Probe for electrical connection device
The probe's hypotenuse support member structure addresses the contradiction of increasing strength and minimizing heat dissipation during laser soldering, achieving robust connections and efficient soldering in electrical connection devices.
Patent Information
- Application Number
- PCT/JP2024/019685
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-06-14
- Filing Date
- 2024-05-29
- Publication Date
- 2024-12-19
AI Technical Summary
Conventional probes for electrical connection devices face challenges in increasing the strength of the support member to withstand contact pressure while minimizing heat dissipation during laser soldering, which are contradictory requirements.
The probe design incorporates a support member with a hypotenuse structure that connects an arbitrary point on the support member to the center of the foot portion, allowing for increased connection strength between the foot and arm parts while suppressing heat radiation during laser irradiation by maintaining a similar cross-sectional area, thus balancing strength and heat management.
This design enhances the connection strength between the foot and arm parts and improves the efficiency of laser soldering by reducing heat dissipation, preventing damage to the probe and ensuring reliable electrical contact.
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Figure JP2024019685_19122024_PF_FP_ABST
Abstract
Description
Electrical connection device probe
[0001] The present invention relates to a probe to be mounted on an electrical connecting device.
[0002] An electrical connection device equipped with a probe that contacts the test object, such as an integrated circuit, is used to test a test object. In a test using the electrical connection device, a contact portion formed at one end of the probe is brought into contact with an electrode terminal of the test object. The other end of the probe is connected to a test device such as a tester via a wiring pattern. In a test using the test device, electrical signals are sent and received between the test object and the test device via the probe, thereby determining whether the test object is good or bad.
[0003] In manufacturing an electrical connection device, in order to align a plurality of probes, the probes are joined by pressing the joints formed on the foot portions of the probes against a plurality of joint pads provided on a probe substrate. The joints between the joint pads and the probes are joined by soldering using heat generated by a laser (see, for example, Patent Document 1).
[0004] The probe has an elongated foot and an arm elastically connected to one end of the foot. Specifically, the arm is connected to a support member extending in a direction perpendicular to the end of the foot. The arm is provided with a contact portion that contacts an electrode terminal of the test object.
[0005] JP 2013-246133 A
[0006] As mentioned above, in conventional probes, the arm is elastically connected to the foot via a support member. Therefore, when the contact part comes into contact with the terminal, a moment due to pressure acts on the support member, and if the support member is weak, the arm may break. Therefore, it is desirable to increase the cross-sectional area of the support member to increase its strength.
[0007] In recent years, as the number of DUTs (Devices Under Test) increases, probe density is required, and the overall probe size tends to decrease, resulting in shorter arms than before. In this case, the moment caused by pressure when the contact part comes into contact with the terminal becomes larger than before, and it may be desirable to increase the cross-sectional area of the support member to increase its strength.
[0008] On the other hand, when soldering a probe, a laser is irradiated from the support member side of the probe toward the joint. If the cross-sectional area of the support member is increased, much of the heat generated during laser irradiation is dissipated through the support member, resulting in a problem of reduced efficiency of laser soldering. In other words, increasing the strength of the support member and avoiding heat dissipation during laser irradiation are trade-offs, making it difficult to achieve both.
[0009] The present invention has been made to solve these conventional problems, and its purpose is to provide a probe for an electrical connection device that increases the connection strength between the foot portion and the arm portion and is capable of suppressing heat dissipation during laser irradiation.
[0010] A probe for an electrical connection device according to one aspect of the present invention is a probe used in an electrical connection device, and comprises: a foot portion having an elongated shape extending in a first direction and having a joint portion for joining to a probe substrate; an arm support portion having a support member extending in a direction intersecting the first direction near one end of the foot portion and a hypotenuse member connecting an arbitrary point on the support member to a point between the other end or the center of the foot portion; and an arm portion of a cantilever structure having a fixed end and a free end, with a contact portion formed at the tip of the free end that contacts an object to be tested, and the fixed end connected to the arm support portion.
[0011] According to the present invention, it is possible to increase the strength of the connection between the foot portion and the arm portion and suppress heat dissipation during laser irradiation.
[0012] Fig. 1 is a side view of a probe according to a first embodiment. Fig. 2 is a side view showing a modified example of the probe shown in Fig. 1. Fig. 3 is a side view of a probe according to a second embodiment. Fig. 4 is a side view of a probe according to a third embodiment. Fig. 5 is a side view of a probe according to a first comparative example. Fig. 6 is a side view of a probe according to a second comparative example.
[0013] Next, an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are designated by the same or similar reference numerals. The embodiment shown below exemplifies an apparatus for embodying the technical idea of the present invention, and the material, shape, structure, arrangement, etc. of the components of the embodiment of the present invention are not limited to those described below.
[0014] [First Embodiment] Fig. 1 is a side view of a probe 1 for an electrical connecting device (hereinafter abbreviated as "probe 1") according to a first embodiment. As shown in Fig. 1, the probe 1 includes a foot portion 11, an arm support portion 12, and an arm portion 13. The probe 1 has a flat plate shape with a desired thickness in a direction perpendicular to the plane of the drawing. The probe 1 is mounted on an electrical connecting device and is made of a conductive material. As will be described later, the probe 1 electrically connects the electrode terminal of the test object to the probe substrate by connecting the joint portion 11a to a probe substrate and bringing the contact portion 13c into contact with the electrode terminal of the test object.
[0015] The foot portion 11 has an elongated shape. Hereinafter, the direction in which the foot portion 11 extends (the left-right direction in the drawing) will be referred to as the first direction. The direction toward the tip of the contact portion 13c will be referred to as the downward direction, and the opposite side will be referred to as the upward direction. That is, the up and down directions in the drawing will be referred to as the upward and downward directions of the probe 1, respectively.
[0016] A bonding portion 11a is formed along one side of the foot portion 11. By bonding the bonding portion 11a to a bonding pad provided on a probe substrate (not shown), the probe 1 and the probe substrate can be electrically connected.
[0017] The joint 11a is formed in a convex shape that protrudes upward from the upper side of the foot portion 11, and is located, for example, above the upper end of the oblique side member 12b. Note that the joint 11a is not limited to being located above the upper end of the oblique side member 12b. Furthermore, multiple joints 11a may be formed.
[0018] The foot portion 11 and the bonding pad are electrically connected by soldering by irradiating a laser from the direction of the arrow Y1 in the figure. Note that the direction of laser irradiation is not limited to the Y1 direction.
[0019] The arm support portion 12 supports the arm by connecting the foot portion 11 and the arm portion 13. The arm support portion 12 has a support member 12a, an oblique side member 12b, a connecting member 12c, and a base member 12d.
[0020] The support member 12a has an elongated shape, and its upper end is connected in a direction substantially perpendicular (a direction intersecting with the first direction) to one end p1 (near the one end) of the foot portion 11. The lower end of the support member 12a is connected to one end of a base member 12d that extends in a direction perpendicular to the support member 12a (i.e., a direction along the first direction).
[0021] The oblique side member 12b connects an arbitrary point p2 on the lower side of the support member 12a to the center point p3 of the foot portion 11. That is, one end of the oblique side member 12b is connected to an arbitrary point on the support member 12a, and the other end is connected to the center of the foot portion 11. The oblique side member 12b has a narrow width near point p4 near its center, and the width gradually increases from point p4 toward the connection point p3 of the foot portion 11. Furthermore, the width gradually increases from point p4 toward the connection point p2. Point p4 and the other end of the base member 12d are connected by a connecting member 12c.
[0022] The arm portion 13 includes a plurality of arms 13a (three in the figure), a tip member 13b connected to the end of each arm 13a, and a contact portion 13c formed at the lower end of the tip member 13b and protruding downward. Each arm 13a has a narrow, elongated shape extending along the first direction. The arms 13a are arranged substantially parallel to one another, and the right ends of each arm 13a are connected to the connecting member 12c. However, the arms 13a do not necessarily have to be arranged parallel to one another.
[0023] The right end of each arm 13a is a fixed end where the arm portion 13 is connected to the arm support portion 12. The left end of the arm portion 13 is a free end where a contact portion 13c is formed. That is, the arm portion 13 has a fixed end and a free end, and the contact portion 13c that comes into contact with the test object is formed at the tip of the free end, and the fixed end has a cantilever structure connected to the arm support portion 12.
[0024] Furthermore, the length in the first direction from the contact portion 13c to the support member 12a (hereinafter, may be referred to as the arm length) is substantially the same as the length in the first direction of the foot portion 11 (hereinafter, may be referred to as the foot length). Note that the arm length is not limited to being substantially the same as the foot length, and there may be cases where the arm length is longer than the foot length, or where the arm length is shorter than the foot length.
[0025] In the probe 1 according to the first embodiment described above, the oblique side member 12b connects the lower point p2 of the support member 12a to the center point p3 of the foot portion 11. Therefore, even if the contact portion 13c of the arm portion 13 is displaced in the vertical direction and a moment is generated in the support member 12a, the arm portion 13 is firmly fixed by the arm support portion 12, and thus the connection strength between the foot portion 11 and the arm portion 13 can be increased.
[0026] Furthermore, the width of the support member 12a (corresponding to the cross-sectional area) is set to be approximately the same as that of a conventional probe. Therefore, when a laser is irradiated from the direction of arrow Y1 in Figure 1 for soldering, heat generated by the laser irradiation can be prevented from dissipating via the support member 12a, improving the efficiency of laser soldering. In other words, it is possible to increase the connection strength between the foot portion 11 and the arm portion 13 and to suppress heat dissipation during laser irradiation.
[0027] The oblique side member 12b is formed so that its width increases from the center (point p4) of the oblique side member 12b toward both ends. That is, the width of the oblique side member 12b gradually increases from the center toward the connection point p3. This makes it possible to distribute the stress that is applied to both ends of the oblique side member 12b when the probe 1 is brought into contact with the DUT. This makes it possible to prevent damage to the probe 1.
[0028] By forming the joint 11a in a convex shape, the joining area can be made smaller than that of the foot portion 11, so that joining can be performed with a relatively small amount of solder. Therefore, even if the heat of the laser irradiation is dissipated, the solder can be sufficiently melted without increasing the laser output. Furthermore, by positioning the joint 11a above the oblique side member 12b, the stress applied to the oblique side member 12b during inspection can be efficiently transmitted to the joint 11a.
[0029] In the probe 1 according to the first embodiment, an example has been shown in which the arm section 13 includes three arms 13a, but the number of arms 13a is not limited to three. For example, as shown in FIG. 2, a configuration in which five arms 13a are provided may also be used.
[0030] Second Embodiment Next, a second embodiment will be described. Fig. 3 is a side view showing the configuration of a probe 2 according to the second embodiment. The probe 2 according to the second embodiment differs from the probe 1 according to the first embodiment in that the support member 12a is composed of a first support member 12a1 and a second support member 12a2.
[0031] The first support member 12a1 is connected to the foot portion 11 near the right end (near one end) in a diagonal direction (a direction intersecting the first direction), and the second support member 12a2 is connected to the first support member 12a1 at a certain angle. Other than that, the probe 2 according to the second embodiment is similar to the probe 1 according to the first embodiment described above. Similarly to the probe 1 according to the first embodiment described above, the probe 2 according to the second embodiment can also increase the connection strength between the foot portion 11 and the arm portion 13 and suppress heat dissipation during laser irradiation.
[0032] [Third Embodiment] Next, a third embodiment will be described. Fig. 4 is a side view showing the configuration of a probe 3 according to the third embodiment. The probe 3 according to the third embodiment differs from the probe 1 according to the first embodiment in that one end of the oblique side member 12b is connected to point p5 on the left end of the foot portion 11. In other words, the oblique side member 12b is connected to the other end of the foot portion 11.
[0033] In the probe 3 of the third embodiment, as in the probe 1 of the first embodiment described above, it is possible to increase the connection strength between the foot portion 11 and the arm portion 13 and suppress heat dissipation during laser irradiation.
[0034] 5 and 6 are side views showing the configurations of the probes according to the first and second comparative examples, and the first to third embodiments described above will be compared with the first and second comparative examples below.
[0035] 5, the probe 101 according to the first comparative example includes a coupling member 18 that couples the end of the connection member 12c provided on the arm support portion 12 to the foot portion 11. However, the coupling member 18 is not coupled at any point between the left end (the other end) and the center of the foot portion 11.
[0036] As shown in FIG. 6 , the probe 102 according to the second comparative example differs from the probe 1 according to the first embodiment described above in that it does not include the oblique side member 12 b that connects the arm support portion 12 and the foot portion 11.
[0037] Heat generated by laser irradiation travels from the joint 11a to the support member 12a via the foot portion 11. That is, to suppress the dissipation of heat generated by laser irradiation, it is necessary to sufficiently separate the connecting portion between the connecting member 18 and the foot portion 11 from the support member 12a. On the other hand, because the connecting member 18 extends in the vertical direction, the arm length of the arm portion 13 becomes shorter as the connecting member 18 is separated from the support member 12a. In recent years, there has been a demand for miniaturized probes, and in cases where the probe size is limited, it is difficult to ensure an arm length sufficient to ensure sufficient needle pressure when the connecting member 18 is used.
[0038] 5 and 6 do not include the oblique side member 12b, which makes it impossible to increase the strength of the connection between the foot portion 11 and the arm portion 13. As a result, a moment caused by pressure when the contact portion 13c comes into contact with the terminal acts on the support member 12a, causing problems such as damage to the connection between the support member 12a and the arm portion 13.
[0039] The probes 1, 2, and 3 of the first to third embodiments are provided with the oblique member 12b, which makes it possible to achieve both the advantage of sufficiently separating the connecting portion between the oblique member 12b and the foot portion 11 from the support member 12a and the advantage of ensuring a sufficient arm length.
[0040] In the first to third embodiments of the present application, an arm support section 12 is provided, which includes a support member 12a extending in a direction intersecting the first direction near one end (p1 in FIG. 1) of the foot section 11, and an oblique side member 12b connecting an arbitrary point (p2 in FIG. 1) on the support member 12a to a connection point (p3 in FIG. 1) between the other end or the center of the foot section 11. By including the oblique side member 12b in the arm support section 12, even if the contact portion 13c of the arm section 13 is displaced in the vertical direction and a moment is generated in the support member 12a, the arm section 13 is firmly fixed by the arm support section 12. Furthermore, by including the oblique side member 12b in the arm support section 12, the width (corresponding to the cross-sectional area) of the support member 12a can be made substantially the same as that of a conventional probe. 1 for soldering, it is possible to prevent the heat generated by the laser irradiation from being dissipated via the support member 12a, thereby improving the efficiency of the laser soldering, i.e., it is possible to increase the connection strength between the foot portion 11 and the arm portion 13 and to suppress heat dissipation during laser irradiation.
[0041] Although the present invention has been described by the above embodiments, the descriptions and drawings forming a part of this invention should not be understood as limiting the present invention. From this disclosure, various alternative embodiments, examples and operating techniques will become apparent to those skilled in the art.
[0042] 1, 2, 3 Probe (electrical connecting device probe) 11 Foot portion 11a Joint portion 12 Arm support portion 12a Support member 12a1 First support member 12a2 Second support member 12b Oblique side member 12c Connection member 12d Bottom side member 13 Arm portion 13a Arm 13b Tip member 13c Contact portion
Claims
1. A probe for an electrical connection device comprising: a foot portion having an elongated shape extending in a first direction and having a joint portion to be joined to a probe base plate; an arm support portion including a support member extending in a direction intersecting the first direction near one end of the foot portion and a hypotenuse member connecting an arbitrary point on the support member to a point between the other end or the center of the foot portion; and an arm portion of a cantilever structure having a fixed end and a free end, a contact portion formed at the tip of the free end that contacts an object to be tested, and the fixed end connected to the arm support portion.
2. The probe for an electrical connecting device according to claim 1, wherein the oblique side member is connected to the center of the foot portion.
3. The probe for electrical connecting devices according to claim 1, wherein the oblique side member is connected to the other end of the foot portion.
4. The probe for electrical connecting devices according to any one of claims 1 to 3, wherein the width of the oblique side member gradually increases from the central portion toward the connection point of the foot portion.
Citation Information
Patent Citations
Probe and electrical connection apparatus
JP2008175762A
Probe, and method for manufacturing the same
JP2009276120A
Electric contact and electrical connection device
JP2021028603A
