Electronic control device

Abstract

To provide an electronic control device that achieves higher heat dissipation and suppression of radiation noise compared to conventional structures.SOLUTION: An electronic control device 100 comprises: a circuit board 3 on which an electronic component 4 is mounted; and an upper housing 1 and a lower housing 2 for housing the circuit board 3. The upper housing 1 has a protrusion 7 having a top surface facing the circuit board 3. At least a part of an upper surface of the electronic component 4 is thermally connected to the upper housing 1 via a heat dissipation member 6. At least a part of a side surface of the electronic component 4 faces the protrusion 7 via the heat dissipation member 6.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an electronic control device. [Background technology]

[0002] As an example of an electronic control device that can efficiently dissipate heat from a heat-generating element, Patent Document 1 describes a cover attached to a circuit board so as to cover the heat-generating element on the side of the circuit board on which the heat-generating element is mounted, the cover having legs and a plate portion, the legs standing upright from the area surrounding the heat-generating element on the circuit board, and the plate portion for heat dissipation connected to the upper part of the legs, with its lower surface close to the upper surface of the heat-generating element and its upper surface close to the inner wall surface of the upper case. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-012127 Summary of the Invention [Problem to be solved by the invention]

[0004] In-vehicle electronic control devices are equipped with microcomputers capable of high-speed calculations and processing to enable advanced autonomous driving functions. However, as the demand for more advanced autonomous driving functions increases, the computing power of microcomputers is increasing year by year, and the amount of heat generated is also increasing proportionally.

[0005] In the past, when thermal grease was applied to electronic components to dissipate heat, there was a problem in that the parasitic capacitance of the thermal grease caused potential fluctuations caused by the operation of the electronic components to propagate to the casing, resulting in electromagnetic noise being radiated to the outside through gaps in the casing.

[0006] To address this issue, the technology described in Patent Document 1 suppresses radiated noise by using a local shielding structure that covers the electronic components that are the noise source. In addition, the heat dissipation material is applied to the semiconductor chip, which achieves both heat dissipation and EMC.

[0007] In recent years, the level of autonomous driving has been further improved, and the integration of ECUs (Electronic Control Units) has expanded, resulting in improved performance requirements. As a result, electronic components have been made into SiPs (System in Packages) and chiplets, which have led to issues of increased heat generation and higher frequencies.

[0008] It was found that if the technology described in Patent Document 1 above is applied to next-generation products, there is a risk that heat dissipation will be insufficient because the thermal grease is applied only to the top surface of the semiconductor chip, and that the parasitic capacitance of the thermal grease will cause the loop of potential fluctuations caused by the operation of electronic components to take a path from the top surface of the chip through the legs, resulting in insufficient suppression of radiated noise, and therefore there is room for improvement.

[0009] The present invention provides an electronic control device that achieves higher heat dissipation and suppression of radiation noise compared to conventional structures. [Means for solving the problem]

[0010] The present invention includes multiple means for solving the above-mentioned problems, and one example thereof is a circuit board on which an electronic component is mounted, and a housing that houses the circuit board, wherein the housing has a protrusion having a top surface facing the circuit board, at least a portion of the top surface of the electronic component is thermally connected to the housing via a heat dissipation member, and at least a portion of the side surface of the electronic component faces the protrusion via the heat dissipation member. [Effects of the Invention]

[0011] According to the present invention, it is possible to achieve higher heat dissipation and suppression of radiated noise than with conventional structures. Objects, configurations, and effects other than those described above will become clear from the following description of the embodiments. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is an external perspective view of an electronic control device according to a first embodiment of the present invention. [Figure 2] 1 is a perspective view of the top surface of a housing of an electronic control device according to a first embodiment. [Figure 3] Cross-sectional view of line II in Figure 2. [Figure 4] Cross-sectional view of line II-II in Figure 2. [Figure 5] 10A and 10B are diagrams showing the results of verifying the noise current reduction effects of the present invention and a comparative example. [Figure 6] FIG. 10 is a diagram showing the results of verifying the effect of reducing the amount of temperature rise of the present invention and a comparative example. [Figure 7] 2. FIG. 4 is a cross-sectional view of an electronic control device according to a second embodiment, taken along line II in FIG. [Figure 8] 2. FIG. 4 is a cross-sectional view of an electronic control device according to a second embodiment, taken along line II-II in FIG. [Figure 9] 10 is a cross-sectional view of an electronic control device according to a modified example of the second embodiment, taken along line II in FIG. 2. [Figure 10] 2. FIG. 5 is a cross-sectional view of an electronic control device according to a third embodiment, taken along line II-II in FIG. [Figure 11] 10 is a cross-sectional view of an electronic control device according to a fourth embodiment, taken along line II in FIG. 2; [Figure 12] 10 is a cross-sectional view of an electronic control device according to a fifth embodiment, taken along line II in FIG. 2. [Figure 13] 10 is a cross-sectional view of an electronic control device according to a sixth embodiment, taken along line II in FIG. 2. [Figure 14] FIG. 13 is a perspective view of the top surface of the housing of an electronic control device according to a seventh embodiment. [Figure 15] FIG. 13 is a perspective view of the top surface of the housing of an electronic control device according to an eighth embodiment. [Figure 16] FIG. 13 is a perspective view of the top surface of the housing of an electronic control device according to a ninth embodiment. [Figure 17] 13 is a cross-sectional view of an electronic control device according to a ninth embodiment, taken along line II in FIG. 2. [Figure 18] 2. FIG. 2 is a cross-sectional view of an electronic control device according to a tenth embodiment, taken along line II in FIG. [Figure 19] 2. FIG. 19 is a cross-sectional view of an electronic control device according to an eleventh embodiment, taken along line II in FIG. [Figure 20] 2. FIG. 22 is a cross-sectional view of an electronic control device according to a twelfth embodiment, taken along line II in FIG. [Figure 21] 2. FIG. 22 is a cross-sectional view of an electronic control device according to a thirteenth embodiment, taken along line II in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, an embodiment of the electronic control device of the present invention will be described with reference to the drawings. In the drawings used in this specification, identical or similar reference numerals are used to designate identical or corresponding components, and repeated description of these components may be omitted.

[0014] First Embodiment A first embodiment of an electronic control device of the present invention will be described with reference to FIGS.

[0015] First, the overall configuration and cross-sectional configuration of the electronic control device will be described with reference to Figures 1 to 4. Figure 1 is an external perspective view of the electronic control device according to the first embodiment of the present invention, Figure 2 is a transparent view of the top surface of the housing of the electronic control device according to the first embodiment, Figure 3 is a cross-sectional view taken along line II in Figure 2, and Figure 4 is a cross-sectional view taken along line II-II in Figure 2.

[0016] The external appearance of the electronic control device 100 shown in Figures 1 and 2 includes an upper housing 1 and a lower housing 2 that house a circuit board 3, housing fins 9 formed on the upper surface side of the upper housing 1, and a connector 10 that serves as a connection terminal with the outside.

[0017] 1, the electronic control device 100 is made up of a lower housing 2 and an upper housing 1, and has a box-like shape as a whole. A circuit board 3 is housed and arranged within these housings. More specifically, the circuit board 3 is sandwiched between the lower housing 2 and the upper housing 1, and in this state, the circuit board 3 is fixed by threading a screw (not shown) through the lower housing 2 and the circuit board 3 into the upper housing 1.

[0018] The upper housing 1 is made of a metal such as copper, iron, aluminum, magnesium, etc., or a resin with a metal film formed by plating or the like on a part or more of its surface in order to dissipate heat from the electronic components 4 to the outside of the housing. Like the upper housing 1, the lower housing 2 is also made of a metal such as copper, iron, aluminum, magnesium, etc., or a resin with a metal film formed by plating or the like on a part or more of its surface.

[0019] 2, electronic components 4, a ground section 5, etc. are mounted on the circuit board 3. Note that the actual positions of the electronic components 4 and the ground section 5 on the circuit board 3 are merely an example, and needless to say, they can be changed as appropriate depending on the design.

[0020] The electronic components 4 consist of one or more high heat generating components 4a and one or more low heat generating components 4b that serve as heat sources for I / O circuits, etc., and a substrate 4c on which these high heat generating components 4a and low heat generating components 4b are mounted, and the high heat generating components 4a and low heat generating components 4b are arranged on the substrate 4c so as to face the upper housing 1.

[0021] 3, a protrusion 7 is provided on the surface of the circuit board 3 of the upper housing 1 on which the electronic components 4 are mounted, protruding so as to cover the electronic components 4. The top surface, which is the tip of this protrusion 7, faces the ground section 5 of the circuit board 3. In other words, the upper housing 1 has the protrusion 7 having a top surface facing the circuit board 3.

[0022] The protrusion 7 can be made of a metal such as copper, iron, aluminum, or magnesium, or a resin with a metal film formed on at least a portion of its surface, and can have high thermal conductivity, and can be made of the same material as the upper housing 1. In this embodiment, the upper housing 1 and the protrusion 7 are made of the same material and are the same molded body.

[0023] 3, the heat dissipation member 6 is filled on the inner periphery of the protrusion 7 on the top surface side of the electronic component 4 on which the high heat generation component 4a and the low heat generation component 4b are formed, so that no space in which gas can exist exists between them. As a result, the top surfaces of the high heat generation component 4a and the low heat generation component 4b of the electronic component 4 are thermally connected to the upper housing 1 via the heat dissipation member 6.

[0024] 3, in the electronic control device 100 of this embodiment, the heat dissipation member 6 is filled in the protrusion 7 so that not only the top surfaces of the electronic components 4 but also the side surfaces of the high heat generation components 4a and the low heat generation components 4b of the electronic components 4 face the protrusion 7 via the heat dissipation member 6. This results in a structure in which no gas exists between the side surfaces of the high heat generation components 4a and the low heat generation components 4b of the electronic components 4 and the inner surfaces of the protrusions 7 that face the corresponding side surfaces.

[0025] Although Figure 3 shows a configuration in which the side surfaces of all high heat-generating components 4a and low heat-generating components 4b of electronic component 4 face protrusion 7 via heat dissipation member 6, it is sufficient that the side surfaces of at least one or more of high heat-generating components 4a or low heat-generating components 4b on electronic component 4 face protrusion 7 via heat dissipation member 6.

[0026] For example, as shown in FIGS. 9 and 17 described later, a configuration may be adopted in which a portion of the high heat generating component 4a and a portion of the low heat generating component 4b do not face the protrusion 7 via the heat dissipation member 6.

[0027] Furthermore, the present invention is not limited to the configuration shown in FIG. 3 in which the inside of the protrusion 7 on the side of the upper housing 1 from the tallest high-heat-generating component 4a facing the upper housing 1 is filled with heat dissipation material 6 and no gas is present inside, i.e., most of the space within the protrusion 7 is filled with heat dissipation material 6; the inside of the protrusion 7 on the side of the upper housing 1 from the tallest high-heat-generating component 4a facing the upper housing 1 may not be filled with heat dissipation material 6, and a space in which gas may be present may be formed; however, from the viewpoint of manufacturability, it is preferable that the protrusion 7 be filled with heat dissipation material 6 as shown in FIG. 3.

[0028] In Figure 3, the upper surface of the substrate 4c is shown as being covered with the heat dissipation material 6 in the areas where the high heat-generating components 4a and the low heat-generating components 4b are not formed, and is filled with the heat dissipation material 6 so that no gas is present between them. In other words, the upper surface of the substrate 4c is also thermally connected to the upper housing 1 via the heat dissipation material 6. However, the upper surface of the substrate 4c does not have to be covered with the heat dissipation material 6 as long as the side of at least one of the high heat-generating components 4a and the low heat-generating components 4b on the electronic component 4 faces the protrusion 7 via the heat dissipation material 6.

[0029] Furthermore, in the electronic component 4, the side surface of the substrate 4c is shown as being covered with the heat dissipation member 6 and therefore not facing the protrusion 7 via the heat dissipation member 6, but the side surface of the substrate 4c may also face the protrusion 7 via the heat dissipation member 6.

[0030] Furthermore, while Figure 3 shows a case where the inner surface side of the protrusion 7 is an approximately rectangular parallelepiped having flat surfaces, the inner surface side of the protrusion 7 may have a shape having multiple flat surfaces as shown in Figure 11 of the fourth embodiment described later, or may have a shape in which curved surfaces are formed on at least a portion of the inner surface, or may be formed only with curved surfaces.

[0031] At least a portion of the top surface of the electronic component 4 is thermally connected to the upper housing 1, and at least a portion of the side surface of the electronic component 4 faces the protrusion 7, thereby forming a thermal connection. Therefore, the heat dissipation material 6 filled inside the protrusion 7 is preferably a semi-curing adhesive material (grease). Because semi-curing adhesives have high adhesion, it is expected that the contact thermal resistance between the electronic component 4 and the protrusion 7 will be reduced, improving heat dissipation. Furthermore, by semi-curing, it is possible to prevent the heat dissipation material 6 from leaking to the circuit board 3, while also alleviating stress caused by vibration and heat.

[0032] In contrast, in the portion of the interior of the electronic control device 100 where the electronic components 4 are not mounted, the heat dissipation member 6 is not filled, and a space exists, as shown in FIG.

[0033] Next, specific results of a study on the side of the electronic component 4 facing the protrusion 7 via the heat dissipation member 6 will be described with reference to Fig. 5 and Fig. 6. Fig. 5 shows the results of an examination of the noise current reduction effect between the present invention and a comparative example, and Fig. 6 shows the results of an examination of the temperature rise reduction effect between the present invention and a comparative example.

[0034] The simulation used thermal resistance calculations to evaluate heat dissipation, and equivalent circuit simulations to evaluate electromagnetic compatibility. The specific conditions were: next-generation SiP, outer diameter of electronic component 4: 65 mm, chip size of high heat-generating component 4a: 25 mm, heat generation: 36 W, and TIM (Thermal Interface Material) thickness: 1.2 mm.

[0035] As a result, as shown in Fig. 5, in the structure described in Patent Document 1 above, in which the heat dissipation member 6 is formed only on the chip corresponding to the high heat-generating component 4a, the noise current at 100 [MHz] was 60 [dBμA] (comparison example in Fig. 5), whereas in the structure of this embodiment in which the heat dissipation member 6 is filled up to the side surface of the chip corresponding to the high heat-generating component 4a and faces the protrusion 7 via the heat dissipation member 6, the noise current at 100 [MHz] was 50 [dBμA], which was an improvement of 10 [dBμA]. Furthermore, although not shown, it was found that the noise current could be reduced by 35 [dBμA] in the structure described in Patent Document 1 above, compared to a structure without a structure corresponding to the protrusion.

[0036] Furthermore, as shown in FIG. 6, in the structure described in Patent Document 1 above, in which the heat dissipation member 6 is formed only on the chip corresponding to the high heat-generating component 4a, the temperature rise ΔT was 13.7°C (comparison example in FIG. 6), whereas in the structure of this embodiment in which the heat dissipation member 6 is filled up to the side of the chip corresponding to the high heat-generating component 4a and therefore faces the protrusion 7 via the heat dissipation member 6, the temperature rise ΔT was 8.6°C, which is a reduction of 5.1°C in the temperature rise amount. In other words, it was found that this structure has a great deal of room for further improvement of chips such as the high heat-generating component 4a.

[0037] Next, the effects of this embodiment will be described.

[0038] The electronic control device 100 of the first embodiment of the present invention described above comprises a circuit board 3 on which electronic components 4 are mounted, and an upper housing 1 and a lower housing 2 that house the circuit board 3, wherein the upper housing 1 has a protrusion 7 having a top surface facing the circuit board 3, at least a portion of the top surface of the electronic component 4 is thermally connected to the upper housing 1 via a heat dissipation member 6, and at least a portion of the side surface of the electronic component 4 faces the protrusion 7 via the heat dissipation member 6.

[0039] This allows the heat dissipation area of ​​the electronic component 4 to be increased compared to conventional structures, thereby further improving heat dissipation, and also allows a loop with little potential fluctuation to be formed between the end of the electronic component 4 and the side of the protrusion 7, thereby reducing radiation noise compared to conventional structures.

[0040] Furthermore, the heat dissipation member 6 is a semi-curing adhesive member, which has the effects of further improving heat dissipation, preventing contamination of the heat dissipation member 6, and alleviating stress in the soldered portions of the electronic components 4.

[0041] <Second embodiment> An electronic control device according to a second embodiment of the present invention will be described with reference to Figures 7 to 9. Figure 7 is a cross-sectional view of the electronic control device according to the second embodiment taken along line II in Figure 2, Figure 8 is a cross-sectional view of the electronic control device according to the second embodiment taken along line II-II in Figure 2, and Figure 9 is a cross-sectional view of an electronic control device according to a modified example of the second embodiment taken along line II in Figure 2.

[0042] 7 and 8, the electronic control device 100A of this embodiment has the protrusion 7 facing the ground section 5 provided on the circuit board 3 via the conductive member 8, thereby electrically connecting the protrusion 7 to the ground section 5 of the circuit board 3, thereby forming electrical continuity or capacitive coupling with the ground section 5 via the conductive member 8. As a result, the impedance from the protrusion 7 to the circuit board 3 is reduced, and the noise current path 11 is further reduced compared to the first embodiment, thereby making it possible to further reduce radiation noise.

[0043] The conductive member 8 is made of a gasket, a conductive adhesive, or the like.

[0044] Furthermore, in the electronic control device 100A1 shown in Figure 9, which is a modified example of this embodiment, the high heat-generating components 4a and the low heat-generating components 4b are thermally connected to the upper housing 1 and the lower housing 2 via the heat dissipation member 6, and the sides of the high heat-generating components 4a and the low heat-generating components 4b facing the protrusion 7 face the protrusion 7 via the heat dissipation member 6A1, as in Figures 3 and 7, but some of the low heat-generating components 4b (the low heat-generating component 4b on the far left in Figure 9) are not covered by the heat dissipation member 6A1.

[0045] The configuration shown in Figure 9 has the advantage that heat from the high heat-generating components 4a covered by the heat-dissipating member 6A1 is less likely to be transmitted to the low heat-generating components 4b that are not covered by the heat-dissipating member 6A1, allowing for a more flexible design.

[0046] In the structure of Figure 9, the protrusion 7 faces the ground portion 5 provided on the circuit board 3 via the conductive member 8, but it is also possible for the protrusion 7 to face the ground portion 5 provided on the circuit board 3 without the conductive member 8 in between, i.e., to have a configuration similar to that of the first embodiment.

[0047] The other configurations and operations are substantially the same as those of the electronic control device of the first embodiment described above, and details thereof will be omitted.

[0048] The electronic control device according to the second embodiment of the present invention also provides substantially the same effects as the electronic control device according to the first embodiment described above.

[0049] Furthermore, the protrusion 7 faces the ground portion 5 provided on the circuit board 3 via the conductive member 8, and by forming electrical continuity or capacitive coupling with the ground portion 5 via the conductive member 8, further reduction in radiation noise can be achieved.

[0050] <Third embodiment> An electronic control device according to a third embodiment of the present invention will be described with reference to Fig. 10. Fig. 10 is a cross-sectional view of the electronic control device according to the third embodiment taken along line II-II in Fig. 2.

[0051] 10, the protrusion 7B includes a box portion 7B1 that forms an opening toward the circuit board 3, and leg portions 7B2 that protrude from the box portion 7B1 toward the circuit board 3. The box portion 7B1 allows the heat dissipation material 6 to be applied to the side surface of the protrusion 7B without any leakage, thereby reliably improving heat dissipation performance, and the leg portions 7B2 create a gap between the electronic component 4 and the box portion 7B1, thereby enabling components to be densely mounted around the electronic component 4.

[0052] The other configurations and operations are substantially the same as those of the electronic control device of the second embodiment described above, and details thereof will be omitted.

[0053] The electronic control device according to the third embodiment of the present invention also provides substantially the same effects as the electronic control device according to the second embodiment described above.

[0054] Furthermore, the protrusion 7B includes a box portion 7B1 that forms an opening toward the circuit board 3, and a leg portion 7B2 that protrudes from the box portion 7B1 toward the circuit board 3, thereby achieving improved heat dissipation and high-density mounting.

[0055] In this embodiment, the protrusion 7B faces the ground portion 5 provided on the circuit board 3 via the conductive member 8, but it is also possible to use a configuration in which the protrusion 7B faces the ground portion 5 via a space without providing the conductive member 8 as in the first embodiment.

[0056] <Fourth embodiment> An electronic control device according to a fourth embodiment of the present invention will be described with reference to Fig. 11. Fig. 11 is a cross-sectional view of the electronic control device according to the fourth embodiment taken along line II in Fig. 2.

[0057] 11, the upper housing 1 has an uneven portion 7C1 on the surface facing the plurality of electronic components 4, and the distance of the uneven portion 7C1 from the circuit board 3 varies depending on the height of the electronic components 4 that the uneven portion 7C1 faces. By providing such uneven portion 7C1, the clearance of the heat dissipation member 6C between the electronic components 4 and the inside of the upper housing 1 can be adjusted, which minimizes the amount of heat dissipation member 6C applied and is expected to further improve heat dissipation.

[0058] The other configurations and operations are substantially the same as those of the electronic control device of the second embodiment described above, and details thereof will be omitted.

[0059] The electronic control device according to the fourth embodiment of the present invention also provides substantially the same effects as the electronic control device according to the second embodiment described above.

[0060] In addition, the upper housing 1 has an uneven portion 7C1 on the surface facing the multiple electronic components 4, and the distance of the uneven portion 7C1 from the circuit board 3 varies depending on the height of the electronic components 4 that the uneven portion 7C1 faces, thereby achieving the effect of minimizing the amount of heat dissipation material to be applied.

[0061] In this embodiment, too, the protrusion 7 faces the ground portion 5 provided on the circuit board 3 via the conductive member 8, but it is also possible to have a configuration in which the protrusion 7 faces the ground portion 5 via a space without providing the conductive member 8 as in the first embodiment, or a configuration in which the protrusion 7 is composed of a box portion and legs as in the third embodiment, regardless of whether the conductive member 8 is provided or not.

[0062] <Fifth embodiment> An electronic control device according to a fifth embodiment of the present invention will be described with reference to Fig. 12. Fig. 12 is a cross-sectional view of the electronic control device according to the fifth embodiment taken along line II in Fig. 2.

[0063] In the electronic control device 100D of this embodiment shown in Figure 12, the protrusion portion 7D is provided separately from the upper housing 1, and is thermally connected to the upper housing 1 via a heat dissipation member 6D, and is also thermally connected to the electronic component 4 via a heat dissipation member 6.

[0064] In this case, the design freedom of the protrusion 7D is improved. That is, the shape can be selected more freely than when the protrusion 7D is formed integrally with the upper housing 1. Similarly, the material of the protrusion 7D can be freely selected from a material different from that of the upper housing 1, such as aluminum or copper. This makes it possible to further improve heat dissipation and further reduce radiation noise by increasing the thickness of the shape.

[0065] The other configurations and operations are substantially the same as those of the electronic control device of the first embodiment described above, and details thereof will be omitted.

[0066] The electronic control device according to the fifth embodiment of the present invention also provides substantially the same effects as the electronic control device according to the first embodiment described above.

[0067] Furthermore, the protrusion 7D is provided separately from the upper housing 1 and is thermally connected to the upper housing 1 via the heat dissipation member 6, thereby increasing design freedom and enabling further improvement in heat dissipation and reduction in radiated noise.

[0068] In this embodiment, too, it is possible to have a configuration in which the protrusion portion 7D faces the ground portion 5 via a space without providing the conductive member 8 as in the first embodiment, and it is also possible to combine a configuration like the third or fourth embodiment regardless of whether or not the conductive member 8 is provided.

[0069] Sixth Embodiment An electronic control device according to a sixth embodiment of the present invention will be described with reference to Fig. 13. Fig. 13 is a cross-sectional view of the electronic control device according to the sixth embodiment taken along line II in Fig. 2.

[0070] 13, like the protrusion 7D of the electronic control device 100D shown in the fifth embodiment, the protrusion 7E is provided separately from the upper housing 1 and is thermally connected to the upper housing 1 via the heat dissipation member 6E1. In addition, at least a part of the top surface of the protrusion 7E facing the circuit board 3 is provided with a folded portion 7E1 extending in the direction in which the electronic component 4 is located. The folded portion 7E1 increases the contact area with the conductive member 8, further reducing radiation noise and more reliably preventing the heat dissipation member 6E from leaking toward the circuit board 3.

[0071] The other configurations and operations are substantially the same as those of the electronic control device of the fifth embodiment described above, and details thereof will be omitted.

[0072] The electronic control device according to the sixth embodiment of the present invention also provides substantially the same effects as the electronic control device according to the fifth embodiment described above.

[0073] Furthermore, at least a portion of the top surface of the protrusion 7E facing the circuit board 3 is provided with a folded portion 7E1 extending in the direction in which the electronic component 4 is located, thereby further reducing radiation noise and further preventing contamination of the heat dissipation member 6.

[0074] In this embodiment, too, it is possible to have a configuration in which the protrusion portion 7E faces the ground portion 5 via a space without providing the conductive member 8 as in the first embodiment, and it is possible to combine one or more of the configurations of any one of the third to fifth embodiments regardless of whether or not the conductive member 8 is provided.

[0075] Seventh Embodiment An electronic control device according to a seventh embodiment of the present invention will be described with reference to Fig. 14. Fig. 14 is a perspective view of the top surface of the housing of the electronic control device according to the seventh embodiment.

[0076] 14, the protrusion 7 forms a rectangular opening facing the circuit board 3, and the four corners of the opening face the ground portion 5 via the conductive members 8F. This reduces radiation noise without interfering with the surface wiring from the electronic components 4, and enables higher-density mounting.

[0077] Although the case where the four corners of the opening face the ground portion 5 via the conductive member 8F is shown as an example, and four corners are very suitable from the viewpoint of stability, the number of corners is not limited to four, and one or more points are sufficient. Furthermore, even if one point is provided, it does not have to be a corner.

[0078] The other configurations and operations are substantially the same as those of the electronic control device of the second embodiment described above, and details thereof will be omitted.

[0079] The electronic control device according to the seventh embodiment of the present invention also provides substantially the same effects as the electronic control device according to the second embodiment described above.

[0080] Furthermore, the protrusion 7 forms a rectangular opening facing the circuit board 3, and the four corners of the opening face the ground portion 5 via conductive members 8, thereby reducing radiation noise and achieving even higher density mounting.

[0081] In this embodiment, too, one or more of the configurations of the third to sixth embodiments can be combined.

[0082] Eighth Embodiment An electronic control device according to an eighth embodiment of the present invention will be described with reference to Fig. 15. Fig. 15 is a perspective view of the top surface of the housing of the electronic control device according to the eighth embodiment.

[0083] 15, in the electronic control device 100G of this embodiment, the protrusion 7 forms a rectangular opening facing the circuit board 3, and the four sides of the opening face the ground portion 5 via conductive members 8G. By disposing the conductive members 8G around the entire periphery of the electronic component 4 in this manner, the shielding effect is further enhanced, and radiation noise can be significantly reduced.

[0084] The other configurations and operations are substantially the same as those of the electronic control device of the second embodiment described above, and details thereof will be omitted.

[0085] The electronic control device according to the eighth embodiment of the present invention also provides substantially the same effects as the electronic control device according to the second embodiment described above.

[0086] In addition, the protrusion 7 forms a rectangular opening facing the circuit board 3, and by facing the ground portion 5 on all four sides of the opening via the conductive members 8, a significant reduction in radiation noise can be achieved.

[0087] In this embodiment, too, one or more of the configurations of the third to sixth embodiments can be combined.

[0088] <Ninth embodiment> An electronic control device according to a ninth embodiment of the present invention will be described with reference to Fig. 16 and Fig. 17. Fig. 16 is a perspective view of the top surface of the housing of the electronic control device according to the ninth embodiment, and Fig. 17 is a cross-sectional view of the electronic control device according to the ninth embodiment taken along line II in Fig. 2.

[0089] 16 and 17, in the electronic control device 100H of this embodiment, the protrusions 7H are separate from the upper housing 1 and are thermally connected to it by the heat dissipation member 6H1. The heat dissipation member 6H is provided on the electronic components 4, particularly on the high heat-generating component 4a1, and the protrusions 7H and conductive members 8H are provided around the electronic components 4 in accordance with the position of the heat dissipation member 6H. As a result, the heat dissipation member 6H is applied to the high heat-generating component 4a1, improving heat dissipation, and the arrangement of the protrusions 7H and conductive members 8H more reliably prevents the heat dissipation member 6H from leaking toward the circuit board 3.

[0090] Furthermore, the top surfaces of the protrusions 7H that face the side surfaces of the high heat-generating components 4a and the low heat-generating components 4b are provided with folded portions 7H1 that extend in the direction of the high heat-generating components 4a and the low heat-generating components 4b. This increases the contact area with the conductive member 8H, further reducing radiation noise, and the folded portions 7H1 more reliably prevent the heat dissipation member 6H from leaking out toward the circuit board 3.

[0091] The other configurations and operations are substantially the same as those of the electronic control device of the first embodiment described above, and details thereof will be omitted.

[0092] The electronic control device according to the ninth embodiment of the present invention also provides substantially the same effects as the electronic control device according to the first embodiment described above.

[0093] Furthermore, the top surface of the protrusion 7 facing the side surfaces of the high heat generating components 4a and the low heat generating components 4b is provided with a folded portion 7H1 extending in the direction in which the high heat generating components 4a and the low heat generating components 4b are located, thereby further reducing radiation noise and reliably preventing contamination of the heat dissipation member 6H.

[0094] In this embodiment, too, the protrusion 7H may be integral with the upper housing 1 rather than being separate from it, and the protrusion 7H may face the ground portion 5 via a space without providing a conductive member 8H as in the first embodiment, and any one or more of the configurations of the third to eighth embodiments may be combined regardless of whether or not the conductive member 8H is provided.

[0095] <Tenth embodiment> An electronic control device according to a tenth embodiment of the present invention will be described with reference to Fig. 18. Fig. 18 is a cross-sectional view of the electronic control device according to the tenth embodiment taken along line II in Fig. 2.

[0096] 18, in addition to the protrusions 7, the upper housing 1 is provided with heat dissipation member partitioning protrusions 7I that protrude from the surface facing the electronic components 4 toward the circuit board 3, and the heat dissipation member 6I is filled into the space defined by the protrusions 7 and the heat dissipation member partitioning protrusions 7I, which includes the high heat generation components 4a and the low heat generation components 4b. In this way, by providing the heat dissipation member partitioning protrusions 7I, it is possible to prevent heat conduction from the high heat generation components 4a to other components and also to minimize the amount of heat dissipation member 6I applied, thereby improving heat dissipation.

[0097] The other configurations and operations are substantially the same as those of the electronic control device of the first embodiment described above, and details thereof will be omitted.

[0098] The electronic control device according to the tenth embodiment of the present invention also provides substantially the same effects as the electronic control device according to the first embodiment described above.

[0099] In addition, the upper housing 1 is provided with a heat dissipation member partitioning protrusion 7I that protrudes from the surface facing the electronic components 4 toward the circuit board 3, and the heat dissipation member 6 is filled into the space partitioned by the protrusion 7 and the heat dissipation member partitioning protrusion 7I, which contains the high heat generation components 4a and the low heat generation components 4b, thereby improving heat dissipation, further reducing radiation noise, and preventing heat conduction from the high heat generation components 4a to other components.

[0100] In this embodiment, too, a conductive member 8 can be provided as in the second embodiment so that the heat dissipation member partitioning protrusion 7I faces the ground portion 5 via a space, and any one or more of the configurations of the third to ninth embodiments can be combined regardless of whether or not the conductive member 8 is provided.

[0101] <Eleventh embodiment> An electronic control device according to an eleventh embodiment of the present invention will be described with reference to Fig. 19. Fig. 19 is a cross-sectional view of the electronic control device according to the eleventh embodiment taken along line II in Fig. 2.

[0102] In the electronic control device 100J of this embodiment shown in Figure 19, the protrusions 7J and housing fins 9J are provided separately from the upper housing 1J and are physically connected to the upper housing 1J with screws or the like. Note that the protrusions 7J and housing fins 9J do not need to be physically connected to the upper housing 1J, and may be electrically connected with a conductive member such as a gasket. This improves ease of manufacturing, improves heat dissipation, reduces radiated noise, and prevents heat conduction from the high heat-generating component 4a to other components.

[0103] The other configurations and operations are substantially the same as those of the electronic control device of the first embodiment described above, and details thereof will be omitted.

[0104] The electronic control device according to the eleventh embodiment of the present invention also provides substantially the same effects as the electronic control device according to the first embodiment described above.

[0105] In this embodiment, too, it is possible to have a configuration in which the protrusion portion 7J faces the ground portion 5 via a space without providing the conductive member 8 as in the first embodiment, and it is possible to combine one or more of the configurations of any one of the third to tenth embodiments regardless of whether or not the conductive member 8 is provided.

[0106] <Twelfth embodiment> An electronic control device according to a twelfth embodiment of the present invention will be described with reference to Fig. 20. Fig. 20 is a cross-sectional view of the electronic control device according to the twelfth embodiment taken along line II in Fig. 2.

[0107] 20, the protrusions 7K are provided separately from the upper housing 1K, and the housing fins 9K are also provided separately from the upper housing 1K, and the housing fins 9K and the protrusions 7K are thermally connected via the heat dissipation member 6K1. By providing the housing fins 9K and the protrusions 7K separately in this way, ease of manufacturing is improved.

[0108] The other configurations and operations are substantially the same as those of the electronic control device of the eleventh embodiment described above, and details thereof will be omitted.

[0109] The electronic control device according to the twelfth embodiment of the present invention also provides substantially the same effects as the electronic control device according to the eleventh embodiment described above.

[0110] In this embodiment, too, it is possible to have a configuration in which the protrusion portion 7K faces the ground portion 5 via a space without providing the conductive member 8 as in the first embodiment, and it is possible to combine one or more of the configurations of any one of the third to tenth embodiments regardless of whether or not the conductive member 8 is provided.

[0111] <Thirteenth embodiment> An electronic control device according to a thirteenth embodiment of the present invention will be described with reference to Fig. 21. Fig. 21 is a cross-sectional view of the electronic control device according to the thirteenth embodiment taken along line II in Fig. 2.

[0112] 21, the electronic control device 100L of this embodiment has protrusions 7L provided separately from the upper housing 1L, and housing fins 9L are also provided separately from the upper housing 1L, with the housing fins 9L and protrusions 7L thermally connected via a heat dissipation member 6L1. In this way, the ease of manufacturing is improved by providing the housing fins 9L and protrusions 7L separately, and the heat dissipation performance and radiation noise reduction performance are improved by filling the housing with the heat dissipation member 6L1.

[0113] The other configurations and operations are substantially the same as those of the electronic control device of the first embodiment described above, and details thereof will be omitted.

[0114] The electronic control device according to the thirteenth embodiment of the present invention also provides substantially the same effects as the electronic control device according to the first embodiment described above.

[0115] In this embodiment, too, it is possible to have a configuration in which the protrusion portion 7L faces the ground portion 5 via a space without providing the conductive member 8 as in the first embodiment, and it is possible to combine one or more of the configurations of any one of the third to tenth embodiments regardless of whether or not the conductive member 8 is provided.

[0116] <Other> It should be noted that the present invention is not limited to the above-described embodiment, and includes various modifications. The above-described embodiment has been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to an embodiment having all of the described configurations.

[0117] It is also possible to replace part of the configuration of one embodiment with the configuration of another embodiment, or to add the configuration of another embodiment to the configuration of one embodiment, or to add, delete, or replace part of the configuration of each embodiment with the configuration of another embodiment. [Explanation of symbols]

[0118] 1, 1J, 1K, 1L...Upper housing (housing) 2...Lower housing (housing) 3...Circuit board 4...Electronic components 4a, 4a1...High heat generating parts (heat generating parts) 4b...Low heat generating parts (heat generating parts) 4c...Board 5...Ground section 6, 6A1, 6C, 6D, 6E, 6E1, 6H, 6H1, 6I, 6K, 6K1, 6L, 6L1...heat dissipation members 7,7B,7D,7E,7H,7J,7K,7L……Protrusion 7B1…Hakobe 7B2…legs 7C1…Uneven part (uneven surface) 7E1, 7H1...Folded section 7I... Heat dissipation member partition protrusion 8, 8F, 8G, 8H...Conductive materials 9, 9J, 9K, 9L...Housing fins 10...Connector 11...Noise current path 100, 100A, 100A1, 100B, 100C, 100D, 100E, 100F, 100G, 100H, 100I, 100J, 100K, 100L...Electronic control device

Claims

1. a circuit board on which electronic components are mounted; a housing that houses the circuit board, the housing has a protrusion having a top surface facing the circuit board, At least a part of an upper surface of the electronic component is thermally connected to the housing via a heat dissipation member, At least a portion of a side surface of the electronic component faces the protrusion via the heat dissipation member.

2. 2. The electronic control device according to claim 1, An electronic control device wherein the protrusion faces a ground portion provided on the circuit board via a conductive member, and forms electrical continuity or capacitive coupling with the ground portion via the conductive member.

3. 2. The electronic control device according to claim 1, The protrusion includes a box portion that forms an opening toward the circuit board, and a leg portion that protrudes from the box portion toward the circuit board.

4. 3. The electronic control device according to claim 2, The protrusion has a rectangular opening facing the circuit board, and four corners of the opening face the ground portion via the conductive member.

5. 3. The electronic control device according to claim 2, The protrusion has a rectangular opening facing the circuit board, and four sides of the opening face the ground portion via the conductive member.

6. 2. The electronic control device according to claim 1, the housing has an uneven surface on a surface facing the plurality of electronic components, An electronic control device, wherein the distance from the uneven surface to the circuit board varies depending on the height of the electronic component that the uneven surface faces.

7. 2. The electronic control device according to claim 1, The protrusion is provided separately from the housing and is thermally connected to the housing via the heat dissipation member.

8. 8. The electronic control device according to claim 7, An electronic control device, wherein a folded portion extending in a direction in which the electronic component is located is provided on at least a part of the top surface of the protrusion that faces the circuit board.

9. 2. The electronic control device according to claim 1, the electronic component includes a heat-generating component, the heat-generating component is thermally connected to the housing via the heat dissipation member, The side surface of the heat-generating component facing the protrusion faces the protrusion via the heat dissipation member.

10. 10. The electronic control device according to claim 9, An electronic control device, wherein a folded portion extending in a direction toward the heat-generating component is provided on a top surface of the protrusion that faces a side surface of the heat-generating component.

11. 2. The electronic control device according to claim 1, The electronic control device, wherein the heat dissipation member is a semi-hardening adhesive member.

12. 2. The electronic control device according to claim 1, the housing is provided with a heat dissipation member dividing protrusion that protrudes from a surface facing the electronic components toward the circuit board, The heat dissipation member is filled into a space that contains a heat-generating component, out of the space defined by the protrusion and the heat dissipation member defining protrusion.

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