Adjustable and non-adjustable heat shields affecting the temperature distribution profile of the substrate support

Abstract

A heat shield for a platen of a substrate support includes a body and an absorbing-reflecting-transmissive region. The absorbing-reflecting-transmissive region is in contact with the body and is configured to at least one of affect and modulate at least a portion of a heat flux pattern between a distal reference surface and the platen. The absorbing-reflecting-transmissive region includes an adjustable feature that adjusts at least a portion of the heat flux pattern.

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of U.S. Provisional Patent Application No. 62 / 907,082, filed September 27, 2019, and U.S. Provisional Patent Application No. 62 / 951,395, filed December 20, 2019. The entire disclosures of the above-referenced applications are incorporated herein by reference.

[0002] FIELD OF THE INVENTION This application relates to heat shields for substrate processing systems. [Background technology]

[0003] The background description provided herein is intended to generally indicate the relevance of the present disclosure. To the extent described in this Background section, not only the works of the inventors named herein, but also aspects of the description that may not otherwise be considered prior art at the time of submission, are not admitted, expressly or impliedly, as prior art to the present disclosure.

[0004] Substrate processing systems may be used to process substrates such as semiconductor wafers. Examples of substrate processing include etching, deposition, etc. During processing, the substrate may be arranged on a substrate support, such as an electrostatic chuck (ESC) or a vacuum chuck, and one or more process gases may be introduced into the processing chamber.

[0005] One or more process gases may be delivered to the processing chamber by a gas delivery system. In some systems, the gas delivery system includes a manifold connected to a showerhead located within the processing chamber. As an example, during plasma enhanced chemical vapor deposition (PECVD) processing, a substrate may be positioned on an ESC or vacuum chuck within the substrate processing system, and a thin film may be deposited on the substrate. The processing involves chemical reactions that occur after generating a plasma from reactive gases and discharging a radio frequency (RF) alternating current (AC) or direct current (DC). Summary of the Invention

[0006] A heat shield for a platen of a substrate support is provided. The heat shield includes a body and an absorptive-reflective-transmissive region. The absorptive-reflective-transmissive region is in contact with the body and is configured to affect at least a portion of a heat flux pattern between a distal reference surface and the platen. The absorptive-reflective-transmissive region includes an adjustable feature that adjusts at least a portion of the heat flux pattern.

[0007] In other features, the absorbing-reflecting-transmitting regions are configured to influence at least a portion of a heat flux pattern between the distal reference surface and the platen. In other features, the body has a modular structure including the absorbing-reflecting-transmitting regions. In other features, one or more of the absorbing-reflecting-transmitting regions include one or more holes. In other features, one or more of the absorbing-reflecting-transmitting regions include at least one of (i) one or more ridges or (ii) one or more trenches.

[0008] In other features, one or more of the absorbing-reflecting-transmitting regions include at least one of (i) layers with multiple different thicknesses or (ii) layers with different materials. In other features, one or more of the absorbing-reflecting-transmitting regions are implemented as different or one of overlapping layers or radially adjacent layers. In other features, the absorbing-reflecting-transmitting regions are implemented as segments that can be adjusted, moved, swapped, or replaced to adjust the heat flux pattern.

[0009] In other features, the body is configured to attach to the axis at a location between the platen and a distal reference surface, which is a surface of a processing chamber wall or other surface that affects the radiation boundary conditions. In other features, one or more of the absorbing-reflecting-transmitting regions can be adjusted to control azimuthal and radial temperature non-uniformities of at least one of the platen or the substrate.

[0010] In other features, the body is configured to attach to the axis at a location between the platen and a distal reference surface, which is a surface of a processing chamber wall. In other features, one or more of the absorbing-reflecting-transmitting regions can be adjusted to control azimuthal and radial temperature non-uniformity of the platen.

[0011] In other features, the absorbing-reflecting-transmitting regions are disposed at different azimuthal or radial locations on the body, with one or more of the absorbing-reflecting-transmitting regions having at least one shape, size, material, contour, or pattern that differs from another one or more of the absorbing-reflecting-transmitting regions.

[0012] In another feature, a heat shield for a platen of a substrate support is provided. The heat shield includes a body and absorbing-reflecting-transmitting portions. The absorbing-reflecting-transmitting portions are in contact with or disposed as part of the body and are configured to affect at least a portion of a heat flux pattern between a distal reference surface and the platen. One or more of the absorbing-reflecting-transmitting portions include at least one heat flux-modifying property that differs from another one or more of the absorbing-reflecting-transmitting portions.

[0013] In other features, the absorbing-reflecting-transmitting portions are at least one of separate portions, layers, or superimposed layers. In other features, the absorbing-reflecting-transmitting portions are disposed at least one of radially and azimuthal angles relative to one another. In other features, the absorbing-reflecting-transmitting portions are at different azimuthal or radial locations on the body.

[0014] In other features, one or more of the absorbing-reflecting-transmitting portions include one or more holes. In other features, one or more of the absorbing-reflecting-transmitting portions include at least one of (i) one or more ridges or (ii) one or more trenches.

[0015] In other features, one or more of the absorbing-reflecting-transmitting portions include at least one of multiple thicknesses or different materials. In other features, one or more of the absorbing-reflecting-transmitting portions are implemented as different or at least one of overlapping layers or radially adjacent layers.

[0016] In other features, the body is configured to attach to the axis at a location between the platen and a distal reference surface that is a surface of a processing chamber wall. In other features, the absorbing-reflecting-transmitting portion is configured to minimize azimuthal and radial temperature non-uniformities of the platen.

[0017] In other features, one or more of the absorbing-reflecting-transmitting portions have at least one shape, size, material, contour, or pattern that is different from another one or more of the absorbing-reflecting-transmitting portions. In other features, the heat shield further includes a retaining clamp that includes the body. The absorbing-reflecting-transmitting portions are implemented as segments that extend radially outward from a sidewall of the body.

[0018] In another feature, a heat shield for a platen of a substrate support is provided. The heat shield includes a body and an absorbing-reflecting-transmitting region. The absorbing-reflecting-transmitting region is in contact with the body and configured to at least one of affecting or modulating at least a portion of a radiant heat flux transfer pattern between the distal reference surface and the platen. The absorbing-reflecting-transmitting region includes an adjustable aspect for adjusting at least a portion of the radiant heat flux transfer pattern. In another feature, a heat shield for a platen of a substrate support is provided. The heat shield includes a body and an absorbing-reflecting-transmitting portion. The absorbing-reflecting-transmitting portion is in contact with the body or disposed as part of the body and configured to at least one of affecting or modulating at least a portion of the radiant heat flux transfer pattern between the distal reference surface and the platen. One or more of the absorbing-reflecting-transmitting portions include at least one radiant heat flux transfer characteristic that differs from one or more of the other absorbing-reflecting-transmitting portions.

[0019] A heat shield for a platen of a substrate support is provided. The heat shield includes an absorbing-reflecting-transmitting segment and a frame. The frame includes a central opening configured to receive a central axis of the substrate support, tabs that protrude radially inward and engage slots in the central axis, and a window configured to be at least partially covered by the absorbing-reflecting-transmitting segment at a designated location. The absorbing-reflecting-transmitting segment is disposed within or across the window and is configured to be held by the frame. In another feature, the absorbing-reflecting-transmitting segment and the frame thermally shield a portion of a processing chamber wall from the platen.

[0020] In other features, the heat shield includes a frame. The absorbing-reflecting-transmitting region is implemented as an absorbing-reflecting-transmitting segment. The frame includes a central opening configured to receive an axis of a substrate support and a window configured to be at least partially covered by the absorbing-reflecting-transmitting segment at a designated location. The body is implemented as a frame. The absorbing-reflecting-transmitting segment is disposed within or across the window and is configured to be held by the frame. In other features, the frame is ring-shaped or polygon-shaped. In other features, the frame includes tabs that engage with hardware components.

[0021] In other features, the window includes a corresponding edge configured to contact or engage the absorbing-reflecting-transmitting segment at a designated location.

[0022] In other features, the window includes a corresponding ledge configured to hold the absorbing-reflecting-transmitting segment in a designated location, the absorbing-reflecting-transmitting segment configured to be disposed within the window and on the ledge.

[0023] In other features, one or more of the absorptive-reflective-transmissive segments are reflective segments that reflect thermal energy received from the platen back to the platen. In other features, one or more of the absorptive-reflective-transmissive segments are absorptive segments that absorb thermal energy emitted by the platen.

[0024] In other features, one or more of the absorbing-reflecting-transmitting segments are transmissive segments that allow a portion of thermal energy emitted from the platen to pass through the one or more of the absorbing-reflecting-transmitting segments to a distal reference surface. In other features, one or more of the absorbing-reflecting-transmitting segments are shaped to vary their effect on azimuthal temperature non-uniformity across the platen. In other features, one or more of the absorbing-reflecting-transmitting segments are shaped to vary their effect on radial temperature non-uniformity across the platen. In other features, the frame is ring-shaped.

[0025] In other features, each of the absorbing-reflecting-transmitting segments is modular and can be positioned at multiple locations within the window. In other features, at least two of the absorbing-reflecting-transmitting segments are different sizes. In other features, the absorbing-reflecting-transmitting segments are wedge-shaped. In other features, the absorbing-reflecting-transmitting segments are circular.

[0026] In other features, the frame includes a first portion and a second portion. The first portion includes a window. The second portion includes a groove and a ridge. The groove reflects thermal energy emitted by the platen back to the platen. In other features, at least one of the absorbing-reflecting-transmitting segments is at least partially transmissive. In other features, at least one of the absorbing-reflecting-transmitting segments includes a layer.

[0027] In other features, the layers include a pair of layers and an intermediate layer, each of the pair of layers including sapphire, the intermediate layer being disposed between the pair of layers, and the intermediate layer including ceramic.

[0028] In other features, the layers include a pair of layers and an intermediate layer, each of the pair of layers including sapphire, and the intermediate layer disposed between the pair of layers, the intermediate layer including at least one of a ceramic, a refractory material, or a metal.

[0029] In other features, the absorbing-reflecting-transmitting segments include wedging sides. The frame includes wedging tabs for engaging the wedging sides of the absorbing-reflecting-transmitting segments. In other features, the central opening of the frame is configured to receive at least a first portion of the thermal barrier. The frame is configured to be arranged over a second portion of the thermal barrier. In other features, each of the windows has a predetermined number of designated locations for one or more of the absorbing-reflecting-transmitting segments.

[0030] In other features, a heat shield assembly is provided and includes a heat shield and a first thermal barrier. In other features, the heat shield assembly includes a second thermal barrier. The heat shield is disposed on and configured to engage the first thermal barrier. The first thermal barrier is disposed on and configured to engage the second thermal barrier.

[0031] In other features, a substrate support is provided and includes a heat shield, a first thermal barrier, a central shaft, and a platen, the first thermal barrier being connected to the central shaft, and the heat shield being disposed on the first thermal barrier.

[0032] In other features, the substrate support includes a second thermal barrier connected to the central axis and a second heat shield disposed on the second thermal barrier, hi other features, a radially innermost edge of the heat shield does not contact the central axis.

[0033] In another feature, a heat shield for a platen of a substrate support of a substrate processing system is provided. The heat shield includes an absorbing-reflecting-transmitting segment and a frame. The frame includes a central opening for a central axis and multiple windows. The central opening is configured to receive at least a portion of a first thermal barrier. The windows are configured to hold the absorbing-reflecting-transmitting segment at a designated location. The absorbing-reflecting-transmitting segment is configured to be at least one of disposed within the window and / or disposed across the window. The absorbing-reflecting-transmitting segment and the frame thermally isolate a portion of a processing chamber wall from the platen.

[0034] In other features, one or more of the absorbing-reflecting-transmitting segments are shaped to vary the effect the absorbing-reflecting-transmitting segment has on azimuthal temperature non-uniformity across the platen. In other features, one or more of the absorbing-reflecting-transmitting segments are shaped to vary the effect the absorbing-reflecting-transmitting segment has on radial temperature non-uniformity across the platen.

[0035] In other features, the absorbing-reflecting-transmitting segment includes a first absorbing-reflecting-transmitting segment and a second absorbing-reflecting-transmitting segment. The size of the second absorbing-reflecting-transmitting segment is different from the size of the first absorbing-reflecting-transmitting segment. In other features, the first thermal barrier is hexagonal.

[0036] In another aspect, a heat shield assembly is provided, the heat shield assembly including a heat shield and a first thermal barrier. In another aspect, the heat shield assembly includes a second thermal barrier configured to be connected to the central shaft. The first thermal barrier is configured to be disposed on the second thermal barrier.

[0037] In other features, the central opening is hexagonal. At least a portion of the first thermal barrier is hexagonal and engages the central opening. The second thermal barrier includes 12 sides. Six of the 12 sides of the second thermal barrier are configured to engage with six sides of the first thermal barrier.

[0038] In another feature, a heat shield for a platen of a substrate support of a substrate processing system is provided. The heat shield includes a body. The body includes: a central shaft opening configured to receive at least a portion of a first thermal barrier; a first portion including a first groove and a first ridge, where the first groove reflects thermal energy emitted by the platen back to the platen; a second portion including a second groove and a second ridge, where the second groove transfers thermal energy received from the platen to a processing chamber wall; and an overlapping portion disposed between the first and second portions. In another feature, the body is configured to thermally shield a portion of the processing chamber wall from the platen. In another feature, the overlapping portion does not include a groove.

[0039] In another feature, a heat shield for a platen of a substrate support is provided. The heat shield includes an absorbent-reflectant-transmitting segment and a retaining clamp. The retaining clamp includes a body configured to connect to a central axis of a substrate processing chamber and a sidewall with slots. Each slot is configured to receive a corresponding portion of one of the absorbent-reflectant-transmitting segments. The absorbent-reflectant-transmitting segments are cantilevered such that a first portion of the sidewall is located below the absorbent-reflectant-transmitting segment and a second portion of the sidewall is located above the absorbent-reflectant-transmitting segment.

[0040] In other features, the slots and absorbing-reflecting-transmitting segments are configured so that each of the absorbing-reflecting-transmitting segments can be retained in any one of the slots. In other features, the absorbing-reflecting-transmitting segments are wedge-shaped. In other features, the absorbing-reflecting-transmitting segments include access holes for installing and removing the absorbing-reflecting-transmitting segments from the retaining clamp. In other features, the absorbing-reflecting-transmitting segments are arranged around the retaining clamp to affect a heat flux pattern 360° around the central axis.

[0041] In other features, one or more of the plurality of absorbing-reflecting-transmitting portions includes at least one of (i) one or more holes or (ii) one or more pockets.

[0042] In other features, each of the absorbing-reflecting-transmitting segments is vertically offset from an adjacent pair of absorbing-reflecting-transmitting segments. In other features, the absorbing-reflecting-transmitting segments alternate in vertical position around the periphery of the retaining clamp, such that every other absorbing-reflecting-transmitting segment is at a first vertical position and every other absorbing-reflecting-transmitting segment is at a second vertical position, the second vertical position being higher than the first vertical position.

[0043] In another feature, a method for manufacturing a heat shield for a platen of a substrate support is provided, the method including: specifying a first heat shield to accommodate one or more critical dimensions of a first substrate, including setting parameters of the first heat shield to provide predetermined heat flux pattern modifying characteristics during use of the first heat shield; fabricating the first heat shield according to the parameters; performing a deposition or etch operation to deposit a layer on or etch a layer of the first substrate while using the first heat shield; performing a metrology operation to measure the one or more critical dimensions; analyzing data generated as a result of performing the metrology operation; and determining whether to redesign the first heat shield to meet first predetermined criteria for the one or more critical dimensions.

[0044] In other features, the method further includes, in response to determining to redesign the first heat shield, adjusting parameters to provide predetermined heat flux pattern modification characteristics; fabricating a second heat shield in accordance with the adjusted parameters; performing a deposition or etching operation to deposit a layer on or etch a layer of the second substrate while using the second heat shield; performing a metrology operation to measure one or more critical dimensions; analyzing data generated as a result of performing the metrology operation; and determining whether to redesign the second heat shield to meet first predetermined criteria for the one or more critical dimensions.

[0045] In other features, the method further includes reconfiguring the first heat shield to fine-tune one or more parameters to set or improve one or more critical dimensions; performing a deposition or etching operation to deposit a layer on or etch a layer of the second substrate while using the first heat shield; performing a metrology operation to measure the one or more critical dimensions; analyzing data generated as a result of performing the metrology operation; and determining whether to redesign the first heat shield to meet first predetermined criteria for the one or more critical dimensions.

[0046] In other features, fine-tuning one or more parameters of the heat shield includes at least one of determining the number of absorbing-reflecting-transmitting segments to include, determining the location of the absorbing-reflecting-transmitting segments on the body of the heat shield, or determining the type of absorbing-reflecting-transmitting segments.

[0047] In other features, the method further includes fabricating the unitary heat shield based on the tuned one or more parameters. In other features, the method further includes fabricating the unitary heat shield based on the parameters.

[0048] Areas of applicability of the present disclosure will become more apparent from the detailed description, claims, and drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

[0049] The present disclosure will become more fully understood from the detailed description and the accompanying drawings. [Brief explanation of the drawings]

[0050] [Figure 1] FIG. 1 is a functional block diagram of a substrate processing system including a processing chamber having a heat shield according to an embodiment of the present disclosure.

[0051] [Figure 2] FIG. 2 is a cross-sectional view of a substrate support including a platen and a heat shield according to an embodiment of the present disclosure.

[0052] [Figure 3] FIG. 3 is a perspective view of a heat shield and corresponding wedge-shaped absorption-reflection-transmission (ART) segment according to an embodiment of the present disclosure.

[0053] [Figure 4] FIG. 4 is a top view of another heat shield including raised reflective segments according to an embodiment of the present disclosure.

[0054] [Figure 5] FIG. 5 is a top cross-sectional view of a processing chamber including another heat shield having a solid portion without ART segments and another portion with wedge-shaped heat absorption segments according to an embodiment of the present disclosure.

[0055] [Figure 6] FIG. 6 is a top cross-sectional view of a processing chamber including another heat shield having a solid portion without ART segments and another portion with circular ART segments according to an embodiment of the present disclosure.

[0056] [Figure 7] FIG. 7 is a top cross-sectional view of a processing chamber including another heat shield having a reflector portion and another portion including circular ART segments according to an embodiment of the present disclosure.

[0057] [Figure 8] FIG. 8 is a top cross-sectional view of another heat shield having a reflector portion and a radiator portion according to an embodiment of the present disclosure.

[0058] [Figure 9] FIG. 9 is a bottom perspective view of the heat shield of FIG.

[0059] [Figure 10] FIG. 10 is a side perspective view of a portion of the heat shield of FIG.

[0060] [Figure 11] FIG. 11 is a top view of another heat shield including wedge-shaped ART segments of the same size and a thermal barrier according to an embodiment of the present disclosure.

[0061] [Figure 12] FIG. 12 is a top view of another heat shield including different sized wedge-shaped ART segments and a thermal barrier according to an embodiment of the present disclosure.

[0062] [Figure 13] FIG. 13 is a top perspective view of the frame and thermal barrier of the heat shield of FIGS.

[0063] [Figure 14] FIG. 14 is a top perspective view of a first thermal barrier of the thermal shield of FIGS.

[0064] [Figure 15] FIG. 15 is a top perspective view of a second thermal barrier within the thermal barriers of the heat shield of FIGS.

[0065] [Figure 16] FIG. 16 is a top perspective view of a wedge-shaped segment having a window in the form of a plate according to an embodiment of the present disclosure.

[0066] [Figure 17] FIG. 17 is a top perspective view of a wedge-shaped segment having an upper surface of varying height, according to an embodiment of the present disclosure.

[0067] [Figure 18] FIG. 18 is a top perspective view of a wedge-shaped segment having a double-notched radially inner end according to an embodiment of the present disclosure.

[0068] [Figure 19] FIG. 19 is a top perspective view of a wedge-shaped segment having a thick hollow body according to an embodiment of the present disclosure.

[0069] [Figure 20] FIG. 20 is a perspective view of a different wedge-shaped segment according to an embodiment of the present disclosure.

[0070] [Figure 21] FIG. 21 is a perspective view of another heat shield including some of the wedge-shaped segments of FIG.

[0071] [Figure 22] FIG. 22 is a perspective view of a heat shield frame including wedging tabs for ART segments.

[0072] [Figure 23] FIG. 23 is a top perspective view of a processing chamber and a segmented heat shield with offset cantilevered ART segments and retaining clamps in place of a frame according to an embodiment of the present disclosure.

[0073] [Figure 24]FIG. 24 is a side view of a substrate support including a platen and a laminated heat shield according to an embodiment of the present disclosure.

[0074] [Figure 25] FIG. 25 is a side view of an ART segment including multiple layers, according to an embodiment of the present disclosure.

[0075] [Figure 26] FIG. 26 is a side perspective view of a non-adjustable heat shield according to another embodiment of the present disclosure.

[0076] [Figure 27] FIG. 27 is a flow chart illustrating a method for manufacturing a tunable heat shield according to another embodiment of the present disclosure.

[0077] [Figure 28] FIG. 28 is a flow chart illustrating a method for adjusting an adjustable heat shield according to another embodiment of the present disclosure.

[0078] [Figure 29] FIG. 29 is a flow chart illustrating a method for manufacturing a non-adjustable heat shield according to another embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0079] In the drawings, reference numbers may be reused to identify similar and / or identical elements.

[0080] During PECVD processing, the platen of the substrate support (sometimes called a pedestal or susceptor) is heated via one or more internal heating elements. The temperature of the substrate support can be on the order of 1000°C. A large temperature difference exists between the substrate support and the process chamber walls. As an example, the chamber walls can be 75°C or lower. As a result, there is a large amount of heat (or energy) loss from the substrate support to the chamber walls and / or other components inside the process chamber that are at a cooler temperature than the substrate support.

[0081] For PECVD processes, there are many film properties that are sensitive to temperature and corresponding performance parameters of the substrate (wafer) that are constantly monitored and / or evaluated. Certain applications can place stringent requirements on the uniformity of performance parameters within a wafer and from wafer to wafer. For example, the temperature of a platen can vary depending on the process chamber wall temperature, the amount of heating of the platen by one or more heating elements within the platen, and the substrate processing being performed within the process chamber. The temperature distribution profile across the platen is based on the properties of the platen material, the amount of heat captured and absorbed by the platen, and the heat lost to the environment, including the process chamber walls.

[0082] Controlling the power to the heating elements in the platen of the substrate support provides a finite amount of control over the temperature distribution profile of the platen. By controlling the heat lost from the platen to surrounding components and the environment, thermal modulation of this temperature distribution can be better controlled. Thermal modulation refers to the emission of heat from the platen and the reflection of the emitted heat back to the platen, which results in a temperature across the entire surface of the platen.

[0083] Examples provided herein include adjustable and non-adjustable heat shields positioned between the platen and the processing chamber wall. The heat shields may be "ring-shaped" and may include multiple absorption-reflection-transmission (ART) regions, ART segments, and / or ART portions with different heat flux pattern-altering properties that may be adjustable and / or preset to provide a selected platen temperature distribution profile. The ART regions, ART segments, and ART portions alter the heat flux pattern between the platen and a distant reference surface, such as the surface of the plasma chamber wall.

[0084] As used herein, the terms "ART region," "ART segment," and "ART portion" refer to a region, segment, or portion of a heat shield having corresponding heat absorption, reflection, and transmission properties. ART regions and portions of tunable and non-tunable heat shields may refer to segments, separate sections, non-separate sections, radially arranged sections, azimuthally arranged sections, layers, overlapping layers, overlapping layers, etc. The tunable aspects of the heat shield may be used to adjust the temperature of the platen and, consequently, the refractive index of the platen, which affects the temperature of the substrate being processed. The heat shield provides preset and / or adjustable parameters to control heat loss to the processing chamber environment, including heat loss to components within the processing chamber and / or to the processing chamber walls. Some ART segments of tunable heat shields provide a segmented modular design that can be customized for a variety of different temperature distribution profiles and corresponding degrees of heat loss. ART regions, ART segments, and ART portions can be preset and / or adjusted to control azimuthal and radial temperature nonuniformities.

[0085] The disclosed examples help improve azimuthal and radial temperature uniformity across the substrate platen, increase control over the amount of thermal compensation when adjusting the temperature distribution profile, provide hardware fine-tuning to compensate for hardware thermal inaccuracies, provide process fine-tuning to compensate for process thermal inaccuracies, reduce the amount of particles generated during processing by covering potential contaminants and thermally shielding metal parts that may become hot and generate particles, and improve substrate support performance without increasing the cost of the substrate support. The disclosed examples also help improve the thermal response of the platen's heating elements, thereby improving productivity. By reducing heat loss, the duty cycle of the heating elements may be reduced because less energy is required to provide the same level of heating. Reducing heat loss also allows the use of less expensive hardware rated for lower levels of heating.

[0086] FIG. 1 shows a substrate processing system 100 including a process chamber 101 having a heat shield 102. The heat shield 102 may be adjustable or non-adjustable and may be configured the same as or similar to any of the heat shields disclosed herein. While a single heat shield is shown, two or more heat shields may be included, as shown in FIG. 21. While FIG. 1 shows a capacitively coupled plasma (CCP) system, embodiments disclosed herein may be applicable to other plasma processing systems. Embodiments may be applicable to plasma-enhanced chemical vapor deposition (PECVD) processes.

[0087] The substrate processing system 100 includes a substrate support 104, such as an electrostatic or vacuum chuck, including a platen 106 disposed within a processing chamber 101. The substrate support 104, and other substrate supports disclosed herein, may be referred to as pedestals or susceptors. The processing chamber 101 has at least one distal reference surface (e.g., a distal reference front surface 103) facing a thermal shield 102. Other components, such as an upper electrode 108, may be disposed within the processing chamber 101. During operation, a substrate 109 is arranged on the platen 106 of the substrate support 104 and electrostatically or vacuum clamped thereto, and an RF plasma is generated within the processing chamber 101.

[0088] By way of example only, the upper electrode 108 may include a showerhead 110 for introducing and distributing gases. The showerhead 110 may include a stem 111 with one end connected to the top surface of the processing chamber 101. The showerhead 110 is generally cylindrical and extends radially outward from the opposing end of the stem 111 at a location spaced from the top surface of the processing chamber 101. The surface facing the substrate or the showerhead 110 includes holes through which process or purge gases flow. Alternatively, the upper electrode 108 may include a conductive plate, and gases may be introduced in another manner. The platen 106 may act as the lower electrode.

[0089] The platen 106 may include a temperature control element (TCE), which may receive power from the power supply 112. The RF generation system 120 generates and outputs an RF voltage to the upper electrode 108. The RF generation system 120 may generate and output an RF voltage to the substrate support 104. One of the upper electrode 108 and the substrate support 104 may be DC grounded, AC grounded, or at a floating potential. By way of example only, the RF generation system 120 may include one or more RF generators 123 (e.g., capacitively coupled plasma RF power generators and / or other RF power generators) that generate an RF voltage that is supplied to the upper electrode 108 by one or more matching networks 127. The RF generators 123 may be high-power RF generators producing, for example, 6 kilowatts (kW) to 10 kilowatts or more of power.

[0090] The gas delivery system 130 includes one or more gas sources 132-1, 132-2, ..., and 132-N (collectively, gas sources 132), where N is an integer greater than or equal to 1. The gas sources 132 supply one or more precursors and gas mixtures of one or more precursors. The gas sources 132 may also supply etching gases, carrier gases, and / or purge gases. Vaporized precursors may also be used. The gas sources 132 are connected to a manifold 140 by valves 134-1, 134-2, ..., and 134-N (collectively, valves 134) and mass flow controllers 136-1, 136-2, ..., and 136-N (collectively, mass flow controllers 136). The output of the manifold 140 is supplied to the processing chamber 101. By way of example only, the output of the manifold 140 is supplied to the showerhead 110.

[0091] The substrate processing system 100 further includes a heating system 141 including a temperature controller 142 that may be connected to the TCE via a power supply 112. Although shown separately from the system controller 160, the temperature controller 142 may be implemented as part of the system controller 160. The platen 106 may include multiple temperature control zones (e.g., four zones each including four temperature sensors).

[0092] The temperature controller 142 may control the operation of the TCE and, consequently, the temperature of the TCE to control the temperature of the platen 106 and the substrate (e.g., substrate 109). The temperature controller 142 and / or the system controller 160 may control the current supplied to the TCE based on detected parameters obtained from the sensor 143 within the process chamber 205. The temperature sensor 243 may include a resistive temperature element, a thermocouple, a digital temperature sensor, and / or other suitable temperature sensor. During a deposition process, the platen 106 may be heated to a predetermined temperature (e.g., 650° C.).

[0093] Valves 156 and pumps 158 may be used to evacuate reactants from the process chamber 101. A system controller 160 may control the components of the substrate processing system 100, including controlling the supplied RF power levels, the pressure and flow rates of supplied gases, RF matching, etc. The system controller 160 controls the states of the valves 156 and pumps 158. A robot 170 may be used to deliver substrates onto and remove substrates from the substrate support 104. For example, the robot 170 may transfer substrates between the substrate support 104 and a load lock 172. The robot 170 may be controlled by the system controller 160. The system controller 160 may control the operation of the load lock 172.

[0094] The power supply 112 may provide power, including high voltage, to electrodes in the substrate support 104 to electrostatically clamp the substrate 109 to the platen 106. The power supply 112 may be controlled by a system controller 160. Valves, pumps, power supplies, RF generators, etc. may be referred to as actuators. The TCE may be referred to as a temperature control element.

[0095] FIG. 2 shows a substrate support 200 including a central shaft 202 and a platen 204. A heat shield 206 is adjustable and supported by the shaft 202. The heat shield 206 may be replaced with any of the other heat shields disclosed herein. The central shaft 202 may be hollow to extend upward from the processing chamber wall 208 to provide power to one or more heating elements (one heating element 207 is shown) in the platen 204. A substrate 210 is disposed on the platen 204. The heat shield 206 is ring-shaped, has a radially inner opening 216 and a frame 218, and may include an ART segment 220 disposed on the frame 218. Examples of ART segments 220 are shown in FIGS. 3-5, 11, and 15-19. Other ART segments and surfaces are shown in FIGS. 6-10, 20, and 21.

[0096] The heat shield 206 reduces the temperature gradient between the platen 204 and the next object near the platen 204. For example, without the heat shield 206, when the temperature of the platen 204 is 650°C and the temperature of the processing chamber wall is 75°C, the temperature gradient between the platen 204 and the processing chamber 208 may be 575°C. With the heat shield 206 and in a steady state, when the temperature of the platen 204 is 650°C and the temperature of the heat shield is 500°C-640°C, the temperature gradient may be reduced to 10°C-150°C (or, as another example, 10°C-20°C). Thus, a first difference between the cold zone of the platen 204 and the heat shield and a second difference between the hot zone of the platen 204 and the shield may be minimized, and the difference between the first difference and the second difference may be minimized and / or insignificant.

[0097] The ART segments 220 may be modular and replaceable. They are mounted on a frame 218 and supported thereon by gravity. ART segments, as well as other ART segments disclosed herein, may have different shapes, sizes, angled surfaces, materials, heights, widths, lengths, contours, patterns, etc. ART segments, as well as other ART segments disclosed herein, may each have multiple layers. The layers may be formed from different materials and may or may not be stacked on top of each other, and / or may or may not overlap each other. Each ART segment 220 has its own absorption, reflection, and transmission levels. These characteristics and / or parameters are set based on the temperature distribution and / or reflectance profile for the platen and a given application.

[0098] The substrate support 200 may further include one or more thermal barriers (one thermal barrier 230 is shown). The heat shield 206 and the heat barrier 230 may be collectively referred to as a heat shield assembly. The heat barrier 230 may be attached to the shaft 202 and may support the heat shield 206. The heat shield 206 may rest on the heat barrier 230. The weight and thickness of the heat shield 206, including the frame 218 and ART segments 220, may be minimized and balanced so that the heat shield 206 is balanced on the heat barrier 230 and (i) the distance between the heat shield 206 and the processing chamber wall 208 remains the same, and the distance between the heat shield 206 and the platen 204 remains the same. When balanced, the top surface 240 of the heat shield 206 may be parallel to the bottom surface 242 of the platen 204. Similarly, the bottom surface 244 of the heat shield 206 may be parallel to the top (or distal reference) surface 246 of the processing chamber wall 208. In an embodiment, the weight and thickness of the heat shield 206 is minimized.

[0099] The heat shield 206 is attached to the shaft at a location between the platen 204 and the distal reference surface 246, but may alternatively or additionally be placed between the platen 204 and one or more other surfaces, thereby further affecting the radiation boundary conditions. The exchange of thermal energy via radiation between any two bodies depends on the temperature, emissivity, absorption, reflection, and transmission of both the bodies and the view factor between the two bodies. A change in any of these parameters results in a change in the thermal energy exchange. These parameters are sometimes grouped together and referred to as the radiation boundary conditions.

[0100] Increasing the infrared transmission of the heat shield 206 under the hot zone of the platen 204 increases heat loss from the platen 204. Improving the directional emissivity of the heat shield 206 under the cooler zone of the platen 204 reduces heat loss, and thus, if the heat shield 206 is configured to act as a focusing ring, infrared radiation may be reflected back to the platen 204. The ART segment 220 may be configured to reflect infrared radiation emitted by the platen 204. Arrow 250 illustrates focused infrared radiation reflection. Arrow 252 illustrates infrared radiation from the platen 204. Arrow 254 illustrates infrared radiation transmission through the heat shield 206.

[0101] The thermal barrier 230 prevents premature failure of the heat shield 206 due to a high temperature gradient between the heat shield 206 and the processing chamber wall 208. If a large temperature gradient exists, cracks may develop within the heat shield 206. The thermal barrier 230 reduces the temperature gradient between the heat shield and the next adjacent object, which is the heat shield 206. This temperature gradient reduction prevents cracks within the heat shield 206, thereby increasing the reliability of the heat shield 206. Therefore, the thermal barrier 230 and other thermal barriers disclosed herein may be formed from aluminum oxide (Al2O3), and / or aluminum nitride (AlN), and / or any other suitable refractory material, and / or a suitable metal. In some embodiments, the thermal barrier 230 and other thermal barriers disclosed herein are formed from an insulating material and act as thermal insulators.

[0102] The ART segments 220 may be configured to adjust (or set) the temperature distribution profile across the platen 204. Examples of ART segments 220 are shown in FIGS. 3-5, 11, 12, and 16-20. FIG. 3 shows a heat shield 300 including a frame 302 with an opening (or window) 304 for an ART segment and a tab 305 for engaging a central shaft. While the frame 302 is shown with the tab 305 for engaging the central shaft, it may have tabs for engaging one or more other hardware components. The tabs may extend inward or outward and may be located on the interior of the frame 302 as shown, or on other portions of the frame 302. As shown, the ART segments are wedge-shaped and include a transmissive (or evacuating) segment 306, a solid minimally transmissive segment 308, and a reflective (non-transmissive) segment 310. The ART segments may have different widths that partially or completely cover one or more of the openings 304. One or more of the openings 304 may not include an ART segment.

[0103] Frame 302 may have any number of ART segment openings. During substrate processing, one or more of openings 304 may be empty, partially filled, or completely filled with ART segments. In the illustrated example, frame 302 has three openings configured to receive ART segments: one opening 304 is completely filled with segment 306, a second opening is completely filled with segment 310, and a third opening is partially filled with segment 308.

[0104] At a given location on the heat shield 300, the maximum amount of heat transmission from the platen to the processing chamber wall is provided when no ART shield is positioned on the frame between the platen and the processing chamber wall. A reduced amount of heat transmission may then be provided when one of the segments 306 is positioned between the platen and the processing chamber wall. The maximum amount of heat absorption may be provided when one of the segments 308 is positioned between the platen and the processing chamber wall. The maximum amount of thermal energy reflection may be provided when one of the segments 310 is positioned between the platen and the processing chamber wall. Arrows 326 are shown to illustrate the thermal impact on the platen of a platen without any ART segments, the transmissive segment 306, the solid, minimally transmissive segment 308, and the reflective (non-transmissive) segment 310. By way of example, the transmissive segment 306 may be formed from sapphire and / or other suitable thermally transmissive material. The solid, minimally transmissive segment 308 may be formed from ceramic, zirconium, and / or other suitable minimally transmissive and heat-absorbing materials. The reflective (non-transmissive) segments 310 may be formed from aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN), and / or other suitable reflective materials.

[0105] Each of the ART segments 306, 308, 310 may include removal holes (one hole is designated 320) for grasping or removing the ART segment 306, 308, 310 with a finger. The frame 302 may have lift pin holes 322 through which lift pins pass and are used to lift the substrate off the platen. The frame 302 also includes a peripheral ledge 330 on which the segments 306, 308, 310 rest within each of the openings 304. While the segments 306, 308, 310 are shown within a particular one of the openings 304, they may be moved to other openings within the openings 304. Each of the openings 304 may contain different types of ART segments, including different types of segments 306, 308, 310.

[0106] The reflective segment 310 includes ridges 350 separated by grooves 352 having concave surfaces. The sides of the ridges 350 may be perpendicular to the grooves 352 or may be angled to have a predetermined pitch to direct reflected heat at a predetermined angle and / or to concentrate heat on a particular zone of the platen.

[0107] 4 shows another heat shield 400 including a frame 402 having an opening 404 with a ledge (one designated 406) in which a raised reflective segment 408 is positioned. The raised reflective segment 408 may be wedge-shaped as shown. Available positions for the raised reflective segment 408 are designated by the numbers 1 through 9. Although nine positions are shown, the size of the raised reflective segment 408 and the size of the opening may vary to accommodate any number of raised reflective segments.

[0108] FIG. 5 shows a processing chamber 500 including a heat shield 502. The heat shield 502 includes a frame 503 having a solid (or non-perforated) portion 504 without ART segments and another (or perforated) portion 506 with heat-absorbing wedge-shaped segments 508. The heat shield 502 includes two openings 510, 512 in portion 506. Opening 510 contains a single ART segment. Opening 512 contains four ART segments. The ART segments 508 are partially transparent so that the ring 514 is visible from the top side of the heat shield 502. In one embodiment, the ART segments 508 are formed from sapphire. In another embodiment, the ART segments 508 include multiple layers, with a silicon (Si) layer disposed between two sapphire layers. The layers extend radially and azimuthally parallel to each other. The sapphire material may cover the edges of the silicon layers to provide edge protection. The sapphire layer protects the silicon layer from exposure to the environment inside the processing chamber 500, thereby preventing degradation of the silicon layer. By including multiple layers, one or more of which are formed from silicon, the ART segment becomes more transparent to infrared radiation. An example of a multi-layer ART segment is shown in FIG. 25.

[0109] Heat shield 502 includes three tabs 520 that protrude radially inward and slide along slots 522 in fasteners 524. Fasteners 524 rest on shafts 526. When installed, tabs 520 on heat shield 502 align with slots 522. Heat shield 502 then slides onto fasteners 524. Tabs 520 prevent heat shield 502 from rotating.

[0110] FIG. 6 shows a processing chamber 600 including a heat shield 602. The heat shield 602 includes a solid (or non-perforated) portion 604 without ART segments and another (perforated) portion 606 with circular ART segments. A set of different types of ART segments is shown, some of which are designated 608 and 610. The ART segments may be similar to the wedge-shaped segments disclosed herein and are formed from different ART materials selected based on the absorption, reflection, and transmission properties selected for a given application. While the ART segments are shown as being equally sized, circular, and arranged in radially extending rows, they may have different shapes and sizes and be arranged in different arrays (or patterns). The ART segments are positioned within corresponding openings (or windows) 612 and may rest on ledges in a manner similar to the wedge-shaped segments.

[0111] Heat shield 602 includes three tabs 620 that protrude radially inward and slide along slots 622 in fasteners 624. Fasteners 624 rest on shafts 626. When installed, tabs 620 on heat shield 602 align with slots 622. Heat shield 602 then slides onto fasteners 624. Tabs 620 prevent heat shield 602 from rotating.

[0112] 7 shows a processing chamber 700 including a heat shield 702 having a reflector portion 704 and another portion 706 including a circular ART segment. The reflective portion 704 may be similarly configured as the reflective ART segments disclosed herein and may include a groove 703 and a ridge 705. The groove 703 and / or the reflective portion 704 may be formed from a reflective material, such as alumina or other reflective material. The groove 703 may face the bottom side of the substrate platen.

[0113] A set of different types of ART segments are shown, some of which are designated 708, 710. The ART segments may be similar to the ART segments of Figure 6. The ART segments may be positioned within reflective openings (or windows) 712 and rest on ledges in a manner similar to the wedge-shaped segments disclosed herein.

[0114] Heat shield 702 includes three tabs 720 that protrude radially inward and slide along slots 722 in fasteners 724. Fasteners 724 rest on shafts 726. When installed, tabs 720 on heat shield 702 align with slots 722. Heat shield 702 then slides onto fasteners 724. Tabs 720 prevent heat shield 702 from rotating.

[0115] In one embodiment, instead of the heat shield 702 including reflective grooves and ridges facing upward toward the bottom surface of the substrate platen, the heat shield 702 includes transmissive grooves and ridges facing downward toward the processing chamber wall. In another embodiment, the shield 702 includes both reflective grooves and ridges and transmissive grooves and ridges. An example of transmissive grooves and ridges is shown in Figure 9, which is shown upside down.

[0116] 8-10 show that a heat shield 800 includes a body (or frame) 801 having a reflector portion (or first half) 802 and an emitter portion (or second half) 804. The reflector portion 802 includes a groove 806 with a reflective surface and a ridge 808 on a first side and a solid flat surface 809 on the opposite side. The emitter portion 804 includes a groove 810 with a radiating concave surface and a ridge 812 on a first side and a solid flat surface 814 on the opposite side. There may be an overlap region 816 between the reflector portion 802 and the emitter portion 804. The grooves 806, 810 have sidewalls that form the ridges 808, 812. An example of a sidewall 820 is shown in FIG. 10. Heat shield 800 includes three tabs 822 that protrude radially inward and slide along slots in a fastener (e.g., one of the fasteners disclosed herein). Heat shield 800 also includes a radial edge 830 and an outermost radial edge 832.

[0117] FIG. 11 shows another heat shield 1100 including a frame 1102 with openings 1104 for wedge-shaped ART segments 1106. The ART segments 1106 are equal in size. The heat shield 1100 is placed on thermal barriers 1110, 1112. The heat shield 1100 is placed on and in contact with the thermal barrier 1110. The thermal barrier 1110 is placed on and in contact with the thermal barrier 1112. During installation, the thermal barrier 1112 may be attached to a central shaft (not shown), which then slides and rotates on the central shaft to lock onto the thermal barrier 1112. The heat shield 1100 then slides and rotates on the thermal barrier 1110 to lock onto the thermal barrier 1110. Examples of thermal barriers are further shown and described with respect to FIGS. 14 and 15. The thermal barrier functions in a manner similar to the other thermal barriers described herein.

[0118] The thermal barrier 1112 may be hexagonal in shape, including six contact points for the thermal barrier 1110 (as shown in FIG. 15 ), or may be any other suitable shape. The thermal barrier 1110 may be dodecagonal in shape, including twelve exterior sides 1114, or may be any other suitable shape. Six of the sides of the thermal barrier 1110 may be in contact with six radially interior sides 1116 of the thermal barrier 1112.

[0119] FIG. 12 shows another heat shield 1200 including a frame 1102 with openings 1104 for wedge-shaped ART segments 1206. The ART segments 1206 are of different sizes. The ART segments 1206 may have different angular widths, providing different numbers of segments in each of the openings 1104. The different angular widths allow for adjustable levels of regulation and / or granularity of temperature control. The illustrated example shows two different sized ART segments. The larger ART segments may have holes 1208 or pockets for easy grasping, removal, and placement of the ART segments. The heat shield 1200 is shown on a thermal barrier 1110.

[0120] Figure 13 shows the frame 1102 and thermal barriers 1110, 1112 of the heat shields 1100, 1200 of Figures 11 and 12. The frame 1102 includes an opening 1104 with an ART segment ledge 1300. The ledge 1300 extends around the outer edge of the window 1104.

[0121] Reference is now made further to Figures 14 and 15. Figure 14 shows the thermal barrier 1110 of the heat shields 1100, 1200 of Figures 11 and 12. The thermal barrier 1110 provides a barrier-to-heat-shield connection. Figure 15 shows the thermal barrier 1112 of the heat shields 1100, 1112 of Figures 11 and 12. The thermal barrier 1110 provides a shaft-to-barrier connection. The thermal barrier 1110 includes six tabs 1400 projecting radially outward from which the thermal barrier 1112 is set. The tabs 1400 are adjacent to the side surfaces 1114. The thermal barrier 1110 includes six attachment points 1402 for attaching the thermal barrier 1110 to a shaft or a fastener on the shaft.

[0122] The thermal barrier 1112 includes six contact points (or outwardly protruding pads) 1500 at which one of the heat shields 1100, 1200 rests. The thermal barrier 1112 includes a base 1502 and a hexagonal ring 1504 extending upward from the base 1502. The base 1502 and ring 1504 may be formed as a single piece. The ring 1504 slides into a central opening in the heat shield and prevents the heat shield from rotating. The sides of the ring 1504 contact the radially innermost edge of the heat shield.

[0123] The hexagonal configuration of the heat shields 1110, 1112 and corresponding heat shield frames provides a robust design for better thermal isolation, and performance reliability is improved by having the corresponding heat shield ART segments have designated, separate locations.

[0124] 16-20 illustrate different wedge-shaped ART segments that may be used and / or sized for use within the frames 218, 302, 402, 503, and 1102 of FIGS. 2-5 and 11-13. The wedge-shaped ART segments have different geometries that affect azimuthal and radial temperature non-uniformities differently. The geometries of the wedge-shaped ART segments and the corresponding hole and notch patterns may be modified and tailored to minimize and / or change the effect of the wedge-shaped ART segments on azimuthal and / or radial non-uniformities. Also, while the wedge-shaped ART segments are shown having particular shapes and attributes (e.g., holes, notches, pockets, peaks, humps, depressions, etc.), the shapes and attributes may be modified and / or the number of attributes may be varied. FIG. 16 shows a wedge-shaped segment 1600 in the form of a plate, also having a wedge-shaped window 1602 .

[0125] The ART segments disclosed herein may be wedged to help the ART segment stay in place on the heat shield frame. For example, segment 1600 includes wedging side 1604 with notch 1605. While one side of segment 1600 is shown as wedging, two or more sides may be wedging. The heat shield frame may have wedging tabs extending radially inward to connect with the wedging side of the ART segment. Example frame 2200 is shown in FIG. 22 and includes wedging tabs 2202, one for each ART segment. The wedging tabs are shown along the radially outermost side of window 2204 of frame 2200, but may be located on other sides of window 2204.

[0126] FIG. 17 shows a wedge-shaped segment 1700 having a top surface 1702 of varying height with angled sides 1704 and a centrally located peak 1706. As an example, the location of the peak 1706 may be moved radially inward or radially outward to adjust for variations in the effect of the wedge-shaped segment 1700 on radial temperature non-uniformity. As another example, the height of the peak 1706 relative to the base of the wedge-shaped segment 1700 may also be adjusted. An example of a heat shield including several wedge-shaped segments 1700 is shown in FIG. 21. FIG. 18 shows a wedge-shaped segment 1800 with a double-notched radially inner end 1802. The end 1802 includes two notches 1804. FIG. 19 shows a wedge-shaped segment 1900 with a body 1902 that may be hollow to reduce weight. In the example shown, the height of the body 1902 is uniform laterally across the entire surface of the body 1902. Examples of ART segments with varying heights are shown in Figure 20. At least some of the examples in Figure 20, as well as the examples in Figures 16-18, may be implemented to affect radial temperature non-uniformity in addition to affecting azimuthal temperature non-uniformity.

[0127] FIG. 20 illustrates a wedge-shaped segment 2000, a thick wedge-shaped segment 2002 having a top surface 2003 that may be positioned near the platen when installed, a wedge-shaped segment 2004 with an angled top surface 2005 that directs heat at an angle relative to the platen, a wedge-shaped segment 2006 with an angled top surface 2007 and an extension 2009 that extends beyond and overhangs the radially outermost edge of the corresponding heat shield, a wedge-shaped segment 2008 with a radially convex top surface 2013 from a radially innermost edge 2015 to a radially outermost edge 2016, and a wedge-shaped segment 2009 with an angled top surface 2017 that extends beyond and overhangs the radially outermost edge of the corresponding heat shield. wedge-shaped segment 2008 having a radially concave top surface 2011, wedge-shaped segment 2010 having a radially concave top surface 2017 from a radially innermost edge 2019 to a radially outermost edge 2021, wedge-shaped segment 2012 having an azimuthally concave top surface 2023 that minimizes interaction with adjacent segments with the same radial thickness, and wedge-shaped segment 2014 having an azimuthally concave, angled top surface 2025 such that the thickness of the segment is thickest at the radially innermost edge. Segments 2002, 2004, 2006, 2008, 2010, 2012, and 2014 may be hollow to reduce weight.

[0128] The ART segments disclosed herein may be perforated, such that the ART segment contains one or more holes. The holes may have different sizes and shapes. Examples of ART segments with a single hole are shown in Figures 16 and 17.

[0129] Figure 21 shows a heat shield 2100 that includes a frame 2102 with windows 2104. Disposed within each of the windows 2104 are multiple ART segments 2106. The ART segments are similar to the ART segments 1700 of Figure 17, but have different sizes. Some of the ART segments 2106 include openings 2108, while others do not.

[0130] 23 shows a processing chamber 2300 and a segmented heat shield 2301 with offset, cantilevered ART segments 2302 and retaining clamps 2304 instead of a frame. The ART segments 2302 are wedge-shaped and have radially innermost ends 2305 that are inserted into slots 2306 in the retaining clamps 2304. The retaining clamps 2304 include a body 2307 having a cylindrical sidewall 2309 with slots 2306. The radially innermost ends 2305 are inserted into the slots 2306 while the ART segments 2302 angle downward toward the retaining clamps 2304, such that the radially outermost ends 2308 of the ART segments 2302 are higher than the radially innermost ends 2305. When inserted into the slot 2306, the radially outermost end 2308 of the ART segment pivots downward, causing the top surface of the ART segment 2302 to extend horizontally. In one embodiment, the radially outermost end 2308 pivots downward, causing the ART segment 2302 to angle downward, where the radially outermost end 2308 is 0° to 0.2° lower than the radially innermost end 2305. The retention clamp 2304 has a lower portion 2320 with an attachment point 2322 for attaching it to the central shaft.

[0131] The heat shield 2301 provides a modular design, allowing for easy and quick replacement of the ART segments 2302 and for insertion and removal of the heat shield 2301 without removing the substrate support from the fixture. Each ART segment 2302 may be simply pulled out of or inserted into one of the slots 2306 when access to the interior of the chamber 2300 is provided. The ART segments 2302 are arranged 360° around the clamp 2304 and may be vertically offset from each other as shown, allowing for easy insertion and removal of the ART segments 2302. Additionally, the offsetting provides another setting for adjusting the amount of absorption, reflection, and transmission based on the distance between the substrate platen and the top surface of the ART segment 2302. Although shown as azimuthally horizontal, each ART segment is angled azimuthally so that one radially extending edge of the ART segment is lower than the other radially extending edge in the opposite radial direction.

[0132] In one embodiment, the ART segment 2302 is formed from ceramic and the fastener 2304 is formed from aluminum. In another embodiment, the ART segment 2302 and fastener 2304 are formed from aluminum. The ART segment 2302 may be formed from a metal-based material other than or in addition to aluminum.

[0133] FIG. 24 illustrates a substrate support 2400 including a platen 2402 and heat shields 2404, 2406 stacked in a nested arrangement. The substrate support 2400 includes a central shaft 2408 on which the platen 2402 is positioned. The platen 2402 supports a substrate 2409. Each of the heat shields 2404, 2406 has a corresponding thermal barrier 2410, 2412 attached to the central shaft 2408 and supporting the heat shields 2404, 2406. The heat shields 2404, 2406 and the thermal barriers 2410, 2412 are sometimes collectively referred to as a heat shield assembly. Although two heat shields and two thermal barriers are shown, any number of each may be included. Each additional heat shield provides another layer of thermal energy isolation between the platen 2402 and a processing chamber wall 2420 having a distal reference surface 2421. Each of the heat shields 2404, 2406 may be configured similarly to any described herein, and there may be a gap between the heat shield 2406 and the thermal barrier 2410 as shown, or the thermal barrier 2410 may be disposed on the heat shield 2406. The heat shields 2404, 2406 may include ART segments 2422, 2424, 2426, 2428, such as any of the ART segments disclosed herein.

[0134] By way of example, the platen may be at 650° C., the temperature of the heat shield 2404 may be between 400° C. and 500° C., the temperature of the heat shield 2406 may be between 250° C. and 350° C., and the temperature of the process chamber walls 2420 may be 70° C. This nested arrangement is also applicable in applications where the temperature of the platen 2402 exceeds 650° C.

[0135] 25 shows a multi-layer ART segment 2500 including a first layer 2502, a second layer 2504, and a third layer 2506. The ART segment 2500 may include an access hatch 2508 and a wedging side 2510 having a notch 2512. The layers 2502 and 2506 may be formed from a first material or materials and may protect the second layer 2504, which may be formed from a different material or materials. One of the layers 2502 or 2506 may cover a peripheral edge of the second layer, as shown by edges 2514 and 2516. By way of example, the layers 2502, 2506 may include sapphire, and the middle layer 2504 may include at least one of a ceramic, a refractory material, or one or more metals.

[0136] Although several adjustable heat shields are described above, non-adjustable heat shields may also be fabricated to have ART characteristics that match any one of the adjustable heat shields in a particular configuration. For example, the adjustable heat shields of Figures 3-11, 13, and 21-23 may be formed as a unitary structure with corresponding ART regions and / or ART portions. By way of example, a particular configuration of any of the adjustable heat shields of Figures 3-11, 13, and 21-23 may be selected, and then a single unitary structure may be fabricated having the same size, shape, and dimensions as the selected heat shield. Another example of a unitary heat shield is shown in Figure 26.

[0137] FIG. 26 shows a circular, non-adjustable heat shield 2600. The heat shield 2600 has a fixed structure including a plate 2601 with a centrally located hexagonal opening 2602, a circular hole 2604, and an arc-shaped, four-sided hole 2608. A curved ridge 2606 extends away from the plate 2601. The opening is configured to connect a thermal barrier (e.g., thermal barrier 1110 of FIG. 13). The hole 2604 and ridge 2606 are located radially outward and surround the opening 2602. The hole 2608 is disposed radially outward of and around the opening 2602, hole 2604, and curved ridge 2606. In the illustrated example, there are three holes 2604, three ridges 2606, and ten holes 2608, although any number of each may be included. The ridge 2606 includes (i) a peak 2610 extending between longitudinal ends 2612, and (ii) angled, arcuate, radially opposed sides 2614. The holes 2608 are spaced equal distances apart.

[0138] 27 illustrates an iterative method 2700 for fabricating a tunable or non-tunable heat shield, such as any of the heat shields disclosed herein. Method 2700 includes, at 2702, first adjusting heat flux pattern modifying characteristics by setting and / or refining one or more critical dimensions of the substrate to design a heat shield that meets first predetermined criteria for the one or more critical dimensions. This includes determining and / or selecting the size, shape, dimensions, and / or configuration of the frame and / or body; the number, size, shape, dimensions, and / or configuration of the ART regions, ART segments, and / or ART portions of the frame and / or body; the number of ART regions, ART segments, and / or ART portions to include; the size, shape, dimensions, location, and / or configuration of each of the ART regions, ART segments, and / or ART portions; the number, location, size, shape, and dimensions of holes and / or other features of the heat shield; etc. This also includes fabricating the heat shield to be tested. Operation 2702 may have high recurring costs and long lead times. At 2703, the heat shield is manufactured according to the latest set parameters.

[0139] At 2704, a substrate is provided to a station to perform a deposition or etching operation. At 2706, while using the thermal shield, a deposition or etching operation is performed on a film layer of the substrate, for example, to alter one or more critical dimensions of the substrate.

[0140] At 2708, the substrate is transferred from the deposition / etch station to a metrology station. At 2710, metrology is performed to measure one or more critical dimensions, and the measurement data is analyzed to determine whether one or more heat flux pattern modifying characteristics and / or ART aspects of the heat shield should be modified based on a first predetermined criterion. If the heat shield design should be modified, operation 2702 is performed to redesign and fabricate another heat shield. Based on the analysis, parameters of the heat shield may be modified and used in operation 2702.

[0141] Although method 2700 is described with respect to forming an adjustable heat shield, similar methods may be used to form a non-adjustable heat shield.

[0142] FIG. 28 illustrates a method 2800 performed iteratively to adjust an adjustable heat shield. The method of FIG. 28 may be performed after completing the method of FIG. 27 . Method 2800 includes, at 2802, fine-tuning the heat shield to set and / or improve one or more critical dimensions of the substrate to meet second predetermined criteria. The second predetermined criteria may have stricter requirements than the first predetermined criteria. The second predetermined criteria may include, for example, determining the number of ART segments to include, the type of ART segments, the location of the ART segments, and the location of the ART segments on the frame or body of the heat shield. The second predetermined criteria may include determining where on the frame and / or body ART segments should not be included. Operation 2802 may not incur any recurring costs and may not require a short lead time, e.g., a lead time much shorter than the lead time of operation 2702 of FIG. 27 .

[0143] At 2804, a substrate is provided to the station to perform a deposition or etching operation. At 2806, while using the thermal shield, a deposition or etching operation is performed on a film layer of the substrate, for example, to alter one or more critical dimensions of the substrate.

[0144] At 2808, the substrate is transferred from the deposition / etch station to a metrology station. At 2810, metrology is performed to measure one or more critical dimensions, and the measurement data is analyzed to determine whether one or more ART aspects of the heat shield should be modified. If the heat shield design should be modified, operation 2802 is performed to further fine-tune the heat shield. Based on the analysis, parameters of the heat shield may be modified and used in operation 2802.

[0145] Figure 29 illustrates an iterative method 2900 for manufacturing a non-adjustable heat shield. This method may be performed alone or after performing the method of Figure 28. For example, the method of Figure 28 may be performed to adjust the adjustable heat shield to save time and money, and then the method of Figure 29 may be performed to fabricate a one-piece heat shield based on and / or matching the finalized adjustable heat shield provided as a result of performing the method of Figure 28.

[0146] Method 2900 includes fabricating a one-piece (non-adjustable) heat shield at 2902. This step may be based on previous test results. Operation 2902 may be performed after performing one or more of the methods of Figures 27 and 28. Operation 2902 may not incur any recurring costs and may not require a lead time that is much shorter than the lead time of operation 2702 of Figure 27 or longer than the lead time of operation 2802 of Figure 28, for example.

[0147] At 2904, a substrate is provided to the station to perform a deposition or etching operation. At 2906, while using the thermal shield, a deposition or etching operation is performed on a film layer of the substrate, for example, to alter one or more critical dimensions of the substrate.

[0148] At 2908, the substrate is transferred from the deposition / etch station to a metrology station. At 2910, metrology is performed to measure one or more critical dimensions. At 2912, the measurement data is analyzed to determine whether one or more ART aspects of the heat shield should be modified, and the heat shield is redesigned and / or modified as a result. This may be based on a third predetermined criterion. The third predetermined criterion may have stricter requirements than the first predetermined criterion. The third predetermined criterion may match or have requirements similar to the second predetermined criterion. If the design of the heat shield is to be modified, operation 2902 is performed. The parameters of the heat shield may be modified based on the analysis and used in operation 2902.

[0149] The disclosed heat shields have predetermined and set parameters to modulate heat loss from a hot platen and may be used as a tool to improve the design of a processing chamber and / or as a feature within a tool to improve the performance of the tool.

[0150] The ART segments, ART regions, and ART portions disclosed herein may not be separate sections of the heat shield, and multiple tuning techniques may be superimposed on top of each other to continuously (spatially) tailor performance.

[0151] The foregoing description is merely exemplary in nature and is in no way intended to limit the disclosure, its field of application, or uses. The broad teachings of the present disclosure can be implemented in a variety of forms. Thus, while the present disclosure includes specific examples, the true scope of the disclosure should not be limited to those examples, as other modifications will become apparent upon study of the drawings, the specification, and the following claims. It should be understood that one or more steps within a method may be performed in a different order (or simultaneously) without altering the principles of the present disclosure. Furthermore, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the present disclosure can be implemented within and / or combined with features of any of the other embodiments, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and substitution of one or more embodiments for another remains within the scope of the present disclosure.

[0152] Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including "connected," "engaged," "coupled," "adjacent," "next to," "on top of," "above," "below," and "disposed." Unless expressly described as "direct," when the above disclosure describes a relationship between a first element and a second element, the relationship can be a direct relationship where no other intervening elements exist between the first and second elements, or it can be an indirect relationship where one or more intervening elements (spatial or functional) exist between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean a logic using a non-exclusive logical OR (A OR B OR C, A or B or C), and not to mean "at least one of A, at least one of B, and at least one of C."

[0153] In some implementations, the controller is part of a system, which may be part of the examples described above. Such systems may include semiconductor processing equipment, including one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (such as wafer pedestals, gas flow systems, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of semiconductor wafers or semiconductor substrates. The electronics may be referred to as a "controller," which may control various components or subdivisions of one or more systems. Depending on the processing requirements and / or type of system, the controller may be programmed to control any of the processes disclosed herein, including process gas delivery, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and motion settings, wafer transfer into and out of tools and other transfer tools, and / or load locks connected to or interfaced with specific systems.

[0154] Broadly speaking, a controller may be defined as an electronic circuit having various integrated circuits, logic circuits, memory, and / or software that receives instructions, issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, etc. Integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute the program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files) that define operational parameters for performing specific processes on or for a semiconductor wafer or for a system. The operational parameters, in some embodiments, may be part of a recipe defined by a process engineer to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon oxides, surfaces, circuits, and / or die of a wafer.

[0155] In some implementations, the controller may be part of or coupled to a computer integrated with, coupled to, or otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or part of a semiconductor fab’s host computer system, thereby enabling remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of a fabrication operation, examine the history of past fabrication operations, examine trends or performance indicators from multiple fabrication operations, modify parameters of a current process, configure processing steps following a current process, or initiate a new process. In some examples, a remote computer (e.g., a server) may provide process recipes to the system over a network, which may include a local network or the Internet. The remote computer may include a user interface that allows entry or programming of parameters and / or settings, which are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data specifying parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool the controller is configured to interface with or control. Thus, as described above, the controller may be distributed, such as by including one or more separate controllers networked together that operate toward a common purpose, such as the process and control described herein. One example of a distributed controller for such purposes is one or more integrated circuits on the chamber that are in communication with one or more remotely located integrated circuits (e.g., at the platform level or as part of a remote computer) that combine to control the process on the chamber.

[0156] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a cleaning chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing system that may be associated with or used in the fabrication and / or manufacturing of semiconductor wafers.

[0157] As noted above, depending on the processing step or steps to be performed by the tool, the controller may communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, nearby tools, adjacent tools, tools located throughout the factory, a main computer, another controller, or tools used in material transport to transport containers of wafers to and from tool locations and / or load ports within the semiconductor fabrication factory. The present disclosure may be realized in the following forms. [Form 1] 1. A heat shield for a platen of a substrate support, comprising: The main body and a plurality of absorbing-reflecting-transmitting regions in contact with the body and configured to affect at least a portion of a heat flux pattern between a distal reference surface and the platen, the plurality of absorbing-reflecting-transmitting regions having adjustable features for adjusting the at least a portion of the heat flux pattern; A heat shield comprising: [Form 2] The heat shield according to aspect 1, The heat shield, wherein the plurality of absorbing-reflecting-transmitting regions are configured to modulate at least a portion of the heat flux pattern between the distal reference surface and the platen. [Form 3] The heat shield according to aspect 1, The heat shield has a modular structure in which the body includes the plurality of absorbing-reflecting-transmitting regions. [Form 4] The heat shield according to aspect 1, A heat shield wherein one or more of the plurality of absorbing-reflecting-transmitting regions comprises one or more holes. [Form 5] The heat shield according to aspect 1, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting regions includes at least one of: (i) one or more ridges; or (ii) one or more trenches. [Form 6] The heat shield according to aspect 1, A heat shield in which one or more of the plurality of absorbing-reflecting-transmitting regions comprises at least one of: (i) multiple layers with different thicknesses; or (ii) layers with different materials. [Form 7] The heat shield according to aspect 1, A heat shield wherein one or more of the plurality of absorbing-reflecting-transmitting regions are implemented as at least one of different overlapping layers and radially adjacent layers. [Form 8] The heat shield according to aspect 1, The body is a heat shield configured to attach to a shaft at a location between the platen and the distal reference surface, which may be a surface of a processing chamber wall or other surface that affects radiation boundary conditions. [Form 9] The heat shield according to aspect 1, A heat shield wherein one or more of the plurality of absorbing-reflecting-transmitting regions are adjustable to control azimuthal and radial temperature non-uniformity of at least one of the platen or substrate. [Form 10] The heat shield according to aspect 1, A heat shield, wherein the plurality of absorbing-reflecting-transmitting regions are disposed at different azimuthal or radial locations on the body. [Form 11] The heat shield according to aspect 1, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting regions has at least one shape, size, material, contour, or pattern that is different from another one or more of the plurality of absorbing-reflecting-transmitting regions. [Form 12] The heat shield according to aspect 1, A heat shield, wherein the plurality of absorbing-reflecting-transmitting regions are implemented as a plurality of segments that can be at least one of adjusted, moved, interchanged, or replaced to adjust the heat flux pattern. [Form 13] 2. The heat shield according to claim 1, comprising a frame: the plurality of absorbing-reflecting-transmitting regions are implemented as a plurality of absorbing-reflecting-transmitting segments; The frame is a central opening configured to receive a shaft of the substrate support; a plurality of windows configured to be at least partially covered by the plurality of absorbing-reflecting-transmitting segments at designated locations; Equipped with The body is implemented as the frame, The plurality of absorption-reflection-transmission segments are at least one of disposed within the plurality of windows and disposed over the entire surface of the plurality of windows, and the heat shield is configured to be held by the frame. [Form 14] 14. The heat shield according to claim 13, The frame includes a plurality of tabs that engage with hardware components. [Form 15] 14. The heat shield according to claim 13, The heat shield, wherein the plurality of windows include corresponding edges configured to contact or engage the plurality of absorbing-reflecting-transmitting segments at the designated locations. [Form 16] 14. The heat shield according to claim 13, the plurality of windows having corresponding ledges configured to hold the plurality of absorbing-reflecting-transmitting segments at the designated locations; The heat shield is configured such that the plurality of absorbing-reflecting-transmitting segments are disposed within the plurality of windows and on the ledge. [Form 17] 14. The heat shield according to claim 13, One or more of the plurality of absorbing-reflecting-transmitting segments is a reflective segment that reflects thermal energy received from the platen back to the platen. [Form 18] 14. The heat shield according to claim 13, One or more of the plurality of absorbing-reflecting-transmitting segments is an absorbing segment, absorbing the thermal energy emitted by the platen. [Form 19] 14. The heat shield according to claim 13, One or more of the absorbing-reflecting-transmitting segments are transmissive segments, and the thermal shield allows a portion of the thermal energy emitted from the platen to pass through the one or more of the absorbing-reflecting-transmitting segments to the distal reference surface. [Form 20] 14. The heat shield according to claim 13, A heat shield, wherein one or more of the absorbing-reflecting-transmitting segments are shaped to vary the effect the one or more of the absorbing-reflecting-transmitting segments have on azimuthal temperature non-uniformity across the platen. [Form 21] 14. The heat shield according to claim 13, A heat shield, wherein one or more of the absorbing-reflecting-transmitting segments are shaped to vary the effect the one or more of the absorbing-reflecting-transmitting segments have on radial temperature non-uniformity across the platen. [Form 22] 14. The heat shield according to claim 13, The heat shield wherein the frame is ring-shaped or polygonal-shaped. [Form 23] 14. The heat shield according to claim 13, Each of the plurality of absorbing-reflecting-transmitting segments is modular and can be positioned in multiple locations within the plurality of windows. [Form 24] 14. The heat shield according to claim 13, A heat shield, wherein at least two of the plurality of absorbing-reflecting-transmitting segments are different in size. [Form 25] 14. The heat shield according to claim 13, The heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are wedge-shaped. [Form 26] 14. The heat shield according to claim 13, The heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are circular. [Form 27] 14. The heat shield according to claim 13, the frame comprising a first portion and a second portion; the first portion includes the plurality of windows; the second portion includes a plurality of grooves and a plurality of ridges; The plurality of grooves form a heat shield that reflects the thermal energy emitted by the platen back to the platen. [Form 28] 14. The heat shield according to claim 13, A heat shield, wherein at least one of the plurality of absorbing-reflecting-transmitting segments is at least partially transmissive. [Form 29] 14. The heat shield according to claim 13, A heat shield, wherein at least one of the plurality of absorbing-reflecting-transmitting segments comprises a plurality of layers. [Form 30] 29. The heat shield according to claim 28, the plurality of layers comprises a pair of layers and an intermediate layer; each of the pair of layers comprises sapphire; the intermediate layer is disposed between the pair of layers; The heat shield, wherein the intermediate layer comprises at least one of a ceramic, a refractory material, or a metal. [Form 31] 14. The heat shield according to claim 13, the plurality of absorbing-reflecting-transmitting segments include wedged sides; The frame includes wedging tabs for engaging the wedging sides of the plurality of absorbing-reflecting-transmitting segments. [Form 32] 14. The heat shield according to claim 13, the central opening of the frame is configured to receive at least a first portion of a thermal barrier; The frame is configured to be disposed over the second portion of the thermal barrier. [Form 33] 14. The heat shield according to claim 13, A heat shield, wherein each of the plurality of windows has a predetermined number of designated locations for one or more of the plurality of absorbing-reflecting-transmitting segments. [Form 34] 1. A heat shield assembly comprising: A heat shield according to aspect 13; a first thermal barrier; A heat shield assembly comprising: [Form 35] 35. The heat shield assembly of claim 34, further comprising a second thermal barrier; the heat shield is disposed on the first thermal barrier and configured to engage the first thermal barrier; A heat shield assembly, wherein the first thermal barrier is disposed on and configured to engage the second thermal barrier. [Form 36] a substrate support, A heat shield according to aspect 34; the first thermal barrier; The central axis; The platen Equipped with the first thermal barrier is connected to the central shaft; The heat shield is a first heat shield disposed on the first thermal barrier substrate support. [Form 37] 37. The substrate support of claim 36, the second thermal barrier connected to the central shaft; a second heat shield disposed on the second thermal barrier; The substrate support further comprises: [Form 38] 37. The substrate support of claim 36, A substrate support wherein the radially innermost edge of the heat shield is not in contact with the central axis. [Form 39] 2. The heat shield according to claim 1, comprising a frame: the plurality of absorbing-reflecting-transmitting regions are implemented as a plurality of absorbing-reflecting-transmitting segments; The frame is a central opening for the central shaft configured to receive at least a portion of the first thermal barrier; a plurality of windows configured to hold the plurality of absorption-reflection-transmission segments at designated locations; Equipped with the plurality of absorbing-reflecting-transmitting segments are configured to be at least one of disposed within the plurality of windows and disposed over the plurality of windows; The plurality of absorbing-reflecting-transmitting segments and the frame form a heat shield that thermally isolates a portion of a processing chamber wall from the platen. [Form 40] 39. The heat shield of claim 39, A heat shield wherein one or more of the absorbing-reflecting-transmitting segments are shaped to vary the effect the absorbing-reflecting-transmitting segments have on azimuthal temperature non-uniformity across the platen. [Form 41] 39. The heat shield of claim 39, A heat shield wherein one or more of the absorbing-reflecting-transmitting segments are shaped to vary the effect the absorbing-reflecting-transmitting segments have on radial temperature non-uniformity across the platen. [Form 42] 39. The heat shield of claim 39, the absorption-reflection-transmission segment includes a first absorption-reflection-transmission segment and a second absorption-reflection-transmission segment; The heat shield, wherein the size of the second absorbing-reflecting-transmitting segment is different from the size of the first absorbing-reflecting-transmitting segment. [Form 43] 39. The heat shield of claim 39, The first thermal barrier is a hexagonal shaped heat shield. [Form 44] 1. A heat shield assembly comprising: A heat shield according to claim 39; the first thermal barrier; A heat shield assembly comprising: [Form 45] 45. The heat shield assembly of claim 44, further comprising a second thermal barrier configured to be connected to the central shaft; The heat shield assembly is configured such that the first thermal barrier is disposed over the second thermal barrier. [Form 46] 46. ​​The heat shield assembly of claim 45, the central opening is hexagonal; At least a portion of the first thermal barrier is hexagonal in shape and engages the central opening; the second thermal barrier includes 12 sides; A heat shield assembly, wherein six of the twelve sides of the second thermal barrier are configured to engage six sides of the first thermal barrier. [Form 47] 10. The heat shield of claim 1, comprising a retaining clamp having a sidewall with a plurality of slots; the body is configured to be connected to a central axis of a substrate processing chamber; each of the plurality of slots configured to receive a corresponding portion of one of the plurality of absorbing-reflecting-transmitting segments; the plurality of absorbing-reflecting-transmitting regions are implemented as the plurality of absorbing-reflecting-transmitting segments; The plurality of absorbing-reflecting-transmitting segments are cantilevered, such that the heat shield is supported by a first portion of the sidewall that is located below the plurality of absorbing-reflecting-transmitting segments and a second portion of the sidewall that is located above the plurality of absorbing-reflecting-transmitting segments. [Form 48] 48. The heat shield according to claim 47, The heat shield, wherein the plurality of slots and the plurality of absorbing-reflecting-transmitting segments are configured such that each of the absorbing-reflecting-transmitting segments can be held by any one of the plurality of slots. [Form 49] 48. The heat shield according to claim 47, A heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are wedge-shaped. [Form 50] 48. The heat shield according to claim 47, The heat shield includes an access hatch for installing and removing the plurality of absorption-reflection-transmission segments between the plurality of absorption-reflection-transmission segments and the retaining clamps. [Form 51] 48. The heat shield according to claim 47, The heat shield wherein the plurality of absorbing-reflecting-transmitting segments are arranged around the retaining clamp so as to affect the heat flux pattern 360° around the central axis. [Form 52] 48. The heat shield according to claim 47, A heat shield wherein each of the plurality of absorbing-reflecting-transmitting segments is vertically offset from an adjacent pair of the plurality of absorbing-reflecting-transmitting segments. [Form 53] 48. The heat shield according to claim 47, the plurality of absorbing-reflecting-transmitting segments are arranged in alternating vertical positions around the circumference of the retaining clamp such that every other absorbing-reflecting-transmitting segment of the plurality is at a first vertical position and every other absorbing-reflecting-transmitting segment is at a second vertical position; The second vertical position of the heat shield is higher than the first vertical position. [Form 54] 1. A heat shield for a platen of a substrate support of a substrate processing system, comprising: a body; The body includes: a central opening for the central shaft configured to receive at least a portion of the first thermal barrier; a first portion including a first groove and a first ridge for reflecting thermal energy emitted by the platen back to the platen; a second portion including a second groove and a second ridge for transmitting thermal energy received from the platen to a processing chamber wall; an overlapping portion disposed between the first portion and the second portion; Equipped with The body is a heat shield configured to thermally shield a portion of the processing chamber wall from the platen. [Form 55] 55. The heat shield of claim 54, The heat shield wherein the overlapping portion does not include a groove. [Form 56] 1. A heat shield for a platen of a substrate support, comprising: The main body and a plurality of absorbing-reflecting-transmitting portions in contact with or disposed as part of the body and configured to affect at least a portion of a heat flux pattern between a distal reference surface and the platen, wherein one or more of the plurality of absorbing-reflecting-transmitting portions has at least one heat flux-modifying property that differs from another one or more of the plurality of absorbing-reflecting-transmitting portions; A heat shield comprising: [Form 57] 57. The heat shield of claim 56, The heat shield, wherein the absorbing-reflecting-transmitting portion is configured to modulate at least a portion of the heat flux pattern between the distal reference surface and the platen. [Form 58] 57. The heat shield of claim 56, The heat shield wherein the absorbing-reflecting-transmitting portion is at least one of a separate portion, layer, or superimposed layer. [Form 59] 57. The heat shield of claim 56, The heat shield, wherein the absorbing-reflecting-transmitting portions are at least one of radially or azimuthally disposed with respect to each other. [Form 60] 57. The heat shield of claim 56, A heat shield, wherein the plurality of absorbing-reflecting-transmitting portions are disposed at different azimuthal or radial locations on the body. [Form 61] 57. The heat shield according to claim 56, One or more of the plurality of absorbing-reflecting-transmitting portions of the heat shield include at least one of: (i) one or more holes; or (ii) one or more pockets. [Form 62] 57. The heat shield of claim 56, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting portions includes at least one of: (i) one or more ridges; or (ii) one or more trenches. [Form 63] 57. The heat shield of claim 56, A heat shield wherein one or more of the plurality of absorbing-reflecting-transmitting portions comprises at least one of multiple thicknesses or different materials. [Form 64] 57. The heat shield of claim 56, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting portions are implemented as at least one of different overlapping layers or radially adjacent layers. [Form 65] 57. The heat shield of claim 56, The body is a heat shield configured to attach to a shaft at a location between the platen and the distal reference surface, which is a surface of a processing chamber wall. [Form 66] 57. The heat shield of claim 56, The heat shield, wherein the plurality of absorbing-reflecting-transmitting sections are configured to minimize azimuthal and radial temperature non-uniformities of the platen. [Form 67] 57. The heat shield of claim 56, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting portions has at least one shape, size, material, contour, or pattern that is different from another one or more of the plurality of absorbing-reflecting-transmitting portions. [Form 68] 57. The heat shield of claim 56, further comprising a retaining clamp comprising the body; The heat shield, wherein the plurality of absorbing-reflecting-transmitting portions are implemented as segments extending radially outward from a sidewall of the body. [Form 69] 1. A method of manufacturing a heat shield for a platen of a substrate support, comprising: designing a first heat shield to provide one or more critical dimensions of a first substrate, including configuration parameters of the first heat shield, to provide predetermined heat flux pattern modifying characteristics during use of the first heat shield; fabricating the first heat shield according to the parameters; performing a deposition or etching operation while using the first thermal shield to deposit a layer on a first substrate or etch a layer of the first substrate; performing metrology operations to measure the one or more critical dimensions; analyzing data generated as a result of performing said metrology operations; determining whether the first heat shield should be redesigned to meet first predetermined criteria related to the one or more critical dimensions; A method for providing the above. [Form 70] 70. The method of claim 69, wherein in response to determining to redesign the first heat shield, adjusting the parameters to provide the predetermined heat flux pattern modification characteristic; fabricating a second heat shield according to the adjusted parameters; performing a deposition or etching operation while using the second thermal shield to deposit a layer on a second substrate or etch a layer of the second substrate; performing metrology operations to measure the one or more critical dimensions; analyzing data generated as a result of performing said metrology operations; determining whether the second heat shield should be redesigned to meet the first predetermined criteria regarding the one or more critical dimensions; and A method further comprising: [Form 71] 70. The method of claim 69, reconfiguring the first heat shield to fine-tune one or more of the parameters to establish or refine the one or more reference dimensions; performing a deposition or etching operation while using the first thermal shield to deposit a layer on the second substrate or etch a layer of the second substrate; performing metrology operations to measure the one or more critical dimensions; analyzing data generated as a result of performing said metrology operations; determining whether the first heat shield should be redesigned to meet the first predetermined criteria for the one or more critical dimensions; A method further comprising: [Form 72] 72. The method of claim 71, wherein fine-tuning the one or more parameters of the heat shield includes at least one of determining the number of absorbing-reflecting-transmitting segments to include, determining the location of the absorbing-reflecting-transmitting segments on the body of the heat shield, or determining the type of the absorbing-reflecting-transmitting segments. [Form 73] 72. The method of claim 71, further comprising fabricating a one-piece heat shield based on the fine-tuned one or more parameters. [Form 74] 70. The method of claim 69, further comprising fabricating a one-piece heat shield based on the parameters.

Claims

1. 1. A heat shield for a platen of a substrate support, comprising: The frame and a plurality of absorbing-reflecting-transmitting segments in contact with the frame and configured to affect at least a portion of a heat flux pattern between a distal reference surface and the platen, the absorbing-reflecting-transmitting segments having adjustable features for adjusting the at least a portion of the heat flux pattern; Equipped with The frame is a central opening configured to receive a central axis of the substrate support; a plurality of windows configured to be at least partially covered by the plurality of absorbing-reflecting-transmitting segments at designated locations; Equipped with The plurality of absorption-reflection-transmission segments are at least one of disposed within the plurality of windows and disposed over the plurality of windows, and are configured to be held by the frame. Heat shield.

2. 10. The heat shield of claim 1, The heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are configured to modify at least a portion of the heat flux pattern between the distal reference surface and the platen.

3. 10. The heat shield of claim 1, The heat shield has a modular structure in which the frame includes the plurality of absorbing-reflecting-transmitting segments.

4. 10. The heat shield of claim 1, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments includes one or more holes.

5. 10. The heat shield of claim 1, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments includes at least one of: (i) one or more ridges; or (ii) one or more trenches.

6. 10. The heat shield of claim 1, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments comprises at least one of: (i) multiple layers with different thicknesses; or (ii) layers with different materials.

7. 10. The heat shield of claim 1, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments are implemented as at least one of overlapping layers and radially adjacent layers.

8. 10. The heat shield of claim 1, The frame is configured to attach to a shaft at a location between the platen and the distal reference surface, which may be a surface of a processing chamber wall or other surface that affects radiation boundary conditions.

9. 10. The heat shield of claim 1, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments are adjustable to control azimuthal and radial temperature non-uniformity of at least one of the platen or substrate.

10. 10. The heat shield of claim 1, The heat shield wherein the plurality of absorbing-reflecting-transmitting segments are positioned at different azimuthal or radial locations on the frame.

11. 10. The heat shield of claim 1, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments has at least one shape, size, material, contour, or pattern that is different from another one or more of the plurality of absorbing-reflecting-transmitting segments.

12. 10. The heat shield of claim 1, The heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are at least one of adjustable, movable, interchangeable, or replaceable to adjust the heat flux pattern.

13. 10. The heat shield of claim 1, The frame includes a plurality of tabs that engage with hardware positioned within a processing chamber to support the frame.

14. 10. The heat shield of claim 1, The heat shield, wherein the plurality of windows have corresponding edges configured to contact or engage the plurality of absorbing-reflecting-transmitting segments at the designated locations.

15. 10. The heat shield of claim 1, the plurality of windows having corresponding ledges configured to hold the plurality of absorption-reflection-transmission segments at the designated locations; The heat shield is configured such that the plurality of absorbing-reflecting-transmitting segments are disposed within the plurality of windows and on the ledge.

16. 10. The heat shield of claim 1, One or more of the plurality of absorbing-reflecting-transmitting segments is a reflective segment that reflects thermal energy received from the platen back to the platen.

17. 10. The heat shield of claim 1, One or more of the plurality of absorbing-reflecting-transmitting segments is an absorbing segment, absorbing thermal energy contained in the heat flux pattern emitted by the platen.

18. 10. The heat shield of claim 1, a heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments are transmitting segments, that allow a portion of the thermal energy contained in the heat flux pattern emitted from the platen to pass through the one or more of the plurality of absorbing-reflecting-transmitting segments to the distal reference surface.

19. 10. The heat shield of claim 1, a heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments are shaped to vary the effect the one or more of the plurality of absorbing-reflecting-transmitting segments have on azimuthal temperature non-uniformity across the platen.

20. 10. The heat shield of claim 1, a heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments are shaped to vary the effect the one or more of the plurality of absorbing-reflecting-transmitting segments have on radial temperature non-uniformity across the platen.

21. 10. The heat shield of claim 1, The heat shield wherein the frame is ring-shaped or polygonal-shaped.

22. 10. The heat shield of claim 1, Each of the plurality of absorbing-reflecting-transmitting segments is modular and can be positioned in multiple locations within the plurality of windows.

23. 10. The heat shield of claim 1, At least two of the plurality of absorbing-reflecting-transmitting segments of the heat shield have different sizes.

24. 10. The heat shield of claim 1, The heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are wedge-shaped.

25. 10. The heat shield of claim 1, The heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are circular.

26. 10. The heat shield of claim 1, the frame comprising a first portion and a second portion; the first portion includes the plurality of windows; the second portion includes a plurality of grooves and a plurality of ridges; The plurality of grooves form a heat shield that reflects thermal energy contained in the heat flux pattern emitted by the platen back to the platen.

27. 10. The heat shield of claim 1, A heat shield wherein at least one of the plurality of absorbing-reflecting-transmitting segments is at least partially transmissive.

28. 10. The heat shield of claim 1, At least one of the plurality of absorbing-reflecting-transmitting segments of the heat shield comprises a plurality of layers.

29. 29. The heat shield of claim 28, the plurality of layers comprises a pair of layers and an intermediate layer; each of the pair of layers comprises sapphire; the intermediate layer is disposed between the pair of layers; The heat shield, wherein the intermediate layer comprises at least one of a ceramic, a refractory material, or a metal.

30. 10. The heat shield of claim 1, the plurality of absorbing-reflecting-transmitting segments include wedged sides; The frame includes wedging tabs for engaging the wedging sides of the plurality of discrete absorbing-reflecting-transmitting segments.

31. 10. The heat shield of claim 1, the central opening of the frame is configured to receive at least a first portion of a thermal barrier; The frame is configured to be disposed over the second portion of the thermal barrier.

32. 10. The heat shield of claim 1, A heat shield, wherein each of said plurality of windows has a predetermined number of designated locations for one or more of said plurality of absorption-reflection-transmission segments.

33. 1. A heat shield assembly comprising: The heat shield of claim 1; a first thermal barrier; and A heat shield assembly comprising:

34. 34. The heat shield assembly of claim 33, further comprising a second thermal barrier; the heat shield is disposed on the first thermal barrier and configured to engage the first thermal barrier; The heat shield assembly, wherein the first thermal barrier is disposed on and configured to engage the second thermal barrier.

35. a substrate support, The heat shield of claim 33; the first thermal barrier; a central axis of the substrate support; The platen Equipped with the first thermal barrier is connected to a central axis of the substrate support; The substrate support, wherein the heat shield is a first heat shield disposed on the first thermal barrier.

36. 36. The substrate support of claim 35, a second thermal barrier connected to a central axis of the substrate support; a second heat shield disposed on the second thermal barrier; The substrate support further comprises:

37. 36. The substrate support of claim 35, A substrate support wherein the radially innermost edge of the heat shield does not contact a central axis of the substrate support.

38. 1. A heat shield for a platen of a substrate support, comprising: The frame and a plurality of absorbing-reflecting-transmitting segments in contact with the frame and configured to affect at least a portion of a heat flux pattern between a distal reference surface and the platen, the absorbing-reflecting-transmitting segments having adjustable features for adjusting the at least a portion of the heat flux pattern; Equipped with The frame is a central opening for the central shaft configured to receive at least a portion of the first thermal barrier; a plurality of windows configured to hold the plurality of absorption-reflection-transmission segments at designated locations; Equipped with the plurality of absorption-reflection-transmission segments are configured to be at least one of disposed within the plurality of windows and disposed across the plurality of windows; The plurality of absorbing-reflecting-transmitting segments and the frame form a heat shield that thermally isolates a portion of a processing chamber wall from the platen.

39. 39. The heat shield of claim 38, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments are shaped to vary the effect the plurality of absorbing-reflecting-transmitting segments have on azimuthal temperature non-uniformity across the platen.

40. 39. The heat shield of claim 38, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments are shaped to vary the effect the plurality of absorbing-reflecting-transmitting segments have on radial temperature non-uniformity across the platen.

41. 39. The heat shield of claim 38, the plurality of absorption-reflection-transmission segments include a first absorption-reflection-transmission segment and a second absorption-reflection-transmission segment; The heat shield, wherein the size of the second absorption-reflection-transmission segment is different from the size of the first absorption-reflection-transmission segment.

42. 39. The heat shield of claim 38, The heat shield wherein the first thermal barrier is hexagonal in shape.

43. 1. A heat shield assembly comprising:

39. The heat shield of claim 38; the first thermal barrier; A heat shield assembly comprising:

44. 44. The heat shield assembly of claim 43, further comprising a second thermal barrier configured to be connected to a central axis of the substrate support; The heat shield assembly is configured such that the first thermal barrier is disposed over the second thermal barrier.

45. 45. The heat shield assembly of claim 44, the central opening is hexagonal; At least a portion of the first thermal barrier is hexagonal in shape and engages the central opening; the second thermal barrier includes 12 sides; A heat shield assembly, wherein six of the twelve sides of the second thermal barrier are configured to engage six sides of the first thermal barrier.

46. 1. A heat shield for a platen of a substrate support, comprising: The frame and a plurality of absorbing-reflecting-transmitting segments in contact with the frame and configured to affect at least a portion of a heat flux pattern between a distal reference surface and the platen, the plurality of absorbing-reflecting-transmitting segments having adjustable features for adjusting the at least a portion of the heat flux pattern, the plurality of absorbing-reflecting-transmitting segments being at least one of: a) radially disposed relative to one another; and b) azimuthally disposed relative to one another; a retaining fastener having a sidewall with a plurality of slots; Equipped with the frame is configured to be connected to a central axis of a substrate processing chamber; each of the plurality of slots configured to receive a corresponding portion of one of the plurality of distinct absorption-reflection-transmission segments; The plurality of absorbing-reflecting-transmitting segments are cantilevered, such that the heat shield is supported by a first portion of the sidewall that is located below the plurality of absorbing-reflecting-transmitting segments and a second portion of the sidewall that is located above the plurality of absorbing-reflecting-transmitting segments.

47. 47. The heat shield of claim 46, The heat shield, wherein the plurality of slots and the plurality of absorbing-reflecting-transmitting segments are configured such that each of the plurality of absorbing-reflecting-transmitting segments can be held by any one of the plurality of slots.

48. 47. The heat shield of claim 46, A heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are wedge-shaped.

49. 47. The heat shield of claim 46, The heat shield includes an access hatch for installing and removing the plurality of absorption-reflection-transmission segments between the plurality of absorption-reflection-transmission segments and the retaining clamps.

50. 47. The heat shield of claim 46, The heat shield is arranged around the retaining clamp such that the plurality of absorbing-reflecting-transmitting segments affect the heat flux pattern 360° around the central axis.

51. 47. The heat shield of claim 46, A heat shield wherein each of the plurality of absorbing-reflecting-transmitting segments is vertically offset from an adjacent pair of the plurality of absorbing-reflecting-transmitting segments.

52. 47. The heat shield of claim 46, the plurality of absorbing-reflecting-transmitting segments are arranged in alternating vertical positions around the circumference of the retaining clamp such that every other absorbing-reflecting-transmitting segment of the plurality is at a first vertical position and every other absorbing-reflecting-transmitting segment is at a second vertical position; The second vertical position of the heat shield is higher than the first vertical position.

53. 1. A heat shield for a platen of a substrate support of a substrate processing system, comprising: a body; The body includes: a central opening for the central shaft configured to receive at least a portion of the first thermal barrier; a first portion including a first groove and a first ridge for reflecting thermal energy emitted by the platen back to the platen; a second portion including a second groove and a second ridge for transmitting thermal energy received from the platen to a processing chamber wall; an overlapping portion disposed between the first portion and the second portion; Equipped with The body is a heat shield configured to thermally shield a portion of the processing chamber wall from the platen.

54. 54. The heat shield of claim 53, The heat shield wherein the overlapping portion does not include a groove.

55. 1. A heat shield for a platen of a substrate support, comprising: The frame and a plurality of absorbing-reflecting-transmitting segments in contact with or disposed as part of the frame and configured to affect at least a portion of a heat flux pattern between a distal reference surface and the platen, wherein one or more of the plurality of absorbing-reflecting-transmitting segments has at least one heat flux-modifying property that differs from another one or more of the plurality of absorbing-reflecting-transmitting segments; Equipped with The frame is a central opening configured to receive a central axis of the substrate support; a plurality of windows configured to be at least partially covered by the plurality of absorbing-reflecting-transmitting segments at designated locations; Equipped with The plurality of absorption-reflection-transmission segments are at least one of disposed within the plurality of windows and disposed over the plurality of windows, and are configured to be held by the frame. Heat shield.

56. 56. The heat shield of claim 55, The heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are configured to modify at least a portion of the heat flux pattern between the distal reference surface and the platen.

57. 56. The heat shield of claim 55, The heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are at least one of separate portions, layers, or superimposed layers.

58. 56. The heat shield of claim 55, The heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are at least one of radially or azimuthally disposed with respect to one another.

59. 56. The heat shield of claim 55, The heat shield wherein the plurality of absorbing-reflecting-transmitting segments are positioned at different azimuthal or radial locations on the frame.

60. 56. The heat shield of claim 55, One or more of the plurality of absorbing-reflecting-transmitting segments of the heat shield include at least one of: (i) one or more holes; or (ii) one or more pockets.

61. 56. The heat shield of claim 55, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments includes at least one of: (i) one or more ridges; or (ii) one or more trenches.

62. 56. The heat shield of claim 55, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments comprises at least one of multiple thicknesses or different materials.

63. 56. The heat shield of claim 55, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments are implemented as at least one of overlapping layers and radially adjacent layers.

64. 56. The heat shield of claim 55, The frame is a heat shield configured to attach to a shaft at a location between the platen and the distal reference surface, which is a surface of a processing chamber wall.

65. 56. The heat shield of claim 55, The heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are configured to minimize azimuthal and radial temperature non-uniformities of the platen.

66. 56. The heat shield of claim 55, A heat shield, wherein one or more of the plurality of absorbing-reflecting-transmitting segments has at least one shape, size, material, contour, or pattern that is different from another one or more of the plurality of absorbing-reflecting-transmitting segments.

67. 56. The heat shield of claim 55, further comprising a retaining clamp comprising the body; The heat shield wherein the plurality of absorbing-reflecting-transmitting segments are implemented as segments extending radially outward from a sidewall of the frame.

68. 10. The heat shield of claim 1, The heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are radially disposed relative to one another and azimuthally disposed relative to one another.

69. 10. The heat shield of claim 1, A heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are implemented as a plurality of separate segments.

70. 54. The heat shield of claim 53, the first portion and the second portion have a plurality of absorbing-reflecting-transmitting segments; The heat shield, wherein the plurality of absorbing-reflecting-transmitting segments are at least one of: a) radially disposed relative to one another; and b) azimuthally disposed relative to one another.

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