Integration method of copper cutting waste

Abstract

To provide an integration method of copper cutting waste which can integrate copper cutting waste while suppressing scattering.SOLUTION: An integration method of copper cutting waste comprises: a mounting step (S11) which scatters and mounts copper cutting waste 101 on a die 102 with a recess part; and an integration step (S12) in which a rotatable and columnar rotary tool 103 is pressed against the copper cutting waste 101 laid on the recess part of the die 102, the columnar rotary tool 103 is rotated so that the copper cutting waste 101 is heated to be more than softening temperature of copper, and the copper cutting waste is agitated in the recess part of the die 102 by the columnar rotary tool 103 to integrate the copper cutting waste 101. A press plate 104 connected through an elastic body to the columnar rotary tool 103 half-blocks the die 102 and resiliently energizes the copper cutting waste 101 by the elastic body in the integration step (S12).SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for consolidating copper cuttings. [Background technology]

[0002] In current motor manufacturing lines, a considerable amount of copper cutting chips is generated when the coil coating is stripped off. These cutting chips are melted and refined to return to copper products. Patent Document 1 describes a method in which a briquette made by incorporating an alloy component with a lower melting point than copper into copper alloy cutting chips and compressing and solidifying it is immersed in molten metal to melt it. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-173142 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the melting and refining method described in Patent Document 1 has problems in that it requires a large amount of operating energy and emits a large amount of carbon dioxide, and oxygen is mixed in during melting, reducing the copper purity and worsening the electrical resistance value.

[0005] In view of this, it is conceivable to use a friction stir welding technique in which a rotating tool is brought into contact with the copper cutting chips to integrate them by frictional heat. However, simply bringing the rotating tool into contact with the copper cutting chips may cause the copper cutting chips to scatter, making it difficult to progress in the integration process.

[0006] The present disclosure has been made in consideration of such problems, and aims to provide a method for consolidating copper cutting chips that can consolidate copper cutting chips while suppressing scattering of the copper cutting chips. [Means for solving the problem]

[0007] In one embodiment, a method for consolidating copper cutting chips includes the steps of: A step of placing the substrate on a die having a recess while scattering copper cutting chips; and an integration process in which a rotatable cylindrical rotary tool is pressed against the copper cutting chips placed in the recess of the die and the cylindrical rotary tool is rotated to heat the copper cutting chips to a temperature equal to or higher than the softening temperature of copper and stir the copper cutting chips in the recess of the die by the cylindrical rotary tool, thereby integrating the copper cutting chips. In the integration step, a pressing plate connected to the cylindrical rotary tool via an elastic body semi-closes the die and elastically biases the copper cutting chips by the elastic body.

[0008] In one embodiment, a method for consolidating copper cutting chips includes the steps of: In the placing step, the copper cutting chips are placed on the die attached to an apparatus base while being scattered thereon; In the integration process, the cylindrical rotating tool connected to a frame body capable of linear movement relative to the apparatus base by linear guides attached to both ends is pressed against the copper cutting chips, while the die is semi-closed and the copper cutting chips are elastically biased by the frame body, which supports the cylindrical rotating tool and has both ends elastically biased by the frame body, and the cylindrical rotating tool is rotated in synchronization with the movement of the linear guide while the cylindrical rotating tool runs by friction stirring while pressing the pressure plate via a bearing. Effect of the Invention

[0009] According to the method for consolidating copper cutting chips of the present disclosure, copper cutting chips can be consolidated while suppressing scattering of the copper cutting chips. [Brief description of the drawings]

[0010] [Figure 1] 1 is a flowchart and a schematic diagram showing an example of a method for consolidating copper cutting chips according to a first embodiment. [Diagram 2] 1 is a schematic diagram for explaining a method for consolidating copper cutting chips according to a first embodiment. [Diagram 3]FIG. 11 is a top view of a copper cutting chips integration device according to a second embodiment. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] FIG. 4 is a cross-sectional view taken along line VV in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] First embodiment Hereinafter, embodiments of the present disclosure will be described with reference to the drawings, in which: Fig. 1 is a flow chart and a schematic diagram showing an example of a method for consolidating copper cutting chips according to a first embodiment.

[0012] First, in step S11, copper cutting chips 101 are placed on a die having a recess while being scattered thereon, and then the process proceeds to step S12.

[0013] Next, in step S12, a rotatable cylindrical rotary tool 103 is pressed against the copper cutting chips placed in the recess of the die 102, and the cylindrical rotary tool 103 is rotated. This rotation heats the copper cutting chips 101 to a temperature equal to or higher than the softening point of copper. Then, together with this heating, the copper cutting chips 101 are stirred by the cylindrical rotary tool 103 in the recess of the die 102, and the copper cutting chips 101 are integrated.

[0014] In step S12, the pressing plate 104 connected to the cylindrical rotating tool 103 via an elastic body (not shown) elastically biases the copper cutting chips 101 by the elastic body while semi-closing the recess of the die 102. Therefore, even when the cylindrical rotating tool 103 is rotated, the copper cutting chips 101 are unlikely to scatter.

[0015] Then, proceed to step S13. In step S13, the integrated copper shavings 105 are removed from the die 102.

[0016] Next, friction stir welding will be described. Fig. 2 is a schematic diagram for explaining a method for integrating copper cutting chips according to the first embodiment. As shown in Fig. 2, friction stir welding (FSW) is a technique for integrating the workpiece 202 by pressing a rotating tool 201 against the workpiece 202, heating it to 200 to 300°C, which is the softening temperature of copper, with the generated frictional heat, and stirring it with the tool 201.

[0017] In the copper cutting chip integration method according to the first embodiment, the copper cutting chips are integrated by friction stir welding. The energy required for friction stir welding is smaller than the energy required for melting and refining the copper cutting chips. Therefore, the copper cutting chip integration method according to the first embodiment can integrate the copper cutting chips with smaller energy than the method for melting and refining the copper cutting chips.

[0018] As shown in Fig. 2, the workpiece 202 is formed in a rod shape. The arrow in Fig. 2 indicates the rotation direction of the tool 201. Heat generated when the tool 201 is pressed against the workpiece 202 and rotated occurs in a spot manner near the contact point between the tool 201 and the workpiece 202. Therefore, in order to heat the entire workpiece 202, the tool 201 rotates while moving linearly from one end of the workpiece 202 to the other end, for example.

[0019] The pressure plate 203 is a plate-like member connected to the tool 201 via an elastic body (not shown) or the like. A through hole is provided in the pressure plate 203. The tool 201 is connected to the pressure plate 203 with an end of the tool 201 inserted into the through hole provided in the pressure plate 203. The tool 201 rotates independently of the pressure plate 203. As shown in FIG. 2, the pressure plate 203 covers the workpiece 202 in the vicinity of the tip of the tool 201, so that scattering of copper cutting chips due to the rotation of the tool 201 can be suppressed.

[0020] In this manner, in the copper cutting chip consolidation method according to the first embodiment, the copper cutting chips can be consolidated while being prevented from scattering.

[0021] Embodiment 2 The second embodiment is a more specific embodiment. Fig. 3 is a top view of the copper cutting chip integrating device 300. The copper cutting chip integrating device 300 is a device for performing the copper cutting chip integrating method according to the second embodiment. Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 3. As shown in Fig. 4, the copper cutting chip integrating device 300 includes a cylindrical rotary tool 301, a pressing plate 302, a spring 303 (303a, 303b), a frame 304, a bearing 305, linear guides 306 (306a, 306b), dies 308 (308a, 308b), and an apparatus base 309.

[0022] The copper cutting chips integration device 300 is a device that places copper cutting chips 307 in a recess provided in a die 308 and integrates the placed copper cutting chips 307 by friction stir welding. As shown in FIG. 4, the die 308 is a combination of a pair of dies 308a and 308b, and is placed on an apparatus base 309. As shown in FIG. 3, the die 308 has an elongated recess 308c. The die 308a has a through hole with an elongated cross section, and the inner wall of the through hole forms the side wall of the recess 308c. The die 308b has a convex portion having a shape corresponding to the through hole of the die 308a, and the upper surface of the convex portion forms the bottom surface of the recess 308c.

[0023] The cylindrical rotating tool 301 is a member that frictionally stirs and welds the copper cutting chips 307 placed in the recess 308c. The cylindrical rotating tool 301 is supported by a frame 304 and a pressing plate 302. In the example shown in FIG. 4, the pressing plate 302 is connected to the frame 304 by two springs 303a and 303b. Hereinafter, the springs 303a and 303b may be collectively referred to as the spring 303. The number of springs that connect the pressing plate 302 to the frame 304 is not particularly limited. In addition, the member that connects the pressing plate 302 to the frame 304 may be an elastic body and is not limited to a spring. In this way, since the pressing plate 302 is connected to the cylindrical rotating tool 301 via the springs 303 and the frame 304, it moves along with the movement of the cylindrical rotating tool 301 when the cylindrical rotating tool 301 moves in the parallel direction.

[0024] Fig. 5 is a cross-sectional view taken along line VV in Fig. 3. As shown in Fig. 5, the pressing plate 302 may have a protrusion 302a protruding toward the bottom surface of the recess 308c on the surface that contacts the copper cutting chips 307. The protrusion 302a can enter the recess 308c and come into contact with the copper cutting chips 307. Therefore, by providing the protrusion 302a, it is possible to further suppress scattering of the copper cutting chips 307 when the cylindrical rotating tool 301 rotates.

[0025] 4, a bearing 305 is provided at a location where the cylindrical rotating tool 301 and the pressing plate 302 come into contact with each other. Therefore, even if the cylindrical rotating tool 301 rotates, the pressing plate 302 does not rotate.

[0026] The frame 304 is connected to an apparatus base 309 via linear guides 306a and 306b. Hereinafter, the linear guides 306a and 306b may be collectively referred to as linear guides 306. The linear guide 306 is a mechanism for linearly moving the cylindrical rotating tool 301 relative to the apparatus base 309. The arrow shown in FIG. 3 indicates the direction of movement of the cylindrical rotating tool 301 by the linear guide 306. As shown in FIG. 4, the linear guide 306 is connected to both ends of the frame 304. Here, the both ends of the frame 304 refer to both ends of the frame 304 in a direction perpendicular to the direction in which the recess 308c extends.

[0027] With the above-mentioned configuration, the copper cutting chips integrating device 300 can semi-close the recess 308c with the pressing plate 302 and elastically bias the copper cutting chips 307 with the spring 303. Therefore, the copper cutting chips can be integrated while preventing them from scattering.

[0028] The present invention is not limited to the above-described embodiment, and can be modified as appropriate without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0029] 101,105 Copper cutting waste 102 Die 103 Cylindrical Rotation Tool 104 Retaining plate 201 Tools 202 Work 203 Retaining plate 300 Copper cutting waste integration device 301 Cylindrical Rotation Tool 302 Retaining plate 302a Convex part 304 Frame 306(306a,306b) Linear guide 307 Copper cutting waste 308(308a,308b) Die 308c Recess 309 Equipment base

Claims

1. A step of placing the substrate on a die having a recess while scattering copper cutting chips; and an integration process in which a rotatable cylindrical rotary tool is pressed against the copper cutting chips placed in the recess of the die and the cylindrical rotary tool is rotated to heat the copper cutting chips to a temperature equal to or higher than the softening temperature of copper and stir the copper cutting chips in the recess of the die by the cylindrical rotary tool, thereby integrating the copper cutting chips. In the integration process, a pressing plate connected to the cylindrical rotating tool via an elastic body semi-closes the die while elastically biasing the copper cutting chips by the elastic body, according to the copper cutting chip integration method.

2. In the placing step, the copper cutting chips are placed on the die attached to an apparatus base while being scattered thereon; 2. The copper cutting chips integration method according to claim 1, wherein in the integration process, the cylindrical rotating tool connected to a frame body capable of linear movement relative to the device base by linear guides attached to both ends is pressed against the copper cutting chips, while the die is semi-closed and the copper cutting chips are elastically biased by the presser plate that axially supports the cylindrical rotating tool and is elastically biased from the frame body at both ends, and the cylindrical rotating tool runs by friction stirring while pressing the presser plate via a bearing while rotating in synchronization with the movement of the linear guide.

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