Glass plate

Abstract

A glass plate (1), comprising a first compressive stress area (31) and a first tensile stress area (32) that are sequentially adjacent to each other from the edge to the inside, wherein the width of the first compressive stress area (31) is K1, and the width of the first tensile stress area (32) is K2; at least one surface of the glass plate (1) is provided with a conductive element (2), the orthographic projection of the conductive element (2) on the surface of the glass plate (1) does not overlap the first tensile stress area (32), the distance T between the side of the conductive element (2) close to the edge of the glass plate (1) and the edge of the glass plate (1) is greater than or equal to K1+K2, and the tensile stress in an orthographic projection area of the conductive element (2) on the surface of the glass plate (1) is less than or equal to 9 MPa. By controlling the position of the conductive element on the glass plate, in the forming process of the glass plate, the stress area formed by the contact between a mold and the glass plate overlaps or offsets the stress area formed by the conductive element, so that new stress distribution is formed at the edge of the glass plate, reducing the risk of glass plate breakage.

Description

glass plate

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This disclosure claims priority to a Chinese patent application filed with the China Patent Office on July 17, 2023, with application number 2023108723775 and titled “Glass Sheet.” The entire contents of the patent application are incorporated herein by reference. Technical Field

[0003] The present application relates to the field of glass technology. Background Art

[0004] In automotive glass, products with antennas or heating wires may experience a risk of cracking at the conductive element location due to improper edge glaze or improper design of the conductive element location. During the subsequent glass sheet forming process, the tensile stress generated by the conductive element near the edge of the glass sheet and the tensile stress generated by the mold supporting the edge of the glass sheet may be superimposed on each other, resulting in excessive tensile stress at the conductive element location.

[0005] Summary of the Invention

[0006] According to various embodiments of the present application, the present application provides a glass plate.

[0007] A glass plate, comprising a first compressive stress zone and a first tensile stress zone adjacent to each other from an edge inward, wherein the first compressive stress zone has a width K1 and the first tensile stress zone has a width K2;

[0008] A conductive element is provided on at least one surface of the glass plate, an orthographic projection of the conductive element on the surface of the glass plate does not overlap with the first tensile stress zone, a distance T ≥ K1 + K2 between a side of the conductive element close to an edge of the glass plate and the edge of the glass plate, and a tensile stress of the orthographic projection area of ​​the conductive element on the surface of the glass plate is less than or equal to 9 MPa.

[0009] Specifically, the distance between the side of the first tensile stress zone close to the glass edge and the glass edge is 5mm≤x1≤15mm, and the distance between the side of the first tensile stress zone away from the glass edge and the glass edge is 20mm≤x2≤35mm.

[0010] Specifically, the width of the first compressive stress region K1≤x1, and the width of the first tensile stress region K2=x2-x1.

[0011] Specifically, the distance T between the side of the conductive element close to the edge of the glass plate and the edge of the glass plate is ≥30 mm.

[0012] Specifically, the glass sheet further includes a second compressive stress zone, and a second tensile stress zone adjacent to the second compressive stress zone and located on a side of the second compressive stress zone away from an edge of the glass sheet. The width of the second compressive stress zone is K3, and the width of the second tensile stress zone is K4. The distance T between the side of the conductive element close to the edge of the glass sheet and the edge of the glass sheet is ≥ K3 + K4.

[0013] Specifically, the distance between the side of the second tensile stress zone close to the glass edge and the glass edge is 25mm≤x3≤30mm, and the distance between the side of the second tensile stress zone away from the glass edge and the glass edge is 45mm≤x4≤50mm.

[0014] Specifically, the width of the second compressive stress zone is K3≤x3, and the width of the second tensile stress zone is K4=x4-x3.

[0015] Specifically, the distance T between the side of the conductive element close to the edge of the glass plate and the edge of the glass plate is ≥50 mm.

[0016] Specifically, the glass plate further includes a first mold projection area located at the edge, the first compressive stress area is located within the first mold projection area, and the width of the first mold projection area is 8 mm to 12 mm.

[0017] Specifically, the glass plate also includes a second mold projection area, which is located on the side of the first mold projection area away from the edge of the glass plate. The distance between the second mold projection area and the first mold projection area is 5mm to 15mm, and the width of the second mold projection area is 3mm to 8mm.

[0018] Specifically, the width of the conductive element is 15 mm to 20 mm.

[0019] Specifically, the conductive element is a busbar printed or bonded on the surface of the glass plate, and the busbar includes at least one of silver paste and copper foil.

[0020] Specifically, the glass plate further includes an ink layer, the ink layer is arranged on the surface of the glass plate and located at the edge of the glass plate, and the conductive element is arranged on the surface of the ink layer.

[0021] Specifically, a functional element is further provided on the surface of the glass plate, the conductive element is electrically connected to the functional element, and the functional element includes at least one of an electric heating film, a conductive wire or a conductive silver paste.

[0022] The details of one or more embodiments of the present application are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the present application will become apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG1 is a schematic diagram showing the structure of a glass plate in this application;

[0024] FIG2 is a schematic diagram showing the position distribution of the first mold projection area of ​​the glass plate in this application;

[0025] FIG3 is a schematic diagram showing the position distribution of the first compressive stress zone and the first tensile stress zone of the glass sheet in this application;

[0026] FIG4 is a schematic diagram showing the position distribution of the second mold projection area of ​​the glass plate in this application;

[0027] FIG5 is a schematic diagram showing the position distribution of the second compressive stress zone and the second tensile stress zone of the glass plate in this application;

[0028] Description of labels:

[0029] 1. Glass plate; 2. Conductive element; 31. First compressive stress zone; 32. First tensile stress zone; 41. Second compressive stress zone; 42. Second tensile stress zone; 51. First mold projection zone; 52. Second mold projection zone; 61. Concave mold; 62. Inner molding ring; 7. Ink layer; 8. Functional element. DETAILED DESCRIPTION

[0030] In order to explain the technical content, achieved objectives and effects of this application in detail, the following is an explanation in conjunction with the implementation methods and the accompanying drawings.

[0031] Referring to FIG. 1 , the present application discloses a glass sheet 1 having a conductive element 2 for electrical heating disposed on its surface. Furthermore, conductive elements 2 are disposed on both sides of a functional element 8, each electrically connected to the functional element 8. The conductive elements 2 can be connected to an external power source, energizing the functional element 8 to generate heat, thereby electrically heating the glass sheet 1. An ink layer 7 is also disposed on the edge of the glass sheet 1, with the conductive elements 2 located within the ink layer 7. This ensures that, after the glass sheet 1 is mounted on a vehicle body, the conductive elements 2 are obscured by the ink layer 7, thereby achieving an aesthetically pleasing appearance. After being bent, the glass sheet 1 exhibits different curvatures in the X and Y directions, respectively, resulting in a complex curved surface having curvatures in at least two directions. While the glass sheet 1 shown in FIG. 1 is rectangular, in certain embodiments, the glass sheet 1 may alternatively be a trapezoid, triangle, or other shape.

[0032] As shown in FIG3 , the glass plate 1 includes an upper surface oriented in the same direction as the Z direction in FIG3 and a lower surface oriented in the opposite direction. In the embodiment shown in FIG3 , the conductive element 2, the ink layer 7, and the conductive element 2 are all located on the upper surface of the glass plate 1. In other embodiments, the ink layer 7 may also be located on the lower surface of the glass plate 1.

[0033] As shown in Figure 3, the glass sheet 1 includes, from the edge inward, a first compressive stress zone 31 and a first tensile stress zone 32, adjacent to each other. The width of the first compressive stress zone 31 is K1, and the width of the first tensile stress zone 32 is K2. During the bending process, the glass sheet 1 is supported on a ring-shaped mold. The inner edge of the mold's contact point with the glass sheet 1 forms the boundary between the first compressive stress zone 31 and the first tensile stress zone 32. The first compressive stress zone 31 is located near the inner edge of the mold's contact point with the glass sheet 1, close to the edge of the glass sheet. The first compressive stress zone 31 is primarily formed by the contact between the mold and the glass sheet 1. Because the edge of the glass sheet 1 is supported by the mold during the forming process, the cooling rate at the edge is inconsistent with that of the interior of the glass, resulting in the formation of the first compressive stress zone 31 with compressive stress at the edge. A corresponding first tensile stress zone 32 forms near the center of the glass sheet 1, i.e., the inner edge of the mold's contact point with the glass sheet 1, close to the center of the glass sheet 1. The mold generally refers to a die 61 used to support the forming of the glass plate 1. The die 61 is annular and supports the edge of the glass plate 1 from the lower surface of the glass plate 1. Since the die 61 is annular, the first compressive stress zone 31 will also form a ring with a similar shape to the die 61, and the first tensile stress zone 32 will also be arranged in a ring shape on the side of the first compressive stress zone 31 away from the edge of the glass plate 1.

[0034] As shown in FIG3 , a conductive element 2 is provided on at least one surface of the glass plate 1. The orthographic projection of the conductive element 2 on the surface of the glass plate 1 does not overlap with the first tensile stress zone 32. The distance T between the side of the conductive element 2 close to the edge of the glass plate 1 and the edge of the glass plate 1 is greater than or equal to K1+K2. The tensile stress of the orthographic projection area of ​​the conductive element 2 on the surface of the glass plate 1 is less than or equal to 9 MPa.

[0035] The conductive element 2 is preferably disposed on the upper surface of the glass plate 1. In some embodiments, the conductive element 2 is a busbar printed or bonded to the upper surface of the glass plate 1, and the busbar comprises at least one of silver paste or copper foil. The conductive element 2 primarily serves to guide current. During subsequent processing of the glass plate 1, terminals for conducting electricity will need to be soldered to the conductive element 2.

[0036] In certain embodiments, as shown in FIG1 , a functional element 8 is further provided on the surface of the glass sheet 1. The conductive element 2 is electrically connected to the functional element 8. The functional element 8 comprises at least one of an electric heating film, a conductive wire, or a conductive silver paste. After the functional element 8 is electrically connected to the conductive element 2, and the conductive element 2 is connected to an external power source via terminals soldered to its surface, the functional element 8 can be energized, thereby achieving auxiliary functions such as electric heating or signal transmission.

[0037] Furthermore, during the forming process of the glass sheet 1, tensile stress is generated in the area within the projection of the conductive element 2 onto the surface of the glass sheet 1. The range of tensile stress generated by the conductive element 2 on the surface of the glass sheet 1 does not exceed the projection of the conductive element 2 onto the surface of the glass sheet 1. That is, the width of the tensile stress generated by the conductive element 2 on the surface of the glass sheet 1 does not exceed the width of the conductive element 2 itself. However, compressive stress is generated in the areas on both sides of the tensile stress range generated by the conductive element 2, namely, the side near the edge of the glass sheet 1 and the side away from the edge of the glass sheet 1. Therefore, if the orthographic projection of the conductive element 2 on the surface of the glass sheet 1 overlaps or partially overlaps with the first tensile stress zone 32, the tensile stress of the conductive element 2 and the tensile stress of the first compressive stress zone are superimposed. After superposition, the tensile stress value in the area of ​​the glass sheet 1 corresponding to the conductive element 2 can reach 15 MPa. At this point, the risk of cracking of the glass sheet 1 is significantly increased, especially after the terminal is welded to the conductive element 2, where the possibility of cracking at the weld is further increased. By ensuring that the orthographic projection of the conductive element 2 on the surface of the glass plate 1 does not overlap with the first tensile stress zone 32 and that the distance T between the side of the conductive element 2 closest to the edge of the glass plate 1 and the edge of the glass plate 1 is greater than or equal to K1+K2, the orthographic projection of the conductive element 2 on the surface of the glass plate 1 can completely avoid the first tensile stress zone 32 of the glass plate 1. Furthermore, the compressive stress exerted by the conductive element 2 on the glass plate 1 can be offset by the tensile stress in the first tensile stress zone 32, thereby reducing the tensile stress in the first tensile stress zone 32.

[0038] In certain embodiments, the distance between the side of the first tensile stress zone 32 near the glass edge and the glass edge is 5 mm ≤ x1 ≤ 15 mm, and the distance between the side of the first tensile stress zone 32 away from the glass edge and the glass edge is 20 mm ≤ x2 ≤ 35 mm. In certain specific embodiments, the distance x1 between the side of the first tensile stress zone 32 near the glass edge and the glass edge is 5 mm, 8 mm, 10 mm, 15 mm, etc., and the distance x2 between the side of the first tensile stress zone 32 away from the glass edge and the glass edge is 20 mm, 25 mm, 30 mm, 35 mm, etc. The values ​​within the above distance ranges are merely examples, and the actual distances between the first tensile stress zone 32 and the glass edge are not limited to the above specific values.

[0039] In some embodiments, the width K1 of the first compressive stress zone 31 is ≤ x1, and the width K2 of the first tensile stress zone 32 is ≤ x2-x1. The width K1 of the first compressive stress zone 31 extends from the inner edge of the contact point between the mold and the glass sheet 1 toward the edge of the glass sheet 1. Since the first tensile stress zone 32 and the first compressive stress zone 31 are adjacent, the maximum width of the first compressive stress zone 31 does not exceed the distance between the side of the first tensile stress zone 32 closest to the glass edge and the glass edge. In some embodiments, the width of the first compressive stress zone 31 is equal to the distance between the side of the first tensile stress zone 32 closest to the glass edge and the glass edge. For example, if the distance x1 between the side of the first tensile stress zone 32 closest to the glass edge and the glass edge is 8 mm, the width K1 of the first compressive stress zone 31 is ≤ 8 mm. Similarly, when x1 is 10 mm, the width K1 of the first compressive stress zone 31 is ≤ 10 mm.

[0040] Secondly, the width of the first tensile stress zone 32 is the difference between its two side edges. Taking the example where the distance x1 between the side of the first tensile stress zone 32 close to the glass edge and the glass edge is 8 mm, and the distance x2 between the side of the first tensile stress zone 32 away from the glass edge and the glass edge is 25 mm, then the width K2 of the first tensile stress zone 32 is 17 mm. Similarly, when x1 is 10 mm and x2 is 30 mm, the width K3 of the first tensile stress zone 32 is 20 mm.

[0041] In certain embodiments, the distance T between the side of the conductive element 2 near the edge of the glass sheet 1 and the edge of the glass sheet 1 is ≥30 mm. When the glass sheet 1 is press-formed using a die 61 without an inner molding ring 62, the distance T ≥30 mm between the side of the conductive element 2 near the edge of the glass sheet 1 and the edge of the glass sheet 1 allows the conductive element 2 to be positioned away from the first tensile stress zone 32 formed by the contact between the die 61 and the glass sheet 1, thereby reducing the risk of the glass sheet 1 cracking.

[0042] In certain embodiments, as shown in FIG2 , the glass sheet 1 further includes a first mold projection area 51 located at an edge, the first compressive stress zone 31 located within the first mold projection area 51 , and the width of the first mold projection area 51 is 8 to 12 mm. The mold used for glass molding is generally a concave mold 61. The first mold projection area 51 is the projection area of ​​the concave mold 61 onto the glass. The concave mold 61 is used to support the glass sheet 1 during molding, and the actual contact point between the glass sheet 1 and the concave mold 61 is also located within the first mold projection area 51. The inner edge of the contact point between the concave mold 61 and the glass sheet 1 forms the boundary between the first compressive stress zone 31 and the first tensile stress zone 32. In other words, the inner edge of the first mold projection area 51 forms the boundary between the first compressive stress zone 31 and the first tensile stress zone 32. The first compressive stress zone 31 is located at the inner edge of the first mold projection area 51, close to the edge of the glass plate 1. Therefore, the first compressive stress zone 31 is located in the first mold projection area 51, and the width of the first mold projection area 51 is equal to or similar to the width of the first compressive stress zone 31. The width of the first mold projection area 51 can be 8 mm, 10 mm, 12 mm, etc. In some embodiments, the width of the first compressive stress zone 31 is smaller than the width of the first mold projection area 51.

[0043] In certain embodiments, as shown in FIG5 , the glass sheet 1 further includes a second compressive stress zone 41 and a second tensile stress zone 42 adjacent to the second compressive stress zone 41 and located on the side of the second compressive stress zone 41 away from the edge of the glass sheet 1. The width of the second compressive stress zone 41 is K3, and the width of the second tensile stress zone 42 is K4. The distance T between the side of the conductive element 2 closest to the edge of the glass sheet 1 and the edge of the glass sheet 1 is ≥ K3 + K4. The second compressive stress zone 41 and the second tensile stress zone 42 are formed by the contact between the inner molding ring 62 and the glass sheet 1. If the orthographic projection of the conductive element 2 on the surface of the glass sheet 1 overlaps or partially overlaps with the second tensile stress zone 42, the tensile stress of the conductive element 2 and the tensile stress of the second compressive stress zone are superimposed. After superposition, the tensile stress value in the area of ​​the glass sheet 1 corresponding to the conductive element 2 can reach 15 MPa. At this point, the risk of cracking of the glass sheet 1 is significantly increased, especially after the terminal is welded to the conductive element 2, where the possibility of cracking at the weld is further increased. By setting the distance T between the side of the conductive element 2 closest to the edge of the glass plate 1 and the edge of the glass plate 1 to be ≥ K3 + K4, the orthographic projection of the conductive element 2 on the surface of the glass plate 1 can completely avoid the second tensile stress zone 42 of the glass plate 1. At the same time, the compressive stress generated by the conductive element 2 on the glass plate 1 can also offset the tensile stress in the second tensile stress zone 42, thereby achieving the effect of reducing the tensile stress in the second tensile stress zone 42.

[0044] In certain embodiments, as shown in FIG4 , the glass sheet 1 further comprises a first mold projection area 51 located at the edge, the first compressive stress zone 31 being located within the first mold projection area 51 , and the width of the first mold projection area 51 being 8 to 12 mm. The glass sheet 1 further comprises a second mold projection area 52 , which is located on the side of the first mold projection area 51 away from the edge of the glass sheet 1 , the spacing between the second mold projection area 52 and the first mold projection area 51 being 5 to 15 mm, and the width of the second mold projection area 52 being 3 to 8 mm. The mold used for molding the glass sheet 1 is generally a concave mold 61 , and the first mold projection area 51 is the projection area of ​​the concave mold 61 on the glass sheet 1 . The concave mold 61 is used to support the glass sheet 1 during the molding process, and the actual contact point between the glass sheet 1 and the concave mold 61 is also located within the first mold projection area 51 . The inner edge of the contact point between the die 61 and the glass sheet 1 forms the boundary between the first compressive stress zone 31 and the first tensile stress zone 32. That is, the inner edge of the first mold projection area 51 forms the boundary between the first compressive stress zone 31 and the first tensile stress zone 32. The first compressive stress zone 31 is located at the inner edge of the first mold projection area 51, near the edge of the glass sheet 1. Therefore, the first compressive stress zone 31 is located within the first mold projection area 51, and the width of the first mold projection area 51 is equal to or similar to the width of the first compressive stress zone 31. The width of the first mold projection area 51 can be 8 mm, 10 mm, 12 mm, etc. In some embodiments, the width of the first compressive stress zone 31 is less than the width of the first mold projection area 51.

[0045] In addition, as shown in Figures 4 and 5, the mold used to form the glass sheet 1 not only has an annular female mold 61, but some molds also have an inner molding ring 62 located inside the female mold 61. The inner molding ring 62 has the same function as the female mold 61, both of which are used to support the glass sheet 1 during the molding process. The inner molding ring 62 generally contacts the glass sheet 1 before the female mold 61 to pre-shape the glass sheet 1. This prevents the excessive weight of the middle portion of the glass sheet 1 from being too heavy when placed directly on the female mold 61, resulting in uncontrollable molding of the glass sheet 1 and warping of the edges during the molding process. The area where the inner molding ring 62 is projected on the glass plate 1 is the second mold projection area 52. Since the inner molding ring 62 does not contact the die 61, there is generally a distance of 5 to 15 mm between the second mold projection area 52 and the first mold projection area 51. In some specific embodiments, the distance between the second mold projection area 52 and the first mold projection area 51 can be 5 mm, 8 mm, 10 mm, 12 mm, 15 mm, etc. In some embodiments, the distance between the second mold projection area 52 and the first mold projection area 51 is in the range of 5 to 10 mm.

[0046] When the inner molding ring 62 actually contacts the glass sheet 1, it also forms compressive and tensile stress zones on the glass sheet 1, namely the second compressive stress zone 41 and the second tensile stress zone 42 described above. The inner edge of the inner molding ring 62 at the point of contact with the glass sheet 1 forms the boundary between the second compressive stress zone 41 and the second tensile stress zone 42, namely the inner edge of the second mold projection area 52. The second compressive stress zone 41 is located near the inner edge of the second mold projection area 52, near the edge of the glass sheet 1. However, the second compressive stress zone 41 is not limited to the second mold projection area 52. In the embodiment shown in FIG5 , the second compressive stress zone 41 extends from the inner edge of the second mold projection area 52 to the outer edge of the glass sheet 1. Thus, the second compressive stress zone 41 and the first compressive stress zone 31 overlap, thereby increasing the compressive stress within the first compressive stress zone 31 and improving the strength of the glass sheet edge. At the same time, the second compressive stress zone 41 partially overlaps with the first tensile stress zone 32, so that the tensile stress in the overlapping portion of the second compressive stress zone 41 and the first tensile stress zone 32 is reduced or even disappears, or compressive stress is formed, which is beneficial to improving the strength of the glass plate edge.

[0047] In addition, the distance T between the side of the conductive element 2 close to the edge of the glass plate 1 and the edge of the glass plate 1 is greater than the sum of the widths of the second compressive stress zone 41 and the second tensile stress zone 42. This can further prevent the tensile stress formed on the glass plate 1 by the conductive element 2 from overlapping with the first tensile stress zone 32 or the second tensile stress zone 42, thereby reducing the risk of the glass plate 1 cracking.

[0048] In certain embodiments, the distance between the first tensile stress zone 32 and the glass edge, located on a side away from the glass edge, is 20 mm ≤ x2 ≤ 35 mm. The second tensile stress zone 42 is located on a side of the first tensile stress zone 32 away from the glass edge, and the distance between the second tensile stress zone 42 and the glass edge, located on a side closer to the glass edge, is 25 mm ≤ x3 ≤ 30 mm. The distance between the second tensile stress zone 42 and the glass edge, located on a side closer to the glass edge, is 45 mm ≤ x4 ≤ 50 mm. In certain specific embodiments, the distance x3 between the second tensile stress zone 42 and the glass edge, located on a side closer to the glass edge, is 25 mm, 28 mm, 30 mm, etc., and the distance x4 between the second tensile stress zone 42 and the glass edge, located on a side closer to the glass edge, is 45 mm, 48 mm, 50 mm, etc. The values ​​within the above distance ranges are merely examples. The actual distance between the second tensile stress zone 42 and the glass edge depends on the distribution of the first tensile stress zone 32 and the second compressive stress zone 41.

[0049] In some embodiments, the width K3 of the second compressive stress zone 41 is ≤ x3, and the width of the second tensile stress zone 42 is K4 = x4 - x3. The second compressive stress zone 41 extends from the inner edge of the second mold projection area 52 and can extend as far as the outer edge of the glass sheet 1. In this case, the width K3 of the second compressive stress zone 41 is equal to x3. In some embodiments, the second compressive stress zone 41 does not reach the outer edge of the glass sheet 1, that is, the width K3 of the second compressive stress zone 41 is less than x3. Furthermore, for example, if the distance x3 between the side of the second tensile stress zone 42 closest to the glass edge and the glass edge is 28 mm, the maximum width K3 of the second compressive stress zone 41 is 28 mm. The second tensile stress zone 42 is adjacent to the second compressive stress zone 41. Therefore, taking the case where the distance x3 between the side of the second tensile stress zone 42 close to the glass edge and the glass edge is 28 mm, and the distance x4 between the side of the second tensile stress zone 42 away from the glass edge and the glass edge is 50 mm as an example, the width K4 of the second tensile stress zone 42 is 22 mm.

[0050] In certain embodiments, the distance T between the side of the conductive element 2 proximate to the edge of the glass sheet 1 and the edge of the glass sheet 1 is ≥50 mm. When the glass sheet 1 is press-formed using a die 61 with an inner molding ring 62, the distance T ≥50 mm between the side of the conductive element 2 proximate to the edge of the glass sheet 1 and the edge of the glass sheet 1 allows the conductive element 2 to be positioned away from the first tensile stress zone 32 formed by contact between the die 61 and the glass sheet 1 and the second tensile stress zone 42 formed by contact between the inner molding ring 62 and the glass sheet 1, thereby reducing the risk of the glass sheet 1 cracking.

[0051] In certain embodiments, the width of the conductive element 2 is 15-25 mm. The tensile stress generated by the conductive element 2 on the glass sheet 1 is related to the width of the conductive element 2 itself. When the width of the conductive element 2 is 15-25 mm, the tensile stress generated by the conductive element 2 on the glass sheet 1 is approximately 8-10 MPa. Therefore, when the conductive element 2 does not overlap with the first tensile stress region 32 or the second tensile stress region 42, the tensile stress generated by the conductive element 2 within this width range can effectively offset the compressive stress of the glass sheet 1 itself, thereby ensuring that the tensile stress of the orthographic projection of the conductive element 2 on the surface of the glass sheet 1 meets the requirement of less than or equal to 9 MPa. Furthermore, the compressive stress generated by the conductive element 2 on the surface of the glass sheet 1 on both sides of the conductive element 2 can also partially overlap with the first tensile stress region 32 or the second tensile stress region 42, thereby reducing the tensile stress value of the first tensile stress region 32 or the second tensile stress region 42 to a certain extent.

[0052] In certain embodiments, as shown in FIG1 , the glass sheet 1 further includes an ink layer 7 disposed on the surface of the glass sheet 1 and at the edge of the glass sheet 1 , and the conductive element 2 is disposed on the surface of the ink layer 7 . The ink layer 7 is generally disposed around the edge of the glass sheet 1 . Because the glass surface does not have good bonding properties, the ink layer 7 needs to be printed on the glass surface to ensure good bonding between the glass sheet 1 and the attachments used for connection. The ink layer 7 also serves to shield the attachments connecting the glass sheet 1 to the vehicle body sheet metal, thereby achieving a certain aesthetic effect. Therefore, by disposing the conductive element 2 on the surface of the ink layer 7 , the bonding between the conductive element 2 and the surface of the glass sheet 1 is improved. Furthermore, the ink layer 7 shields the conductive element 2, thereby enhancing the overall aesthetics of the glass sheet 1 .

[0053] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent transformations made using the contents of the present application specification and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A glass plate, comprising a first compressive stress zone and a first tensile stress zone adjacent to each other from an edge to an inside, wherein the width of the first compressive stress zone is K1, and the width of the first tensile stress zone is K2; A conductive element is provided on at least one surface of the glass plate, an orthographic projection of the conductive element on the surface of the glass plate does not overlap with the first tensile stress zone, a distance T≥K1+K2 between a side of the conductive element close to an edge of the glass plate and the edge of the glass plate, and a tensile stress in an orthographic projection area of ​​the conductive element on the surface of the glass plate is less than or equal to 9 MPa.

2. The glass sheet according to claim 1, wherein: The distance between the side of the first tensile stress zone close to the glass edge and the glass edge is 5mm≤x1≤15mm, and the distance between the side of the first tensile stress zone away from the glass edge and the glass edge is 20mm≤x2≤35mm.

3. The glass sheet according to claim 2, wherein: The width of the first compressive stress zone is K1≤x1, and the width of the first tensile stress zone is K2=x2-x1.

4. The glass sheet according to any one of claims 1 to 3, wherein: The distance T between the side of the conductive element close to the edge of the glass plate and the edge of the glass plate is ≥30 mm.

5. The glass sheet according to any one of claims 1 to 4, wherein: The glass plate also includes a second compressive stress zone, and a second tensile stress zone adjacent to the second compressive stress zone and located on a side of the second compressive stress zone away from an edge of the glass plate, the width of the second compressive stress zone is K3, and the width of the second tensile stress zone is K4; a distance T≥K3+K4 between a side of the conductive element close to the edge of the glass plate and the edge of the glass plate.

6. The glass sheet according to claim 5, wherein: The distance between the side of the second tensile stress zone close to the glass edge and the glass edge is 25mm≤x3≤30mm, and the distance between the side of the second tensile stress zone away from the glass edge and the glass edge is 45mm≤x4≤50mm.

7. The glass sheet according to claim 6, wherein: The width of the second compressive stress zone is K3≤x3, and the width of the second tensile stress zone is K4=x4-x3.

8. The glass sheet according to any one of claims 5 to 7, wherein: The distance T between the side of the conductive element close to the edge of the glass plate and the edge of the glass plate is ≥50 mm.

9. The glass sheet according to any one of claims 5 to 8, wherein: The second compressive stress region and the first compressive stress region overlap each other.

10. The glass sheet according to any one of claims 5 to 9, wherein: The second compressive stress region partially overlaps with the first tensile stress region.

11. The glass sheet according to any one of claims 1 to 10, wherein: The glass plate further includes a first mold projection area located at the edge, the first compressive stress area is located in the first mold projection area, and the width of the first mold projection area is 8 mm to 12 mm.

12. The glass sheet according to claim 11, wherein: The inner edge of the first mold projection area forms a boundary line between the first compressive stress area and the first tensile stress area.

13. The glass sheet according to any one of claims 11 to 12, wherein: The glass plate also includes a second mold projection area, which is located on the side of the first mold projection area away from the edge of the glass plate. The distance between the second mold projection area and the first mold projection area is 5mm to 15mm, and the width of the second mold projection area is 3mm to 8mm.

14. The glass sheet according to claim 13, wherein: The inner edge of the second mold projection area forms a boundary line between the second compressive stress area and the second tensile stress area.

15. The glass sheet according to any one of claims 1 to 14, wherein: The width of the conductive element is 15 mm to 20 mm.

16. The glass sheet according to any one of claims 1 to 15, wherein: The conductive element is a busbar printed or bonded on the surface of the glass plate, and the busbar includes at least one of silver paste or copper foil.

17. The glass sheet according to any one of claims 1 to 16, wherein: The glass plate further comprises an ink layer, which is arranged on the surface of the glass plate and located at the edge of the glass plate, and the conductive element is arranged on the surface of the ink layer.

18. The glass sheet according to any one of claims 1 to 17, wherein: A functional element is also arranged on the surface of the glass plate, the conductive element is electrically connected to the functional element, and the functional element includes at least one of an electric heating film, a conductive wire or a conductive silver paste.

19. The glass sheet according to any one of claims 1 to 18, wherein: The range of tensile stress formed by the conductive element on the surface of the glass plate will not exceed the projection range of the conductive element on the surface of the glass plate.

20. The glass sheet according to any one of claims 1 to 19, wherein: Part of the regions on both sides of the tensile stress range formed by the conductive element will be affected by the conductive element to form compressive stress.

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