Heating system, vacuum chamber, and method of processing a substrate in a vacuum chamber
A modular heating system with linear lamps and transparent tubes addresses the challenge of uniform heating large substrates in vacuum chambers, ensuring rapid and efficient processing with easy maintenance and high throughput.
Patent Information
- Application Number
- PCT/IB2025/053519
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-05-24
- Filing Date
- 2025-04-03
- Publication Date
- 2025-11-27
AI Technical Summary
Existing vacuum processing systems face challenges in uniformly and rapidly heating large substrates, such as glass substrates for display manufacturing, due to deflection issues and the need for easy maintenance and modification of heating systems, while also requiring high throughput and uniform spacing between heaters and the chamber body.
A modular heating system with linear heating lamps supported in a frame, forming seals between the vacuum chamber body and lid, allowing for easy installation and removal, and featuring a transparent tube to shield the lamps from vacuum, ensuring uniform heating and easy maintenance.
The system enables rapid and uniform heating of large substrates, supports easy assembly and replacement of heating components, and maintains vacuum integrity, enhancing substrate throughput and reducing contamination risks.
Smart Images

Figure IB2025053519_27112025_PF_FP_ABST
Abstract
Description
HEATING SYSTEM, VACUUM CHAMBER, AND METHOD OF PROCESSING A SUBSTRATE IN A VACUUM CHAMBERTECHNICAL FIELD
[0001] Embodiments of the present invention relate to the handling and processing of substrates, particularly substrates for display manufacturing. Embodiments particularly relate to a heating system with linear heating lamps supported in a frame, and a vacuum chamber having a modular heating system. Embodiments of the present invention particularly relate to a modular, heated load lock chamber for a cluster processing tool.BACKGROUND
[0002] Substrates, such as glass substrates, are commonly processed in vacuum processing systems such as cluster processing systems or cluster tools. A common use for such processed substrates includes the manufacture of displays, such as liquid crystal displays and / or organic light-emitting diode (OLED) displays, solar panels, microelectronic devices, or insulating panels. Processing of the substrate may include depositing one or more material layers on the substrate. Several methods are known for the deposition of a material on a substrate. For example, a substrate may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, etc., or a chemical vapor deposition (CVD) process. A substrate on which material is deposited, i.e. a substrate to be coated, is introduced into a vacuum chamber of a vacuum processing system and positioned relative to a processing area of the vacuum chamber of the vacuum processing system. For example, a coating process can take place in the vacuum processing chamber. For loading and unloading of the substrate, the processing system may include vacuum chambers, such as load lock chambers, to introduce the substrate into the vacuum environment of the vacuum processing system, and / or releasing it therefrom.
[0003] Generally, the processing of larger substrates is desirable due to increased process efficiency and the possibility to manufacture larger sized products. Equipment to fabricate such large substrates represents a substantial investment to fabricators. Conventional systems require large and expensive hardware. In order to offset this investment, high substrate throughput is very desirable.
[0004] For processing the substrate in a processing chamber, the substrate is typically loaded into the processing system through a load lock chamber. Likewise, the substrate may be transferred between processing chambers of the processing system through transfer chambers. Heating a substrate in the load lock chamber or the transfer chamber may be desirable, e.g. to increase substrate throughput. Furthermore, it may be desirable to condition, e.g. bake-out, a load lock chamber or transfer chamber while no substrate is present in the load lock chamber or transfer chamber, e.g. to reduce risk of contamination of the substrate.
[0005] As future processing systems are envisioned to process even larger sized substrates, the need for uniform rapid heating of large area substrates is of great concern. In particular, the deflection due to the large surface area exposed to a vacuum presents a challenge in maintaining uniform spacing between the heaters, substrate and chamber body.
[0006] Furthermore, it is desirable to provide a heating system which is easy to maintain, assemble and / or replace. Likewise, it is desirable to provide a vacuum chamber which may be easily modified to include a heater when required.
[0007] Thus, there is a need for an improved heating system and vacuum chamber that facilitates rapid and uniform heating while providing the above-mentioned advantages.SUMMARY
[0008] The invention is set out in the appended set of claims.
[0009] According to one embodiment, a heating system for a vacuum chamber for holding a substrate is described. The heating system includes a frame configuredto be inserted between a vacuum chamber body and a vacuum chamber lid, and a plurality of linear heating lamps supported in the frame. The frame includes a first sealing surface configured for forming a first seal between a top surface of the chamber body and the frame, and a second sealing surface opposite the first sealing surface configured for forming a second seal between the vacuum chamber lid and the frame.
[0010] According to one embodiment, a vacuum chamber configured for holding a substrate and having a modular heating system is described. The vacuum chamber includes a chamber body with sidewalls, the sidewalls having a top surface, the top surface being configured for forming a first seal between the top surface and the first sealing surface of a heating system according embodiments described herein. The vacuum chamber further includes a lid with a bottom surface, the bottom surface being configured for forming a second seal between the bottom surface and the second sealing surface of a heating system according to embodiments described herein. The vacuum chamber further is configured for forming a seal between the top surface and the bottom surface when the lid is provided directly on the chamber body.
[0011] According to one embodiment, a method of processing a substrate in a vacuum chamber is described. The vacuum chamber includes a chamber body with sidewalls, the sidewalls having a top surface, and a heating system including a frame and a plurality of linear heating lamps supported in the frame. A first seal is formed between the top surface and a bottom surface of the frame. The vacuum chamber further includes a lid. A second seal is formed between a bottom surface of the lid and a top surface of the frame. The method includes activating the plurality of linear heating lamps.BRIEF DESCRIPTION OF THE DRAWINGS
[0012] So that the manner in which the above recited features can be understood in detail, a more particular description, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments and are described in the following:Fig. 1A shows a vacuum chamber according to embodiments with a heating system according to embodiments in a schematic cutaway side view;Fig. 1 B shows the vacuum chamber of Fig. 1 A without the heating system;Fig. 2 shows a heating system according to embodiments in a schematic plan view;Fig. 3 shows a support structure for a linear heating lamp according to embodiments in a schematic cutaway side view;Fig. 4 shows a support structure for a linear heating lamp and a transparent tube according to embodiments in a schematic cutaway side view;Fig. 5 shows a support structure for a linear heating lamp and a transparent tube according to embodiments in a schematic cutaway side view;Fig. 6 shows a support bracket for a transparent tube according to embodiments in a schematic cutaway side view; andFig. 7 shows a method of processing a substrate in a vacuum chamber according to embodiments.DETAILED DESCRIPTION OF EMBODIMENTS
[0013] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same or similar components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation and is not meant as a limitation. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.
[0014] It should be noted that the figures are exemplary. In particular, to help in understanding the invention, some elements may be drawn schematically, enlarged, shrunken down and / or may not be to scale. Furthermore, some elements commonly known in the art may have been omitted for better visibility of the figures.
[0015] Embodiments described herein relate to the processing of substrates, particularly glass substrates, e.g. for display manufacturing. According to some embodiments, the vacuum chamber and / or heating system described herein are configured for processing one or more substrates, having a size of at least 0.5 m2. For instance, the vacuum chamber may be adapted for processing large area substrates, such as substrates of GEN 5, which corresponds to about 1.4 m2substrates (1.1 m x 1.3 m), GEN 6, which corresponds to about 2.7 m2(1.5 m x about 1.8 m), GEN 7.5, which corresponds to about 4.29 m2substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m2substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m2substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12, and corresponding substrate areas can be similarly implemented. Substrate sizes of GEN 6 and larger may be particularly preferable. According to yet further implementations, half sizes of the above-mentioned substrate generations can be processed. Alternatively, or additionally, semiconductor wafers may be processed and / or handled in a vacuum chamber according to the present disclosure.
[0016] In the following, aspects of a vacuum chamber and / or a heating system may be described with reference to directions such as up / down, inside / outside, or top / bottom. These directions are to be understood as describing the vacuum chamber and / or heating system in a configuration suitable for processing and / or handling a substrate. For example, in a configuration suitable for processing and / or handling a substrate, the substrate is typically provided within the vacuum chamber in a horizontal orientation, and a lid of the vacuum processing chamber may be provided above the substrate, while a substrate holder holding the substrate may be provided below the substrate. It is understood that the directions given herein are intended to describe the systems and apparatus described herein, independent of the environment of the systems and apparatus, and may vary e.g. during operation,assembly and / or handling of the apparatus. For example, and not limited thereto, a lid of the apparatus may be removed and / or tilted or even flipped during removal, however, e.g. a top surface of the lid would be considered a top surface of the lid even when the lid is provided at a different orientation than shown in the figures.
[0017] Fig. 1A and Fig. 1 B (collectively Fig. 1 ) show a vacuum chamber 100. The vacuum chamber 100 may be a load lock chamber or a transfer chamber, particularly for a cluster processing system and / or cluster tool (not shown). For example, the vacuum chamber 100 may form an interface between atmosphere and a portion of the cluster processing system being maintained at vacuum, such as one or more processing or transfer chambers of the cluster processing system. The vacuum chamber 100 may be configured for receiving a substrate 142 from outside the cluster processing system and / or a factory interface. Likewise, the vacuum chamber 100 may be provided within the cluster processing system, e.g. operate as a transfer chamber in-between two chambers of the cluster processing system.
[0018] The vacuum chamber 100 may be configured for establishing and / or maintaining a vacuum, particularly a vacuum having a pressure from 0.05 mbar to 1 mbar. For example, a vacuum may be established after loading the substrate 142. Likewise, the vacuum chamber 100 may be configured to be vented to atmospheric pressure, e.g. with a gas such as air or an inert gas, for releasing a substrate from the cluster processing tool.
[0019] The vacuum chamber 100 may be configured for processing essentially rectangular or square-shaped substrates. Accordingly, the vacuum chamber 100 may have an essentially rectangular footprint, e.g. as indicated by the essentially square-shaped frame 112 shown in Fig. 2.
[0020] The vacuum chamber 100 is configured for holding a substrate 142. For example, and not limited thereto, the vacuum chamber may include a substrate holder 140, such as a platen and / or pins, to hold the substrate 142.
[0021] The vacuum chamber 100 may be modular. Modular, in the sense of this disclosure, is to be understood as the vacuum chamber 100 having at least twoconfigurations. In a first configuration, shown in Fig. 1A, the vacuum chamber includes a heating system 110. In a second configuration, shown in Fig. 1 B, the vacuum chamber does not include the heating system 110, and is configured for having the heating system 110 included as an optional module. In both configurations, the vacuum chamber 100 is functional and operable in the cluster processing system, e.g. to establish a vacuum.
[0022] Referring now to Fig. 1A, a first configuration of the vacuum chamber 100 is described in further detail. The vacuum chamber 100 includes a chamber body 130 with sidewalls. The sidewalls include a top surface 152 which extends essentially horizontally and / or parallel to the substrate 142 and / or the substrate holder 140.
[0023] According to embodiments, as shown in Fig. 1 , the top surface 152 may include one or more sealing elements 154, such as a gasket, such as an O-ring gasket, provided in a groove formed within the top surface 152 of the chamber body sidewalls.
[0024] The top surface 152 is configured for form ing a seal together with a surface provided opposite the top surface 152. In Fig. 1A, a first seal 150 is formed between the top surface 152 and a first sealing surface 162 of a frame 112 of a heating system 110.
[0025] The vacuum chamber 100 further includes a lid 120 provided on top of the vacuum chamber 100 so that the lid and the body of the vacuum chamber, and optionally the frame 112 of the heating system 110, define an enclosed volume within the vacuum chamber 100.
[0026] The lid 120 includes a bottom surface 172. The bottom surface 172 is configured for forming a seal together with a surface provided opposite the bottom surface 172. In Fig. 1A, a second seal 160 is formed between the bottom surface 172 of the lid and a second sealing surface 164 of a frame 112 of a heating system 110.
[0027] According to embodiments, as shown in Fig. 1A, the second sealing surface 164 may include one or more sealing elements 166, such as a gasket, such as an O-ring gasket, provided in a groove formed within the second sealing surface 164. In particular, the second sealing surface 164 may be configured similar to the top surface 152, particularly so that a seal formed between the top surface 152 and the bottom surface 172 has essentially the same characteristics and / or dimensions as a seal formed between the second sealing surface 164 and the bottom surface 172.
[0028] In the second configuration shown in Fig. 1 B, the heating system 110 is removed from the vacuum chamber 100. Accordingly, a seal 170 is formed between the top surface 152 of the chamber body sidewalls and the bottom surface 172 of the lid.
[0029] As shown in Fig. 1A, in the first configuration, a heating system 110 is provided in-between the vacuum chamber body 130 and the lid 120. The heating system 110 is shown in further detail in Fig. 2 in a plan view. The heating system 110 includes a frame 112 and a plurality of linear heating lamps 114 supported in the frame 112. The frame 112 is configured for being inserted between the vacuum chamber body 130 and a vacuum chamber lid 120. The frame includes a first sealing surface 162 configured for forming a first seal 150 between a top surface 152 of the chamber body and the frame 112, and a second sealing surface 164 opposite the first sealing surface 162 configured for forming a second seal 160 between the vacuum chamber lid 120, particularly a bottom surface 172 of the lid 120, and the frame 112.
[0030] As shown in Fig. 1 , the first seal 150, the second seal 160, and the seal 170 formed between the top surface 152 and the bottom surface 172 have essentially the same configuration. According to embodiments, the first sealing surface 162 may include a flat surface dimensioned so as to correspond to the bottom surface 172 of the lid 120, and the second sealing surface 164 may include a groove for holding a gasket and is dimensioned so as to correspond to the top surface 152 of the chamber body. Beneficially, the first seal 150, the second seal 160, and the seal 170 having essentially the same configuration allows the vacuumchamber 100 to be modular, i.e. the heating system 110 being optional. Accordingly, a user of the vacuum chamber may operate the vacuum chamber 100 with the heating system 110 installed, e.g. when heating of the substrate 142 and / or an inside of the vacuum chamber 100 is desirable, or with the heating system 110 removed.
[0031] According to embodiments, the first sealing surface 162 and the second sealing surface 164 are different. In the example shown in Fig. 1A, the second sealing surface 164 includes a groove for holding a gasket, such as an O-ring gasket. Likewise, the second sealing surface 164 may include or be configured for holding other types of sealing elements. The first sealing surface 162 is a flat surface. A flat surface, in the context of the seals described herein, should be understood as a surface configured for having an essentially flat portion for forming a seal e.g. with a corresponding sealing element 154, such as the gasket provided in a top surface 152 of a sidewall of the vacuum chamber body, e.g. when the sealing element is pressed against the flat surface. Accordingly, in some configurations, a surface such as the top surface 152, the first sealing surface 162, the second sealing surface 164, and the bottom surface 172 may include a flat surface portion for engaging a sealing element, such as a gasket provided in the opposite surface, while simultaneously including e.g. a groove for holding a gasket in a position offset from the flat surface portion.
[0032] It should be noted that the configuration of the first seal 150, the second seal 160 and / or the seal 170 is exemplary, and alternative sealing configurations may be provided. For example, in an alternative configuration, the sealing elements 154, 166 may be provided in a groove in the bottom surface 172 of the lid 120 and the first sealing surface 162 while the top surface 152 and the second sealing surface 164 are flat surfaces. Likewise, additional sealing elements, such as additional O-rings may be provided.
[0033] Referring now to Fig. 2, further aspects of the heating system 110 are described. The plurality of linear heating lamps 114 may include heating lamps comprising one or more filaments to generate infrared radiation when powered by an electric power source, such as nichrome, tungsten, graphite, or carbon fiberfilaments. Beneficially, a linear heating lamp may be chosen according to the desired infrared wavelength and / or spectrum at a desired power rating of the lamp. A linear heating lamp may be understood as a heating lamp having an essentially cylindrical body portion, a length of the cylindrical body portion being equal or larger than 10 times the diameter of the cylindrical body portion, or equal or larger than 20, equal or larger than 50, or even equal or larger than 100 times the diameter of the cylindrical body portion. Essentially bulb-shaped heating lamps are not considered linear heating lamps in the context of this disclosure.
[0034] As shown in Fig. 2, the plurality of linear heating lamps 114 may be arranged in an array, e.g. by arranging the plurality of linear heating lamps in parallel, in-between sidewalls of the frame. According to embodiments, the linear heating lamps extend essentially horizontally between opposite sidewalls of the frame. The array of linear heating lamps 114 may be arranged on a plane essentially parallel to the substrate 142, the substrate holder 140, and / or the lid 120.
[0035] In the exemplary embodiment shown in Fig. 2, the plurality of linear heating lamps 1 14 includes 6 heating lamps. The number of linear heating lamps may vary according to the dimensions of the vacuum chamber 100 and / or the frame 112, e.g. a higher or lower number of heating lamps may be provided depending on the size of the vacuum chamber 100 and / or the size of the substrate 142 to be held and / or processed in the vacuum chamber 100. For example, in some embodiments, the plurality of heating lamps may be in the range between 4 and 50, such as between 10 and 40, such as between 20 and 30.
[0036] According to embodiments, the vacuum chamber 100 may include an electric power source (not shown) for powering the linear heating lamps 114. For example, and not limited thereto, the power source may activate the plurality of linear heating lamps 114 together and / or individually.
[0037] The plurality of heating lamps may be equally spaced within the frame, the equal spacing beneficially improving heating homogeneity, e.g. when heating a substrate 142.
[0038] Referring now to Fig. 3, a support structure 300 according to embodiments for supporting a linear heating lamp 114 in a frame 112 of a heating system 110 is described. The support structure 300 includes an outer flange 310 for supporting the linear heating lamp 114 in a sidewall of the frame 112. In some embodiments, the support structure 300 may be provided in opposite sidewalls of the frame 112, particularly so that the linear heating lamp 114 is supported by two support structures 300 on opposite ends of the linear heating lamp 114. In some embodiments, e.g. when a plurality of linear heating lamps 114 is provided, each linear heating lamp may be individually supported by at least one support structure 300, such as two opposite support structures 300.
[0039] In the embodiment shown in Fig. 3, the support structure 300 includes an outer flange 310 extending at least partially into an opening formed in the sidewall of the frame 112, and extending partially around a portion of the linear heating lamp 114 and surrounding the linear heating lamp 114. In some embodiments, the outer flange 310 may mechanically support the linear heating lamp 114. In particular, the linear heating lamp 114 may be slidably supported, e.g. so that the lamp can slide within the outer flange 310, e.g. along a horizontal direction, such as an axial direction of the lamp. Likewise, the outer flange 310 may be configured for providing a limited rotation of the outer flange 310 with respect to the linear heating lamp 114.
[0040] In some embodiments, additionally, or alternatively, the linear heating lamp 114 may be mechanically supported by the connection to the conductive bolt 340. For example, a mechanical connection may be established between the conductive bolt 340 and an end portion of the linear heating lamp 114 by a clamp or other fastening element. The mechanical connection may contribute to and / or form the electrical connection between the conductive bolt 340 and the linear heating lamp 114.
[0041] In some embodiments, such as shown in Fig. 3, additionally, or alternatively, the linear heating lamp 114 may be supported by a seating portion of the outer flange 310 configured for seating the linear heating lamp 114. The seating portion is formed by a portion of the outer flange 310 having a diameter larger than the outer diameter of the heating lamp and configured for contacting the linearheating lamp 114 so that the linear heating lamp 114 can slide within the seating portion. The seating portion may protrude inwardly, i.e. towards the linear heating lamp 114, from the outer flange 310. According to embodiments, the outer flange 310 may be formed of a heat resistant, electrically non-conductive material, such as a ceramic material.
[0042] In the embodiment shown in Fig. 3, the outer flange 310 includes a main body and a removeable top portion 312. The top portion 312 may be removeable from the main body, e.g. for installation of the linear heating lamp 114 and / or for providing access for forming an electrical connection with the linear heating lamp 114 between the conductive bolt 340 and a connector of the linear heating lamp 114.
[0043] In the embodiment shown in Fig. 3, the support structure 300 further includes an isolation disc 330 provided on the outside of the frame. The isolation disc 330 may be made of an insulating material, such as a polymer, such as polyether ether ketone (PEEK). The support structure 300 may include a pin 350 extending through the isolation disc 330 and at least partially into the outer flange 310. The pin 350 may be a locating pin, e.g. for rotationally locking the isolation disc 330 and the outer flange 310. In some embodiments, the pin 350 may be a bolt, e.g. for affixing the isolation disc 330 to the outer flange 310.
[0044] In the embodiment shown in Fig. 3, the support structure 300 includes a conductive bolt 340 configured for providing an electric connection between an external power source connected to the conductive bolt 340 e.g. via a terminal 342 and a connector of the linear heating lamp. Accordingly, the conductive bolt 340 provides a power feedthrough from the outside of the frame 112 to the inside of the frame 112 through the isolation disc 330 and the outer flange 310. In some embodiments, the conductive bolt 340 may be configured, in addition to or alternatively to the pin 350, for affixing the isolation disc 330 to the outer flange 310. For example, the conductive bolt 340 may include one or more threaded portions for receiving one or more nuts so that, when a nut is tightened, the outer flange 310 is pulled towards the isolation disc 330.
[0045] In the embodiment shown in Fig. 3, when the heating system 110 is operating in a vacuum chamber 100 according to embodiments described herein, the linear heating lamp 114 is exposed to a vacuum when a vacuum is provided inside the vacuum chamber 100. Accordingly, the support structure 300 includes a sealing arrangement configured for sealing the support structure 300 against atmosphere ingress. The sealing arrangement includes a first sealing element 314, such as a gasket, particularly an O-ring gasket, for sealing the outer flange 310 against an inner sidewall of the frame 112. According to embodiments, a second sealing element (not shown) may be provided for sealing the conductive bolt 340 against the outer flange 310. The second sealing element may include a gasket provided longitudinally along the length of the conductive bolt 340, and / or a gasket, such as an O-ring gasket, provided in-between a radially extending, e.g. discshaped protrusion (not shown) of the conductive bolt 340, located in-between the outer flange 310 and the linear heating lamp 114. The protrusion may be pushed against the outer flange 310 when the outer flange 310 is pulled towards the isolation disc 330 by the conductive bolt 340.
[0046] In the embodiment shown in Fig. 3, the linear heating lamp 114 is supported on opposite sides of the linear heating lamp 114 by the support structure 300. Each of the support structures 300 includes an electrical connection formed between the conductive bolt 340 and the linear heating lamp 114 to electrically connect the linear heating lamp 114 to an electric power source. According to further embodiments, the support structure 300 may include two electrical connections, e.g. two conductive bolts 340, and supply two electrical connections on only one side of the linear heating lamp 114. Accordingly, when two electrical connections are provided on one side of the linear heating lamp 114, a support structure 300 provided on the opposite side may be devoid of an electrical connection, e.g. the conductive bolt 340 may be optional.
[0047] Beneficially, the support structure 300 allows a deformation of the frame 112, e.g. due to flexion of the vacuum chamber 100 when applying a vacuum, without transferring undesirable forces onto the linear heating lamp 114 that could lead to breaking of the linear heating lamp. In particular, the linear heating lamp maymove, e.g. longitudinally, within the outer flange 310 and / or a seating portion of the outer flange 310. Beneficially, the connection between the conductive bolt 340 and the linear heating lamp 114 may be flexible, e.g. by allowing limited movement between the conductive bolt 340 and the linear heating lamp 114. Beneficially, the electrical connection, e.g. between the conductive bolt 340 and the linear heating lamp 114, is shielded by the outer flange 310 to reduce the risk of arcing during operation of the linear heating lamp 114 while under vacuum.
[0048] Referring now to Fig. 4, a support structure 400 according to embodiments for supporting a linear heating lamp 114 in a frame 112 of a heating system 110 is described. The support structure 400 shares several of the features of the support structure 300 described with reference to Fig. 3, and only the differences with respect to the support structure 300 shown in Fig. 3 are explained. Aspects explained with reference to the support structure 400 shown in Fig. 4 may apply to the support structure 300 shown in Fig. 3.
[0049] In the embodiment shown in Fig. 4, the linear heating lamp 114 is provided inside a transparent tube 430. Transparent, in the context of this disclosure, should be understood as having an optical transmittance of 80% or more in the IR spectrum, such as at wavelengths between 1000 nm and 3000 nm. For example, the transparent tube may be made from quartz, such as fused quartz.
[0050] The transparent tube 430 defines an inner space, the linear heating lamp 114 being provided within the inner space. The transparent tube 430 separates the inner space from a processing volume of the vacuum chamber 100. For example, while the vacuum chamber 100 is maintained at a vacuum, the inner space may be maintained at a different pressure, such as atmospheric pressure. Accordingly, the linear heating lamp 114 is shielded from a vacuum provided in the vacuum chamber 100 by the transparent tube 430.
[0051] The support structure 400 includes an outer flange 410 and an inner flange 420. The outer flange is mounted to a sidewall of the frame 112, e.g. by bolts (not shown) extending through the outer flange 410, and optionally the inner flange 420 into the sidewall of the frame 112. Additionally, or alternatively, as shown in Fig. 4,bolts 422 and 424 may be provided for affixing the inner flange 420 to the outer flange 410 and providing a clamping force for affixing the transparent tube 430 inbetween the inner flange 420 and the outer flange 410.
[0052] A pin 450 may be provided for rotationally locking the outer flange 410 with respect to the sidewall. Rotationally locking the outer flange 410 may beneficially provide the one or more conductive bolts 440 in a desired rotational position. For example, in some embodiments, the one or more conductive bolts 440 may be supported within and / or by the outer flange 410 in a defined position with respect to the outer flange 410. Accordingly, the pin 450 may lock the rotational position of the one or more conductive bolts 440 with respect to the sidewall.
[0053] In the embodiment shown in Fig. 4, a single conductive bolt 440 is shown. Accordingly, an electrical and / or mechanical connection between the linear heating lamp 114 and the conductive bolt 440 may be formed on both ends of the linear heating lamp 114 by a pair of support structures 400. An electric power source may be connected to a terminal 442 of the conductive bolt 440.
[0054] Alternatively, the support structure may include two conductive bolts 440 provided e.g. side by side. Each conductive bolt 440 may be connected to separate terminals of the linear heating lamp for powering the linear heating lamp. Accordingly, an electric power source may be connected to separate terminals 442 of the conductive bolts 440 so that an electric circuit is formed between the power supply and the linear heating lamp 114. The rotational orientation of the conductive bolts 440 may define the rotational orientation of the linear heating lamp. In the alternative embodiment, only one of the pair of support structures may be a support structure 400 as shown in Fig. 4, and the opposite support structure may e.g. be a support structure 500 as shown in Fig. 5.
[0055] The support structure 400 includes a sealing arrangement for sealing the inside volume of the transparent tube 430 from an inside of the vacuum chamber 100. In the embodiment shown in Fig. 4, the sealing arrangement includes a first gasket 414 for sealing the outer flange 410 against the sidewall, a second gasket 416 for sealing the outer flange 410 against an outer flanged portion of thetransparent tube 430, and a third gasket 418 for sealing an inner flanged portion of the transparent tube 430 against the inner flange 420. In some embodiments, the third gasket 418 may be optional. According to embodiments, the gaskets 414, 416, 418 may be 0-ring gaskets.
[0056] The support structure 400 includes a support bracket 460 for supporting the transparent tube 430. In the embodiment shown in Fig. 4, the support bracket 460 is shown as having an L-shaped profile, however, other shapes, such as U- shapes, may be suitable. Further aspects of the support bracket 460 are described herein with reference to Fig. 6.
[0057] The support bracket 460 is mounted to the inner flange 420, e.g. by the bolt 422. Alternatively, the support bracket 460 may be mounted to other elements of the support structure 400, such as the outer flange 410, or even an inner sidewall of the frame 112. While the support structure 400 shown in Fig. 4 shows the outer flange 410 and the inner flange 420 as contacting the transparent tube 430, a radial gap between the transparent tube and the outer flange 410 and / or the inner flange 420 may be provided. The radial gap may be in the range of 0.5 mm to 2 mm. Likewise, an axial gap may be provided between the flanged portion of the transparent tube 430 and the outer flange 410 and / or the inner flange 420. The axial gap may be in the range of 0.5 mm to 2 mm. Accordingly, the support bracket 460 may support the transparent tube 430 at least vertically so that the transparent tube does not contact, or only loosely contacts, the inner flange 420 and / or the outer flange 410 at positions other than the sealing arrangement, e.g. the gaskets 414, 416, 418.
[0058] According to embodiments, the transparent tube 430 is slidably supported on the support bracket. Beneficially, the support structure 400 allows a deformation of the frame 112, e.g. due to flexion of the vacuum chamber 100 when applying a vacuum, without transferring undesirable forces onto the transparent tube 430 that could lead to breaking of the transparent tube 430.
[0059] Referring now to Fig. 5, a support structure 500 according to embodiments for supporting a linear heating lamp 114 in a frame 112 of a heating system 110 isdescribed. The support structure 500 shares several of the features of the support structure 400 described with reference to Fig. 4, and only the differences with respect to the support structure 400 shown in Fig. 4 are explained. Some elements of the support structure 500 were omitted in the figure for clarity.
[0060] In particular, the support structure 500 may form an opposite counterpart in a pair of support structures with the support structure 400 shown in Fig. 4, where the support structure 400 includes the electrical connections, e.g. two electrical connections, with the linear heating lamp 114, and no electrical connection is provided by the support structure 500.
[0061] The support structure 500 is devoid of a feedthrough in the frame 112, and is further devoid of a conductive bolt 440 and the inner and outer flanges 410, 420. As shown in Fig. 5, the transparent tube 430 and the linear heating lamp 113 are closed at the end supported by the support structure 500. Accordingly, in the embodiment shown in Fig. 5, no further sealing elements are required, and the support structure 500 may be devoid of sealing elements. Due to no conductive bolt 440 being present for mechanically supporting the linear heating lamp 114, the linear heating lamp is supported within the transparent tube 430 by a bushing 520. In the embodiment shown in Fig. 5, the bushing 520 is provided between inner walls of the transparent tube 430 and the linear heating lamp.
[0062] The linear heating lamp 114 is slidably provided within the bushing 520. In particular, an inner diameter of the bushing 520 may be larger than an outer diameter of the linear heating lamp 114. Beneficially, the support structure 500 allows a deformation of the frame 112, e.g. due to flexion of the vacuum chamber 100 when applying a vacuum, without transferring undesirable forces onto the linear heating lamp 114 that could lead to breaking of the linear heating lamp 114.
[0063] In the embodiment shown in Fig. 5, the support bracket 460 is mounted to an inner sidewall of the frame 112 and supports the transparent tube 430. Beneficially, as shown in Fig. 5, the support bracket 460 may support the transparent tube 430 at and / or close to the bushing 520 so that a force generated by the weight of the linear heating lamp 114 is transferred through the transparenttube 430 onto the support bracket 460 without causing excessive axial strain within the transparent tube 430.
[0064] Referring now to Fig. 6, a support bracket 460 according to embodiments is shown in a front view, i.e. in the plane extending parallel to an inner sidewall of the vacuum chamber body 130. In the example shown in Fig. 6, the support bracket 460 is configured for supporting two neighboring transparent tubes 430, which may be individually supported by a pair of support structures, such as the support structures 400, 500 shown in Fig. 4 and / or 5. The support bracket may be configured for supporting a larger number of transparent tubes 430, such as the number of transparent tubes provided within the frame 112. Accordingly, a heating system 110 according to embodiments may include two support brackets 460, each support bracket 460 supporting the plurality of linear heating lamps on opposite sides.
[0065] As shown in Fig. 6, the support bracket 460 includes recesses with a portion having a circular sector shape profile, such as a half-circle. The recesses are configured for having the transparent tube 430 lowered therein so that the transparent tube is supported, e.g. held up, by the circular section profile portion of the recess. Additionally, as shown in Fig. 6, the recess may further support the transparent tube 430 against sideways, i.e. left or right movement. A diameter of the circular section profile portion of the recess may be larger than an outer diameter of the transparent tube 430 so that the transparent tube is slidably supported in the recess by the support bracket.
[0066] According to embodiments, as shown in Fig. 6, the support structure 400 shown in Fig. 4, the support structure 500 shown in Fig. 5, and the support bracket 460 shown in Fig. 4, 5 and 6 are provided so that the transparent tube 430 and the linear heating lamp 114 are supported essentially coaxially.
[0067] According to embodiments, when a linear heating lamp is supported by two opposing support structures 400 shown in Fig. 4, each support structure may provide an electrical and mechanical connection between the support structure 400 and an end of the linear heating lamp. The connection may be flexible, e.g. by including a flexible portion, such as a wire portion and / or a flexible terminal portionof the linear heating lamp 114, between the conductive bolt 440 and the linear heating lamp, which may compensate for flexion of the vacuum chamber 100.
[0068] According to embodiments, when a linear heating lamp 114 is supported by the support structure 400 having two electrical connections on one end of the linear heating lamp 114, and the support structure 500 supporting the linear heating lamp in a bushing 520 on the other end, the electrical connection may be comparably stiff and / or rigid, since a flexion of the vacuum chamber 100 may be compensated by the slidable support of the linear heating lamp 114 in the support structure 500.
[0069] Beneficially, providing the transparent tube 430 separates the linear heating lamp and an inside portion of the support structure 400, 500 from the inside of the vacuum chamber. Separating the heating lamp from the inside of the vacuum chamber may beneficially reduce the risk of arcing due to no electric power carrying parts being exposed to a vacuum. Additionally, the transparent tube 430 may beneficially reduce the risk of contamination of the inside of the vacuum chamber 100.
[0070] Referring now to Fig. 7, a method 700 of processing a substrate in a vacuum chamber is described. The vacuum chamber may be the vacuum chamber 100 according to embodiments described herein, e.g. as described with reference to Fig. 1. The heating system may be the heating system 110 according to embodiments described herein.
[0071] The vacuum chamber includes a chamber body with sidewalls, a lid, and a heating system with a frame and a plurality of linear heating lamps supported in the frame. A first seal is formed between a top surface of the sidewalls of the chamber body and a bottom surface of the frame. A second seal is formed between a bottom surface of the lid and a top surface of the frame.
[0072] The method 700 may include installing 710 the heating system. Installing the heating system may include positioning a frame of the heating system, e.g. a first sealing surface of the frame, on the top surface of the sidewalls and forming thefirst seal. Installing the heating system may further include positioning the lid on a top surface of the frame, such as a second sealing surface, and forming the second seal.
[0073] It should be noted that the operation 710 is reversible. In particular, the heating system may be removed from the vacuum chamber, and a seal may be formed between the top surface of the chamber body and the bottom surface of the lid. Accordingly, a vacuum may be established within the vacuum chamber even when the heating system is not present.
[0074] According to embodiments, operation 710 may include replacing a first heating system with a second heating system. The heating system being replaceable may beneficially allow the vacuum chamber to remain in operation with a functional second heating system, while the first heating system is being maintained.
[0075] According to embodiments, the method 700 includes activating 720 the plurality of heating lamps. Activating the plurality of heating lamps may include providing an electric power to the heating lamps, e.g. by an electric power source connected to the plurality of heating lamps so that the plurality of heating lamps emit radiation, particularly infrared radiation.
[0076] In some embodiments, activating 720 the plurality of heating lamps may include providing a vacuum in the vacuum chamber. For example, the vacuum chamber may be a load lock chamber, and a vacuum may be established after loading of a substrate from an atmosphere-facing lock, or before loading a substrate from a vacuum-facing lock.
[0077] The method 700 may include conditioning 730 the vacuum chamber for substrate processing. For example, conditioning 730 may include establishing a vacuum inside the vacuum chamber. Conditioning the vacuum chamber may include activating 720 the plurality of linear heating lamps without a substrate present, e.g. to perform a bake-out of the vacuum chamber.
[0078] The method 700 may include heating 740 a substrate. Heating a substrate may include loading a substrate into the vacuum chamber, establishing a vacuum, and activating the plurality of linear heating lamps to heat the substrate. Beneficially, heating the substrate in the vacuum chamber 100 may bring the substrate to a processing temperature so that when the substrate is transferred from the vacuum chamber 100 to a downstream processing chamber, processing of the substrate may begin within the processing chamber with no or only a limited delay.
[0079] While the foregoing is directed to some embodiments, other and further embodiments may be devised without departing from the basic scope, and the scope is determined by the claims that follow.
Claims
CLAIMSWhat is claimed is:1 . Heating system for a vacuum chamber for holding a substrate, comprising: a frame configured to be inserted between a vacuum chamber body and a vacuum chamber lid; a plurality of linear heating lamps supported in the frame; wherein the frame comprises a first sealing surface configured for forming a first seal between a top surface of the chamber body and the frame, and a second sealing surface opposite the first sealing surface configured for forming a second seal between the vacuum chamber lid and the frame.
2. The heating system according to claim 1 , wherein the first sealing surface and the second sealing surface are different.
3. The heating system according to claim 1 or 2, wherein one of the first sealing surface and the second sealing surface comprises a gasket.
4. The heating system according to any one of the preceding claims, wherein the linear heating lamps are arranged in an array and extend horizontally between opposite sidewalls of the frame.
5. The heating system according to any one of the preceding claims, wherein each of the linear heating lamps are provided inside a transparent tube, the transparent tube defining an inner space of the transparent tube, the inner spacebeing separated from a processing volume of the vacuum chamber and being provided at an atmospheric pressure.
6. The heating system according to claim 5, comprising support brackets provided in opposite sidewalls of the frame, the support brackets being configured for supporting the transparent tube.
7. The heating system according to claim 6, wherein the transparent tube is slidably supported on the support bracket.
8. The heating system according to any one of the preceding claims, comprising a support structure for individually supporting the linear heating lamps in opposite sidewalls of the frame.
9. The heating system according to claim 8, each of the linear heating lamps being supported on opposite sides of the linear heating lamp by a pair of support structures, at least one support structure of the pair of support structures comprising an electrical connection for electrically connecting the linear heating lamp to a power source.
10. The heating system according to claim 9, wherein the linear heating lamp is slidably supported by at least one support structure of the pair of support structures.11 . The heating system according to any one of claims 8 to 10, wherein each of the support structures comprises an outer flange mounted to a sidewall of the frame.
12. A vacuum chamber configured for holding a substrate and having a modular heating system, the vacuum chamber comprising: a chamber body comprising sidewalls, the sidewalls comprising a top surface, the top surface being configured for forming a first seal between the top surface and the first sealing surface of a heating system according to any one of claims 1 to 11 ; a lid comprising a bottom surface, the bottom surface being configured for forming a second seal between the bottom surface and the second sealing surface of a heating system according to any one of claims 1 to 11 ; the vacuum chamber further being configured for forming a seal between the top surface and the bottom surface when the lid is provided directly on the chamber body.
13. The vacuum chamber according to claim 12, wherein the vacuum chamber is a load lock chamber for a cluster processing system.
14. The vacuum chamber according to claim 12 or 13, wherein the top surface comprises a groove for holding a gasket, and wherein the bottom surface of the lid comprises a flat surface.
15. The vacuum chamber according to any one of claims 12 to 14, further comprising the heating system according to any one of claims 1 to 11 being the modular heating system.
16. The vacuum chamber according to claim 15, wherein the first sealing surface comprises a flat surface dimensioned so as to correspond to the bottom surface of the lid, and wherein the second sealing surface comprises a groove for holding a gasket and is dimensioned so as to correspond to the top surface of the chamber body.
17. Method of processing a substrate in a vacuum chamber, the vacuum chamber comprising: a chamber body comprising sidewalls, the sidewalls comprising a top surface, a heating system comprising a frame and a plurality of linear heating lamps supported in the frame; a first seal formed between the top surface and a bottom surface of the frame; a lid; and a second seal formed between a bottom surface of the lid and a top surface of the frame; the method comprising: activating the plurality of linear heating lamps.
18. The method according to claim 17, further comprising: providing a vacuum in the vacuum chamber.
19. The method according to claim 17 or 18, further comprising providing a substrate in the vacuum chamber, wherein activating the plurality of linear heating lamps comprises heating the substrate.
20. The method according to claim 17 or 18, wherein activating the plurality of linear heating lamps comprises conditioning the vacuum chamber for substrate processing.
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