Mounting apparatus

Abstract

To provide a mounting device capable of efficiently mounting a plurality of electronic components.SOLUTION: The mounting device 1 includes the plurality of feeding modules 14A and 14B that feed the electronic components 102A and 102B, the mounting module 101 that mounts the electronic components 14A and 14B on the substrate 41, and the transport mechanism 120 that includes at least one transport unit configured to be able to transport the electronic components 102A and 102B from each of the plurality of feeding modules 14A and to the mounting module 101 and is configured to extend in the first direction in a plan view over the plurality of feeding modules and and the mounting module 101. 14B 102A 102B.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a mounting apparatus. [Background technology]

[0002] Flip-chip bonding is a widely known method for mounting semiconductor chips to substrates. In this method, a semiconductor chip is picked up from a semiconductor wafer, flipped over, and the surface opposite the connection terminals of the semiconductor chip is placed over a bonding tool for suction. The bonding tool then thermally welds the connection terminals of the semiconductor chip to the electrode pads of the substrate, thereby mounting the semiconductor chip to the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 3567896 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, when multiple semiconductor chips are supplied from multiple semiconductor wafers and mounted on a single substrate, there are two ways to do it: one is to prepare a mounting device for each semiconductor wafer and move the substrate between the mounting devices, and the other is to replace the semiconductor wafer during mounting. In the former case, mounting defects may occur due to misalignment between the substrate and the semiconductor chip. In the latter case, the time required to replace the semiconductor wafer may cause the solder flux to dry out during mounting, resulting in mounting defects.

[0005] The present invention has been made in view of the above circumstances, and has as its object to provide a mounting apparatus capable of efficiently mounting a plurality of electronic components. [Means for solving the problem]

[0006] A mounting device according to one aspect of the present invention includes a plurality of supply modules that supply electronic components, a mounting module that mounts the electronic components on a substrate, and a transport mechanism that has at least one transport unit configured to transport the electronic components from each of the plurality of supply modules to the mounting module, and that extends across the plurality of supply modules and mounting modules in a first direction in a planar view. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a mounting apparatus capable of efficiently mounting a plurality of electronic components. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view showing a mounting apparatus according to an embodiment of the present invention. [Figure 2] FIG. 2 is a side view showing the mounting apparatus according to the present embodiment. [Figure 3] FIG. 1 is a front view showing a mounting device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] The following describes embodiments of the present invention. In the following description of the drawings, the same or similar components are denoted by the same or similar reference numerals. The drawings are illustrative, and the dimensions and shapes of each part are schematic. The technical scope of the present invention should not be interpreted as being limited to the embodiments.

[0010] The mounting apparatus 1 is a flip-chip bonder that mounts semiconductor dies 14A and 14B on a circuit board 41. The semiconductor dies 14A and 14B are an example of electronic components, such as semiconductor chips having integrated circuits. The circuit board 41 is an example of a substrate, such as a printed circuit board (PCB) or a flexible printed circuit (FPC).

[0011] The electronic components and substrate are not limited to those described above. The electronic components may be, for example, various active or passive components. The substrate may be, for example, a lead frame, a ceramic substrate, a semiconductor substrate, or an electronic component. The electronic components may be directly mounted on the substrate, or may be indirectly mounted on the substrate by being mounted on another electronic component mounted on the substrate.

[0012] The mounting apparatus 1 includes a mounting module 101, multiple supply modules 102A and 102B, and a transport mechanism 120. The mounting module 101, supply module 102A, and supply module 102B are arranged in this order in the X-axis direction. Supply module 102A is adjacent to the mounting module 101 on the negative side of the X-axis, and supply module 102B is adjacent to the mounting module 101 on the negative side of the X-axis, and supply module 102A is located between the mounting module 101 and supply module 102B. Supply module 102A is connected to mounting module 101, and supply module 102B is connected to supply module 102A.

[0013] The mounting module 101 transports the semiconductor dies 14A and 14B in the Y-axis direction and mounts the semiconductor dies 14A and 14B on the circuit board 41. The mounting module 101 is provided with a stand 11.

[0014] As shown in FIG. 1, a mounting stage 40 is provided on the upper surface of the mount 11. The mounting stage 40 adsorbs a circuit board 41 on which the semiconductor dies 14A and 14B are to be mounted, and heats the circuit board 41 using a built-in heater. A conveyor rail 42 is connected to the mounting stage 40. The conveyor rail 42 supplies the circuit board 41 from a board supply module (not shown) to the mounting stage 40, and also supplies the circuit board 41 on which the semiconductor dies 14A and 14B are mounted to a product recovery module (not shown). The conveyor rail 42 is configured by connecting rails provided in the mounting module 101 and the supply modules 102A and 102B, and extends in the X-axis direction across the mounting module 101 and the supply modules 102A and 102B.

[0015] 1, a pair of guide rails 43 extending in the X-axis direction are provided on the upper surface of the base 11. Sliders 44A and 44B are attached to the pair of guide rails 43, respectively. The sliders 44A and 44B are configured to be movable in the X-axis direction by a drive motor (not shown).

[0016] A gantry frame 45A is attached to the slider 44A, and a gantry frame 45B is attached to the slider 44B. The gantry frames 45A and 45B are gate-shaped frames extending in the Y-axis direction, with the legs of the gantry frame 45A fixed to the slider 44A and the legs of the gantry frame 45B fixed to the slider 44B. The gantry frame 45A is configured to be movable in the X-axis direction as the slider 44A moves along the guide rails 43. Similarly, the gantry frame 45B is configured to be movable in the X-axis direction as the slider 44B moves along the guide rails 43.

[0017] A mounting head 46A is attached to the gantry frame 45A, and a mounting head 46B is attached to the gantry frame 45B. The mounting head 46A has a mounting nozzle 47A, and the mounting head 46B has a mounting nozzle 47B. The mounting heads 46A and 46B are configured to be movable in the Y-axis direction by a drive motor (not shown). The mounting head 46A picks up and transports the semiconductor die 14A received from the transport mechanism 120, and mounts it on the circuit board 41. The mounting head 46B picks up and transports the semiconductor die 14B received from the transport mechanism 120, and mounts it on the circuit board 41. The mounting heads 46A and 46B are configured to be movable independently of each other.

[0018] The mounting head 46A is configured to be able to suck and transport both the semiconductor dies 14A and 14B, and the mounting head 46B is similarly configured to be able to suck and transport both the semiconductor dies 14A and 14B. Therefore, the combinations of the mounting heads 46A and 46B with the semiconductor dies 14A and 14B are not limited to those described above. The mounting head 46A may mount the semiconductor die 14B on the circuit board 41, or may mount both the semiconductor dies 14A and 14B on the circuit board 41. Similarly, the mounting head 46B may mount the semiconductor die 14A on the circuit board 41, or may mount both the semiconductor dies 14A and 14B on the circuit board 41.

[0019] As shown in FIG. 2, the mounting nozzle 47A includes, for example, a motor 50, a base 51, a ball screw 52, ​​a pulse heater 53, and a mounting tool 54. The motor 50 is fixed to the mounting head 46A. The base 51 is attached to the mounting head 46A so as to be movable in the Z direction. The ball screw 52 rotates based on the driving force from the motor 50, thereby moving the base 51 in the Z direction. The pulse heater 53 is attached to the base 51, and a mounting tool 54 is attached below the pulse heater 53. The mounting tool 54 is configured to be able to adsorb the semiconductor chip 14 to its tip surface. When the base 51 is moved in the Z direction by the motor 50, the mounting tool 54 moves in the Z-axis direction together with the base 51. Although not shown, the mounting nozzle 47B also includes a motor, a base, a ball screw, a pulse heater, and a mounting tool, similar to the mounting nozzle 47A.

[0020] Supply module 102A supplies semiconductor dies 14A, and supply module 102B supplies semiconductor dies 14B. Supply module 102A is provided with wafer holder 12A, and supply module 102B is provided with wafer holder 12B. Wafer holder 12A is annular and holds diced semiconductor wafer 13A. Wafer holder 12B similarly holds diced semiconductor wafer 13B. Wafer holders 12A and 12B are moved in the Y-axis direction by a drive motor (not shown). Wafer holders 12A and 12B are configured not to move in the X-axis direction.

[0021] A push-up unit 15 is provided below the wafer holders 12A and 12B. As shown in Fig. 3, the push-up unit 15 is configured to be movable between the supply module 102A and the supply module 102B, and pushes up the semiconductor die 14A from the diced semiconductor wafer 13A, and also pushes up the semiconductor die 14B from the diced semiconductor wafer 13B.

[0022] Alternatively, a first push-up unit that pushes up the semiconductor die 14A from the semiconductor wafer 13A and a second push-up unit that pushes up the semiconductor die 14B from the semiconductor wafer 13B may be provided separately. In this case, the first push-up unit may be provided in the supply module 102A and configured not to be movable to the supply module 102B, and the second push-up unit may be provided in the supply module 102B and configured not to be movable to the supply module 102A.

[0023] The supply modules 102A and 102B are provided with a pickup camera 16. As shown in Fig. 3, the pickup camera 16 is configured to be movable between the supply modules 102A and 102B, and captures an image of the semiconductor die 14A in the semiconductor wafer 13A for position recognition, and also captures an image of the semiconductor die 14B in the semiconductor wafer 13B for position recognition.

[0024] Alternatively, a first pickup camera that captures an image of semiconductor die 14A in semiconductor wafer 13A and a second pickup camera that captures an image of semiconductor die 14B in semiconductor wafer 13B may be provided separately. In this case, the first pickup camera may be provided in supply module 102A and configured not to be able to move to supply module 102B, and the second pickup camera may be provided in supply module 102B and configured not to be able to move to supply module 102A.

[0025] The transfer mechanism 120 is configured to extend in the X-axis direction across the mounting module 101 and the supply modules 102A and 102B. The transfer mechanism 120 includes two transfer units 20A and 20B. The transfer unit 20A is configured to transfer the semiconductor dies 14A and 14B from the supply modules 102A and 102B, respectively, to the mounting module 101. The transfer unit 20B is configured to transfer the semiconductor dies 14A and 14B from the supply modules 102A and 102B, respectively, to the mounting module 101. For example, the transfer unit 20A picks up the semiconductor die 14A from the wafer holder 12A, inverts the picked-up semiconductor die 14A, and delivers the inverted semiconductor die 14A to the mounting head 46A. The transfer unit 20B picks up the semiconductor die 14B from the wafer holder 12B, inverts the picked-up semiconductor die 14B, and delivers the inverted semiconductor die 14B to the mounting head 46B.

[0026] As shown in FIG. 2, the transport unit 20A includes, for example, a guide rail 21A, a slider 22A, a carriage 23A, a rotary shaft 24A, and a transport head 25A.

[0027] The guide rail 21A is fixed to a recess 11A formed on the upper surface of the mount 11. The recess 11A has a long groove shape extending in the X direction. The guide rail 21A is configured by connecting rails provided on the mounting module 101 and the supply modules 102A and 102B, and extends in the X-axis direction across the mounting module 101 and the supply modules 102A and 102B. A slider 22A is attached to the guide rail 21A. The slider 22A is configured to be movable in the X-axis direction by a drive motor (not shown). A carriage 23A is attached to the slider 22A. The carriage 23A is configured to be movable in the X-axis direction by the slider 22A moving along the guide rail 21A. A rotating shaft 24A is attached to the carriage 23A. An attachment arm of the rotating shaft 24A extends in a direction obliquely intersecting the center line of the rotating shaft 24A. A transport head 25A is attached to the tip of an attachment arm of the rotary shaft 24A. A stepping motor (not shown) rotates the rotary shaft 24A, causing the transport head 25A to rotate in an inverted direction.

[0028] The transfer head 25A transfers, for example, a semiconductor die 14A from the supply module 102A to the mounting module 101. The transfer head 25A includes a base 27A and a pickup nozzle 28A. The base 27A is plate-shaped and is fixed to the tip of the mounting arm of the rotation shaft 24A. The pickup nozzle 28A is fixed to the base 27A. The pickup nozzle 28A includes, for example, a casing 29A, a suction head 30A, and an electromagnetic coil 31A. The casing 29A is annular and houses the electromagnetic coil 31A in its annular portion. A through-hole extending in the longitudinal direction of the casing 29A is formed in the center of the casing 29A. The suction head 30A is configured to be able to suction the semiconductor die 14A onto its tip surface. The suction head 30A is housed in the through-hole of the casing 29A. The suction head 30A is configured so that when an electric current is applied to the electromagnetic coil 31A, it moves through the through-hole of the casing 29A, and the amount of feeding out from the end face of the casing 29A can be adjusted.

[0029] Similar to transport unit 20A, transport unit 20B includes guide rail 21B, slider 22B, carriage 23B, rotary shaft 24B, and transport head 25B. Guide rail 21B is provided parallel to guide rail 21A. Guide rail 21B is fixed to a portion of recess 11A facing guide rail 21A. Transport head 25A and transport head 25B are configured to be able to move independently of each other and can pass each other.

[0030] The transfer head 25B transfers, for example, a semiconductor die 14B from the supply module 102B to the mounting module 101. Similar to the transfer head 25A, the transfer head 25B includes a base 27B and a pickup nozzle 28B, which includes a casing 29B, a suction head 30B, and an electromagnetic coil 31B.

[0031] The transfer head 25A is configured to be able to adsorb and transport both the semiconductor dies 14A and 14B, and the transfer head 25B is similarly configured to be able to adsorb and transport both the semiconductor dies 14A and 14B. Therefore, the combination of the transfer heads 25A and 25B with the semiconductor dies 14A and 14B is not limited to the above. The transfer head 25A may transport the semiconductor die 14B, or may transport both the semiconductor dies 14A and 14B. Similarly, the transfer head 25B may transport the semiconductor die 14A, or may transport both the semiconductor dies 14A and 14B. Furthermore, the mounting apparatus may be provided with only one transfer head, and this one transfer head may transport both the semiconductor dies 14A and 14B.

[0032] Next, the operation from supplying the semiconductor die 14A to mounting will be described.

[0033] First, pickup camera 16 captures an image of semiconductor die 14A on semiconductor wafer 13A to confirm the position of semiconductor die 14A. Push-up unit 15 pushes up semiconductor die 14A from semiconductor wafer 13A held by wafer holder 12A. Transfer head 25A picks up the pushed-up semiconductor die 14A, and transfers the semiconductor die 14A from wafer holder 12A of supply module 102A to transfer unit 20A of transfer mechanism 120. Transfer unit 20A transfers the picked-up semiconductor die 14A from supply module 102A to mounting module 101.

[0034] The semiconductor die 14A transported to the mounting module 101 is inverted together with the transport head 25A by the rotary shaft 24A. The mounting head 46A moves above the inverted semiconductor die 14A, and the motor 50 of the mounting nozzle 47A rotates the ball screw 52, ​​causing the base unit 51, pulse heater 53, and mounting tool 54 to descend. The mounting tool 54, which has descended to the position of the semiconductor die 14A, picks up the inverted semiconductor die 14A. This transfers the semiconductor die 14A from the transport head 25A to the mounting head 46A. The mounting tool 54, which has picked up the semiconductor die 14A, is raised by the ball screw 52, ​​which is rotated by the driving force of the motor 50, and is transported by the mounting head 46A along the gantry frame 45A to above the mounting stage 40. Here, the motor 50 of the mounting nozzle 47A rotates the ball screw 52, ​​causing the base part 51, the pulse heater 53, and the mounting tool 54 to descend, and the semiconductor die 14A is pressed against the circuit board 41. At this time, the semiconductor die 14A is heated by the pulse heater 53 and is mounted on the circuit board 41. The mounting tool 54 releases the semiconductor die 14A from suction, and after releasing the semiconductor die 14A mounted on the circuit board 41, the mounting tool 54 rises due to the ball screw 52 rotating with the driving force of the motor 50, and moves above the semiconductor die 14A that has been sucked onto the inverted transfer head 25A to receive the next semiconductor die 14A.

[0035] While the transfer head 25A is transferring the semiconductor die 14A, the pickup camera 16 and the push-up unit 15 move from the supply module 102A to the supply module 102B. Then, in the supply module 102B, as in the supply module 102A, the semiconductor die 14B is transferred from the wafer holder 12B of the supply module 102B to the transfer unit 20B of the transfer mechanism 120. Then, the transfer unit 20B transfers the adsorbed semiconductor die 14B from the supply module 102B to the mounting module 101. The transferred semiconductor die 14B is transferred from the transfer head 25B to the mounting head 46B, and is mounted on the circuit board 41 by the mounting head 46B. In this way, the semiconductor die 14A and the semiconductor die 14B are mounted on the circuit board 41 alternately or simultaneously.

[0036] As described above, in the mounting apparatus 1 of this embodiment, the mounting module 101, the supply module 102A, and the supply module 102B are arranged in this order in the X-axis direction, and the transport mechanism 120 has a plurality of transport units 20A, 20B configured to be able to transport a plurality of semiconductor dies 14A, 14B from each of the plurality of supply modules 102A, 102B, and is configured to extend in the X-axis direction across the mounting module 101 and the plurality of supply modules 102A, 102B.

[0037] This reduces the likelihood of misalignment of the semiconductor dies relative to the circuit board compared to a system that mounts multiple semiconductor dies supplied from multiple semiconductor wafers onto a single circuit board by preparing a mounting device for each semiconductor wafer and moving a single circuit board between the mounting devices. This reduces the likelihood of mounting defects due to misalignment. Furthermore, compared to a system that mounts multiple semiconductor dies supplied from multiple semiconductor wafers onto a single circuit board by replacing the semiconductor wafer during mounting using a single mounting device, this system reduces the mounting time, thereby preventing the drying of flux in the solder that joins the circuit board and the semiconductor dies. This reduces the likelihood of mounting defects due to drying of flux. Therefore, a mounting device 1 can be provided that can efficiently mount multiple semiconductor dies 14A, 14B onto a single circuit board 41.

[0038] In addition, in this embodiment, the mounting apparatus 1 has a supply module 102A that supplies the semiconductor die 14A and a supply module 102B that supplies the semiconductor die 14B, and the semiconductor die 14A and the semiconductor die 14B are of different types.

[0039] This allows two types of semiconductor dies 14A and 14B to be mounted on one circuit board 41 efficiently.

[0040] In this embodiment, wafer holder 12A of supply module 102A and wafer holder 12B of supply module 102B are configured to be movable in the Y-axis direction. The Y-axis direction, which is the direction of movement of each of the multiple wafer holders 12A and 12B, intersects with, for example, the X-axis direction, which is the direction of movement of each of the multiple transport units 20A and 20B.

[0041] With this, even if each of the plurality of wafer holders 12A, 12B does not move in the X-axis direction, the plurality of transport units 20A, 20B can pick up the semiconductor die 14A from the entire area of ​​the semiconductor wafer 13A and can pick up the semiconductor die 14B from the entire area of ​​the semiconductor wafer 13B. Therefore, compared to a configuration in which the wafer holders are configured to be movable in the X-axis direction as well, the mounting apparatus 1 can be made smaller.

[0042] In this embodiment, the mounting module 101 also has a plurality of mounting heads 46A, 46B that receive the semiconductor dies 14A, 14B from the plurality of transport units 20A, 20B and mount them on the circuit board 41. The plurality of mounting heads 46A, 46B are configured to be movable independently of each other.

[0043] This allows the efficiency of mounting the multiple semiconductor dies 14A and 14B in the mounting module 101 to be improved.

[0044] In this embodiment, the mounting apparatus 1 further includes a push-up unit 15. The push-up unit 15 is configured to be movable between the plurality of supply modules 102A and 102B, and pushes up the semiconductor die 14A from the semiconductor wafer 13A and delivers it to the transport unit 20A, and pushes up the semiconductor die 14B from the semiconductor wafer 13B and delivers it to the transport unit 20B.

[0045] According to this embodiment, one push-up unit 15 can be shared by two supply modules 102A and 102B, which simplifies the configuration of the mounting device 1 compared to when each supply module has its own push-up unit, thereby reducing the manufacturing and maintenance costs of the mounting device 1.

[0046] In this embodiment, the mounting apparatus 1 further includes a pickup camera 16. The pickup camera 16 is configured to be movable between the plurality of supply modules 102A and 102B, and recognizes the position of the semiconductor die 4A in the supply module 102A and the position of the semiconductor die 14B in the supply module 102B.

[0047] According to this embodiment, one pickup camera 16 can be shared by two supply modules 102A, 102B, which simplifies the configuration of the mounting device 1 compared to when each supply module has its own pickup camera, thereby reducing the manufacturing and maintenance costs of the mounting device 1.

[0048] In this embodiment, the mounting apparatus 1 includes two supply modules 102A and 102B, but a mounting apparatus according to an embodiment of the present invention may include three or more supply modules. To increase the variety of semiconductor dies to be mounted onto the circuit board 41 from the mounting apparatus 1, an additional supply module can be connected to the side of supply module 102B opposite to supply module 102A, and the transport mechanism 120 can be extended to cover the additional supply module. This makes it easy to add more types of semiconductor dies to be mounted, and prevents the dimensions of the mounting apparatus from increasing when the number of types of semiconductor dies to be mounted is increased.

[0049] Some or all of the embodiments of the present invention will be described below, but the present invention is not limited to the following descriptions.

[0050] [Appendix 1] a plurality of supply modules for supplying electronic components; a mounting module that mounts the electronic component on a substrate; a transport mechanism including at least one transport unit configured to be able to transport the electronic components from each of the plurality of supply modules to the mounting module, the transport mechanism extending across the plurality of supply modules and the mounting module in a first direction in a plan view; Equipped with Mounting equipment.

[0051] [Appendix 2] the mounting module transports the electronic component in a second direction intersecting the first direction; The mounting device described in [Appendix 1].

[0052] [Appendix 3] the plurality of supply modules include a first supply module that supplies a first electronic component and a second supply module that supplies a second electronic component of a different type from the first electronic component; The mounting device described in [Appendix 1] or [Appendix 2].

[0053] [Appendix 4] each of the plurality of supply modules supplies a semiconductor die as the electronic component from a semiconductor wafer; each of the plurality of supply modules has a wafer holder for holding the semiconductor wafer; the wafer holder is configured to be movable in a second direction intersecting the first direction in a plan view. A mounting device according to any one of [Appendix 1] to [Appendix 3].

[0054] [Appendix 5] the at least one transport unit includes a plurality of transport heads; The plurality of transport heads are configured to be movable independently of each other. A mounting device according to any one of [Appendix 1] to [Appendix 4].

[0055] [Appendix 6] the mounting module has a plurality of mounting heads that receive the electronic components from the at least one transport head and mount them on the substrate; The plurality of mounting heads are configured to be movable independently of each other. A mounting device according to any one of [Appendix 1] to [Appendix 5].

[0056] [Appendix 7] each of the plurality of supply modules supplies a semiconductor die as the electronic component from a semiconductor wafer; a push-up unit that pushes up the semiconductor die from the semiconductor wafer and transfers the semiconductor die to the at least one transfer unit, The push-up unit is configured to be movable between the plurality of supply modules. A mounting device according to any one of [Appendix 1] to [Appendix 6].

[0057] [Appendix 8] a pickup camera for detecting the position of the electronic component in the plurality of supply modules; The pickup camera is configured to be movable between the plurality of supply modules. A mounting device according to any one of [Appendix 1] to [Appendix 7].

[0058] As described above, according to one embodiment of the present invention, it is possible to provide a mounting apparatus that can efficiently mount a plurality of electronic components.

[0059] The above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangement, materials, conditions, shapes, sizes, etc., are not limited to those illustrated and can be modified as appropriate. Furthermore, configurations shown in different embodiments can be partially substituted or combined with each other. [Explanation of symbols]

[0060] 1...Mounting device 101...Mounting module 11... Mounting stand 40...Implementation Stage 41...Circuit board 42...Transport rail 43...Guide rail 44A, 44B...Slider 45A, 45B...Gantry frame 46A, 46B...Mounting head 47A, 47B... Mounting nozzle 50...Motor 51...Base part 52...Ball screw 53...Pulse heater 54...Implementation Tools 102A, 102B...Supply module 12A, 12B...wafer holder 13A, 13B...Semiconductor wafer 14A, 14B...Semiconductor die 15...Thrust unit 16...Pickup camera 120...Transport mechanism 20A, 20B...Transport unit 21A, 21B...Guide rail 22A, 22B...Slider 23A, 23B...Carriage 24A, 24B...Rotating shaft 25A, 25B...Transport head 27A, 27B...base 28A, 28B...Pickup nozzle 29A, 29B...Casing 30A, 30B...Suction head 31A, 31B...Electromagnetic coil

Claims

1. a plurality of supply modules for supplying electronic components; a mounting module that mounts the electronic component on a substrate; a transport mechanism including at least one transport unit configured to be able to transport the electronic components from each of the plurality of supply modules to the mounting module, the transport mechanism extending across the plurality of supply modules and the mounting module in a first direction in a plan view; Equipped with Mounting equipment.

2. the mounting module transports the electronic component in a second direction intersecting the first direction; The mounting device according to claim 1 .

3. the plurality of supply modules include a first supply module that supplies a first electronic component and a second supply module that supplies a second electronic component of a different type from the first electronic component; The mounting device according to claim 1 .

4. each of the plurality of supply modules supplies a semiconductor die as the electronic component from a semiconductor wafer; each of the plurality of supply modules has a wafer holder for holding the semiconductor wafer; The wafer holder is configured to be movable in a first direction. The mounting device according to claim 1 .

5. the at least one transport unit includes a plurality of transport heads; The plurality of transport heads are configured to be movable independently of each other. The mounting device according to claim 1 .

6. the mounting module has a plurality of mounting heads that receive the electronic components from the at least one transport unit and mount them on the board; The plurality of mounting heads are configured to be movable independently of each other. The mounting device according to claim 1 .

7. each of the plurality of supply modules supplies a semiconductor die as the electronic component from a semiconductor wafer; a push-up unit that pushes up the semiconductor die from the semiconductor wafer and transfers the semiconductor die to the at least one transfer unit, The push-up unit is configured to be movable between the plurality of supply modules. The mounting device according to claim 1 .

8. a pickup camera for detecting the position of the electronic component in the plurality of supply modules; The pickup camera is configured to be movable between the plurality of supply modules. The mounting device according to claim 1 .

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