be insufficient.

[0090] In such a case, as shown in Figures 12A and 12B, by arranging the first stretchable wiring 2B in the vicinity of the second electronic component 9, the first stretchable wiring 2B functions as a heat dissipation member for the second electronic component 9. Specifically, as shown in Figures 12A and 12B, when viewed from the thickness direction of the stretchable substrate 1, a part of the first stretchable wiring 2B overlaps with the sealing layer 8 that seals the second electronic component 9.

[0091] That is, the wiring connected to a certain electronic component can be made to function as a heat dissipation member for the other electronic components. The first electronic component 3 and the second electronic component 9 may be multiple, and may include a stretchable wiring other than the first stretchable wiring 2 and the second stretchable wiring 4. As shown in FIG. 12A and FIG. 12B, it is preferable that the first electronic component 3 and the second electronic component 9 are sufficiently close to each other. As described above, each stretchable wiring more reliably functions as a heat dissipation member for the electronic component connected to the other. Even if the first electronic components 3B and 3C are separated from the second electronic component 9, the current density of the second stretchable wiring 4 can be adjusted by making the second electronic component 9 generate less heat than the first electronic components 3B and 3C. That is, as described above, heat dissipation from the first electronic components 3B and 3C can be performed more efficiently.

[0092] The fourth embodiment has been described using a combination of the first and third embodiments, but a plurality of first embodiments may be combined, or a plurality of second embodiments may be combined. It should be clearly stated that the present invention as described above includes the following aspects. First aspect: A stretchable substrate; A first elastic wiring provided on the elastic base material; A first electronic component mounted on the elastic substrate and connected to the first elastic wiring; An elastic heat dissipation member provided on the elastic base material, The first elastic wiring has a component connection portion connected to the first electronic component, When viewed in the thickness direction of the elastic base material, a part of the elastic base material is overlapping with the child component or the component connection portion; Stretchable mounting board. Second aspect: In the thickness direction of the elastic base material, between the first electronic component and the elastic heat dissipation member A first insulating layer is disposed; The stretchable mounting substrate according to the first embodiment. Third aspect: The elastic heat dissipation member is a second elastic wiring, The stretchable mounting substrate according to the first or second aspect. Fourth aspect: The component connection portion and the second elastic wiring are at different distances from the elastic base material. The part is provided with The stretchable mounting substrate according to the third embodiment. Fifth aspect: In the thickness direction of the elastic base material, between the first electronic component and the elastic heat dissipation member A first insulating layer is disposed; The second elastic wiring is provided on the elastic base material, and the first insulating layer is disposed on the front side. The component connection portion is provided on the upper side of the second elastic wiring. The stretchable mounting substrate according to the fourth embodiment. Sixth aspect: The wiring density of the first elastic wiring provided on the upper side of the first insulating layer is is greater than the wiring density of the second elastic wiring provided below The stretchable mounting substrate according to the fifth embodiment. Seventh aspect: The extension direction of the first elastic wire and the extension direction of the second elastic wire are at least Parallel in the vicinity of the first electronic component; The stretchable mounting substrate according to any one of the fourth to sixth aspects. Eighth aspect: The extension direction of the first elastic wire and the extension direction of the second elastic wire are at least intersect in the vicinity of the first electronic component; The stretchable mounting substrate according to any one of the fourth to sixth aspects. Ninth aspect: When viewed in the thickness direction of the elastic base material, the second elastic wiring and the first electronic component or the In a region where the component connection portion overlaps with the second elastic wiring, a first elastic wiring is provided between the second elastic wiring and the elastic base material. 2 further comprising an insulating layer; The stretchable mounting substrate according to any one of the fourth to eighth aspects. Tenth aspect: Further comprising a second electronic component; The second elastic wiring is connected to the second electronic component. The stretchable mounting substrate according to any one of the fourth to ninth aspects. Eleventh aspect: A stretchable substrate; A first elastic wiring provided on the elastic base material; A first electronic component mounted on the elastic substrate and connected to the first elastic wiring; An elastic heat dissipation member provided on the elastic base material; a sealing layer that seals the electronic component, The first elastic wiring has a component connection portion that is connected to the electronic component, When viewed in the thickness direction of the elastic base material, a part of the elastic heat dissipation member is Overlapping with Stretchable mounting board. Twelfth aspect: A portion of the elastic heat dissipation member is disposed inside the sealing layer. The stretchable mounting substrate according to an eleventh embodiment. Thirteenth aspect: In the thickness direction of the elastic base material, between the first electronic component and the elastic heat dissipation member A first insulating layer is disposed; The stretchable mounting substrate according to the eleventh or twelfth aspect. Fourteenth aspect: The elastic heat dissipation member is a second elastic wiring, The stretchable mounting substrate according to any one of the eleventh to thirteenth aspects. Fifteenth aspect: The component connection portion and the second elastic wiring are at different distances from the elastic base material. The part is provided with The stretchable mounting substrate according to a fourteenth embodiment. Sixteenth aspect: In the thickness direction of the elastic base material, between the first electronic component and the elastic heat dissipation member A first insulating layer is disposed; The wiring density of the first elastic wiring provided on the upper side of the first insulating layer is is greater than the wiring density of the second elastic wiring provided below The stretchable mounting substrate according to the fourteenth or fifteenth aspect. Seventeenth aspect: The extension direction of the first elastic wire and the extension direction of the second elastic wire are at least Parallel in the vicinity of the first electronic component; The stretchable mounting substrate according to the fifteenth or sixteenth aspect. 18th aspect: The extension direction of the first elastic wire and the extension direction of the second elastic wire are at least intersect in the vicinity of the first electronic component; The stretchable mounting substrate according to the fifteenth or sixteenth aspect. 19th aspect: When viewed in the thickness direction of the elastic base material, the second elastic wiring and the first electronic component or the In a region where the component connection portion overlaps with the second elastic wiring, a first elastic wiring is provided between the second elastic wiring and the elastic base material. 2 further comprising an insulating layer; The stretchable mounting substrate according to any one of the fifteenth to eighteenth aspects. 20th aspect: Further comprising a second electronic component; The second elastic wiring is connected to the second electronic component. The stretchable mounting substrate according to any one of the fifteenth to nineteenth aspects. [Explanation of symbols]

[0093] 1: Stretchable base material 2, 2A, 2B: 1st elastic wiring 3, 3A, 3B, 3C, 3D: 1st electronic component 4, 4A, 4B, 4C, 4D: 2nd elastic wiring (stretchable heat dissipation member) 5: Parts connection 6: First insulating layer 7: Second insulating layer 8: Sealing layer 9: Second electronic component 10: Connection 11A, 11B: Electronic components 12: Connector 100, 100A, 100B, 100C, 100D, 100E, 100F, 101, 102, 102A, 103: Stretchable mounting substrate Z, Z1, Z2: Mounting area

Claims

1. A stretchable substrate; A first elastic wiring provided on the elastic base material; A first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring; An elastic heat dissipation member provided on the elastic base material; a sealing layer that seals the electronic component, The first elastic wiring has a component connection portion connected to the electronic component, When viewed in the thickness direction of the elastic base material, a portion of the elastic heat dissipation member overlaps with the sealing layer. Stretchable mounting board.

2. A portion of the elastic heat dissipation member is disposed inside the sealing layer. The stretchable mounting substrate according to claim 1 .

3. a first insulating layer is disposed between the first electronic component and the elastic heat dissipation member in a thickness direction of the elastic base material; The stretchable mounting substrate according to claim 1 .

4. The elastic heat dissipation member is a second elastic wiring, The stretchable mounting substrate according to claim 1 .

5. The component connection portion and the second elastic wiring are provided at different distances from the elastic base material, The stretchable mounting substrate according to claim 4 .

6. In the thickness direction of the elastic base material, between the first electronic component and the elastic heat dissipation member A first insulating layer is disposed; The wiring density of the first elastic wiring provided on the upper side of the first insulating layer is greater than the wiring density of the second elastic wiring provided on the lower side of the first insulating layer, The stretchable mounting substrate according to claim 4 .

7. The extension direction of the first elastic wire and the extension direction of the second elastic wire are parallel to each other at least in the vicinity of the first electronic component. The stretchable mounting substrate according to claim 5 .

8. The extension direction of the first elastic wire and the extension direction of the second elastic wire intersect at least in the vicinity of the first electronic component, The stretchable mounting substrate according to claim 5 .

9. A second insulating layer is further provided between the second elastic wiring and the elastic substrate in a region where the second elastic wiring and the first electronic component or the component connection portion overlap when viewed from the thickness direction of the elastic substrate, The stretchable mounting substrate according to claim 5 .

10. Further comprising a second electronic component; The second elastic wiring is connected to the second electronic component. The stretchable mounting substrate according to claim 5 .

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