Substrate bonding apparatus

Abstract

To provide a substrate bonding apparatus which can efficiently carry substrates.SOLUTION: A substrate bonding apparatus 1 comprises: a plasma processing unit 2p; a load lock chamber 12 into which substrates W to be processed in the plasma processing unit 2p are carried; an unload lock chamber 14 into which the substrates W thus processed in the plasma processing unit 2p are carried; a second carrying chamber 13; a vacuum pump; a second carrier robot R2 which carries the substrates W from the load lock chamber 12 to the plasma processing unit 2p via the second carrying chamber 13, and which carries the substrates W from the plasma processing unit 2p to the unload lock chamber 14 via the second carrying chamber 13; a washing unit 2c which is disposed, in plan view, on the same side as the unload lock chamber 14 with respect to the second carrying chamber 13, and which washes the substrates W carried out of the unload lock chamber 14; and a bonding unit 2b which bonds together two substrates W thus washed in the washing unit 2c.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a substrate bonding apparatus for bonding two substrates, including, for example, semiconductor wafers, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (electroluminescence) displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells. [Background technology]

[0002] Patent Document 1 discloses a bonding system for bonding an upper wafer and a lower wafer. In the bonding system shown in FIG. 1 and FIG. 2 of Patent Document 1, the upper wafer is transported in the order of load lock chamber 31, surface modification device 33, load lock chamber 31, surface hydrophilization device 34, position adjustment device 51, substrate temperature adjustment device 42, and bonding device 41. The lower wafer is transported in the same manner as the upper wafer after the upper wafer is unloaded from load lock chamber 31. Paragraphs 0163 to 0168 of Patent Document 1 disclose that the upper wafer and the lower wafer are unloaded one by one from substrate temperature adjustment device 42, and the upper wafer and the lower wafer are loaded one by one into bonding device 41. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-10921 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the bonding system described in Patent Document 1, a substrate before plasma processing enters the load lock chamber 31, and a substrate after plasma processing leaves the load lock chamber 31. Therefore, there is room for improvement in terms of efficient transport of the substrate.

[0005] SUMMARY OF THE PRESENT EMBODIMENTS Accordingly, one object of the present invention is to provide a substrate bonding apparatus capable of efficiently transporting substrates. [Means for solving the problem]

[0006] an unload lock chamber into which the substrate to be processed in the plasma processing unit is carried; a vacuum transfer chamber through which the substrate transferred from the load lock chamber to the plasma processing unit and the substrate transferred from the plasma processing unit to the unload lock chamber pass; at least one vacuum pump which reduces air pressure in the load lock chamber, the vacuum transfer chamber, and the unload lock chamber; a vacuum transfer robot which transfers the substrate from the load lock chamber to the plasma processing unit via the vacuum transfer chamber and transfers the substrate from the plasma processing unit to the unload lock chamber via the vacuum transfer chamber; a cleaning unit which is disposed on the same side of the vacuum transfer chamber as the unload lock chamber in a plan view and which cleans the substrate carried out from the unload lock chamber; and a bonding unit which bonds the two substrates cleaned in the cleaning unit.

[0007] In the above embodiment, at least one of the following features may be added to the substrate bonding apparatus.

[0008] The cleaning unit is disposed on the opposite side of the unload lock chamber from the vacuum transfer chamber in a plan view.

[0009] The joining unit is disposed on the same side as the cleaning unit with respect to the unload lock chamber in a plan view.

[0010] The joining unit is disposed on the opposite side of the cleaning unit from the unload lock chamber in a plan view.

[0011] The multiple load ports hold the multiple carriers so that the multiple carriers are aligned in the left-right direction in a plan view, and the load lock chamber, vacuum transfer chamber, unload lock chamber, and cleaning unit are aligned from front to back in the following order from front to back: load lock chamber, vacuum transfer chamber, unload lock chamber, cleaning unit. [Brief description of the drawings]

[0012] [Figure 1] 3A and 3B are schematic diagrams showing an example of a first substrate and a second substrate before and after they are bonded together. [Diagram 2] 1A to 1C are process diagrams illustrating a substrate bonding method according to an embodiment of the present invention. [Diagram 3] 1 is a schematic plan view of a substrate bonding apparatus according to an embodiment of the present invention; [Figure 4A] FIG. 4 is a schematic diagram showing a portion of FIG. [Figure 4B] 4B is a schematic diagram showing a vertical cross section taken along line BB shown in FIG. 4A. [Figure 4C] 4B is a schematic diagram showing a vertical cross section taken along line CC shown in FIG. 4A. [Figure 5A] FIG. 4 is a schematic diagram showing a portion of FIG. [Figure 5B] 5B is a schematic diagram showing a vertical cross section taken along line BB shown in FIG. 5A. [Figure 6A] FIG. 4 is a schematic diagram showing a portion of FIG. [Figure 6B] FIG. 6B is a schematic diagram showing a vertical cross section taken along line BB shown in FIG. 6A. [Figure 6C] FIG. 6B is a schematic diagram showing a vertical cross section taken along line CC shown in FIG. 6A. [Figure 7A] FIG. 4 is a schematic diagram showing a portion of FIG. [Figure 7B] FIG. 7B is a schematic diagram showing a vertical cross section taken along line BB shown in FIG. 7A. [Figure 8A] 13 is a schematic plan view showing a state in which the third transport robot is placed at a multi-access position. FIG. [Figure 8B]13 is a schematic plan view showing a state in which the third transport robot is placed at a multi-access position. FIG. [Figure 9A] 5A to 5C are process diagrams for explaining an example of the operation of the substrate bonding apparatus. [Figure 9B] 5A to 5C are process diagrams for explaining an example of the operation of the substrate bonding apparatus. [Figure 10] 4 is a time chart showing an example of a period during which plasma processing is performed on a first substrate and a second substrate. [Figure 11] 4 is a time chart showing an example of a period during which the first substrate and the second substrate are cleaned. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0014] Fig. 1 is a schematic diagram showing an example of a first substrate W1 and a second substrate W2 before and after bonding. Fig. 2 is a process diagram for explaining a substrate bonding method according to an embodiment of the present invention.

[0015] In the following description, the first substrate W1 and the second substrate W2 represent the two substrates W to be bonded. The third substrate W3 represents the bonded first substrate W1 and second substrate W2. When it does not matter whether it is the first substrate W1, the second substrate W2, or the third substrate W3, it is simply referred to as the substrate W.

[0016] As shown in FIG. 1, the first substrate W1 and the second substrate W2 are flat disks with the same diameter. The diameters of the first substrate W1 and the second substrate W2 may be 300 mm or other. The thermal expansion coefficient of the first substrate W1 may be equal to or different from the thermal expansion coefficient of the second substrate W2. The first substrate W1 includes a disk-shaped substrate WD1, and the second substrate W2 includes a disk-shaped substrate WD2. The substrates WD1 and WD2 are made of a semiconductor such as a single crystal of silicon. The substrates WD1 and WD2 may be made of a material other than a semiconductor.

[0017] Both the substrate WD1 and the substrate WD2 include a circular front surface and a rear surface that are parallel to each other, and an annular end surface that connects the outer edges of the front surface and the rear surface. The front surface and the rear surface of the substrate WD1 are flat surfaces that are parallel to each other. The front surface and the rear surface of the substrate WD2 are similar. The front surfaces of the substrate WD1 and the substrate WD2 are device formation surfaces on which devices such as transistors are formed. The rear surfaces of the substrate WD1 and the substrate WD2 are non-device formation surfaces on which devices are not formed. Both the front surface and the rear surface of the substrate WD1 or the substrate WD2 may be device formation surfaces.

[0018] The outer periphery of the substrate WD1 forms a V-shaped notch that opens at the end face of the substrate WD1 when the substrate WD1 is viewed in a direction perpendicular to the surface of the substrate WD1. The outer periphery of the substrate WD1 may form an orientation flat (so-called orientation flat) instead of a notch. The notch and orientation flat indicate the crystal orientation of the substrate WD1 or the substrate WD2. The first substrate W1 is positioned in the circumferential direction of the first substrate W1 based on the notch or orientation flat of the first substrate W1. The same applies to the second substrate W2.

[0019] The first substrate W1 includes a device layer WC1 covering the surface of the base material WD1 and a bonding layer WB1 covering the surface of the device layer WC1. The second substrate W2 includes a device layer WC2 covering the surface of the base material WD2 and a bonding layer WB2 covering the surface of the device layer WC2. Devices such as transistors are disposed in the device layer WC1 and the device layer WC2. The devices are covered by the bonding layer WB1 and the bonding layer WB2. The bonding layer WB1 and the bonding layer WB2 are transparent or semi-transparent insulating layers. The bonding layer WB1 and the bonding layer WB2 may be silicon oxide films or thin films of materials other than silicon oxide. In the former case, the bonding layer WB1 and the bonding layer WB2 may be silicon oxide films made using TEOS (tetraethoxysilane).

[0020] The bonding surface WA1 of the first substrate W1 is the surface of the first substrate W1 that is in contact with the atmosphere in the space in which the first substrate W1 is placed. When the bonding surface WA1 of the first substrate W1 is facing upward, the bonding surface WA1 of the first substrate W1 corresponds to the upper surface of the first substrate W1, and the back surface of the first substrate W1 corresponds to the lower surface of the first substrate W1. The surface of the bonding layer WB1 corresponds to the bonding surface WA1 of the first substrate W1. The bonding surface WA1 may be a circular plane that covers the entire surface of the base material WD1 and is parallel to the surface of the base material WD1, or may be a plane that covers only a part of the surface of the base material WD1 and is parallel to the surface of the base material WD1. The same applies to the second substrate W2.

[0021] 2 shows an example of a process for bonding the first substrate W1 and the second substrate W2. When bonding the first substrate W1 and the second substrate W2, an activation process (step S1 in FIG. 2) is performed to activate the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2, and a cleaning process (step S2 in FIG. 2) is performed to clean and dry the two activated substrates W. Then, an inversion process (step S3 in FIG. 2) is performed to invert one of the first substrate W1 and the second substrate W2.

[0022] After one of the first substrate W1 and the second substrate W2 is inverted, an alignment confirmation process (step S4 in FIG. 2) is performed to confirm the alignment representing the relative position and angle of the first substrate W1 and the second substrate W2, an alignment adjustment process (step S5 in FIG. 2) is performed to adjust the alignment of the first substrate W1 and the second substrate W2 based on the confirmed alignment, and a substrate contact process (step S6 in FIG. 2) is performed to bond the first substrate W1 and the second substrate W2 by contacting the first substrate W1 and the second substrate W2 whose alignment has been adjusted. Then, an inspection process (step S7 in FIG. 2) is performed to inspect the bonding accuracy of the first substrate W1 and the second substrate W2, that is, the amount of misalignment of the positions of the two bonded substrates W and the amount of misalignment of the angles of the two bonded substrates W (angles around the center of the substrates W).

[0023] The activation step may be a plasma treatment in which plasma such as oxygen plasma is irradiated onto the bonding surfaces WA1 and WA2 of the substrate W. In this case, moisture in the air or moisture supplied to the substrate W in the cleaning step comes into contact with the bonding surfaces WA1 and WA2 of the substrate W irradiated with the plasma, and hydrophilic groups such as hydroxyl groups (OH groups) are formed on the bonding surfaces WA1 and WA2 of the substrate W. The plasma treatment is an example of surface modification that modifies the surface of the substrate W. The activation step may be a wet treatment in which a hydrophilizing liquid that forms hydrophilic groups on the bonding surfaces WA1 and WA2 of the substrate W is supplied to the bonding surfaces WA1 and WA2 of the substrate W.

[0024] The substrate contacting step may be a step of directly bonding two substrates W in the atmosphere at room temperature (e.g., 20 to 30° C.). The substrate contacting step may be a step of performing face-to-face bonding in which the two substrates W are bonded so that their surfaces face each other. In this case, the surfaces of the two substrates W correspond to the bonding surface WA1 and the bonding surface WA2 of the two substrates W. The substrate contacting step may be a step of bonding two substrates W without pressing one of the two substrates W against the other of the two substrates W, or by pressing one of the two substrates W against the other of the two substrates W with a pressure that does not damage devices formed on the two substrates W.

[0025] The lower side of Fig. 1 shows a cross section of the first substrate W1 and the second substrate W2 cut along a plane perpendicular to the first substrate W1 and the second substrate W2. The ratio of the thickness of the device layer WC1 and the device layer WC2 to the thickness of the bonding layer WB1 and the bonding layer WB2 shown in Fig. 1 is not necessarily the same as the actual ratio. The left side of Fig. 1 shows an example in which a hydroxyl group, which is an example of a hydrophilic group, is formed on the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2 before bonding. In this example, an oxygen atom (O) in the hydroxyl group is bonded to a silicon atom (Si) in the bonding layer WB1 and the bonding layer WB2.

[0026] Before bonding, the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2 are terminated with multiple hydroxyl groups. When the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2 are brought into contact with each other, the first substrate W1 and the second substrate W2 are bonded together by the intermolecular force acting between the two hydroxyl groups. In some cases, water molecules are released from the two hydroxyl groups, and silicon atoms in the bonding layer WB1 of the first substrate W1 and silicon atoms in the bonding layer WB2 of the second substrate W2 are bonded together via oxygen atoms. In this way, the first substrate W1 and the second substrate W2 are bonded together.

[0027] In the following, the substrate bonding apparatus 1 that bonds two substrates W as described above will be described.

[0028] 3 is a schematic plan view of a substrate bonding apparatus 1 according to an embodiment of the present invention. In the following description, the up-down direction, the left-right direction LR, and the front-rear direction FB refer to the up-down direction, the left-right direction LR, and the front-rear direction FB of the substrate bonding apparatus 1, unless otherwise specified. The up-down direction is the vertical direction. The left-right direction LR and the front-rear direction FB are two horizontal directions that are perpendicular to each other. The left-right direction LR is the arrangement direction of multiple carriers CA held by multiple load ports LP. Each carrier CA is held by the load port LP with the opening of the carrier CA (see FIG. 4C) facing backward.

[0029] The substrate bonding apparatus 1 is an apparatus for bonding two disk-shaped substrates W. The substrate bonding apparatus 1 includes a plurality of load ports LP on which a plurality of carriers CA, each of which accommodates a plurality of substrates W such as a FOUP (Front-Opening Unified Pod), are placed, a plurality of processing units for processing the substrates W transported from the plurality of load ports LP, a transport system TS for transporting the substrates W between the plurality of load ports LP and the plurality of processing units, and an outer wall 1a forming an enclosed space accommodating the plurality of processing units and the transport system TS.

[0030] FIG. 3 shows an example in which six load ports LP are provided. The number of load ports LP may be other than six, as long as it is three or more. The multiple load ports LP include a first load port LP on which a carrier CA accommodating a first substrate W1 is placed, a second load port LP on which a carrier CA accommodating a second substrate W2 is placed, and a third load port LP on which a carrier CA accommodating a third substrate W3 representing the bonded first substrate W1 and second substrate W2 is placed. The first load port LP and the second load port LP are loading ports on which a carrier CA accommodating a substrate W to be bonded in the substrate bonding apparatus 1 is placed. The third load port LP is an unloading port on which a carrier CA accommodating two substrates W bonded in the substrate bonding apparatus 1 is placed.

[0031] The multiple processing units are units that cause at least one of a physical change and a chemical change to at least one of the front and rear surfaces of the substrate W. The multiple processing units include at least one plasma processing unit 2p that performs plasma processing to activate the front or rear surface of the substrate W by contacting the front or rear surface of the substrate W with plasma, at least a cleaning unit 2c that cleans the substrate W by supplying a cleaning liquid to the substrate W, and at least one bonding unit 2b that bonds the two substrates W by contacting the two substrates W. FIG. 3 shows an example in which two plasma processing units 2p, two cleaning units 2c, and two bonding units 2b are provided. In this example, two cleaning units 2c are stacked one above the other. The multiple processing units may further include a heating unit that heats the two substrates W bonded by the bonding unit 2b to increase the bonding strength of the two substrates W.

[0032] The transfer system TS is a system that transfers the substrate W while maintaining the substrate W horizontal. The transfer system TS includes a first transfer robot R1 that transfers the substrate W between the multiple load ports LP and at least one plasma processing unit 2p, and a second transfer robot R2 that transfers the substrate W to and from the at least one plasma processing unit 2p. The transfer system TS further includes a third transfer robot R3 that transfers the substrate W between the at least one plasma processing unit 2p and at least the cleaning unit 2c, and a fourth transfer robot R4 that transfers the substrate W to and from the at least one bonding unit 2b.

[0033] The substrate bonding apparatus 1 includes a first transfer chamber 10 that houses a first transfer robot R1, a second transfer chamber 13 that houses a second transfer robot R2, a third transfer chamber 16 that houses a third transfer robot R3, and a fourth transfer chamber 19 that houses a fourth transfer robot R4. FIG. 3 shows an example in which the first transfer robot R1, the third transfer robot R3, and the fourth transfer robot R4 are each a traveling robot that travels horizontally, and the second transfer robot R2 is a fixed robot that does not travel horizontally. In this example, the first transfer robot R1 and the fourth transfer robot R4 travel in the left-right direction LR in the first transfer chamber 10 and the fourth transfer chamber 19, and the third transfer robot R3 travels in the front-back direction FB in the third transfer chamber 16.

[0034] The substrate bonding apparatus 1 includes a control device 3 that controls the electric and electronic devices provided in the substrate bonding apparatus 1. The control device 3 includes at least one computer. The computer includes a memory 3m that stores information such as programs, and a CPU 3c (central processing unit) that controls the substrate bonding apparatus 1 in accordance with the programs stored in the memory 3m. The control device 3 controls the substrate bonding apparatus 1 to transport and process the substrate W as described below. In other words, the control device 3 is programmed to transport and process the substrate W as described below.

[0035] Next, the first transport robot R1 and the related configuration will be described.

[0036] Fig. 4A is a schematic diagram showing a part of Fig. 3. Fig. 4B is a schematic diagram showing a vertical cross section along line BB shown in Fig. 4A. Fig. 4C is a schematic diagram showing a vertical cross section along line CC shown in Fig. 4A. As shown in Fig. 4B, the substrate bonding apparatus 1 includes at least one pre-activation aligner 11 that positions one substrate W based on a notch or an orientation flat, and a load lock chamber 12 that accommodates the substrate W unloaded from the at least one pre-activation aligner 11.

[0037] 4B shows an example in which two pre-activation aligners 11 are provided. In this example, the two pre-activation aligners 11 are stacked vertically, and the load lock chamber 12 is disposed below the two pre-activation aligners 11. The load lock chamber 12 may be disposed above the two pre-activation aligners 11, or may be disposed between the two pre-activation aligners 11. The load lock chamber 12 does not have to overlap the two pre-activation aligners 11 in a plan view. The two pre-activation aligners 11 do not have to overlap each other in a plan view.

[0038] The pre-activation aligner 11 includes a plurality of partition plates 5 that form an internal space in which the substrate W is placed and a passage opening 4 through which the substrate W passes to enter and exit the internal space, and a chuck 8a that holds the substrate W horizontally in the internal space. The plurality of partition plates 5 include a fixed partition plate 6 that forms the internal space and the passage opening 4, and a door 7 that opens and closes the passage opening 4 by moving relative to the fixed partition plate 6. A part of the outer wall 1a (see FIG. 4A) of the substrate bonding apparatus 1 may be included in the plurality of partition plates 5. The passage opening 4 corresponds to a passage that connects the space outside the pre-activation aligner 11 to the space inside the pre-activation aligner 11. The passage opening 4 includes a space through which the substrate W passes and an inner peripheral surface that surrounds the entire periphery of this space. This is the same for the passage opening 4a and the passage opening 4b and other passage openings 4 described later.

[0039] The pre-activation aligner 11 further includes an electric motor 9 that rotates the chuck 8a to rotate the substrate W around a vertical center of rotation passing through the center of the substrate W held by the chuck 8a, an edge sensor 11s that identifies the orientation of the notch or orientation flat by detecting the outer peripheral shape of the substrate W, and a control device (not shown) that stops the substrate W at a position where the orientation of the notch or orientation flat matches a reference direction by causing the electric motor 9 to rotate the chuck 8a based on the detection value of the edge sensor 11s.

[0040] The chuck 8a may be a mechanical chuck that holds the substrate W horizontally by pressing a plurality of chuck pins horizontally against the edge surface of the substrate W, or may be a vacuum chuck that holds the substrate W horizontally by adsorbing the lower surface of the substrate W to the upper surface of a spin base arranged below the substrate W. In the latter case, the edge sensor 11s may identify the position of the center of the substrate W by detecting the outer circumferential shape of the substrate W. In this case, the pre-activation aligner 11 may further include a centering actuator that moves the chuck 8a horizontally to bring the center of the substrate W closer to the center of rotation of the substrate W. The contents of this paragraph also apply to the pre-bonding aligner 20 described later.

[0041] An actuator is a device that converts driving energy, which may be electrical, fluid, magnetic, thermal, or chemical energy, into mechanical work. Actuators include electric motors (rotary motors), linear motors, air cylinders, and other devices. When the motion of the actuator is different from the motion of the object, a motion converter may be provided to convert the motion of the actuator into linear motion or rotation. For example, when the actuator is an electric motor and moves the object in a linear motion, the rotation of the electric motor may be converted into linear motion by a motion converter such as a ball screw and ball nut.

[0042] The load lock chamber 12 includes a plurality of partition plates 5 that form an internal space in which the substrate W is placed and a passage port 4a and a passage port 4b through which the substrate W passes entering and exiting the internal space, and a vacuum pump P that reduces the air pressure in the internal space. The plurality of partition plates 5 include a fixed partition plate 6 that forms an internal space and the passage port 4a and a passage port 4b, an inlet side gate valve 7A that opens and closes the passage port 4a by moving relative to the fixed partition plate 6, and an outlet side gate valve 7B that opens and closes the passage port 4b by moving relative to the fixed partition plate 6. The inlet side gate valve 7A and the outlet side gate valve 7B correspond to doors that open and close the passage port 4a and the passage port 4b. The passage port 4a and the passage port 4b of the load lock chamber 12 are arranged at the same height.

[0043] The load lock chamber 12 includes a plurality of supports 8b that horizontally support the substrates W in the load lock chamber 12 so that the substrates W are arranged in parallel with a gap therebetween. FIG. 4B shows an example in which two supports 8b are provided. The supports 8b may be a plurality of pins that contact the lower surface of the substrate W, or a pair of rails that are parallel to each other and in contact with the lower surface of the substrate W. FIG. 4B shows an example of the former. As long as the first transport robot R1 can transfer the substrate W to and from the supports 8b without contacting the supports 8b, the supports 8b may be something other than the plurality of pins and the pair of rails.

[0044] As shown in FIG. 4C, the substrate bonding apparatus 1 includes a post-bonding relay stand 22 that supports two bonded substrates W. The post-bonding relay stand 22 includes a plurality of partition plates 5 that form an internal space in which the substrates W are placed and a passage opening 4a and a passage opening 4b through which the substrates W pass entering and exiting the internal space, and at least one support portion 8b that horizontally supports the substrate W in the internal space. The plurality of partition plates 5 includes a fixed partition plate 6 that forms the passage opening 4a and the passage opening 4b. The passage opening 4a and the passage opening 4b of the post-bonding relay stand 22 may be always open or may be opened and closed. In the latter case, the plurality of partition plates 5 may include a door 7a that moves relative to the fixed partition plate 6 to open and close the passage opening 4a, and a door 7b that moves relative to the fixed partition plate 6 to open and close the passage opening 4b.

[0045] The first transport robot R1 includes at least one first hand H1 that horizontally supports the substrate W, and a first body B1 that supports all of the first hands H1. FIGS. 4A to 4C show an example in which four first hands H1 are provided, and each first hand H1 is provided with a multi-joint arm that can be bent and extended horizontally. The number of first hands H1 provided in the first transport robot R1 may be any one of 1 to 3. When two or more first hands H1 are provided, two first hands H1 may be attached to one multi-joint arm. This is also true for transport robots other than the first transport robot R1.

[0046] The first hand H1 may be a grip type, vacuum type, electrostatic type, or Bernoulli type hand, or may be a hand of other types. The first hand H1 is disposed above the first body B1. The first hand H1 rotates together with the first body B1 around the rotation center C1 of the first transport robot R1. The rotation center C1 of the first transport robot R1 is a vertical line passing through the first body B1. The contents of this paragraph also apply to transport robots other than the first transport robot R1, such as the second transport robot R2.

[0047] As shown in Fig. 4B, the first transport robot R1 includes a rotation actuator AR that rotates the first body B1 around a rotation center C1 that represents a vertical line, a horizontal actuator AH that changes the horizontal distance from the rotation center C1 to the first hand H1 by moving the first hand H1 horizontally, and a vertical actuator AV that moves the first hand H1 vertically. The first transport robot R1 further includes a travel actuator AT that moves all of the first hands H1 horizontally in a first travel direction by moving the first body B1 horizontally in the first horizontal travel direction. In the example shown in Fig. 4A, the first travel direction is the left-right direction LR.

[0048] As shown in FIG. 4C, the opening of the carrier CA faces the first transfer chamber 10. As shown in FIG. 4B and FIG. 4C, the passage openings 4 of the two pre-activation aligners 11, the passage opening 4a of the load lock chamber 12, and the passage opening 4b of the post-bonding relay stage 22 face the first transfer chamber 10. The passage opening 4b of the load lock chamber 12 and the passage opening 4a of the post-bonding relay stage 22 face the opposite side to the first transfer chamber 10. The opening of the carrier CA faces backward. The passage opening 4 of the pre-activation aligner 11, the passage opening 4a of the load lock chamber 12, and the passage opening 4b of the post-bonding relay stage 22 face forward. The passage opening 4b of the load lock chamber 12 and the passage opening 4a of the post-bonding relay stage 22 face backward.

[0049] The first transport robot R1 performs at least one of changing the orientation of the first hand H1 (rotating the first hand H1 around the rotation center C1), moving the first hand H1 in the vertical direction, and traveling in the first traveling direction. As a result, the first transport robot R1 makes the first hand H1 horizontally face any of the carriers CA. Similarly, the first transport robot R1 makes the first hand H1 horizontally face any of the pre-activation aligner 11, the load lock chamber 12, and the post-bonding relay stand 22 by performing at least one of changing the orientation of the first hand H1.

[0050] The first transport robot R1 moves the first hand H1 in and out of the carrier CA through an opening of the carrier CA. The first transport robot R1 moves the first hand H1 in and out of the pre-activation aligner 11 through the passage opening 4 of the pre-activation aligner 11. The first transport robot R1 moves the first hand H1 in and out of the load lock chamber 12 through the passage opening 4a of the load lock chamber 12. The first transport robot R1 moves the first hand H1 in and out of the post-bonding relay stage 22 through the passage opening 4b of the post-bonding relay stage 22.

[0051] The first transport robot R1 can carry the substrate W into and out of the carrier CA on any of the load ports LP. The first transport robot R1 can carry the substrate W into and out of any of the pre-activation aligners 11. The first transport robot R1 can carry the substrate W into and out of the load lock chamber 12, and can carry the substrate W into and out of the post-bonding staging stage 22. The first transport robot R1 can carry the substrate W into and out of the carrier CA, the pre-activation aligner 11, the load lock chamber 12, and the post-bonding staging stage 22 using any of the first hands H1.

[0052] The first transport robot R1 can exchange the substrate W with each of the carrier CA, the pre-activation aligner 11, the load lock chamber 12, and the post-bonding relay stage 22 by carrying in and out the substrate W. When the first transport robot R1 exchanges the substrate W with the pre-activation aligner 11, the first transport robot R1 carries out the substrate W from the pre-activation aligner 11 using the first hand H1. After carrying out the substrate W from the pre-activation aligner 11, the first transport robot R1 carries the substrate W supported by another first hand H1 into the pre-activation aligner 11. This allows the substrate W to be exchanged between the pre-activation aligner 11 and the first transport robot R1.

[0053] Next, the second transport robot R2 and the related configuration will be described.

[0054] Fig. 5A is a schematic diagram showing a part of Fig. 3. Fig. 5B is a schematic diagram showing a vertical cross section along line BB shown in Fig. 5A. The substrate bonding apparatus 1 includes at least one plasma processing unit 2p that performs plasma processing on the substrate W unloaded from the load lock chamber 12. Fig. 5A shows an example in which two plasma processing units 2p are provided.

[0055] 5B, the plasma processing unit 2p includes a plurality of partition plates 5 forming an internal space in which the substrate W is placed and a passage opening 4 through which the substrate W passes entering and exiting the internal space, a lower electrode 15L supporting the substrate W horizontally in the internal space, an upper electrode 15u disposed above the substrate W held by the lower electrode 15L, a gas pipe 15p supplying a processing gas between the upper electrode 15u and the lower electrode 15L, a gas valve 15v opening and closing the gas pipe 15p, a power source 15s changing the processing gas between the upper electrode 15u and the lower electrode 15L into plasma, and a vacuum pump P discharging gas from the internal space. The plurality of partition plates 5 include a fixed partition plate 6 forming the internal space and the passage opening 4, and a door 7 moving relative to the fixed partition plate 6 to open and close the passage opening 4.

[0056] Although not shown, the gas valve 15v includes a valve body provided with an annular valve seat through which gas passes, a valve element movable relative to the valve seat, and an actuator that moves the valve element between a closed position in which the valve element contacts the valve seat and an open position in which the valve element is separated from the valve seat. The actuator may be a pneumatic actuator, an electric actuator, or another actuator. The control device 3 (see FIG. 3) opens and closes the gas valve 15v by controlling the actuator.

[0057] The substrate bonding apparatus 1 includes an unload lock chamber 14 that accommodates the substrate W unloaded from the plasma processing unit 2p. The unload lock chamber 14 includes the same configuration as the load lock chamber 12. Thus, the unload lock chamber 14 includes a plurality of partition plates 5 that form an internal space, a passage port 4a, and a passage port 4b, a plurality of support parts 8b, and a vacuum pump P. The plurality of partition plates 5 include a fixed partition plate 6, an inlet side gate valve 7A, and an outlet side gate valve 7B. The load lock chamber 12, the plasma processing unit 2p, and the unload lock chamber 14 are connected to a second transfer chamber 13 in which a second transfer robot R2 is disposed. The load lock chamber 12, the plasma processing unit 2p, and the unload lock chamber 14 are disposed within a range in which the second transfer robot R2 can transfer the substrate W.

[0058] The second transport robot R2 includes at least one second hand H2 that horizontally supports the substrate W, and a second body B2 that supports all of the second hands H2. Figures 5A and 5B show an example in which two second hands H2 are provided, and each second hand H2 is provided with a multi-joint arm that can bend and extend horizontally.

[0059] The second transfer robot R2 includes a rotation actuator AR that rotates the second hand H2 around a rotation center C2 that represents a vertical line, a horizontal actuator AH that changes the horizontal distance from the rotation center C2 to the second hand H2 by moving the second hand H2 horizontally, and a vertical actuator AV that moves the second hand H2 vertically. As described above, the second transfer robot R2 is a fixed robot that does not move horizontally. The second body B2 can rotate and move up and down relative to the floor surface F1 of the substrate bonding apparatus 1, but does not move horizontally.

[0060] As shown in FIG. 5A, the second transfer chamber 13 is disposed between the load lock chamber 12 and the unload lock chamber 14 in the front-rear direction FB. The passage port 4b of the load lock chamber 12 and the passage port 4a of the unload lock chamber 14 are directed toward the second transfer chamber 13. The passage port 4 of the plasma processing unit 2p, which will be described later, is also directed toward the second transfer chamber 13. The passage port 4b of the load lock chamber 12 is directed toward the rear. The passage port 4a of the unload lock chamber 14 is directed toward the front. The passage port 4b of the unload lock chamber 14 is directed toward the third transfer chamber 16. The passage port 4b of the unload lock chamber 14 is directed toward the side. FIG. 5A shows an example in which the passage port 4b of the unload lock chamber 14 is directed to the right.

[0061] The second transfer robot R2 performs at least one of changing the orientation of the second hand H2 (rotating the second hand H2 around the rotation center C2) and moving the second hand H2 in the vertical direction. As a result, the second transfer robot R2 causes the second hand H2 to face horizontally to any one of the load lock chamber 12, the plasma processing unit 2p, and the unload lock chamber 14. The second transfer robot R2 moves the second hand H2 in and out of the load lock chamber 12 through the passage 4b ​​of the load lock chamber 12. The second transfer robot R2 moves the second hand H2 in and out of the plasma processing unit 2p through the passage 4 of the plasma processing unit 2p. The second transfer robot R2 moves the second hand H2 in and out of the load lock chamber 12 through the passage 4a of the unload lock chamber 14.

[0062] The second transport robot R2 can carry the substrate W into and out of any of the load lock chamber 12, the plasma processing unit 2p, and the unload lock chamber 14. The second transport robot R2 can carry the substrate W into and out of the load lock chamber 12, the plasma processing unit 2p, and the unload lock chamber 14 using any of the second hands H2. The second transport robot R2 can exchange the substrate W with each of the load lock chamber 12, the plasma processing unit 2p, and the unload lock chamber 14 by carrying the substrate W into and out of the load lock chamber 12, the plasma processing unit 2p, and the unload lock chamber 14.

[0063] When the exit gate valve 7B of the load lock chamber 12 is closed, the internal space of the second transfer chamber 13 is isolated from the internal space of the load lock chamber 12 by the exit gate valve 7B of the load lock chamber 12, and neither the substrate W nor gas can move between the internal space of the load lock chamber 12 and the internal space of the second transfer chamber 13. Similarly, when the entrance gate valve 7A of the unload lock chamber 14 is closed, the internal space of the second transfer chamber 13 is isolated from the internal space of the unload lock chamber 14 by the entrance gate valve 7A of the unload lock chamber 14, and neither the substrate W nor gas can move between the internal space of the unload lock chamber 14 and the internal space of the second transfer chamber 13.

[0064] The air pressure in the second transfer chamber 13 is maintained at a low pressure lower than the air pressure in the clean room (hereinafter also referred to as normal pressure) by a vacuum pump P (see FIG. 5B). The air pressure in the plasma processing unit 2p is also maintained at a low pressure. The second transfer chamber 13 is a vacuum transfer chamber in which the air pressure is maintained at a low pressure. The air pressure in the load lock chamber 12 changes between normal pressure and low pressure. Similarly, the air pressure in the unload lock chamber 14 changes between normal pressure and low pressure. The second transfer robot R2 transfers the substrate W between the load lock chamber 12 and the second transfer chamber 13 when the air pressure in the load lock chamber 12 is low pressure, and transfers the substrate W between the unload lock chamber 14 and the second transfer chamber 13 when the air pressure in the unload lock chamber 14 is low pressure. The second transfer robot R2 is a vacuum transfer robot that transfers the substrate W in a reduced pressure atmosphere lower than the air pressure in the clean room.

[0065] When the substrate W is transferred from the first transfer chamber 10 to the load lock chamber 12, the entrance gate valve 7A of the load lock chamber 12 is opened while the exit gate valve 7B of the load lock chamber 12 is closed. When the substrate W is transferred from the first transfer chamber 10 to the load lock chamber 12, the entrance gate valve 7A of the load lock chamber 12 is closed. Then, while the entrance gate valve 7A and the exit gate valve 7B of the load lock chamber 12 are closed, the vacuum pump P of the load lock chamber 12 reduces the air pressure in the load lock chamber 12 to a low pressure. Then, while the entrance gate valve 7A of the load lock chamber 12 is closed, the exit gate valve 7B of the load lock chamber 12 is opened. In this state, the second transfer robot R2 transfers the substrate W from the load lock chamber 12 to the second transfer chamber 13.

[0066] When the substrate W is transferred from the second transfer chamber 13 to the unload lock chamber 14, the entrance gate valve 7A and the exit gate valve 7B of the unload lock chamber 14 are closed, and the vacuum pump P of the unload lock chamber 14 reduces the air pressure in the unload lock chamber 14 to a low pressure. Thereafter, the entrance gate valve 7A of the unload lock chamber 14 is opened, and the second transfer robot R2 transfers the substrate W from the second transfer chamber 13 to the unload lock chamber 14, with the exit gate valve 7B of the unload lock chamber 14 closed. When the substrate W is transferred from the unload lock chamber 14 to the third transfer chamber 16, the entrance gate valve 7A of the unload lock chamber 14 is closed, and the exit gate valve 7B of the unload lock chamber 14 is opened. In this state, the third transfer robot R3 transfers the substrate W from the unload lock chamber 14 to the third transfer chamber 16.

[0067] Next, the third transport robot R3 and the related configuration will be described.

[0068] FIG. 6A is a schematic diagram showing a part of FIG. 3. FIG. 6B is a schematic diagram showing a vertical cross section along line BB shown in FIG. 6A. FIG. 6C is a schematic diagram showing a vertical cross section along line CC shown in FIG. 6A. The substrate bonding apparatus 1 is provided with at least one cleaning unit 2c that cleans the substrate W by supplying a cleaning liquid to the substrate W that has been subjected to plasma processing. FIG. 6B shows an example in which two cleaning units 2c are provided. In this example, the two cleaning units 2c are stacked vertically.

[0069] 6A, the cleaning unit 2c includes a plurality of partition plates 5 forming an internal space in which the substrate W is placed and a passage port 4 through which the substrate W passes entering and exiting the internal space, a chuck 8a for horizontally holding the substrate W, an electric motor 9 for rotating the chuck 8a to rotate the substrate W about a vertical rotation center passing through the center of the substrate W held by the chuck 8a, and one or more processing liquid nozzles 17 for ejecting a processing liquid such as a cleaning liquid toward the substrate W held by the chuck 8a. The plurality of partition plates 5 include a fixed partition plate 6 forming an internal space and the passage port 4, and a door 7 for opening and closing the passage port 4 by moving relative to the fixed partition plate 6. The cleaning liquid may be pure water (deionized water (DIW)) or a liquid other than pure water.

[0070] As shown in Fig. 6C, the substrate bonding apparatus 1 includes at least one post-cleaning staging stand 18 that supports the substrate W cleaned in the cleaning unit 2c. Fig. 6C shows an example in which three post-cleaning staging stands 18 are provided, stacked vertically. One post-cleaning staging stand 18 is a first post-bonding staging stand 18a that relays two substrates W after bonding. The remaining two post-cleaning staging stands 18 are pre-bonding staging stands 18b that relay substrates W before bonding. The above-mentioned post-bonding staging stand 22 is a second post-bonding staging stand that relays the substrate W carried out from the first post-bonding staging stand 18a.

[0071] In the example shown in Fig. 6C, the first post-bonding relay stand 18a is disposed above the two pre-bonding relay stands 18b. The first post-bonding relay stand 18a may be disposed below the two pre-bonding relay stands 18b, or may be disposed between the two pre-bonding relay stands 18b. The first post-bonding relay stand 18a may be disposed at a position that does not overlap the pre-bonding relay stand 18b in a plan view. Similarly, the two pre-bonding relay stands 18b may be disposed at positions that do not overlap each other in a plan view. The number of pre-bonding relay stands 18b may be one.

[0072] The post-cleaning relay stand 18 includes a plurality of partition plates 5 that form an internal space in which the substrate W is placed and a passage opening 4a and a passage opening 4b through which the substrate W passes entering and exiting the internal space, and at least one support portion 8b that horizontally supports the substrate W within the internal space. The plurality of partition plates 5 includes a fixed partition plate 6 that forms the passage opening 4a and the passage opening 4b. The passage opening 4a and the passage opening 4b of the post-cleaning relay stand 18 may be always open or may be opened and closed. In the latter case, the plurality of partition plates 5 may include a door 7a that moves relative to the fixed partition plate 6 to open and close the passage opening 4a, and a door 7b that moves relative to the fixed partition plate 6 to open and close the passage opening 4b.

[0073] The passage opening 4a of the post-cleaning relay platform 18 faces the third transport chamber 16. The passage opening 4b of the post-cleaning relay platform 18 faces the fourth transport chamber 19. The passage opening 4a of the post-cleaning relay platform 18 faces forward. The passage opening 4b of the post-cleaning relay platform 18 faces to the side. FIG. 6A shows an example in which the passage opening 4b of the post-cleaning relay platform 18 faces to the left. As described above, the passage opening 4b of the unload lock chamber 14 faces to the right. Therefore, the passage opening 4b of the post-cleaning relay platform 18 faces the opposite side to the passage opening 4b of the unload lock chamber 14 in the left-right direction LR.

[0074] The substrate W unloaded from the cleaning unit 2c is loaded into the post-cleaning relay stand 18 through the passage 4a of the post-cleaning relay stand 18, and is unloaded from the post-cleaning relay stand 18 through the passage 4b ​​of the post-cleaning relay stand 18. The two substrates W bonded by the bonding unit 2b are loaded into the post-cleaning relay stand 18 through the passage 4b ​​of the post-cleaning relay stand 18, and are unloaded from the post-cleaning relay stand 18 through the passage 4a of the post-cleaning relay stand 18. Therefore, for the two bonded substrates W, the passage 4b ​​of the post-cleaning relay stand 18 is an entrance, and the passage 4a of the post-cleaning relay stand 18 is an exit. The first substrate W1 and the second substrate W2 to be bonded by the bonding unit 2b are loaded into the same post-cleaning relay stand 18. FIG. 6C shows an example in which two support parts 8b are provided for each post-cleaning relay stand 18. The two support portions 8b horizontally support the first substrate W1 and the second substrate W2 in the internal space such that the first substrate W1 and the second substrate W2 are arranged in parallel with a gap therebetween.

[0075] The pre-bonding staging stand 18b that relays the substrates W before bonding may include at least one of a heater and a cooler 18c that raises or lowers the temperature of the internal space of the pre-bonding staging stand 18b, and a control device that maintains the temperature of the internal space at a constant set temperature by controlling at least one of the heater and the cooler 18c. Fig. 6C shows an example in which the cooler 18c is provided.

[0076] The set temperature may be room temperature, or may be higher or lower than room temperature. The set temperature may be set by a human operation of the substrate bonding apparatus 1, or may be set by a control device based on a detection value of a temperature sensor that detects the temperature of the substrate W before it is carried into the internal space. In either case, the temperature of the substrate W in the pre-bonding staging stand 18b is brought close to the set temperature, so that the temperature of the substrate W when it is carried out from the pre-bonding staging stand 18b can be stabilized.

[0077] As shown in Fig. 6A, the third transport robot R3 includes at least one third hand H3 that horizontally supports the substrate W, and a third body B3 that supports all of the third hands H3. Fig. 6A and Fig. 6C show an example in which four third hands H3 are provided, and each third hand H3 is provided with a multi-joint arm that can bend and stretch horizontally.

[0078] The third transport robot R3 includes a rotation actuator AR that rotates the third hand H3 around a rotation center C3 that represents a vertical line, a horizontal actuator AH that changes the horizontal distance from the rotation center C3 to the third hand H3 by moving the third hand H3 horizontally, and a vertical actuator AV that moves the third hand H3 vertically. The third transport robot R3 further includes a travel actuator AT that moves all the third hands H3 horizontally in the third travel direction by moving the third body B3 horizontally in the horizontal third travel direction. In the example shown in FIG. 6A, the third travel direction is the front-back direction FB.

[0079] The passage port 4b of the unload lock chamber 14 faces the third transfer chamber 16. Similarly, the passage port 4 of the cleaning unit 2c, the passage port 4a of the post-cleaning staging table 18, and the passage port 4a of the post-bonding staging table 22 face the third transfer chamber 16. The passage port 4a of the post-cleaning staging table 18 faces forward. The passage port 4a of the post-bonding staging table 22 faces backward. The passage port 4b of the unload lock chamber 14 and the passage port 4 of the cleaning unit 2c face sideways. FIG. 6A shows an example in which the passage port 4b of the unload lock chamber 14 and the passage port 4 of the cleaning unit 2c face rightward.

[0080] The third transport robot R3 performs at least one of changing the orientation of the third hand H3 (rotating the third hand H3 around the rotation center C3), moving the third hand H3 in the vertical direction, and traveling in the third traveling direction. As a result, the third transport robot R3 makes the third hand H3 face horizontally to any one of the unload lock chamber 14, the cleaning unit 2c, the post-cleaning staging table 18, and the post-bonding staging table 22. The third transport robot R3 makes the third hand H3 enter and exit the unload lock chamber 14 through the passage port 4b of the unload lock chamber 14. The third transport robot R3 makes the third hand H3 enter and exit the cleaning unit 2c through the passage port 4 of the cleaning unit 2c. The third transport robot R3 makes the third hand H3 enter and exit the post-cleaning staging table 18 through the passage port 4a of the post-cleaning staging table 18. The third transport robot R3 moves the third hand H3 into and out of the post-bonding staging stand 22 through the passage opening 4a of the post-bonding staging stand 22.

[0081] The third transport robot R3 can carry the substrate W into and out of the unload lock chamber 14, the cleaning unit 2c, the post-cleaning staging stage 18, and the post-bonding staging stage 22. The third transport robot R3 can carry the substrate W into and out of the unload lock chamber 14, the cleaning unit 2c, the post-cleaning staging stage 18, and the post-bonding staging stage 22 using any of the third hands H3. The third transport robot R3 can exchange the substrate W with each of the unload lock chamber 14, the cleaning unit 2c, the post-cleaning staging stage 18, and the post-bonding staging stage 22 by carrying the substrate W into and out of the unload lock chamber 14, the cleaning unit 2c, the post-cleaning staging stage 18, and the post-bonding staging stage 22.

[0082] Next, the fourth transport robot R4 and the related configuration will be described.

[0083] Fig. 7A is a schematic diagram showing a part of Fig. 3. Fig. 7B is a schematic diagram showing a vertical cross section along line BB shown in Fig. 7A. The substrate bonding apparatus 1 has at least one bonding unit 2b that bonds two cleaned substrates W. Fig. 7A shows an example in which two bonding units 2b are provided. In this example, the two bonding units 2b are horizontally adjacent to each other in the left-right direction LR.

[0084] 7B, the joining unit 2b includes a plurality of partition plates 5 that form an internal space in which the first substrate W1 and the second substrate W2 are disposed and a passage opening 4 through which the first substrate W1 and the second substrate W2 pass before and after joining, a first chuck 8A that holds the first substrate W1 horizontally within the internal space, and a second chuck 8B that holds the second substrate W2 horizontally within the internal space. The plurality of partition plates 5 include a fixed partition plate 6 that forms the internal space and the passage opening 4, and a door 7 that moves relative to the fixed partition plate 6 to open and close the passage opening 4.

[0085] The joining unit 2b further includes a plurality of joining actuators 21a that join the first substrate W1 and the second substrate W2 by moving the first chuck 8A and the second chuck 8B relatively while they are holding the first substrate W1 and the second substrate W2, and at least one camera 21c that detects the alignment of the first substrate W1 and the second substrate W2 at least either before or after joining the first substrate W1 and the second substrate W2 by photographing at least one of the first substrate W1 and the second substrate W2.

[0086] The multiple bonding actuators 21a may include a horizontal actuator that moves the first chuck 8A and the second chuck 8B relatively in the horizontal direction, a vertical actuator that moves the first chuck 8A and the second chuck 8B relatively in the vertical direction, and a rotation actuator that rotates the first chuck 8A and the second chuck 8B relatively around a vertical line. The multiple bonding actuators 21a may include an inversion actuator that rotates the first chuck 8A around a horizontal line to invert the first substrate W1 held by the first chuck 8A up and down. The inversion actuator may invert the first substrate W1 held by a chuck other than the first chuck 8A up and down. The inversion actuator may invert the first substrate W1 up and down outside the bonding unit 2b.

[0087] At least one camera 21c may include a first camera that photographs the first substrate W1 before being bonded to the second substrate W2, a second camera that photographs the second substrate W2 before being bonded to the first substrate W1, and a third camera that photographs the bonded first substrate W1 and second substrate W2. The first camera may photograph the first substrate W1 held by the first chuck 8A, or may photograph the first substrate W1 held by a chuck other than the first chuck 8A. The same applies to the second camera. The third camera may photograph the third substrate W3 (the bonded first substrate W1 and second substrate W2) held by the first chuck 8A or the second chuck 8B, or may photograph the third substrate W3 held by a chuck other than the first chuck 8A and the second chuck 8B. At least one camera 21c may photograph at least one of the first substrate W1 and the second substrate W2 outside the bonding unit 2b.

[0088] The substrate bonding apparatus 1 includes at least one pre-bonding aligner 20 that positions one substrate W based on a notch or an orientation flat. FIGS. 7A and 7B show an example in which two pre-bonding aligners 20 are provided for each bonding unit 2b. Thus, four pre-bonding aligners 20 are provided for two bonding units 2b. The pre-bonding aligner 20 has a configuration similar to that of the pre-activation aligner 11. Thus, the pre-bonding aligner 20 includes a plurality of partition plates 5, a chuck 8a, an electric motor 9, an edge sensor 11s, and a control device. The plurality of partition plates 5 include a fixed partition plate 6 and a door 7.

[0089] The four pre-bonding aligners 20 form two pairs. The pre-bonding aligners 20 of one pair correspond to one bonding unit 2b, and the pre-bonding aligners 20 of the other pair correspond to the other bonding unit 2b. The pre-bonding aligners 20 of one pair position the first substrate W1 and the second substrate W2 to be carried into one bonding unit 2b. The pre-bonding aligners 20 of the other pair position the first substrate W1 and the second substrate W2 to be carried into the other bonding unit 2b. One of the two pre-bonding aligners 20 forming one pair is a first pre-bonding aligner 20 that positions the first substrate W1, and the other of the two pre-bonding aligners 20 forming one pair is a second pre-bonding aligner 20 that positions the second substrate W2.

[0090] One pair of pre-bonding aligners 20 are arranged above the bonding unit 2b in a vertically overlapping state. The remaining pair of pre-bonding aligners 20 are arranged above the remaining bonding unit 2b in a vertically overlapping state. The pair of pre-bonding aligners 20 do not have to be vertically overlapped. For example, the pair of pre-bonding aligners 20 may be horizontally aligned in the left-right direction LR at a position overlapping the bonding unit 2b in a plan view. The pair of pre-bonding aligners 20 may be horizontally aligned, and the remaining pair of pre-bonding aligners 20 may be vertically overlapped. The number of pre-bonding aligners 20 corresponding to one bonding unit 2b may be one.

[0091] The fourth transport robot R4 includes at least one fourth hand H4 that horizontally supports the substrate W, and a fourth body B4 that supports all of the fourth hands H4. Figures 7A and 7B show an example in which four fourth hands H4 are provided, and each fourth hand H4 is provided with an articulated arm that can bend and extend horizontally.

[0092] The fourth transport robot R4 includes a rotation actuator AR that rotates the fourth hand H4 around a rotation center C4 that represents a vertical line, a horizontal actuator AH that changes the horizontal distance from the rotation center C4 to the fourth hand H4 by moving the fourth hand H4 horizontally, and a vertical actuator AV that moves the fourth hand H4 vertically. The fourth transport robot R4 further includes a travel actuator AT that moves all the fourth hands H4 horizontally in a fourth travel direction by moving the fourth body B4 horizontally in the horizontal fourth travel direction. In the example shown in FIG. 7A, the fourth travel direction is the left-right direction LR.

[0093] The passage opening 4b of the post-cleaning relay table 18 faces the fourth transport chamber 19. Similarly, the passage opening 4 of the pre-bonding aligner 20 and the passage opening 4 of the bonding unit 2b face the fourth transport chamber 19. The passage opening 4 of the pre-bonding aligner 20 and the passage opening 4 of the bonding unit 2b face forward. The fourth transport robot R4 moves the fourth hand H4 in and out of the post-cleaning relay table 18 through the passage opening 4b of the post-cleaning relay table 18. The fourth transport robot R4 moves the fourth hand H4 in and out of the pre-bonding aligner 20 through the passage opening 4 of the pre-bonding aligner 20. The fourth transport robot R4 moves the fourth hand H4 in and out of the bonding unit 2b through the bonding unit 2b.

[0094] The fourth transport robot R4 performs at least one of changing the orientation of the fourth hand H4 (rotating the fourth hand H4 around the rotation center C4), moving the fourth hand H4 in the vertical direction, and traveling in the fourth traveling direction. As a result, the fourth transport robot R4 makes the fourth hand H4 face horizontally to any one of the post-cleaning relay table 18, the pre-bonding aligner 20, and the bonding unit 2b. The fourth transport robot R4 can carry the substrate W into and out of any one of the post-cleaning relay table 18, the pre-bonding aligner 20, and the bonding unit 2b. The fourth transport robot R4 can carry the substrate W into and out of the post-cleaning relay table 18, the pre-bonding aligner 20, and the bonding unit 2b using any one of the fourth hands H4. The fourth transport robot R4 can exchange the substrate W with each of the post-cleaning relay table 18, the pre-bonding aligner 20, and the bonding unit 2b by carrying in and carrying out the substrate W.

[0095] Next, an example of the layout of the substrate bonding apparatus 1 will be described.

[0096] In the following, reference will be made to Figure 3. In the following description, the center WO of substrate bonding apparatus 1 represents a vertical plane that bisects substrate bonding apparatus 1 in the left-right direction LR, which corresponds to the width direction.

[0097] The multiple load ports LP are aligned in the left-right direction LR in a plan view. The multiple carriers CA held by the multiple load ports LP are also aligned in the left-right direction LR in a plan view. The first transfer chamber 10 is disposed behind the multiple load ports LP. The first transfer chamber 10 extends in the left-right direction LR in a plan view. The first transfer chamber 10 is connected to all of the load ports LP.

[0098] The pre-activation aligner 11, the load lock chamber 12, and the post-bonding relay stage 22 are disposed behind the first transfer chamber 10. In a plan view, the pre-activation aligner 11, the load lock chamber 12, and the post-bonding relay stage 22 are disposed on the opposite side of the first transfer chamber 10 from the multiple load ports LP. The post-bonding relay stage 22 is disposed outboard in the width direction of the pre-activation aligner 11 and the load lock chamber 12. The distance in the left-right direction LR from the center WO of the substrate bonding apparatus 1 to the post-bonding relay stage 22 is longer than the distance in the left-right direction LR from the center WO of the substrate bonding apparatus 1 to the pre-activation aligner 11.

[0099] The second transfer chamber 13 is disposed behind the load lock chamber 12. The unload lock chamber 14 is disposed behind the second transfer chamber 13. The second transfer chamber 13 is disposed at a position intersecting the center WO of the substrate bonding apparatus 1. The plasma processing unit 2p is disposed on the opposite side of the load lock chamber 12 and the unload lock chamber 14 with respect to the center WO of the substrate bonding apparatus 1. The two plasma processing units 2p are disposed on the sides of the second transfer chamber 13. The two plasma processing units 2p are disposed symmetrically with respect to a reference plane RS1, which is a vertical plane that passes through the rotation center C2 of the second transfer robot R2 and is perpendicular to the front-rear direction FB.

[0100] The cleaning unit 2c is disposed rearward of the unload lock chamber 14. The cleaning unit 2c may be adjacent to the unload lock chamber 14, or may be disposed rearward away from the unload lock chamber 14. The cleaning unit 2c is disposed on the same side of the third transfer chamber 16 as the second transfer chamber 13 and the unload lock chamber 14. FIG. 3 shows an example in which the second transfer chamber 13, the unload lock chamber 14, and the cleaning unit 2c are disposed to the left of the third transfer chamber 16.

[0101] The cleaning unit 2c is disposed on the same side as the unload lock chamber 14 with respect to a reference plane RS1 of the second transport robot R2. The reference plane RS1 is a vertical plane that passes through the rotation center C2 of the second transport robot R2 and is perpendicular to the reference line. The reference line is a straight line that passes through the center of the substrate W held horizontally in the load lock chamber 12 and the center of the substrate W held horizontally in the unload lock chamber 14 in a plan view. In the example shown in FIG. 3, the reference line is a straight line extending in the front-rear direction FR. The unload lock chamber 14 may be disposed between the second transport chamber 13 and the cleaning unit 2c, or may be disposed at a position other than between the second transport chamber 13 and the cleaning unit 2c. The cleaning unit 2c may be horizontally adjacent to the unload lock chamber 14, or may overlap the unload lock chamber 14 in a plan view.

[0102] The post-cleaning relay platform 18 is disposed behind the third transfer chamber 16. The third transfer chamber 16 is disposed behind the post-bonding relay platform 22. The post-cleaning relay platform 18 and the post-bonding relay platform 22 are disposed on opposite sides of the third transfer chamber 16. The post-bonding relay platform 22 is disposed forward of the unload lock chamber 14. The post-cleaning relay platform 18 is disposed rearward of the cleaning unit 2c. The post-cleaning relay platform 18 is disposed to the side of the fourth transfer chamber 19. FIG. 3 shows an example in which the post-cleaning relay platform 18 is disposed to the right of the fourth transfer chamber 19.

[0103] The fourth transfer chamber 19 is disposed behind the cleaning unit 2c. The fourth transfer chamber 19 is longer in the left-right direction LR than the cleaning unit 2c. The fourth transfer chamber 19 is parallel to the first transfer chamber 10 and is spaced rearward from the first transfer chamber 10. The two plasma processing units 2p are disposed between the first transfer chamber 10 and the fourth transfer chamber 19 in the front-rear direction FB in a plan view. The pre-activation aligner 11, the load lock chamber 12, the second transfer robot R2, the second transfer chamber 13, the unload lock chamber 14, and the cleaning unit 2c are also disposed between the first transfer chamber 10 and the fourth transfer chamber 19 in the front-rear direction FB in a plan view.

[0104] The bonding unit 2b and the pre-bonding aligner 20 are arranged along the fourth transfer chamber 19. The two bonding units 2b are arranged behind the fourth transfer chamber 19. The four pre-bonding aligners 20 are also arranged behind the fourth transfer chamber 19. The bonding unit 2b and the pre-bonding aligner 20 are arranged behind the post-cleaning relay table 18. The bonding unit 2b and the pre-bonding aligner 20 are arranged on the opposite side of the fourth transfer chamber 19 to the cleaning unit 2c. The two bonding units 2b are horizontally adjacent to each other. FIG. 3 shows an example in which the two bonding units 2b are horizontally adjacent to each other in the left-right direction LR. The two bonding units 2b may be in contact with each other or may be horizontally separated from each other.

[0105] The bonding unit 2b is disposed on the same side as the cleaning unit 2c with respect to a reference plane RS2 of the unload lock chamber 14. The reference plane RS2 is a vertical plane that passes through the center of the substrate W held horizontally in the unload lock chamber 14 and is perpendicular to the reference line. The cleaning unit 2c may be disposed between the unload lock chamber 14 and the bonding unit 2b, or may be disposed at a position other than between the unload lock chamber 14 and the bonding unit 2b.

[0106] The cleaning unit 2c is disposed on the opposite side of the unload lock chamber 14 from the second transfer chamber 13. The bonding unit 2b is disposed on the opposite side of the cleaning unit 2c from the unload lock chamber 14. More specifically, the cleaning unit 2c is disposed on the opposite side of the second transfer chamber 13 from a reference plane RS2 of the unload lock chamber 14. The bonding unit 2b is disposed on the opposite side of the unload lock chamber 14 from a reference plane RS3 of the cleaning unit 2c. The reference plane RS3 is a vertical plane that passes through the center of the substrate W held horizontally in the cleaning unit 2c and is perpendicular to the reference line.

[0107] 8A and 8B are schematic plan views showing a state in which the third transport robot R3 is disposed at a multi-access position where the third transport robot R3 can carry the substrate W in and out of both the cleaning unit 2c and the post-cleaning relay stand 18. FIG.

[0108] The cleaning unit 2c and the post-cleaning relay stage 18 are disposed within a range where the third transport robot R3 can transport the substrate W without traveling in the third travel direction. More specifically, the cleaning unit 2c and the post-cleaning relay stage 18 are disposed within a range where the third hand H3 can reach without horizontally moving the rotation center C3 of the third transport robot R3. FIGS. 8A and 8B show a state where the third transport robot R3 is disposed at the multi-access position. The multi-access position is a position where the third transport robot R3 can load and unload the substrate W to and from the cleaning unit 2c and the post-cleaning relay stage 18 without traveling in the third travel direction.

[0109] 8A and 8B, when the third transport robot R3 is located at the multi-access position, the third transport robot R3 can change the orientation of the third hand H3 to horizontally face either the passage opening 4 of the cleaning unit 2c or the passage opening 4a of the post-cleaning relay stand 18. The rotation actuator AR of the third transport robot R3 maintains the rotation angle of the third transport robot R3 at any value including a first rotation angle at which the third hand H3 horizontally faces the passage opening 4 of the cleaning unit 2c, and a second rotation angle at which the third hand H3 horizontally faces the passage opening 4a of the post-cleaning relay stand 18.

[0110] When the third transport robot R3 is located at the multi-access position and the rotation angle of the third transport robot R3 is the first rotation angle, the third hand H3 faces the passage opening 4 of the cleaning unit 2c horizontally. In this state, the third transport robot R3 moves the third hand H3 in the horizontal and vertical directions to load and unload the substrate W to and from the cleaning unit 2c. Similarly, when the third transport robot R3 is located at the multi-access position and the rotation angle of the third transport robot R3 is the second rotation angle, the third transport robot R3 moves the third hand H3 in the horizontal and vertical directions to load and unload the substrate W to and from the post-cleaning staging stand 18. Therefore, the third transport robot R3 can transport the substrate W from the cleaning unit 2c to the post-cleaning staging stand 18 without horizontally moving the rotation center C3 of the third transport robot R3.

[0111] The post-cleaning relay stage 18 and the bonding unit 2b (here, the bonding unit 2b on the post-cleaning relay stage 18 side; the same applies below) are also arranged within a range in which the fourth transport robot R4 can transport the substrate W without horizontally moving the rotation center C4 of the fourth transport robot R4. FIG. 3 shows a state in which the fourth transport robot R4 is arranged at a multi-access position in which the fourth transport robot R4 can carry the substrate W into and out of the post-cleaning relay stage 18 and the bonding unit 2b without traveling in the fourth travel direction. When the fourth transport robot R4 is located at the multi-access position, when the rotation actuator AR (see FIG. 7B) of the fourth transport robot R4 rotates the fourth hand H4 around the rotation center C4 of the fourth transport robot R4, the fourth hand H4 faces horizontally either the passage opening 4b of the post-cleaning relay stage 18 or the passage opening 4 of the bonding unit 2b. At this time, the fourth transport robot R4 may move the fourth hand H4 vertically as necessary.

[0112] The bonding unit 2b and the pre-bonding aligner 20, which overlap each other in a plan view, are also disposed within a range in which the fourth transport robot R4 can transport the substrate W without horizontally moving the rotation center C4 of the fourth transport robot R4. When the fourth transport robot R4 is disposed at the multi-access position shown in FIG. 3 and the fourth hand H4 faces horizontally the passage opening 4 of the bonding unit 2b, when the vertical actuator AV of the fourth transport robot R4 translates the fourth hand H4 vertically, the fourth hand H4 faces horizontally the passage opening 4 of the lower pre-bonding aligner 20. When the vertical actuator AV of the fourth transport robot R4 further translates the fourth hand H4 vertically, the fourth hand H4 faces horizontally the passage opening 4 of the upper pre-bonding aligner 20. Therefore, the fourth transport robot R4 located at the multi-access position can position the fourth hand H4 horizontally opposite any one selected from the joining unit 2b and the pre-joining aligner 20 simply by moving the fourth hand H4 vertically in parallel.

[0113] The right-side bonding unit 2b and pre-bonding aligner 20 are defined as the near-side bonding unit 2b and near-side aligner that are relatively close to the post-cleaning relay stage 18, and the left-side bonding unit 2b and pre-bonding aligner 20 are defined as the far-side bonding unit 2b and far-side aligner that pass relatively from the post-cleaning relay stage 18. The multi-access position where the fourth transport robot R4 carries the substrate W into and out of the near-side bonding unit 2b and the front-side aligner is defined as the near side position, and the multi-access position where the fourth transport robot R4 carries the substrate W into and out of the far-side bonding unit 2b and the far-side aligner is defined as the far side position.

[0114] The multi-access position where the fourth transport robot R4 carries the substrate W into and out of the post-cleaning staging stage 18 and the bonding unit 2b is the same position as the front position. Therefore, the fourth transport robot R4 located at the front position can carry the substrate W into and out of the post-cleaning staging stage 18, the front bonding unit 2b, and the front aligner without traveling in the fourth travel direction. However, the multi-access position where the fourth transport robot R4 carries the substrate W into and out of the post-cleaning staging stage 18 and the bonding unit 2b may be a position different from the front position.

[0115] The pre-activation aligner 11 and the load lock chamber 12 are also disposed within a range in which the first transport robot R1 can transport the substrate W without horizontally moving the rotation center C1 of the first transport robot R1. When the first transport robot R1 is disposed at the multi-access position (the position of the first transport robot R1 shown in FIG. 4B) and the first hand H1 faces horizontally to the passage opening 4a of the load lock chamber 12, when the vertical actuator AV (see FIG. 4B) of the first transport robot R1 translates the first hand H1 vertically, the first hand H1 faces horizontally to the passage opening 4 of the lower pre-activation aligner 11. When the vertical actuator AV of the first transport robot R1 further translates the first hand H1 vertically, the first hand H1 faces horizontally to the passage opening 4 of the upper pre-activation aligner 11. Therefore, the first transport robot R1 positioned at the multi-access position can position the first hand H1 horizontally opposite any one of the pre-activation aligner 11 and the load lock chamber 12 by simply translating the first hand H1 vertically.

[0116] Next, an example of the operation of the substrate bonding apparatus 1 will be described.

[0117] 9A and 9B are process diagrams for explaining an example of the operation of the substrate bonding apparatus 1. FIG. 10 is a time chart showing an example of a period during which the first substrate W1 and the second substrate W2 are plasma-treated. FIG. 11 is a time chart showing an example of a period during which the first substrate W1 and the second substrate W2 are cleaned. FIG. 9B shows a continuation of FIG. 9A. In the following, reference will be made to FIG. 3, FIG. 9A, and FIG. 9B. Reference will be made to FIG. 10 and FIG. 11 as appropriate.

[0118] The operation of the substrate bonding apparatus 1 described below is the operation of the substrate bonding apparatus 1 during continuous processing. Continuous processing refers to the period after the first third substrate W3 (bonded first substrate W1 and second substrate W2) has returned to the carrier CA on the load port LP and before the last first substrate W1 and second substrate W2 are unloaded from the carrier CA on the load port LP.

[0119] In the following description, when the four first hands H1 are to be distinguished, they may be referred to as first hand H1A, first hand H1B, first hand H1C, or first hand H1D. The same is true for the four third hands H3 and the four fourth hands H4. When the two second hands H2 are to be distinguished, they may be referred to as second hand H2A or second hand H2B.

[0120] The first load port LP, the second load port LP, and the third load port LP represent three load ports LP that are different from each other. The first pre-activation aligner 11 and the second pre-activation aligner 11 represent two pre-activation aligners 11 that are different from each other. The same applies to the plasma treatment unit 2p, the cleaning unit 2c, and the pre-bonding aligner 20. The pair of the first pre-bonding aligner 20 and the second pre-bonding aligner 20 represent pre-bonding aligners 20 that correspond to the same bonding unit 2b.

[0121] As shown in FIG. 9A, when bonding a plurality of pairs of first substrates W1 and second substrates W2, the first transport robot R1 uses the first hand H1A to take out the first substrate W1 from the carrier CA on the first load port LP (step S11 in FIG. 9A). After that, while supporting the first substrate W1 horizontally with the first hand H1A, the first transport robot R1 uses the first hand H1B to take out the second substrate W2 from the carrier CA on the second load port LP (step S12 in FIG. 9A). After that, while supporting the first substrate W1 horizontally with the first hand H1A and the second substrate W2 horizontally with the first hand H1B, the first transport robot R1 simultaneously transports the first substrate W1 and the second substrate W2 to the two pre-activation aligners 11 and the load lock chamber 12 (step S13 in FIG. 9A).

[0122] When the first substrate W1 and the second substrate W2 arrive at the two pre-activation aligners 11 and the load lock chamber 12, the first transport robot R1 uses the first hand H1C to transport the positioned first substrate W1 out of the first pre-activation aligner 11. After that, the first transport robot R1 transports the first substrate W1 supported horizontally by the first hand H1A into the first pre-activation aligner 11. This allows the first substrate W1 to be exchanged between the first pre-activation aligner 11 and the first transport robot R1 (step S14 in FIG. 9A).

[0123] Thereafter, the first transport robot R1 horizontally supports the first substrate W1 with the first hand H1C and the second substrate W2 with the first hand H1B, and uses the first hand H1D to transport the positioned second substrate W2 out of the second pre-activation aligner 11. Thereafter, the first transport robot R1 transports the second substrate W2 supported horizontally by the first hand H1B into the second pre-activation aligner 11. This allows the second substrate W2 to be exchanged between the second pre-activation aligner 11 and the first transport robot R1 (step S15 in FIG. 9A).

[0124] Thereafter, the first transport robot R1 simultaneously loads the first substrate W1 supported by the first hand H1C and the second substrate W2 supported by the first hand H1D into the load lock chamber 12 (step S16 in FIG. 9A). At this time, the inlet gate valve 7A of the load lock chamber 12 is opened, and the outlet gate valve 7B of the load lock chamber 12 is closed. The first transport robot R1 may load the second substrate W2 before or after loading the first substrate W1. When the first substrate W1 and the second substrate W2 are loaded into the load lock chamber 12, the inlet gate valve 7A of the load lock chamber 12 is closed while the outlet gate valve 7B of the load lock chamber 12 is closed. In this state, the air pressure in the load lock chamber 12 is lowered.

[0125] With the exit gate valve 7B of the load lock chamber 12 open and the entrance gate valve 7A of the load lock chamber 12 closed, the second transfer robot R2 uses the second hand H2A to take out the first substrate W1 from the load lock chamber 12 (step S17 in FIG. 9A). Thereafter, while supporting the first substrate W1 horizontally with the second hand H2A, the second transfer robot R2 takes out the first substrate W1 that has been subjected to the plasma processing from the first plasma processing unit 2p using the second hand H2B. Thereafter, the second transfer robot R2 takes in the first substrate W1 supported horizontally by the second hand H2A into the first plasma processing unit 2p (step S18 in FIG. 9A). Thereafter, with the entrance gate valve 7A of the unload lock chamber 14 open and the exit gate valve 7B of the unload lock chamber 14 closed, the second transport robot R2 loads the first substrate W1, which is supported horizontally by the second hand H2B, into the unload lock chamber 14 (step S19 in FIG. 9A).

[0126] After the second transport robot R2 carries the first substrate W1 into the unload lock chamber 14, it uses the second hand H2A to carry the second substrate W2 out of the load lock chamber 12 (step S20 in FIG. 9A). When the second substrate W2 is carried out of the load lock chamber 12, the exit gate valve 7B of the load lock chamber 12 is closed, and then the entrance gate valve 7A of the load lock chamber 12 is opened. Then, in the same manner as described above, the next first substrate W1 and second substrate W2 are carried into the load lock chamber 12 by the first transport robot R1.

[0127] After the second transfer robot R2 takes out the second substrate W2 from the load lock chamber 12, it takes out the plasma-processed second substrate W2 from the second plasma processing unit 2p using the second hand H2B. Then, the second transfer robot R2 takes in the second substrate W2 supported horizontally by the second hand H2A into the second plasma processing unit 2p (step S21 in FIG. 9A). Then, the second transfer robot R2 takes in the second substrate W2 supported horizontally by the second hand H2B into the unload lock chamber 14 with the inlet gate valve 7A of the unload lock chamber 14 open and the outlet gate valve 7B of the unload lock chamber 14 closed (step S22 in FIG. 9A). As a result, the first substrate W1 and the second substrate W2 are disposed in the unload lock chamber 14.

[0128] As shown in FIG. 10, the plasma treatment of the second substrate W2 starts when the plasma treatment of the first substrate W1 is being performed, and ends after the plasma treatment of the first substrate W1 is completed. Therefore, there is a period in which the two plasma treatment units 2p simultaneously perform plasma treatment on the first substrate W1 and the second substrate W2. The period in which the plasma treatment is simultaneously performed on the first substrate W1 and the second substrate W2 may be equal to or different from the period in which the plasma treatment is performed on only one of the first substrate W1 and the second substrate W2. The period in which the plasma treatment is simultaneously performed on the first substrate W1 and the second substrate W2 may be equal to or different from the sum of the period in which the plasma treatment is performed on only the first substrate W1 and the period in which the plasma treatment is performed on only the second substrate W2.

[0129] When the first substrate W1 and second substrate W2 that have been subjected to plasma processing are carried into the unload lock chamber 14, the entrance gate valve 7A of the unload lock chamber 14 is closed, and then the exit gate valve 7B of the unload lock chamber 14 is opened. Then, the third transfer robot R3 uses the third hand H3A and the third hand H3B to simultaneously carry out the first substrate W1 and the second substrate W2 from the unload lock chamber 14 (step S23 in FIG. 9A). The third transfer robot R3 may carry out the second substrate W2 before or after carrying out the first substrate W1.

[0130] When the first substrate W1 and the second substrate W2 are transferred out of the unload lock chamber 14, the entrance gate valve 7A of the unload lock chamber 14 is closed and the exit gate valve 7B of the unload lock chamber 14 is closed. In this state, the air pressure inside the unload lock chamber 14 is lowered. Thereafter, the entrance gate valve 7A of the unload lock chamber 14 is opened and the exit gate valve 7B of the unload lock chamber 14 is closed. Thereafter, the next first substrate W1 and second substrate W2 are transferred into the unload lock chamber 14 by the second transport robot R2 in the same manner as described above.

[0131] The third transfer robot R3 transfers the first substrate W1 and the second substrate W2 that have been subjected to the plasma processing out of the unload lock chamber 14, and then simultaneously transfers the first substrate W1 and the second substrate W2 to the cleaning unit 2c (step S24 in FIG. 9A). Then, the third transfer robot R3 transfers the cleaned first substrate W1 out of the first cleaning unit 2c using the third hand H3C. Then, the third transfer robot R3 transfers the first substrate W1 supported horizontally by the third hand H3A into the first cleaning unit 2c (step S25 in FIG. 9B).

[0132] After the third transport robot R3 transports the first substrate W1 into the first cleaning unit 2c, it transports the cleaned second substrate W2 out of the second cleaning unit 2c using the third hand H3D. After that, the third transport robot R3 transports the second substrate W2 supported horizontally by the third hand H3B into the second cleaning unit 2c (step S26 in FIG. 9B). As a result, the cleaned first substrate W1 and second substrate W2 are supported horizontally by the third hand H3C and the third hand H3D.

[0133] As shown in FIG. 11, cleaning of the second substrate W2 starts when cleaning of the first substrate W1 is being performed and ends after cleaning of the first substrate W1 is completed. Therefore, there is a period during which the two cleaning units 2c simultaneously clean the first substrate W1 and the second substrate W2. The period during which the first substrate W1 and the second substrate W2 are simultaneously cleaned may be equal to or different from the period during which only one of the first substrate W1 and the second substrate W2 is cleaned. The period during which the first substrate W1 and the second substrate W2 are simultaneously cleaned may be equal to or different from the sum of the period during which only the first substrate W1 is cleaned and the period during which only the second substrate W2 is cleaned.

[0134] The third transport robot R3 carries the cleaned first substrate W1 and second substrate W2 into one of the post-cleaning staging stands 18. As described above, two of the three vertically stacked post-cleaning staging stands 18 are pre-bonding staging stands 18b that relay the substrates W before bonding, and the remaining one is the first post-bonding staging stand 18a that relays the two substrates W after bonding. The above-mentioned post-bonding staging stand 22 is the second post-bonding staging stand that relays the two substrates W after bonding carried out from the first post-bonding staging stand 18a.

[0135] The third transport robot R3 simultaneously carries the first substrate W1 and the second substrate W2 supported horizontally by the third hand H3C and the third hand H3D into the pre-bonding staging stage 18b (step S27 in FIG. 9B). The third transport robot R3 may carry the second substrate W2 into the pre-bonding staging stage 18b before or after carrying in the first substrate W1. The third transport robot R3 may carry the second substrate W2 into a pre-bonding staging stage 18b different from the pre-bonding staging stage 18b into which the first substrate W1 was carried in.

[0136] The fourth transport robot R4 simultaneously transports the first substrate W1 and the second substrate W2 from the post-cleaning staging stage 18 using the fourth hand H4A and the fourth hand H4B (step S28 in FIG. 9B). The fourth transport robot R4 may transport the second substrate W2 before or after transporting the first substrate W1. After transporting both the first substrate W1 and the second substrate W2 from the post-cleaning staging stage 18, the fourth transport robot R4 simultaneously transports the first substrate W1 and the second substrate W2 to the bonding unit 2b (step S29 in FIG. 9B). Thereafter, the fourth transport robot R4 replaces the first substrate W1 and the second substrate W2 with a pair of the first pre-bonding aligner 20 and the second pre-bonding aligner 20 corresponding to this bonding unit 2b.

[0137] Specifically, the fourth transport robot R4 horizontally supports the first substrate W1 with the fourth hand H4A and the second substrate W2 with the fourth hand H4B, and uses the fourth hand H4C to transport the positioned first substrate W1 out of the first pre-bonding aligner 20. Thereafter, the fourth transport robot R4 transports the first substrate W1 supported horizontally by the fourth hand H4A into the same first pre-activation aligner 11. As a result, the first substrate W1 is exchanged between the fourth transport robot R4 and the first pre-bonding aligner 20 (step S30 in FIG. 9B).

[0138] Thereafter, the fourth transport robot R4 horizontally supports the first substrate W1 with the fourth hand H4C and the second substrate W2 with the fourth hand H4B, and uses the fourth hand H4D to transport the positioned second substrate W2 out of the second pre-bonding aligner 20. Thereafter, the fourth transport robot R4 transports the second substrate W2 supported horizontally by the fourth hand H4B into the same second pre-bonding aligner 20. As a result, the second substrate W2 is exchanged between the fourth transport robot R4 and the second pre-bonding aligner 20 (step S31 in FIG. 9B).

[0139] After the fourth transport robot R4 carries out the first substrate W1 and the second substrate W2 from the pair of the first pre-bonding aligner 20 and the second pre-bonding aligner 20, the fourth transport robot R4 carries out the bonded first substrate W1 and the second substrate W2, that is, the third substrate W3, from the bonding unit 2b corresponding to the pair of the first pre-bonding aligner 20 and the second pre-bonding aligner 20 using the fourth hand H4A or the fourth hand H4B (step S32 in FIG. 9B). After that, the fourth transport robot R4 carries the first substrate W1 supported horizontally by the fourth hand H4C and the second substrate W2 supported horizontally by the fourth hand H4D into the same bonding unit 2b (step S33 in FIG. 9B). The fourth transport robot R4 may carry in the first substrate W1 and the second substrate W2 at the same time, or may carry in the second substrate W2 before or after carrying in the first substrate W1.

[0140] After the fourth transport robot R4 carries the first substrate W1 and the second substrate W2 into the bonding unit 2b, it carries the third substrate W3 supported horizontally by the fourth hand H4A or the fourth hand H4B into the post-cleaning staging stage 18 corresponding to the first post-bonding staging stage 18a (step S34 in FIG. 9B). After the third transport robot R3 carries the cleaned first substrate W1 and second substrate W2 into the post-cleaning staging stage 18 corresponding to the pre-bonding staging stage 18b, it uses the third hand H3C or the third hand H3D to carry the third substrate W3 out of the post-cleaning staging stage 18 corresponding to the first post-bonding staging stage 18a (step S35 in FIG. 9B). Thereafter, the third transport robot R3 travels in the third travel direction to the post-bonding relay stage 22 corresponding to the second post-bonding relay stage, and transports the third substrate W3 supported horizontally by the third hand H3C or the third hand H3D to the post-bonding relay stage 22 (step S36 in FIG. 9B).

[0141] After the first transport robot R1 carries the first substrate W1 and the second substrate W2 into the load lock chamber 12, it uses one of the first hands H1 to carry the third substrate W3 out of the post-bonding relay table 22 (step S37 in FIG. 9B). After that, the first transport robot R1 carries the third substrate W3 into the carrier CA on the third load port LP (step S38 in FIG. 9B). In this way, the first substrate W1 and the second substrate W2 are bonded in the substrate bonding device 1, and the third substrate W3 representing the bonded first substrate W1 and second substrate W2 is accommodated in the carrier CA on the load port LP. The first transport robot R1 and the like repeat the above-mentioned operation until the last third substrate W3 is carried into the carrier CA. In this way, multiple pairs of the first substrate W1 and the second substrate W2 are bonded.

[0142] Next, the effects of this embodiment will be described.

[0143] In this embodiment, the substrate W transferred from the carrier CA to the load lock chamber 12 is transferred from the load lock chamber 12 to the second transfer chamber 13 by a second transfer robot R2 corresponding to a vacuum transfer robot, and then transferred from the second transfer chamber 13 to the plasma processing unit 2p. The substrate W subjected to plasma processing by the plasma processing unit 2p is transferred from the plasma processing unit 2p to the second transfer chamber 13 by the second transfer robot R2, and then transferred from the second transfer chamber 13 to the unload lock chamber 14. The substrate W is then transferred from the unload lock chamber 14 to the cleaning unit 2c. Therefore, the substrate W can be transferred more efficiently than when the substrate W subjected to plasma processing is transferred out of the load lock chamber 12.

[0144] The cleaning unit 2c is disposed on the same side as the unload lock chamber 14 with respect to the second transfer chamber 13 in a plan view. In other words, the substrate W held horizontally in the cleaning unit 2c is disposed on the same side as the substrate W held horizontally in the unload lock chamber 14 with respect to the second transfer chamber 13 in a plan view. Therefore, the distance from the unload lock chamber 14 to the cleaning unit 2c can be shortened, and the transport distance of the substrate W can be shortened, compared to when the cleaning unit 2c is disposed on the opposite side of the unload lock chamber 14 with respect to the second transfer chamber 13.

[0145] In this embodiment, not only is the cleaning unit 2c disposed on the same side as the unload lock chamber 14 with respect to the second transfer chamber 13 in a plan view, but the cleaning unit 2c is also disposed on the opposite side of the unload lock chamber 14 to the second transfer chamber 13 in a plan view. When the substrate W is transported from the second transfer chamber 13 to the unload lock chamber 14, the substrate W approaches the cleaning unit 2c. Therefore, the substrate W can be transported from the unload lock chamber 14 to the cleaning unit 2c without returning to the second transfer chamber 13 side. This makes it possible to shorten the transport distance of the substrate W.

[0146] In this embodiment, the bonding unit 2b is disposed on the same side of the unload lock chamber 14 as the cleaning unit 2c in a plan view. In other words, the substrate W held horizontally in the bonding unit 2b is disposed on the same side of the unload lock chamber 14 as the substrate W held horizontally in the cleaning unit 2c in a plan view. Therefore, the distance from the cleaning unit 2c to the bonding unit 2b can be shortened, and the transport distance of the substrate W can be shortened, compared to when the bonding unit 2b is disposed on the opposite side of the unload lock chamber 14 to the cleaning unit 2c.

[0147] In this embodiment, not only is the bonding unit 2b disposed on the same side of the unload lock chamber 14 as the cleaning unit 2c in a plan view, but the bonding unit 2b is also disposed on the opposite side of the unload lock chamber 14 from the cleaning unit 2c in a plan view. When the substrate W is transported from the unload lock chamber 14 to the cleaning unit 2c, the substrate W approaches the bonding unit 2b. Therefore, the substrate W can be transported from the cleaning unit 2c to the bonding unit 2b without being returned to the unload lock chamber 14. This makes it possible to shorten the transport distance of the substrate W.

[0148] In this embodiment, the load lock chamber 12, the second transfer chamber 13, the unload lock chamber 14, and the cleaning unit 2c are arranged in this order from the front. By transferring the substrate W from the load lock chamber 12 to the second transfer chamber 13, the substrate W can be brought closer to the unload lock chamber 14 and the cleaning unit 2c. Furthermore, by transferring the substrate W from the second transfer chamber 13 to the unload lock chamber 14, the substrate W can be brought closer to the cleaning unit 2c. Therefore, unnecessary movement of the substrate W can be reduced, and the substrate W can be transferred efficiently.

[0149] In this embodiment, the first substrate W1 and the second substrate W2 are transported from the carrier CA to the load lock chamber 12 by the first transport robot R1, and the first substrate W1 and the second substrate W2 are transported from the load lock chamber 12 to at least one plasma processing unit 2p by the second transport robot R2. The second transport robot R2 transports the first substrate W1 and the second substrate W2 from the at least one plasma processing unit 2p to the unload lock chamber 14. Therefore, the substrate W can be transported more efficiently than when the substrate W that has been subjected to plasma processing is taken out of the load lock chamber 12.

[0150] The first substrate W1 and the second substrate W2 represent two substrates W of a pair to be bonded. Therefore, the first substrate W1 is not bonded to a substrate W other than the second substrate W2 that forms the pair, but is bonded to the second substrate W2 that forms the pair. The first substrate W1 and the second substrate W2 are bonded by the bonding unit 2b. The first transport robot R1 simultaneously loads the first substrate W1 and the second substrate W2 into the load lock chamber 12. The third transport robot R3 simultaneously unloads the first substrate W1 and the second substrate W2 from the unload lock chamber 14. Therefore, the substrates W can be transported more efficiently than when the first substrate W1 and the second substrate W2 are loaded or unloaded separately.

[0151] When the first substrate W1 and the second substrate W2 are separately loaded into the load lock chamber 12, the air pressure in the load lock chamber 12 may be lowered by the vacuum pump P after the first substrate W1 is loaded, and the air pressure in the load lock chamber 12 may be lowered by the vacuum pump P after the second substrate W2 is loaded. Similarly, when the first substrate W1 and the second substrate W2 are separately unloaded from the unload lock chamber 14, the air pressure in the unload lock chamber 14 may be lowered by the vacuum pump P after the first substrate W1 is unloaded, and the air pressure in the unload lock chamber 14 may be lowered by the vacuum pump P after the second substrate W2 is unloaded. If the first substrate W1 and the second substrate W2 are loaded or unloaded at the same time, the number of times the air pressure is lowered can be reduced, and energy consumption can be reduced.

[0152] In this embodiment, the first substrate W1 and the second substrate W2 are simultaneously transported to the bonding unit 2b by the fourth transport robot R4. The first substrate W1 and the second substrate W2 arrive in front of the bonding unit 2b at the same time. Therefore, the substrates W can be transported more efficiently than when the first substrate W1 and the second substrate W2 are transported separately to the bonding unit 2b. The fourth transport robot R4 transports the first substrate W1 and the second substrate W2 simultaneously or separately to the bonding unit 2b. In either case, there is no or short time between when the fourth transport robot R4 transports one of the first substrate W1 and the second substrate W2 to the bonding unit 2b and when it transports the other of the first substrate W1 and the second substrate W2 to the bonding unit 2b, so the bonding unit 2b can be operated efficiently.

[0153] In this embodiment, the plasma processing of the first substrate W1 and the second substrate W2 is performed by two plasma processing units 2p. The two plasma processing units 2p perform plasma processing on the first substrate W1 and the second substrate W2 such that there is a period during which the plasma processing is performed on the first substrate W1 and the second substrate W2 simultaneously. Therefore, the time required to complete the plasma processing of both the first substrate W1 and the second substrate W2 can be shortened compared to the case where the plasma processing of the second substrate W2 is started after the plasma processing of the first substrate W1 is finished.

[0154] In this embodiment, the first substrate W1 and the second substrate W2 that have been subjected to the plasma processing are cleaned by two cleaning units 2c. The two cleaning units 2c clean the first substrate W1 and the second substrate W2 with the cleaning liquid so that there is a period during which the cleaning liquid is simultaneously supplied to the first substrate W1 and the second substrate W2. Therefore, the time required to complete cleaning of both the first substrate W1 and the second substrate W2 can be shortened compared to the case where the supply of the cleaning liquid to the first substrate W1 is stopped and then the supply of the cleaning liquid to the second substrate W2 is started.

[0155] In this embodiment, the substrate W is transported from the carrier CA to the plasma processing unit 2p, and the substrate W is subjected to plasma processing. Thereafter, the substrate W is transported from the plasma processing unit 2p to the cleaning unit 2c, and the substrate W is cleaned with a cleaning liquid. Such plasma processing and cleaning are performed on two substrates W. Thereafter, the two substrates W are transported to the bonding unit 2b, and bonded by the bonding unit 2b.

[0156] The plasma processing unit 2p is disposed rearward of the multiple load ports LP. The cleaning unit 2c is disposed rearward of the plasma processing unit 2p. The bonding unit 2b is disposed rearward of the cleaning unit 2c. By transporting the substrate W from the carrier CA to the plasma processing unit 2p, the substrate W can be brought closer to the cleaning unit 2c and the bonding unit 2b. Furthermore, by transporting the substrate W from the plasma processing unit 2p to the cleaning unit 2c, the substrate W can be brought closer to the bonding unit 2b. Therefore, unnecessary movement of the substrate W can be reduced, and the substrate W can be transported efficiently.

[0157] In this embodiment, the first transport robot R1 transports the substrate W between the multiple load ports LP and the plasma processing unit 2p. The second transport robot R2 transports the substrate W transported by the first transport robot R1 into and out of the plasma processing unit 2p. The third transport robot R3 transports the substrate W unloaded from the plasma processing unit 2p by the second transport robot R2 into and out of the cleaning unit 2c. The fourth transport robot R4 transports the substrate W unloaded from the cleaning unit 2c by the third transport robot R3 into the bonding unit 2b and unloads the two bonded substrates W from the bonding unit 2b.

[0158] The third transport robot R3 transports the two substrates W that have been bonded by and removed from the bonding unit 2b to the multiple load ports LP. That is, the third transport robot R3 transports not only the substrates W before bonding, but also the substrates W after bonding. This makes it possible to reduce the number of transport robots. Furthermore, since the substrates W are carried in and out of the bonding unit 2b by the fourth transport robot R4, it is possible to reduce an increase in the burden on the third transport robot R3.

[0159] In this embodiment, the substrate W is positioned by the pre-activation aligner 11 before being carried into the plasma processing unit 2p. Similarly, the substrate W is positioned by the pre-bonding aligner 20 before being carried into the bonding unit 2b. This can shorten the time it takes for the bonding unit 2b to adjust the relative positions of the two substrates W to be bonded. Furthermore, since the substrate W is carried into and out of the pre-bonding aligner 20 by the fourth transport robot R4 instead of the third transport robot R3, the burden of transporting the substrate W can be evenly distributed to multiple transport robots including the third transport robot R3 and the fourth transport robot R4, and the increase in the burden on the third transport robot R3 can be reduced.

[0160] In this embodiment, the post-cleaning relay stage 18 supports the substrate W horizontally on a path along which the substrate W transported between the cleaning unit 2c and the bonding unit 2b passes. At least one of the substrate W before bonding transported from the cleaning unit 2c and the two substrates W bonded in the bonding unit 2b is supported horizontally by the post-cleaning relay stage 18. The third transport robot R3 not only transports the substrate W to and from the cleaning unit 2c using at least one third hand H3 that supports the substrate W horizontally, but also transports the substrate W to and from the post-cleaning relay stage 18.

[0161] The rotation actuator AR of the third transport robot R3 rotates at least one third hand H3 around a rotation center C3 that represents a vertical line. The horizontal actuator of the third transport robot R3 changes the horizontal distance from the rotation center C3 to the at least one third hand H3 by moving the at least one third hand H3 horizontally. The vertical actuator of the third transport robot R3 moves the at least one third hand H3 vertically.

[0162] The third transport robot R3 loads and unloads the substrate W by combining these operations of the third hand H3. The third transport robot R3 can load and unload the substrate W to and from both the cleaning unit 2c and the post-cleaning staging stand 18 without horizontally moving the rotation center C3 of the third transport robot R3. Therefore, the third transport robot R3 can transport the substrate W from the cleaning unit 2c to the post-cleaning staging stand 18 without horizontally moving the rotation center C3 of the third transport robot R3. This can reduce the number of operations of the third transport robot R3.

[0163] Next, another embodiment will be described.

[0164] The substrate W after plasma processing may be unloaded from the load lock chamber 12, rather than from the unload lock chamber 14. In this case, the unload lock chamber 14 may be omitted.

[0165] The layout of the load lock chamber 12, the second transfer chamber 13, the unload lock chamber 14, the cleaning unit 2c, the bonding unit 2b, etc. is not limited to the above example. For example, the load lock chamber 12, the second transfer chamber 13, and the unload lock chamber 14 may be arranged in this order in the left-right direction LR instead of in the front-rear direction FB.

[0166] When a plurality of plasma processing units 2p are provided, a plasma processing unit 2p that performs plasma processing on the first substrate W1 and plasma processing on the second substrate W2 may be included.

[0167] When performing plasma processing on a pair of a first substrate W1 and a second substrate W2, the two plasma processing units 2p may start plasma processing on the second substrate W2 after finishing plasma processing on the first substrate W1. Similarly, when performing cleaning of a pair of a first substrate W1 and a second substrate W2, the two cleaning units 2c may start cleaning of the second substrate W2 after finishing cleaning of the first substrate W1.

[0168] The first transport robot R1 may separately carry the first substrate W1 and the second substrate W2 into the load lock chamber 12. The third transport robot R3 may separately carry the first substrate W1 and the second substrate W2 out of the unload lock chamber 14. The fourth transport robot R4 may separately transport the first substrate W1 and the second substrate W2 to the bonding unit 2b. For example, the fourth transport robot R4 may carry the first substrate W1, which has been carried out from the post-cleaning staging stage 18, into the first pre-bonding aligner 20, and then carry out the second substrate W2 out of the post-cleaning staging stage 18.

[0169] At least one of the post-cleaning relay stage 18 and the post-bonding relay stage 22 may not be a fixed stage fixed to the floor surface F1 of the substrate bonding apparatus 1, but may be a shuttle that moves back and forth horizontally by moving relative to the floor surface F1 of the substrate bonding apparatus 1.

[0170] The shuttle is included in a transport system TS that transports the substrate W. The shuttle includes a movable platform that horizontally supports the substrate W, and an actuator that horizontally reciprocates the movable platform by moving the movable platform relative to the floor surface F1 of the substrate bonding apparatus 1. When the post-cleaning staging platform 18 is a shuttle, the post-cleaning staging platform 18 may travel horizontally in the third travel direction or the fourth travel direction between the starting position (position shown in FIG. 3) and the intermediate position. When the post-bonding staging platform 22 is a shuttle, the post-bonding staging platform 22 may travel horizontally in the third travel direction between the starting position (position shown in FIG. 3) and the intermediate position.

[0171] The substrate bonding apparatus 1 is not limited to an apparatus for bonding two disk-shaped substrates W, but may be an apparatus for bonding two polygonal substrates W.

[0172] Any two or more of the above mentioned features may be combined. Any two or more of the above mentioned steps may be combined.

[0173] Although the embodiments of the present invention have been described in detail, these are merely examples used to clarify the technical contents of the present invention, and the present invention should not be construed as being limited to these examples. The spirit and scope of the present invention are limited only by the appended claims. [Explanation of symbols]

[0174] 1: substrate bonding device, 2b: bonding unit, 2c: cleaning unit, 2p: plasma treatment unit, 11: pre-activation aligner, 12: load lock chamber, 13: second transfer chamber (vacuum transfer chamber), 14: unload lock chamber, 18: post-cleaning relay stand, 20: pre-bonding aligner, AH: horizontal actuator, AR: rotation actuator, AV: vertical actuator, CA: carrier, H3: third hand, LP: load port, P: vacuum pump, R1: first transfer robot, R2: second transfer robot (vacuum transfer robot), R3: third transfer robot, R4: fourth transfer robot, W: substrate, W1: first substrate, W2: second substrate, W3: third substrate

Claims

1. a plasma processing unit for performing plasma processing on substrates transferred from a plurality of carriers held by a plurality of load ports; a load lock chamber into which the substrate to be processed in the plasma processing unit is carried; an unload lock chamber into which the substrate processed in the plasma processing unit is carried; a vacuum transfer chamber through which the substrate is transferred from the load lock chamber to the plasma processing unit and through which the substrate is transferred from the plasma processing unit to the unload lock chamber; at least one vacuum pump for reducing the air pressure in the load lock chamber, the vacuum transfer chamber, and the unload lock chamber; a vacuum transfer robot that transfers the substrate from the load lock chamber to the plasma processing unit via the vacuum transfer chamber, and transfers the substrate from the plasma processing unit to the unload lock chamber via the vacuum transfer chamber; a cleaning unit that is disposed on the same side of the vacuum transfer chamber as the unload lock chamber in a plan view and that cleans the substrate transferred from the unload lock chamber; a bonding unit that bonds the two substrates cleaned in the cleaning unit.

2. 2. The substrate bonding apparatus according to claim 1, wherein the cleaning unit is disposed on an opposite side of the unload lock chamber from the vacuum transfer chamber in a plan view.

3. 3. The substrate bonding apparatus according to claim 1, wherein the bonding unit is disposed on the same side as the cleaning unit with respect to the unload lock chamber in a plan view.

4. The substrate bonding apparatus according to claim 3 , wherein the bonding unit is disposed on an opposite side of the cleaning unit from the unload lock chamber in a plan view.

5. the plurality of load ports hold the plurality of carriers so that the plurality of carriers are aligned in a left-right direction in a plan view, 3. The substrate bonding apparatus according to claim 1, wherein the load lock chamber, the vacuum transfer chamber, the unload lock chamber, and the cleaning unit are arranged in front to back in this order: the load lock chamber, the vacuum transfer chamber, the unload lock chamber, and the cleaning unit.

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