Printed circuit board assembly and electronic device comprising same

Abstract

A printed circuit board assembly according to an embodiment of the present disclosure may comprise: a printed circuit board (PCB); a plurality of electronic components which are configured to be mounted on a first surface of the PCB; a first shielding member which is configured to cover the plurality of electronic components; and a heat transfer member which is accommodated in the shielding member, at least a part of which is disposed in spaces formed between the plurality of electronic components, and which is configured to be thermally deformable.

Description

Printed circuit board assembly and electronic device including same

[0001] Various embodiments of the present disclosure relate to printed circuit board assemblies and electronic devices including the same.

[0002] Electronic devices such as smartphones and tablet computers are becoming essential means of rapidly changing information transmission. These devices facilitate user interaction through touchscreen-based graphical user interfaces (GUIs) and provide a variety of web-based multimedia.

[0003] Electronic devices incorporate various communication and electronic components to provide diverse functions. For example, a stereo speaker module is embedded in an electronic device, allowing users to enjoy music using stereo sound. A camera module is also embedded in an electronic device, providing a photo-taking function. Furthermore, a communication module is embedded in an electronic device, enabling communication with other electronic devices via a network.

[0004] Additionally, for higher performance electronic devices, more and more electronic components are mounted on a limited printed circuit board space.

[0005] The above information may be provided as background information to aid in understanding this document. None of the above is claimed to be prior art related to this document or can be used to determine prior art.

[0006] Electronic devices may experience increased heat generation from mounted components due to slimmer bodies and the use of high-spec APs (application processors). Various embodiments of the present disclosure may provide a printed circuit board assembly having an additional heat diffusion structure.

[0007] A printed circuit board assembly according to one embodiment of the present disclosure may include a PCB, a plurality of electronic components configured to be mounted on a first surface of the PCB, a first shielding member configured to cover the plurality of electronic components, and a heat transfer member accommodated within the shielding member, at least a portion of which is disposed in a space formed between the plurality of electronic components, and configured to be thermally deformable.

[0008] According to various embodiments proposed in the present disclosure, a printed circuit board assembly can have improved heat dissipation performance of a main heating element such as an AP.

[0009] The effects that can be obtained from the exemplary embodiments of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly derived and understood by those skilled in the art to which the exemplary embodiments of the present disclosure pertain from the following description. In other words, unintended effects resulting from implementing the exemplary embodiments of the present disclosure can also be derived by those skilled in the art from the exemplary embodiments of the present disclosure.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0011] FIG. 2A is a front perspective view of an electronic device according to one embodiment.

[0012] Figure 2b is a rear perspective view of the electronic device of Figure 2a.

[0013] FIG. 3 is a perspective view of an unfolded electronic device according to one embodiment.

[0014] FIG. 4 is a plan view of a printed circuit board assembly according to one embodiment.

[0015] FIG. 5 is a cross-sectional view of a printed circuit board assembly according to one embodiment.

[0016] FIG. 6 is a perspective view illustrating a thermal compression device according to one embodiment.

[0017] FIGS. 7A and 7B are cross-sectional views illustrating a process in which a first shielding member and a first heat transfer member are thermally compressed according to one embodiment.

[0018] Figure 8 is a flowchart of a method for manufacturing a printed circuit board assembly according to one embodiment.

[0019] FIG. 9 is an experimental example showing the temperature change of the first heat transfer member according to the time of thermal compression of the first shielding member and the first heat transfer member according to one embodiment.

[0020] FIG. 10 is a graph illustrating improved operating performance of a main heating element mounted on a printed circuit board assembly according to one embodiment.

[0021] FIGS. 11A and 11B are drawings for explaining shape changes when a first heat transfer member is thermally compressed according to one embodiment.

[0022] Figure 12 is a plan view of a printed circuit board assembly according to one embodiment.

[0023] Figure 13 is a cross-sectional view of a printed circuit board assembly according to one embodiment.

[0024] FIG. 14 is a cross-sectional view of a printed circuit board assembly according to one embodiment.

[0025] FIG. 15 is a cross-sectional view of a printed circuit board assembly according to one embodiment.

[0026] FIG. 16 is a cross-sectional view of a printed circuit board assembly according to one embodiment.

[0027] The following description refers to the attached drawings, and specific examples of implementations are illustrated within the drawings. Furthermore, other examples may be utilized and structural changes may be made without departing from the scope of the various examples.

[0028] The various embodiments used to illustrate the principles of the present disclosure, as illustrated in FIGS. 1 through 16 below and in this patent document, are for illustrative purposes only and should not be construed as limiting the scope of the present disclosure in any way. Those skilled in the art will appreciate that the principles of the present disclosure can be implemented in any appropriately arranged system or device.

[0029] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0030] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0031] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0032] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0033] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0034] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0035] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0036] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0037] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0038] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0039] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0040] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0041] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0042] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0043] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0044] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0045] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0046] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0047] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0048] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0049] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0050] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0051] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0052] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0053] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0054] FIG. 2A is a front perspective view of an electronic device according to one embodiment. FIG. 2B is a rear perspective view of the electronic device of FIG. 2A.

[0055] Referring to FIGS. 2A and 2B, an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In another embodiment (not shown), the housing may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIG. 1. According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0056] In the illustrated embodiment, the front plate (202) may include two first regions (210D) extending seamlessly from the first surface (210A) toward the rear plate (211) at both ends of a long edge of the front plate (202). In the illustrated embodiment (see FIG. 2), the rear plate (211) may include two second regions (210E) extending seamlessly from the second surface (210B) toward the front plate (202) at both ends of a long edge. In some embodiments, the front plate (202) (or the rear plate (211)) may include only one of the first regions (210D) (or the second regions (210E)). In another embodiment, some of the first areas (210D) or the second areas (210E) may not be included. In the above embodiments, when viewed from the side of the electronic device (200), the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first areas (210D) or the second areas (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first areas (210D) or the second areas (210E). In one embodiment, the first areas (210D) or the second areas (210E) may be formed as a plane so as not to be bent and to form substantially one plane with the first surface (210A) or the second surface (210B).

[0057] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 207, 214), a sensor module (204, 216, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0058] The display (201) may be exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first areas (210D) of the side surfaces (210C). In some embodiments, the edges of the display (201) may be formed to be substantially identical to the adjacent outer shape of the front plate (202). In other embodiments (not shown), the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially identical to expand the area over which the display (201) is exposed.

[0059] In another embodiment (not shown), a recess or opening may be formed in a portion of the screen display area of ​​the display (201), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included aligned with the recess or opening. In another embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (216), and a light-emitting element (206) may be included on the back surface of the screen display area of ​​the display (201). In another embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219) and / or at least a portion of the key input device (217) may be disposed in the first areas (210D) and / or the second areas (210E).

[0060] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sounds, and in some embodiments, multiple microphones may be disposed to detect the direction of sounds. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In some embodiments, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0061] The sensor modules (204, 216, 219) can generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device (200) or the external environmental state. The sensor modules (204, 216, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) and / or a fourth sensor module (216) (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) (e.g., the display (201)) of the housing (210) as well as the second surface (210B). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0062] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0063] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In other embodiments, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In some embodiments, the key input device may include a sensor module (216) disposed on a second surface (210B) of the housing (210).

[0064] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0065] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0066] FIG. 3 is a perspective view of an unfolded electronic device according to one embodiment.

[0067] Referring to FIG. 3, the electronic device (300) may include a side bezel structure (310), a first support member (311) (e.g., a bracket), a front plate (320), a display (330), a printed circuit board (340), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (300) may be the same as or similar to at least one of the components of the electronic device (100) of FIG. 1 or FIG. 2, and any redundant description thereof will be omitted below.

[0068] The first support member (311) may be disposed inside the electronic device (300) and connected to the side bezel structure (310), or may be formed integrally with the side bezel structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (340). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0069] The memory may include, for example, volatile memory or non-volatile memory.

[0070] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0071] The battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit board (340). The battery (350) may be disposed integrally within the electronic device (300), or may be disposed detachably from the electronic device (300).

[0072] The antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (310) and / or the first support member (311).

[0073] FIG. 4 is a plan view of a printed circuit board assembly according to one embodiment.

[0074] The printed circuit board assembly (400) illustrated in FIG. 4 may be accommodated in an electronic device (e.g., the electronic device (200) of FIG. 2A) illustrated in FIG. 2A to FIG. 3. The printed circuit board assembly (400) illustrated in FIG. 4 may replace a PCB (e.g., the printed circuit board (340) of FIG. 3) of the electronic device (e.g., the electronic device (300) of FIG. 3) illustrated in FIG. 3, or may be included in a PCB (e.g., the printed circuit board (340) of FIG. 3).

[0075] The embodiment of FIG. 4 can be optionally combined with the embodiments of FIGS. 12 to 16.

[0076] Referring to FIG. 4, a printed circuit board assembly (400) may include a PCB (410), a plurality of electronic components (420), and at least one of a first shielding member (431) or a second shielding member (432). The first shielding member (431) or the second shielding member (432) may be referred to as, for example, a shield can. For example, a support member (4311) of the first shielding member (431) may be referred to as a shield can.

[0077] The printed circuit board assembly (400) may be, for example, a module such as a solid state drive (SSD) module, a memory module, a computer system module, or a mobile system module, but is not limited thereto. The printed circuit board assembly (400) may be a semiconductor substrate. In the following description, the printed circuit board assembly (400) will be specifically described as a semiconductor substrate, but the proposed structure or its manufacturing method is not specifically applicable only to semiconductor substrates, but may be applied to all printed circuit board assemblies in which electronic components are mounted by soldering.

[0078] The PCB (410) may include a first side (410a) or a second side (410b). The first side (410a) and the second side (410b) may be sides facing opposite directions. For example, the first side (410a) may be a side facing a display (e.g., a display (330) of FIG. 3) in an electronic device (e.g., an electronic device (300) of FIG. 3) in which the PCB (410) is placed. The PCB (410) may be configured such that at least one electronic component is mounted on at least one side of the first side (410a) and the second side (410b) by soldering, for example.

[0079] PCB (410) may utilize various types of substrates well known in the art (e.g., ceramic substrates, printed circuit boards, flexible substrates, etc.). Although not illustrated, an electrically connected wiring pattern may be formed on at least one of the first side (410a) and the second side (410b) of PCB (410).

[0080] PCB (410) can be distinguished into a single-layer PCB in which circuit wiring is formed on only one side, and a double-layer PCB in which circuit wiring is formed on both sides. In the case of the double-layer PCB (410), the circuit wiring on the upper and lower sides can be electrically connected through a conductive via that penetrates the body.

[0081] According to an example, a plurality of electronic components (420) may be mounted on a PCB (410). The plurality of electronic components (420) may be mounted on at least one of the first side (410a) or the second side (410b) of the PCB (410).

[0082] In one example, a portion of the plurality of electronic components (420) may be shielded by a shielding member (430). The shielding member (430) may be positioned to protect the plurality of electronic components (420) from external impact. The shielding member (430) may be positioned to surround at least one of the plurality of electronic components (420). For example, the shielding member (430) may be positioned to surround a portion of the plurality of electronic components (420) mounted on the first surface (410a). For example, the shielding member (430) may be positioned to surround a portion of the plurality of electronic components (420) mounted on the second surface (410b).

[0083] In one example, the shielding member (430) may include a first shielding member (431) and a second shielding member (432). In one example, a plurality of electronic components (420) may be shielded from the outside by the first shielding member (431) or the second shielding member (432). For example, the first shielding member (431) and the second shielding member (432) may be disposed on the first surface (410a) of the PCB (410).

[0084] The first shielding member (431) may be positioned corresponding to a third electronic component (e.g., the third electronic component (423) of FIG. 5 or the main heating element) mounted on the second surface (410b) to be described later. The first shielding member (431) may be positioned so that at least a portion thereof overlaps with the third electronic component (423) mounted on the second surface (410b) to be described later.

[0085] The second shielding member (432) may be arranged around the first shielding member (431). The second shielding member (432) may be arranged on the side of the first shielding member (431). The second shielding member (432) may be positioned within a predetermined distance from the first shielding member (431). A plurality of second shielding members (432) may be provided around the first shielding member (431).

[0086] FIG. 5 is a cross-sectional view of a printed circuit board assembly according to one embodiment.

[0087] FIG. 5 may be a cross-sectional view taken along line AA' of the printed circuit board assembly (400) of FIG. 4. The drawing illustrated in FIG. 5 is schematically illustrated for convenience of explanation, and the scope of the present disclosure is not limited to the illustrated form.

[0088] The embodiment of FIG. 5 can be optionally combined with the embodiments of FIGS. 12 to 16.

[0089] Referring to FIG. 5, the printed circuit board assembly (400) may include at least one of a PCB (410), a shielding member (430), a plurality of electronic components (420), a first heat transfer member (440), or a second heat transfer member (450).

[0090] According to an example, the shielding member (430) may include a first shielding member (431), a second shielding member (432), and a third shielding member (433). The first shielding member (431) and the second shielding member (432) may be disposed on a first surface (410a) of the PCB (410). The third shielding member (433) may be disposed on a second surface (410b) of the PCB (410). The first shielding member (431) and the third shielding member (433) may be disposed in corresponding areas.

[0091] According to an example, the first shielding member (431) may include a support member (4311) and a cover member (4312). The support member (4311) and the cover member (4312) may be configured to protect a plurality of first electronic components (421) arranged within the first shielding member (431) from external impact and to efficiently dissipate heat.

[0092] In one example, the cover portion (4312) may be configured to be thermocompressible. The cover portion (4312) may have a non-recoverable property that does not return to its original shape after thermal deformation. When heat above a predetermined temperature is applied to the cover portion (4312), the cover portion (4312) may be plastically deformed. The cover portion (4312) may have both shielding and heat dissipation functions.

[0093] In one example, the cover portion (4312) may include a heat transfer layer (4312b). The heat transfer layer (4312b) may form, for example, an upper surface of the cover portion (4312). The heat transfer layer (4312b) may have, for example, a thermal conductivity of up to 1400 W / mK, but is not limited thereto. In one example, the heat transfer layer (4312b) may be, but is not limited to, a graphite sheet.

[0094] For example, the heat transfer layer (4312b) can disperse heat transferred from the first heat transfer member (440) in a horizontal direction. By re-dispersing heat transferred vertically from the main heating element to the first heat transfer member (440) in a horizontal direction, the heat dissipation performance of the printed circuit board assembly (400) can be improved.

[0095] In one example, the cover portion (4312) may include a shielding layer (4312a). The shielding layer (4312a) may be disposed below the heat transfer layer (4312b). Contrary to the illustration, the shielding layer (4312a) may also be disposed above the heat transfer layer (4312b). The shielding layer (4312a) may have a thermal conductivity of, for example, 300 to 400 W / mK, but is not limited thereto. The shielding layer (4312a) may have a relatively low thermal conductivity compared to, for example, the heat transfer layer (4312b). The shielding layer (4312a) may include, for example, copper, but is not limited thereto. In one example, the heat transfer layer (4312b) and the shielding layer (4312a) may be configured by being laminated.

[0096] Unlike the illustrated embodiment, the cover portion (4312) may not be formed by combining the heat transfer layer (4312b) and the shielding layer (4312a). Unlike the illustrated embodiment, the cover portion (4312) may be formed by omitting the heat transfer layer (4312b). In this case, since the shielding layer (4312a) has high thermal conductivity, the shielding layer (4312a) may play a role in dispersing the heat transferred from the first heat transfer member (440).

[0097] Unlike the illustrated embodiment, the cover part (4312) may be configured such that the heat transfer layer (4312b) and the shielding layer (4312a) are combined, and at least a portion of the heat transfer layer (4312b) or the shielding layer (4312a) is omitted in some areas.

[0098] According to one example, the support member (4311) may be provided to support the cover member (4312). The support member (4311) may form a side or a side surface of the first shielding member (431). The support member (4311) may be arranged between the PCB (410) and the cover member (4312). The support member (4311) may include an opening (4311a) having an open top. The cover member (4312) may be arranged to cover the opening (4311a). The support member (4311) may be configured to shield electromagnetic waves generated from a plurality of first electronic components (421).

[0099] According to an example, the second shielding member (432) may be arranged around the first shielding member (431). The second shielding member (432) may be arranged adjacent to the first shielding member (431).

[0100] According to an example, the third shielding member (433) may be placed on the opposite side of the first shielding member (431).

[0101] According to an example, the plurality of electronic components (420) may include a plurality of first electronic components (421), a plurality of second electronic components (422), and a third electronic component (423). The plurality of first electronic components (421) may be mounted on a first surface (410a) of the PCB (410). The plurality of first electronic components (421) may be located inside a first shielding member (431). The plurality of second electronic components (422) may be mounted on the first surface (410a) of the PCB (410). The plurality of second electronic components (422) may be located inside a second shielding member (432). The third electronic component (423) may be mounted on a second surface (410b) of the PCB (410). The third electronic component (423) may be located inside a third shielding member (433).

[0102] According to one example, each of the plurality of first electronic components (421) may have different heights and sizes. According to one example, the third electronic component (423) may include a main heating element. The main heating element may be mounted on the second surface (410b) of the PCB (410). The main heating element may include, for example, at least one of an application processor (AP), a central processing unit (CPU), a graphics processing unit (GPU), a power amplifying module (PAM), or a memory. However, the present invention is not limited thereto, and the main heating element may include elements that must operate at a high clock for high-performance operation.

[0103] Since the heights of the plurality of first electronic components (421) are different, a step is formed. Therefore, when a heat transfer member having a fixed shape or elasticity is placed on the plurality of first electronic components (421), the heat transfer member cannot fill the space between the stepped spaces. When a liquid heat transfer member is applied around the plurality of first electronic components (421), surface tension and capillary force act simultaneously, making it difficult for the liquid heat transfer member to penetrate the space between the plurality of first electronic components (421). In addition, when a liquid heat transfer member is used, a leakage problem or a backflow problem may occur when the heat transfer member is injected. In the present disclosure, by using a heat-compressible heat transfer member, the first heat transfer member (440) is provided not only on the upper side of the plurality of first electronic components (421) but also on the side of each of the plurality of first electronic components (421), thereby increasing the contact area between the plurality of first electronic components (421) and the first heat transfer member (440). By maximizing the contact area between the plurality of first electronic components (421) and the first heat transfer member (440), the thermal resistance can be reduced. As a result, some of the heat generated from the main heating element can be efficiently dissipated to the outside through the PCB (410) and the first heat transfer member (440).

[0104] According to one example, the first heat transfer member (440) may be accommodated within the first shielding member (431). A portion of the first heat transfer member (440) may be disposed in a space formed between the plurality of first electronic components (421). The first heat transfer member (440) may be arranged to be in close contact with the surfaces of the plurality of first electronic components (421).

[0105] In one example, the first heat transfer member (440) may be configured to be thermally deformable. For example, the first heat transfer member (440) may be configured to be deformable when the temperature exceeds a certain temperature.

[0106] According to an example, the first heat transfer member (440) may be placed at a portion corresponding to the third electronic component (423) (or main heating element). For example, the first heat transfer member (440) may be placed on the opposite side of the third electronic component (423) (or main heating element) with the PCB (410) therebetween.

[0107] According to an example, the first heat transfer member (440) may include a heat dissipation material having high thermal conductivity. The heat dissipation material having high thermal conductivity may include at least one of Al2O3 (Aluminum Oxide), AlN (Aluminum Nitride), BN (Boron Nitride), SiC (Silicon Carbide), MgO (Magnesium Oxide), ZnO (Zinc Oxide), carbon fiber, or graphene. However, the present invention is not limited thereto. For example, the heat dissipation material having high thermal conductivity may have a weight ratio of 86% to 94% in the first heat transfer member (440).

[0108] According to one example, the first heat transfer member (440) may include a rubber material. By including the rubber material in the first heat transfer member (440), the first heat transfer member (440) may have compressive performance. In addition, when the first heat transfer member (440) is compressed, the first heat transfer member (440) may be brought into close contact with the surfaces of the plurality of first electronic components (421) by the rubber material included in the first heat transfer member (440). For example, the rubber material may have a weight ratio of 6.75% to 8.25% in the first heat transfer member (440).

[0109] According to an example, the first heat transfer member (440) may include a phase change material (PCM). The phase change material may enable the first heat transfer member (440) to change shape due to heat. For example, the phase change material may include, but is not limited to, a paraffin-based material. For example, the phase change material may have a weight ratio of 6.75% to 8.25% in the first heat transfer member (440).

[0110] In one example, the first heat transfer member (440) may be configured to maintain a solid form at room temperature. The first heat transfer member (440) may have, for example, a glass transition temperature of 40 degrees Celsius or higher. The first heat transfer member (440) may have, for example, a weight ratio of a heat-dissipating material with high thermal conductivity, a rubber material, and a phase change material of 85:7.5:7.5, but is not limited thereto. For example, the weight ratio of each material may be configured to be changeable within a range of 10%.

[0111] The first heat transfer member (440) is shown as being housed within the first shielding member (431), but this is exemplary, and the heat-compressible first heat transfer member (440) may also be housed within other shielding members.

[0112] According to an example, the second heat transfer member (450) may be accommodated in the third shielding member (433). The second heat transfer member (450) may be disposed between the third electronic component (423) (or main heating element) and the third shielding member (433). The second heat transfer member (450) may be disposed to transfer heat generated from the third electronic component (423) (or main heating element) to the outside.

[0113] For example, heat generated from the main heating element of the third electronic component (423) may be diffused through a first heat diffusion path (P1) and a second heat diffusion path (P2). The first heat diffusion path (P1) may include, for example, a path through which heat generated from the main heating element sequentially passes through the second heat transfer member (450) and the third shielding member (433) and diffuses to the outside.

[0114] For example, the second heat diffusion path (P2) may include a path along which heat generated from the main heating element sequentially passes through the PCB (410), the first heat transfer member (440), and the first shielding member (431) and diffuses to the outside. The second heat diffusion path (P2) may include, for example, a path along which heat is transferred from the main heating element to the PCB (410) and the first heat transfer member (440), and the heat of the first heat transfer member (440) diffuses horizontally through the cover portion (4312) of the first shielding member (431). The heat transferred from the main heating element may diffuse horizontally, for example, by the heat transfer layer (4312b) of the cover portion (4312). Here, the horizontal direction may refer to a plane direction of the cover portion (4312). In the present disclosure, the heat dissipation performance of the main heating element can be improved by additionally configuring a second heat diffusion path (P2) in addition to the first heat diffusion path (P1).

[0115] FIG. 6 is a perspective view illustrating a thermal compression device according to one embodiment.

[0116] Referring to FIG. 6, the thermal compression device (600) may include an upper jig (610) and a lower jig (620).

[0117] According to an example, the upper jig (610) may be configured to be movable up and down. The upper jig (610) may include a heating block (611). The heating block (611) may have a temperature of, for example, 130 degrees or higher.

[0118] According to one example, the lower jig (620) may include a mounting groove (621). A printed circuit board assembly (400) may be mounted in the mounting groove (621). The printed circuit board assembly (400) may be mounted in the mounting groove (621) such that the first shielding member (431) faces upward. The mounting groove (621) should be formed to an appropriate depth to prevent damage to a third electronic component (e.g., the third electronic component (423) of FIG. 5) (or a main heating element) mounted on a second surface (e.g., the second surface (410b) of FIG. 5) opposite to the first shielding member (431). For example, the mounting groove (621) may be formed with an indentation of 4.5 to 5.1 T. As one example, the mounting groove (621) may be applied with an indentation of 4.8 T.

[0119] According to one example, an additional engraving may be formed in a portion corresponding to or overlapping the first shielding member (431) in the mounting groove (621). For example, an additional engraving of 0.25 to 0.45T may be formed in a portion corresponding to the first shielding member (431) in the mounting groove (621).

[0120] According to one example, the first shielding member (431) of the printed circuit board assembly (400) can be thermally compressed by a thermal compression device (600). As the upper jig (610) moves toward the lower jig (620), the first shielding member (431) of the printed circuit board assembly (400) seated in the seating groove (621) can be thermally compressed. During the process in which the upper jig (610) presses the printed circuit board assembly (400), the heating block (611) can come into contact with the first shielding member (431). The first shielding member (431) and the first heat transfer member (e.g., the first heat transfer member (440) of FIG. 5) accommodated in the first shielding member can be heated by the heating block (611).

[0121] When pressing a printed circuit board assembly (400) using an upper jig (610) and a lower jig (620), the thermal compression device (600) may include an elastic pad to prevent damage to the portion of the printed circuit board assembly (400) to which the pressurization is applied. The elastic pad may be, for example, a silicone pad or a rubber pad.

[0122] Although not shown, when the upper jig (610) presses the cover portion (4312) of the first shielding member (431), a release sheet may be provided on the upper side of the cover portion (4312) to prevent damage to the cover portion (4312). The release sheet may prevent damage to the heat transfer layer (4312b) located on the upper side of the cover portion (4312).

[0123] When the upper jig (610) moves downward to pressurize the first shielding member (431), the first shielding member (431) must be pressed with an appropriate pressure so that the third electronic component (e.g., the third electronic component (423) of FIG. 5) placed on the opposite side is not damaged. For example, the upper jig (610) can pressurize the first shielding member (431) with a pressure of approximately 0.8 bar or more.

[0124] FIGS. 7A and 7B are cross-sectional views illustrating a process in which a first shielding member and a first heat transfer member are thermally compressed according to one embodiment.

[0125] The configuration of the printed circuit board assembly (400) illustrated in FIGS. 7a and 7b may be substantially the same as or similar to the configuration of the printed circuit board assembly (400) illustrated in FIG. 5. Among the configurations illustrated in FIGS. 7a and 7b, the same reference numbers are used for configurations that are substantially the same as or similar to the configuration illustrated in FIG. 5.

[0126] The embodiments of FIGS. 7a and 7b can be optionally combined with the embodiments of FIGS. 12 to 16.

[0127] Figure 7a is a cross-sectional view showing a state of a printed circuit board assembly (400) before being thermally compressed.

[0128] Before the first heat transfer member (440) is thermally compressed, the first heat transfer member (440) may be placed on a plurality of first electronic components (421). The first heat transfer member (440) may be placed on a plurality of first electronic components (421), for example, in a roughly block shape. A first shielding member (431) may be placed on the first heat transfer member (440). Since the first heat transfer member (440) is in a state before being thermally compressed, a portion of the cover portion (4312) of the first shielding member (431) may protrude upward. For example, a portion of the cover portion (4312) may be placed on the first heat transfer member (440) by protruding upward by a size equal to D illustrated in FIG. 7A. The degree of protrusion of the cover portion (4312) may be somewhat exaggerated for convenience of explanation.

[0129] Figure 7b is a cross-sectional view showing the state of the printed circuit board assembly (400) after being thermally compressed.

[0130] The first shielding member (431) and the first heat transfer member (440) can be thermally compressed by a thermal compression device (600). For example, the first shielding member (431) and the first heat transfer member (440) can be compressed by a length D protruding upward from the first shielding member (431). The first shielding member (431) and the first heat transfer member (440) can be thermally compressed by being pressed in a downward direction (700).

[0131] When the first heat transfer member (440) is thermally compressed in the downward direction (700), a portion of it may permeate the space between the plurality of first electronic components (421), as shown in FIG. 7b.

[0132] After thermal compression, the upper surface of the cover portion (4312) and the electronic component having the highest height among the plurality of first electronic components (421) may be spaced apart from each other. For example, to increase heat dissipation performance, the distance between the cover portion (4312) and the upper surface of the electronic component having the highest height among the plurality of first electronic components (421) may be 50 micrometers or more.

[0133] Figure 8 is a flowchart of a method for manufacturing a printed circuit board assembly according to one embodiment.

[0134] The flowchart of Fig. 8 is a flowchart illustrating a portion of the process for manufacturing the printed circuit board assembly (400) of Fig. 5. Hereinafter, the configuration of the printed circuit board assembly (400) of Fig. 5 will be described.

[0135] According to one example, a method for manufacturing a printed circuit board assembly (400) may include a step (810) of placing a first heat transfer member (440) that is heat-compressible on a plurality of first electronic components (421). The first heat transfer member (440) may have an approximately block shape. Before the first heat transfer member (440) is pressed, it may be placed so as to overlap on the plurality of first electronic components (421).

[0136] According to one example, a method for manufacturing a printed circuit board assembly (400) may include a process (820) of arranging a first shielding member (431) to cover a plurality of first electronic components (421) and a first heat transfer member (440). The printed circuit board assembly (400) that has completed the process 820 may correspond to the shape illustrated in FIG. 7A.

[0137] In one example, processes 810 and 820 can be performed as a single process. In one example, after attaching a first heat transfer member (440) to a first shielding member (431), the first shielding member (431) to which the first heat transfer member (440) is attached can be placed on a plurality of first electronic components (421).

[0138] According to one example, a method for manufacturing a printed circuit board assembly (400) may include a step (830) of mounting the printed circuit board assembly (400) on a lower jig (e.g., the lower jig (620) of FIG. 6). The printed circuit board assembly (400) may be mounted on the lower jig (620) with the first shielding member (431) facing upward. The printed circuit board assembly (400) may be mounted in a mounting groove (621) of the lower jig (620).

[0139] According to one example, a method for manufacturing a printed circuit board assembly (400) may include a step (840) in which an upper jig (e.g., an upper jig (610) of FIG. 6) including a heating block (e.g., a heating block (611) of FIG. 6) presses a first shielding member (431). The upper jig (610) may press a cover portion (4312) of the first shielding member (431). When the upper jig (610) presses the printed circuit board assembly (400), an appropriate pressure should be applied so that a third electronic component (e.g., a third electronic component (423) of FIG. 5) disposed on the opposite side is not damaged. For example, the printed circuit board assembly (400) may be pressurized at a pressure of 0.7 to 0.9 bar. The printed circuit board assembly (400) that has completed the 840 process may correspond to the shape illustrated in FIG. 7b.

[0140] FIG. 9 is an experimental example showing the temperature change of the first heat transfer member according to the time of thermal compression of the first shielding member and the first heat transfer member according to one embodiment.

[0141] The table illustrated in Fig. 9 is an exemplary experimental example, and the experimental results illustrated do not limit the scope of the present disclosure. The experimental example in Fig. 9 is data obtained by testing a heating block (e.g., the heating block (611) in Fig. 6) at a temperature of 130 degrees. The temperature of the heating block (611) may range from 125 degrees to 135 degrees.

[0142] Referring to FIG. 9, the temperature change over time while the upper jig including the heating block (611) (e.g., the upper jig (610) of FIG. 6) presses the first shielding member (431) is displayed. The temperature value displayed in FIG. 9 may represent the temperature value inside the first shielding member (431). In the table of FIG. 9, the temperature change over time inside the first shielding member (431) is displayed for each case where the cover part (4312) is formed by laminating the heat transfer layer (4312b) and the shielding layer (4312a) and the case where the cover part (4312) is formed by only the shielding layer (4312a). In addition, the temperature change over time inside the first shielding member (431) is displayed depending on the presence or absence of a release paper.

[0143] The temperature inside the first shielding member (431) must exceed the glass transition temperature of the first heat transfer member (440) so that the first heat transfer member (440) can be deformed by thermal compression. For example, if the glass transition temperature of the first heat transfer member (440) is 40 degrees Celsius, it may be necessary to apply pressure for 5 seconds or more, regardless of the material of the cover part (4312) or the presence or absence of a release paper, based on experimental values. Here, the process of applying pressure for 5 seconds or more can be performed in process 840 of FIG. 8.

[0144] FIG. 10 is a graph illustrating improved operating performance of a main heating element mounted on a printed circuit board assembly according to one embodiment.

[0145] The graph of FIG. 10 shows the performance score according to the number of cycles of a third electronic component (e.g., the third electronic component (423) of FIG. 5) or an application processor (AP), which is a component of the main heating element.

[0146] Referring to FIG. 10, the performance (910) according to the number of cycles of a printed circuit board assembly in which the first heat transfer member (440) is omitted and the performance (920) according to the number of cycles of a printed circuit board assembly (e.g., the printed circuit board assembly (400) of FIG. 5) in which the first heat transfer member (e.g., the first heat transfer member (440) of FIG. 5) is provided are shown. As can be seen from the graph, by providing the first heat transfer member (440) configured to be thermally compressible within a shielding member (e.g., the shielding member (430) of FIG. 1) located on the opposite side of the main heating element, the heat dissipation performance is improved, and as a result, the operating performance can be improved by approximately 10%.

[0147] FIGS. 11A and 11B are drawings for explaining shape changes when a first heat transfer member is thermally compressed according to one embodiment.

[0148] The printed circuit board assembly (400) illustrated in FIGS. 11A and 11B may be substantially identical or similar to the printed circuit board assembly (400) of FIG. 4. Among the configurations illustrated in FIGS. 11A and 11B, the same reference numbers are used for configurations that are substantially identical or similar to the configuration illustrated in FIG. 4.

[0149] FIGS. 11A and 11B illustrate a state in which the cover portion (4312) of the first shielding member (431) and the first heat transfer member (440) are separated from the printed circuit board assembly (400). In FIGS. 11A and 11B, the left configuration is a drawing showing a state in which the first heat transfer member (440) is attached to the back surface of the cover portion (4312), and the right configuration is a plan view viewed from above after the cover portion (4312) and the first heat transfer member (440) are separated from the printed circuit board assembly (400).

[0150] Fig. 11a illustrates a state before the first heat transfer member (440) is thermally compressed. Fig. 11a may correspond to the state illustrated in Fig. 7a. Fig. 11b illustrates a state after the first heat transfer member (440) is thermally compressed. Fig. 11b may correspond to the state illustrated in Fig. 7b.

[0151] The embodiments of FIGS. 11a and 11b can be optionally combined with the embodiments of FIGS. 12 to 16.

[0152] According to one example, the first heat transfer member (440) may have a shape in which grooves are dug in the shape of a plurality of first electronic components (421), as illustrated in FIG. 11B, after being thermally compressed. By accommodating a plurality of first electronic components (421) in each groove formed in the first heat transfer member (440), the contact area between the plurality of first electronic components (421) and the first heat transfer member (440) can be maximized.

[0153] Figure 12 is a plan view of a printed circuit board assembly according to one embodiment.

[0154] The printed circuit board assembly (1200) illustrated in FIG. 12 can be accommodated in an electronic device (e.g., the electronic device (200) of FIG. 2A) illustrated in FIG. 2A to FIG. 3. The printed circuit board assembly (1200) illustrated in FIG. 12 can replace a PCB (e.g., the printed circuit board (340) of FIG. 3) of the electronic device (e.g., the electronic device (300) of FIG. 3) illustrated in FIG. 3, or can be included in a PCB (e.g., the printed circuit board (340) of FIG. 3).

[0155] Among the configurations illustrated in FIG. 12, the same reference numbers are used for configurations that are substantially the same or similar to the configuration of the printed circuit board assembly (400) illustrated in FIG. 4.

[0156] The embodiment of FIG. 12 can be optionally combined with the embodiments of FIGS. 4 to 11b. The embodiment of FIG. 12 can be optionally combined with the embodiments of FIGS. 13 to 16.

[0157] Referring to FIG. 12, the printed circuit board assembly (1200) may include a first shielding member (1231). The first shielding member (1231) may be positioned corresponding to a third electronic component (e.g., the third electronic component (423) of FIG. 13 or the main heating element) mounted on the second surface (410b) to be described later. The first shielding member (1231) may be positioned so that at least a portion thereof overlaps with the third electronic component (423) mounted on the second surface (410b) to be described later.

[0158] According to one example, the upper surface of the first shielding member (1231) may be configured to cover at least one second shielding member (432) among a plurality of adjacent second shielding members (432). By expanding the area of ​​the upper surface of the first shielding member (1231), the heat diffusion path of the first shielding member (1231) may be widened.

[0159] Figure 13 is a cross-sectional view of a printed circuit board assembly according to one embodiment.

[0160] FIG. 13 may be a cross-sectional view taken along line BB' of the printed circuit board assembly (1200) of FIG. 12. The drawing illustrated in FIG. 13 is schematically illustrated for convenience of explanation, and the scope of the present disclosure is not limited to the illustrated form.

[0161] Among the configurations illustrated in FIG. 13, the same reference numbers are used for configurations that are substantially the same or similar to the configuration of the printed circuit board assembly (400) illustrated in FIG. 5.

[0162] Referring to FIG. 13, the printed circuit board assembly (1200) may include a first shielding member (1231).

[0163] According to an example, the first shielding member (1231) may include a support member (1231a) and a cover member (1231b, 1231c). The support member (1231a) and the cover member (1231b, 1231c) may be configured to protect a plurality of first electronic components (421) arranged within the first shielding member (1231) from external impact and to efficiently dissipate heat.

[0164] For example, the cover portions (1231b, 1231c) may be configured to be heat-compressible. The cover portions (1231b, 1231c) may have a non-recoverable property of not returning to their original shape after thermal deformation. When heat above a predetermined temperature is applied to the cover portions (1231b, 1231c), the cover portions (1231b, 1231c) may be plastically deformed. The cover portions (1231b, 1231c) may have both shielding and heat dissipation functions.

[0165] In one example, the cover portion (1231b, 1231c) may include a heat transfer layer (1231c). The heat transfer layer (1231c) may form, for example, an upper surface of the cover portion (1231b, 1231c). The heat transfer layer (1231c) may have, for example, a thermal conductivity of up to 1400 W / mK, but is not limited thereto. In one example, the heat transfer layer (1231c) may be, but is not limited thereto, a graphite sheet.

[0166] For example, the heat transfer layer (1231c) can disperse heat transferred from the first heat transfer member (440) in a horizontal direction. By re-dispersing heat transferred vertically from the main heating element to the first heat transfer member (440) in a horizontal direction, the heat dissipation performance of the printed circuit board assembly (1200) can be improved.

[0167] According to an example, the cover portions (1231b, 1231c) may include a shielding layer (1231b). The shielding layer (1231b) may be disposed below the heat transfer layer (1231c). Contrary to the illustration, the shielding layer (1231b) may also be disposed above the heat transfer layer (1231c). The shielding layer (1231b) may have a thermal conductivity of, for example, 300 to 400 W / mK, but is not limited thereto. The shielding layer (1231b) may have a relatively low thermal conductivity compared to, for example, the heat transfer layer (1231c). The shielding layer (1231b) may include, for example, copper, but is not limited thereto. According to an example, the heat transfer layer (1231c) and the shielding layer (1231b) can be formed by combining them.

[0168] According to one example, the support member (1231a) may be provided to support the cover members (1231b, 1231c). The support member (1231a) may form a side or a side surface of the first shielding member (1231). The support member (1231a) may be positioned between the PCB (410) and the cover members (1231b, 1231c). The support member (1231a) may include an opening with an open top. The cover members (1231b, 1231c) may be positioned to cover the opening. The support member (1231a) may be configured to shield electromagnetic waves generated from a plurality of first electronic components (421).

[0169] According to one example, the cover portions (1231b, 1231c) may be formed to extend from the upper surface of the first shielding member (1231). The cover portions (1231b, 1231c) may be formed to extend outward from the upper portion of the support portion (1231a). The width of the cover portions (1231b, 1231c) may be relatively larger than the horizontal width formed by the support portion (1231a). The cover portions (1231b, 1231c) may be configured to cover at least a portion of at least one second shielding member (432) among the plurality of adjacent second shielding members (432). The cover portions (1231b, 1231c) may be configured to cover at least a portion of the first shielding member (1231) and at least one second shielding member (432).

[0170] According to one example, the heat transfer layer (1231c) and the shielding layer (1231b) of the cover portions (1231b, 1231c) may be formed to extend from the upper surface of the first shielding member (1231). The combined heat transfer layer (1231c) and the shielding layer (1231b) may extend outward from the upper portion of the support portion (1231a) to cover at least a portion of the upper surface of at least one second shielding member (432) among the plurality of surrounding second shielding members (432).

[0171] For example, heat generated from the main heating element of the third electronic component (423) may be diffused to a first heat diffusion path (P1) and a third heat diffusion path (P3). The first heat diffusion path (P1) may include, for example, a path along which heat generated from the main heating element sequentially passes through the second heat transfer member (450) and the third shielding member (433) and diffuses to the outside.

[0172] For example, the third heat diffusion path (P3) may include a path along which heat generated from the main heating element sequentially passes through the PCB (410), the first heat transfer member (440), and the first shielding member (1231) and diffuses to the outside. The third heat diffusion path (P3) may include, for example, a path along which heat is transferred from the main heating element to the PCB (410) and the first heat transfer member (440), and through which heat from the first heat transfer member (440) diffuses horizontally through the cover portions (1231b, 1231c) of the first shielding member (1231). The heat transferred from the main heating element may diffuse horizontally, for example, by the heat transfer layer (1231c) of the cover portions (1231b, 1231c). Here, the horizontal direction may refer to a plane direction of the cover portions (1231b, 1231c). The cover portions (1231b, 1231c) extended to cover at least one adjacent second shielding member (432) can provide a third heat diffusion path (P3) that is wider than the second heat diffusion path (P2) of FIG. 5. By expanding the area of ​​the cover portions (1231b, 1231c), the printed circuit board assembly (1200) can be more efficiently heat dissipated. In the present disclosure, in addition to the first heat diffusion path (P1), the third heat diffusion path (P3) is additionally configured to improve the heat dissipation performance of the main heating element.

[0173] FIG. 14 is a cross-sectional view of a printed circuit board assembly according to one embodiment.

[0174] FIG. 14 may be a cross-sectional view taken along line BB' of the printed circuit board assembly (1200) of FIG. 12. The drawing illustrated in FIG. 14 is schematically illustrated for convenience of explanation, and the scope of the present disclosure is not limited to the illustrated form.

[0175] Among the configurations illustrated in FIG. 14, the same reference numbers are used for configurations that are substantially the same or similar to the configuration of the printed circuit board assembly (400) illustrated in FIG. 5.

[0176] The embodiment of Fig. 14 can be optionally combined with the embodiments of Figs. 4 to 13. The embodiment of Fig. 14 can be optionally combined with the embodiments of Figs. 15 and 16.

[0177] Referring to FIG. 14, the printed circuit board assembly (1200-1) may include a first shielding member (1231).

[0178] According to an example, the first shielding member (1231) may include a support member (1231a) and a cover member (1231b-1, 1231c-1). The support member (1231a) and the cover member (1231b-1, 1231c-1) may be configured to protect a plurality of first electronic components (421) arranged within the first shielding member (1231) from external impact and to efficiently dissipate heat.

[0179] According to an example, the cover portion (1231b-1, 1231c-1) may be configured to be heat-compressible. The cover portion (1231b-1, 1231c-1) may have a non-restorable property of not returning to its original shape after thermal deformation. When heat above a predetermined temperature is applied to the cover portion (1231b-1, 1231c-1), the cover portion (1231b-1, 1231c-1) may be plastically deformed. The cover portion (1231b-1, 1231c-1) may have both shielding and heat dissipation functions.

[0180] In one example, the cover portion (1231b-1, 1231c-1) may include a heat transfer layer (1231c-1). The heat transfer layer (1231c-1) may form, for example, an upper surface of the cover portion (1231b-1, 1231c-1). The heat transfer layer (1231c-1) may have, for example, a thermal conductivity of up to 1400 W / mK, but is not limited thereto. In one example, the heat transfer layer (1231c-1) may be, but is not limited thereto, a graphite sheet.

[0181] For example, the heat transfer layer (1231c-1) can disperse heat transferred from the first heat transfer member (440) in a horizontal direction. By re-dispersing heat transferred vertically from the third electronic component (423) to the first heat transfer member (440) in a horizontal direction, the heat dissipation performance of the printed circuit board assembly (1200-1) can be improved.

[0182] According to an example, the cover portions (1231b-1, 1231c-1) may include a shielding layer (1231b-1). The shielding layer (1231b-1) may be disposed below the heat transfer layer (1231c-1). Contrary to the drawing, the shielding layer (1231b-1) may also be disposed above the heat transfer layer (1231c-1). The shielding layer (1231b-1) may have a thermal conductivity of, for example, 300 to 400 W / mK, but is not limited thereto. The shielding layer (1231b-1) may have a relatively low thermal conductivity compared to, for example, the heat transfer layer (1231c-1). The shielding layer (1231b-1) may include, for example, copper, but is not limited thereto. According to an example, the heat transfer layer (1231c-1) and the shielding layer (1231b-1) can be formed by combining them.

[0183] According to an example, the support member (1231a) may be provided to support the cover members (1231b-1, 1231c-1). The support member (1231a) may form a side or a side surface of the first shielding member (1231). The support member (1231a) may be arranged between the PCB (410) and the cover members (1231b-1, 1231c-1). The support member (1231a) may include an opening with an open top. The cover members (1231b-1, 1231c-1) may be arranged to cover the opening. The support member (1231a) may be configured to shield electromagnetic waves generated from a plurality of first electronic components (421).

[0184] According to one example, the cover portions (1231b-1, 1231c-1) may be formed to extend from the upper surface of the first shielding member (1231). The area of ​​the cover portions (1231b-1, 1231c-1) may be relatively larger than the horizontal area formed by the support portion (1231a). The cover portions (1231b-1, 1231c-1) may be configured to cover at least a portion of at least one second shielding member (432) among the adjacent plurality of second shielding members (432). The cover portions (1231b-1, 1231c-1) may be configured to cover at least a portion of the first shielding member (1231) and at least one second shielding member (432).

[0185] According to one example, the heat transfer layer (1231c-1) of the cover portion (1231b-1, 1231c-1) may be formed to extend from the upper surface of the first shielding member (1231). The size of the heat transfer layer (1231c-1) may be larger than the size of the shielding layer (1231b-1). The heat transfer layer (1231c-1) may be arranged to extend outward with respect to the shielding layer (1231b-1). Among the combined heat transfer layer (1231c-1) and shielding layer (1231b-1), only the heat transfer layer (1231c-1) may extend outward from the upper portion of the support portion (1231a) to cover at least a portion of the upper surface of at least one second shielding member (432) among the plurality of surrounding second shielding members (432). Unlike the embodiment shown in FIG. 13, in the embodiment of FIG. 14, the shielding layer (1231b-1) can be placed only on the upper portion of the support (1231a).

[0186] For example, heat generated from the main heating element of the third electronic component (423) may be diffused to a first heat diffusion path (P1) and a third heat diffusion path (P3). The first heat diffusion path (P1) may include, for example, a path along which heat generated from the main heating element sequentially passes through the second heat transfer member (450) and the third shielding member (433) and diffuses to the outside.

[0187] For example, the third heat diffusion path (P3) may include a path along which heat generated from the main heating element sequentially passes through the PCB (410), the first heat transfer member (440), and the first shielding member (1231) and diffuses to the outside. The third heat diffusion path (P3) may include, for example, a path along which heat is transferred from the main heating element to the PCB (410) and the first heat transfer member (440), and the heat of the first heat transfer member (440) diffuses horizontally through the cover portions (1231b-1, 1231c-1) of the first shielding member (1231). The heat transferred from the main heating element may be diffused horizontally by, for example, the heat transfer layer (1231c-1) of the cover portions (1231b-1, 1231c-1). Here, the horizontal direction may refer to the plane direction of the cover portions (1231b-1, 1231c-1). The cover portions (1231b-1, 1231c-1) (particularly the heat transfer layer (1231c-1)) extended to cover at least one adjacent second shielding member (432) may provide a third heat diffusion path (P3) that is wider than the second heat diffusion path (P2) of FIG. 5. By expanding the area of ​​the heat transfer layer (1231c-1), the printed circuit board assembly (1200-1) may be heat dissipated more efficiently. In the present disclosure, the heat dissipation performance of the main heating element may be improved by additionally configuring the third heat diffusion path (P3) in addition to the first heat diffusion path (P1).

[0188] FIG. 15 is a cross-sectional view of a printed circuit board assembly according to one embodiment.

[0189] Among the configurations illustrated in FIG. 15, the same reference numbers are used for configurations that are substantially the same or similar to the configuration of the printed circuit board assembly (400) illustrated in FIG. 5.

[0190] The embodiment of Fig. 15 can be optionally combined with the embodiments of Figs. 4 to 14. The embodiment of Fig. 15 can be optionally combined with the embodiment of Fig. 16.

[0191] Referring to FIG. 15, the printed circuit board assembly (1500) may further include a third heat transfer member (1510), a fourth heat transfer member (1520), and a rear cover (1530).

[0192] According to an example, the third heat transfer member (1510) may be disposed on the first shielding member (431). The third heat transfer member (1510) may be disposed to contact the upper surface of the first shielding member (431). The third heat transfer member (1510) may have, for example, a configuration substantially the same as or similar to that of the second heat transfer member (450).

[0193] According to an example, the fourth heat transfer member (1520) may be disposed on the third heat transfer member (1510). The fourth heat transfer member (1520) may be disposed to contact the upper surface of the third heat transfer member (1510). The fourth heat transfer member (1520) may include a metal material.

[0194] In one example, the rear cover (1530) may be arranged to cover the first shielding member (431), the third heat transfer member (1510), and the fourth heat transfer member (1520). The rear cover (1530) may be in contact with the fourth heat transfer member (1520). The rear cover (1530) may have a thermal conductivity similar to or lower than that of the first heat transfer member (440), the third heat transfer member (1510), or the fourth heat transfer member (1520). The rear cover (1530) may, for example, form an outermost portion of the electronic device (200) when the printed circuit board assembly (1500) is mounted on the electronic device (e.g., the electronic device (200) of FIG. 2A), or may be a configuration that is closest to the outermost portion of the electronic device (200).

[0195] For example, heat generated from the main heating element of the third electronic component (423) may be diffused to the first heat diffusion path (P1) and the fourth heat diffusion path (P4). The first heat diffusion path (P1) may include, for example, a path along which heat generated from the main heating element sequentially passes through the second heat transfer member (450) and the third shielding member (433) and diffuses to the outside.

[0196] According to an example, the fourth heat diffusion path (P4) may include a path along which heat generated from the main heating element sequentially passes through the PCB (410), the first heat transfer member (440), the first shielding member (1231), the third heat transfer member (1510), the fourth heat transfer member (1520), and the rear cover (1530) to diffuse to the outside. The fourth heat diffusion path (P4) may include, for example, a path along which heat is transferred from the main heating element to the PCB (410) and the first heat transfer member (440), and the heat of the first heat transfer member (440) passes through the first shielding member (1231) to diffuse to the outside through the third heat transfer member (1510), the fourth heat transfer member (1520), and the rear cover (1530). The heat transferred from the main heating element may, for example, diffuse along the surface of the rear cover (1530).

[0197] FIG. 16 is a cross-sectional view of a printed circuit board assembly according to one embodiment.

[0198] Among the configurations illustrated in FIG. 16, the same reference numbers are used for configurations that are substantially the same or similar to the configuration of the printed circuit board assembly (400) illustrated in FIG. 5.

[0199] The embodiment of FIG. 16 can be optionally combined with the embodiments of FIGS. 4 to 15.

[0200] Referring to FIG. 16, the printed circuit board assembly (1600) may include a first shielding member (431-1).

[0201] In one example, the first shielding member (431-1) may include a support member (4311) and a cover member (4312-1). In one example, the cover member (4312-1) may be formed such that at least a portion thereof protrudes upward. Here, the upward portion may refer to a direction from the cover member (4312-1) toward the third heat transfer member (1610). In order to secure a heat transfer path by bringing the cover member (4312-2) into contact with another heat transfer member (e.g., the third heat transfer member (1610) or the rear cover (1620)), the shape of the cover member (4312-1) may be intentionally made to protrude.

[0202] According to an example, the cover portion (4312-1) may include a shielding layer (4312a-1) and a heat transfer layer (4312b-1). For example, the shielding layer (4312a-1) may be formed so that at least a portion thereof protrudes upward. For example, the heat transfer layer (4312b-1) may be formed so that at least a portion thereof protrudes upward.

[0203] According to one example, the printed circuit board assembly (1600) may further include a third heat transfer member (1610) and a rear cover (1620).

[0204] According to an example, the third heat transfer member (1610) may be disposed on the first shielding member (431). The third heat transfer member (1610) may be disposed to contact the upper surface of the first shielding member (431). The third heat transfer member (1610) may have, for example, a configuration substantially identical or similar to that of the second heat transfer member (450).

[0205] In one example, the rear cover (1620) may be positioned to cover the first shielding member (431) and the third heat transfer member (1610). The rear cover (1620) may be in contact with the third heat transfer member (1610). The rear cover (1620) may have a thermal conductivity similar to that of the first heat transfer member (440) or the third heat transfer member (1610).

[0206] For example, heat generated from the main heating element of the third electronic component (423) may be diffused to the first heat diffusion path (P1) and the fifth heat diffusion path (P5). The first heat diffusion path (P1) may include, for example, a path along which heat generated from the main heating element sequentially passes through the second heat transfer member (450) and the third shielding member (433) and diffuses to the outside.

[0207] For example, the fifth heat diffusion path (P5) may include a path along which heat generated from the main heating element sequentially passes through the PCB (410), the first heat transfer member (440), the first shielding member (431-1), the third heat transfer member (1610), and the rear cover (1620) to diffuse to the outside. The fifth heat diffusion path (P5) may include, for example, a path along which heat is transferred from the main heating element to the PCB (410) and the first heat transfer member (440), and the heat of the first heat transfer member (440) passes through the first shielding member (431-1) to the third heat transfer member (1610), and the rear cover (1620) to diffuse to the outside. The heat transferred from the main heating element may, for example, diffuse along the surface of the rear cover (1620).

[0208] A printed circuit board assembly (400) according to one embodiment may include a PCB (410), a plurality of electronic components (420) configured to be mounted on a first surface (410a) of the PCB (410), a first shielding member (431) configured to cover the plurality of electronic components (420), and a heat transfer member (440) accommodated within the first shielding member (431), at least a portion of which is disposed in a space formed between the plurality of electronic components (420), and configured to be thermally deformable.

[0209] According to one embodiment, the heat transfer member (440) may be configured to have a glass transition temperature of 40 degrees Celsius or higher.

[0210] According to one embodiment, the printed circuit board assembly (400) may further include a main heating element (423) mounted on a portion corresponding to the heat transfer member (440) on a second surface (410b) of the PCB (410) opposite the first surface (410a).

[0211] According to one embodiment, the first shielding member (431) may include a graphite sheet forming at least a portion of the upper surface.

[0212] According to one embodiment, the printed circuit board assembly (400) may further include at least one second shielding member (432) disposed around the first shielding member (431). The graphite sheet may be configured to extend from an upper surface of the first shielding member (431) to cover the at least one second shielding member (432).

[0213] According to one embodiment, the heat transfer member (440) may include a rubber material.

[0214] According to one embodiment, the heat transfer member (440) may include a phase change material (PCM).

[0215] An electronic device according to one embodiment may include a housing (210), a display (201), and a printed circuit board assembly (400) disposed within the housing (210). The printed circuit board assembly (400) may include a PCB (410), a plurality of electronic components (420) mounted on a first surface (410a) of the PCB (410), a first shielding member (431) provided to cover the plurality of electronic components (420), and a heat transfer member (440) accommodated within the first shielding member (431), at least a portion of which is disposed in a space formed between the plurality of electronic components (420), and configured to be thermally deformable.

[0216] According to one embodiment, the heat transfer member (440) may have a glass transition temperature of 40 degrees Celsius or higher.

[0217] According to one embodiment, the PCB (410) may further include a main heating element mounted on a portion corresponding to the heat transfer member (440) on a second surface (410b) opposite to the first surface (410a).

[0218] According to one embodiment, the first shielding member (431) may include a graphite sheet forming at least a portion of the upper surface.

[0219] According to one embodiment, the printed circuit board assembly (400) may further include at least one second shielding member (432) disposed around the first shielding member (431).

[0220] An electronic device, wherein the graphite sheet is configured to extend from the upper surface of the first shielding member (431) and cover the at least one second shielding member (432).

[0221] According to one embodiment, the heat transfer member (440) may include a rubber-based material.

[0222] According to one embodiment, the heat transfer member (440) may include a phase change material (PCM) series material.

[0223] According to one embodiment, the first side (410a) may be a side facing the display (201).

[0224] A method for manufacturing a printed circuit board assembly according to one embodiment may include a step of placing a heat transfer member (440) configured to be thermally deformable on a plurality of electronic components (420) mounted on a PCB (410), a step of placing a first shielding member (431) to cover the heat transfer member (440) and the plurality of electronic components (420), and a step of applying pressure to the first shielding member (431) by an upper jig including a heating block.

[0225] According to one embodiment, the glass transition temperature of the heat transfer member (440) may be 40 degrees Celsius or higher.

[0226] In one embodiment, the heating block is at 125 to 135 degrees, and the upper jig can pressurize the first shielding member (431) for 5 seconds or more.

[0227] According to one embodiment, in the process of covering the heat transfer member (440) and the plurality of electronic components (420), the first shielding member (431) may be configured such that a portion of the upper surface of the first shielding member (431) protrudes upward.

[0228] According to one embodiment, when the upper surface of the first shielding member (431) is pressed by the heating block, the protruding portion of the upper surface of the first shielding member (431) is pressed, and the heat transfer member (440) can permeate into the space between the plurality of electronic components (420).

[0229] The terminology used herein is merely used to describe specific embodiments and is not intended to limit the present disclosure. For example, a singular element should be understood to include plural elements unless the context clearly indicates only a singular element. As used herein, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. It should be understood that the term "and / or" as used herein encompasses any and all possible combinations of one or more of the listed items. The terms "include," "have," "comprise," and the like used in this disclosure are intended to specify only the presence of a feature, component, part, or combination thereof described in this disclosure, and the use of these terms does not exclude the possibility of the presence or addition of one or more other features, components, parts, or combinations thereof. The expressions "first," "second," and the like used in this disclosure can modify various components regardless of order and / or importance, and are only used to distinguish one component from another, without limiting the components.

[0230] The expression "configured to" used in the present disclosure can be appropriately used interchangeably with, for example, "suitable for," "capable of," "designed to," "modified to," "made to," or "capable of." The term "configured to" may not necessarily mean only something "specially designed" in terms of hardware. Instead, in some situations, the expression "a device configured to" may mean that the device is "capable of" doing something together with other devices or components. For example, the phrase "a device configured (or set) to perform A, B, and C" may mean a dedicated device for performing the corresponding operations, or a general-purpose device that can perform various operations including the corresponding operations.

[0231] Meanwhile, the terms “upper side,” “lower side,” and “front-rear direction” used in the present disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0232] Although the foregoing description in this disclosure has focused on specific embodiments, it should be understood that this disclosure is not limited to such specific embodiments, but rather encompasses various modifications, equivalents, and / or alternatives of the various embodiments.

Claims

1. PCB(410); A plurality of electronic components (420) configured to be mounted on the first surface (410a) of the above PCB (410); A first shielding member (431) configured to cover the above plurality of electronic components (420); and A printed circuit board assembly, comprising a heat transfer member (440) accommodated within the first shielding member (431), a portion of which is disposed in a space formed between the plurality of electronic components (420), and configured to be thermally deformable.

2. In paragraph 1, The above heat transfer member (440) is A printed circuit board assembly configured to have a glass transition temperature of greater than 40 degrees Celsius.

3. In paragraph 1 or 2, A printed circuit board assembly further comprising a main heating element (423) mounted on a portion corresponding to the heat transfer member (440) on a second surface (410b) opposite to the first surface (410a) of the PCB (410).

4. In one of paragraphs 1 to 3, It further includes at least one second shielding member (432) arranged around the first shielding member (431), The above first shielding member (431) is A printed circuit board assembly comprising a graphite sheet configured to extend from an upper surface of the first shielding member (431) and cover the at least one second shielding member (432).

5. In one of paragraphs 1 to 4, The above heat transfer member (440) is A printed circuit board assembly comprising at least one rubber material or a PCM (phase change material) family material.

6. In electronic devices, Housing (210); display (201); and Includes a printed circuit board assembly (400) placed within the housing (210), The above printed circuit board assembly (400) is PCB(410); A plurality of electronic components (420) mounted on the first surface (410a) of the above PCB (410); A first shielding member (431) provided to cover the above plurality of electronic components (420); and A heat transfer member (440) is accommodated in the first shielding member (431), at least a portion of which is disposed in a space formed between the plurality of electronic components (420), and configured to be thermally deformable. Electronic devices.

7. In paragraph 6, The above heat transfer member (440) is An electronic device having a glass transition temperature of greater than 40 degrees Celsius.

8. In paragraph 6 or 7, An electronic device further comprising a main heating element mounted on a portion corresponding to the heat transfer member (440) on a second surface (410b) opposite to the first surface (410a) of the PCB (410).

9. In one of paragraphs 6 to 8, The above first shielding member (431) is An electronic device comprising a graphite sheet.

10. In paragraph 9, The above printed circuit board assembly (400) is It further includes at least one second shielding member (432) arranged around the first shielding member (431), An electronic device, wherein the graphite sheet is configured to extend from the upper surface of the first shielding member (431) and cover the at least one second shielding member (432).

11. In one of the clauses 6 to 10, The above heat transfer member (440) is An electronic device comprising at least one of a rubber-based material or a PCM (phase change material)-based material.

12. A method for manufacturing a printed circuit board assembly, A process for placing a heat transfer member (440) configured to be thermally deformable on a plurality of electronic components (420) mounted on a PCB (410); A process of arranging a first shielding member (431) to cover the heat transfer member (440) and the plurality of electronic components (420); and A manufacturing method comprising a process in which an upper jig including a heating block pressurizes the first shielding member (431).

13. In paragraph 12, A manufacturing method wherein the glass transition temperature of the above heat transfer member (440) is 40 degrees Celsius or higher.

14. In paragraph 12 or 13, The above heating block is 125 to 135 degrees, A manufacturing method in which, in a process in which the upper jig pressurizes the first shielding member (431), the upper jig pressurizes the first shielding member (431) for 5 seconds or more.

15. In one of the clauses 12 to 14, In the process of covering the heat transfer member (440) and the plurality of electronic components (420) with the first shielding member (431), a portion of the upper surface of the first shielding member (431) is positioned to protrude upward. A manufacturing method in which, when the upper surface of the first shielding member (431) is pressurized by the heating block, the protruding portion of the upper surface of the first shielding member (431) is pressurized, causing the heat transfer member (440) to permeate into the space between the plurality of electronic components (420).

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