Display substrate and manufacturing method therefor

Abstract

A display substrate and a manufacturing method therefor. The display substrate comprises: a base substrate; multiple light-emitting assemblies disposed on the base substrate, each light-emitting assembly comprising a light-emitting unit and an optical functional unit disposed at a side of the light-emitting unit facing away from the base substrate, and optical functional units of at least some of the multiple light-emitting assemblies being used to convert the color of light entering the optical functional units; an accommodating recess defined between two adjacent light-emitting assemblies; and a dimming layer, the dimming layer comprising a first part located in an accommodating recess, and a second part located outside of the accommodating recess and located at the side of a light-emitting assembly facing away from the base substrate. The second part comprises a convex surface protruding away from the base substrate, and each second part corresponds to one optical functional unit. The first parts and the second parts are continuously distributed integrated structures. Light emitted by the light-emitting assemblies is emitted by means of the dimming layer.

Description

Display substrate and manufacturing method thereof TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, in particular to a display substrate and manufacturing method thereof. BACKGROUND

[0002] In some display products, full-color display is realized by using the architecture of combining monochromatic light-emitting units with color conversion structures, but such display products are prone to have low forward luminance.

[0003] SUMMARY

[0004] The present disclosure aims to at least solve one of the technical problems existing in the prior art, and proposes a display substrate and manufacturing method thereof.

[0005] To achieve the above-mentioned purpose, the present disclosure provides a display substrate, comprising:

[0006] a substrate;

[0007] a plurality of light-emitting components disposed on the substrate, the light-emitting components comprising: a light-emitting unit and an optical functional unit disposed on a side of the light-emitting unit away from the substrate, the optical functional unit of at least part of the light-emitting components being configured to convert the color of light entering the optical functional unit; and a containing groove defined between two adjacent light-emitting components;

[0008] a light-adjusting layer, the light-adjusting layer comprising a first part located in the containing groove and a second part located outside the containing groove and on a side of the light-emitting component away from the substrate; the second part comprises a convex surface protruding away from the substrate, and each second part corresponds to an optical functional unit;

[0009] the first part and the second part are a continuous and integral structure, and the light emitted by the light-emitting component exits through the light-adjusting layer.

[0010] In some embodiments, the edge of the second part is a groove of the containing groove;

[0011] In a direction from the edge of the second part to the center of the second part, the thickness of the second part gradually increases.

[0012] In some embodiments, the thickness of the light-adjusting layer corresponding to the groove of the containing groove is less than the thickness of the light-adjusting layer corresponding to a position inside the groove.

[0013] In some embodiments, the surface of the first part away from the substrate is a concave surface facing the substrate;

[0014] The minimum distance of the concave surface to the substrate is lower than the minimum distance of the notch to the substrate.

[0015] In some embodiments, the center of the accommodating groove corresponds to a thickness of the light-adjusting layer that is greater than a thickness of the light-adjusting layer at the center of the second portion.

[0016] In some embodiments, the material of the light-adjusting layer comprises resin.

[0017] In some embodiments, the light-emitting assembly further comprises a first light-shielding layer,

[0018] The first light-shielding layer comprises a first light-shielding portion and a second light-shielding portion, the first light-shielding portion forms at least part of the groove wall of the accommodating groove, and the second light-shielding portion is located outside the groove wall of the accommodating groove, and the second light-shielding portion is located on a side of the light-emitting unit away from the substrate.

[0019] The second light-shielding portion comprises a first opening opposite to the light-emitting unit, and the light emitted by the light-emitting unit enters the light-adjusting layer through the first opening.

[0020] In some embodiments, the first light-shielding portion and the second light-shielding portion are continuously distributed, and the notch of the accommodating groove is the boundary line of the first light-shielding portion and the second light-shielding portion.

[0021] In some embodiments, the optical functional layer is located between the light-shielding layer and the light-emitting unit, or,

[0022] At least part of the optical functional layer is located inside the first opening.

[0023] In some embodiments, the convex surface comprises a first sub-surface and a second sub-surface surrounding the first sub-surface, a projection of the first sub-surface on the substrate is located within the projection range of the color conversion unit on the substrate and does not overlap with the projection of the first light-shielding layer on the substrate, and a projection of the second sub-surface on the substrate overlaps with the projection of the first light-shielding layer on the substrate.

[0024] The curvature of the second sub-surface is greater than the curvature of the first sub-surface.

[0025] In some embodiments, the optical functional unit comprises a first sub-unit and a second sub-unit, the first sub-unit is located on a side of the light-emitting unit away from the substrate, and the second sub-unit is arranged around the light-emitting unit.

[0026] In some embodiments, the display substrate further comprises:

[0027] a flat layer located on a side of the light-adjusting layer away from the substrate and attached to a surface of the light-adjusting layer away from the substrate, the flat layer having a refractive index less than that of the light-adjusting layer;

[0028] a plurality of light-filtering units located on a side of the flat layer away from the substrate, the light-filtering units being arranged one-to-one with the optical-function units, and the orthographic projection of the light-filtering units on the substrate overlapping with the orthographic projection of the corresponding optical-function units on the substrate.

[0029] In some embodiments, the light emitted by the light-emitting units is blue light or ultraviolet light.

[0030] The optical-function units of the plurality of light-emitting components include a first optical-function unit, a second optical-function unit, and a third optical-function unit; the first optical-function unit is configured to convert the light emitted by the light-emitting units into red light; the second optical-function unit is configured to convert the light emitted by the light-emitting units into green light; and the third optical-function unit is configured to convert the light emitted by the light-emitting units into blue light or maintain the state of blue light.

[0031] The plurality of light-filtering units include a first light-filtering unit corresponding to the first optical-function unit, the first light-filtering unit being a red color resist or a red-green-trans-blue light-filtering film; a second light-filtering unit corresponding to the second optical-function unit, the second light-filtering unit being a green color resist or a red-green-trans-blue light-filtering film; and a third light-filtering unit corresponding to the third optical-function unit, the third light-filtering unit being a blue color resist or a transparent layer.

[0032] In some embodiments, the display substrate further includes a second light-shielding layer located on a side of the flat layer away from the substrate and having second openings corresponding one-to-one to the light-filtering units, the light-filtering units being arranged in the corresponding second openings.

[0033] In some embodiments, the width of the bottom surface of the accommodating groove is greater than or equal to 1 micrometer, and the vertical distance between the bottom surface of the accommodating groove and the surface of the color-conversion unit away from the substrate is greater than or equal to 8 micrometers.

[0034] In some embodiments, the cross-sectional area of the accommodating groove gradually increases in a direction away from the substrate.

[0035] In some embodiments, the display substrate further includes:

[0036] a driving-wire layer arranged on the substrate;

[0037] an insulating layer located on a side of the driving-wire layer away from the substrate;

[0038] a plurality of first conductive pads and a plurality of second conductive pads, the first conductive pads and the second conductive pads being located on a side of the insulating layer away from the substrate, the first conductive pads being electrically connected to the driving trace layer through first vias on the insulating layer, and the second conductive pads being electrically connected to the driving trace layer through second vias on the insulating layer; wherein the first conductive pads and the second conductive pads are respectively electrically connected to the same side of the light-emitting unit and respectively provide first signals and second signals to the light-emitting unit;

[0039] a first planarization layer located between the light-emitting unit and the optical functional unit;

[0040] wherein the first planarization layer is located within the light-emitting assembly, the first planarization layers in adjacent two light-emitting assemblies are spaced apart, a first portion of the light-adjusting layer includes a first bottom surface facing the substrate, a projection of the first planarization layer on the substrate does not overlap with a projection of the first bottom surface on the substrate, or

[0041] the first planarization layer includes a first planar portion located within the light-emitting assembly and a second planar portion located between adjacent light-emitting assemblies, a thickness of the first planar portion is greater than a thickness of the second planar portion, a first portion of the light-adjusting layer includes a first bottom surface facing the substrate, a projection of the second planar portion on the substrate overlaps with a projection of the first bottom surface on the substrate.

[0042] In some embodiments, the display substrate further comprises:

[0043] a driving trace layer disposed on the substrate;

[0044] an insulating layer located on a side of the driving trace layer away from the substrate;

[0045] a plurality of first conductive pads and a connection electrode, the first conductive pads being located on a side of the insulating layer away from the substrate and electrically connected to the driving trace layer through first vias on the insulating layer, the connection electrode being located on a side of the insulating layer away from the substrate and electrically connected to the driving trace layer through third vias on the insulating layer, the first conductive pads and the connection electrode being respectively electrically connected to opposite sides of the light-emitting unit;

[0046] the connection electrode overlaps with at least part of the light-emitting assembly;

[0047] a first planarization layer located between the light-emitting unit and the optical functional unit; the connection electrode is electrically connected to the light-emitting unit through fourth vias on the first planarization layer,

[0048] The first planarization layer is located in the light emitting component, and there is a gap between the first planarization layers in two adjacent light emitting components. The first part of the light adjusting layer includes a first bottom surface facing the substrate. The non-overlapping area between the orthogonal projection of the first planarization layer on the substrate and the orthogonal projection of the first bottom surface on the substrate, or

[0049] The first planarization layer includes a first flat part located in the light emitting component and a second flat part located between adjacent light emitting components. The thickness of the first flat part is greater than the thickness of the second flat part. The first part of the light adjusting layer includes a first bottom surface facing the substrate. The orthogonal projection of the second flat part on the substrate and the orthogonal projection of the first bottom surface on the substrate overlap.

[0050] In some embodiments, the first conductive pad and the connection electrode are respectively used to provide a first signal and a second signal to the light emitting unit; wherein,

[0051] Each of the connection electrodes is connected to a plurality of light emitting units, or,

[0052] Each of the connection electrodes corresponds to one of the light emitting units. The first end of the connection electrode is electrically connected to the light emitting unit through the fourth via. The second end of the connection electrode is electrically connected to the driving trace layer through the third via. The third via is located in a region between at least part of the light emitting components.

[0053] In some embodiments, each of the light emitting units corresponds to one of the connection electrodes. The plurality of light emitting components are divided into a plurality of groups. Each group includes at least two light emitting components with the same light emitting color connected in series. In two adjacent series connected light emitting components, the connection electrode connected to one of the light emitting units is also electrically connected to the first conductive pad corresponding to another light emitting unit.

[0054] In some embodiments, the first part of the light adjusting layer includes a first bottom surface facing the substrate;

[0055] The first bottom surface is in contact with the connection electrode, or,

[0056] The display substrate further includes a second planarization layer. The second planarization layer is located on the side of the connection electrode and the light emitting unit of the light emitting component away from the substrate. The first bottom surface is attached to the second planarization layer.

[0057] In some embodiments, the display substrate further includes:

[0058] A first encapsulation layer is located between the color conversion unit and the light emitting unit.

[0059] a second encapsulation layer located on a side of the color conversion unit away from the substrate;

[0060] The first part of the light-adjusting layer comprises a first bottom surface facing the substrate, and the first bottom surface is attached to the first encapsulation layer or the second encapsulation layer.

[0061] The present disclosure also provides a manufacturing method of a display substrate, comprising:

[0062] forming a plurality of light-emitting assemblies on a substrate; the light-emitting assemblies comprise light-emitting units and optical functional units arranged on a side of the light-emitting units away from the substrate, at least part of the optical functional units of the light-emitting assemblies are used for converting the color of light entering the optical functional units; a containing groove is defined between two adjacent light-emitting assemblies;

[0063] forming a light-adjusting material layer and curing the light-adjusting material layer to form a light-adjusting layer;

[0064] During the curing process, the light-adjusting material layer flows along the topography of the light-emitting assemblies and the containing groove, so that the light-adjusting layer formed after curing comprises a first part located in the containing groove and a second part located outside the containing groove and on a side of the light-emitting assemblies away from the substrate; the second part comprises a convex surface protruding away from the substrate, each second part corresponds to one optical functional unit; the first part and the second part are a continuous and integral structure, and the light emitted by the light-emitting assemblies exits through the light-adjusting layer.

[0065] In some embodiments, the light-adjusting material layer comprises a thermosetting material. BRIEF DESCRIPTION OF DRAWINGS

[0066] The accompanying drawings are included to provide a further understanding of the present disclosure and constitute a part of the specification, and are used together with the specific embodiments described below to explain the present disclosure, but do not constitute a limitation on the present disclosure. In the drawings:

[0067] FIG. 1 is a cross-sectional view of a plurality of light-emitting assemblies of a display substrate provided in some embodiments of the present disclosure.

[0068] FIG. 2 is a schematic view of a plurality of light-emitting assemblies and a light-adjusting layer of a display substrate provided in some embodiments of the present disclosure.

[0069] FIG. 3A is a cross-sectional view of a display substrate provided in some embodiments of the present disclosure.

[0070] FIG. 3B is another cross-sectional view of a display substrate provided in some embodiments of the present disclosure.

[0071] FIG. 4 is still another cross-sectional view of a display substrate provided in some embodiments of the present disclosure.

[0072] FIG. 5 is a scanning electron microscope image of a light modulation layer formed by simulation.

[0073] FIG. 6 is a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0074] FIG. 7 is another cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0075] FIG. 8 is a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0076] FIG. 9 is another cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0077] FIG. 10 is a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0078] FIG. 11A is a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0079] FIG. 11B is another cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0080] FIG. 12 is a further cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0081] FIGS. 13A-13M are schematic views of structures during fabrication of a display substrate according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0082] The specific embodiments of the present disclosure will be described hereinafter with reference to the accompanying drawings, but the present disclosure can not be limited thereto. As those skilled in the art will understand, the embodiments described herein are meant to be illustrative only and not limiting as to the scope of the present disclosure.

[0083] In order to make the objects, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative effort fall within the scope of the present disclosure.

[0084] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the meanings as commonly understood by one of ordinary skill in the art to which this present disclosure belongs. The terms "first", "second", and similar terms do not imply any order, quantity, or importance, but are used to distinguish one element from another, and are also used for the purpose of description and explanation in the present disclosure. Also, the terms "include" or "comprise" and similar terms do not exclude the presence of other elements or steps, but allow the presence thereof. The "connected" or "coupled" or similar terms do not refer to a direct or physical connection or coupling, but also include an electrical connection or coupling, whether direct or indirect. The terms "upper", "lower", "left", "right", and the like are used for ease of description only and are not intended to be limiting. When the absolute position of the described object is changed, the relative positional relationship can also be changed accordingly.

[0085] As used herein, "parallel", "perpendicular" include the recited condition and conditions that are approximately the recited condition, the range of which is within an acceptable deviation range, as determined by a person of ordinary skill in the art taking into account the measurement being discussed and the error associated with a particular measurement (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable deviation range for approximately parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximately perpendicular, where the acceptable deviation range for approximately perpendicular can also be, for example, within 5°.

[0086] It should be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers can also be present.

[0087] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are idealized examples. In the interest of clarity, not all of the layer and regions are shown in the drawings with the same dimensions. For example, the thickness of layers and regions can be exaggerated in some drawings. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated in the drawings, which are schematically represented. The exemplary embodiments are intended to include structures that are equivalent to structures shown in the drawings and structures that are equivalent to structures not explicitly shown in the drawings, such as modified versions of the various regions, including portions and details of regions. In addition, the exemplary embodiments described herein are intended to include structures that are equivalent to structures shown in the drawings and structures that are equivalent to structures not explicitly shown in the drawings, such as modified versions of the various regions, including portions and details of regions. In addition, the exemplary embodiments described herein are intended to include structures that are equivalent to structures shown in the drawings and structures that are equivalent to structures not explicitly shown in the drawings, such as modified versions of the various regions, including portions and details of regions.

[0088] With the development of display technology, LED (mini light-emitting diode) display substrates have become the most advantageous next-generation display medium due to their advantages such as pure color, wide dynamic range, high brightness, high definition, low operating voltage, low power consumption, long lifespan, shock resistance, wide viewing angle, and stable and reliable operation. LED display substrates consist of multiple LED light-emitting chips arranged in an array. The research and development of LED light-emitting chips, especially mini-LED and micro-LED light-emitting chips, has become an important topic in the display field.

[0089] Currently, among red, green, and blue LED chips, blue LED chips have the highest luminous efficiency and the lowest cost. Therefore, in some display substrates, full-color displays can be achieved using blue LED chips combined with a color conversion structure. Correspondingly, during the LED chip transfer process, only one color of LED chip needs to be transferred, thereby improving transfer efficiency and reducing repair difficulty.

[0090] In order to improve the blue light absorption rate of the color conversion structure, a large number of scattering particles are usually added to the color conversion structure. This causes the light emitted by the blue LED chip to be greatly scattered at the light angle after passing through the color conversion layer, resulting in a decrease in the intensity of the forward light output. This can affect the user experience in some application scenarios (such as virtual reality).

[0091] To solve the above-mentioned technical problems, this disclosure provides a display substrate. FIG1 is a cross-sectional view of a plurality of light-emitting components of the display substrate provided in some embodiments of this disclosure. FIG2 is a schematic diagram of a plurality of light-emitting components and a dimming layer of the display substrate provided in some embodiments of this disclosure. FIG3A is a cross-sectional view of a display substrate provided in some embodiments of this disclosure. FIG3B is another cross-sectional view of a display substrate provided in some embodiments of this disclosure. FIG4 is yet another cross-sectional view of a display substrate provided in some embodiments of this disclosure. As shown in FIG1 to FIG4, the display substrate includes a substrate 10, and a plurality of light-emitting components 20 and a dimming layer 30 disposed on the substrate 10.

[0092] The light-emitting component 20 includes a light-emitting unit 22 and an optical functional unit 21 disposed on the side of the light-emitting unit 22 facing away from the substrate 10. At least a portion of the optical functional unit 21 of the light-emitting component 20 is used to convert the color of the light entering the optical functional unit 21. A receiving groove SL is defined between two adjacent light-emitting components 20. In some examples, multiple light-emitting components 20 can be arranged in multiple rows and columns, with a receiving groove SL defined between two adjacent light-emitting components 20 in the same row and between two adjacent light-emitting components 20 in the same column.

[0093] The normal projection of the light-adjusting layer 30 on the substrate 10 covers the normal projection of the light-emitting component 20 on the substrate 10, and the light emitted by the light-emitting component 20 exits through the light-adjusting layer 30. The light-adjusting layer 30 includes a first part 31 and a second part 32, wherein the first part 31 is located in the accommodation groove SL; that is, the normal projection of the first part 31 on the substrate 10 is within the range of the normal projection of the accommodation groove SL on the substrate 10. The second part 32 is located outside the accommodation groove SL and on the side of the light-emitting component 20 away from the substrate 10; that is, the second part 32 is located on the side of the light-emitting component 20 away from the substrate 10, and the normal projection of the second part 32 on the substrate 10 is outside the normal projection of the accommodation groove SL on the substrate 10. Each second part 32 corresponds to an optical functional unit 21, and the surface of the second part 32 away from the substrate 10 (hereinafter referred to as the top surface 320 of the second part 32) is a convex surface protruding away from the substrate 10, which is used to converge the light emitted by the light-emitting component 20.

[0094] In addition, as shown in FIGS. 2 to 4, the first part 31 and the second part 32 are a continuous and integrated structure.

[0095] In the embodiments of the present disclosure, the second part 32 includes a convex surface protruding away from the substrate 10, so that the light emitted by the light-emitting component 20 can be converged by the light-adjusting layer 30, thereby improving the forward light-emitting angle of the display substrate and improving the user experience. In addition, the accommodation groove SL is formed between two adjacent light-emitting components 20, the first part 31 of the light-adjusting layer 30 is located in the accommodation groove SL, and the second part 32 located on the side of the light-emitting component 20 away from the substrate 10 is a continuous and integrated structure. Therefore, during manufacturing, a flowing light-adjusting material layer can be formed on the substrate 10 with multiple light-emitting components 20, and then the light-adjusting material layer is solidified. During the solidification process, the light-adjusting material layer flows along the shape of the light-emitting component 20 due to the difference between the light-emitting component 20 and the accommodation groove SL, so that the second part 32 of the light-adjusting layer 30 formed after solidification has the above-mentioned convex surface, thereby eliminating the need for patterning process, simplifying the manufacturing process, and further improving the production efficiency.

[0096] In some embodiments, the edge of the second part 32 is the slot of the accommodation groove SL. In addition, in the direction from the edge of the second part 32 to the center of the second part 32, the thickness of the second part 32 gradually increases, so that the second part 32 can converge as much light emitted by the light-emitting component 20 as possible.

[0097] The slot of the accommodation groove SL is the position farthest from the substrate 10 on the side surface of the accommodation groove SL.

[0098] In some embodiments, as shown in FIG. 2, the thickness d1 of the light-adjusting layer 30 corresponding to the notch of the accommodating groove SL is smaller than the thickness of the light-adjusting layer 30 corresponding to the position inside the notch. As described above, when the light-adjusting layer 30 is prepared, the light-adjusting material layer is formed to have the convex surface by virtue of the conformal flowability of the light-adjusting material layer. Therefore, the thickness d1 of the light-adjusting layer 30 at the position of the notch, i.e., the position where the step occurs, is smaller than the thickness of the light-adjusting layer 30 at the position inside the notch after the flow of the light-adjusting material layer, and the thickness of the light-adjusting layer 30 at the position of the notch is smaller than the thickness of the light-adjusting layer 30 at the position inside the notch after solidification. In FIG. 2, the thickness d2 of the light-adjusting layer 30 corresponding to one of the positions inside the notch is shown, and d2>d1. It should be noted that the thickness of the light-adjusting layer 30 at other positions inside the notch is greater than d1.

[0099] The thickness of the light-adjusting layer 30 corresponding to the notch can be determined in the following manner: a straight line passing through a position point A of the notch and being perpendicular to the substrate 10 is drawn, the straight line intersects with the surface of the light-adjusting layer 30 away from the substrate 10 at a position point B, and the length of the line segment between A and B is the thickness of the light-adjusting layer 30 corresponding to the notch. Similarly, the thickness of the light-adjusting layer 30 corresponding to the position inside the notch can be determined in the following manner: a straight line perpendicular to the substrate 10 is drawn inside the region surrounded by the notch, the straight line intersects with the surface of the light-adjusting layer 30 away from the substrate 10 and the surface of the light-adjusting layer 30 facing the substrate 10 at two points, and the distance between the two points is the thickness of the light-adjusting layer 30 corresponding to the position inside the notch.

[0100] In some embodiments, the thickness d1 of the light-adjusting layer 30 corresponding to the notch of the accommodating groove SL is the smallest in the entire light-adjusting layer 30.

[0101] In some embodiments, as shown in FIGS. 3A-4, the surface of the first portion 31 away from the substrate 10 (hereinafter referred to as the top surface of the first portion 31) is a concave surface facing the substrate 10, and the minimum distance d3 between the concave surface and the substrate 10 is smaller than the minimum distance d4 between the notch and the substrate 10. The light-emitting assembly 20 mainly emits light from the surface away from the substrate 10, and the minimum distance d3 between the concave surface and the substrate 10 is set to be smaller than the minimum distance d4 between the notch and the substrate 10, which is beneficial to increase the curvature of the edge region of the top surface 320 of the second portion 32 and improve the converging effect of the top surface 320 on the large-angle light emitted by the light-emitting assembly 20.

[0102] It should be noted that the “concave surface” herein refers to a surface that is concave as a whole towards the substrate 10, and does not mean that each small region in the concave surface is concave towards the substrate 10. For example, in one example, a part of the top surface of the first portion 31 and the top surface of the second portion 320 form a continuous and smooth large convex surface.

[0103] It should be further noted that the topography of the light-adjusting layer 30 in FIGS. 3A-4 is only illustrative. The concave surface of the first portion 31 can have a cusp pointing towards the substrate 10 as shown in FIGS. 3A-4, or can be a smooth curved surface. FIG. 5 is a scanning electron microscope (SEM) image of a simulated light-adjusting layer. In the simulation, a plurality of spaced apart protrusions 90 are provided to simulate the light-emitting components 20, and the spaces between the protrusions 90 form the accommodation grooves. In some examples, as shown in FIG. 5, the top surface of the first portion 31 of the light-adjusting layer 30 formed by the self-flowing property of the light-adjusting material layer is a smooth concave surface.

[0104] In some embodiments, as shown in FIGS. 3A and 3B, the thickness d5 of the light-adjusting layer 30 at the center of the accommodation groove SL is greater than the thickness d6 of the light-adjusting layer 30 at the center of the second portion 32.

[0105] In the embodiments of the present disclosure, the light-adjusting layer 30 is formed by curing a light-adjusting material layer in a fluid state. The light-adjusting material layer flows into the accommodation grooves SL due to the self-flowing property when it is cured, thereby forming the first portion 31 in the accommodation grooves SL and the second portion 32 with a convex surface after curing. In actual applications, the accommodation grooves SL can be provided with a larger depth, thereby facilitating the formation of the desired topography. In this case, due to the large depth of the accommodation grooves SL and the self-flowing property of the light-adjusting material layer, the thickness of the light-adjusting layer 30 at the center of the accommodation groove SL is greater than the thickness of the light-adjusting layer 30 at the center of the second portion 32.

[0106] In some embodiments, as shown in FIG. 2, the width w of the bottom surface of the accommodation groove SL is greater than or equal to 1 micron, and the vertical distance H between the bottom surface of the accommodation groove SL and the surface of the optical functional unit 21 away from the substrate 10 is greater than or equal to 8 microns, thereby facilitating the light-adjusting material layer to flow over the plurality of light-emitting components 20 and form the light-adjusting layer 30 with the above-described topography.

[0107] In the above description, the width w of the bottom surface of the accommodation groove SL refers to the dimension of the bottom surface of the accommodation groove SL in the arrangement direction of the light-emitting components 20. In other words, the accommodation groove SL includes one or more pairs of oppositely arranged groove walls, and the width w of the bottom surface of the accommodation groove SL between two adjacent light-emitting components 20 is the distance between the positions where the two groove walls extend to the groove bottom in the arrangement direction of the light-emitting components 20. For example, for the accommodation groove SL between two adjacent light-emitting components 20 in the same row, the width of the bottom surface of the accommodation groove SL is the dimension of the bottom surface of the accommodation groove SL in the row direction; for the accommodation groove SL of two adjacent light-emitting components 20 in the same column, the width w of the bottom surface of the accommodation groove SL is the dimension of the bottom surface of the accommodation groove SL in the column direction.

[0108] In some embodiments, the width w of the bottom surface of the accommodation groove SL is less than or equal to 5 microns, which is conducive to improving the high resolution of the display product and forming the desired topography of the light-adjusting layer 30.

[0109] In some embodiments, the cross-sectional area of the accommodation groove SL gradually increases in a direction away from the substrate 10, which is conducive to the light-adjusting material layer smoothly flowing into the accommodation groove SL to form the light-adjusting layer 30 with the above-mentioned topography.

[0110] In some embodiments, the material of the light-adjusting layer 30 includes a thermosetting material. The thermosetting material has strong conformability when baked at high temperature, and therefore, the light-adjusting layer 30 using the thermosetting material can form the desired topography by relying on the material itself to flow during the manufacturing process. For example, the material of the light-adjusting layer 30 includes resin, such as any one of acrylate, siloxane, and polyimide.

[0111] In some embodiments, as shown in FIGS. 1-4, the light-emitting assembly 20 further includes a first light-blocking layer BM1, which includes a first light-blocking portion BM11 and a second light-blocking portion BM12. The first light-blocking portion BM11 forms at least part of the groove wall of the accommodation groove SL, and the second light-blocking portion BM12 is located outside the groove wall of the accommodation groove SL. The second light-blocking portion BM12 is located on the side of the light-emitting unit 22 away from the substrate 10. It should be noted that “the second light-blocking portion BM12 is located on the side of the light-emitting unit 22 away from the substrate 10” means that the second light-blocking portion BM12 is located on the side of the plane in which the top surface of the light-emitting unit 22 away from the substrate 10; the top surface of the light-emitting unit 22 is the surface of the light-emitting unit 22 away from the substrate 10. In one example, the side surface of the accommodation groove SL is the surface of the first light-blocking portion BM11, and the first light-blocking portion BM11 surrounds the light-emitting unit 22 and the optical functional unit 21; the second light-blocking portion BM12 is connected to the edge of the first light-blocking portion BM11 away from the substrate 10.

[0112] The second light-blocking portion BM12 includes a first opening SP opposite the light-emitting unit 22, that is, the orthographic projection of the first opening SP on the substrate 10 overlaps the orthographic projection of the light-emitting unit 22 on the substrate 10. For example, the orthographic projection of the first opening SP on the substrate 10 covers the orthographic projection of the light-emitting unit 22 on the substrate 10. The light emitted by the light-emitting unit 22 enters the light-adjusting layer 30 through the first opening SP.

[0113] In some embodiments, as shown in FIGS. 1-4, the first light-blocking portion BM11 and the second light-blocking portion BM12 are continuously distributed, the second light-blocking portion BM12 includes a top surface away from the substrate 10, the first light-blocking portion BM11 includes a side surface continuously distributed with the top surface thereof, and the slot opening of the accommodating slot SL is the junction line of the first light-blocking portion BM11 and the second light-blocking portion BM12. Further, the slot opening can be regarded as the junction line of the side surface of the first light-blocking portion BM11 and the top surface of the second light-blocking portion BM12. In this case, the normal projection of the convex surface of the second portion 32 on the substrate 10 completely covers and exceeds the normal projection of the first opening SP on the substrate 10, so that more light emitted by the light-emitting assembly 20 can be collected through the convex surface.

[0114] In some embodiments, the thickness of the first light-blocking portion BM11 and the second light-blocking portion BM12 is greater than or equal to 1 micrometer to meet the light-blocking requirement. For example, the thickness of the first light-blocking portion BM11 and the second light-blocking portion BM12 is between 1-1.2 micrometers or between 1.2 micrometers-1.5 micrometers. For example, the material of the first light-blocking layer BM1 satisfies a transmittance of 0.01% at a thickness of 1 micrometer.

[0115] In some embodiments, the optical functional unit 21 is located between the first light-blocking layer BM1 and the light-emitting unit 22. For example, a part of the optical functional unit 21 is located between the first light-blocking portion BM11 and the light-emitting unit 22. For example, the optical functional unit 21 includes a first sub-unit 211 and a second sub-unit 212, the first sub-unit 211 is located on the side of the light-emitting unit 22 away from the substrate 10, and the second sub-unit 212 is arranged around the light-emitting unit 22, so that the optical functional unit 21 capable of color conversion can more fully convert the color of the light emitted by the light-emitting unit 22, thereby improving the light utilization rate.

[0116] In some embodiments, the convex surface of the second portion 32 includes a first sub-surface 3201 and a second sub-surface 3202 surrounding the first sub-surface 3201, the normal projection of the first sub-surface 3201 on the substrate 10 is located within the normal projection range of the color conversion unit on the substrate 10 and does not overlap with the normal projection of the first light-blocking layer BM1 on the substrate 10. The normal projection of the second sub-surface 3202 on the substrate 10 overlaps with the normal projection of the first light-blocking layer BM1 on the substrate 10. The curvature of the second sub-surface 3202 is greater than the curvature of the first sub-surface 3201. The first sub-surface 3201 is a central region of the top surface of the second portion 32, and the second sub-surface 3202 is an edge region of the top surface of the second portion 32. The curvature of the second sub-surface 3202 is greater than the curvature of the first sub-surface 3201, which is conducive to collecting the large-angle light emitted by the light-emitting assembly 20, thereby improving the brightness of the front viewing angle of the display substrate.

[0117] In some embodiments, as shown in FIGS. 3A-4, the display panel further comprises a flat layer 60 and a plurality of light filtering units 51. The flat layer 60 is located on the side of the light adjusting layer 30 away from the substrate 10 and is attached to the surface of the light adjusting layer 30 away from the substrate 10, i.e., there is no gap between the flat layer 60 and the light adjusting layer 30. The refractive index n2 of the flat layer 60 is less than the refractive index n1 of the light adjusting layer 30, so that the light emitted by the light emitting assembly 20 is deflected at the interface between the flat layer 60 and the light adjusting layer 30, and the deflection direction is closer to the thickness direction of the display substrate.

[0118] In one example, 1.3 < n2 < 1.5; 1.5 < n1 < 1.7; for example, 1.3 < n2 < 1.35, 1.5 < n1 < 1.55; for another example, 1.35 < n2 < 1.45, 1.55 < n1 < 1.65; for another example, 1.45 < n2 < 1.5, 1.65 < n1 < 1.7.

[0119] In one example, the flat layer 60 can be made of a material with high flatness, so that the surface of the flat layer 60 away from the substrate 10 is a flat or substantially flat surface, thereby facilitating the arrangement of the light filtering units 51. For example, the flat layer 60 can be made of a siloxane material, a SOG material, etc.

[0120] As shown in FIGS. 3A-4, the plurality of light filtering units 51 are arranged on the side of the flat layer 60 away from the substrate 10; the light filtering units 51 are arranged one-to-one with the optical functional units 21, and the orthographic projection of the light filtering units 51 on the substrate 10 overlaps with the orthographic projection of the corresponding optical functional units 21 on the substrate 10.

[0121] In some embodiments, the light emitted by the light emitting unit 22 is blue light or ultraviolet light. The optical functional units 21 of the plurality of light emitting assemblies 20 comprise a first optical functional unit 21r, a second optical functional unit 21g, and a third optical functional unit 21b; the first optical functional unit 21r is configured to convert the light emitted by the light emitting unit 22 into red light; the second optical functional unit 21g is configured to convert the light emitted by the light emitting unit 22 into green light; and the third optical functional unit 21b is configured to convert the light emitted by the light emitting unit 22 into blue light or maintain the state of blue light.

[0122] For example, the first optical functional unit 21r comprises red quantum dot material for converting light into red light; preferably, the first optical functional unit 21r further comprises scattering particles for scattering light. When the light emitted by the corresponding light emitting unit 22 is incident on the first optical functional unit 21r, the red quantum dot material can convert blue light or ultraviolet light into red light, and the scattering particles can scatter the blue light or ultraviolet light and the red light emitted by the light emitting unit 22, so that more light can be converted into red light by the red quantum dot material.

[0123] For example, the second optical functional unit 21g includes green quantum dot material for converting light into green light; preferably, scattering particles for scattering light can also be included in the second optical functional unit 21g. When the light emitted by the corresponding light emitting unit 22 is incident on the second optical functional unit 21g, the green quantum dot material can convert blue light or ultraviolet light into green light, and the scattering particles can scatter the blue light or ultraviolet light and the green light emitted by the light emitting unit 22 to ensure that more light can be converted into green light by the green quantum dot.

[0124] For example, the third optical functional unit 21b is used for converting light into blue light or maintaining the emission of blue light. For example, when the light only includes blue light, the third optical functional unit 21b can be a transparent part or include blue quantum dots; wherein the transparent part is used for direct transmission of light, and the blue quantum dots can be used for converting light into blue light with a different wavelength from the light. Preferably, the third optical functional unit 21b also includes scattering particles for scattering light. When the light emitted by the light emitting unit 22 includes ultraviolet light, the third optical functional unit 21b includes blue quantum dots for converting light into blue light, or the third optical functional unit 21b simultaneously includes scattering particles for scattering light and blue quantum dots for converting ultraviolet light into blue light.

[0125] In some embodiments, as shown in FIGS. 3A and 3B, the plurality of filter units 51 includes: a first filter unit 511 corresponding to the first optical functional unit 21r, which is a red color resistance or a red-green-blue filter film to ensure that red light passes through; a second filter unit 512 corresponding to the second optical functional unit 21g, which is a green color resistance or a red-green-blue filter film to ensure that green light passes through; and a third filter unit 513 corresponding to the third optical functional unit 21b, which is a blue color resistance or a transparent layer to ensure that blue light passes through.

[0126] For example, the above-mentioned red color resistance can transmit red light and absorb light of other colors. In this way, the light emitted from the first optical functional unit 21r can be emitted after passing through the first filter unit 511, and the first filter unit 511 can filter out light of other colors except red light to ensure that the blue light component in the filtered light is removed.

[0127] For example, the aforementioned red-green anti-blue filter film allows the red portion of the light emitted from the first optical functional unit 21r to pass through and reflect blue light. In this way, the red light in the light can pass through the first filter unit 511 and be emitted, while the blue light can be reflected back to the first optical functional unit 21r by the first filter unit 511. This allows the red quantum dots in the first optical functional unit 21r to excite the blue light into red light, thereby further improving the excitation efficiency of the red quantum dots.

[0128] For example, the aforementioned green color filter can transmit green light and absorb light of other colors. In this way, the light emitted from the second optical functional unit 21g can pass through the second filter unit 512 before being emitted, and the second filter unit 512 can filter out light of other colors except green light, so as to ensure that the blue light component in the light is filtered out.

[0129] For example, the aforementioned red-green-blue-reflecting filter film allows the green portion of the light emitted from the second optical functional unit 21g to pass through and reflect blue light. In this way, the green light in the light can pass through the second filter unit 512 and be emitted, while the blue light can be reflected back to the second optical functional unit 21g by the second filter unit 512. This allows the green quantum dots in the second optical functional unit 21g to excite the blue light back into green light, thereby further improving the excitation efficiency of the green quantum dots.

[0130] For example, the aforementioned blue color filter can transmit blue light and absorb other colors of light. In this way, the light emitted from the third optical functional unit 21b can pass through the third filter unit 513 before being emitted, and the third filter unit 513 can filter out light of other colors except blue light, so that the third filter unit 513 transmits relatively pure blue light.

[0131] For example, since the third optical functional unit 21b can emit blue light, a transparent layer can be used as the third filter unit 513 to transmit blue light.

[0132] In some embodiments, as shown in Figures 3A to 4, the display substrate may further include a second light-shielding layer BM2. The second light-shielding layer BM2 is located on the side of the planarization layer 60 away from the substrate 10 and has a second opening corresponding to a filter unit 51. The filter unit 51 is disposed in the corresponding second opening. By providing the second light-shielding layer BM2, cross-color mixing between adjacent pixel areas can be prevented, where the pixel area refers to the area corresponding to the light-emitting component 20. Since the dimming layer 30 provided in this embodiment can converge the light emitted from the light-emitting component 20, at least part of the light that was originally to be directed towards the second light-shielding layer BM2 is refracted and directed towards the filter unit 51, thereby improving light utilization.

[0133] In some embodiments, as shown in FIGS. 3A-4, the display substrate can further include a cover layer 60 located on the side of the filter layer away from the substrate 10. The cover layer 60 is made of a transparent material and is a continuous film layer.

[0134] In some embodiments, the light emitting unit 22 is an LED light emitting chip, for example, a Mini-LED light emitting chip or a Micro-LED light emitting chip.

[0135] As shown in FIGS. 1-4, in one example, the light emitting unit 22 is a vertical type LED light emitting chip, specifically including, in order from the side away from the substrate 10: a first electrode 221, a light emitting body 223, and a second electrode 222. The light emitting body 223 can include, in order from the side away from the substrate 10: a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode 221 and the second electrode 222 can be used as an anode and a cathode, respectively, to cause the transmission of holes and electrons in the first semiconductor layer, the light emitting layer, and the second semiconductor layer between the first electrode 221 and the second electrode 222 after the first electrode 221 and the second electrode 222 are fed with current, thereby exciting the light emitting layer to emit light.

[0136] The first semiconductor layer is, for example, a P-type gallium nitride (GaN) layer; the light emitting layer is, for example, a quantum well material (MQW) layer; and the second semiconductor layer is, for example, an N-type gallium nitride layer.

[0137] In order to drive the light emitting unit 22 to emit light, as shown in FIGS. 1-4, the display substrate further includes a drive trace layer 12, an insulating layer 11, a plurality of first conductive pads 141, and at least one connection electrode 16, and a first planarization layer PLN1. The drive trace layer 12 is disposed on the substrate 10, and can include structures such as transistors, signal traces, etc.

[0138] The insulating layer 11 is located on the side of the drive trace layer 12 away from the substrate 10, and the material of the insulating layer 11 can include, for example, silicon nitride, silicon oxide, silicon oxynitride, etc., and the insulating layer 11 can be a single film layer or a plurality of film layers stacked.

[0139] The first conductive pad 141 is located on the side of the insulating layer 11 away from the substrate 10 and is electrically connected to the driving wire layer 12 through a first via V1 on the insulating layer 11. The first via V1 is filled with a conductive material, which can be in an integral structure with the first conductive pad 141 or be the same material as the driving wire layer 12. The connecting electrode 16 is located on the side of the insulating layer 11 away from the substrate 10 and is electrically connected to the driving wire layer 12 through a third via V3 on the insulating layer 11. The first conductive pad 141 and the connecting electrode 16 are respectively electrically connected to the opposite sides of the light-emitting unit 22. For example, the first conductive pad 141 is electrically connected to the first electrode 221, and the connecting electrode 16 is electrically connected to the second electrode 222. The first conductive pad 141 can be made of a metal material, such as copper. In order to prevent the connecting electrode 16 from affecting the light emission of the light-emitting unit 22, in an example, the connecting electrode 16 can be made of a transparent conductive material such as indium tin oxide (ITO).

[0140] In some embodiments, the first planarization layer PLN1 is located between the light-emitting unit 22 and the color conversion unit, and the connecting electrode 16 is electrically connected to the light-emitting unit 22 through a fourth via on the first planarization layer PLN1. For example, the fourth via can be located on the side of the light-emitting unit 22 away from the substrate 10. The area between the connecting electrode 16 and at least part of the light-emitting assembly 20 overlaps.

[0141] In a specific example, as shown in FIG. 3A, the first planarization layer PLN1 is located in the light-emitting assembly 20. In this case, the part of the first planarization layer PLN1 located in the single light-emitting assembly 20 is referred to as the first flat part PLN11, and the first flat parts PLN11 in the adjacent two light-emitting assemblies 20 are spaced apart. The spacing area between the adjacent two first flat parts PLN11 is referred to as the first spacing area, and the normal projection of the accommodation groove SL on the substrate 10 overlaps with the normal projection of the first spacing area on the substrate 10, for example, the normal projection of the accommodation groove SL on the substrate 10 is located within the normal projection range of the first spacing area on the substrate 10. In addition, the fourth via can be located on the first flat part PLN11. For example, the fourth via exposes the second electrode 222, and the connecting electrode 16 is electrically connected to the second electrode 222 through the fourth via.

[0142] The first part 31 of the dimming layer 30 includes a first bottom surface facing the substrate 10, and the normal projection of the first planarization layer PLN1 on the substrate 10 and the normal projection of the first bottom surface on the substrate 10 have a non-overlapping area. For example, the normal projection of the first planarization layer PLN1 on the substrate 10 and the normal projection of the first bottom surface on the substrate 10 can be completely non-overlapping.

[0143] In another specific example, as shown in FIG. 3B, the first planarization layer PLN1 includes a first planar portion PLN11 located within the light emitting assembly 20 and a second planar portion PLN12 located between adjacent light emitting assemblies 20, the first planar portion PLN11 has a thickness greater than that of the second planar portion PLN12, the first portion 31 of the light modulation layer includes a first bottom surface facing the substrate 10, and a normal projection of the second planar portion PLN12 on the substrate 10 overlaps with a normal projection of the first bottom surface on the substrate 10. For example, the normal projection of the first bottom surface on the substrate 10 can be entirely within the normal projection of the second planar portion PLN12 on the substrate 10.

[0144] It can be understood that when the first planarization layer PLN1 includes the second planar portion PLN12 and the third via V3 is located in the region between adjacent light emitting assemblies 20, the third via V3 can simultaneously penetrate the insulating layer 11 and the second planar portion PLN12.

[0145] In some embodiments, the brightness of each light emitting unit 22 can be independently controlled. In this case, the first conductive pad 141 and the connection electrode 16 are respectively used to provide a first signal and a second signal to the light emitting unit 22, for example, one of the first signal and the second signal is an anode signal (i.e., a high-level signal), and the other is a cathode signal (i.e., a low-level signal).

[0146] In some examples, as shown in FIGS. 3A and 3B, each connection electrode 16 can correspond to one light emitting unit 22, the first end of the connection electrode 16 is electrically connected to the light emitting unit 22 through a fourth via, and the second end of the connection electrode 16 is electrically connected to the driving trace layer 12 through a third via V3. The third via V3 is located in a region between at least part of the light emitting assemblies 20. In another example, each connection electrode 16 can also correspond to multiple light emitting units 22, for example, all light emitting units 22 in a light emitting assembly 20 with the same light emitting color are connected to the same connection electrode 16; for another example, all light emitting units 22 are connected to the same connection electrode 16. In this case, the connection electrode 16 can be electrically connected to the driving trace layer 12 through one third via V3 or multiple third vias V3. When each connection electrode 16 corresponds to one light emitting unit 22, the third via V3 can be located in a region between part of the light emitting assemblies 20, or can be arranged at other positions, for example, arranged in a peripheral region of the display substrate.

[0147] In some embodiments, referring to FIG. 4, the plurality of light emitting components 20 are divided into groups, and each group includes at least two light emitting components 20 connected in series. Here, "connected in series" means that the second electrode 222 of one light emitting component 20 is electrically connected to the first electrode 221 of another light emitting component 20. For example, the light emitting components 20 in the same group have the same light emitting color. For example, each group of light emitting components 20 includes 2x2 or 1x4 light emitting components 20. For example, the light emitting components 20 in the same group all have the first optical functional unit 21r, or all have the second optical functional unit 21g, or all have the third optical functional unit 21b.

[0148] For example, referring to FIG. 4, each light emitting unit 22 corresponds to a connection electrode 16, and the connection electrode 16 connected to the light emitting unit 22 in one of the two light emitting components 20 connected in series is also electrically connected to the first conductive pad 141 corresponding to the light emitting unit 22 in the other light emitting component 20. For example, the connection electrode 16 and the first conductive pad 141 are electrically connected by a connection line in the driving trace layer 12.

[0149] In addition, the driving trace layer 12 further includes a plurality of first voltage lines and a plurality of second voltage lines. The first conductive pad 141 connected to each light emitting unit 22 can correspond to a first voltage line, and the connection electrode 16 connected to each light emitting unit 22 can correspond to a second voltage line. In this case, the light emitting state of the light emitting unit 20 can be flexibly controlled. For example, when each light emitting component 20 is not faulty and can normally emit light, only the first voltage line connected to the first light emitting unit 22 in each group is provided with a first signal, and the second voltage line connected to the last light emitting unit 22 is provided with a second signal, that is, the light emitting brightness of the light emitting units 22 in the same group is the same. When a light emitting component 20 in a group is faulty, for example, the last light emitting component 20 is faulty, only the first voltage line connected to the first light emitting unit 22 is provided with a first signal, and the second voltage line connected to the second last light emitting unit 22 is provided with a second signal, that is, the last light emitting component 20 does not emit light, and the remaining light emitting components 20 have the same light emitting brightness.

[0150] As shown in FIGS. 3A-4, the display substrate further includes a second planarization layer PLN2 located on the side of the connection electrode 16 and the light emitting unit 22 of the light emitting component 20 away from the substrate 10, and the second planarization layer PLN2 can be a continuous film layer. The first portion 31 of the light modulation layer 30 includes a first bottom surface facing the substrate 10, and the first bottom surface is attached to the second planarization layer PLN2.

[0151] To reduce the impact of the second planarization layer PLN2 on the light emitting component 20 light emitting effect, in some embodiments, the thickness of the second planarization layer PLN2 is less than 2 microns, for example, between 1-1.5 microns, or between 0.5-1 micron, or between 1.5-1.8 microns.

[0152] In one example, the orthographic projection of the optical functional unit 21 on the substrate 10 covers the orthographic projection of the light emitting unit 22 on the substrate 10, and there is a gap between the edges of the two projections. For example, the orthographic projections of the optical functional unit 21 and the light emitting unit 22 are both rectangular, and the length and width of the optical functional unit 21 are greater than the length and width of the light emitting unit 22, respectively, to ensure that the optical functional unit 21 with the first sub-unit 211 and the second sub-unit 212 can be formed even if there is a process error. For example, the length of the light emitting unit 22 is 12 microns, and the width of the optical functional unit 21 is at least 18 microns.

[0153] In one example, the width of the bottom surface of the accommodation groove SL is at least 1 micron. In one example, the distance between the bottoms of the second sub-units 212 of two adjacent optical functional units 21 is at least 3 microns.

[0154] In one example, the width w of the bottom surface of the accommodation groove SL is less than or equal to 5 microns.

[0155] In one example, the thickness of the second sub-unit 212 closest to the substrate 10 is less than or equal to 0.5 microns.

[0156] In one example, the thickness of the first light blocking layer BM1 is at least 1 micron.

[0157] In one example, the width of the second planarization layer PLN2 away from the flat surface of the substrate 10 between two adjacent light emitting components 20 (as shown by D in FIG. 3A) needs to be less than or equal to 8 microns.

[0158] In one example, as described above, the width of the bottom surface of the accommodation groove SL is at least 1 micron. Therefore, the distance between the bottoms of the second sub-units 212 of two adjacent optical functional units 21 is at least 3 microns, because when the thickness of the first light blocking layer BM1 is at least 1 micron, a good light blocking effect can be achieved. By setting the distance between the bottoms of the second sub-units 212 of two adjacent optical functional units 21 to be at least 3 microns, it can be prevented that after the first light blocking layer BM1 is formed, the material of the first light blocking layer BM1 accumulates at the bottom of the accommodation groove SL, thereby affecting the depth of the accommodation groove SL and preventing the morphology of the light adjusting layer SL from being affected.

[0159] In one example, the width w of the bottom surface of the accommodation groove SL is less than or equal to 5 microns, as described above. In one example, the thickness of the second sub-unit 212 closest to the substrate 10 is less than or equal to 0.5 microns, in which case, in order to achieve the above-mentioned purpose of the width w of the bottom surface of the accommodation groove SL being less than or equal to 5 microns, it is necessary to ensure that, after the second planarization layer PLN2 is formed, the width of the second planarization layer PLN2 away from the planar surface of the substrate 10 between two adjacent light emitting components 20 (indicated by D in FIG. 3A) is less than or equal to 8 microns, so that the thickness of the first light shielding layer BM1 is at least 1 micron, and the width w of the bottom surface of the accommodation groove SL is less than or equal to 5 microns.

[0160] In one example, the second planarization layer PLN2 can also be discontinuously provided in the region between two adjacent light emitting components 20, and the discontinuous interval is less than or equal to 8 microns. In order to achieve the above-mentioned purpose of the width w of the bottom surface of the accommodation groove SL being less than or equal to 5 microns when the thickness of the first light shielding layer BM1 is at least 1 micron, it is necessary to ensure that, after the second planarization layer PLN2 is formed, the width of the second planarization layer PLN2 away from the planar surface of the substrate 10 between two adjacent light emitting components 20 (indicated by D in FIG. 3A) is less than or equal to 8 microns, so that the thickness of the first light shielding layer BM1 is at least 1 micron, and the width w of the bottom surface of the accommodation groove SL is less than or equal to 5 microns. It can be understood that, when the second planarization layer PLN2 is discontinuously provided, the first bottom surface of the first portion 31 of the light modulation layer 30 is in contact with the connecting electrode 16.

[0161] FIG. 6 is a cross-sectional view of a display substrate provided in another embodiment of the present disclosure, and FIG. 7 is another cross-sectional view of a display substrate provided in another embodiment of the present disclosure. The display substrates shown in FIGS. 6 and 7 are similar to those in FIGS. 3A to 4, except that the second planarization layer PLN2 is not provided in FIGS. 6 and 7, and the connecting electrode 16 is in direct contact with the optical functional unit 21, so that the overall thickness of the display substrate can be reduced. Moreover, the second planarization layer PLN2 can be prevented from affecting the light emitting effect of the light emitting component 20.

[0162] In this case, as shown in FIG. 6, when the first planarization layer PLN1 is located in the light emitting component 20 (i.e., the first planarization layer PLN1 includes the first flat portion PLN11 but does not include the second flat portion PLN12), the connecting electrode 16 is in contact with the first bottom surface of the first portion 31 of the light modulation layer 30; wherein the first bottom surface is the surface of the first portion 31 facing the substrate 10.

[0163] It can be understood that, when the second planarization layer PLN2 is not provided, the first planarization layer PLN1 can also include both the first flat portion PLN11 and the second flat portion PLN12, as described in the above embodiments.

[0164] The series connection of the light emitting components 20 is shown in FIG. 7, and the series connection is similar to that in FIG. 4, which will not be described here.

[0165] FIG. 8 is a sectional view of a display substrate according to some embodiments of the present disclosure, and FIG. 9 is another sectional view of a display substrate according to some embodiments of the present disclosure. The display substrates shown in FIGS. 8 and 9 are similar to those shown in FIGS. 3A-4, except that in FIGS. 8 and 9, the display substrate further includes a first encapsulation layer 71 and a second encapsulation layer 72. The first encapsulation layer 71 is located between the color conversion unit and the light emitting unit 22, and the second encapsulation layer 72 is located on the side of the color conversion unit away from the substrate 10. By providing the first encapsulation layer 71 and the second encapsulation layer 72 to encapsulate the optical functional unit 21, the reliability of the optical functional unit 21 can be improved. The first encapsulation layer 71 and the second encapsulation layer 72 are both inorganic film layers, such as silicon nitride. The thickness of the first encapsulation layer 71 and the second encapsulation layer 72 is greater than 8000 angstroms, and the first encapsulation layer 71 and the second encapsulation layer 72 can be formed by a chemical vapor deposition process, an atomic layer deposition process, or the like.

[0166] The first portion 31 of the light modulation layer 30 includes a first bottom surface facing the substrate 10, and the first bottom surface is attached to the first encapsulation layer 71 or the second encapsulation layer 72.

[0167] For example, the first encapsulation layer 71 is a continuous film layer, the second encapsulation layer 72 includes a plurality of encapsulation portions arranged at intervals, adjacent two encapsulation portions are spaced apart at positions corresponding to the accommodation grooves SL, and the first bottom surface is in contact with the first encapsulation layer 71. For another example, the first encapsulation layer 71 and the second encapsulation layer 72 are both continuous film layers, and the first bottom surface is attached to the second encapsulation layer 72.

[0168] For the display panel shown in FIGS. 8 and 9, the first planarization layer PLN1 therein can be similar to the foregoing embodiments, including a plurality of first planar portions PLN11, but not including a second planar portion PLN12; or can include both the first planar portion PLN11 and the second planar portion PLN12. In addition, the second planarization layer PLN2 can be similar to the foregoing embodiments, and can be a continuous film layer or can be disconnected at positions of the bottom of the accommodation grooves.

[0169] In FIG. 9, the light emitting assembly 20 is shown in series, and the series mode is similar to that shown in FIG. 4, which will not be described again. It should be noted that for the display panel shown in FIGS. 8 and 9, the first planarization layer PLN1 therein can be as shown in FIG. 3A, located in the light emitting assembly 20; or can be as shown in FIG. 3B, including the first planar portion PLN11 and the second planar portion PLN12.

[0170] FIG. 10 is a sectional view of a display substrate provided in yet some embodiments of the present disclosure, the display substrate shown in FIG. 10 is similar to the display substrate shown in FIGS. 3A-4, the difference is that, in FIG. 10, at least part of the optical functional unit 21 is located inside the first opening SP. For example, the optical functional unit 21 is entirely located inside the first opening SP, or part of the optical functional unit 21 is located inside the first opening SP, and the maximum distance from the other part of the optical functional unit 21 to the substrate 10 is greater than the maximum distance from the surface of the second light-blocking portion BM12 away from the substrate 10 to the substrate 10.

[0171] The display panel shown in FIG. 10 includes the second planarization layer PLN2, in other examples, the second planarization layer PLN2 in FIG. 10 can be removed, in which case the first bottom surface of the first portion 31 is in contact with the connection electrode 16. In addition, the first planarization layer PLN1 can be located inside the light-emitting assembly 20 as shown in FIG. 3A, or can include the first planar portion PLN11 and the second planar portion PLN12 as shown in FIG. 3B. In addition, in the display panel shown in FIG. 10, a first encapsulation layer and a second encapsulation layer can also be provided, at least one of the first encapsulation layer and the second encapsulation layer can be a continuous film layer (see FIG. 8), or the first encapsulation layer and the second encapsulation layer can only be provided in the first opening SP region, thereby encapsulating the optical functional unit 21.

[0172] For the display panel shown in FIG. 10, the connection relationship between the first conductive pad 141, the connection electrode 16 and the light-emitting unit 22, and the connection relationship between the first conductive pad 141, the connection electrode 16 and the drive wire layer 12 can be referred to the description of FIGS. 3A-4 above, and will not be described here.

[0173] Among them, for the display panel shown in FIG. 10, the first planarization layer PLN1 therein is similar to the foregoing embodiments, including a plurality of first planar portions PLN11, and not including a second planar portion PLN12; or can include both the first planar portion PLN11 and the second planar portion PLN12. In addition, the second planarization layer PLN2 can be similar to the foregoing embodiments, which can be a continuous film layer, or can be disconnected at the position of the bottom of the accommodating groove.

[0174] FIG. 11A is a sectional view of a display substrate provided in some other embodiments of the present disclosure, FIG. 11B is another sectional view of a display substrate provided in some other embodiments of the present disclosure, and FIG. 12 is still another sectional view of a display substrate provided in some other embodiments of the present disclosure. The display substrates shown in FIGS. 11A-12 are similar to the display substrates shown in FIGS. 8-9, except that in FIGS. 11A-12, the light-emitting unit 22 adopts an inverted LED light-emitting chip. Specifically, the light-emitting unit 22 includes a light-emitting body 223 and a first electrode 221 and a second electrode 222 located on a side of the light-emitting body 223 facing the substrate 10, wherein the light-emitting body 223 includes a first semiconductor layer, a light-emitting layer, and a second semiconductor layer arranged in sequence in a direction away from the substrate 10, the first electrode 221 is electrically connected to the first semiconductor layer, and the second electrode 222 is electrically connected to the second semiconductor layer.

[0175] As the same as FIGS. 3A-4 and 6-10, the display substrate further includes the driving wire layer 12, the insulating layer 11, a plurality of first conductive pads 141, and a first planarization layer PLN1. The driving wire layer 12 is disposed on the substrate 10, and the insulating layer 11 is located on a side of the driving wire layer 12 away from the substrate 10. The first conductive pads 141 are located on a side of the insulating layer 11 away from the substrate 10 and are electrically connected to the driving wire layer 12 through first vias V1 on the insulating layer 11, the first vias V1 can be filled with a conductive material, which can be the same as the material of the part of the driving wire layer 12 electrically connected to the first conductive pads 141 or can be an integral structure with the first conductive pads 141. Different from the foregoing embodiments, since the light-emitting unit 22 adopts an inverted LED light-emitting chip, as shown in FIGS. 11A-12, a plurality of second conductive pads 142 are further disposed on a side of the insulating layer 11 away from the substrate 10, and the second conductive pads 142 are electrically connected to the driving wire layer 12 through second vias V2 on the insulating layer 11, the second vias V2 can be filled with a conductive material, which can be an integral structure with the second conductive pads 142 or can be the same as the material of the part of the driving wire layer 12 electrically connected to the second conductive pads 142. The first conductive pads 141 and the second conductive pads 142 are electrically connected to the same side of the light-emitting unit 22, thereby providing the first signal and the second signal to the light-emitting unit 22, respectively. For example, the first conductive pads 141 are electrically connected to the first electrode 221, thereby providing the first signal to the first electrode 221; and the second conductive pads 142 are electrically connected to the second electrode 222, thereby providing the second signal to the second electrode 222.

[0176] As shown in FIGS. 11A and 11B, the first planarization layer PLN1 is located between the light emitting unit 22 and the optical functional unit 21. In one example, as shown in FIG. 11A, the first planarization layer PLN1 is located within the light emitting assembly 20, and the portion of the first planarization layer PLN1 located within the single light emitting assembly 20 is referred to as a first flat portion PLN11, and the first planarization layer PLN1 includes a plurality of first flat portions PLN11 spaced apart from each other, the first flat portion PLN11 corresponds to the light emitting unit 22 one by one, and the first flat portion PLN11 is located between the corresponding light emitting unit 22 and the optical functional unit 21. The first portion 31 of the light modulation layer 30 includes a first bottom surface facing the substrate 10, and the first planarization layer PLN1 and the orthographic projection of the first bottom surface on the substrate 10 have a non-overlapping area, for example, the orthographic projection of the first planarization layer PLN1 on the substrate 10 and the orthographic projection of the first bottom surface on the substrate 10 can be completely non-overlapping. In another example, as shown in FIG. 11B, the first planarization layer PLN1 includes a first flat portion PLN11 located within the light emitting assembly 20 and a second flat portion PLN12 located between adjacent light emitting assemblies 20, the thickness of the first flat portion PLN11 is greater than the thickness of the second flat portion PLN12, and the first portion 31 of the light modulation layer 30 includes a first bottom surface facing the substrate 10, and the orthographic projection of the second flat portion PLN12 on the substrate 10 and the orthographic projection of the first bottom surface on the substrate 10 have an overlapping area, for example, the orthographic projection of the first bottom surface on the substrate 10 is completely located within the orthographic projection of the second flat portion PLN12 on the substrate 10.

[0177] In one example, when the light emitting unit 22 adopts an inverted LED light emitting chip, the display substrate can further include the first encapsulation layer 71 and the second encapsulation layer 72 described above, and the first bottom surface can be attached to the first encapsulation layer 71 or the second encapsulation layer 72, as described above.

[0178] When the light emitting unit 22 adopts an inverted LED light emitting chip, since the first flat portion PLN11 away from the surface of the substrate 10 can play a planarization role, the second planarization layer PLN2 can not be necessarily provided, of course, the second planarization layer PLN2 can be provided, and the first encapsulation layer 71 and the second encapsulation layer 72 are not included, in this case, the first bottom surface of the first portion 31 is attached to the second planarization layer PLN2. When the second planarization layer PLN2 is provided, the second planarization layer PLN2 can be a continuous film layer, or can be similar to the foregoing embodiments, and is disconnected at the position of the accommodating groove.

[0179] In some other examples, when the light emitting unit 22 adopts an inverted LED light emitting chip, the display substrate can also not include the second planarization layer PLN2, the first encapsulation layer 71, and the second encapsulation layer 72. In this case, when the first planarization layer PLN1 is located in the light emitting assembly 20, the first bottom surface is attached to the insulating layer 11; when the first planarization layer PLN1 includes both the first flat portion PLN11 and the second flat portion PLN12, the first bottom surface is attached to the second flat portion PLN12.

[0180] In addition, when the light emitting unit 22 adopts an inverted LED light emitting chip, the luminance of different light emitting units 22 can be independently controlled, or a plurality of light emitting units 22 can be connected in series (referring to the driving mode described above). In this case, no connection electrode is needed, and adjacent two light emitting units 22 with the same light emitting color in the same group are connected in series through the signal line in the driving trace layer 12. For example, as shown in FIG. 12, the second conductive pad 142 corresponding to one of the adjacent two light emitting units 22 is electrically connected to the first conductive pad 141 corresponding to the other light emitting unit 22.

[0181] The display substrate provided by the embodiments of the present disclosure also provides a manufacturing method thereof. Referring to FIGS. 1 to 4, the manufacturing method includes the following steps.

[0182] S1, forming a plurality of light emitting assemblies 20 on the substrate 10; the light emitting assembly 20 includes a light emitting unit 22 and an optical functional unit 21 arranged on the side of the light emitting unit 22 away from the substrate 10, and at least part of the optical functional units 21 of the light emitting assemblies 20 are used to convert the color of the light entering the optical functional units 21; a containing groove SL is defined between adjacent two light emitting assemblies 20.

[0183] S2, forming a light adjusting material layer and curing the light adjusting material layer to form a light adjusting layer 30.

[0184] In the step S2, the light adjusting material layer flows along the topography of the light emitting assembly 20 and the containing groove SL during the curing process, so that the light adjusting layer 30 formed after the curing includes a first part 31 located in the containing groove SL and a second part 32 located outside the containing groove SL and on the side of the light emitting assembly 20 away from the substrate 10; the second part 32 includes a convex surface protruding away from the substrate 10, and each second part 32 corresponds to an optical functional unit 21; the first part 31 and the second part 32 are a continuous and integral structure, and the light emitted by the light emitting assembly 20 passes through the light adjusting layer 30 and is emitted.

[0185] In the embodiments of the present disclosure, the light adjusting layer 30 with the required topography is formed by the flowability of the light adjusting material layer itself, and the light emitted by the light emitting assembly 20 is gathered, so that the luminance of the front view angle can be improved while simplifying the process flow.

[0186] In some embodiments, the light-adjusting material layer comprises a thermosetting material, thereby facilitating the light-adjusting material layer to flow over the plurality of light-emitting components 20 in a shape following process of heating, forming the light-adjusting layer 30 with the above-mentioned topography.

[0187] FIGS. 13A-13L are schematic diagrams of structures in a manufacturing process of a display substrate provided in some embodiments of the present disclosure. Hereinafter, the manufacturing process of the display substrate will be introduced by taking the display substrate shown in FIG. 3A as an example.

[0188] S11, as shown in FIG. 13A, a driving wire layer 12 and an insulating layer 11 are formed on a substrate 10, the insulating layer 11 is located on a side of the driving wire layer 12 away from the substrate 10; and a first via V1 and a third via V3 penetrating the insulating layer 11 are formed.

[0189] S12, as shown in FIG. 13B, a first conductive pad 141 is formed, the first conductive pad 141 is electrically connected to the driving wire layer 12 through the first via V1.

[0190] S13, as shown in FIG. 13C, a light-emitting unit 22 is transferred to the substrate 10 on which the first conductive pad 141 is formed, the light-emitting unit 22 is located on a side of the first conductive pad 141 away from the substrate 10, and a first electrode 221 of the light-emitting unit 22 is electrically connected to the first conductive pad 141.

[0191] S14, as shown in FIG. 13D, a first planarization layer PLN1 is formed, the first planarization layer PLN1 comprises a plurality of planar portions PLN11 corresponding to the plurality of light-emitting units 22 one by one, the plurality of planar portions PLN11 are arranged spaced apart from each other, and a fourth via V4 is formed on the planar portion PLN11.

[0192] S15, as shown in FIG. 13E, a second planarization layer PLN2 is formed, the second planarization layer PLN2 covers the plurality of planar portions PLN11 and the interval regions between adjacent planar portions PLN11.

[0193] S16, as shown in FIG. 13F, a connecting electrode 16 is formed, the connecting electrode 16 is electrically connected to the light-emitting unit 22 through the fourth via V4, and is electrically connected to the driving wire layer 12 through the third via V3.

[0194] S16, as shown in FIG. 13G, an optical functional unit 21 corresponding to the light-emitting unit 22 is formed on a side of the second planarization layer PLN2 away from the substrate 10. The optical functional unit 21 can be formed by a photolithography patterning process.

[0195] S17. As shown in FIG. 13H, a first light-blocking layer BM1 is formed, which includes a first light-blocking portion BM11 surrounding the optical functional unit 21 and the light-emitting unit 22, and a second light-blocking portion BM12 on the side of the optical functional unit 21 away from the substrate 10. In one example, the first light-blocking portion BM11 serves as at least part of the groove wall of the accommodation groove SL.

[0196] S18. As shown in FIG. 13I, a light-adjusting material layer is formed and cured to form the light-adjusting layer 30 described above.

[0197] S19. As shown in FIG. 13J, a planarization layer 60 is formed on the side of the light-adjusting layer 30 away from the substrate 10.

[0198] S20. As shown in FIG. 13K, a second light-blocking layer BM2 is formed on the side of the planarization layer 60 away from the substrate 10, which has a plurality of second openings.

[0199] S21. As shown in FIG. 13L, a plurality of light-filtering units 51 are formed, which correspond to the second openings one-to-one, and each of the light-filtering units 51 is disposed in a corresponding second opening.

[0200] S22. As shown in FIG. 13M, a cover layer 60 is formed on the side of the light-filtering units 51 and the second light-blocking layer BM2 away from the substrate 10.

[0201] The embodiments of the present disclosure also provide a display device including the display substrate in any of the above embodiments.

[0202] For example, the display device can be a head-mounted display device. Since the display substrate of the present disclosure can improve the forward light-emitting brightness, the display device employing the display substrate described above as a head-mounted display device can provide a better experience for the user.

[0203] It can be understood that the above embodiments are merely exemplary embodiments adopted for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and principle of the present disclosure, and these modifications and improvements are also considered to be within the protection scope of the present disclosure.

Claims

1. A display substrate, comprising: Substrate; A plurality of light-emitting components are disposed on the substrate, the light-emitting components including: a light-emitting unit and an optical functional unit disposed on the side of the light-emitting unit facing away from the substrate, at least some of the optical functional units of the light-emitting components are used to convert the color of light entering the optical functional unit; a receiving groove is defined between two adjacent light-emitting components; The dimming layer includes a first portion located in the receiving groove and a second portion located outside the receiving groove and on the side of the light-emitting component away from the substrate; the second portion includes a convex surface protruding away from the substrate, and each second portion corresponds to one optical functional unit; The first part and the second part are a continuously distributed integral structure, and the light emitted by the light-emitting component is emitted through the dimming layer.

2. The display substrate according to claim 1, wherein, The edge of the second part forms the opening of the receiving groove; The thickness of the second part gradually increases in the direction from the edge of the second part toward the center of the second part.

3. The display substrate according to claim 1, wherein, The thickness of the dimming layer corresponding to the slot opening is less than the thickness of the dimming layer corresponding to the position inside the slot opening.

4. The display substrate according to claim 1, wherein, The surface of the first portion away from the substrate is a concave surface facing the substrate; The minimum distance between the concave surface and the substrate is lower than the minimum distance between the slot and the substrate.

5. The display substrate according to claim 1, wherein, The thickness of the dimming layer corresponding to the center of the receiving groove is greater than the thickness of the dimming layer corresponding to the center of the second part.

6. The display substrate according to claim 1, wherein, The material of the dimming layer includes resin.

7. The display substrate according to claim 1, wherein, The light-emitting component also includes a first light-shielding layer. The first light-shielding layer includes a first light-shielding portion and a second light-shielding portion. The first light-shielding portion forms at least a portion of the wall of the receiving groove, and the second light-shielding portion is located outside the wall of the receiving groove and on the side of the light-emitting unit away from the substrate. The second light-shielding portion includes a first opening disposed opposite to the light-emitting unit, through which the light emitted by the light-emitting unit enters the dimming layer.

8. The display substrate according to claim 7, wherein, The first light-shielding portion and the second light-shielding portion are continuously distributed, and the opening of the receiving groove is the boundary line between the first light-shielding portion and the second light-shielding portion.

9. The display substrate according to claim 7, wherein, The optical functional layer is located between the light-shielding layer and the light-emitting unit, or, At least a portion of the optical functional layer is located inside the first opening.

10. The display substrate according to claim 7, wherein, The convex surface includes a first sub-surface and a second sub-surface surrounding the first sub-surface. The orthographic projection of the first sub-surface on the substrate is located within the orthographic projection range of the color conversion unit on the substrate and does not overlap with the orthographic projection of the first light-shielding layer on the substrate. The orthographic projection of the second sub-surface onto the substrate overlaps with the orthographic projection of the first light-shielding layer onto the substrate; The curvature of the second sub-face is greater than the curvature of the first sub-face.

11. The display substrate according to claim 7, wherein, The optical functional unit includes a first sub-unit and a second sub-unit. The first sub-unit is located on the side of the light-emitting unit away from the substrate, and the second sub-unit is arranged around the light-emitting unit.

12. The display substrate according to claim 1, wherein, The display substrate further includes: A planarization layer is located on the side of the dimming layer away from the substrate and is attached to the surface of the dimming layer away from the substrate; the refractive index of the planarization layer is less than the refractive index of the dimming layer; Multiple filter units are located on the side of the planarization layer away from the substrate; the filter units are arranged in a one-to-one correspondence with the optical functional units, and the orthographic projection of the filter unit on the substrate overlaps with the orthographic projection of the corresponding optical functional unit on the substrate.

13. The display substrate according to claim 1, wherein, The light emitted by the light-emitting unit is blue light or ultraviolet light; The optical functional units of the plurality of light-emitting components include: a first optical functional unit, a second optical functional unit, and a third optical functional unit; the first optical functional unit is used to convert the light emitted by the light-emitting unit into red light; the second optical functional unit is used to convert the light emitted by the light-emitting unit into green light; and the third optical functional unit is used to convert the light emitted by the light-emitting unit into blue light or maintain it in a blue light state. The plurality of filter units include: a first filter unit corresponding to each of the first optical functional units, wherein the first filter unit is a red color resist or a red-green-blue-transmitting filter; a second filter unit corresponding to the second optical functional unit, wherein the second filter unit is a green color resist or a red-green-blue-transmitting filter; and a third filter unit corresponding to the third optical functional unit, wherein the third filter unit is a blue color resist or a transparent layer.

14. The display substrate according to claim 13, wherein, The display substrate further includes a second light-shielding layer, which is located on the side of the planarization layer away from the substrate and has a second opening corresponding to each of the filter units, wherein the filter units are disposed in the corresponding second openings.

15. The display substrate according to any one of claims 1 to 14, wherein, The width of the bottom surface of the receiving tank is greater than or equal to 1 micrometer, and the vertical distance between the bottom surface of the receiving tank and the surface of the color conversion unit away from the substrate is greater than or equal to 8 micrometers.

16. The display substrate according to any one of claims 1 to 14, wherein, The cross-sectional area of ​​the receiving groove gradually increases in the direction away from the substrate.

17. The display substrate according to any one of claims 1 to 14, wherein, The display substrate further includes: A driving trace layer is disposed on the substrate; An insulating layer is located on the side of the drive trace layer away from the substrate; A plurality of first conductive pads and a plurality of second conductive pads are provided, wherein the first conductive pads and the second conductive pads are located on the side of the insulating layer away from the substrate. The first conductive pads are electrically connected to the driving wiring layer through a first via on the insulating layer, and the second conductive pads are electrically connected to the driving wiring layer through a second via on the insulating layer. The first conductive pads and the second conductive pads are respectively electrically connected to the same side of the light-emitting unit and provide a first signal and a second signal to the light-emitting unit, respectively. The first planarization layer is located between the light-emitting unit and the optical functional unit; The first planarization layer is located within the light-emitting component, and the first planarization layers in two adjacent light-emitting components are spaced apart. The first portion of the dimming layer includes a portion facing... Regarding the first bottom surface of the substrate, the orthographic projection of the first planarization layer onto the substrate and the orthographic projection of the first bottom surface onto the substrate have a non-overlapping region, or... The first planarization layer includes a first planar portion located within the light-emitting component and a second planar portion located between adjacent light-emitting components. The thickness of the first planar portion is greater than the thickness of the second planar portion. The first portion of the dimming layer includes a first bottom surface facing the substrate. The orthographic projection of the second planar portion on the substrate overlaps with the orthographic projection of the first bottom surface on the substrate.

18. The display substrate according to any one of claims 1 to 14, wherein, The display substrate further includes: A driving trace layer is disposed on the substrate; An insulating layer is located on the side of the drive trace layer away from the substrate; A connecting electrode and a plurality of first conductive pads are provided. The first conductive pads are located on the side of the insulating layer away from the substrate and are electrically connected to the driving wiring layer through a first via on the insulating layer. The connecting electrode is located on the side of the insulating layer away from the substrate and is electrically connected to the driving wiring layer through a third via on the insulating layer. The first conductive pads and the connecting electrode are electrically connected to opposite sides of the light-emitting unit, respectively. The area between the connecting electrode and at least a portion of the light-emitting component overlaps; A first planarization layer is located between the light-emitting unit and the optical functional unit; the connecting electrode is electrically connected to the light-emitting unit through a fourth via on the first planarization layer. Wherein, the first planarization layer is located within the light-emitting component, and the first planarization layers in two adjacent light-emitting components are spaced apart. The first portion of the dimming layer includes a first bottom surface facing the substrate. The orthographic projection of the first planarization layer on the substrate and the orthographic projection of the first bottom surface on the substrate have a non-overlapping region, or... The first planarization layer includes a first planarization portion located within the light-emitting component and a second planarization portion located between adjacent light-emitting components, wherein the thickness of the first planarization portion is greater than that of the second planarization portion. The thickness of the two flat portions, the first portion of the dimming layer includes a first bottom surface facing the substrate, and the orthographic projection of the second flat portion on the substrate overlaps with the orthographic projection of the first bottom surface on the substrate.

19. The display substrate according to claim 18, wherein, The first conductive pad and the connecting electrode are respectively used to provide a first signal and a second signal to the light-emitting unit; wherein, Each of the connection electrodes is connected to a plurality of the light-emitting units, or, Each of the connection electrodes corresponds to one of the light-emitting units. The first end of the connection electrode is electrically connected to the light-emitting unit through the fourth via. The second end of the connection electrode is electrically connected to the driving trace layer through the third via. The third via is located in the region between at least a portion of the light-emitting components.

20. The display substrate according to claim 18, wherein, Each of the light-emitting units corresponds to one of the connecting electrodes. The plurality of light-emitting components are divided into multiple groups. Each group includes at least two light-emitting components with the same light-emitting color connected in series. In two adjacent light-emitting components connected in series, the connecting electrode connected to one of the light-emitting units is also electrically connected to the first conductive pad corresponding to the other light-emitting unit.

21. The display substrate according to claim 18, wherein, The first portion of the dimming layer includes a first bottom surface facing the substrate; Wherein, the first bottom surface is in contact with the connecting electrode, or... The display substrate further includes a second planarization layer, which is located on the side of the light-emitting unit of the connecting electrode and the light-emitting component away from the substrate, and the first bottom surface is attached to the second planarization layer.

22. The display substrate according to claim 17 or 18, wherein, The display substrate further includes: The first encapsulation layer is located between the color conversion unit and the light-emitting unit; The second encapsulation layer is located on the side of the color conversion unit away from the substrate; The first portion of the dimming layer includes a first bottom surface facing the substrate, and the first bottom surface is bonded to the first encapsulation layer or the second encapsulation layer.

23. A method for manufacturing a display substrate, comprising: Multiple light-emitting components are formed on the substrate; The light-emitting component includes: a light-emitting unit and an optical functional unit disposed on the side of the light-emitting unit facing away from the substrate, wherein at least a portion of the optical functional units of the light-emitting component are used to convert the color of light entering the optical functional unit; a receiving groove is defined between two adjacent light-emitting components; A dimming material layer is formed, and the dimming material layer is cured to form a dimming layer; The dimming material layer flows along with the shape of the light-emitting component and the receiving groove during the curing process, so that the cured dimming layer includes a first part located in the receiving groove and a second part located outside the receiving groove and on the side of the light-emitting component away from the substrate; the second part includes a convex surface protruding away from the substrate, and each second part corresponds to one optical functional unit; the first part and the second part are a continuously distributed integral structure, and the light emitted by the light-emitting component is emitted through the dimming layer.

24. The manufacturing method according to claim 23, wherein, The dimming material layer includes a thermosetting material.

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