Collective board, method for manufacturing same, and method for manufacturing circuit board

Abstract

The present invention provides a collective board capable of improving work efficiency for obtaining individual circuit boards from a collective board in which the circuit boards are arranged in a lattice pattern. The present invention comprises: a product part 3 in which a plurality of circuit boards 17 respectively having circuit patterns 15 on an insulating board 13 are arranged in a lattice pattern in a first direction and a second direction intersecting each other; slits 7 which extend at least between the ends of the product part 3 in the first direction and penetrate in the plate thickness direction between the adjacent circuit boards 17 in the second direction; coupling parts 9 which couple the adjacent circuit boards 17 in the second direction at at least one end of the product part 3 in the first direction; and grooves 11 which extend between the ends of the product part 3 in the second direction, are positioned between the coupling parts 9 and the circuit boards 17 adjacent in the first direction and between the adjacent circuit boards 17, and are non-penetrating in the plate thickness direction.

Description

Aggregate substrate and its manufacturing method, and circuit board manufacturing method

[0001] The present invention relates to an aggregate substrate in which a plurality of circuit boards are arranged in a grid pattern, a method for manufacturing the same, and a method for manufacturing a circuit board.

[0002] One method for manufacturing a circuit board involves dividing an aggregate substrate in which a plurality of circuit boards are arranged in a grid pattern into individual circuit boards.

[0003] When dividing the individual circuit boards, a V-groove is formed in the aggregate substrate by V-cutting, as in Patent Document 1, for example. The V-groove creates a thin-walled portion between adjacent circuit boards, making them rupturable. By breaking this thin-walled portion, the individual circuit boards can be obtained by dividing them.

[0004] However, in the case of an aggregate board in which circuit boards are arranged in a grid pattern, the grid-like circuit board must first be divided into an aggregate of circuit boards in one row, and then each individual circuit board must be separated from this aggregate.

[0005] Therefore, the conventional manufacturing method of the circuit board increases the number of divisions and the number of divisions, resulting in poor work efficiency for obtaining the individual circuit boards.

[0006] JP 2016-63201 A

[0007] The problem to be solved is the poor work efficiency in obtaining individual circuit boards from an aggregate board in which circuit boards are arranged in a grid pattern.

[0008] The present invention provides an aggregate substrate comprising: a product section in which a plurality of circuit boards, each having a circuit pattern on an insulating substrate, are arranged in a grid pattern in a first direction and a second direction that intersect with each other; slits that extend at least between the ends of the product section in the first direction and penetrate in the plate thickness direction between the circuit boards that are adjacent to each other in the second direction of the product section; joining sections that join the circuit boards that are adjacent to each other in the second direction at least at one end of the product section in the first direction; and grooves that do not penetrate in the plate thickness direction and extend between the ends of the product section in the second direction and are located between the circuit boards and the joining sections that are adjacent to each other in the first direction and between the adjacent circuit boards.

[0009] The present invention also provides a method for manufacturing an aggregate circuit board including a product part in which a plurality of circuit boards, each having a circuit pattern on an insulating substrate, are arranged in a grid pattern in a first direction and a second direction that intersect with each other, slits that extend at least between the ends of the product part in the first direction and penetrate in the plate thickness direction between the circuit boards that are adjacent in the second direction of the product part, joining parts that join the circuit boards that are adjacent in the second direction at at least one end of the product part in the first direction, and grooves that do not penetrate in the plate thickness direction and extend between the ends of the product part in the second direction and are located between the circuit boards and the joining parts that are adjacent in the first direction and between the adjacent circuit boards, wherein the slits and the grooves are formed in a semi-finished product having the product part.

[0010] The present invention also provides a method for manufacturing a circuit board using an aggregate substrate including: a product portion in which a plurality of circuit boards, each having a circuit pattern on an insulating substrate, are arranged in a grid pattern in a first direction and a second direction that intersect with each other; a slit extending at least between ends of the product portion in the first direction and penetrating in the plate thickness direction between the circuit boards that are adjacent in the second direction of the product portion; a joining portion that joins the circuit boards that are adjacent in the second direction at at least one end of the product portion in the first direction; and a groove that does not pass through in the plate thickness direction and extends between the ends of the product portion in the second direction and is located between the circuit boards and the joining portion that are adjacent in the first direction and between the adjacent circuit boards, wherein both sides of the groove are gripped in the first direction to break between the adjacent circuit boards and the joining portion and between the adjacent circuit boards.

[0011] The present invention can improve the efficiency of the work required to obtain individual circuit boards from an aggregate board in which circuit boards are arranged in a grid pattern.

[0012] FIG. 1 is a schematic perspective view showing an aggregate substrate according to a first embodiment of the present invention. FIG. 2 is a plan view of the aggregate substrate of FIG. 1. FIG. 3 is a cross-sectional view of the aggregate substrate of FIG. 2 taken along line III-III. FIG. 4 is a cross-sectional view of the aggregate substrate of FIG. 2 taken along line IV-IV. FIG. 5 is a schematic perspective view showing the formation of slits in an aggregate substrate according to an embodiment of the present invention. FIG. 6 is a schematic perspective view showing the formation of grooves in an aggregate substrate according to an embodiment of the present invention. FIG. 7 is a side view showing a cutter when forming the slits of FIG. 5. FIG. 8 is an enlarged front view showing portion VIII of FIG. 7. FIG. 9 is a schematic cross-sectional view of the cutter of FIG. 7. FIG. 10 is a side view of the cutter when forming the grooves of FIG. 6. FIG. 11 is a schematic cross-sectional view of the cutter of FIG. 10. FIG. 12 is a schematic perspective view showing cleaning of an aggregate substrate according to the first embodiment. FIGS. 13(A) and 13(B) are enlarged photographs showing intersections of slits and grooves in an aggregate substrate according to the first embodiment. FIGS. 14(A) to 14(C) are perspective views showing a method for manufacturing a circuit board according to the first embodiment. Fig. 15 is a schematic cross-sectional view showing a method for manufacturing a circuit board according to Example 1. Fig. 16 is a plan view of an aggregate substrate according to Example 2 of the present invention. Fig. 17 is a plan view of an aggregate substrate according to a modified example of Example 2. Fig. 18 is a plan view of an aggregate substrate according to another modified example of Example 2.

[0013] The objective of improving the work efficiency for obtaining individual circuit boards from an aggregate substrate in which circuit boards are arranged in a grid pattern has been achieved by arranging a combination of slits and grooves between adjacent circuit boards.

[0014] The aggregate substrate 1 includes a product portion 3 , a slit 7 , a connecting portion 9 , and a groove 11 .

[0015] The product section 3 comprises a plurality of circuit boards 17, each having a circuit pattern 15 on an insulating substrate 13, arranged in a grid pattern in a first direction and a second direction that intersect with each other. The slits 7 extend at least between the ends of the product section 3 in the first direction and penetrate the portion of the product section 3 between adjacent circuit boards 17 in the second direction in the plate thickness direction. The joining sections 9 join the circuit boards 17 adjacent in the second direction at least at one end of the product section 3 in the first direction. The grooves 11 extend between the ends of the product section 3 in the second direction and are located between adjacent circuit boards 17 and joining sections 9 and between adjacent circuit boards 17 in the first direction, and do not penetrate in the plate thickness direction.

[0016] In one embodiment, the connecting portion 9 may be provided along the second direction at each end of the product portion 3 in the first direction. In another embodiment, the connecting portion 9 may be provided along the second direction at one end of the product portion 3 in the first direction. In yet another embodiment, a portion of the connecting portion 9 may be provided at one end of the product portion 3 in the first direction, and another portion may be provided at the other end of the product portion 3 in the first direction.

[0017] In this manufacturing method for aggregate substrate 1, slits 7 and grooves 11 are formed in semi-finished product 27 having product portions 3. Preferably, grooves 11 are formed after slits 7 are formed. After forming slits 7 and grooves, fluid F may be sprayed onto product portions 3. In this case, the width of slits 7 may gradually narrow toward the middle of product portions 3 in the plate thickness direction.

[0018] The method for manufacturing circuit boards 17 using aggregate substrate 1 involves gripping both sides of groove 11 in the first direction to break the gap between adjacent circuit boards 17 and coupling portions 9 and between adjacent circuit boards 17. Gripping is preferably performed for each row along the second direction.

[0019] [Aggregate Substrate] Fig. 1 is a schematic perspective view showing an aggregate substrate according to Example 1 of the present invention. Fig. 2 is a plan view of the aggregate substrate of Fig. 1. Fig. 3 is a cross-sectional view of the aggregate substrate of Fig. 2 taken along line III-III. Fig. 4 is a cross-sectional view of the aggregate substrate of Fig. 2 taken along line IV-IV.

[0020] 1 to 4, the aggregate substrate 1 includes a product portion 3, a frame portion 5, a plurality of slits 7, a connecting portion 9, and a plurality of grooves 11. Note that the slits 7 and grooves 11 are not shown in FIG.

[0021] The product section 3 is made up of a plurality of circuit boards 17, each having a circuit pattern 15 on an insulating substrate 13, arranged in a grid pattern in a first direction and a second direction that intersect with each other. In this embodiment, the insulating substrate 13 is a metal-based substrate in which an insulating layer 21 is laminated on a metal base 19. However, the insulating substrate 13 can also be another insulating substrate, such as a ceramic substrate.

[0022] A frame portion 5 is provided around the outer periphery of the product portion 3. The frame portion 5 includes a frame portion 5A at the end of the product portion 3 in the first direction and a frame portion 5B at the end of the product portion 3 in the second direction. The frame portion 5 serves as a discarded board outside the product. The frame portion 5B at the end of the second direction may be omitted.

[0023] The circuit board 17 of the product part 3 is divided into a lattice shape by a plurality of slits 7 and a plurality of grooves 11 .

[0024] The multiple slits 7 each extend in the first direction between the ends of the product portion 3. The slits 7 are arranged in parallel at intervals in the second direction. Each slit 7 is located between adjacent frame portions 5B and circuit boards 17 or between adjacent circuit boards 17 in the second direction, and penetrates the product portion 3 in the thickness direction at this portion.

[0025] As a result, the slits 7 separate adjacent circuit boards 17 in the second direction. The circuit boards 17 located at the ends in the second direction are separated from the adjacent circuit boards 17 in the second direction and from the frame portion 5B. Between adjacent slits 7, the multiple circuit boards 17 are continuous in the first direction via the grooves 11.

[0026] The cross-sectional shape of the slits 7 can be set as appropriate as long as they penetrate the aggregate substrate 1 in the thickness direction. In this embodiment, the cross-sectional shape of the slits 7 gradually narrows from both sides of the product portion 3 in the thickness direction toward the middle.

[0027] In this embodiment, the slit 7 reaches both of the frame portions 5A at the ends in the first direction, but does not completely cut through the frame portions 5A, leaving a continuous portion in the second direction. As a result, the frame portions 5A at each end in the first direction define the joint portion 9. Note that the slit 7 may extend only between the ends of the product portion 3 without reaching the frame portions 5A.

[0028] The connecting portions 9 connect adjacent circuit boards 17 in the second direction at least at one end of the product portion 3 in the first direction. The connecting portions 9 in this embodiment are provided along the second direction at each end of the product portion 3 in the first direction according to the frame portion 5A. The connecting portions 9 integrally connect the circuit boards 17 arranged in a row along the second direction at each end of the product portion 3.

[0029] The plurality of grooves 11 are arranged in parallel at intervals in the first direction on both sides in the thickness direction of the aggregate substrate 1. The grooves 11 on both sides in the thickness direction are arranged corresponding to each other in the thickness direction. Note that the grooves 11 may be provided only on one side in the thickness direction of the aggregate substrate 1.

[0030] The plurality of grooves 11 on each side extend in the second direction between the ends of the product portion 3. In this embodiment, the grooves 11 reach the edges of both of the pair of frame portions 5B in the second direction.

[0031] Each groove 11 is located between adjacent frame portion 5A and circuit board 17 in the first direction or between adjacent circuit boards 17, and forms a thin-walled portion 23 that does not penetrate in the thickness direction by thinning the product portion 3 in this portion. The individual circuit boards 17 can be separated by breaking this thin-walled portion 23. The non-penetrating portion is sufficient as long as it has a non-penetrating portion, and also includes perforations that also have a penetrating portion.

[0032] The cross-sectional shape of the groove 11 can be set as appropriate as long as it can form the thin-walled portion 23 in the product portion 3. In this embodiment, the groove 11 is a V-shaped groove, and its cross-sectional shape is a triangle whose width gradually narrows toward the thin-walled portion 23 in the middle of the product portion 3 in the plate thickness direction.

[0033] [Manufacturing method] Fig. 5 is a schematic perspective view showing the formation of slits in an aggregate substrate 1 according to an embodiment of the present invention, and Fig. 6 is a schematic perspective view showing the formation of grooves 11 in the aggregate substrate 1. Fig. 7 is a side view showing the cutter 25 when forming the slits 7 in Fig. 5. Fig. 8 is an enlarged front view showing part VIII in Fig. 7. Fig. 9 is a schematic cross-sectional view of the cutter 25 in Fig. 7. Fig. 10 is a side view of the cutter 25 when forming the grooves 11 in Fig. 6. Fig. 11 is a schematic cross-sectional view of the cutter in Fig. 10.

[0034] The manufacturing method of the aggregate substrate 1 of this embodiment produces a semi-finished product 27 (see FIG. 5, etc.) that has a frame portion 5 around the product portion 3 and does not have slits 7 or grooves 11. The semi-finished product 27 is manufactured by stacking circuit conductors 15a on a metal base 19 with an insulating layer 21 interposed therebetween (see FIGS. 3 and 4).

[0035] The circuit conductors 15a may be laminated using a resin layer as an adhesive layer. The laminated circuit conductors 15a may be either unpatterned or patterned. If the circuit conductors 15a are not patterned, they may be patterned by etching or the like after lamination.

[0036] The slits 7 and grooves 11 are formed in the semi-finished product 27 thus manufactured to obtain the aggregate substrate 1. In this embodiment, the grooves 11 are formed after the slits 7 are formed. However, it is also possible to form the slits 7 after the grooves 11 are formed.

[0037] When forming the slits 7, as shown in Fig. 5, the semi-finished product 27 is sandwiched between a pair of cutters 25 on both sides in the thickness direction and moved relatively in the first direction. At this time, the pair of cutters 25 are moved apart to avoid the frame portions 5A at both ends in the first direction so as not to completely cut through the frame portions 5A, and are brought close to each other between the ends of the product portion 3 in the first direction. Note that in this embodiment, the slits 7 are formed simultaneously from both sides of the semi-finished product 27, but the slits 7 may also be formed by cutting with the cutters 25 on one side at a time.

[0038] When the pair of cutters 25 are brought close to each other, the teeth 25a of the cutters 25 overlap each other in the first direction, as shown in Figures 7 to 9. This ensures that the slits 7 are formed through the semi-finished product 27. In this embodiment, the frame 5A is also partially cut, but the joints 9 remain in the frame 5A (see Figure 2). The slits 7 need only be formed in the portion that will become the finished product 3.

[0039] The slits 7 are formed between the circuit boards 17 in the second direction while the semi-finished products 27 are shifted relatively in the second direction. The slits 7 thus formed have a cross section whose width gradually narrows from the surface to the middle in the thickness direction of the semi-finished product 27 in accordance with the shape of the teeth 25a of the cutter 25, as shown in FIG.

[0040] When forming the grooves 11, the semi-finished product 27 and the cutter 25 are rotated relative to each other so as to interchange the first and second directions of the semi-finished product 27 as shown in Fig. 6. This causes the movement direction of the cutter 25 to coincide with the second direction of the semi-finished product 27.

[0041] In this state, the semi-finished product 27 is sandwiched between a pair of cutters 25 from both sides in the plate thickness direction and moved relatively in the second direction. When forming the groove 11, as shown in Figures 10 and 11, the cutters 25 are spaced apart to leave a gap S corresponding to the thin-walled portion 23, and in this state, the cutters 25 are moved relatively to the semi-finished product 27. Note that the groove 11 may also be formed by cutting with the cutters 25 on one side at a time.

[0042] The grooves 11 are formed between the circuit boards 17 in the first direction while the semi-finished products 27 are shifted relative to one another in the first direction. The grooves 11 thus formed become V-shaped grooves that form thin-walled portions 23 in the semi-finished products 27 according to the shape of the teeth 25a of the cutter 25, as shown in FIG.

[0043] Fig. 12 is a schematic perspective view showing the cleaning of the aggregate substrate 1. Fig. 13 is a photograph showing an enlarged view of the intersection of the slits 7 and grooves 11 of the aggregate substrate, Fig. 13(A) being the front surface and Fig. 13(B) being the back surface. Note that in Fig. 12, the slits 7 and grooves 11 are shown only by dashed lines. The same is true in Fig. 14.

[0044] 12, the assembly substrate 1 having the slits 7 and grooves 11 formed therein is cleaned by spraying a fluid F. In this embodiment, the cleaning is performed by high-pressure water washing, and pure water is used as the fluid F. The fluid F is not limited to pure water as long as cleaning can be performed by spraying, and an aqueous solution of isopropyl alcohol or the like can also be used.

[0045] This cleaning removes burrs and chips that were generated on the substrate assembly 1 when forming the slits 7 and grooves 11. In this embodiment, the grooves 11 are formed after the slits 7 are formed, so that the burrs B can be positioned so as to protrude into the slits 7 as shown in FIG.

[0046] Therefore, the burrs B can be reliably removed by the fluid F passing through the slit 7. In particular, since the width of the slit 7 in this embodiment gradually narrows toward the middle portion in the plate thickness direction, the flow rate of the fluid F increases, making it easier to remove the burrs.

[0047] 14A to 14C are perspective views showing a method for manufacturing the circuit board 17. FIG. 15 is a schematic cross-sectional view showing the method for manufacturing the circuit board 17.

[0048] 14(A) to 14(C), individual circuit boards 17 are obtained from the cleaned aggregate substrate 1. In this embodiment, as shown in FIG. 15, both sides of the groove 11 are grasped from one end of the aggregate substrate 1 in the first direction, and the aggregate substrate 1 is bent along the groove 11, thereby sequentially dividing the frame portion 5A and the circuit boards 17.

[0049] Specifically, first, frame portion 5A is divided as shown in Fig. 14(A). This division is performed by grasping frame portion 5A located at one end in the first direction and circuit board 17 adjacent to frame portion 5A in the first direction with groove 11 therebetween, as shown in Fig. 15, and bending them along groove 11. This breaks thin portion 23 between frame portion 5A and circuit board 17, and frame portion 5A is divided.

[0050] The gripping is performed row by row along the second direction, with the divided frame portion 5A being gripped as a whole along the second direction on the one hand, and the circuit boards 17 adjacent to it in the first direction being gripped together on the other hand.

[0051] By dividing the frame portion 5A, the circuit board 17 located at one end in the first direction is connected in the second direction only at the connecting portion 9 on the frame portion 5A located at the other end in the first direction.

[0052] In this state, as shown in Fig. 14(B), the circuit board 17 located at one end in the first direction of the aggregate board 1 is divided. This division is performed in the same manner as in Fig. 14(A), by gripping the circuit board 17 located at one end in the first direction and the circuit board 17 adjacent to it in the first direction, and bending them along the groove 11. This breaks the thin-walled portion 23, and the circuit board 17 located at one end in the first direction is divided.

[0053] The clamping here is also performed for each row along the second direction. As a result, the circuit boards 17 located at one end in the first direction are divided into rows along the second direction. The multiple circuit boards 17 thus divided are separated from the frame portion 5B and from each other in the second direction by slits 7, as shown in Figure 14(C), and can be obtained as individual circuit boards 17 that are separated from each other.

[0054] By repeating this division, all of the circuit boards 17 of the aggregate board 1 can be obtained.

[0055] As described above, the aggregate board 1 of this embodiment comprises a product section 3 in which a plurality of circuit boards 17 are arranged in a grid pattern in a first direction and a second direction that intersect with each other, slits 7 that extend between at least the ends of the product section 3 in the first direction and penetrate in the plate thickness direction to separate adjacent circuit boards 17 in the second direction, joining sections 9 that join adjacent circuit boards in the second direction at least at one end of the product section 3 in the first direction, and non-penetrating grooves 11 in the plate thickness direction that extend between the ends of the product section 3 in the second direction and thin the space between adjacent circuit boards 17 and joining sections 9 in the first direction and between adjacent circuit boards 17.

[0056] Therefore, in collective substrate 1, circuit boards 17 can be handled as a single unit by connecting portions 9. Furthermore, in collective substrate 1, individual circuit boards 17 are connected only in the first direction by grooves 11, so that individual circuit boards 17 can be easily obtained by simply breaking at grooves 11. This improves the efficiency of work required to obtain individual circuit boards 17 from collective substrate 1 in which circuit boards 17 are arranged in a grid pattern.

[0057] The connecting portions 9 are provided along the second direction at each end of the product portion 3 in the first direction, making handling easier.

[0058] In the manufacturing method of the aggregate substrate 1, a slit 7 is formed in the semi-finished product 27 having the product portion 3, and then a groove 11 is formed, so that the burr B can be positioned within the slit 7, and the burr B can be easily removed through the slit 7.

[0059] In this embodiment, the fluid F is sprayed onto the product portion 3, thereby reliably removing the burrs B. In particular, the width of the slit 7 gradually narrows toward the middle of the product portion 3 in the thickness direction, so that the flow rate can be increased and the burrs B can be easily removed.

[0060] The manufacturing method of the circuit boards 17 involves gripping both sides of the groove 11 in the first direction of the aggregate board 1, and breaking the gap between adjacent circuit boards 17 and the joints 9, and between adjacent circuit boards 17. This allows the individual circuit boards 17 to be separated, and the individual circuit boards 17 can be easily obtained.

[0061] Since the clamping is performed for each row along the second direction, a plurality of circuit boards 17 arranged in a row along the second direction can be separated into individual pieces by a single breaking operation.

[0062] 16 is a plan view of an aggregate substrate according to Example 2 of the present invention. Since Example 2 has a basic configuration in common with Example 1, the same reference numerals are used to designate corresponding components, and redundant explanations will be omitted.

[0063] In the aggregate substrate 1 of this embodiment, the frame portion 5A at one end in the first direction is cut by the slit 7, and at one end in the first direction, there is no continuous portion between adjacent circuit boards 17 in the second direction. The rest is the same as in the first embodiment.

[0064] Fig. 17 is a plan view of an aggregate substrate according to a modified example of Example 2. Fig. 18 is a plan view of an aggregate substrate according to another modified example of Example 2.

[0065] In the modified example of Fig. 17, the frame portion 5A at one end in the first direction is omitted from Example 2. In the modified example of Fig. 18, coupling portions 9 are provided alternately on the frame portions 5A at both ends in the first direction.

[0066] In the modified example shown in Fig. 18, adjacent slits 7 in the second direction cut frame portions 5A located at different ends in the first direction, separating them in the second direction. As a result, the coupling portions 9 couple a pair of adjacent circuit boards 17 in the second direction at each end in the first direction. In this embodiment, of the three rows of circuit boards 17 in the second direction, the top two rows in Fig. 18 are coupled by coupling portions 9 at one end in the first direction, and the bottom two rows are coupled by coupling portions 9 at the other end in the first direction. The upper and lower circuit boards 17 are coupled via the circuit boards 17 in the upper and lower middle rows in Fig. 18 and both coupling portions 9.

[0067] In the second embodiment and its modifications, the same effects as those of the first embodiment can be achieved.

[0068] REFERENCE SIGNS LIST 1 aggregate substrate 3 product portion 7 slit 9 joint portion 11 groove 13 insulating substrate 15 circuit pattern 17 circuit board 23 thin portion

Claims

1. An aggregate board comprising: a product section in which a number of circuit boards, each having a circuit pattern on an insulating substrate, are arranged in a lattice pattern in a first direction and a second direction that intersect with each other; a slit extending at least between the ends of the product section in the first direction and penetrating in the plate thickness direction between the circuit boards adjacent in the second direction of the product section; a joining section joining the circuit boards adjacent in the second direction at least at one end of the product section in the first direction; and a groove extending between the ends of the product section in the second direction and not penetrating in the plate thickness direction and located between the circuit boards and the joining section adjacent in the first direction and between the adjacent circuit boards.

2. The aggregate substrate according to claim 1, wherein the coupling portions are provided along the second direction at each end of the product portions in the first direction.

3. A method for manufacturing an aggregate substrate comprising: a product section in which a plurality of circuit boards, each having a circuit pattern on an insulating substrate, are arranged in a lattice pattern in a first direction and a second direction that intersect with each other; slits extending at least between the ends of the product section in the first direction and penetrating in the plate thickness direction between the circuit boards adjacent in the second direction of the product section; joining sections that join the circuit boards adjacent in the second direction at least at one end of the product section in the first direction; and grooves that do not pass through in the plate thickness direction and extend between the ends of the product section in the second direction and are located between the circuit boards and the joining sections adjacent in the first direction and between the adjacent circuit boards, wherein the slits and the grooves are formed in a semi-finished product having the product section.

4. A method for manufacturing an aggregate substrate according to claim 3, comprising forming the grooves after forming the slits.

5. A method for manufacturing an aggregate substrate according to claim 3 or 4, comprising the step of spraying a fluid onto the product portions.

6. A method for manufacturing an aggregate substrate as claimed in claim 5, wherein the width of the slits gradually narrows towards the middle of the product portion in the thickness direction.

7. A method for manufacturing a circuit board using an aggregate board including: a product section in which a plurality of circuit boards, each having a circuit pattern on an insulating substrate, are arranged in a lattice pattern in a first direction and a second direction that intersect with each other; a slit extending at least between the ends of the product section in the first direction and penetrating in the board thickness direction a portion between the circuit boards adjacent in the second direction of the product section; a joining section that joins the circuit boards adjacent in the second direction at at least one end of the product section in the first direction; and a groove that does not pass through in the board thickness direction and extends between the ends of the product section in the second direction and is located between the circuit boards and the joining section adjacent in the first direction and between the adjacent circuit boards, wherein both sides of the groove are gripped in the first direction to break the gap between the adjacent circuit boards and the joining section and between the adjacent circuit boards.

8. A method for manufacturing a circuit board using the method for manufacturing an aggregate board according to claim 7, wherein the holding is performed for each row along the second direction.

Images