Heat exchange device having separate evaporators, and heat exchange system

Abstract

The present application provides a heat exchange device having separate evaporators. The heat exchange device comprises a condenser, a high-temperature evaporator, a low-temperature evaporator and a compressor; the high-temperature evaporator and the low-temperature evaporator are spaced apart from each other and communicated with each other; the compressor is communicated with the high-temperature evaporator and the condenser; the compressor is used for boosting the pressure of a refrigerant flowing out of the high-temperature evaporator and then conveying the refrigerant to the condenser; and the condenser is used for cooling the refrigerant and then conveying the refrigerant to the low-temperature evaporator. According to the heat exchange device of the present application, by providing the high-temperature evaporator and the low-temperature evaporator spaced apart from each other, the refrigerant in the heat exchange device flows into the compressor after being subjected to heat exchange twice, thereby effectively reducing the liquid slugging risk. The present application further provides a heat exchange system.

Description

Heat exchange equipment and heat exchange system of split evaporator Technical Field

[0001] The present application relates to the field of heat exchange systems, and in particular to a heat exchange device of a split evaporator and a heat exchange system. Background Art

[0002] Equipment in outdoor cabinets or computer rooms generates a significant amount of heat during continuous operation. This continued temperature increase can affect the efficiency of the equipment inside. To ensure continuous and stable operation of equipment in outdoor cabinets or computer rooms, heat exchangers are typically installed within the cabinets and computer rooms to dissipate heat.

[0003] Heat exchangers are equipped with compressors, which pressurize the refrigerant inside the heat exchanger to circulate it and improve its heat dissipation efficiency. To ensure proper operation, the refrigerant must enter the compressor in a gaseous state to avoid the risk of liquid hammer caused by liquid refrigerant entering the compressor.

[0004] Summary of the Invention

[0005] The purpose of the present application is to provide a heat exchange device with high refrigeration efficiency and capable of avoiding the risk of liquid hammer, and a heat exchange system having the heat exchange device.

[0006] In the first aspect, the present application provides a heat exchange device with a split evaporator, which includes a condenser, a high-temperature evaporator, a low-temperature evaporator and a compressor. The high-temperature evaporator and the low-temperature evaporator are arranged at intervals and are connected. The compressor is connected to the high-temperature evaporator and the condenser. The compressor is used to increase the pressure of the refrigerant flowing out of the high-temperature evaporator and then transport it to the condenser. The condenser is used to cool the refrigerant and then transport it to the low-temperature evaporator.

[0007] The heat exchanger of this application is interconnected by a condenser, a high-temperature evaporator, a low-temperature evaporator, and a compressor, which can drive the refrigerant to circulate in different states within the heat exchanger. The refrigerant can dissipate heat with the outdoor air in the condenser and then exchange heat with the indoor air twice in the high-temperature evaporator and the low-temperature evaporator, thus achieving the cooling and heat dissipation functions of the heat exchanger.

[0008] The heat exchange device of the present application is able to form a double heat exchange effect with the indoor air by setting a low-temperature evaporator and a high-temperature evaporator that are spaced apart and connected, so as to make the heat exchange between the refrigerant and the indoor air more complete. The refrigerant transported from the condenser to the low-temperature evaporator is in liquid state. After the liquid refrigerant forms heat exchange with the indoor air in the low-temperature evaporator and the high-temperature evaporator, it can be completely converted into gaseous state and flow out of the high-temperature evaporator into the compressor. The heat exchange device of the present application is able to ensure full contact between the refrigerant and the indoor air, so that the refrigerant entering the compressor is in gaseous state, which forms a protective effect on the compressor and avoids the risk of liquid hammer in the compressor.

[0009] In a possible implementation, the outlet of the high-temperature evaporator is higher than the inlet of the high-temperature evaporator along the gravity direction.

[0010] In this implementation, the gaseous refrigerant in the high-temperature evaporator flows upward along the direction of gravity. By setting the outlet of the high-temperature evaporator higher than the inlet of the high-temperature evaporator along the direction of gravity, it is possible to ensure that the refrigerant flowing out of the outlet of the high-temperature evaporator is gaseous, and avoid liquid refrigerant flowing out of the outlet of the high-temperature evaporator.

[0011] In a possible implementation, the outlet of the low-temperature evaporator is higher than the inlet of the low-temperature evaporator along the gravity direction.

[0012] In this implementation, the refrigerant in the low-temperature evaporator is in a gaseous state or a gas-liquid mixed state after heat exchange, wherein the gaseous or gas-liquid mixed refrigerant flows upward along the direction of gravity. By setting the outlet of the low-temperature evaporator higher than the inlet of the low-temperature evaporator along the direction of gravity, it can be ensured that the refrigerant flowing out of the outlet of the low-temperature evaporator is in a gaseous state or a gas-liquid mixed state, thereby preventing liquid refrigerant from flowing out of the outlet of the low-temperature evaporator.

[0013] In one possible implementation, the heat exchange device includes a connected auxiliary condenser and an auxiliary evaporator, the auxiliary evaporator is thermally coupled to the low-temperature evaporator or the high-temperature evaporator, and the auxiliary condenser is used to cool the refrigerant flowing out of the auxiliary evaporator.

[0014] In this implementation, by connecting the auxiliary condenser to the auxiliary evaporator, an independent refrigerant circulation loop can be formed between the auxiliary condenser and the auxiliary evaporator, so that the refrigerant circulating between the auxiliary condenser and the auxiliary evaporator can independently achieve the effect of cooling and heat dissipation, further improving the cooling efficiency of the heat exchange equipment. By thermally coupling the auxiliary evaporator to the low-temperature evaporator or the high-temperature evaporator, the refrigerant in the auxiliary evaporator can form a heat exchange with the refrigerant in the low-temperature evaporator or the high-temperature evaporator, thereby increasing the temperature of the refrigerant in the low-temperature evaporator or the high-temperature evaporator and ensuring that the refrigerant entering the compressor is in a gaseous state, thereby protecting the compressor.

[0015] In a possible implementation, the outlet of the auxiliary condenser is higher than the inlet of the auxiliary evaporator along the direction of gravity.

[0016] In this implementation, since the auxiliary condenser and the auxiliary evaporator are connected and can form an independent refrigerant circulation loop, the auxiliary condenser and the auxiliary evaporator can operate in independent heat dissipation modes. Among them, the outlet of the auxiliary condenser is higher than the inlet of the auxiliary evaporator in the direction of gravity, so that the liquid refrigerant flowing out of the auxiliary condenser can flow into the inlet of the auxiliary evaporator under the action of gravity. After the refrigerant in the auxiliary evaporator is heated and vaporized, it can flow into the auxiliary condenser against the direction of gravity to dissipate heat and be converted into liquid. Therefore, the refrigerant circulates between the auxiliary condenser and the auxiliary evaporator based on gravity, so that the heat exchange equipment of this application also has the function of passive heat dissipation, thereby reducing energy consumption and saving resources.

[0017] Because the auxiliary evaporator's inlet is lower than the auxiliary condenser's outlet in the direction of gravity, the liquid refrigerant in the auxiliary condenser flows into the auxiliary evaporator under the influence of gravity and accumulates there. When the compressor starts, the liquid refrigerant accumulated in the auxiliary evaporator can fully exchange heat with the indoor air, evaporating and converting to a gaseous state before flowing out of the auxiliary evaporator's outlet. In other words, the auxiliary condenser's outlet is higher than the auxiliary evaporator's inlet in the direction of gravity, which improves the heat exchange efficiency of the heat exchanger to the indoor air when the compressor starts, and improves the operating stability of the heat exchanger when switching to cooling mode.

[0018] In one possible implementation, the heat exchange device includes two auxiliary condensers and two auxiliary evaporators. The two auxiliary condensers are arranged at intervals, and each auxiliary condenser is connected to an auxiliary evaporator. One auxiliary evaporator is thermally coupled to the high-temperature evaporator, and the other auxiliary evaporator is thermally coupled to the low-temperature evaporator.

[0019] In this implementation, an auxiliary condenser is connected to an auxiliary evaporator, forming an independent refrigerant circulation loop. Two independent refrigerant circulation loops can improve the heat exchange efficiency of the heat exchange equipment when operating in passive cooling mode. When the compressor is operating, the two auxiliary evaporators are thermally coupled to the high-temperature evaporator and the low-temperature evaporator, respectively, raising the refrigerant temperature in these two evaporators, further ensuring that the refrigerant entering the compressor is in a gaseous state, thus protecting the compressor.

[0020] In a possible implementation, the condenser includes a high-temperature condenser and a low-temperature condenser that are connected to each other, and the high-temperature condenser and the low-temperature condenser are respectively thermally coupled to an auxiliary condenser.

[0021] In this implementation, the refrigerant can form a double heat exchange effect with the outdoor air in the low-temperature condenser and the high-temperature condenser, making the heat exchange between the refrigerant and the outdoor air more sufficient, and can further improve the heat dissipation efficiency of the refrigerant in the condenser.

[0022] In a possible implementation, two auxiliary condensers are arranged at intervals, one of the auxiliary condensers is thermally coupled to the high-temperature condenser, and the other auxiliary condenser is thermally coupled to the low-temperature condenser.

[0023] In this implementation, the two auxiliary condensers are thermally coupled to the high-temperature condenser and the low-temperature condenser respectively, which can improve the cooling efficiency of the heat exchange device of this application.

[0024] In a possible implementation, the outlet of the high-temperature condenser is lower than the inlet of the high-temperature condenser along the direction of gravity.

[0025] In this implementation, the refrigerant fed from the compressor to the condenser is in gaseous form. The gaseous refrigerant undergoes heat exchange with the outdoor air within the high-temperature condenser, cooling it and converting it to a liquid or gas-liquid mixture. By positioning the high-temperature condenser outlet below the high-temperature condenser inlet, the liquid or gas-liquid mixture flows out from the bottom of the high-temperature condenser.

[0026] In a possible implementation, the outlet of the low-temperature condenser is lower than the inlet of the low-temperature condenser along the direction of gravity.

[0027] In this implementation, the refrigerant in the low-temperature condenser is converted into liquid after cooling. By setting the outlet of the low-temperature condenser lower than the inlet of the low-temperature condenser in the direction of gravity, the liquid refrigerant flows out from the bottom of the low-temperature condenser.

[0028] In one possible implementation, the two auxiliary evaporators include a split auxiliary evaporator, which includes a first part and a second part that are connected, and the first part and the second part are arranged at intervals along the arrangement direction of the high-temperature evaporator and the low-temperature evaporator, wherein: when the split auxiliary evaporator is thermally coupled with the high-temperature evaporator, the first part of the split auxiliary evaporator is thermally coupled with the high-temperature evaporator.

[0029] In this implementation, by setting the first part of the split auxiliary evaporator to be thermally coupled with the high-temperature evaporator, thermal coupling is formed between the split auxiliary evaporator and the high-temperature evaporator, further increasing the temperature of the high-temperature evaporator to ensure that the refrigerant entering the compressor is in a gaseous state.

[0030] In one possible implementation, the two auxiliary evaporators include a split auxiliary evaporator, which includes a first part and a second part that are connected, and the first part and the second part are arranged at intervals along the arrangement direction of the high-temperature evaporator and the low-temperature evaporator, wherein: when the split auxiliary evaporator is thermally coupled with the low-temperature evaporator, the second part of the split auxiliary evaporator is thermally coupled with the low-temperature evaporator.

[0031] In this implementation, by providing the second part of the split auxiliary evaporator to be thermally coupled with the low-temperature evaporator, the temperature of the low-temperature evaporator is further increased to ensure that the refrigerant entering the high-temperature evaporator is mostly in gaseous state.

[0032] In one possible implementation, the two auxiliary condensers include a split auxiliary condenser, and the split auxiliary condenser includes a third part and a fourth part that are connected. The third part and the fourth part are arranged at intervals along the arrangement direction of the high-temperature condenser and the low-temperature condenser, wherein: when the split auxiliary condenser is thermally coupled with the high-temperature condenser, the third part of the split auxiliary condenser is thermally coupled with the high-temperature condenser.

[0033] In one possible implementation, the two auxiliary condensers include a split auxiliary condenser, and the split auxiliary condenser includes a third part and a fourth part that are connected. The third part and the fourth part are arranged at intervals along the arrangement direction of the high-temperature condenser and the low-temperature condenser, wherein: when the split auxiliary condenser is thermally coupled with the low-temperature condenser, the fourth part of the split auxiliary condenser is thermally coupled with the low-temperature condenser.

[0034] In a possible implementation, the high-temperature evaporator and the low-temperature evaporator are arranged in a direction parallel to the flow direction of indoor air in the heat exchange device, and the high-temperature evaporator is located in front of the low-temperature evaporator.

[0035] In this implementation, a high-temperature evaporator and a low-temperature evaporator are spaced apart along the flow direction of the indoor air in the heat exchange device, with the high-temperature evaporator positioned in front of the low-temperature evaporator. This allows the indoor air to flow through the high-temperature evaporator and then through the low-temperature evaporator, achieving a double heat exchange and cooling effect. The indoor air first flows through the high-temperature evaporator, where its temperature decreases, before flowing through the low-temperature evaporator. At this point, the refrigerant temperature in the high-temperature evaporator is higher than that in the low-temperature evaporator, ensuring that the refrigerant in the high-temperature evaporator is fully evaporated into a gaseous state before being transported from the high-temperature evaporator's outlet to the compressor.

[0036] In a possible implementation, the high-temperature condenser and the low-temperature condenser are arranged in a direction parallel to the flow direction of outdoor air in the heat exchange device, and the low-temperature condenser is located in front of the high-temperature condenser.

[0037] In this implementation, a high-temperature condenser and a low-temperature condenser are spaced apart along the flow direction of the outdoor air within the heat exchange device, and the low-temperature condenser is located in front of the high-temperature condenser. This allows the outdoor air to flow through the low-temperature condenser and then the high-temperature condenser, creating a double heat exchange and heat dissipation effect. The outdoor air first flows through the low-temperature condenser, where its temperature rises, and then flows through the high-temperature condenser. At this point, the refrigerant temperature within the low-temperature condenser is lower than that within the high-temperature condenser, ensuring that the refrigerant within the low-temperature condenser is cooled and converted to liquid before being transported from the outlet of the low-temperature condenser to the low-temperature evaporator.

[0038] In one possible implementation, the auxiliary evaporator thermally coupled to the high temperature evaporator communicates with the auxiliary condenser thermally coupled to the high temperature condenser, and the auxiliary evaporator thermally coupled to the low temperature evaporator communicates with the auxiliary condenser thermally coupled to the low temperature condenser.

[0039] In this implementation, an independent high-temperature refrigerant circulation loop is formed between an auxiliary evaporator thermally coupled to the high-temperature evaporator and an auxiliary condenser thermally coupled to the high-temperature condenser. The auxiliary condenser exchanges heat with relatively high-temperature outdoor air, while the auxiliary evaporator exchanges heat with relatively high-temperature indoor air, resulting in a relatively high average refrigerant temperature within the refrigerant circulation loop. An independent low-temperature refrigerant circulation loop is formed between an auxiliary evaporator thermally coupled to the low-temperature evaporator and an auxiliary condenser thermally coupled to the low-temperature condenser. The auxiliary condenser exchanges heat with relatively low-temperature outdoor air, while the auxiliary evaporator exchanges heat with relatively low-temperature indoor air, resulting in a relatively low average refrigerant temperature within the refrigerant circulation loop.

[0040] As a result, on both the high-temperature and low-temperature evaporators, the refrigerant temperature in the auxiliary evaporator thermally coupled to the low-temperature evaporator is relatively low, while the refrigerant temperature in the auxiliary evaporator thermally coupled to the high-temperature evaporator is relatively high. The refrigerant temperature in the low-temperature evaporator is also correspondingly lower than that in the high-temperature evaporator. The higher refrigerant temperature in the high-temperature evaporator ensures that the refrigerant fully evaporates and converts to a gaseous state within the high-temperature evaporator, preventing the risk of liquid hammer in the compressor.

[0041] In one possible implementation, the high-temperature evaporator, the low-temperature evaporator, and the auxiliary evaporator each include a plurality of heat exchange plates arranged at intervals along a direction perpendicular to the arrangement of the high-temperature evaporator and the low-temperature evaporator, wherein: when the auxiliary evaporator is thermally coupled with the high-temperature evaporator, the heat exchange plate of any auxiliary evaporator is thermally coupled with the heat exchange plate of at least one high-temperature evaporator.

[0042] In this implementation, the staggered arrangement of multiple heat exchange plates can increase the heat exchange area between the indoor air and each refrigerant, thereby improving the heat exchange efficiency of the heat exchange equipment. Thermally coupling the heat exchange plates of an auxiliary evaporator with the heat exchange plates of at least one high-temperature evaporator creates a better thermal coupling effect between the auxiliary evaporator and the high-temperature evaporator, reducing the refrigerant temperature difference between the high-temperature evaporator and the thermally coupled auxiliary evaporator.

[0043] In one possible implementation, along a direction perpendicular to the arrangement of the high-temperature evaporator and the low-temperature evaporator, the high-temperature evaporator, the low-temperature evaporator and the auxiliary evaporator respectively include multiple heat exchange plates arranged at intervals, wherein: when the auxiliary evaporator is thermally coupled with the low-temperature evaporator, the heat exchange plate of any auxiliary evaporator is thermally coupled with the heat exchange plate of at least one low-temperature evaporator.

[0044] In this implementation, by arranging the heat exchange plate of any auxiliary evaporator to be thermally coupled with the heat exchange plate of at least one low-temperature evaporator, the auxiliary evaporator and the low-temperature evaporator can be thermally coupled to form heat exchange between the auxiliary evaporator and the low-temperature evaporator.

[0045] In one possible implementation, when the auxiliary evaporator is thermally coupled with the high-temperature evaporator, multiple heat exchange plates of the auxiliary evaporator and multiple heat exchange plates of the high-temperature evaporator are arranged alternately along a direction perpendicular to the arrangement of the high-temperature evaporator and the low-temperature evaporator, and the heat exchange plates of any auxiliary evaporator are at least partially attached to the heat exchange plates of a high-temperature evaporator to form thermal coupling.

[0046] In one possible implementation, when thermally coupling the auxiliary evaporator to the low-temperature evaporator, the auxiliary evaporator's multiple heat exchange plates are arranged alternately with the low-temperature evaporator's multiple heat exchange plates in a direction perpendicular to the arrangement of the high-temperature and low-temperature evaporators. A heat exchange plate of any auxiliary evaporator is at least partially abutted against a heat exchange plate of the low-temperature evaporator to form thermal coupling. This increases the contact area between the auxiliary evaporator's heat exchange plates and the high-temperature evaporator's, and between the auxiliary evaporator's heat exchange plates and the low-temperature evaporator's, resulting in a better thermal coupling effect.

[0047] In one possible implementation, the heat exchange device includes multiple groups of heat sinks, multiple heat sinks in each group are arranged at intervals along a direction perpendicular to the arrangement of the multiple heat exchange plates, and each group of heat sinks is connected between two adjacent heat exchange plates.

[0048] In this implementation, the heat dissipation fins can further increase the contact area between the heat exchange device and the indoor and / or outdoor air, thereby improving the heat exchange efficiency of the heat exchange device. Furthermore, the heat dissipation fins can also facilitate heat conduction between the heat exchange plates, thereby improving the thermal coupling effect between the heat exchange plates.

[0049] In one possible implementation, the heat exchange device includes an electronic expansion valve, which is connected between the condenser and the low-temperature evaporator. The electronic expansion valve is used to reduce the pressure of the refrigerant transported from the condenser to the low-temperature evaporator.

[0050] In this implementation, by setting an electronic expansion valve connected between the condenser and the low-temperature evaporator, the high-pressure liquid refrigerant transported from the condenser to the low-temperature evaporator can be depressurized to lower the boiling point of the refrigerant, ensuring that the liquid refrigerant can exchange heat with the indoor air in the low-temperature evaporator to cool the indoor air, further improving the refrigeration efficiency of the heat exchange equipment of this application.

[0051] On the second aspect, the present application also provides a heat exchange system, including a containment chamber, a heat source and a heat exchange device as described in any of the above implementation methods, wherein the heat source is located in the containment chamber, the high-temperature evaporator and the low-temperature evaporator in the heat exchange device are connected to the containment chamber, and the heat exchange device is used to dissipate heat from the heat source.

[0052] When the heat source is located in the receiving room, a large amount of heat will continue to be generated in the receiving room, causing the temperature in the receiving room to continue to rise. The heat exchange system of the present application connects the high-temperature evaporator and the low-temperature evaporator in the heat exchange equipment with the receiving room, so that the liquid refrigerant in the high-temperature evaporator and the low-temperature evaporator absorbs the heat in the receiving room during the process of evaporating into a gaseous state, and then can take away the heat in the receiving room to dissipate the heat from the heat source in the receiving room. At the same time, through the cooperation between the high-temperature evaporator and the low-temperature evaporator, a double heat exchange effect can be formed with the indoor air, making the heat exchange between the refrigerant and the indoor air more sufficient, further improving the heat dissipation efficiency of the heat exchange system of the present application for the heat source.

[0053] The heat exchange system of the present application has all the possible beneficial effects of the heat exchange equipment in any of the above implementations because it has the heat exchange equipment in any of the above implementations.

[0054] In a possible implementation, the heat exchange system is a cabinet, a container, or a data center. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] FIG1 is a schematic structural diagram of a heat exchange system provided in a possible embodiment of the present application from a side perspective;

[0056] FIG2a is a schematic structural diagram of a heat exchange system provided in a possible embodiment of the present application from a side perspective;

[0057] FIG2 b is a schematic structural diagram of a heat exchange system provided in a possible embodiment of the present application from a side perspective;

[0058] FIG3 is a schematic diagram of the internal structure of a heat exchange device provided in a possible embodiment of the present application;

[0059] FIG4 is a schematic diagram of the internal structure of a heat exchange device provided in a possible embodiment of the present application;

[0060] FIG5 is a schematic diagram of the internal structure of a heat exchange device provided in a possible embodiment of the present application;

[0061] FIG6 is a schematic diagram of the internal structure of a heat exchange device provided in a possible embodiment of the present application;

[0062] FIG7 is a schematic diagram of the internal structure of a heat exchange device provided in a possible embodiment of the present application;

[0063] FIG8 is a schematic diagram of the internal structure of a heat exchange device provided in a possible embodiment of the present application;

[0064] FIG9 is a schematic diagram of the internal structure of a heat exchange device provided in a possible embodiment of the present application;

[0065] FIG10 is a schematic diagram of the internal structure of a heat exchange device provided in a possible embodiment of the present application;

[0066] FIG11 is a schematic diagram of the internal structure of the heat exchange device provided in the embodiment shown in FIG7 of the present application from a side perspective;

[0067] FIG12 is a schematic structural diagram of a heat exchange plate from one side in a possible embodiment of the present application;

[0068] FIG13 is a schematic structural diagram of a heat exchange plate from a side perspective provided in another possible embodiment of the present application. DETAILED DESCRIPTION

[0069] The following will describe the technical solutions in the embodiments of this application in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of this application.

[0070] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" mentioned in this application includes direct and indirect connections unless otherwise specified. In the description of this application, it should be understood that the orientation or position relationship indicated by the terms "upper", "lower", "front", "back", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0071] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above" or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below" or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0072] The present application provides a heat exchange device with a split evaporator. The heat exchange device includes a condenser, a high-temperature evaporator, a low-temperature evaporator, and a compressor. The high-temperature evaporator and the low-temperature evaporator are arranged in a spaced-apart and interconnected manner. The compressor is connected to the high-temperature evaporator and the condenser. The compressor is used to increase the pressure of the refrigerant flowing out of the high-temperature evaporator and then transport it to the condenser. The condenser is used to cool the refrigerant and then transport it to the low-temperature evaporator. In the heat exchange device of the present application, the refrigerant is fully in contact with the indoor air, ensuring that the refrigerant entering the compressor is in a gaseous state, thus providing a protective effect on the compressor and avoiding the risk of liquid hammer in the compressor.

[0073] The present application provides a heat exchange system, including a receiving chamber, a heat source and the above-mentioned heat exchange equipment. The heat source is located in the receiving chamber, and the high-temperature evaporator and the low-temperature evaporator in the heat exchange equipment are connected to the receiving chamber. The heat exchange equipment is used to dissipate heat from the heat source.

[0074] Please refer to Figure 1, which is a schematic diagram of the structure of a heat exchange system 300 provided in one possible embodiment of the present application from a side perspective. As shown in Figure 1, the heat exchange system 300 of the present application includes a containment chamber 310, a heat source 320, and a heat exchange device 200. The heat exchange device 200 is the heat exchange device provided simultaneously with the present application.

[0075] The heat exchange device 200 includes a refrigeration component and a heat dissipation component. The refrigeration component is used to realize the cooling function of the heat exchange device 200, and the heat dissipation component is used to realize the heat dissipation function of the heat exchange device 200. The refrigeration component is connected to the receiving chamber 310 (in the schematic diagram of Figure 1, the heat exchange device 200 is provided with an internal circulation chamber 201 for accommodating the refrigeration component), and the heat dissipation component is connected to the outside world (in the schematic diagram of Figure 1, the heat exchange device 200 is provided with an external circulation chamber 202 for accommodating the heat dissipation component).

[0076] The heat source 320 is located in the receiving chamber 310. The heat source 320 generates heat when it is working. When the heat source 320 is located in the receiving chamber 310, a large amount of heat will be continuously generated in the receiving chamber 310, causing the temperature in the receiving chamber 310 to continue to rise.

[0077] The heat exchange device 200 is used to cool and dissipate heat from the heat source 320. Specifically, in the embodiment shown in FIG1 , the containment chamber 310 is connected to the internal circulation chamber 201. The heat exchange device 200 drives the relatively high-temperature indoor air in the containment chamber 310 into the internal circulation chamber 201, where the relatively high-temperature indoor air exchanges heat with the refrigeration components within the internal circulation chamber 201.

[0078] That is, the refrigeration component cools and dissipates heat from the indoor air, thereby cooling and lowering the temperature of the relatively high indoor air. After the refrigeration component cools and lowers the temperature of the indoor air, the indoor air temperature decreases and flows back into the storage chamber 310 to exchange heat with the heat source 320, thereby cooling and dissipating heat from the heat source 320. This achieves the heat dissipation effect of the heat exchange device 200 of the present application.

[0079] Specifically, the inner circulation cavity 201 is provided with an indoor air inlet and an indoor air outlet facing the heat source 320. The indoor air inlet and the indoor air outlet are respectively arranged opposite the containment chamber 310. The containment chamber 310 realizes air circulation with the inner circulation cavity 201 through the indoor air inlet and the indoor air outlet.

[0080] The indoor air with a relatively high temperature in the receiving chamber 310 can flow into the inner circulation chamber 201 from the indoor air inlet, and flow out of the inner circulation chamber 201 from the indoor air outlet after heat exchange with the heat exchange device 200 in the inner circulation chamber 201.

[0081] An outdoor air inlet and an outdoor air outlet are provided on the side of the external circulation chamber 202 away from the heat source 320. The outdoor air inlet and the outdoor air outlet are set toward the outside and connected to the outside to realize air circulation between the external circulation chamber 202 and the outside.

[0082] That is, outdoor air from outside the cabinet or outside the computer room can flow into the external circulation cavity 202 from the outdoor air inlet, and flow out of the external circulation cavity 202 from the outdoor air outlet after heat exchange with the heat exchange device 200 in the external circulation cavity 202.

[0083] The heat exchange device 200 may be fixed on the receiving chamber 310 .

[0084] For example, in one possible embodiment, a hole may be opened on the side wall of the receiving chamber 310 for inserting the heat exchange device 200 into the hole, so that the heat exchange device 200 can be fixed to the side wall of the receiving chamber 310. By fixing the heat exchange device 200 to the side wall of the receiving chamber 310, the overall volume of the heat exchange system 300 can be reduced.

[0085] In one embodiment, the heat exchange system 300 may be, but is not limited to, a cabinet, a container, or a data center.

[0086] For example, in a possible embodiment, when the heat exchange system 300 is a cabinet, the receiving chamber 310 may be a shell of the cabinet, and the heat exchange device 200 may be fixedly installed on the cabinet shell.

[0087] In one embodiment, the heat source 320 may be, but is not limited to, a server, a baseband processing unit, a lithium battery, or a power supply.

[0088] For example, in one possible embodiment, heat exchange system 300 is a cabinet, and heat source 320 may be a server located within the cabinet. The server continuously generates a large amount of heat during operation, which accumulates within the cabinet, causing the ambient temperature within the cabinet to continuously rise. Prolonged operation of the server in a high-temperature environment can affect its normal performance, resulting in reduced performance, shortened service life, and even possible server downtime or damage.

[0089] By being equipped with the heat exchange device 200 of the present application, the cabinet can achieve a cooling and heat dissipation effect inside the cabinet to reduce the temperature inside the cabinet, that is, reduce the working environment temperature of the server, thereby enabling the server to operate in a suitable temperature environment.

[0090] It should be noted that in the embodiment shown in FIG1 , the heat exchange device 200 of the present application is fixedly mounted on the side wall of the receiving chamber 310 for illustrative purposes only, but the arrangement position between the heat exchange device 200 of the present application and the receiving chamber 310 is not limited to this. In other embodiments of the present application, the heat exchange device 200 may be arranged outside the receiving chamber 310, or the heat exchange device 200 may be fixedly mounted inside the receiving chamber 310. In other words, the specific arrangement position of the heat exchange device 200 relative to the receiving chamber 310 can be set based on the actual working scenario and heat exchange requirements of the heat exchange system 300, and this application does not specifically limit this.

[0091] For example, in one possible embodiment, please refer to Figure 2a, which is a schematic structural diagram of a heat exchange system 300 provided in this application from a side perspective. As shown in Figure 2a, the heat exchange device 200 is located outside the containment chamber 310, and a first air duct 203 is provided between the heat exchange device 200 and the containment chamber 310. The first air duct 203 connects the inner circulation chamber 201 of the heat exchange device 200 and the containment chamber 310, thereby enabling airflow exchange between the inner circulation chamber 201 and the containment chamber 310.

[0092] The outer circulation chamber 202 of the heat exchange device 200 may be provided with an opening connected to the outside, and the air flow exchange between the outer circulation chamber 202 and the outside can be achieved through the opening.

[0093] When the heat exchange device 200 is located outside the receiving chamber 310 , it can be used in a heat exchange system 300 with a smaller size.

[0094] For example, see Figure 2b, which is a schematic diagram of the structure of a heat exchange system 300 provided in one possible embodiment of the present application from a side perspective. As shown in Figure 2b, the heat exchange device 200 is located within a containment chamber 310. The inner circulation chamber 201 of the heat exchange device 200 is connected to the containment chamber 310, and the outer circulation chamber 202 of the heat exchange device 200 is connected to the outside of the room via a second air duct 204, enabling airflow exchange between the outer circulation chamber 202 and the outside air.

[0095] When the heat exchange device 200 is located inside the receiving chamber 310 , it can be applied to a heat exchange system 300 of a larger size.

[0096] It should be noted that in the embodiments shown in Figures 1 to 2b, only one heat exchange device 200 is set in the heat exchange system 300 for illustrative introduction, but the number of heat exchange devices 200 set in the heat exchange system 300 is not limited to this.

[0097] For example, in a possible embodiment, a data center has multiple servers, and when multiple servers are in operation at the same time, more heat is generated. In this case, multiple heat exchange devices 200 can be arranged in the data center according to actual needs to enhance heat dissipation within the data center.

[0098] For example, in a possible embodiment, when the heat exchange system 300 is a cabinet or a container, the number of heat exchange devices 200 can also be adjusted according to the actual structural size of the cabinet or container, the actual application scenario, etc., to meet the heat dissipation requirements of the cabinet or container and ensure the working performance and service life of the heat source 320 in the cabinet or container.

[0099] In the following description, for ease of description and clarity, the relatively high-temperature air inside the containment chamber 310, i.e., the relatively high-temperature indoor air after heat exchange with the heat source 320, will be referred to as "indoor air." The outdoor air flowing into the external circulation chamber 202 from outside the cabinet or the computer room will be referred to as "outdoor air."

[0100] The heat exchange device 200 provided in this application will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0101] Please refer to Figure 3, which is a schematic diagram of the internal structure of a heat exchange device 200 provided in one possible embodiment of the present application. The heat exchange device 200 of the present application includes a condenser 10, a low-temperature evaporator 20, a high-temperature evaporator 30, and a compressor 40. The condenser 10 can be understood as the heat dissipation component of the heat exchange device 200, while the low-temperature evaporator 20 and the high-temperature evaporator 30 can be understood as the refrigeration components of the heat exchange device 200.

[0102] Specifically, as shown in FIG3 , the low-temperature evaporator 20 and the high-temperature evaporator 30 are arranged at intervals and are connected, the compressor 40 is connected between the high-temperature evaporator 30 and the condenser 10 , and the condenser 10 is connected between the compressor 40 and the low-temperature evaporator 20 .

[0103] Refrigerant circulates within the heat exchange device 200. Specifically, in the embodiment shown in FIG3 , the condenser 10, the low-temperature evaporator 20, the high-temperature evaporator 30, and the compressor 40 collectively form a refrigerant circulation loop of "condenser 10 → low-temperature evaporator 20 → high-temperature evaporator 30 → compressor 40 → condenser 10." The refrigerant circulates within the refrigerant circulation loop in various states. For ease of description, this specification defines the refrigerant circulation loop formed by "condenser 10 → low-temperature evaporator 20 → high-temperature evaporator 30 → compressor 40 → condenser 10" as the first loop L1, hereinafter referred to as "first loop L1."

[0104] The condenser 10, low-temperature evaporator 20, high-temperature evaporator 30 and compressor 40 in the first loop L1 can be connected to each other by pipelines, but are not limited to them, so that the refrigerant circulating in the heat exchange equipment 200 can be transported to the functional structural parts through the pipelines. For example, the refrigerant can be transported from the compressor 40 to the condenser 10 through the pipeline, or the refrigerant can be transported from the condenser 10 to the low-temperature evaporator 20.

[0105] That is, by setting up pipelines, the condenser 10, the low-temperature evaporator 20, the high-temperature evaporator 30 and the compressor 40 can be connected to each other, so that the refrigerant can circulate in the heat exchange device 200, thereby realizing the cooling and heat dissipation function of the heat exchange device 200 of this application.

[0106] As shown in Figure 3 , the compressor 40 is used to provide driving force for the refrigerant to drive the refrigerant to circulate in the first loop L1. Specifically, the compressor 40 is used to increase the pressure of the refrigerant and transport the refrigerant to the condenser 10 in a gaseous state.

[0107] The gaseous refrigerant exchanges heat with the outdoor air in condenser 10. Because the refrigerant's pressure is higher, its temperature is also higher than the outdoor air's. After exchanging heat with the outdoor air in condenser 10, the refrigerant's temperature decreases and condenses into a liquid or a gas-liquid mixture. The refrigerant is then transferred from condenser 10 to low-temperature evaporator 20.

[0108] As shown in FIG3 , the condenser 10 is connected between the compressor 40 and the low-temperature evaporator 20 . The condenser 10 is used to cool the refrigerant and to transport the cooled refrigerant to the low-temperature evaporator 20 connected thereto.

[0109] The refrigerant flowing between the compressor 40 and the condenser 10 is in a gaseous state. When the compressor 40 delivers the gaseous refrigerant to the condenser 10, the temperature of the gaseous refrigerant decreases and it cools and condenses into a liquid or a gas-liquid mixture within the condenser 10. The refrigerant is then delivered from the condenser 10 to the low-temperature evaporator 20. During the condensation process, the refrigerant releases heat, which is then removed by the outdoor air flowing into the condenser 10, dissipating the heat from the refrigerant.

[0110] That is, when the gaseous refrigerant flowing out of the compressor 40 circulates into the condenser 10, it can form a heat exchange with the outdoor air flowing into the condenser 10. That is, the gaseous refrigerant releases heat, its own temperature drops, and condenses into a liquid state. The outdoor air flows into the condenser 10 and carries away the heat released during the cooling process of the refrigerant in the condenser 10. When the outdoor air flows out of the condenser 10, it also carries away the heat released by the refrigerant, thereby achieving the effect of the condenser 10 cooling the refrigerant.

[0111] As shown in FIG3 , the low-temperature evaporator 20 and the high-temperature evaporator 30 are arranged at intervals and connected to each other. The low-temperature evaporator 20 is connected between the condenser 10 and the high-temperature evaporator 30 , and the high-temperature evaporator 30 is connected between the low-temperature evaporator 20 and the compressor 40 .

[0112] The refrigerant delivered to the low-temperature evaporator 20 exchanges heat with the indoor air within the low-temperature evaporator 20. At this point, the refrigerant's temperature is lower than the indoor air's. Therefore, after the refrigerant exchanges heat with the indoor air within the low-temperature evaporator 20, it cools the indoor air. The cooled indoor air is then returned to the receiving chamber 310, achieving the heat dissipation effect of the heat exchange device 200 of the present application from the heat source 320 within the receiving chamber 310 via the first loop L1.

[0113] After the refrigerant in the low-temperature evaporator 20 has increased in temperature, it is transported to the high-temperature evaporator 30. The refrigerant can exchange heat with the indoor air again in the high-temperature evaporator 30. In other words, the refrigerant exchanges heat with the indoor air twice, first in the low-temperature evaporator 20 and then in the high-temperature evaporator 30. This allows the refrigerant to fully contact the indoor air, resulting in a better heat dissipation effect.

[0114] Correspondingly, the refrigerant in the low-temperature evaporator 20 and the high-temperature evaporator 30 undergoes two heat exchanges with the indoor air, creating a secondary heat exchange effect, which raises the refrigerant's temperature and converts it into a gaseous state. Specifically, the refrigerant, which has evaporated into a gaseous state or a gas-liquid mixed state in the low-temperature evaporator 20, flows out of the low-temperature evaporator 20 and is transported to the high-temperature evaporator 30. There, it undergoes another sufficient heat exchange with the indoor air and completely evaporates into a gaseous state. The gaseous refrigerant then flows out of the high-temperature evaporator 30 and is transported to the compressor 40.

[0115] In one embodiment, as shown in FIG3 , the heat exchange device 200 includes an electronic expansion valve 50 , which is connected between the condenser 10 and the low-temperature evaporator 20 . The electronic expansion valve 50 is used to reduce the pressure of the refrigerant transported from the condenser 10 to the low-temperature evaporator 20 .

[0116] In this implementation, by setting an electronic expansion valve 50 connected between the condenser 10 and the low-temperature evaporator 20, the high-pressure liquid refrigerant transported from the condenser 10 to the low-temperature evaporator 20 can be reduced in pressure to ensure that the refrigerant is completely converted into liquid under low-pressure conditions, thereby allowing the liquid refrigerant transported to the low-temperature evaporator 20 to form a better heat exchange effect with the indoor air in the low-temperature evaporator 20.

[0117] In the low-temperature evaporator 20 and the high-temperature evaporator 30, the liquid refrigerant exchanges heat with the indoor air, evaporating due to the heat and converting to a gaseous state. This means that the refrigerant in the low-temperature evaporator 20 and the high-temperature evaporator 30 is mostly in a gas-liquid mixed state. This gas-liquid mixed state offers higher heat exchange efficiency, resulting in a better cooling effect on the indoor air. This further enhances the cooling efficiency of the heat exchange device 200 of the present application.

[0118] It should be noted that this application only uses the electronic expansion valve 50 as an example of a throttling device for illustrative purposes, but does not limit the throttling device used to reduce the pressure of the liquid refrigerant in this embodiment of the application to only an electronic expansion valve. In other embodiments of the application, the throttling device used to reduce the pressure of the liquid refrigerant delivered to the low-temperature evaporator 20 may also be, but is not limited to, a capillary tube, a thermal expansion valve, or other structural components.

[0119] In one embodiment, as shown in FIG3 , the arrangement direction of the low-temperature evaporator 20 and the high-temperature evaporator 30 is parallel to the flow direction of the indoor air in the heat exchange device 200 , and the high-temperature evaporator 30 is located in front of the low-temperature evaporator 20 .

[0120] Specifically, after the indoor air with a relatively high temperature flows into the heat exchange device 200, it performs two heat exchanges with the high-temperature evaporator 30 and the low-temperature evaporator 20 in the heat exchange device 200, and then the temperature is reduced before flowing out of the heat exchange device 200.

[0121] In the embodiment shown in Figure 3, when indoor air flows within the heat exchange device 200, it first flows through the high-temperature evaporator 30 and then flows through the low-temperature evaporator 20. The phrase "high-temperature evaporator 30 is located in front of low-temperature evaporator 20" in this specification can be understood to mean that the indoor air first flows to the high-temperature evaporator 30 and then to the low-temperature evaporator 20, and that the high-temperature evaporator 30 exchanges heat with the indoor air before the low-temperature evaporator 20.

[0122] After the indoor air passes through the high-temperature evaporator 30 and the low-temperature evaporator 20 successively, and forms two heat exchanges with the refrigerants in the high-temperature evaporator 30 and the low-temperature evaporator 20 successively, the temperature of the indoor air decreases and flows out of the heat exchange device 200.

[0123] After the first heat exchange between the indoor air and the refrigerant in the high-temperature evaporator 30, the indoor air temperature decreases and the refrigerant temperature in the high-temperature evaporator 30 increases. After the second heat exchange between the cooled indoor air and the refrigerant in the low-temperature evaporator 20, the indoor air temperature further decreases and the refrigerant temperature in the low-temperature evaporator 20 increases.

[0124] As a result, the indoor air flows through the high-temperature evaporator 30 and then the low-temperature evaporator 20, gradually decreasing in temperature. The refrigerant is then delivered to the low-temperature evaporator 20 and then the high-temperature evaporator 30, first exchanging heat with the relatively cool indoor air and then with the relatively warm indoor air. In other words, in this embodiment, the refrigerant evaporates twice, in both the low-temperature evaporator 20 and the high-temperature evaporator 30, and the refrigerant temperature in the low-temperature evaporator 20 is lower than that in the high-temperature evaporator 30.

[0125] After the refrigerant evaporates into a gas or a gas-liquid mixed state through heat exchange with the indoor air at a relatively low temperature in the low-temperature evaporator 20, it is transported to the high-temperature evaporator 30 to form heat exchange with the indoor air at a relatively high temperature again. This can ensure that the refrigerant is completely evaporated into a gas in the high-temperature evaporator 30 and then transported to the compressor 40 from the outlet of the high-temperature evaporator 30.

[0126] It should be noted that, in the embodiment shown in FIG3 , the high-temperature evaporator 30 and the low-temperature evaporator 20 are only used to distinguish the positional difference between the two evaporators connected between the condenser 10 and the compressor 40, that is, the “low temperature” and the “high temperature” are only used to distinguish the arrangement positions of the two evaporators, but do not indicate or limit the existence of differences in the structure, type, function, etc. of the high-temperature evaporator 30 and the low-temperature evaporator 20.

[0127] The heat exchange device 200 of the present application drives the refrigerant to circulate within the first loop L1 via the compressor 40. This allows for a double heat exchange effect on the indoor air via the high-temperature evaporator 30 and the low-temperature evaporator 20, resulting in a more complete heat exchange between the refrigerant and the indoor air, and a better heat dissipation effect on the indoor air. The heat exchange device 200 also uses the condenser 10 to exchange heat between the heated refrigerant and the outdoor air to dissipate heat from the refrigerant, resulting in the first loop L1 actively cooling the heat source 320.

[0128] The refrigerant in the first loop L1 undergoes two heat exchanges with the indoor air in the low-temperature evaporator 20 and the high-temperature evaporator 30, achieving a double evaporation effect. This ensures that the refrigerant is completely converted to a gaseous state before flowing from the high-temperature evaporator 30 into the compressor 40. This ensures that the refrigerant entering the compressor 40 is in a gaseous state, protecting the compressor 40 from the risk of liquid hammer caused by liquid refrigerant entering the compressor 40.

[0129] It is understandable that the heat exchange device 200 of the present application can achieve an active cooling effect on the heat source 320 by providing a compressor 40 to drive the refrigerant to circulate within the first loop L1. When the heat exchange device 200 actively cools the heat source 320, the compressor 40 is started to pressurize the refrigerant in the first loop L1, which is used to drive the refrigerant to circulate within the first loop L1 so that it can exchange heat with the indoor air and achieve cooling. Based on the active cooling heat dissipation mode, the heat exchange device 200 has a higher heat dissipation efficiency and can be used in scenarios where the outdoor air temperature is relatively high or the heat dissipation demand in the containment chamber 310 is relatively large.

[0130] It should be noted that in the embodiment shown in FIG3 , the connection relationship and positional relationship among the condenser 10, high-temperature evaporator 30, low-temperature evaporator 20, and compressor 40 are merely illustrative, but the actual structural shape and actual structural dimensions of the condenser 10, high-temperature evaporator 30, low-temperature evaporator 20, and compressor 40 within the heat exchange device 200 of the present application are not limited to this embodiment, nor are the functional structural components of the heat exchange device 200 of the present application limited to this embodiment. In other words, the actual structural shape, dimensions, etc. of the condenser 10, high-temperature evaporator 30, low-temperature evaporator 20, and compressor 40 within the heat exchange device 200 of the present application can be adjusted according to actual scenario requirements, and this application does not impose specific limitations on this.

[0131] In one embodiment, as shown in FIG3 , the outlet of the high-temperature evaporator 30 is higher than the inlet of the high-temperature evaporator 30 along the gravity direction.

[0132] Specifically, the high-temperature evaporator 30 has a high-temperature evaporation inlet 31 (i.e., the inlet of the high-temperature evaporator 30 ) and a high-temperature evaporation outlet 32 ​​(i.e., the outlet of the high-temperature evaporator 30 ). The refrigerant flowing out of the low-temperature evaporator 20 flows into the high-temperature evaporator 30 through the high-temperature evaporation inlet 31 . After exchanging heat with the indoor air in the high-temperature evaporator 30 and completely evaporating into a gaseous state, the gaseous refrigerant flows out of the high-temperature evaporator 30 through the high-temperature evaporation outlet 32 ​​and enters the compressor 40 .

[0133] It can be understood that the gaseous refrigerant in the high-temperature evaporator 30 flows upward along the direction of gravity. By setting the high-temperature evaporation outlet 32 ​​higher than the high-temperature evaporation inlet 31, it can be ensured that the refrigerant flowing out of the high-temperature evaporation outlet 32 ​​is gaseous, and liquid or gas-liquid mixed refrigerant is prevented from flowing from the high-temperature evaporation outlet 32 ​​to the compressor 40.

[0134] In one embodiment, as shown in FIG3 , the outlet of the low-temperature evaporator 20 is higher than the inlet of the low-temperature evaporator 20 along the gravity direction.

[0135] In the embodiment shown in FIG3 , the low-temperature evaporator 20 has a low-temperature evaporation inlet 21 (i.e., the inlet of the low-temperature evaporator 20 ) and a low-temperature evaporation outlet 22 (i.e., the outlet of the low-temperature evaporator 20 ). The refrigerant flowing out of the condenser 10 flows into the low-temperature evaporator 20 through the low-temperature evaporation inlet 21 , exchanges heat with the indoor air within the low-temperature evaporator 20 , and then flows out of the low-temperature evaporator 20 through the low-temperature evaporation outlet 22 .

[0136] The refrigerant in the low-temperature evaporator 20 is in a gaseous state or a gas-liquid mixed state after heat exchange, wherein the gaseous or gas-liquid mixed refrigerant flows upward along the direction of gravity. By setting the outlet of the low-temperature evaporator 20 higher than the inlet of the low-temperature evaporator 20 along the direction of gravity, it can be ensured that the refrigerant flowing out of the outlet of the low-temperature evaporator 20 is mostly in a gaseous state, and liquid refrigerant is prevented from flowing from the outlet of the low-temperature evaporator 20 to the high-temperature evaporator 30.

[0137] The low-temperature evaporation outlet 22 of the low-temperature evaporator 20 is connected to the high-temperature evaporation inlet 31 of the high-temperature evaporator 30, so that the refrigerant flowing out of the low-temperature evaporation outlet 22 is transported to the high-temperature evaporation inlet 31 and flows into the high-temperature evaporator 30 from the high-temperature evaporation inlet 31. That is, by providing the low-temperature evaporation outlet 22 and the high-temperature evaporation inlet 31 in communication, the high-temperature evaporator 30 can be connected to the low-temperature evaporator 20.

[0138] Please refer to Figure 4, which is a schematic diagram of the internal structure of a heat exchange device 200 provided in one possible embodiment of the present application. As shown in Figure 4, the heat exchange device 200 of the present application includes an auxiliary evaporator 60 and an auxiliary condenser 70. The auxiliary evaporator 60 can be thermally coupled to the low-temperature evaporator 20 or the high-temperature evaporator 30, and the auxiliary evaporator 60 and the auxiliary condenser 70 are interconnected.

[0139] Specifically, since the auxiliary evaporator 60 and the auxiliary condenser 70 are interconnected, the auxiliary evaporator 60 and the auxiliary condenser 70 can jointly form a refrigerant circulation loop of "auxiliary condenser 70 → auxiliary evaporator 60 → auxiliary condenser 70", so that the refrigerant can circulate between the auxiliary evaporator 60 and the auxiliary condenser 70 in different states. For ease of description, the refrigerant circulation loop formed by "auxiliary condenser 70 → auxiliary evaporator 60 → auxiliary condenser 70" is defined in this application specification as the second loop L2, hereinafter referred to as "second loop L2".

[0140] Because the auxiliary evaporator 60 is thermally coupled to the high-temperature evaporator 30, it is used to exchange heat with the indoor air and cool it down. After the refrigerant in the auxiliary evaporator 60 exchanges heat with the indoor air, its temperature rises and it transforms into a gaseous state. In one embodiment, the auxiliary evaporation outlet 62 of the auxiliary evaporator 60 is located above the auxiliary evaporator 60 in the direction of gravity. The refrigerant flowing out of the auxiliary evaporator 60 is in a gaseous state. The gaseous refrigerant flows out of the auxiliary evaporator 60 and rises against gravity before flowing into the auxiliary condenser 70. After the gaseous refrigerant exchanges heat with the outdoor air in the auxiliary condenser 70, its temperature decreases and it condenses into a liquid or a gas-liquid mixture. In one embodiment, the auxiliary condensation outlet 72 of the auxiliary condenser 70 is located below the auxiliary condenser in the direction of gravity. The liquid or gas-liquid mixture refrigerant then flows out of the auxiliary condensation outlet 72 of the auxiliary condenser 70 and flows back into the auxiliary evaporator 60 in the direction of gravity.

[0141] As can be understood, the liquid refrigerant flowing into the auxiliary evaporator 60 once again exchanges heat with the indoor air within the auxiliary evaporator 60. At this point, the temperature of the refrigerant within the auxiliary evaporator 60 is lower than that of the indoor air. Therefore, after the refrigerant exchanges heat with the relatively warm indoor air within the auxiliary evaporator 60, its own temperature rises while simultaneously cooling the indoor air. The cooled indoor air then flows back into the receiving chamber 310, thereby achieving the heat dissipation effect of the heat exchange device 200 of the present application from the heat source 320 within the receiving chamber 310 via the second loop L2.

[0142] In the auxiliary evaporator 60, the liquid refrigerant is heated and evaporated into gaseous form when exchanging heat with the indoor air. The gaseous refrigerant flowing out of the auxiliary evaporator 60 flows into the auxiliary condenser 70, achieving the effect of the refrigerant being able to circulate independently in the second loop L2.

[0143] It can be understood that by setting the auxiliary evaporator 60 to be connected with the auxiliary condenser 70, an independent refrigerant circulation loop can be formed between the auxiliary evaporator 60 and the auxiliary condenser 70, that is, the second loop L2 in which the refrigerant can circulate independently, so that the refrigerant circulating between the auxiliary evaporator 60 and the auxiliary condenser 70 can achieve the effect of independent passive heat dissipation, further improving the cooling efficiency of the heat exchange device 200 of the present application.

[0144] Furthermore, as shown in FIG4 , the indoor air with a relatively high temperature flows through the high-temperature evaporator 30 and forms heat exchange with the refrigerant in the high-temperature evaporator 30 , while also flowing through the auxiliary evaporator 60 and forming heat exchange with the refrigerant in the auxiliary evaporator 60 .

[0145] Specifically, when the relatively high-temperature indoor air flows through the auxiliary evaporator 60 and exchanges heat with the refrigerant within the auxiliary evaporator 60, the temperature of the indoor air decreases and flows out of the auxiliary evaporator 60, while the temperature of the refrigerant within the auxiliary evaporator 60 increases. Because the auxiliary evaporator 60 is thermally coupled to the high-temperature evaporator 30, the refrigerant within the auxiliary evaporator 60 can exchange heat with the refrigerant within the high-temperature evaporator 30. In other words, the temperature of the refrigerant within the auxiliary evaporator 60 approaches the same temperature as the refrigerant within the high-temperature evaporator 30. At this point, the temperature of the refrigerant within the auxiliary evaporator 60 is higher than the temperature of the refrigerant within the low-temperature evaporator 20.

[0146] It is understandable that because the refrigerant in the second loop L2 circulates under the action of gravity and forms heat exchange with the outdoor air to achieve passive heat dissipation, the heat dissipation effect of the refrigerant in the second loop L2 is poor. Therefore, based on the same indoor and outdoor temperature difference conditions, the temperature of the refrigerant in the second loop L2 is generally higher than the temperature of the refrigerant in the first loop L1. At this time, by providing the auxiliary evaporator 60 thermally coupled to the high-temperature evaporator 30, heat exchange can be formed between the refrigerant in the auxiliary evaporator 60 and the refrigerant in the high-temperature evaporator 30, so that the auxiliary evaporator 60 can have a heating effect on the refrigerant in the high-temperature evaporator 30, thereby increasing the temperature of the refrigerant in the high-temperature evaporator 30, thereby ensuring that the refrigerant flowing out of the high-temperature evaporator 30 is completely in a gaseous state when entering the compressor 40, thereby improving the protection effect on the compressor 40.

[0147] For an embodiment, please refer to FIG5 , which is a schematic diagram of the internal structure of a heat exchange device 200 provided in one possible embodiment of the present application. As shown in FIG5 , the auxiliary evaporator 60 can also be thermally coupled to the low-temperature evaporator 20 , enabling heat exchange between the refrigerant in the auxiliary evaporator 60 and the refrigerant in the low-temperature evaporator 20 , thereby increasing the temperature of the refrigerant in the low-temperature evaporator 20 and further raising the temperature of the refrigerant flowing from the low-temperature evaporator 20 into the high-temperature evaporator 30 .

[0148] Please continue to refer to Figure 4. As shown in Figure 4, auxiliary condenser 70 is thermally coupled to condenser 10. Specifically, while outdoor air flows through condenser 10 and exchanges heat with the refrigerant within condenser 10, it also flows through auxiliary condenser 70 and exchanges heat with the refrigerant within auxiliary condenser 70. As the outdoor air flows through auxiliary condenser 70 and exchanges heat with the refrigerant within auxiliary condenser 70, the temperature of the refrigerant within auxiliary condenser 70 decreases.

[0149] For the reasons stated above, the refrigerant in the second loop L2 has a poor heat dissipation effect. Under the same indoor and outdoor temperature difference conditions, the temperature of the refrigerant in the second loop L2 is generally higher than that of the refrigerant in the first loop L1. Because the auxiliary condenser 70 is thermally coupled to the condenser 10, the refrigerant in the auxiliary condenser 70 can exchange heat with the refrigerant in the condenser 10. Specifically, the relatively low-temperature refrigerant in the condenser 10 exchanges heat with the higher-temperature refrigerant in the auxiliary condenser 70. This lowers the temperature of the refrigerant in the auxiliary condenser 70 compared to the temperature of the refrigerant in the condenser 10, thereby lowering the temperature of the refrigerant in the auxiliary condenser 70 and improving the heat dissipation efficiency of the refrigerant circulating in the second loop L2.

[0150] That is, by setting the auxiliary condenser 70 to be thermally coupled to the condenser 10, heat exchange can be formed between the refrigerant in the auxiliary condenser 70 and the refrigerant in the condenser 10, so that the condenser 10 has a cooling effect on the refrigerant in the auxiliary condenser 70, thereby improving the heat dissipation efficiency of the refrigerant in the second loop L2, thereby improving the efficiency of passive heat dissipation of the heat exchange device 200 of the present application, and further improving the cooling efficiency of the heat exchange device 200 of the present application.

[0151] In one embodiment, as shown in FIG. 4 , the outlet of the auxiliary condenser 70 is higher than the inlet of the auxiliary evaporator 60 along the direction of gravity.

[0152] Specifically, the auxiliary condenser 70 has an auxiliary condensation inlet 71 (i.e., the inlet of the auxiliary condenser 70) and an auxiliary condensation outlet 72 (i.e., the outlet of the auxiliary condenser 70). When the refrigerant circulates in the second loop L2, the refrigerant flowing out of the auxiliary evaporator 60 flows into the auxiliary condenser 70 through the auxiliary condensation inlet 71. After heat exchange with the outdoor air in the auxiliary condenser 70, the refrigerant is cooled and condensed into a liquid state or a gas-liquid mixed state. The liquid or gas-liquid mixed state refrigerant then flows out of the auxiliary condenser 70 through the auxiliary condensation outlet 72 and into the auxiliary evaporator 60.

[0153] The auxiliary evaporator 60 has an auxiliary evaporation inlet 61 (i.e., the inlet of the auxiliary evaporator 60) and an auxiliary evaporation outlet 62 (i.e., the outlet of the auxiliary evaporator 60). When the refrigerant circulates in the second loop L2, the refrigerant flowing out of the auxiliary condensation outlet 72 flows into the auxiliary evaporation inlet 61 and into the auxiliary evaporator 60. After exchanging heat with the indoor air in the auxiliary evaporator 60, the refrigerant is heated and evaporated to a gaseous state or a gas-liquid mixed state. After that, the refrigerant flows out of the auxiliary evaporator 60 through the auxiliary evaporation outlet 62 and flows into the auxiliary condenser 70, completing one cycle of the refrigerant in the second loop L2.

[0154] As shown in Figure 4, the auxiliary condenser outlet 72 is higher than the auxiliary evaporator inlet 61 along the direction of gravity, allowing the liquid refrigerant flowing out of the auxiliary condenser 70 to flow from the auxiliary evaporator inlet 61 into the auxiliary evaporator 60 under the action of gravity. After being heated and vaporized, the refrigerant in the auxiliary evaporator 60 can flow into the auxiliary condenser 70 against the direction of gravity to dissipate heat and cool down before being converted into a liquid state. As a result, the refrigerant circulates between the auxiliary evaporator 60 and the auxiliary condenser 70 based on gravity, allowing the heat exchange device 200 of the present application to also have the function of passive heat dissipation, thereby reducing energy consumption and conserving resources.

[0155] Because the auxiliary evaporator 60 and the auxiliary condenser 70 are connected and form independent refrigerant circulation loops, the auxiliary evaporator 60 and the auxiliary condenser 70 can operate in independent heat dissipation modes. Furthermore, the refrigerant circulating between the auxiliary evaporator 60 and the auxiliary condenser 70 is driven by gravity. That is, the refrigerant circulates within the second loop L2 under the action of gravity, enabling the heat exchange device 200 of the present application to achieve passive heat dissipation based on the "gravity heat pipe" mode, thereby achieving passive heat dissipation of the heat source 320.

[0156] It is understood that the operating mode of the second loop L2 is suitable for scenarios where the outdoor air temperature is relatively low or the heat dissipation demand within the containment chamber 310 is relatively small. The heat exchange device 200 of the present application can meet the heat dissipation demand of the heat exchange system 300 by passively dissipating heat through the refrigerant in the second loop L2 based on the gravity heat pipe mode. At this time, the compressor 40 in the first loop L1 can be turned off, and the energy consumption of the heat exchange device 200 is low, consuming fewer resources, and improving the energy efficiency of the heat exchange device 200.

[0157] On the other hand, because the inlet of the auxiliary evaporator 60 is lower than the outlet of the auxiliary condenser 70 in the direction of gravity, the liquid refrigerant in the auxiliary condenser 70 flows into the auxiliary evaporator 60 under the action of gravity and accumulates in the auxiliary evaporator 60. At this time, when the heat exchange device 200 starts the compressor 40 based on working needs, the liquid refrigerant accumulated in the auxiliary evaporator 60 can fully exchange heat with the indoor air, evaporate, and convert into gas before flowing out of the outlet of the auxiliary evaporator 60.

[0158] That is, the outlet of the auxiliary condenser 70 is higher than the inlet of the auxiliary evaporator 60 in the direction of gravity, which can improve the heat exchange efficiency of the heat exchange device 200 for the indoor air when the compressor 40 is started, and improve the working stability of the heat exchange device 200 when switching the cooling mode.

[0159] It is understood that when the compressor 40 is in the off state, the refrigerant can circulate independently in the second loop L2, and the refrigerant is driven to circulate based on gravity, thereby realizing the passive heat dissipation of the heat exchange device 200 of the present application based on the gravity heat pipe mode. When the compressor 40 is in the on state, the refrigerant can circulate simultaneously in the first loop L1 and the second loop L2 to improve the cooling efficiency of the heat exchange device 200 of the present application, thereby enabling the heat exchange device 200 of the present application to switch its own heat dissipation mode based on the outdoor air temperature or the heat dissipation requirements of the receiving chamber 310, thereby achieving different heat dissipation effects of the heat exchange device 200 of the present application and meeting the different heat dissipation requirements of the heat exchange system 300.

[0160] For example, in one possible embodiment, when the heat source 320 is operating in winter, the external ambient temperature of the containment chamber 310 is relatively low, that is, the temperature of the outdoor air is relatively low. In this case, the heat exchange device 200 of the present application can adopt a gravity heat pipe mode, driving the refrigerant to circulate in the second loop L2 under the action of gravity, and through the auxiliary evaporator 60 and auxiliary condenser 70, achieve a passive heat dissipation effect on the indoor air in the containment chamber 310. In addition, the cooler outdoor air can be used for passive heat dissipation, thereby reducing the energy consumption of the heat exchange device 200 of the present application during cooling and heat dissipation.

[0161] For example, in one possible embodiment, when the heat source 320 is operating in the summer, the external ambient temperature of the containment chamber 310 is relatively high, that is, the temperature of the outdoor air is relatively high. In this case, the heat exchange device 200 of the present application can adopt an active cooling mode, that is, starting the compressor 40 to drive the refrigerant to circulate in the first loop L1 through the compressor 40, and at the same time, the passive heat dissipation achieved by the refrigerant circulating in the second loop L2 can improve the heat dissipation efficiency of the indoor air.

[0162] For an embodiment, please refer to Figure 6, which is a schematic diagram of the internal structure of a heat exchange device 200 provided in a possible embodiment of the present application. As shown in Figure 6, the heat exchange device 200 of the present application includes two auxiliary evaporators 60, one of which is thermally coupled to the high-temperature evaporator 30, and the other is thermally coupled to the low-temperature evaporator 20.

[0163] Specifically, as shown in Figure 6, the two auxiliary evaporators 60 include a low-temperature auxiliary evaporator 60a and a high-temperature auxiliary evaporator 60b. The low-temperature auxiliary evaporator 60a and the high-temperature auxiliary evaporator 60b are arranged at intervals, and the low-temperature auxiliary evaporator 60a is thermally coupled to the low-temperature evaporator 20, and the high-temperature auxiliary evaporator 60b is thermally coupled to the high-temperature evaporator 30.

[0164] It can be understood that by respectively providing a low-temperature auxiliary evaporator 60a thermally coupled with the low-temperature evaporator 20, and a high-temperature auxiliary evaporator 60b thermally coupled with the high-temperature evaporator 30, when the compressor 40 is working, that is, when the heat exchange device 200 of the present application is in active cooling mode, the temperature of the refrigerant in the low-temperature evaporator 20 and the high-temperature evaporator 30 can be increased respectively, further ensuring that the refrigerant entering the compressor 40 is in a gaseous state, thereby protecting the compressor 40.

[0165] In one embodiment, as shown in FIG6 , the heat exchange device 200 of the present application includes two auxiliary condensers 70 , which are arranged at intervals. The two auxiliary condensers 70 correspond to the two auxiliary evaporators 60 one to one, that is, each auxiliary condenser 70 is connected to one auxiliary evaporator 60 .

[0166] Specifically, as shown in Figure 6, the two auxiliary condensers include a low-temperature auxiliary condenser 70a and a high-temperature auxiliary condenser 70b. The low-temperature auxiliary condenser 70a is connected to the low-temperature auxiliary evaporator 60a, and the high-temperature auxiliary condenser 70b is connected to the high-temperature auxiliary evaporator 60b. In other words, an independent refrigerant circulation loop is formed between the low-temperature auxiliary evaporator 60a and the low-temperature auxiliary condenser 70a, and an independent refrigerant circulation loop is formed between the high-temperature auxiliary evaporator 60b and the high-temperature auxiliary condenser 70b.

[0167] For the sake of convenience of description, the refrigerant circulation loop formed between the low-temperature auxiliary evaporator 60a and the low-temperature auxiliary condenser 70a is defined in this application specification as the second low-temperature loop L2a, hereinafter referred to as the "second low-temperature loop L2a", and the refrigerant circulation loop formed between the high-temperature auxiliary evaporator 60b and the high-temperature auxiliary condenser 70b is defined in this application specification as the second high-temperature loop L2b, hereinafter referred to as the "second high-temperature loop L2b".

[0168] The refrigerant can circulate independently in the second low-temperature circuit L2a and the second high-temperature circuit L2b respectively, and the second low-temperature circuit L2a and the second high-temperature circuit L2b both drive the refrigerant to circulate under the action of gravity, so as to simultaneously realize the passive heat dissipation function of the heat exchange device 200 of the present application, thereby improving the heat exchange efficiency of the heat exchange device 200 of the present application when working in the passive heat dissipation mode, and further reducing the energy consumption of the heat exchange device 200 of the present application during passive heat dissipation.

[0169] For an embodiment, please refer to Figure 7, which is a schematic diagram of the internal structure of a heat exchange device 200 provided in a possible embodiment of the present application. The condenser 10 includes a low-temperature condenser 11 and a high-temperature condenser 12 that are connected.

[0170] Specifically, as shown in Figure 7, the low-temperature condenser 11 and the high-temperature condenser 12 are connected between the compressor 40 and the low-temperature evaporator 20, and the high-temperature condenser 12 is connected between the compressor 40 and the low-temperature condenser 11, and the low-temperature condenser 11 is connected between the high-temperature condenser 12 and the low-temperature evaporator 20.

[0171] The gaseous refrigerant delivered by the compressor 40 to the high-temperature condenser 12 exchanges heat with the outdoor air once inside the high-temperature condenser 12. There, the gaseous refrigerant cools down and condenses into a liquid or a gas-liquid mixture. The liquid or gas-liquid mixture refrigerant is then delivered from the high-temperature condenser 12 to the low-temperature condenser 11, where it exchanges heat with the outdoor air again, further lowering the refrigerant temperature.

[0172] That is, the refrigerant forms two heat exchanges with the outdoor air in the high-temperature condenser 12 and the low-temperature condenser 11 respectively, so that the heat exchange between the refrigerant and the outdoor air is more complete to form a better heat dissipation effect, and can further improve the heat dissipation efficiency of the refrigerant in the condenser 10, while ensuring that the refrigerant can be completely cooled, condensed into liquid and transported to the low-temperature evaporator 20.

[0173] One embodiment is shown in FIG7 . The low-temperature condenser 11 and the high-temperature condenser 12 are arranged in a direction parallel to the flow direction of outdoor air in the heat exchange device 200 , and the low-temperature condenser 11 is located in front of the high-temperature condenser 12 .

[0174] Specifically, as shown in Figure 7, compared with the temperature of the refrigerant delivered from the compressor 40 to the high-temperature condenser 12, after the outdoor air with a relatively low temperature flows into the heat exchange device 200, it forms two heat exchanges with the low-temperature condenser 11 and the high-temperature condenser 12 in the heat exchange device 200, and then the temperature rises and flows out of the heat exchange device 200.

[0175] In the embodiment shown in FIG7 , when relatively low-temperature outdoor air flows within the heat exchange device 200, it first flows through the low-temperature condenser 11 and then flows through the high-temperature condenser 12. The phrase "low-temperature condenser 11 is located in front of high-temperature condenser 12" in this specification can be understood to mean that the outdoor air first flows to the low-temperature condenser 11 and then to the high-temperature condenser 12, and that the low-temperature condenser 11 exchanges heat with the outdoor air before the high-temperature condenser 12.

[0176] When the outdoor air flows through the low-temperature condenser 11 and the high-temperature condenser 12 successively and forms two heat exchanges with the refrigerants in the low-temperature condenser 11 and the high-temperature condenser 12 successively, the temperature of the outdoor air increases and flows out of the heat exchange device 200.

[0177] After the first heat exchange between the outdoor air and the refrigerant in the low-temperature condenser 11, the temperature of the outdoor air increases and the temperature of the refrigerant in the low-temperature condenser 11 decreases. After the second heat exchange between the outdoor air having increased in temperature and the refrigerant in the high-temperature condenser 12, the temperature of the outdoor air further increases and the temperature of the refrigerant in the high-temperature condenser 12 decreases.

[0178] As a result, the outdoor air flows through the low-temperature condenser 11 and the high-temperature condenser 12, gradually increasing in temperature. After exiting the compressor 40, the refrigerant is delivered to the high-temperature condenser 12 and then to the low-temperature condenser 11. The refrigerant first exchanges heat with the relatively high-temperature outdoor air, then with the relatively low-temperature outdoor air, gradually decreasing in temperature before being delivered to the low-temperature evaporator 20. This ensures that the refrigerant delivered from the low-temperature condenser 11 to the low-temperature evaporator 20 is converted to liquid, ensuring effective heat exchange between the refrigerant and the indoor air within the low-temperature evaporator 20.

[0179] 7 , the refrigerant forms a double heat dissipation effect in the low-temperature condenser 11 and the high-temperature condenser 12 , and the temperature of the refrigerant in the low-temperature condenser 11 is lower than the temperature of the refrigerant in the high-temperature condenser 12 .

[0180] It can be understood that the low-temperature condenser 11 and the high-temperature condenser 12 are arranged at intervals along the flow direction of the outdoor air in the heat exchange device 200 of the present application, and the low-temperature condenser 11 is arranged in front of the high-temperature condenser 12, so that the outdoor air can flow through the low-temperature condenser 11 and the high-temperature condenser 12 successively, forming the effect of two heat exchange and heat dissipation.

[0181] The outdoor air first flows through the low-temperature condenser 11, where its temperature rises, and then flows through the high-temperature condenser 12. At this point, the refrigerant temperature in the low-temperature condenser 11 is lower than that in the high-temperature condenser 12. This ensures that the refrigerant in the low-temperature condenser 11 is cooled and converted to liquid before being transported from the outlet of the low-temperature condenser 11 to the low-temperature evaporator 20.

[0182] It should be noted that, in the embodiment shown in FIG7 , the low-temperature condenser 11 and the high-temperature condenser 12 are only used to distinguish the positional difference between the two condensers connected to the condenser 10, that is, the “low temperature” and the “high temperature” are only used to distinguish the arrangement positions of the two condensers, but do not indicate or limit the existence of differences in the structure, type, function, etc. of the low-temperature condenser 11 and the high-temperature condenser 12.

[0183] In one embodiment, as shown in FIG7 , the outlet of the high-temperature condenser 12 is lower than the inlet of the high-temperature condenser 12 along the direction of gravity.

[0184] Specifically, the high-temperature condenser 12 has a high-temperature condensation inlet 121 (i.e., the inlet of the high-temperature condenser 12) and a high-temperature condensation outlet 122 (i.e., the outlet of the high-temperature condenser 12). The refrigerant delivered to the high-temperature condenser 12 by the compressor 40 is delivered to the high-temperature condenser 12 through the high-temperature condensation inlet 121. Inside the high-temperature condenser 12, it exchanges heat with the outdoor air and is cooled and condensed into a liquid or a gas-liquid mixture. After that, it flows out of the high-temperature condenser 12 through the high-temperature condensation outlet 122 and is then delivered to the low-temperature condenser 11.

[0185] As can be understood, the refrigerant delivered from the compressor 40 to the condenser 10 is in a gaseous state. The gaseous refrigerant is cooled and converted to a liquid state or a gas-liquid mixed state after heat exchange with the outdoor air in the high-temperature condenser 12. By arranging the high-temperature condensation outlet 122 to be lower than the high-temperature condensation inlet 121 in the direction of gravity, the liquid or gas-liquid mixed refrigerant flows out from the bottom of the high-temperature condenser 12.

[0186] In one embodiment, as shown in FIG7 , the outlet of the low-temperature condenser 11 is lower than the inlet of the low-temperature condenser 11 along the direction of gravity.

[0187] Specifically, the low-temperature condenser 11 has a low-temperature condensation inlet 111 (i.e., the inlet of the low-temperature condenser 11) and a low-temperature condensation outlet 112 (i.e., the outlet of the low-temperature condenser 11). The gaseous or gas-liquid mixed refrigerant output from the high-temperature condenser 12 flows into the low-temperature condenser 11 through the low-temperature condensation inlet 111, exchanges heat with the outdoor air within the low-temperature condenser 11, and the refrigerant in the low-temperature condenser 11 is cooled and condensed into a liquid state. After that, it flows out of the low-temperature condenser 11 through the low-temperature condensation outlet 112 and enters the low-temperature evaporator 20.

[0188] It can be understood that the refrigerant in the low-temperature condenser 11 is converted into liquid after cooling. By setting the low-temperature condensation outlet 112 lower than the low-temperature condensation inlet 111 in the direction of gravity, the liquid refrigerant flows out from the bottom of the low-temperature condenser 11, ensuring that the refrigerant flowing into the low-temperature evaporator 20 is all liquid, thereby improving the heat exchange between the refrigerant in the low-temperature evaporator 20 and the indoor air to be more sufficient, so as to further improve the refrigeration efficiency of the heat exchange equipment 200 of this application.

[0189] Furthermore, the two auxiliary condensers 70 are arranged at intervals, and the low-temperature condenser 11 and the high-temperature condenser 12 are thermally coupled with one auxiliary condenser 70 respectively, that is, one auxiliary condenser 70 is thermally coupled with the high-temperature condenser 12, and the other auxiliary condenser 70 is thermally coupled with the low-temperature condenser 11.

[0190] Specifically, as shown in FIG7 , the low-temperature auxiliary condenser 70a is thermally coupled to the low-temperature condenser 11, and the high-temperature auxiliary condenser 70b is thermally coupled to the high-temperature condenser 12. By providing two auxiliary condensers 70 that are thermally coupled to the low-temperature condenser 11 and the high-temperature condenser 12, respectively, the heat exchange efficiency between the refrigerant in the two auxiliary condensers 70 and the outdoor air can be improved, thereby further improving the heat dissipation efficiency of the refrigerant in the second loop L2, thereby improving the cooling efficiency of the heat exchange device 200 of the present application.

[0191] In one embodiment, as shown in Figure 7, the auxiliary evaporator 60 thermally coupled to the high-temperature evaporator 30 is connected to the auxiliary condenser 70 thermally coupled to the high-temperature condenser 12, and the auxiliary evaporator 60 thermally coupled to the low-temperature evaporator 20 is connected to the auxiliary condenser 70 thermally coupled to the low-temperature condenser 11.

[0192] Specifically, in the embodiment shown in Figure 7, the low-temperature auxiliary evaporator 60a is connected to the low-temperature auxiliary condenser 70a, and the high-temperature auxiliary evaporator 60b is connected to the high-temperature auxiliary condenser 70b to form two independent refrigerant circulation loops, namely, a second low-temperature loop L2a formed by the low-temperature auxiliary evaporator 60a and the low-temperature auxiliary condenser 70a, and a second high-temperature loop L2b formed by the high-temperature auxiliary evaporator 60b and the high-temperature auxiliary condenser 70b.

[0193] In the second high-temperature circuit L2b, the high-temperature auxiliary condenser 70b exchanges heat with the relatively high-temperature outdoor air, and the high-temperature auxiliary evaporator 60b exchanges heat with the relatively high-temperature indoor air, so that the average temperature of the refrigerant circulating in the second high-temperature circuit L2b is relatively high.

[0194] In the second low-temperature circuit L2a, the low-temperature auxiliary condenser 70a exchanges heat with the relatively cool outdoor air, and the low-temperature auxiliary evaporator 60a exchanges heat with the relatively cool indoor air, resulting in a relatively low average temperature of the refrigerant circulating in the second low-temperature circuit L2a. In other words, the average temperature of the refrigerant circulating in the second low-temperature circuit L2a is lower than the average temperature of the refrigerant in the second high-temperature circuit L2b.

[0195] As a result, on the side of the low-temperature evaporator 20 and the high-temperature evaporator 30, the refrigerant temperature in the auxiliary evaporator 60 thermally coupled to the low-temperature evaporator 20 is relatively low, while the refrigerant temperature in the auxiliary evaporator 60 thermally coupled to the high-temperature evaporator 30 is relatively high. The refrigerant temperature in the low-temperature evaporator 20 is also correspondingly lower than the refrigerant temperature in the high-temperature evaporator 30.

[0196] The refrigerant temperature in the high-temperature evaporator 30 is higher, which can ensure that the refrigerant is fully evaporated and converted into gas in the high-temperature evaporator 30, avoiding the risk of liquid hammer in the compressor 40.

[0197] For an example embodiment, please refer to Figure 8, which is a schematic diagram of the internal structure of a heat exchange device 200 provided in one possible embodiment of the present application. As shown in Figure 8, the two auxiliary evaporators 60 include a split auxiliary evaporator, which includes a first portion P1 and a second portion P2 that are connected. The first portion P1 and the second portion P2 are arranged in an alternating pattern along the arrangement direction of the low-temperature evaporator 20 and the high-temperature evaporator 30.

[0198] The two auxiliary condensers 70 include a split auxiliary condenser, which includes a third part P3 and a fourth part P4 that are connected. The third part P3 and the fourth part P4 are arranged at intervals along the arrangement direction of the high-temperature condenser 12 and the low-temperature condenser 11.

[0199] Specifically, as shown in FIG8 , the high-temperature auxiliary evaporator 60b is configured as a split auxiliary evaporator, and the low-temperature auxiliary evaporator 60a is thermally coupled to the low-temperature evaporator 20. In this case, the split auxiliary evaporator is thermally coupled to the high-temperature evaporator 30, i.e., the first portion P1 of the split auxiliary evaporator is thermally coupled to the high-temperature evaporator 30, and the first portion P1 and the second portion P2 are in communication, i.e., the first portion P1 and the second portion P2 are connected in parallel.

[0200] By setting the first part P1 of the split auxiliary evaporator to be thermally coupled with the high-temperature evaporator 30, thermal coupling is formed between the split auxiliary evaporator and the high-temperature evaporator 30, further increasing the temperature of the high-temperature evaporator 30 to ensure that the refrigerant entering the compressor 40 is in a gaseous state.

[0201] As shown in Figure 8, the high-temperature auxiliary condenser 70b is configured as a split auxiliary condenser, and the low-temperature auxiliary condenser 70a is thermally coupled to the low-temperature condenser 11. In this case, the split auxiliary condenser is thermally coupled to the high-temperature condenser 12, i.e., the third portion P3 of the split auxiliary condenser is thermally coupled to the high-temperature condenser 12, and the third portion P3 is connected to the fourth portion P4, creating a parallel connection between the third portion P3 and the fourth portion P4.

[0202] By providing the third part P3 of the split auxiliary condenser to be thermally coupled with the high-temperature condenser 12 , the heat exchange effect between the refrigerant in the split auxiliary condenser and the outdoor air can be improved, thereby further reducing the temperature of the refrigerant in the split auxiliary condenser.

[0203] It can be understood that, as shown in Figure 8, an independent refrigerant circulation loop, i.e., the second low-temperature loop L2a, is formed between the low-temperature auxiliary evaporator 60a thermally coupled to the low-temperature evaporator 20 and the low-temperature auxiliary condenser 70a thermally coupled to the low-temperature condenser 11, so that the refrigerant can circulate independently in the second low-temperature loop L2a and achieve the effect of passive heat dissipation of the heat exchange device 200 of the present application.

[0204] At this point, the first portion P1, thermally coupled to the high-temperature evaporator 30, and the third portion P3, thermally coupled to the high-temperature condenser 12, are connected to form an independent second high-temperature circuit L2b, allowing the refrigerant to circulate independently within the second high-temperature circuit L2b. Furthermore, the second portion P2 and the fourth portion P4 are connected in parallel to the second high-temperature circuit L2b, respectively, to improve the heat exchange efficiency between the refrigerant in the high-temperature evaporator 30 and the indoor air, and between the refrigerant in the high-temperature condenser 12 and the outdoor air, further enhancing the cooling efficiency of the heat exchange device 200 of the present application.

[0205] In one embodiment, as shown in FIG8 , when the split auxiliary evaporator is thermally coupled to the low-temperature evaporator 20, the second portion P2 of the split auxiliary evaporator is thermally coupled to the low-temperature evaporator 20. By thermally coupling the second portion P2 of the split auxiliary evaporator to the low-temperature evaporator 20, the temperature of the low-temperature evaporator 20 is further increased to ensure that the refrigerant entering the high-temperature evaporator 30 is mostly in a gaseous state.

[0206] In one embodiment, as shown in FIG8 , when the split auxiliary condenser is thermally coupled to the low-temperature condenser 11 , the fourth portion P4 of the split auxiliary condenser is coupled to the low-temperature condenser 11 .

[0207] When the split auxiliary condenser is thermally coupled to the low-temperature condenser 11, the fourth portion P4 of the split auxiliary condenser is thermally coupled to the low-temperature condenser 11. By thermally coupling the fourth portion P4 of the split auxiliary condenser to the low-temperature condenser 11, the heat exchange efficiency between the refrigerant in the split auxiliary condenser and the outdoor air can be improved, further improving the cooling efficiency of the heat exchange device 200 of the present application.

[0208] It should be noted that in the embodiments shown in Figures 3 to 8, the heat exchange device 200 of the present application is described by way of example only, assuming that the number of the low-temperature evaporator 20, the high-temperature evaporator 30, the low-temperature condenser 11, and the high-temperature condenser 12 are all one. However, this does not limit the number of the low-temperature evaporator 20, the high-temperature evaporator 30, the low-temperature condenser 11, and the high-temperature condenser 12 to be one. In other embodiments of the present application, the number of the low-temperature evaporator 20, the high-temperature evaporator 30, the low-temperature condenser 11, and the high-temperature condenser 12 can be adjusted based on actual design requirements or the actual application scenario of the heat exchange device of the present application, and this application does not impose any specific limitations on this.

[0209] For example, in one possible embodiment, see Figure 9, which is a schematic diagram of the internal structure of a heat exchange device 200 provided in this application in one possible embodiment. As shown in Figure 9, there are two low-temperature condensers 11, which are interconnected and connected in series between the high-temperature condenser 12 and the low-temperature evaporator 20.

[0210] It can be understood that by setting two low-temperature condensers 11 in series between the high-temperature condenser 12 and the low-temperature evaporator 20, the heat exchange efficiency between the refrigerant in the condenser 10 and the outdoor air can be improved, ensuring that the refrigerant can form sufficient heat exchange with the outdoor air in the condenser 10 and then cool down and condense into liquid, thereby making the refrigerant flowing into the low-temperature evaporator 20 all liquid, further improving the refrigeration efficiency of the heat exchange equipment 200 of this application.

[0211] For an embodiment, please refer to Figure 10, which is a schematic diagram of the internal structure of a heat exchange device 200 provided in one possible embodiment of the present application. As shown in Figure 10, an intermediate evaporator M1 is connected in series between the low-temperature evaporator 20 and the high-temperature evaporator 30. That is, the intermediate evaporator M1 is connected between the low-temperature evaporator 20 and the high-temperature evaporator 30.

[0212] Specifically, after the refrigerant exchanges heat with the indoor air in the low-temperature evaporator 20 and is heated to a gaseous state or a gas-liquid mixed state, it flows out of the low-temperature evaporator 20 and into the intermediate evaporator M1. The gaseous or gas-liquid mixed refrigerant flowing into the intermediate evaporator M1 exchanges heat with the indoor air in the intermediate evaporator M1, and its temperature rises further than that of the refrigerant in the low-temperature evaporator 20 before flowing into the high-temperature evaporator 30. The refrigerant flowing from the intermediate evaporator M1 into the high-temperature evaporator 30 is mostly in a gaseous state.

[0213] By providing the intermediate evaporator M1, the temperature of the refrigerant flowing into the high-temperature evaporator 30 can be further increased, further ensuring that the refrigerant is fully evaporated and converted into a gaseous state within the high-temperature evaporator 30, thereby avoiding the risk of liquid hammer in the compressor 40. Furthermore, by providing the intermediate evaporator M1, it is possible to ensure that the relatively low-temperature refrigerant can form a more complete heat exchange with the relatively high-temperature indoor air, thereby improving the heat exchange efficiency between the refrigerant and the indoor air, thereby improving the cooling efficiency of the heat exchange device 200 of the present application.

[0214] In one embodiment, as shown in FIG. 10 , the intermediate evaporator M1 is arranged between the high-temperature evaporator 30 and the low-temperature evaporator 20 in parallel with the flow direction of the indoor air in the heat exchange device 200 .

[0215] In one embodiment, as shown in FIG10 , an intermediate condenser M2 is connected in series between the low-temperature condenser 11 and the high-temperature condenser 12 , that is, the intermediate condenser M2 is connected between the low-temperature condenser 11 and the high-temperature condenser 12 .

[0216] Specifically, as shown in Figure 10, the gaseous refrigerant delivered by the compressor 40 to the high-temperature condenser 12 undergoes heat exchange with the outdoor air in the high-temperature condenser 12, is converted to a liquid state or a gas-liquid mixed state, and is then delivered to the intermediate condenser M2. The refrigerant delivered to the intermediate condenser M2 can further exchange heat with the indoor air in the intermediate condenser M2, resulting in the refrigerant being delivered to the low-temperature condenser 11 being mostly in a liquid state.

[0217] It is understandable that by providing the intermediate condenser M2, the temperature of the refrigerant flowing into the low-temperature condenser 11 can be further reduced, ensuring that the refrigerant can be converted into liquid in the low-temperature condenser 11, and improving the heat exchange efficiency after the refrigerant is transported to the low-temperature evaporator 20. At the same time, by providing the intermediate condenser M2, it can be ensured that the refrigerant can form a more sufficient heat exchange with the outdoor air, and the heat dissipation efficiency of the refrigerant can be improved, thereby improving the heat dissipation efficiency of the heat exchange device 200 of the present application.

[0218] In one embodiment, as shown in FIG. 10 , the intermediate condenser M2 is arranged between the low-temperature condenser 11 and the high-temperature condenser 12 in parallel with the flow direction of the outdoor air in the heat exchange device 200 .

[0219] In one embodiment, as shown in FIG10 , the intermediate evaporator M1 is provided with an auxiliary evaporator 60, which is thermally coupled to the intermediate evaporator M1. The intermediate condenser M2 is provided with an auxiliary condenser 70, which is thermally coupled to the intermediate condenser M2. The auxiliary evaporator 60, which is thermally coupled to the intermediate evaporator M1, is connected to the auxiliary condenser 70, which is thermally coupled to the intermediate condenser M2.

[0220] By setting up an auxiliary evaporator 60 thermally coupled with the intermediate evaporator M1 and connecting it to the auxiliary condenser 70 thermally coupled with the intermediate condenser M2, an independent refrigerant circulation loop can be formed between the auxiliary evaporator 60 thermally coupled with the intermediate evaporator M1 and the auxiliary condenser 70 thermally coupled with the intermediate condenser M2, and the refrigerant can be driven to circulate in the refrigerant circulation loop based on the action of gravity, so as to further improve the efficiency of passive heat dissipation of the heat exchange equipment 200 of the present application.

[0221] An embodiment, please refer to Figures 11 to 13 together, Figure 11 is a schematic diagram of the internal structure of the heat exchange device 200 provided in the embodiment shown in Figure 7 of the present application from a side perspective, Figure 12 is a schematic diagram of the structure of the heat exchange plate 80 provided in a possible embodiment of the present application from a side perspective, and Figure 13 is a schematic diagram of the structure of the heat exchange plate 80 provided in another possible embodiment of the present application from a side perspective.

[0222] As shown in Figures 11 to 13 , the low-temperature evaporator 20, the high-temperature evaporator 30, and the auxiliary evaporator 60 each include a plurality of heat exchange plates 80. The heat exchange plates 80 are arranged at intervals perpendicular to the arrangement of the low-temperature evaporator 20 and the high-temperature evaporator 30. The interspaced arrangement of the heat exchange plates 80 increases the heat exchange area between the indoor air and each refrigerant, thereby improving the heat exchange efficiency of the heat exchange device 200 of the present application.

[0223] When the auxiliary evaporator 60 is thermally coupled to the high-temperature evaporator 30, the heat exchange plates 80a of any auxiliary evaporator 60 are thermally coupled to the heat exchange plates 80b of at least one high-temperature evaporator 30. Specifically, as shown in FIG12 , the multiple heat exchange plates 80a of the auxiliary evaporator 60 and the multiple heat exchange plates 80b of the high-temperature evaporator 30 are alternately arranged, and the heat exchange plates 80a of any auxiliary evaporator 60 are at least partially abutted against the heat exchange plates 80b of one high-temperature evaporator 30 to form a thermal coupling.

[0224] By setting a heat exchange plate 80a of an auxiliary evaporator 60 to be thermally coupled with a heat exchange plate 80b of at least one high-temperature evaporator 30, a better thermal coupling effect can be formed between the auxiliary evaporator 60 and the high-temperature evaporator 30, thereby reducing the refrigerant temperature difference between the high-temperature evaporator 30 and the thermally coupled auxiliary evaporator 60.

[0225] When the auxiliary evaporator 60 is thermally coupled to the low-temperature evaporator 20, the heat exchange plates 80a of any auxiliary evaporator 60 are thermally coupled to the heat exchange plates 80c of at least one low-temperature evaporator 20. Specifically, as shown in FIG13 , the multiple heat exchange plates 80a of the auxiliary evaporator 60 and the multiple heat exchange plates 80c of the low-temperature evaporator 20 are alternately arranged, and the heat exchange plates 80a of any auxiliary evaporator 60 are at least partially abutted against the heat exchange plates 80c of one low-temperature evaporator 20 to form a thermal coupling.

[0226] By setting the heat exchange plate 80a of any auxiliary evaporator 60 to be thermally coupled with the heat exchange plate 80c of at least one low-temperature evaporator 20, the auxiliary evaporator 60 and the low-temperature evaporator 20 can be thermally coupled to form heat exchange between the auxiliary evaporator 60 and the low-temperature evaporator 20.

[0227] At the same time, by arranging the heat exchange plate 80a of the auxiliary evaporator 60, it can form at least partial adhesion with the heat exchange plate 80b of the high-temperature evaporator 30 and the heat exchange plate 80c of the low-temperature evaporator 20, respectively, thereby increasing the contact area between the heat exchange plate 80a of the auxiliary evaporator 60 and the heat exchange plate 80b of the high-temperature evaporator 30, and between the heat exchange plate 80a of the auxiliary evaporator 60 and the heat exchange plate 80c of the low-temperature evaporator 20, thereby forming a better thermal coupling effect.

[0228] In one embodiment, as shown in FIG11 , the heat exchange device 200 of the present application further includes multiple groups of heat dissipation fins 90, each group of heat dissipation fins 90 being connected between two adjacent heat exchange plates 80. Each group of heat dissipation fins 90 includes multiple heat dissipation fins, and the multiple heat dissipation fins are spaced apart and arranged in a direction perpendicular to the arrangement of the multiple heat exchange plates 80.

[0229] It is understood that the heat dissipation fins 90 can further increase the contact area between the heat exchange device 200 of the present application and the outdoor air and / or the outdoor air, thereby improving the heat exchange efficiency of the heat exchange device 200 of the present application. At the same time, the heat dissipation fins 90 can also form heat conduction between the heat exchange plates 80, thereby improving the thermal coupling effect between the heat exchange plates 80.

[0230] Compressors are used to pressurize the refrigerant within heat exchange equipment, driving it to circulate and improve its heat dissipation efficiency. To ensure proper operation, the refrigerant must enter the compressor in a gaseous state to avoid the risk of liquid hammer caused by liquid refrigerant entering the compressor.

[0231] The heat exchange device 200 of the present application, by providing a low-temperature evaporator 20 and a high-temperature evaporator 30 that are spaced apart and connected, can achieve a double heat exchange effect with the indoor air, thereby achieving a more complete heat exchange between the refrigerant and the indoor air. The refrigerant delivered from the condenser to the low-temperature evaporator 20 is in liquid form. After the liquid refrigerant exchanges heat with the indoor air in the low-temperature evaporator 20 and the high-temperature evaporator 30, it can be completely converted to a gaseous state and flow out of the high-temperature evaporator 30 into the compressor 40.

[0232] The heat exchange device 200 of the present application can ensure sufficient contact between the refrigerant and the indoor air, so that the refrigerant entering the compressor 40 is in a gaseous state, thereby forming a protective effect on the compressor 40 and avoiding the risk of liquid hammer in the compressor 40.

[0233] The heat exchange system 300 of the present application connects the low-temperature evaporator 20 and the high-temperature evaporator 30 in the heat exchange device 200 with the containment chamber 310, so that the liquid refrigerant in the low-temperature evaporator 20 and the high-temperature evaporator 30 absorbs the heat in the containment chamber 310 during the process of evaporating into a gaseous state, and can then take away the heat in the containment chamber 310 to dissipate heat from the heat source in the containment chamber 310.

[0234] At the same time, through the cooperation between the low-temperature evaporator 20 and the high-temperature evaporator 30, a double heat exchange effect can be formed with the indoor air, making the heat exchange between the refrigerant and the indoor air more sufficient, further improving the heat dissipation efficiency of the heat exchange system 300 of this application to the heat source 320.

[0235] Furthermore, the heat exchange system 300 of the present application has the heat exchange device 200 in any of the above embodiments, so the heat exchange system 300 of the present application has all possible beneficial effects of the heat exchange device 200 in any of the above embodiments.

[0236] Of course, the above-mentioned embodiments can be applied individually or in combination. The above-mentioned are preferred embodiments of the present application. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A heat exchange device of a split evaporator, characterized in that: The heat exchange equipment includes a condenser, a high-temperature evaporator, a low-temperature evaporator and a compressor. The high-temperature evaporator and the low-temperature evaporator are arranged at intervals and are connected. The compressor is connected to the high-temperature evaporator and the condenser. The compressor is used to increase the pressure of the refrigerant flowing out of the high-temperature evaporator and then transport it to the condenser. The condenser is used to cool the refrigerant and then transport it to the low-temperature evaporator.

2. The heat exchange device according to claim 1, characterized in that: The outlet of the high-temperature evaporator is higher than the inlet of the high-temperature evaporator in the direction of gravity; or, The outlet of the low-temperature evaporator is higher than the inlet of the low-temperature evaporator along the gravity direction.

3. The heat exchange device according to claim 1 or 2, characterized in that: The heat exchange device includes an auxiliary condenser and an auxiliary evaporator which are connected to each other. The auxiliary evaporator is thermally coupled to the low-temperature evaporator or the high-temperature evaporator. The auxiliary condenser is used to cool the refrigerant flowing out of the auxiliary evaporator.

4. The heat exchange device according to claim 3, characterized in that: The outlet of the auxiliary condenser is higher than the inlet of the auxiliary evaporator along the gravity direction.

5. The heat exchange device according to claim 3 or 4, characterized in that: The heat exchange device includes two auxiliary condensers and two auxiliary evaporators, the two auxiliary condensers are arranged at intervals, each auxiliary condenser is connected to an auxiliary evaporator, one of the auxiliary evaporators is thermally coupled to the high-temperature evaporator, and the other auxiliary evaporator is thermally coupled to the low-temperature evaporator.

6. The heat exchange device according to claim 5, characterized in that: The two auxiliary evaporators include a split auxiliary evaporator, and the split auxiliary evaporator includes a first part and a second part that are connected, and along the arrangement direction of the high-temperature evaporator and the low-temperature evaporator, the first part and the second part are arranged alternately, wherein: When the split auxiliary evaporator is thermally coupled to the high-temperature evaporator, the first part of the split auxiliary evaporator is thermally coupled to the high-temperature evaporator; or, When the split auxiliary evaporator is thermally coupled to the low-temperature evaporator, the second part of the split auxiliary evaporator is thermally coupled to the low-temperature evaporator.

7. The heat exchange device according to any one of claims 4 to 6, characterized in that: The condenser includes a high-temperature condenser and a low-temperature condenser which are connected to each other. The high-temperature condenser and the low-temperature condenser are thermally coupled to one of the auxiliary condensers respectively.

8. The heat exchange device according to claim 7, characterized in that: The arrangement direction of the high-temperature evaporator and the low-temperature evaporator is parallel to the flow direction of the indoor air in the heat exchange device, and the high-temperature evaporator is located in front of the low-temperature evaporator; or, The high-temperature condenser and the low-temperature condenser are arranged in a direction parallel to a flow direction of outdoor air in the heat exchange device, and the low-temperature condenser is located in front of the high-temperature condenser.

9. The heat exchange device according to any one of claims 3 to 8, characterized in that: Along a direction perpendicular to the arrangement of the high-temperature evaporator and the low-temperature evaporator, the high-temperature evaporator, the low-temperature evaporator and the auxiliary evaporator respectively include a plurality of heat exchange plates arranged at intervals, wherein: When the auxiliary evaporator is thermally coupled to the high-temperature evaporator, the heat exchange plate of any auxiliary evaporator is thermally coupled to the heat exchange plate of at least one high-temperature evaporator; or, When the auxiliary evaporator is thermally coupled to the low-temperature evaporator, the heat exchange plate of any auxiliary evaporator is thermally coupled to the heat exchange plate of at least one low-temperature evaporator.

10. The heat exchange device according to claim 9, characterized in that: When the auxiliary evaporator is thermally coupled with the high-temperature evaporator, along a direction perpendicular to the arrangement of the high-temperature evaporator and the low-temperature evaporator, the plurality of heat exchange plates of the auxiliary evaporator and the plurality of heat exchange plates of the high-temperature evaporator are arranged alternately, and the heat exchange plate of any auxiliary evaporator is at least partially attached to the heat exchange plate of one of the high-temperature evaporators to form thermal coupling; or, When the auxiliary evaporator is thermally coupled to the low-temperature evaporator, along a direction perpendicular to the arrangement direction of the high-temperature evaporator and the low-temperature evaporator, The multiple heat exchange plates of the auxiliary evaporator and the multiple heat exchange plates of the low-temperature evaporator are arranged alternately, and the heat exchange plate of any auxiliary evaporator is at least partially attached to the heat exchange plate of the low-temperature evaporator to form thermal coupling.

11. The heat exchange device according to claim 10, characterized in that: The heat exchange device comprises a plurality of groups of heat dissipation fins, wherein a plurality of heat dissipation fins in each group of the heat dissipation fins are arranged at intervals in a direction perpendicular to the arrangement direction of the plurality of heat exchange plates, and each group of the heat dissipation fins is connected between two adjacent heat exchange plates.

12. The heat exchange device according to any one of claims 1 to 11, characterized in that: The heat exchange device includes an electronic expansion valve, which is connected between the condenser and the low-temperature evaporator. The electronic expansion valve is used to reduce the pressure of the refrigerant transported from the condenser to the low-temperature evaporator.

13. A heat exchange system, characterized in that: It comprises a receiving chamber, a heat source and a heat exchange device as claimed in any one of claims 1 to 12, wherein the heat source is located in the receiving chamber, a high-temperature evaporator and a low-temperature evaporator in the heat exchange device are connected to the receiving chamber, and the heat exchange device is used to dissipate heat from the heat source.

14. The heat exchange system according to claim 13, characterized in that: The heat exchange system is a cabinet, a container or a data center.

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