Multilayer electronic component

Abstract

To improve the reliability of a multilayer electronic component, improve the capacity per unit volume, and improve the bonding power between a side margin part and a main body.SOLUTION: A multilayer electronic component includes: a main body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; a side margin part disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces. At least one of both end parts of the internal electrode in the third direction is disposed apart from the side margin part and the average thickness thereof is smaller than that of a central part of the internal electrode in the third direction.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-Layered Ceramic Capacitor (MLCC), a type of multi-layered electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small yet high capacitance and easy to mount, and can be used as components of various electronic devices. As various electronic devices such as computers and mobile devices become smaller and have higher output, there is an increasing demand for multilayer ceramic capacitors to be smaller and have higher capacitance.

[0004] Furthermore, as the industry has recently become more interested in automotive electrical components, multilayer ceramic capacitors are also being required to have high reliability characteristics for use in automobiles and infotainment systems.

[0005] In manufacturing multilayer ceramic capacitors, a method was developed in which the internal electrodes are exposed in the width direction of the body, maximizing the overlapping area of ​​the internal electrodes through a margin-free design, and side margins are attached separately to both sides of the body in the width direction to minimize the margins in the width direction, thereby maximizing the capacitance per unit volume.

[0006] However, moisture can easily penetrate between the side margin and the main body, which can reduce the moisture resistance reliability. If the side margin cannot make good contact with the main body and the gap between the side margin and the main body widens, the moisture resistance reliability could be further reduced.

[0007] In addition, in the process of cutting the internal electrodes so that they are exposed in the width direction of the body, blade chipping, in which scratches occur vertically due to a damaged blade, can occur. When blade chipping occurs, a moisture penetration path is formed from the cover part to the capacitance forming part, which can reduce the moisture resistance reliability.

[0008] Therefore, a method is required that can improve the capacitance per unit volume while also improving the moisture resistance reliability. Summary of the Invention [Problem to be solved by the invention]

[0009] One of the various objects of the present invention is to improve the reliability of multilayer electronic components.

[0010] One of the various objects of the present invention is to improve the capacitance per unit volume of a multilayer electronic component.

[0011] One of the various objects of the present invention is to improve the bond between the side margins and the body.

[0012] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0013] A multilayer electronic component according to one embodiment of the present invention includes a body including dielectric layers and internal electrodes arranged alternately with the dielectric layers in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected from the first surface to the fourth surface and facing each other in the third direction, side margin portions arranged on the fifth and sixth surfaces, and external electrodes arranged on the third and fourth surfaces, at least one of both ends of the internal electrodes in the third direction is arranged spaced apart from the side margin portions and may have an average thickness thinner than a central portion of the internal electrodes in the third direction.

[0014] A method for manufacturing a multilayer electronic component according to an embodiment of the present invention includes the steps of: forming a plurality of conductive patterns arranged in a second direction perpendicular to the first direction and a third direction perpendicular to the first and second directions on one surface of a ceramic green sheet in a first direction; stacking a plurality of the ceramic green sheets in the first direction to obtain a laminate; and cutting the laminate in the second and third directions to obtain a plurality of unit chips, wherein when cutting in the third direction, a first internal electrode pattern is formed in which a cut surface of the conductive pattern is exposed on one surface of the unit chip in the second direction and a cut surface of the conductive pattern is exposed on the other surface of the unit chip in the second direction. The method may include a laminate cutting step of cutting the laminate to include an exposed second internal electrode pattern, and when cutting in the second direction, the conductive pattern is cut within a range of We in the third direction from the center of a region where the conductive pattern is separated from an adjacent conductive pattern in the third direction, where the conductive pattern is separated from at least one of first and second side surfaces of the unit chip facing in the third direction, where We is a distance between the conductive pattern and an adjacent conductive pattern in the third direction, and a side margin forming step of attaching a ceramic green sheet for a side margin portion to the first and second side surfaces of the unit chip. Effect of the Invention

[0015] One of the various effects of the present invention is that it improves the reliability of multilayer electronic components.

[0016] One of the various effects of the present invention is that it improves the capacitance per unit volume of a multilayer electronic component.

[0017] One of the various advantages of the present invention is that it improves the bond between the side margins and the main body.

[0018] One of the various effects of the present invention is that the occurrence of steps due to internal electrodes is reduced.

[0019] However, the various yet significant advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0020] [Figure 1] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] 2 is a perspective view showing the multilayer electronic component of FIG. 1, with the main body and side margin portions separated from each other, excluding the external electrodes. FIG. [Diagram 3] 2 is a cross-sectional view taken along line II' in FIG. [Figure 4] 2 is a cross-sectional view taken along line II-II' in FIG. [Diagram 5] FIG. 2 is a cross-sectional view taken along line III-III' in FIG. [Figure 6] 5 is an enlarged view of the K1 region in FIG. 4. [Figure 7] 5 is an enlarged view of the K2 region in FIG. 4. [Figure 8] 8 is a view corresponding to FIG. 7 according to another embodiment. [Figure 9] 8 is a view corresponding to FIG. 7 according to yet another embodiment. [Figure 10] 1 illustrates a ceramic green sheet on which an internal electrode pattern is printed, which is used to manufacture a multilayer electronic component according to an embodiment of the present invention. [Figure 11]11 shows cross sections in the first and third directions of a laminate obtained by laminating the ceramic green sheets of FIG. 10. [Figure 12] 5 is a view corresponding to FIG. 4 according to a first modified example. [Figure 13] 5 is a view corresponding to FIG. 4 according to a second modified example. [Figure 14] 5 is a view corresponding to FIG. 4 according to a third modified example. [Figure 15] 11 is a view corresponding to FIG. 4 according to a fourth modified example. [Figure 16] 13 is a view corresponding to FIG. 4 according to a fifth modified example. [Figure 17] 13 is a view corresponding to FIG. 4 according to a sixth modified example. [Figure 18] 13 is a view corresponding to FIG. 4 according to a seventh modified example. [Figure 19] 5 is a view corresponding to FIG. 4 according to Comparative Example 3. [Figure 20] 1 is a schematic perspective view of a multilayer electronic component according to a first comparative example. [Figure 21] 21 is a perspective view showing the multilayer electronic component of FIG. 20 with the main body and side margins separated from each other, excluding the external electrodes. FIG. [Figure 22] 21 is a cross-sectional view taken along line IV-IV' in FIG. 20. [Figure 23] 13 is a schematic perspective view of a multilayer electronic component of Comparative Example 2. FIG. [Figure 24] 24 is a cross-sectional view taken along line VV' in FIG. 23. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention may be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0022] In addition, in the drawings, parts that are not relevant to the description are omitted in order to clearly explain the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited by the drawings. Furthermore, components having the same function within the same concept may be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it does not mean that the part excludes other components, but that the part may further include other components, unless otherwise specified to the contrary.

[0023] In the drawings, the first direction can be defined as the stacking direction or thickness (T) direction, the second direction can be defined as the length (L) direction, and the third direction can be defined as the width (W) direction.

[0024] Multilayer Electronic Components FIG. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is a perspective view of the multilayer electronic component of FIG. 1, showing the main body and side margin portion separated from each other, excluding the external electrodes, FIG. 3 is a cross-sectional view taken along line I-I' in FIG. 1, FIG. 4 is a cross-sectional view taken along line II-II' in FIG. 1, FIG. 5 is a cross-sectional view taken along line III-III' in FIG. 1, FIG. 6 is an enlarged drawing of area K1 in FIG. 4, and FIG. 7 is an enlarged drawing of area K2 in FIG. 4.

[0025] Hereinafter, a multilayer electronic component according to one embodiment of the present invention will be described in detail with reference to FIGS.

[0026] A multilayer electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111 and internal electrodes 121, 122 arranged alternately with the dielectric layer in a first direction, a body 110 including first and second surfaces 1, 2 facing each other in the first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces and facing each other in the third direction, side margin portions 114, 115 arranged on the fifth and sixth surfaces, and external electrodes 131, 132 arranged on the third and fourth surfaces, at least one of both ends of the internal electrodes in the third direction is arranged away from the side margin portion and may have an average thickness smaller than that of a center portion of the internal electrodes in the third direction.

[0027] In manufacturing a multilayer ceramic capacitor, a method has been developed in which the overlapping area of ​​the internal electrodes is maximized by a margin-free design in which the internal electrodes are exposed in the width direction of the body, and side margins are separately attached to both sides in the width direction of the body to minimize the margin in the width direction, thereby maximizing the capacitance per unit volume.

[0028] However, moisture can easily penetrate between the side margin and the main body, which can reduce the moisture resistance reliability. If the side margin cannot make good contact with the main body and the gap between the side margin and the main body widens, the moisture resistance reliability could be further reduced.

[0029] In addition, in the process of cutting the internal electrodes so that they are exposed in the width direction of the body, blade chipping, in which scratches occur vertically due to a damaged blade, can occur. When blade chipping occurs, a moisture penetration path is formed from the cover part to the capacitance forming part, which can reduce the moisture resistance reliability.

[0030] According to an embodiment of the present invention, by making the average thickness of at least one of the ends of the internal electrodes 121, 122 in the third direction thinner than the average thickness of the center of the internal electrodes 121, 122 in the third direction, the contact area between the side margins 114, 115 and the internal electrodes 121, 122 can be reduced or prevented, and the bonding strength between the side margins 114, 115 and the body 110 can be improved, and the occurrence of blade chipping can be reduced. As a result, the moisture resistance reliability of the multilayer electronic component 100 can be improved while the capacitance per unit volume can be improved. In addition, by disposing at least one of the ends of the internal electrodes 121, 122 in the third direction apart from the side margins 114, 115, the moisture resistance reliability can be further improved.

[0031] Hereinafter, each component of the multilayer electronic component 100 according to one embodiment of the present invention will be described in detail.

[0032] The body 110 has dielectric layers 111 and internal electrodes 121 and 122 laminated alternately.

[0033] Although there is no particular limitation on the specific shape of the body 110, the body 110 may be hexahedral or a similar shape as shown in the figure. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may not be a hexahedral shape with perfectly straight lines, but may be substantially hexahedral.

[0034] The main body 110 may have first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in the second direction, and fifth and sixth surfaces 5, 6 connected to the first and second surfaces 1, 2, connected to the third and fourth surfaces 3, 4, and facing each other in the third direction.

[0035] The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to see without the use of a scanning electron microscope (SEM).

[0036] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as a sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material can be used. The barium titanate-based material can include a BaTiO3-based ceramic powder, and examples of the ceramic powder include BaTiO3, BaTiO3 partially solid-dissolved with Ca (calcium), Zr (zirconium), etc. 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3, etc.

[0037] The material for forming the dielectric layer 111 may be a powder such as barium titanate (BaTiO3) to which various ceramic additives, organic solvents, binders, dispersants, etc. may be added according to the purpose of the present invention.

[0038] On the other hand, the average thickness td of the dielectric layer 111 does not need to be particularly limited, but can be, for example, 0.05 μm to 3.0 μm. The average thickness td of the dielectric layer 111 can be set arbitrarily depending on the desired characteristics and applications.

[0039] The average thickness td of the dielectric layer 111 may mean the size of the dielectric layer 111 in the first direction. The average thickness td of the dielectric layer 111 may be measured by scanning the cross sections of the body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, the average thickness td of the dielectric layer 111 may be measured by measuring the thickness at multiple points of one dielectric layer 111, for example, 30 points equally spaced in the second direction, and then measuring the average value. The 30 equally spaced points may be designated as the capacitance forming portion Ac. Meanwhile, if such an average value measurement is performed for each of 10 dielectric layers 111 and then the average value is measured, the average thickness td of the dielectric layer 111 may be further generalized.

[0040] The internal electrodes 121 , 122 may be arranged alternately with the dielectric layers 111 .

[0041] The internal electrodes 121, 122 may include first and second internal electrodes 121, 122. The first and second internal electrodes 121, 122 are alternately arranged to face each other across the dielectric layer 111 constituting the body 110, and may be exposed to third and fourth surfaces 3, 4 of the body 110, respectively.

[0042] In one embodiment, the internal electrodes 121, 122 include first and second internal electrodes 121, 122 alternately arranged in a first direction across the dielectric layer 111, and the first internal electrode 121 may be connected to the third surface and the second internal electrode 122 may be connected to the fourth surface.

[0043] 2 to 4, the first internal electrode 121 may be spaced apart from the fourth, fifth, and sixth surfaces 4, 5, and 6 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third, fifth, and sixth surfaces 3, 5, and 6 and exposed through the fourth surface 4.

[0044] At this time, the first and second internal electrodes 121 and 122 can be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0045] The internal electrodes 121, 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0046] The body 110 may include an active portion Ac that is disposed inside the body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are arranged to face each other across a dielectric layer 111 to form a capacitance, and cover portions 112 and 113 that are formed on the upper and lower portions of the active portion Ac in a first direction.

[0047] The active portion Ac is a portion that contributes to forming the capacitance of the capacitor, and may be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0048] The upper cover part 112 and the lower cover part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the active part Ac in the thickness direction, respectively, and may basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0049] The upper cover part 112 and the lower cover part 113 do not include an internal electrode and may include the same material as the dielectric layer 111 .

[0050] That is, the upper cover part 112 and the lower cover part 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0051] On the other hand, there is no need to particularly limit the thickness of the covers 112 and 113. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the thickness tc of the covers 112 and 113 can be 80 μm or less.

[0052] The average thickness tc of the cover parts 112, 113 may mean the size in the first direction, and may be the average value of the size in the first direction of the cover parts 112, 113 measured at five equally spaced points on the upper or lower part of the capacitance forming part Ac.

[0053] The side margins 114 , 115 may be disposed on the fifth and sixth faces of the body 110 .

[0054] The side margin portions 114, 115 may include a first side margin portion 114 disposed on the fifth surface 5 of the body 110 and a second side margin portion 115 disposed on the fifth surface 5. That is, the margin portions 114, 115 may be disposed on both end surfaces of the body 110 in the third direction.

[0055] The side margin portions 114, 115 can be disposed so as to cover both end faces of the cover portions 112, 113 in the third direction.

[0056] The side margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0057] In one embodiment, the average thickness of at least one of both ends in the third direction of the internal electrodes 121, 122 may be thinner than the average thickness of the center of the internal electrodes 121, 122 in the third direction. This reduces or eliminates the contact area between the side margin portions 114, 115 and the internal electrodes 121, 122, thereby improving the bonding strength between the side margin portions 114, 115 and the body 110 and reducing the occurrence of blade chipping. This improves the moisture resistance reliability of the multilayer electronic component 100 while improving the capacitance per unit volume.

[0058] In manufacturing a multilayer ceramic capacitor, a method has been developed in which the overlapping area of ​​the internal electrodes is maximized by a margin-free design in which the internal electrodes are exposed in the width direction of the body, and side margins are separately attached to both sides in the width direction of the body to minimize the margins in the width direction, thereby maximizing the capacitance per unit volume. Referring to Figs. 20 to 22 which are drawings of a multilayer electronic component 200 of Comparative Example 1 manufactured by this method, the multilayer electronic component 200 of Comparative Example 1 has no steps due to the internal electrodes 221 and 222, so that the internal electrodes 221 and 222 have a uniform thickness in the third direction. In addition, the internal electrodes 221 and 222 are exposed to the fifth and sixth surfaces of the body 210 and are in contact with the side margins 214 and 215.

[0059] However, moisture can easily penetrate between the side margins 214, 215 and the main body 210, which can reduce the moisture resistance reliability. If the side margins 214, 215 cannot be well bonded to the main body 210 and the gap between the side margins 214, 215 and the main body 210 widens, the moisture resistance reliability may be further reduced. In addition, blade chipping, which is a vertical scratch caused by a damaged blade during a cutting process to expose the internal electrodes 221, 222 in the width direction of the main body, may occur. If blade chipping occurs, a moisture penetration path is formed from the cover parts 212, 213 to the capacitance forming part Ac, which can reduce the moisture resistance reliability.

[0060] Meanwhile, referring to Figs. 23 and 24 which are drawings of Comparative Example 2 manufactured by a conventional general manufacturing method in which the side margins are not separately attached and the margins are formed on the ceramic green sheets and the internal electrodes are formed by applying a conductive paste, the width Wm'' of the margins 314, 315 needs to be large in order to sufficiently protect the internal electrodes 321, 322 from the outside, so the capacity per unit volume may be reduced, and in the process of laminating the ceramic green sheets, the difference in height between the parts where the internal electrodes 321, 322 are not printed and the parts where they are printed accumulates, so that a significant step may be generated. Such a step may bend the edge of each sheet, generating stress, which may cause defects such as delamination in which the layers spread.

[0061] Meanwhile, according to one embodiment of the present invention, since separate side margin portions 114, 115 are disposed in main body 110, even if the widths Wg1, Wg2 of margin regions G1, G2 in main body 110 are made smaller, unlike Comparative Example 2, the internal electrodes 321, 322 can be adequately protected from the outside. Furthermore, the widths Wm1, Wm2 of the entire margin portion, which are the sum of the widths Wg1, Wg2 of margin regions G1, G2 in main body 110 and the widths Ws1, Ws2 of side margin portions 114, 115, can be made smaller than the width Wm'' of margin portions 314, 315 in Comparative Example 2, thereby improving the capacitance per unit volume.

[0062] According to an embodiment of the present invention, the presence of margin regions G1 and G2 in the body 110 can reduce the occurrence of blade chipping that may occur in Comparative Example 1, and can improve the bonding strength between the side margins 114 and 115 and the body 110 to prevent moisture penetration. Even if moisture penetrates between the side margins 114 and 115 and the body 110, the presence of margin regions G1 and G2 makes it difficult for the moisture to reach the internal electrodes 121 and 122, improving moisture resistance reliability. In addition, according to the modified example of the present invention, even if one of both ends of the internal electrode contacts the side margin, the thickness of both ends of the internal electrode is thin, so that the bonding strength between the side margins and the body is greater than that of Comparative Example 1, which is advantageous in ensuring moisture resistance reliability.

[0063] That is, according to one embodiment of the present invention, while ensuring higher moisture resistance reliability than Comparative Example 1, it is possible to improve the capacity per unit volume compared to Comparative Example 2.

[0064] 6, when the first internal electrode 121 is divided into ten equal parts in the third direction into first to tenth regions R1 to R10, both ends 121e1 and 121e2 of the first internal electrode 121 may be the first region R1 and the tenth region R10, and the central portion 121c of the first internal electrode 121 may be the second to ninth regions R2 to R9. Both ends 122e1 and 122e2 and the central portion 122c of the second internal electrode 122 may be divided in the same manner.

[0065] As a specific example of a measuring method, the average thickness of both ends and the average thickness of the central portion of the internal electrodes 121 and 122 may be measured by scanning a cross section in the first and third directions cut at the center of the body 110 in the second direction with a scanning electron microscope (SEM). After selecting one internal electrode from the scanned image, the cross section is divided into 10 equal parts in the third direction into first to tenth regions, and the thickness of the internal electrode is measured at five evenly spaced points in the first region and the average value is set as the average thickness of one end of the internal electrodes 121 and 122. The thickness of the internal electrode is measured at five evenly spaced points in the tenth region and the average value is set as the average thickness of the other end of the internal electrodes 121 and 122. The average value of the average thickness of one end of the internal electrodes 121 and 122 and the average thickness of the other end of the internal electrodes 121 and 122 may be set as the average thickness of both ends of the internal electrodes 121 and 122. In addition, the thickness of the internal electrodes may be measured at 10 evenly spaced points in the second to ninth regions, and the average value may be determined as the average thickness of the central portion of the internal electrodes 121 and 122.

[0066] Meanwhile, if such average thickness measurements are performed on ten internal electrodes 121, 122 and then the average value is measured, the average thicknesses at both ends and the average thickness at the center of the internal electrodes 121, 122 can be further generalized.

[0067] In one embodiment, the average thickness of both ends of the internal electrodes 121, 122 may be 0.90 or less relative to the average thickness of the central portion of the internal electrodes 121, 122. This can further improve the effect of improving the bonding strength between the side margin portions 114, 115 and the body 110 and the effect of reducing the occurrence of blade chipping. In addition, the average thickness of both ends of the internal electrodes 121, 122 relative to the average thickness of the central portion of the internal electrodes 121, 122 may be more preferably 0.80 or less, and further preferably 0.70 or less.

[0068] The average thickness of the central portion of the internal electrodes 121, 122 does not need to be particularly limited, but can be, for example, 0.05 μm to 3.0 μm.

[0069] In one embodiment, at least one of the ends of the internal electrodes 121, 122 may have a shape curved toward the center of the body in the first direction. This allows at least one of the ends of the internal electrodes 121, 122 to be located closer to the center of the body in the first direction than the center of the internal electrodes 121, 122.

[0070] There is no need to particularly limit the average widths Wm1 and Wm2 in the third direction from both ends of the internal electrodes 121 and 122 in the third direction to the outsides of the adjacent side margins 114 and 115. However, the average widths Wm1 and Wm2 in the third direction from both ends of the internal electrodes 121 and 122 in the third direction to the outsides of the adjacent side margins 114 and 115, which can more significantly improve the capacitance per unit volume while ensuring the moisture resistance reliability of the multilayer electronic component according to the present invention, can be 20 μm or more and 55 μm or less.

[0071] Meanwhile, in the case of Comparative Example 1, the width Wm' of the side margin portions 214, 215 for maximizing the capacitance per unit volume is 20 μm or less, and in the case of Comparative Example 2, the width Wm'' of the margin portions 314, 315 for stably ensuring moisture resistance reliability is 50 μm or more. Therefore, Wm1 and Wm2 can be larger than the width Wm' of the side margin portions 214, 215 of Comparative Example 1, but smaller than the width Wm'' of the margin portions 314, 315 of Comparative Example 2. Also, when Wm1 and Wm2 are the width Wm' of the side margin portions 214, 215 of Comparative Example 1, the capacitance per unit volume is the same as that of Comparative Example 1, but the moisture resistance reliability can be superior.

[0072] 4, Wm1 may be a value obtained by adding a distance Wg1 between one end 121e1, 122e1 of the internal electrode and the fifth surface to a width Ws1 of the first side margin, and Wm2 may be a value obtained by adding a distance Wg2 between the other end 121e2, 122e2 of the internal electrode and the sixth surface. Wm1 and Wm2 may be values ​​measured on cross sections in the first and third directions cut at the center of the multilayer electronic component 100 in the second direction, and may be values ​​obtained by averaging values ​​measured at five points evenly spaced in the first direction.

[0073] The average widths Ws1 and Ws2 in the third direction of the side margin portions 114 and 115 do not need to be particularly limited. For example, Ws1 and Ws2 may each be 50 μm or less, and for miniaturization and high capacity, Ws1 and Ws2 may each be 20 μm or less. Here, the widths in the third direction of the side margin portions 114 and 115 may refer to the size of the side margin portions 114 and 115 in the third direction.

[0074] Meanwhile, according to an embodiment of the present invention, since a widthwise margin may exist within the body 110, the width of the side margin portions 114, 115 in the third direction may be reduced to improve the capacitance per unit volume while ensuring moisture resistance. For example, when the average widths Ws1, Ws2 in the third direction of the side margin portions 114, 115 are 15 μm or less, the effect of improving the capacitance per unit volume while ensuring the moisture resistance of the multilayer electronic component according to the present invention may be more pronounced.

[0075] Meanwhile, the widths of the side margin portions 114, 115 at different positions in the first direction may be substantially the same, and the deviation in the widths may be within 5%. This may be because the side margin portions 114, 115 are formed by attaching the ceramic green sheets for the side margin portions to the side surfaces of the body 110.

[0076] In an embodiment, at least one of both ends of the internal electrodes 121 and 122 in the third direction may be disposed apart from the side margin portions 114 and 115.

[0077] At this time, both ends of the internal electrodes 121, 122 in the third direction can be arranged apart from the side margin parts 114, 115. This can further improve the bonding strength between the side margin parts 114, 115 and the body 110. This is because the bonding strength between the side margin parts 114, 115 and the dielectric layer 111 is greater than the bonding strength between the side margin parts 114, 115 and the internal electrodes 121, 122. In addition, since both ends of the internal electrodes 121, 122 in the third direction are arranged apart from the side margin parts 114, 115, even if moisture penetrates between the side margin parts 114, 115 and the body 110, it is difficult for moisture to reach the internal electrodes, and the moisture resistance reliability can be further improved. In addition, the occurrence of blade chipping that may occur in the cutting process can be suppressed.

[0078] However, the present invention is not limited to a configuration in which both ends of the internal electrodes 121, 122 in the third direction are arranged apart from the side margin portions 114, 115, and at least one end of both ends of the internal electrodes 121, 122 in the third direction may be in contact with the side margin portions, as in the modified example described below.

[0079] In one embodiment, when the ends of the internal electrodes 121 and 122 in the third direction are the first ends 121e1 and 122e1 that are closer to the fifth surface of the body 110, and the second ends 121e2 and 122e2 that are closer to the sixth surface of the body 110, the sum of the distance Wg1 between the first ends 121e1 and 122e1 and the fifth surface and the distance Wg2 between the second ends 121e2 and 122e2 and the sixth surface can be 15 μm or more. By making the sum of Wg1 and Wg2 15 μm or more, the effect of improving the moisture resistance reliability according to the present invention can be further improved.

[0080] On the other hand, the upper limit of the sum of Wg1 and Wg2 does not need to be particularly limited, but can be, for example, 82 μm or less. In order to further improve the capacity improvement effect per unit volume according to the present invention, the sum of Wg1 and Wg2 can be 60 μm or less.

[0081] Meanwhile, the side margin parts 114 and 115 may be formed by stacking a single dielectric layer or two or more dielectric layers in the third direction on both end surfaces in the third direction of the body 110. The side margin parts 114 and 115 may have a different composition from the dielectric layer 111, a different crystal grain size from the dielectric layer 111, and a different porosity from the dielectric layer 111. However, the present invention is not limited thereto, and the side margin parts 114 and 115 may have the same composition as the dielectric layer 111.

[0082] In one embodiment, when the regions between the ends of the internal electrode in the third direction that are spaced apart from the side margin portion and the side margin portion are defined as margin regions G1 and G2, the side margin portions 114 and 115 and the margin regions G1 and G2 may have different compositions.

[0083] In this case, the mole number of Mg contained in the side margin portions 114, 115 relative to 100 moles of Ti may be higher than the mole number of Mg contained in the margin regions G1, G2 relative to 100 moles of Ti, thereby improving the adhesive strength of the side margin portions 114, 115 to the main body 110 and further improving the capacity per unit volume.

[0084] In one embodiment, when the regions between the ends of the internal electrodes 121, 122 in the third direction that are spaced apart from the side margin portions 114, 115 and the side margin portions 114, 115 are defined as margin regions G1, G2, the average size of the dielectric crystal grains included in the side margin portions 114, 115 may be smaller than the average size of the dielectric crystal grains included in the margin regions G1, G2. This can further improve the adhesive strength of the side margin portions 114, 115 to the body 110, and can further improve the capacitance per unit volume.

[0085] In one embodiment, when the average size of the dielectric crystal grains adjacent to the ends of the internal electrodes 121 and 122 in the third direction that are disposed apart from the side margin parts 114 and 115 is Gs1, the average size of the dielectric crystal grains adjacent to the center parts of the internal electrodes 121 and 122 is Gs2, and the average size of the dielectric crystal grains in the regions adjacent to the outer surfaces of the side margin parts 114 and 115 is Gs3, the difference between Gs1 and Gs2 may be smaller than the difference between Gs1 and Gs3. In this case, Gs1 and Gs2 may be substantially the same, and Gs3 may be smaller or larger than Gs1 and Gs2. More specifically, Gs1 may be 0.95 to 1.05 times Gs2, and Gs3 may be more than 1.1 times or less than 0.9 times Gs1. This may be because the ceramic sheets for forming the side margins 114, 115 and the ceramic sheets for forming the dielectric layer 111 of the body 110 have different compositions.

[0086] 7, one end 114e of the first side margin portion 114 may be connected to the second surface of the body 110 by contacting one end of the fifth surface in the first direction. Also, the other end of the first side margin portion 114 may be connected to the first surface of the body 110 by contacting the other end of the fifth surface in the first direction. Similarly, one end of the second side margin portion 115 may be connected to the second surface of the body 110 by contacting one end of the sixth surface in the first direction, and the other end of the first side margin portion 114 may be connected to the first surface of the body 110 by contacting the other end of the sixth surface in the first direction.

[0087] However, when the manufacturing error of the side margin portion is taken into consideration, it is not necessarily required to have such a configuration.

[0088] For example, according to another embodiment of the present invention, as shown in FIG. 8, an end 114e' of the first side margin portion 114' may be disposed on the fifth surface, and the first side margin portion 114' may be disposed so as not to cover a portion of the fifth surface. Similarly, an end of the second side margin portion may be disposed on the sixth surface, and the second side margin portion may be disposed so as not to cover a portion of the sixth surface. Thus, according to another embodiment of the present invention, the first side margin portion 114' may be disposed so as not to contact the extension line E5 of the fifth surface, and the second side margin portion may be disposed so as not to contact the extension line of the sixth surface. Also, as shown in FIG. 8, a step may be generated at the boundary of the main body 110 because the first side margin portion 114' covers only a portion of the fifth surface.

[0089] Furthermore, according to yet another embodiment of the present invention, at least a portion of the side margin portions 114'', 115'' may be disposed on the first and second surfaces. Referring to FIG. 8, one end 114e'' of the first side margin portion 114'' may be disposed on the second surface. In this case, the other end of the first side margin portion 114'' may be disposed on the first surface, one end of the second side margin portion may be disposed on the second surface, and the other end of the second side margin portion may be disposed on the first surface.

[0090] The external electrodes 131 , 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110 .

[0091] The external electrodes 131 and 132 may include first and second external electrodes 131 and 132 disposed on the third and fourth surfaces 3 and 4 of the body 110, respectively, and connected to the first and second internal electrodes 121 and 122, respectively.

[0092] Referring to FIG. 1, the external electrodes 131 and 132 may be disposed to cover both end surfaces of the side margin portions 114 and 115 in the second direction.

[0093] In this embodiment, a structure in which the multilayer electronic component 100 has two external electrodes 131, 132 is described, but the number and shapes of the external electrodes 131, 132 can be changed depending on the configuration of the internal electrodes 121, 122 and other purposes.

[0094] In one embodiment, the external electrodes 131, 132 include a first external electrode 131 arranged on the third surface of the body 110 and a second external electrode 132 arranged on the fourth surface of the body 110, and the first external electrode 131 can cover one end of the side margin portions 114, 115 in the second direction, and the second external electrode 132 can cover the other end of the side margin portions 114, 115 in the second direction.

[0095] Meanwhile, the external electrodes 131 and 132 may be formed using any material having electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical characteristics, structural stability, etc., and may further have a multi-layer structure.

[0096] For example, the external electrodes 131 and 132 may include electrode layers 131a and 132a disposed on the body 110 and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0097] As a more specific example of the electrode layers 131a and 132a, the electrode layers 131a and 132a may be firing electrodes including a conductive metal and glass, or resin-based electrodes including a conductive metal and resin.

[0098] The electrode layers 131a and 132a may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body, and may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto the fired electrode.

[0099] The conductive metal contained in the electrode layers 131a and 132a may be any material having excellent electrical conductivity, but is not limited thereto. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0100] The plating layers 131b and 132b serve to improve mounting characteristics. The type of the plating layers 131b and 132b is not particularly limited, and may be a plating layer containing one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of multiple layers.

[0101] As a more specific example of the plating layers 131b, 132b, the plating layers 131b, 132b may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layers 131a, 132a, or in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. The plating layers 131b, 132b may also include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0102] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0103] However, in order to simultaneously achieve miniaturization and high capacity, the thickness of the dielectric layers and internal electrodes must be reduced and the number of layers must be increased, so the effect of improving reliability according to the present invention may be more pronounced in a multilayer electronic component 100 having a size of 1005 (length x width, 1.0 mm x 0.5 mm) or less.

[0104] Taking into consideration manufacturing errors, the size of the external electrodes, etc., when the length of the multilayer electronic component 100 is 1.1 mm or less and the width is 0.55 mm or less, the effect of improving reliability and capacitance per unit volume according to the present invention may be more significant. Here, the length of the multilayer electronic component 100 may refer to the maximum size of the multilayer electronic component 100 in the second direction, and the width of the multilayer electronic component 100 may refer to the maximum size of the multilayer electronic component 100 in the third direction.

[0105] FIG. 10 shows a ceramic green sheet 10 printed with a conductive pattern 120 used to manufacture a multilayer electronic component according to one embodiment of the present invention, and FIG. 11 shows cross sections in the first and third directions of a laminate 10' formed by stacking the ceramic green sheets of FIG. 10.

[0106] A multilayer electronic component according to a modified example of the present invention will be described with reference to FIGS.

[0107] First, as shown in FIG. 10, a plurality of conductive patterns 120 are printed on a ceramic green sheet 10, and then a plurality of the ceramic green sheets 10 are laminated and pressed together to form a laminate 10'.

[0108] 11, the laminate 10' is cut along reference cutting lines C1 and C2 in the center of an area where the conductive patterns are spaced apart from adjacent conductive patterns in the third direction, thereby obtaining the body U1 of the unit chip. When the laminate 10' is cut along reference cutting lines C1 and C2 in FIG. 10, the internal electrodes 121 and 122 may be spaced apart from the fifth and sixth surfaces of the body, and the internal electrodes 121 and 122 may be spaced apart from the side margin portions 114 and 115.

[0109] Thereafter, by attaching one or more dielectric sheets for the side margins to the fifth and sixth surfaces of the body as shown in FIG. 2, both ends of the internal electrodes can be disposed apart from the side margins.

[0110] Then, after a sintering process, external electrodes 131 and 132 are formed on the third and fourth surfaces of the body 110, thereby obtaining a multilayer electronic component.

[0111] On the other hand, if dispersion occurs in the cutting process, the laminate 10' may not be cut exactly along the reference cutting lines C1 and C2, but may be cut at the left side A1 or right side B1 of the first reference cutting line C1, or may be cut at the left side A2 or right side B2 of the second reference cutting line C2.

[0112] Depending on the distribution of the cutting process, the multilayer electronic component according to an embodiment of the present invention may have various modified forms as described below.

[0113] 12 is a view corresponding to FIG. 4 according to the first modified example. When cutting is performed along the left side A2 of the first reference cutting line C1 and the second reference cutting line C2, a multilayer electronic component 100-1 can be obtained in which the internal electrodes 121-1 and 122-1 are separated from the fifth surface but exposed to the sixth surface and in contact with the second side margin portion 115, as shown in FIG. 12. Therefore, when the end portions of the internal electrodes 121-1 and 122-1 in the third direction that are closer to the fifth surface are defined as a first end portion and the end portions closer to the sixth surface are defined as a second end portion, the first end portion can be disposed apart from the fifth surface and the second end portion can be disposed so as to be in contact with the sixth surface. In this case, the distance between the first end portion and the fifth surface can be 5 μm or more.

[0114] Fig. 13 is a view corresponding to Fig. 4 according to the second modified example. When cutting is performed along the right side B1 of the first reference cutting line C1 and the second reference cutting line C2, a multilayer electronic component 100-2 can be obtained in which the internal electrodes 121-2, 122-2 are separated from the sixth surface but exposed on the fifth surface and in contact with the first side margin portion 114, as shown in Fig. 13.

[0115] Fig. 14 is a view corresponding to Fig. 4 according to a third modified example. When cut along the right side B2 of the first reference cutting line C1 and the second reference cutting line C2, as shown in Fig. 14, the internal electrodes 121-3 and 122-3 are spaced apart from the fifth and sixth surfaces, but a part of the adjacent conductive patterns may be included in the main body. As a result, the multilayer electronic component 100-3 may include second additional patterns 141b-3 and 142b-3 that are in contact with the sixth surface and spaced apart from the second end portion.

[0116] Fig. 15 is a view corresponding to Fig. 4 according to a fourth modified example. When cut along the left side A1 of the first reference cutting line C1 and the second reference cutting line C2, as shown in Fig. 15, the internal electrodes 121-4 and 122-4 are spaced apart from the fifth and sixth surfaces, but a part of the adjacent conductive patterns may be included in the main body. As a result, the multilayer electronic component 100-4 may include first additional patterns 141a-4 and 142a-4 that are in contact with the fifth surface and spaced apart from the first end portion.

[0117] As shown in Figures 14 and 15, according to one embodiment of the present invention, both ends of the internal electrode in the third direction are arranged spaced apart from the side margin portion, and when the end of the internal electrode in the third direction closest to the fifth surface is defined as a first end and the end closest to the sixth surface is defined as a second end, the body may include at least one of a first additional pattern in contact with the fifth surface and spaced apart from the first end, and a second additional pattern in contact with the sixth surface and spaced apart from the second end.

[0118] In this case, the end portion of the first additional pattern in the third direction that is closest to the first end portion, the end portion of the second additional pattern in the third direction that is closest to the second end portion, and the first and second ends of the internal electrode may have a shape curved toward the center of the first direction of the body.

[0119] In addition, the first additional pattern may have a portion in contact with the fifth surface that is thicker than the end portion closer to the first end, and the second additional pattern may have a portion in contact with the sixth surface that is thicker than the end portion closer to the second end.

[0120] Fig. 16 is a view corresponding to Fig. 4 according to the fifth modified example. When cut along the left side A1 of the first reference cutting line C1 and the left side A2 of the second reference cutting line C2, the internal electrodes 121-5 and 122-5 are spaced apart from the fifth surface but in contact with the sixth surface, and a part of the adjacent conductive pattern may be included in the main body, as shown in Fig. 16. As a result, the multilayer electronic component 100-5 may include first additional patterns 141a-5 and 142a-5 that are in contact with the fifth surface and spaced apart from the first end portion.

[0121] Therefore, when the end of the internal electrodes 121-5, 122-5 in the third direction, the end closer to the fifth surface is defined as a first end and the end closer to the sixth surface is defined as a second end, the first end may be disposed apart from the fifth surface and the second end may be disposed in contact with the sixth surface, and the body may further include first additional patterns 141a-5, 142a-5 in contact with the fifth surface and disposed apart from the first end.

[0122] In this case, the distance between the first end and the first additional patterns 141a-5 and 142a-5 may be 15 μm or more.

[0123] In addition, the ends of the first additional patterns 141a-5 and 142a-5 in the third direction close to the first end and the first end of the internal electrode may have a shape curved toward the center of the first direction of the body. In addition, the first additional patterns 141a-5 and 142a-5 may have a thickness in a portion contacting the fifth surface that is thicker than the thickness of the end close to the first end.

[0124] Fig. 17 is a view corresponding to Fig. 4 according to the sixth modified example. When cut along the right side B1 of the first reference cutting line C1 and the right side B2 of the second reference cutting line C2, the internal electrodes 121-6 and 122-6 are in contact with the fifth surface but are spaced apart from the sixth surface, and a part of the adjacent conductive pattern may be included in the main body, as shown in Fig. 16. As a result, the multilayer electronic component 100-6 may include second additional patterns 141b-6 and 142b-6 that are in contact with the sixth surface and spaced apart from the second end portion.

[0125] Fig. 18 is a view corresponding to Fig. 4 according to the seventh modified example. When cut along the left side A1 of the first reference cutting line C1 and the right side B2 of the second reference cutting line C2, the internal electrodes 121-7 and 122-7 are spaced apart from the fifth and sixth surfaces, and a part of the adjacent conductive pattern may be included in the main body, as shown in Fig. 17. As a result, the multilayer electronic component 100-7 may include first additional patterns 141a-7 and 142a-7 in contact with the fifth surface and spaced apart from the first end portion, and second additional patterns 141b-7 and 142b-7 in contact with the sixth surface and spaced apart from the second end portion.

[0126] FIG. 19 is a view corresponding to FIG. 4 according to Comparative Example 3. When cut along the right side B1 of the first reference cutting line C1 and the left side A2 of the second reference cutting line C2, the internal electrodes 121-8 and 122-8 can contact the fifth and sixth surfaces as shown in FIG. 18. Thus, both ends of the internal electrodes 121-8 and 122-8 in the third direction can be arranged to contact the side margins 114 and 115. In this case, it may be similar to Comparative Example 1, and moisture resistance reliability may be reduced by arranging both ends of the internal electrodes to contact the side margins 114 and 115. Meanwhile, according to an embodiment of the present invention, at least one of both ends of the internal electrodes 121 and 122 in the third direction is arranged to be spaced apart from the side margins 114 and 115, thereby further improving moisture resistance reliability.

[0127] Manufacturing method for multilayer electronic components A method for manufacturing a multilayer electronic component according to an embodiment of the present invention includes the steps of forming a plurality of conductive patterns 120 arranged on one surface in a first direction of a ceramic green sheet 10 in a second direction perpendicular to the first direction and a third direction perpendicular to the first and second directions, laminating a plurality of the ceramic green sheets in the first direction to obtain a laminate 10', and cutting the laminate in the second and third directions to obtain a plurality of unit chips U1, wherein when cutting in the third direction, a first internal electrode pattern is formed such that a cut surface of the conductive pattern is exposed on one surface of the unit chip in the second direction, and a cut surface of the conductive pattern is exposed on one surface of the unit chip in the second direction. The method may further include a laminate cutting step of cutting the laminate to include a second internal electrode pattern exposed on the other side, and cutting the laminate in the second direction from a center C1, C2 of an area where the conductive pattern is separated from an adjacent conductive pattern in the third direction within a range of We in the third direction, where the conductive pattern is separated from at least one of a first and a second side surface of the unit chip facing in the third direction, where We is a distance by which the conductive pattern is separated from an adjacent conductive pattern in the third direction, and a side margin forming step of attaching a ceramic green sheet for a side margin portion to the first and the second side surface of the unit chip.

[0128] Fig. 10 shows a ceramic green sheet on which an internal electrode pattern is printed, which is used to manufacture a multilayer electronic component according to an embodiment of the present invention. Fig. 10 shows cross sections in the first and third directions of a laminate obtained by stacking the ceramic green sheets of Fig. 9.

[0129] A method for manufacturing a multilayer electronic component according to one embodiment of the present invention will be described with reference to FIGS.

[0130] First, as shown in FIG. 10, a plurality of conductive patterns 120 may be formed on one surface of a ceramic green sheet 10 in a first direction, the conductive patterns 120 being arranged in a second direction perpendicular to the first direction and a third direction perpendicular to the first and second directions.

[0131] The ceramic green sheet 10 does not particularly need to be limited, and a ceramic green sheet can be formed using a ceramic powder. For example, the ceramic green sheet can be formed using a slurry containing a ceramic powder, an organic solvent, and a binder. Specifically, after an additive is added to the ceramic powder, ethanol and toluene are mixed with a dispersant as solvents, and then a binder is mixed to form the ceramic green sheet 10. The ceramic powder can be a BaTiO3-based ceramic powder. For example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. can be mentioned.

[0132] The method for forming the conductive pattern 120 is not particularly limited. An internal electrode conductive paste containing a conductive metal can be applied to form the internal electrode pattern 120. As the application method of the internal electrode conductive paste, a screen printing method, a gravure printing method, etc. can be used, but the present invention is not limited thereto. On the other hand, the conductive pattern 120 becomes the internal electrodes 121 and 122 after the sintering process, and a part of it can form the additional patterns 141a, 141b, 142a, and 142b.

[0133] Thereafter, a plurality of ceramic green sheets 10 on which the plurality of conductive patterns 120 are formed can be laminated and pressure-bonded in the first direction to obtain a laminate 10'.

[0134] Cover portions can be formed by laminating ceramic green sheets 10 on which the conductive pattern 120 is not formed on the upper and lower portions of the laminate 10' in the first direction.

[0135] Thereafter, the laminate is cut in the second direction and the third direction to obtain a plurality of unit chips U1. When cutting in the third direction, the cut surface of the conductive pattern is cut to include a first internal electrode pattern exposed to one side of the unit chip in the second direction and a second internal electrode pattern exposed to the other side of the unit chip in the second direction. When the distance by which the conductive pattern is separated from an adjacent conductive pattern in the third direction is We, when cutting in the second direction, the conductive pattern is cut within the range of We in the third direction at the center of the region separated from the adjacent conductive pattern in the third direction, but the conductive pattern is separated from at least one of the first and second side surfaces facing the third direction of the unit chip. A laminate cutting step may be performed.

[0136] 11, when cutting in the second direction, the center of an area where the conductive pattern is separated from the adjacent conductive pattern in the third direction can be selected as the reference cutting lines C1 and C2, and the laminate 10' can be cut in the third direction from the reference cutting lines C1 and C2 within a range We. That is, when the reference cutting line on the left side of the unit chip U1 is the first reference cutting line C1 and the reference cutting line on the right side of the unit chip U1 is the second reference cutting line C2, when cutting at the left side A1 of the first reference cutting line C1, cutting can be performed within a range WA1, and the size of WA1 can be equal to or less than We. Also, when cutting at the right side B1 of the first reference cutting line C1, cutting can be performed within a range WB1, and the size of WB1 can be equal to or less than We. Similarly, when cutting at the left side A2 of the second reference cutting line C2, cutting can be performed within a range WA2, and the size of WA2 can be equal to or less than We. Also, when cutting at the right side B2 of the second reference cutting line C2, cutting can be performed within a range WB2, and the size of WB2 can be equal to or less than We.

[0137] When cutting the laminate 10' along the reference cutting lines C1 and C2 in FIG. 10, the internal electrodes 121 and 122 may be spaced apart from the fifth and sixth surfaces of the main body, and the internal electrodes 121 and 122 may be arranged spaced apart from the side margin portions 114 and 115.

[0138] If the cutting process is dispersed, the laminate 10' may not be cut precisely along the reference cutting lines C1 and C2, but may be cut at the left side A1 or right side B1 of the first reference cutting line C1, and may be cut at the left side A2 or right side B2 of the second reference cutting line C2. Depending on the dispersion of the cutting process, the multilayer electronic component according to an embodiment of the present invention may have various modified forms as described above.

[0139] In an embodiment, when cutting in the second direction, the conductive pattern may be cut in the third direction at a center of a region separated from an adjacent conductive pattern in the third direction within a range of less than We / 2. As a result, a multilayer electronic component in which both ends of the internal electrodes are arranged apart from the side margins can be obtained, and the bonding strength between the side margins and the main body can be improved, thereby improving moisture resistance reliability. Referring to FIG. 11, when cutting at the left side A1 of the first reference cutting line C1, the cut may be made within a range of WA1, and the size of WA1 may be less than We / 2, and when cutting at the right side B1 of the first reference cutting line C1, the cut may be made within a range of WB1, and the size of WB1 may be less than We / 2. Similarly, when cutting at the left side A2 of the second reference cutting line C2, the cut may be made within a range of WA2, and the size of WA2 may be less than We / 2, and when cutting at the right side B2 of the second reference cutting line C2, the cut may be made within a range of WB2, and the size of WB2 may be less than We / 2.

[0140] That is, when cutting in the second direction, the conductive pattern 120 can be cut so as not to be exposed to the first and second sides of the unit chip. The first side of the unit chip corresponds to the fifth side of the body, and the second side of the unit chip corresponds to the sixth side of the body.

[0141] In this case, the multilayer electronic component 100 shown in FIGS. 1 to 5 can be manufactured.

[0142] In an embodiment, when cutting in the second direction, the conductive pattern may be cut so as to be exposed on one side of the first and second sides of the unit chip.

[0143] At this time, in order to expose the conductive pattern on the first side, cutting may be performed on the right side B1 of the first reference cutting line C1 within a range of WB1, and the size of WB1 may be equal to or larger than We / 2 and equal to or smaller than We. In this case, as shown in FIGS. 13, 17, and 19, the internal electrodes may be exposed on the fifth surface.

[0144] Also, in order to expose the conductive pattern on the second side, cutting may be performed on the left side A2 of the second reference cutting line C2 within a range WA2, and the size of WA2 may be greater than or equal to We / 2 and less than or equal to We. In this case, as shown in FIGS. 12, 16, and 19, the internal electrodes may be exposed on the sixth side.

[0145] In an embodiment, when cutting in the second direction, the conductive pattern adjacent to the conductive pattern may be cut so as to be exposed on at least one of the first and second side surfaces.

[0146] At this time, in order to expose the adjacent conductive pattern to the first side, cutting may be performed within a range WA1 on the left side A1 of the first reference cutting line C1, and the size of WA1 may be equal to or larger than We / 2 and equal to or smaller than We. In this case, the first additional pattern may be exposed to the fifth surface as shown in FIGS. 15, 16, and 18.

[0147] Also, in order to expose the adjacent conductive pattern on the second side, cutting may be performed on the right side B2 of the second reference cutting line C2 within a range of WB2, and the size of WB2 may be equal to or larger than We / 2 and equal to or smaller than We. In this case, the second additional pattern may be exposed on the sixth side as shown in FIGS. 14, 17, and 18.

[0148] After the above-described laminate cutting step, a side margin portion forming step of attaching a ceramic green sheet for a side margin portion to the first and second side surfaces facing each other in the third direction of the unit chip can be performed.

[0149] The ceramic green sheet for the side margin portion does not need to be particularly limited, and the ceramic green sheet for the side margin portion can be formed using ceramic powder, and the ceramic green sheet used for forming the laminate can also be used. For example, the ceramic green sheet can be formed using a slurry containing ceramic powder, an organic solvent, and a binder. Specifically, after adding an additive to the ceramic powder, ethanol and toluene are mixed with a dispersant as solvents and then a binder is mixed to form the ceramic green sheet 10. The ceramic powder can be a BaTiO3-based ceramic powder. For example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. can be mentioned.

[0150] Also, the ceramic green sheet for the side margin portion can have a higher Mg content than the ceramic green sheet used for forming the laminate in order to improve the bonding strength with the laminate. At this time, the Mg content can mean the number of moles of Mg per 100 moles of Ti.

[0151] Also, after sintering the unit chip to which the ceramic green sheet for the side margin portion is attached, external electrodes 131 and 132 can be formed on the third and fourth surfaces of the main body 110 to obtain a multilayer electronic component.

[0152] The method of forming the external electrodes 131 and 132 is not particularly limited, and may be a method of dipping in a paste containing conductive metal and glass, or may be formed by transferring a sheet containing conductive metal. Also, the external electrodes may be formed using a paste containing conductive metal and resin, or using an atomic layer deposition (ALD) method, a molecular layer deposition (MLD) method, a chemical vapor deposition (CVD) method, a sputtering method, etc.

[0153] Furthermore, a plating process may be further performed so that the external electrodes include plating layers 131b, 132b.

[0154] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications, and changes can be made by a person having ordinary knowledge in the art within the scope of the technical idea of ​​the present invention described in the claims, and these also belong to the scope of the present invention.

[0155] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-mentioned one embodiment does not exclude being realized in combination with the features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description that is opposite or contradictory to the matter in the other embodiment.

[0156] The terms used in the present disclosure are merely used to describe one embodiment and are not intended to limit the present disclosure. In this case, a singular expression includes a plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0157] 100 Multilayer electronic components 110 Main unit 111 Dielectric layer 112, 113 Cover part 114, 115 Side margin 121, 122 Internal electrode 141a, 141b, 142a, 142b additional patterns 131, 132 External electrode 131a, 132a electrode layer 131b, 132b plating layer

Claims

1. a body including dielectric layers and internal electrodes alternately disposed in a first direction with the dielectric layers, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first and fourth surfaces and facing each other in the third direction; Side margin portions disposed on the fifth and sixth surfaces; external electrodes disposed on the third and fourth surfaces; At least one of both end portions of the internal electrode in the third direction is disposed apart from the side margin portion and has an average thickness smaller than that of a central portion of the internal electrode in the third direction.

2. 2. The multilayer electronic component according to claim 1, wherein one end of each of the internal electrodes in the third direction is disposed apart from the side margin portion, and the other end of each of the internal electrodes in the third direction is disposed so as to be in contact with the side margin portion.

3. 2. The multilayer electronic component according to claim 1, wherein, of both ends of the internal electrode in the third direction, an end closer to the fifth surface is defined as a first end and an end closer to the sixth surface is defined as a second end, the first end is disposed apart from the fifth surface and the second end is in contact with the sixth surface.

4. The multilayer electronic component according to claim 3 , wherein the distance between the first end and the fifth surface is 5 μm or more.

5. The multilayer electronic component according to claim 3 , wherein the main body further includes a first additional pattern in contact with the fifth surface and spaced apart from the first end.

6. The multilayer electronic component according to claim 5 , wherein the distance between the first end and the first additional pattern is 15 μm or more.

7. 6. The multilayer electronic component according to claim 5, wherein an end of the first additional pattern that is close to the first end and a first end of the internal electrode have a shape curved toward the center of the body in the first direction.

8. 6. The multilayer electronic component according to claim 5, wherein the first additional pattern has a thickness in a portion in contact with the fifth surface that is greater than a thickness of an end portion closer to the first end portion.

9. The multilayer electronic component according to claim 1 , wherein both end portions of the internal electrodes in the third direction are disposed spaced apart from the side margin portions.

10. 10. The multilayer electronic component according to claim 9, wherein, of both ends of the internal electrode in the third direction, an end closer to the fifth surface is defined as a first end and an end closer to the sixth surface is defined as a second end, and a sum of a distance between the first end and the fifth surface and a distance between the second end and the sixth surface is 15 μm or more.

11. When an end portion of the internal electrode in the third direction that is closer to the fifth surface is defined as a first end portion and an end portion closer to the sixth surface is defined as a second end portion, 10. The laminated electronic component according to claim 9, wherein the main body includes at least one of a first additional pattern in contact with the fifth surface and spaced apart from the first end, and a second additional pattern in contact with the sixth surface and spaced apart from the second end.

12. 12. The multilayer electronic component according to claim 11, wherein an end of the first additional pattern that is closer to the first end, an end of the second additional pattern that is closer to the second end, and a first end and a second end of the internal electrode have a shape curved toward the center of the body in the first direction.

13. the first additional pattern has a portion in contact with the fifth surface having a thickness greater than a thickness of an end portion close to the first end portion; The multilayer electronic component according to claim 11 , wherein the second additional pattern has a thickness in a portion in contact with the sixth surface that is greater than a thickness of an end portion closer to the second end portion.

14. The laminated electronic component according to claim 11 , wherein the main body includes the first additional pattern and the second additional pattern.

15. When a region between an end of the internal electrode in the third direction that is spaced apart from the side margin portion and the side margin portion is defined as a margin region, The multilayer electronic component according to claim 1 , wherein the side margin portion and the margin region have different compositions.

16. 16. The multilayer electronic component according to claim 15, wherein the number of moles of Mg contained per 100 moles of Ti contained in the side margin portion is higher than the number of moles of Mg contained per 100 moles of Ti contained in the margin region.

17. When a region between an end of the internal electrode in the third direction that is spaced apart from the side margin portion and the side margin portion is defined as a margin region, 2. The multilayer electronic component according to claim 1, wherein an average size of the dielectric crystal grains included in the side margin portions is smaller than an average size of the dielectric crystal grains included in the margin regions.

18. 2. The multilayer electronic component according to claim 1, wherein a dielectric crystal grain size adjacent to an end portion of the internal electrode in a third direction that is spaced apart from the side margin portion is defined as Gs1, a dielectric crystal grain size adjacent to a center portion of the internal electrode is defined as Gs2, and a dielectric crystal grain size in a region adjacent to an outer surface of the side margin portion is defined as Gs3, and a difference between Gs1 and Gs2 is smaller than a difference between Gs1 and Gs3.

19. the side margin portion includes a first side margin portion disposed on the fifth surface and a second side margin portion disposed on the sixth surface, the first side margin portion is disposed so as not to cover a portion of the fifth surface, and an end of the first side margin portion is disposed on the fifth surface; 2 . The multilayer electronic component according to claim 1 , wherein the second side margin portion is disposed so as not to cover a portion of the sixth surface, and an end of the first side margin portion is disposed on the sixth surface.

20. The multilayer electronic component according to claim 1 , wherein at least a portion of the side margin portion is disposed on the first and second surfaces.

21. 2. The multilayer electronic component according to claim 1, wherein when the internal electrodes are divided into ten equal parts in a third direction into first to tenth regions, both ends of the internal electrodes are the first region and the tenth region, and a center portion of the internal electrodes is the second to ninth regions.

22. 2. The multilayer electronic component according to claim 1, wherein an average thickness of each of said internal electrodes at both ends in the third direction is 0.90 or less relative to an average thickness of a central portion of said internal electrodes in the third direction.

23. 2 . The multilayer electronic component according to claim 1 , wherein at least one of both end portions of the internal electrode in the third direction has a shape curved toward the center of the body in the first direction.

24. 2. The multilayer electronic component according to claim 1, wherein an average width in the third direction from both ends of the internal electrode in the third direction to an outside of an adjacent side margin portion is 20 μm or more and 55 μm or less.

25. 25. The multilayer electronic component according to claim 24, wherein the average size of the side margin portion in the third direction is 15 μm or less.

26. forming a plurality of conductive patterns arranged on one surface of the ceramic green sheet in a first direction, the conductive patterns being arranged in a second direction perpendicular to the first direction and a third direction perpendicular to the first and second directions; laminating a plurality of the ceramic green sheets in a first direction to obtain a laminate; cutting the laminate in the second direction and in a third direction to obtain a plurality of unit chips, the laminate being cut in the third direction such that a cut surface of the conductive pattern includes a first internal electrode pattern exposed on one side of the unit chip in the second direction and a second internal electrode pattern exposed on the other side of the unit chip in the second direction, and the conductive pattern is cut in the second direction within a range of We in the third direction at a center of a region separated from an adjacent conductive pattern in the third direction, where the conductive pattern is separated from at least one of a first side and a second side of the unit chip facing in the third direction, where We is a distance that the conductive pattern is separated from an adjacent conductive pattern in the third direction; and attaching side margin portion ceramic green sheets to first and second side surfaces of the unit chip to form side margin portions.

27. 27. The method for producing a multilayer electronic component according to claim 26, wherein when cutting in the second direction, the conductive pattern is cut in the third direction at a center of a region separated from an adjacent conductive pattern in the third direction within a range of less than We / 2.

28. The method for producing a multilayer electronic component according to claim 26 , wherein cutting in the second direction is performed such that the conductive patterns are not exposed on the first and second side surfaces of the unit chips.

29. The method for manufacturing a multilayer electronic component according to claim 26 , wherein cutting in the second direction is performed such that the conductive pattern is exposed on one side of the first and second side surfaces of the unit chip.

30. 27. The method for producing a multilayer electronic component according to claim 26, wherein cutting in the second direction is performed such that a conductive pattern adjacent to the conductive pattern is exposed on at least one of the first and second side surfaces.

Images