Quality determination method and substrate production system

Abstract

To provide a quality determination method capable of responding to the lack of solder balls of a solder ball group which is held by a suction nozzle, and a substrate production system.SOLUTION: A quality determination method includes a supply step, a suction step, an imaging step, a determination step, and a complementation step. In the supply step, a solder ball group is supplied. In the suction step, the solder ball group supplied in the supply step is sucked and held by a suction nozzle. In the imaging step, the solder ball group held by the suction nozzle is imaged. In the determination step, a quality of the solder ball group before being supplied to a target area is determined based on image data on the solder ball group acquired in the imaging step. In the complementation step, in a case where the determination step determines a defect that solder balls of the solder ball group are lacked, solder balls corresponding to the lack are supplied to the target area.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] This specification discloses a technique relating to a quality determination method and a board production system. [Background technology]

[0002] The solder ball mounter described in Patent Document 1 uses a tape structure in which a plurality of first solder balls are formed on one main surface of an insulating tape, and a plurality of second solder balls are formed on the other main surface, the first solder balls being electrically connected to the respective second solder balls. Each tape structure is mounted on a plurality of electrode pads of an insulating substrate, and after the tape structures are mounted, image processing is performed to inspect the mounting state. In this way, the invention described in Patent Document 1 aims to reduce mounting defects of solder balls. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2001-110933 A Summary of the Invention [Problem to be solved by the invention]

[0004] There is a possibility that the group of solder balls held by the suction nozzle will run out of solder balls.

[0005] In consideration of the above circumstances, this specification discloses a quality determination method and a board production system that can address a shortage of solder balls in a group of solder balls held by a suction nozzle. [Means for solving the problem]

[0006] This specification discloses a quality determination method including a supplying step, a suction step, an imaging step, a judging step, and a complementing step. The supplying step supplies a group of solder balls to be supplied to a target area, which is at least a part of a mounting area of ​​a component to be mounted on a board, the group being arranged in accordance with electrode positions of the component. The suction step sucks and holds the group of solder balls supplied in the supplying step by a suction nozzle. The imaging step images the group of solder balls held by the suction nozzle. The judging step judges the quality of the group of solder balls before being supplied to the target area based on image data of the group of solder balls acquired by the imaging step. The complementing step supplies the missing solder balls to the target area when the judging step judges that the solder balls of the group of solder balls are defective due to a shortage of solder balls.

[0007] This specification also discloses a board production system including a component mounting machine that mounts components on a board to produce a board product, and a management device that manages the production of the board product. The board production system includes a supply device, a suction nozzle, a component camera, a judgment unit, and a complement unit. The supply device supplies a group of solder balls that are supplied to a target area, which is at least a part of a mounting area of ​​the component to be mounted on the board, and that are arranged in accordance with electrode positions of the component. The suction nozzle sucks and holds the group of solder balls supplied by the supply device. The component camera captures an image of the group of solder balls held by the suction nozzle. The judgment unit judges whether the group of solder balls is good or bad before being supplied to the target area based on image data of the group of solder balls acquired by the component camera. The complement unit supplies the missing solder balls to the target area when the judgment unit judges that the solder balls of the group of solder balls are defective due to a shortage. Effect of the Invention

[0008] According to the above-mentioned quality determination method, when it is determined that there are not enough solder balls in the group of solder balls held by the suction nozzle, the missing solder balls can be supplied to the target area. The above-mentioned description of the quality determination method can also be applied to the board production system. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a plan view showing a configuration example of a component mounting machine. [Diagram 2] FIG. 4 is a plan view showing a configuration example of a supply unit. [Diagram 3] FIG. 2 is a block diagram showing an example of a control block of a quality determination device. [Figure 4] 4 is a flowchart showing an example of a control procedure performed by the quality determination device. [Diagram 5] 10 is a schematic diagram showing an example of image data of a solder ball group; FIG. [Figure 6] FIG. 2 is a side view showing an example of the configuration of a first imaging device. [Figure 7] FIG. 13 is a side view showing an example of the configuration of a third imaging device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] 1. Embodiment 1-1. Example of the configuration of the component placement machine 10 The quality determination device 50 is applied to a component mounting machine 10. The component mounting machine 10 mounts a plurality of components 92, including a component 91, onto a board 90. The components 91 are mounted onto the board 90 via solder balls 80. As shown in FIG 1, the component mounting machine 10 includes a board transport device 11, a supply device 12, a transfer device 13, a component camera 14, a board camera 15, and a control device 16.

[0011] The board transport device 11 is, for example, configured with a belt conveyor or the like, and transports the board 90 in a transport direction (X-axis direction). The board 90 is a circuit board on which various circuits such as electronic circuits, electric circuits, and magnetic circuits are formed. The board transport device 11 transports the board 90 into the component mounting machine 10, positions the board 90 at a predetermined position within the machine, and clamps it. After the component mounting machine 10 has completed the mounting process of the mounted components 92, the board transport device 11 unclamps the board 90 and transports the board 90 out of the component mounting machine 10.

[0012] The supplying device 12 supplies components 92 to be mounted. The supplying device 12 can include a feeder 12a provided along the transport direction (X-axis direction) of the substrate 90. The feeder 12a pitch-feeds a carrier tape containing a plurality of chip components, and supplies the chip components so that they can be picked at a supply position located at the tip side of the feeder 12a. The supplying device 12 can also supply components 91 (e.g., BGA (Ball Grid Array) components) that are relatively large compared to chip components and the like, arranged on a pallet 30. The feeder 12a and the pallet 30 are provided in the supplying device 12 so as to be detachable (replaceable).

[0013] Supply device 12 can also supply solder ball groups 80g using pallet 30. A plurality of supply units 70 (six in FIG. 1) are arranged on pallet 30. As shown in FIGS. 1 and 2, each of the plurality of (six) supply units 70 carries a solder ball group 80g. Solder ball group 80g is a plurality of solder balls 80 to be supplied to target area TA0 which is at least a part of mounting area MA0 of component 91 to be mounted on board 90, and is arranged in accordance with electrode positions of component 91.

[0014] Specifically, the supply unit 70 includes a plate-shaped base member 71 on which the solder ball group 80g can be mounted. The base member 71 has a plurality of holes formed therein in accordance with the electrode positions of the component 91. The size of each of the plurality of holes is formed slightly smaller than the size of the solder ball 80, and one solder ball 80 can be mounted in one hole. As shown in FIG. 1, the target area TA0 may be the entire area of ​​the mounting area MA0 of the component 91. The target area TA0 may be at least one of the divided areas obtained by dividing the mounting area MA0 into a plurality of (e.g., four) areas.

[0015] The pallet 30 is moved, for example, in the Y-axis direction (a direction perpendicular to the X-axis direction on a horizontal plane) by the driving device 41. The driving device 41 pulls out a pallet 30 to be used in the production of substrate products from among the multiple pallets 30 stored in the storage device 40, and moves the pallet 30 in the Y-axis direction to load it onto the supplying device 12. The driving device 41 can also move a used pallet 30 that has been used in the production of substrate products in the Y-axis direction to retrieve it from the supplying device 12 to the storage device 40.

[0016] The transfer device 13 includes a head driving device 13a and a movable stage 13b. The head driving device 13a is configured to be able to move the movable stage 13b in the X-axis direction and the Y-axis direction by a linear motion mechanism. A mounting head 20 is detachably (replaceably) provided on the movable stage 13b by a clamp member. The mounting head 20 uses at least one suction nozzle 21 to suck and hold a component 92 to be mounted that is supplied by the supply device 12, and mounts the component 92 to a board 90 that has been positioned by the board transport device 11.

[0017] Known imaging devices can be used for the component camera 14 and the board camera 15. The component camera 14 is fixed to a base of the component mounting machine 10 so that its optical axis faces upward in the vertical direction (Z-axis direction perpendicular to the X-axis and Y-axis directions). The component camera 14 can capture an image of the mounting component 92 held by the suction nozzle 21 from below. The board camera 15 is provided on the moving stage 13b of the transfer device 13 so that its optical axis faces downward in the vertical direction (Z-axis direction). The board camera 15 can capture an image of the board 90 from above.

[0018] The component camera 14 and the board camera 15 capture images based on control signals sent from the control device 16. Image data of images captured by the component camera 14 and the board camera 15 are sent to the control device 16. The control device 16 includes a known arithmetic unit and storage device, and constitutes a control circuit. Information and image data output from various sensors provided in the component mounting machine 10 are input to the control device 16. The control device 16 sends control signals to each device based on a control program and predetermined mounting conditions that have been set in advance.

[0019] For example, the control device 16 causes the board camera 15 to capture an image of the board 90 positioned by the board transport device 11. The control device 16 processes the image captured by the board camera 15 to recognize the positioning state of the board 90. The control device 16 also causes the suction nozzle 21 to suck and hold the components 92 supplied by the supply device 12, and causes the component camera 14 to capture an image of the components 92 held by the suction nozzle 21. The control device 16 processes the image captured by the component camera 14 to recognize the holding posture of the components 92.

[0020] The control device 16 moves the suction nozzle 21 toward above the intended mounting position that is set in advance by a control program or the like. The control device 16 also corrects the intended mounting position based on the positioning state of the board 90, the holding attitude of the component to be mounted 92, and the like, and sets the mounting position where the component to be mounted 92 is actually mounted. The intended mounting position and the mounting position include a rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate).

[0021] The control device 16 corrects the target position (X-axis coordinates and Y-axis coordinates) and rotation angle of the suction nozzle 21 according to the mounting position. The control device 16 lowers the suction nozzle 21 at the corrected rotation angle in the corrected target position to mount the component 92 on the board 90. The control device 16 repeats the above pick-and-place cycle to execute the mounting process of mounting a plurality of components 92 on the board 90.

[0022] The above description of the component to be placed 92 also applies to the target TS0. Specifically, the suction nozzle 21 suctions and holds the target TS0, which is the supply unit 70 or the solder ball group 80g mounted on the supply unit 70, and supplies it to the target area TA0 of the board 90. The suction nozzle 21 is moved by the mounting head 20, as in the case of the component to be placed 92.

[0023] When the suction nozzle 21 suctions the supply unit 70 (the target TS0 is the supply unit 70), the suction nozzle 21 suctions the base member 71. The base member 71 is made of an insulating material so that the plurality of solder balls 80 included in the solder ball group 80g are electrically insulated. When the suction nozzle 21 suctions the solder ball group 80g mounted on the supply unit 70 (the target TS0 is the solder ball group 80g), the suction nozzle 21 is formed with a plurality of holes aligned with the electrode positions of the component 91. The size of each of the plurality of holes is formed slightly smaller than the size of the solder ball 80, and one solder ball 80 can be suctioned into one hole.

[0024] 1-2. Configuration example of quality determination device 50 As described above, the component mounting machine 10 can include a pallet 30. On the pallet 30, supply units 70 are arranged, each carrying a solder ball group 80g that is arranged in accordance with the electrode position of a component 91. The suction nozzle 21 suctions and holds the target TS0, and supplies it to a target area TA0 of the board 90. In this case, if the suction nozzle 21 suctions the target TS0 that includes a defective solder ball group 80g, it will be necessary to deal with the defective solder ball group 80g after the target TS0 has been supplied, which may result in a decrease in production efficiency.

[0025] Therefore, the component mounting machine 10 of this embodiment is applied with a quality determination device 50. The quality determination device 50 includes a first determination unit 51. The quality determination device 50 can also include a first imaging unit 52. The quality determination device 50 can also include at least the second imaging unit 53 of the second imaging unit 53 and the third imaging unit 54, and at least the second determination unit 55 of the second determination unit 55 and the third determination unit 56. The component mounting machine 10 can also include a complementing unit 57. As shown in FIG. 3, the quality determination device 50 of this embodiment includes the first determination unit 51, the first imaging unit 52, the second imaging unit 53, the third imaging unit 54, the second determination unit 55, and the third determination unit 56. In addition, the control device 16 of the component mounting machine 10 includes the complementing unit 57.

[0026] The quality determination device 50 can be provided in various control devices, management devices, on the cloud, etc. As shown in FIG. 3, the quality determination device 50 of this embodiment is provided in the control device 16 of the component mounting machine 10. The quality determination device 50 of this embodiment executes control according to the flowchart shown in FIG. 4. The first determination unit 51 performs the process shown in step S12. The first imaging unit 52 performs the process shown in step S11. The second imaging unit 53 performs the process shown in step S17. The third imaging unit 54 performs the process shown in step S15. The second determination unit 55 performs the process shown in step S18. The third determination unit 56 performs the process shown in step S16. The complement unit 57 performs the judgment shown in step S19 and the process shown in step S20. The control device 16 of the component mounting machine 10 performs the judgment shown in step S13 and the process shown in step S14.

[0027] 1-2-1. First determination unit 51 and first imaging unit 52 Before the suction nozzle 21 suctions the target object TS0, the first judgment unit 51 judges whether the solder ball group 80g mounted on at least one of the multiple supply units 70 arranged on the pallet 30 is good or bad (step S12).

[0028] The first determination unit 51 may take various forms as long as it can determine whether the solder ball group 80g is good or bad. For example, the first determination unit 51 can determine whether the solder ball group 80g is good or bad using a known detection device that detects the solder ball group 80g mounted on the supply unit 70. In this embodiment, the first determination unit 51 determines whether the solder ball group 80g is good or bad based on image data PD0 of the solder ball group 80g acquired by the first imaging unit 52.

[0029] The first imaging section 52 causes the first imaging device 61 to image the solder ball group 80g mounted on at least one of the supply units 70 arranged on the pallet 30 (step S11). The first imaging device 61 may be any known imaging device as long as it can image the solder ball group 80g. The first imaging device 61 may be, for example, the board camera 15. The board camera 15 images the solder ball group 80g mounted on the base member 71 from above.

[0030] Fig. 5 shows an example of image data PD0 of a solder ball group 80g. The figure shows an example of image data PD0 captured by board camera 15 of a solder ball group 80g mounted on a base member 71 of one supply unit 70 of pallet 30 from above the base member 71. As shown in Figs. 2 and 5, the image data PD0 captures a plurality (47 pieces) of solder balls 80, which is one less than the prescribed number (48 pieces in the example shown in Fig. 2) that should be mounted on one supply unit 70.

[0031] For example, when a worker removes the lid covering the pallet 30 and loads the pallet 30 into the storage device 40, the solder balls 80 may adhere to the lid. This may result in a supply unit 70 in which the number of solder balls 80 included in the solder ball group 80g is insufficient for the specified number (48 in the above example).

[0032] Therefore, the first judgment unit 51 judges that the solder ball group 80g is good when the number of solder balls 80 contained in the solder ball group 80g recognized by image processing the image data PD0 of the solder ball group 80g matches the specified number (48) to be mounted on the supply unit 70. The first judgment unit 51 judges that the solder ball group 80g is defective when the number of solder balls 80 contained in the solder ball group 80g recognized by image processing the image data PD0 of the solder ball group 80g is insufficient for the specified number (48). In the example shown in FIG. 5, one solder ball 80 is missing from the specified number (48). Therefore, in this case, the first judgment unit 51 judges that the solder ball group 80g is defective.

[0033] Furthermore, for example, when a worker arranges supply units 70 on a pallet 30, there is a possibility that a supply unit 70 different from the supply unit 70 to be arranged may be arranged on the pallet 30. As a result, there is a possibility that a supply unit 70 may be produced in which the size of each solder ball 80 included in the solder ball group 80g differs from the predetermined size to be mounted on the supply unit 70.

[0034] Therefore, the first judgment unit 51 can also judge that the solder ball group 80g is good when the size of each solder ball 80 included in the solder ball group 80g recognized by image processing the image data PD0 of the solder ball group 80g matches a predetermined size to be mounted on the supply unit 70. The first judgment unit 51 can also judge that the solder ball group 80g is defective when the size of at least one solder ball 80 included in the solder ball group 80g recognized by image processing the image data PD0 of the solder ball group 80g differs from the predetermined size.

[0035] The first judgment unit 51 can also judge that the solder ball group 80g is good when the number of solder balls 80 included in the solder ball group 80g matches a specified number to be mounted on the supply unit 70 and the size of each solder ball 80 included in the solder ball group 80g matches a predetermined size to be mounted on the supply unit 70. The first judgment unit 51 can also judge that the solder ball group 80g is defective when at least one of the following is true: the number of solder balls 80 included in the solder ball group 80g is insufficient for the specified number, and the size of at least one solder ball 80 included in the solder ball group 80g is different from the predetermined size.

[0036] The specified number and the predetermined size of the solder balls 80 to be mounted on the supply unit 70 can be obtained, for example, from a management device that manages the production of board products. Specifically, the first determination unit 51 can obtain information on the solder balls 80 that match the type of board product to be produced by supplying the solder ball group 80g from the management device, and recognize the specified number and the specified size of the solder balls 80 to be mounted on the supply unit 70. What has been described above about the specified number of solder balls 80 to be mounted on the supply unit 70 can also be said about the second determination unit 55 and the third determination unit 56 described later.

[0037] As described above, the supply unit 70 includes a plate-shaped base member 71 on which the solder ball group 80g can be mounted. As shown in FIG. 2, in this embodiment, the base member 71 is colored blackish. Moreover, the white solder ball group 80g is mounted on the base member 71. In this case, it is easy to recognize the multiple solder balls 80 included in the solder ball group 80g by binarization processing. Therefore, the first determination unit 51 may perform binarization processing on the image data PD0 of the white solder ball group 80g mounted on the base member 71 colored blackish, recognize each solder ball 80 included in the solder ball group 80g, and determine the quality of the solder ball group 80g.

[0038] 1, for convenience of illustration, the base member 71 is illustrated in white. Even if the base member 71 is not colored in a blackish color, the first judgment unit 51 can perform a binarization process on the image data PD0 of the solder ball group 80g to recognize each solder ball 80 included in the solder ball group 80g, and judge the quality of the solder ball group 80g. In this case, it is preferable to lower the threshold value of the binarization process compared to when the base member 71 is colored in a blackish color.

[0039] The first imaging section 52 can cause the first imaging device 61 to capture an image of the solder ball groups 80g mounted on each of a predetermined number of supply units 70 among the multiple supply units 70 (six in the example shown in FIG. 1) arranged on the pallet 30. The number of supply units 70 captured by the first imaging device 61 (the above-mentioned predetermined number) may be one or more. In this case, the first judging section 51 can judge the quality of the solder ball groups 80g for each of the predetermined number of supply units 70.

[0040] As described above, in this embodiment, the first imaging device 61 is the board camera 15. For example, the predetermined number can be set according to the number of supply units 70 included in the imaging field of view of the board camera 15. Furthermore, the mounting head 20 can support a plurality of suction nozzles 21 each capable of suctioning an object TS0. In this case, the predetermined number can also be set according to the number of objects TS0 to be suctioned in one pick-and-place cycle of the mounting head 20.

[0041] As described above, the supply unit 70 includes a plate-shaped base member 71 on which the solder ball group 80g can be mounted. As shown in Fig. 2, the base member 71 is provided with a reference portion 72 that is used when recognizing the mounted solder ball group 80g. The reference portion 72 is a position reference when recognizing the solder ball group 80g, and can take various forms. In the example shown in the figure, the reference portion 72 is a white triangle, and is provided at one of the four corners of the approximately square-shaped base member 71.

[0042] Furthermore, the reference portion 72 is often provided so as to be recognizable by being illuminated by incident light, and the solder ball group 80g is easily recognizable by being illuminated by oblique light. As shown in Fig. 6, in this embodiment, the first imaging device 61 includes a reference portion light source 61a, an incident light conversion unit 61b, and a solder ball group light source 61c. The reference portion light source 61a is a light source that illuminates the reference portion 72. The incident light conversion unit 61b converts the light irradiated from the reference portion light source 61a into incident light, and illuminates the reference portion 72 from above in the vertical direction (Z-axis direction).

[0043] The solder ball group light source 61c illuminates the solder ball group 80g from above at a predetermined angle with respect to the vertical direction (Z-axis direction). The predetermined angle is an angle at which the solder ball group 80g can be recognized, and is set in advance by simulation, verification using an actual device, or the like. Note that the reference portion light source 61a and the solder ball group light source 61c can use, for example, a known light emitting diode (Light Emitting Diode), and the wavelength of the irradiated light is not limited. Also, the incident light conversion portion 61b can use, for example, a half mirror.

[0044] The reference section light source 61a irradiates light toward the incident light converting section 61b (arrow L11). The irradiated light irradiated from the reference section light source 61a is reflected by the incident light converting section 61b and travels toward the reference section 72 (arrow L12). The reflection angle is set to 90 degrees. The irradiated light reflected by the reference section 72 travels toward the lens 15b (arrow L13). The irradiated light that reaches the lens 15b passes through the lens 15b and travels toward the imaging element 15a (arrow L14).

[0045] The solder ball group light source 61c irradiates the solder ball group 80g with light from an obliquely upward direction inclined at a predetermined angle with respect to the vertical direction (Z-axis direction) (arrow L21). The irradiated light reflected by the solder ball group 80g proceeds toward the lens 15b (arrow L22). The irradiated light that reaches the lens 15b passes through the lens 15b and proceeds toward the imaging element 15a (arrow L23). What has been described above about the first imaging device 61 can also be said about the third imaging device 63, except for the illumination direction.

[0046] In this way, the first imaging unit 52 acquires image data PD0 of the reference portion 72 captured by illuminating the reference portion 72 using the reference portion light source 61a and the incident light converting unit 61b, and image data PD0 of the solder ball group 80g captured by illuminating the solder ball group 80g using the solder ball group light source 61c. In this case, the first judgment unit 51 recognizes each solder ball 80 included in the solder ball group 80g with reference to the reference portion 72 based on the image data PD0 of the reference portion 72 and the image data PD0 of the solder ball group 80g, and can judge the quality of the solder ball group 80g.

[0047] If the first judgment unit 51 judges that the solder ball group 80g is good (Yes in step S13 shown in FIG. 4), the control device 16 of the component mounting machine 10 causes the suction nozzle 21 to suction the object TS0 including the solder ball group 80g judged to be good (step S14).

[0048] As in the present embodiment, it is assumed that the first imaging section 52 causes the first imaging device 61 to image the solder ball group 80g mounted on each supply unit 70 for each supply unit 70. If the first judging section 51 judges that the solder ball group 80g is defective (No in step S13), control returns to the process shown in step S11 as shown in FIG. 4. Then, the first imaging section 52 causes the first imaging device 61 to image the solder ball group 80g mounted on the other supply unit 70 (step S11). The processes and judgments shown in steps S11 to S13 are repeated until the first judging section 51 judges that the solder ball group 80g is good.

[0049] It is also assumed that the first imaging section 52 causes the first imaging device 61 to image the solder ball group 80g mounted on the supply unit 70 for each of the plurality of supply units 70. If the first judging section 51 judges that the solder ball group 80g is defective (No in step S13), the control returns to the process shown in step S12. Then, the first judging section 51 judges whether the solder ball groups 80g mounted on the other supply units 70 are good or bad (step S12). If there is no good solder ball group 80g, the control returns to the process shown in step S11. Then, the processes and judgments shown in steps S11 to S13 are repeated until the first judging section 51 judges that the solder ball group 80g is good.

[0050] 1-2-2. Second imaging unit 53, third imaging unit 54, second determination unit 55, and third determination unit 56 The suction nozzle 21 suctions and holds the object TS0, and supplies it to the target area TA0 of the substrate 90. For example, the object TS0 may fall while being supplied to the target area TA0 of the substrate 90. Therefore, the quality determination device 50 may preferably include at least the second imaging unit 53 out of the second imaging unit 53 and the third imaging unit 54, and at least the second determination unit 55 out of the second determination unit 55 and the third determination unit 56.

[0051] The second imaging unit 53 causes the second imaging device 62 to image the solder ball group 80g of the target object TS0 supplied to the target area TA0 of the substrate 90 by the suction nozzle 21 (step S17 shown in FIG. 4). The second imaging device 62 only needs to be able to image the solder ball group 80g of the target object TS0 supplied to the target area TA0, and any known imaging device may be used. The second imaging device 62 may be, for example, the substrate camera 15.

[0052] In this case, the board camera 15 captures an image of the solder ball group 80g of the target object TS0 supplied to the target area TA0 from above. As described above, the board camera 15 is provided on the transfer device 13 that moves the mounting head 20 equipped with the suction nozzle 21. In this manner, the second imaging device 62 is provided on the transfer device 13 that moves the mounting head 20 equipped with the suction nozzle 21, and can be used in combination with the first imaging device 61.

[0053] When the target object TS0 is a solder ball group 80g, a region reference portion similar to the reference portion 72 provided on the base member 71 is provided in the target region TA0 of the substrate 90. In this case, the description of the second imaging device 62 can be made by replacing the reference portion 72 with the region reference portion in the description of the first imaging device 61, and duplicated description is omitted in this specification. Furthermore, the second imaging unit 53 can cause the second imaging device 62 to image the solder ball group 80g for each target region TA0. Furthermore, the second imaging unit 53 can also cause the second imaging device 62 to image the solder ball group 80g for each of the multiple target regions TA0.

[0054] The third imaging unit 54 causes the third imaging device 63 to image the solder ball group 80g of the target TS0 held by the suction nozzle 21 (step S15). The third imaging device 63 may be any known imaging device as long as it can image the solder ball group 80g of the target TS0 held by the suction nozzle 21. The third imaging device 63 may be, for example, the component camera 14.

[0055] In this case, the component camera 14 captures an image of the solder ball group 80g of the target object TS0 held by the suction nozzle 21 from below. As described above, the component camera 14 is fixed to the base of the component mounting machine 10. In this manner, the third imaging device 63 is fixed to the base of the component mounting machine 10 and can capture an image of the solder ball group 80g of the target object TS0 held by the suction nozzle 21 from below.

[0056] In the third imaging device 63, when the object TS0 is the supply unit 70, the reference portion 72 is provided on the surface of the base member 71 facing the third imaging device 63. When the object TS0 is a solder ball group 80g, the reference portion 72 is provided on the suction nozzle 21 or the mounting head 20. Also, as shown in Fig. 7, the third imaging device 63 has a different illumination direction from that of the first imaging device 61. Specifically, like the first imaging device 61, the third imaging device 63 includes a reference portion light source 63a, an incident light conversion unit 63b, and a solder ball group light source 63c.

[0057] However, the incident light converting unit 63b of the third imaging device 63 converts the light emitted from the reference portion light source 63a into incident light and illuminates the reference portion 72 from below in the vertical direction (Z-axis direction). The solder ball group light source 63c of the third imaging device 63 illuminates the solder ball group 80g from below at a predetermined angle with respect to the vertical direction (Z-axis direction). The third imaging unit 54 obtains image data PD0 of the reference portion 72 imaged by illuminating the reference portion 72 using the reference portion light source 63a and the incident light converting unit 63b, and image data PD0 of the solder ball group 80g imaged by illuminating the solder ball group 80g using the solder ball group light source 63c.

[0058] Furthermore, when the mounting head 20 supports a plurality of suction nozzles 21, the third imaging section 54 can cause the third imaging device 63 to image the solder ball group 80g of the target TS0 for each of the suction nozzles 21. Furthermore, the third imaging section 54 can also cause the third imaging device 63 to image the solder ball group 80g of the target TS0 for each of the plurality of suction nozzles 21.

[0059] The second judgment unit 55 is provided when the quality determination device 50 includes the second imaging unit 53. The second judgment unit 55 judges the quality of the solder ball group 80g of the target TS0 after it has been supplied to the target area TA0, based on image data PD0 of the solder ball group 80g acquired by the second imaging unit 53 (step S18). The second judgment unit 55 can judge the quality of the solder ball group 80g in the same manner as the first judgment unit 51.

[0060] The second judgment unit 55 judges that the solder ball group 80g is good when the number of solder balls 80 contained in the solder ball group 80g recognized by image processing the image data PD0 of the solder ball group 80g matches the specified number (48 in the above-mentioned example) to be supplied to the target area TA0. The second judgment unit 55 judges that the solder ball group 80g is defective when the number of solder balls 80 contained in the solder ball group 80g recognized by image processing the image data PD0 of the solder ball group 80g is insufficient for the specified number (48).

[0061] The third judgment unit 56 is provided when the quality determination device 50 includes the third imaging unit 54. The third judgment unit 56 judges the quality of the solder ball group 80g of the target object TS0 before it is supplied to the target area TA0 based on the image data PD0 of the solder ball group 80g acquired by the third imaging unit 54 (step S16). The above description of the second judgment unit 55 also applies to the third judgment unit 56.

[0062] Further, the second imaging section 53 causes the second imaging device 62 to image the solder ball group 80g of the object TS0 for each of the predetermined number of target areas TA0, and the second judging section 55 can judge the quality of the solder ball group 80g for each of the predetermined number of target areas TA0. Similarly, the third imaging section 54 causes the third imaging device 63 to image the solder ball group 80g of the object TS0 for each of the objects TS0 held by the predetermined number of suction nozzles 21, and the third judging section 56 can judge the quality of the solder ball group 80g for each of the objects TS0 held by the predetermined number of suction nozzles 21.

[0063] In addition, since there is a possibility that defects may occur in the solder ball group 80g after the solder ball group 80g is imaged by the third imaging unit 54, it is preferable that the pass / fail judgment device 50 be equipped with at least the second imaging unit 53 of the second imaging unit 53 and the third imaging unit 54, and at least the second judgment unit 55 of the second judgment unit 55 and the third judgment unit 56.

[0064] 1-2-3. Complementary Part 57 The complementing unit 57 supplies the missing solder balls 80 to the target area TA0 when at least the second judgment unit 55 out of the second judgment unit 55 and the third judgment unit 56 judges that the solder ball group 80g is defective (if Yes in step S19 and step S20 shown in Figure 4).

[0065] For example, the complementing unit 57 uses the suction nozzle 21 capable of suctioning one solder ball 80 to supply the missing solder balls 80 to the target area TA0. Specifically, the complementing unit 57 moves the mounting head 20 to cause the suction nozzle 21 to suction and hold one solder ball 80 from a storage case that stores a plurality of solder balls 80. Then, the complementing unit 57 moves the mounting head 20 to supply the solder ball 80 to an area (missing area) of the target area TA0 to which no solder balls 80 have been supplied.

[0066] When multiple missing areas occur in one target area TA0, the complementing unit 57 repeats the above complementing process. When the mounting head 20 supports multiple suction nozzles 21, the complementing unit 57 can also cause a single solder ball 80 to be sucked by a suction nozzle 21 capable of sucking the solder ball 80 in advance.

[0067] Also, assume that the board 90 is conveyed to a plurality of component mounting machines 10 in sequence, and a plurality of mounting components 92 including a component 91 are mounted on the board 90. In this case, the complementing unit 57 can supply the missing solder balls 80 to the target area TA0 in the component mounting machine 10 that supplied the target object TS0 to the target area TA0. The complementing unit 57 can also supply the missing solder balls 80 to the target area TA0 in a component mounting machine 10 that is downstream of the component mounting machine 10 that supplied the target object TS0 to the target area TA0. In this case, the supply process and the complementing process of the solder balls 80 can be distributed. The complementing unit 57 can also supply the solder balls 80 collectively to a plurality of missing areas occurring in the plurality of component mounting machines 10 in a component mounting machine that is downstream of the component mounting machine 10.

[0068] It is assumed that the quality judging device 50 includes the third imaging unit 54 and the third judging unit 56, and that the solder ball group 80g is defective before the solder ball group 80g is imaged by the third imaging unit 54. In this case, the third judging unit 56 is likely to judge the solder ball group 80g to be defective before the second judging unit 55 judges the solder ball group 80g to be defective. Therefore, the complementing unit 57 can start preparation for the complementing process when the solder ball group 80g is judged to be defective by the third judging unit 56. For example, when the mounting head 20 supports a plurality of suction nozzles 21, the complementing unit 57 can cause a suction nozzle 21 capable of suctioning one solder ball 80 to suction the solder ball 80 in advance. Then, the complementing unit 57 can start the complementing process after the solder ball group 80g is imaged by the second imaging unit 53 and before the second judging unit 55 judges the quality of the solder ball group 80g.

[0069] 1-3. Method for determining quality The above description of the quality determination device 50 also applies to the quality determination method. Specifically, the quality determination method includes a first determination step. The first determination step corresponds to the control performed by the first determination unit 51. The quality determination method can also include a first imaging step. The first imaging step corresponds to the control performed by the first imaging unit 52. The quality determination method can also include at least the second imaging step of the second imaging step and the third imaging step, and at least the second determination step of the second determination step and the third determination step. The second imaging step corresponds to the control performed by the second imaging unit 53. The third imaging step corresponds to the control performed by the third imaging unit 54. The second determination step corresponds to the control performed by the second determination unit 55. The third determination step corresponds to the control performed by the third determination unit 56. The control by the component mounting machine 10 can also include a complement step. The complement step corresponds to the control performed by the complement unit 57.

[0070] 2. Examples of Effects of the Embodiments According to the quality determination method, when it is determined that the solder balls 80 in the solder ball group 80g held by the suction nozzle 21 are defective due to a shortage, the missing solder balls 80 can be supplied to the target area TA0. What has been described above about the quality determination method can also be similarly applied to the board production system. [Explanation of symbols]

[0071] 10: component mounting machine, 12: supply device, 14: component camera, 21: suction nozzle, 56: third judgment unit (corresponding to the judgment unit), 57: Complementary part, 80: Solder ball, 80g: solder ball group, 90: board, 91: parts, PD0: image data, MA0: mounting area, TA0: target area.

Claims

1. a supply step of supplying a group of solder balls to be supplied to a target area, which is at least a part of a mounting area of ​​a component to be mounted on a board, the solder balls being arranged in accordance with electrode positions of the component; a suction step of suctioning and holding the solder ball group supplied in the supply step by a suction nozzle; an imaging step of imaging the solder ball group held by the suction nozzle; a determining step of determining whether the solder ball group is good or bad before being supplied to the target area based on image data of the solder ball group acquired by the imaging step; a supplementing step of supplying the missing solder balls to the target area when the solder balls of the solder ball group are determined to be defective due to a shortage in the determining step; The method includes the steps of:

2. 2. The method of determining pass / fail as claimed in claim 1, wherein the determination step determines that the solder ball group is good when the number of solder balls contained in the solder ball group recognized by image processing of the image data matches a specified number to be supplied to the target area, and determines that the solder ball group is defective due to a shortage of solder balls when the number of solder balls contained in the recognized solder ball group is insufficient for the specified number.

3. 3. The quality determination method according to claim 1, wherein the supplementing step comprises the step of supplying the missing solder balls to the target area using the suction nozzle capable of suctioning one of the solder balls.

4. 2. The quality determination method according to claim 1, wherein the supplementing step starts preparations for supplying the missing solder balls to the target area when the solder ball group is determined to be defective in the determining step.

5. A component placement machine that places components on a board to produce a board product; A management device for managing the production of the substrate products; A board production system comprising: a supply device that supplies a group of solder balls that are supplied to a target area, which is at least a portion of a mounting area of ​​the component to be mounted on the board, the solder balls being arranged in accordance with electrode positions of the component; a suction nozzle that suctions and holds the solder ball group supplied by the supply device; a component camera for capturing an image of the solder ball group held by the suction nozzle; a determination unit that determines whether the solder ball group is good or bad before being supplied to the target area based on image data of the solder ball group acquired by the component camera; a complementing unit that, when the determining unit determines that the solder balls in the solder ball group are defective due to a shortage, supplies the missing solder balls to the target area; A board production system comprising:

6. A plurality of the component mounting machines are provided, 6. The board production system according to claim 5, wherein the complementing unit supplies the missing solder balls to the target area in a component mounting machine at a stage subsequent to the component mounting machine that adsorbed and held the group of solder balls with the suction nozzle and supplied them to the target area of ​​the board.

Images