Compression-cooled fiber laser

Abstract

The compression-cooled fiber laser includes a housing, an optical part, a laser cooling device, a laser driving part, and an optoelectronic interface part. The structure and relative position of the fiber laser and the compression cooling device in the laser housing are reasonably arranged to ensure that the heat of the laser is quickly removed and does not destroy the stability of the laser.

Description

[Technical field]

[0001] The present invention relates to a compression-cooled fiber laser, and to controlling the temperature of a pump light source in a machine box by compression cooling. [Background technology]

[0002] The use of high-power lasers is highly dependent on the cooling mechanism. Conventional laser cooling is often performed using a water-cooling mechanism, which is huge and requires strict installation conditions, which is disadvantageous for outdoor mobile welding.

[0003] At present, some lasers use air-cooling mechanisms to dissipate heat, but most use fans to directly dissipate heat from heat sources or heat-sunk fins. For example, in CN2114287U, the optical equipment is a relatively precise instrument, so the air flow directly flows near the optical equipment, which is likely to affect the optical equipment nearby, resulting in the deterioration of some indicators and affecting the reliability of the equipment. Prior art has adopted air-cooled heat-dissipating fiber lasers that use compression refrigeration, for example, CN1032799A discloses a structure that uses compressor refrigeration and heating cycles to keep the laser at a constant temperature, and document CN203071389U discloses a small laser device that uses frequency conversion compressor compression refrigeration, but both only use the principle of simple frequency conversion compression, and do not optimize the structure based on the characteristics of fiber lasers and the principle of compression cooling. The structure of the cooling system is complex and unreasonable, the heat removal ability is relatively poor, which affects the cooling performance of the entire system, the output power is small, and the air path separation effect is poor, which affects the stability of the device. Summary of the Invention [Means for solving the problem]

[0004] In response to the deficiencies of the prior art, the present invention provides a compression-cooled fiber laser, which overcomes the deficiencies of the prior art and is rational in design.

[0005] In order to achieve the above objectives, the present invention is realized by the following technical solutions: The compression-cooled fiber laser of the present invention includes a laser body, which includes a laser housing, in which an optical section of the fiber laser, a laser cooling device, a laser driving section, and an optoelectronic interface section are provided.

[0006] The optical section is used for launching an optical fiber laser signal, and includes a pump laser unit, an amplifying optical fiber section, a temperature control board, an optical section driver, and preferably further includes an N+1 forward and reverse optical fiber coupler.

[0007] The pump laser unit is one or more semiconductor lasers, preferably a semiconductor laser is used to provide a 976 nm pump laser absorbed in the amplification chamber over a certain temperature range.

[0008] The amplifying optical fiber section is divided into a dopant amplifying optical fiber and a first grating and a second grating located at both ends of the dopant amplifying optical fiber.

[0009] The temperature control plate is a cold plate, the semiconductor laser and / or the amplifying optical fiber part is attached to the cold plate, and the cold plate is a cold plate with buried piping, which is a one-sided piping (copper) buried cold plate or a two-sided piping (copper) buried cold plate (the cold plate functions as an evaporator during cooling).

[0010] The N+1 forward and backward optical fiber coupler is used to couple the pump light combined beam emitted from the pump laser unit into the amplifying optical fiber section.

[0011] Preferably, the pump laser unit, the amplifying optical fiber section, and the N+1 forward and reverse optical fiber coupler of the optical section are all integrally mounted on the cold plate of the temperature control board, and the cold plate is a flat structure with the cold plate coolant (copper) piping embedded therein.

[0012] The laser cooling device is composed of a (frequency conversion) compressor, a condenser, a refrigerant piping, an expansion valve, and a (frequency conversion) fan (and may further include an electromagnetic four-way valve and a refrigerant storage tank), and is a phase change type frequency conversion compression temperature control system for providing temperature cooling with a large temperature difference to a semiconductor laser, where the cold plate refrigerant piping is connected to the refrigerant piping of the laser cooling device and is used for the circulation and flow of refrigerant, the frequency conversion compressor is connected to the condenser and the cold plate refrigerant piping via the refrigerant piping, and a coolant is contained in the refrigerant piping and the cold plate refrigerant piping.

[0013] Preferably, the laser cooling apparatus further includes a dry filter, said dry filter being provided between said condenser and the thermal expansion valve.

[0014] Preferably, the condenser employs an aluminum parallel-flow heat exchanger.

[0015] The laser driver is used to drive the laser cooling device and the optical system.

[0016] The photoelectric interface unit is used for photoelectrically connecting the laser body with the outside, and includes a device power input interface, a security lock interface, a control signal input interface and an output optical cable interface.

[0017] The equipment power input interface is used for external power supply, the security lock interface is used for laser safety interlock, and the control signal input interface is used for inputting external control signals.

[0018] The housing is a substantially rectangular housing and is surrounded by a front cabinet plate, a rear cabinet plate, an upper cabinet plate, a lower cabinet plate, a left cabinet plate, and a right cabinet plate.

[0019] The housing has an upper cabinet plate and a lower cabinet plate corresponding to the upper cabinet plate, and between the upper cabinet plate and the lower cabinet plate are four side plates connected in order, namely a first side plate (i.e., the left cabinet plate), a second side plate (i.e., the front cabinet plate), a third side plate (i.e., the right cabinet plate), and a fourth side plate (i.e., the rear cabinet plate), with the first side plate facing the third side plate (i.e. the left cabinet plate facing the right cabinet plate) and the second side plate facing the fourth side plate (i.e. the front cabinet plate facing the rear cabinet plate).

[0020] The area of ​​the first side plate is larger than the area of ​​the second side plate, the area of ​​the first side plate is larger than the area of ​​the fourth side plate, the area of ​​the third side plate is larger than the area of ​​the second side plate, and the area of ​​the third side plate is larger than the area of ​​the fourth side plate.

[0021] The upper cabinet plate and the lower cabinet plate are respectively provided with a first ventilation hole and a second ventilation hole, and a flow path of air from bottom to top is formed between the two ventilation holes. Preferably, the upper cabinet plate is provided with a first fan group, and the lower cabinet plate is provided with a second fan group, and optionally, only the first fan group on the upper cabinet plate or only the second fan group on the lower cabinet plate can be installed. When air is heated, it usually tends to rise, so in order to prevent turbulence of the airflow and accelerate the outflow of heat, the rotation direction of the fan is set to accelerate the inflow of air from the ventilation hole at the bottom of the laser housing and the outflow of air from the ventilation hole at the top of the laser housing.

[0022] The cold plate is a flat structure having four sides, a first cold plate surface on which the semiconductor laser is mounted, and a second cold plate surface opposite the first cold plate surface, the cold plate being mounted vertically on one interior side of the laser housing.

[0023] The housing has an interior space between the upper cabinet and the lower cabinet (i.e., the space surrounded by the six panels of the housing), which is divided into a first interior space adjacent to the first side panel and a second interior space adjacent to the third side panel.

[0024] The first ventilation hole is located in the upper cabinet plate at a portion corresponding to the second internal space, and the second ventilation hole is located in the lower cabinet plate at a portion corresponding to the second internal space.

[0025] An optical part including a cold plate is mounted within the first internal space, the cold plate is substantially parallel to the first side plate (i.e., the left cabinet plate), a first cold plate surface of the cold plate faces toward the inside of the first side plate (i.e., the left cabinet plate) of the housing, a second cold plate surface of the cold plate faces toward a third side plate of the housing, and the second cold plate surface of the cold plate forms a dividing surface between the first internal space and the second internal space.

[0026] The four peripheral side edges of the cold plate are in contact with the upper cabinet plate, the lower cabinet plate, the second side plate and the fourth side plate of the housing respectively, the cold plate and the housing together enclose and form a sealable first internal space, and the second cold plate surface of the cold plate forms a dividing surface for the complete first internal space and the second internal space, completely dividing the first internal space and the second internal space, and preventing the air flowing between the first ventilation hole and the second ventilation hole from passing through the first internal space and avoiding affecting the optical part.

[0027] A cold plate heat dissipation fin protrusion structure is preferably disposed on the side (second cold plate surface) of the cold plate facing the second space. Preferably, the cold plate heat dissipation fin protrusion structure has a plurality of fin protrusions extending along a vertical direction, and vertical grooves extending along the vertical direction are formed between the plurality of fin protrusions.

[0028] The laser cooling device is mounted within the second internal space, i.e., devices such as a compressor, a condenser, refrigerant piping, an expansion valve, a fan (in some embodiments further including an electromagnetic four-way valve and a refrigerant storage tank) are installed within the second internal space, where the condenser is located on the upper side of the second internal space (to facilitate heat removal), the condenser includes a condensing fin device with the refrigerant piping embedded therein, and the condensing fin device is located between the compressor device and the first vent.

[0029] The condensation fin device is attached to the underside of the first ventilation hole of the upper cabinet plate, and the condensation fin device has a plurality of gaps between the fins, and the plurality of gaps form an air passage from bottom to top so that the air flow passage is not blocked by the condensation fin device.

[0030] The first vent is located on an upper side of the second internal space, and the second vent is located on a lower side of the second internal space.

[0031] Preferably, the first fan group is located below the condensation fin group and above the compressor, i.e., between the condensation fin group and the compressor; of course, the first fan group may also be located below the first air vent and above the condensation fin group, i.e., between the first air vent and the condenser, so as to make the airflow in the passage more stable.

[0032] Preferably, the second fan group is located between the compressor and the second vent.

[0033] The second side plate of the housing has an optoelectronic interface mounting area adjacent to the first side plate and a heat dissipation surface area adjacent to the third side plate, and the optoelectronic interface mounting area is used for mounting at least a part or all of the interfaces of the optoelectronic interface unit.

[0034] The photoelectric interface mounting area of ​​the second side panel corresponds to a side surface of the first internal space, and has optical components such as a pump light source and an amplifying optical fiber within the first internal space. Therefore, by mounting the photoelectric interface to the photoelectric interface mounting area adjacent to the first side panel, the optical components located in the first internal space can be directly connected, and a long and complicated photoelectric path inside can be avoided.

[0035] The heat dissipation surface area of ​​the second side panel corresponds to a side surface of the second internal space, and since a cooling device is installed in the second internal space and an air cooling passage is formed, the heat dissipation surface area of ​​the second side panel is provided with a surface structure for enhancing heat dissipation, so that the heat dissipation of the device can be enhanced. The heat dissipation surface area is provided with a plurality of heat dissipation protrusions, and preferably, the heat dissipation protrusions may be provided on the heat dissipation surface area and on a side facing the outside of the housing and / or a side facing the inside of the housing.

[0036] Similarly, it is preferable that the fourth side plate of the housing is provided in the same manner as the second side plate.

[0037] The fourth side plate has an optoelectronic interface mounting area adjacent to the first side plate and a heat dissipation surface area adjacent to the third side plate, and the optoelectronic interface mounting area is used for mounting at least a part or all of the interfaces of the optoelectronic interface unit.

[0038] The photoelectric interface mounting area of ​​the fourth side panel corresponds to a side surface of the first internal space, and has optical components such as a pump light source and an amplifying optical fiber within the first internal space. Therefore, by mounting the photoelectric interface to the photoelectric interface mounting area adjacent to the first side panel, the optical components located in the first internal space can be directly connected, and a long and complicated photoelectric path inside can be avoided.

[0039] The heat dissipating surface area of ​​the fourth side panel corresponds to a side surface of the second internal space, and since a cooling device is installed in the second internal space and an air cooling passage is formed, the heat dissipating surface area of ​​the fourth side panel is provided with a surface structure for enhancing heat dissipation, so that the heat dissipation of the device can be enhanced. The heat dissipating surface area is provided with a plurality of heat dissipating protrusions, and preferably, the heat dissipating protrusions may be provided on the heat dissipating surface area and on a side facing the outside of the housing and / or a side facing the inside of the housing.

[0040] In some embodiments, the third side panel of the housing has a protruding structure on a surface facing outward from the housing and / or on a surface facing inward from the housing to enhance heat dissipation.

[0041] Preferably, the cabinet has a dimension of 650mm×300mm×570mm. Preferably, the lower cabinet plate of the cabinet has four corners each equipped with a universal wheel. The housing adopts an aluminum profile structure, which is convenient for assembly and disassembly, and ensures heat dissipation while saving cabinet space. Preferably, the compression-cooled fiber laser is used in a portable handheld fiber welder. Effect of the Invention

[0042] The present invention provides a compression-cooled fiber laser, and its reasonable structure constitutes the structure of the fiber laser and the compression-cooling device, so that the heat of the laser can be removed quickly and does not destroy the stability of the laser. The pump light source of the fiber laser, the optical fiber coupler, and the entire amplifying optical fiber are integrated into the cold plate, making the laser more integrated and easier to cool. The pump laser is distributed on a large-area cold plate, and the heat transfer is faster. The side of the cold plate is attached to the side of the laser housing, and the cooling device is attached to the opposite side of the housing, and the refrigerant in the cold plate with buried piping is used to quickly remove heat, and the heat is brought to the condenser through the compressor. By configuring an air passage from bottom to top, the air naturally rises when it receives heat, and the fan is set to accelerate the inflow of air from bottom to top, or to blow out the heat with the fan. The cold plate separates the first internal space of the optical part and the second internal space of the cooling device, and divides the optical device space and the heat dissipation space, so that the condenser can rapidly dissipate heat without affecting the laser. At the same time, the wind flows over the second cold plate surface of the cold plate, so that the second cold plate surface of the cold plate can also dissipate heat, and the surface area of ​​heat dissipation is also increased. That is, under the same air duct, the heat conduction heat dissipation structure using refrigerant and the heat dissipation area on the surface of the second cold plate simultaneously remove heat through the same high-speed airflow, realizing double high-efficiency heat dissipation (the condensation fin group on the forward path of the air duct and the heat conduction heat dissipation of the second cold plate surface on the side direction of the air duct), while at the same time not complicating the layout inside the machine box (the entire large-volume air duct is more efficient and less noisy than multiple individual air ducts); at the same time, the interface mounting area and the heat dissipation area are divided on the second or fourth side of the housing, which increases the heat dissipation capacity of the housing and at the same time makes the photoelectric connection more direct, reducing the complexity of the photoelectric connection and possible optical attenuation. [Brief description of the drawings]

[0043] In order to more clearly describe the technical aspects of the present invention or the prior art, the following briefly describes the drawings which need to be used in the description of the prior art. [Figure 1] 1 is a schematic diagram of a laser according to the present invention; [Diagram 2]13 is a schematic diagram of the layout inside the housing as viewed from outside the housing toward the fourth side plate (or the second side plate). FIG. [Diagram 3] FIG. 2 is a schematic diagram of a laser air path according to the present invention. [Figure 4] FIG. 1 is a schematic diagram of a second side plate (or a fourth side plate) according to the present invention. [Diagram 5] FIG. 3 is an enlarged view of the cold plate in FIG. 2. [Figure 6] Schematic diagram of the refrigerant piping connection method in Figure 2. [Figure 7] FIG. 1 is a schematic diagram of a layout viewed from above (or below) the housing. [Figure 8] FIG. 4 is a schematic diagram of the heat dissipation structure of the second cold plate surface of the cold plate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0044] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention are clearly and completely described below in combination with the drawings of the present invention.

[0045] As shown in FIG. 1, the compression-cooled fiber laser of the present invention includes a laser body, which includes a laser housing, in which an optical section of the fiber laser, a laser cooling device, a laser driving section, and an optoelectronic interface section are provided.

[0046] The optical section is used to launch an optical fiber laser signal and includes a pump laser unit 101, an amplifying optical fiber section 102, a temperature control plate 103, an optical section driver, and in some embodiments further includes an N+1 forward and reverse optical fiber coupler.

[0047] The pump laser unit 101 is one or more semiconductor lasers, and in some embodiments, a semiconductor laser is used to provide a 976 nm pump laser absorbed in the amplification chamber over a certain temperature range.

[0048] The amplifying optical fiber section 102 is divided into a dopant amplifying optical fiber and a first grating and a second grating located at both ends of the dopant amplifying optical fiber.

[0049] The temperature control plate 103 is a cold plate, and the semiconductor laser and / or amplifying optical fiber part is attached to the cold plate, and the cold plate is a cold plate with buried piping, and is a one-sided piping (copper) buried cold plate or a two-sided piping (copper) buried cold plate (the cold plate functions as an evaporator during cooling).

[0050] The N+1 forward and backward optical fiber coupler is used to couple the pump light combined beam emitted from the pump laser unit into the amplifying optical fiber section.

[0051] In some embodiments, the pump laser unit 101, the amplifying optical fiber section 102, and the N+1 forward and reverse optical fiber coupler of the optical section are all integrally mounted on the cold plate 103 of the temperature control board, which is a flat structure with the cold plate coolant (copper) piping 1031 embedded in it.

[0052] The laser cooling device is composed of a (frequency conversion) compressor, a condenser, a refrigerant piping, an expansion valve, and a (frequency conversion) fan (and may further include an electromagnetic four-way valve and a refrigerant storage tank), and is a phase change type frequency conversion compression temperature control system for providing temperature cooling with a large temperature difference to a semiconductor laser, where the cold plate refrigerant piping 1031 is connected to the refrigerant piping of the laser cooling device and is used for the circulation and flow of refrigerant, the frequency conversion compressor is connected to the condenser and the cold plate refrigerant piping 1031 via the refrigerant piping, and a coolant is contained in the refrigerant piping and the cold plate refrigerant piping 1031.

[0053] In some embodiments, the laser cooling apparatus further comprises a dry filter, said dry filter being disposed between said condenser and the thermal expansion valve.

[0054] In some embodiments, the condenser employs an aluminum parallel-flow heat exchanger.

[0055] The laser driver is used to drive the laser cooling device and the optical system.

[0056] The photoelectric interface unit is used for photoelectrically connecting the laser body with the outside, and includes a device power input interface, a security lock interface, a control signal input interface and an output optical cable interface.

[0057] The equipment power input interface 4 is used for external power supply, the security lock interface 5 is used for laser safety interlock, and the control signal input interface 6 is used for inputting external control signals.

[0058] Referring to FIG. 1, the housing is a substantially rectangular housing, and is surrounded by a front cabinet plate, a rear cabinet plate, an upper cabinet plate, a lower cabinet plate, a left cabinet plate, and a right cabinet plate.

[0059] The housing has an upper cabinet plate 1011 and a lower cabinet plate 1012 that corresponds to the upper cabinet plate 1011, and between the upper cabinet plate and the lower cabinet plate are four side plates connected in sequence: a first side plate 1013 (i.e. the left cabinet plate), a second side plate 1014 (i.e. the front cabinet plate), a third side plate 1015 (i.e. the right cabinet plate), and a fourth side plate 1016 (i.e. the rear cabinet plate), with the first side plate 1013 facing the third side plate 1015 (i.e. the left cabinet plate facing the right cabinet plate) and the second side plate 1014 facing the fourth side plate 1016 (i.e. the front cabinet plate facing the rear cabinet plate).

[0060] The area of ​​the first side plate is larger than the area of ​​the second side plate, the area of ​​the first side plate is larger than the area of ​​the fourth side plate, the area of ​​the third side plate is larger than the area of ​​the second side plate, and the area of ​​the third side plate is larger than the area of ​​the fourth side plate.

[0061] The upper cabinet plate 1011 and the lower cabinet plate 1012 are provided with a first ventilation hole and a second ventilation hole, respectively, and a flow path of air from bottom to top is formed between the two ventilation holes. In some embodiments, the upper cabinet plate 1011 is provided with a first fan group, and the lower cabinet plate 1012 is provided with a second fan group, and optionally, only the first fan group on the upper cabinet plate or only the second fan group on the lower cabinet plate can be installed. When air is heated, it usually tends to rise, so in order to prevent turbulence of the airflow and accelerate the outflow of heat, the rotation direction of the fan is set to accelerate the inflow of air from the ventilation hole at the bottom of the laser housing and the outflow of air from the ventilation hole at the top of the laser housing, as shown in FIG. 3.

[0062] The cold plate is a flat structure having four sides, a first cold plate surface on which the semiconductor laser is mounted, and a second cold plate surface opposite the first cold plate surface, the cold plate being mounted vertically on one interior side of the laser housing.

[0063] Referring to FIG. 2, the housing has an interior space (i.e., the space surrounded by the six panels of the housing) between the upper cabinet 1011 and the lower cabinet 1012, which is divided into a first interior space adjacent to the first side panel 1013 and a second interior space adjacent to the third side panel.

[0064] The first ventilation hole is located in the upper cabinet plate at a portion corresponding to the second internal space, and the second ventilation hole is located in the lower cabinet plate at a portion corresponding to the second internal space.

[0065] An optical part including a cold plate is mounted within the first internal space, the cold plate is substantially parallel to the first side plate (i.e., the left cabinet plate), a first cold plate surface of the cold plate faces toward the inside of the first side plate (i.e., the left cabinet plate) of the housing, a second cold plate surface of the cold plate faces toward a third side plate of the housing, and the second cold plate surface of the cold plate forms a dividing surface between the first internal space and the second internal space.

[0066] The four peripheral side edges of the cold plate are in contact with the upper cabinet plate, the lower cabinet plate, the second side plate and the fourth side plate of the housing respectively, the cold plate and the housing together enclose and form a sealable first internal space, and the second cold plate surface of the cold plate forms a dividing surface for the complete first internal space and the second internal space, completely dividing the first internal space and the second internal space, and preventing the air flowing between the first ventilation hole and the second ventilation hole from passing through the first internal space and avoiding affecting the optical part.

[0067] Since the wind flows over the second cold plate surface of the cold plate, the second cold plate surface of the cold plate can also dissipate heat, and the surface area for heat dissipation is also increased.

[0068] In order to remove the heat of the cold plate by the refrigerant while efficiently removing it by high-speed airflow, it is preferable to arrange a cold plate heat dissipation fin protrusion structure on the side of the cold plate facing the second space (second cold plate surface). Preferably, the cold plate heat dissipation fin protrusion structure has a plurality of fin protrusions extending along the vertical direction, and vertical grooves extending along the vertical direction are formed between the plurality of fin protrusions, thereby improving the heat dissipation efficiency of air cooling.

[0069] The cold plate and the cold plate heat dissipating fin protrusion structure are preferably of one-piece construction, and the cold plate and / or the cold plate heat dissipating fin protrusion structure are preferably made of a highly thermally conductive material.

[0070] The laser cooling device is mounted within the second internal space, i.e., devices such as a compressor, a condenser, refrigerant piping, an expansion valve, a fan (in some embodiments further including an electromagnetic four-way valve and a refrigerant storage tank) are installed within the second internal space, where the condenser is located on the upper side of the second internal space (to facilitate heat removal), the condenser includes a condensing fin device with the refrigerant piping embedded therein, and the condensing fin device is located between the compressor device and the first vent.

[0071] The condensation fin device is attached to the underside of the first ventilation hole of the upper cabinet plate 1011, and the condensation fin device has multiple gaps between the fins, and the multiple gaps form an air path from bottom to top so that the air flow passage is not blocked by the condensation fin device.

[0072] In some embodiments, the volume of the second interior space is greater than the volume of the first interior space.

[0073] The first vent is located on an upper side of the second internal space, and the second vent is located on a lower side of the second internal space.

[0074] In some embodiments, the first fan group is located below the condensation fin group and above the compressor, i.e., between the condensation fin group and the compressor; of course, the first fan group may also be located below the first vent and above the condensation fin group, i.e., between the first vent and the condenser, so as to make the airflow in the passage more stable.

[0075] In some embodiments, the second fan group is located between the compressor and the second vent.

[0076] Referring to FIG. 4, the second side plate 1014 of the housing has an optoelectronic interface mounting area adjacent to the first side plate and a heat dissipation surface area adjacent to the third side plate, and the optoelectronic interface mounting area is used to mount at least a part or all of the interfaces of the optoelectronic interface unit.

[0077] The photoelectric interface mounting area of ​​the second side panel corresponds to a side surface of the first internal space, and has optical components such as a pump light source and an amplifying optical fiber within the first internal space. Therefore, by mounting the photoelectric interface to the photoelectric interface mounting area adjacent to the first side panel, the optical components located in the first internal space can be directly connected, and a long and complicated photoelectric path inside can be avoided.

[0078] The heat dissipation surface area of ​​the second side plate corresponds to the side of the second internal space, and since a cooling device is installed in the second internal space and an air cooling passage is formed, the heat dissipation surface area of ​​the second side plate is provided with a surface structure for enhancing heat dissipation, so that the heat dissipation of the device can be enhanced. Referring to Fig. 4, the heat dissipation surface area is provided with a plurality of heat dissipation protrusions, and preferably, the heat dissipation protrusions may be provided on the heat dissipation surface area and on a side facing the outside of the housing and / or a side facing the inside of the housing.

[0079] Similarly, in some embodiments, a fourth side panel 1016 of the housing may be provided similar to the second side panel.

[0080] The fourth side plate 1016 has an optoelectronic interface mounting area adjacent to the first side plate and a heat dissipation surface area adjacent to the third side plate, where the optoelectronic interface mounting area is used to mount at least a part or all of the interfaces of the optoelectronic interface unit.

[0081] The photoelectric interface mounting area of ​​the fourth side panel corresponds to a side surface of the first internal space, and has optical components such as a pump light source and an amplifying optical fiber within the first internal space. Therefore, by mounting the photoelectric interface to the photoelectric interface mounting area adjacent to the first side panel, the optical components located in the first internal space can be directly connected, and a long and complicated photoelectric path inside can be avoided.

[0082] The heat dissipating surface area of ​​the fourth side panel corresponds to a side surface of the second internal space, and since a cooling device is installed in the second internal space and an air cooling passage is formed, the heat dissipating surface area of ​​the fourth side panel is provided with a surface structure for enhancing heat dissipation, so that the heat dissipation of the device can be enhanced. The heat dissipating surface area is provided with a plurality of heat dissipating protrusions, and preferably, the heat dissipating protrusions may be provided on the heat dissipating surface area and on a side facing the outside of the housing and / or a side facing the inside of the housing.

[0083] In some embodiments, the third side panel of the housing has a protruding structure on a surface facing outward from the housing and / or on a surface facing inward from the housing to enhance heat dissipation.

[0084] In a preferred embodiment, the cabinet dimensions are 650mm x 300mm x 570mm.

[0085] In a preferred embodiment, the four corners of the lower cabinet plate of the cabinet are respectively fitted with a universal wheel.The housing adopts an aluminum profile structure, which is convenient for assembly and disassembly, and can ensure heat dissipation while saving cabinet space.

[0086] The above embodiments are only used to describe the technical aspects of the present invention, and are not limited thereto. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can modify the claims described in the above embodiments or replace some of the technical features with equivalents, and these modifications or replacements do not cause the essence of the corresponding technical solution to deviate from the spirit and scope of the technical solution of each embodiment of the present invention.

Claims

1. A compression-cooled fiber laser including a housing, in which an optical section of a fiber laser and a laser cooling device are provided, the optical section including a cold plate, a pump laser provided on the cold plate, and an amplifying optical fiber section, the laser cooling device including a compressor, a condenser, a refrigerant pipe, an expansion valve, and a fan, A compression-cooled fiber laser, characterized in that a housing has a first internal space and a second internal space, an optical part is located in the first internal space, a laser cooling device is located in the second internal space, a cold plate includes a cold plate refrigerant piping, the cold plate refrigerant piping is connected to the refrigerant piping of the laser cooling device, and is used for the flow and circulation of refrigerant.

2. 2. The compression-cooled fiber laser according to claim 1, wherein the cold plate has a flat structure in which piping is embedded, and has a first cold plate surface on which a semiconductor laser is mounted and a second cold plate surface opposite to the first cold plate surface, the cold plate being attached vertically to one inner side of the laser housing, and the second cold plate surface of the cold plate being a dividing surface between the first internal space and the second internal space.

3. 3. The compression-cooled fiber laser according to claim 2, wherein the housing has an upper cabinet plate and a lower cabinet plate corresponding to the upper cabinet plate, and between the upper cabinet plate and the lower cabinet plate are four side plates, namely a first side plate, a second side plate, a third side plate and a fourth side plate, which are connected in sequence, respectively, the first side plate faces the third side plate, the second side plate faces the fourth side plate, the housing is surrounded by an internal space, and the internal space is divided into a first internal space adjacent to the first side plate and a second internal space adjacent to the third side plate, a first cold plate surface of the cold plate faces an inside of the first side plate of the housing, and a second cold plate surface of the cold plate faces the third side plate of the housing.

4. 4. The compression-cooled fiber laser according to claim 3, characterized in that a first ventilation hole is provided on an upper cabinet plate of the housing, a second ventilation hole is provided on a lower cabinet plate of the housing, an air flow passage from bottom to top is formed between the two ventilation holes, a first fan group is attached on the underside of the upper cabinet plate and / or a second fan group is attached on the upper side of the lower cabinet plate, and the rotation direction of the fan is set to accelerate the air flowing in from the ventilation hole at the bottom of the laser housing or the air flowing out from the ventilation hole at the top of the laser housing.

5. 4. The compression-cooled fiber laser according to claim 3, wherein the four peripheral side edges of the cold plate are in contact with the upper cabinet plate, the lower cabinet plate, the second side plate and the fourth side plate of the housing, respectively, the cold plate and the housing together form a surrounding first internal space that can be sealed, and the second cold plate surface of the cold plate forms a dividing surface between the complete first internal space and the second internal space, so that the air flowing between the first vent and the second vent does not pass through the first internal space.

6. 5. The compression-cooled fiber laser according to claim 4, wherein the laser cooling device is disposed in the second internal space, the condenser is located in the upper side of the second internal space, the condenser includes a condensing fin device with a refrigerant pipe embedded therein, the condensing fin device is located between the compressor device and the first ventilation hole, the first ventilation hole is located in the upper side of the second internal space, the second ventilation hole is located in the lower side of the second internal space, the condensing fin device is attached to the lower side of the first ventilation hole of the upper cabinet plate, the condensing fin device has a plurality of gaps between the fins, and the plurality of gaps form an air passage from bottom to top.

7. 7. The compression-cooled fiber laser according to claim 6, wherein the cold plate is a one-sided piping-buried cold plate or a two-sided piping-buried cold plate, the first ventilation hole is located in the upper cabinet plate and in a portion corresponding to the second internal space, the second ventilation hole is located in the lower cabinet plate and in a portion corresponding to the second internal space, the first fan group is located below the first ventilation hole and above the condensation fin group, and / or the second fan group is located between the compressor and the second ventilation hole.

8. 4. The compression-cooled fiber laser according to claim 3, wherein the air-cooled laser comprises an optoelectronic interface unit, the optoelectronic interface unit comprises a plurality of optoelectronic interfaces, the second side plate of the housing has an optoelectronic interface mounting area adjacent to the first side plate and a heat dissipation surface area adjacent to the third side plate, the optoelectronic interface mounting area is used for mounting at least some or all of the interfaces of the optoelectronic interface unit, the optoelectronic interface mounting area of ​​the second side plate corresponds to a side surface of the first internal space, the heat dissipation surface area of ​​the second side plate corresponds to a side surface of the second internal space, and the heat dissipation surface area of ​​the second side plate is provided with a surface structure for enhancing heat dissipation.

9. 9. The compression-cooled fiber laser according to claim 8, wherein the photoelectric interface unit is used for photoelectrically connecting the laser body with the outside, and includes an equipment power input interface, a security lock interface, a control signal input interface and an output optical cable interface, and the photoelectric interface mounting area is used for mounting all interfaces of the photoelectric interface unit.

10. 10. The compression-cooled fiber laser according to claim 9, further comprising: a laser driver; the pump laser unit is one or more semiconductor lasers; and further comprising an N+1 forward and reverse optical fiber coupler; the amplifying optical fiber section is divided into a dopant amplifying optical fiber and a first grating and a second grating located at both ends of the dopant amplifying optical fiber; the N+1 forward and reverse optical fiber coupler is used for coupling the pump light combined beam emitted from the pump laser unit to the amplifying optical fiber section; the laser cooling device further comprises an electromagnetic four-way switching valve and a refrigerant storage tank; the frequency conversion compressor is connected to the condenser and the cold plate refrigerant pipe through a refrigerant pipe, and the refrigerant pipe and the cold plate refrigerant pipe are filled with refrigerant; the laser cooling device further comprises a dry filter, the dry filter is disposed between the condenser and the thermal expansion valve, and the condenser adopts an aluminum parallel-flow type heat exchanger.

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