Chip deposition region estimation device, chip deposition region estimation method, and chip removal device

Abstract

This chip deposition region estimation device (2) is configured so as to comprise: a cutting information acquisition unit (11) that acquires cutting information including any one information among information indicating a material of a cutting object (50) by a processing machine, information indicating a cutting method of the processing machine with respect to the cutting object (50), or information indicating a tool used when the processing machine cuts the cutting object (50); and a chip deposition region estimation unit (12) that estimates, on the basis of the cutting information acquired by the cutting information acquisition unit (11), a chip deposition region (56) that is a region in which chips generated from the cutting object (50) are deposited when the processing machine cuts the cutting object (50).

Description

Chip accumulation area estimation device, chip accumulation area estimation method, and chip removal device

[0001] The present disclosure relates to a chip accumulation area estimation device, a chip accumulation area estimation method, and a chip removal device.

[0002] There is a chip accumulation area estimation device that estimates a chip accumulation area, which is an area where chips generated from a cutting object accumulate when the cutting object is cut by a processing machine. For example, Patent Document 1 discloses an example of such a chip accumulation area estimation device, which is a machine tool system equipped with a scattering direction calculation unit. The scattering direction calculation unit acquires, from a camera, a captured image showing how the processing machine is cutting the cutting object. The scattering direction calculation unit identifies the chip accumulation area by calculating the scattering direction of the chips based on the captured image.

[0003] Japanese Patent Application Laid-Open No. 2021-94624

[0004] In the machine tool system disclosed in Patent Document 1, even if the scattering direction calculation unit monitors the captured video showing the cutting of the workpiece by the processing machine, it may not be able to confirm chips generated from the workpiece. For example, poor visibility may occur due to the effects of smoke generated when the processing machine cuts the workpiece, and the scattering direction calculation unit may not be able to confirm chips even when monitoring the captured video due to the poor visibility. As such, if the scattering direction calculation unit cannot confirm chips even when monitoring the captured video, there is a problem in that the scattering direction calculation unit cannot identify the chip accumulation area.

[0005] The present disclosure has been made to solve the above-mentioned problems, and aims to provide a chip accumulation area estimation device that can estimate a chip accumulation area, which is an area where chips accumulate, regardless of whether poor visibility occurs or not.

[0006] The chip accumulation area estimation device according to the present disclosure includes a cutting information acquisition unit that acquires cutting information including any of the following information: information indicating the material of the object to be cut by the processing machine, information indicating the cutting method of the processing machine for the object to be cut, or information indicating the tool used by the processing machine to cut the object to be cut; and a chip accumulation area estimation unit that estimates a chip accumulation area, which is an area where chips generated from the object to be cut accumulate when the processing machine cuts the object to be cut, based on the cutting information acquired by the cutting information acquisition unit.

[0007] According to the present disclosure, it is possible to estimate a chip accumulation area, which is an area where chips accumulate, regardless of whether poor visibility occurs or not.

[0008] FIG. 1 is a configuration diagram showing a chip removal device including a chip accumulation area estimation device 2 according to a first embodiment. FIG. 2 is a hardware configuration diagram showing hardware of the chip accumulation area estimation device 2 according to the first embodiment. FIG. 3 is a hardware configuration diagram of a computer in the case where the chip accumulation area estimation device 2 is realized by software, firmware, or the like. FIG. 4 is a perspective view showing an example of a processing machine. FIG. 5 is a flowchart showing a chip accumulation area estimation method, which is a processing procedure of the chip accumulation area estimation device 2. FIG. 6 is a configuration diagram showing a chip removal device including the chip accumulation area estimation device 2 according to a second embodiment. FIG. 7 is a hardware configuration diagram showing hardware of the chip accumulation area estimation device 2 according to the second embodiment. FIG. 8 is a flowchart showing a chip accumulation area estimation method, which is a processing procedure of the chip accumulation area estimation device 2. FIG. 9 is a configuration diagram showing a chip removal device including the chip accumulation area estimation device 2 according to a third embodiment. FIG. 10 is a hardware configuration diagram showing hardware of the chip accumulation area estimation device 2 according to the third embodiment.

[0009] In order to explain the present disclosure in more detail, embodiments of the present disclosure will be described below with reference to the accompanying drawings.

[0010] Embodiment 1. Fig. 1 is a configuration diagram showing a chip removal device including a chip accumulation area estimation device 2 according to embodiment 1. Fig. 2 is a hardware configuration diagram showing the hardware of the chip accumulation area estimation device 2 according to embodiment 1. The chip removal device shown in Fig. 1 includes a learning model 1, a chip accumulation area estimation device 2, and a cleaning liquid spray unit 40. The chip removal device shown in Fig. 1 includes a learning model 1. However, this is merely an example, and the learning model 1 may be provided outside the chip removal device.

[0011] The learning model 1 is realized, for example, by a neural network. The learning model 1 is provided with cutting information and training data during learning. The cutting information includes cutting information including any of information indicating the material of the workpiece 50 (see FIG. 4 ) to be cut by a processing machine, information indicating a cutting method of the processing machine for the workpiece 50, or information indicating a tool used when the processing machine cuts the workpiece 50. That is, the cutting information may include only one or two of information indicating the material of the workpiece 50, information indicating the cutting method of the processing machine, or information indicating the tool. Furthermore, the cutting information may include all of information indicating the material of the workpiece 50, information indicating the cutting method of the processing machine, and information indicating the tool. The training data is information indicating a chip accumulation region, which is a region where chips generated from the workpiece accumulate when the processing machine cuts the workpiece. When the learning model 1 is provided with cutting information and training data during learning, it learns the chip accumulation region corresponding to the cutting information. When cutting information is given during inference, the learning model 1 outputs information indicating a chip accumulation area corresponding to the cutting information. In the chip removal device shown in Figure 1, the learning model 1 is provided outside the chip accumulation area estimation device 2. However, this is merely an example, and the learning model 1 may also be provided inside the chip accumulation area estimation device 2.

[0012] The chip accumulation area estimation device 2 includes a cutting information acquisition unit 11 and a chip accumulation area estimation unit 12. The cutting information acquisition unit 11 is realized, for example, by a cutting information acquisition circuit 21 shown in FIG. 2. The cutting information acquisition unit 11 acquires cutting information including information indicating the material of the object to be cut by the processing machine. The cutting information acquisition unit 11 outputs the cutting information to the chip accumulation area estimation unit 12.

[0013] Here, the cutting information acquisition unit 11 acquires cutting information including information indicating the material of the object to be cut by the processing machine. However, this is merely an example. During learning, for example, when the learning model 1 is given cutting information including information indicating the material of the object to be cut and information indicating the cutting method of the processing machine, and teacher data, and is learning a chip accumulation area corresponding to the cutting information, the cutting information acquisition unit 11 acquires cutting information including information indicating the material of the object to be cut and information indicating the cutting method of the processing machine. Also, during learning, for example, when the learning model 1 is given cutting information including information indicating the material of the object to be cut and information indicating the tool, and teacher data, and is learning a chip accumulation area corresponding to the cutting information, the cutting information acquisition unit 11 acquires cutting information including information indicating the material of the object to be cut and information indicating the tool. Furthermore, when the learning model 1 is given, during learning, cutting information including, for example, information indicating the material of the object to be cut, information indicating the cutting method of the processing machine, and information indicating the tool, as well as teacher data, and is learning the chip accumulation area corresponding to the cutting information, the cutting information acquisition unit 11 acquires cutting information including information indicating the material of the object to be cut, information indicating the cutting method of the processing machine, and information indicating the tool.

[0014] The chip accumulation area estimation unit 12 is realized, for example, by the chip accumulation area estimation circuit 22 shown in FIG. 2 . The chip accumulation area estimation unit 12 acquires cutting information from the cutting information acquisition unit 11. Based on the cutting information, the chip accumulation area estimation unit 12 estimates a chip accumulation area, which is an area where chips generated from the cutting object accumulate when the processing machine cuts the cutting object. Specifically, the chip accumulation area estimation unit 12 provides the cutting information acquired by the cutting information acquisition unit 11 to the learning model 1 and acquires information indicating the chip accumulation area corresponding to the cutting information acquired by the cutting information acquisition unit 11 from the learning model 1. The chip accumulation area estimation unit 12 outputs the information indicating the chip accumulation area to the cleaning liquid spray unit 40. In the chip accumulation area estimation device 2 shown in FIG. 1 , the chip accumulation area estimation unit 12 provides the cutting information to the learning model 1 and acquires information indicating the chip accumulation area corresponding to the cutting information from the learning model 1. However, this is merely an example, and the chip accumulation area estimation unit 12 may acquire information indicating the chip accumulation area from the cutting information based on a rule base, for example.

[0015] The cleaning liquid spraying unit 40 acquires information indicating the chip accumulation area from the chip accumulation area estimation unit 12. The cleaning liquid spraying unit 40 sprays cleaning liquid to wash away chips accumulated in the chip accumulation area estimated by the chip accumulation area estimation unit.

[0016] 1, it is assumed that each of the cutting information acquisition unit 11 and the chip accumulation area estimation unit 12, which are components of the chip accumulation area estimation device 2, is realized by dedicated hardware as shown in Fig. 2. That is, it is assumed that the chip accumulation area estimation device 2 is realized by a cutting information acquisition circuit 21 and a chip accumulation area estimation circuit 22. Each of the cutting information acquisition circuit 21 and the chip accumulation area estimation circuit 22 corresponds to, for example, a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or a combination thereof.

[0017] The components of the chip accumulation area estimation device 2 are not limited to those realized by dedicated hardware, and the chip accumulation area estimation device 2 may be realized by software, firmware, or a combination of software and firmware. The software or firmware is stored as a program in the memory of a computer. The computer refers to hardware that executes a program, and includes, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a central processing unit, a processing unit, an arithmetic unit, a microprocessor, a microcomputer, a processor, or a DSP (Digital Signal Processor).

[0018] 3 is a hardware configuration diagram of a computer when the chip accumulation area estimation device 2 is realized by software, firmware, etc. When the chip accumulation area estimation device 2 is realized by software, firmware, etc., a program for causing a computer to execute the respective processing procedures of the cutting information acquisition unit 11 and the chip accumulation area estimation unit 12 is stored in a memory 31. Then, a processor 32 of the computer executes the program stored in the memory 31.

[0019] 2 shows an example in which each of the components of the chip accumulation area estimation device 2 is realized by dedicated hardware, and Fig. 3 shows an example in which the chip accumulation area estimation device 2 is realized by software, firmware, etc. However, this is merely an example, and some of the components in the chip accumulation area estimation device 2 may be realized by dedicated hardware, and the remaining components may be realized by software, firmware, etc.

[0020] FIG. 4 is a perspective view showing an example of a processing machine. The processing machine shown in FIG. 4 includes a table 51 on which a cutting object 50 is mounted and a spindle 52 to which a tool used to cut the cutting object 50 is attached. As shown in FIG. 4, the processing machine is covered with a cover 54. When the processing machine cuts the cutting object 50, chips generated from the cutting object 50 are accumulated in a chip accumulation area 56. In the example of FIG. 4, the chip accumulation area 56 is an area surrounded by a dashed line. The chip accumulation area 56 varies depending on the material of the cutting object 50, the cutting method of the processing machine for the cutting object 50, or the tool used by the processing machine to cut the cutting object 50. For example, the harder the material of the cutting object 50, the farther the chips will scatter and accumulate from the cutting object 50. The direction in which the chips are scattered varies depending on the cutting method of the cutting object 50. The direction or distance in which chips are scattered varies depending on the tool. Methods for cutting the workpiece 50 include, for example, a cutting method using a grinding tool such as a file, or a cutting method using a saw. Examples of tools include a file, a saw, or a drill.

[0021] As shown in FIG. 4, the processing machine is equipped with a plurality of nozzles 53, and each nozzle 53 sprays the cleaning liquid output from the cleaning liquid spraying unit 40. Slopes 55 are provided on both sides of the table 51. In the example of FIG. 4, the slopes 55 are inclined so that the rear side is lower than the front side in the figure. Therefore, the cleaning liquid sprayed from the nozzles 53 flows on the slopes 55 from the front side to the rear side in the figure, and is then discharged outside the processing machine. At this time, chips are discharged outside the processing machine together with the cleaning liquid.

[0022] Next, the operation of the chip accumulation area estimation device 2 shown in FIG. 1 will be described. FIG. 5 is a flowchart showing a chip accumulation area estimation method, which is a processing procedure of the chip accumulation area estimation device 2. The cutting information acquisition unit 11 acquires cutting information, for example, from a control device (not shown) of a processing machine (step ST1 in FIG. 5). The cutting information includes information indicating the material of the cutting object 50. Instead of the information indicating the material of the cutting object 50, the cutting information may include information indicating the cutting method of the processing machine or information indicating the tool used to cut the cutting object 50, or may include all of the information indicating the material of the cutting object 50, information indicating the cutting method of the processing machine, and information indicating the tool used to cut the cutting object 50. The cutting information acquisition unit 11 outputs the cutting information to the chip accumulation area estimation unit 12.

[0023] The chip accumulation area estimation unit 12 acquires cutting information from the cutting information acquisition unit 11. Based on the cutting information, the chip accumulation area estimation unit 12 estimates a chip accumulation area 56, which is an area where chips generated from the cutting object 50 accumulate when the processing machine cuts the cutting object 50 (step ST2 in FIG. 5 ). Specifically, the chip accumulation area estimation unit 12 provides the cutting information to the learning model 1 and acquires information indicating the chip accumulation area 56 corresponding to the cutting information from the learning model 1. If the information indicating the material of the cutting object 50 included in the cutting information changes, the chip accumulation area 56 corresponding to the cutting information changes. If the information indicating the cutting method of the processing machine included in the cutting information changes, the chip accumulation area 56 corresponding to the cutting information changes. Furthermore, if the information indicating the tool included in the cutting information changes, the chip accumulation area 56 corresponding to the cutting information changes. The chip accumulation area estimation unit 12 outputs information indicating the estimated chip accumulation area 56 to the cleaning liquid spray unit 40. The chip accumulation area estimation unit 12 can estimate the chip accumulation area 56 based on cutting information including only information indicating the material of the cutting object 50, cutting information including only information indicating the cutting method of the processing machine, or cutting information including only information indicating the tool. However, the estimation accuracy of the chip accumulation area 56 by the chip accumulation area estimation unit 12 is improved when the cutting information includes two or more pieces of information among information indicating the material, information indicating the cutting method of the processing machine, and information indicating the tool, compared to when the cutting information includes only one piece of information.

[0024] The cleaning liquid spraying unit 40 acquires information indicating the chip accumulation area 56 from the chip accumulation area estimation unit 12. Based on the information indicating the chip accumulation area 56, the cleaning liquid spraying unit 40 selects one or more nozzles 53 from which to spray the cleaning liquid, from among the plurality of nozzles 53. For example, as shown below, if a table indicating the correspondence between the chip accumulation area 56 and the nozzles 53 is prepared, the cleaning liquid spraying unit 40 refers to the table and selects the nozzle 53 that corresponds to the chip accumulation area 56 indicated by the information.

[0025] [Table] Chip accumulation region 56 is region A: for example, in FIG. 4, a region on the left and front side → among the plurality of nozzles 53 arranged on the left side, the first nozzle 53 from the front among the plurality of nozzles 53 arranged on the left side. Chip accumulation region 56 is region B: for example, in FIG. 4, a region on the left and rear side → among the plurality of nozzles 53 arranged on the left side, the second nozzle 53 from the front and the third nozzle 53 from the front. Chip accumulation region 56 is region C: for example, in FIG. 4, a region on the right and front side → among the plurality of nozzles 53 arranged on the right side, the first nozzle 53 from the front and the second nozzle 53 from the front: for example, in FIG. 4, a region on the right and rear side. Chip accumulation region 56 is region D → among the plurality of nozzles 53 arranged on the right side, the third nozzle 53 from the front

[0026] When the cleaning liquid spraying unit 40 selects one or more nozzles 53 from which to spray the cleaning liquid, it outputs the cleaning liquid to the selected nozzles 53, thereby spraying the cleaning liquid from the selected nozzles 53. As a result, the chips accumulated in the chip accumulation area 56 are washed away by the cleaning liquid and discharged outside the processing machine.

[0027] In the first embodiment described above, the chip accumulation area estimation device 2 is configured to include a cutting information acquisition unit 11 that acquires cutting information including any of information indicating the material of the workpiece 50 to be cut by the processing machine, information indicating the cutting method of the processing machine for the workpiece 50, or information indicating the tool used when the processing machine cuts the workpiece 50, and a chip accumulation area estimation unit 12 that estimates a chip accumulation area 56, which is an area where chips generated from the workpiece 50 accumulate when the processing machine cuts the workpiece 50, based on the cutting information acquired by the cutting information acquisition unit 11. Therefore, the chip accumulation area estimation device 2 can estimate the chip accumulation area 56 regardless of whether poor visibility is occurring.

[0028] 1 , the cutting information acquisition unit 11 acquires cutting information including any of information indicating the material of the object 50 to be cut by the processing machine, information indicating the cutting method of the processing machine for the object 50, or information indicating the tool used when the processing machine cuts the object 50. However, the cutting information only needs to be information that can be used to estimate the chip accumulation area 56, and the cutting information may include information different from the information indicating the material of the object 50 to be cut, the information indicating the cutting method of the processing machine, and the information indicating the tool.

[0029] Second Embodiment In a second embodiment, a chip accumulation region estimation device 2 will be described, which includes a visibility condition determination unit 14 that determines the visibility condition of chips generated from the cutting object 50 based on a captured video showing how the processing machine is cutting the cutting object 50.

[0030] FIG. 6 is a configuration diagram showing a chip removal device including a chip accumulation area estimation device 2 according to a second embodiment. In FIG. 6, the same reference numerals as those in FIG. 1 indicate the same or corresponding parts, and therefore detailed description thereof will be omitted. FIG. 7 is a hardware configuration diagram showing hardware of the chip accumulation area estimation device 2 according to the second embodiment. In FIG. 7, the same reference numerals as those in FIG. 2 indicate the same or corresponding parts, and therefore detailed description thereof will be omitted. The chip removal device shown in FIG. 6 includes a learning model 1, a camera 3, a chip accumulation area estimation device 2, and a cleaning liquid spraying unit 40. The chip removal device shown in FIG. 6 includes a learning model 1 and a camera 3. However, this is merely an example, and the learning model 1 and the camera 3 may each be provided outside the chip removal device. The camera 3 captures images of the machining tool cutting the workpiece 50 and outputs the captured images to the chip accumulation area estimation device 2.

[0031] The chip accumulation area estimation device 2 shown in Fig. 6 includes a cutting information acquisition unit 11, a photographed image acquisition unit 13, a visibility condition determination unit 14, and a chip accumulation area estimation unit 15. The photographed image acquisition unit 13 is realized by, for example, a photographed image acquisition circuit 23 shown in Fig. 7. The photographed image acquisition unit 13 acquires photographed images from the camera 3. The photographed image acquisition unit 13 outputs the photographed images to the visibility condition determination unit 14 and the chip accumulation area estimation unit 15, respectively.

[0032] The visibility condition determination unit 14 is realized by, for example, a visibility condition determination circuit 24 shown in Fig. 7. The visibility condition determination unit 14 acquires the captured image from the captured image acquisition unit 13. The visibility condition determination unit 14 determines the visibility condition of chips generated from the cutting object 50 based on the captured image. The visibility condition determination unit 14 outputs the determination result of the visibility condition to the chip accumulation area estimation unit 15.

[0033] The chip accumulation area estimation unit 15 is realized by, for example, the chip accumulation area estimation circuit 25 shown in FIG. 7 . The chip accumulation area estimation unit 15 acquires cutting information from the cutting information acquisition unit 11. The chip accumulation area estimation unit 15 acquires the captured video from the captured video acquisition unit 13 and acquires the visibility status determination result from the visibility status determination unit 14. If the visibility status determination result by the visibility status determination unit 14 indicates that chips are visible, the chip accumulation area estimation unit 15 estimates the chip accumulation area 56 based on the captured video. If the visibility status determination result by the visibility status determination unit 14 indicates that chips are not visible, the chip accumulation area estimation unit 15 estimates the chip accumulation area 56 based on the cutting information, similar to the chip accumulation area estimation unit 12 shown in FIG. 1 . The chip accumulation area estimation unit 15 outputs information indicating the chip accumulation area 56 to the cleaning liquid spray unit 40.

[0034] 6, it is assumed that each of the components of the chip accumulation area estimation device 2, namely, the cutting information acquisition unit 11, the photographed image acquisition unit 13, the visibility condition determination unit 14, and the chip accumulation area estimation unit 15, is realized by dedicated hardware such as that shown in Fig. 7. That is, it is assumed that the chip accumulation area estimation device 2 is realized by a cutting information acquisition circuit 21, a photographed image acquisition circuit 23, a visibility condition determination circuit 24, and a chip accumulation area estimation circuit 25. Each of the cutting information acquisition circuit 21, the photographed image acquisition circuit 23, the visibility condition determination circuit 24, and the chip accumulation area estimation circuit 25 corresponds to, for example, a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC, an FPGA, or a combination thereof.

[0035] The components of the chip accumulation area estimation device 2 are not limited to those realized by dedicated hardware, and the chip accumulation area estimation device 2 may be realized by software, firmware, or a combination of software and firmware. When the chip accumulation area estimation device 2 is realized by software, firmware, or the like, a program for causing a computer to execute the respective processing procedures of the cutting information acquisition unit 11, the captured image acquisition unit 13, the visibility status determination unit 14, and the chip accumulation area estimation unit 15 is stored in the memory 31 shown in Fig. 3. Then, the processor 32 shown in Fig. 3 executes the program stored in the memory 31.

[0036] 7 shows an example in which each of the components of the chip accumulation area estimation device 2 is realized by dedicated hardware, while Fig. 3 shows an example in which the chip accumulation area estimation device 2 is realized by software, firmware, etc. However, this is merely an example, and some of the components in the chip accumulation area estimation device 2 may be realized by dedicated hardware, and the remaining components may be realized by software, firmware, etc.

[0037] Next, the operation of the chip accumulation area estimation device 2 shown in Fig. 6 will be described. Fig. 8 is a flowchart showing a chip accumulation area estimation method, which is a processing procedure of the chip accumulation area estimation device 2. The cutting information acquisition unit 11 acquires cutting information, for example, from a control device (not shown) of the processing machine (step ST11 in Fig. 8). The cutting information includes any of information indicating the material of the object 50 to be cut by the processing machine, information indicating the cutting method of the processing machine, or information indicating the tool used when the processing machine cuts the object 50 to be cut. The cutting information acquisition unit 11 outputs the cutting information to the chip accumulation area estimation unit 15.

[0038] The camera 3 captures an image of the processing machine cutting the cutting object 50, and outputs the captured image to the chip accumulation area estimation device 2. The captured image acquisition unit 13 acquires the captured image from the camera 3 (step ST12 in FIG. 8 ). The captured image acquisition unit 13 outputs the captured image to both the visibility condition determination unit 14 and the chip accumulation area estimation unit 15.

[0039] The visibility condition determination unit 14 acquires the captured image from the captured image acquisition unit 13. The visibility condition determination unit 14 determines the visibility condition of chips generated from the cutting object 50 based on the captured image (step ST13 in FIG. 8 ). The visibility condition determination unit 14 outputs the determination result of the visibility condition to the chip accumulation area estimation unit 15. The process of determining the visibility condition by the visibility condition determination unit 14 will be specifically described below.

[0040] The internal memory of the visibility condition determination unit 14 stores a captured image when the chip visibility condition is good (hereinafter referred to as "good visibility image"). Here, the good visibility image is assumed to be stored in the internal memory of the visibility condition determination unit 14. However, this is merely an example, and the good visibility image may be provided to the visibility condition determination unit 14 from outside the visibility condition determination unit 14. The visibility condition determination unit 14 acquires the captured image (hereinafter referred to as "current captured image") from the captured image acquisition unit 13. The visibility condition determination unit 14 calculates the difference between the good visibility image and the current captured image. If the difference is equal to or greater than a threshold, the visibility condition determination unit 14 determines that the chip visibility condition is bad, and if the difference is less than the threshold, the visibility condition of the chips is good. The threshold may be stored in the internal memory of the visibility condition determination unit 14 or may be provided from outside the visibility condition determination unit 14. A judgment that the visibility of chips is poor corresponds to a judgment that the chips cannot be seen, and a judgment that the visibility of chips is good corresponds to a judgment that the chips can be seen.

[0041] Here, the visibility condition determination unit 14 calculates the difference between the good visibility image and the currently captured image and determines the visibility condition of the chips based on the difference. However, this is merely an example, and the visibility condition determination unit 14 may extract edges from each of the good visibility image and the currently captured image and determine the visibility condition of the chips based on the difference between the edges extracted from the good visibility image and the edges extracted from the currently captured image. For example, in a situation where smoke or mist is generated, the number of edges extracted from the currently captured image will be fewer than the edges extracted from the good visibility image.

[0042] The chip accumulation area estimation unit 15 acquires cutting information from the cutting information acquisition unit 11. The chip accumulation area estimation unit 15 acquires captured video from the captured video acquisition unit 13 and acquires a visibility status determination result from the visibility status determination unit 14. If the visibility status determination result by the visibility status determination unit 14 indicates that chips are visible (step ST14 in FIG. 8 : YES), the chip accumulation area estimation unit 15 estimates a chip accumulation area 56 based on the captured video (step ST15 in FIG. 8 ). Specifically, the chip accumulation area estimation unit 15 detects optical flow between multiple captured videos captured at different times. The chip accumulation area estimation unit 15 estimates the chip accumulation area 56 by estimating the direction in which chips are flying and the flying distance of the chips based on the optical flow. Here, the chip accumulation area estimation unit 15 estimates the chip accumulation area 56 based on the optical flow. However, this is merely an example, and the chip accumulation area estimation unit 15 may estimate the chip accumulation area 56 based on the difference between the image captured before chips were accumulated and the current image captured.

[0043] If the result of the determination of the visibility condition by the visibility condition determination unit 14 indicates that chips cannot be seen (step ST14 in FIG. 8 : NO), the chip accumulation area estimation unit 15 estimates a chip accumulation area 56 based on the cutting information (step ST16 in FIG. 8 ), similar to the chip accumulation area estimation unit 12 shown in FIG. 1 . The chip accumulation area estimation unit 15 outputs information indicating the chip accumulation area 56 to the cleaning liquid spray unit 40.

[0044] In a situation where chips cannot be seen, the accuracy of estimating the chip accumulation area 56 based on the captured video is likely to be lower than the accuracy of estimating the chip accumulation area 56 based on the cutting information. On the other hand, in a situation where chips can be seen, the accuracy of estimating the chip accumulation area 56 based on the captured video is likely to be higher than the accuracy of estimating the chip accumulation area 56 based on the cutting information.

[0045] In the second embodiment described above, the chip accumulation area estimation device 2 is configured to include a captured image acquisition unit 13 that acquires captured image showing the cutting of the workpiece 50 by the processing machine, and a visibility condition determination unit 14 that determines the visibility condition of chips generated from the workpiece 50 based on the captured image acquired by the captured image acquisition unit 13. If the visibility condition determination result by the visibility condition determination unit 14 indicates that chips are visible, the chip accumulation area estimation unit 15 of the chip accumulation area estimation device 2 estimates the chip accumulation area 56 based on the captured image. If the visibility condition determination result by the visibility condition determination unit 14 indicates that chips are not visible, the chip accumulation area estimation unit 15 estimates the chip accumulation area 56 based on the cutting information acquired by the cutting information acquisition unit 11. Therefore, the chip accumulation area estimation device 2 shown in FIG. 6 can estimate the chip accumulation area 56 regardless of whether poor visibility occurs, and may be able to estimate the chip accumulation area 56 with higher accuracy than the chip accumulation area estimation device 2 shown in FIG. 1.

[0046] Third Embodiment In a third embodiment, a chip accumulation area estimation device 2 including a chip accumulation area estimation unit 16 that estimates a chip accumulation area 56 using a first learning model 4 or a second learning model 5 will be described.

[0047] FIG. 9 is a configuration diagram showing a chip removal device including a chip accumulation area estimation device 2 according to a third embodiment. In FIG. 9, the same reference numerals as those in FIGS. 1 and 6 indicate the same or corresponding parts, and therefore detailed descriptions thereof will be omitted. FIG. 10 is a hardware configuration diagram showing the hardware of the chip accumulation area estimation device 2 according to the third embodiment. In FIG. 10, the same reference numerals as those in FIGS. 2 and 7 indicate the same or corresponding parts, and therefore detailed descriptions thereof will be omitted. The chip removal device shown in FIG. 9 includes a camera 3, a first learning model 4, a second learning model 5, a chip accumulation area estimation device 2, and a cleaning liquid spray unit 40. The chip removal device shown in FIG. 9 includes a camera 3, a first learning model 4, and a second learning model 5. However, this is merely an example, and the camera 3, the first learning model 4, and the second learning model 5 may each be provided outside the chip removal device.

[0048] The first learning model 4 is realized by, for example, a neural network. During learning, the first learning model 4 is provided with photographed video showing the processing machine cutting the workpiece 50 and training data. The training data is information indicating a chip accumulation area 56, which is an area where chips generated from the workpiece 50 accumulate when the processing machine cuts the workpiece 50. When the first learning model 4 is provided with the photographed video and training data during learning, it learns the chip accumulation area 56 corresponding to the photographed video. Here, the chip accumulation area 56 corresponding to the photographed video is the chip accumulation area 56 indicated by the training data. During inference, when the first learning model 4 is provided with photographed video, it outputs information indicating the chip accumulation area 56 corresponding to the photographed video.

[0049] The second learning model 5 is realized by, for example, a neural network. The second learning model 5 is provided with cutting information and training data during learning. The cutting information includes any of information indicating the material of the workpiece 50 to be cut by the processing machine, information indicating the cutting method of the processing machine, or information indicating the tool used when the processing machine cuts the workpiece 50. The training data is information indicating a chip accumulation region 56, which is an area where chips generated from the workpiece 50 accumulate when the processing machine cuts the workpiece 50. When the second learning model 5 is provided with the cutting information and the training data during learning, it learns the chip accumulation region 56 corresponding to the cutting information. Here, the chip accumulation region 56 corresponding to the cutting information is the chip accumulation region 56 indicated by the training data. When the second learning model 5 is provided with cutting information during inference, it outputs information indicating the chip accumulation region 56 corresponding to the cutting information.

[0050] 9 , the first learning model 4 and the second learning model 5 are each provided outside the chip accumulation area estimation device 2. However, this is merely an example, and the first learning model 4 and the second learning model 5 may each be provided inside the chip accumulation area estimation device 2.

[0051] The chip accumulation area estimation device 2 shown in Fig. 9 includes a cutting information acquisition unit 11, a captured image acquisition unit 13, a visibility condition determination unit 14, and a chip accumulation area estimation unit 16. The chip accumulation area estimation unit 16 is realized, for example, by a chip accumulation area estimation circuit 26 shown in Fig. 10. The chip accumulation area estimation unit 16 acquires cutting information from the cutting information acquisition unit 11. The cutting information includes any of information indicating the material of the object 50 to be cut by the processing machine, information indicating the cutting method of the processing machine, or information indicating the tool used when the processing machine cuts the object 50. The chip accumulation area estimation unit 16 acquires the captured image from the captured image acquisition unit 13 and acquires the visibility condition determination result from the visibility condition determination unit 14. If the determination result of the visibility condition by the visibility condition determination unit 14 indicates that chips are visible, the chip accumulation area estimation unit 16 provides the captured image to the first learning model 4 and acquires information indicating the chip accumulation area 56 corresponding to the captured image from the first learning model 4. If the determination result of the visibility condition by the visibility condition determination unit 14 indicates that chips are not visible, the chip accumulation area estimation unit 16 provides the cutting information to the second learning model 5 and acquires information indicating the chip accumulation area 56 corresponding to the cutting information from the second learning model 5. The chip accumulation area estimation unit 16 outputs the information indicating the chip accumulation area 56 to the cleaning liquid spray unit 40.

[0052] 9, it is assumed that each of the components of the chip accumulation area estimation device 2, namely, the cutting information acquisition unit 11, the photographed image acquisition unit 13, the visibility condition determination unit 14, and the chip accumulation area estimation unit 16, is realized by dedicated hardware such as that shown in Fig. 10. That is, it is assumed that the chip accumulation area estimation device 2 is realized by a cutting information acquisition circuit 21, a photographed image acquisition circuit 23, a visibility condition determination circuit 24, and a chip accumulation area estimation circuit 26. Each of the cutting information acquisition circuit 21, the photographed image acquisition circuit 23, the visibility condition determination circuit 24, and the chip accumulation area estimation circuit 26 corresponds to, for example, a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC, an FPGA, or a combination thereof.

[0053] The components of the chip accumulation area estimation device 2 are not limited to those realized by dedicated hardware, and the chip accumulation area estimation device 2 may be realized by software, firmware, or a combination of software and firmware. When the chip accumulation area estimation device 2 is realized by software, firmware, or the like, a program for causing a computer to execute the respective processing procedures of the cutting information acquisition unit 11, the captured image acquisition unit 13, the visibility status determination unit 14, and the chip accumulation area estimation unit 16 is stored in the memory 31 shown in Figure 3. Then, the processor 32 shown in Figure 3 executes the program stored in the memory 31.

[0054] 10 shows an example in which each of the components of the chip accumulation area estimation device 2 is realized by dedicated hardware, while Fig. 3 shows an example in which the chip accumulation area estimation device 2 is realized by software, firmware, etc. However, this is merely an example, and some of the components in the chip accumulation area estimation device 2 may be realized by dedicated hardware, and the remaining components may be realized by software, firmware, etc.

[0055] Next, the operation of the chip accumulation area estimation device 2 shown in Fig. 9 will be described. Fig. 11 is a flowchart showing a chip accumulation area estimation method, which is a processing procedure of the chip accumulation area estimation device 2. The cutting information acquisition unit 11 acquires cutting information, for example, from a control device (not shown) of the processing machine (step ST21 in Fig. 11). The cutting information acquisition unit 11 outputs the cutting information to the chip accumulation area estimation unit 16.

[0056] The camera 3 captures an image of the processing machine cutting the cutting object 50, and outputs the captured image to the chip accumulation area estimation device 2. The captured image acquisition unit 13 acquires the captured image from the camera 3 (step ST22 in FIG. 11 ). The captured image acquisition unit 13 outputs the captured image to both the visibility condition determination unit 14 and the chip accumulation area estimation unit 16.

[0057] The visibility condition determination unit 14 acquires the photographed video from the photographed video acquisition unit 13. The visibility condition determination unit 14 determines the visibility condition of chips generated from the cutting object 50 based on the photographed video (step ST23 in FIG. 11 ). The visibility condition determination unit 14 outputs the determination result of the visibility condition to the chip accumulation area estimation unit 16.

[0058] The chip accumulation area estimation unit 16 acquires cutting information from the cutting information acquisition unit 11. The chip accumulation area estimation unit 16 acquires the captured video from the captured video acquisition unit 13 and acquires the visibility situation determination result from the visibility situation determination unit 14. If the visibility situation determination result by the visibility situation determination unit 14 indicates that chips are visible (step ST24 in FIG. 11 : YES), the chip accumulation area estimation unit 16 provides the captured video to the first learning model 4 and acquires information indicating the chip accumulation area 56 corresponding to the captured video from the first learning model 4 (step ST25 in FIG. 11 ).

[0059] If the visibility condition determination unit 14 determines that chips are not visible (step ST24 in FIG. 11 : NO), the chip accumulation area estimation unit 16 provides the cutting information to the second learning model 5 and acquires information indicating the chip accumulation area 56 corresponding to the cutting information from the second learning model 5 (step ST26 in FIG. 11 ). The chip accumulation area estimation unit 16 outputs the information indicating the chip accumulation area 56 to the cleaning liquid spray unit 40.

[0060] In the above-described third embodiment, there are a first learning model 4 that is given a photographed video showing the processing machine cutting the workpiece 50 and teacher data showing the chip accumulation region 56 and has learned the chip accumulation region 56 corresponding to the photographed video, and a second learning model 5 that is given cutting information and teacher data showing the chip accumulation region 56 and has learned the chip accumulation region 56 corresponding to the cutting information. The chip accumulation region estimation device 2 shown in FIG. 9 is configured to include a photographed video acquisition unit 13 that acquires a photographed video showing the processing machine cutting the workpiece 50, and a visibility condition determination unit 14 that determines the visibility condition of chips generated from the workpiece 50 based on the photographed video acquired by the photographed video acquisition unit 13. If the visibility condition determination unit 14 determines that chips are visible, the chip accumulation area estimation unit 16 of the chip accumulation area estimation device 2 shown in Figure 9 provides the captured image acquired by the captured image acquisition unit 13 to the first learning model 4 and acquires information indicating the chip accumulation area 56 corresponding to the captured image from the first learning model 4. If the visibility condition determination unit 14 determines that chips are not visible, the chip accumulation area estimation unit 16 provides the cutting information acquired by the cutting information acquisition unit 11 to the second learning model 5 and acquires information indicating the chip accumulation area 56 corresponding to the cutting information from the second learning model 5. Therefore, the chip accumulation area estimation device 2 shown in Figure 9 can estimate the chip accumulation area 56 regardless of whether poor visibility occurs, and may be able to estimate the chip accumulation area 56 with higher accuracy than the chip accumulation area estimation device 2 shown in Figure 1.

[0061] In addition, the present disclosure allows for free combination of the respective embodiments, modification of any of the components of the respective embodiments, or omission of any of the components of the respective embodiments.

[0062] The present disclosure is suitable for a chip accumulation area estimation device, a chip accumulation area estimation method, and a chip removal device.

[0063] 1 Learning model, 2 Chip accumulation area estimation device, 3 Camera, 4 First learning model, 5 Second learning model, 11 Cutting information acquisition unit, 12 Chip accumulation area estimation unit, 13 Photographed image acquisition unit, 14 Visibility status determination unit, 15, 16 Chip accumulation area estimation unit, 21 Cutting information acquisition circuit, 22 Chip accumulation area estimation circuit, 23 Photographed image acquisition circuit, 24 Visibility status determination circuit, 25, 26 Chip accumulation area estimation circuit, 31 Memory, 32 Processor, 40 Cleaning liquid injection unit, 50 Cutting object, 51 Table, 52 Spindle, 53 Nozzle, 54 Cover, 55 Slope, 56 Chip accumulation area.

Claims

1. A chip accumulation area estimation device comprising: a cutting information acquisition unit that acquires cutting information including any of the following information: information indicating the material of an object to be cut by a processing machine, information indicating a cutting method of the processing machine for the object to be cut, or information indicating a tool used by the processing machine to cut the object to be cut; and a chip accumulation area estimation unit that estimates a chip accumulation area, which is an area in which chips generated from the object to be cut accumulate when the processing machine cuts the object to be cut, based on the cutting information acquired by the cutting information acquisition unit.

2. The chip accumulation area estimation device according to claim 1, characterized in that a learning model is provided with the cutting information and teacher data indicating the chip accumulation area, and has learned the chip accumulation area corresponding to the cutting information, and the chip accumulation area estimation unit provides the cutting information acquired by the cutting information acquisition unit to the learning model, and acquires from the learning model information indicating the chip accumulation area corresponding to the cutting information acquired by the cutting information acquisition unit.

3. A chip accumulation area estimation device as described in claim 1, comprising: a captured image acquisition unit that acquires captured image showing the state in which the processing machine is cutting the cutting object; and a visibility condition determination unit that determines the visibility condition of chips generated from the cutting object based on the captured image acquired by the captured image acquisition unit, wherein the chip accumulation area estimation unit estimates the chip accumulation area based on the captured image if the judgment result of the visibility condition by the visibility condition determination unit indicates that the chips are visible, and estimates the chip accumulation area based on the cutting information acquired by the cutting information acquisition unit if the judgment result of the visibility condition by the visibility condition determination unit indicates that the chips are not visible.

4. A first learning model is provided with a photographed image showing the processing machine cutting the workpiece and teaching data showing the chip accumulation area, and has learned the chip accumulation area corresponding to the photographed image; and a second learning model is provided with the cutting information and teaching data showing the chip accumulation area, and has learned the chip accumulation area corresponding to the cutting information; the system comprises a photographed image acquisition unit that acquires the photographed image showing the processing machine cutting the workpiece; and a visibility condition determination unit that determines the visibility condition of chips generated from the cutting workpiece based on the photographed image acquired by the photographed image acquisition unit, and the chip accumulation area estimation unit is The chip accumulation area estimation device according to claim 1, characterized in that if the judgment result of the visibility situation by the visibility situation judgment unit indicates that the chips are visible, the photographed image acquired by the photographed image acquisition unit is provided to the first learning model, and information indicating the chip accumulation area corresponding to the photographed image is acquired from the first learning model, and if the judgment result of the visibility situation by the visibility situation judgment unit indicates that the chips are not visible, the cutting information acquired by the cutting information acquisition unit is provided to the second learning model, and information indicating the chip accumulation area corresponding to the cutting information is acquired from the second learning model.

5. A chip accumulation area estimation method in which a cutting information acquisition unit acquires cutting information including any of the following information: information indicating the material of the object to be cut by a processing machine, information indicating the cutting method of the processing machine for the object to be cut, or information indicating a tool used by the processing machine when cutting the object to be cut; and a chip accumulation area estimation unit estimates a chip accumulation area, which is an area in which chips generated from the object to be cut accumulate when the processing machine cuts the object to be cut, based on the cutting information acquired by the cutting information acquisition unit.

6. A chip removal device comprising: a cutting information acquisition unit that acquires cutting information including any of the following information: information indicating the material of an object to be cut by a processing machine, information indicating a cutting method of the processing machine for the object to be cut, or information indicating a tool used by the processing machine to cut the object to be cut; a chip accumulation area estimation unit that estimates a chip accumulation area, which is an area where chips generated from the object to be cut accumulate when the processing machine cuts the object to be cut, based on the cutting information acquired by the cutting information acquisition unit; and a cleaning liquid injection unit that injects cleaning liquid to wash away chips accumulated in the chip accumulation area estimated by the chip accumulation area estimation unit.

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