Case heat dissipation device having heat pipes and cooling fins, and case

Abstract

A case heat dissipation device having heat pipes (8) and cooling fins (7), and a case. The case heat dissipation device comprises at least one radiator (6) arranged on each circuit board (4) in the up-down direction, and comprise top and bottom radiators (6); each radiator (6) comprises a plurality of rows of cooling fins (7); a vertical angle is formed between the cooling fins (7) and the circuit board (4); the top and bottom radiators (6) sandwich the circuit board (4) therebetween and the three are locked into a whole by means of screws; the heat of a computing power unit (3) is transferred to the cooling fins (7) and is taken away by flowing air; the radiator (6) is correspondingly arranged on each column of chips (5) of the computing power unit (3); heat pipes (8) are embedded in the radiator (6); the positions between the chips (5) and the heat pipes (8) are filled with thermally conductive silicone grease to ensure sufficient connection; the heat pipes (8) and the radiator (6) are connected by means of welding; the heat pipes (8) are evenly embedded into the cooling fins (7) in rows; the cooling fins (7) and the heat pipes (8) are made of different materials; the cross section of each heat pipe (8) is convex; the heat pipes (8) embedded in the top and the bottom radiators (6) are arranged in a crisscross pattern. The heat dissipation capacity of the whole machine can be improved, and the problem of nonuniform temperature distribution of the whole machine can be solved.

Description

Chassis heat dissipation device with heat pipe radiator and chassis thereof Technical Field

[0001] The present invention belongs to the field of computer technology, and in particular relates to a chassis heat dissipation device with a heat pipe heat sink and a chassis thereof. Background Art

[0002] With the rapid development of technologies like AI and the ever-increasing impact of the virtual age, the demand for powerful computers is increasing. This is particularly true for computers centered around hashing power, such as Bitcoin mining machines, where the higher the hashing power, the higher the profit. Driven by this goal, Bitcoin mining machine manufacturers are using various methods to increase hashing power and thus enhance their products' core competitiveness. However, as hashing power increases, the power consumption of the entire machine also increases, making heat dissipation a key issue that needs to be addressed.

[0003] In order to achieve higher computing power, a Bitcoin mining machine often integrates multiple computing power units, and each unit integrates a large number of chips, as shown in Figure 1. The chips are connected in parallel in groups of multiple chips (5 groups in Figure 1, a total of 52 groups) to form a small unit. The small units are connected in series through lines. The entire circuit board is powered by the left terminal, one terminal is positive and one terminal is negative, and all the small units form a loop, as shown in Figure 2. Each unit is evenly distributed with the input voltage. That is: Vunit = Vin / N, where N is the number of units. The working voltage Vunit allocated to each unit must be the same to ensure the stability of the entire circuit loop. Otherwise, the imbalance in voltage distribution will cause the chip to reduce the frequency and lose computing power. In severe cases, it will directly cause the loop to collapse and the machine to work abnormally. In order to ensure that the working voltage Vunit allocated to each unit is the same, all chips are required to work in the same state. The same state includes:

[0004] 1. Same operating frequency.

[0005] 2. Same operating temperature.

[0006] The same operating frequency can be ensured through software settings, which is very easy to achieve, but the same operating temperature is generally more difficult.

[0007] Existing computing devices often use forced air cooling, as shown in Figure 3. Air is forced into the enclosure from the right by an axial-flow fan and drawn out by a fan on the left. Chips closer to the right receive the cool air that has just entered the enclosure, while chips closer to the left receive air that has been heated by the right chip. This results in temperature discrepancies between the left and right chips. Under the same cooling conditions, the right chip will be hotter than the left, causing a voltage shift in the unit. This necessitates reducing the power consumption and heat generation of the left chip by lowering its frequency to balance the temperature, resulting in a loss of computing power.

[0008] In addition, as shown in Figure 4, since there is an axis at the center of the fan, the area projected by the fan center is shown in Figure 5. The chips in the shaded part receive less air volume due to the problem of the central axis, and take away less heat. The temperature will be higher than that of the chips in the non-shaded area. Therefore, it is necessary to reduce the operating frequency of the chips in the shaded area and reduce the heat generation to achieve temperature consistency, resulting in computing power loss.

[0009] Existing technical solutions usually adopt a denser chip arrangement at the air inlet and a sparser chip arrangement at the air outlet to reduce the temperature difference between the left and right sides, but the actual effect is limited. It is usually necessary to reduce the frequency of the chips in the high-temperature zone to the same frequency as the chips in the low-temperature zone to ensure circuit stability, and frequency reduction directly leads to a loss of computing power of the entire machine.

[0010] To solve the heat dissipation problem, many manufacturers have begun to develop liquid cooling methods, which involves immersing circuit boards in oil. Since oil has a much greater thermal conductivity than air, it can increase the power of the entire machine. However, this solution is often complex to design and produce, and the cost is very high, so the number of actual deployments is small.

[0011] Therefore, the existing technology adopts the following solution improvement:

[0012] 1. Use forced air cooling technology and add axial fans at both ends of the machine to dissipate heat. By increasing the fan speed, the air flow rate is increased, the heat exchange capacity is enhanced, and the heat dissipation capacity is improved.

[0013] 2. Increase the size of the fan to increase the air inlet section. At the same time, you can also increase the size of the radiator to increase the heat exchange area and thus improve the heat dissipation capacity.

[0014] 3. Use aluminum-based PCB to reduce thermal resistance and thus improve heat dissipation capacity.

[0015] 4. Use high thermal conductivity silicone grease to fill the gaps between the chip and the radiator, and between the PCB and the radiator to reduce thermal resistance and improve thermal conductivity.

[0016] However, the existing technology still has the following problems:

[0017] 1. Currently, Bitcoin mining machines basically use forced air cooling technology. Due to the limitation of fan speed, it is difficult to improve the heat dissipation capacity by increasing the fan speed.

[0018] 2. Because there are many chips on a single board, and the cold air has a distance from the air inlet to the air outlet, the air is pressed into the chassis by the fan, exchanges heat with the front and rear chips in turn, and is finally discharged from the chassis. The air temperature gradually rises, and therefore the temperature of the single board also shows a gradually rising distribution. This distribution can cause the air inlet temperature to be too low, the operating frequency to be too low, and computing power to be lost, and the temperature of the air outlet chip to be too high, resulting in reduced reliability.

[0019] 3. From the perspective of fan characteristics, the air volume at the center axis and edge of the fan is small, while the air volume on the projection surface of the fan blade is large, which will also lead to uneven temperature on the left and right sides of the single board.

[0020] In addition, commonly used technical terms in the prior art include:

[0021] Heat pipe: thermally conductive material, hollow inside, with a thermal conductivity of up to 20,000W / mk to 200,000W / mk. Ordinary aluminum is 200W / mk, as shown in Figure 6.

[0022] Summary of the Invention

[0023] To address the above issues, the purpose of this application is to optimize heat dissipation to ensure that the amount of heat Q dissipated by each unit through the heat dissipation system is essentially the same. The goal of this invention is to ensure the stability of the machine by optimizing heat dissipation, enabling it to operate at the highest computing power level and achieve the highest output. This improves the heat dissipation capacity of the entire machine and solves the problem of uneven temperature distribution throughout the machine.

[0024] Specifically, the present invention provides a chassis heat dissipation device with a heat pipe heat sink, the device includes: at least two axial flow fans distributed on both sides of the chassis shell, the chassis shell is used to accommodate a computing unit, and at least one computing unit, each computing unit contains at least one circuit board, each computing unit integrates multiple chips, multiple chips are arranged side by side, multiple chips are connected in parallel to form a small unit, and the small units are connected in series through lines to form a circuit board, and each circuit board is placed with at least one radiator above and below for heat dissipation, the one located on the upper side of the circuit board is the top radiator, and the one located on the circuit board is the top radiator. The bottom heat sink is located at the bottom. Each heat sink contains multiple rows of fins arranged in parallel. The front ends of the top and bottom heat sinks are each beveled outward at an angle of 20 to 50 degrees. The heat sink and the circuit board are at a vertical angle. The top heat sink is directly pressed against the chip on the circuit board, and the circuit board is placed directly on the bottom heat sink, thereby sandwiching the circuit board in the middle. The heat sink and the circuit board in the middle are pressed and locked into a whole by spring screws. Each chip on the circuit board is an independent heat generating unit. The heat of the computing power unit is transferred to the heat sink and carried away by the flowing air.

[0025] The radiator is placed on all the chips of the computing power unit. A groove with the same size as the heat pipe is cut out at the bottom of the radiator by CNC. The radiator is electroplated to achieve tinning capability. A layer of solder paste is brushed in the groove. The heat pipe is placed in the groove and welded to form a whole through high temperature. After welding into a whole, the bottom of the radiator is leveled to ensure that the bottom of the heat pipe and the bottom of the radiator are flat; the heat pipe of the radiator is placed on the chip; the chip and the heat pipe are connected by thermal conductive silicone grease, which fills the gap between the heat pipe and the chip and between the heat pipe and the circuit board to ensure full contact between the chip and the radiator. The heat pipe and the radiator are connected by welding to weld the heat pipe and the radiator into a whole;

[0026] The heat pipes are evenly embedded in the heat sink in rows; the heat sink and the heat pipes are made of different materials;

[0027] The heat pipe has a convex cross-section. Since the heat pipe has a higher thermal conductivity, the convex shape can not only add a convex surface to the original thickness of the heat pipe, thus increasing the contact surface, but also the stepped slots make it easier to fix the position of the heat pipe, making it less likely to deviate during the welding process, and can stably bring more heat Q to the heat sink.

[0028] The heat pipes embedded in the top heat sink and the bottom heat sink are arranged in a cross shape, that is, after the top and bottom heat sinks clamp the circuit board, the temperatures of all chips can be made uniform in different cross directions at the same time.

[0029] The heat of each chip in the computing unit is transferred to the top radiator and carried away by the flowing air; the heat of each chip is also transferred to the bottom radiator through the circuit board and carried away by the air.

[0030] The heat pipes of the radiator are placed on the chip, including: the top radiator and the bottom radiator are respectively placed on each column / row of chips of the computing power unit, and the bottom of the top radiator and the bottom of the bottom radiator are respectively electroplated on the surfaces that contact the circuit board, so that the heat pipes of the top radiator are placed directly above the chip; the heat pipes of the bottom radiator are evenly distributed directly below the chip.

[0031] The heat sink is made of aluminum, and the thermal conductivity k of aluminum is 200W / mk.

[0032] The heat pipe is made of copper, and its thermal conductivity coefficient k is between 20,000W / mk and 200,000W / mk, which is 100 to 1,000 times that of aluminum. The heat pipe quickly levels the temperature difference between each chip and can bring more heat to the aluminum heat sink.

[0033] At least one heat pipe welded to the bottom of the radiator is extended from one side thereof, bent along the edge of the radiator, and then inserted back into the heat dissipation tooth. The heat dissipation tooth has a reserved perforation in the middle part of the side surface for passing the bent heat pipe. Since the heat sink has a certain height, there is a temperature difference between its bottom and top, and the temperature at the top is lower. The heat pipe that is bent and inserted back into the heat dissipation tooth can bring heat to the low-temperature area closer to the top of the heat dissipation tooth.

[0034] The heat pipe is bent into a U shape on the radiator, one side of the U shape is located at the bottom of the radiator to contact the chip, and the other side of the U shape is located in the heat sink.

[0035] The heat pipes embedded in the top radiator and the bottom radiator are arranged in a cross shape, including: the heat pipes in the top radiator are arranged in a horizontal direction, and the heat pipes in the bottom radiator are arranged in a vertical direction, which can take away heat from the heat sink in the horizontal direction and the vertical direction respectively;

[0036] The heat pipes on the top radiator are arranged in a vertical direction, and the heat pipes on the bottom radiator are arranged in a horizontal direction; or in any other intersecting direction between the two, so that the heat pipes on the two radiators level the temperature from different directions.

[0037] The present invention also includes a chassis with a heat pipe heat sink, and any of the above-mentioned chassis heat dissipation devices can be applied to the chassis, and the chassis also includes:

[0038] A bracket, used to support and fix the chassis shell, fan, upper cover, computing unit and the chassis heat dissipation device, wherein the upper cover and chassis shell form the outer contour of the chassis through the bracket;

[0039] The chassis heat dissipation device and various electronic components are accommodated in the chassis shell;

[0040] The power module is located next to the fan on one side and is connected to the circuit board and control module in the chassis;

[0041] The control module is placed on the bracket above the chassis shell and below the upper cover, and is used to control the electronic components of the chassis;

[0042] The chassis heat dissipation device and computing power unit are located behind the fan to facilitate heat dissipation.

[0043] Therefore, the advantages of this application are: by adding heat pipes to industry-standard radiators and integrating the heat pipes and radiators in a specific way, this application can effectively solve the problems of uneven temperature and insufficient heat dissipation capacity, while being low-cost and convenient for production and deployment. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The drawings described herein are used to provide a further understanding of the present invention, constitute a part of this application, and do not constitute a limitation of the present invention.

[0045] FIG1 is a schematic diagram of a circuit board chip layout in the prior art.

[0046] FIG2 is a schematic diagram of chip series power supply in the prior art.

[0047] FIG3 is a schematic diagram of a cooling method of a conventional computing device in the prior art.

[0048] FIG4 is a schematic diagram of a chassis fan in the prior art.

[0049] FIG5 is a schematic diagram of the air volume distribution received by the chassis shell in the prior art.

[0050] FIG6 is a schematic diagram of a heat pipe in the prior art.

[0051] FIG7 is a schematic diagram of a computing unit and a heat sink in an embodiment of the present application.

[0052] FIG8 is a perspective view of a circuit board sandwiched between top and bottom heat sinks in an embodiment of the present application.

[0053] FIG. 9 is a side view of a circuit board sandwiched between top and bottom heat sinks in an embodiment of the present application.

[0054] FIG10 is a schematic diagram of a top heat sink and a heat pipe in an embodiment of the present application.

[0055] FIG11 is a schematic cross-sectional view of a heat sink and a heat pipe in an embodiment of the present application.

[0056] FIG12 is a schematic diagram of a bottom heat sink and a heat pipe in an embodiment of the present application.

[0057] FIG13 is a schematic diagram of a U-shaped heat pipe in an embodiment of the present application.

[0058] FIG. 14 is a schematic diagram of staggered heat pipes of top and bottom heat sinks in an embodiment of the present application.

[0059] FIG15 is a schematic diagram of the appearance of a chassis embodiment of the present application.

[0060] FIG16 is a schematic diagram of an exploded view of an embodiment of a chassis of the present application.

[0061] FIG17 is a schematic diagram of an exploded view of the heat dissipation device and the chassis in the present application. DETAILED DESCRIPTION

[0062] In order to more clearly understand the technical content and advantages of the present invention, the present invention is now further described in detail with reference to the accompanying drawings.

[0063] As shown in Figures 7 to 14, the present application designs a chassis heat dissipation device, in particular a chassis heat dissipation device with a heat pipe heat sink, which improves and enhances the heat dissipation capacity of a virtual currency mining machine. The device includes:

[0064] At least two axial fans 1 are distributed on both sides of the chassis shell 2. The chassis shell 2 is used to accommodate a computing unit 3 and at least one computing unit 3. Each computing unit 3 contains at least one circuit board 4. Each computing unit 3 integrates multiple chips 5. Multiple chips 5 are arranged side by side. The chips are connected in parallel to form a small unit. The small units are connected in series through lines to form a circuit board 4. Each circuit board 4 is placed with at least one radiator 6 on the upper and lower sides for heat dissipation. The top radiator 61 is located on the upper side of the circuit board, and the bottom radiator is located on the lower side of the circuit board. The heat sink 62 comprises a plurality of parallel rows of heat sinks 7. The front ends of the top and bottom heat sinks are each beveled outward at an angle of 20 to 50 degrees. The top heat sink 61 is directly pressed against the chip on the circuit board 4. The circuit board 4 is directly placed on the bottom heat sink 62, thereby sandwiching the circuit board 4 between the two. The heat sink 7 and the circuit board in the middle are pressed and locked into a whole by spring screws. The spring screws can effectively prevent the screws from loosening after long-term use and can also prevent the chip on the circuit board from being damaged when the circuit board is locked.

[0065] Each chip on the circuit board is an independent heat-generating unit. The heat of the computing unit 3 is transferred to the heat sink 7 and carried away by the flowing air. That is, the heat of each chip in the computing unit 3 is transferred to the top heat sink 61 and carried away by the flowing air. The heat of each chip is also transferred to the bottom heat sink 62 through the circuit board and carried away by the air.

[0066] The heat sink 6 is placed on all chips 5 of the computing unit 3, as shown in Figures 10 and 12. For clarity, the heat sink is not shown in the figures. The heat sink 6 includes: the top heat sink 61 and the bottom heat sink 62 are placed above each column / row of chips 5 of the computing unit 3, respectively. The bottom of the top heat sink 61 and the bottom of the bottom heat sink 62 are electroplated on the surface contacting the circuit board 4, so that the heat pipe 81 of the top heat sink 61 is placed directly above the chip 5; the heat pipe 82 of the bottom heat sink 62 is evenly distributed directly below the chip 5.

[0067] A groove of the same size as the heat pipe 8 is cut out at the bottom of the radiator 6 by CNC, and the radiator 6 is electroplated to achieve tinning capability. A layer of solder paste is brushed in the groove, and the heat pipe 8 is placed in the groove. The heat pipe 8 is welded to form a whole through high temperature welding. After welding into a whole, the bottom of the radiator 6 is leveled to ensure that the bottom of the heat pipe 8 and the bottom of the radiator 6 are flat; the heat pipe 8 of the radiator 6 is placed on the chip 5; the chip 5 and the heat pipe 8 are connected by thermal conductive silicone grease, which fills the gaps between the heat pipe and the chip and between the heat pipe and the circuit board 4 to ensure full contact between the chip and the radiator. The heat pipe 8 and the radiator 6 are connected by welding to weld the heat pipe and the radiator into a whole.

[0068] The heat pipes 8 are evenly embedded in the heat sink 7 in rows;

[0069] The heat sink 7 and the heat pipe 8 are made of different materials; the heat pipe has a convex cross-section. Since the heat pipe has a higher thermal conductivity, the convex shape can not only add a convex surface to the heat pipe of the original thickness, thus increasing the contact surface, but also the stepped slots make it easier to fix the position of the heat pipe, making it less likely to deviate during the welding process, and can stably bring more heat Q to the heat sink;

[0070] The heat pipes 8 embedded in the top heat sink 61 and the bottom heat sink 62 are arranged in a cross shape, that is, after the top and bottom heat sinks clamp the circuit board, the temperatures of all chips can be made uniform in different cross directions at the same time.

[0071] As shown in Figure 10, the top heat sink 61 corresponds to the top of each column of chips 5. A heat pipe 8 is embedded in the heat sink. The chip 5 and the heat pipe 8 are connected by thermal grease, and the heat pipe 8 and the heat sink 6 are connected by welding. It is known that the heat pipe 8 is a copper tube, and its thermal conductivity k is between 20,000W / mk and 200,000W / mk, which is 100 to 1,000 times that of aluminum's 200W / mk. According to the heat conduction formula Q = kA (ΔT / L), Q is the heat, k is the thermal conductivity, A represents the heat transfer area, ΔT represents the temperature difference, and L represents the heat conduction distance. From this, we can know that: ΔT = QL / kA. The temperature difference is inversely proportional to the thermal conductivity. A larger k can quickly average the temperature of different areas. The heat pipe 8 in this direction can quickly level the temperature difference between each chip in the horizontal direction, for example, to solve the problem of excessive temperature in the fan projection area. At the same time, according to the heat conduction formula, a larger k can also bring more heat Q to the aluminum heat sink 7, that is, through the copper tube 8 with a high thermal conductivity coefficient, the heat is quickly conducted to the heat sink 7, so that the air can take away more heat, thereby improving the heat dissipation capacity of the entire machine.

[0072] As shown in Figure 11, the copper tube 8 is in a convex shape. Since the thermal conductivity of the copper tube 8 is stronger, the convex shape can increase the contact area between the copper tube and the radiator. It can be seen from the formula that Q = kA (ΔT / L). The larger heat transfer area can bring more heat Q to the aluminum heat sink 7, thereby improving the overall heat dissipation capacity. Under the same conditions, the temperature of the chip (heat source) can be reduced, making the whole machine more stable and having a higher frequency increase space.

[0073] As shown in Figure 12, horizontal heat pipes 8 are embedded in the bottom heat sink 62, evenly spaced within the heat sink 6. Similarly, according to the equation: ΔT = QL / kA, vertical chip temperature differences can be quickly leveled. Furthermore, according to the heat conduction formula, a larger k value can transfer more heat Q to the aluminum heat sink 7, allowing the air to carry more heat away, thereby improving the heat dissipation capacity of the entire device.

[0074] As shown in Figure 13, in order to achieve a better heat dissipation effect, at least one heat pipe (the number is optional, one, several, or all) welded to the bottom of the radiator is extended from one side and bent along the edge of the radiator before being inserted back into the heat dissipation tooth. The heat dissipation tooth has a reserved perforation in the middle part of the side for inserting the bent heat pipe. Since the heat sink has a certain height, there is a temperature difference between its bottom and top. The top temperature is lower, and the heat pipe that is bent and inserted back into the heat dissipation tooth can bring heat to the low-temperature area closer to the top of the heat dissipation tooth. In this way, a larger temperature difference can achieve a stronger heat dissipation capacity.

[0075] In particular, the at least one heat pipe 8 is bent into a U shape at the heat sink when viewed from the side, with one side of the U being located at the bottom of the heat sink contacting the chip, and the other side of the U being located in the heat sink.

[0076] As shown in Figure 14, after the top radiator 61 and the bottom radiator 62 are clamped around the circuit board 4, the temperature of all computing chips 5 can be averaged in the cross direction, here in the horizontal direction and the vertical direction, so that the temperature of all units of the whole machine is basically the same. This avoids the situation where the operating frequency is forced to be reduced to reduce heat and achieve temperature consistency, and also ensures the stability of the operation of the circuit board 4. In addition to the heat pipes of the top radiator being arranged in the horizontal direction and the heat pipes of the bottom radiator being arranged in the vertical direction, which can take away heat from the heat sink in the horizontal and vertical directions respectively, it also includes: the heat pipes of the top radiator are arranged in the vertical direction and the heat pipes of the bottom radiator are arranged in the horizontal direction; and any other cross direction between the two, so that the heat pipes on the two radiators level the temperature from different directions. In short, a stronger heat dissipation capacity can also make the chip work at a higher frequency, thereby improving the computing power and improving the benefits of the whole machine.

[0077] As shown in FIG15 to FIG17, it is a schematic diagram of the structure of the chassis with heat pipe radiator of the present application, a chassis with heat pipe radiator, including any of the chassis heat dissipation devices 13 described above, and the chassis also includes:

[0078] Bracket 9, used to support and fix the chassis shell 2, fan 1, upper cover 12, computing unit 3 and the chassis heat sink 13. The upper cover 12 and chassis shell 2 form the chassis outer contour through the bracket 9; the chassis heat sink 13 and various electronic components are accommodated in the chassis shell 2;

[0079] The power module 10 is located next to the fan 1 on one side and is connected to the circuit board and control module in the chassis;

[0080] The control module 11 is placed on the bracket 9 and above the chassis shell 2 and below the upper cover 12, and is used to control the electronic components of the chassis;

[0081] The chassis heat dissipation device 13 and the computing unit 3 are located behind the fan 1 to facilitate heat dissipation.

[0082] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A chassis heat dissipation device with a heat pipe heat sink, the device comprising: At least two axial flow fans (1) are distributed on both sides of a chassis shell (2); the chassis shell (2) is used to accommodate a computing unit (3) and at least one computing unit (3); each computing unit (3) contains at least one circuit board (4); each computing unit integrates a plurality of chips (5); the plurality of chips (5) are arranged side by side; the chips are connected in parallel to form a small unit; the small units are connected in series through lines to form a circuit board (4); the characteristic is that: At least one heat sink (6) is placed above and below each circuit board (4) for heat dissipation. The top heat sink (61) is located on the upper side of the circuit board (4), and the bottom heat sink (62) is located on the lower side of the circuit board. Each heat sink (6) comprises a plurality of rows of heat sinks (7) arranged in parallel. The front ends of the top and bottom heat sinks respectively present an outward bevel angle, and the angle is between 20 and 50 degrees. The heat sink (7) and the circuit board (4) form a vertical angle. The top heat sink (61) is directly pressed on the chip on the circuit board (4), and the circuit board (4) is directly placed on the bottom heat sink (62), so that the circuit board (4) is sandwiched in the middle. The heat sink (7) and the circuit board in the middle are pressed and locked into a whole by spring screws. Each chip on the circuit board is an independent heat generating unit. The heat of the computing power unit (3) is transferred to the heat sink (7) and carried away by the flowing air. The heat sink (6) is placed on all the chips (5) of the computing power unit (3). A groove with the same size as the heat pipe (8) is cut out at the bottom of the heat sink (6) by CNC. The heat sink (6) is electroplated to achieve tinning capability. A layer of solder paste is brushed in the groove. The heat pipe (8) is placed in the groove and formed into a whole by high-temperature welding. After welding into a whole, the bottom of the heat sink (6) is leveled to ensure that the bottom of the heat pipe (8) and the bottom of the heat sink (6) are flat; the heat pipe (8) of the heat sink (6) is placed on the chip (5); the chip (5) and the heat pipe (8) are connected by thermal conductive silicone grease, which fills the gap between the heat pipe and the chip and between the heat pipe and the circuit board (4). To ensure that the chip and the heat sink are in full contact, the heat pipe (8) and the heat sink (6) are connected by welding to form a whole; The heat pipes (8) are evenly embedded in the heat sink (7) in rows; the heat sink (7) and the heat pipes (8) are made of different materials; The heat pipe adopts a convex cross-section shape. Since the heat pipe has a stronger thermal conductivity, the convex shape can not only add a convex surface on the basis of the original thickness of the heat pipe, that is, increase the contact surface, but also the stepped slot hole makes it easier to fix the position of the heat pipe, and is not easy to deviate during the welding process, so that more heat Q can be stably brought to the heat sink; The heat pipes (8) embedded in the top heat sink (61) and the bottom heat sink (62) are arranged in a cross shape, that is, after the top and bottom heat sinks clamp the circuit board, the temperatures of all chips can be made uniform in different cross directions at the same time.

2. A chassis heat dissipation device with a heat pipe heat sink according to claim 1, characterized in that: The heat of each chip of the computing unit (3) is transferred to the top heat sink (61) and carried away by the flowing air; the heat of each chip is also transferred to the bottom heat sink (62) through the circuit board and carried away by the air.

3. The chassis heat dissipation device with heat pipe heat sink according to claim 1, characterized in that: The heat pipe (8) of the heat sink (6) is placed on the chip (5), including: the top heat sink (61) and the bottom heat sink (62) are respectively placed above each column / row of chips (5) of the computing power unit (3); the bottom of the top heat sink (61) and the bottom of the bottom heat sink (62) are respectively electroplated on the surface contacting the circuit board (4), so that the heat pipe (81) of the top heat sink (61) is placed directly above the chip (5); and the heat pipe (82) of the bottom heat sink (62) is evenly distributed directly below the chip (5).

4. The chassis heat dissipation device with heat pipe heat sink according to claim 1, characterized in that: The heat sink is made of aluminum, and the thermal conductivity k of aluminum is 200W / mk.

5. A chassis heat dissipation device with heat pipe heat sink according to claim 4, characterized in that: The heat pipe is made of copper, and its thermal conductivity k is between 20000W / mk and 200000W / mk, which is 100 to 1000 times that of aluminum. The heat pipe can quickly level the temperature difference between each chip and bring more heat to the aluminum heat sink.

6. A chassis heat dissipation device with heat pipe heat sink according to claim 5, characterized in that: At least one heat pipe welded to the bottom of the radiator is extended from one side thereof, bent along the edge of the radiator, and then inserted back into the heat dissipation tooth. A perforation is reserved in the middle part of the side of the heat dissipation tooth for passing the bent heat pipe. Since the heat sink has a certain height, there is a temperature difference between the bottom and the top, and the temperature at the top is lower. The heat pipe that is bent and inserted back into the heat dissipation tooth can bring heat to a low-temperature area closer to the top of the heat dissipation tooth.

7. A chassis heat dissipation device with heat pipe heat sink according to claim 6, characterized in that: The heat pipe is bent in a U shape on the heat sink, one side of the U shape is located at the bottom of the heat sink to contact the chip, and the other side of the U shape is located in the heat sink.

8. The chassis heat dissipation device with heat pipe heat sink according to claim 1, characterized in that: The heat pipes (8) embedded in the top radiator (61) and the bottom radiator (62) are arranged in a cross shape and include: The heat pipes on the top radiator are arranged horizontally, and the heat pipes on the bottom radiator are arranged vertically, which can take away heat from the radiator horizontally and vertically respectively; The heat pipes on the top radiator are arranged in a vertical direction, and the heat pipes on the bottom radiator are arranged in a horizontal direction; or in any other intersecting directions between the two, so that the heat pipes on the two radiators level the temperature from different directions.

9. A chassis with a heat pipe radiator, characterized in that: The chassis heat dissipation device (13) described in any one of claims 1 to 8 is applied to the chassis, and the chassis further comprises: A bracket (9) is used to support and fix the chassis shell (2), the fan (1), the upper cover (12), the computing unit (3) and the chassis heat dissipation device (13), wherein the upper cover (12) and the chassis shell (2) form an outer contour of the chassis through the bracket (9); The chassis heat dissipation device (13) and various electronic components are accommodated in the chassis shell (2); A power module (10) is located next to the fan (1) on one side and is connected to the circuit board and the control module in the chassis; A control module (11) is placed on the bracket (9) above the chassis shell (2) and below the upper cover (12), and is used to control the electronic components of the chassis; The chassis heat dissipation device (13) and the computing unit (3) are located behind the fan (1) to facilitate heat dissipation.

Images