Transfer jig and method for manufacturing electronic component

Abstract

To hold a chip component with high positional accuracy.SOLUTION: A flat plate 110 and a plurality of partition plates 120 are provided. The flat plate 110 has a main surface 111 extending in a first direction and a second direction orthogonal to the first direction. The plurality of partition plates 120 are configured to be incorporated into the flat plate 110 so as to extend in the second direction while being spaced apart from each other in the first direction. The flat plate 110 is formed with a plurality of recesses 112 opening in the main surface 111. Each of the plurality of recesses 112 has a wall surface portion 113 extending in the first direction. The partition plates 120 adjacent to each other in the first direction among the plurality of partition plates 120 sandwich the wall surface portion 113 therebetween.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a transfer jig and a method for manufacturing an electronic component. [Background technology]

[0002] A prior art document disclosing a component alignment pallet is Japanese Patent No. 6163085 (Patent Document 1). In the component alignment pallet described in Patent Document 1, chip components distributed over one surface of the pallet are accommodated in a plurality of component accommodating holes provided on the surface for accommodating chip components, thereby aligning the chip components on the pallet. Each of the component accommodating holes has a first hole having a first diameter and a second hole having a second diameter. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6163085 Summary of the Invention [Problem to be solved by the invention]

[0004] A transfer jig is sometimes required to hold chip components in their positions with high precision. When a rectangular chip component is housed and held in a receiving hole with rounded walls, it is difficult to maintain the orientation of the chip component, and the position of the chip component cannot be held with high precision.

[0005] The present invention has been made in view of the above-mentioned problems, and has as its object to provide a transfer jig and a method for manufacturing electronic components that can hold chip components with high positional accuracy. [Means for solving the problem]

[0006] A transfer jig according to the present invention comprises a flat plate and a plurality of partition plates. The flat plate has a main surface extending in a first direction and a second direction perpendicular to the first direction. The plurality of partition plates are configured to be mountable on the flat plate so as to extend in the second direction while being spaced apart from one another in the first direction. The flat plate has a plurality of recesses formed therein that open to the main surface. Each of the plurality of recesses has a wall portion extending in the first direction. Adjacent partition plates of the plurality of partition plates in the first direction sandwich the wall portion between them. [Effects of the Invention]

[0007] According to the present invention, chip components can be held with high positional accuracy. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view showing a transfer jig according to a first embodiment of the present invention. FIG. [Figure 2] 1 is a perspective view showing a flat plate according to a first embodiment of the present invention. [Figure 3] FIG. 1 is a perspective view showing a partition plate according to a first embodiment of the present invention. [Figure 4] FIG. 10 is a plan view showing the first transferring jig. [Figure 5] 5 is a cross-sectional view of the first transferring jig of FIG. 4 as seen from the direction of the arrow VV. [Figure 6] 10 is a plan view showing a state in which an electronic component has been inserted into a first inserting jig. FIG. [Figure 7] FIG. 10 is a side view showing the first and second transferring jigs arranged opposite each other and turned upside down. [Figure 8] 10 is a plan view showing a state in which a plurality of electronic components are housed in a plurality of recesses of the second transferring jig. FIG. [Figure 9] FIG. 10 is a side view showing the state in which the jig having an adhesive layer and the second transferring jig are placed opposite each other and inverted upside down. [Figure 10] FIG. 10 is a side view showing a state in which a plurality of electronic components have been transferred to a jig having an adhesive layer. [Figure 11] FIG. 10 is a plan view showing a transferring jig according to a second embodiment of the present invention. [Figure 12] FIG. 10 is a perspective view showing the periphery of a recess of a feeding jig according to a second embodiment of the present invention. [Figure 13] 10 is a plan view showing the periphery of a plurality of holes formed in a zigzag pattern in a flat plate; FIG. [Figure 14] 14 is a perspective view showing the periphery of a hole in the flat plate of FIG. 13. FIG. [Figure 15] FIG. 10 is a plan view showing a state in which a plurality of engagement grooves are formed along the second direction so as to remove the square corners of each of a plurality of holes. [Figure 16] FIG. 16 is a perspective view showing the state of FIG. [Figure 17] FIG. 10 is a plan view showing a state in which the partition plate is inserted into the engagement groove. [Figure 18] FIG. 18 is a perspective view showing the state of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, a description will be given of a transfer jig and a method for manufacturing an electronic component according to each embodiment of the present invention with reference to the drawings. In the following description of the embodiments, the same or corresponding parts in the drawings are given the same reference numerals, and the description thereof will not be repeated.

[0010] (Embodiment 1) In the following description of a method for manufacturing an electronic component, a method for manufacturing a multilayer ceramic capacitor will be described. However, the electronic component is not limited to a multilayer ceramic capacitor and may be a multilayer ceramic coil, a thermistor, a resistor, or the like, as long as it is a chip component that is a chip-shaped electronic component.

[0011] First, a method for manufacturing a multilayer ceramic capacitor will be described. When manufacturing a multilayer ceramic capacitor, a ceramic dielectric slurry is first prepared. Specifically, ceramic dielectric powder, additive powder, binder resin, and a dissolving solution are dispersed and mixed to prepare the ceramic dielectric slurry. The ceramic dielectric powder is, for example, dielectric particles with a perovskite structure such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The additive powder is, for example, composed of at least one of a Si compound, a Mg compound, a Mn compound, an Fe compound, a Cr compound, a Ni compound, and a Co compound. Examples of binder resins that can be used include polyurethane resins, urea resins, melamine resins, epoxy resins, vinyl acetate resins, acrylic resins, and aqueous polymers such as polyvinyl alcohol (PVA) and polyvinyl butyral (PVB). These may be used alone or in combination. The ceramic dielectric slurry may be either solvent-based or water-based. When the ceramic dielectric slurry is a water-based paint, the ceramic dielectric slurry is prepared by mixing a water-soluble binder, a dispersant, etc. with a dielectric raw material dissolved in water.

[0012] Next, a ceramic dielectric sheet is formed. Specifically, the ceramic dielectric slurry is formed into a sheet on a carrier film using a die coater, gravure coater, or microgravure coater, and then dried to form the ceramic dielectric sheet. From the viewpoint of miniaturization and high capacitance of the multilayer ceramic capacitor, the thickness of the ceramic dielectric sheet is preferably 0.2 μm or more and 10 μm or less.

[0013] Next, a mother sheet is formed. Specifically, a conductive paste is applied to a ceramic dielectric sheet in a predetermined pattern, thereby forming a mother sheet having a predetermined internal electrode pattern on the ceramic dielectric sheet. The conductive paste contains Ni powder, a solvent, a dispersant, a binder, and the like, and is prepared to have a constant viscosity. Methods for applying the conductive paste include screen printing, inkjet printing, and gravure printing. From the viewpoint of miniaturization and high capacity of multilayer ceramic capacitors, the thickness of the internal electrode pattern is preferably 0.2 μm or more and 10 μm or less. In addition to mother sheets having internal electrode patterns, ceramic dielectric sheets without internal electrode patterns can also be prepared.

[0014] Next, multiple mother sheets are stacked. Specifically, a predetermined number of mother sheets, each consisting of only ceramic dielectric sheets and without an internal electrode pattern, are stacked to a thickness of, for example, 0.5 μm or more and 5 μm or less. A predetermined number of mother sheets, each having an internal electrode pattern, are stacked on top of these. The number of stacked mother sheets with internal electrode patterns is, for example, 5 to 2000. A predetermined number of mother sheets, each consisting of only ceramic dielectric sheets and without an internal electrode pattern, are stacked on top of these to a thickness of, for example, 0.5 μm or more and 10 μm or less. This forms a mother sheet group.

[0015] Next, the mother sheet group is pressed together to form a dielectric block. Specifically, the mother sheet group is pressed in the stacking direction using a hydrostatic press or a rigid press to form the dielectric block. At this time, the ceramic dielectric sheets are pressed at a predetermined temperature, so that the ceramic dielectric sheets adhere to each other. Furthermore, by placing and pressing a ceramic dielectric sheet of a certain thickness as the outermost layer in the stacking direction, it is possible to protect the dielectric sheet on which the internal electrode pattern is formed.

[0016] Next, the dielectric block is divided into elements, specifically, by cutting, dicing, or laser cutting into a matrix of individual elements.

[0017] Next, the element body is fired. Specifically, the element body is heated, thereby firing the dielectric material and conductive material contained in the element body, and forming a laminate. The firing temperature is set appropriately depending on the dielectric material and conductive material. The laminate may be barrel polished.

[0018] Next, external electrodes are formed. For example, the laminate is plated with Ni and then Sn in this order to form plating layers, thereby forming external electrodes on the outer surfaces of the laminate.

[0019] A multilayer ceramic capacitor can be manufactured through the above-described series of steps. When manufacturing chip components such as multilayer ceramic capacitors, the chip components may be processed, measured, or inspected while held in a transfer jig.

[0020] Here, the configuration of the transferring jig according to the first embodiment of the present invention will be described. Fig. 1 is a perspective view showing the transferring jig according to the first embodiment of the present invention. As shown in Fig. 1, the transferring jig 100 according to the first embodiment of the present invention comprises a flat plate 110 and a plurality of partition plates 120. Fig. 2 is a perspective view showing the flat plate according to the first embodiment of the present invention. Fig. 3 is a perspective view showing the partition plates according to the first embodiment of the present invention.

[0021] As shown in FIGS. 1 to 3, the flat plate 110 has a main surface 111 extending in a first direction (X-axis direction) and a second direction (Y-axis direction) perpendicular to the first direction (X-axis direction). The multiple partition plates 120 are configured to be mountable on the flat plate 110 so as to extend in the second direction (Y-axis direction) at intervals from each other in the first direction (X-axis direction). The flat plate 110 is formed with a plurality of recesses 112 that open to the main surface 111. Each of the multiple recesses 112 has a wall surface portion 113 extending in the first direction (X-axis direction). Among the multiple partition plates 120, adjacent partition plates 120 in the first direction (X-axis direction) sandwich the wall surface portion 113 between them.

[0022] A plurality of engagement grooves 114 extending in a second direction (Y-axis direction) and spaced apart from one another in a first direction (X-axis direction) are formed in the flat plate 110. A plurality of partition plates 120 are fitted into the plurality of engagement grooves 114, respectively, and are incorporated into the flat plate 110.

[0023] In this embodiment, a plurality of grooves 115 extending in the first direction (X-axis direction) are formed in the flat plate 110 and spaced apart from one another in the second direction (Y-axis direction).

[0024] The plurality of recesses 112 are portions of the plurality of groove portions 115 that are sandwiched between adjacent engagement grooves 114 in the first direction (X-axis direction) among the plurality of engagement grooves 114. By forming the plurality of recesses 112 from the groove portions 115 in this way, the arrangement density of the plurality of recesses 112 can be increased.

[0025] The depth of the multiple engagement grooves 114 is greater than the depth of the multiple recessed streak portions 115. This allows the pair of side surfaces 122 in each of the multiple recessed portions 112 to sandwich the entire pair of wall surface portions 113 in the third direction (Z-axis direction). As a result, the corner between the bottom surface of the recessed portion 112 and the pair of side surfaces 122 can be made into an unrounded right angle. Each of the multiple engagement grooves 114 and the multiple recessed streak portions 115 is formed by cutting using an end mill or the like.

[0026] The flat plate 110 is made of resin, aluminum, stainless steel, or the like. From the standpoint of weight reduction and dimensional stability, the flat plate 110 is preferably made of polyethylene terephthalate, unilate, or the like. If the flat plate 110 is made of resin, the electronic components transferred into the transferring jig 100 are less likely to be scratched, cracked, or chipped.

[0027] The dimensions of the flat plate 110 are, for example, 25 mm to 600 mm in the first direction (X-axis direction), 25 mm to 600 mm in the second direction (Y-axis direction), and 3 mm to 10 mm in the third direction (Z-axis direction).

[0028] The dimensions of the engagement grooves 114 are, for example, a width in the first direction (X-axis direction) of 0.3 mm to 5 mm, and a depth in the third direction (Z-axis direction) of 3 mm to 7 mm. The number of engagement grooves 114 is, for example, 3 to 400. In this embodiment, the engagement grooves 114 are formed over the entire length of the flat plate 110 in the second direction (Y-axis direction), but are not limited to this, and the engagement grooves 114 may be formed in a portion of the flat plate 110 excluding at least one of both end portions in the second direction (Y-axis direction).

[0029] The dimensions of the recessed streaks 115 are, for example, a width in the second direction (Y-axis direction) of 1 mm to 10 mm, and a depth in the third direction (Z-axis direction) of 0.3 mm to 5 mm. The number of recessed streaks 115 is, for example, 3 to 400. In this embodiment, the recessed streaks 115 are formed over the entire length of the flat plate 110 in the first direction (X-axis direction), but are not limited to this, and may be formed in a portion of the flat plate 110 excluding at least one of both end portions in the first direction (X-axis direction).

[0030] The partition plate 120 is made of resin, aluminum, stainless steel, etc. From the viewpoint of light weight and durability, the partition plate 120 is preferably made of polyacetal.

[0031] The dimensions of the partition plate 120 are, for example, a width in the first direction (X-axis direction) of 0.3 mm or more and 5 mm or less, and a thickness in the third direction (Z-axis direction) of 2 mm or more and 6 mm or less.

[0032] In this embodiment, the partition plate 120 is incorporated into the flat plate 110 by fitting into the engagement groove 114, but it may also be fixed to the engagement groove 114 by adhesive. However, it is preferable that the partition plate 120 is incorporated into the flat plate 110 by fitting into the engagement groove 114, because this can prevent burrs from being generated due to the adhesive overflowing.

[0033] 1, the plurality of recesses 112 are arranged in a matrix in a first direction (X-axis direction) and a second direction (Y-axis direction). Each of the plurality of recesses 112 is surrounded by a pair of wall surfaces 113 extending in the first direction (X-axis direction) and a pair of side surfaces 122 extending in the second direction (Y-axis direction). In other words, the recess 112 is surrounded by four planes that are perpendicular to each other. As a result, as will be described later, a rectangular parallelepiped chip component 10 placed in the recess 112 is sandwiched and held between the pair of wall surfaces 113 and the pair of side surfaces 122, thereby stabilizing the posture and position of the chip component 10.

[0034] The opening dimension of the recess 112 is 110% to 120% of the chip component 10 to be inserted into the recess 112. Specifically, the dimension in the first direction (X-axis direction) of the opening surrounded by the pair of wall surfaces 113 and the pair of side surfaces 122 is 110% to 120% of the dimension in the first direction (X-axis direction) of the chip component 10. Furthermore, the dimension in the second direction (Y-axis direction) of the opening surrounded by the pair of wall surfaces 113 and the pair of side surfaces 122 is 110% to 120% of the dimension in the second direction (Y-axis direction) of the chip component 10. This ensures clearance for inserting the chip component 10 into the recess 112 while allowing for dimensional tolerance of the chip component 10, and enables the chip component 10 inserted into the inserting jig 100 to be held with good positional precision.

[0035] The step in the third direction (Z-axis direction) between the top surface 121 and the main surface 111 of the partition plate 120 incorporated into the flat plate 110 is 0.2 mm or less. As a result, when transferring the chip components 10 transferred into the first transferring jig to the transferring jig 100 according to this embodiment, which is the second transferring jig, as will be described later, the chip components 10 can be transferred stably with the main surfaces of the flat plates of both transferring jigs overlapping each other.

[0036] Here, an example of the operation when transferring chip components from one transfer jig to another transfer jig in the electronic component manufacturing method according to this embodiment will be described. First, a first transfer jig and a second transfer jig, transfer jig 100, are prepared. Fig. 4 is a plan view showing the first transfer jig. Fig. 5 is a cross-sectional view of the first transfer jig in Fig. 4 as seen from the direction of the VV line arrow. Fig. 6 is a plan view showing the state in which electronic components have been transferred into the first transfer jig.

[0037] 4 to 6, the first transferring jig 300 is composed of a flat plate 310 having a plurality of holes 312 each capable of accommodating a plurality of chip components 10. The holes 312 are formed at positions corresponding to the recesses 112 of the transferring jig 100.

[0038] Flat plate 310 is made of resin, aluminum, stainless steel, or the like. From the standpoint of weight reduction and dimensional stability, flat plate 310 is preferably made of polyethylene terephthalate, unilate, or the like. If flat plate 310 is made of resin, it can make it less likely that the electronic components transferred into the first transferring jig will be scratched, cracked, or chipped.

[0039] The plurality of holes 312 are formed by cutting using an end mill, etc. When viewed from a third direction (Z-axis direction) perpendicular to the main surface 311, each of the plurality of holes 312 has a rectangular shape with rounded corners 316.

[0040] At the open ends of the plurality of holes 312, rectangular annular inclined surfaces 313 are formed that are inclined so that the opening area increases toward the main surface 311. The inclined surfaces 313 function as guides when the plurality of chip components 10 are inserted into the plurality of holes 312, making it easier for the plurality of chip components 10 to be accommodated in the plurality of holes 312.

[0041] The opening dimension of each of the plurality of holes 312 is larger than the opening dimension of each of the plurality of recesses 112. Specifically, the dimension A in the first direction (X-axis direction) of hole 312 shown in Fig. 4 is larger than the dimension in the first direction (X-axis direction) of an opening surrounded by a pair of wall surface portions 113 and a pair of side surface portions 122 shown in Fig. 1. For example, the dimension A in the first direction (X-axis direction) of hole 312 is 105% or more and 110% or less of the dimension in the first direction (X-axis direction) of the opening surrounded by a pair of wall surface portions 113 and a pair of side surface portions 122 shown in Fig. 1.

[0042] 4 is greater than the dimension in the second direction (Y-axis direction) of the opening surrounded by the pair of wall surface portions 113 and the pair of side surface portions 122 shown in Fig. 1. For example, the dimension B in the second direction (Y-axis direction) of the hole 312 is 105% or more and 110% or less of the dimension in the second direction (Y-axis direction) of the opening surrounded by the pair of wall surface portions 113 and the pair of side surface portions 122 shown in Fig. 1.

[0043] Due to the above configuration, the first transferring jig 300 is easier to transfer multiple chip components 10 than the second transferring jig, transferring jig 100. On the other hand, the transferring jig 100 has a better ability to maintain the posture and position of the transferred chip components 10 than the first transferring jig 300.

[0044] When multiple chip components 10 are transferred into the first transfer jig 300, the flat plate 310 is vibrated while being tilted with the multiple chip components 10 placed on the main surface 311, thereby transferring the chip components 10 into the multiple hole portions 312.

[0045] After multiple chip components 10 are transferred into the first transferring jig 300, the transferring jig 100 is placed opposite the first transferring jig 300 so that the main surface 111 of the flat plate 110 of the transferring jig 100 overlaps the main surface 311 of the flat plate 310 and the multiple recesses 112 are positioned above the multiple hole portions 312.

[0046] Fig. 7 is a side view showing the state in which the first and second transferring jigs are inverted upside down while positioned opposite each other. As shown in Fig. 7, the first transferring jig 300 and the second transferring jig, transferring jig 100, are inverted upside down while positioned opposite each other, thereby transferring the plurality of chip components 10 transferred into the first transferring jig 300 to the transferring jig 100. At this time, the transfer of the plurality of chip components 10 to the transferring jig 100 may be promoted by applying vibration to the first transferring jig 300 while the first transferring jig 300 and transferring jig 100 are positioned opposite each other.

[0047] Fig. 8 is a plan view showing a state in which a plurality of electronic components are respectively accommodated in a plurality of recesses of the second transferring jig. As shown in Fig. 8, a plurality of chip components 10 transferred from the first transferring jig 300 to the transferring jig 100 are respectively accommodated in a plurality of recesses 112. The rectangular parallelepiped-shaped chip components 10 transferred into the recesses 112 are held between a pair of wall surfaces 113 and a pair of side surfaces 122, thereby stabilizing the posture and position of the chip components 10 in the in-plane directions extending in the first direction (X-axis direction) and the second direction (Y-axis direction).

[0048] Specifically, rotation of the chip components 10 in in-plane directions extending in the first direction (X-axis direction) and the second direction (Y-axis direction) can be suppressed, thereby stabilizing the posture of the chip components 10. Furthermore, movement of the chip components 10 in the first direction (X-axis direction) and movement of the chip components 10 in the second direction (Y-axis direction) can be suppressed, thereby stabilizing the positions of the chip components 10. Therefore, the multiple chip components 10 can be held with high positional accuracy in the first direction (X-axis direction) and the second direction (Y-axis direction).

[0049] In the method for manufacturing an electronic component according to this embodiment, the plurality of chip components 10 transferred to the second transferring jig, ie, the transferring jig 100, are further transferred to a jig having an adhesive layer.

[0050] Specifically, after multiple chip components 10 are transferred to the transfer jig 100, a jig having an adhesive layer is placed opposite the first transfer jig 300 so that the adhesive layer overlaps the main surface 111 of the flat plate 110 of the transfer jig 100.

[0051] Fig. 9 is a side view showing the state in which the jig with the adhesive layer and the second transferring jig are turned upside down while facing each other, and Fig. 10 is a side view showing the state in which a plurality of electronic components have been transferred to the jig with the adhesive layer.

[0052] As shown in FIG. 9, by inverting the second transferring jig 100 and the jig 400 having an adhesive layer 411 on a flat plate 410 while they are positioned opposite each other, the multiple chip components 10 transferred into the transferring jig 100 are transferred onto the adhesive layer 411 of the jig 400 as shown in FIG. 10.

[0053] The plurality of chip components 10 held on the adhesive layer 411 maintain high positional accuracy in the first direction (X-axis direction) and the second direction (Y-axis direction) when they were inserted into the inserting jig 100. The plurality of chip components 10 held on the adhesive layer 411 are subjected to certain processes such as processing, measurement, or inspection. Processing includes the application of a functional coating to the chip components 10. Measurement includes the measurement of the resistance value of the chip components 10. Inspection includes the insulation test of the chip components 10. Since the plurality of chip components 10 are held with high positional accuracy, the above-mentioned certain processes can be stably performed.

[0054] (Embodiment 2) A transfer jig according to a second embodiment of the present invention will be described below with reference to the drawings. The transfer jig according to the second embodiment of the present invention differs from the transfer jig according to the first embodiment of the present invention in that it has multiple holes instead of grooves, and therefore the description of the same configuration as the transfer jig according to the first embodiment of the present invention will not be repeated.

[0055] Fig. 11 is a plan view showing a transferring jig according to embodiment 2 of the present invention. Fig. 12 is a perspective view showing the periphery of the recess of the transferring jig according to embodiment 2 of the present invention. As shown in Figs. 11 and 12, transferring jig 500 according to embodiment 2 of the present invention comprises flat plate 510 and multiple partition plates 120.

[0056] The flat plate 510 has a main surface 511 extending in a first direction (X-axis direction) and a second direction (Y-axis direction) perpendicular to the first direction (X-axis direction). A plurality of holes 515 are formed in the flat plate 510. The plurality of holes 515 are arranged in a matrix in the first direction (X-axis direction) and the second direction (Y-axis direction). The plurality of holes 515 are open to the main surface 511. When viewed from a third direction (Z-axis direction) perpendicular to the main surface 511, each of the plurality of holes 515 has a rectangular shape with rounded corners 516. The plurality of holes 515 are formed by cutting using an end mill or the like.

[0057] A plurality of engagement grooves 114 are formed in the flat plate 510, extending in a second direction (Y-axis direction) and spaced apart from each other in a first direction (X-axis direction). Specifically, a pair of engagement grooves 114 is formed so as to pass through a plurality of hole portions 515 aligned in a row in the second direction (Y-axis direction). The depth of the plurality of engagement grooves 114 is greater than the depth of the plurality of hole portions 515.

[0058] The plurality of partition plates 120 are inserted into the plurality of engagement grooves 114, respectively, and assembled to the flat plate 510. As a result, a plurality of recesses 512 opening to the main surface 511 are formed in the flat plate 510. Each of the plurality of recesses 512 has a wall surface portion 513 extending in the first direction (X-axis direction). The partition plates 120 inserted into the pair of engagement grooves 114 sandwich the wall surface portion 513 between them.

[0059] The recesses 512 are arranged in a matrix in a first direction (X-axis direction) and a second direction (Y-axis direction). Each of the recesses 512 is surrounded by a pair of wall surfaces 513 extending in the first direction (X-axis direction) and a pair of side surfaces 122 extending in the second direction (Y-axis direction). In other words, the recess 512 is surrounded by four planes that are perpendicular to each other. As a result, the rectangular parallelepiped chip component 10 inserted into the recess 512 is sandwiched and held between the pair of wall surfaces 513 and the pair of side surfaces 122, thereby stabilizing the posture and position of the chip component 10. As a result, the chip component 10 inserted into the inserting jig 500 can be held with high positional accuracy.

[0060] (Embodiment 3) A transfer jig according to a third embodiment of the present invention will be described below with reference to the drawings. The transfer jig according to the third embodiment of the present invention differs from the transfer jig according to the second embodiment of the present invention in that the multiple holes are arranged in a zigzag pattern, and therefore, the description of the same configuration as the transfer jig according to the second embodiment of the present invention will not be repeated.

[0061] First, a method for manufacturing a transferring jig according to a third embodiment of the present invention will be described. Fig. 13 is a plan view showing the periphery of a hole in a flat plate in which a plurality of holes are formed in a zigzag pattern. Fig. 14 is a perspective view showing the periphery of the hole in the flat plate of Fig. 13.

[0062] As shown in Figures 13 and 14, a plurality of holes 615 are formed in a zigzag pattern in a flat plate 610. The plurality of holes 615 are open to a main surface 611. When viewed from a third direction (Z-axis direction) perpendicular to the main surface 611, each of the plurality of holes 615 has a rectangular shape with rounded corners 616. In each of the plurality of holes 615, a pair of wall surface portions 613 extending in a first direction (X-axis direction) is formed between the corners 616. The plurality of holes 615 are formed by cutting using an end mill or the like.

[0063] Fig. 15 is a plan view showing a state in which a plurality of engagement grooves are formed along the second direction so as to remove the square corners of each of the plurality of holes. Fig. 16 is a perspective view showing the state of Fig. 15.

[0064] As shown in Figures 15 and 16, of the hole portions 615 adjacent to each other in the first direction (X-axis direction), two corners 616 located on the other side in the first direction (X-axis direction) in the hole portion 615 located on one side in the first direction (X-axis direction) and two corners 616 located on one side in the first direction (X-axis direction) in the hole portion 615 located on the other side in the first direction (X-axis direction) are removed by one engagement groove 614.

[0065] Fig. 17 is a plan view showing a state in which the partition plate is inserted into the engagement groove, and Fig. 18 is a perspective view showing the state of Fig. 17.

[0066] 17 and 18, the partition plates 120 are inserted into the respective engagement grooves 614 and assembled into the flat plate 610. As a result, the flat plate 610 is formed with a plurality of recesses 612 that open to the main surface 611. Each of the recesses 612 has a wall surface portion 613 that extends in the first direction (X-axis direction). The partition plates 120 inserted into the engagement grooves 114 that are adjacent to each other in the first direction (X-axis direction) sandwich the wall surface portions 613 between them.

[0067] The recesses 612 are arranged in a zigzag pattern along the second direction (Y-axis direction). Each of the recesses 612 is surrounded by a pair of wall surfaces 613 extending in the first direction (X-axis direction) and a pair of side surfaces 122 extending in the second direction (Y-axis direction). In other words, the recess 612 is surrounded by four planes that are perpendicular to each other. As a result, the rectangular parallelepiped chip component 10 inserted into the recess 612 is sandwiched and held between the pair of wall surfaces 613 and the pair of side surfaces 122, thereby stabilizing the posture and position of the chip component 10. As a result, the chip component 10 inserted into the inserting jig 600 can be held with high positional accuracy.

[0068] The transfer jig 600 according to the third embodiment of the present invention is useful when it is necessary to ensure spacing between the chip components 10 when a certain process is performed on a plurality of chip components 10.

[0069] In the above-described embodiments, configurations that can be combined may be combined with each other.

[0070] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0071] 10 Chip parts, 100,500,600 Transfer jig, 110,310,410,510,610 Flat plate, 111,311,511,611 Main surface, 112,512,612 Recess, 113,513,613 Wall portion, 114,614 Engagement groove, 115 Recess portion, 120 Partition plate, 121 Top surface, 122 Side portion, 300 First transfer jig, 312,515,615 Hole portion, 313 Inclined surface, 316,516,616 Corner, 400 Jig with adhesive layer, 411 Adhesive layer.

Claims

1. a flat plate having a main surface extending in a first direction and a second direction perpendicular to the first direction; a plurality of partition plates that can be incorporated into the flat plate so as to extend in the second direction while being spaced apart from each other in the first direction; a plurality of recesses that are open to the main surface are formed in the flat plate, Each of the plurality of recesses has a wall surface portion extending in the first direction, The transfer jig, wherein adjacent partition plates in the first direction among the plurality of partition plates sandwich the wall surface portion therebetween.

2. a plurality of engagement grooves are formed in the flat plate, the engagement grooves extending in the second direction and spaced apart from one another in the first direction; The transferring jig according to claim 1 , wherein the plurality of partition plates are fitted into the plurality of engagement grooves and are incorporated into the flat plate.

3. a plurality of grooves extending in the first direction and spaced apart from one another in the second direction are formed in the flat plate; the plurality of recesses are portions of the plurality of grooves that are sandwiched between adjacent engagement grooves in the first direction among the plurality of engagement grooves, The transferring jig according to claim 2 , wherein the depth of the plurality of engagement grooves is greater than the depth of the plurality of grooves.

4. Preparing a first transfer jig and a second transfer jig; Transferring a plurality of electronic components into the first transfer jig; disposing the second transferring jig opposite to the first transferring jig and transferring the electronic components transferred to the first transferring jig to the second transferring jig; the first transferring jig has a plurality of holes capable of accommodating the plurality of electronic components, The second transfer jig is a flat plate having a main surface extending in a first direction and a second direction perpendicular to the first direction; a plurality of partition plates that can be incorporated into the flat plate so as to extend in the second direction while being spaced apart from each other in the first direction; a plurality of recesses that are open to the main surface are formed in the flat plate, Each of the plurality of recesses has a wall surface portion extending in the first direction, Among the plurality of partition plates, partition plates adjacent to each other in the first direction sandwich the wall surface portion therebetween, the second transferring jig is capable of accommodating the plurality of electronic components in the plurality of recesses, A method for manufacturing an electronic component, wherein an opening dimension of each of the plurality of holes is larger than an opening dimension of each of the plurality of recesses.

5. The method for manufacturing an electronic component according to claim 4 , further comprising transferring the plurality of electronic components transferred to the second transferring jig to a jig having an adhesive layer.

Images