Display panel and display device

Abstract

A display panel and a display device, relating to the technical field of display. The display panel comprises: a substrate, a first metal driving layer, a light absorption layer, an auxiliary light absorption layer, and a plurality of light-emitting units. The orthographic projection of the light absorption layer on the substrate overlaps with the orthographic projection of the driving layer on the substrate. In this way, ambient light emitted to the display panel can be absorbed by means of the light absorption layer, such that the ambient light emitted to the display panel is less reflected by the driving layer, thereby ensuring the reflectivity of the display panel to the ambient light to be relatively low. The light absorption layer is provided in the display panel, such that the reflectivity of the display panel to the ambient light is reduced. Therefore, the transmittance of the auxiliary light absorption layer located on the side of the plurality of light-emitting units facing away from the substrate can be properly improved, such that the absorption rate of the auxiliary light absorption layer to light is low, and thus the light emitted by the light-emitting units is less absorbed by the auxiliary light absorption layer.

Description

Display panel and display device

[0001] The present application claims priority to the Chinese patent application No. 202310625067.3, filed on May 29, 2023, and entitled "Display panel and display device", the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of display, in particular to a display panel and a display device. BACKGROUND

[0003] With the development of the display technical field, the mini Light-Emitting Diode (LED) display panel will become the most advantageous new generation of display media due to its advantages of high color purity, wide dynamic range, high brightness, high definition, low working voltage, small power consumption, long service life, impact resistance, large viewing angle and stable and reliable operation, and has been widely used.

[0004] At present, the LED display panel usually includes a driving backboard and a plurality of LEDs located on one side of the driving backboard. The driving backboard can send driving signals to each LED, so that the LED can emit corresponding light, and thus the LED display panel can present a corresponding display picture.

[0005] However, the driving backboard usually contains a metal layer, and the reflectivity of the metal layer to ambient light is relatively high. Therefore, the current LED display panel is prone to reflecting ambient light, resulting in poor effect of the LED display panel.

[0006] SUMMARY

[0007] The present application provides a display panel and a display device. The technical problem of poor effect of the LED display panel in the prior art can be solved, and the technical solution is as follows:

[0008] In one aspect, a display panel is provided, comprising:

[0009] a substrate;

[0010] a first metal driving layer located on one side of the substrate, the first metal driving layer having a plurality of conductive pads;

[0011] a light-absorbing layer located on the side of the first metal driving layer away from the substrate, the light-absorbing layer having a plurality of first vias corresponding to the plurality of conductive pads, the first vias having projections on the substrate that overlap the projections of the corresponding conductive pads on the substrate.

[0012] a plurality of light emitting units located on a side of the light absorbing layer away from the substrate, the light emitting units being electrically connected to at least part of the conductive pads through the first via holes;

[0013] and an auxiliary light absorbing layer located on a side of the light emitting units away from the substrate.

[0014] Optionally, the display panel further comprises a reflective layer located between the substrate and the light absorbing layer, a projection of the reflective layer on the substrate overlapping a projection of the light absorbing layer on the substrate.

[0015] Optionally, the reflective layer is located on a side of the first metal driving layer away from the substrate, and the reflective layer has second via holes communicating with the first via holes.

[0016] Optionally, a projection of the light absorbing layer on the substrate is located within a projection of the reflective layer on the substrate.

[0017] Optionally, the display panel further comprises a first insulating layer located between the first metal driving layer and the light absorbing layer, the first insulating layer having third via holes communicating with the first via holes.

[0018] Optionally, the reflective layer is insulating, and the reflective layer and the first insulating layer are the same film layer structure.

[0019] Optionally, the reflective layer is located on a side of the first insulating layer away from the substrate, or the reflective layer is located on a side of the first insulating layer close to the substrate.

[0020] Optionally, the display panel further comprises a second insulating layer located on a side of the light absorbing layer away from the substrate, the second insulating layer having fourth via holes communicating with the first via holes, and part of the second insulating layer extending into the first via holes and covering at least part of the inner wall of the first via holes.

[0021] Optionally, the light absorbing layer comprises carbon particles; and the inner wall of the first via hole is completely covered by the second insulating layer.

[0022] Optionally, part of the second insulating layer also extends into the second via hole and covers at least part of the inner wall of the second via hole.

[0023] Optionally, the display panel further comprises a second metal driving layer located on a side of the first metal driving layer close to the substrate, and the reflective layer is located on a side of the second metal driving layer close to the substrate.

[0024] Optionally, at least one of the first metal driving layer and the second metal driving layer has a mark pattern, and the light-absorbing layer has a avoiding hole corresponding to the mark pattern, and a normal projection of the avoiding hole on the substrate overlaps with a normal projection of the mark pattern on the substrate.

[0025] Optionally, the material of the light-reflecting layer comprises at least one of amorphous silicon, low-temperature polysilicon, and white ink.

[0026] Optionally, when the material of the light-reflecting layer comprises amorphous silicon, the thickness of the light-reflecting layer ranges from 500 angstroms to 2000 angstroms.

[0027] When the material of the light-reflecting layer comprises white ink, the thickness of the light-reflecting layer ranges from 0.5 microns to 3 microns.

[0028] When the material of the light-emitting layer is low-temperature polysilicon, the thickness of the light-emitting layer ranges from 500 angstroms to 2000 angstroms.

[0029] Optionally, the display panel further comprises a plurality of driving circuits located on the first metal driving layer close to the substrate, and the driving circuits are electrically connected to the light-emitting units through the conductive pads.

[0030] The driving circuit comprises a plurality of electrical patterns arranged in layers, and the display panel further comprises an insulating layer located between two adjacent electrical patterns.

[0031] Optionally, the display panel further comprises a light-reflecting layer arranged in the same layer as one of the electrical patterns, and a normal projection of the light-reflecting layer on the substrate overlaps with a normal projection of the light-absorbing layer on the substrate.

[0032] Optionally, the driving circuit has at least one transistor, one of the electrical patterns is an active layer pattern of the transistor, and the material of the active layer pattern and the material of the light-reflecting layer both comprise low-temperature polysilicon.

[0033] The active layer is arranged in the same layer as the light-reflecting layer and has the same material.

[0034] Optionally, the minimum distance between the outer boundary of the normal projection of the active layer pattern on the substrate and the outer boundary of the normal projection of the light-reflecting layer on the substrate is greater than or equal to 5 microns.

[0035] Optionally, the edge region of the substrate away from the first metal driving layer comprises a binding area, and the display panel further comprises a plurality of signal leads located in the binding area, and at least part of the signal leads are electrically connected to the driving circuits.

[0036] The area between two adjacent driving signal leads is a spacing area, and a normal projection of the spacing area on the substrate overlaps with a normal projection of the light reflection layer on the substrate.

[0037] Optionally, the spacing area comprises a first area and a second area.

[0038] The first area is an area of the spacing area covered by the first metal driving layer and the plurality of electrical patterns, and the second area is an area of the spacing area other than the first area.

[0039] At least part of the normal projection of the light reflection layer on the substrate is located within the normal projection of the second area on the substrate.

[0040] Optionally, the normal projection of the light reflection layer on the substrate does not overlap with the normal projection of the first metal driving layer on the substrate, and does not overlap with the normal projection of each electrical pattern on the substrate.

[0041] Optionally, the normal projection of the light reflection layer on the substrate completely covers the second area.

[0042] Optionally, a boundary of the normal projection on the substrate of the part of the light reflection layer covered by the second area extends along a boundary of the normal projection on the substrate of the first area, and the boundary of the normal projection on the substrate of the part of the light reflection layer covered by the second area does not overlap with the boundary of the normal projection on the substrate of the first area.

[0043] Optionally, the display panel further comprises a mark pattern of at least one electrical pattern in the plurality of electrical patterns, which is arranged in the same layer and is made of the same material as the mark pattern, and the light reflection layer has an avoiding hole corresponding to the mark pattern, and a normal projection of the avoiding hole on the substrate overlaps with a normal projection of the mark pattern on the substrate.

[0044] Optionally, the plurality of electrical patterns comprises a first gate pattern, an active layer pattern, a second gate pattern and a source-drain electrode pattern, which are arranged in a stack in a direction perpendicular to and away from the substrate.

[0045] In the case where the light reflection layer is arranged in the same layer as the active layer pattern, the number of the mark patterns is at least two, one of the mark patterns is arranged in the same layer as the second gate pattern and is made of the same material, and the other of the mark patterns is arranged in the same layer as the source-drain electrode pattern and is made of the same material.

[0046] Optionally, the auxiliary light absorption layer has a transmittance of greater than or equal to 50% for the light emitted by the light emitting unit.

[0047] Optionally, the light emitting unit comprises a mini light emitting diode or a micro light emitting diode.

[0048] In another aspect, a display device is provided, comprising a driving component, and a display panel electrically connected with the driving component, wherein the display panel is the display panel described above.

[0049] The technical scheme provided by the embodiments of the present application has at least the following beneficial effects:

[0050] A display panel comprises a substrate, a first metal driving layer, a light absorption layer, an auxiliary light absorption layer, and a plurality of light emitting units. The light absorption layer has an overlapping projection on the substrate with the driving layer. In this way, the ambient light incident on the display panel can be absorbed by the light absorption layer, so that the ambient light incident on the display panel is less reflected by the driving layer, thereby ensuring that the reflectivity of the display panel to ambient light is low. In addition, by providing the light absorption layer in the display panel, the reflectivity of the display panel to ambient light can be reduced. Therefore, the transmittance of the auxiliary light absorption layer on the side of the plurality of light emitting units away from the substrate can be appropriately increased, so that the absorption rate of the auxiliary light absorption layer to light is low, thereby reducing the degree of absorption of the light emitted by the light emitting units by the auxiliary light absorption layer. In this way, without providing a large driving current to the light emitting units, the overall display brightness of the display panel can be high, thereby effectively reducing the power consumption of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0051] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0052] FIG. 1 is a top view of a display panel according to an embodiment of the present application;

[0053] FIG. 2 is a schematic diagram of the film layer structure of the display panel shown in FIG. 1 at A-A';

[0054] FIG. 3 is a schematic diagram of the film layer structure of a display panel according to an embodiment of the present application;

[0055] FIG. 4 is a schematic diagram of the back of a display panel according to an embodiment of the present application;

[0056] FIG. 5 is a partial side view of a display panel according to an embodiment of the present application;

[0057] FIG. 6 is a schematic diagram of the film layer structure of a driving backplane in a display panel according to an embodiment of the present application;

[0058] FIG. 7 is a schematic view of a film layer structure of a driving backplane in another display panel according to an embodiment of the present application;

[0059] FIG. 8 is a schematic view of a film layer structure of a driving backplane in still another display panel according to an embodiment of the present application;

[0060] FIG. 9 is a schematic view of a film layer structure of a driving backplane in yet another display panel according to an embodiment of the present application;

[0061] FIG. 10 is a partial enlarged view of a driving backplane in a display panel according to an embodiment of the present application;

[0062] FIG. 11 is a schematic view of a film layer structure of a driving backplane in a display panel according to another embodiment of the present application;

[0063] FIG. 12 is a schematic view of a film layer structure of a driving backplane in another display panel according to another embodiment of the present application;

[0064] FIG. 13 is a schematic view of a film layer structure of a driving backplane in still another display panel according to another embodiment of the present application;

[0065] FIG. 14 is a schematic view of a film layer structure of a driving backplane in yet another display panel according to another embodiment of the present application;

[0066] FIG. 15 is a partial top view of a driving backplane in a display panel according to an embodiment of the present application;

[0067] FIG. 16 is a partial top view of a display panel according to an embodiment of the present application;

[0068] FIG. 17 is a schematic view of a film layer structure of a driving backplane in a display panel according to yet another embodiment of the present application;

[0069] FIG. 18 is a schematic view of a film layer structure of a driving backplane in another display panel according to yet another embodiment of the present application;

[0070] FIG. 19 is a partial enlarged view of a display panel at a back according to an embodiment of the present application;

[0071] FIG. 20 is a partial enlarged view of a display panel at a front according to an embodiment of the present application;

[0072] FIG. 21 is a partial schematic view of a single interval area at a front of another display panel according to an embodiment of the present application;

[0073] FIG. 22 is a schematic view of a film layer structure of a driving backplane in still another display panel according to yet another embodiment of the present application;

[0074] FIG. 23 is a partial enlarged view of a display panel at a front according to another embodiment of the present application;

[0075] FIG. 24 is a partial enlarged view of a front side of yet another display panel according to an embodiment of the present application;

[0076] FIG. 25 is a partial enlarged view of a front side of still another display panel according to an embodiment of the present application;

[0077] FIG. 26 is a partial enlarged view of a front side of a display panel according to another embodiment of the present application;

[0078] FIG. 27 is a partial enlarged view of a front side of another display panel according to another embodiment of the present application. DETAILED DESCRIPTION

[0079] For the purpose of making the purpose, technical solutions and advantages of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0080] In the related art, in order to reduce the reflectivity of the LED display panel to the ambient light, it is usually necessary to provide a black film in the LED display panel. For example, in the LED display panel, the black film can be located on the side of the plurality of LEDs away from the driving backboard. In this way, part of the ambient light incident on the LED display panel can be absorbed by the black film, so that the ambient light incident on the LED display panel is less reflected by the metal signal lines in the driving backboard.

[0081] However, in order to reduce the reflectivity of the LED display panel to the ambient light, it is necessary to ensure that the black film has a high light absorption rate. When the black film has a high light absorption rate, the transmittance of the black film is low, for example, the light transmittance of the black film is usually less than 30%, resulting in a high absorption rate of the light emitted from the LED by the black film. Therefore, the driving backboard needs to supply a larger current to the LED to ensure that the overall display brightness of the LED is high, thereby resulting in a large power consumption of the LED display panel.

[0082] Please refer to FIG. 1 and FIG. 2, FIG. 1 is a top view of a display panel according to an embodiment of the present application, and FIG. 2 is a schematic view of the film layer structure of the display panel shown in FIG. 1 at A-A'. Here, the display panel 000 can include a substrate 100, a first metal driving layer 201, a light absorbing layer 300, an auxiliary light absorbing layer 500, and a plurality of light emitting units 400.

[0083] The first metal driving layer 201 in the display panel 000 can be located on one side of the substrate 100, and the first metal driving layer 201 can have a plurality of conductive pads S. Here, the first metal driving layer 201 belongs to a metal layer with a high reflectivity.

[0084] The light-absorbing layer 300 in the display panel 000 can be located on the side of the first metal driving layer 201 away from the substrate 100. The light-absorbing layer 300 can have an orthogonal projection on the substrate 100 that overlaps with an orthogonal projection of the first metal driving layer 201 on the substrate 100. In this way, the light-absorbing layer 300 can absorb ambient light that is incident on the display panel 000, so that the ambient light that is incident on the display panel 000 is less likely to be reflected by the first metal driving layer 201, thereby ensuring that the display panel 000 has a low reflectivity to ambient light. In addition, the light-absorbing layer 300 in the display panel 000 can have a plurality of first vias V1 corresponding to the plurality of conductive pads S, and each first via V1 can have an orthogonal projection on the substrate 100 that overlaps with an orthogonal projection of a corresponding conductive pad S on the substrate 100. For example, the orthogonal projection of each first via V1 on the substrate 100 can be located within the orthogonal projection of the corresponding conductive pad S on the substrate 100. In this way, the light-absorbing layer 300 can be prevented from blocking the conductive pads S, so that the conductive pads S can be subsequently electrically connected to the light-emitting units 400.

[0085] For example, in the display area of the display panel 000, the light-absorbing layer 300 in the display panel 000 can cover the orthogonal projection on the substrate 100 of the part of the first metal driving layer 201 other than the conductive pads S. That is, in the display area of the display panel 000, the part of the first metal driving layer 201 other than the conductive pads S can be blocked by the light-absorbing layer 300. It should be noted that the display area of the display panel 000 refers to the area of the front surface of the display panel 000 that can display a picture. Typically, the front surface of the display panel 000 also includes a non-display area that surrounds the display area. In one possible embodiment, the light-absorbing layer 300 in the display panel 000 can also be distributed in the non-display area of the display panel 000.

[0086] Since the conductive pads S in the first metal driving layer 201 need to be connected to the light-emitting units 400, the conductive pads S can be blocked by the light-emitting units 400, while the part of the first metal driving layer 201 other than the conductive pads S belongs to the metal part with a high reflectivity and is not blocked by the light-emitting units 400. Therefore, when the light-absorbing layer 300 covers the part of the first metal driving layer 201 other than the conductive pads S, the overall reflectivity of the display panel 000 can be further reduced.

[0087] The plurality of light emitting units 400 in the display panel 000 can be located on the side of the light absorbing layer 300 away from the substrate 100. Here, the light emitting units 400 can be electrically connected to at least part of the conductive pads S through the first via V1. In the present application, the display panel 000 can further include a driving structure layer distributed on the side of the first metal driving layer 201 facing the substrate 100, and the driving structure layer can be electrically connected to the first metal driving layer 201. In this way, under the joint action of the driving structure layer and the first metal driving layer 201, the light emitting units 400 can be driven to emit light through the conductive pads S. It should be noted that the part of the display panel 000 located below the plurality of light emitting units 400 is the driving backboard in the display panel 000, that is, the driving backboard can include the substrate 100, and the first metal driving layer 201 and the light absorbing layer 300 on the side of the substrate 100. The plurality of light emitting units 400 in the display panel 000 can be arranged on the driving backboard. Here, below the plurality of light emitting units 400 refers to the side opposite to the light emitting direction of the plurality of light emitting units 400.

[0088] In the present application, the light emitting unit 400 in the display panel 000 can include an LED. In a possible implementation, the driving backboard in the display panel 000 can directly drive the LED to emit light. In this case, the LED can be directly driven to emit light by the driving backboard in the display panel 000.

[0089] In another possible implementation, as shown in FIG. 3, which is a diagram of the film layer structure of a display panel provided by an embodiment of the present application, the light emitting unit 400 in the display panel 000 can not only include an LED 401, but also include a driving chip 402. Here, the LED 401 and the driving chip 402 in the light emitting unit 400 need to be electrically connected to the first metal driving layer 201 in the display panel 000 through the conductive pads S. In this case, the LED 401 needs to be driven to emit light by both the driving backboard in the display panel 000 and the driving chip 402.

[0090] It should be noted that the LED in the light emitting unit 400 can be a common size LED, a mini Light-Emitting Diode (mini-LED) or a Micro Light-Emitting Diode (Micro-LED).

[0091] In the embodiment of the present application, the color of the outer surface of the LED in different light emitting units 400 can have a large difference, and for the light emitting unit 400 containing both the LED and the light emitting chip, the color of the outer surface of the LED 401 of the light emitting unit 400 also has a large difference with the color of the outer surface of the driving chip 402. Therefore, it is necessary to set the auxiliary light absorbing layer 500 in the display panel 000. Here, the auxiliary light absorbing layer 500 can be located on the side of the plurality of light emitting units 400 away from the substrate 100, and the auxiliary light absorbing layer 500 simultaneously covers the LED 401 and the driving chip 402 in each light emitting unit 400. It should be noted that the auxiliary light absorbing layer 500 is also commonly referred to as a black film, and when the auxiliary light absorbing layer 500 simultaneously covers the LED 401 and the driving chip 402, the outer surface of the LED 401 and the outer surface of the driving chip 402 can both appear black, thereby effectively eliminating the color difference of the outer surface of the LED in different light emitting units 400, and effectively eliminating the color difference of the outer surface of the LED 401 and the driving chip 402.

[0092] In the present application, since the light absorbing layer 300 is set in the display panel 000, the reflectivity of the display panel 000 to ambient light can be reduced. Therefore, the transmittance of the auxiliary light absorbing layer 500 (i.e. the black film) located on the side of the plurality of light emitting units 400 away from the substrate 100 can be appropriately increased. For example, the transmittance of the auxiliary light absorbing layer 500 to the light emitted by the light emitting unit 400 is greater than or equal to 50%. In the case where no light absorbing layer is set in the display panel, the transmittance of the black film in the display panel needs to be below 30% to ensure that the reflectivity of the display panel to ambient light is low. Therefore, after the light absorbing layer 300 is set in the display panel 000, the absorption rate of the auxiliary light absorbing layer 500 to light can be ensured to be low, thereby making the degree of absorption of the light emitted by the light emitting unit 400 by the auxiliary light absorbing layer 500 low. In this way, without requiring the display panel 000 to provide a large driving current to the light emitting unit 400, the overall display brightness of the display panel 000 can be high, thereby effectively reducing the power consumption of the display panel. Preferably, the transmittance of the auxiliary light absorbing layer 500 to the light emitted by the light emitting unit 400 is greater than or equal to 60%.

[0093] In the embodiment of the present application, the transmittance of the auxiliary light absorbing layer 500 in the display panel 000 can be less than or equal to 90%. In this way, the color difference between the outer surfaces of the LEDs in different light emitting units 400 can be ensured to be small, and for the light emitting unit 400 containing both the LED and the light emitting chip, the color difference between the outer surfaces of the LED and the light emitting chip in the light emitting unit 400 can also be ensured to be small.

[0094] Optionally, the light-absorbing layer 300 in the display panel 000 includes an organic film layer made of an organic material with light-absorbing property. For example, the organic material can be a black matrix (BM) material. That is, the light-absorbing layer 300 can be made of the BM material. Since the BM material has good light-absorbing property, when the light-absorbing layer 300 is made of the BM material, the light-absorbing layer 300 has high absorption of ambient light rays incident on the display panel 000, thereby effectively reducing the reflectivity of the display panel 000 to the ambient light rays. For example, the BM material can include an organic material and a plurality of carbon particles dispersed in the organic material. Here, by adjusting the concentration of the carbon particles filled in the organic material, the absorption of light rays by the BM material can be adjusted. It should be noted that the organic material can include organic resin, polyimide (PI), polyvinyl alcohol (PVA), polyester (PET), or polyethylene naphthalate glycol (PEN).

[0095] Optionally, the thickness of the light-absorbing layer 300 in the above embodiment can range from 0.5 microns to 5 microns. Here, the greater the thickness of the light-absorbing layer 300, the greater the absorption of light rays by the light-absorbing layer 300.

[0096] For example, the optical density (OD) value of the light-absorbing layer 300 is greater than or equal to 4. Here, the OD value of the light-absorbing layer 300 refers to the absorption of light rays by the light-absorbing layer 300. The greater the OD value of the light-absorbing layer 300, the greater the absorption of light rays by the light-absorbing layer 300.

[0097] In the embodiments of the present application, the auxiliary light-absorbing layer 500 in the display panel 000 can include a protective film and a light-absorbing adhesive on the side of the protective film facing the substrate 100. Here, the protective film in the auxiliary light-absorbing layer 500 can be attached to the side of the light-emitting unit 400 of the display panel 000 away from the substrate 100 by the light-absorbing adhesive. Therefore, the protective layer in the auxiliary light-absorbing layer 500 can also protect the light-emitting unit 400 in the display panel 000 to prevent the surface of the light-emitting unit 400 from being scratched.

[0098] The light-absorbing adhesive in the auxiliary light-absorbing layer 500 can include a transparent adhesive with adhesive effect and a light-absorbing dye mixed in the transparent adhesive. For example, the light-absorbing dye can be black dye.

[0099] In summary, the display panel provided by the embodiment of the present application comprises a substrate, a first metal driving layer, a light-absorbing layer, an auxiliary light-absorbing layer, and a plurality of light-emitting units. The light-absorbing layer has an overlapping projection on the substrate with the driving layer. In this way, the ambient light incident on the display panel can be absorbed by the light-absorbing layer, so that the ambient light is less likely to be reflected by the driving layer, thereby ensuring that the reflectivity of the display panel to the ambient light is low. In addition, by arranging the light-absorbing layer in the display panel, the reflectivity of the display panel to the ambient light can be reduced. Therefore, the transmittance of the auxiliary light-absorbing layer on the side of the plurality of light-emitting units away from the substrate can be appropriately increased, so that the absorption rate of the auxiliary light-absorbing layer to the light is low, thereby reducing the degree of absorption of the light emitted by the light-emitting unit by the auxiliary light-absorbing layer. In this way, without providing a large driving current to the light-emitting unit by the display panel, the overall display brightness of the display panel can be high, thereby effectively reducing the power consumption of the display panel.

[0100] In the embodiment of the present application, the display panel 000 can be used as a spliced display unit in a spliced screen. In this way, after a plurality of display panels 000 are spliced, a larger spliced display screen can be obtained. When the display panel 000 is used as a spliced display unit, the width of the frame of the display panel 000 needs to be narrow. Therefore, in the present application, the driving assembly is bound to the display panel 000 by a back binding method.

[0101] For example, as shown in FIG. 4, FIG. 4 is a back view of the display panel provided by the embodiment of the present application. The edge driving of the substrate 100 in the display panel 000 away from the first metal driving layer 201 can include a binding area F. The display panel 000 can further include a plurality of signal leads D1 in the binding area F. Here, at least part of the plurality of signal leads D1 can be electrically connected to the first metal driving layer 201 in the display panel 000. Here, the plurality of signal leads D1 in the binding area F are used to be bound to the driving assembly, so that the driving assembly can be bound to the display panel 000. In this way, the driving assembly can send a driving signal to the first metal driving layer 201 through the signal lead D1, so that the corresponding light-emitting unit 400 can be turned on. When the driving assembly is bound to the back of the display panel 000, the driving assembly does not occupy the space on the front of the display panel 000, so that the screen occupation ratio of the front of the display panel 000 is high, thereby ensuring that the width of the frame of the display panel 000 is narrow.

[0102] Optionally, as shown in FIG. 5, FIG. 5 is a partial side view of the display panel according to an embodiment of the present application. The display panel 000 can further include a plurality of connection traces D2 electrically connected to the plurality of signal leads D1. Part of the connection traces D2 is located on the side of the substrate 100 close to the first metal driving layer 201, and the part of the connection traces D2 can be electrically connected to the driving structure layer in the display panel 000. Another part of the connection traces D2 is located on the side of the substrate 100, and the end of the part of the connection traces D2 towards the back of the display panel 000 can be electrically connected to the corresponding signal lead D1.

[0103] In the above embodiment, the plurality of connection traces D2 and the plurality of signal leads D1 are formed by the same process. For example, the plurality of connection traces D2 and the plurality of signal leads D1 can be formed by a laser etching process. For example, after the driving backboard is prepared, a conductive layer can be sputtered on the edge area of the front of the driving backboard, the side of the driving backboard, and the binding area on the back of the driving backboard. Then, the conductive layer is subjected to a laser etching process, and the plurality of connection traces D2 and the plurality of signal leads D1 can be formed at the same time.

[0104] It should be noted that in the process of forming the plurality of signal leads D1 in the binding area F by the laser etching process, a laser (for example, a laser with a wavelength of 350-390 nm) needs to be used to irradiate the binding area F. In this process, the laser can pass through the substrate 100 and irradiate the part of the light-absorbing layer 300 distributed in the binding area F, and the light-absorbing layer 300 is made of an organic material with light-absorbing property. Thus, the light-absorbing layer 300 will have the undesirable phenomenon of bubbling under the irradiation of the laser, resulting in a lower flatness of the light-absorbing layer 300.

[0105] Therefore, as shown in FIG. 2, the display panel 000 according to an embodiment of the present application can further include a light-reflecting layer 600 located between the substrate 100 and the light-absorbing layer 300. The light-reflecting layer 600 can have an overlapping projection on the substrate 100 with the light-absorbing layer 300.

[0106] For example, the light-reflecting layer 600 can reflect the laser that passes through the substrate 100 and irradiates the light-absorbing layer 300, so that the laser does not irradiate the light-absorbing layer 300, effectively avoiding the undesirable phenomenon of bubbling of the light-absorbing layer 300, resulting in a higher flatness of the light-absorbing layer 300, and thus a higher reliability of the display panel 000.

[0107] Optionally, the material of the reflecting layer 600 in the display panel 000 can include amorphous silicon, low-temperature polysilicon or white ink. In a possible implementation, when the material of the reflecting layer 600 includes amorphous silicon, the amorphous silicon belongs to inorganic insulating material, and the amorphous silicon has a relatively high refractive index, and therefore, the laser (for example, laser with a wavelength between 350 nm and 390 nm) directed to the amorphous silicon is easily reflected. The thickness of the reflecting layer 600 ranges from 500 angstroms to 2000 angstroms, so that the laser irradiated on the reflecting layer 600 can be reflected by the reflecting layer 600, so that the laser does not irradiate on the light-absorbing layer 300.

[0108] In another possible implementation, when the material of the reflecting layer 600 includes low-temperature polysilicon, the low-temperature polysilicon belongs to semiconductor material, and the low-temperature polysilicon also has a relatively high refractive index, and therefore, the laser (for example, laser with a wavelength between 350 nm and 390 nm) directed to the low-temperature polysilicon is easily reflected. The thickness of the reflecting layer 600 ranges from 500 angstroms to 2000 angstroms, so that the laser irradiated on the reflecting layer 600 can be reflected by the reflecting layer 600, so that the laser does not irradiate on the light-absorbing layer 300.

[0109] In yet another possible implementation, when the material of the reflecting layer 600 includes white ink, the white ink belongs to organic insulating material with scattering property, and the thickness of the reflecting layer 600 ranges from 0.5 microns to 3 microns, so that the laser irradiated on the reflecting layer 600 can be reflected by the reflecting layer 600, and the reflected laser is emitted in a scattered form, so that the laser does not irradiate on the light-absorbing layer 300.

[0110] In the embodiment of the present application, the structure of the driving structure layer of the display panel 000 located on the side of the first metal driving layer 201 facing the substrate has various structures, for example, the driving structure layer can be the second metal driving layer 202, and for another example, the driving structure layer can also include a plurality of driving circuits. In addition, the reflecting layer 600 in the display panel 000 is distributed between the substrate 100 and the light-absorbing layer 300 in various positions. Therefore, the present application will be described by taking the following four optional implementations as examples:

[0111] In the first optional implementation, refer to FIG. 6, which is a schematic diagram of a film layer structure of a driving backplane in a display panel according to an embodiment of the present application. Here, the driving backplane in the display panel 000 refers to a part of the display panel 000 without the light-emitting unit 400. The reflective layer 600 in the display panel 000 can be located on a side of the first metal driving layer 201 away from the substrate 100, and the display panel 000 can further include a second metal driving layer 202 located on a side of the first metal driving layer 201 close to the substrate 100. That is, the reflective layer 600 can be located between the first metal driving layer 201 and the light-absorbing layer 300, and the driving structure layer in the display panel 000 is the second metal driving layer 202. In this case, the reflective layer 600 can have a second via V2 in communication with the first via V1, so that the light-emitting unit 400 in the display panel 000 can be electrically connected to the conductive pad S through the first via V1 and the second via V2.

[0112] In the present application, when the reflective layer 600 is located between the first metal driving layer 201 and the light-absorbing layer 300, the second via V2 in the reflective layer 600 and the first via V1 in the light-absorbing layer 300 are formed at the same time by the same patterning process. Here, the patterning process can include photoresist coating, exposure, development, etching, and photoresist stripping. In this case, the reflective layer 600 and the light-absorbing layer 300 can be formed in layers in sequence first, and then the first via V1 can be formed in the light-absorbing layer 300 and the second via V2 in communication with the first via V1 can be formed in the reflective layer 600 by the patterning process. In this way, the process difficulty of the display panel 000 can be effectively simplified.

[0113] Alternatively, the orthographic projection of the light-absorbing layer 300 on the substrate 100 can be located within the orthographic projection of the reflective layer 600 on the substrate 100. In this way, in the process of forming the plurality of signal leads D1 in the binding area F by the laser etching process, the laser irradiated on the binding area F can be fully reflected by the reflective layer 600 after passing through the substrate 100 and the first metal driving layer 201, so as to ensure that the laser does not irradiate on the light-absorbing layer 300.

[0114] In the embodiment of the present application, the display panel 000 can further include a first insulating layer 700 located between the first metal driving layer 201 and the light-absorbing layer 300. Here, the first insulating layer 700 can have a third via V3 in communication with the first via V1, so that the light-emitting unit 400 in the display panel 000 can be electrically connected to the conductive pad S through the first via V1 and the third via V3.

[0115] It should be noted that since the light-absorbing layer 300 in the display panel 000 also has insulation, the light-absorbing layer 300 can be in direct contact with the first metal driving layer 201 away from the substrate 100, or the first insulating layer 700 can be in direct contact with the driving layer 300 away from the substrate 100. Therefore, the embodiments of the present application will be described below with the following three cases as examples:

[0116] In the first case, as shown in FIG. 6, the first insulating layer 700 in the display panel 000 is in direct contact with the driving layer 300 away from the substrate 100. The light-reflecting layer 600 in the display panel 000 is located on the side of the first insulating layer 700 away from the substrate 100. In this case, the first via V1 of the light-absorbing layer 300, the second via V2 of the light-reflecting layer 600, and the third via V3 of the first insulating layer 700 are sequentially connected, and the light-emitting unit 400 can be electrically connected to the conductive pad S through the first via V1, the second via V2, and the third via V3 in sequence. Moreover, the first via V1 of the light-absorbing layer 300, the second via V2 of the light-reflecting layer 600, and the third via V3 of the first insulating layer 700 can be formed at the same time by a one-time patterning process.

[0117] It should be noted that the material of the light-reflecting layer 600 in the display panel 000 in this case can be amorphous silicon or white ink. Moreover, the first insulating layer 700 can be made of inorganic materials with good water and oxygen barrier ability, so that when the first insulating layer 700 is in direct contact with the first metal driving layer 201 away from the substrate 100, the water and oxygen in the external environment will not erode the first metal driving layer 201 from the side of the first metal driving layer 201 away from the substrate 100, thereby effectively reducing the probability of oxidation and corrosion of the first metal driving layer 201. In addition, when the material of the light-reflecting layer 600 is amorphous silicon, since amorphous silicon also belongs to inorganic insulating materials, the layering of the first insulating layer 700 and the light-reflecting layer 600 can further improve the protection effect of the first metal driving layer 201.

[0118] In the second case, refer to FIG. 7, which is a schematic diagram of a film layer structure of a driving backplane in another display panel according to an embodiment of the present application. The light reflecting layer 600 in the display panel 000 directly contacts the driving layer 300 on the side of the driving layer 300 away from the substrate 100. The first insulating layer 700 in the display panel 000 is located on the side of the light reflecting layer 600 away from the substrate 100. In this case, the first via hole V1 of the light absorbing layer 300, the third via hole V3 of the first insulating layer 700, and the second via hole V2 of the light reflecting layer 600 are sequentially connected, and the light emitting unit 400 can be electrically connected to the conductive pad S through the first via hole V1, the third via hole V3, and the second via hole V2 in sequence. In addition, the first via hole V1 of the light absorbing layer 300, the third via hole V3 of the first insulating layer 700, and the second via hole V2 of the light reflecting layer 600 can be formed at the same time through a one-time patterning process.

[0119] It should be noted that the material of the light reflecting layer 600 in the display panel 000 in this case needs to be amorphous silicon. Since amorphous silicon is an inorganic insulating material, the water and oxygen in the external environment cannot erode the first metal driving layer 201 from the side of the first metal driving layer 201 away from the substrate 100 through the light reflecting layer 600, thereby effectively reducing the probability of oxidation and corrosion of the first metal driving layer 201. In addition, the first insulating layer 700 can be made of an inorganic material with good water and oxygen isolation ability, or an organic material with good planarity, which is not limited in the embodiments of the present application.

[0120] In the third case, refer to FIG. 8, which is a schematic diagram of a film layer structure of a driving backplane in another display panel according to an embodiment of the present application. The light reflecting layer 600 in the display panel 000 directly contacts the driving layer 300 on the side of the driving layer 300 away from the substrate 100, and the light reflecting layer 600 and the first insulating layer 700 in the display panel 000 are the same film layer structure. In this case, the light reflecting layer 600 in the display panel 000 can not only reflect laser light, but also insulate between the first metal driving layer 201 and the light absorbing layer 300. In addition, the number of film layer structures in the display panel 000 can be reduced, thereby reducing the preparation cost of the display panel 000.

[0121] It should be noted that the material of the light reflecting layer 600 in the display panel 000 in this case needs to be amorphous silicon. In this way, the water and oxygen in the external environment cannot erode the first metal driving layer 201 from the side of the first metal driving layer 201 away from the substrate 100 through the light reflecting layer 600, thereby effectively reducing the probability of oxidation and corrosion of the first metal driving layer 201.

[0122] In a second alternative implementation, refer to FIG. 9, which is a schematic diagram of a film layer structure of a driving backplane in a display panel according to an embodiment of the present application. The reflective layer 600 in the display panel 000 can be located on the side of the first metal driving layer 201 close to the base 100, and the display panel 000 can further include a second metal driving layer 202 located on the side of the first metal driving layer 201 close to the base 100. That is, the reflective layer 600 can be located between the first metal driving layer 201 and the base 100, and the driving structure layer in the display panel 000 is the second metal driving layer 202. For example, the reflective layer 600 can be located between the second metal driving layer 202 and the base 100. In this way, in the process of forming the plurality of signal leads D1 in the binding area F by using the laser etching process, the laser irradiated on the binding area F can be directly reflected by the reflective layer 600 after passing through the base 100, so as to ensure that the laser cannot irradiate on the light-absorbing layer 300. Here, when the reflective layer 600 is located between the second metal driving layer 202 and the base 100, the laser irradiated on the binding area F can be reflected by the reflective layer 600 after passing through the base 100 without passing through the first metal driving layer 201, so that the reflective layer 600 has a higher efficiency in reflecting the laser.

[0123] In the embodiment of the present application, refer to FIG. 10, which is a partial enlarged view of a driving backplane in a display panel according to an embodiment of the present application. At least one of the first metal driving layer 201 and the second metal driving layer 202 in the display panel 000 has a mark pattern M. Here, after the mark pattern M is arranged in at least one of the first metal driving layer 201 and the second metal driving layer 202, a plurality of signal leads are arranged in the binding area on the back of the base 100, or the driving component is bound in the binding area on the back of the base 100, the position of at least one of the first metal driving layer 201 and the second metal driving layer 202 on the base 100 can be determined based on the mark pattern M, so that the signal leads formed in the binding area can be accurately electrically connected with the first metal driving layer 201 and the second metal driving layer 202, and the driving component can be accurately bound in the binding area.

[0124] When the reflective layer 600 in the display panel 000 is located between the substrate 100 and the second metal driving layer 202, the reflective layer 200 will shield the mark pattern M in at least one of the first metal driving layer 201 and the second metal driving layer 202, resulting in that the mark pattern M cannot be recognized from the back of the substrate 100. Therefore, the reflective layer 600 needs to be provided with the avoiding hole K. Here, the orthographic projection of the avoiding hole K in the reflective layer 600 on the substrate 100 can overlap with the orthographic projection of the mark pattern M in the first metal driving layer 201 on the substrate 100. For example, the orthographic projection of the mark pattern M on the substrate 100 can be located within the orthographic projection of the avoiding hole K on the substrate 100. In this way, the mark pattern M in at least one of the first metal driving layer 201 and the second metal driving layer 202 can be exposed from the avoiding hole K in the reflective layer 600, so that the mark pattern M can be recognized from the back of the substrate 100. Moreover, the orthographic projection of the mark pattern M on the substrate 100 and the orthographic projection of the avoiding hole K on the substrate 100 have the same shape, and the distance between the boundary of the orthographic projection of the mark pattern M on the substrate 100 and the boundary of the orthographic projection of the avoiding hole K on the substrate 100 is small, for example, the distance between them can be usually less than or equal to 1 micrometer. In this way, in the process of forming the plurality of signal leads D1 located in the binding area F by using the laser etching process, even if the laser can pass through the avoiding hole K in the reflective layer 600, it can be ensured that the laser passing through the avoiding hole K can be shielded by the mark pattern M.

[0125] It should be noted that for the above first optional implementation, that is, when the reflective layer 600 in the display panel 000 is located between the first metal driving layer 201 and the light-absorbing layer 300, the first metal driving layer 201 is closer to the substrate 100 relative to the reflective layer 600. Therefore, from the side of the back of the substrate 100, the reflective layer 600 will not shield the first metal driving layer 201, so that even if the avoiding hole is not provided in the reflective layer 600, the mark pattern M in at least one of the first metal driving layer 201 and the second metal driving layer 202 can be recognized from the back of the substrate 100. In this case, the reflective layer 600 in the display panel 000 does not need to be formed by a single patterning process, and the reflective layer 600 and the light-absorbing layer 200 can be formed at the same time by using a single patterning process, further simplifying the preparation difficulty of the display panel 000.

[0126] Optionally, for the first optional implementation and the second optional implementation, the display panel 000 can drive the light-emitting unit 300 in the display panel 000 to emit light under the joint action of the first metal driving layer 201 and the second metal driving layer 202, and the light-emitting unit 400 in the display panel 000 under this architecture needs to simultaneously include the LED 401 and the driving chip 402. The following embodiments will describe other structures in the display panel 000 under this architecture and the driving principle of the display panel 000.

[0127] As shown in FIGS. 6-9, the display panel 000 can further include a first inorganic protective layer 801 located between the second metal driving layer 202 and the substrate 100. Here, the first inorganic protective layer 801 can prevent water and oxygen in the external environment from corroding the first metal driving layer 201 from the side of the first metal driving layer 201 close to the substrate 100, thereby further reducing the probability of oxidation and corrosion of the first metal driving layer 201.

[0128] It should be noted that for the first optional implementation, that is, when the reflective layer 600 in the display panel 000 is located between the first metal driving layer 201 and the light-absorbing layer 300, the first inorganic protective layer 801 in the display panel 000 can directly contact the side of the first metal driving layer 201 close to the substrate 100.

[0129] For the second optional implementation, that is, when the reflective layer 600 in the display panel 000 is located between the second metal driving layer 202 and the substrate 100, if the material of the reflective layer 600 is amorphous silicon, the inorganic protective layer 801 can be located on the side of the reflective layer 600 close to the substrate 100 or on the side of the reflective layer 600 away from the substrate 100. Of course, the inorganic protective layer 801 and the reflective layer 600 can also be the same film structure, and the embodiments of the present application do not limit this. If the material of the reflective layer 600 is white ink, the inorganic protective layer 801 needs to be arranged on the side of the reflective layer 600 away from the substrate 100, so that the inorganic protective layer 801 can directly contact the side of the second metal driving layer 202 close to the substrate 100, thereby enabling the inorganic protective layer 801 to better protect the first metal driving layer 201.

[0130] Optionally, as shown in FIGS. 6-9, the display panel 000 can further include a second insulating layer 900 located on the side of the light-absorbing layer 300 away from the substrate 100. In this way, the second insulating layer 900 can protect the light-absorbing layer 300 in the display panel 000 to ensure that the light-absorbing layer 300 will not be damaged and thus cause the shielding effect of the first metal driving layer 201 and the second metal driving layer 202 to deteriorate.

[0131] In the present application, the second insulating layer 900 can have a fourth via V4 in communication with the first via V1. In this case, a plurality of light emitting units 400 in the display panel 000 can be distributed on the side of the second insulating layer 900 away from the substrate 100, and the light emitting units 400 can be electrically connected to the conductive pads S through the fourth via V4 and the first via V1.

[0132] Optionally, as shown in FIGS. 6-9, a portion of the second insulating layer 900 can extend into the first via V1, and the portion of the second insulating layer 900 extending into the first via V1 can cover at least part of the inner wall of the first via V1. In this case, the portion of the second insulating layer 900 extending into the first via V1 can have a fourth via V4 in communication with this first via V1, and the orthographic projection of this fourth via V4 on the substrate 100 can be located within the orthographic projection of the first via V1 on the substrate 100. In this way, at least part of the inner wall of this first via V1 can be protected by the portion of the second insulating layer 900 extending into the first via V1.

[0133] For example, the inner wall of the first via V1 of the light absorbing layer 300 can be completely covered by the second insulating layer 900. That is, the portion of the second insulating layer 900 extending into the first via V1 can completely cover the inner wall of this first via V1. In this case, the light absorbing layer 300 can be covered at various positions by the second insulating layer 900 to ensure that the light absorbing layer 300 is not exposed.

[0134] In one possible case, the light absorbing layer 300 in the display panel 000 generally includes carbon particles. The carbon particles can give the light absorbing layer 300 light absorbing function. During the preparation of the display panel 000, the display panel 000 needs to be soaked in a plating tank, and the solution (usually an acidic or alkaline solution) in the plating tank can precipitate the carbon particles in the light absorbing layer 300, thereby contaminating the plating tank. Therefore, in order to prevent the plating tank from being contaminated, the portion of the second insulating layer 900 extending into the first via V1 needs to completely cover the inner wall of this first via V1 to ensure that the light absorbing layer 300 is not exposed, thereby ensuring that the solution in the plating tank does not precipitate the carbon particles in the light absorbing layer 300 when the display panel 000 is soaked in the plating tank, so as to ensure that the plating tank is not contaminated.

[0135] It should be noted that, for the first optional implementation, that is, when the reflective layer 600 in the display panel 000 is located between the first metal driving layer 201 and the light-absorbing layer 300, as shown in FIGS. 6 to 8, the part of the second insulating layer 900 extending into the first via V1 can also extend into the second via V2 and cover at least part of the inner wall of the second via V2. Similarly, the part of the second insulating layer 900 extending into the first via V1 can also extend into the third via V3 and cover at least part of the inner wall of the third via V3. For example, the inner wall of the second via V2 can be completely covered by the second insulating layer 900, and the inner wall of the third via V3 can also be completely covered by the second insulating layer 900.

[0136] In the embodiment of the present application, the type of the second insulating layer 900 in the display panel 000 is various, for example, the second insulating layer 900 can include at least one of an inorganic insulating layer and an organic insulating layer. Here, when the second insulating layer 900 in the display panel 000 contains both the inorganic insulating layer 901 and the organic insulating layer 902, the fourth via V4 in the second insulating layer 900 can contain a first sub-aperture V41 and a second sub-aperture V42 connected in communication, wherein the first sub-aperture V41 is located in the inorganic insulating layer 901, and the second sub-aperture V42 is located in the organic insulating layer 902. The embodiment of the present application will be illustratively described with the following four possible cases:

[0137] The first possible case is shown in FIG. 11, which is a schematic diagram of a film layer structure of a driving backplane in a display panel according to another embodiment of the present application. When the second insulating layer 900 in the display panel 000 is a single-layer film layer structure and the second insulating layer 900 is an inorganic insulating layer 901, part of the inorganic insulating layer 901 can extend into the first via V1, and the part of the inorganic insulating layer 901 extending into the first via V1 can completely cover the inner wall of the first via V1 to ensure that the light-absorbing layer 300 is not exposed.

[0138] It should be noted that the part of the inorganic insulating layer 901 located outside the first via V1 can be in contact with the side of the light-absorbing layer 300 away from the substrate 100. In this way, the part of the inorganic insulating layer 901 located outside the first via V1 can protect the light-absorbing layer 300 from the side of the light-absorbing layer 300 away from the substrate 100, and the part of the inorganic insulating layer 901 located in the first via V1 can protect the light-absorbing layer 300 from the inner wall of the first via V1. Here, since the inorganic insulating layer 901 has good water and oxygen barrier ability, when the light-absorbing layer 300 is wrapped and protected by the inorganic insulating layer 901, the protection effect on the light-absorbing layer 300 can be effectively improved.

[0139] The second possible case is shown in FIG. 12, which is a schematic view of a film layer structure of a driving backplane in another display panel according to another embodiment of the present application. When the second insulating layer 900 in the display panel 000 is a single-layer film layer structure, and the second insulating layer 900 is an organic insulating layer 902, the portion of the organic insulating layer 902 extending into the first via V1 can completely cover the inner wall of the first via V1, so as to ensure that the light-absorbing layer 300 is not exposed.

[0140] It should be noted that the portion of the organic insulating layer 902 outside the first via V1 can be in contact with the side of the light-absorbing layer 300 away from the substrate 100. In this way, the portion of the organic insulating layer 902 outside the first via V1 can protect the light-absorbing layer 300 from the side of the light-absorbing layer 300 away from the substrate 100, and the portion of the organic insulating layer 902 extending into the first via V1 can protect the light-absorbing layer 300 from the inner wall of the first via V1. Here, since the organic insulating layer 902 can be well attached to the light-absorbing layer 300, the portion of the organic insulating layer 902 extending into the first via V1 can be closely attached to the inner wall of the first via V1.

[0141] In addition, since the organic insulating layer 902 has good planarity, when the organic insulating layer 902 is arranged on the side of the light-absorbing layer 300 away from the substrate 100, the side of the organic insulating layer 902 away from the substrate 100 can have good planarity. In this case, the side of the organic insulating layer 902 away from the substrate 100 is the outermost side of the driving backplane, and therefore, when a plurality of light-emitting units 400 are subsequently formed on the driving backplane, the side of each light-emitting unit 400 away from the substrate 100 can be flush, so as to ensure that the display panel 000 has good display effect.

[0142] The third possible case is shown in FIG. 13, which is a schematic view of a film layer structure of a driving backplane in another display panel according to another embodiment of the present application. When the second insulating layer 900 in the display panel 000 is a double-layer film layer structure, that is, the second insulating layer 900 comprises an inorganic insulating layer 901 and an organic insulating layer 902, and the inorganic insulating layer 901 is closer to the light-absorbing layer 300 than the organic insulating layer 902, the portion of the inorganic insulating layer 602 extending into the first via V1 and covering the inner wall of the first via V1, and / or the portion of the organic insulating layer 902 extending into the first via V1 and covering the inner wall of the first via V1.

[0143] For example, in FIG. 13, both the inorganic insulating layer 901 and the organic insulating layer 902 have a portion extending into the first via V1, and the portion of the inorganic insulating layer 901 extending into the first via V1 can completely cover the inner wall of the first via V1, and the portion of the organic insulating layer 603 extending into the first via V1 can completely cover the portion of the inorganic insulating layer 901 away from the inside of the first via V1. In this way, it can be ensured that the light-absorbing layer 300 is not exposed.

[0144] It should be noted that the portion of the inorganic insulating layer 901 outside the first via V1 can be in contact with the side of the light-absorbing layer 300 away from the substrate 100, and the portion of the organic insulating layer 902 outside the first via V1 can be in contact with the side of the inorganic insulating layer 901 away from the substrate 100. In this way, the portions of the inorganic insulating layer 901 and the organic insulating layer 902 outside the first via V1 can protect the light-absorbing layer 300 from the side of the light-absorbing layer 300 away from the substrate 100, and the portions of the inorganic insulating layer 901 and the organic insulating layer 902 inside the first via V1 can protect the light-absorbing layer 300 from the inner wall of the first via V1.

[0145] In addition, since the organic insulating layer 902 has good planarity, when the organic insulating layer 902 is located on the side of the inorganic insulating layer 901 away from the substrate 100, it can be ensured that the side of the organic insulating layer 902 away from the substrate 100 has good planarity. And the side of the organic insulating layer 902 away from the substrate 100 in this case is the outermost side of the driving backplane, and therefore, when a plurality of light-emitting units 400 are subsequently formed on the driving backplane, it can be ensured that the side of each light-emitting unit 400 away from the substrate 100 is flush, so as to ensure that the display effect of the display panel 000 is good.

[0146] The fourth possible case is shown in FIG. 14, which is a schematic diagram of the film layer structure of the driving backplane in another display panel according to an embodiment of the present application. When the second insulating layer 900 in the display panel 000 has a double-layer film layer structure, that is, the second insulating layer 900 includes both the inorganic insulating layer 901 and the organic insulating layer 902, and the organic insulating layer 902 is closer to the light-absorbing layer 300 than the inorganic insulating layer 901, a portion of the organic insulating layer 902 extends into the first via V1 and covers the inner wall of the first via V1, and / or a portion of the inorganic insulating layer 602 extends into the first via V1 and covers the inner wall of the first via V1.

[0147] For example, in FIG. 14, the organic insulating layer 902 and the inorganic insulating layer 901 both have portions extending into the first via V1, and the portion of the organic insulating layer 902 extending into the first via V1 can completely cover the inner wall of the first via V1, and the portion of the inorganic insulating layer 901 extending into the first via V1 can completely cover the portion of the organic insulating layer 902 away from the inside of the first via V1. In this way, it can be ensured that the light-absorbing layer 300 is not exposed.

[0148] It should be noted that the portion of the organic insulating layer 902 outside the first via V1 can be in contact with the side of the light-absorbing layer 300 away from the substrate 100, and the portion of the inorganic insulating layer 901 outside the first via V1 can be in contact with the side of the organic insulating layer 902 away from the substrate 100. In this way, the portions of the organic insulating layer 902 and the inorganic insulating layer 901 outside the first via V1 can protect the light-absorbing layer 300 from the side of the light-absorbing layer 300 away from the substrate 100, and the portions of the organic insulating layer 902 and the inorganic insulating layer 901 inside the first via V1 can protect the light-absorbing layer 300 from the inner wall of the first via V1.

[0149] Here, since the organic insulating layer 902 can be well attached to the light-absorbing layer 300, the portion of the organic insulating layer 902 extending into the first via V1 can be closely attached to the inner wall of the first via V1. Also, since the inorganic insulating layer 901 has good water and oxygen blocking ability, when the organic insulating layer 902 is covered by the inorganic insulating layer 901, it can be ensured that the water and oxygen in the external environment will not erode the internal structure of the display panel 000. In this way, the protection effect of the light-absorbing layer 300 can be further improved.

[0150] Optionally, the second metal driving layer 202 in the display panel 000 can include a plurality of second driving signal lines (not labeled in the figure). The first metal driving layer 201 in the display panel 000 can include a first driving signal line (not labeled in the figure) and a plurality of conductive pads S. Here, the extension direction of the first driving signal line can intersect the extension direction of the second driving signal line. For example, the extension direction of the first driving signal line is perpendicular to the extension direction of the second driving signal line.

[0151] Among the plurality of conductive pads S in the first metal driving layer 201, a part of the conductive pads S need to be electrically connected to the first driving signal line, and another part of the conductive pads S need to be electrically connected to the second driving signal line.

[0152] In the embodiments of the present application, the display panel 000 can further include a third insulating layer 800 located between the second metal driving layer 202 and the first metal driving layer 201. Here, the second metal driving layer 202 and the first metal driving layer 201 can be insulated by the third insulating layer 800, so as to ensure that the second driving signal line in the second metal driving layer 202 and the first driving signal line in the first metal driving layer 201 will not be short-circuited at the intersecting position.

[0153] For example, the third insulating layer 800 can have a fifth via V5, so that part of the structure in the first metal driving layer 201 can be electrically connected to part of the structure in the second metal driving layer 202 through the fifth via V5.

[0154] Optionally, the third insulating layer 800 in the display panel 000 can include a second inorganic protective layer 802, an organic planar layer 803 and a third inorganic protective layer 804 which are stacked in the direction perpendicular to and away from the substrate 100. Here, the second inorganic protective layer 802 can cover the second metal driving layer 202, and the second inorganic protective layer 802 has a third sub-opening; the organic planar layer 803 can be located on the side of the second inorganic protective layer 802 away from the substrate 100, and the organic planar layer 803 can have a fourth sub-opening in communication with the third sub-opening; the third inorganic protective layer 804 can be located on the side of the organic planar layer 803 away from the substrate 100, and part of the third inorganic protective layer 804 extends into the third sub-opening and the fourth sub-opening, and can cover the inner wall of the third sub-opening and the inner wall of the fourth sub-opening, and the part of the third inorganic protective layer 804 extending into the third sub-opening and the fourth sub-opening has a fifth sub-opening. Therefore, the third sub-opening, the fourth sub-opening and the fifth sub-opening in communication with each other can constitute the fifth via V5 of the third insulating layer 800.

[0155] It should be noted that for the second inorganic protective layer 802, the second inorganic protective layer 802 can isolate water and oxygen in the external environment, so that the water and oxygen in the external environment will not erode the second metal driving layer 202 from the side of the second metal driving layer 202 away from the substrate 100, thereby effectively reducing the probability of oxidation and corrosion of the second metal driving layer 202.

[0156] For the organic planar layer 803, the organic planar layer 803 can play a planarizing role, so as to ensure that the subsequent film layer structure can be stably formed.

[0157] For the third inorganic protective layer 804, and since the subsequent first metal driving layer 201 needs to be arranged on the side of the third inorganic protective layer 804 away from the substrate 100, the water and oxygen in the external environment cannot erode the first metal driving layer 201 from the side of the first metal driving layer 201 close to the substrate 100 through the third inorganic protective layer 804, thereby effectively reducing the probability of oxidation and corrosion of the first metal driving layer 201.

[0158] Optionally, please refer to FIG. 15 and FIG. 16, FIG. 15 is a partial top view of a driving backplane in a display panel provided by an embodiment of the present application, and FIG. 16 is a partial top view of a display panel provided by an embodiment of the present application. The light emitting units 400 in the display panel 000 can be arranged in multiple rows and multiple columns. The multiple second driving signal lines 2021 in the second metal driving layer 202 can include multiple groups of second driving signal lines 2021 corresponding to the multiple columns of light emitting units 400, and each group of second driving signal lines 2021 can be electrically connected to a column of light emitting units 400. The multiple first driving signal lines 2011 in the first metal driving layer 201 can correspond to the multiple rows of light emitting units 400, and each first driving signal line 2011 can be electrically connected to a row of light emitting units 400. Wherein, the orthogonal projection of a column of light emitting units 400 on the substrate 100 can intersect with the orthogonal projection of a corresponding group of second driving signal lines 2021 on the substrate 100, and a row of light emitting units 400 can be distributed between two adjacent first driving signal lines 2011.

[0159] For example, a group of second driving signal lines 2021 corresponding to a column of light emitting units 400 in the display panel 000 can include an anode driving signal line L1, a data signal line L2 and a ground line L3, and a first driving signal line 2011 corresponding to a row of light emitting units 400 can be a power signal line.

[0160] The light emitting unit 400 in the display panel 000 can include a driving chip 402 and at least one LED 401. In this case, the multiple conductive pads S distributed in the first metal driving layer 201 in the display panel 000 can include a first pad group S10 for fixed connection with the LED 401 in the light emitting unit 400, and a second pad group S20 for fixed connection with the driving chip 402 in the light emitting unit 400. Optionally, the orthogonal projection of the first pad group S10 on the substrate 100 can be located within the orthogonal projection of the anode driving signal line L1 on the substrate 100; and the orthogonal projection of the second pad group S20 on the substrate 100 can be located within the orthogonal projection of the ground line L3 on the substrate 100.

[0161] Here, the first pad group S10 can include a first conductive pad S1 and a second conductive pad S2. The second pad group S20 can include a third conductive pad S3, a fourth conductive pad S4, and a fifth conductive pad S5.

[0162] The first conductive pad S1 in the first pad group S10 can be electrically connected to the first driving signal line 2011. For example, the first metal driving layer 201 can further include a first transfer electrode 2012. The first driving signal line 2011 can be electrically connected to the first conductive pad S1 through the first transfer electrode 2012.

[0163] The second conductive pad S2 in the first pad group S10 can be electrically connected to the third conductive pad S3 in the second pad group S20. For example, the first metal driving layer 201 can further include a second transfer electrode 2013. The first conductive pad S1 can be electrically connected to the third conductive pad S3 through the second transfer electrode 2013.

[0164] The other part of the second driving signal lines 2021 electrically connected to the light emitting unit 400 can be electrically connected to the fourth conductive pad S4 in the second pad group S20. For example, the first metal driving layer 201 can further include a third transfer electrode 2014. The data signal line L2 in the second driving signal lines 2021 can be electrically connected to one of the fourth conductive pads S4 through one of the third transfer electrodes 2014; and the ground line L3 in the second driving signal lines 2021 can be electrically connected to another of the fourth conductive pads S4 through another of the third transfer electrodes 2014.

[0165] The first driving signal line 2011 electrically connected to the light emitting unit 400 can be electrically connected to the fifth conductive pad S5 in the second pad group S20. For example, the first metal driving layer 201 can further include a fourth transfer electrode 2015. The first driving signal line 2011 can be electrically connected to the fifth conductive pad S5 through the fourth transfer electrode 2015.

[0166] For example, the number of the LEDs 401 in the light emitting unit 400 can be three, which can be distributed as a red LED 401a for emitting red light, a green LED 401b for emitting green light, and a blue LED 401c for emitting blue light. In this case, the number of the first pad groups S10 can also be three, which can be electrically connected to the red LED 401a, the green LED 401b, and the blue LED 401c, respectively.

[0167] Here, the red LED 401a, the green LED 401b and the blue LED 401c in the light emitting unit 400 each have two pins, which are the positive pin and the negative pin respectively.

[0168] The positive pin of the red LED 401a can be soldered with the first conductive pad S1 in the corresponding first pad group S10, so that the positive pin of the red LED 401a can be connected to the corresponding anode driving signal line L1 through the first conductive pad S1. The negative pin of the red LED 401a can be soldered with the second conductive pad S2 in the corresponding first pad group S10.

[0169] The positive pin of the green LED 401b can be soldered with the first conductive pad S1 in the corresponding first pad group S10, so that the positive pin of the green LED 401b can be connected to the corresponding anode driving signal line L1 through the first conductive pad S1. The negative pin of the green LED 401b can be soldered with the second conductive pad S2 in the corresponding first pad group S10.

[0170] The positive pin of the blue LED 401c can be soldered with the first conductive pad S1 in the corresponding first pad group S10, so that the positive pin of the blue LED 401c can be connected to the corresponding anode driving signal line L1 through the first conductive pad S1. The negative pin of the blue LED 401c can be soldered with the second conductive pad S2 in the corresponding first pad group S10.

[0171] The driving chip 402 in the light emitting unit 400 has six pins, which are the power signal input pin, the data signal input pin, the ground pin, and the three signal output pins corresponding to the three LEDs respectively.

[0172] The three signal output pins of the driving chip 402 can be soldered with the three third conductive pads S3 in the second pad group S20 respectively. Since the three third conductive pads S3 are electrically connected with the three second conductive pads S2 in the three first pad groups S10, the three signal output pins of the driving chip 402 can be electrically connected with the three LED negative pins respectively.

[0173] The power signal input pin of the driving chip 402 can be soldered with a fifth conductive pad S5 in the second pad group S20, so that the power signal input pin can be connected to the power signal line (i.e. the first driving signal line 2011) through the fifth conductive pad S5.

[0174] The data signal input pin of the driving chip 402 can be welded with a fourth conductive pad S4 in the second pad group S20, so that the data signal input pin can be connected to the data signal line L2 through the fourth conductive pad S4.

[0175] The ground pin of the driving chip 402 can be welded with another fourth conductive pad S4 in the second pad group S20, so that the ground pin can be connected to the ground line L3 through the fourth conductive pad S4.

[0176] In this case, when the display panel 000 needs to control the light emitting unit 400 to emit light, a power supply driving signal can be applied to the power supply signal line in the display panel 000 which is electrically connected to the light emitting unit 400, and a data driving signal can be applied to the data signal line L2 which is electrically connected to the light emitting unit 400. In this way, after the driving chip 402 in the light emitting unit 400 receives the power supply driving signal through the power signal input pin, the driving chip 402 can be in a working state. And after the driving chip 402 receives the data signal through the data signal input pin, the driving chip 402 can generate three cathode signals corresponding to the three LEDs based on the data signal. The three cathode signals can be transmitted to the three LED anode pins through the three signal output pins respectively. Since the anode pin of the LED is always connected to the anode signal applied by the anode driving signal line L1, after the LED receives the anode signal and the cathode signal respectively, the LED can emit light with a corresponding intensity.

[0177] It should be noted that, in order to simplify the wiring structure in the display panel 000, at least two of the anode pin of the red LED 401a, the anode pin of the green LED 401b and the anode pin of the blue LED 401c can be connected to the same anode driving signal line L1. Since the light emitting characteristics of the red LED 401a are quite different from those of the green LED 401b and those of the blue LED 401c, and the light emitting characteristics of the green LED 401b are quite similar to those of the blue LED 401c, the anode pin of the green LED 401b and the anode pin of the blue LED 401c can be connected to the same anode driving signal line L1, and the anode pin of the red LED 401a can be connected to a different anode driving signal line L1. In this case, the first conductive pad S1 welded with the anode pin of the green LED 401b and the first conductive pad S1 welded with the anode pin of the blue LED 401c can be an integrated structure. That is, the anode pin of the green LED 401b and the anode pin of the blue LED 401c can be welded with the same first conductive pad S1, and the anode pin of the red LED 401a can be welded with another first conductive pad S1.

[0178] In a third optional implementation, referring to FIG. 17, FIG. 17 is a schematic diagram of a film layer structure of a driving backplane in a display panel according to an embodiment of the present application. The reflective layer 600 in the display panel 000 can be located on a side of the first metal driving layer 201 away from the substrate 100, and the display panel 000 can further include a plurality of driving circuits 203 located on a side of the first metal driving layer 201 close to the substrate 100. That is, the reflective layer 600 can be located between the first metal driving layer 201 and the light absorbing layer 300, and the driving structure layer in the display panel 000 includes the plurality of driving circuits 203.

[0179] It should be noted that the distribution position and principle of the reflective layer 600 and the material of the reflective layer 600 in this case can refer to the corresponding content in the first optional implementation, and the embodiments of the present application will not be described here.

[0180] In a fourth optional implementation, referring to FIG. 18, FIG. 18 is a schematic diagram of another film layer structure of a driving backplane in a display panel according to an embodiment of the present application. The reflective layer 600 in the display panel 000 can be located on a side of the first metal driving layer 201 close to the substrate 100, and the display panel 000 can further include a plurality of driving circuits 203 located on a side of the first metal driving layer 201 close to the substrate 100. That is, the reflective layer 600 can be located between the first metal driving layer 201 and the substrate 100, and the driving structure layer in the display panel 000 includes the plurality of driving circuits 203.

[0181] For example, the plurality of driving circuits 203 in the display panel 000 can correspond to the plurality of light emitting units 400 one by one, and each driving circuit 203 can be electrically connected to the corresponding light emitting unit 400 through a conductive pad S in the first metal driving layer 201. Here, each driving circuit 203 in the display panel 000 can include a plurality of electrical patterns stacked, and the display panel 000 can further include an insulating layer located between two adjacent electrical patterns. The two electrical patterns can be insulated by the insulating layer located therebetween, so as to ensure that the electrical patterns in each driving circuit 203 can cooperate with each other to drive the corresponding light emitting unit 400 to emit light.

[0182] In this case, the reflective layer 600 in the display panel 000 can be arranged in the same layer as one of the plurality of electrical patterns, and the orthographic projection of the reflective layer 600 on the substrate 100 can overlap the orthographic projection of the light-absorbing layer 300 on the substrate 100. In this way, in the process of forming the plurality of signal leads D1 in the bonding area F by using the laser etching process, the laser irradiated on the bonding area F can be directly reflected by the reflective layer 600 after passing through the substrate 100, so as to ensure that the laser cannot be irradiated on the light-absorbing layer 300.

[0183] It should be noted that when the reflective layer 600 is arranged in the same layer as one of the plurality of electrical patterns, the material of the reflective layer 600 can be the same as or different from the material of the electrical pattern. Here, when the material of the reflective layer 600 is the same as the material of the electrical pattern, the display panel 000 can be effectively simplified by forming the electrical pattern and the reflective layer 600 by using one patterning process.

[0184] Optionally, for the third and fourth optional implementation manners, the display panel 000 can drive the light-emitting unit 300 in the display panel 000 to emit light under the joint action of the first metal driving layer 201 and the plurality of driving circuits 203, and the light-emitting unit 400 in the display panel 000 in this architecture can include at least one LED. The following embodiments will describe other structures in the display panel 000 in this architecture.

[0185] As shown in FIGS. 17 and 18, the plurality of electrical patterns in each driving circuit 203 in the display panel 000 can include a first gate pattern 2031, an active layer pattern 2032, a second gate pattern 2033, and a source-drain electrode pattern 2034 arranged in a direction perpendicular to and away from the substrate 100. The display panel 000 can further include a first gate insulating layer 2035 between the first gate pattern 2031 and the active layer pattern 2032, a second gate insulating layer 2036 between the second gate pattern 2033 and the active layer pattern 2032, and an interlayer dielectric layer 2037 between the second gate pattern 2033 and the source-drain electrode pattern 2034.

[0186] Here, the driving circuit 203 can have at least one transistor, and the first gate pattern 2031, the active layer pattern 2032, the second gate pattern 2033, and the source-drain electrode pattern 2034 in the driving circuit 203 can be used to form the at least one transistor, and the transistors belong to double-gate transistors.

[0187] For example, the orthographic projections of the first gate pattern 2031 and the second gate pattern 2033 on the substrate 100 can both overlap the orthographic projection of the active layer pattern 2032 on the substrate 100, and the first gate pattern 2031 can be insulated from the active layer pattern 2032 by the first gate insulating layer 2035, and the second gate pattern 2033 can be insulated from the active layer pattern 2032 by the second gate insulating layer 2046. The source-drain electrode pattern 2034 can include a first electrode 2034a and a second electrode (not shown in the figure) respectively overlapped with the active layer pattern 2032, and an overlap electrode 2034b arranged separately from the first electrode 2032a and the second electrode. The first electrode 2034a can be one of the source electrode and the drain electrode, and the second electrode can be the other of the source electrode and the drain electrode. The overlap electrode 2032b can be electrically connected to the first gate pattern 2031 and the second gate pattern 2033 through the first overlap via V10 and the second overlap via V20 respectively. In this way, the first gate pattern 2031 and the second gate pattern 2033 can apply the same potential through the overlap electrode, and the potential can act on the active layer pattern 2033 to turn on or turn off the first electrode 2034a and the second electrode overlapped with the active layer pattern 2033.

[0188] Optionally, the driving electrode layer in the display panel 000 can further include a plurality of driving signal lines electrically connected to the pixel driving circuit 203. For example, the plurality of driving signal lines electrically connected to the pixel driving circuit 203 can include a data signal line L2, a high-level voltage signal line L4, and a low-level voltage signal line L5. Here, the light emitting unit 400 can include a red LED, a green LED, and a blue LED, and the light emitting unit 400 can have a plurality of conductive pins electrically connected to the LEDs, and a part of the conductive pins can be electrically connected to the driving signal lines through the corresponding conductive pads S in the first metal driving layer 201, and another part of the conductive pins can be electrically connected to the driving circuit 203 through the corresponding conductive pads S in the first metal driving layer 201. In this way, the light emitting state and the light emitting brightness of each LED in the corresponding light emitting unit 300 can be controlled through the cooperation of the driving signal lines and the pixel driving circuit 203.

[0189] In the embodiments of the present application, the display panel 000 can further include an organic planarization layer 803 located on the side of the plurality of driving circuits 203 away from the substrate 100, a third inorganic protective layer 804 located between the organic planarization layer 803 and the first metal driving layer 201, a first insulating layer 700 located between the first metal driving layer 201 and the light absorbing layer 300, and a second insulating layer 900 located on the side of the light absorbing layer 300 away from the substrate 100. The structures and characteristics of these insulating layers can be referred to the corresponding contents in the foregoing embodiments, which will not be described here.

[0190] It should be noted that in the fourth optional implementation manner, the material of the reflective layer 600 in the display panel 000 can be the same as or different from the material of the electrical pattern arranged in the same layer. Therefore, the embodiments of the present application will be described by taking two example cases as follows.

[0191] In the first example case, when the material of the reflective layer 600 in the display panel 000 is different from the material of the electrical pattern arranged in the same layer, the material of the reflective layer 600 can be amorphous silicon or white ink, and the reflective layer 600 can be arranged in the same layer as any one of the plurality of electrical patterns in the driving circuit 203.

[0192] In the second example case, when the material of the reflective layer 600 in the display panel 000 is the same as the material of the electrical pattern arranged in the same layer, the reflective layer 600 can be arranged in the same layer as the electrical pattern and have the same material, and the reflective layer 600 and the electrical pattern can be formed at the same time through one-time communication process, which can effectively simplify the manufacturing process of the display panel 000.

[0193] For example, the reflective layer 600 can be arranged in the same layer as the active layer pattern 2032 in the driving circuit 203. In this case, the material of the active layer pattern 2032 can be the same as the material of the reflective layer 600, for example, both of which are low-temperature polycrystalline silicon. Since the low-temperature polycrystalline silicon belongs to a material having reflective property and semiconductor property, the low-temperature polycrystalline silicon can be used as the active layer pattern 2032 in the transistor by using the semiconductor property of the low-temperature polycrystalline silicon, or the low-temperature polycrystalline silicon can be used as the reflective layer 600 by using the reflective property of the low-temperature polycrystalline silicon.

[0194] The following embodiments will be described by taking the case where the reflective layer 600 is arranged in the same layer as the active layer pattern 2032 and has the same material as the active layer pattern 2032.

[0195] As shown in FIG. 19, FIG. 19 is a partial enlarged view of the back of a display panel provided by an embodiment of the present application. The edge of the substrate 100 in the display panel 000 away from the first metal driving layer 201 includes a binding area F, and at least part of the plurality of signal leads D1 arranged in the binding area F can be electrically connected with the driving circuit 203. Here, in the binding area F, the area between two adjacent signal leads D1 is a spacing area C. In the process of forming the plurality of signal leads D1 in the binding area F by using a laser etching process, the laser needs to irradiate the spacing area C, so that the metal part in the spacing area C can be etched away under the irradiation of the laser. Here, the orthographic projection of the reflective layer 600 on the substrate 100 can intersect and overlap with the orthographic projection of the spacing area C on the substrate 100.

[0196] In the present application, the interval area C between two adjacent signal leads D1 is distributed on the front surface of the display panel 400. Referring to FIG. 20, which is a schematic diagram of a single interval area on the front surface of a display panel according to an embodiment of the present application. The interval area C can include areas that are not covered by the first metal driving layer 201 and the plurality of electrical patterns in the driving circuit 203 in the display panel 000. The light-reflecting layer 600, which is in the same layer as the active layer pattern 2032 and has the same material, is required to be at least located in these areas to ensure that the laser light transmitted through the substrate 100 in the interval area C can be blocked by the light-reflecting layer 600, thereby ensuring that the laser light does not irradiate on the light-absorbing layer 300.

[0197] For example, the interval area C between two adjacent signal leads D1 can include a first area C01 and a second area C02.

[0198] The first area C01 is the area in the interval area C that is covered by the first metal driving layer 201 and the plurality of electrical patterns in the driving circuit 203. The second area C02 is the area in the interval area C other than the first area C01. It should be noted that in FIG. 20, the black area 001 can represent the area covered by the first metal driving layer 201 and the plurality of electrical patterns in the driving circuit 203.

[0199] In the present application, at least part of the light-reflecting layer 600 in the orthographic projection on the substrate 100 is located in the orthographic projection on the substrate 100 of the second area C02. In this way, the laser light transmitted through the second area C02 in the interval area C can be blocked by the light-reflecting layer 600, so that the laser light does not irradiate on the light-absorbing layer 300.

[0200] It should be noted that since the first area C01 in the interval area C can be covered by the first metal driving layer 201 and the plurality of electrical patterns in the driving circuit 203, the laser light transmitted through the first area C01 in the interval area C can be blocked by the first metal driving layer 201 and the plurality of electrical patterns in the driving circuit 203, so that the laser light does not irradiate on the light-absorbing layer 300.

[0201] Exemplarily, the orthographic projection of the light-reflecting layer 600 on the substrate 100 does not coincide with the orthographic projection of the first metal driving layer 201 on the substrate 100, and does not coincide with the orthographic projection of each electrical pattern in the driving circuit 203 on the substrate 100. That is, the orthographic projection of the light-reflecting layer 600 on the substrate 100 does not coincide with the orthographic projection of the first region C01 in the interval region C on the substrate 100. In this case, when the light-reflecting layer 600 is arranged in the same layer as and is made of the same material as a certain electrical pattern in the driving circuit 203, it can be ensured that no parasitic capacitance is generated between the light-reflecting layer 600 and the electrical pattern arranged nearby, and thus it can be ensured that the signal inside the display panel 000 is less affected by parasitic capacitance interference.

[0202] Exemplarily, as shown in FIG. 20, the orthographic projection of the light-emitting layer 600 on the substrate 100 can completely cover the second region C02 in the interval region C. Here, the laser light transmitted at each position in the second region C02 in the interval region C can be blocked by the light-reflecting layer 600, so that the laser light cannot be emitted to the light-absorbing layer 300.

[0203] Exemplarily, as shown in FIG. 21, which is a partial schematic view of a single interval region on the front of another display panel provided by an embodiment of the present application, the boundary of the orthographic projection of the part of the light-reflecting layer 600 covered by the second region C02 in the interval region C on the substrate 100 can extend along the boundary of the orthographic projection of the first region C01 in the interval region C on the substrate 100, and the boundary of the orthographic projection of the part of the light-reflecting layer 600 covered by the second region C02 on the substrate 100 does not coincide with the boundary of the orthographic projection of the first region C01 on the substrate 100. However, the width of the gap d1 between the two boundaries is small, for example, the maximum width of the gap d1 between the two boundaries can be less than or equal to 15 microns. In this way, even if the laser light irradiated on the interval region C can be transmitted to the light-absorbing layer 300 through the gap d1 between the two boundaries, it can be ensured that the energy of the laser light irradiated on the light-absorbing layer 300 is small, so that the light-absorbing layer 300 will not have a blister phenomenon. For example, the maximum width of the gap d1 between the two boundaries can be less than or equal to 5 microns.

[0204] As shown in FIG. 22, the projection of the light-reflecting layer 600 on the substrate 100 does not overlap with the projection of the first area on the substrate 100. In this case, the projection of the light-reflecting layer 600 on the substrate 100 does not overlap with the projection of the first metal driving layer 201 on the substrate 100, nor does it overlap with the projection of each electrical pattern in the driving circuit 203 on the substrate 100. In this case, since the light-reflecting layer 600 is arranged in the same layer as the active layer pattern 2032 and is made of the same material, the material of the light-reflecting layer 600 is low-temperature polysilicon with semiconductor properties. Therefore, when the projection of the light-reflecting layer 600 on the substrate 100 does not overlap with the projection of the first metal driving layer 201 on the substrate 100, nor does it overlap with the projection of the first gate pattern 2031, the second gate pattern 2033, and the source-drain pattern 2034 in the driving circuit 203 on the substrate 100, it can be ensured that the first metal driving layer 201, the first gate pattern 2031, the second gate pattern 2033, and the source-drain pattern 2034 will not cause electrical interference to the light-reflecting layer 600, so that the light-reflecting layer 600 is always in a non-conductive state, thereby ensuring that the parasitic capacitance generated between the light-reflecting layer 600 and the metal structure arranged near the light-reflecting layer 600 is small.

[0205] In other possible implementations, the projection of the light-reflecting layer 600 on the substrate 100 can also overlap with the projection of the first area on the substrate 100, but the overlapping area is small. For example, the maximum width of the area where the projection of the light-reflecting layer 600 on the substrate 100 overlaps with the projection of the first area on the substrate 100 is less than 5 microns.

[0206] Optionally, as shown in FIG. 22, when the light-reflecting layer 600 is arranged in the same layer as the active layer pattern 2032 and is made of the same material, the minimum distance d2 between the outer boundary of the projection of the active layer pattern 2032 on the substrate 100 and the outer boundary of the projection of the light-reflecting layer 600 on the substrate 100 needs to be greater than or equal to 5 microns. In this way, it can be ensured that the light-reflecting layer 600 arranged in the same layer as the active layer pattern 2032 and made of the same material will not interfere with the normal operation of the active layer pattern 2032.

[0207] It should be noted that the active layer pattern 2032 in each pixel circuit 203 in the display panel 000 is an island-shaped pattern, and here, each island-shaped pattern retains a continuously distributed internal area and a contour edge surrounding the internal area, which is the outer boundary of the projection of the active layer pattern 2032 on the substrate 100.

[0208] In the embodiment of the present application, as shown in FIG. 22, the display panel 000 can further include a transfer pad S0 electrically connected to the pixel circuit 203. One end of the connection wire D2 can be overlapped with the transfer pad S0 on the side of the transfer pad S0 away from the substrate, and the other end of the connection wire D2 can be electrically connected to the signal lead D1. In this way, the driving components bound in the binding area F can be electrically connected to the corresponding driving circuit 203 in sequence through the signal lead D1, the connection wire D2 and the transfer pad S0.

[0209] Optionally, for the fourth optional implementation manner, as shown in FIG. 10, the display panel 000 further includes a mark pattern M which is arranged in the same layer and made of the same material as at least one of the plurality of electrical patterns. The light-emitting layer 600 in the display panel 000 can have an avoiding hole K corresponding to the mark pattern M. Here, the orthographic projection of the avoiding hole K on the substrate 100 can overlap the orthographic projection of the mark pattern M on the substrate 100. For example, the orthographic projection of the mark pattern M on the substrate 100 can be located within the orthographic projection of the avoiding hole K on the substrate 100.

[0210] In the present application, in the case that the reflective layer 600 is arranged in the same layer and made of the same material as the active layer pattern 2032, the number of the mark patterns M in the display panel 000 is at least two. One mark pattern M can be arranged in the same layer and made of the same material as the second gate pattern 2033, and the other mark pattern M can be arranged in the same layer and made of the same material as the source-drain electrode pattern 2034. The reflective layer 600 can have at least two avoiding holes K corresponding to the at least two mark patterns M. The orthographic projection of each mark pattern M on the substrate 100 can be located within the orthographic projection of the corresponding avoiding hole K on the substrate 100.

[0211] It should be noted that the reasons for designing the mark pattern M in the display panel 000 and arranging the corresponding avoiding hole K in the reflective layer 600 can be referred to the corresponding parts in the above-mentioned embodiments, which will not be described herein. It should be further noted that the display panel 000 can further include auxiliary mark patterns arranged in the same layer and made of the same material as the first gate pattern 2031 and the active layer pattern 2032. However, these auxiliary mark patterns will not be blocked by the reflective layer 600, and therefore, the reflective layer 600 does not need to have avoiding holes corresponding to these auxiliary mark patterns.

[0212] It should be further explained that, for the first and second optional implementation manners, i.e., in the case that the display panel 000 simultaneously includes the first metal driving layer 201 and the second metal driving layer 202, the interval area C between two adjacent signal leads D1 in the binding area F is distributed on the front surface of the display panel 400, which can be referred to FIG. 23, which is a partial enlarged view of the front surface of a display panel according to an embodiment of the present application. Therefore, the interval area C can also include a region that is not covered by the second metal driving layer 202 and the first metal driving layer 201 in the display panel 000. In this way, when the interval area C is irradiated by laser, the laser can be transmitted through the substrate 100, the second metal driving layer 202 and the first metal driving layer 201 to the light-absorbing layer 300, and after the reflective layer 600 is added between the substrate 100 and the light-absorbing layer 300, the laser can be reflected by the reflective layer 600, so that the laser does not irradiate the light-absorbing layer 300, thereby ensuring that the light-absorbing layer 300 does not have the phenomenon of bubbles.

[0213] Here, when the material of the reflective layer 600 is amorphous silicon or low-temperature polycrystalline silicon, because the reflectivity of amorphous silicon with different thicknesses to laser with different wavelengths is different, when a laser with a longer wavelength is used in the process of forming the plurality of signal leads D1 by using a laser etching process, a reflective layer 600 with a relatively thick thickness can be used, so that the reflectivity of the reflective layer 600 to the laser is relatively high, for example, the thickness of the reflective layer 600 can range from 1100 angstroms to 2000 angstroms. When a laser with a shorter wavelength is used in the process of forming the plurality of signal leads D1 by using a laser etching process, a reflective layer 600 with a relatively thin thickness can be used, so that the reflectivity of the reflective layer 600 to the laser is relatively high, for example, the thickness of the reflective layer 600 can range from 500 angstroms to 1100 angstroms.

[0214] In the embodiments of the present application, in order to further avoid the phenomenon that the light-absorbing layer 300 is irradiated by laser and bubbles appear in the light-absorbing layer 300, in addition to the reflective layer 600, other structures in the display panel 000 can also be optimized. The following embodiments will take the display panel 000 simultaneously including the first metal driving layer 201 and the second metal driving layer 202 as an example, and three exemplary implementation manners of optimizing other structures in the display panel 000 are proposed.

[0215] In a first example implementation, the structure of the light-absorbing layer 300 in the display panel 000 can be optimized. Referring to FIG. 24, FIG. 24 is a partial enlarged view of the front of yet another display panel according to an embodiment of the present application. It should be noted that the structure of the light-absorbing layer 300 is shown in the display panel 000 in FIG. 24, but is not shown in the top view or the front partial view of the other display panels in the above embodiments. The light-absorbing layer 300 in the display panel 000 can have an auxiliary slot U, and the orthogonal projection of the auxiliary slot U on the substrate 100 can overlap with the portion of the orthogonal projection of the spacing region C on the substrate 100 that is not covered by the first metal driving layer 201 and the second metal driving layer 202. The orthogonal projection of the auxiliary slot U on the substrate 100 does not overlap with the orthogonal projection of the first metal driving layer 201 on the substrate 100, and does not overlap with the orthogonal projection of the second metal driving layer 202 on the substrate 100.

[0216] For example, the portion of the orthogonal projection of the spacing region C on the substrate 100 that is not covered by the first metal driving layer 201 and the second metal driving layer 202 can be located within the orthogonal projection of the auxiliary slot U on the substrate 100. In this way, the light-absorbing layer 300 can block the first metal driving layer 201 and the second metal driving layer 202 on the front of the display panel 000, so as to ensure that the reflectivity of the display panel 000 to ambient light is low, and the laser irradiating the spacing region C will not irradiate the light-absorbing layer 300 after passing through the substrate 100, the first metal driving layer 201 and the second metal driving layer 202, thereby further reducing the probability of the light-absorbing layer 300 having a bulging defect.

[0217] In the present application, as shown in FIG. 24, the first end of the spacing region C near the edge of the display panel 000 is usually distributed between two adjacent groups of second driving signal lines 2021, and the first end of the spacing region C near the display panel 000 extends in a zigzag manner. Therefore, the portion of the light-absorbing layer 300 between the two adjacent groups of second driving signal lines 2021 needs to be provided with an auxiliary slot U extending in a zigzag manner, and the auxiliary slot U covers the first end of the spacing region C.

[0218] Similarly, the second end of the spacing region C away from the edge of the display panel 000 is usually distributed between another two adjacent groups of second driving signal lines 2021, and the second end of the spacing region C away from the display panel 000 extends in a straight line. Therefore, the portion of the light-absorbing layer 300 between the other two adjacent groups of second driving signal lines 2021 needs to be provided with an auxiliary slot U extending in a straight line, and the auxiliary slot U covers the second end of the spacing region C.

[0219] Optionally, as shown in FIG. 23 and FIG. 24, the region between the first end and the second end in the spacing area C can cross a set of second driving signal lines 2021. There is a region not covered by the first metal driving layer 201 in the gap area between two adjacent second driving signal lines 2021 in the set of second driving signal lines 2021. Therefore, there is also a region not covered by the first metal driving layer 201 and the second metal driving layer 202 in the spacing area C between the first end and the second end. The portion of the light-absorbing layer 300 between the two adjacent second driving signal lines 2021 can be provided with an auxiliary slot U, and the auxiliary slot U covers the region in the spacing area C that overlaps with the gap area.

[0220] It should be noted that in other possible implementations, since the width of the gap area between two adjacent second driving signal lines 2021 in the set of second driving signal lines 2021 is small, for example, the width of the gap area is only about 15 microns. Therefore, in the process of forming the plurality of signal leads D1 in the binding area F by using the laser etching process, even if the laser still transmits through the substrate 100 and can be incident on the light-absorbing layer 300 after passing through the gap area between two adjacent second driving signal lines 2021 in the set of second driving signal lines 2021, the laser energy passing through the gap area is small due to the small width of the gap area, and the laser will not cause the light-absorbing layer 300 to bubble even if it is incident on the light-absorbing layer 300. Therefore, the portion of the light-absorbing layer 300 between the two adjacent second driving signal lines 2021 can also not be provided with an auxiliary slot U.

[0221] In the embodiments of the present application, the shape of the auxiliary slot U provided in the light-absorbing layer 300 is consistent with the shape of the portion of the spacing area C not covered by the first metal driving layer 201 and the second metal driving layer 202. In this way, without a large area of the auxiliary slot U provided in the light-absorbing layer 300, it can be ensured that the laser incident in the spacing area C will not be directed to the light-absorbing layer 300. In this way, it can be ensured that the area of the auxiliary slot U provided in the light-absorbing layer 300 is small, thereby reducing the probability of color deviation of the display panel 000 due to the large area of the slot provided in the light-absorbing layer 300.

[0222] It should be noted that, due to the processing error of the film layer structure on the substrate 100 during the preparation of each film layer structure, the position of the film layer structure on the substrate 100 may deviate from the designed position. Therefore, in order to ensure that the auxiliary slot U can completely cover the part of the interval area C which is not covered by the first metal driving layer 201 and the second metal driving layer 202, it is necessary to leave a certain distance between the boundary of the auxiliary slot U and the adjacent boundary in the interval area C during the design stage. In an example, the distance can be greater than or equal to 10 microns. In this way, even if there is a processing error of the film layer structure on the substrate 100, it can be ensured that the auxiliary slot U in the finally prepared display panel 000 can completely cover the part of the interval area C which is not covered by the first metal driving layer 201 and the second metal driving layer 202.

[0223] It should also be noted that a part of the part of the interval area C which is not covered by the first metal driving layer 201 and the second metal driving layer 202 in the orthographic projection on the substrate 100 can also be located outside the orthographic projection of the auxiliary slot U on the substrate 100, that is, there can be a part of the interval area C which is not covered by the first metal driving layer 201 and the second metal driving layer 202 and is not covered by the auxiliary auxiliary slot U, but it is necessary to ensure that the maximum width of the orthographic projection of the part of the interval area C which is not covered by the first metal driving layer 201 and the second metal driving layer 202 and is not covered by the auxiliary auxiliary slot U on the substrate 100 is small, for example, the maximum width needs to be less than or equal to 15 microns, so as to ensure that the energy of the laser irradiated on the interval area C is small after transmitting through the substrate 100, the second metal driving layer 202 and the first metal driving layer 201 and then irradiating the light-absorbing layer 300. Here, the width of the orthographic projection of the part of the interval area C which is not covered by the first metal driving layer 201 and the second metal driving layer 202 and is not covered by the auxiliary auxiliary slot U on the substrate 100 refers to the width of the orthographic projection in any direction. Therefore, the maximum value of the width of the orthographic projection in each direction is the maximum width of the orthographic projection.

[0224] In a second example implementation, the arrangement position or shape of the interval area C between two adjacent signal leads D1 in the binding area F can be optimized to completely cover the interval area C by the first metal driving layer 201 and the second metal driving layer 202. Here, a part of the interval area C can be covered by the first metal driving layer 201, and another part of the interval area C can be covered by the second metal driving layer 202. In this way, the laser irradiated in the interval area C can be blocked by the second metal driving layer 202 or the first metal driving layer 201, so that the laser cannot irradiate the light-absorbing layer 300.

[0225] It should be noted that the arrangement position of the interval region C can be optimized, or the shape of the interval region C can be optimized, so that the interval region C is completely covered by the first metal driving layer 201. The embodiments of the present application are described below in two exemplary cases.

[0226] In the first exemplary case, the arrangement position of the interval region C can be optimized. Please refer to FIG. 25, which is a partial enlarged view of the front of another display panel provided by the embodiments of the present application. The orthographic projection of the interval region C between two adjacent signal leads D1 on the substrate 100 can be located in the orthographic projection of the region on the substrate 100 where the second driving signal lines 2021 are located. In this way, a part of the interval region C can be covered by the second driving signal lines 2021 in the second metal driving layer 202, and another part of the region C can be covered by the first metal driving layer 201.

[0227] For example, the second driving signal lines 2021 in the group of second driving signal lines 2021 have a gap region between two adjacent second driving signal lines 2021. The part of the interval region C in the orthographic projection on the substrate 100 that overlaps with the orthographic projection on the substrate 100 of the gap region can be covered by the first metal driving layer 201. For example, the part of the interval region C in the orthographic projection on the substrate 100 that overlaps with the orthographic projection on the substrate 100 of the gap region can be covered by at least one of the first driving signal lines 2011 and the transfer electrodes (for example, the first transfer electrode 2012) in the first metal driving layer 201.

[0228] It should be noted that in order to ensure that the first metal driving layer 201 can completely cover the part of the interval region C that overlaps with the gap region, at least one of the first driving signal lines 2011 and the transfer electrodes can be widened. Moreover, the minimum distance between the metal parts in the first metal driving layer 201 and the second metal driving layer 202 and the interval region C should be greater than or equal to 10 microns in the design stage, so that even if there is a processing error in the film layer structure on the substrate 100, the first metal driving layer 201 and the second metal driving layer 202 in the display panel 000 prepared finally can also completely cover the interval region C.

[0229] The second example case can optimize the shape of the interval region C. Please refer to FIG. 26, which is a partial enlarged view of the front of a display panel according to another embodiment of the present application. The interval region C between two adjacent signal leads D1 can include two first sub-strip regions C1 and a second sub-strip region C2 between the two first sub-strip regions C1. Here, the two ends of the second sub-strip region C2 can be distributed in communication with the first sub-strip regions C1, and among the two first sub-strip regions C1, one first sub-strip region C1 can be distributed on the side of the interval region C close to the edge of the display panel 000, and the other first sub-strip region C2 can be distributed on the side of the interval region C away from the edge of the display panel 000.

[0230] Here, the extension direction of the first sub-strip region C1 can be parallel to the extension direction of the second drive signal line 2021, and the two first sub-strip regions C1 in the interval region C can be covered by two second drive signal lines 2021 respectively. The extension direction of the second sub-strip region C2 can be parallel to the extension direction of the second drive signal line 2012, and the second sub-strip region C2 can be covered by one second drive signal line 2012.

[0231] For example, since the width of the ground line L3 in the group of second drive signal lines 2021 is large, for the two first sub-strip regions C1 in the interval region C, one first sub-strip region C1 can be covered by the ground line L3 in the group of second drive signal lines 2021, and the other first sub-strip region C1 can be covered by the ground line L3 in the adjacent group of second drive signal lines 2021.

[0232] It should be noted that in the design stage, the boundary of the first sub-strip region C1 and the boundary adjacent to the second drive signal line 2021 are required to be greater than or equal to 10 microns, and the boundary of the second sub-strip region C2 and the boundary adjacent to the second drive signal line 2012 are required to be greater than or equal to 10 microns, so that in the case of processing error of the film layer structure on the substrate 100, the first metal drive layer 201 and the second metal drive layer 202 in the display panel 000 in the final preparation can also be completely covered by the interval region C.

[0233] The third example implementation can optimize the structure of the first metal drive layer 201 and the second metal drive layer 202 in the display panel 000 to completely cover the interval region C by the first metal drive layer 201. For example, the area of the front projection of the first metal drive layer 201 on the substrate 100 can be increased, so that the part of the interval region C that cannot be covered by the second metal drive layer 202 before can be covered by the newly added metal part of the first metal drive layer 201.

[0234] Please refer to FIG. 27, which is a partial enlarged view of the front side of a display panel according to another embodiment of the present application. For the interval region C between two adjacent signal leads D1, the first end of the interval region C close to the edge of the display panel 000 can be distributed between two groups of adjacent second driving signal lines 2021, and the second end of the interval region C away from the edge of the display panel 000 can be distributed between another two groups of adjacent second driving signal lines 2021. The first metal driving layer 201 can further include a first auxiliary electrode G1 and a second auxiliary electrode G2. Here, the first end of the interval region C close to the edge of the display panel 000 can be covered by the first auxiliary electrode G1, and the second end of the interval region C away from the edge of the display panel 000 can be covered by the second auxiliary electrode G2.

[0235] In the present application, the first end of the interval region C close to the edge of the display panel 000 extends in a zigzag shape, and therefore the first auxiliary electrode G1 covering the first end also needs to extend in a zigzag shape. The second end of the interval region C away from the edge of the display panel 000 extends in a straight line shape, and therefore the second auxiliary electrode G2 covering the second end also needs to extend in a straight line shape.

[0236] Optionally, as shown in FIG. 27, the region of the interval region C between the first end and the second end can cross a group of second driving signal lines 2021. There is a gap region between two adjacent second driving signal lines 2021 in the group of second driving signal lines 2021. The part of the interval region C overlapping the projection of the gap region on the substrate 100 in the front projection of the interval region C on the substrate 100 can be covered by the first metal driving layer 201. For example, the part of the interval region C overlapping the projection of the gap region on the substrate 100 in the front projection of the interval region C on the substrate 100 can be covered by at least one of the first driving signal lines 2011 and the transfer electrodes (e.g., the third transfer electrode 2014 and the fourth transfer electrode 2015) in the first metal driving layer 201.

[0237] It should be noted that, in order to ensure that the first metal driving layer 201 can cover the part of the interval region C overlapping the gap region, at least one of the first driving signal lines 2011 and the transfer electrodes can be locally widened. Moreover, the minimum distance between the metal part in the first metal driving layer 201 and the interval region C should be greater than or equal to 10 microns in the design stage, so that the first metal driving layer 201 in the display panel 000 prepared finally can completely cover the interval region C even if there is a processing error in the film layer structure on the substrate 100.

[0238] Optionally, the first auxiliary electrode G1 and the second auxiliary electrode G2 added in the first metal driving layer 201 both need to be electrically connected with the signal transmission structure in the first metal driving layer 201. For example, as shown in FIG. 23, the first auxiliary electrode G1 can be electrically connected with the fourth transfer electrode 2015 in the first metal driving layer 201, and the second auxiliary electrode G2 can be electrically connected with the first driving signal line 2011 in the first metal driving layer 201. In this way, it can be ensured that the charges accumulated by the first auxiliary electrode G1 and the second auxiliary electrode G2 can be conducted to the signal transmission structure during the preparation of the display panel 000, so that the first auxiliary electrode G1 and the second auxiliary electrode G2 will not accumulate charges alone, thereby avoiding the adverse phenomenon of electrostatic breakdown at these positions due to excessive charges accumulated by the first auxiliary electrode G1 and the second auxiliary electrode G2.

[0239] It also needs to be noted that in other possible implementations, for the above-mentioned second exemplary implementation and the third exemplary implementation, since the width of the gap region between two adjacent driving signal lines 2011 in the group of second driving signal lines 2021 is small. Therefore, in the process of forming the plurality of signal leads D1 located in the binding area F by using the laser etching process, even if the laser still transmits through the substrate 100 and may pass through the gap region between two adjacent driving signal lines 2011 in the group of second driving signal lines 2021 to irradiate on the light-absorbing layer 300, but because the width of the gap region is small, the laser energy passing through the gap region is small, and this laser will not cause the light-absorbing layer 300 to bubble even if it irradiates on the light-absorbing layer 300. Therefore, the structure in the first metal driving layer 201 can also not be widened. In this way, the first metal driving layer 201 can ensure that the light-absorbing layer 300 will not bubble even if the part of the spacing region C overlapping with the gap region is not covered.

[0240] It can be understood that most of the interval region C can be completely covered by the first metal driving layer 201 and the second metal driving layer 202, and a small part of the interval region (for example, the part of the interval region C overlapping with the gap region) can not be covered by the first metal driving layer 201 and the second metal driving layer 202. However, it is necessary to ensure that the maximum width of the orthographic projection of the part of the interval region C not covered by the first metal driving layer 201 and the second metal driving layer 201 on the substrate 100 is small. For example, the maximum width of the orthographic projection of the part of the interval region C not covered by the first metal driving layer 201 and the second metal driving layer 201 on the substrate 100 needs to be less than or equal to a preset width threshold. For example, the preset width threshold can be 15 microns, that is, the maximum width of the orthographic projection of the part of the interval region C not covered by the first metal driving layer 201 and the second metal driving layer 201 on the substrate 100 needs to be less than or equal to 15 microns, so as to ensure that the energy of the laser irradiated on the interval region C is small after transmitting through the substrate 100 and the first metal driving layer 201 and the second metal driving layer 202 to the light-absorbing layer 300.

[0241] Here, the width of the orthographic projection of the part of the interval region C not covered by the first metal driving layer 201 and the second metal driving layer 202 on the substrate 100 refers to the width of the orthographic projection in any direction. Therefore, the maximum value of the width of the orthographic projection in each direction is the maximum width of the orthographic projection.

[0242] In summary, the display panel provided by the embodiments of the present application includes a substrate, a first metal driving layer, a light-absorbing layer, an auxiliary light-absorbing layer, and a plurality of light-emitting units. The orthographic projection of the light-absorbing layer on the substrate overlaps with the orthographic projection of the driving layer on the substrate. In this way, the light-absorbing layer can absorb the ambient light irradiated on the display panel, so that the ambient light irradiated on the display panel is less reflected by the driving layer, thereby ensuring that the reflectivity of the display panel to the ambient light is low. In addition, by arranging the light-absorbing layer in the display panel, the reflectivity of the display panel to the ambient light can be reduced. Therefore, the transmittance of the auxiliary light-absorbing layer on the side of the plurality of light-emitting units away from the substrate can be appropriately increased, so that the absorption rate of the auxiliary light-absorbing layer to the light is low, thereby reducing the degree of absorption of the light emitted by the light-emitting unit by the auxiliary light-absorbing layer. In this way, without providing a large driving current to the display panel from the light-emitting unit, the overall display brightness of the display panel can be high, thereby effectively reducing the power consumption of the display panel. In addition, by arranging the reflecting layer between the substrate and the light-absorbing layer, the laser transmitting through the substrate during the laser etching process can be reflected, so that the laser does not irradiate on the part of the light-absorbing layer not covered by the driving layer, which can effectively avoid the undesirable phenomenon of the light-absorbing layer bulging, so that the flatness of the light-absorbing layer is high, thereby improving the reliability of the display panel.

[0243] Another embodiment of the present application also provides a display panel. The display panel can include a substrate, a driving layer, a light absorption layer, a plurality of signal leads and a plurality of light emitting units.

[0244] The driving layer can be located on a side of the substrate away from the driving layer. The driving layer has a plurality of conductive pads, and an edge region of a side of the substrate away from the driving layer includes a binding area.

[0245] The light absorption layer can be located on a side of the driving layer away from the substrate. A projection of the light absorption layer on the substrate overlaps a projection of the driving layer on the substrate, and the light absorption layer has a plurality of first vias corresponding to the plurality of conductive pads. A projection of the first via on the substrate overlaps a projection of the corresponding conductive pad on the substrate.

[0246] The plurality of signal leads can be located in the binding area. At least part of the plurality of signal leads are electrically connected to the driving layer. A region between two adjacent signal leads is a spacing area.

[0247] The plurality of light emitting units can be located on a side of the light absorption layer away from the substrate. The light emitting units are electrically connected to at least part of the conductive pads through the first vias.

[0248] It should be noted that the structure of the display panel can refer to the structure of the display panel in the above embodiments. However, the display panel can not be provided with a light reflection layer, but only by optimizing other structures in the display panel to ensure that the laser irradiated in the spacing area cannot be irradiated to the light absorption layer.

[0249] For example, in a possible case, the structure of the light absorption layer in the display panel can be optimized to set an auxiliary slot in the light absorption layer. A projection of the auxiliary slot on the substrate can overlap a part of the projection of the spacing area on the substrate that is not covered by the driving layer.

[0250] In another possible case, the arrangement position or shape of the spacing area between two adjacent signal leads in the binding area can be optimized so that the spacing area can be completely covered by the driving layer.

[0251] In another possible case, the structure of the driving layer in the display panel can be optimized so that the spacing area can be completely covered by the driving layer.

[0252] It should be noted that the principle of optimizing other structures in the display panel can refer to the corresponding content in the foregoing embodiments. Here, no longer be described.

[0253] The display device can be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like. The display device can include a driving component and the display panel in the above embodiments. The driving component can be electrically connected with the driving layer in the display panel, and the driving component is configured to provide a driving signal to the light emitting unit through the driving layer.

[0254] It is noted that in the drawings, the dimensions of layers and regions can be exaggerated for clarity. Also, it is to be understood that when a layer or element is referred to as being "on" another layer or element, it can be directly on the other layer or element or intervening layers can also be present. In addition, it is to be understood that when a layer or element is referred to as being "beneath" another layer or element, it can be directly beneath the other layer or element or one or more intervening layers or elements can also be present. In addition, it is to be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer or element between the two layers or elements or one or more intervening layers or elements can also be present. Like reference numerals refer to like elements throughout.

[0255] In the present application, the terms "first" and "second" are used only for descriptive purposes and are not to be construed as indicating or implying relative importance. The term "a plurality of" refers to two or more, unless otherwise indicated.

[0256] The above description is only optional embodiments of the present application, and is not used to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that, include: Base; A first metal driving layer is located on one side of the substrate, and the first metal driving layer has a plurality of conductive pads; A light-absorbing layer is located on the side of the first metal driving layer away from the substrate. The orthographic projection of the light-absorbing layer on the substrate overlaps with the orthographic projection of the first metal driving layer on the substrate. The light-absorbing layer has a plurality of first vias corresponding to the plurality of conductive pads. The orthographic projection of the first via on the substrate overlaps with the orthographic projection of the corresponding conductive pad on the substrate. A plurality of light-emitting units are located on the side of the light-absorbing layer opposite to the substrate, and the light-emitting units are electrically connected to at least a portion of the conductive pads through the first via. And an auxiliary light-absorbing layer located on the side of the light-emitting unit opposite to the substrate.

2. The display panel according to claim 1, characterized in that, The display panel further includes a reflective layer located between the substrate and the light-absorbing layer, wherein the orthographic projection of the reflective layer on the substrate overlaps with the orthographic projection of the light-absorbing layer on the substrate.

3. The display panel according to claim 2, characterized in that, The reflective layer is located on the side of the first metal driving layer away from the substrate, and the reflective layer has a second via communicating with the first via.

4. The display panel according to claim 3, characterized in that, The orthogonal projection of the light-absorbing layer on the substrate lies within the orthogonal projection of the reflective layer on the substrate.

5. The display panel according to claim 4, characterized in that, The display panel further includes a first insulating layer located between the first metal driving layer and the light-absorbing layer, the first insulating layer having a third via communicating with the first via.

6. The display panel according to claim 5, characterized in that, The reflective layer is insulating, and the reflective layer and the first insulating layer have the same film structure.

7. The display panel according to claim 5, characterized in that, The reflective layer is located on the side of the first insulating layer away from the substrate, or the reflective layer is located on the side of the first insulating layer closer to the substrate.

8. The display panel according to claim 3, characterized in that, The display panel further includes: a second insulating layer located on the side of the light-absorbing layer opposite to the substrate, the second insulating layer having a fourth via communicating with the first via, and a portion of the second insulating layer extending into the first via and covering at least a portion of the inner wall of the first via.

9. The display panel according to claim 8, characterized in that, The light-absorbing layer comprises carbon particles; the inner wall of the first through-hole is completely covered by the second insulating layer.

10. The display panel according to claim 9, characterized in that, A portion of the second insulating layer extends into the second via and covers at least a portion of the inner wall of the second via.

11. The display panel according to claim 2, characterized in that, The display panel further includes: a second metal driving layer located on the side of the first metal driving layer near the substrate, and the reflective layer located on the side of the second metal driving layer near the substrate.

12. The display panel according to claim 11, characterized in that, At least one of the first metal driving layer and the second metal driving layer has a marking pattern, and the light-absorbing layer has a clearance hole corresponding to the marking pattern, wherein the orthographic projection of the clearance hole on the substrate overlaps with the orthographic projection of the marking pattern on the substrate.

13. The display panel according to any one of claims 2 to 12, characterized in that, The reflective layer is made of at least one of the following materials: amorphous silicon, low-temperature polycrystalline silicon, and white ink.

14. The display panel according to claim 13, characterized in that, When the material of the reflective layer includes amorphous silicon, the thickness of the reflective layer ranges from 500 angstroms to 2000 angstroms; When the material of the reflective layer includes white ink, the thickness of the reflective layer ranges from 0.5 micrometers to 3 micrometers; When the material of the light-emitting layer is low-temperature polycrystalline silicon, the thickness of the light-emitting layer ranges from 500 angstroms to 2000 angstroms.

15. The display panel according to claim 1, characterized in that, The display panel further includes: a plurality of driving circuits located on the side of the first metal driving layer near the substrate, the driving circuits being electrically connected to the light-emitting unit through the conductive pads; The driving circuit includes multiple stacked electrical patterns; the display panel further includes an insulating layer located between two adjacent electrical patterns.

16. The display panel according to claim 15, characterized in that, The display panel further includes a reflective layer disposed on the same layer as one of the plurality of electrical patterns, wherein the orthographic projection of the reflective layer on the substrate overlaps with the orthographic projection of the light-absorbing layer on the substrate.

17. The display panel according to claim 16, characterized in that, The driving circuit has at least one transistor, and one of the plurality of electrical patterns is an active layer pattern in the transistor. The material of the active layer pattern and the material of the reflective layer both include low-temperature polycrystalline silicon. The active layer and the reflective layer are disposed in the same layer and are made of the same material.

18. The display panel according to claim 17, characterized in that, The minimum spacing between the outer boundary of the orthographic projection of the active layer pattern on the substrate and the outer boundary of the orthographic projection of the reflective layer on the substrate is greater than or equal to 5 micrometers.

19. The display panel according to claim 17, characterized in that, The edge region of the substrate facing away from the first metal driving layer includes a bonding area, and the display panel further includes a plurality of signal leads located in the bonding area, at least a portion of the plurality of signal leads being electrically connected to the driving circuit; The area between two adjacent drive signal leads is a gap region, and the orthographic projection of the gap region on the substrate overlaps with the orthographic projection of the reflective layer on the substrate.

20. The display panel according to claim 19, characterized in that, The interval region includes: a first region and a second region; The first region is the area within the interval region covered by the first metal driving layer and the plurality of electrical patterns; the second region is the area within the interval region excluding the first region. At least a portion of the orthographic projection of the reflective layer onto the substrate lies within the orthographic projection of the second region onto the substrate.

21. The display panel according to claim 20, characterized in that, The orthographic projection of the reflective layer on the substrate does not coincide with the orthographic projection of the first metal driving layer on the substrate, nor with the orthographic projection of each of the electrical patterns on the substrate.

22. The display panel according to claim 20, characterized in that, The reflective layer's orthogonal projection onto the substrate completely covers the second region.

23. The display panel according to claim 20, characterized in that, The boundary of the orthographic projection of the portion of the reflective layer covered by the second region on the substrate extends along the boundary of the orthographic projection of the first region on the substrate, and the boundary of the orthographic projection of the portion of the reflective layer covered by the second region on the substrate does not coincide with the boundary of the orthographic projection of the first region on the substrate.

24. The display panel according to any one of claims 16 to 23, characterized in that, The display panel further includes: at least one of the plurality of electrical patterns is disposed on the same layer and made of the same material as the electrical patterns, the reflective layer has a clearance hole corresponding to the clearance hole, and the orthographic projection of the clearance hole on the substrate overlaps with the orthographic projection of the clearance hole on the substrate.

25. The display panel according to claim 24, characterized in that, The plurality of electrical patterns include: a first gate pattern, an active layer pattern, a second gate pattern, and a source / drain pattern stacked along a direction perpendicular to and away from the substrate; When the reflective layer and the active layer pattern are disposed in the same layer, the number of the marking patterns is at least two. One marking pattern is disposed in the same layer as the second gate pattern and is made of the same material, and the other marking pattern is disposed in the same layer as the source and drain patterns and is made of the same material.

26. The display panel according to any one of claims 1-12, 14-23, and 25, characterized in that, The auxiliary light-absorbing layer has a transmittance of 50% or greater for the light emitted by the light-emitting unit.

27. The display panel according to any one of claims 1-12, 14-23, and 25, characterized in that, The light-emitting unit includes: a mini light-emitting diode or a micro light-emitting diode.

28. A display device, characterized in that, include: A driving component, and a display panel electrically connected to the driving component, wherein the display panel is the display panel according to any one of claims 1 to 27.

Images