Module and electronic apparatus

Abstract

To improve the reliability of solder joining in a module.SOLUTION: A module has a first printed circuit board, a second printed circuit board joined to the first printed circuit board via a plurality of first solder joining parts, a third printed circuit board joined to the second printed circuit board via a plurality of second solder joining parts, and first and second reinforcement resin parts. The second printed circuit board has a first side face and a second side face facing each other in a first direction. The first reinforcement resin part is attached to a principal surface of the first printed circuit board, the first side face of the second printed circuit board, and the third printed circuit board, and is separated from at least one end of both ends in a second direction of the first side face of the second printed circuit board. The second reinforcement resin part is attached to the principal surface of the first printed circuit board, the second side face of the second printed circuit board, and the third printed circuit board, and is separated from at least one end of both ends in the second direction of the second side face of the second printed circuit board.SELECTED DRAWING: Figure 4C

Description

Technical Field

[0001] The present invention relates to a module and an electronic device.

Background Art

[0002] In electronic devices, the communication speed of semiconductor devices and the implementation density are increasing, and three-dimensional implementation technology for laminating and mounting a plurality of semiconductor devices and printed circuit boards has become essential. A semiconductor device is a semiconductor package having a semiconductor element and an interposer, such as a digital signal processor or a memory. Also, a printed circuit board plays a role of electrically connecting these semiconductor devices when, for example, a plurality of semiconductor devices are laminated.

[0003] In recent years, in semiconductor devices mounted on electronic devices such as mobile devices, high-speed and large-capacity data processing is performed, so the temperature rise during operation has increased. In such semiconductor devices, the stress applied to the solder joints due to thermal deformation has also increased. In particular, in a three-dimensional mounting structure in which semiconductor devices and printed circuit boards having different linear expansion coefficients are laminated on a printed wiring board, the risk of a decrease in the reliability of the solder joints may increase.

[0004] Therefore, Patent Document 1 describes a mounting method in which reinforcing resin portions are formed at the peripheral portions of the four corners of a semiconductor device and a printed circuit board, and each thermal deformation is suppressed, thereby reducing the stress applied to the solder joints and improving the reliability of the solder joints. Specifically, the mounting method described in Patent Document 1 is a mounting method of a three-dimensional mounting structure in which a semiconductor device is mounted on a printed wiring board, resin is applied on the printed wiring board near the semiconductor device, and further a printed circuit board is mounted on the semiconductor device and reflow heated. According to the above method, it is said that the resin can be cured simultaneously with solder bonding by the reflow process, and the solder joints can be reinforced.

Prior Art Documents

Patent Documents

[0005] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2015-50355 [Summary of the Invention] [Problems to be Solved by the Invention]

[0006] However, depending on the three-dimensional mounting structure, even if the resin is formed in a U-shape as described in Patent Document 1, stress may concentrate on the solder joint near the portion where the resin is not formed. Therefore, in the mounting structure according to the mounting method described in Patent Document 1, a sufficient reinforcing effect cannot be obtained, and there is a problem that the solder joint reliability is insufficient.

[0007] Therefore, an object of the present invention is to provide a module capable of improving the reliability of solder joints. [Means for Solving the Problems]

[0008] According to one aspect of the present invention, there is provided a module including a first printed wiring board, a second printed wiring board disposed on a main surface of the first printed wiring board and joined to the first printed wiring board via a plurality of first solder joints, a third printed wiring board disposed on a side opposite to the side of the first printed wiring board with respect to the second printed wiring board and joined to the second printed wiring board via a plurality of second solder joints, a first reinforcing resin portion, and a second reinforcing resin portion. The second printed wiring board has a first side surface and a second side surface facing each other in a first direction, and a third side surface and a fourth side surface facing each other in a second direction intersecting the first direction. The first reinforcing resin portion adheres to the main surface of the first printed wiring board, the first side surface of the second printed wiring board, and the third printed wiring board, and is separated from at least one of both ends of the first side surface of the second printed wiring board in the second direction. The second reinforcing resin portion adheres to the main surface of the first printed wiring board, the second side surface of the second printed wiring board, and the third printed wiring board, and is separated from at least one of both ends of the second side surface of the second printed wiring board in the second direction.

[0009] According to another aspect of the present invention, there are provided a first printed wiring board, a second printed wiring board disposed on a main surface of the first printed wiring board and joined to the first printed wiring board via a plurality of first solder joints, a third printed wiring board disposed on a side opposite to the side of the first printed wiring board with respect to the second printed wiring board and joined to the second printed wiring board via a plurality of second solder joints, a first reinforcing resin portion, and a second reinforcing resin portion. The second printed wiring board has a first side surface and a second side surface facing each other in a first direction, and a third side surface and a fourth side surface facing each other in a second direction intersecting the first direction. The first reinforcing resin portion adheres to the main surface of the first printed wiring board, the first side surface of the second printed wiring board, and the third printed wiring board, and is separated from the solder joint closest to the first reinforcing resin portion among one of the plurality of first solder joints and the plurality of second solder joints. A module is provided that adheres to the solder joint closest to the first reinforcing resin portion among the other solder joints of the plurality of first solder joints and the plurality of second solder joints.

Advantages of the Invention

[0010] According to the present invention, the reliability of solder joints in a module can be improved.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4A

Figure 4B

Figure 4C

Figure 5A

Figure 5B

Figure 5C

Figure 5D

Figure 5E

Figure 6A

Figure 6B

Figure 6C

Figure 7A

Figure 7B

Figure 8A

Figure 8B

Figure 9A

Figure 9B

Figure 10A

Figure 10B

Figure 10C

Figure 10D

Figure 11A

Figure 11B

Figure 12A

Figure 12B

Figure 12C

Mode for Carrying Out the Invention

[0012] [First Embodiment] A three-dimensional mounting structure which is a module according to the first embodiment of the present invention and an electronic device using the same will be described with reference to FIGS. 1 to 5E.

[0013] First, an example of an electronic device using the three-dimensional mounting structure according to the present embodiment will be described with reference to FIG. 1. FIG. 1 is a schematic view showing a lens-exchangeable digital camera 600 which is an example of an electronic device using the three-dimensional mounting structure 500 according to the present embodiment. In the present embodiment, the lens-exchangeable digital camera 600 will be described, but the digital camera 600 may be a lens-integrated type in which a lens is built in the camera body 601. Further, the electronic device in which the three-dimensional mounting structure 500 according to the present embodiment is used is not limited to the digital camera 600 which is an imaging device, and may be any type of device.

[0014] As shown in FIG. 1, the digital camera 600 is, for example, a lens-exchangeable digital camera such as a digital single-lens reflex camera or a digital mirrorless camera, and includes a camera body 601 and a lens unit 602 including a lens. The lens unit 602 is detachably attached to the camera body 601.

[0015] The camera body 601 includes a housing 611, a three-dimensional mounting structure 500, and a sensor module 900. The three-dimensional mounting structure 500 and the sensor module 900 are each processing modules and are arranged inside the housing 611. The three-dimensional mounting structure 500 and the sensor module 900 are electrically connected to each other by a flexible wiring 950. The flexible wiring 950 is, for example, a flexible cable, a flexible printed circuit board, or the like.

[0016] The sensor module 900 has an image sensor 700 which is an imaging device, and a printed circuit board 800. The image sensor 700 is mounted on the printed circuit board 800. The image sensor 700 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. The image sensor 700 has a function of converting the light incident through the lens unit 602 into an electrical signal.

[0017] Next, the configuration of the three-dimensional mounting structure 500 according to this embodiment will be described with reference to FIG. 2. FIG. 2 is a perspective view showing the three-dimensional mounting structure 500 according to this embodiment. In the following description, as shown in FIG. 2, among the plane directions of the printed circuit board 100 described below, the direction parallel to one longitudinal direction of the reinforcing resin portion 410 described below is taken as the x-axis direction, and the direction orthogonal to the x-axis direction in the plane direction is taken as the y-axis direction. Also, the direction orthogonal to the x-axis direction and the y-axis direction is taken as the z-axis direction. The x-axis direction, the y-axis direction, and the z-axis direction do not necessarily have to be orthogonal to each other, and may be directions intersecting each other.

[0018] As shown in FIG. 2, the three-dimensional mounting structure 500 includes a mounting structure 510, a printed circuit board 100, and a reinforcing resin portion 410. The mounting structure 510 includes a semiconductor device 200. The reinforcing resin portion 410 is composed of a resin 400. The mounting structure 510 is mounted on one main surface as the mounting surface of the printed circuit board 100. The printed circuit board 100 is, for example, a rigid substrate, which is a printed wiring board with components mounted thereon.

[0019] The mounting structure 510 has, for example, a semiconductor device 200 and a printed circuit board 300, and the printed circuit board 300 is mounted on the semiconductor device 200 via a solder joint portion 620 (see FIG. 3) and is a stacked structure. The semiconductor device 200 is, for example, a digital signal processor, and has a function of acquiring an electrical signal from an image sensor 700, performing a process of correcting the acquired electrical signal, and generating image data. The printed circuit board 300 is, for example, a rigid substrate, which is a printed wiring board with components mounted thereon. The reinforcing resin portion 410 is composed of a resin 400 and fixes the printed circuit board 100 and the mounting structure 510.

[0020] Next, the specific structure of the three-dimensional mounting structure 500 according to the present embodiment will be described with reference to FIGS. 3 to 5E. FIG. 3 is a cross-sectional view showing a cross section along the line A-A shown in FIG. 2 of the three-dimensional mounting structure 500. FIGS. 4A to 4C are top views showing an interposer 220 of the semiconductor device 200, the printed circuit board 300, and the three-dimensional mounting structure 500, respectively. FIGS. 4A to 4C are top views seen in the z-axis direction. FIGS. 5A to 5C and FIG. 5E are enlarged views showing an enlarged cross section along the line A-A shown in FIG. 2 of the three-dimensional mounting structure 500. FIG. 5D is a side view showing the three-dimensional mounting structure 500. FIG. 5D is a side view seen in the y-axis direction.

[0021] The semiconductor device 200 is, for example, a semiconductor package of an area array, specifically, a semiconductor package of BGA (Ball Grid Array). As shown in FIG. 3, the semiconductor device 200 includes a semiconductor element 210 and an interposer 220. The interposer 220 is, for example, a printed circuit board which is a rigid substrate and has components mounted on the printed wiring board. The semiconductor element 210 is mounted on the interposer 220.

[0022] As shown in FIG. 4A, the interposer 220 has a rectangular planar shape in a top view seen in the z-axis direction, and has side surfaces 1a, 2b, 3c, and 4d on sides 1, 2, 3, and 4 of the rectangular planar shape, respectively. Side 1 and side 2 are two opposite sides, and side 3 and side 4 are two opposite sides. In the rectangular planar shape including sides 1, 2, 3, and 4 of the interposer 220, the length of the long side is not particularly limited, but is, for example, 1.05 times or more the length of the short side or 1 mm or more larger. The side surfaces 1a and 2b are end surfaces of the interposer 220 facing each other in the y-axis direction. The side surfaces 3c and 4d are end surfaces of the interposer 220 facing each other in the x-axis direction. For example, the distance between the side surface 1a and the side surface 2b is smaller than the distance between the side surface 3c and the side surface 4d. That is, among sides 1, 2, 3, and 4 of the interposer 220, sides 1 and 2 may be long sides and sides 3 and 4 may be short sides. The distance between the side surface 1a and the side surface 2b, that is, the lengths of the side surfaces 3c and 4d in the y-axis direction are, for example, 5 to 50 mm, typically 10 to 30 mm, and preferably may be 10 to 20 mm. The distance between the side surface 3c and the side surface 4d, that is, the lengths of the side surfaces 1a and 2b in the x-axis direction are, for example, 5 to 50 mm, typically 10 to 30 mm, and preferably 10 to 20 mm. It is effective to provide the reinforcing resin portion 410 on the long sides (sides 1, 2) rather than on the short sides (sides 3, 4).

[0023] The interposer 220 has an insulating substrate 230 as shown in FIG. 3. The insulating substrate 230 has a main surface 231 and a main surface 232 on the side opposite to the main surface 231. The main surface 231 is the surface on the side where the semiconductor element 210 is mounted (die-bonded), and is the surface opposite to the printed circuit board 100. The main surface 232 is the surface on the side of the printed circuit board 100. The material of the insulating substrate 230 is, for example, glass epoxy. Also, the semiconductor element 210 is composed of, for example, silicon. Note that the semiconductor element 210 may be disposed between the interposer 220 and the printed circuit board 300, and may be mounted (die-bonded) on the main surface 332 on the side of the interposer 220 in the printed circuit board 300, for example.

[0024] The interposer 220 has a plurality of lands 241 disposed on the main surface 231 of the insulating substrate 230 and a plurality of lands 242 disposed on the main surface 232. The plurality of lands 241 are disposed on the main surface 231 in a peripheral array pattern that surrounds, for example, the outer periphery of the semiconductor element 210. The plurality of lands 242 may be disposed on the main surface 232 in a grid pattern, that is, a matrix pattern, or may be disposed on the main surface 232 in a staggered array pattern. The lands 241 and the lands 242 are terminals formed of a conductive metal material, for example, copper or gold.

[0025] Also, the interposer 220 has solder resists 251 and 252. That is, a solder resist 251 is provided on the main surface 231 of the insulating substrate 230. The solder resist 251 is a film made of a solder resist material. Each of the plurality of lands 241 is exposed through an opening formed in the solder resist 251. Also, a solder resist 252 is provided on the main surface 232 of the insulating substrate 230. The solder resist 252 is a film made of a solder resist material. Each of the plurality of lands 242 is exposed through an opening formed in the solder resist 252. The land 241 and the land 242 may be either SMD (Solder Mask Defined) or NSMD (Non-Solder Mask Defined) lands.

[0026] As shown in FIG. 4B, the printed circuit board 300 has a rectangular planar shape in a top view in the z-axis direction, and has side surfaces 10a, 20b, 30c, and 40d on sides 10, 20, 30, and 40, respectively, of the rectangular planar shape. Side 10 and side 20 are two opposite sides, and side 30 and side 40 are two opposite sides. Sides 10, 20, 30, and 40 are respectively located on the same side as sides 1, 2, 3, and 4 of the interposer 220 and the mounting structure 510. In the rectangular planar shape including sides 10, 20, 30, and 40 of the printed circuit board 300, the length of the long side is not particularly limited, but is, for example, 1.2 times to 1.6 times the length of the short side. Also, the length of the long side of the rectangular planar shape including sides 10, 20, 30, and 40 is not particularly limited, but is, for example, 1.1 times to 1.5 times the length of the side in the same direction of the rectangular planar shape including sides 1, 2, 3, and 4 of the interposer 220. Side surfaces 10a and 20b are end faces of the printed circuit board 300 that face each other in the y-axis direction. Side surfaces 30c and 40d are end faces of the printed circuit board 300 that face each other in the x-axis direction.

[0027] For example, in the printed circuit board 300, the distance between the side surface 30c and the side surface 40d is greater than the distance between the side surface 10a and the side surface 20b. Also, for example, the distance between the side surface 30c and the side surface 40d in the printed circuit board 300 is greater than the distance between the side surface 3c and the side surface 4d in the interposer 220.

[0028] As shown in FIG. 3, the printed circuit board 300 has an insulating substrate 330. The insulating substrate 330 has a main surface 331 and a main surface 332 opposite to the main surface 331. The main surface 331 is a surface opposite to the interposer 220 and faces outward. The main surface 332 is a surface on the side of the interposer 220. The material of the insulating substrate 330 is, for example, glass epoxy.

[0029] The printed circuit board 300 has a plurality of lands 342 disposed on the main surface 332 of the insulating substrate 330. The plurality of lands 342 are arranged on the main surface 332 in an array pattern corresponding to the array pattern of the plurality of lands 241 in the interposer 220. The land 342 is a terminal formed of a conductive metal material, such as copper or gold.

[0030] Also, the printed circuit board 300 has solder resists 351 and 352. That is, a solder resist 351 is provided on the main surface 331 of the insulating substrate 330. Also, a solder resist 352 is provided on the main surface 332 of the insulating substrate 330. The solder resist 351 and the solder resist 352 are films made of a solder resist material. Each of the plurality of lands 342 is exposed by an opening formed in the solder resist 352. The land 342 may be either an SMD or an NSMD land.

[0031] As shown in FIG. 3, the printed circuit board 100 has an insulating substrate 130. The insulating substrate 130 has a main surface 131 on the side where the mounting structure 510 is mounted and a main surface 132 opposite to the main surface 131 and facing outward. The material of the insulating substrate 330 is, for example, glass epoxy.

[0032] The printed circuit board 100 has a plurality of lands 141 disposed on the main surface 131 of the insulating substrate 130. The plurality of lands 141 are arranged on the main surface 131 in an array pattern corresponding to the array pattern of the plurality of lands 242 in the interposer 220. The land 141 is a terminal formed of a conductive metal material, such as copper or gold.

[0033] Also, the printed circuit board 100 has a solder resist 151. That is, a solder resist 151 is provided on the main surface 131 of the insulating substrate 130. The solder resist 151 is a film made of a solder resist material. Each of the plurality of lands 141 is exposed by an opening formed in the solder resist 151. The land 141 may be either an SMD or an NSMD land.

[0034] The plurality of lands 141 and the plurality of lands 242 are joined by a solder joint 610 formed of solder. Also, the plurality of lands 241 and the plurality of lands 342 are joined by a solder joint 620 formed of solder. The solder forming the solder joints 610, 620 is, for example, solder balls. The arrangement of the solder joint 610 and the arrangement of the solder joint 620 do not have to be aligned vertically when viewed from the x-axis direction and the y-axis direction.

[0035] Thus, the interposer 220 is disposed on one surface of the printed circuit board 100 and is joined to the printed circuit board 100 via a plurality of solder joints 610. Also, the printed circuit board 300 is disposed on the side opposite to the printed circuit board 100 side with respect to the interposer 220 and is joined to the interposer 220 via a plurality of solder joints 620. The plurality of solder joints 610 are provided at least on the sides of the sides 1, 2, 3, 4 of the interposer 220. The plurality of solder joints 620 are also provided at least on the sides of the sides 1, 2, 3, 4 of the interposer 220. The plurality of solder joints 620 are arranged around the semiconductor element 210 on the surface of the interposer 220 on the printed circuit board 300 side.

[0036] The interposer 220 and the printed circuit board 300 fixed to each other by the solder joint 620 are arranged so as to overlap each other in a top view seen in the z-axis direction and the printed circuit board 300 covers the interposer 220, as shown in FIG. 4C. In the top view, the sides 10, 20, 30, 40 of the rectangular shape of the printed circuit board 300 are located on the same side as the sides 1, 2, 3, 4 of the rectangular shape of the interposer 220 and the mounting structure 510, respectively. The rectangular shape of the interposer 220 may have the same shape and the same area as the rectangular shape of the printed circuit board 300, or may have a smaller area with the same shape or different shapes. That is, in the top view, the side surfaces 1a, 2b, 3c, 4d of the interposer 220 may be located at the same positions as the side surfaces 10a, 20b, 30c, 40d of the printed circuit board 300 located on the same side of the mounting structure 510. Also, in the top view, the side surfaces 1a, 2b, 3c, 4d of the interposer 220 may be located inside the side surfaces 10a, 20b, 30c, 40d of the printed circuit board 300 located on the same side of the mounting structure 510, respectively. That is, the side surfaces 1a, 2b, 3c, 4d of the interposer 220 may be located between the printed circuit board 100 and the printed circuit board 300 in the z-axis direction perpendicular to the main surface of the printed circuit board 100.

[0037] The reinforcing resin portion 410 is formed on the four sides of the sides 1, 2, 3, 4 of the interposer 220 and the four sides of the sides 10, 20, 30, 40 of the printed circuit board 300, as shown in FIG. 4C, in a top view of the three-dimensional mounting structure 500 seen from above in the z-axis direction. This reinforcing resin portion 410 is composed of the resin 400. The reinforcing resin portion 410 can be formed by applying the resin 400 before curing to the region where the reinforcing resin portion 410 is to be formed and curing the resin 400. Although FIG. 4C shows a case where the reinforcing resin portion 410 is formed in a plurality of parts on the four sides of the sides 10, 20, 30, 40, there may be some that are integrated and continuous among the plurality of reinforcing resin portions 410.

[0038] Note that the semiconductor element 210 is provided between the reinforcing resin portions 410 formed on sides 1 and 10 and the reinforcing resin portions 410 formed on sides 2 and 20 in the y-axis direction. Also, the semiconductor element 210 is provided between the reinforcing resin portions 410 formed on sides 3 and 30 and the reinforcing resin portions 410 formed on sides 4 and 40 in the x-axis direction.

[0039] For the resin 400, for example, a thermosetting resin or an ultraviolet (UV) curable resin is used. Note that when a UV curable resin is used for the resin 400, depending on the size relationship between the outer shapes of the semiconductor device 200 and the printed circuit board 300 to be laminated, the UV irradiated when curing the UV curable resin may not reach the resin, and the UV curable resin may remain uncured. Therefore, as the resin 400, a thermosetting resin is preferable in that it can be surely cured by heating with a heating means such as an oven. Examples of the constituent materials of the thermosetting resin include epoxy resin, filler, curing agent, and the like. The heating temperature when curing the thermosetting resin as the resin 400 needs to be lower than the melting point of the solder joint 610, the melting point of the solder joint 620, and the heat resistance temperature of electronic components (not shown) other than the semiconductor device 200 and the mounting structure 510. The cured resin 400 preferably has a flexural modulus of about several tens of GPa in order to obtain a sufficient reinforcing effect.

[0040] In the three-dimensional mounting structure 500 described above, the printed circuit board 100, the interposer 220, and the printed circuit board 300 joined via the solder joint 610 and the solder joint 620 are fixed by the reinforcing resin portions 410. The reinforcing resin portions 410 for fixing these are formed as follows.

[0041] FIG. 5A is an enlarged cross-sectional view taken along line A-A in FIG. 2, showing a cross section including side 1 of the interposer 220 and side 10 of the printed circuit board 300 as viewed in the x-axis direction. The x-axis direction is a direction parallel to the longitudinal direction of the reinforcing resin portions 410 provided on sides 1 and 10, that is, a direction parallel to sides 1 and 10.

[0042] As shown in FIG. 5A, in the reinforcing resin portion 410, the resin 400 adheres to at least a part of the printed circuit board 100 (for example, a part of the solder resist 151), the side surface 1a of the interposer 220, and a part of the printed circuit board 300 (for example, a part of the solder resist 352). Here, the side surface 1a of the interposer 220 includes a part (end portion) of the solder resist 251, a part (end portion) of the solder resist 252, and the side surface (end surface) of the insulating substrate 230. The resin 400 adhered to the printed circuit board 100, the interposer 220, and the printed circuit board 300 typically contacts the printed circuit board 100, the interposer 220, and the printed circuit board 300. Typically, the resin 400 is formed so as to contact the surface of the printed circuit board 100 on the side of the interposer 220 and the surface of the printed circuit board 300 on the side of the interposer 220. However, the resin 400 adhered to the printed circuit board 100, the interposer 220, and the printed circuit board 300 may contact a coating or the like applied to at least any one of the printed circuit board 100, the interposer 220, and the printed circuit board 300. Thus, the reinforcing resin portion 410 adheres to the main surface of the printed circuit board 100, the side surface 1a of the interposer 220, and the printed circuit board 300. Further, the resin 400 is formed so as to partially cover the end surface of the interposer 220 as described later.

[0043] In the example of FIG. 5A, the reinforcing resin portion 410 is separated from the solder joint 610 that is closest to the reinforcing resin portion 410 among the plurality of solder joints 610. Also, it is separated from the solder joint 620 that is closest to the reinforcing resin portion 410 among the plurality of solder joints 620. Alternatively, as shown in FIG. 5B, the resin 400 in the reinforcing resin portion 410 preferably contacts the solder joint 610 disposed on the outermost periphery among the plurality of solder joints 610, that is, the solder joint 610 in the row closest to side 1. That is, the reinforcing resin portion 410 preferably adheres to the solder joint 610 that is closest to the reinforcing resin portion 410 among the plurality of solder joints 610. Thereby, the resin 400 can more reliably fix the interposer 220 and the printed circuit board 100. Also, the resin 400 preferably contacts the solder joint 620 disposed on the outermost periphery among the plurality of solder joints 620, that is, the solder joint 620 in the row closest to side 10. That is, the reinforcing resin portion 410 preferably adheres to the solder joint 620 that is closest to the reinforcing resin portion 410 among the plurality of solder joints 620. Thereby, the resin 400 can more reliably fix the interposer 220 and the printed circuit board 300.

[0044] Further, the resin 400 in the reinforcing resin portion 410 is formed with a height 421 in the z-axis direction. The height 421 is equal to or greater than the height from the surface on the main surface 131 side of the printed circuit board 100 to the surface on the main surface 332 side of the printed circuit board 300. That is, the height 421 is equal to or greater than the height from the surface of the solder resist 151 of the printed circuit board 100 to the surface of the solder resist 352 of the printed circuit board 300.

[0045] Here, as shown in FIG. 5C, the resin 400 may be formed so as to reach the side surface 10a of the printed circuit board 300. Further, the resin 400 may be formed so as to reach the surface on the main surface 331 side, that is, the surface of the solder resist 351, which is the surface opposite to the interposer 220 of the printed circuit board 300. What is important here is that in the reinforcing resin portion 410, the resin 400 is in contact with each of the printed circuit board 100, the interposer 220, and the printed circuit board 300, and the resin 400 is fixed to each of them. In the case shown in FIG. 5C, the height of the reinforcing resin portion 410 in the z-axis direction is not particularly limited, and it may only adhere to the side surface 10a of the printed circuit board 300. When the reinforcing resin portion 410 adheres to the side surface 10a of the printed circuit board 300, the reinforcing resin portion 410 may not adhere to the main surface 331 and / or the main surface 332 of the printed circuit board 300.

[0046] As shown in FIGS. 5A to 5C, in the side portion 511 of the mounting structure 510 provided with the reinforcing resin portion 410, the resin 400 is formed so as to cover the side surface of the interposer 220 between the printed circuit board 100 and the printed circuit board 300. The reinforcing resin portion 410 has a portion located between the printed circuit board 100 and the interposer 220 and a portion located between the interposer 220 and the printed circuit board 300 in the z-axis direction perpendicular to the main surface of the printed circuit board 100.

[0047] FIG. 5D shows a side view of the reinforcing resin portion 410 provided on side 1 of the interposer 220 and side 10 of the printed circuit board 300, viewed in the y-axis direction. As shown in FIG. 5D, the reinforcing resin portion 410 is separated from at least one of the two ends in the x-axis direction of side surface 1a of the interposer 220. That is, the resin 400 in the reinforcing resin portion 410 is formed such that at least one of the two ends in the x-axis direction of side surface 1a of the interposer 220 is not covered by the resin 400 and is exposed from the reinforcing resin portion 410. Further, at least one of the two end portions in the x-axis direction of side surface 1a of the interposer 220 is exposed from the resin 400. Note that the end of the side surface of the interposer 220 corresponds to the corner in the quadrilateral composed of the four sides 1a, 1b, 1c, and 1d, and the end portion of the side surface refers to the end and the portion in the vicinity of the end. At one end of side surface 1a and one end of side surface 3c, side surface 1a and side surface 3c are connected to each other. At one end of side surface 2a and one end of side surface 4d, side surface 2a and side surface 4d are connected to each other. At the other end of side surface 1a and the other end of side surface 4d, side surface 1a and side surface 4d are connected to each other. At the other end of side surface 3a and the other end of side surface 4d, side surface 3a and side surface 4d are connected to each other. Here, the reinforcing resin portion 410 has a length 411 in the x-axis direction. That is, in sides 1 and 10 where the reinforcing resin portion 410 is formed, the length 411 of the reinforcing resin portion 410 is shorter than the length of side 1 of the interposer 220. That is, in the x-axis direction, which is the direction along the side portion 511 of the mounting structure 510 described later, the reinforcing resin portion 410 is shorter than the interposer 220. Here, it is preferable that the resin 400 in the reinforcing resin portion 410 has both end portions in the x-axis direction of side surface 1a of the interposer 220 exposed from the reinforcing resin portion 410 without being covered by the resin 400. This is because the side surface 1a is exposed at both end portions instead of one end portion, so that the balance of the reinforcing effect by the reinforcing resin portion 410 on the three-dimensional mounting structure 500 becomes better.

[0048] On one hand, when the reinforcing resin part 410 is viewed in the y-axis direction, the solder joints 610 and 620 are covered by the resin 400 in the reinforcing resin part 410 and are not exposed. Note that, as in the second embodiment described later, the solder joints 610 and 620 may be exposed from the resin 400 without being covered by the resin 400 on both sides of the reinforcing resin part 410 in the x-axis direction.

[0049] In the above description, the reinforcing resin part 410 provided on the side 1 of the interposer 220 and the side 10 of the printed circuit board 300 has been described. However, other reinforcing resin parts 410 also have the same configuration as described above. That is, the reinforcing resin part 410 provided on the side 2 and the side 20 of the interposer 220 and the printed circuit board 300 also has the same configuration as the above-described configuration of the reinforcing resin part 410 provided on the side 1 and the side 10. Further, the reinforcing resin parts 410 provided on the side 3 and the side 30 and the side 4 and the side 40 of the interposer 220 and the printed circuit board 300 also have the same configuration as the above-described configuration of the reinforcing resin part 410 provided on the side 1, 10 except that the x-axis direction and the y-axis direction are interchanged.

[0050] Thus, in the three-dimensional mounting structure 500 according to the present embodiment, the reinforcing resin parts 410 are formed on the respective side parts 511, 512, 513, 514 of the mounting structure 510. Here, the side part 511 of the mounting structure 510 includes the side 1 of the interposer 220 and the side 10 of the printed circuit board 300. The side part 512 includes the side 2 of the interposer 220 and the side 20 of the printed circuit board 300. The side part 513 includes the side 3 of the interposer 220 and the side 30 of the printed circuit board 300. The side part 514 includes the side 4 of the interposer 220 and the side 40 of the printed circuit board 300. When one or both of the side surfaces 1a, 1b, 1c, 1d at both ends of the interposer 220 are exposed from the resin 400 in each of the side parts 511, 512, 513, 514, a part or all of the four corners of the interposer 220 are exposed from the resin 400. Note that the reinforcing resin part 410 may be provided on at least two side parts that face each other among the side parts 511, 512, 513, 514.

[0051] The reinforcing resin portion 410 only needs to be provided so as to be separated from at least one of both ends of the side surface 1a of the interposer 220 in the x-axis direction and from at least one of both ends of the side surface 2b of the interposer 220 in the x-axis direction. In this case, the end of the reinforcing resin portion 410 separated from the side surface 1a may be closer to the side surface 3d than to the side surface 4d, and the end of the reinforcing resin portion 410 separated from the side surface 2b may be closer to the side surface 4d than to the side surface 3c. In this way, by arranging the exposed portions where the reinforcing resin portions 410 are not provided at the diagonals of the rectangular planar shape of the interposer 220, the reinforcing effect by the resin 400 can be obtained more evenly.

[0052] Further, the reinforcing resin portion 410 only needs to be provided so as to be separated from one end and the other end of both ends of the side surface 1a of the interposer 220 in the x-axis direction and from one end and the other end of both ends of the side surface 2b of the interposer 220 in the x-axis direction.

[0053] By forming the reinforcing resin portion 410 in this way, the reinforcing effect by the resin 400 can be sufficiently obtained. Further, in the three-dimensional mounting structure 500, stress concentrates particularly on the solder joints 610 and 620 in the vicinity of the portions where the resin 400 is not formed. On the other hand, since a part or all of the four corners of the interposer 220 are exposed from the resin 400, this stress concentration can be reduced. This is because the stress is dispersed to the solder joints 610 and 620 in the vicinity of the four corners where the resin 400 is not formed. Further, since the four corners of the interposer 220 are exposed from the resin 400 and are not reinforced by the resin 400, when the interposer 220 or the printed circuit board 300 is deformed, the deformation can be released from the four corners. Thereby, while avoiding the occurrence of defects due to deformation in the interposer 220 and the printed circuit board 300, the bonding by the solder joints 610 and 620 can be reinforced.

[0054] As described above, according to the present embodiment, the reliability of the solder joints in the three-dimensional mounting structure 500 can be improved.

[0055] Regarding the thickness of the interposer 220 and the printed circuit board 300, as shown in FIG. 5E, it is preferable that the thickness 301 of the printed circuit board 300 is smaller than the thickness 221 of the interposer 220. When the thickness 301 is smaller than the thickness 221, the rigidity of the printed circuit board 300 becomes relatively lower than the rigidity of the interposer 220. As a result, when the printed circuit board 300 is deformed by heat, the influence on the interposer 220, which has higher rigidity than the printed circuit board 300, is reduced. Consequently, the stress applied to the solder joints 610 and 620 at the locations where the resin 400 is not formed is further reduced. Therefore, by making the thickness 301 thinner than the thickness 221, the reliability of the solder joints in the three-dimensional mounting structure 500 can be further improved.

[0056] Also, the planar shapes of the interposer 220 and the printed circuit board 300 in a top view seen in the z-axis direction are not limited to rectangles, and may be shapes such as polygons that can include the sides where the reinforcing resin portions 410 are formed as described above. Further, the sides where the reinforcing resin portions 410 of the interposer 220 and the printed circuit board 300 are formed may be not only linear but also curved.

[0057] [Second Embodiment] The three-dimensional mounting structure 500 according to the second embodiment of the present invention will be described with reference to FIGS. 6A to 6C. For the same configurations as those in the first embodiment, the same reference numerals are given and the detailed description is omitted or simplified.

[0058] The basic configuration of the three-dimensional mounting structure 500 according to the present embodiment is the same as the configuration of the three-dimensional mounting structure 500 according to the first embodiment. The relationship between the resin 400 of the reinforcing resin portion 410 and the solder joints 610 and 620 in the three-dimensional mounting structure 500 according to the present embodiment is different from that in the first embodiment.

[0059] FIG. 6A is a cross-sectional view showing the three-dimensional mounting structure 500 according to the present embodiment, and is a cross-sectional view corresponding to the cross-sectional view of FIG. 3. FIG. 6B is an enlarged view showing an enlarged cross-section of the three-dimensional mounting structure 500 according to the present embodiment. FIG. 6C is an enlarged view showing another example of the cross-section of the three-dimensional mounting structure 500 according to the present embodiment. FIGS. 6B and 6C are enlarged views corresponding to FIG. 5A, respectively, and show a cross-section including side 1 of the interposer 220 and side 10 of the printed circuit board 300 viewed in the x-axis direction.

[0060] As shown in FIG. 6A, in the three-dimensional mounting structure 500 according to the present embodiment as well, similar to the first embodiment, the plurality of lands 141 and the plurality of lands 242 are joined by a solder joint 610. Also, the plurality of lands 241 and the plurality of lands 342 are joined by a solder joint 620. Further, as shown in FIG. 6C, in another example of the three-dimensional mounting structure 500 according to the present embodiment, the plurality of lands 141 and the plurality of lands 242 are joined by a solder joint 710. Also, the plurality of lands 241 and the plurality of lands 342 are joined by a solder joint 720.

[0061] As shown in FIGS. 6B and 6C, the solder joint 610 has a solder joint 610a located on the outermost periphery and a solder joint 610b located inside the solder joint 610a. The solder joint 620 has a solder joint 620a located on the outermost periphery and a solder joint 620b located inside the solder joint 620a. Further, as shown in FIG. 6C, the solder joint 710 has a solder joint 710a located on the outermost periphery and a solder joint 710b located inside the solder joint 710a. The solder joint 720 has a solder joint 720a located on the outermost periphery and a solder joint 720b located inside the solder joint 720a.

[0062] The solder joints 610 and 710 are formed with a height 616 in the z-axis direction. The height 616 is the height from the main surface 133 of the solder resist 151 to the main surface 234 of the solder resist 252. The solder joints 620 and 720 are formed with a height 626 in the z-axis direction. The height 626 is the height from the main surface 233 of the solder resist 251 to the main surface 334 of the solder resist 352. Note that the solder resist 251 has a thickness 256. Also, the solder resist 351 formed on the main surface 331 of the insulating substrate 330 in the printed circuit board 300 has a main surface 333.

[0063] As shown in FIGS. 6A and 6B, the semiconductor element 210 may be mounted on the main surface 231 of the insulating substrate 230, or as shown in FIG. 6C, it may be mounted on the main surface 232 of the insulating substrate 230.

[0064] As shown in FIG. 6B, when the semiconductor element 210 is mounted on the main surface 231 of the insulating substrate 230, the outermost peripheral position of the solder joint 610a in the y-axis direction enters inside the central position of the solder joint 620a in the y-axis direction. Also, as shown in FIG. 6C, when the semiconductor element 210 is mounted on the main surface 232 of the insulating substrate 230, the outermost peripheral position of the solder joint 720a in the y-axis direction is located inside the central position of the solder joint 710a in the y-axis direction.

[0065] In the top view of the three-dimensional mounting structure 500 looking from above in the z-axis direction, the reinforcing resin part 410 is formed on the four sides of the sides 1, 2, 3, 4 of the interposer 220 and the four sides of the sides 10, 20, 30, 40 of the printed circuit board 300, similar to the first embodiment.

[0066] Also in the three-dimensional mounting structure 500 according to the present embodiment, as shown in FIG. 6A, the printed circuit board 100, the interposer 220, and the printed circuit board 300 joined via the solder joints 610 and 620 are fixed by the reinforcing resin portion 410. Further, as shown in FIG. 6C, the printed circuit board 100, the interposer 220, and the printed circuit board 300 joined via the solder joints 710 and 720 are fixed by the reinforcing resin portion 410.

[0067] As shown in FIGS. 6B and 6C, in the reinforcing resin portion 410, the resin 400 adheres to at least a part of the printed circuit board 100 (for example, a part of the solder resist 151), the side surface 1a of the interposer 220, and a part of the printed circuit board 300 (for example, a part of the solder resist 352). The resin 400 adhering to the printed circuit board 100, the interposer 220, and the printed circuit board 300 typically contacts the printed circuit board 100, the interposer 220, and the printed circuit board 300. Typically, the resin 400 is formed so as to contact the surface of the printed circuit board 100 on the side of the interposer 220 and the surface of the printed circuit board 300 on the side of the interposer 220. However, the resin 400 adhering to the printed circuit board 100, the interposer 220, and the printed circuit board 300 may contact a coating or the like applied to at least any one of the printed circuit board 100, the interposer 220, and the printed circuit board 300. Thus, the reinforcing resin portion 410 adheres to the main surface of the printed circuit board 100, the side surface 1a of the interposer 220, and the printed circuit board 300. Further, the resin 400 is formed so as to partially cover the end surface of the interposer 220.

[0068] In the present embodiment, as shown in FIG. 6B, the resin 400 in the reinforcing resin portion 410 contacts the solder joint portion 620a located at the outermost periphery and does not contact the solder joint portion 610a located at the outermost periphery. That is, the reinforcing resin portion 410 adheres to the solder joint portion 620a closest to the reinforcing resin portion 410 among the plurality of solder joint portions 620 and does not adhere to the solder joint portion 610a closest to the reinforcing resin portion 410 among the plurality of solder joint portions 610.

[0069] In the case shown in FIG. 6B, the distance between the solder joint portion 610a closest to the reinforcing resin portion 410 among the plurality of solder joint portions 610 and the side surface 1a is longer than the distance between the solder joint portion 620a closest to the reinforcing resin portion 410 among the plurality of solder joint portions 620 and the side surface 1a.

[0070] The contact relationship between the resin 400 in the reinforcing resin portion 410 and the solder joint portions 610a, 620a may be the reverse of the relationship shown in FIG. 6B. That is, among the plurality of solder joint portions 610 and the plurality of solder joint portions 620, it is sufficient that one solder joint portion has a relationship of adhering to the resin 400 and the other solder joint portion has a relationship of not adhering to the resin 400. Specifically, as shown in FIG. 6C, the resin 400 in the reinforcing resin portion 410 may contact the solder joint portion 710a located at the outermost periphery and may not contact the solder joint portion 720a located at the outermost periphery. That is, the reinforcing resin portion 410 may adhere to the solder joint portion 710a closest to the reinforcing resin portion 410 among the plurality of solder joint portions 710 and may not adhere to the solder joint portion 720a closest to the reinforcing resin portion 410 among the plurality of solder joint portions 720.

[0071] In the case shown in FIG. 6C, the distance between the solder joint portion 720a closest to the reinforcing resin portion 410 among the plurality of solder joint portions 720 and the side surface 1a is longer than the distance between the solder joint portion 710a closest to the reinforcing resin portion 410 among the plurality of solder joint portions 710 and the side surface 1a.

[0072] Also, the resin 400 in the reinforcing resin portion 410 formed on sides 2, 3, 4 other than side 1 of the interposer 220 and sides 20, 30, 40 other than side 10 of the printed circuit board 300 may be formed to have a relationship similar to the relationship shown in FIG. 6B or FIG. 6C.

[0073] By forming the reinforcing resin portion 410 in this way, a sufficient reinforcing effect by the resin 400 can be obtained. Further, when the resin 400 is not formed on all four sides of the interposer 220 and the printed circuit board 300, the reliability of the solder joint can be improved as follows. That is, as shown in FIG. 6B, particularly in the three-dimensional mounting structure 500 where the resin 400 is not formed, the number of solder joints of the solder joint 620 on which the semiconductor element 210 is mounted is smaller than that of the solder joint 610. Therefore, stress concentrates on the solder joint 620a. On the other hand, when the reinforcing resin is formed on at least two opposing sides of the interposer 220 and the printed circuit board 300, the stress on the solder joint 620a is reduced. At this time, since the solder joint 610a on the side where the resin 400 is formed is not in contact with the resin 400, stress is also dispersed to the solder joint 610a where stress was not applied due to the contact of the resin 400. Therefore, as the stress applied to the solder joint 610a on the side where the resin 400 is formed increases, the stress applied to the solder joint 620a on the side where the resin 400 is not formed decreases. Thereby, the solder joint reliability of the entire three-dimensional mounting structure 500 can be improved. Further, as shown in FIG. 6C, particularly in the three-dimensional mounting structure 500 where the resin 400 is not formed, the number of solder joints of the solder joint 710 on which the semiconductor element 210 is mounted is smaller than that of the solder joint 720. Therefore, stress concentrates on the solder joint 710a. On the other hand, when the reinforcing resin is formed on at least two opposing sides of the interposer 220 and the printed circuit board 300, the stress on the solder joint 710a is reduced. At this time, since the solder joint 720a on the side where the resin 400 is formed is not in contact with the resin 400, stress is also dispersed to the solder joint 720a where stress was not applied due to the contact of the resin 400. Therefore, as the stress applied to the solder joint 720a on the side where the resin 400 is formed increases, the stress applied to the solder joint 710a on the side where the resin 400 is not formed decreases. Thereby, the solder joint reliability of the entire three-dimensional mounting structure 500 can be improved.

[0074] [Third Embodiment] A three-dimensional mounting structure according to the third embodiment of the present invention will be described with reference to FIGS. 7A and 7B. For the same configurations as those in the first and second embodiments, the same reference numerals are given and detailed descriptions are omitted or simplified.

[0075] The basic configuration of the three-dimensional mounting structure 500 according to the present embodiment is the same as the configuration of the three-dimensional mounting structure 500 according to the second embodiment. The three-dimensional mounting structure 500 according to the present embodiment is different from the second embodiment in that a step that is recessed is formed in a portion outside the solder joint 620a in the interposer 220.

[0076] FIG. 7A is a cross-sectional view showing the three-dimensional mounting structure 500 according to the present embodiment, and is a cross-sectional view corresponding to the cross-sectional view of FIG. 6B. As shown in FIG. 7A, in the present embodiment, a part of the portion located outside the solder joint 620a located at the outermost periphery on the main surface 231 of the insulating substrate 230 is missing, and a step 260 that is recessed is formed. A reinforcing resin portion 410 is formed on the step 260. The range of the step 260 formed outside the plurality of solder joints 620 extends in a rectangular ring shape in the x-axis direction and the y-axis direction so as to surround the outermost periphery of the solder joint 620a. The step 260 has a height 266. The step 260 may reach the end of the interposer 220 or may be formed between the solder joint 620a and the end of the interposer 220. At this time, the height between the interposer 220 and the printed circuit board 300 is the height 628 in the z-axis direction at the portion where the step 260 is present. The height 628 is the height from the main surface 231 of the step 260 of the insulating substrate 230 to the main surface 234 of the solder resist 352.

[0077] In the portion where there is a step 260 on the side where the reinforcing resin portion 410 is formed, the resin 400 of the reinforcing resin portion 410 has entered. Due to the presence of this step 260, the height 628 at which the resin 400 penetrates is higher by the height 266 of the step 260 compared to the height 626 shown in FIG. 6B where there is no step 260. Thus, when there is a step 260, the height at which the resin 400 penetrates becomes higher, so the resin 400 is more likely to penetrate.

[0078] Also, the step 260 does not necessarily have to be formed by a part of the insulating substrate 230 being missing. FIG. 7B is a cross-sectional view showing another example of the step 260. For example, as shown in FIG. 7B, the step 260 may be formed as an opening 255 in which a part of the portion located outside the outermost solder joint 620a in the solder resist 251 provided on the main surface 231 of the insulating substrate 230 is removed. In this case, the height between the interposer 220 and the printed circuit board 300 is the height 627 in the z-axis direction at the portion where there is the opening 255. The height 627 is the height from the main surface 231 of the insulating substrate 230 to the main surface 234 of the solder resist 352.

[0079] As in the present embodiment, a step 260 may be provided outside the outermost solder joint 620a, and the resin 400 of the reinforcing resin portion 410 may be formed to enter the step 260. Thereby, the resin 400 of the reinforcing resin portion 410 can be made to enter more easily between the interposer 220 and the printed circuit board 300, and the resin 400 can be made to contact the solder joint 620a more surely.

[0080] Note that a step 260 may also be provided in the three-dimensional mounting structure 500 according to the first embodiment in the same manner as in the present embodiment.

[0081] [Fourth Embodiment] The three-dimensional mounting structure 500 according to the fourth embodiment of the present invention will be described with reference to FIGS. 8A and 8B. For components having the same configuration as those in the first to third embodiments, the same reference numerals will be used, and detailed descriptions thereof will be omitted or simplified.

[0082] The basic configuration of the three-dimensional mounting structure 500 according to the present embodiment is the same as that of the three-dimensional mounting structure 500 according to the second embodiment. The three-dimensional mounting structure 500 according to the present embodiment is different from the second embodiment in that a dummy bump 650, which is a solder portion, is provided outside the solder joint portion 610a located on the outermost periphery.

[0083] FIG. 8A is a cross-sectional view showing the three-dimensional mounting structure 500 according to the present embodiment, and is a cross-sectional view corresponding to the cross-sectional view of FIG. 6A. As shown in FIG. 8A, the printed circuit board 100 has lands 143 disposed on the outer periphery of the lands 141 on the main surface 131. The interposer 220 has lands 244 disposed on the outer periphery of the lands 242 on the main surface 232 of the insulating substrate 230. A dummy bump 650, which is a solder portion, is mounted on the land 244. The height of the dummy bump 650 is lower than the height 616 (see FIG. 6B) and is not joined to the land 143. Therefore, a gap exists between the dummy bump 650 and the printed circuit board 100.

[0084] FIG. 8B is a cross-sectional view showing another example of the dummy bump 650. As shown in FIG. 8B, the dummy bump 650 may be mounted on the land 143 on the printed circuit board 100 side instead of the land 244 on the interposer 220 side. In this case, a gap exists between the dummy bump 650 and the interposer 220.

[0085] As described above, the dummy bump 650 provided between the printed circuit board 100 and the interposer 220 is provided so as not to be joined to either the printed circuit board 100 or the interposer 220. A reinforcing resin portion 410 is attached to such a dummy bump 650.

[0086] Since the dummy bumps 650 are provided as described above, the penetration of the resin 400 of the reinforcing resin portion 410 into the mounting structure 510 is prevented. As a result, in the three-dimensional mounting structure 500 according to the present embodiment, the resin 400 is formed so as not to come into contact with the solder joint portion 610a located on the outermost periphery, similar to the second embodiment.

[0087] In addition, as shown in FIG. 6C, when the semiconductor element 210 is mounted on the main surface 232 of the insulating substrate 230, the dummy bumps 650 may be provided outside the solder joint portion 720a instead of outside the solder joint portion 710a.

[0088] Also, in the three-dimensional mounting structure 500 according to the first or third embodiment, the dummy bumps 650 may be provided in the same manner as in the present embodiment.

[0089] [Fifth Embodiment] A three-dimensional mounting structure according to the fifth embodiment of the present invention will be described with reference to FIGS. 9A and 9B. FIG. 9A is a top view showing the three-dimensional mounting structure according to the present embodiment. FIG. 9B is a side view of the three-dimensional mounting structure 500 according to the present embodiment as viewed from the y-axis direction. Regarding the same configurations as those in the first to fourth embodiments, the same reference numerals are given and detailed descriptions are omitted or simplified.

[0090] As shown in FIGS. 9A and 9B, in this embodiment, compared with the first embodiment, the length 411 of the reinforcing resin portion 410 is shortened in the x-axis direction, which is the direction along the side portion 511 of the mounting structure 510 provided with the reinforcing resin portion 410. As shown in FIG. 9B, in this embodiment, the reinforcing resin portion 410 is provided at a position overlapping the projected semiconductor element 210 when the semiconductor element 210 is projected in the y-axis direction. That is, in a side view of the side portion 511 of the mounting structure 510, the reinforcing resin portion 410 is provided so as to include a region where the semiconductor element 210 and the solder joint portion 620 overlap. As shown in FIGS. 9A and 9B, in this embodiment, compared with the first embodiment, the length 411 of the reinforcing resin portion 410 is shortened in the x-axis direction, which is the direction along the side portion 511 of the mounting structure 510 provided with the reinforcing resin portion 410. As shown in FIG. 9B, in this embodiment, the reinforcing resin portion 410 is provided at a position overlapping the projected semiconductor element 210 when the semiconductor element 210 is projected in the y-axis direction. That is, in a side view of the side portion 511 of the mounting structure 510, the reinforcing resin portion 410 is provided so as to include a region where the semiconductor element 210 and the solder joint portion 620 overlap.

[0091] Note that, in a side view of the side portion 511 of the mounting structure 510, the outermost peripheral solder joint portion 610 among the plurality of solder joint portions 610 is arranged at the same position as the outermost peripheral solder joint portion 620 among the plurality of solder joint portions 620, but it is not limited thereto. In a side view of the side portion 511 of the mounting structure 510, the outermost peripheral solder joint portion 610 among the plurality of solder joint portions 610 may be arranged inside the outermost peripheral solder joint portion 620 among the plurality of solder joint portions 620.

[0092] In the x-axis direction, which is the direction along the side portion 511 of the mounting structure 510, the length 411 of the reinforcing resin portion 410 is longer than the length of the semiconductor element 210, that is, the length 211 of the side of the projected semiconductor element 210. Thus, in the x-axis direction, the length 411 of the reinforcing resin portion 410 may be shorter compared to the case of the first embodiment as long as it is longer than the length 211 of the side of the semiconductor element 210. Since the length 411 of the reinforcing resin portion 410 is short in this way, when the reinforcing resin portion 410 is viewed from the y-axis direction, the solder joints 610 and 620 may be exposed from the resin 400 without being covered by the resin 400 on both sides of the reinforcing resin portion 410 in the x-axis direction.

[0093] Thus, in the present embodiment, at both ends of the side portion 511 of the mounting structure 510 provided with the reinforcing resin portion 410, the solder joints 610 disposed on the outermost periphery among the plurality of solder joints 610 are exposed from the resin 400. That is, the reinforcing resin portion 410 is away from the solder joints 610 that are closest to one end and the other end in the x-axis direction of the side surface 1a of the interposer 220 among the plurality of solder joints 610. Note that, on one end side of the side portion 511 of the mounting structure 510, a plurality of solder joints 610 disposed on the outermost periphery among the plurality of solder joints 610 may be exposed from the resin 400. In this example, among the solder joints 610 disposed on the outermost periphery, the first three solder joints 610 in ascending order of the distance from one end in the x-axis direction of the side surface 1a of the interposer 220 are exposed from the resin 400. The same applies to the other end side of the side surface 1a of the interposer 220 in the x-axis direction. Also, at both ends of the side portion 511 of the mounting structure 510, the solder joints 620 disposed on the outermost periphery among the plurality of solder joints 620 are exposed from the resin 400. That is, the reinforcing resin portion 410 is away from the solder joints 620 that are closest to one end and the other end in the x-axis direction of the side surface 1a of the interposer 220 among the plurality of solder joints 620. Note that, on one end side of the side portion 511 of the mounting structure 510, a plurality of solder joints 620 disposed on the outermost periphery among the plurality of solder joints 620 may be exposed from the resin 400. In this example, among the solder joints 610 disposed on the outermost periphery, the first three solder joints 620 in ascending order of the distance from one end in the x-axis direction of the side surface 1a of the interposer 220 are exposed from the resin 400. The same applies to the other end side of the side surface 1a of the interposer 220 in the x-axis direction.

[0094] In the above description, the reinforcing resin portions 410 provided on side 1 of the interposer 220 and side 10 of the printed circuit board 300 have been described. However, as shown in FIG. 9A, other reinforcing resin portions 410 may also have the same configuration as described above. That is, the reinforcing resin portions 410 provided on side 2 and side 20 of the interposer 220 and the printed circuit board 300 may also have the same configuration as the above-described configuration of the reinforcing resin portions 410 provided on side 1 and side 10. Further, the reinforcing resin portions 410 provided on side 3 and side 30 and side 4 and side 40 of the interposer 220 and the printed circuit board 300 may also have the same configuration as the above-described configuration of the reinforcing resin portions 410 provided on side 1, 10, except for the point where the x-axis direction and the y-axis direction are interchanged.

[0095] Also in this embodiment, the stress dispersion effect described in the first embodiment, that is, the effect that stress is dispersed to the solder joints 610, 620 in the vicinity of the four corners where the reinforcing resin portion 410 is not formed, can be sufficiently obtained. Further, since the reinforcing resin portion 410 is provided so as to include a region where the semiconductor element 210 and the solder joint 620 overlap, the solder joint at the location where the stress most concentrates can be reinforced. In this way, by applying resin at least longer than the semiconductor element and exposing the end portion on the side surface of the interposer from the resin, the reliability of the solder joint of the three-dimensional mounting structure can be improved. Therefore, according to this embodiment, the reliability of the solder joint in the three-dimensional mounting structure 500 can be sufficiently maintained. Further, by shortening the length of the resin within the range described in this embodiment and reducing the amount of resin applied as compared with the first embodiment, the cost of the resin can be reduced.

[0096] Note that in the three-dimensional mounting structure 500 according to the second, third, or fourth embodiment, the length 411 of the reinforcing resin portion 410 may also be shortened in the same manner as in this embodiment.

[0097] [Sixth Embodiment] The three-dimensional mounting structure 500 according to the sixth embodiment of the present invention will be described with reference to FIGS. 10A to 10D. FIG. 10A is a top view showing the three-dimensional mounting structure 500 according to the present embodiment. Further, FIG. 10B is a side view of the three-dimensional mounting structure 500 according to the present embodiment as viewed from the y-axis direction. FIG. 10C is a plan view showing the solder joint 610. FIG. 10D is a plan view showing the solder joint 620. Regarding the same configurations as those in the first to fifth embodiments, the same reference numerals are given and detailed descriptions are omitted or simplified.

[0098] In the first to fifth embodiments, the reinforcing resin portions 410 were formed on each of the four side portions of the mounting structure 510 corresponding to the four sides of the interposer 220 and the four sides of the printed circuit board 300. In contrast, in the present embodiment, the side portions of the mounting structure 510 on which the reinforcing resin portions 410 are formed are two of the four side portions. In the present embodiment, the reinforcing resin portions 410 formed on the two side portions and the surrounding structure can have the same structure as any of the first to fifth embodiments.

[0099] As shown in FIG. 10A, in the present embodiment, the reinforcing resin portions 410 are formed on two opposing side portions 511 and 512 of the mounting structure 510. The side portion 511 of the mounting structure 510 includes side 1 of the interposer 220 and side 10 of the printed circuit board 300. The side portion 512 of the mounting structure 510 includes side 2 of the interposer 220 and side 20 of the printed circuit board 300.

[0100] On the other hand, the reinforcing resin portions 410 are not formed on two opposing side portions 513 and 514 of the mounting structure 510. The side portion 513 of the mounting structure 510 includes side 3 of the interposer 220 and side 30 of the printed circuit board 300. The side portion 514 of the mounting structure 510 includes side 4 of the interposer 220 and side 40 of the printed circuit board 300. That is, resin portions made of the same material as the reinforcing resin portion 410 are not attached to the side surfaces 3c and 4c of the interposer 220.

[0101] In this embodiment, for example, it is assumed that sides 10 and 20 of the printed circuit board 300 are approximately 1.1 times longer than sides 1 and 2 of the interposer 220, and sides 30 and 40 of the printed circuit board 300 are of the same length as sides 3 and 4 of the interposer 220. That is, sides 3 and 4 of the interposer 220 are hidden under the printed circuit board 300 where sides 30 and 40 are located outside the interposer 220. In this case, as shown in FIG. 10A, a reinforcing resin portion 410 is formed on two opposing side portions 511 and 512 of the mounting structure 510. Side portion 511 includes side 1 of the interposer 220 and side 10 of the printed circuit board 300. Side portion 512 includes side 2 of the interposer 220 and side 20 of the printed circuit board 300. Further, as shown in FIG. 10B, when the three-dimensional mounting structure 500 is viewed from the y-axis direction, in side portion 511, the solder joint 610 is hidden by the reinforcing resin portion 410 and is not visible. On the other hand, the outermost solder joint 620 among the plurality of solder joints 620 is disposed outside the outermost solder joint 610 among the plurality of solder joints 610 and is exposed one by one from both ends of the reinforcing resin portion 410. Note that side portion 512 of the mounting structure 510 also has the same configuration as described above. Thereby, the stress concentrated on the solder joints 610 in the vicinity of side portions 513 and 514 can be dispersed to the solder joints 620 exposed from both ends of the resin of side portions 511 and 512. Therefore, according to this embodiment, compared with the case where the reinforcing resin portion 410 is formed on two side portions of the mounting structure 510 so as to cover sides 1 and 2 of the interposer 220, the reliability of the solder joint of the three-dimensional mounting structure 500 can be improved.

[0102] Also, depending on the production cycle time, there may be a case where it is necessary to shorten the time required for applying the resin 400. In such a case, by forming the reinforcing resin portion 410 on two side portions 511 and 512 of the mounting structure 510 as in this embodiment, the time required for applying the resin 400 can be shortened, and the reliability of the solder joint can be sufficiently ensured.

[0103] Here, FIGS. 10C and 10D show the arrangements of solder joints 610 and 620 viewed from the z-axis direction. Among the plurality of solder joints 610, the distance between the solder joint 610 closest to one end of side surface 1a in the x-axis direction and the solder joint 610 closest to the other end of side surface 1a in the x-axis direction among the plurality of solder joints 610 is defined as L1. Also, among the plurality of solder joints 620, the distance between the solder joint 620 closest to one end of side surface 1a in the x-axis direction and the solder joint 620 closest to the other end of side surface 1a in the x-axis direction among the plurality of solder joints 620 is defined as L2. Then, the distance L2 may be greater than the distance L1.

[0104] Further, the solder joints 610 or the solder joints 620 are not arranged in an equal number of rows on the sides of the four side portions 511, 512, 513, and 514 of the mounting structure 510, and it is also conceivable that the number of rows is smaller on the sides of two opposing side portions. In this case, it is preferable that the reinforcing resin portion 410 is formed on the two side portions where the number of rows of the solder joints 610 or the solder joints 620 is smaller. This is because the portion with a smaller number of rows of solder joints is more likely to break when stress is concentrated compared to the portion with a larger number of rows. Therefore, by preferentially forming the reinforcing resin portion 410 at that portion to reduce stress, the reinforcing effect can be effectively exerted. For example, the plurality of solder joints 610 or the plurality of solder joints 620 are provided in a smaller number of rows on the sides of the side portions 511 and 512 where the reinforcing resin portion 410 is provided than on the sides of the side portions 513 and 514 where the reinforcing resin portion 410 is not provided. Here, the sum of the number of solder joints 620 located between the semiconductor element 210 and the side surface 1a of the interposer 220 in the y-axis direction and the number of solder joints 620 located between the semiconductor element 210 and the side surface 2b of the interposer 220 in the y-axis direction is defined as S1. Also, the sum of the number of solder joints 620 located between the semiconductor element 210 and the side surface 3c of the interposer 220 in the x-axis direction and the number of solder joints 620 located between the semiconductor element 210 and the side surface 4d of the interposer 220 in the x-axis direction is defined as S2. Then, in the case of the exemplary difference in the number of rows described above, the sum S1 is smaller than the sum S2.

[0105] [Embodiment] (Embodiment 1) Embodiment 1 corresponding to the first embodiment will be described. The sizes of each part of the three-dimensional mounting structure 500 were as follows. The outer shape of the interposer 220 had side 1 and side 2 with lengths of 16.40 mm respectively, and side 3 and side 4 with lengths of 15.20 mm respectively. Also, the thickness of the interposer 220 including the solder resists 251 and 252 was about 0.50 mm, and the thicknesses of the solder resists 251 and 252 were about 0.015 mm respectively. The outer shape of the printed circuit board 300 had side 10 and side 20 with lengths of 22.0 mm respectively, and side 30 and side 40 with lengths of 15.8 mm respectively. Also, the thickness of the printed circuit board 300 including the solder resists 351 and 352 was about 0.37 mm, and the thicknesses of the solder resists 351 and 352 were about 0.016 mm respectively.

[0106] The solder joints 610 were arranged in a staggered pattern with a pitch of 0.40 mm. Also, the solder joints 620 were arranged in a staggered pattern with a pitch of 0.60 mm so as to surround the outer periphery of the semiconductor element 210. In the state where the solder joints 620 and the solder joints 620 were formed, the height from the surface of the solder resist 151 of the printed circuit board 100 to the solder resist 352 of the printed circuit board 300 was about 0.90 mm.

[0107] In the above three-dimensional mounting structure 500, resin 400 was applied to sides 1, 2, 3, 4 of the interposer 220 and sides 10, 20, 30, 40 of the printed circuit board 300. When applying the resin 400, it was applied while moving the resin 400 discharged from a nozzle attached to a dispenser (not shown).

[0108] Next, the three-dimensional mounting structure 500 coated with the resin 400 was placed in an oven (not shown) and heated to cure the resin 400, thereby forming a reinforcing resin portion 410 made of the cured resin 400. The curing conditions by the oven were a temperature of 125 °C and a time of 30 minutes.

[0109] The reinforcing resin portion 410 thus formed had a length of about 15.00 mm, a width of about 1.60 mm, and a height of about 1.20 mm. That is, in the four side portions 511, 512, 513, and 514 of the mounting structure 510 in which the reinforcing resin portion 410 was formed, the length of the reinforcing resin portion 410 was shorter than the sides 1, 2, 3, and 4 of the interposer 220. Also, from both ends of the reinforcing resin portion 410, the side surfaces 1a, 1b, 1c, and 1d of the interposer 220 were exposed.

[0110] By forming the reinforcing resin portion 410 as described above, in Example 1, the reliability of soldering in the three-dimensional mounting structure 500 could be improved.

[0111] (Example 2) Example 2 corresponding to the first embodiment and the sixth embodiment will be described. The sizes of each part of the three-dimensional mounting structure 500 were as follows. The outer shape of the printed circuit board 300 had sides 10 and 20 with lengths of 21.45 mm each, and sides 30 and 40 with lengths of 15.40 mm each. Also, the thickness of the printed circuit board 300 including the solder resists 351 and 352 was about 0.37 mm, and the thicknesses of the solder resists 351 and 352 were each about 0.016 mm. Among the outermost solder joints 610, the distance between the solder joints 610 at both ends near the side portions 511 and 512 of the mounting structure 510 was about 14.9 mm. Among the outermost solder joints 620, the end-to-end distance between the solder joints 620 at both ends near the side portions 511 and 512 was about 15.9 mm.

[0112] Also, the reinforcing resin portion 410 was formed on the side portion 511 including side 1 of the interposer 220 and side 10 of the printed circuit board 300, and on the side portion 512 including side 2 of the interposer 220 and side 20 of the printed circuit board 300. The reinforcing resin portion 410 had a length of about 15.00 mm, a width of about 1.60 mm, and a height of about 1.20 mm.

[0113] Other points such as the side length of the interposer 220 and the height from the surface of the solder resist 151 of the printed circuit board 100 to the solder resist 352 of the printed circuit board 300 were the same as those in the first embodiment.

[0114] In the two side portions 511 and 512 of the mounting structure 510 in which the reinforcing resin portion 410 was formed, the length of the reinforcing resin portion 410 was shorter than the sides 1 and 2 of the interposer 220. Further, the side surfaces 1a and 2a of the interposer 220 were exposed from both ends of the reinforcing resin portion 410. Furthermore, the solder joint portion 610 was in a state of being hidden by the reinforcing resin portion 410 and not visible, and the solder joint portion 620 was in a state where the joint portions at both ends were exposed from the reinforcing resin portion 410 one by one.

[0115] By forming the reinforcing resin portion 410 as described above, the reliability of solder joints in the three-dimensional mounting structure 500 could also be improved in the second embodiment.

[0116] Next, in the three-dimensional mounting structure 500, a simulation was performed on the relationship between the length of the resin 400 applied to the side portions 511 including the side 1 and side 10 of the mounting structure 510 and the side portions 512 including the side 2 and side 20, and the stress applied to the solder joint portions 610 and 620. Also, a simulation was performed on the relationship between the length of the resin 400 applied to the side portions 511 and 512 of the mounting structure 510 and the reliability of solder joints. In the simulation, the sizes of each part of the three-dimensional mounting structure 500 were set in the same manner as in the second embodiment except for the length of the resin 400 to be changed. In the simulation, the application length of the resin 400 was increased from the center of the long sides 10 and 20 of the printed circuit board 300 toward both ends of the sides 10 and 20, and the change in the stress applied to the solder joint portions 610 and 620 and the reliability of solder joints at that time were confirmed.

[0117] FIG. 11A is a graph showing the results of a simulation on the relationship between the length of the resin 400 applied to the side portions 511 and 512 of the mounting structure 510 in the three-dimensional mounting structure 500 and the stress applied to the solder joint portions 610 and 620.

[0118] By applying the resin 400 to form the reinforcing resin portion 410, the thermal deformation of the interposer 220 and the printed circuit board 300 is suppressed. Therefore, the stress applied to the solder joints 610 and 620 is reduced. However, if the length of the resin 400 is further increased and the length of the resin 400 is made longer than the side 1 and side 2 of the interposer 220, the interposer 220 will be greatly affected by the thermal deformation of the printed circuit board 300. As a result, as shown on the right side of the boundary 11 in FIG. 11A, the stress applied to the solder joints 610 and 620 gradually increases. Here, the boundary 11 is the point where the length of the resin 400 to be applied is equal to the lengths of the side 1 and side 2 of the interposer 220.

[0119] FIG. 11B is a graph showing the result of a simulation of the relationship between the length of the resin 400 applied to the side portions 511 and 512 of the mounting structure 510 in the three-dimensional mounting structure 500 and the reliability of the solder joint.

[0120] When the resin 400 is applied longer than the boundary 11, corresponding to the increase in the stress applied to the solder joints 610 and 620 as shown in FIG. 11A, the reliability of the solder joint in the three-dimensional mounting structure 500 decreases as shown in FIG. 11B. Therefore, as shown in FIGS. 11A and 11B, it is preferable to set the length of the resin 400 constituting the reinforcing resin portion 410 to the optimal length P within a range not exceeding the boundary 11. In the three-dimensional mounting structure in which the above simulation was performed, the optimal length P was about 15 mm, and the solder joints 620 at both ends were exposed from the resin 400 one by one.

[0121] (Example 3) Example 3 corresponding to the second embodiment and the sixth embodiment will be described. The sizes of the respective parts of the three-dimensional mounting structure 500 were as follows. The outer shape of the interposer 220 had side 1 and side 2 each with a length of 16.40 mm, and side 3 and side 4 each with a length of 15.20 mm. Also, the thickness of the interposer 220 including the solder resists 251 and 252 was approximately 0.50 mm, and the thicknesses of the solder resists 251 and 252 were each approximately 0.015 mm. The semiconductor element 210 was mounted on the main surface 231 of the insulating substrate 230. The outer shape of the printed circuit board 300 had side 10 and side 20 each with a length of 21.45 mm, and side 30 and side 40 each with a length of 15.40 mm. Also, the thickness of the printed circuit board 300 including the solder resists 351 and 352 was approximately 0.37 mm, and the thicknesses of the solder resists 351 and 352 were each approximately 0.016 mm.

[0122] The solder joints 610 were arranged in a staggered pattern with a pitch of 0.40 mm. Also, the solder joints 620 were arranged in a staggered pattern with a pitch of 0.42 mm so as to surround the outer periphery of the semiconductor element 210. Also, the distance between the center position of the solder joint 610a and the end of the interposer 220 was 0.53 [mm]. The distance between the center position of the solder joint 620a and the end of the interposer 220 was 0.40 mm. Also, the solder joints 610 each had a diameter of 0.30 mm. The solder joints 620 each had a diameter of 0.26 mm. At this time, the distance between the outermost peripheral position of the solder joint 610a and the end of the interposer 220 was 0.40 mm, which was equal to the distance between the center position of the solder joint 620a and the end of the interposer 220. In the state where the solder joints 610 and 620 were formed, the height from the main surface 131 of the printed circuit board 100 to the main surface 332 of the printed circuit board 300 was approximately 0.90 mm.

[0123] In the above three-dimensional mounting structure 500, resin 400 was applied to sides 1 and 2 of the interposer 220 and sides 10 and 20 of the printed circuit board 300. When applying the resin 400, it was applied while moving the resin 400 discharged from a nozzle attached to a dispenser (not shown).

[0124] Next, the three-dimensional mounting structure 500 coated with resin was placed in an oven (not shown) and heated to cure the resin 400, thereby forming a reinforcing resin portion 410 made of the cured resin 400. The curing conditions in the oven were a temperature of 125° C. and a time of 30 minutes.

[0125] The reinforcing resin portion 410 thus formed had a length of approximately 15.00 mm, a width of approximately 1.60 mm, and a height of approximately 1.20 mm.

[0126] [Other Embodiments] The above-described embodiments and examples are merely illustrative of several aspects to which the present invention can be applied. That is, the present invention is not limited to the above-described embodiments and examples, and can be appropriately modified and deformed without departing from the spirit of the present invention.

[0127] In the above-described embodiment, the case where a plurality of lands 342 are provided on the main surface 332 of the insulating substrate 330 in the printed circuit board 300 has been described. However, a plurality of lands may also be provided on the main surface 331 of the insulating substrate 330. In this case, on the printed circuit board 300, a printed circuit board, a semiconductor device, an electronic component, etc. may be further mounted via a solder joint portion that joins the plurality of lands provided on the main surface 331.

[0128] A three-dimensional mounting structure 500 according to another embodiment in which a printed circuit board or the like is further mounted on a printed circuit board 300 will be described with reference to FIGS. 12A to 12C. FIG. 12A is a top view showing the three-dimensional mounting structure 500 according to another embodiment. FIG. 12B is a side view of the three-dimensional mounting structure 500 according to another embodiment as viewed from the y-axis direction. FIG. 12C is a cross-sectional view of the three-dimensional mounting structure 500 according to another embodiment as viewed from the x-axis direction. For components having the same configuration as those in the first to sixth embodiments, the same reference numerals are given and detailed descriptions are omitted or simplified. As shown in FIGS. 12A to 12C, in this embodiment, a plurality of printed circuit boards 450 and a plurality of electronic components 460 are mounted on the main surface 331 of the insulating substrate 330 in the printed circuit board 300.

[0129] A plurality of lands 341 and a plurality of lands 343 are arranged on the main surface 331 of the insulating substrate 330 in the printed circuit board 300. The lands 341 and 343 are terminals formed of a conductive metal material, such as copper or gold. A solder resist 351 is provided on the main surface 331 of the insulating substrate 330. Each of the plurality of lands 341 and each of the plurality of lands 343 are exposed by openings formed in the solder resist 351. The lands 341 and 343 may be either SMD or NSMD lands.

[0130] The plurality of printed circuit boards 450 are mounting substrates for semiconductor elements 461 in semiconductor devices such as memories. Semiconductor elements 461 and other components are mounted (die-bonded) on the printed circuit boards 450 to form semiconductor devices. The printed circuit boards 450 have insulating substrates 430. A plurality of lands 442 are arranged on the main surface 432 of the insulating substrate 430. A solder resist 452 is provided on the main surface 432 of the insulating substrate 430. The plurality of lands 442 are exposed by openings formed in the solder resist 452. The plurality of electronic components 460 are chip components such as capacitors and resistors.

[0131] On the main surface 431 opposite to the main surface 432 of the insulating substrate 430, semiconductor elements 461 such as memories are mounted on the printed circuit board 450. On the main surface 431 including the semiconductor elements 461, a sealing resin 462 is formed to seal the semiconductor elements 461. The semiconductor device includes at least the semiconductor elements 461, and further includes the printed circuit board 450 and the sealing resin 462 as necessary.

[0132] A plurality of lands 341 of the printed circuit board 300 and a plurality of lands 442 of the printed circuit board 450 are joined by solder joints 630. Thus, the plurality of printed circuit boards 450 are arranged on the side opposite to the side of the interposer 220 with respect to the printed circuit board 300 and are joined to the printed circuit board 300 via the plurality of solder joints 630. Further, a plurality of lands 343 of the printed circuit board 300 and the electronic component 460 are joined by a solder joint 640. The solder forming the solder joints 630 and 640 is, for example, solder balls.

[0133] Thus, a semiconductor device including a semiconductor element 461, a printed circuit board 450, and a sealing resin 462 is disposed on the printed circuit board 300 on the side opposite to the side of the interposer 220. And, for example, a first semiconductor device including one printed circuit board 450 and at least one semiconductor element 461 and a second semiconductor device including another printed circuit board 450 and at least one semiconductor element 461 are arranged side by side in the x-axis direction. Therefore, it is preferable that the x-axis direction in which a plurality of semiconductor devices are arranged is the long side direction of the printed circuit board 300. Also in the printed circuit board 300, it is effective to provide a reinforcing resin portion 410 on the long side rather than the short side. Therefore, it is preferable to arrange the reinforcing resin portions 410 on the side portions 511 and 512 along the x-axis direction in which a plurality of semiconductor devices are arranged. Thereby, the distortion of the printed circuit board 300 caused by each of the plurality of semiconductor devices can be suppressed by the reinforcing resin portions 410 of the side portions 511 and 512. Also, in addition to the side portions 511 and 512, as shown in FIGS. 4C and 9A, the reinforcing resin portions 410 may also be arranged on the side portions 513 and 514. Note that when a plurality of semiconductor devices are arranged in the x-axis direction, the reinforcing resin portions 410 can be provided only on the side portions 513 and 514 along the y-axis direction, but the reinforcing effect is reduced as compared with the form of FIG. 12A.

[0134] As described above, a plurality of printed circuit boards 450 and a plurality of electronic components 460 may be mounted on the printed circuit board 300. Also in such an embodiment, as in the first to sixth embodiments described above, a configuration including a printed circuit board 100, an interposer 220, and a reinforcing resin portion 410 attached to the printed circuit board 300 can be adopted. In this case, the reinforcing resin portion 410 is separated from the solder joints 630, 640 and the plurality of printed circuit boards 450.

[0135] The disclosure of this embodiment includes the following configurations. (Configuration 1) A first printed wiring board, A second printed wiring board disposed on the main surface of the first printed wiring board and joined to the first printed wiring board via a plurality of first solder joints, A third printed wiring board that is disposed on a side opposite to the side of the first printed wiring board with respect to the second printed wiring board and is joined to the second printed wiring board via a plurality of second solder joints, a first reinforcing resin portion, and a second reinforcing resin portion, wherein the second printed wiring board has a first side surface and a second side surface that face each other in a first direction, and a third side surface and a fourth side surface that face each other in a second direction intersecting the first direction, the first reinforcing resin portion adheres to the main surface of the first printed wiring board, the first side surface of the second printed wiring board, and the third printed wiring board, and is separated from at least one end of both ends of the first side surface of the second printed wiring board in the second direction, the second reinforcing resin portion adheres to the main surface of the first printed wiring board, the second side surface of the second printed wiring board, and the third printed wiring board, and is separated from at least one end of both ends of the second side surface of the second printed wiring board in the second direction. A module characterized by the above. (Configuration 2) One end of the first side surface is closer to the third side surface than the fourth side surface, and one end of the second side surface is closer to the fourth side surface than the third side surface. The module according to Configuration 1, characterized by the above. (Configuration 3) The first reinforcing resin portion is separated from the other end of both ends of the first side surface of the second printed wiring board in the second direction, and the second reinforcing resin portion is separated from the other end of both ends of the second side surface of the second printed wiring board in the second direction. The module according to Configuration 1 or 2, characterized by the above. (Configuration 4) The first reinforcing resin portion is separated from the solder joint closest to one end of the first side surface among the plurality of second solder joints, The second reinforcing resin part is separated from the solder joint among the plurality of second solder joints that is closest to one end of the second side surface. The module according to any one of Configurations 1 to 3, characterized in that. (Configuration 5) The first reinforcing resin part is separated from the solder joint among the plurality of second solder joints that is closest to the other end of the first side surface. The second reinforcing resin part is separated from the solder joint among the plurality of second solder joints that is closest to the other end of the second side surface. The module according to Configuration 4, characterized in that. (Configuration 6) Among the plurality of second solder joints, the distance between the solder joint closest to one end of the first side surface and the solder joint closest to the other end of the first side surface is Greater than the distance between the solder joint closest to one end of the first side surface and the solder joint closest to the other end of the first side surface among the plurality of first solder joints. The module according to Configuration 5, characterized in that. (Configuration 7) The first reinforcing resin part is separated from the solder joint among the plurality of second solder joints that is closest to the first reinforcing resin part. The second reinforcing resin part is separated from the solder joint among the plurality of second solder joints that is closest to the second reinforcing resin part. The module according to Configuration 1 or 2, characterized in that. (Claim 8) The first reinforcing resin part is attached to the solder joint among the plurality of second solder joints that is closest to the first reinforcing resin part. The second reinforcing resin part is attached to the solder joint among the plurality of second solder joints that is closest to the second reinforcing resin part. The module according to any one of Configurations 1 to 7, characterized in that. (Configuration 9) A resin part made of the same material as the first reinforcing resin part is not attached to the third side surface. A resin part made of the same material as the second reinforcing resin part is not attached to the fourth side surface. The module according to any one of Configurations 1 to 8, characterized in that. (Configuration 10) A third reinforcing resin part, A fourth reinforcing resin part, and has The third reinforcing resin part is attached to the main surface of the first printed wiring board, the third side surface of the second printed wiring board, and the third printed wiring board, and is separated from at least one of both ends in the second direction of the third side surface of the second printed wiring board. The fourth reinforcing resin part is attached to the main surface of the first printed wiring board, the fourth side surface of the second printed wiring board, and the third printed wiring board, and is separated from at least one of both ends in the second direction of the fourth side surface of the second printed wiring board. The module according to any one of Configurations 1 to 9, characterized in that. (Configuration 11) A first printed wiring board, A second printed wiring board disposed on the main surface of the first printed wiring board and joined to the first printed wiring board via a plurality of first solder joints, A third printed wiring board disposed on the side opposite to the side of the first printed wiring board with respect to the second printed wiring board and joined to the second printed wiring board via a plurality of second solder joints, A first reinforcing resin part, A second reinforcing resin part, and has The second printed wiring board has a first side surface and a second side surface facing each other in the first direction, and a third side surface and a fourth side surface facing each other in the second direction intersecting the first direction. The first reinforcing resin portion adheres to the main surface of the first printed wiring board, the first side surface of the second printed wiring board, and the third printed wiring board, and is separated from the solder joint closest to the first reinforcing resin portion among one of the plurality of first solder joints and the plurality of second solder joints, and adheres to the solder joint closest to the first reinforcing resin portion among the other of the plurality of first solder joints and the plurality of second solder joints. Module characterized by the above. (Configuration 12) The second reinforcing resin portion adheres to the main surface of the first printed wiring board, the second side surface of the second printed wiring board, and the third printed wiring board, and is separated from the solder joint closest to the second reinforcing resin portion among one of the plurality of first solder joints and the plurality of second solder joints, and adheres to the solder joint closest to the second reinforcing resin portion among the other of the plurality of first solder joints and the plurality of second solder joints. The module according to Configuration 11, characterized by the above. (Configuration 13) One of the joints is the plurality of first solder joints. The other joint is the plurality of second solder joints. The module according to Configuration 11 or 12, characterized by the above. (Configuration 14) Among one of the joints, the distance between the solder joint closest to the first reinforcing resin portion and the first side surface is longer than the distance between the solder joint closest to the first reinforcing resin portion and the first side surface among the other joints. The module according to Configuration 13, characterized by the above. (Configuration 15) A solder portion that does not join to one of the first printed wiring board and the second printed wiring board is provided between the first printed wiring board and the second printed wiring board. The first reinforcing resin portion adheres to the solder portion. The module according to any one of Configurations 1 to 14, characterized by the above. (Configuration 16) The second printed wiring board has a step formed outside the second solder joint portion, and the first reinforcing resin portion is formed on the step. The module according to any one of Configurations 1 to 15, characterized in that. (Configuration 17) The second printed wiring board has a substrate and a solder resist formed on the substrate, and the step is formed on the substrate. The module according to Configuration 16, characterized in that. (Configuration 18) The second printed wiring board has a substrate and a solder resist formed on the substrate, and the step is an opening formed in the solder resist. The module according to Configuration 16, characterized in that. (Configuration 19) The first reinforcing resin portion faces a plurality of third solder joint portions among the plurality of first solder portions and a plurality of fourth solder joint portions among the plurality of second solder joint portions. The module according to any one of Configurations 1 to 18, characterized in that. (Configuration 20) The first reinforcing resin portion and the second reinforcing resin portion have a portion located between the first printed wiring board and the second printed wiring board and a portion located between the second printed wiring board and the third printed wiring board in a third direction perpendicular to the main surface of the first printed wiring board. The module according to any one of Configurations 1 to 19, characterized in that. (Configuration 21) It has a semiconductor element disposed between the second printed wiring board and the third printed wiring board, the plurality of second solder joint portions are disposed around the semiconductor element, and in the first direction, the semiconductor element is provided between the first reinforcing resin portion and the second reinforcing resin portion. The module according to any one of Configurations 1 to 20, characterized in that... (Configuration 22) In the second direction, the second reinforcing resin portion is longer than the semiconductor element The module according to Configuration 21, characterized in that... (Configuration 23) The sum of the number of the second solder joints located between the semiconductor element and the first side surface in the first direction and the number of the second solder joints located between the semiconductor element and the second side surface in the first direction is Smaller than the sum of the number of the second solder joints located between the semiconductor element and the third side surface in the second direction and the number of the second solder joints located between the semiconductor element and the fourth side surface in the second direction The module according to Configuration 21, characterized in that... (Configuration 24) The thickness of the third printed wiring board is smaller than the thickness of the second printed wiring board The module according to any one of Configurations 1 to 23, characterized in that... (Configuration 25) The third printed wiring board has a fifth side surface and a sixth side surface facing each other in the first direction, and a seventh side surface and an eighth side surface facing each other in the second direction, The first reinforcing resin portion adheres to the fifth side surface of the third printed wiring board, The second reinforcing resin portion adheres to the sixth side surface of the third printed wiring board The module according to any one of Configurations 1 to 24, characterized in that... (Configuration 26) The first side surface and the second side surface of the second printed wiring board are located between the first printed wiring board and the third printed wiring board in a third direction perpendicular to the main surface of the first printed wiring board. The module according to any one of Configurations 1 to 25, characterized in that... (Configuration 27) A fourth printed wiring board that is disposed on the side opposite to the side of the second printed wiring board with respect to the third printed wiring board and is joined to the third printed wiring board via a plurality of third solder joints. The first reinforcing resin portion and the second reinforcing resin portion are separated from the third solder joints and the fourth printed wiring board. The module according to any one of Configurations 1, 2, 11, and 12, characterized in that. (Configuration 28) The distance between the seventh side surface and the eighth side surface is greater than the distance between the fifth side surface and the sixth side surface. The distance between the seventh side surface and the eighth side surface is greater than the distance between the third side surface and the fourth side surface. The module according to Configuration 25, characterized in that. (Configuration 29) A first semiconductor device disposed on the side opposite to the side of the second printed wiring board with respect to the third printed wiring board; A second semiconductor device disposed on the side opposite to the side of the second printed wiring board with respect to the third printed wiring board, and the first semiconductor device and the second semiconductor device are arranged side by side in the second direction. The module according to any one of Configurations 1 to 28, characterized in that. The module according to any one of Configurations 1 to 28, characterized in that. (Configuration 30) A housing; A first module disposed inside the housing; A second module disposed inside the housing, and the first module and the second module are electrically connected, and the second module is the module according to any one of Configurations 1 to 29. An electronic device, characterized in that. The first module and the second module are electrically connected. The second module is the module according to any one of Configurations 1 to 29. The electronic device, characterized in that. (Configuration 31) The first module and the second module are electrically connected via a flexible wiring. The electronic device according to Configuration 30, characterized in that. (Configuration 32) The first module includes an imaging device The electronic device according to Configuration 30, characterized by the above

Explanation of Signs

[0136] 100…Printed circuit board 200…Semiconductor device 210…Semiconductor element 220…Interposer 300…Printed circuit board 400…Resin 410…Reinforced resin part 500…Three-dimensional mounting structure 510…Mounting structure 610…Soldering joint 620…Soldering joint 710…Soldering joint 720…Soldering joint 255…Opening 260…Step 650…Dummy bump

Claims

1. a first printed wiring board, a second printed wiring board disposed on a main surface of the first printed wiring board and joined to the first printed wiring board via a plurality of first solder joints, a third printed wiring board disposed on a side opposite to the side of the first printed wiring board with respect to the second printed wiring board and joined to the second printed wiring board via a plurality of second solder joints, a first reinforcing resin part, a second reinforcing resin part, and having, the second printed wiring board has a first side surface and a second side surface facing each other in a first direction, and a third side surface and a fourth side surface facing each other in a second direction intersecting the first direction, the first reinforcing resin part adheres to the main surface of the first printed wiring board, the first side surface of the second printed wiring board, and the third printed wiring board, and is separated from at least one end of both ends of the first side surface of the second printed wiring board in the second direction, the second reinforcing resin part adheres to the main surface of the first printed wiring board, the second side surface of the second printed wiring board, and the third printed wiring board, and is separated from at least one end of both ends of the second side surface of the second printed wiring board in the second direction A module characterized by this.

2. one end of the first side surface is closer to the third side surface than the fourth side surface, and one end of the second side surface is closer to the fourth side surface than the third side surface The module according to claim 1, characterized by this.

3. the first reinforcing resin part is separated from the other end of both ends of the first side surface of the second printed wiring board in the second direction, the second reinforcing resin part is separated from the other end of both ends of the second side surface of the second printed wiring board in the second direction The module according to claim 1 or 2, characterized by this.

4. the first reinforcing resin part is separated from the solder joint closest to one end of the first side surface among the plurality of second solder joints, the second reinforcing resin part is separated from the solder joint closest to one end of the second side surface among the plurality of second solder joints The module according to claim 1 or 2, characterized by this.

5. the first reinforcing resin part is separated from the solder joint closest to the other end of the first side surface among the plurality of second solder joints, The second reinforcing resin portion is separated from the solder joint among the plurality of second solder joints that is closest to the other end of the second side surface. The module according to claim 4, wherein the module is characterized in that.

6. Among the plurality of second solder joints, the distance between the solder joint closest to the one end of the first side surface and the solder joint closest to the other end of the first side surface among the plurality of second solder joints is Greater than the distance between the solder joint closest to the one end of the first side surface among the plurality of first solder joints and the solder joint closest to the other end of the first side surface among the plurality of first solder joints. The module according to claim 5, wherein the module is characterized in that.

7. The first reinforcing resin portion is separated from the solder joint among the plurality of second solder joints that is closest to the first reinforcing resin portion, The second reinforcing resin portion is separated from the solder joint among the plurality of second solder joints that is closest to the second reinforcing resin portion. The module according to claim 1 or 2, wherein the module is characterized in that.

8. The first reinforcing resin portion is attached to the solder joint among the plurality of second solder joints that is closest to the first reinforcing resin portion, The second reinforcing resin portion is attached to the solder joint among the plurality of second solder joints that is closest to the second reinforcing resin portion. The module according to claim 1 or 2, wherein the module is characterized in that.

9. A resin portion made of the same material as the first reinforcing resin portion is not attached to the third side surface, A resin portion made of the same material as the second reinforcing resin portion is not attached to the fourth side surface. The module according to claim 1 or 2, wherein the module is characterized in that.

10. A third reinforcing resin portion, A fourth reinforcing resin portion, and has The third reinforcing resin portion is attached to the main surface of the first printed wiring board, the third side surface of the second printed wiring board, and the third printed wiring board, and is separated from at least one of both ends in the second direction of the third side surface of the second printed wiring board. The fourth reinforcing resin portion is attached to the main surface of the first printed wiring board, the fourth side surface of the second printed wiring board, and the third printed wiring board, and is separated from at least one of both ends in the second direction of the fourth side surface of the second printed wiring board. The module according to claim 1 or 2, wherein the module is characterized in that.

11. A first printed wiring board, A second printed wiring board disposed on the main surface of the first printed wiring board and joined to the first printed wiring board via a plurality of first solder joints; A third printed wiring board disposed on the side opposite to the side of the first printed wiring board with respect to the second printed wiring board and joined to the second printed wiring board via a plurality of second solder joints; A first reinforcing resin portion; A second reinforcing resin portion, and having: The second printed wiring board has a first side surface and a second side surface facing each other in a first direction, and a third side surface and a fourth side surface facing each other in a second direction intersecting the first direction; The first reinforcing resin portion adheres to the main surface of the first printed wiring board, the first side surface of the second printed wiring board, and the third printed wiring board, and among one of the plurality of first solder joints and the plurality of second solder joints, it is separated from the solder joint closest to the first reinforcing resin portion, and among the other of the plurality of first solder joints and the plurality of second solder joints, it adheres to the solder joint closest to the first reinforcing resin portion. A module characterized by the above.

12. The second reinforcing resin portion adheres to the main surface of the first printed wiring board, the second side surface of the second printed wiring board, and the third printed wiring board, and among one of the plurality of first solder joints and the plurality of second solder joints, it is separated from the solder joint closest to the second reinforcing resin portion, and among the other of the plurality of first solder joints and the plurality of second solder joints, it adheres to the solder joint closest to the second reinforcing resin portion. The module according to claim 11, characterized by the above.

13. The one joint is the plurality of first solder joints; The other joint is the plurality of second solder joints. The module according to claim 11 or 12, characterized by the above.

14. Among the one joints, the distance between the solder joint closest to the first reinforcing resin portion and the first side surface is longer than the distance between the solder joint closest to the first reinforcing resin portion and the first side surface among the other joints. The module according to claim 13, characterized by the above.

15. A solder portion that does not join to one of the first printed wiring board and the second printed wiring board is provided between the first printed wiring board and the second printed wiring board. The first reinforcing resin part is attached to the solder part. The module according to any one of claims 1, 2, 11, and 12, characterized in that.

16. The second printed wiring board has a step formed outside the second solder joint part. The first reinforcing resin part is formed on the step. The module according to any one of claims 1, 2, 11, and 12, characterized in that.

17. The second printed wiring board has a substrate and a solder resist formed on the substrate. The step is formed on the substrate. The module according to claim 16, characterized in that.

18. The second printed wiring board has a substrate and a solder resist formed on the substrate. The step is an opening formed in the solder resist. The module according to claim 16, characterized in that.

19. The first reinforcing resin part faces a plurality of third solder joint parts among the plurality of first solder joint parts and a plurality of fourth solder joint parts among the plurality of second solder joint parts. The module according to any one of claims 1, 2, 11, and 12, characterized in that.

20. The first reinforcing resin part and the second reinforcing resin part have a portion located between the first printed wiring board and the second printed wiring board and a portion located between the second printed wiring board and the third printed wiring board in a third direction perpendicular to the main surface of the first printed wiring board. The module according to any one of claims 1, 2, 11, and 12, characterized in that.

21. It has a semiconductor element disposed between the second printed wiring board and the third printed wiring board. The plurality of second solder joint parts are disposed around the semiconductor element. In the first direction, the semiconductor element is provided between the first reinforcing resin part and the second reinforcing resin part. The module according to any one of claims 1, 2, 11, and 12, characterized in that.

22. In the second direction, the second reinforcing resin part is longer than the semiconductor element. The module according to claim 21, characterized in that.

23. The sum of the number of the second solder joint parts located between the semiconductor element and the first side surface in the first direction and the number of the second solder joint parts located between the semiconductor element and the second side surface in the first direction is. Less than the sum of the number of the second solder joints located between the semiconductor element and the third side surface in the second direction and the number of the second solder joints located between the semiconductor element and the fourth side surface in the second direction The module according to claim 21, wherein the module is characterized in that

24. The thickness of the third printed wiring board is smaller than the thickness of the second printed wiring board The module according to any one of claims 1, 2, 11, and 12, wherein the module is characterized in that

25. The third printed wiring board has a fifth side surface and a sixth side surface facing each other in the first direction, and a seventh side surface and an eighth side surface facing each other in the second direction The first reinforcing resin portion adheres to the fifth side surface of the third printed wiring board The second reinforcing resin portion adheres to the sixth side surface of the third printed wiring board The module according to any one of claims 1, 2, 11, and 12, wherein the module is characterized in that

26. The first side surface and the second side surface of the second printed wiring board are located between the first printed wiring board and the third printed wiring board in a third direction perpendicular to the main surface of the first printed wiring board The module according to any one of claims 1, 2, 11, and 12, wherein the module is characterized in that

27. A fourth printed wiring board is disposed on the side opposite to the side of the second printed wiring board with respect to the third printed wiring board and is joined to the third printed wiring board via a plurality of third solder joints The first reinforcing resin portion and the second reinforcing resin portion are away from the third solder joints and the fourth printed wiring board The module according to any one of claims 1, 2, 11, and 12, wherein the module is characterized in that

28. The distance between the seventh side surface and the eighth side surface is larger than the distance between the fifth side surface and the sixth side surface The distance between the seventh side surface and the eighth side surface is larger than the distance between the third side surface and the fourth side surface The module according to claim 25, wherein the module is characterized in that

29. A first semiconductor device disposed on the side opposite to the side of the second printed wiring board with respect to the third printed wiring board A second semiconductor device disposed on the side opposite to the side of the second printed wiring board with respect to the third printed wiring board, and the first semiconductor device and the second semiconductor device are arranged side by side in the second direction The first semiconductor device and the second semiconductor device are arranged side by side in the second direction The module according to any one of claims 1, 2, 11, and 12, characterized by the above.

30. A housing, A first module disposed inside the housing, A second module disposed inside the housing, Comprising: The first module and the second module are electrically connected, The second module is the module according to any one of claims 1, 2, 11, and 12 An electronic device characterized by the above.

31. The first module and the second module are electrically connected via a flexible wiring. The electronic device according to claim 30, characterized by the above.

32. The first module includes an imaging element. The electronic device according to claim 30, characterized by the above.

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