Computing heat driven sorption-based air-cooling systems and methods

Abstract

The present invention discloses a computing heat driven sorption-based cooling system, comprising: a computing unit, wherein the computing unit comprises a set of processing units configured to perform computing operation, and the set of processing units is operable to generate waste heat while performing the computing operation; a sorption-based cooling unit; and, a heat transfer unit configured to thermally couple the set of processing units and the sorption-based cooling unit, transferring the waste heat to the sorption-based cooling unit, wherein the sorption-based cooling unit is configured to cool ambient air within an indoor environment in which the sorption-based cooling unit resides by way of a sorption-based cooling process, wherein the waste heat produced by the set of processing units and transferred to the sorption-based cooling unit at least partially facilitate or drive the sorption-based cooling process. The present invention achieves efficient and sustainable cooling of processing units by not only removing waste heat from the processing units, but also further utilizing this waste heat to drive a sorption-based cooling process. The latter further cools the ambient environment around the processing units, making the invention particularly suitable for computing systems with small physical footprints over extended durations.

Description

DESCRIPTIONTITLE OF INVENTION: COMPUTING HEAT DRIVENSORPTION-BASED AIR-COOLING SYSTEMS AND METHODSREFERENCE TO RELATED APPLICATIONS

[0001] This application claims the priority to US provisional patent application No. 63 / 516,481 , filed on 28 July 2023, the contents of which are incorporated herein by reference.TECHNICAL FIELD

[0002] The present disclosure relates generally to the technical field of air-cooling systems and methods, particularly those that utilize sorption-based technologies.BACKGROUND

[0003] The following discussion of the background to the invention is intended to facilitate an understanding of the present invention only. It should be appreciated that the discussion is not an acknowledgement or admission that any of the material referred to was published, known or part of the common general knowledge of the person skilled in the art in any jurisdiction as at the priority date of the invention.

[0004] Because of ongoing technological advancement, computer systems have become vastly more computationally capable over time. Technological development has resulted in computer systems having increasingly powerful data processing / numerical computation capabilities and progressively smaller physical footprints over time, including generally small or small physical footprint yet computationally powerful computer systems. Accordingly, these modern computers can perform powerful data processing tasks while taking up less space, making them more convenient and adaptable to various environments where space might be a constraint.

[0005] Such computer systems often have multiple processing core processing units, which can efficiently or feasibly perform increasingly complex / computationally intensive computing operations (e.g., parallel computing operations and distributed computing operations). Computationally powerful yet reasonably or generally compact computer systems have become increasingly common in generally small or small-scaleenvironments, for instance, home / office environments, in recent years.

[0006] Unfortunately, while performing computationally intensive computing operations over significant periods of time (e.g., several or many minutes, hours, or days), the processing units of such computer systems generate significant amounts of byproduct or waste heat, and can also generate significant amounts of unwanted noise because of large cooling fan units configured to cool the processing units. Conventional methods focus on removing this waste heat to enable the computing units to operate continuously for extended periods, often using mechanical compression-based systems. However, these systems can incur high operational costs, primarily because the compression mechanisms require substantial external electricity. Additionally, the use of refrigerants such as chlorofluorocarbons (CFCs), hydrochlorofluorocarbons (HCFCs), and hydrofluorocarbons (HFCs) raises environmental concerns. Therefore, efforts have been made to utilize a sorption-based cooling process as an alternative for cooling heat generated by intensive computing operations. For example, the US patent document US20090244830A1 , titled “Systems and Methods for Cooling a Computing Component in a Computing Rack,” discloses a system for cooling computing components that includes a computing rack housing a plurality of computing components. In this system, the absorption of heat from a heat-absorbing plate causes the liquid coolant to boil and vaporize, thereby driving an absorption-based cooling process.

[0007] However, whether using mechanical compression-based systems or sorptionbased cooling systems, most conventional methods consider the heat generated from computing units as undesirable “waste” that must be eliminated, suppressed, or exhausted. These methods overlook the fact that the heat generated from these computing units could also be effectively recovered for productive and practical purposes. This need is particularly relevant in the types of environments where these computer systems are deployed, including computationally powerful computing systems with small physical footprints in small-scale environments. Of course, recovering this heat could also serve to cool the computing units and potentially reduce unwanted noise generation in these environments, thereby achieving multiple beneficial effects simultaneously.

[0008] Even for conventional systems that claim to harvest heat from computing units for productive uses (e.g., US patent document US201 10096503A1 , titled “Utilization of Data Center Waste Heat for Heat Driven Engine”), the design is often sophisticated,inflexible to implement, and challenging to maintain. Therefore, to effectively convert byproduct or waste heat into productive uses, the technical challenge lies in designing a system that is easy to implement and maintain, while also achieving high efficiency in harvesting heat from a large number of actively running processing units over an extended period.

[0009] In summary, there exists a need to develop an improved sorption-based air- cooling system to be driven by computationally powerful small physical footprint computing systems and alleviate at least one of the aforementioned problems.SUMMARY

[0010] Specifically, to address the above-mentioned technical problems, the present invention specifically uses the following technical solutions:

[0011] Accordingly, an aspect of the invention refers to a computing heat driven sorption-based cooling system, comprising: a computing unit, wherein the computing unit comprises a set of processing units configured to perform computing operation, and the set of processing units is operable to generate waste heat while performing the computing operation; a sorption-based cooling unit; and, a heat transfer unit configured to thermally couple the set of processing units and the sorption-based cooling unit, transferring the waste heat to the sorption-based cooling unit; wherein the sorption-based cooling unit is configured to cool ambient air within an indoor environment by way of a sorption-based cooling process, wherein the waste heat produced by the set of processing units and transferred to the sorption-based cooling unit at least partially facilitate or drive the sorption-based cooling process.

[0012] In some embodiments, the computing operation is selected from the group consisting of distributed computing operation, parallel computing operation, and any combination thereof.

[0013] In some embodiments, the computing operation is directed towards a computationally intensive task.

[0014] In some embodiments, the indoor environment is selected from the group consisting of a habitation, a residence, an office environment, a building, and any combination thereof.

[0015] In some embodiments, the residence is selected from the group consisting of a house, a townhouse, a duplex, a condominium, a flat, and an apartment; wherein the office environment is selected from the group consisting of a meeting room, a set of cubicles, a set of work stations, and a set of work spaces.

[0016] In some embodiments, the heat transfer unit comprises one or more components selected from the group consisting of: (a) a set of thermal coupler structures configured to be thermally coupled to the set of processing units and the sorption-based cooling unit, wherein the set of thermal coupler structures are configured to transfer the waste heat produced by the set of processing units to the sorption-based cooling unit; (b) a set of heat pipe structures configured to capture the waste heat produced by the set of processing units, and to transfer the waste heat towards the sorption-based cooling unit at least by way of two-phase heat transfer; and, (c) a fluidic circuit configured to comprise at least one fluid-carrying apparatus, wherein the at least one fluid-carrying apparatus is configured to carry a heat transfer fluid and thermally couple the heat transfer fluid to the set of processing units; wherein a heat transfer pump is configured to circulate the heat transfer fluid around the fluidic circuit.

[0017] In some embodiments, the at least one fluid-carrying apparatus comprises a heat transfer fluid reservoir configured to carry a reservoir volume of the heat transfer fluid.

[0018] In some embodiments, the heat transfer fluid reservoir is configured to carry the set of processing units therein such that the set of processing units is immersed in the reservoir volume.

[0019] In some embodiments, the at least one fluid-carrying apparatus comprises a set of fluid blocks, wherein each fluid block is configured to comprise a thermally conductive material, and wherein the each fluid block is configured to be structurally coupled to or mounted to the set of processing units.

[0020] In some embodiments, the fluidic circuit comprises a plurality conduits configured to carry a flow of the heat transfer fluid therein; wherein the plurality conduits comprise: a first conduit fluidically coupled to an output of the heat transfer fluid pump, and fluidically coupled to an input of the sorption-based cooling unit; a second conduit fluidically coupled to an output of the sorption-based cooling unit and an input of the heattransfer fluid reservoir and / or the set of fluid blocks; and, an intermediate conduit fluidically coupled to an output of the heat transfer fluid reservoir and / or the set of fluid blocks and an input of the heat transfer fluid pump.

[0021] In some embodiments, the set of thermal coupler structures and the set of heat pipe structures are configured to be interposed therebetween the set of processing units and the sorption-based cooling unit.

[0022] In some embodiments, the sorption-based cooling unit comprises an absorption cooling unit that is configured to internally carry a refrigerant.

[0023] In some embodiments, the refrigerant is a water - lithium bromide ( LiBr) pair.

[0024] In some embodiments, the absorption cooling unit comprises an absorption cooler generator, a condenser, an evaporator, an absorber, a solution pump, and a heat exchanger, which are configured to provide an absorption cooling process.

[0025] In some embodiments, the condenser and the absorber are configured to reside in an outdoor environment, and other components of the absorption cooling unit are configured to reside in the indoor environment.

[0026] In some embodiments, the condenser and the absorber are configured to reside in the indoor environment, and the absorption cooling unit comprises a heat venting apparatus configured to transfer heat generated by the condenser and / or the absorber to an outdoor environment.

[0027] In some embodiments, the sorption-based cooling unit comprises an adsorption cooling unit configured for cooling ambient air by way of an adsorbent - adsorbate working pair by which an adsorption cooling process occurs; wherein the adsorbent - adsorbate working pair comprises an adsorbent and an adsorbate.

[0028] In some embodiments, the adsorbent is selected from a group consisting of silica gel, zeolite, and alumina; and the adsorbate is water.

[0029] In some embodiments, the adsorption cooling unit comprises: a first sealed chamber configured to house a first adsorber - desorber component and a first evaporator - condenser component; wherein the first adsorber - desorber component is configured to carry the adsorbent, and wherein the first sealed chamber is configured tocarry the adsorbate; and, a second sealed chamber configured to house a second adsorber - desorber component and a second evaporator - condenser component; wherein the second adsorber - desorber component is configured to carry the adsorbent, and wherein the second sealed chamber is configured to carry the adsorbate.

[0030] In some embodiments, the computing heat driven sorption-based cooling system further comprises: a hydraulic switching unit comprising a control unit, a plurality of hydraulic switches and a plurality of pumps; wherein the control unit is configured to either selectively or programmably, and either cyclically or recurrently exchange a fluid with the first adsorber - desorber component, the first evaporator - condenser component, the second adsorber - desorber component, and the second evaporator - condenser component; wherein the fluid is selected from the group consisting of heat transfer fluid, chilled water, and heat dissipation water.

[0031] In some embodiments, the computing heat driven sorption-based cooling system further comprises: a heat dissipation unit configured to carry a heat dissipation water and to reside in an outdoor environment; wherein the heat dissipation unit is configured to transfer heat associated with the adsorption cooling process; and an ambient air cooling unit configured to receive a chilled water and to produce cooled ambient air therefrom; and wherein the ambient air cooling unit is configured to reside in a generally small or small indoor environment.

[0032] In some embodiments, a heat dissipation unit is configured to reside in an outdoor environment, and the adsorption cooling unit is configured to reside in the indoor environment.

[0033] In some embodiments, the computing unit comprises a small physical footprint distributed computing unit.

[0034] In some embodiments, the small physical footprint distributed computing unit is configured to occupy a spatial volume between approximately 0.01 - 8.00 cubic meters.

[0035] In some embodiments, the set of processing units is configured to occupy a spatial volume of approximately 0.500, 0.250, or 0.125 cubic meters.

[0036] Another aspect of the invention refers to a computing heat driven sorption-based cooling method, based on the distributed computing heat driven sorption-based coolingsystem, comprising the following steps: (1 ) capturing a waste heat generated by a computing unit; and, (2) using the waste heat captured to facilitate a sorption-based cooling process, which is operable to cool an ambient air within an indoor environment.

[0037] In some embodiments, the sorption-based cooling process is either an absorption cooling process or an adsorption cooling process.

[0038] Other aspects and features of the present invention will become apparent to those of ordinary skill in the art upon review of the following description of specific embodiments of the invention in conjunction with the accompanying figures.BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In the figures, which illustrate, by way of non-limiting examples only, embodiments of the present invention,

[0040] [Fig. 1]: illustrates, using a block diagram, aspects or portions of a first distributed computing heat driven absorption cooling system in accordance with an embodiment of the present disclosure, which is configured for single effect absorption cooling.

[0041] [Fig. 2A] : illustrates, using a block diagram, aspects or portions of particular types of heat transfer unit configurations of distributed computing heat driven absorption cooling systems in accordance with certain embodiments of the present disclosure.

[0042] [Fig. 2B] : illustrates, using a block diagram, aspects or portions of particular types of heat transfer unit configurations of distributed computing heat driven absorption cooling systems in accordance with certain embodiments of the present disclosure.

[0043] [Fig. 2C]: illustrates, using a block diagram, aspects or portions of particular types of heat transfer unit configurations of distributed computing heat driven absorption cooling systems in accordance with certain embodiments of the present disclosure.

[0044] [Fig. 2D]: illustrates, using a block diagram, aspects or portions of particular types of heat transfer unit configurations of distributed computing heat driven absorption cooling systems in accordance with certain embodiments of the present disclosure.

[0045] [Fig. 3]: illustrates, using a block diagram, aspects or portions of a seconddistributed computing heat driven absorption cooling system, respectively, in accordance with certain embodiments of the present disclosure, which are configured for dual-effect absorption cooling.

[0046] [Fig. 4]: illustrates, using a block diagram, aspects or portions of a third distributed computing heat driven absorption cooling system, respectively, in accordance with certain embodiments of the present disclosure, which are configured for triple-effect absorption cooling.

[0047] [Fig. 5]: illustrates, using a block diagram, aspects or portions of a fourth distributed computing heat driven absorption cooling system in accordance with an embodiment of the present disclosure.

[0048] [Fig. 6 A]: illustrates, using a block diagram, aspects or portions of a distributed computing heat driven adsorption cooling system in accordance with an embodiment of the present disclosure.

[0049] [Fig. 6B]: illustrates, using a block diagram, aspects or portions of a distributed computing heat driven adsorption cooling system in accordance with an embodiment of the present disclosure.DETAILED DESCRIPTION

[0050] Throughout this document, unless otherwise indicated to the contrary, the terms “comprising”, “consisting of”, “having” and the like, are to be construed as non-exhaustive, or in other words, as meaning “including, but not limited to”.

[0051] Furthermore, throughout the document, unless the context requires otherwise, the word “include” or variations such as “includes” or “including” will be understood to imply the inclusion of a stated integer or group of integers but not the exclusion of any other integer or group of integers.

[0052] Unless defined otherwise, all other technical and scientific terms used herein have the same meaning as is commonly understood by a skilled person to which the subject matter herein belongs.

[0053] Overview

[0054] Embodiments in accordance with the present disclosure are directed to temperature alteration, management, or control systems and methods, which include or are ambient heat removal or air cooling / conditioning / chilling systems and methods involving:

[0055] (a) the production of thermal energy by at least one computing unit, for instance, byproduct or waste heat produced by way of a computing unit (e.g., where the computing unit can include or be a generally small or small physical footprint I portable distributed and / or parallel computing unit) during the performance of computational operations by the computing unit; and

[0056] (b) the provision, application, delivery or transfer of at least some of such waste heat, to a thermal energy driven air cooling / conditioning / chilling unit by way of at least one heat transfer apparatus, unit, structure, or element corresponding to, coupling, and / or operating between the computing unit and the thermal energy driven air cooling / conditioning / chilling unit,

[0057] wherein such systems and methods are specifically configured to cool ambient air within at least portions of one or more indoor spatial environments, and include components or elements intended to be deployed in portions of such indoor spatial environments (e.g., at least for cooling ambient air therein).

[0058] Such indoor spatial environments can include or be (but are not limited to) moderately small, generally small, or small-scale spatial environments, such as but not limited to:

[0059] (i) a moderately small, generally small, or small scale residential spatial environment such as a room or a plurality of adjacent rooms or habitation / living spaces configurable or configured for direct air circulation therebetween within a residential home, townhouse, duplex, condominium, flat, or apartment (e.g., a family dwelling, such as a single-family home); or

[0060] (ii) a moderately small, generally small, or small scale commercial spatial environment such as a meeting room in an office / workplace; a work space / desk / station or cubicle or a plurality of adjacent work spaces / desks / stations or cubicles configurable or configured for direct air circulation thereacross within an office / workplace; or a room ora plurality of rooms or adjacent physical spaces configurable or configured for direct air circulation therebetween within a retail shop or hotel.

[0061] In accordance with multiple embodiments of the present disclosure, a computing unit is not specifically limited or restricted to a moderately small, generally small, or small physical footprint / portable distributed and / or parallel computing unit; however, for purposes of brevity and simplicity, the description below primarily considers embodiments in which the computing unit is a generally small or small physical footprint / portable distributed and / or parallel computing unit.

[0062] Additionally, in accordance with multiple embodiments of the present disclosure, an indoor spatial environment in which ambient air is to be cooled is not limited to a moderately small, generally small, or small scale indoor spatial environment; however, for purpose of brevity and simplicity, the description below primarily considers embodiments in which the indoor spatial environment is a generally small or small-scale spatial environment such as set forth above.

[0063] In the description that follows, for purpose of brevity and simplicity: the term “cooling / conditioning / chilling” can be referred to as “cooling”; the term “thermal energy driven” can be referred to as “heat driven”; and the term “apparatus, unit, structure, or element” can be referred to or defined as “unit”.

[0064] Additionally, in the description that follows, the term “generally small or small physical footprint / generally portable or portable computing unit” can be referred to or defined as “generally small or small scale distributed / paral lei computing unit” or “generally small or small physical footprint distributed / parallel computing unit”. Furthermore, the term “distributed / parallel computing unit” can be referred to or defined as “distributed computing unit”, which can be understood to refer to a computing unit having a generally small or small physical footprint and configured to occupy a generally small or small spatial environment, which includes multiple local processing units and / or multiple processing cores configurable or configured to perform parallel computing operations, and which can be configured to operate as a particular computing node in a networkable or networked distributed computing system involving multiple or many computing nodes that are physically separate or remote from each other, and which cooperatively work on solving a given computing problem. Hence, a particular distributed computing unit can be configurable or configured to locally perform parallel computing operations by way of itsown local or built-in group of processing units / cores, and when the distributed computing unit operates as a particular node of a networked multi-node distributed computing system, such parallel computing capabilities can be utilized by this particular distributed computing node for locally performing distributed computing operations directed to solving the computing problem being worked on by the collection of networked distributed computing nodes. Distributed computing operations can include computing operations associated with or corresponding or directed to distributed computing processes such as (but not limited to) bitcoin or other digital asset mining; cryptocurrency mining; artificial intelligence (Al) and / or machine learning (ML) model training and applications; scientific / engineering computational modelling and / or discovery (e.g., relating to physics, electrical / computer engineering, chemistry, materials science, biosciences, geosciences, and / or other technological fields), video rendering and processing, computer gaming applications, and other applications.

[0065] Further to the foregoing, a distributed computing heat driven air cooling system in accordance with various embodiments of the present disclosure includes at least one generally small or small physical footprint distributed computing unit (e.g., a practically transportable, portable, or repositionable distributed computing unit, such as a small / home / personal bitcoin or cryptocurrency mining rig, or AI / ML platform or setup) configurable or configured to reside and operating near, in close proximity / next / adjacent to, or within a moderately small, generally small, or small scale spatial environment such as set forth above.

[0066] In a manner indicated above, the distributed computing unit includes a set of processing units (e.g., one or more general purpose and / or special purpose data processing / numerical computation units, which can include multiple processing cores) configurable or configured to perform computing operations, such as or including computationally-intensive operations or numerical calculations, for instance, corresponding to distributed computing processes (e.g., blockchain based cryptocurrency mining). The set of processing units can thus generate significant amounts of heat while performing computing operations.

[0067] In some embodiments, the set of processing units is coupled (e.g., thermally coupled) to a heat driven air cooling unit by way of at least one heat transfer unit. The heat transfer unit includes at least one thermal coupler configured to transfer, convey,transport, or carry at least some heat, and preferably or ideally significant amounts or a significant or large percentage of heat, produced by the set of processing units to one or more portions (e.g., a particular portion) of the heat driven air cooling unit. The heat driven air cooling unit is configurable or configured to remove heat from ambient air within portions of the aforementioned generally small or small-scale spatial environment in a manner that is correlated with or which corresponds to the amount of heat transferred from the set of processing units to the heat driven air cooling unit by way of the heat transfer unit’s thermal coupler.

[0068] In view of the foregoing, a distributed computing heat driven air cooling system is typically or specifically intended to be configurable or configured to recover at least some heat (e.g., byproduct or waste heat) produced by the processing unit(s) of a generally small or small physical footprint distributed cooling unit, and convert at least some of such recovered heat to cooled ambient air by way of the heat driven air cooling unit. It can be noted that by itself, a distributed computing heat driven air cooling system in accordance with an embodiment of the present disclosure is not specifically intended or configured for or capable of recovering the majority of byproduct or waste heat energy produced by an industrial / large scale product manufacturing process.

[0069] In various embodiments, the heat driven air cooling unit is configurable or configured to remove heat from (or analogously, producing a temperature reduction / drop or providing a cooling effect in) a given spatial volume or environment by way of a sorption-based process (e.g., absorption-based and adsorption-based processes), rather than by way of a mechanical compression process. Thus, the heat driven air cooling unit includes or is a sorption-based air-cooling unit. A system in accordance with embodiments of the present disclosure therefore does not require or omits or excludes a conventional mechanical compressor. Hence, a system in accordance with an embodiment of the present disclosure need not be or is not configured to remove heat by way of a conventional mechanical compressor driven vapor compression refrigeration (VCR) cycle.

[0070] As described in detail below, in various embodiments a sorption-based air- cooling unit includes or is an absorption cooling unit, which depending upon embodiment details can be configurable or configured for single effect absorption cooling or multiple effect absorption cooling. In some embodiments, a sorption-based cooling unit includesor is an adsorption cooling unit, as also described in detail below. Aspects of particular non-limiting representative embodiments of distributed computing heat driven sorptionbased air-cooling systems, apparatuses / units, devices, methods, and processes in accordance with the present disclosure are described below with respect to FIGs. 1 - 6B.

[0071] Representative Aspects of Distributed Computing Heat DrivenAbsorption Cooling Systems

[0072] FIGs. 1 - 5 are block diagrams showing portions of distributed computing heat driven absorption cooling systems 100 in accordance with certain representative embodiments of the present disclosure. In particular, FIG. 1 and FIG. 5 are block diagrams showing portions of a first distributed computing heat driven absorption cooling system 100a and a fourth distributed computing heat driven absorption cooling system 100d, respectively, configured for single effect absorption cooling; and FIGs. 3 and 4 are block diagrams of second and third distributed computing heat energy driven absorption cooling systems 100b,c, respectively, configured for multiple effect absorption cooling. More specifically, FIG. 3 is a block diagram of a second system 100b configured for double effect absorption cooling; and FIG. 4 is a block diagram of a third system 100c configured for triple effect absorption cooling 100c. It can be noted that with respect to single effect absorption cooling, embodiments in accordance with the present disclosure are not limited to the specific embodiments shown in FIG. 1 and FIG. 5. It can also be noted that with respect to multiple effect absorption cooling, embodiments in accordance with the present disclosure are not limited to the specific embodiments shown in FIGs. 3 and 4, and are not limited to double effect or triple effect absorption cooling.

[0073] In various embodiments, each system 100 shown in FIGs. 1 , 3, 4, and 5 includes a plurality of fluidically coupled components, including at least an absorber 110, a solution pump 120, a first or high temperature heat exchanger 130, a distributed computing generator 200, a first pressure reduction device 140 (which in certain embodiments can be optional), a condenser 150, a second pressure reduction device 145, and an evaporator 170.

[0074] Each of such systems 100 internally carries a refrigerant - absorbent working pair by which heat driven absorption cooling can occur in accordance with a closed-loop cycle, as individuals having ordinary skill in the relevant art will comprehend. In various or many representative implementations, the refrigerant - absorbent working pair is awater - lithium bromide (LiBr) pair (e.g., in which water serves a dual role as the refrigerant as well as a solvent for the LiBr). The refrigerant - absorbent working pair can also be described as the absorbate - absorbent working pair, wherein the absorbent (e.g., LiBr) absorbs the absorbate (e.g., water) to generate the absorption solution.

[0075] Systems 100 configured for heat-driven absorption cooling using a water-LiBr working pair are designed to operate at internal pressures significantly below atmospheric pressure. These pressures range from approximately 1 / 100 atmospheric pressure (about 1 ,013.25 Pa or 0.01 atm) to approximately 1 / 10 atmospheric pressure (about 10,132.5 Pa or 0.10 atm), and can even go up to approximately 1 / 2 atmospheric pressure (about 50,662.5 Pa or 0.50 atm), in a manner that individuals having ordinary skill in the relevant art will also comprehend. The low internal pressure enhances the refrigerant's (e.g., water) evaporation efficiency, allowing it to effectively mix with and be absorbed by the corresponding absorbent (e.g., lithium bromide, LiBr).

[0076] Notwithstanding the foregoing, embodiments of the distributed computing heat- driven absorption cooling systems in accordance with the present disclosure are not limited to a water-LiBr working pair. The internal system pressures and operational characteristics can vary depending on the specific type of refrigerant-absorbent working pair used, such as an ammonia-water working pair. Other possible refrigerant-absorbent working pairs are summarized in Table 1 below. Merely for simplicity and to aid understanding, the non-limiting representative embodiments of distributed computing heat energy-driven absorption cooling systems described herein consider the refrigerantabsorbent working pair to be water-LiBr.

[0077] Table.1 Possible Refrigerant - Absorbent Working Pairs

[0078] Relative to fluidic couplings between the aforementioned components, the absorber 110 includes an output fluidically coupled or connected to an input of the solution pump 120, which includes an output fluidically coupled to a first input of the first heat exchanger 120. The first heat exchanger 120 includes a first output fluidically coupled to an input of the distributed computing generator 200, which includes a first output fluidically coupled to an input of the first pressure reduction device 140, which itself includes an output coupled to a second input of the first heat exchanger 130. The first heat exchanger 130 also includes a second output fluidically coupled to a first input of the absorber 1 10.

[0079] The distributed computing generator 200 also includes a second output fluidically coupled to an input of the condenser 150, which includes an output fluidically coupled to an input of the second pressure reduction device 145. The second pressure reduction device 145 includes an output fluidically coupled to an input of the evaporator 170, which includes an output fluidically coupled to a second input of the absorber 1 10. The second pressure reduction device 145 improves the operational efficiency of the cooling system by regulating the pressure within the fluidic circuit, particularly between the condenser 150 and the evaporator 170. This regulation allows the liquid water to more effectively transform into water vapor, thereby enhancing the efficiency of the evaporator 170 and its effective absorption of ambient heat.

[0080] The absorber 110 includes an internal chamber 112 configured to hold a volume of water - LiBr solution at a first temperature and a first pressure (well below the atmospheric pressure), which are respectively lower than a second temperature and a second pressure associated with or corresponding to the absorption cooler generator’s 260 internal chamber 262, wherein the absorption cooler generator 260 is part of the Distributed computing generator 200. As described below, maintaining a relatively lower first temperature and first pressure in the absorber 1 10 facilitates the absorption of waterinto the LiBr solution, improving the efficiency of water evaporation in the absorber 110 and, consequently, the absorption process of water into the LiBr solution. This enhances the efficiency of generating the weak water-LiBr solution inside the absorber 1 10, helpful for maintaining the continuous operation of the cooling system of the present invention.

[0081] The solution pump 120 is configured to pump water - LiBr solution from the absorber’s internal chamber 112 into a portion of the distributed computing generator 200, such that the distributed computing generator 200 can transfer distributed computing unit heat (e.g., byproduct or waste heat generated from the computing operations) to the water - LiBr solution therein, as further detailed below.

[0082] The distributed computing generator 200 is configured to perform computing operations, including, for instance, computationally-intensive computing operations (e.g., computationally-intensive distributed computing operations); produce heat, including by way of performing computing operations, where such heat can include, be defined as, or is distributed computing byproduct or waste heat; and transfer, deliver, or apply at least some of such produced heat into a volume of water - LiBr solution contained in or carried by a portion of the distributed computing generator 200 in a manner that can facilitate or at least partially activate, drive, or maintain an absorption-based cooling process within the system 100.

[0083] In the systems of FIGs. 1 , 3, 4, and 5, the absorber 110 is essentially configured to allow the water to be absorbed to the LiBr to generate the weak water - LiBr solution, which will be pumped into the first heat exchanger 130, and then to Distributed Computing generator 200.

[0084] FIGs. 2A, 2B, 2C, and 2D are block diagrams showing portions of distributed computing generators 200 in accordance with particular embodiments of the present disclosure. More particularly, FIGs. 2A, 2B, 2C, and 2D are block diagrams showing portions of a first, a second, a third, and a fourth distributed computing generator 200a,b,c,d, respectively, in accordance with particular embodiments of the present disclosure. It can be noted that in certain embodiments, a distributed computing heat driven absorption cooling system 100 can include or combine components or elements from two or each of the first, second, third, and fourth distributed computing generators 200a,b,c,d.

[0085] In an embodiment, the distributed computing generator 200 includes a distributed computing unit 210; an absorption cooling generator 260; and at least one heat transfer unit 270 configurable or configured to transfer heat produced by portions of the distributed computing unit 210 to the absorption cooling generator 260.

[0086] As indicated above, the distributed computing unit 210 includes a set of processing units 220 (e.g., multi-core processing units) configurable or configured to executing program instructions, including program instructions corresponding to computing operations (e.g., numerical and logical operations). Depending upon embodiment details, the set of processing units 220 can include one or more Central Processing Units (CPUs), Graphical Processing Units (GPUs), Application Specific Integrated Circuit (ASIC) or Field Programmable Gate Array (FPGA) based processing units, and / or other types of processing units. Each processing unit within the set of processing units 220 generates heat when in an “on” or powered-up state, including a first amount of heat while in an idle state (e.g., no computing operation being actively executed), and a second larger or much larger amount of heat while in an active state processing / executing instructions and / or performing computing operations, such as computationally-intensive computing operations that can be associated with or correspond to distributed computing processes. In various embodiments, the set of processing units 220 can exhibit operating temperatures at one or more times between approximately 50 - 150°C or possibly higher temperatures, for instance, between approximately 60 - 135°C, or approximately 65 - 125°C, or approximately 65 - 95°C or 70 - 90°C, depending upon factors or parameters such as clocking or overclocking speed as well as computing operation load and time spent under such load. In a representative implementation, the set of processing units 220 can be generally similar or analogous to or based on one or more processing units of a bitcoin mining system such as a HeatBit One or HeatBit Mini system (www.heatbit.com or one.heatbit.com).

[0087] In various embodiments, the distributed computing unit 210 includes not only a set of processing units 220, but also includes at least one power supply, and typically further includes at least some of: one or more memories configurable or configured to store program instructions and data, which can include program instructions corresponding to an operating system (OS) and one or more application programs; a network interface unit by which the distributed computing unit 210 can be or is coupled wirelessly and / or by wire to one or more other computing devices and / or computer / datatransmission networks, such as the Internet, a Wide Area Network (WAN), a Local Area Network (LAN), a Personal Area Network (PAN), a cellular data network; and a set of user interface devices, for instance, including a set of user input devices (e.g., typically a keyboard and a mouse) and at least one user output device 216 (e.g., a computer display device or monitor). It is clear to a skilled person that while these additional components can assist users in controlling the cooling system of the present invention under certain circumstances, they are optional and can be omitted in situations where user interaction and control are not required.

[0088] Depending upon embodiment details, particular components or elements of the distributed computing unit 210 can be electrically coupled to yet physically separable / isolatable or separated / isolated from each other. For instance, the set of processing units 220 be carried by a first structure such as processing unit module 218, which can include or be a set of circuit boards / cards and / or a structural panel or first housing, and which is physically isolated / separated by way of a second structure such as at least a second housing from other components or elements of the distributed computing system 210. The first structure (e.g., processing unit module 218) is external to the second structure that carries one or more other components of the distributed computing unit 210. In some embodiments, particular components of the distributed computing unit 210 such as at least a power supply can reside in an auxiliary case or second housing 216 that is physically separated / isolated from and external to the first structure (e.g., the processing unit module 218) that carries the set of processing units 220. Notwithstanding, electrical components or elements of the distributed computing unit 210 can be electrically couplable or coupled to each other by way of a set of signal / data transfer lines (or wireless connection) 215, in a manner understood by individuals having ordinary skill in the relevant art.

[0089] Utilizing the second structure to separate the first structure (i.e. , the processing unit module 218) from the other components of the distributed computing system 210 offers technical advantages in environments with strict form factor requirements, such as homes, residential areas, and offices. This separation also helps meet other relevant requirements, such as minimizing electromagnetic radiation levels from the PSU and other PCBs within a certain space. The absorption cooling generator 260 includes or is a vessel having an internal or interior chamber 262, which provides a set of inputs and outputs that include the distributed computing generator’s input 264a, b, first output (i.e.,configured to connect directly to the absorber 110 or through the first pressure reduction device 140), and second output (i.e., configured to connect to the condenser 150) mentioned above with respect to the distributed computing generator’s fluidic couplings involving the absorber 110 and the condenser 150. The absorption cooling generator’s internal chamber 262 is configured to carry a volume of water - LiBr solution, and in particular, a volume of water - LiBr solution that has been pumped into the absorption cooling generator 260 from an internal chamber 1 12 of the absorber 1 10 by way of the solution pump 120. The absorption cooling generator 260 also includes a heating element 264 by which the volume of water - LiBr solution in its internal chamber 262 can be heated (e.g., by which heat originating from an external source can be transferred into the volume of water - LiBr solution). The absorption cooling generator’s heating element 264 can include or be a heat exchanger (e.g., a tubular coil heat exchanger), which can be carried within the absorption cooling generator’s internal chamber 264, or mounted to a bottom wall thereof.

[0090] The heat transfer unit 270 provides a thermal coupler (e.g., a set of heat transfer structures or elements) 274 by way of which heat produced by the set of processing units 220 is transferrable or transferred to the absorption cooling generator’s heating element 264, such that portions of the heat produced by the set of processing units 220 can be transferred to the volume of water - LiBr solution carried by the absorption cooling generator’s internal chamber 262 in a manner that facilitates or at least partially enables absorption based cooling by the system 100. In various embodiments, heat transfer from the set of processing units 220 to the volume of water - LiBr solution in the absorption cooling generator’s internal chamber 262 includes or occurs by way of fluid based or fluidic heat transfer involving a heat transfer fluid 290 having generally good to excellent thermal conductivity, so that the heat transfer fluid 290 can efficiently and effectively transfer the byproduct or waste heat captured from the set of processing units 220 to the absorption cooling generator's heating element 264. Depending upon embodiment details, the heat transfer fluid 290 can include or be water (e.g., liquid water alone, or liquid water that carries a one or more types of material compositions I particles having a high thermal conductivity, which can enhance heat transfer, such as microparticles or nanoparticles made of metal(s) or other substances); a hydrocarbon based coolant fluid (e.g., a liquid mineral oil, a natural I biological oil, or a synthetic oil); or a fluorocarbon based fluid (e.g., a specifically engineered fluorocarbon based liquid).According to the specific circumstances, the selection of the heat transfer fluid 290 could depend on factors such as its heat transfer efficiency, environmental impact, and costeffectiveness. In such embodiments, the heat transfer unit's thermal coupler 274 and the absorption cooling generator’s heating element 264 are fluidically and structurally coupled to each other, such as by way of fluid-tight fittings or seals. More particularly, the thermal coupler 274 includes or is a set of conduits, tubes, or pipes configured to carry a stream or flow of heat transfer fluid 290; and the absorption cooling generator's heating element 264 correspondingly includes or is a set of conduits, tubes, or pipes configured to carry the heat transfer fluid 290. In multiple embodiments, the thermal coupler 274 includes a first conduit 274a that is fluidically and structurally couplable or coupled to a heat transfer fluid input 264a of the absorption cooling generator’s heating element 264; and a second conduit 274b that is fluidically and structurally coupled to a heat transfer fluid output 264b of the absorption cooling generator’s heating element 264.

[0091] The heat transfer unit 270 includes a heat transfer fluid reservoir or tank 292 configured to provide a reservoir volume of heat transfer fluid 290, and includes a heat transfer fluid input or input port or coupler 292a by which the heat transfer fluid 290 can be introduced therein, and a heat transfer fluid output or output port or coupler 292b by which the heat transfer fluid 290 can be withdrawn therefrom, such as way of a heat transfer fluid pump 294 which is configured to actively pump the heat transfer fluid 290 out of the heat transfer fluid reservoir or tank 292. The heat transfer fluid pump 294 includes (i) a heat transfer fluid input 294a fluidically coupled to the heat transfer fluid reservoir 292, for instance, by way of an intermediate conduit 296; and (ii) a heat transfer fluid output 294b fluidically coupled to the thermal coupler’s first conduit 274a, through which the heat transfer fluid 290 can be transported to the heat transfer fluid input 264a of the absorption cooling generator’s heating element 264.

[0092] Heat transfer fluid 290 corresponding to, within, or obtained from the heat transfer fluid reservoir 290 is exposable or exposed to the set of processing units 220, such that heat produced by the set of processing units 220 can be transferred to portions of the heat transfer fluid 290. The heat transfer fluid pump 294 is configured to facilitate or provide a recirculating flow of the heat transfer fluid 290 along or around a fluidic circuit, for instance, which includes: (i)the heat transfer fluid reservoir 292; (ii) at least one heat absorption region, zone, area, or site corresponding to one or more locations at which the set of processing units 220 resides, and relative to which heat produced by the set ofprocessing units 220 can be transferred to the heat transfer fluid 290; (iii) an internal chamber and / or conduit of the heat transfer fluid pump 294; (iv) the thermal coupler’s first conduit 274a; (v) the absorption cooling generator heating element’s heat transfer fluid input 264a, heating element 264, and heat transfer fluid output 264b; and (vi) the thermal coupler’s second conduit 274b. The thermal coupler’s second conduit 274b can be fluidical ly coupled to the heat transfer fluid input 292a of the heat transfer fluid reservoir 292 for returning heat transfer fluid 290 thereto as part of the aforementioned fluidic circuit.

[0093] In some embodiments, particularly embodiments in which the heat transfer fluid 290 is not electrically conductive (e.g., the heat transfer fluid 290 is a mineral oil, natural / biological oil, or a synthetic oil), the heat transfer reservoir 292 is configured to accommodate or carry one or more portions of the distributed computing unit 210 including the set of processing units 220 therein, such as in a manner indicated in FIG. 2A. The set of processing units 220 is positioned within the heat transfer fluid reservoir 292 and immersed (e.g., directly immersed) in the heat transfer fluid 290 carried by the heat transfer fluid reservoir 292 (e.g., thus enabling “immersion cooling” of the set of processing units 220). Heat can thus be transferred, including directly transferred, from the set of processing units 220 into the heat transfer fluid 290 in the heat transfer fluid reservoir 292. The set of processing units 220 can be carried by or on a processing unit module 218, which includes or is one or more circuit boards / cards, such a main circuit board and / or one or more auxiliary circuit boards / cards (e.g., GPU boards / cards), the immersion of which in the heat transfer fluid 290 correspondingly immerses at least portions of the set of processing units 220 in the heat transfer fluid 290. The set of processing units 220 can be electrically coupled to other portions of the distributed computing unit 210 that reside external to the heat transfer fluid reservoir 292, such as by way of a set of signal / data transfer lines (or wireless connection) 215. Immersing the processing units 220 in the heat transfer fluid reservoir 292 can facilitate efficient heat harvest and transfer from the processing units 220 to the heat transfer fluid 290. This approach is suitable for processing units 220 of various forms and configurations, as the heat transfer fluid 290 can easily reach all parts of the processing units 220 immersed in the heat transfer fluid reservoir 292. Additionally or alternatively, as shown in FIG. 2B, the transfer of heat from the set of processing units 220 to the heat transfer fluid 290 can occur by way of one or more thermally conductive fluid blocks 278 (e.g., “water blocks”)structurally coupled or mounted to the set of processing units 220, which can be carried by a processing unit module 218 that includes or is a set of circuit boards and / or cards. The fluid blocks 278 are configured to absorb the byproduct or waste heat generated by the set of processing units 220. To facilitate the heat absorption, each fluid block 278 includes a highly thermally conductive material, for instance, a casing made of metal such as aluminium. This metal casing is able to absorb heat produced by the set of processing units 220, and is configured to contain the heat transfer fluid 290. The fluid block 278 can include a heat transfer fluid input 278a into which the heat transfer fluid 290 can flow; a heat transfer fluid output 278b out of which the heat transfer fluid 290 can flow; and a number of internal heat transfer structures, structural features or contours, elements, or passages (e.g., radiator-type metal fin structures) through which the heat transfer fluid 290 can flow after entering the fluid block’s heat transfer fluid input 278a, and by way of which heat produced by the set of processing units 220 can be transferred to the heat transfer fluid 290 prior to the heat transfer fluid 290 exiting the fluid block’s heat transfer fluid output 278b. In an embodiment such as shown in FIG. 2B, a fluid block’s heat transfer fluid input 278a can be fluidically coupled to the heat transfer fluid reservoir’s output 292a by way of a first intermediate conduit 296a, and the fluid block’s heat transfer fluid output 278b can be fluidically coupled to the heat transfer fluid pump’s input 294a by way of a second intermediate conduit 296b. Accordingly, in the embodiments of FIG. 2B, the circulation of the heat transfer fluid 290 is operated and maintained by the heat transfer fluid pump 294. This heat transfer fluid pump 294 is configured to direct the heat transfer fluid 290 out of the fluid block 278 via the heat transfer fluid output 278b and to draw the heat transfer fluid 290 from the heat transfer fluid reservoir 292 via the heat transfer fluid input 278a. Further additionally or alternatively, as shown in FIG. 2C, the transfer of heat from the set of processing units 220 to absorption cooling generator 260 can occur by way of a set of thermally conductive plates, bars, rods, sheets, and / or slats 297 that forms one or more portions of the heat transfer unit 270. The set of thermally conductive plates, bars, rods, sheets, and / or slats 297 is configured to accept, receive, or capture at least some (e.g., significant or large amounts of) byproduct or waste heat produced by the set of processing units 220, and transfer portions of such accepted, received, or captured byproduct or waste heat toward / to / into the absorption cooling generator 260 and / or the heating element 264 therein (and hence toward / to / into the water - LiBr solution within the absorption cooling generator’s internal compartment 262) by way of thermal conduction and / or thermal convection. The set of thermally conductive plates, bars, rods, sheets,and / or slats 297 can include or be formed of one or more types of high thermal conductivity metals and / or other high thermal conductivity materials.

[0094] One or more segments or sections of the set of thermally conductive plates, bars, rods, sheets, and / or slats 297 (collectively referred to as “thermally conductive couplers”) can be mounted to and / or disposed adjacent to the set of processing units 220, and can extend towards, to, and / or into portions of the absorption cooling generator 260 to deliver portions of byproduct or waste heat produced by the set of processing units 220 to and / or into the absorption cooling generator’s internal compartment 262. In other words, the thermally conductive couplers 297 are configured to physically connect the set of processing units 220 and the absorption cooling generator 260, or position them in close proximity. This configuration allows the byproduct or waste heat generated by the processing units 220 to be transferred to the absorption cooling generator 260 through the thermally conductive couplers 297.

[0095] In some embodiments, the set of thermally conductive plates, bars, rods, sheets, and / or slats 297 is mounted (structurally and thermally) to the set of processing units 220, and is also mounted (structurally and thermally) to the absorption cooling generator 260 (e.g., interposed between the set of processing units 220 and the absorption cooling generator 260). Structural and thermal mounting can occur by way of a thermally conductive paste and / or a thermal gripping liquid metal. In particular embodiments, the set of thermally conductive plates, bars, rods, sheets, and / or slats 297 is mounted (structurally and thermally) to the set of processing units 220, and is mounted (structurally and thermally) to at least an external bottom portion of the absorption cooling generator 260, and / or includes a number of thermally conductive projections, extensions, or fingers 299 that project toward / to / into the absorption cooling generator’s internal compartment 262. In specific embodiments, the set of thermally conductive plates, bars, rods, sheets, and / or slats 297 and the absorption cooling generator 260 (and / or the absorption cooling generator’s heating element 264) can exist or be formed as an integral unit.

[0096] Still further additionally or alternatively, the transfer of heat (e.g., byproduct or waste heat) from the set of processing units 220 to the absorption cooling generator 260 occurs by way of a set of heat pipe structures and / or vapor chamber structures 298 that form one or more portions of the heat transfer unit 270, such as indicated in FIG. 2D. Theset of heat pipe structures and / or vapor chamber structures 298 includes at least one sealed device or element having a reduced pressure therein (e.g., which has been at least partially or significantly evacuated, such as by way of a vacuum pump), which includes set of wick structures therein, and which internally carries a working fluid such as water, a liquid metal, a liquid metal - water mixture, or another working fluid. The set of heat pipe structures and / or vapor chamber structures 298 is configured to operate as a self-driven, two-phase heat transfer device between a higher temperature / evaporator portion and a lower temperature / condenser portion thereof by way of boiling and condensation of the working fluid, where the wick structure is configured to facilitate transferring or returning the working fluid from the lower temperature / condenser portion to the higher temperature / evaporator portion by way of a capillary action or force, in a manner individuals having ordinary skill in the relevant art will comprehend. The set of heat pipe structures and / or vapor chamber structures 298 can transfer heat by way of thermal conductivity, phase change, and mass transfer with convection to transfer heat between two solid interfaces, as individuals having ordinary skill in the relevant art will also comprehend.

[0097] In some embodiments, the set of heat pipe structures and / or vapor chamber structures is mounted (structurally and thermally) to the set of processing units 220, and is also mounted (structurally and thermally) to the absorption cooling generator 260 (e.g., interposed between the set of processing units 220 and the absorption cooling generator 260), such as by way of a thermal paste and / or a thermal gripping liquid metal. The higher temperature / evaporator portion of the set of heat pipe structures and / or vapor chamber structures 298 is thermally coupled to or in thermal contact with the set of processing units 220, and the lower temperature / condenser portion of the set of heat pipe structures and / or vapor chamber structures 298 is thermally coupled to or in thermal contact with portions of the absorption cooling generator 260 (e.g., such as bottom portions of the absorption cooling generator housing or casing, or the absorption cooling generator’s heating element 264). In certain embodiments, the set of heat pipe structures and / or vapor chamber structures 298 and the absorption cooling generator 260 (and / or the absorption cooling generator’s heating element 264) can exist or be formed as an integral unit.

[0098] Cooling arrangements using the set of heat pipe structures and / or vapor chamber structures 298 do not require a pump to facilitate the circulation of the workingfluid. Instead, the working fluid flows within the fluidic circuit through boiling / evaporation (moving the fluid from the high temperature zone to the low temperature zone) and capillary action (moving the fluid from the low temperature zone to the high temperature zone). Since this circulation occurs automatically without the need for an external force (e.g., a pump), the cooling system can operate continuously and cost-effectively for extended periods. This is particularly suitable for maintaining continuous computational operations over long durations.

[0099] It can be noted that depending upon embodiment details, a heat transfer unit 270 can include one or more devices, structures, and / or elements shown therefor in FIGs. 2A - 2D. For instance, one or more portions of a heat transfer unit 270 such as shown in FIG. 2C and / or FIG. 2D can be included in a heat transfer unit 270 such as shown in FIG. 2A and / or FIG. 2B. Additionally, it can be noted that in view of FIGs. 2A - 2D, in some embodiments a set of cooling fans configured for directing or delivering air (e.g., ambient air) to and / or removing air (e.g., ambient air) from the set of processing units 220 can be omitted or excluded.

[0100] Additionally with respect to embodiments such as shown in FIGs. 2A - 2D, in some embodiments, a generally small or small physical footprint distributed computing unit 210 can correspond to or be a distributed computing unit 210 configurable or configured to occupy and operate in a spatial volume that is between approximately 0.01 - 8.000 cubic meters (e.g., approximately 8.000, 3.375, 1.000, 0.500, 0.250, or 0.150 cubic meters or less), depending upon the nature and configuration of the distributed computing unit 210. In some embodiments, the set of processing units 220 is configured to occupy a spatial volume of approximately 0.500, 0.250, or 0.125 cubic meters or less, depending upon the nature and configuration of the set of processing units 220. The present invention is technically advantageous in achieving a relatively small spatial volume, as the concentration of heat generated from the processing units 220 in a compact space can be beneficial for driving the sorption-based cooling system of the present invention. Such a configuration facilitates achieving relatively high temperatures from the processing units 220. This contrasts with conventional methods that focus on cooling the processing units, where having them in a small spatial volume is undesirable. In fact, the higher the temperature generated from the byproduct or waste heat from the processing units 220, the more efficient the operation of the sorption-based cooling system of the present invention. The upper limit of this temperature is constrained onlyby the hardware of the processing units 220. In other words, as long as the processing units can withstand the temperature, it can be utilized to drive an efficient sorption-based cooling process of the present invention. In view of the foregoing, in various embodiments portions of byproduct or waste heat produced by the set of processing units 220 can be transferred toward / to / into the absorption cooling unit generator 270 by way of:

[0101] (a) the heat transfer fluid pump 294 and the aforementioned distributed computing generator fluidic circuit, wherein the heat transfer fluid pump 294 circulates the heat transfer fluid 290 around the fluidic circuit such that the heat transfer fluid 290 receives or removes byproduct or waste heat produced by the set of processing units 220 and correspondingly transfers such heat to / into the absorption cooling generator’s heating element 264;

[0102] (b) the set of thermally conductive plates, bars, rods, sheets, and / or slats 297(i.e., thermally conductive couplers 297), which by way of thermal conduction and / or convection accepts, receives, or captures byproduct or waste heat produced by the set of processing units 220, and transfers portions of such accepted, received, or captured byproduct or waste heat toward / to / into the absorption cooling generator 260 by way of thermal conduction and / or thermal convection; and / or

[0103] (c) the set of heat pipe structures and / or vapor chamber structures 298, which accepts, receives, or captures byproduct or waste heat produced by the set of processing units 220, and transfers portions of such accepted, received, or captured byproduct or waste heat toward / to / into the absorption cooling generator 260 at least by way of two-phase heat transfer as set forth above.

[0104] In view of the aforementioned heat transfer toward / to / into the absorption cooling generator 260, the absorption cooling generator’s heating element 264 heats the volume of water - Li Br solution in the absorption cooling generator’s internal compartment 262, which liberates water in the form of water vapor from the water - LiBr solution (e.g., by way of boiling), while concentrates the LiBr within the absorption cooling generator 260.

[0105] With additional reference again to FIG. 1 , because of this liberation of water vapor from the water - LiBr solution in the absorption cooling generator’s internal compartment 262, the water - LiBr solution therein becomes a stronger or “strong”water - Li Br solution, relative to the water - Li Br solution in the absorber’s internal compartment 1 12, which is thus a weaker or “weak” solution in comparison. As indicated in FIG. 1 , a portion of the strong water - LiBr solution exits the distributed computing generator’s first output, and can pass through the first pressure reduction device 140, is introduced into the first heat exchanger 130 at which it is cooled by transferring the heat to weak water - LiBr solution being pumped from the absorber 1 10 to the first heat exchanger 130 and further into the Distributed computing generator 200. The cooled down strong water - LiBr solution then passes into the first input of the absorber 1 10. It can be noted that the first pressure reduction device 140 is configured for creating or establishing a reduced pressure environment therein / therethrough, which correspondingly produces a reduced pressure environment at the second input of the first heat exchanger 130. The first pressure reduction device 140 can include or be a thermal expansion valve. It can also be noted that at least some of the heat imparted to the first heat exchanger 130 by the heated strong water - LiBr solution that exits the distributed computing generator’s first output can also heat the weak water - LiBr solution that is pumped by way of the solution pump 120 from the absorber 1 10 through the first heat exchanger 130 and into the distributed computing generator’s input. The first heat exchanger 130 can be a plate-type heat exchanger, in a manner understood by individuals having ordinary skill in the relevant art. In some embodiments, the first pressure reduction device 140 is implemented for regulating the flow of the strong water-LiBr solution, which aims to prevent the solution from being driven by high pressure to rush through the heat exchanger 130 and into the absorber 1 10. Without reducing the pressure, the strong water-LiBr solution would flow into the absorber 1 10 too quickly, negatively affecting the mixing of the strong water-LiBr and the water vapor from the evaporator 170, and disrupting the operation of the sorption-based cooling process of the present invention.

[0106] As also indicated in FIG. 1 , water vapor liberated from the water - LiBr solution in the absorption cooling generator’s internal compartment 262 passes out of the distributed computing generator’s output and into the input of the condenser 150. The condenser 150 includes a thermally conductive cooling element such as a coil structure (e.g., a metal coil) within which the water vapor travels, and which is cooled by way of an external cooling source / medium (e.g., air / liquid such as water) that absorbs heat from the water vapor by way of the coil structure. In some embodiments, the condenser 150includes an air finned tubular heat exchanger, whereas in other embodiments the condenser 150 includes a liquid cooled plate or tube-based heat exchanger, in a manner that individuals having ordinary skill in the relevant art will comprehend.

[0107] Water vapor travelling within the condenser’s cooling element is cooled to its condensation temperature, and thus this water vapor is condensed into liquid water as it passes through the condenser 150. This liquid water can be further cooled below the condensation temperature by way of heat transfer to and through the condenser’s cooling element and into the external cooling source / medium. In association with the second pressure reduction device 145, the aforementioned cooling and condensation facilitate the creation of a lower pressure environment within the condenser, particularly at the output thereof, compared to the pressure within the absorption cooling generator’s internal compartment, thereby facilitating the transfer of liberated water vapor from the absorption cooling generator’s internal compartment 262 into the condenser 150.

[0108] Cooled liquid water exits the condenser’s output, and passes into and through the second pressure reduction device 145, which is configured for creating a reduced pressure environment therein / therethrough, which correspondingly produces a reduced pressure environment at the input of and within the evaporator 170. The reduced pressure environment created by the second pressure reduction device 145 facilitates a rapid change of state in the liquid water to water vapor as the liquid water exits the second pressure reduction device 145 and enters the evaporator 170 (e.g., such that at least some water vapor may have already flashed or boiled off from the liquid water at the output of the second pressure reduction device 145). The second pressure reduction device 145 can include or be a thermal expansion valve, in a manner similar, analogous, or essentially identical to the first pressure reduction device 140.

[0109] The evaporator 170 is configured to absorb ambient heat from the spatial environment in which it resides, and transferring ambient heat from the spatial environment in which it resides to the liquid water within in the evaporator 170 as the liquid water passes through the evaporator 170, which reduces the amount of ambient heat in the spatial environment in which the evaporator 170 resides, thereby cooling this spatial environment. More particularly, in some embodiments the evaporator 170 includes at least one fan 172 configured to pass ambient air within the spatial environment in which the evaporator 170 resides across / over the evaporator 170 to enhance the transfer ofheat from this ambient air into the liquid water 170 passing through the evaporator 170, thereby cooling the ambient air in the spatial environment in which the evaporator resides. The evaporator 170 can include or be, for instance, a typical or common indoor unit (e.g., an indoor high wall mount unit) of a conventional split air conditioning (AC) system.

[0110] In addition to cool the ambient heat, the transfer of ambient heat into the liquid water within the evaporator 170 heats and can boil the liquid water therein such that water vapor is generated within the evaporator 170 and at the evaporator’s output. Water vapor output from the evaporator 170 is transferred into the absorber 1 10, which in a manner analogous, similar, or essentially identical to the condenser 150, is cooled by way of an external cooling source / medium (e.g., air / liquid such as water). In the absorber 1 10, portions of the strong water - LiBr solution that exited the distributed computing generator’s first output and were returned to the absorber 110 via the first pressure reduction device 140 (optionally, in some embodiments) and the first heat exchanger 130 combine with the water vapor and any liquid output from the evaporator 170. These portions are then cooled by way of the external cooling source / medium, and form portions of the weak water - LiBr solution in the absorber 1 10. In several embodiments, water - LiBr solution entering the absorber’s internal chamber 1 12 is distributed therein by way of a spray element, such that this sprayed water - LiBr solution from the output of the first heat exchanger and the water vapor fed into the internal chamber 1 12 from the evaporator 170 are thoroughly mixed.

[0111] As indicated in FIG. 1 , in various embodiments (though not all embodiments) the absorber 1 10 and the condenser 150 are intended or configured to reside outdoors; and the distributed computing generator 200, the evaporator 170, the solution pump 120, the first heat exchanger 130, the first pressure reduction device 140, and the second pressure reduction device 145 are intended or configured to reside in a generally small or small scale spatial environment such as described above (e.g., in which ambient air is to be cooled). More particularly, the absorber 110 and the condenser 150 can reside external to the generally small or small spatial environment in which ambient air is to be cooled, in a set of outdoor locations or areas; and other elements of the system 100 can reside indoors, wherein the evaporator 170 in particular is intended to reside in the generally small or small-scale spatial environment in which ambient air is to be cooled. In some embodiments, the absorber 1 10 and the condenser 150 can be cooled by way of the same external cooling source / medium (e.g., absorber 1 10 and the condenser 150 canbe air cooled by way of a common set of fans). It can be noted that depending upon embodiment details, the solution pump 120 and / or one or each of the first pressure reduction device 140 and the second pressure reduction device 145 can be configured to reside and operate outdoors.

[0112] Individuals having ordinary skill in the relevant art will understand that systems 100 in accordance with embodiments of the present disclosure include one or more power supplies / sources (e.g., line power couplings / batteries) configured to power fluid pump(s) as well as other electrically powered elements (e.g., fans / air blowers). Such individuals will also understand that systems 100 in accordance with embodiments of the present disclosure further include a control unit configured to receive user input (e.g., by way of a touch screen display, a cooling app executing on a smart phone, or a handheld remote controller) that establishes a cool air temperature setpoint and a fan / blower speed, and a set of temperature sensing elements (e.g., a set of thermocouples) configured to establish a feedback loop by which the controller adjusts (e.g., automatically adjusts) fluid pump speed(s) / rate(s) and / or fan / blower speeds in association with outputting cooled air at the cool air temperature setpoint in response to such user input.

[0113] In certain non-limiting representative implementations, particular components mentioned above can be based on, similar or analogous to, or include or be as follows:(1 ) Condenser 150: JX Refrigeration FNH-2.7 / 6; or Laird Thermal LA5000 up to 5 kW (water as coolant); or regular air cooled finned tube condensing unit;(2) Evaporator 170: Carrier High wall 42QHG-H;(3) First heat exchanger 130: Alfa-Laval brazed plate heat exchanger;(4) Absorption cooling generator 260: TESY - EV 7 / 5 S2 200 65;(5) Solution pump 120: Alpha Solar 15-75 130; and,(6) Pressure reduction devices 140, 145: Danfoss AKV 10P4.

[0114] With further reference to FIGs. 3 and 4, as indicated above a system 100b,c in accordance with an embodiment of the present disclosure can include a number of additional components organized in relation to particular components of the first system 100a shown in FIG. 1 to provide a multiple effect distributed computing heat absorption cooling system 100b,c. A multiple effect distributed computing heat driven absorption cooling system 100b,c can provide a higher coefficient of performance (COP) than a single effect distributed computing heat driven absorption cooling system 100a, in a manner that individuals having ordinary skill in the relevant art will comprehend.

[0115] More specifically, a double effect distributed computing heat driven absorption cooling system 100b such as shown in FIG. 3 can include a low temperature generator 360, a low temperature heat exchanger 330, and an intermediate heat exchanger 350, for instance, interposed among the components shown in FIG. 1 in the manner shown in FIG. 3, where the components of this second system 100b are fluidically coupled in a manner indicated in FIG. 3. In such a double effect distributed computing heat driven absorption cooling system 100b, an overall absorption cooling process is further driven by way of additional heat exchange stages provided by the low temperature heat exchanger 330 and the intermediate heat exchanger 350, and associated introduction of water vapor liberated from the strong water - LiBr solution in the distributed computing generator 200 into the low temperature generator 360 rather than directly into the condenser 150, in a manner that individuals having ordinary skill in the relevant art will comprehend. Such individuals will also comprehend that the low temperature generator 360 can have a structure that is similar, analogous, or essentially identical to the distributed computing generator’s absorption cooling generator 260; and water vapor that was liberated from the strong water - LiBr solution in the distributed computing generator 200 and introduced into the low temperature generator 360 can pass through a heating element (not shown) of the low temperature generator 360 configured to heat a volume of water - LiBr solution that has been transferred into in an internal chamber (not shown) of the low temperature generator 360 by way of the solution pump 120 and the low temperature heat exchanger 330. This configuration facilitates the further separation of the water from the water - LiBr solution, which has not yet been fully separated inside the distributed computing generator 200 and enters into the low temperature generator. This accordingly further enhances the efficiency of the system in achieving better cooling effects.

[0116] A triple effect distributed computing heat driven absorption cooling system 100c such as shown in FIG. 4 can further include a medium temperature generator 460 and a medium temperature heat exchanger 430, for instance, interposed among the components shown in FIG. 3 in the manner shown in FIG. 4, where the components of this third system 100b are fluidically coupled in a manner indicated in FIG. 4. In such a triple effect distributed computing heat driven absorption cooling system 100c, an overall absorption cooling process is still further driven by way of an additional heat exchange stage provided by the medium temperature heat exchanger 430, and associatedintroduction of water vapor liberated from the strong water - Li B r solution in the distributed computing generator 200 into the medium temperature generator 460, before passing water vapor output by the medium temperature generator 460 into the low temperature generator 360, in a manner that individuals having ordinary skill in the relevant art will comprehend. Such individuals will also comprehend that the medium temperature generator 460 can have a structure that is similar, analogous, or essentially identical to the distributed computing generator’s absorption cooling generator 260; and water vapor that was liberated from the strong water - LiBr solution in the distributed computing generator 200 and introduced into the medium temperature generator 460 can pass through a heating element (not shown) of the medium temperature generator 460 configured to heat a volume of water - LiBr solution that has been transferred into in an internal chamber (not shown) of the medium temperature generator 460 by way of the solution pump 120, the low temperature heat exchanger 330, and the medium temperature heat exchanger 430.

[0117] As further detailed hereafter, some embodiments of distributed computing heat driven absorption cooling systems 100 can be configured to entirely reside indoors (e.g., in the form of a unified / portable unit) with the exception of one or more warm air ejection hoses, conduits, tubes, or pipes that are configured to deliver warm air produced by the absorber 1 10 and the condenser 150 away from the distributed computing heat driven absorption coolers 100 (e.g., out a window into an outdoor environment).

[0118] FIG. 5 is a block diagram showing portions of a fourth distributed computing heat driven absorption cooling system 100d in accordance with an embodiment of the present disclosure. In an embodiment, the system 100d includes a main housing, enclosure, or cabinet 101 in which the absorber 1 10, the solution pump 120, the first heat exchanger 130, the first pressure reduction device 140, the absorption cooling generator 260, the condenser 150, the second pressure reduction device 145, and the evaporator 170 reside.

[0119] Internal thermal barriers can exist within the main housing 101 to facilitate thermal efficiency. For instance, the absorber 110 and the condenser 150 can be disposed (e.g., proximate or adjacent to each other) in a first thermally insulated spatial volume 102a within the main housing 101 , and the evaporator 170 can reside in a separate second thermally insulated spatial volume 102b within the main housing 101 . Atleast a first air inflow / intake vent 104-i1 and a first air outflow / output vent 104-o1 corresponding to the first thermally insulated spatial volume 102a can be disposed in the main housing 101 to facilitate air flow across the absorber 1 10 and the condenser 150; and at least a second air inflow / intake vent 104-i2 and a second air outflow / output vent 104-o2 corresponding to the second thermally insulated spatial volume 102b can be disposed in the main housing 101 to facilitate air flow across the evaporator 170. A first set of fans or air blowers 106a can be disposed in the first thermally insulated spatial volume 102a and configured to blow or draw air (e.g., ambient indoor air) such that air flows into the first air inflow / intake vent 104-i1 , across the absorber 1 10 and the condenser 150, out of the first air outflow / output vent 104-o1 , and into, within, and along a warm air ejection hose, conduit, tube, or pipe 105. A second set of fans or air blowers 106b can be disposed in the second thermally insulated spatial volume 102b and configured to blow or draw air (e.g., ambient indoor air) such that air flows into the second air inflow / intake vent 104-I2, across the evaporator 170, and out of the second air outflow / output vent 104-o2 into the spatial environment that is to be cooled.

[0120] In various embodiments, the set of processing units 220 and at least portions of the heat transfer unit 270 also reside within the main housing 101. In some embodiments, essentially the entire or the entire distributed computing unit 210 and essentially the entire or the entire heat transfer unit 270 are disposed in the main housing 101. A display device 214 (e.g., a touch screen display device) corresponding to the distributed computing unit 210 can be mounted in or on the main housing 101 , and can serve as a user interface configured to receive user input directed to controlling the operation of the system 100d. An application program executed by the distributed computing unit 1 10 can control fluid pump speeds and / or fan / blower speeds in response to such user input, in association with a set of feedback signals provided by one or more cool air temperature sensing elements (not shown) such as thermocouples configured to sense air temperature near or at an output side of the second set of fans or air blowers 106b. An auxiliary housing 216 corresponding to the distributed computing unit 210 can carry a power supply and possibly other components or elements of the distributed computing unit 210, such as a network interface unit configured to enable wireless and / or wire-based communication between the distributed computing unit 210 and other electronic devices, apparatuses, and / or systems external to the system 100d. In certain embodiments, the system 100d can additionally or alternatively be controlled (e.g.,wirelessly controlled) by way of user input directed to a smart phone 108a executing a cooling system control app, and / or a handheld remote-control device 108b. A set of wheels 107 can be structurally coupled to the main housing 101 to facilitate system repositionability / portability.

[0121] Individuals having ordinary skill in the relevant art will understand the main housing 101 can include one or more additional power supplies / sources (e.g., line power couplings / batteries) configured to power fluid pump(s) as well as other electrically powered elements (e.g., fans / air blowers).

[0122] Representative Aspects of a Distributed Computing Heat Driven Adsorption Cooling System

[0123] FIGs. 6A and 6B are block diagrams showing portions of distributed computing heat driven adsorption cooling systems 500 in accordance with particular embodiments of the present disclosure, including a first and a second distributed computing heat adsorption cooling system 500a, b. In an embodiment, the system 500 includes a distributed computing unit 210 such as set forth above, which provides a set of processing units 220 that generate heat in association with performing computing operations; a heat transfer unit 270 such as set forth above, which includes a first and a second conduit 274a, b that each internally carry a heat transfer fluid 290 (e.g., water), which is thermally couplable or coupled to the set of processing units 220 such that heat produced by the set of processing units 220 is transferrable or transferred into portions of the heat transfer fluid 290 carried by the first and second conduits 274a, b; an adsorption cooling unit 510 fluidically and structurally coupled to the heat transfer unit’s first and second conduits 274a, b and which is configurable or configured to produce a stream or flow of cooled, chilled, or cold water (hereafter “chilled water” for purpose of brevity and simplicity) by way of adsorption cooling processes that are facilitated or at least partially driven by the heat transfer fluid 290; a heat dissipation unit 550 configurable or configured to remove heat produced by adsorption cooling processes themselves by way of a flow of heat dissipation water; and an ambient air cooling / distribution unit 570 configurable or configured to receive the chilled water stream and producing cooled ambient air therefrom in a generally small or small spatial environment such as described above.

[0124] The ambient air cooling / distribution unit 570 is intended or specifically configured to reside in a particular indoor environment in which ambient air is to becooled; and the heat dissipation unit 550 is intended or specifically configured to reside in an environment that is external to this particular indoor environment, such as an outdoor environment. The ambient air cooling / distribution unit 570 can include or be a set of fan-assisted cooling coils; and the heat dissipation unit 550 can include or be a condenser or a dry cooler (e.g., which in some embodiments can be buried in-ground). Other components of the distributed computing heat adsorption cooling system 500 are intended or configured to reside in an indoor environment, which can include one or more portions of the particular indoor environment in which ambient air is to be cooled.

[0125] Adsorption cooling processes can occur by way of adsorption - evaporation and desorption - condensation cycles, typically at low or very low pressures, involving an adsorbate - adsorbent pair, which can also be referred to as a refrigerant - adsorbent pair. In various embodiments in accordance with the present disclosure, the adsorbate or refrigerant includes or is water, and the adsorbent includes or is silica gel, zeolite, or alumina. Some embodiments can utilize another or a different adsorbate or refrigerant and / or another or a different adsorbent.

[0126] Individuals having ordinary skill in the relevant art will understand that adsorption of an adsorbate onto an adsorbent is an exothermic process. Such individuals will also comprehend that once an adsorbent becomes saturated with an adsorbate, further adsorption (e.g., further net adsorption) of the adsorbate onto the adsorbent does not occur, and the adsorbent can be regenerated by way of the application of heat thereto such that the adsorbate desorbs from the adsorbent and the adsorbent returns to an essentially fully desaturated state. Desorption of the adsorbate from the adsorbent is an endothermic process.

[0127] The adsorption cooling unit 510 can produce the aforementioned chilled water stream by way of multiple cyclically or recurrently linked I synchronized and alternating adsorption - evaporation processes and desorption - condensation processes. Representative adsorption cooling unit components that facilitate or enable such cyclically or recurrently linked / synchronized and alternating adsorption - evaporation processes and desorption - condensation processes are described in detail hereafter.

[0128] In an embodiment, the adsorption cooling unit 510 includes a first sealed chamber 520 in which adsorbate resides, and in which a first adsorber - desorber component 522 and a first evaporator - condenser component 524 reside; a secondsealed chamber 530 in which adsorbate resides, and in which a second adsorber - desorber component 532 and a second evaporator - condenser component 534 reside; and a hydraulic switching unit 540.

[0129] The hydraulic switching unit 540 includes a heat transfer fluid input I output pair 544a, b configured to exchange heat transfer fluid 290 with the heat transfer unit's first and second conduits 274a, b; a chilled water input / output pair 546a, b configured to exchange chilled water with the ambient air cooling / distribution unit 570; a heat dissipation water input / output pair 545a, b configured to exchange heat dissipation water with the heat dissipation unit 550; a plurality of hydraulic valves / switches and pumps (not shown) by which the hydraulic switching unit 540 can selectively or programmably and cyclically or recurrently fluidically couple the first adsorber - desorber component 522, the first evaporator - condenser component 524, the second adsorber - desorber component 532, and the second evaporator - condenser component 534 to particular combinations (e.g., specific subcombinations) of the heat transfer fluid input / output pair 544a, b, the chilled water input / output pair 546a, b, and the heat dissipation water input / output pair 545a, b. In general, in the context of a distributed computing heat driven adsorption cooling system 500, the heat transfer fluid 290 functions or is designated as a high temperature fluid; the heat dissipation water functions or is designated as an intermediate or medium temperature fluid; and the chilled water functions or is designated as a low temperature fluid.

[0130] The hydraulic switching unit 540 additionally includes a control unit 548 configurable or configured to control or manage the operation of the hydraulic switching unit 540. The control unit 548 can include or be an embedded controller, such as an embedded microprocessor or microcontroller coupled to a memory that stores program instructions and data, in a manner understood by individuals having ordinary skill in the relevant art.

[0131] In various embodiments, each adsorber - desorber component 522, 532 includes or is a heat exchanger carrying (e.g., coated with) an adsorbent, and which can selectably or selectively operate as an adsorber or a desorber. Each adsorber - desorber component 522, 532 can include or be, for instance, a tubular coil type finned heat exchanger that carries or is coated with the adsorbent. Each evaporator - condenser component 524, 534 includes or is a heat exchanger that can selectably or selectivelyoperate as an evaporator or a condenser. For instance, each evaporator - condenser component 524, 534 can be a tubular coil type finned heat exchanger (e.g., which does not carry or is not coated with the adsorbent).

[0132] Further to the foregoing, each sealed chamber 520, 530 provides a low pressure (e.g., near vacuum) internal environment in which the adsorbate exists. In a given sealed chamber 520, 530, the adsorbate can selectively adsorb onto or desorb from the adsorbent carried by the adsorber - desorber component 522, 532, and hence the adsorber - desorber component 522, 532 can operate as an adsorber or a desorber, in a manner that depends upon the saturation or desaturation state of the adsorbent and the temperature of a fluid flowing through the adsorber - desorber component 522, 532. Moreover, within each sealed chamber 520, 530, the evaporator - condenser component 524, 534 can operate as an evaporator or a condenser in a manner that depends upon the temperature of a fluid flowing therethrough.

[0133] Pairing an adsorption - evaporation process in a given sealed chamber 522, 532 with a desorption - condensation process in the other sealed chamber 522, 532 in a cyclically or recurrently alternating manner (e.g., a temporally cyclical or recurrent manner, or a pressure based cyclical or recurrent manner), wherein the adsorption - evaporation process and the desorption - condensation process correspond to or are facilitated by particular fluid exchange selections or subcombinations among the heat transfer fluid 290, the chilled water, and the heat dissipation water in relation to the individual components in each sealed chamber 522, 532, facilitates the adsorption cooling unit’s ongoing, near / essentially continuous, or effectively continuous production of chilled water.

[0134] The control unit 548 is configured to programmably control or switch the hydraulic switching unit’s fluidic couplings to the first sealed chamber’s first adsorber - desorber component 522 and first evaporator - condenser component 524, and the hydraulic switching unit’s fluidic couplings to the second sealed chamber’s second adsorber - desorber component 532 and second evaporator - condenser component 534 in accordance with cyclically alternating first and second adsorption cooling phases.

[0135] A. During the first adsorption cooling operational phase,

[0136] 1 . Within the first sealed chamber 520, the adsorbent carried therein is initiallyessentially fully desaturated, and:

[0137] (a) the first adsorber - desorber component 522 is configured to operate as an adsorber, and is fluidically coupled to the heat dissipation water input / output pair 546a, b, such that heat dissipation water circulates in the first adsorber - desorber component 522; and

[0138] (b) the first evaporator - condenser component 524 is configured to operate as an evaporator, and is fluidically coupled to the chilled water input / output pair 545a, b, such that chilled water circulates in the first evaporator - condenser component 524,

[0139] until or such that the adsorbent in the first sealed chamber 520 progressively becomes essentially fully saturated.

[0140] 2. Within the second sealed chamber 530, the adsorbent therein is initially essentially fully saturated, and:

[0141] (a) the second adsorber - desorber component 532 configured to operate as a desorber, and is fluidically coupled to the heat transfer fluid input / output pair 544a, b, such that heat transfer fluid 290 circulates in the second adsorber - desorber component 532; and

[0142] (b) the second evaporator - condenser component 534 is configured to operate as a condenser, and is fluidically coupled to the heat dissipation water input / output pair 546a, b, such that heat dissipation water circulates in the second evaporator - condenser component 534,

[0143] until or such that the adsorbent in the second sealed chamber 530 becomes essentially fully desaturated.

[0144] B. During the second adsorption cooling phase,

[0145] 1. Within the first sealed chamber 520, the adsorbent therein is initially essentially fully saturated, and:

[0146] (a) the first adsorber - desorber component 522 is configured to operate as a desorber, and is fluidically coupled to the heat transfer fluid input / output pair 544a, b, such that heat transfer fluid 290 circulates in the first adsorber - desorber component 522; and

[0147] (b) the first evaporator - condenser component 524 is configured to operate as a condenser, and is fluidically coupled to the heat dissipation water input / output pair 546a, b, such that heat dissipation water circulates in the first evaporator - condenser component 524,

[0148] until or such that the adsorbent in the first sealed chamber becomes essentially fully desaturated.

[0149] 2. Within the second sealed chamber 530, the adsorbent carried therein is initially essentially fully desaturated, and:

[0150] (a) the second adsorber - desorber component 532 is configured to operate as an adsorber, and is fluidically coupled to the heat dissipation water input / output pair 546a, b, such that heat dissipation water circulates in the second adsorber - desorber component 532; and

[0151] (b) the second evaporator - condenser component 534 is configured to operate as an evaporator, and is fluidically coupled to the chilled water input / output pair 545a, b, such that chilled water circulates in the second evaporator - condenser component 534,

[0152] until or such that the adsorbent within the second sealed chamber 530 becomes essentially fully saturated.

[0153] Aspects of particular non-limiting representative embodiments of distributed computing heat driven sorption-based cooling systems, apparatuses, components, devices, elements, and processes in accordance with the present disclosure have been described in detail above. In view of the description herein, an individual having ordinary skill in the relevant art may make modifications to one or more portions of such nonlimiting representative embodiments, where such modifications remain within the scope of the present disclosure.

[0154] The reference herein to any prior publication (or information derived from it), or to any matter which is known, is not, and should not be taken as an acknowledgment or admission or any form of suggestion that such prior publication (or information derived from it) or known matter forms part of the common general knowledge in the field of endeavor to which this specification relates. Herein, unless the context stipulates or requires otherwise, any use of the word "comprise," and variations such as "comprises"and "comprising," imply the inclusion of a stated element or procedure / step or group of elements or procedures I steps but not the exclusion of any other element or procedures I step or group of elements or procedures / steps. Reference to one or more embodiments, e.g., as various embodiments, many embodiments, several embodiments, multiple embodiments, some embodiments, certain embodiments, particular embodiments, specific embodiments, or a number of embodiments, need not or does not mean or imply all embodiments. Reference to a number of embodiments means at least one embodiment.

[0155] As used herein, the term “set” corresponds to or is defined as a non-empty finite organization of elements that mathematically exhibits a cardinality of at least 1 (i.e., a set as defined herein can correspond to a unit, singlet, or single element set, or a multiple element set), in accordance with known mathematical definitions (for instance, in a manner corresponding to that described in An Introduction to Mathematical Reasoning: Numbers, Sets, and Functions , "Chapter 11 : Properties of Finite Sets" (e.g., as indicated on p. 140), by Peter J. Eccles, Cambridge University Press (1998)). Thus, a set includes at least one element. In general, an element of a set can include or be one or more portions of a structure, an object, a process, a composition, a physical parameter, or a value depending upon the type of set under consideration.

[0156] The presencein a FIG. or text herein is understood to mean "and / or" unless otherwise indicated or precluded. The term “configured for” can be interpreted as “configured to” in the description herein, unless otherwise indicated or precluded. The recitation of a particular numerical value or value range herein is understood to include or be a recitation of an approximate numerical value or value range, for instance, within + / - 20%, + / - 15%, + / - 10%, + / - 5%, + / -2.5%, + / - 2%, + / - 1 %, + / - 0.5%, or + / - 0%. The term "essentially all" or "substantially" can indicate a percentage greater than or equal to 90%, for instance, greater than 92.5%, 95%, 97.5%, 99%, or 100%. The term "significant fraction” can indicate a percentage greater than or equal to 20%, for instance, greater than 25%, 50%, 75%, 80%, or 100%.

Claims

ClaimsClaim 1 . A computing heat driven sorption-based cooling system, comprising: a computing unit, wherein the computing unit comprises a set of processing units configured to perform computing operation, and the set of processing units is operable to generate waste heat while performing the computing operation; a sorption-based cooling unit; and, a heat transfer unit configured to thermally couple the set of processing units and the sorption-based cooling unit, transferring the waste heat to the sorption-based cooling unit, wherein the sorption-based cooling unit is configured to cool ambient air within an indoor environment by way of a sorption-based cooling process, wherein the waste heat produced by the set of processing units and transferred to the sorption-based cooling unit at least partially facilitate or drive the sorption-based cooling process.Claim 2. The computing heat driven sorption-based cooling system according to Claim 1 , wherein the computing operation is selected from the group consisting of distributed computing operation, parallel computing operation, and any combination thereof.Claim 3. The computing heat driven sorption-based cooling system according to Claim 1 , wherein the computing operation is directed towards a computationally intensive task.Claim 4. The computing heat driven sorption-based cooling system according to Claim 1 , wherein the indoor environment is selected from the group consisting of a habitation, a residence, an office environment, a building, and any combination thereof.Claim 5. The computing heat driven sorption-based cooling system according to Claim 3, wherein the residence is selected from the group consisting of a house, a townhouse, a duplex, a condominium, a flat, and an apartment; wherein the office environment isselected from the group consisting of a meeting room, a set of cubicles, a set of work stations, and a set of work spaces.Claim 6. The computing heat driven sorption-based cooling system according to Claim 1 , wherein the heat transfer unit comprises one or more components selected from the group consisting of:(a) a set of thermal coupler structures configured to be thermally coupled to the set of processing units and the sorption-based cooling unit, wherein the set of thermal coupler structures are configured to transfer the waste heat produced by the set of processing units to the sorption-based cooling unit;(b) a set of heat pipe structures configured to capture the waste heat produced by the set of processing units, and to transfer the waste heat towards the sorption-based cooling unit at least by way of two-phase heat transfer; and,(c) a fluidic circuit configured to comprise at least one fluid-carrying apparatus, wherein the at least one fluid-carrying apparatus is configured to carry a heat transfer fluid and thermally couple the heat transfer fluid to the set of processing units; wherein a heat transfer pump is configured to circulate the heat transfer fluid around the fluidic circuit.Claim 7. The computing heat driven sorption-based cooling system according to Claim 6, the at least one fluid-carrying apparatus comprises a heat transfer fluid reservoir configured to carry a reservoir volume of the heat transfer fluid.Claim 8. The computing heat driven sorption-based cooling system according to Claim 7, wherein the heat transfer fluid reservoir is configured to carry the set of processing units therein such that the set of processing units is immersed in the reservoir volume.Claim 9: The computing heat driven sorption-based cooling system according to Claim 6, the at least one fluid-carrying apparatus comprises a set of fluid blocks, wherein each fluid block is configured to comprise a thermally conductive material, and wherein theeach fluid block is configured to be structurally coupled to or mounted to the set of processing units.Claim 10. The computing heat driven sorption-based cooling system according to Claim 9, wherein the fluidic circuit comprises a plurality conduits configured to carry a flow of the heat transfer fluid therein; wherein the plurality conduits comprise: a first conduit fluidically coupled to an output of the heat transfer fluid pump, and fluidical ly coupled to an input of the sorption-based cooling unit; a second conduit fluidically coupled to an output of the sorption-based cooling unit and an input of the heat transfer fluid reservoir and / or the set of fluid blocks; and, an intermediate conduit fluidically coupled to an output of the heat transfer fluid reservoir and / or the set of fluid blocks and an input of the heat transfer fluid pump.Claim 1 1 . The computing heat driven sorption-based cooling system according to Claim 6, wherein the set of thermal coupler structures and the set of heat pipe structures are configured to be interposed therebetween the set of processing units and the sorptionbased cooling unit.Claim 12. The computing heat driven sorption-based cooling system according to Claim 1 , wherein the sorption-based cooling unit comprises an absorption cooling unit that is configured to internally carry a refrigerant.Claim 13. The computing heat driven sorption-based cooling system according to Claim 12, wherein the refrigerant is a water - lithium bromide (LiBr) pair.Claim 14. The computing heat driven sorption-based cooling system according to Claim 12, wherein the absorption cooling unit comprises an absorption cooler generator, a condenser, an evaporator, an absorber, a solution pump, and a heat exchanger, which are configured to provide an absorption cooling process.Claim 15. The computing heat driven sorption-based cooling system according to Claim14, wherein the condenser and the absorber are configured to reside in an outdoor environment, and other components of the absorption cooling unit are configured to reside in the indoor environment.Claim 16. The computing heat driven sorption-based cooling system according to Claim15, wherein the condenser and the absorber are configured to reside in the indoor environment, and the absorption cooling unit comprises a heat venting apparatus configured to transfer heat generated by the condenser and / or the absorber to an outdoor environment.Claim 17. The computing heat driven sorption-based cooling system according to Claim 1 , wherein the sorption-based cooling unit comprises an adsorption cooling unit configured for cooling ambient air by way of an adsorbent - adsorbate working pair by which an adsorption cooling process occurs; wherein the adsorbent - adsorbate working pair comprises an adsorbent and an adsorbate.Claim 18. The computing heat driven sorption-based cooling system according to Claim 17, wherein the adsorbent is selected from a group consisting of silica gel, zeolite, and alumina; and the adsorbate is water.Claim 19. The computing heat driven sorption-based cooling system according to Claim 17, wherein the adsorption cooling unit comprises: a first sealed chamber configured to house a first adsorber - desorber component and a first evaporator - condenser component; wherein the first adsorber - desorber component is configured to carry the adsorbent, and wherein the first sealed chamber is configured to carry the adsorbate; and, a second sealed chamber configured to house a second adsorber - desorber component and a second evaporator - condenser component; wherein the secondadsorber - desorber component is configured to carry the adsorbent, and wherein the second sealed chamber is configured to carry the adsorbate.Claim 20. The computing heat driven sorption-based cooling system according to Claim 19, further comprising: a hydraulic switching unit comprising a control unit, a plurality of hydraulic switches and a plurality of pumps; wherein the control unit is configured to either selectively or programmably, and either cyclically or recurrently exchange a fluid with the first adsorber- desorber component, the first evaporator - condenser component, the second adsorber- desorber component, and the second evaporator - condenser component; wherein the fluid is selected from the group consisting of heat transfer fluid, chilled water, and heat dissipation water.Claim 21 . The computing heat driven sorption-based cooling system according to Claim 17, further comprising: a heat dissipation unit configured to carry a heat dissipation water and to reside in an outdoor environment; wherein the heat dissipation unit is configured to transfer heat associated with the adsorption cooling process; and an ambient air cooling unit configured to receive a chilled water and to produce cooled ambient air therefrom; and wherein the ambient air cooling unit is configured to reside in a generally small or small indoor environment.Claim 22. The computing heat driven sorption-based cooling system according to Claim 1 1 , wherein a heat dissipation unit is configured to reside in an outdoor environment, and the adsorption cooling unit is configured to reside in the indoor environment.Claim 23. The computing heat driven sorption-based cooling system according to Claim 1 , wherein the computing unit comprises a small physical footprint distributed computing unit.Claim 24. The computing heat driven sorption-based cooling system according to Claim 23, wherein the small physical footprint distributed computing unit is configured to occupy a spatial volume between approximately 0.01 - 8.00 cubic meters.Claim 25. The computing heat driven sorption-based cooling system according to Claim 24, wherein the set of processing units is configured to occupy a spatial volume of approximately 0.500, 0.250, or 0.125 cubic meters.Claim 26. A computing heat driven sorption-based cooling method, based on the distributed computing heat driven sorption-based cooling system according to any one of Claim 1 - 25, comprising the following steps:(1 ) capturing a waste heat generated by a computing unit; and,(2) using the waste heat captured to facilitate a sorption-based cooling process, which is operable to cool an ambient air within an indoor environment.Claim 27. The computing heat driven sorption-based cooling method according to Claim 26, wherein the sorption-based cooling process is either an absorption cooling process or an adsorption cooling process.

Images