Single board, method for assembling single board, and communication device

Abstract

The present disclosure belongs to the technical field of communications. Provided are a single board, a method for assembling a single board, and a communication device. The single board comprises: a main chip module, a basic configuration, an interface device, and a first circuit board, wherein the main chip module comprises a main chip and a second circuit board, and the main chip is located on a surface of the second circuit board; there is at least one first circuit board, and the basic configuration and the interface device are located on a surface of the at least one first circuit board; and the main chip is electrically connected to the basic configuration and the interface device, respectively. By using the present disclosure, resource waste can be reduced, and the cost of a single board is reduced.

Description

Single board, single board assembly method, and communication equipment

[0001] This application claims priority to Chinese patent application No. 202310717140.X filed on June 15, 2023, entitled “Single board, single board assembly method and communication equipment,” the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of communication technology, and in particular to a single board, a single board assembly method, and communication equipment. Background Art

[0003] Communication equipment, such as routers and switches, structurally includes multiple boards, such as service boards and switch boards. Among them, the service board is mainly responsible for receiving and sending service signals, and the switch board is mainly responsible for forwarding service signals between different service boards.

[0004] While these boards have different functions, they typically consist of a mainboard, a main chip, basic components (such as a central processing unit (CPU) system, a clock system, and a power supply system), and interface components. The mainboard is also known as a printed circuit board (PCB), and the main chip depends on the type of board. For example, the main chip on a service board can be a network processor (NP) or a packet processor (PP), while the main chip on a switch board is a forwarding engine (FE).

[0005] The main chip, basic configuration, and interface components are all located on the motherboard's surface, interconnected by traces on the motherboard. This layout of the board is costly.

[0006] Summary of the Invention

[0007] The present disclosure provides a single board, a single board assembly method, and a communication device, which can solve the problem of high single board costs in related technologies. The technical solution is as follows:

[0008] In a first aspect, according to the present disclosure, a single board includes a main chip module, a basic configuration, an interface device, and a first circuit board;

[0009] The main chip module includes a main chip and a second circuit board, and the main chip is located on the surface of the second circuit board;

[0010] There is at least one first circuit board, and the basic configuration and the interface device are located on a surface of at least one of the first circuit boards;

[0011] The main chip is electrically connected to the basic configuration and the interface device respectively.

[0012] In the solution presented in this disclosure, the main chip is located on the surface of a second circuit board, while the basic configuration and interface components of the single board are located on the surface of at least one first circuit board. This means that the high-speed main chip and the low-speed basic configuration and interface components are not located on the same circuit board. This allows the first circuit board to only meet the operating requirements of the basic configuration and interface components, without having to meet the operating requirements of the main chip. The second circuit board is used to meet the operating requirements of the main chip. This maximizes the value of both the first and second circuit boards, thereby reducing resource waste.

[0013] Moreover, the second circuit board is processed using high-performance board materials suitable for the main chip, while the first circuit board is processed using board materials suitable for basic configuration and interface devices. There is no need for all circuit boards to be processed using high-performance board materials. Therefore, the board cost of the circuit board can be reduced, thereby reducing the cost of a single board.

[0014] In a possible implementation manner, the second circuit board is electrically connected to at least one of the first circuit boards.

[0015] In the solution disclosed herein, the electrical connection between the main chip and the basic configuration can be achieved by connecting the second circuit board, where the main chip resides, to the first circuit board, where the basic configuration resides. The electrical connection between the main chip and the interface device can also be achieved by connecting the second circuit board, where the main chip resides, to the first circuit board, where the interface device resides. This prevents wire crossover and facilitates simple wiring management within the board.

[0016] In a possible implementation, the second circuit board and the first circuit board are electrically connected by at least one of a cable connection, a flexible circuit board connection, a pluggable connector connection, and an adapter board connection.

[0017] The pluggable connector may be a blind-plug connector, a pogopin connector or a crimp connector.

[0018] In the solution disclosed herein, the electrical connection between the first and second circuit boards can be achieved through cables, such as copper wires, flexible circuit boards, adapter boards, or pluggable connectors. The second circuit board can also be located on the surface of the first circuit board, with the lower surface of the second circuit board crimped onto the upper surface of the first circuit board to achieve electrical connection between the two.

[0019] In the solution shown in the present disclosure, there are multiple electrical connections between the first circuit board and the second circuit board. Then, the electrical connection methods at these multiple locations can be the same, which is one of the above-mentioned electrical connection methods, or the electrical connection methods at these multiple locations can be different, which is two or more of the above-mentioned electrical connection methods.

[0020] It can be seen that the electrical connection method between the first circuit board and the second circuit board is more flexible and the electrical connection method is more compatible. Furthermore, the electrical connection method between the main chip and the basic configuration, as well as the electrical connection method between the main chip and the interface device, are more flexible and more compatible.

[0021] In a possible implementation, there is one first circuit board, and the basic configuration and the interface device are located on a surface of the same first circuit board.

[0022] In the solution shown in the present disclosure, the basic configuration can be located on the surface of the first circuit board, and the interface components can be directly arranged in the single board. Alternatively, the basic configuration and the external interface components are arranged on the surface of the same first circuit board, and the internal interface components are directly arranged in the single board.

[0023] In a possible implementation, there are multiple first circuit boards, and the basic configuration and the interface device are located on surfaces of different first circuit boards.

[0024] In the solution shown in the present disclosure, the basic configuration and interface components are arranged on different surfaces of the first circuit board. For example, the basic configuration and interface components are located on different sides of the main chip module. In this case, the basic configuration can be located on a small-sized first circuit board, the internal interface components can be arranged on one small-sized first circuit board, and the external interface components can be arranged on another small-sized first circuit board. Compared to using a large-sized first circuit board to accommodate the basic configuration and interface components in different locations, the board size of the first circuit board can be reduced, thereby controlling the board material cost of the circuit board.

[0025] In a possible implementation, the interface device includes an external interface device and an internal interface device;

[0026] There are at least two first circuit boards, the external interface device is located on a surface of one first circuit board, and the internal interface device is located on a surface of another first circuit board.

[0027] In the solution shown in the present disclosure, the internal interface devices and the external interface devices are located on opposite sides of the main chip module. In this layout, the internal interface devices are arranged on a first circuit board, and the external interface devices are arranged on another first circuit board. Compared with using a large-sized first circuit board to take into account the internal structural devices and external interface devices that are relatively far apart, the board size of the first circuit board can be reduced, thereby controlling the board cost of the circuit board.

[0028] In a possible implementation, the second circuit board of the main chip module is fixed on the housing of the single board.

[0029] In the solution shown in the present disclosure, the main chip module can be directly fixed to the housing of the single board through its second circuit board, for example, it can be directly fixed to the bottom plate or upper cover of the housing.

[0030] In a possible implementation, the second circuit board of the main chip module is suspended on the lower surface of the heat sink of the single board, and the heat sink is fixed on the housing of the single board.

[0031] In the solution shown in the present disclosure, the main chip module can be suspended on the lower surface of the heat sink through its second circuit board.

[0032] In a possible implementation, the first circuit board is fixed to the housing of the single board, and the second circuit board of the main chip module is fixed to the first circuit board via a structural member.

[0033] In the solution shown in the present disclosure, the second circuit board of the main chip module is fixed on the first circuit board through a structural member.

[0034] It can be seen that the main chip module can be fixed in the housing of the single board in a variety of ways, thereby enhancing the assembly flexibility of the main chip module in the single board.

[0035] In a second aspect, according to the present disclosure, a method for assembling a single board is provided, wherein the single board is the single board described in the first aspect, and the method comprises:

[0036] fixing the basic configuration and the interface device on a surface of at least one first circuit board;

[0037] Fixing the main chip module and the at least one first circuit board in the housing of the single board;

[0038] The main chip of the main chip module is electrically connected to the basic configuration and the interface device respectively.

[0039] In the solution presented in this disclosure, the main chip is located on the surface of a second circuit board, while the basic configuration and interface components of the single board are located on the surface of at least one first circuit board. This means that the high-speed main chip and the low-speed basic configuration and interface components are not located on the same circuit board. This allows the first circuit board to only meet the operating requirements of the basic configuration and interface components, without having to meet the operating requirements of the main chip. The second circuit board is used to meet the operating requirements of the main chip. This allows both the first and second circuit boards to maximize their respective value, thereby reducing resource waste.

[0040] Moreover, the second circuit board is processed using high-performance board materials suitable for the main chip, while the first circuit board is processed using board materials suitable for basic configuration and interface devices. There is no need for all circuit boards to be processed using high-performance board materials. Therefore, the board cost of the circuit board can be reduced, thereby reducing the cost of a single board.

[0041] In a possible implementation, fixing the main chip module in the housing of the single board includes fixing the second circuit board of the main chip module on the housing of the single board.

[0042] In a possible implementation, fixing the second circuit board of the main chip module in the housing of the single board includes:

[0043] Fixing the second circuit board of the main chip module to the lower surface of the heat sink, wherein the main chip of the main chip module is located between the heat sink and the second circuit board;

[0044] The radiator is fixed on the housing of the single board.

[0045] In a possible implementation, fixing the second circuit board of the main chip module and the at least one first circuit board in the housing of the single board includes:

[0046] Using a structural member to fix the second circuit board of the main chip module on the at least one first circuit board;

[0047] The at least one first circuit board is fixed on the housing of the single board.

[0048] In the solution shown in the present disclosure, the main chip module can be fixed in the housing of the single board in a variety of ways, thereby enhancing the assembly flexibility of the main chip module in the single board.

[0049] In a third aspect, according to the present disclosure, a communication device is provided, wherein the communication device includes the single board described in the second aspect.

[0050] In the solution presented in this disclosure, the main chip is located on the surface of a second circuit board, while the basic configuration and interface components of the single board are located on the surface of at least one first circuit board. This means that the high-speed main chip and the low-speed basic configuration and interface components are not located on the same circuit board. This allows the first circuit board to only meet the operating requirements of the basic configuration and interface components, without having to meet the operating requirements of the main chip. The second circuit board is used to meet the operating requirements of the main chip. This allows both the first and second circuit boards to maximize their respective value, thereby reducing resource waste.

[0051] Moreover, the second circuit board is processed using high-performance board materials suitable for the main chip, while the first circuit board is processed using board materials suitable for basic configuration and interface devices. There is no need for all circuit boards to be processed using high-performance board materials. Therefore, the board cost of the circuit board can be reduced, thereby reducing the cost of a single board. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] FIG1 is a schematic diagram of the architecture of a communication device provided by the present disclosure;

[0053] FIG2 is a schematic diagram of the architecture of a communication device provided by the present disclosure;

[0054] FIG3 is a schematic diagram of a communication device provided by the present disclosure;

[0055] FIG4 is a schematic diagram of a single board provided by the present disclosure;

[0056] FIG5 is a schematic diagram of a plurality of main chip modules provided by the present disclosure;

[0057] FIG6 is a schematic diagram of a basic configuration provided by the present disclosure and an internal interface device located on the same surface of a first circuit board, while an external interface device is located on a different surface of the first circuit board;

[0058] FIG7 is a schematic diagram of a basic configuration and external interface components provided by the present disclosure, located on surfaces of different first circuit boards;

[0059] FIG8 is a schematic diagram of a basic configuration and internal interface components provided by the present disclosure, located on surfaces of different first circuit boards;

[0060] FIG9 is a schematic diagram of a basic configuration provided by the present disclosure, an internal interface component and an external interface component located on different surfaces of a first circuit board;

[0061] FIG10 is a schematic diagram of a basic configuration and interface device provided by the present disclosure, located on the surface of the same first circuit board;

[0062] FIG11 is a schematic diagram of a single board provided by the present disclosure;

[0063] FIG12 is a schematic diagram of a single board provided by the present disclosure;

[0064] FIG13 is a schematic diagram of an electrical connection between a first circuit board and a second circuit board provided by the present disclosure;

[0065] FIG14 is a schematic diagram of an electrical connection between a first circuit board and a second circuit board provided by the present disclosure;

[0066] FIG15 is a schematic diagram of an electrical connection between a first circuit board and a second circuit board provided by the present disclosure;

[0067] FIG16 is a schematic diagram of a first surface of a second circuit board of a main chip module provided by the present disclosure;

[0068] FIG17 is a schematic diagram of a second surface of a second circuit board of a main chip module provided by the present disclosure;

[0069] FIG18 is a schematic diagram of a second circuit board of a main chip module provided by the present disclosure being directly fixed in a housing;

[0070] FIG19 is a schematic diagram of a second circuit board of a main chip module provided by the present disclosure being hoisted on the lower surface of a radiator;

[0071] FIG20 is a schematic diagram of a second circuit board of a main chip module provided by the present disclosure, which is fixed on a first circuit board through a structural member.

[0072] Explanation of Reference Numerals: 1. Main chip module; 11. Main chip; 12. Second circuit board; 13. Power supply module. 2. Basic configuration; 21. CPU system; 22. Clock system; 23. Power supply system. 3. Interface components; 31. Internal interface components; 32. External interface components. 4. First circuit board. 5. Housing. 6. Heat sink. 7. Structural components. 8. Adapter board. DETAILED DESCRIPTION

[0073] Although the description of the present disclosure will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the embodiments. On the contrary, the purpose of introducing the application in conjunction with the embodiments is to cover other options or modifications that may be extended based on the claims of the present disclosure. In order to provide an in-depth understanding of the present disclosure, the following description will contain many specific details. The present disclosure can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present disclosure, some specific details will be omitted in the description. It should be noted that the embodiments in the present disclosure and the features in the embodiments can be combined with each other unless there is a conflict.

[0074] In the embodiments of the present disclosure, references to "one embodiment" or "some embodiments" mean that one or more embodiments of the present disclosure include a particular feature, structure, or characteristic described in conjunction with the embodiment. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in different places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized.

[0075] In the embodiments of the present disclosure, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of the features.

[0076] In the embodiments of the present disclosure, the terms “including,” “comprising,” “having,” and their variations all mean “including but not limited to,” unless specifically emphasized otherwise.

[0077] In the embodiments of the present disclosure, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0078] In the embodiments of the present disclosure, "and / or" is simply a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0079] In the embodiments of the present disclosure, the directional terms mentioned, such as "up", "down", "left", "right", "inside", "outside", etc., are only references to the directions of the drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present disclosure, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present disclosure.

[0080] The embodiments of the present disclosure relate to a single board, which may also be called a board card. The single board may be used in a communication device, which may specifically be a routing device, a switching device, or other devices including the single board.

[0081] The communication device can be either a frame-type device or a box-type device. Figures 1 and 2 show the architecture of a frame-type communication device. Figure 1 shows an orthogonal architecture of a communication device without a backplane, while Figure 2 shows a non-orthogonal architecture of a communication device with a backplane. The communication device primarily includes a chassis (not shown), one or more main control boards (not shown), one or more service boards, one or more switch boards, cooling fans, and power supply modules (not shown).

[0082] The main control board manages the switch boards and service boards. The service boards are responsible for receiving and sending data. Specifically, each service board has one or more service chips, which are used to receive and send data. In some embodiments, the communication device includes 16 service boards. The switch boards are responsible for forwarding data. Specifically, each switch board has one or more switch chips, which are used to forward data between different service chips. In some embodiments, the communication device includes 8 switch boards.

[0083] The following is a more detailed exemplary description of the communication device:

[0084] 3 is a logical diagram of a communication device 100 . The communication device 100 includes a main control board 110 , a switch board 120 , and a service board 130 .

[0085] Main control board 110, also known as the main processing unit (MPU) or route processing card, is responsible for controlling and managing various components in communication device 100, including routing calculation, device management, device maintenance, and protocol processing. As shown in Figure 3, main control board 110 includes a main control board central processing unit 111 and memory 112.

[0086] The switch board 120 may also be referred to as a switch fabric unit (SFU) or a fabric board. If the communication device 100 has multiple service boards 130, the switch board 120 is used to exchange data between the service boards 130. For example, the two service boards 130 in Figure 3 can communicate via the switch board 120. The switch board 120 includes a switch chip, which may be a forwarding engine (FE) chip.

[0087] The service board 130 is also called an interface board, a line processing unit (LPU), or a line card. The service board 130 is used to provide various service interfaces and implement data packet forwarding. Service interfaces include, but are not limited to, Ethernet interfaces, POS (Packet over SONET / SDH) interfaces, etc. Ethernet interfaces are, for example, flexible Ethernet clients (FlexE Clients). As shown in Figure 3, the service board 130 includes: a central processing unit 131, a service chip 132 (the service chip can also be called a network chip), a forwarding table entry memory 134, and a physical interface card (PIC) 133. Among them, the service chip 132 can specifically be a network processor (NP) chip or a packet processor (PP) chip.

[0088] The central processing unit 131 on the service board 130 is used to control and manage the service board 130 and communicate with the main control board central processing unit 111 on the main control board 110 .

[0089] The service chip 132 is used to implement message forwarding processing. The service chip 132 can be in the form of a forwarding chip. Specifically, the service chip 132 is used to forward received messages based on the forwarding table stored in the forwarding table entry memory 134. If the destination address of the message is the address of the communication device 100, the message is sent to the CPU (such as the main control board central processing unit 111) for processing; if the destination address of the message is not the address of the communication device 100, the next hop and output interface corresponding to the destination address are found in the forwarding table based on the destination address, and the message is forwarded to the output interface corresponding to the destination address. Among them, the processing of uplink messages includes: processing of the message input interface, forwarding table search; processing of downlink messages: forwarding table search, etc.

[0090] Physical interface card 133 implements physical layer connectivity. Raw traffic enters service board 130 through this card, and processed messages are sent from this physical interface card 133. Physical interface card 133, also known as a daughter card, can be installed on service board 130. It converts optical and electrical signals into messages, performs a validity check on these messages, and forwards them to service chip 132 for processing. In some embodiments, a central processing unit (CPU) can also perform the functions of service chip 132, such as implementing software forwarding based on a general-purpose CPU. Therefore, service chip 132 is no longer required in physical interface card 133.

[0091] In some examples, the communication device 100 includes multiple service boards 130 .

[0092] The main control board 110 and the service board 130 are coupled. For example, the main control board 110, the two service boards 130, and the switch board 120 are connected to the system backplane via a system bus for intercommunication. In some examples, an inter-process communication (IPC) channel is established between the main control board 110 and the service boards 130, and communication between the main control board 110 and the service boards 130 is performed via the IPC channel.

[0093] Logically, the communication device 100 comprises a control plane and a forwarding plane. The control plane includes the main control board 110 and the central processing unit 131, while the forwarding plane includes various components that perform forwarding, such as the forwarding table entry memory 134, the physical interface card 133, and the network chip 132. The control plane performs functions such as routing, generating forwarding tables, processing signaling and protocol messages, and configuring and maintaining device status. The control plane sends the generated forwarding tables to the forwarding plane. On the forwarding plane, the service chip 132 forwards messages received by the physical interface card 133 based on the forwarding tables sent by the control plane. The forwarding tables sent by the control plane can be stored in the forwarding table entry memory 134. In some embodiments, the control plane and forwarding plane can be completely separate and not located on the same device.

[0094] In some embodiments, there may be one or more main control boards 110, which may include a primary main control board and a backup main control board. There may be one or more service boards 130. The more service boards 130 a communication device provides, the stronger its data processing capability generally is. There may also be one or more physical interface cards on the service board 130. There may also be one or more switch boards 120, which, when multiple, can collectively implement load sharing and redundant backup. In a distributed forwarding architecture, a communication device may have at least one switch board 120, which enables data exchange between multiple service boards 130, providing high-capacity data exchange and processing capabilities.

[0095] The control board, service board, and switch board mentioned above are all types of single boards. While these boards have different functions, their structure primarily includes a mainboard, a main chip, basic configurations, and interface components. The mainboard is also known as a PCB. The main chip, for example, is the service chip on the service board, while the switch chip is the switch chip on the switch board. Basic configurations include, for example, the CPU system, clock system, and power supply system. Interface components can be external (such as optical cages) or internal (such as high-speed connectors), or a combination of both.

[0096] The layout of these components on a single board involves mounting the main chip, basic components, and interface components on the same motherboard. The main chip is electrically connected to the basic components and interface components via traces on the motherboard. However, placing all components on the same motherboard presents at least the following issues.

[0097] First, the motherboard's performance must match that of the main chip. For example, a high-performance main chip requires a high-performance motherboard, while other components on the motherboard, such as basic configurations and interface devices, do not require such a high-performance motherboard. Therefore, requiring high-performance boards for the entire motherboard wastes resources and increases the cost of the motherboard.

[0098] Secondly, when a single board needs to be configured with multiple main chips, it is also necessary to develop a motherboard that can assemble so many main chips, which not only increases the cost of the motherboard board, but also increases the cost of motherboard development.

[0099] This embodiment provides a single board that separates its main chip and configures a circuit board adapted thereto, and does not share the circuit board with basic configurations and interface devices, thereby reducing the board material cost of the circuit board and thus saving the cost of the single board.

[0100] As shown in Figure 4, the single board includes a main chip module 1, basic configuration 2, interface components 3, and a first circuit board 4. The main chip module 1 includes a main chip 11 and a second circuit board 12, with the main chip 11 located on the surface of the second circuit board 12. There is at least one first circuit board 4, and the basic configuration 2 and interface components 3 are located on the surface of at least one first circuit board 4. The main chip 11 is electrically connected to the basic configuration 2 and interface components 3, respectively.

[0101] The main chip 11 is located on the surface of the second circuit board 12, while the basic configuration 2 and interface components 3 of the single board are located on the surface of at least one first circuit board 4. This shows that the high-speed main chip 11 and the low-speed basic configuration 2 and interface components 3 are not located on the same circuit board. This allows the first circuit board 4 to only meet the operating requirements of the basic configuration 2 and interface components 3, without having to meet the operating requirements of the main chip 11. The second circuit board 12 is used to meet the operating requirements of the main chip 11. This allows both the first circuit board 4 and the second circuit board 12 to maximize their respective value, thereby reducing resource waste.

[0102] Moreover, the second circuit board 12 is processed using high-performance board materials suitable for the main chip 11, while the first circuit board 4 is processed using board materials suitable for the basic configuration 2 and the interface device 3. There is no need for all circuit boards to be processed using high-performance board materials. Therefore, the board cost of the circuit board can be reduced, thereby reducing the cost of a single board.

[0103] The following is a detailed introduction to the characteristics of each component on the board.

[0104] The main chip 11 is the chip that implements the main functions of the board. The specific chip depends on the type of board. For example, if the board is a service board, the main chip 11 can be a service chip, specifically a network processor (NP) chip or a packet processor (PP) chip. If the board is a switch board, the main chip 11 can be a switch chip, specifically a forwarding engine (FE) chip.

[0105] In one example, the second circuit board 12 is compatible with the main chip 11 . For example, the size, specifications, and performance of the second circuit board 12 are compatible with the main chip 11 , and the main chip 11 is located on the surface of the second circuit board 12 .

[0106] In one example, the number of main chip modules 1 can be one or more. For example, as shown in FIG4 , the number of main chip modules 1 is one, and as shown in FIG5 , the number of main chip modules 1 is two. Of course, the number of main chip modules 1 can be greater. In the solution where there are multiple main chip modules 1, each main chip module 1 includes a main chip 11 and a second circuit board 12, and the main chip 11 is located on the surface of the second circuit board 12.

[0107] It should be noted that in the case where there are multiple main chip modules 1, these multiple main chip modules 1 can be the same or different. Specifically, the difference between two main chip modules 1 may be that the types of main chips 11 included are different. For example, the main chip 11 of one main chip module 1 is an NP chip, while the main chip 11 of the other main chip module 1 is a PP chip. The difference between two main chip modules 1 may also be that the types of main chips 11 included are the same, but the sizes, capacities, or processing capabilities of the included main chips 11 are different.

[0108] In one example, regarding the number of main chips 11 and second circuit boards 12 included in each main chip module 1 , there are several options as follows.

[0109] One solution may be that the main chip module 1 includes a main chip 11 and a second circuit board 12, and the main chip 11 is located on the surface of the second circuit board 12. When this main chip module 1 with one-to-one correspondence between the main chip 11 and the second circuit board 12 is used in a single board, if the single board needs to be configured with multiple main chips 11, then multiple main chip modules 1 can be assembled in the single board.

[0110] Alternatively, the main chip module 1 may include a second circuit board 12 and multiple main chips 11, with the multiple main chips 11 located on the surface of the same second circuit board 12. When this main chip module 1, consisting of multiple main chips 11 and one second circuit board 12, is used in a single board, one or more main chip modules 1 may be assembled in the single board if the single board requires multiple chips 11.

[0111] Another solution is to provide multiple main chip modules 1, with several types of main chip modules 1 being developed based on the number of main chips 11 typically included in a single board. For example, a single board typically includes one, two, or four main chips 11. In this case, there can be three types of main chip modules 1: one main chip module 1 with a one-to-one correspondence between the main chip 11 and the second circuit board 12; another main chip module 1 with two main chips 11 corresponding to one second circuit board 12, with the two main chips 11 located on the surface of one second circuit board 12; and another main chip module 1 with four main chips 11 corresponding to one second circuit board 12, with the four main chips 11 located on the surface of one second circuit board 12. In this way, when subsequently assembling the single board, the corresponding main chip module 1 can be selected and assembled in the single board based on the single board's requirements for the main chip 11.

[0112] For example, if a single board needs to be configured with two main chips 11, then a main chip module 1 with two main chips 11 located on a second circuit board 12 can be assembled in the single board. Alternatively, two main chip modules 1 can be assembled in the single board, where each main chip module 1 includes a main chip 11 and a second circuit board 12.

[0113] The present embodiment does not specifically limit the number of main chips 11 that the main chip module 1 includes. For ease of description, it is assumed that the main chip module 1 includes one main chip 11 and one second circuit board 12 .

[0114] The above describes the main chip module 1. Next, we will introduce the basic configuration 2 and interface components 3 of the board. Basic configuration 2 comprises the essential components required for the normal operation of the board. For example, as shown in Figure 4, basic configuration 2 may include a CPU system 21, a clock system 22, and a power supply system 23. Of course, basic configuration 2 also includes other components, such as heat sinks, which are not detailed here.

[0115] In one example, as shown in FIG4 , the interface device 3 may include an internal interface device 31 and an external interface device 32, wherein there are generally multiple internal interface devices 31 and multiple external interface devices 32. The internal interface device 31 is used to connect to other boards within the communication device where the board is located, and the external interface device 32 is used to connect to other communication devices outside the communication device where the board is located.

[0116] The internal interface device 31 may be a high-speed connector, and the external interface device 32 may be an optical cage.

[0117] For example, the single board is a service board of a frame-type communication device. The service board's internal interface device 31 is used to connect to the switch board of the communication device. The service board's external interface device 32 is used to connect to other communication devices. One end of the optical cable is connected to the external interface device 32, and the other end is connected to the external interface device 32 of another communication device. The connection between the optical cable and the communication device is achieved through an optical module. For example, the electrical interface of the optical module is plugged into the external interface device 32 of the communication device, and the optical interface of the optical module is plugged into the optical cable.

[0118] 6 , the interface device 3 may also include only the external interface device 32, but not the internal interface device 31. For example, a box-type communication device generally includes multiple external interface devices 32.

[0119] In this embodiment, whether the interface device 3 includes multiple external interface devices 32 or multiple internal interface devices 31 and multiple external interface devices 32 is not specifically limited and can be flexibly designed according to the application scenario of the communication device.

[0120] In an example, there is at least one first circuit board 4 , and the basic configuration 2 and the interface device 3 are located on a surface of the at least one first circuit board 4 .

[0121] For example, as shown in Figures 4 and 5, there are two first circuit boards 4, the basic configuration 2 is located on the surface of one first circuit board 4, the external interface device 32 in the interface device 3 is located on the surface of another first circuit board 4, and the internal interface device 31 of the interface device 3 is not arranged on the first circuit board 4, but is directly assembled in the single board.

[0122] For another example, as shown in FIG6 , there are two first circuit boards 4 , the basic configuration 2 and the internal interface device 31 are located on the surface of the same first circuit board 4 , and the external interface device 32 is located on the surface of another first circuit board 4 .

[0123] Of course, in the solution with two first circuit boards 4 , the basic configuration 2 and the external interface device 32 may be located on the surface of the same first circuit board 4 , while the internal interface device 31 may be located on the surface of another first circuit board 4 .

[0124] For another example, as shown in Figure 7, there are two first circuit boards 4, the basic configuration 2 is located on the surface of one first circuit board 4, the interface device 3 includes an external interface device 32 but does not include an internal interface device 31, then the external interface device 32 is located on the surface of another first circuit board 4.

[0125] For another example, as shown in Figure 8, there are two first circuit boards 4, the basic configuration 2 is located on the surface of one first circuit board 4, the interface device 3 includes an internal interface device 31 and does not include an external interface device, then the internal interface device 31 is located on the surface of another first circuit board 4.

[0126] For another example, as shown in Figure 9, the number of first circuit boards 4 is three, the basic configuration 2 is located on the surface of one first circuit board 4, the external interface device 32 in the interface device 3 is located on the surface of one first circuit board 4, and the internal interface device 31 in the interface device 3 is located on the surface of another first circuit board 4.

[0127] For another example, as shown in Figure 10, the number of first circuit boards 4 can also be one, and the basic configuration 2 and the interface device 3 are both arranged on the surface of the same first circuit board 4, wherein the interface device 3 can include an internal interface device 31 and an external interface device 32, or can only include the external interface device 32, or even only include the internal interface device 31.

[0128] As shown in FIG. 10 , a hole may be dug in the first circuit board 4 in the installation area corresponding to the main chip module 1 , and the main chip module 1 is located in the dug area of ​​the first circuit board 4 .

[0129] Alternatively, in another embodiment, the number of first circuit boards 4 can be one, and the basic configuration 2, interface device 3, and main chip module 1 can all be located on the surface of the first circuit board 4. The basic configuration 2 and interface device 3 are both fixed to the surface of the first circuit board 4, while the lower surface of the second circuit board 12 of the main chip module 1 is electrically connected to the upper surface of the first circuit board 4 to achieve electrical connection between the main chip 11 and the contact configuration 2, and between the main chip 11 and the interface device 3. Of course, the main chip module 1 may not be located on the surface of the first circuit board 4.

[0130] It should be noted that, in some examples, some components in the basic configuration 2 may be arranged on the surface of the same first circuit board 4 , or on the surfaces of different first circuit boards 4 .

[0131] The above is a case where the basic configuration 2 and the interface device 3 are arranged on the surface of at least one first circuit board 4 . This embodiment does not specifically limit how the basic configuration 2 and the interface device 3 are arranged on the surface of at least one first circuit board 4 .

[0132] In one example, regardless of whether the single board is a single board of a frame-type communication device or a single board of a box-type communication device, the single board further includes a housing 5. The housing 5 serves as a protective plate for the single board and has the function of shielding external signals and protecting internal components. As shown in FIG11 and FIG12 , the main chip module 1, the basic configuration 2, the interface device 3 and the first circuit board 4 are assembled in the housing 5, wherein the basic configuration 2 is not shown in FIG11 and FIG12 . The internal interface device 31 in FIG11 is directly assembled in the housing 5, and the internal interface device 31 in FIG12 is arranged on the surface of a first circuit board 4 and assembled in the housing 5 through the first circuit board 4. Since the interface device 3 is used to connect to components outside the single board, a portion of the interface device 3 is located in the housing 5, and the other portion is exposed to the housing 5, for example, through a port of the housing 5.

[0133] In one example, the main chip 11 of the main chip module 1 is electrically connected to the basic configuration 2 and the interface device 3. For example, as shown in FIG4 , the main chip 11 and the basic configuration 2 can be electrically connected by connecting the second circuit board 12 where the main chip 11 is located and the first circuit board 4 where the basic configuration 2 is located. As shown in FIG6 , the main chip 11 and the interface device 3 are also electrically connected by connecting the second circuit board 12 where the main chip 11 is located and the first circuit board 4 where the interface device 3 is located.

[0134] In another example, the main chip 11 and the basic configuration 2, as well as the main chip 11 and the interface device 3, can also be directly electrically connected. For example, as shown in Figures 4 and 5, the main chip 11 is directly electrically connected to the external interface device 32 and also directly electrically connected to the internal interface device 31.

[0135] Among them, this embodiment does not make specific limitations on whether the main chip 11 and the basic configuration 2 are directly electrically connected or electrically connected through their respective circuit boards. It does not make specific limitations on whether the main chip 11 and the interface device 3 are directly electrically connected or electrically connected through their respective circuit boards. Several possible electrical connection implementation methods can be exemplified by the electrical connection between the main chip 11 and the basic configuration 2 through their respective circuit boards, and the electrical connection between the main chip 11 and the interface device 3 through their respective circuit boards.

[0136] One electrical connection method may be that the first circuit board 4 and the second circuit board 12 may be electrically connected via a cable, such as a copper cable.

[0137] For example, one end of the cable is electrically connected to the first circuit board 4, and the other end is electrically connected to the second circuit board 12. The cable can be electrically connected to the first circuit board 4 and the second circuit board 12 by laser welding, crimping, or by an elastic conductor.

[0138] Another electrical connection method may be to electrically connect the first circuit board 4 and the second circuit board 12 via a flexible printed circuit (FPC), for example, by welding or crimping the flexible printed circuits onto the surfaces of the first circuit board 4 and the second circuit board 12, respectively.

[0139] Another electrical connection method can be, as shown in Figure 13, the first circuit board 4 and the second circuit board 12 can be electrically connected via an adapter board 8. The adapter board 8 is also a circuit board. As shown in Figure 13, one end of the adapter board 8 is electrically connected to the first circuit board 4, and the other end is electrically connected to the second circuit board 12. The adapter board 8 can be electrically connected to the first circuit board 4 and the second circuit board 12 by welding, crimping, or by connecting via an elastic conductor.

[0140] Another electrical connection method can be, as shown in Figure 6, the second circuit board 12 can also be arranged on the surface of the first circuit board 4, and the lower surface of the second circuit board 12 is directly crimped onto the upper surface of the first circuit board 4, thereby realizing the electrical connection between the first circuit board 4 and the second circuit board 12.

[0141] In one example, the electrical connection between the first circuit board 4 and the second circuit board 12 can be a detachable connection to facilitate subsequent upgrades of the main chip. For example, when upgrading the main chip, the old main chip module can be directly removed from the single board and the new main chip module can be installed in the single board. For other components of the single board, the changes are minimal or even no changes, which facilitates the upgrade of the single board.

[0142] Among them, the detachable electrical connection between the first circuit board 4 and the second circuit board 12 can be achieved by a pluggable connector. The pluggable connector can be a blind plug connector, a pogo pin connector or a crimp connector.

[0143] In other examples, there are multiple electrical connections between the first circuit board 4 and the second circuit board 12. These multiple electrical connections may adopt one or more of the above-mentioned electrical connection methods. For example, at least one of a cable connection, a flexible circuit board connection, an adapter board connection, and a pluggable connector connection may be adopted.

[0144] It can be seen that the electrical connection method between the first circuit board 4 and the second circuit board 12 is relatively flexible and the electrical connection method is highly compatible. Furthermore, the electrical connection method between the main chip 11 and the basic configuration 2, as well as the electrical connection method between the main chip 11 and the interface device 3, are relatively flexible and highly compatible.

[0145] The present embodiment does not limit the electrical connection method between the first circuit board 4 and the second circuit board 12 , and the method can be flexibly selected.

[0146] In one example, the electrical connection between the first circuit board 4 and the second circuit board 12 can be that the solder balls on the first surface of the first circuit board 4 are electrically connected to the solder balls on the first surface of the second circuit board 12, or that the solder balls on the second surface of the first circuit board 4 are electrically connected to the solder balls on the second surface of the second circuit board 12, or that the solder balls on the first surface of the first circuit board 4 are electrically connected to the solder balls on the second surface of the second circuit board 12, or that the solder balls on the second surface of the first circuit board 4 are electrically connected to the solder balls on the first surface of the second circuit board 12. The first surface of the first circuit board 4 and the first surface of the second circuit board 12 are located on the same side, for example, both are top surfaces, and the second surface of the first circuit board 4 and the second surface of the second circuit board 12 are located on the same side, for example, both are bottom surfaces.

[0147] For example, the first surfaces of the first circuit board 4 and the second circuit board 12 on the same side are electrically connected via a cable or a flexible circuit board or an adapter board 8 , as shown in FIG. 13 .

[0148] For another example, the first circuit board 4 and the second circuit board 12 , which are located on the same side, are electrically connected via a cable, a flexible circuit board, or an adapter board 8 .

[0149] For another example, the first surfaces of the first circuit board 4 and the second circuit board 12 located on the same side are electrically connected through a cable or a flexible circuit board or an adapter board 8, and the second surfaces located on the same side are also electrically connected through a cable or a flexible circuit board or an adapter board 8. As shown in Figure 14, the first circuit board 4 and the second circuit board 12 are electrically connected on both sides.

[0150] In one example, regarding the electrical connection position between the first circuit board 4 and the second circuit board 12, the surface of the first circuit board 4 has solder balls, and the surface of the second circuit board 12 has solder balls. The two solder balls are connected by a cable or a flexible circuit board or an adapter board to achieve electrical connection between the first circuit board 4 and the second circuit board 12.

[0151] It should be pointed out that the electrical connection between the first circuit board 4 and the second circuit board 12 is to realize the electrical connection between the basic configuration 2 or the interface device 3 on the first circuit board 4 and the main chip 11 on the second circuit board 12. Therefore, the solder balls on the surface of the first circuit board 4 connected to the cable or flexible circuit board or adapter board need to be electrically connected to the basic configuration 2 or the interface device 3, and the solder balls on the surface of the second circuit board 12 connected to the cable or flexible circuit board or adapter board need to be electrically connected to the main chip 11.

[0152] The cable, adapter board 8 or flexible circuit board connecting the first circuit board 4 and the second circuit board 12 can be connected to any solder ball on the surface of the first circuit board 4 and any solder ball on the surface of the second circuit board 12 .

[0153] For example, as shown in Figures 13 to 15 , the surface of the first circuit board 4 where the internal interface device 31 is located has a first solder ball 01, a second solder ball 02, and a third solder ball 03. The first solder ball 01 and the second solder ball 02 are electrically connected via a transverse trace within the first circuit board 4, and the third solder ball 03 is electrically connected to the internal interface device 31 via a transverse trace within the first circuit board 4. The surface of the second circuit board 12 has a fourth solder ball 04, a fifth solder ball 05, and a sixth solder ball 06. The fourth solder ball 04 and the fifth solder ball 05 are electrically connected via a transverse trace within the second circuit board 12, and the sixth solder ball 06 is electrically connected to the main chip 11 via a transverse trace within the second circuit board 12.

[0154] In one solution, as shown in Figure 13, taking the adapter board 8 connecting the first circuit board 4 and the second circuit board 12 as an example, the adapter board 8 can be connected to the third solder ball 03 and the sixth solder ball 06 respectively, wherein the third solder ball 03 is electrically connected to the internal interface device 31, and the sixth solder ball 06 is electrically connected to the main chip 11, thereby realizing the electrical connection between the main chip 11 and the internal interface device 31.

[0155] In another solution, as shown in FIG. 15 , taking a cable connecting the first circuit board 4 and the second circuit board 12 as an example, the cable can be electrically connected to the first solder ball 01 and the fourth solder ball 04 respectively.

[0156] As shown in Figure 15 , the first solder ball 01 on the surface of the first circuit board 4 where the internal interface device 31 is located, connected to the cable, is not electrically connected to the internal interface device 31 via a transverse trace within the first circuit board 4. However, the first solder ball 01 is electrically connected to the second solder ball 02 on the surface of the first circuit board 4 via a transverse trace within the first circuit board 4, and the third solder ball 03 on the surface of the first circuit board 4 is electrically connected to the internal interface device 31 via a transverse trace within the first circuit board 4. Therefore, to achieve an electrical connection between the first solder ball 01 and the internal interface device 31, an electrical connection can be established between the second solder ball 02 and the third solder ball 03. For example, this can be achieved through a resistor, capacitor, or crimping.

[0157] In this way, the first solder ball 01 and the second solder ball 02 are electrically connected through the horizontal traces inside the first circuit board 4, and the second solder ball 02 and the third solder ball 03 are electrically connected through the resistor or capacitor on the surface of the first circuit board 4, and the third solder ball 03 and the internal interface device 31 are electrically connected through the horizontal traces inside the first circuit board 4, thereby making the first solder ball 01 and the internal interface device 31 electrically connected.

[0158] Similarly, referring to FIG15 , the fourth solder ball 04 on the surface of the second circuit board 12, which is connected to the cable, is not electrically connected to the main chip 11 via the transverse trace within the second circuit board 12. However, the fourth solder ball 04 is electrically connected to the fifth solder ball 05 on the surface of the second circuit board 12 via the transverse trace within the second circuit board 12, and the sixth solder ball 06 on the second surface 12 is electrically connected to the main chip 11 via the transverse trace within the second circuit board 12. Therefore, to achieve an electrical connection between the fourth solder ball 04 and the main chip 11, an electrical connection can be established between the fifth solder ball 05 and the sixth solder ball 06. For example, the electrical connection between the fifth solder ball 05 and the sixth solder ball 06 can be established using a resistor, a capacitor, or a press-fit connection.

[0159] In this way, the fourth solder ball 04 and the fifth solder ball 05 are electrically connected through the horizontal trace inside the second circuit board 12, and the fifth solder ball 05 and the sixth solder ball 06 are electrically connected through the resistor or capacitor on the surface of the second circuit board 12, and the sixth solder ball 06 and the main chip 11 are electrically connected through the horizontal trace inside the second circuit board 12, thereby making the fourth solder ball 04 and the main chip 11 electrically connected.

[0160] Then, based on the electrical connection between the first solder ball 01 and the internal interface device 31, the electrical connection between the fourth solder ball 04 and the main chip 11, and the cable connection between the first solder ball 01 and the fourth solder ball 04, the electrical connection between the main chip 11 and the internal interface device 31 can be achieved.

[0161] In another embodiment, the cable or flexible circuit board or adapter board connecting the first circuit board 4 and the second circuit board 12 can also be connected between the first solder ball 01 and the sixth solder ball 06, or, connected between the first solder ball 01 and the fifth solder ball 05, or, connected between the second solder ball 02 and the fourth solder ball 04, or, connected between the second solder ball 02 and the fifth solder ball 05, or, connected between the second solder ball 02 and the sixth solder ball 06, or, connected between the third solder ball 03 and the fourth solder ball 04, or, connected between the third solder ball 03 and the fifth solder ball 05.

[0162] It can be seen that the connection position between the first circuit board 4 and the second circuit board 12 is relatively flexible, and the connection position can be flexibly selected according to the actual layout situation.

[0163] In one example, the solder balls are typically arranged near the edge of the circuit board. For example, as shown in Figure 16, the first surface of the second circuit board 12 on which the main chip 11 is assembled has a solder ball area near the left edge, which can be used to electrically connect to the internal interface device 31, a solder ball area near the right edge, which can be used to electrically connect to the external connector 32, and a solder ball area near the upper edge, which can be used to electrically connect to the basic configuration 2.

[0164] Continuing to refer to Figure 16, the main chip 11 can be installed on the first surface of the second circuit board 12, for example, installed near the center of the first surface, that is, the center position of the main chip 11 is opposite to the center position of the second circuit board 12.

[0165] As described above, the second circuit board 12 can be electrically connected to the first circuit board 4 via its first surface, or it can be electrically connected to the first circuit board 4 via its second surface. Therefore, as shown in FIG17 , the second surface of the second circuit board 12 (opposite to the first surface) has solder balls near the left edge, which can be used to electrically connect to the internal interface device 31; solder balls near the right edge, which can be used to electrically connect to the external connector 32; and solder balls near the top edge, which can be used to electrically connect to the base configuration 2.

[0166] Continuing to refer to Figure 17, on the second surface of the second circuit board 12, at the position corresponding to the main chip 11, a power supply module 13 for supplying power to the main chip 11 can be installed. These power supply modules 13 can be installed vertically on the second surface of the second circuit board 12.

[0167] In one example, as described above, the main chip 11 is electrically connected to the internal interface devices 31. In a solution where there are multiple main chip modules 1, the main chip 11 of each main chip module 1 may be electrically connected to all of the internal interface devices 31, or the main chips 11 of some main chip modules 1 may be electrically connected to some of the internal interface devices 31, while the main chips 11 of another part of the main chip modules 1 may be electrically connected to other internal interface devices 31. For example, as shown in FIG9 , there are eight internal interface devices 31 and two main chip modules 1. In this case, the second circuit board 12 of one main chip module 1 is electrically connected to four of the internal interface devices 31, and the second circuit board 12 of another main chip module 1 is electrically connected to the remaining four internal interface devices 31.

[0168] Similarly, in a scenario where there are multiple main chip modules 1, the electrical connection between the main chip 11 and the external connectors 32 can be such that the main chip 11 of each main chip module 1 is electrically connected to all external connectors 32. Alternatively, the main chips 11 of some main chip modules 1 can be electrically connected to some external connectors 32, while the main chips 11 of another part of the main chip modules 1 are electrically connected to other external connectors 32. For example, as shown in FIG9 , there are four external connectors 32 and two main chip modules 1. In this case, the second circuit board 12 of one main chip module 1 is electrically connected to two of the external connectors 32, while the second circuit board 12 of the other main chip module 1 is connected to the remaining two external connectors 32.

[0169] In one example, regarding the fixing method of the main chip module 1 in the housing 5, one fixing method may be, as shown in FIG18 , directly fixing the second circuit board 12 of the main chip module 1 to the housing 5. For example, as shown in FIG18 , the second circuit board 12 is directly mounted on the bottom plate of the housing 5 by screws.

[0170] 18 , the first circuit board 4 where the internal interface device 31 is located can also be fixed directly to the bottom plate of the housing 5 by screws. The first circuit board 4 where the external connector 32 is located can also be fixed directly to the bottom plate of the housing 5 by screws.

[0171] The height of the first circuit board 4 and the second circuit board 12 in the housing 5 can be adjusted by the height of the limit posts inside the housing 5. As shown in FIG18 , the height of the first circuit board 4 where the external connector 32 is located can be adjusted by the limit posts.

[0172] In one example, since the main chip 11 needs to dissipate heat, as shown in FIG18 , the heat sink 6 can be installed on the second circuit board 12 , and the lower surface of the heat sink 6 is in contact with the main chip 11 to dissipate heat for the main chip 11 .

[0173] Another way to fix the main chip module 1 in the shell 5 can be, as shown in Figure 19, the radiator 6 is directly fixed on the bottom plate of the shell 5, the second circuit board 12 of the main chip module 1 is suspended on the lower surface of the radiator 6, and the main chip 11 and the lower surface of the radiator 6 are in contact.

[0174] As shown in Figure 19, the substrate of the radiator 6 is fixed to the bottom plate of the shell 5 by screws, there is a gap between the lower surface of the radiator 6 and the bottom plate of the shell 5, the second circuit board 12 is fixed to the lower surface of the radiator 6 by screws, and the main chip 11 and the lower surface of the radiator 6 are in contact with each other.

[0175] Another way to fix the main chip module 1 in the shell 5 can be, as shown in Figure 20, the first circuit board 4 is fixed on the shell 5 of the single board, and the second circuit board 12 of the main chip module 1 is fixed to the first circuit board 4 through the structural member 7.

[0176] For example, as shown in Figure 20, the left side of the second circuit board 12 is close to the first circuit board 4 where the internal interface device 31 is located, and the right side of the second circuit board 12 is close to the first circuit board 4 where the external connector 32 is located. Therefore, the left side of the second circuit board 12 is fixed to the first circuit board 4 where the internal interface device 31 is located via a structural member 7, and the right side of the second circuit board 12 is fixed to the first circuit board 4 where the external connector 32 is located via another structural member 7. The first circuit board 4 where the internal interface device 31 is located and the first circuit board 4 where the external connector 32 is located are both fixed to the bottom plate of the housing 5 via screws. In this way, the second circuit board 12 is fixed to the housing 5 via the two first circuit boards 4.

[0177] Continuing to refer to FIG. 20 , the heat sink 6 is fixed on the second circuit board 12 , and the lower surface of the heat sink 6 is in contact with the main chip 11 .

[0178] Based on the above, the single board of this embodiment includes a main chip module, which includes a main chip and a second circuit board. The main chip is located on the surface of the second circuit board, while the basic configuration and interface devices of the single board are located on the surface of at least one first circuit board. It can be seen that the main chip operating at high speed and the basic configuration and interface devices operating at low speed are not on the same circuit board. In this way, the first circuit board only needs to meet the operating requirements of the basic configuration and interface devices, and does not need to meet the operating requirements of the main chip. The second circuit board is used to meet the operating requirements of the main chip. Therefore, this allows the first circuit board and the second circuit board to maximize their respective value, thereby reducing resource waste. Moreover, the second circuit board is processed using high-performance plate materials suitable for the main chip, while the first circuit board is processed using plate materials suitable for the basic configuration and interface devices. There is no need for all circuit boards to be processed using high-performance plate materials. Therefore, the plate material cost of the circuit board can be reduced, thereby reducing the cost of the single board.

[0179] According to this embodiment, when assembling a single board, if the single board needs to be configured with multiple main chips, it is only necessary to install a main chip module including multiple main chips, or to install multiple main chip modules. There is no need to develop a main board that can be configured with multiple main chips, thereby reducing the development cost of the main board and helping to control the cost of the single board.

[0180] When the main chip of a single board is upgraded, only the second circuit board where the main chip is located needs to be updated and upgraded, which can also control the upgrade cost of the circuit board.

[0181] When assembling a single board, the main chip module and the first circuit board can be flexibly matched with each other. For example, the main chip module can be matched with first circuit boards of different specifications or sizes to form a single board. For another example, the first circuit board can also be matched with different main chip modules to form a single board, thereby enhancing the assembly flexibility of the single board.

[0182] The different main chip modules may include different main chips or different numbers of main chips. The different main chips may be different types of main chips or the same type of main chips but different sizes or capacities.

[0183] Since the main chip of the single board and the circuit board on which it is located form an independent module, the electrical connection method between the main chip and other devices can adopt any possible electrical connection method, thereby enhancing the flexibility of the electrical connection method between the main chip and peripheral circuits.

[0184] This embodiment also provides a method for assembling a single board, which is the single board described above. The method may include fixing the basic configuration 2 and the interface device 3 on the surface of at least one first circuit board 4. For example, the basic configuration 2 and the interface device 3 are arranged on the surface of the same first circuit board 4. For another example, the basic configuration 2 is arranged on the surface of one first circuit board 4, and the interface device 3 is arranged on the surface of another first circuit board 4. For another example, the basic configuration 2 and the internal interface device 31 are arranged on the surface of the same first circuit board 4, and the external interface device 32 is arranged on the surface of another first circuit board 4. For another example, the basic configuration 2 and the external interface device 32 are arranged on the surface of the same first circuit board 4, and the internal interface device 31 is arranged on the surface of another first circuit board 4. For another example, the basic configuration 2 is arranged on the surface of one first circuit board 4, the internal interface device 31 is arranged on the surface of one first circuit board 4, and the external interface device 32 is arranged on the surface of another first circuit board 4.

[0185] After the basic configuration 2 and the interface device 3 are mounted on the surface of at least one first circuit board 4, the at least one first circuit board 4 can be fixed in the single board housing 5, for example, by being fixed to the bottom plate or upper cover of the housing 5 by screws.

[0186] The main chip module 1 is also fixed in the single board housing 5. For example, the second circuit board of the main chip module is directly fixed to the bottom plate or upper cover of the housing 5. In another example, the second circuit board of the main chip module is suspended on the lower surface of the heat sink, and the heat sink is fixed to the bottom plate or upper cover of the housing 5, wherein the main chip 11 and the lower surface of the heat sink 6 are in contact. In another example, the second circuit board of the main chip module is fixed to the first circuit board 4 via the structural member 7, and the first circuit board 4 is fixed in the housing 5.

[0187] The main chip 11 of the main chip module 1 is electrically connected to the basic configuration 2 and the interface device 3, respectively. For example, the main chip 11 and the basic configuration 2 are directly connected via a cable, a flexible circuit board, or an adapter board, and the main chip 11 and the interface device 3 are directly connected via a cable, a flexible circuit board, or an adapter board. For another example, the main chip 11 and the basic configuration 2 are electrically connected by electrically connecting the second circuit board where the main chip 11 is located to the first circuit board where the basic configuration 2 is located, and the main chip 11 and the interface device 3 are electrically connected by electrically connecting the second circuit board where the main chip 11 is located to the first circuit board where the interface device 3 is located.

[0188] In this embodiment, the single board includes a main chip module, which includes a main chip and a second circuit board. The main chip is located on the surface of the second circuit board, while the basic configuration and interface devices of the single board are located on the surface of at least one first circuit board. It can be seen that the high-speed main chip and the low-speed basic configuration and interface devices are not on the same circuit board. In this way, the first circuit board only needs to meet the operating requirements of the basic configuration and interface devices, and does not need to meet the operating requirements of the main chip. The second circuit board is used to meet the operating requirements of the main chip. Therefore, this allows the first and second circuit boards to maximize their respective value, thereby reducing resource waste. Moreover, the second circuit board is processed using high-performance board material suitable for the main chip, while the first circuit board is processed using board material suitable for the basic configuration and interface devices. There is no need for all circuit boards to be processed using high-performance board material. Therefore, the board material cost of the circuit board can be reduced, thereby reducing the cost of the single board.

[0189] This embodiment further provides a communication device, which includes the above-mentioned single board. The communication device can be a router or a switch, and the architecture of the communication device can be a frame-type communication device or a box-type communication device.

[0190] The above description is only one embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present disclosure should be included in the scope of protection of the present disclosure.

Claims

1. A single board, comprising a main chip module (1), a basic configuration (2), an interface device (3) and a first circuit board (4); The main chip module (1) comprises a main chip (11) and a second circuit board (12), wherein the main chip (11) is located on the surface of the second circuit board (12); The number of the first circuit board (4) is at least one, and the basic configuration (2) and the interface device (3) are located on the surface of at least one of the first circuit boards (4); The main chip (11) is electrically connected to the basic configuration (2) and the interface device (3) respectively.

2. The single board according to claim 1, characterized in that The second circuit board (12) is electrically connected to at least one of the first circuit boards (4).

3. The single board according to claim 2, characterized in that The electrical connection between the second circuit board (12) and the first circuit board (4) comprises at least one of connection via a cable, connection via a flexible circuit board, connection via a pluggable connector and connection via an adapter board.

4. The single board according to any one of claims 1 to 3, characterized in that: The number of the first circuit board (4) is one, and the basic configuration (2) and the interface device (3) are located on the surface of the same first circuit board (4).

5. The single board according to any one of claims 1 to 3, characterized in that: There are multiple first circuit boards (4), and the basic configuration (2) and the interface device (3) are located on surfaces of different first circuit boards (4).

6. The single board according to any one of claims 1 to 3 or 5, characterized in that: The interface device (3) comprises an external interface device (32) and an internal interface device (31); The number of the first circuit boards (4) is at least two, the external interface device (32) is located on the surface of one first circuit board (4), and the internal interface device (31) is located on the surface of another first circuit board (4).

7. The single board according to any one of claims 1 to 6, characterized in that: The second circuit board (12) of the main chip module (1) is fixed on the housing (5) of the single board.

8. The single board according to any one of claims 1 to 6, characterized in that: The second circuit board (12) of the main chip module (1) is suspended on the lower surface of the heat sink (6) of the single board, and the heat sink (6) is fixed on the housing (5) of the single board.

9. The single board according to any one of claims 1 to 6, characterized in that: The first circuit board (4) is fixed on the housing (5) of the single board, and the second circuit board (12) of the main chip module (1) is fixed to the first circuit board (4) via a structural member (7).

10. A method for assembling a single board, characterized in that: The single board is a single board according to any one of claims 1 to 9, and the method comprises: Fixing the basic configuration (2) and the interface device (3) on the surface of at least one first circuit board (4); The main chip module (1) and the at least one first circuit board (4) are fixed in a housing (5) of the single board; The main chip (11) of the main chip module (1) is electrically connected to the basic configuration (2) and the interface device (3) respectively.

11. The method according to claim 10, characterized in that The step of fixing the main chip module (1) in the housing (5) of the single board comprises fixing the second circuit board (12) of the main chip module (1) on the housing (5) of the single board.

12. The method according to claim 10, characterized in that The method of fixing the second circuit board (12) of the main chip module (1) in the housing (5) of the single board comprises: The second circuit board (12) of the main chip module (1) is fixed to the lower surface of the heat sink (6), wherein the main chip module (1) The main chip (11) is located between the heat sink (6) and the second circuit board (12); The heat sink (6) is fixed on the housing (5) of the single board.

13. The method according to claim 10, characterized in that The second circuit board (12) of the main chip module (1) and the at least one first circuit board (4) are fixed in the housing (5) of the single board, comprising: Using a structural member (7) to fix the second circuit board (12) of the main chip module (1) on the at least one first circuit board (4); The at least one first circuit board (4) is fixed on the housing (5) of the single board.

14. A communication device, characterized in that: The communication device comprises the single board described in any one of claims 1 to 9.

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