Substrate bonding apparatus

Abstract

A substrate bonding apparatus 1 includes: plasma processing units 2p; a load lock chamber 12 to which substrates W to be processed by the plasma processing units 2p are transferred; an unload lock chamber 14 to which the substrates W processed by the plasma processing units 2p are transferred; a second transfer chamber 13; a vacuum pump; a second transfer robot R2 which transfers the substrates W from the load lock chamber 12 to the plasma processing units 2p via the second transfer chamber 13, and conveys the substrates W from the plasma processing units 2p to the unload lock chamber 14 via the second transfer chamber 13; a cleaning unit 2c which is placed on the same side as the unload lock chamber 14 with respect to the second transfer chamber 13 in plan view, and cleans the substrates W transferred from the unload lock chamber 14; and a bonding unit 2b which bonds the two substrates W cleaned by the cleaning unit 2c.

Description

Substrate bonding equipment Related Applications

[0001] This application claims priority based on Japanese Patent Application No. 2023-122702, filed on July 27, 2023, the entire contents of which are incorporated herein by reference.

[0002] The present invention relates to a substrate bonding apparatus for bonding two substrates, including, for example, semiconductor wafers, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic electroluminescence (EL) displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

[0003] Patent Document 1 discloses a bonding system for bonding an upper wafer and a lower wafer. In the bonding system shown in FIGS. 1 and 2 of Patent Document 1, the upper wafer is transported in the following order: load lock chamber 31, surface modification device 33, load lock chamber 31, surface hydrophilization device 34, position adjustment device 51, substrate temperature adjustment device 42, and bonding device 41. The lower wafer is transported in the same manner as the upper wafer after the upper wafer is unloaded from load lock chamber 31. Paragraphs 0163 to 0168 of Patent Document 1 disclose that the upper wafer and the lower wafer are unloaded one by one from the substrate temperature adjustment device 42, and then the upper wafer and the lower wafer are loaded one by one into the bonding device 41.

[0004] JP 2018-10921 A

[0005] In the bonding system described in Patent Document 1, substrates before plasma processing enter the load lock chamber 31, and substrates after plasma processing exit the load lock chamber 31. Therefore, there is room for improvement in terms of efficient substrate transport.

[0006] At least one embodiment of the present invention provides a substrate bonding apparatus that can efficiently transport substrates.

[0007] an unload lock chamber into which the substrate processed in the plasma processing unit is transferred; a vacuum transfer chamber through which the substrate transferred from the load lock chamber to the plasma processing unit and the substrate transferred from the plasma processing unit to the unload lock chamber pass; at least one vacuum pump for reducing the air pressure in the load lock chamber, the vacuum transfer chamber, and the unload lock chamber; a vacuum transfer robot for transferring the substrate from the load lock chamber to the plasma processing unit via the vacuum transfer chamber and for transferring the substrate from the plasma processing unit to the unload lock chamber via the vacuum transfer chamber; a cleaning unit, located on the same side of the vacuum transfer chamber as the unload lock chamber in a plan view, for cleaning the substrate transferred from the unload lock chamber; and a bonding unit for bonding the two substrates cleaned in the cleaning unit.

[0008] In the above embodiment, at least one of the following features may be added to the substrate bonding apparatus.

[0009] The cleaning unit is disposed on the opposite side of the unload lock chamber from the vacuum transfer chamber in a plan view.

[0010] The joining unit is disposed on the same side as the cleaning unit with respect to the unload lock chamber in a plan view.

[0011] The joining unit is disposed on the opposite side of the cleaning unit from the unload lock chamber in a plan view.

[0012] The multiple load ports hold the multiple carriers so that they are lined up in the left-right direction in a plan view, and the load lock chamber, vacuum transfer chamber, unload lock chamber, and cleaning unit are lined up in front-to-back order from the front: load lock chamber, vacuum transfer chamber, unload lock chamber, cleaning unit.

[0013] The above and other objects, features and advantages of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings.

[0014] 6A. FIG. 6B is a schematic diagram showing an example of a first substrate and a second substrate before and after bonding. FIG. 6C is a process diagram for explaining a substrate bonding method according to an embodiment of the present invention. FIG. 6D is a schematic plan view of a substrate bonding apparatus according to an embodiment of the present invention. FIG. 6E is a schematic diagram showing a part of FIG. 3. FIG. 6F is a schematic diagram showing a vertical cross section taken along line B-B shown in FIG. 4A. FIG. 6G is a schematic diagram showing a vertical cross section taken along line C-C shown in FIG. 4A. FIG. 6H is a schematic diagram showing a part of FIG. 3. FIG. 6I is a schematic diagram showing a vertical cross section taken along line B-B shown in FIG. 5A. FIG. 6I is a schematic diagram showing a part of FIG. 3. FIG. 6I is a schematic diagram showing a vertical cross section taken along line B-B shown in FIG. 7A. FIG. 6F is a schematic plan view showing a state in which a third transfer robot is arranged at a multi-access position. FIG. 6G is a schematic plan view showing a state in which a third transfer robot is arranged at a multi-access position. FIG. 6I is a process diagram for explaining an example of an operation of the substrate bonding apparatus. FIG. 6I is a process diagram for explaining an example of an operation of the substrate bonding apparatus. 10A and 10B are time charts showing an example of a period during which a first substrate and a second substrate are plasma-processed, and a period during which a first substrate and a second substrate are cleaned.

[0015] Fig. 1 is a schematic diagram showing an example of a first substrate W1 and a second substrate W2 before and after bonding, and Fig. 2 is a process diagram for explaining a substrate bonding method according to an embodiment of the present invention.

[0016] In the following description, the first substrate W1 and the second substrate W2 represent the two substrates W to be bonded. The third substrate W3 represents the bonded first substrate W1 and second substrate W2. When any of the first substrate W1, the second substrate W2, and the third substrate W3 is acceptable, it will simply be referred to as the substrate W.

[0017] As shown in FIG. 1 , the first substrate W1 and the second substrate W2 are flat, circular plates with the same diameter. The diameters of the first substrate W1 and the second substrate W2 may be 300 mm or a different value. The thermal expansion coefficient of the first substrate W1 may be the same as or different from the thermal expansion coefficient of the second substrate W2. The first substrate W1 includes a circular substrate WD1, and the second substrate W2 includes a circular substrate WD2. The substrate WD1 and the substrate WD2 are made of a semiconductor such as single crystal silicon. The substrate WD1 and the substrate WD2 may also be made of a material other than a semiconductor.

[0018] Both the substrate WD1 and the substrate WD2 include a circular front surface and a back surface that are parallel to each other, and an annular end surface that connects the outer edges of the front surface and the back surface. The front surface and the back surface of the substrate WD1 are flat surfaces that are parallel to each other. The front surface and the back surface of the substrate WD2 are similar. The front surfaces of the substrate WD1 and the substrate WD2 are device formation surfaces on which devices such as transistors are formed. The back surfaces of the substrate WD1 and the substrate WD2 are non-device formation surfaces on which devices are not formed. Both the front surface and the back surface of the substrate WD1 or the substrate WD2 may be device formation surfaces.

[0019] The outer periphery of the substrate WD1 forms a V-shaped notch that opens at the end face of the substrate WD1 when the substrate WD1 is viewed in a direction perpendicular to the surface of the substrate WD1. The outer periphery of the substrate WD1 may form an orientation flat (so-called orientation flat) instead of a notch. The notch and orientation flat indicate the crystal orientation of the substrate WD1 or the substrate WD2. The first substrate W1 is positioned in the circumferential direction of the first substrate W1 based on the notch or orientation flat of the first substrate W1. The same applies to the second substrate W2.

[0020] The first substrate W1 includes a device layer WC1 covering the surface of the substrate WD1 and a bonding layer WB1 covering the surface of the device layer WC1. The second substrate W2 includes a device layer WC2 covering the surface of the substrate WD2 and a bonding layer WB2 covering the surface of the device layer WC2. Devices such as transistors are disposed in the device layers WC1 and WC2. The devices are covered by the bonding layers WB1 and WB2. The bonding layers WB1 and WB2 are transparent or semi-transparent insulating layers. The bonding layers WB1 and WB2 may be silicon oxide films or thin films made of a material other than silicon oxide. In the former case, the bonding layers WB1 and WB2 may be silicon oxide films made using TEOS (tetraethoxysilane).

[0021] The bonding surface WA1 of the first substrate W1 is the surface of the first substrate W1 that comes into contact with the atmosphere in the space in which the first substrate W1 is placed. When the bonding surface WA1 of the first substrate W1 is facing upward, the bonding surface WA1 of the first substrate W1 corresponds to the upper surface of the first substrate W1, and the back surface of the first substrate W1 corresponds to the lower surface of the first substrate W1. The surface of the bonding layer WB1 corresponds to the bonding surface WA1 of the first substrate W1. The bonding surface WA1 may be a circular plane that covers the entire surface of the base material WD1 and is parallel to the surface of the base material WD1, or may be a plane that covers only a portion of the surface of the base material WD1 and is parallel to the surface of the base material WD1. The same applies to the second substrate W2.

[0022] 2 shows an example of a process for bonding a first substrate W1 and a second substrate W2. When bonding the first substrate W1 and the second substrate W2, an activation process (step S1 in FIG. 2) is performed to activate the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2, followed by a cleaning process (step S2 in FIG. 2) to clean and dry the two activated substrates W. This is followed by an inversion process (step S3 in FIG. 2) to invert one of the first substrate W1 and the second substrate W2.

[0023] After one of the first substrate W1 and the second substrate W2 has been inverted, the following steps are performed: an alignment confirmation step (step S4 in FIG. 2 ) of confirming the alignment, which indicates the relative position and angle of the first substrate W1 and the second substrate W2; an alignment adjustment step (step S5 in FIG. 2 ) of adjusting the alignment of the first substrate W1 and the second substrate W2 based on the confirmed alignment; and a substrate contact step (step S6 in FIG. 2 ) of bonding the first substrate W1 and the second substrate W2 by bringing them into contact with each other after the alignment adjustment. This is followed by an inspection step (step S7 in FIG. 2 ) of inspecting the bonding accuracy of the first substrate W1 and the second substrate W2, i.e., the amount of misalignment between the two bonded substrates W and the amount of misalignment between the two bonded substrates W (the angle around the center of the substrate W).

[0024] The activation step may be a plasma treatment in which plasma such as oxygen plasma is applied to the bonding surfaces WA1 and WA2 of the substrate W. In this case, moisture in the air or moisture supplied to the substrate W in the cleaning step comes into contact with the bonding surfaces WA1 and WA2 of the substrate W that have been irradiated with the plasma, and hydrophilic groups such as hydroxyl groups (OH groups) are formed on the bonding surfaces WA1 and WA2 of the substrate W. The plasma treatment is an example of surface modification that modifies the surface of the substrate W. The activation step may also be a wet treatment in which a hydrophilizing liquid is supplied to the bonding surfaces WA1 and WA2 of the substrate W, which forms hydrophilic groups on the bonding surfaces WA1 and WA2 of the substrate W.

[0025] The substrate contacting step may be a step of directly bonding two substrates W in the atmosphere at room temperature (e.g., 20 to 30° C.). The substrate contacting step may be a step of performing face-to-face bonding in which the two substrates W are bonded together so that their surfaces face each other. In this case, the surfaces of the two substrates W correspond to the bonding surfaces WA1 and WA2 of the two substrates W. The substrate contacting step may be a step of bonding two substrates W together without pressing one of the two substrates W against the other of the two substrates W, or by pressing one of the two substrates W against the other of the two substrates W with a pressure that does not damage devices formed on the two substrates W.

[0026] The lower side of Fig. 1 shows a cross section of the first substrate W1 and the second substrate W2 cut along a plane perpendicular to the first substrate W1 and the second substrate W2. The ratio of the thickness of the device layer WC1 and the device layer WC2 to the thickness of the bonding layer WB1 and the bonding layer WB2 shown in Fig. 1 is not necessarily the same as the actual ratio. The left side of Fig. 1 shows an example in which hydroxyl groups, an example of hydrophilic groups, are formed on the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2 before bonding. In this example, oxygen atoms (O) in the hydroxyl groups are bonded to silicon atoms (Si) in the bonding layers WB1 and WB2.

[0027] Before bonding, the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2 are terminated with multiple hydroxyl groups. When the bonding surface WA1 of the first substrate W1 and the bonding surface WA2 of the second substrate W2 are brought into contact, the first substrate W1 and the second substrate W2 are bonded together due to the intermolecular force acting between the two hydroxyl groups. In some cases, water molecules are released from the two hydroxyl groups, and silicon atoms in the bonding layer WB1 of the first substrate W1 and silicon atoms in the bonding layer WB2 of the second substrate W2 are bonded together via oxygen atoms. In this manner, the first substrate W1 and the second substrate W2 are bonded together.

[0028] The substrate bonding apparatus 1 that bonds two substrates W as described above will be described below.

[0029] 3 is a schematic plan view of a substrate bonding apparatus 1 according to one embodiment of the present invention. In the following description, the up-down direction, the left-right direction LR, and the front-rear direction FB refer to the up-down direction, the left-right direction LR, and the front-rear direction FB of the substrate bonding apparatus 1 unless otherwise specified. The up-down direction is the vertical direction. The left-right direction LR and the front-rear direction FB are two horizontal directions that are perpendicular to each other. The left-right direction LR is the arrangement direction of multiple carriers CA held on multiple load ports LP. Each carrier CA is held on the load port LP with the opening of the carrier CA (see FIG. 4C) facing rearward.

[0030] The substrate bonding apparatus 1 is an apparatus for bonding two disk-shaped substrates W. The substrate bonding apparatus 1 includes a plurality of load ports LP on each of which a plurality of carriers CA, such as FOUPs (Front-Opening Unified Pods), are placed, each carrier CA accommodating a plurality of substrates W, a plurality of processing units for processing the substrates W transported from the plurality of load ports LP, a transport system TS for transporting the substrates W between the plurality of load ports LP and the plurality of processing units, and an outer wall 1a that forms an enclosed space accommodating the plurality of processing units and the transport system TS.

[0031] 3 shows an example in which six load ports LP are provided. The number of load ports LP may be any number other than six, as long as it is three or more. The multiple load ports LP include a first load port LP on which a carrier CA accommodating a first substrate W1 is placed, a second load port LP on which a carrier CA accommodating a second substrate W2 is placed, and a third load port LP on which a carrier CA accommodating a third substrate W3 representing the bonded first and second substrates W1 and W2 is placed. The first load port LP and the second load port LP are load ports on which a carrier CA accommodating a substrate W to be bonded in the substrate bonding apparatus 1 is placed. The third load port LP is an unload port on which a carrier CA accommodating two substrates W bonded in the substrate bonding apparatus 1 is placed.

[0032] The multiple processing units are units that cause at least one of a physical change and a chemical change to at least one of the front and back surfaces of the substrate W. The multiple processing units include at least one plasma processing unit 2p that performs plasma processing to activate the front or back surface of the substrate W by contacting plasma with the front or back surface of the substrate W, at least a cleaning unit 2c that cleans the substrate W by supplying a cleaning liquid to the substrate W, and at least one bonding unit 2b that bonds two substrates W by contacting the two substrates W. FIG. 3 shows an example in which two plasma processing units 2p, two cleaning units 2c, and two bonding units 2b are provided. In this example, two cleaning units 2c are stacked one above the other. The multiple processing units may further include a heating unit that heats the two substrates W bonded by the bonding unit 2b to increase the bonding strength of the two substrates W.

[0033] The transport system TS is a system that transports substrates W while maintaining the substrates W horizontally. The transport system TS includes a first transport robot R1 that transports substrates W between multiple load ports LP and at least one plasma processing unit 2p, and a second transport robot R2 that transports substrates W into and out of at least one plasma processing unit 2p. The transport system TS further includes a third transport robot R3 that transports substrates W between at least one plasma processing unit 2p and at least one cleaning unit 2c, and a fourth transport robot R4 that transports substrates W into and out of at least one bonding unit 2b.

[0034] The substrate bonding apparatus 1 includes a first transfer chamber 10 that houses a first transfer robot R1, a second transfer chamber 13 that houses a second transfer robot R2, a third transfer chamber 16 that houses a third transfer robot R3, and a fourth transfer chamber 19 that houses a fourth transfer robot R4. Figure 3 shows an example in which the first transfer robot R1, the third transfer robot R3, and the fourth transfer robot R4 are all mobile robots that move horizontally, while the second transfer robot R2 is a fixed robot that does not move horizontally. In this example, the first transfer robot R1 and the fourth transfer robot R4 move in the left-right direction LR within the first transfer chamber 10 and the fourth transfer chamber 19, respectively, and the third transfer robot R3 moves in the front-back direction FB within the third transfer chamber 16.

[0035] The substrate bonding apparatus 1 includes a control device 3 that controls the electrical and electronic devices provided in the substrate bonding apparatus 1. The control device 3 includes at least one computer. The computer includes a memory 3m that stores information such as programs, and a CPU 3c (central processing unit) that controls the substrate bonding apparatus 1 in accordance with the programs stored in the memory 3m. The control device 3 controls the substrate bonding apparatus 1 to transport and process the substrates W as described below. In other words, the control device 3 is programmed to transport and process the substrates W as described below.

[0036] Next, the first transport robot R1 and the related configuration will be described.

[0037] Fig. 4A is a schematic diagram showing a part of Fig. 3. Fig. 4B is a schematic diagram showing a vertical cross section taken along line B-B shown in Fig. 4A. Fig. 4C is a schematic diagram showing a vertical cross section taken along line CC shown in Fig. 4A. As shown in Fig. 4B, the substrate bonding apparatus 1 includes at least one pre-activation aligner 11 that positions one substrate W with reference to a notch or an orientation flat, and a load lock chamber 12 that accommodates the substrate W unloaded from the at least one pre-activation aligner 11.

[0038] 4B shows an example in which two pre-activation aligners 11 are provided. In this example, the two pre-activation aligners 11 are stacked one on top of the other, and the load lock chamber 12 is arranged below the two pre-activation aligners 11. The load lock chamber 12 may be arranged above the two pre-activation aligners 11, or may be arranged between the two pre-activation aligners 11. The load lock chamber 12 does not have to overlap the two pre-activation aligners 11 in a plan view. The two pre-activation aligners 11 do not have to overlap each other in a plan view. Note that a plan view means that the object is viewed from directly above.

[0039] The pre-activation aligner 11 includes a plurality of partition plates 5 that form an internal space in which the substrate W is placed and a passage opening 4 through which the substrate W passes to enter and exit the internal space, and a chuck 8a that holds the substrate W horizontally within the internal space. The plurality of partition plates 5 includes a fixed partition plate 6 that forms the internal space and the passage opening 4, and a door 7 that opens and closes the passage opening 4 by moving relative to the fixed partition plate 6. A portion of the outer wall 1a (see FIG. 4A ) of the substrate bonding apparatus 1 may be included in the plurality of partition plates 5. The passage opening 4 corresponds to a passage connecting the space outside the pre-activation aligner 11 to the space inside the pre-activation aligner 11. The passage opening 4 includes a space through which the substrate W passes and an inner peripheral surface that surrounds the entire periphery of this space. This also applies to passage openings 4a and 4b and other passage openings 4 described below.

[0040] The pre-activation aligner 11 further includes an electric motor 9 that rotates the chuck 8a to rotate the substrate W around a vertical center of rotation that passes through the center of the substrate W held on the chuck 8a, an edge sensor 11s that identifies the orientation of the notch or orientation flat by detecting the outer peripheral shape of the substrate W, and a control device (not shown) that causes the electric motor 9 to rotate the chuck 8a based on the detection value of the edge sensor 11s, thereby stopping the substrate W at a position where the orientation of the notch or orientation flat coincides with a reference direction.

[0041] The chuck 8a may be a mechanical chuck that holds the substrate W horizontally by pressing multiple chuck pins horizontally against the edge surface of the substrate W, or a vacuum chuck that holds the substrate W horizontally by attracting the lower surface of the substrate W to the upper surface of a spin base arranged below the substrate W. In the latter case, the edge sensor 11s may identify the position of the center of the substrate W by detecting the outer circumferential shape of the substrate W. In this case, the pre-activation aligner 11 may further include a centering actuator that moves the chuck 8a horizontally to bring the center of the substrate W closer to the center of rotation of the substrate W. The content of this paragraph also applies to the pre-bonding aligner 20 described below.

[0042] An actuator is a device that converts driving energy, such as electrical, fluid, magnetic, thermal, or chemical energy, into mechanical work. Actuators include electric motors (rotary motors), linear motors, air cylinders, and other devices. When the motion of the actuator differs from the motion of the object, a motion converter may be provided to convert the actuator's motion into linear or rotational motion. For example, if the actuator is an electric motor that moves the object linearly, the rotation of the electric motor may be converted into linear motion by a motion converter such as a ball screw and ball nut.

[0043] The load lock chamber 12 includes a plurality of partition plates 5 that form an internal space in which the substrate W is placed and passage ports 4a and 4b through which the substrate W passes to enter and exit the internal space, and a vacuum pump P that reduces the air pressure within the internal space. The plurality of partition plates 5 include a fixed partition plate 6 that forms the internal space and the passage ports 4a and 4b, an entrance gate valve 7A that moves relative to the fixed partition plate 6 to open and close the passage port 4a, and an exit gate valve 7B that moves relative to the fixed partition plate 6 to open and close the passage port 4b. The entrance gate valve 7A and the exit gate valve 7B correspond to doors that open and close the passage ports 4a and 4b. The passage ports 4a and 4b of the load lock chamber 12 are located at the same height.

[0044] The load lock chamber 12 includes a plurality of supports 8b that horizontally support the substrates W in the load lock chamber 12 so that the substrates W are arranged in parallel with a gap between them. Fig. 4B shows an example in which two supports 8b are provided. The supports 8b may be a plurality of pins that contact the lower surface of the substrate W, or a pair of horizontal, parallel rails that contact the lower surface of the substrate W. Fig. 4B shows an example of the former. The supports 8b may be something other than a plurality of pins and a pair of rails, as long as the first transport robot R1 can transfer the substrate W to and from the supports 8b without contacting them.

[0045] As shown in FIG. 4C , the substrate bonding apparatus 1 includes a post-bonding staging table 22 that supports two bonded substrates W. The post-bonding staging table 22 includes a plurality of partition plates 5 that form an internal space in which the substrates W are placed and passage openings 4 a and 4 b through which the substrates W pass to enter and exit the internal space, and at least one support portion 8 b that horizontally supports the substrates W within the internal space. The plurality of partition plates 5 includes a fixed partition plate 6 that forms the passage openings 4 a and 4 b. The passage openings 4 a and 4 b of the post-bonding staging table 22 may be always open or may be open and closed. In the latter case, the plurality of partition plates 5 may include a door 7 a that moves relative to the fixed partition plate 6 to open and close the passage opening 4 a, and a door 7 b that moves relative to the fixed partition plate 6 to open and close the passage opening 4 b.

[0046] The first transport robot R1 includes at least one first hand H1 that horizontally supports a substrate W, and a first body B1 that supports all of the first hands H1. Figures 4A to 4C show an example in which four first hands H1 are provided, and each first hand H1 is provided with an articulated arm that can bend and stretch horizontally. The number of first hands H1 provided on the first transport robot R1 may be one to three. When two or more first hands H1 are provided, two first hands H1 may be attached to one articulated arm. This also applies to transport robots other than the first transport robot R1.

[0047] The first hand H1 may be a grip-type, vacuum-type, electrostatic-type, or Bernoulli-type hand, or may be another type of hand. The first hand H1 is disposed above the first body B1. The first hand H1 rotates together with the first body B1 around the rotation center C1 of the first transport robot R1. The rotation center C1 of the first transport robot R1 is a vertical line passing through the first body B1. The contents of this paragraph also apply to transport robots other than the first transport robot R1, such as the second transport robot R2.

[0048] As shown in FIG. 4B , the first transport robot R1 includes a rotation actuator AR that rotates the first body B1 around a rotation center C1 that represents a vertical line, a horizontal actuator AH that moves the first hand H1 horizontally to change the horizontal distance from the rotation center C1 to the first hand H1, and a vertical actuator AV that moves the first hand H1 vertically. The first transport robot R1 further includes a travel actuator AT that moves the first body B1 horizontally in a horizontal first travel direction to move all of the first hands H1 horizontally in the first travel direction. In the example shown in FIG. 4A , the first travel direction is the left-right direction LR.

[0049] As shown in Figure 4C, the opening of the carrier CA faces the first transfer chamber 10. As shown in Figures 4B and 4C, the passage ports 4 of the two pre-activation aligners 11, the passage port 4a of the load lock chamber 12, and the passage port 4b of the post-bonding staging stage 22 face the first transfer chamber 10. The passage port 4b of the load lock chamber 12 and the passage port 4a of the post-bonding staging stage 22 face the opposite side of the first transfer chamber 10. The opening of the carrier CA faces rearward. The passage port 4 of the pre-activation aligners 11, the passage port 4a of the load lock chamber 12, and the passage port 4b of the post-bonding staging stage 22 face forward. The passage port 4b of the load lock chamber 12 and the passage port 4a of the post-bonding staging stage 22 face rearward.

[0050] The first transport robot R1 performs at least one of changing the orientation of the first hand H1 (rotating the first hand H1 around the rotation center C1), moving the first hand H1 in the vertical direction, and traveling in the first traveling direction. As a result, the first transport robot R1 causes the first hand H1 to horizontally face any of the carriers CA. Similarly, the first transport robot R1 performs at least one of changing the orientation of the first hand H1, etc., to cause the first hand H1 to horizontally face any of the pre-activation aligner 11, the load lock chamber 12, and the post-bonding staging table 22.

[0051] The first transfer robot R1 moves the first hand H1 into and out of the carrier CA through an opening of the carrier CA. The first transfer robot R1 moves the first hand H1 into and out of the pre-activation aligner 11 through the passage 4 of the pre-activation aligner 11. The first transfer robot R1 moves the first hand H1 into and out of the load lock chamber 12 through the passage 4a of the load lock chamber 12. The first transfer robot R1 moves the first hand H1 into and out of the post-bonding staging stage 22 through the passage 4b ​​of the post-bonding staging stage 22.

[0052] The first transport robot R1 can load and unload a substrate W into and from a carrier CA on any of the load ports LP. The first transport robot R1 can load and unload a substrate W into and from any of the pre-activation aligners 11. The first transport robot R1 can load and unload a substrate W into and from the load lock chamber 12, and can load and unload a substrate W into and from the post-bonding staging table 22. The first transport robot R1 can load and unload a substrate W into and from the carrier CA, pre-activation aligner 11, load lock chamber 12, and post-bonding staging table 22 using any of the first hands H1.

[0053] The first transport robot R1 can exchange the substrate W with each of the carrier CA, the pre-activation aligner 11, the load lock chamber 12, and the post-bonding staging table 22 by loading and unloading the substrate W. When the first transport robot R1 exchanges the substrate W with the pre-activation aligner 11, the first transport robot R1 uses the first hand H1 to unload the substrate W from the pre-activation aligner 11. After unloading the substrate W from the pre-activation aligner 11, the first transport robot R1 loads the substrate W supported by another first hand H1 into the pre-activation aligner 11. In this way, the substrate W is exchanged between the pre-activation aligner 11 and the first transport robot R1.

[0054] Next, the second transport robot R2 and the related configuration will be described.

[0055] Fig. 5A is a schematic diagram showing a part of Fig. 3. Fig. 5B is a schematic diagram showing a vertical cross section along line B-B shown in Fig. 5A. The substrate bonding apparatus 1 is provided with at least one plasma processing unit 2p that performs plasma processing on the substrate W unloaded from the load lock chamber 12. Fig. 5A shows an example in which two plasma processing units 2p are provided.

[0056] 5B , the plasma processing unit 2p includes a plurality of partition plates 5 that form an internal space in which the substrate W is placed and a passage opening 4 through which the substrate W passes to enter and exit the internal space, a lower electrode 15L that horizontally supports the substrate W in the internal space, an upper electrode 15u that is positioned above the substrate W held by the lower electrode 15L, a gas pipe 15p that supplies a processing gas between the upper electrode 15u and the lower electrode 15L, a gas valve 15v that opens and closes the gas pipe 15p, a power source 15s that converts the processing gas between the upper electrode 15u and the lower electrode 15L into plasma, and a vacuum pump P that exhausts gas from the internal space. The plurality of partition plates 5 include a fixed partition plate 6 that forms the internal space and the passage opening 4, and a door 7 that moves relative to the fixed partition plate 6 to open and close the passage opening 4.

[0057] Although not shown, the gas valve 15v includes a valve body provided with an annular valve seat through which gas passes, a valve element movable relative to the valve seat, and an actuator that moves the valve element between a closed position in which the valve element contacts the valve seat and an open position in which the valve element is separated from the valve seat. The actuator may be a pneumatic actuator, an electric actuator, or another type of actuator. The control device 3 (see FIG. 3) controls the actuator to open and close the gas valve 15v.

[0058] The substrate bonding apparatus 1 includes an unload lock chamber 14 that accommodates substrates W unloaded from the plasma processing unit 2p. The unload lock chamber 14 has a configuration similar to that of the load lock chamber 12. Accordingly, the unload lock chamber 14 includes a plurality of partition plates 5 that define an internal space, passage openings 4a and 4b, a plurality of support members 8b, and a vacuum pump P. The partition plates 5 include a fixed partition plate 6, an inlet gate valve 7A, and an outlet gate valve 7B. The load lock chamber 12, the plasma processing unit 2p, and the unload lock chamber 14 are connected to a second transfer chamber 13 in which a second transfer robot R2 is disposed. The load lock chamber 12, the plasma processing unit 2p, and the unload lock chamber 14 are disposed within a range in which the second transfer robot R2 can transfer substrates W.

[0059] The second transport robot R2 includes at least one second hand H2 that horizontally supports the substrate W, and a second body B2 that supports all of the second hands H2. Figures 5A and 5B show an example in which two second hands H2 are provided, and each second hand H2 is provided with an articulated arm that can bend and stretch horizontally.

[0060] The second transfer robot R2 includes a rotation actuator AR that rotates the second hand H2 around a rotation center C2 that represents a vertical line, a horizontal actuator AH that moves the second hand H2 horizontally to change the horizontal distance from the rotation center C2 to the second hand H2, and a vertical actuator AV that moves the second hand H2 vertically. As described above, the second transfer robot R2 is a fixed robot that does not move horizontally. The second body B2 can rotate and move up and down relative to the floor surface F1 of the substrate bonding apparatus 1, but does not move horizontally.

[0061] As shown in FIG. 5A , the second transfer chamber 13 is disposed between the load lock chamber 12 and the unload lock chamber 14 in the front-to-rear direction FB. The passage 4b ​​of the load lock chamber 12 and the passage 4a of the unload lock chamber 14 face toward the second transfer chamber 13. The passage 4 of the plasma processing unit 2p, which will be described later, also faces toward the second transfer chamber 13. The passage 4b ​​of the load lock chamber 12 faces toward the rear. The passage 4a of the unload lock chamber 14 faces toward the front. The passage 4b ​​of the unload lock chamber 14 faces toward the third transfer chamber 16. The passage 4b ​​of the unload lock chamber 14 faces toward the side. FIG. 5A shows an example in which the passage 4b ​​of the unload lock chamber 14 faces toward the right.

[0062] The second transfer robot R2 performs at least one of changing the orientation of the second hand H2 (rotating the second hand H2 around the rotation center C2) and moving the second hand H2 vertically. As a result, the second transfer robot R2 positions the second hand H2 horizontally facing one of the load lock chamber 12, the plasma processing unit 2p, and the unload lock chamber 14. The second transfer robot R2 moves the second hand H2 in and out of the load lock chamber 12 through the passage 4b ​​of the load lock chamber 12. The second transfer robot R2 moves the second hand H2 in and out of the plasma processing unit 2p through the passage 4 of the plasma processing unit 2p. The second transfer robot R2 moves the second hand H2 in and out of the load lock chamber 12 through the passage 4a of the unload lock chamber 14.

[0063] The second transport robot R2 can load and unload a substrate W into and from any of the load lock chamber 12, the plasma processing unit 2p, and the unload lock chamber 14. The second transport robot R2 can use any of the second hands H2 to load and unload a substrate W into and from the load lock chamber 12, the plasma processing unit 2p, and the unload lock chamber 14. The second transport robot R2 can exchange substrates W with each of the load lock chamber 12, the plasma processing unit 2p, and the unload lock chamber 14 by loading and unloading the substrate W.

[0064] When the exit gate valve 7B of the load lock chamber 12 is closed, the internal space of the second transfer chamber 13 is isolated from the internal space of the load lock chamber 12 by the exit gate valve 7B of the load lock chamber 12, and neither the substrate W nor gas can move between the internal space of the load lock chamber 12 and the internal space of the second transfer chamber 13. Similarly, when the entrance gate valve 7A of the unload lock chamber 14 is closed, the internal space of the second transfer chamber 13 is isolated from the internal space of the unload lock chamber 14 by the entrance gate valve 7A of the unload lock chamber 14, and neither the substrate W nor gas can move between the internal space of the unload lock chamber 14 and the internal space of the second transfer chamber 13.

[0065] The air pressure in the second transfer chamber 13 is maintained at a low pressure lower than the air pressure in the clean room (hereinafter also referred to as normal pressure) by a vacuum pump P (see FIG. 5B ). The air pressure in the plasma processing unit 2p is also maintained at a low pressure. The second transfer chamber 13 is a vacuum transfer chamber in which the air pressure is maintained at a low pressure. The air pressure in the load lock chamber 12 varies between normal pressure and low pressure. Similarly, the air pressure in the unload lock chamber 14 varies between normal pressure and low pressure. The second transfer robot R2 transfers substrates W between the load lock chamber 12 and the second transfer chamber 13 when the air pressure in the load lock chamber 12 is low, and transfers substrates W between the unload lock chamber 14 and the second transfer chamber 13 when the air pressure in the unload lock chamber 14 is low. The second transfer robot R2 is a vacuum transfer robot that transfers substrates W in a reduced pressure atmosphere lower than the air pressure in the clean room.

[0066] When the substrate W is transferred from the first transfer chamber 10 to the load lock chamber 12, the entrance gate valve 7A of the load lock chamber 12 is opened while the exit gate valve 7B of the load lock chamber 12 is closed. Once the substrate W has been transferred from the first transfer chamber 10 to the load lock chamber 12, the entrance gate valve 7A of the load lock chamber 12 is closed. Thereafter, with the entrance gate valve 7A and the exit gate valve 7B of the load lock chamber 12 closed, the vacuum pump P of the load lock chamber 12 reduces the air pressure inside the load lock chamber 12 to a low pressure. Thereafter, with the entrance gate valve 7A of the load lock chamber 12 closed, the exit gate valve 7B of the load lock chamber 12 is opened. In this state, the second transfer robot R2 transfers the substrate W from the load lock chamber 12 to the second transfer chamber 13.

[0067] When loading a substrate W from the second transfer chamber 13 into the unload lock chamber 14, the entrance gate valve 7A and exit gate valve 7B of the unload lock chamber 14 are closed, and the vacuum pump P of the unload lock chamber 14 reduces the air pressure inside the unload lock chamber 14 to a low pressure. Thereafter, the entrance gate valve 7A of the unload lock chamber 14 is opened, and the second transfer robot R2 transfers the substrate W from the second transfer chamber 13 to the unload lock chamber 14, with the exit gate valve 7B of the unload lock chamber 14 closed. When loading a substrate W from the unload lock chamber 14 to the third transfer chamber 16, the entrance gate valve 7A of the unload lock chamber 14 is closed, and the exit gate valve 7B of the unload lock chamber 14 is opened. In this state, the third transfer robot R3 transfers the substrate W from the unload lock chamber 14 to the third transfer chamber 16.

[0068] Next, the third transport robot R3 and the related configuration will be described.

[0069] Fig. 6A is a schematic diagram showing a part of Fig. 3. Fig. 6B is a schematic diagram showing a vertical cross section taken along line B-B shown in Fig. 6A. Fig. 6C is a schematic diagram showing a vertical cross section taken along line CC shown in Fig. 6A. The substrate bonding apparatus 1 is provided with at least one cleaning unit 2c that cleans the substrate W by supplying a cleaning liquid to the substrate W that has been subjected to plasma processing. Fig. 6B shows an example in which two cleaning units 2c are provided. In this example, the two cleaning units 2c are stacked one on top of the other.

[0070] 6A , the cleaning unit 2c includes a plurality of partition plates 5 that form an internal space in which the substrate W is placed and a passage opening 4 through which the substrate W passes to enter and exit the internal space, a chuck 8a that holds the substrate W horizontally, an electric motor 9 that rotates the chuck 8a to rotate the substrate W about a vertical rotation center passing through the center of the substrate W held by the chuck 8a, and one or more processing liquid nozzles 17 that discharge a processing liquid such as a cleaning liquid toward the substrate W held by the chuck 8a. The plurality of partition plates 5 include a fixed partition plate 6 that forms the internal space and the passage opening 4, and a door 7 that moves relative to the fixed partition plate 6 to open and close the passage opening 4. The cleaning liquid may be pure water (deionized water (DIW)) or a liquid other than pure water.

[0071] As shown in Fig. 6C, the substrate bonding apparatus 1 is provided with at least one post-cleaning staging table 18 that supports the substrates W cleaned in the cleaning unit 2c. Fig. 6C shows an example in which three post-cleaning staging tables 18 are provided stacked one on top of the other. One of the post-cleaning staging tables 18 is a first post-bonding staging table 18a that relays two substrates W after bonding. The remaining two post-cleaning staging tables 18 are pre-bonding staging tables 18b that relay substrates W before bonding. The above-mentioned post-bonding staging table 22 is a second post-bonding staging table that relays the substrates W carried out from the first post-bonding staging table 18a.

[0072] 6C , the first post-bonding staging stand 18a is disposed above the two pre-bonding staging stands 18b. The first post-bonding staging stand 18a may be disposed below the two pre-bonding staging stands 18b, or may be disposed between the two pre-bonding staging stands 18b. The first post-bonding staging stand 18a may be disposed at a position where it does not overlap the pre-bonding staging stand 18b in a plan view. Similarly, the two pre-bonding staging stands 18b may be disposed at positions where they do not overlap each other in a plan view. The number of pre-bonding staging stands 18b may be one.

[0073] The post-cleaning staging platform 18 includes a plurality of partition plates 5 that form an internal space in which the substrates W are placed and passage openings 4a and 4b through which the substrates W pass to enter and exit the internal space, and at least one support portion 8b that horizontally supports the substrates W within the internal space. The plurality of partition plates 5 includes a fixed partition plate 6 that forms the passage openings 4a and 4b. The passage openings 4a and 4b of the post-cleaning staging platform 18 may be always open or may be opened and closed. In the latter case, the plurality of partition plates 5 may include a door 7a that moves relative to the fixed partition plate 6 to open and close the passage opening 4a, and a door 7b that moves relative to the fixed partition plate 6 to open and close the passage opening 4b.

[0074] The passage opening 4a of the post-cleaning staging platform 18 faces the third transport chamber 16. The passage opening 4b of the post-cleaning staging platform 18 faces the fourth transport chamber 19. The passage opening 4a of the post-cleaning staging platform 18 faces forward. The passage opening 4b of the post-cleaning staging platform 18 faces sideways. Figure 6A shows an example in which the passage opening 4b of the post-cleaning staging platform 18 faces left. As mentioned above, the passage opening 4b of the unload lock chamber 14 faces right. Therefore, the passage opening 4b of the post-cleaning staging platform 18 faces the opposite side to the passage opening 4b of the unload lock chamber 14 in the left-right direction LR.

[0075] The substrate W unloaded from the cleaning unit 2c is loaded onto the post-cleaning staging platform 18 through the passage opening 4a of the post-cleaning staging platform 18 and unloaded from the post-cleaning staging platform 18 through the passage opening 4b of the post-cleaning staging platform 18. The two substrates W bonded by the bonding unit 2b are loaded onto the post-cleaning staging platform 18 through the passage opening 4b of the post-cleaning staging platform 18 and unloaded from the post-cleaning staging platform 18 through the passage opening 4a of the post-cleaning staging platform 18. Therefore, for the two bonded substrates W, the passage opening 4b of the post-cleaning staging platform 18 is an entrance, and the passage opening 4a of the post-cleaning staging platform 18 is an exit. The first substrate W1 and the second substrate W2 to be bonded in the bonding unit 2b are loaded onto the same post-cleaning staging platform 18. Figure 6C shows an example in which two supports 8b are provided for each post-cleaning staging platform 18. The two support portions 8b horizontally support the first substrate W1 and the second substrate W2 in the internal space so that the first substrate W1 and the second substrate W2 are arranged parallel to each other with a gap between them.

[0076] The pre-bonding staging stand 18 b, which relays the substrates W before bonding, may include at least one of a heater and a cooler 18 c that raise or lower the temperature of the internal space of the pre-bonding staging stand 18 b, and a control device that maintains the temperature of the internal space at a constant set temperature by controlling at least one of the heater and the cooler 18 c. Fig. 6C shows an example in which the cooler 18 c is provided.

[0077] The set temperature may be room temperature, or may be higher or lower than room temperature. The set temperature may be set by a human operating the substrate bonding apparatus 1, or may be set by a control device based on a detection value of a temperature sensor that detects the temperature of the substrate W before it is carried into the internal space. In either case, the temperature of the substrate W in the pre-bonding staging stand 18b is made to approach the set temperature, so that the temperature of the substrate W when it is carried out from the pre-bonding staging stand 18b can be stabilized.

[0078] 6A, the third transport robot R3 includes at least one third hand H3 that horizontally supports a substrate W, and a third body B3 that supports all of the third hands H3. Figures 6A and 6C show an example in which four third hands H3 are provided, and each third hand H3 is provided with an articulated arm that can bend and stretch horizontally.

[0079] The third transport robot R3 includes a rotation actuator AR that rotates the third hand H3 around a rotation center C3 that represents a vertical line, a horizontal actuator AH that moves the third hand H3 horizontally to change the horizontal distance from the rotation center C3 to the third hand H3, and a vertical actuator AV that moves the third hand H3 vertically. The third transport robot R3 further includes a travel actuator AT that moves the third body B3 horizontally in a horizontal third travel direction, thereby moving all of the third hands H3 horizontally in the third travel direction. In the example shown in FIG. 6A , the third travel direction is the front-to-rear direction FB.

[0080] The passage port 4b of the unload lock chamber 14 faces toward the third transfer chamber 16. Similarly, the passage port 4 of the cleaning unit 2c, the passage port 4a of the post-cleaning staging table 18, and the passage port 4a of the post-bonding staging table 22 face toward the third transfer chamber 16. The passage port 4a of the post-cleaning staging table 18 faces forward. The passage port 4a of the post-bonding staging table 22 faces rearward. The passage port 4b of the unload lock chamber 14 and the passage port 4 of the cleaning unit 2c face sideways. Figure 6A shows an example in which the passage port 4b of the unload lock chamber 14 and the passage port 4 of the cleaning unit 2c face to the right.

[0081] The third transfer robot R3 performs at least one of changing the orientation of the third hand H3 (rotating the third hand H3 around the rotation center C3), moving the third hand H3 vertically, and traveling in the third traveling direction. As a result, the third transfer robot R3 positions the third hand H3 horizontally facing one of the unload lock chamber 14, the cleaning unit 2c, the post-cleaning staging table 18, and the post-bonding staging table 22. The third transfer robot R3 moves the third hand H3 in and out of the unload lock chamber 14 through the passage opening 4b of the unload lock chamber 14. The third transfer robot R3 moves the third hand H3 in and out of the cleaning unit 2c through the passage opening 4 of the cleaning unit 2c. The third transfer robot R3 moves the third hand H3 in and out of the post-cleaning staging table 18 through the passage opening 4a of the post-cleaning staging table 18. The third transport robot R3 moves the third hand H3 into and out of the post-bonding staging table 22 through the passage opening 4a of the post-bonding staging table 22.

[0082] The third transport robot R3 can carry the substrate W into and out of any of the unload lock chamber 14, the cleaning unit 2c, the post-cleaning staging table 18, and the post-bonding staging table 22. The third transport robot R3 can use any of the third hands H3 to carry the substrate W into and out of the unload lock chamber 14, the cleaning unit 2c, the post-cleaning staging table 18, and the post-bonding staging table 22. The third transport robot R3 can exchange the substrate W with each of the unload lock chamber 14, the cleaning unit 2c, the post-cleaning staging table 18, and the post-bonding staging table 22 by carrying the substrate W into and out of each of them.

[0083] Next, the fourth transport robot R4 and the related configuration will be described.

[0084] Fig. 7A is a schematic diagram showing a part of Fig. 3. Fig. 7B is a schematic diagram showing a vertical cross section along line B-B shown in Fig. 7A. The substrate bonding apparatus 1 is equipped with at least one bonding unit 2b that bonds two cleaned substrates W. Fig. 7A shows an example in which two bonding units 2b are provided. In this example, the two bonding units 2b are horizontally adjacent to each other in the left-right direction LR.

[0085] 7B , the bonding unit 2b includes a plurality of partition plates 5 that form an internal space in which the first substrate W1 and the second substrate W2 are placed and a passage opening 4 through which the first substrate W1 and the second substrate W2 pass before and after bonding, a first chuck 8A that holds the first substrate W1 horizontally within the internal space, and a second chuck 8B that holds the second substrate W2 horizontally within the internal space. The plurality of partition plates 5 include a fixed partition plate 6 that forms the internal space and the passage opening 4, and a door 7 that moves relative to the fixed partition plate 6 to open and close the passage opening 4.

[0086] The bonding unit 2b further includes a plurality of bonding actuators 21a that bond the first substrate W1 and the second substrate W2 by moving the first chuck 8A and the second chuck 8B relatively while they are holding the first substrate W1 and the second substrate W2, and at least one camera 21c that detects the alignment of the first substrate W1 and the second substrate W2 at least either before or after bonding the first substrate W1 and the second substrate W2 by photographing at least one of the first substrate W1 and the second substrate W2.

[0087] The multiple bonding actuators 21a may include a horizontal actuator that moves the first chuck 8A and the second chuck 8B relatively in the horizontal direction, a vertical actuator that moves the first chuck 8A and the second chuck 8B relatively in the vertical direction, and a rotation actuator that rotates the first chuck 8A and the second chuck 8B relatively about a vertical line. The multiple bonding actuators 21a may include an inversion actuator that rotates the first chuck 8A about a horizontal line to invert the first substrate W1 held by the first chuck 8A up and down. The inversion actuator may also invert the first substrate W1 held by a chuck other than the first chuck 8A up and down. The inversion actuator may also invert the first substrate W1 up and down outside the bonding unit 2b.

[0088] The at least one camera 21c may include a first camera that photographs the first substrate W1 before being bonded to the second substrate W2, a second camera that photographs the second substrate W2 before being bonded to the first substrate W1, and a third camera that photographs the bonded first substrate W1 and second substrate W2. The first camera may photograph the first substrate W1 held by the first chuck 8A, or may photograph the first substrate W1 held by a chuck other than the first chuck 8A. The same applies to the second camera. The third camera may photograph the third substrate W3 (the bonded first substrate W1 and second substrate W2) held by the first chuck 8A or the second chuck 8B, or may photograph the third substrate W3 held by a chuck other than the first chuck 8A or the second chuck 8B. The at least one camera 21c may photograph at least one of the first substrate W1 and the second substrate W2 outside the bonding unit 2b.

[0089] The substrate bonding apparatus 1 includes at least one pre-bonding aligner 20 that positions one substrate W based on the notch or orientation flat. Figures 7A and 7B show an example in which two pre-bonding aligners 20 are provided for each bonding unit 2b. Therefore, four pre-bonding aligners 20 are provided for two bonding units 2b. The pre-bonding aligner 20 has a configuration similar to that of the pre-activation aligner 11. Therefore, the pre-bonding aligner 20 includes multiple partition plates 5, a chuck 8a, an electric motor 9, an edge sensor 11s, and a control device. The multiple partition plates 5 include a fixed partition plate 6 and a door 7.

[0090] The four pre-bonding aligners 20 form two pairs. The pre-bonding aligners 20 of one pair correspond to one bonding unit 2b, and the pre-bonding aligners 20 of the other pair correspond to the other bonding unit 2b. The pre-bonding aligners 20 of one pair position the first substrate W1 and the second substrate W2 to be carried into one bonding unit 2b. The pre-bonding aligners 20 of the other pair position the first substrate W1 and the second substrate W2 to be carried into the other bonding unit 2b. One of the two pre-bonding aligners 20 forming one pair is the first pre-bonding aligner 20 that positions the first substrate W1, and the other of the two pre-bonding aligners 20 forming one pair is the second pre-bonding aligner 20 that positions the second substrate W2.

[0091] One pair of pre-bonding aligners 20 are arranged above the bonding unit 2b in a vertically stacked state. The remaining pair of pre-bonding aligners 20 are arranged above the remaining bonding units 2b in a vertically stacked state. The pair of pre-bonding aligners 20 do not have to be vertically stacked. For example, the pair of pre-bonding aligners 20 may be aligned horizontally in the left-right direction LR at a position that overlaps the bonding unit 2b in a plan view. One pair of pre-bonding aligners 20 may be aligned horizontally, and the remaining pair of pre-bonding aligners 20 may be vertically stacked. The number of pre-bonding aligners 20 corresponding to one bonding unit 2b may be one.

[0092] The fourth transport robot R4 includes at least one fourth hand H4 that horizontally supports the substrate W, and a fourth body B4 that supports all of the fourth hands H4. Figures 7A and 7B show an example in which four fourth hands H4 are provided, and each fourth hand H4 is provided with an articulated arm that can bend and stretch horizontally.

[0093] The fourth transport robot R4 includes a rotation actuator AR that rotates the fourth hand H4 around a rotation center C4 that represents a vertical line, a horizontal actuator AH that moves the fourth hand H4 horizontally to change the horizontal distance from the rotation center C4 to the fourth hand H4, and a vertical actuator AV that moves the fourth hand H4 vertically. The fourth transport robot R4 further includes a travel actuator AT that moves the fourth body B4 horizontally in a horizontal fourth travel direction to move all of the fourth hands H4 horizontally in the fourth travel direction. In the example shown in FIG. 7A , the fourth travel direction is the left-right direction LR.

[0094] The passage opening 4b of the post-cleaning staging table 18 faces the fourth transport chamber 19. Similarly, the passage opening 4 of the pre-bonding aligner 20 and the passage opening 4 of the joining unit 2b face the fourth transport chamber 19. The passage opening 4 of the pre-bonding aligner 20 and the passage opening 4 of the joining unit 2b face forward. The fourth transport robot R4 moves the fourth hand H4 in and out of the post-cleaning staging table 18 through the passage opening 4b of the post-cleaning staging table 18. The fourth transport robot R4 moves the fourth hand H4 in and out of the pre-bonding aligner 20 through the passage opening 4 of the pre-bonding aligner 20. The fourth transport robot R4 moves the fourth hand H4 in and out of the joining unit 2b through the joining unit 2b.

[0095] The fourth transport robot R4 performs at least one of changing the orientation of the fourth hand H4 (rotating the fourth hand H4 around the rotation center C4), moving the fourth hand H4 vertically, and traveling in a fourth traveling direction. This allows the fourth transport robot R4 to horizontally face any of the post-cleaning staging table 18, the pre-bonding aligner 20, and the bonding unit 2b. The fourth transport robot R4 can load and unload a substrate W into and from any of the post-cleaning staging table 18, the pre-bonding aligner 20, and the bonding unit 2b. The fourth transport robot R4 can load and unload a substrate W into and from any of the post-cleaning staging table 18, the pre-bonding aligner 20, and the bonding unit 2b using any of the fourth hands H4. The fourth transport robot R4 can load and unload a substrate W into and from the post-cleaning staging table 18, the pre-bonding aligner 20, and the bonding unit 2b by loading and unloading the substrate W.

[0096] Next, an example of the layout of the substrate bonding apparatus 1 will be described.

[0097] In the following description, reference will be made to Figure 3. In the following description, the center WO of the substrate bonding apparatus 1 represents a vertical plane that divides the substrate bonding apparatus 1 into two equal parts in the left-right direction LR, which corresponds to the width direction.

[0098] The multiple load ports LP are aligned in the left-right direction LR in a plan view. The multiple carriers CA held by the multiple load ports LP are also aligned in the left-right direction LR in a plan view. The first transfer chamber 10 is disposed behind the multiple load ports LP. The first transfer chamber 10 extends in the left-right direction LR in a plan view. The first transfer chamber 10 is connected to all of the load ports LP.

[0099] The pre-activation aligner 11, the load lock chamber 12, and the post-bonding staging stage 22 are disposed behind the first transfer chamber 10. In a plan view, the pre-activation aligner 11, the load lock chamber 12, and the post-bonding staging stage 22 are disposed on the opposite side of the first transfer chamber 10 from the multiple load ports LP. The post-bonding staging stage 22 is disposed outward in the width direction from the pre-activation aligner 11 and the load lock chamber 12. The distance in the left-right direction LR from the center WO of the substrate bonding apparatus 1 to the post-bonding staging stage 22 is longer than the distance in the left-right direction LR from the center WO of the substrate bonding apparatus 1 to the pre-activation aligner 11.

[0100] The second transfer chamber 13 is disposed rearward of the load lock chamber 12. The unload lock chamber 14 is disposed rearward of the second transfer chamber 13. The second transfer chamber 13 is disposed at a position intersecting the center WO of the substrate bonding apparatus 1. The plasma processing unit 2p is disposed on the opposite side of the center WO of the substrate bonding apparatus 1 from the load lock chamber 12 and the unload lock chamber 14. The two plasma processing units 2p are disposed on either side of the second transfer chamber 13. The two plasma processing units 2p are disposed symmetrically with respect to a reference plane RS1, which is a vertical plane that passes through the rotation center C2 of the second transfer robot R2 and is perpendicular to the front-rear direction FB.

[0101] The cleaning unit 2c is disposed rearward of the unload lock chamber 14. The cleaning unit 2c may be adjacent to the unload lock chamber 14 or may be disposed rearward away from the unload lock chamber 14. The cleaning unit 2c is disposed on the same side of the third transfer chamber 16 as the second transfer chamber 13 and the unload lock chamber 14. FIG. 3 shows an example in which the second transfer chamber 13, the unload lock chamber 14, and the cleaning unit 2c are disposed to the left of the third transfer chamber 16.

[0102] The cleaning unit 2c is disposed on the same side of the reference plane RS1 of the second transport robot R2 as the unload lock chamber 14. The reference plane RS1 is a vertical plane that passes through the rotation center C2 of the second transport robot R2 and is perpendicular to the reference line. The reference line is a line that passes through the center of the substrate W held horizontally in the load lock chamber 12 and the center of the substrate W held horizontally in the unload lock chamber 14 in a plan view. In the example shown in FIG. 3 , the reference line is a line extending in the front-rear direction FR. The unload lock chamber 14 may be disposed between the second transport chamber 13 and the cleaning unit 2c, or may be disposed at a position other than between the second transport chamber 13 and the cleaning unit 2c. The cleaning unit 2c may be horizontally adjacent to the unload lock chamber 14 or may overlap the unload lock chamber 14 in a plan view.

[0103] The post-cleaning staging platform 18 is disposed rearward of the third transfer chamber 16. The third transfer chamber 16 is disposed rearward of the post-bonding staging platform 22. The post-cleaning staging platform 18 and the post-bonding staging platform 22 are disposed on opposite sides of the third transfer chamber 16. The post-bonding staging platform 22 is disposed forward of the unload lock chamber 14. The post-cleaning staging platform 18 is disposed rearward of the cleaning unit 2c. The post-cleaning staging platform 18 is disposed to the side of the fourth transfer chamber 19. FIG. 3 shows an example in which the post-cleaning staging platform 18 is disposed to the right of the fourth transfer chamber 19.

[0104] The fourth transfer chamber 19 is disposed behind the cleaning unit 2c. The fourth transfer chamber 19 is longer in the left-right direction LR than the cleaning unit 2c. The fourth transfer chamber 19 is parallel to the first transfer chamber 10 and is spaced rearward from the first transfer chamber 10. The two plasma processing units 2p are disposed between the first transfer chamber 10 and the fourth transfer chamber 19 in the front-to-back direction FB in a plan view. The pre-activation aligner 11, the load lock chamber 12, the second transfer robot R2, the second transfer chamber 13, the unload lock chamber 14, and the cleaning unit 2c are also disposed between the first transfer chamber 10 and the fourth transfer chamber 19 in the front-to-back direction FB in a plan view.

[0105] The bonding unit 2b and the pre-bonding aligners 20 are arranged along the fourth transfer chamber 19. The two bonding units 2b are arranged rearward of the fourth transfer chamber 19. The four pre-bonding aligners 20 are also arranged rearward of the fourth transfer chamber 19. The bonding unit 2b and the pre-bonding aligners 20 are arranged rearward of the post-cleaning relay table 18. The bonding unit 2b and the pre-bonding aligners 20 are arranged on the opposite side of the fourth transfer chamber 19 from the cleaning unit 2c. The two bonding units 2b are horizontally adjacent to each other. FIG. 3 shows an example in which two bonding units 2b are horizontally adjacent to each other in the left-right direction LR. The two bonding units 2b may be in contact with each other or may be horizontally separated from each other.

[0106] The bonding unit 2b is disposed on the same side as the cleaning unit 2c with respect to a reference plane RS2 of the unload lock chamber 14. The reference plane RS2 is a vertical plane that passes through the center of the substrate W held horizontally in the unload lock chamber 14 and is perpendicular to the reference line. The cleaning unit 2c may be disposed between the unload lock chamber 14 and the bonding unit 2b, or may be disposed at a position other than between the unload lock chamber 14 and the bonding unit 2b.

[0107] The cleaning unit 2c is disposed on the opposite side of the unload lock chamber 14 from the second transfer chamber 13. The bonding unit 2b is disposed on the opposite side of the cleaning unit 2c from the unload lock chamber 14. More specifically, the cleaning unit 2c is disposed on the opposite side of the second transfer chamber 13 from a reference plane RS2 of the unload lock chamber 14. The bonding unit 2b is disposed on the opposite side of the unload lock chamber 14 from a reference plane RS3 of the cleaning unit 2c. The reference plane RS3 is a vertical plane that passes through the center of the substrate W held horizontally in the cleaning unit 2c and is perpendicular to the reference line.

[0108] 8A and 8B are schematic plan views showing a state in which the third transport robot R3 is disposed at a multi-access position where it can carry substrates W into and out of both the cleaning unit 2c and the post-cleaning staging table 18. FIG.

[0109] The cleaning unit 2c and the post-cleaning staging table 18 are arranged within a range where the third transport robot R3 can transport the substrate W without traveling in the third traveling direction. More specifically, the cleaning unit 2c and the post-cleaning staging table 18 are arranged within a range where the third hand H3 can reach them without horizontally moving the rotation center C3 of the third transport robot R3. Figures 8A and 8B show a state where the third transport robot R3 is arranged at the multi-access position. The multi-access position is a position where the third transport robot R3 can load and unload substrates W into and from the cleaning unit 2c and the post-cleaning staging table 18 without traveling in the third traveling direction.

[0110] 8A and 8B , when the third transport robot R3 is located at the multi-access position, the third transport robot R3 can change the orientation of the third hand H3 to horizontally face either the passage opening 4 of the cleaning unit 2c or the passage opening 4a of the post-cleaning staging table 18. The rotation actuator AR of the third transport robot R3 maintains the rotation angle of the third transport robot R3 at any value including a first rotation angle at which the third hand H3 horizontally faces the passage opening 4 of the cleaning unit 2c, and a second rotation angle at which the third hand H3 horizontally faces the passage opening 4a of the post-cleaning staging table 18.

[0111] When the third transport robot R3 is located at the multi-access position and the rotation angle of the third transport robot R3 is the first rotation angle, the third hand H3 horizontally faces the passage opening 4 of the cleaning unit 2c. In this state, the third transport robot R3 moves the third hand H3 horizontally and vertically to load and unload the substrate W into and from the cleaning unit 2c. Similarly, when the third transport robot R3 is located at the multi-access position and the rotation angle of the third transport robot R3 is the second rotation angle, the third transport robot R3 moves the third hand H3 horizontally and vertically to load and unload the substrate W into and from the post-cleaning staging table 18. Therefore, the third transport robot R3 can transport the substrate W from the cleaning unit 2c to the post-cleaning staging table 18 without horizontally moving the rotation center C3 of the third transport robot R3.

[0112] The post-cleaning staging table 18 and the bonding unit 2b (here, the bonding unit 2b on the post-cleaning staging table 18 side; the same applies below) are also positioned within a range within which the fourth transport robot R4 can transport substrates W without horizontally moving the rotation center C4 of the fourth transport robot R4. FIG. 3 shows the fourth transport robot R4 positioned at a multi-access position where the fourth transport robot R4 can load and unload substrates W into and from the post-cleaning staging table 18 and the bonding unit 2b without traveling in the fourth travel direction. When the fourth transport robot R4 is positioned at the multi-access position, the rotation actuator AR (see FIG. 7B ) of the fourth transport robot R4 rotates the fourth hand H4 around the rotation center C4 of the fourth transport robot R4, so that the fourth hand H4 horizontally faces either the passage opening 4b of the post-cleaning staging table 18 or the passage opening 4 of the bonding unit 2b. At this time, the fourth transport robot R4 may vertically move the fourth hand H4 as necessary.

[0113] The bonding unit 2b and the pre-bonding aligner 20, which overlap each other in a plan view, are also arranged within a range in which the fourth transport robot R4 can transport the substrate W without horizontally moving the rotation center C4 of the fourth transport robot R4. When the fourth transport robot R4 is arranged in the multi-access position shown in Figure 3 and the fourth hand H4 is horizontally facing the passage opening 4 of the bonding unit 2b, when the vertical actuator AV of the fourth transport robot R4 translates the fourth hand H4 vertically, the fourth hand H4 comes to horizontally face the passage opening 4 of the lower pre-bonding aligner 20. When the vertical actuator AV of the fourth transport robot R4 further translates the fourth hand H4 vertically, the fourth hand H4 comes to horizontally face the passage opening 4 of the upper pre-bonding aligner 20. Therefore, the fourth transport robot R4 located at the multi-access position can position the fourth hand H4 horizontally opposite any one selected from the joining unit 2b and the pre-joining aligner 20 simply by moving the fourth hand H4 vertically in parallel.

[0114] The right-side bonding unit 2b and pre-bonding aligner 20 are defined as the near-side bonding unit 2b and near-side aligner that are relatively close to the post-cleaning staging table 18, and the left-side bonding unit 2b and pre-bonding aligner 20 are defined as the far-side bonding unit 2b and far-side aligner that pass relatively from the post-cleaning staging table 18. The multi-access position where the fourth transport robot R4 loads and unloads the substrate W to and from the near-side bonding unit 2b and the front-side aligner is defined as the near side position, and the multi-access position where the fourth transport robot R4 loads and unloads the substrate W to and from the far-side bonding unit 2b and the far-side aligner is defined as the far side position.

[0115] The multi-access position at which the fourth transport robot R4 loads and unloads the substrate W to and from the post-cleaning staging table 18 and the bonding unit 2b is the same as the front position. Therefore, the fourth transport robot R4 located at the front position can load and unload the substrate W to and from the post-cleaning staging table 18, the front-side bonding unit 2b, and the front-side aligner without traveling in the fourth travel direction. However, the multi-access position at which the fourth transport robot R4 loads and unloads the substrate W to and from the post-cleaning staging table 18 and the bonding unit 2b may be a position different from the front position.

[0116] The pre-activation aligner 11 and the load lock chamber 12 are also positioned within a range in which the first transport robot R1 can transport the substrate W without horizontally moving the rotation center C1 of the first transport robot R1. When the first transport robot R1 is positioned at the multi-access position (the position of the first transport robot R1 shown in FIG. 4B ) and the first hand H1 is horizontally facing the passage opening 4a of the load lock chamber 12, when the vertical actuator AV (see FIG. 4B ) of the first transport robot R1 translates the first hand H1 vertically, the first hand H1 comes to horizontally face the passage opening 4 for the lower pre-activation aligner 11. When the vertical actuator AV of the first transport robot R1 further translates the first hand H1 vertically, the first hand H1 comes to horizontally face the passage opening 4 for the upper pre-activation aligner 11. Therefore, the first transport robot R1 located at the multi-access position can horizontally position the first hand H1 opposite any one of the pre-activation aligner 11 and the load lock chamber 12 simply by moving the first hand H1 vertically in parallel.

[0117] Next, an example of the operation of the substrate bonding apparatus 1 will be described.

[0118] Figures 9A and 9B are process diagrams for explaining an example of the operation of the substrate bonding apparatus 1. Figure 10 is a time chart showing an example of a period during which plasma processing of the first substrate W1 and the second substrate W2 is performed. Figure 11 is a time chart showing an example of a period during which cleaning of the first substrate W1 and the second substrate W2 is performed. Figure 9B shows a continuation of Figure 9A. Below, reference will be made to Figures 3, 9A, and 9B. Figures 10 and 11 will be referenced as appropriate.

[0119] The operation of the substrate bonding apparatus 1 described below is the operation of the substrate bonding apparatus 1 during continuous processing, which refers to the period after the first third substrate W3 (the bonded first and second substrates W1 and W2) has returned to the carrier CA on the load port LP and before the last first and second substrates W1 and W2 have been unloaded from the carrier CA on the load port LP.

[0120] In the following description, when distinguishing between the four first hands H1, they may be referred to as first hand H1A, first hand H1B, first hand H1C, or first hand H1D. The same applies to the four third hands H3 and the four fourth hands H4. When distinguishing between the two second hands H2, they may be referred to as second hand H2A or second hand H2B.

[0121] The first load port LP, the second load port LP, and the third load port LP represent three different load ports LP. The first pre-activation aligner 11 and the second pre-activation aligner 11 represent two different pre-activation aligners 11. The same applies to the plasma processing unit 2p, the cleaning unit 2c, and the pre-bonding aligner 20. The pair of the first pre-bonding aligner 20 and the second pre-bonding aligner 20 represents pre-bonding aligners 20 corresponding to the same bonding unit 2b.

[0122] 9A , when bonding multiple pairs of first and second substrates W1 and W2, the first transport robot R1 uses the first hand H1A to unload the first substrate W1 from the carrier CA on the first load port LP (step S11 in FIG. 9A ). Then, while horizontally supporting the first substrate W1 with the first hand H1A, the first transport robot R1 uses the first hand H1B to unload the second substrate W2 from the carrier CA on the second load port LP (step S12 in FIG. 9A ). Then, while horizontally supporting the first substrate W1 with the first hand H1A and the second substrate W2 with the first hand H1B, the first transport robot R1 simultaneously transports the first substrate W1 and the second substrate W2 to the two pre-activation aligners 11 and the load lock chamber 12 (step S13 in FIG. 9A ).

[0123] When the first substrate W1 and the second substrate W2 arrive at the two pre-activation aligners 11 and the load lock chamber 12, the first transport robot R1 uses the first hand H1C to remove the positioned first substrate W1 from the first pre-activation aligner 11. The first transport robot R1 then carries the first substrate W1, which is supported horizontally by the first hand H1A, into the first pre-activation aligner 11. This allows the first substrate W1 to be exchanged between the first pre-activation aligner 11 and the first transport robot R1 (step S14 in FIG. 9A ).

[0124] Thereafter, while horizontally supporting the first substrate W1 with the first hand H1C and the second substrate W2 with the first hand H1B, the first transport robot R1 uses the first hand H1D to transport the positioned second substrate W2 out of the second pre-activation aligner 11. Thereafter, the first transport robot R1 transports the second substrate W2, which is supported horizontally by the first hand H1B, into the second pre-activation aligner 11. This results in the exchange of the second substrate W2 between the second pre-activation aligner 11 and the first transport robot R1 (step S15 in FIG. 9A ).

[0125] Thereafter, the first transport robot R1 simultaneously loads the first substrate W1 supported by the first hand H1C and the second substrate W2 supported by the first hand H1D into the load lock chamber 12 (step S16 in FIG. 9A ). At this time, the entrance gate valve 7A of the load lock chamber 12 is open, and the exit gate valve 7B of the load lock chamber 12 is closed. The first transport robot R1 may load the second substrate W2 before or after loading the first substrate W1. Once the first substrate W1 and the second substrate W2 have been loaded into the load lock chamber 12, the entrance gate valve 7A of the load lock chamber 12 is closed, with the exit gate valve 7B of the load lock chamber 12 being closed. In this state, the air pressure inside the load lock chamber 12 is reduced.

[0126] With the exit gate valve 7B of the load lock chamber 12 open and the entrance gate valve 7A of the load lock chamber 12 closed, the second transport robot R2 uses the second hand H2A to unload the first substrate W1 from the load lock chamber 12 (step S17 in FIG. 9A ). Then, while horizontally supporting the first substrate W1 with the second hand H2A, the second transport robot R2 unloads the plasma-treated first substrate W1 from the first plasma processing unit 2p with the second hand H2B. Then, the second transport robot R2 loads the first substrate W1, supported horizontally by the second hand H2A, into the first plasma processing unit 2p (step S18 in FIG. 9A ). Thereafter, the second transport robot R2 loads the first substrate W1, which is supported horizontally by the second hand H2B, into the unload lock chamber 14 with the entrance gate valve 7A of the unload lock chamber 14 open and the exit gate valve 7B of the unload lock chamber 14 closed (step S19 in Figure 9A).

[0127] The second transport robot R2 loads the first substrate W1 into the unload lock chamber 14, and then uses the second hand H2A to load the second substrate W2 out of the load lock chamber 12 (step S20 in FIG. 9A ). After the second substrate W2 is loaded out of the load lock chamber 12, the exit gate valve 7B of the load lock chamber 12 is closed, and then the entrance gate valve 7A of the load lock chamber 12 is opened. Thereafter, the next first substrate W1 and second substrate W2 are loaded into the load lock chamber 12 by the first transport robot R1, in the same manner as described above.

[0128] After the second transport robot R2 removes the second substrate W2 from the load lock chamber 12, it removes the plasma-treated second substrate W2 from the second plasma processing unit 2p using the second hand H2B. The second transport robot R2 then loads the second substrate W2, which is supported horizontally by the second hand H2A, into the second plasma processing unit 2p (step S21 in FIG. 9A ). The second transport robot R2 then loads the second substrate W2, which is supported horizontally by the second hand H2B, into the unload lock chamber 14 with the entrance gate valve 7A of the unload lock chamber 14 open and the exit gate valve 7B of the unload lock chamber 14 closed (step S22 in FIG. 9A ). This places the first substrate W1 and the second substrate W2 in the unload lock chamber 14.

[0129] 10 , plasma treatment of the second substrate W2 begins while plasma treatment of the first substrate W1 is being performed and ends after plasma treatment of the first substrate W1 is completed. Therefore, there is a period during which the two plasma processing units 2p simultaneously perform plasma treatment on the first substrate W1 and the second substrate W2. The period during which plasma treatment is simultaneously performed on the first substrate W1 and the second substrate W2 may be equal to or different from the period during which plasma treatment is performed on only one of the first substrate W1 and the second substrate W2. The period during which plasma treatment is simultaneously performed on the first substrate W1 and the second substrate W2 may be equal to or different from the sum of the period during which plasma treatment is performed on only the first substrate W1 and the period during which plasma treatment is performed on only the second substrate W2.

[0130] When the plasma-treated first substrate W1 and second substrate W2 are loaded into the unload lock chamber 14, the entrance gate valve 7A of the unload lock chamber 14 is closed, and then the exit gate valve 7B of the unload lock chamber 14 is opened. Thereafter, the third transport robot R3 simultaneously unloads the first substrate W1 and the second substrate W2 from the unload lock chamber 14 using the third hand H3A and the third hand H3B (step S23 in FIG. 9A ). The third transport robot R3 may unload the second substrate W2 before or after unloading the first substrate W1.

[0131] After the first substrate W1 and the second substrate W2 are unloaded from the unload lock chamber 14, the exit gate valve 7B of the unload lock chamber 14 is closed while the entrance gate valve 7A of the unload lock chamber 14 is closed. In this state, the air pressure inside the unload lock chamber 14 is reduced. Thereafter, the entrance gate valve 7A of the unload lock chamber 14 is opened while the exit gate valve 7B of the unload lock chamber 14 is closed. Thereafter, the next first substrate W1 and second substrate W2 are loaded into the unload lock chamber 14 by the second transport robot R2, in the same manner as described above.

[0132] The third transport robot R3 removes the plasma-treated first substrate W1 and second substrate W2 from the unload lock chamber 14, and then simultaneously transports the first substrate W1 and second substrate W2 to the cleaning unit 2c (step S24 in FIG. 9A ). The third transport robot R3 then removes the cleaned first substrate W1 from the first cleaning unit 2c using the third hand H3C. The third transport robot R3 then loads the first substrate W1, which is supported horizontally by the third hand H3A, into the first cleaning unit 2c (step S25 in FIG. 9B ).

[0133] The third transport robot R3 loads the first substrate W1 into the first cleaning unit 2c, and then loads the cleaned second substrate W2 out of the second cleaning unit 2c using the third hand H3D. The third transport robot R3 then loads the second substrate W2, which is supported horizontally by the third hand H3B, into the second cleaning unit 2c (step S26 in FIG. 9B ). This causes the cleaned first and second substrates W1 and W2 to be supported horizontally by the third hands H3C and H3D.

[0134] 11 , cleaning of the second substrate W2 begins while cleaning of the first substrate W1 is being performed and ends after cleaning of the first substrate W1 is completed. Therefore, there is a period during which the two cleaning units 2c simultaneously clean the first substrate W1 and the second substrate W2. The period during which the first substrate W1 and the second substrate W2 are simultaneously cleaned may be equal to or different from the period during which only one of the first substrate W1 and the second substrate W2 is cleaned. The period during which the first substrate W1 and the second substrate W2 are simultaneously cleaned may be equal to or different from the sum of the period during which only the first substrate W1 is cleaned and the period during which only the second substrate W2 is cleaned.

[0135] The third transport robot R3 carries the cleaned first substrate W1 and second substrate W2 into one of the post-cleaning staging stands 18. As described above, two of the three vertically stacked post-cleaning staging stands 18 are pre-bonding staging stands 18b that relay the substrates W before bonding, and the remaining one is the first post-bonding staging stand 18a that relays the two bonded substrates W. The above-mentioned post-bonding staging stand 22 is the second post-bonding staging stand that relays the two bonded substrates W that have been carried out from the first post-bonding staging stand 18a.

[0136] The third transport robot R3 simultaneously transports the first substrate W1 and the second substrate W2, which are supported horizontally by the third hands H3C and H3D, onto the pre-bonding staging table 18b (step S27 in FIG. 9B ). The third transport robot R3 may transport the second substrate W2 before or after transporting the first substrate W1. The third transport robot R3 may transport the second substrate W2 onto a pre-bonding staging table 18b different from the pre-bonding staging table 18b onto which the first substrate W1 was transported.

[0137] The fourth transport robot R4 simultaneously removes the first substrate W1 and the second substrate W2 from the post-cleaning staging table 18 using the fourth hand H4A and the fourth hand H4B (step S28 in FIG. 9B ). The fourth transport robot R4 may remove the second substrate W2 before or after removing the first substrate W1. After removing both the first substrate W1 and the second substrate W2 from the post-cleaning staging table 18, the fourth transport robot R4 simultaneously transports the first substrate W1 and the second substrate W2 to the bonding unit 2b (step S29 in FIG. 9B ). Thereafter, the fourth transport robot R4 exchanges the first substrate W1 and the second substrate W2 for a pair of first pre-bonding aligners 20 and second pre-bonding aligners 20 corresponding to this bonding unit 2b.

[0138] Specifically, while horizontally supporting the first substrate W1 with the fourth hand H4A and the second substrate W2 with the fourth hand H4B, the fourth transport robot R4 uses the fourth hand H4C to transport the positioned first substrate W1 out of the first pre-bonding aligner 20. Thereafter, the fourth transport robot R4 transports the first substrate W1 supported horizontally by the fourth hand H4A into the same first pre-activation aligner 11. In this way, the first substrate W1 is exchanged between the fourth transport robot R4 and the first pre-bonding aligner 20 (step S30 in FIG. 9B ).

[0139] Thereafter, while horizontally supporting the first substrate W1 with the fourth hand H4C and the second substrate W2 with the fourth hand H4B, the fourth transport robot R4 uses the fourth hand H4D to transport the positioned second substrate W2 out of the second pre-bonding aligner 20. Thereafter, the fourth transport robot R4 transports the second substrate W2, which is supported horizontally by the fourth hand H4B, into the same second pre-bonding aligner 20. In this way, the second substrate W2 is exchanged between the fourth transport robot R4 and the second pre-bonding aligner 20 (step S31 in FIG. 9B ).

[0140] After the fourth transport robot R4 removes the first substrate W1 and the second substrate W2 from the pair of first and second pre-bonding aligners 20 and 20, it uses the fourth hand H4A or H4B to remove the bonded first and second substrates W1 and W2, i.e., the third substrate W3, from the bonding unit 2b corresponding to the pair of first and second pre-bonding aligners 20 and 20 (step S32 in FIG. 9B ). The fourth transport robot R4 then loads the first substrate W1, which is supported horizontally by the fourth hand H4C, and the second substrate W2, which is supported horizontally by the fourth hand H4D, into the same bonding unit 2b (step S33 in FIG. 9B ). The fourth transport robot R4 may load the first substrate W1 and the second substrate W2 simultaneously, or may load the second substrate W2 before or after loading the first substrate W1.

[0141] After the fourth transport robot R4 carries the first substrate W1 and the second substrate W2 into the bonding unit 2b, it carries the third substrate W3, which is supported horizontally by the fourth hand H4A or H4B, onto the post-cleaning staging stage 18, which corresponds to the first post-bonding staging stage 18a (step S34 in FIG. 9B ). After the third transport robot R3 carries the cleaned first substrate W1 and second substrate W2 onto the post-cleaning staging stage 18, which corresponds to the pre-bonding staging stage 18b, it uses the third hand H3C or H3D to carry the third substrate W3 out of the post-cleaning staging stage 18, which corresponds to the first post-bonding staging stage 18a (step S35 in FIG. 9B ). Thereafter, the third transport robot R3 travels in the third travel direction to the post-bonding relay table 22, which corresponds to the second post-bonding relay table, and transports the third substrate W3, which is supported horizontally by the third hand H3C or the third hand H3D, onto the post-bonding relay table 22 (step S36 in Figure 9B).

[0142] After the first transport robot R1 loads the first substrate W1 and the second substrate W2 into the load lock chamber 12, it uses one of the first hands H1 to load the third substrate W3 from the post-bonding staging table 22 (step S37 in FIG. 9B ). The first transport robot R1 then loads the third substrate W3 into the carrier CA on the third load port LP (step S38 in FIG. 9B ). In this manner, the first substrate W1 and the second substrate W2 are bonded in the substrate bonding apparatus 1, and the third substrate W3 representing the bonded first substrate W1 and second substrate W2 is housed in the carrier CA on the load port LP. The first transport robot R1 and the like repeat the above-described operations until the last third substrate W3 is loaded into the carrier CA. This bonds multiple pairs of first substrates W1 and second substrates W2.

[0143] Next, the effects of this embodiment will be described.

[0144] In this embodiment, the substrate W transferred from the carrier CA to the load lock chamber 12 is transferred from the load lock chamber 12 to the second transfer chamber 13 by a second transfer robot R2, which corresponds to a vacuum transfer robot, and then transferred from the second transfer chamber 13 to the plasma processing unit 2p. The substrate W that has been plasma processed in the plasma processing unit 2p is then transferred from the plasma processing unit 2p to the second transfer chamber 13 by the second transfer robot R2, and then transferred from the second transfer chamber 13 to the unload lock chamber 14. The substrate W is then transferred from the unload lock chamber 14 to the cleaning unit 2c. Therefore, the substrate W can be transferred more efficiently than when the substrate W that has been plasma processed is transferred out of the load lock chamber 12.

[0145] The cleaning unit 2c is arranged on the same side of the second transfer chamber 13 as the unload lock chamber 14 in a plan view. In other words, the substrate W held horizontally in the cleaning unit 2c is arranged on the same side of the second transfer chamber 13 as the substrate W held horizontally in the unload lock chamber 14 in a plan view. Therefore, the distance from the unload lock chamber 14 to the cleaning unit 2c can be shortened, and the transport distance of the substrate W can be shortened, compared to when the cleaning unit 2c is arranged on the opposite side of the second transfer chamber 13 from the unload lock chamber 14.

[0146] In this embodiment, not only is the cleaning unit 2c disposed on the same side as the unload lock chamber 14 with respect to the second transfer chamber 13 in a plan view, but the cleaning unit 2c is also disposed on the opposite side of the unload lock chamber 14 from the second transfer chamber 13 in a plan view. When the substrate W is transported from the second transfer chamber 13 to the unload lock chamber 14, the substrate W approaches the cleaning unit 2c. Therefore, the substrate W can be transported from the unload lock chamber 14 to the cleaning unit 2c without returning to the second transfer chamber 13. This shortens the transport distance of the substrate W.

[0147] In this embodiment, the bonding unit 2b is arranged on the same side of the unload lock chamber 14 as the cleaning unit 2c in plan view. In other words, the substrate W held horizontally in the bonding unit 2b is arranged on the same side of the unload lock chamber 14 as the substrate W held horizontally in the cleaning unit 2c in plan view. Therefore, the distance from the cleaning unit 2c to the bonding unit 2b can be shortened compared to when the bonding unit 2b is arranged on the opposite side of the unload lock chamber 14 from the cleaning unit 2c, and the transport distance of the substrate W can be shortened.

[0148] In this embodiment, not only is the bonding unit 2b located on the same side of the unload lock chamber 14 as the cleaning unit 2c in a plan view, but the bonding unit 2b is also located on the opposite side of the unload lock chamber 14 from the cleaning unit 2c in a plan view. When the substrate W is transported from the unload lock chamber 14 to the cleaning unit 2c, the substrate W approaches the bonding unit 2b. Therefore, the substrate W can be transported from the cleaning unit 2c to the bonding unit 2b without being returned to the unload lock chamber 14. This shortens the transport distance of the substrate W.

[0149] In this embodiment, the load lock chamber 12, the second transfer chamber 13, the unload lock chamber 14, and the cleaning unit 2c are arranged in this order from front to back. By transporting the substrate W from the load lock chamber 12 to the second transfer chamber 13, the substrate W can be brought closer to the unload lock chamber 14 and the cleaning unit 2c. Furthermore, by transporting the substrate W from the second transfer chamber 13 to the unload lock chamber 14, the substrate W can be brought closer to the cleaning unit 2c. Therefore, unnecessary movement of the substrate W can be reduced, and the substrate W can be transported efficiently.

[0150] In this embodiment, the first substrate W1 and the second substrate W2 are transported from the carrier CA to the load lock chamber 12 by the first transport robot R1, and then the first substrate W1 and the second substrate W2 are transported from the load lock chamber 12 to at least one plasma processing unit 2p by the second transport robot R2. The second transport robot R2 transports the first substrate W1 and the second substrate W2 from at least one plasma processing unit 2p to the unload lock chamber 14. Therefore, the substrates W can be transported more efficiently than when the substrates W that have been subjected to plasma processing are removed from the load lock chamber 12.

[0151] The first substrate W1 and the second substrate W2 represent two substrates W of a pair to be bonded. Therefore, the first substrate W1 is not bonded to a substrate W other than the second substrate W2 that forms the pair, but is bonded to the second substrate W2 that forms the pair. The first substrate W1 and the second substrate W2 are bonded by the bonding unit 2b. The first transport robot R1 simultaneously loads the first substrate W1 and the second substrate W2 into the load lock chamber 12. The third transport robot R3 simultaneously unloads the first substrate W1 and the second substrate W2 from the unload lock chamber 14. Therefore, the substrates W can be transported more efficiently than when the first substrate W1 and the second substrate W2 are loaded or unloaded separately.

[0152] When the first substrate W1 and the second substrate W2 are loaded separately into the load lock chamber 12, it may happen that the air pressure in the load lock chamber 12 is reduced by the vacuum pump P after the first substrate W1 is loaded, and that the air pressure in the load lock chamber 12 is reduced by the vacuum pump P after the second substrate W2 is loaded. Similarly, when the first substrate W1 and the second substrate W2 are unloaded separately from the unload lock chamber 14, it may happen that the air pressure in the unload lock chamber 14 is reduced by the vacuum pump P after the first substrate W1 is unloaded, and that the air pressure in the unload lock chamber 14 is reduced by the vacuum pump P after the second substrate W2 is unloaded. If the first substrate W1 and the second substrate W2 are loaded or unloaded simultaneously, it is possible to reduce the number of times the air pressure is reduced, thereby reducing energy consumption.

[0153] In this embodiment, the first substrate W1 and the second substrate W2 are simultaneously transported to the bonding unit 2b by the fourth transport robot R4. The first substrate W1 and the second substrate W2 arrive in front of the bonding unit 2b at the same time. Therefore, the substrates W can be transported more efficiently than when the first substrate W1 and the second substrate W2 are transported separately to the bonding unit 2b. The fourth transport robot R4 transports the first substrate W1 and the second substrate W2 into the bonding unit 2b simultaneously or separately. In either case, there is no or short time between when the fourth transport robot R4 transports one of the first substrate W1 and the second substrate W2 into the bonding unit 2b and when it transports the other of the first substrate W1 and the second substrate W2 into the bonding unit 2b, allowing the bonding unit 2b to operate efficiently.

[0154] In this embodiment, the first substrate W1 and the second substrate W2 are plasma-treated by two plasma treatment units 2p. The two plasma treatment units 2p perform plasma treatment on the first substrate W1 and the second substrate W2 such that there is a period during which the first substrate W1 and the second substrate W2 are simultaneously plasma-treated. Therefore, the time required to complete plasma treatment on both the first substrate W1 and the second substrate W2 can be shortened compared to when plasma treatment on the first substrate W1 is completed before plasma treatment on the second substrate W2 is started.

[0155] In this embodiment, the first substrate W1 and the second substrate W2 that have been subjected to plasma processing are cleaned by two cleaning units 2c. The two cleaning units 2c clean the first substrate W1 and the second substrate W2 with the cleaning liquid so that there is a period during which the cleaning liquid is simultaneously supplied to the first substrate W1 and the second substrate W2. Therefore, the time required to complete cleaning of both the first substrate W1 and the second substrate W2 can be shortened compared to when the supply of the cleaning liquid to the first substrate W1 is stopped before the supply of the cleaning liquid to the second substrate W2 is started.

[0156] In this embodiment, the substrate W is transported from the carrier CA to the plasma processing unit 2p, where it is subjected to plasma processing. Thereafter, the substrate W is transported from the plasma processing unit 2p to the cleaning unit 2c, where it is cleaned with a cleaning liquid. Such plasma processing and cleaning are performed on two substrates W. Thereafter, the two substrates W are transported to the bonding unit 2b, where they are bonded by the bonding unit 2b.

[0157] The plasma processing unit 2p is disposed rearward of the multiple load ports LP. The cleaning unit 2c is disposed rearward of the plasma processing unit 2p. The bonding unit 2b is disposed rearward of the cleaning unit 2c. By transporting the substrate W from the carrier CA to the plasma processing unit 2p, the substrate W can be brought closer to the cleaning unit 2c and the bonding unit 2b. Furthermore, by transporting the substrate W from the plasma processing unit 2p to the cleaning unit 2c, the substrate W can be brought closer to the bonding unit 2b. Therefore, unnecessary movement of the substrate W can be reduced, and the substrate W can be transported efficiently.

[0158] In this embodiment, the first transport robot R1 transports substrates W between the multiple load ports LP and the plasma processing unit 2p. The second transport robot R2 transports the substrates W transported by the first transport robot R1 into and out of the plasma processing unit 2p. The third transport robot R3 transports the substrates W transported from the plasma processing unit 2p by the second transport robot R2 into and out of the cleaning unit 2c. The fourth transport robot R4 transports the substrates W transported from the cleaning unit 2c by the third transport robot R3 into the bonding unit 2b and transports the two bonded substrates W out of the bonding unit 2b.

[0159] The third transport robot R3 transports two substrates W that have been bonded by and unloaded from the bonding unit 2b to multiple load ports LP. That is, the third transport robot R3 transports not only the substrates W before bonding, but also the substrates W after bonding. This makes it possible to reduce the number of transport robots. Furthermore, since the substrates W are loaded into and unloaded from the bonding unit 2b by the fourth transport robot R4, the increase in the burden on the third transport robot R3 can be reduced.

[0160] In this embodiment, the substrate W is positioned by the pre-activation aligner 11 before being carried into the plasma processing unit 2p. Similarly, the substrate W is positioned by the pre-bonding aligner 20 before being carried into the bonding unit 2b. This shortens the time required for the bonding unit 2b to adjust the relative positions of the two substrates W to be bonded. Furthermore, since the substrate W is carried into and out of the pre-bonding aligner 20 by the fourth transport robot R4 rather than the third transport robot R3, the burden of transporting the substrate W can be evenly distributed among multiple transport robots including the third transport robot R3 and the fourth transport robot R4, thereby minimizing the increase in the burden on the third transport robot R3.

[0161] In this embodiment, the substrate W is supported horizontally on a post-cleaning staging table 18 on a path along which the substrate W travels as it is transported between the cleaning unit 2c and the bonding unit 2b. At least one of the substrate W before bonding that is carried out from the cleaning unit 2c and the two substrates W bonded in the bonding unit 2b is supported horizontally by the post-cleaning staging table 18. The third transport robot R3 uses at least one third hand H3 that supports the substrate W horizontally to not only carry the substrate W into and out of the cleaning unit 2c, but also carry the substrate W into and out of the post-cleaning staging table 18.

[0162] The rotational actuator AR of the third transport robot R3 rotates at least one third hand H3 around a rotation center C3 that represents a vertical line. The horizontal actuator of the third transport robot R3 moves the at least one third hand H3 horizontally to change the horizontal distance from the rotation center C3 to the at least one third hand H3. The vertical actuator of the third transport robot R3 moves the at least one third hand H3 vertically.

[0163] The third transport robot R3 loads and unloads the substrate W by combining these operations of the third hand H3. The third transport robot R3 can load and unload the substrate W to and from both the cleaning unit 2c and the post-cleaning staging table 18 without horizontally moving the rotation center C3 of the third transport robot R3. Therefore, the third transport robot R3 can transport the substrate W from the cleaning unit 2c to the post-cleaning staging table 18 without horizontally moving the rotation center C3 of the third transport robot R3. This reduces the number of operations of the third transport robot R3.

[0164] Next, another embodiment will be described.

[0165] The plasma-processed substrate W may be unloaded from the load lock chamber 12 rather than from the unload lock chamber 14. In this case, the unload lock chamber 14 may be omitted.

[0166] The layout of the load lock chamber 12, the second transfer chamber 13, the unload lock chamber 14, the cleaning unit 2c, the bonding unit 2b, etc. is not limited to the example described above. For example, the load lock chamber 12, the second transfer chamber 13, and the unload lock chamber 14 may be arranged in this order in the left-right direction LR instead of in the front-to-back direction FB.

[0167] When a plurality of plasma processing units 2p are provided, a plasma processing unit 2p that performs plasma processing on the first substrate W1 and plasma processing on the second substrate W2 may be included.

[0168] When performing plasma processing on a pair of a first substrate W1 and a second substrate W2, the two plasma processing units 2p may start plasma processing on the second substrate W2 after finishing plasma processing on the first substrate W1. Similarly, when performing cleaning on a pair of a first substrate W1 and a second substrate W2, the two cleaning units 2c may start cleaning on the second substrate W2 after finishing cleaning on the first substrate W1.

[0169] The first transport robot R1 may separately load the first substrate W1 and the second substrate W2 into the load lock chamber 12. The third transport robot R3 may separately unload the first substrate W1 and the second substrate W2 from the unload lock chamber 14. The fourth transport robot R4 may separately transport the first substrate W1 and the second substrate W2 to the bonding unit 2b. For example, the fourth transport robot R4 may load the first substrate W1, which has been unloaded from the post-cleaning staging table 18, into the first pre-bonding aligner 20, and then unload the second substrate W2 from the post-cleaning staging table 18.

[0170] At least one of the post-cleaning relay table 18 and the post-bonding relay table 22 may not be a fixed table fixed to the floor surface F1 of the substrate bonding apparatus 1, but may be a shuttle that moves back and forth horizontally by moving relative to the floor surface F1 of the substrate bonding apparatus 1.

[0171] The shuttle is included in the transport system TS that transports the substrate W. The shuttle includes a movable platform that horizontally supports the substrate W, and an actuator that moves the movable platform horizontally back and forth relative to the floor surface F1 of the substrate bonding apparatus 1. When the post-cleaning staging platform 18 is a shuttle, the post-cleaning staging platform 18 may travel horizontally in a third travel direction or a fourth travel direction between a starting position (position shown in FIG. 3 ) and an intermediate position. When the post-bonding staging platform 22 is a shuttle, the post-bonding staging platform 22 may travel horizontally in the third travel direction between a starting position (position shown in FIG. 3 ) and an intermediate position.

[0172] The substrate bonding apparatus 1 is not limited to an apparatus for bonding two disk-shaped substrates W, but may be an apparatus for bonding two polygonal substrates W.

[0173] Any two or more of the above-described features may be combined. Any two or more of the above-described steps may be combined.

[0174] Although the embodiments of the present invention have been described in detail, these are merely examples used to clarify the technical contents of the present invention, and the present invention should not be construed as being limited to these examples. The spirit and scope of the present invention are limited only by the appended claims.

Claims

1. A substrate bonding apparatus comprising: a plasma processing unit which performs plasma processing on substrates transferred from a plurality of carriers held by a plurality of load ports; a load lock chamber into which the substrate to be processed in the plasma processing unit is transferred; an unload lock chamber into which the substrate processed in the plasma processing unit is transferred; a vacuum transfer chamber through which the substrate transferred from the load lock chamber to the plasma processing unit and the substrate transferred from the plasma processing unit to the unload lock chamber pass; at least one vacuum pump which reduces air pressure in the load lock chamber, the vacuum transfer chamber, and the unload lock chamber; a vacuum transfer robot which transfers the substrate from the load lock chamber to the plasma processing unit via the vacuum transfer chamber, and which transfers the substrate from the plasma processing unit to the unload lock chamber via the vacuum transfer chamber; a cleaning unit which is located on the same side of the vacuum transfer chamber as the unload lock chamber in a plan view, and which cleans the substrate transferred from the unload lock chamber; and a bonding unit which bonds the two substrates cleaned in the cleaning unit.

2. The substrate bonding apparatus according to claim 1, wherein the cleaning unit is disposed on the opposite side of the unload lock chamber from the vacuum transfer chamber in a plan view.

3. The substrate bonding apparatus according to claim 1 or 2, wherein the bonding unit is disposed on the same side as the cleaning unit with respect to the unload lock chamber in a plan view.

4. The substrate bonding apparatus according to claim 3, wherein the bonding unit is disposed on an opposite side of the cleaning unit from the unload lock chamber in a plan view.

5. A substrate bonding apparatus as described in claim 1 or 2, wherein the multiple load ports hold the multiple carriers so that the multiple carriers are aligned in the left-right direction in a plan view, and the load lock chamber, vacuum transfer chamber, unload lock chamber, and cleaning unit are aligned from front to back in the order of the load lock chamber, the vacuum transfer chamber, the unload lock chamber, and the cleaning unit.

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