Component mounting system, component mounting device, and component mounting method

Abstract

To provide a component mounting system capable of properly managing the thickness of an adhesive between a board and a component, a component mounting device, and a component mounting method.SOLUTION: A component mounting method includes the steps of; holding a component with a nozzle (ST5); moving the nozzle holding the component above a board where adhesive is applied to the top mounting position (ST7); lowering the nozzle holding the component to mount the component onto the mounting position under specified mounting conditions (ST8); detecting the thickness of the adhesive between the top of the board and the bottom surface of the component mounted on the board (ST9); and changing the mounting conditions based on the thickness of the adhesive (ST11).SELECTED DRAWING: Figure 12

Description

[Technical field]

[0001] The present invention relates to a component mounting system, a component mounting apparatus, and a component mounting method that pick up components with a nozzle and mount them on a board. [Background technology]

[0002] Conventionally, there is known a component mounting system that includes an adhesive application device, a component mounting device, and an appearance inspection device, in which the adhesive application device applies adhesive to a board, the component mounting device mounts components with LEDs formed on their surfaces onto the board, and the appearance inspection device inspects the condition of the components mounted on the board (for example, Patent Document 1). The component mounting system disclosed in Patent Document 1 automatically corrects various setting conditions, such as the amount of adhesive applied and application position of the adhesive application device, and the component pressing force (mounting load) and component suction position of the component mounting device, based on feedback data from the appearance inspection device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 6-45753 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, there has been a demand for detailed control of the thickness of the adhesive between the board and the components after mounting. In particular, in products in which LED components are mounted on a board with an adhesive and in which heat generated from the LED components during light emission is dissipated from the board, it is necessary to strictly control the thickness of the adhesive. However, the prior art including Patent Document 1 does not disclose anything about controlling the thickness of the adhesive after mounting, and there is room for further improvement in order to mount components on a board while controlling the thickness of the adhesive after mounting.

[0005] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide a component mounting system, a component mounting apparatus, and a component mounting method that are capable of appropriately controlling the thickness of the adhesive between a board and a component. [Means for solving the problem]

[0006] The present disclosure provides a component mounting system which adsorbs a component with a nozzle and mounts it on a board, the system comprising: board height measurement means which measures the board height at a mounting position on the top surface of the board; adhesive application means which applies adhesive to the mounting position under predetermined application conditions; a mounting head which has a nozzle which holds a component and moves above the board and lowers the nozzle holding the component to mount the component at the mounting position under predetermined mounting conditions; and nozzle height measurement means which measures the height of the adsorption surface of the nozzle, wherein the mounting head stops the descent of the nozzle when the height of the adsorption surface of the nozzle which is pressing the component against the board reaches a height which is the measured board height plus the component thickness of the component and a preset adhesive thickness of the adhesive.

[0007] The present disclosure also provides a component mounting device that adsorbs a component with a nozzle and mounts it on a board, the component mounting device comprising: a board height measuring means that measures the board height at a mounting position on the top surface of the board; a mounting head that has a nozzle that holds a component, and moves above a board on which adhesive has been applied at the mounting position and lowers the nozzle holding the component to mount the component at the mounting position under predetermined mounting conditions; and a nozzle height measuring means that measures the height of the adsorption surface of the nozzle, wherein the mounting head stops the descent of the nozzle when the height of the adsorption surface of the nozzle that is pressing the component against the board reaches a height that is the measured board height plus a component thickness of the component and a preset adhesive thickness of the adhesive.

[0008] The present disclosure also provides a component mounting method for suctioning a component with a nozzle and mounting it on a board, the component mounting method including a board height measurement step of measuring the board height at the mounting position on the top surface of the board, a component holding step of holding the component with a nozzle, a nozzle moving step of moving the nozzle holding the component to above the board on which adhesive has been applied at the mounting position, a component pressing step of lowering the nozzle holding the component to press the component against the mounting position, and a nozzle height measurement step of measuring the height of the suction surface of the nozzle during the component pressing step, wherein the component pressing step is terminated when the height of the suction surface of the nozzle reaches the measured board height plus the component thickness of the component and a preset adhesive thickness of the adhesive. Effect of the Invention

[0009] According to the present invention, the thickness of the adhesive between the substrate and the component can be appropriately controlled. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a configuration explanatory diagram of a component mounting system according to an embodiment of the present invention; [Diagram 2] FIG. 2A is a front view of an example of a component mounted on a board by a component mounting apparatus according to an embodiment of the present invention; [Diagram 3] FIG. 1 is a configuration explanatory diagram of a component mounting device according to an embodiment of the present invention; [Figure 4] FIG. 1 is a functional explanatory diagram of a component mounting device according to an embodiment of the present invention; [Diagram 5] FIG. 1 is a block diagram showing a configuration of a control system of a component mounting apparatus according to an embodiment of the present invention. [Figure 6] FIG. 1 is a front view and a plan view illustrating a substrate height measurement process in a component mounting device according to an embodiment of the present invention. [Figure 7] FIG. 1 is a front view and a plan view illustrating an adhesive application process in a component mounting apparatus according to an embodiment of the present invention; [Figure 8] FIG. 1 is an explanatory diagram for explaining a component thickness measurement process in a component mounting device according to an embodiment of the present invention. [Figure 9] FIG. 1 is a front view and a plan view illustrating a component pressing process in a component mounting device according to an embodiment of the present invention; [Figure 10] FIG. 1 is a front view illustrating a component height measurement process in a component mounting device according to an embodiment of the present invention; [Figure 11] FIG. 1 is a flow diagram of a first embodiment of a component mounting method according to the present invention. [Figure 12] 2 is a flow diagram of a second embodiment of a component mounting method according to an embodiment of the present invention; [Figure 13] FIG. 3 is a flow diagram of a third embodiment of a component mounting method according to an embodiment of the present invention. [Figure 14] FIG. 3 is a flow diagram of a third embodiment of a component mounting method according to an embodiment of the present invention. [Figure 15] FIG. 4 is a flow diagram of a fourth embodiment of a component mounting method according to an embodiment of the present invention. [Figure 16] FIG. 4 is a flow diagram of a fourth embodiment of a component mounting method according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation and can be appropriately changed according to the specifications of the component mounting system, adhesive application device, component mounting device, etc. In the following, the same reference numerals are used for corresponding elements in all drawings, and duplicated explanations are omitted. In FIG. 2 and some parts described later, the X-axis (left-right direction in FIG. 3) in the board transport direction and the Y-axis (up-down direction in FIG. 3) perpendicular to the board transport direction are shown as two axes perpendicular to each other in the horizontal plane. In FIG. 2 and some parts described later, the Z-axis (up-down direction in FIG. 4) is shown as the height direction perpendicular to the horizontal plane.

[0012] First, the configuration of the component mounting system 1 will be described with reference to Fig. 1. The system is configured by connecting production devices such as an adhesive application device M1 and a component mounting device M2 in series from upstream (left side of the page) to downstream (right side of the page) in the board transport direction. Each production device is connected to a management computer 3 via a communication network 2. The component mounting system 1 has the function of processing a board B carried into the adhesive application device M1 in sequence while transporting the board B, and mounting a component D on the board B to produce a mounted board. Note that the component mounting system 1 is a group of production devices connected via the communication network 2, and the production devices do not need to be physically connected to each other.

[0013] 1, adhesive application device M1 applies adhesive under preset application conditions to mounting position P or the vicinity of mounting position P set on the top surface of board B carried in from upstream by the adhesive application work unit. In other words, adhesive application device M1 is an adhesive application means that applies adhesive under predetermined application conditions to mounting position P on the top surface of board B. Component mounting device M2 performs component mounting work to mount component D at mounting position P of board B to which adhesive has been applied by the component mounting work unit.

[0014] Here, referring to FIG. 2, an example of a component D mounted on a board B will be described. In the component D, an LED portion Db and a plurality of electrodes Dc are formed on the upper surface of a main body portion Da. An LED chip is attached to the LED portion Db. The plurality of electrodes Dc are connected to the LED chip of the LED portion Db. The LED portion Db emits light by supplying a predetermined voltage and current from the plurality of electrodes Dc. The upper surface of the LED portion Db is located at the highest position in the component D, and the upper surface of the LED portion Db is defined as the upper surface De of the component D. In addition, the lower surface of the main body portion Da is located at the lowest position in the component D, and the lower surface of the main body portion Da is defined as the lower surface Dd of the component D. The difference between the upper surface De and the lower surface Dd of the component D is defined as the component thickness Td of the component D.

[0015] Next, the configuration of the component mounting apparatus M2 will be described with reference to Fig. 3 and Fig. 4. Fig. 4 shows a schematic view of a part of the component mounting apparatus M2 including the mounting head in Fig. 3. The component mounting apparatus M2 has a function of performing a component mounting operation to mount the components D supplied from a component supply unit onto the board B. The component mounting apparatus M2 also has a function of applying adhesive to the board B. In other words, the component mounting apparatus M2 can apply adhesive to the board B and mount the components D without being connected to the adhesive application apparatus M1.

[0016] In Fig. 3, a board transport mechanism 5 is disposed along the X-axis at the center of the base 4. The board transport mechanism 5 transports the board B transported from upstream to the mounting work position, positions it, and holds it. The board transport mechanism 5 also transports the board B downstream after component mounting work has been completed. A component supply unit 6 is disposed on one side (the front side in the Y-axis direction) of the board transport mechanism 5. The component supply unit 6 has multiple tape feeders 7 and tray feeders 8 attached in parallel along the X-axis.

[0017] Tape feeder 7 pitch-feeds a component tape, on which pockets for storing components D are formed, in a direction (tape feed direction) from the outside of component supply unit 6 toward board transport mechanism 5, to supply components D to a component supply position from which components D are picked up by a mounting head, which will be described below. Tray feeder 8 moves pallet 9, on which trays 10, which store a plurality of components D in an array, are placed, to the component supply position, and supplies components D on trays 10.

[0018] In Fig. 3, a Y-axis table 11 equipped with a linear drive mechanism is arranged along the Y-axis at both ends in the X-axis direction on the upper surface of the base 4. A front beam 12A and a rear beam 12B, which are also equipped with linear drive mechanisms, are connected to the Y-axis table 11 so as to be movable along the Y-axis. The front beam 12A and the rear beam 12B are arranged along the X-axis. A front plate 12Aa is attached to the front beam 12A so as to be movable along the X-axis. A mounting head 13 is attached to the front plate 12Aa.

[0019] 3 and 4, the mounting head 13 is equipped with a plurality of (four in this example) suction units 14. A nozzle 13a is attached to the lower end of a shaft of each suction unit 14. The nozzle 13a sucks and holds a component D on a suction surface 13b. Each suction unit 14 has a function of raising and lowering the shaft in the vertical direction (Z-axis direction) (arrow a) and rotating the nozzle 13a by θ around the Z axis.

[0020] Each suction unit 14 is also equipped with an encoder 14a that detects the height of the shaft. The nozzle height Hn of the nozzle 13a is detected from the output of the encoder 14a. In this manner, the suction unit 14 rotates the nozzle 13a by a predetermined rotation angle θ, and lowers the nozzle 13a in the Z-axis direction according to preset mounting conditions, thereby mounting the component D held by the nozzle 13a at the mounting position P on the board B.

[0021] In Fig. 3, a rear plate 12Ba is attached to the rear beam 12B so as to be movable along the X-axis. A coating head 16 is attached to the rear plate 12Ba. The coating head 16 includes a dispenser 17 that applies adhesive C to the upper surface of the substrate B according to preset coating conditions (see Fig. 7).

[0022] 3, the Y-axis table 11 and the front beam 12A constitute a mounting head moving mechanism 15A that moves the mounting head 13 in the X-axis and Y-axis directions. The mounting head moving mechanism 15A and the mounting head 13 perform a mounting turn in which the nozzle 13a picks up and picks up the component D from the tape feeder 7 or the tray feeder 8 arranged in the component supply unit 6, and mounts it at the mounting position P of the board B positioned by the board transport mechanism 5.

[0023] The Y-axis table 11 and the rear beam 12B constitute a coating head moving mechanism 15B that moves the coating head 16 in the X-axis and Y-axis directions. The coating head moving mechanism 15B and the coating head 16 perform an adhesive coating operation to apply adhesive C to the mounting position P or the vicinity of the mounting position P of the substrate B positioned by the substrate transport mechanism 5.

[0024] 3 and 4, a head camera 19 is attached to the front plate 12Aa to which the mounting head 13 is attached. The head camera 19 moves integrally with the mounting head 13. As the mounting head 13 moves, the head camera 19 moves to above the board B positioned by the board transport mechanism 5, and captures an image of a board mark (not shown) provided on the board B. The position of the board B is recognized from the image capture result.

[0025] A component recognition camera 20 is disposed between the component supply unit 6 and the board transport mechanism 5. When the mounting head 13, which has picked up a component D from the component supply unit 6, moves above the component recognition camera 20, the component recognition camera 20 captures an image of the component D held by the mounting head 13 (see FIG. 8). From the captured image, the holding posture of the component D is recognized. When the mounting head 13 mounts the component on the board B, the mounting position is corrected taking into account the recognition result of the component D by the component recognition camera 20 and the recognition result of the board position by the head camera 19.

[0026] 3 and 4, a height sensor 18 (distance sensor) such as a laser displacement sensor that moves integrally with the mounting head 13 by the mounting head moving mechanism 15A is installed on one side of the mounting head 13. The height sensor 18 includes a laser light source that projects laser light downward, and a light receiving element that receives the reflected light of the laser light projected by the laser light source. The height sensor 18 is controlled by a height sensor measurement processing unit 41 (see FIG. 5), and projects and receives laser light to derive the distance to the measurement target using the principle of triangulation. The height sensor 18 measures the distance to the upper surface Ba of the substrate B while the substrate B is held by the substrate transport mechanism 5, thereby measuring the substrate height Hb.

[0027] 3, a touch panel I operated by an operator is installed at a position where an operator works on component mounting device M2. Touch panel I displays various information such as error information on its display unit, and an operator inputs data and operates component mounting device M2 using operation buttons displayed on the display unit.

[0028] Next, a detailed configuration of the board transport mechanism 5 will be described with reference to Figures 3 and 4. In the board transport mechanism 5, a pair of transport conveyors 24 are installed inside a pair of plate-like members 23 extending in the X-axis direction. The transport conveyor 24 supports both ends of the board B from below and transports it in the X-axis direction by a transport belt driven by a motor (not shown). A pressure plate 21 that protrudes above the transport conveyor 24 is installed on the upper ends of the pair of plate-like members 23. The distance between the lower surface of the pressure plate 21 and the upper surface of the transport conveyor 24 is wider than the thickness of the board B transported by the transport conveyor 24.

[0029] Below the board B being transported to the mounting work position, a lower support member 22 that is raised and lowered (arrow b) by a cylinder 25 is provided. The board transport mechanism 5 positions the board B at the mounting work position, raises the lower support member 22 to lift the board B from the transport conveyor 24, and holds the board B at the mounting work position by pressing down both edges of the board B from above with the lower surfaces of the pressing plates 21 (the state shown in FIG. 4). When transporting the board B, the board transport mechanism 5 lowers the lower support member 22 to a position where it does not interfere with the lower surface of the board B, and releases the board B.

[0030] Next, the configuration of the component recognition camera 20 will be described with reference to Fig. 8. A transparent plate 27 is installed on the upper part of the housing 26 of the component recognition camera 20 by cutting out a part of the housing 26. A central camera unit 29, a left camera unit 28L, and a right camera unit 28R are installed inside the housing 26. The central camera unit 29, the left camera unit 28L, and the right camera unit 28R are arranged so as to be able to capture an image of the underside Dd of the component D held by the nozzle 13a located at the imaging height He.

[0031] The central camera unit 29 is installed with its optical axis 29a facing upward, and images the target component D from below. The left camera unit 28L is disposed on the left side of the central camera unit 29 in the X-axis direction (upstream in the board transport direction). The left camera unit 28L is installed with its optical axis 28La facing upward and to the right, and images the target component D from the lower left. The right camera unit 28R is disposed on the right side of the central camera unit 29 in the X-axis direction (downstream in the board transport direction). The right camera unit 28R is installed with its optical axis 28Ra facing upward and to the left, and images the target component D from the lower right.

[0032] The optical axis 28La of the left camera unit 28L and the optical axis 28Ra of the right camera unit 28R are set to intersect in a range including an imaging height He at which the bottom surface Dd of the part D held by the nozzle 13a is located. The imaging height He at which the bottom surface Dd of the part D is located is detected from the parallax between the image of the part D captured by the left camera unit 28L and the image of the part D captured by the right camera unit 28R. In other words, the left camera unit 28L and the right camera unit 28R form a stereo camera that detects the imaging height He of the part D held by the nozzle 13a.

[0033] Next, the configuration of the control system of the component mounting device M2 will be described with reference to Fig. 5. The component mounting device M2 includes a control device 30 to which are connected a board transport mechanism 5, a tape feeder 7, a tray feeder 8, a mounting head 13, a mounting head moving mechanism 15A, a coating head 16, a coating head moving mechanism 15B, a height sensor 18, a head camera 19, a component recognition camera 20, and a touch panel I. The control device 30 includes a memory unit 31, a nozzle height measurement processing unit 40, a height sensor measurement processing unit 41, an adhesive coating processing unit 42, a component thickness measurement processing unit 43, a mounting control unit 44, an adhesive thickness calculation unit 45, and a condition change unit 46.

[0034] The storage unit 31 is a storage device, and stores production data 32, component data 33, adhesive data 34, application condition data 35, mounting condition data 36, ​​board height data 37, component thickness data 38, component height data 39, etc. The production data 32 stores, for each mounting position P where the component D is mounted on the board B, the mounting order of the component D, the component mounting coordinates (X coordinate, Y coordinate, component direction), the component name (type) of the component D, the type and size (length) of the nozzle 13a that picks up the component D, etc. The component data 33 stores, for each component name of the component D, the size and shape of the component D, the normal pickup target position of the nozzle 13a on the component D, an offset value between the pickup target position and the component mounting coordinates, etc.

[0035] 5, the adhesive data 34 stores a target value, an allowable range, and the like of an adhesive thickness Tc (see FIG. 10(a)) of the adhesive C between the upper surface Ba of the board B and the lower surface Dd of the component D mounted on the board B. The application condition data 35 stores control parameters related to the application amount of adhesive C applied by the application head 16 to the board B, such as the discharge speed at which the dispenser 17 discharges the adhesive C, the movement speed of the application head 16 applying the adhesive C, and the application area of ​​the adhesive C. The mounting condition data 36 stores control parameters for mounting the component D on the board B, such as the pressing time for which the nozzle 13a presses the component D against the board B, the mounting load, and the like.

[0036] The nozzle height measurement processor 40 measures the height of the suction surface 13b of the nozzle 13a (nozzle height Hn) based on the output signal of the encoder 14a of the suction unit 14 provided in the mounting head 13 and the size (length) of the nozzle 13a attached to the suction unit 14 (FIGS. 4 and 9(a)). In other words, the mounting head 13 and the nozzle height measurement processor 40 constitute a nozzle height measuring means 47 that measures the height of the suction surface 13b of the nozzle 13a (nozzle height Hn).

[0037] 5, height sensor measurement processing unit 41 controls mounting head moving mechanism 15A to move height sensor 18 above a predetermined measurement position, and measures the height of upper surface Ba of board B located below height sensor 18 (board height Hb) (FIG. 6(a)) and the height of upper surface De of component D mounted on board B (component height Hd) (FIG. 10(a)) based on the output signal of height sensor 18. In this way, mounting head moving mechanism 15A, height sensor 18, and height sensor measurement processing unit 41 constitute height sensor measurement means 48 that measures the height of a predetermined measurement position.

[0038] That is, the height sensor measurement means 48 is a board height measurement means that measures the board height Hb at the mounting position P on the top surface Ba of the board B (FIG. 6(a)), and is also a component height measurement means that measures the component height Hd on the top surface De of the component D mounted on the board B (FIG. 10(a)). In other words, the board height measurement means and the component height measurement means measure the board height Hb and the component height Hd using the same height measurement unit (height sensor 18). The measured board height Hb is stored in the memory unit 31 as board height data 37. In addition, the measured component height Hd is stored in the memory unit 31 as component height data 39.

[0039] 5, adhesive application processing unit 42 controls application head moving mechanism 15B and application head 16 based on application conditions included in application condition data 35 to apply adhesive C discharged by dispenser 17 to upper surface Ba of substrate B. That is, application head moving mechanism 15B, application head 16, and adhesive application processing unit 42 constitute adhesive application means 49 that applies adhesive C under predetermined application conditions to mounting position P on upper surface Ba of substrate B or in the vicinity of mounting position P.

[0040] 5, the component thickness measurement processing unit 43 detects the height (imaging height He) of the bottom surface Dd of the component D held by the nozzle 13a based on images captured by the left camera unit 28L and right camera unit 28R (stereo cameras) of the component recognition camera 20 (FIG. 8). Furthermore, the component thickness measurement processing unit 43 calculates the component thickness Td of the component D from the difference between the nozzle height Hn detected by the nozzle height measurement means 47 and the imaging height He. In other words, the component recognition camera 20 and the component thickness measurement processing unit 43 constitute a component thickness measurement means 50 that measures the component thickness Td of the component D held by the nozzle 13a.

[0041] The measured component thickness Td is stored in the storage unit 31 as component thickness data 38. The storage unit 31 may store the component thickness Td measured before the component D is stored on the component tape or tray 10 as the component thickness data 38. The storage unit 31 may store a catalog value for the component thickness Td of the component D as the component thickness data 38. The component thickness measuring means 50 may be configured to include a camera that captures an image of the component D from the side, and to calculate the component thickness Td from the image captured by the camera.

[0042] 5, the mounting control unit 44 controls the suction unit 14 of the mounting head 13 and the mounting head moving mechanism 15A based on the mounting conditions included in the production data 32 and the mounting condition data 36, ​​causes the nozzle 13a to pick up the component D from the component supply unit 6, moves the nozzle 13a to above the board B on which the adhesive C has been applied, and lowers the nozzle 13a holding the component D to mount the component D at the mounting position P (FIG. 9). When mounting the component D on the board B, the mounting control unit 44 causes the nozzle 13a to press the component D against the board B for a pressing time with the mounting load F specified in the mounting conditions. In the process of pressing the component D against the board B, the adhesive C applied to the board B is crushed and spreads laterally, resulting in a predetermined adhesive thickness Tc.

[0043] The adhesive thickness calculation unit 45 calculates the adhesive thickness Tc of the adhesive C between the board B and the component D based on the board height Hb of the mounting position P where the component D is mounted, which is included in the board height data 37, the component thickness Td, which is included in the component thickness data 38, and the component height Hd of the component D mounted on the board B, which is included in the component height data 39. That is, the board height measurement means (height sensor measurement means 48), the component thickness measurement means 50, and the component height measurement means (height sensor measurement means 48) constitute an adhesive thickness detection means 51.

[0044] The component height Hd may be determined by lowering the nozzle 13a to contact the top surface De of the component D mounted on the board B and measuring the nozzle height Hn by the nozzle height measuring means 47 at this time. In this case, the nozzle height measuring means 47 that measures the component height Hd based on the height (nozzle height Hn) of the suction surface 13b of the nozzle 13a that contacts the top surface De of the component D serves as the component height measuring means.

[0045] 5, adhesive thickness detection means 51 calculates adhesive thickness Tc based on the measured component height Hd, the measured board height Hb, the measured component thickness Td, or a catalog value of the component thickness Td. The adhesive thickness detection means 51 may be configured to include a camera that captures an image of a component D mounted on a board B from an oblique side, and detect the component thickness Td from the length of a gap between an upper surface Ba of the board B and a lower surface Dd of the component D in an image captured by the camera. Also, the component mounting system 1 may be configured to include a component height measurement means in a mounting inspection device (not shown) downstream of the component mounting device M2, and the adhesive thickness detection means 51 may calculate the adhesive thickness Tc based on the component height Hd calculated by the mounting inspection device.

[0046] The adhesive thickness detection means 51 may detect the adhesive thickness Tc every time a component D is mounted on the board B, or may detect the adhesive thickness Tc at predetermined time intervals (for example, every 5 minutes, or every time 10 components D are mounted). Furthermore, the adhesive thickness detection means 51 may increase the detection interval when the fluctuation in the detected adhesive thickness Tc becomes small.

[0047] 5, when the detected adhesive thickness Tc exceeds an allowable range (predetermined range) included in the adhesive data 34, the condition change unit 46 changes at least one of the application conditions in the application condition data 35 and the mounting conditions in the mounting condition data 36. For example, the condition change unit 46 changes a control parameter related to the amount of adhesive C applied to the board B, among the application conditions, to update the application condition data 35. The condition change unit 46 also changes at least one of the control parameters related to the mounting load and the pressing time for which the nozzle 13a presses the component D against the board B when mounting the component D on the board B, among the mounting conditions, to update the mounting condition data 36.

[0048] Next, a first embodiment of a component mounting method for adsorbing a component D with a nozzle 13a and mounting the component D on a board B will be described with reference to the flow chart in FIG. 11. The first embodiment is performed by a component mounting system 1 including an adhesive application device M1 (adhesive application means) and a component mounting device M2 shown in FIG. 1. First, the adhesive application device M1 applies adhesive C to the mounting position P or the vicinity of the mounting position P on the upper surface Ba of the board B carried in from upstream under a predetermined application condition (ST1: first adhesive application step) (FIG. 7). Next, the board transport mechanism 5 of the component mounting device M2 carries in the board B with the adhesive C applied thereto to the mounting work position (ST2: board carrying step), and raises the lower support member 22 to sandwich the board B with the pressing plate 21 and hold the board B (ST3: board holding step).

[0049] Next, the board height measuring means (height sensor measuring means 48) uses the height sensor 18 to measure the board height Hb at the mounting position P on the top surface Ba of the board B (ST4: board height measuring step) (FIG. 6). Next, the nozzle 13a holds the component D supplied to the component supply unit 6 (ST5: component holding step). Next, the component thickness measuring means 50 uses the stereo camera (component recognition camera 20) to measure the component thickness Td of the component D held by the nozzle 13a (ST6: component thickness measuring step) (FIG. 8). Next, the nozzle 13a holding the component D moves above the board B where the adhesive C has been applied to the mounting position P on the top surface Ba (ST7: nozzle moving step).

[0050] 11, the mounting control unit 44 then lowers the nozzle 13a holding the component D to mount the component D at the mounting position P under predetermined mounting conditions (ST8: component mounting step) (FIG. 9). Next, the component height measurement means (height sensor measurement means 48) measures the component height Hd of the component D mounted on the board B (FIG. 10), and the adhesive thickness detection means 51 detects (calculates) the adhesive thickness Tc of the adhesive C between the upper surface Ba of the board B and the lower surface Dd of the component D mounted on the board B based on the board height Hb, the component thickness Td, and the component height Hd (ST9: adhesive thickness detection step).

[0051] Next, the condition change unit 46 judges whether the adhesive thickness Tc is within the allowable range (predetermined range) (ST10: allowable range judgment step). If the adhesive thickness Tc exceeds the allowable range (No in ST10), the condition change unit 46 changes at least one of the application conditions and the mounting conditions based on the adhesive thickness Tc (ST11: condition change step). If the adhesive thickness Tc is within the allowable range (Yes in ST10), the condition change unit 46 does not change either the application conditions or the mounting conditions.

[0052] Next, the board height measurement step (ST4) through the condition change step (ST11) are repeatedly executed until all components D are mounted on board B (No in ST12). When all components D are mounted on board B (Yes in ST12), board transport mechanism 5 releases board B (ST13: board release step) and transports board B with components D mounted thereon downstream (ST14: board transport step). This allows the adhesive thickness Tc of adhesive C between board B and components D to be appropriately managed.

[0053] In the above, the board height measurement process (ST4) is described as being executed each time a component D is mounted, but the board heights Hb of all mounting positions P on the board B may be measured in the board height measurement process (ST4), and then the component holding process (ST5) through the condition change process (ST11) may be repeated.

[0054] As described above, the component mounting system 1 of the present embodiment includes an adhesive application means (adhesive application device M1) that applies adhesive C under predetermined application conditions to the mounting position P on the upper surface Ba of the substrate B, a mounting head 13 having a nozzle 13a that holds a component D, which moves above the substrate B and lowers the nozzle 13a holding the component D to mount the component D under predetermined mounting conditions at the mounting position P, an adhesive thickness detection means 51 that detects an adhesive thickness Tc of the adhesive C between the upper surface Ba of the substrate B and the lower surface Dd of the component D mounted on the substrate B, and a condition change unit 46 that changes at least one of the application conditions and the mounting conditions based on the adhesive thickness Tc. This allows the adhesive thickness Tc of the adhesive C between the substrate B and the component D to be appropriately managed.

[0055] Next, a second embodiment of the component mounting method in which a component D is sucked by a nozzle 13a and mounted on a board B will be described with reference to the drawing along the flow of Fig. 12. The second embodiment differs from the first embodiment in that, instead of the adhesive application device M1, an adhesive application means 49 of the component mounting device M2 applies adhesive C to the board B. That is, the second embodiment is performed by the component mounting device M2 alone. Hereinafter, the same steps as those in the first embodiment are given the same reference numerals, and detailed explanations will be omitted.

[0056] First, a board loading step (ST2), a board holding step (ST3), and a board height measuring step (ST4) are performed. Next, the adhesive applying means 49 applies the adhesive C discharged from the dispenser 17 to the mounting position P or the vicinity of the mounting position P on the upper surface Ba of the board B under a predetermined application condition (ST21: second adhesive applying step) (FIG. 7). Next, the component holding step (ST5) to the condition changing step (ST11) are performed. Next, the board height measuring step (ST4) to the condition changing step (ST11) are repeatedly performed until all the components D are mounted on the board B (No in ST12). When all the components D are mounted on the board B (Yes in ST12), the board release step (ST13) and the board unloading step (ST14) are performed. This allows the adhesive thickness Tc of the adhesive C between the board B and the components D to be appropriately managed.

[0057] In the above, the board height measurement process (ST4) and the second adhesive application process (ST21) are performed each time a component D is mounted. However, the board heights Hb of all mounting positions P on the board B may be measured in the board height measurement process (ST4), adhesive C may be applied to all mounting positions P or in the vicinity of mounting positions P in the second adhesive application process (ST21), and then the component holding process (ST5) through the condition change process (ST11) may be repeated.

[0058] As described above, the component mounting apparatus M2 of this embodiment includes a mounting head 13 having a nozzle for holding a component, which moves above the board B on which adhesive C has been applied at a mounting position P on the top surface Ba, and lowers the nozzle 13a holding the component D to mount the component D at the mounting position P under predetermined mounting conditions, adhesive thickness detection means 51 for detecting an adhesive thickness Tc of the adhesive C between the top surface Ba of the board B and the bottom surface Dd of the component D mounted on the board B, and a condition change unit 46 for changing the mounting conditions based on the adhesive thickness Tc. This makes it possible to appropriately manage the adhesive thickness Tc of the adhesive C between the board B and the component D.

[0059] 13 and 14, a third embodiment of a component mounting method in which component D is sucked by nozzle 13a and mounted on board B will be described with reference to the drawings. The third embodiment differs from the second embodiment in that if the nozzle 13a does not press component D against board B for an insufficient pressing time, component D is additionally pressed against board B. Hereinafter, the same steps as in the first and second embodiments are denoted by the same reference numerals, and detailed explanations will be omitted.

[0060] 13, first, a substrate loading step (ST2) through a nozzle moving step (ST7) are executed. At this point, the nozzle 13a holding the component D has moved to above the mounting position P of the substrate B on which the adhesive C has been applied.

[0061] 14, the mounting control unit 44 then lowers the nozzle 13a holding the component D, and presses the component D against the board B for a predetermined pressing time (ST22: component pressing step) (FIG. 9). Next, an adhesive thickness detection step (ST9) is executed, and the mounting control unit 44 judges whether the adhesive thickness Tc has reached the target value of the adhesive thickness Tc included in the adhesive data 34 (ST23: adhesive thickness judgment step). If the adhesive thickness Tc has not reached the target value (No in ST23), the mounting control unit 44 lowers the nozzle 13a, and presses the component D mounted on the board B against the board B for a predetermined additional pressing time (ST24: additional component pressing step) (FIG. 9).

[0062] Next, an adhesive thickness detection step (ST9) is performed, and the mounting control unit 44 judges whether the adhesive thickness Tc has reached the target value of the adhesive thickness Tc (ST25: adhesive thickness addition judgment step). If the adhesive thickness Tc has not reached the target value (No in ST25), the component addition pressing step (ST24) is performed again. If the adhesive thickness Tc has reached the target value (Yes in ST25), the condition change step (ST11) is performed. If the adhesive thickness Tc has reached the target value during the pressing time of the component pressing step (ST22) (Yes in ST23), the condition change step (ST11) is not performed.

[0063] 14, the board height measurement step (ST4) through the condition change step (ST11) are then repeatedly executed until all components D are mounted on the board B (No in ST12). When all components D are mounted on the board B (Yes in ST12), the board release step (ST13) and the board removal step (ST14) are executed. This allows the adhesive thickness Tc of the adhesive C between the board B and the components D to be appropriately managed.

[0064] As described above, in the third embodiment of the component mounting method of the present embodiment, after the nozzle 13a presses the component D against the board B for a predetermined pressing time (after ST22), if the adhesive thickness Tc detected by the adhesive thickness detection means 51 does not reach the target value (predetermined thickness) (No in ST23), the nozzle 13a further presses the component D against the board B for a predetermined additional pressing time (ST24). Then, when the adhesive thickness Tc reaches the target value (Yes in ST25), the condition change unit 46 changes at least one of the application conditions and the mounting conditions (ST11). Specifically, the condition change unit 46 changes the target value of the pressing time of the mounting conditions to the time to which the additional pressing time is added. This allows the adhesive thickness Tc of the adhesive C between the board B and the component D to be appropriately managed.

[0065] 15 and 16, a fourth embodiment of the component mounting method in which the component D is sucked by the nozzle 13a and mounted on the board B will be described with reference to the drawings. The fourth embodiment differs from the second embodiment in that the adhesive thickness Tc is calculated while the nozzle 13a is pressing the component D against the board B. Hereinafter, the same steps as the first and second embodiments are denoted by the same reference numerals, and detailed explanations will be omitted.

[0066] 15, first, a substrate loading step (ST2) through a nozzle moving step (ST7) are executed. At this point, the nozzle 13a holding the component D has moved to above the mounting position P of the substrate B on which the adhesive C has been applied.

[0067] 16, the mounting control unit 44 then starts the descent of the nozzle 13a holding the component D toward the mounting position P (ST31: nozzle descent start step). Next, the nozzle height measurement means 47 measures the height (nozzle height Hn) of the suction surface 13b of the nozzle 13a (ST32: nozzle height measurement step) (FIG. 9). Next, the adhesive thickness calculation unit 45 calculates the adhesive thickness Tc based on the nozzle height Hn, the board height Hb, and the component thickness Td (ST33: adhesive thickness calculation step).

[0068] Next, the mounting control unit 44 judges whether the calculated adhesive thickness Tc reaches the target value of the adhesive thickness Tc included in the adhesive data 34 (ST34: adhesive thickness judgment step). If the target value of the adhesive thickness Tc has not been reached (No in ST34), the mounting control unit 44 judges whether a preset pressing time has elapsed (ST35: pressing time elapse judgment step). If the pressing time has not elapsed (No in ST35), the nozzle 13a continues to press down the component D, and the nozzle height measurement step (ST32) is executed.

[0069] 16, when the pressing time has elapsed (Yes in ST35), the mounting control unit 44 causes the touch panel I to notify an error (ST36: error notifying step). That is, the touch panel I and the mounting control unit 44 constitute a notifying means for notifying an error when the set adhesive thickness Tc is not reached even when the nozzle 13a presses the component D against the board B for a preset pressing time (Yes in ST35).

[0070] When the adhesive thickness Tc reaches the target value (Yes in ST34), the mounting control unit 44 raises the nozzle 13a (ST37: nozzle raising step). Thus, the period from the nozzle lowering start step (ST31) to before the start of the nozzle raising step (ST37) is the component pressing step (ST38) in which the nozzle 13a holding the component D is lowered to press the component D against the mounting position P. The nozzle height measurement step (ST32) is then executed during the component pressing step (ST38).

[0071] 15 and 16, the substrate height measurement step (ST4) through the nozzle lifting step (ST37) are then repeatedly executed until all components D are mounted on the substrate B (No in ST12). When all components D are mounted on the substrate B (Yes in ST12), the substrate release step (ST13) and the substrate removal step (ST14) are executed. This allows the adhesive thickness Tc of the adhesive C between the substrate B and the components D to be appropriately managed.

[0072] As described above, the fourth embodiment of the component mounting method of this embodiment, in which the component D is sucked up by the nozzle 13a and mounted on the board B, includes a board height measurement process (ST4) of measuring the board height Hb of the mounting position P on the upper surface Ba of the board B, a component holding process (ST5) of holding the component D with the nozzle 13a, a nozzle moving process (ST7) of moving the nozzle 13a holding the component D to above the mounting position P or the board B on which adhesive C has been applied near the mounting position P, a component pressing process (ST38) of lowering the nozzle 13a holding the component D and pressing the component D against the mounting position P, and a nozzle height measurement process (ST32) of measuring the height (nozzle height Hn) of the suction surface 13b of the nozzle 13a during the component pressing process (ST38).

[0073] Then, in the component pressing process (ST38), when the height (nozzle height Hn) of the suction surface 13b of the nozzle 13a reaches the measured board height Hb plus the component thickness Td of the component D and the predetermined adhesive thickness Tc of the adhesive C (Yes in ST34), the component pressing process (ST38) is terminated.

[0074] In addition, the component mounting apparatus M2 (component mounting system 1) of this embodiment is equipped with a board height measuring means (height sensor measuring means 48) that measures the board height Hb at the mounting position P on the upper surface Ba of the board B, a mounting head 13 having a nozzle 13a that holds a component D and that moves above the board B where adhesive C has been applied at the mounting position P or in the vicinity of the mounting position P and lowers the nozzle 13a holding the component D to mount the component D at the mounting position P under predetermined mounting conditions, and a nozzle height measuring means 47 that detects the height (nozzle height Hn) of the suction surface 13b of the nozzle 13a.

[0075] Then, the mounting head 13 stops the downward movement of the nozzle 13a when the height (nozzle height Hn) of the suction surface 13b of the nozzle 13a pressing the component D against the board B reaches a height obtained by adding the measured board height Hb, the component thickness Td of the component D, and the preset adhesive thickness Tc of the adhesive C. This makes it possible to appropriately manage the adhesive thickness Tc of the adhesive C between the board B and the component D. [Industrial Applicability]

[0076] The component mounting system, component mounting apparatus, and component mounting method of the present invention have the effect of enabling appropriate management of the thickness of the adhesive between a substrate and a component, and are useful in fields where components are mounted on substrates. [Explanation of symbols]

[0077] 1 Component mounting system 13 Mounting head 13a Nozzle 13b Adsorption surface 18 Height sensor (height measurement part) 47 Nozzle height measurement means (component height measurement means) 48 Height sensor measurement means (board height measurement means, component height measurement means) 49 Adhesive application means 50 Component thickness measurement means 51 Adhesive thickness detection means B Substrate Ba Top C. Adhesive D parts Dd bottom surface De top surface Hb Board height Hd Part height Hn Nozzle height (height of the adsorption surface) M1 Adhesive application device (adhesive application means) M2 component mounting equipment P mounting position Tc adhesive thickness Td Part thickness

Claims

1. A component mounting system that picks up components with a nozzle and mounts them on a substrate, a board height measuring means for measuring the board height at a mounting position on the top surface of the board; an adhesive application means for applying adhesive to the mounting position under predetermined application conditions; a mounting head having a nozzle for holding a component, moving above the board, and lowering the nozzle holding the component to place the component at the placement position under predetermined placement conditions; a nozzle height measuring means for measuring the height of the suction surface of the nozzle, The mounting head stops the descent of the nozzle when the height of the suction surface of the nozzle pressing the component against the board reaches a height obtained by adding together the measured board height, the component thickness of the component, and a preset adhesive thickness of the adhesive.

2. 2. The component mounting system according to claim 1, further comprising a notification means for notifying an error if the set adhesive thickness is not reached even when the nozzle is pressed against the board for a preset time.

3. A component mounting device that picks up components with a nozzle and mounts them on a board, a board height measuring means for measuring the board height at a mounting position on the top surface of the board; a mounting head having a nozzle for holding a component, which moves above the board on which adhesive has been applied at the mounting position, and lowers the nozzle holding the component to mount the component at the mounting position under predetermined mounting conditions; a nozzle height measuring means for measuring the height of the suction surface of the nozzle, The mounting head stops the descent of the nozzle when the height of the suction surface of the nozzle pressing the component against the board reaches a height obtained by adding together the measured board height, the component thickness of the component, and a preset adhesive thickness of the adhesive.

4. A component mounting method for mounting a component on a substrate by suction with a nozzle, comprising the steps of: a substrate height measuring step of measuring a substrate height at a mounting position on an upper surface of the substrate; a component holding step of holding a component with a nozzle; a nozzle moving step of moving the nozzle holding the component to above the board on which adhesive is applied at the mounting position; a component pressing step of lowering the nozzle holding the component and pressing the component to the mounting position; a nozzle height measuring step of measuring a height of the suction surface of the nozzle during the component pressing step, A component mounting method, in which, in the component pressing process, when the height of the suction surface of the nozzle reaches the measured board height plus the component thickness of the component and the predetermined adhesive thickness of the adhesive, the component pressing process is terminated.

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