Optical device, optical device processing method, and electronic device

Abstract

Disclosed in the present application are an optical device, an optical device processing method, and an electronic device, belonging to the field of optical devices. The optical device comprises a metal frame and at least one chip, wherein the metal frame has a first surface and a second surface opposite each other, a mounting groove is provided on the first surface, and the chip is disposed in the mounting groove; and a packaging groove is provided on the second surface, the packaging groove and the mounting groove are opposite in position in the direction from the second surface to the first surface, and are in communication with each other, and the chip faces an opening of the packaging groove.

Description

Optical devices, optical device fabrication methods and electronic equipment

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202410780140.9, filed on June 17, 2024, entitled "Optical Device, Method for Processing Optical Device and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application belongs to the field of optical devices, specifically relating to an optical device, an optical device processing method, and an electronic device. Background Technology

[0004] With the development of technology, electronic devices are becoming increasingly widely used, enabling users to watch videos, capture images, and more. Furthermore, the inclusion of optical components in electronic devices allows for range measurement, infrared detection, and other functions. However, the relatively large thickness of these optical components hinders the pursuit of thinner and lighter electronic devices.

[0005] Application content

[0006] The purpose of this application is to provide an optical device, an optical device processing method, and an electronic device, at least to solve the problem that the large thickness of the optical device is not conducive to the thinning and lightening of the electronic device.

[0007] In a first aspect, embodiments of this application provide an optical device, the optical device comprising: a metal frame and at least one chip;

[0008] The metal frame has a first surface and a second surface facing away from each other. A mounting groove is provided on the first surface, and the chip is disposed in the mounting groove.

[0009] The second surface is provided with a packaging groove, and the packaging groove and the mounting groove are positioned opposite each other in the direction from the second surface to the first surface and are connected. The chip faces the opening of the packaging groove.

[0010] In a second aspect, embodiments of this application provide an optical device processing method for processing the optical device described in the first aspect above, the optical device processing method comprising:

[0011] A metal frame is provided, the metal frame including a first surface and a second surface facing away from each other;

[0012] At least one mounting groove is etched into the first surface, and the chip is placed in the mounting groove;

[0013] An encapsulation groove is etched on the second surface, and the encapsulation groove and the mounting groove are positioned opposite each other in the direction from the second surface to the first surface and are connected.

[0014] Thirdly, embodiments of this application provide an electronic device, which includes the optical device described in the first aspect above.

[0015] In this embodiment, since a mounting groove is provided on the first surface, and the chip is disposed in the mounting groove, the chip can be effectively blocked by the groove wall, preventing the chip from being affected. Because the encapsulation groove and the mounting groove are opposite each other in the direction from the second surface to the first surface and are connected, with the chip facing the opening of the encapsulation groove, the encapsulation groove can avoid the chip, allowing the chip to normally receive or emit light. That is, in this embodiment, by providing mounting grooves and encapsulation grooves on the opposing first and second surfaces of the metal frame, the problem of a large thickness of the optical device caused by placing a top cover on the metal frame or placing the chip on the surface of the metal frame can be avoided. This reduces the thickness of the optical device and is beneficial for the thinning and lightening of electronic devices.

[0016] Additional aspects and advantages of this application will become apparent in the following description or may be learned by practice of this application. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0018] Figure 1 shows one of the schematic diagrams of an optical device provided in an embodiment of this application;

[0019] Figure 2 shows a second schematic diagram of an optical device provided in an embodiment of this application;

[0020] Figure 3 shows a third schematic diagram of an optical device provided in an embodiment of this application;

[0021] Figure 4 shows a fourth schematic diagram of an optical device provided in an embodiment of this application;

[0022] Figure 5 shows a fifth schematic diagram of an optical device provided in an embodiment of this application;

[0023] Figure 6 shows a schematic diagram of an optical device provided in an embodiment of this application;

[0024] Figure 7 shows a schematic diagram of an optical device provided in an embodiment of this application;

[0025] Figure 8 shows an eighth schematic diagram of an optical device provided in an embodiment of this application;

[0026] Figure 9 shows a schematic diagram of an optical device provided in an embodiment of this application;

[0027] Figure 10 shows a schematic diagram of an optical device provided in an embodiment of this application;

[0028] Figure 11 is a flowchart of an optical device processing method provided in an embodiment of this application.

[0029] Reference numerals: 001: Connecting line; 002: Solder; 003: Surface plating; 100: Adhesive; 10: Metal frame; 20: Receiver chip; 30: Transmitter chip; 40: Transmitting element; 50: Molded component; 11: Mounting slot; 12: First encapsulation slot; 13: Second encapsulation slot; 14: Isolation slot; 21: Photosensitive surface; 31: Emitting surface; 101: First surface; 102: Second surface; 103: Connecting terminal; 110: Encapsulation slot; 1201: First slot portion; 1202: Second slot portion. Specific Implementation

[0030] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0031] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] As shown in Figures 1 to 10, the optical device includes: a metal frame 10 and at least one chip;

[0034] The metal frame 10 has a first surface 101 and a second surface 102 facing away from each other. A mounting groove 11 is provided on the first surface 101, and the chip is disposed in the mounting groove 11. A packaging groove 110 is provided on the second surface 102. The packaging groove 110 and the mounting groove 11 are opposite to each other in the direction from the second surface 102 to the first surface 101, and the two are connected. The chip faces the opening of the packaging groove 110.

[0035] In this embodiment, since a mounting groove 11 is provided on the first surface 101, and the chip is disposed in the mounting groove 11, the chip can be effectively blocked by the groove wall of the mounting groove 11, preventing the chip from being affected. Since the encapsulation groove 110 and the mounting groove 11 are positioned opposite each other in the direction from the second surface 102 to the first surface 101 and are connected, and the chip faces the opening of the encapsulation groove 110, the encapsulation groove 110 can avoid the chip, allowing the chip to normally receive or emit light. That is, in this embodiment, by providing the mounting groove 11 and the encapsulation groove 110 on the opposing first surface 101 and second surface 102 of the metal frame 10, the problem of a large thickness of the optical device caused by setting a top cover on the metal frame 10 or placing the chip on the surface of the metal frame 10 can be avoided. This reduces the thickness of the optical device and is beneficial for the thinning and lightening of electronic devices.

[0036] In some embodiments, at least one chip includes a transmitter chip 30 and a receiver chip 20. The metal frame 10 has a first surface 101 and a second surface 102 facing away from each other. At least two mounting slots 11 are provided on the first surface 101. The transmitter chip 30 is disposed in one mounting slot 11, and the receiver chip 20 is disposed in the other mounting slot 11. The encapsulation slot 110 includes a first encapsulation slot 12 and a second encapsulation slot 13. The first encapsulation slot 12 and the mounting slot 11 for the transmitter chip 30 are positioned opposite each other in the direction from the second surface 102 to the first surface 101, and are connected. At least a portion of the transmitter chip 30 faces the opening of the first encapsulation slot 12. The second encapsulation slot 13 and the mounting slot 11 for the receiver chip 20 are positioned opposite each other in the direction from the second surface 102 to the first surface 101, and are connected. At least a portion of the receiver chip 20 faces the opening of the second encapsulation slot 13.

[0037] Since at least two mounting slots 11 are provided on the first surface 101, with the transmitting chip 30 disposed in one mounting slot 11 and the receiving chip 20 disposed in the other mounting slot 11, the receiving chip 20 and the transmitting chip 30 are effectively isolated by the slot walls between the two mounting slots 11, preventing the receiving chip 20 and the transmitting chip 30 from interfering with each other. Because the first encapsulation slot 12 and the mounting slot 11 where the transmitting chip 30 is disposed are positioned opposite each other in the direction from the second surface 102 to the first surface 101, and are connected, with at least a portion of the transmitting chip 30 facing the opening of the first encapsulation slot 12, the light emitted by the transmitting chip 30 can pass through the first encapsulation slot 12 and be transmitted from the first encapsulation slot 12 to the outside of the metal frame 10. Since the second encapsulation slot 13 and the mounting slot 11 for the receiving chip 20 are positioned opposite each other in the direction from the second surface 102 to the first surface 101 and are connected, with at least a portion of the receiving chip 20 facing the opening of the second encapsulation slot 13, once the light emitted by the transmitting chip 30 shines on an object, after the light is reflected by the object, the reflected light can pass through the second encapsulation slot 13 and shine on the receiving chip 20, allowing the receiving chip 20 to receive the light from the transmitting chip 30 and determine the corresponding information through the light from the transmitting chip 30. Furthermore, by providing mounting slots 11, the first encapsulation slot 12, and the second encapsulation slot 13 on the opposing first surface 101 and second surface 102 of the metal frame 10, the transmitting chip 30 and the receiving chip 20 can be placed in different mounting slots 11, preventing them from interfering with each other. Moreover, by providing mounting slots 11, the problem of a large thickness of the optical device can be avoided by placing a top cover on the metal frame 10 or placing the transmitting chip 30 and the receiving chip 20 on the surface of the metal frame 10. That is, in this embodiment of the application, by setting mounting grooves 11, first encapsulation grooves 12 and second encapsulation grooves 13 on the first surface 101 and the second surface 102 opposite to the metal frame 10 respectively, the transmitting chip 30 and the receiving chip 20 are respectively set in different mounting grooves 11, and the thickness of the optical device can be reduced.

[0038] In related technologies, optical devices may include a substrate, which generally has a mounting surface. A transmitting chip 30 and a receiving chip 20 are disposed on the mounting surface. A top cover is then placed on the mounting surface to encapsulate the transmitting chip 30 and the receiving chip 20. Alternatively, a barrier is placed on the mounting surface, located behind the transmitting chip 30 and the receiving chip 20, thus preventing them from interfering with each other. The transmitting chip 30 and the receiving chip 20 are then encapsulated using an encapsulation material. However, both placing a top cover and a barrier on the mounting surface result in a relatively large thickness of the optical device, which is detrimental to achieving a thinner and lighter design. In this embodiment, by opening mounting grooves 11, first encapsulation grooves 12, and second encapsulation grooves 13 on the opposite first surface 101 and second surface 102 of the metal frame 10, after the receiving chip 20 and the transmitting chip 30 are respectively placed in different mounting grooves 11, it is equivalent to the receiving chip 20 and the transmitting chip 30 being located inside the metal frame 10, rather than on the surface of the metal frame 10. Furthermore, the transmitting chip 30 and the receiving chip 20 can be isolated by different mounting grooves 11, thereby avoiding the need to set additional barrier components on the surface of the metal frame 10. In other words, the thickness of the optical device can be reduced through the solution of this application, which is beneficial for the thinning of electronic devices.

[0039] It should be noted that, in this embodiment, the emitting chip 30 may have a light-emitting surface 31, and the receiving chip 20 may have a photosensitive surface 21. The light-emitting surface 31 of the emitting chip 30 may face the opening of the first encapsulation groove 12, so that the light emitted by the light-emitting surface 31 can pass through the first encapsulation groove 12 and be transmitted to the outside of the metal frame 10. The photosensitive surface 21 of the receiving chip 20 may face the opening of the second encapsulation groove 13, so that the light emitted by the emitting chip 30 shines on the object and is reflected, and the reflected light can be transmitted to the opening of the second encapsulation groove 13 and then shine on the photosensitive surface 21, so that the receiving chip 20 can sense the light.

[0040] In addition, in this embodiment, the transmitting chip 30 can be a light-emitting chip. Furthermore, the receiving chip 20 can be a photosensitive chip.

[0041] Of course, in the embodiments of this application, at least one chip may be only one chip, and the chip is a receiving chip 20. In this case, it is equivalent to having only a receiving chip 20 in the optical device and no transmitting chip 30.

[0042] In addition, in this embodiment, when the emitting chip 30 is placed in the mounting groove 11, adhesive 100 can be applied to the light-emitting surface 31 of the emitting chip 30, and then the adhesive 100 is bonded to the bottom of the mounting groove 11. When the receiving chip 20 is placed in the mounting groove 11, soldering adhesive can be applied to the photosensitive surface 21 of the receiving chip 20, and then the adhesive 100 is bonded to the bottom of the mounting groove 11. When the first encapsulation groove 12 and the second encapsulation groove 13 are provided on the second surface 102 of the metal frame 10, the first encapsulation groove 12 and the second encapsulation groove 13 can be formed by etching on the second surface 102. When etching to form the first encapsulation groove 12 and the second encapsulation groove 13, once the first encapsulation groove 12 is connected to the mounting groove 11 where the emitting chip 30 is provided, etching can continue to etch a portion of the adhesive 100 on the light-emitting surface 31 of the emitting chip 30, so that the light-emitting surface 31 is bonded to the bottom of the mounting groove 11 through the other portion of the adhesive 100. Similarly, once the second encapsulation groove 13 is connected to the mounting groove 11 where the receiving chip 20 is provided, etching can continue to etch a portion of the adhesive 100 on the photosensitive surface 21 of the receiving chip 20, so that the photosensitive surface 21 is bonded to the bottom of the mounting groove 11 through the other portion of the adhesive 100.

[0043] In addition, in some embodiments, the first surface 101 is provided with an isolation groove 14 to isolate the remaining positions on the first surface 101 except for the position of the mounting groove 11 to form a plurality of connection terminals 103. The transmitting chip 30 is electrically connected to the connection terminal 103, and the receiving chip 20 is electrically connected to the connection terminal 103.

[0044] Because the first surface 101 is provided with an isolation groove 14, the remaining positions on the first surface 101, except for the mounting groove 11, can be isolated to form multiple connection terminals 103. Since the transmitting chip 30 and the receiving chip 20 are electrically connected to the connection terminals 103, when it is necessary to connect the optical device to other components, the connection terminals 103 can be directly connected to other components, thereby realizing the connection between the transmitting chip 30 and the receiving chip 20 and other components. Furthermore, the transmitting chip 30 and the receiving chip 20 can transmit signals to other components through the connection terminals 103, or other components can transmit signals to the transmitting chip 30 and / or the receiving chip 20. In other words, by providing the connection terminals 103, and with both the transmitting chip 30 and the receiving chip 20 electrically connected to the connection terminals 103, it is convenient for the optical device to connect to other components, and it is also convenient for other components to communicate with the transmitting chip 30 and the receiving chip 20.

[0045] For example, when optical devices are applied to mobile phones, and when it is necessary for the optical devices to connect to the motherboard of the mobile phone, the connection terminal 103 can be soldered onto the motherboard so that the motherboard can communicate with the transmitting chip 30 and the receiving chip 20. That is, the transmitting chip 30 and the receiving chip 20 can transmit signals to the motherboard, and the motherboard can also transmit signals to the transmitting chip 30 and the receiving chip 20.

[0046] It should be noted that the first surface 101 can be etched to form an isolation groove 14, and the etching can be performed as needed to obtain multiple connection terminals 103, and the multiple connection terminals 103 can be independent of each other.

[0047] In addition, in some embodiments, both the transmitting chip 30 and the receiving chip 20 are electrically connected to the connecting terminal 103 via connecting lines 001, and at least a portion of the connecting lines 001 are located in the first packaging groove 12 and / or the second packaging groove 13.

[0048] Since at least a portion of the connecting wire 001 is located in the first encapsulation groove 12 and / or the second encapsulation groove 13, the problem of the connecting wire 001 being exposed outside the metal frame 10, thus avoiding the need for additional protective adhesive to be applied to the connecting wire 001, can be avoided. Placing at least a portion of the connecting wire 001 in the first encapsulation groove 12 and / or the second encapsulation groove 13 can help reduce the thickness of the optical component.

[0049] It should be noted that when electrically connecting the transmitter chip 30 to the connection terminal 103 via the connecting wire 001, one end of the connecting wire 001 can be soldered to the transmitter chip 30, and the other end of the connecting wire 001 can be soldered to the connection terminal 103, with the connecting wire 001 located in the first packaging groove 12. When electrically connecting the receiver chip 20 to the connection terminal 103 via the connecting wire 001, one end of the connecting wire 001 can be soldered to the receiver chip 20, and the other end of the connecting wire 001 can be soldered to the connection terminal 103, with the connecting wire 001 located in the second packaging groove 13.

[0050] In addition, in some embodiments, the transmitting chip 30 has a light-emitting surface 31 and the receiving chip 20 has a photosensitive surface 21; the light-emitting surface 31 faces the opening of the first packaging groove 12 and the photosensitive surface 21 faces the opening of the second packaging groove 13. Part of the photosensitive surface 21 is electrically connected to the connecting terminal 103 through the connecting line 001, and part of the light-emitting surface 31 is electrically connected to the connecting terminal 103 through the connecting line 001.

[0051] Since part of the photosensitive surface 21 is electrically connected to the connecting terminal 103 through the connecting line 001, and part of the light-emitting surface 31 is electrically connected to the connecting terminal 103 through the connecting line 001, the connecting line 001 can have less impact on the photosensitive surface 21, allowing the photosensitive surface 21 to receive light normally, and the connecting line 001 can also have less impact on the light-emitting surface 31, allowing the light-emitting surface 31 to emit light normally.

[0052] It should be noted that when part of the photosensitive surface 21 is electrically connected to the connecting terminal 103 via the connecting line 001, the connecting line 001 can be bent, so that the connecting line 001 does not affect the photosensitive surface 21 from receiving light. When part of the light-emitting surface 31 is electrically connected to the connecting terminal 103 via the connecting line 001, the connecting line 001 can also be bent, so that the connecting line 001 does not affect the light-emitting surface 31 from emitting light.

[0053] In some embodiments, the transmitting chip 30 has a light-emitting surface 31, and the receiving chip 20 has a photosensitive surface 21. Part of the light-emitting surface 31 is soldered to the bottom of the mounting groove 11 via solder 002, and part of the photosensitive surface 21 is soldered to the bottom of the mounting groove 11 via solder 002. With this configuration, when the transmitting chip 30 or the receiving chip 20 is placed in the mounting groove 11, direct soldering connection can be achieved, avoiding the need for components such as adhesive 100 to fix the transmitting chip 30 or the receiving chip 20. Furthermore, through soldering connection, the transmitting chip 30 can be directly electrically connected to the bottom of the mounting groove 11, thereby enabling the transmitting chip 30 to be electrically connected to the connection terminal 103, and the receiving chip 20 can be electrically connected to the bottom of the mounting groove 11, thereby enabling the receiving chip 20 to be electrically connected to the connection terminal 103.

[0054] In addition, in some embodiments, a surface plating layer 003 is provided on the connection terminal 103, and / or, the remaining portion of the second surface 102 other than the first encapsulation layer and the second encapsulation layer is provided with a surface plating layer 003.

[0055] Because the connection terminal 103 has a surface plating layer 003, when it needs to be connected to other components, the connection terminal 103 can be directly soldered to other components through the surface plating layer 003, thereby enabling communication between the receiving chip 20 and the transmitting chip 30 and other components. Similarly, because the second surface 102 has a surface plating layer 003, when it needs to be connected to other components, the second surface 102 can be directly soldered to other components through the surface plating layer 003, thereby enabling communication between the receiving chip 20 and the transmitting chip 30 and other components. In other words, by providing the surface plating layer 003, it is convenient to solder the connection terminal 103 or the second surface 102 to other components.

[0056] It should be noted that in this embodiment, the surface coating 003 can be a solder ball. Of course, the surface coating 003 can also be of other types, such as a solder layer. The specific type of the surface coating 003 is not limited in this embodiment.

[0057] Furthermore, in this embodiment, the surface plating layer 003 may be provided only on the connecting terminal 103, or only on the second surface 102. Alternatively, the surface plating layer 003 may be provided on both the connecting terminal 103 and the second surface 102. This embodiment does not limit the scope of the application.

[0058] In addition, in some embodiments, a light-transmitting element 40 is provided in both the first encapsulation groove 12 and the second encapsulation groove 13. The light-transmitting element 40 blocks the first encapsulation groove 12 and / or the second encapsulation groove 13, and the light-transmitting element 40 covers the transmitting chip 30 and / or the receiving chip 20.

[0059] Since the light-transmitting element 40 covers the transmitting chip 30 and / or the receiving chip 20, it protects both the transmitting chip 30 and the receiving chip 20. Furthermore, the presence of the light-transmitting element 40 does not affect the light emitted by the transmitting chip 30 or the light received by the receiving chip 20. That is, the light emitted by the transmitting chip 30 can pass through the light-transmitting element 40 to the outside of the metal frame 10, and the light from outside the metal frame 10 can pass through the light-transmitting element 40 and illuminate the receiving chip 20. In other words, by providing the light-transmitting element 40, not only are the transmitting chip 30 and the receiving chip 20 protected, but it also has minimal impact on their normal operation.

[0060] It should be noted that the light-transmitting element 40 can be formed of a light-transmitting material, and the light-transmitting element 40 can be flush with the second surface 102 of the metal frame 10. Furthermore, the light-transmitting element 40 in the first encapsulation groove 12 can completely fill the first encapsulation groove 12, and the light-transmitting element 40 in the second encapsulation groove 13 can completely fill the second encapsulation groove 13, thereby allowing the light-transmitting element 40 to completely cover the receiving chip 20 or the transmitting chip 30, providing better protection for the transmitting chip 30 or the receiving chip 20. Additionally, when a connecting line 001 is provided in the first encapsulation groove 12 and the second encapsulation groove 13, the light-transmitting element 40 can wrap around the connecting line 001, also providing protection for the connecting line 001.

[0061] In addition, in this embodiment, the light-transmitting element 40 can cover the light-emitting surface 31 of the emitting chip 30, and the light-transmitting element 40 can also cover the photosensitive surface 21 of the receiving chip 20.

[0062] In some embodiments, a molding compound 50 is provided in the mounting slot 11, covering both the transmitting chip 30 and the receiving chip 20. By providing the molding compound 50, the transmitting chip 30 and the receiving chip 20 can be protected, avoiding the problem of easy damage to them.

[0063] It should be noted that the molding compound 50 can be formed of molding compound material, and the molding compound 50 can be flush with the first surface 101 of the metal frame 10. In addition, the molding compound 50 in the mounting groove 11 can completely fill the mounting groove 11, so that the molding compound 50 can completely cover the receiving chip 20 or the transmitting chip 30, so as to provide better protection for the transmitting chip 30 or the receiving chip 20.

[0064] In addition, in some embodiments, the first encapsulation groove 12 and the second encapsulation groove 13 are both stepped grooves. The stepped groove includes a first groove portion 1201 and a second groove portion 1202. The size of the first groove portion 1201 is larger than the size of the second groove portion 1202. The second groove portion 1202 is close to the mounting groove 11 and communicates with the mounting groove 11. The opening of the first groove portion 1201 is the groove opening of the first encapsulation groove 12 or the groove opening of the second encapsulation groove 13.

[0065] Since the second groove 1202 is close to and connected to the mounting groove 11, and the opening of the first groove 1201 is the opening of either the first encapsulation groove 12 or the second encapsulation groove 13, the light from the transmitting chip 30 can pass through the second groove 1202 and the first groove 1201 to the outside of the metal frame 10, and the light from the outside of the metal frame 10 can also pass through the first groove 1201 and the second groove 1202 to the receiving chip 20. Furthermore, if it is necessary to install light-transmitting elements 40 in the first encapsulation groove 12 and the second encapsulation groove 13, the stepped groove form can accommodate more light-transmitting elements 40, thus providing better protection for the transmitting chip 30 and the receiving chip 20.

[0066] In addition, in this embodiment, the first encapsulation groove 12 and the second encapsulation groove 13 may only have the second groove portion 1202. That is, after both the first encapsulation groove 12 and the second encapsulation groove 13 are set as stepped grooves, the metal frame 10 can be thinned by etching or other processes, that is, the first groove portion 1201 can be eliminated, and the thickness of the optical device can be further reduced.

[0067] In this embodiment, since a mounting groove 11 is provided on the first surface 101, and the chip is disposed in the mounting groove 11, the chip can be effectively blocked by the groove wall of the mounting groove 11, preventing the chip from being affected. Since the encapsulation groove 110 and the mounting groove 11 are positioned opposite each other in the direction from the second surface 102 to the first surface 101 and are connected, and the chip faces the opening of the encapsulation groove 110, the encapsulation groove 110 can avoid the chip, allowing the chip to normally receive or emit light. That is, in this embodiment, by providing the mounting groove 11 and the encapsulation groove 110 on the opposing first surface 101 and second surface 102 of the metal frame 10, the problem of a large thickness of the optical device caused by setting a top cover on the metal frame 10 or placing the chip on the surface of the metal frame 10 can be avoided. This reduces the thickness of the optical device and is beneficial for the thinning and lightening of electronic devices.

[0068] This application provides an optical device fabrication method for any of the optical devices described in the above embodiments, as shown in FIG11. The optical device fabrication method includes:

[0069] Step 1101: Provide a metal frame, the metal frame including a first surface and a second surface facing away from each other.

[0070] Step 1102: At least one mounting groove is etched on the first surface, and the chip is disposed in the mounting groove.

[0071] The chip can include a transmitting chip and a receiving chip. Of course, the chip can also be just a single chip, namely a receiving chip.

[0072] Additionally, when placing the transmitter chip in the mounting slot, adhesive can be applied to the transmitter chip to bond it to the bottom of the slot. Alternatively, the transmitter chip can be soldered to the bottom of the mounting slot. Similarly, when placing the receiver chip in the mounting slot, adhesive can be applied to the receiver chip to bond it to the bottom of the slot. Again, the transmitter chip can be soldered to the bottom of the mounting slot.

[0073] Step 1103: Etch a packaging groove on the second surface. The packaging groove and the mounting groove are positioned opposite each other in the direction from the second surface to the first surface and are connected.

[0074] If both the transmitting chip and the receiving chip are bonded to the bottom of the mounting groove with adhesive, when etching to form the first encapsulation groove and the second encapsulation groove, a portion of the adhesive can also be etched, so that at least a portion of the light-emitting surface of the transmitting chip and at least a portion of the photosensitive surface of the receiving chip are exposed.

[0075] In addition, in the embodiments of this application, if both the first encapsulation groove and the second encapsulation groove are stepped grooves, after the first encapsulation groove and the second encapsulation groove are formed, the metal frame can be thinned by etching or other processes, that is, the first groove portion can be eliminated, and the thickness of the optical device can be further reduced.

[0076] This application provides an electronic device that includes the optical components described in any of the above embodiments.

[0077] It should be noted that, in the embodiments of this application, electronic devices include, but are not limited to, controllers, smart devices, terminal products, etc., wherein smart devices include, for example, smartphones, smart TVs, smart speakers, smart robots, VR devices, AR devices, XR devices, etc., and terminal products include, for example, personal computers, tablet computers, etc.

[0078] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0079] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An optical device, the optical device comprising: Metal frame and at least one chip; The metal frame has a first surface and a second surface facing away from each other. A mounting groove is provided on the first surface, and the chip is disposed in the mounting groove. The second surface is provided with a packaging groove, and the packaging groove and the mounting groove are positioned opposite each other in the direction from the second surface to the first surface and are connected. The chip faces the opening of the packaging groove.

2. The optical device according to claim 1, wherein, The at least one chip includes a receiving chip and a transmitting chip; The first surface is provided with at least two mounting slots, the transmitting chip is disposed in one of the mounting slots, and the receiving chip is disposed in the other mounting slot; The encapsulation slot includes a first encapsulation slot and a second encapsulation slot. The first encapsulation slot and the mounting slot for the transmitting chip are positioned opposite each other in the direction from the second surface to the first surface and are connected. At least a portion of the transmitting chip faces the opening of the first encapsulation slot. The second encapsulation slot and the mounting slot for the receiving chip are positioned opposite each other in the direction from the second surface to the first surface and are connected. At least a portion of the receiving chip faces the opening of the second encapsulation slot.

3. The optical device according to claim 2, wherein, The first surface is provided with an isolation groove to isolate the remaining positions on the first surface, except for the position of the mounting groove, to form a plurality of connection terminals. The transmitting chip is electrically connected to the connection terminals, and the receiving chip is electrically connected to the connection terminals.

4. The optical device according to claim 3, wherein, Both the transmitting chip and the receiving chip are electrically connected to the connecting terminal via connecting lines, and at least a portion of the connecting lines are located in the first packaging slot and / or the second packaging slot.

5. The optical device according to claim 4, wherein, The transmitting chip has a light-emitting surface, and the receiving chip has a photosensitive surface; The light-emitting surface faces the opening of the first encapsulation groove, and the photosensitive surface faces the opening of the second encapsulation groove. Part of the photosensitive surface is electrically connected to the connection terminal through the connecting line, and part of the light-emitting surface is electrically connected to the connection terminal through the connecting line.

6. The optical device according to claim 3, wherein, The transmitting chip has a light-emitting surface, and the receiving chip has a photosensitive surface; Part of the light-emitting surface is soldered to the bottom of the mounting groove, and part of the photosensitive surface is soldered to the bottom of the mounting groove.

7. The optical device according to claim 3, wherein, The connection terminal is provided with a surface plating layer, and / or the second surface is provided with the surface plating layer in the remaining parts other than the first encapsulation layer and the second encapsulation layer.

8. The optical device according to claim 2, wherein, Both the first encapsulation slot and the second encapsulation slot are provided with light-transmitting elements, which block the first encapsulation slot and / or the second encapsulation slot, and cover the transmitting chip and / or the receiving chip.

9. The optical device according to claim 1, wherein, A molding compound is provided in the mounting slot, and the molding compound covers the chip.

10. The optical device according to claim 2, wherein, Both the first encapsulation groove and the second encapsulation groove are stepped grooves. The stepped groove includes a first groove portion and a second groove portion. The size of the first groove portion is larger than the size of the second groove portion. The second groove portion is close to the mounting groove and communicates with the mounting groove. The opening of the first groove portion is the groove opening of the first encapsulation groove or the groove opening of the second encapsulation groove.

11. A method for processing an optical device, used to process the optical device according to any one of claims 1-10, the method comprising: A metal frame is provided, the metal frame including a first surface and a second surface facing away from each other; At least one mounting groove is etched into the first surface, and the chip is placed in the mounting groove; An encapsulation groove is etched on the second surface, and the encapsulation groove and the mounting groove are positioned opposite each other in the direction from the second surface to the first surface and are connected.

12. An electronic device comprising the optical element according to any one of claims 1-10.

Images