Printing system, management method, and program

Abstract

This printing system comprises a printing unit, a storage unit, an identification unit, and a management unit. By using a mask and a squeegee, the printing unit performs printing by means of a solder paste on a board according to board data in which printing conditions are set. The storage unit stores mask information, squeegee information, and solder information in each of which a proper printing condition range is set. The identification unit includes a reading part that reads identification information from a recording part. The management unit executes: an acquisition process for acquiring, from the storage unit, the mask information, the squeegee information, and the solder information regarding the mask, the squeegee, and the solder paste, respectively, to be read by the reading part; and a printing condition determination process for determining whether or not the printing conditions set in the board data fall within the proper printing condition ranges set in the mask information, the squeegee information, and the solder information.

Description

Printing system, management method and program

[0001] The present invention relates to a printing system including a printing unit that prints solder paste on a substrate, a method for managing the printing unit, and a program that causes a processor to execute processing for managing the printing unit.

[0002] BACKGROUND ART Screen printing devices have been known in the past that print solder paste on a substrate such as a printed circuit board superimposed on a mask by sliding a squeegee over the mask to which solder paste such as cream solder has been supplied.

[0003] In a screen printing apparatus, it is required that appropriate printing materials, such as a mask, a squeegee, and a solder paste, be used in the printing unit depending on the characteristics of the substrate to be printed. Patent Document 1 discloses a technology for determining whether the printing materials used in the printing unit of a screen printing apparatus are appropriate. The technology disclosed in Patent Document 1 reads an identification mark attached to the printing material and compares the material information corresponding to the read identification mark with the material information assigned to the substrate to determine whether the printing material is appropriate.

[0004] In a screen printing apparatus, a printing unit prints solder paste on a substrate by sliding a squeegee over a mask to which solder paste has been supplied according to preset printing conditions. In this case, if the printing unit is not set to the appropriate printing conditions, it may not be able to properly print the solder paste on the substrate. For this reason, it is not sufficient to simply determine whether the printing material used in the printing unit is appropriate, as in the technology disclosed in Patent Document 1; it is necessary to properly manage the printing unit, including the printing conditions.

[0005] JP 2014-108569 A

[0006] An object of the present invention is to provide a printing system capable of accurately managing printing units including printing conditions, a management method for managing printing units, and a program that causes a processor to execute processing for managing printing units.

[0007] According to one aspect of the present invention, there is provided a printing system for printing solder paste on a substrate, the printing system including: a printing unit that includes a mask disposed above the substrate and a squeegee that slides on the mask to which the solder paste is supplied, and that prints the solder paste on the substrate in accordance with substrate data that sets printing conditions related to the contact angle, pressing force, and movement speed of the squeegee with respect to the mask; a storage unit that stores information that sets appropriate printing condition ranges indicating appropriate ranges of the printing conditions, the information including mask information for each of the masks, squeegee information for each of the squeegees, and solder information for each of the solder pastes; an identification unit that is attached to each of the masks, the squeegee, and a solder container that contains the solder paste, the identification unit including a recording unit that records identification information for identifying each of the components, and a reading unit that reads the identification information from the recording unit; and a management unit that manages the printing unit. The management unit performs an acquisition process to acquire from the storage unit the mask information, the squeegee information, and the solder information relating to each of the mask, the squeegee, and the solder paste to be read, whose identification information has been read by the reading unit, and a printing condition determination process to determine whether the printing conditions set in the board data are within the appropriate range of printing conditions set in the mask information, the squeegee information, and the solder information acquired in the acquisition process, and to output correction guidance information to guide the user to correct the printing conditions if the printing conditions are outside the appropriate range of printing conditions.

[0008] A management method according to another aspect of the present invention is a management method for managing a printing unit that includes a mask placed above a substrate and a squeegee that slides on the mask to which solder paste has been supplied, and that prints the solder paste on the substrate in accordance with substrate data that sets printing conditions related to the contact angle, pressing force, and movement speed of the squeegee with respect to the mask. In this management method, when identification information recorded in recording units attached to each of the mask, the squeegee, and a solder container that contains the solder paste is read by a reading unit, information that sets an appropriate printing condition range indicating an appropriate range of the printing conditions, mask information related to the mask to be read by the reading unit, squeegee information related to the squeegee, and solder information related to the solder paste, is obtained, and it is determined whether the printing conditions set in the substrate data are within the appropriate printing condition range set in the mask information, the squeegee information, and the solder information.

[0009] According to another aspect of the present invention, there is provided a program for causing a processor to execute processes for managing a printing unit that includes a mask placed above a substrate and a squeegee that slides on the mask to which solder paste has been supplied, and that prints the solder paste on the substrate in accordance with substrate data that sets printing conditions related to the contact angle, pressing force, and movement speed of the squeegee with respect to the mask. When identification information recorded in recording units attached to the mask, the squeegee, and the solder container that contains the solder paste is read by a reading unit, the program causes the processor to execute processes for acquiring mask information related to the mask, squeegee information related to the squeegee, and solder information related to the solder paste that are read by the reading unit, the mask information being information that sets an appropriate printing condition range indicating an appropriate range of the printing conditions, and determining whether the printing conditions set in the substrate data are within the appropriate printing condition range set in the mask information, the squeegee information, and the solder information.

[0010] 1 is a diagram schematically illustrating the configuration of a component mounting system to which a printing system according to an embodiment of the present invention is applied; FIG. 2 is a side view of a printer provided in the printing system; FIG. 3 is a front view of the printer; FIG. 4 is a diagram for explaining board data referenced by a printing unit of the printer; FIG. 5 is a diagram for explaining mask information stored in a storage unit provided in the printing system; FIG. 6 is a diagram for explaining squeegee information stored in the storage unit; FIG. 7 is a diagram for explaining solder information stored in the storage unit; and FIG. 8 is a diagram for explaining judgment management data referenced by a management unit provided in the printing system when performing printing condition judgment processing. FIG. 9 is a flowchart illustrating the flow of acquisition processing and usability judgment processing when the management unit manages masks used in the printing unit; FIG. 10 is a flowchart illustrating the flow of printing condition judgment processing when the management unit manages masks used in the printing unit; FIG. 11 is a flowchart illustrating the flow of acquisition processing and usability judgment processing when the management unit manages squeegees used in the printing unit; FIG. 12 is a flowchart illustrating the flow of acquisition processing and usability judgment processing when the management unit manages solder paste used in the printing unit;

[0011] A printing system, a management method, and a program according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, directional relationships will be described using XYZ Cartesian coordinates. That is, mutually orthogonal directions on a horizontal plane are referred to as the X-axis direction and the Y-axis direction, and a vertical direction orthogonal to the X-axis direction and the Y-axis direction is referred to as the Z-axis direction. The printing system according to this embodiment is applied to a component mounting system that mounts components on a substrate such as a printed circuit board, and is a system equipped with a printing unit that prints solder paste such as cream solder on the substrate. The management method is a method for managing the printing unit. The program is a program that causes a processor to execute processing to manage the printing unit.

[0012] 1 is a diagram showing a schematic configuration of a component mounting system PMS to which a printing system PS according to an embodiment of the present invention is applied. The component mounting system PMS includes a production line PL and a printing system PS.

[0013] The production line PL is a line on which a printing machine 1, a print inspection machine PIM, a mounting machine MM, a reflow machine RM, and a board inspection machine BIM are arranged as multiple work machines that perform work to produce mounted boards on boards PB with components mounted on them. On the production line PL, the printing machine 1, the print inspection machine PIM, the mounting machine MM, the reflow machine RM, and the board inspection machine BIM are arranged in tandem from the upstream side to the downstream side in the board transport direction on a board transport path TP that transports the boards PB. At the upstream end of the production line PL is arranged a loader LD that transports the boards PB into the printing machine 1, and at the downstream end is arranged an unloader ULD that removes the produced boards PB from the board inspection machine BIM.

[0014] The printer 1 constitutes a part of the printing system PS. The printer 1 performs an operation of printing solder paste such as cream solder onto the substrate PB, for example, by a screen printing method. The printer 1 will be described in detail later.

[0015] The print inspection machine PIM inspects whether the position, amount, and height of solder paste printed on the substrate PB are appropriate. The print inspection machine PIM includes a print inspection unit PIMU that inspects the printing state of the solder paste at multiple printing positions set on the substrate PB. The print inspection unit PIMU captures an image of the substrate PB on which solder paste has been printed at each printing position to obtain the captured image, and moves above the substrate PB while recognizing the FID (fiducial) marks on the substrate PB, the size of the substrate PB, and the like based on the captured image, to inspect the printing state of the solder paste at each printing position on the substrate PB.

[0016] The mounting machine MM mounts components on a substrate PB printed with solder paste to produce a mounted substrate. The mounting machine MM includes a mounting unit MMU that performs the work of producing the mounted substrate. The mounting unit MMU captures images of the substrate PB and components to obtain captured images, and then moves above the substrate PB while recognizing the FID marks on the substrate PB, the size of the substrate PB, the shapes of the components, etc., based on the captured images, and mounts the components on the substrate PB.

[0017] The reflow machine RM heats the mounting board produced by the mounting machine MM to melt the solder and fix the components to the board PB.

[0018] The board inspection machine BIM is a device that inspects mounted boards and is located at the most downstream position in the board transport direction on the production line PL. The board inspection machine BIM inspects mounted boards for component misalignment, lead misalignment, component lift, missing components, soldering defects, and foreign matter. The board inspection machine BIM includes a board inspection unit BIMU that performs the work of inspecting mounted boards. The board inspection unit BIMU captures an image of the mounted board and, based on the captured image, moves above the mounted board while recognizing the FID marks on the mounted board, the size of the mounted board, and the positions of the components on the mounted board, and inspects for component misalignment. It should be noted that, in addition to being located at the most downstream position in the board transport direction on the production line PL, a board inspection machine BIM may also be located between the mounting machine MM and the reflow machine RM. In this case, the board inspection machine BIM inspects the mounted board before the reflow process by the reflow machine RM.

[0019] [Overall Configuration of Printing System] The printing system PS is a system for printing solder paste such as cream solder on a substrate PB. The printing system PS includes a printing machine 1, a print management device PM, a server device SM, and an identification unit IDU.

[0020] <About the Printer> The printer 1 prints solder paste at a plurality of printing positions set on the substrate PB. This printer 1 will be described with reference to Figs. 2 and 3 in addition to Fig. 1. The printer 1 is a so-called screen printing device and includes a base 1A. On this base 1A, an input conveyor 2a, an output conveyor 2b, and a printing stage 3 located between these conveyors 2a and 2b are arranged in the Y-axis direction. In the printer 1, the substrate PB is carried into the printing stage 3 by the input conveyor 2a, where it is subjected to a printing process in which solder paste is printed, and then carried out by the output conveyor 2b.

[0021] A four-axis unit 10 is disposed on the printing stage 3. The four-axis unit 10 supports the substrate PB and mounts the substrate PB on the underside of a mask 4 (described later), and supports the substrate PB carried in by the carry-in conveyor 2a horizontally and supports it so that it can be displaced in the X-axis direction, Y-axis direction, Z-axis direction, and R direction (around the Z axis).

[0022] Specifically, the four-axis unit 10 is hierarchically provided with, in order from the bottom up, a fixed table 11 fixed on the base 1A, an X-axis table 12 movable in the X-axis direction relative to the fixed table 11, a Y-axis table 13 movable in the Y-axis direction relative to the X-axis table 12, an R-axis table 14 rotatable about the Z-axis relative to the Y-axis table 13, and a lifting table 15 movable up and down in the Z-axis direction relative to the R-axis table 14. A support unit 16 is provided on the lifting table 15, and the substrate PB is supported by this support unit 16, so that the substrate PB moves in the X-axis, Y-axis, Z-axis, and R directions by driving the tables 12, 13, 14, and 15.

[0023] The support unit 16 has a conveyor 19 that supports the substrate PB so that it can be transported in the Y-axis direction, a support mechanism 17 for supporting the substrate PB, and a clamp mechanism 18 for clamping the substrate PB. In other words, the support unit 16 receives the substrate PB from the carry-in conveyor 2a onto the conveyor 19, and lifts the substrate PB from the conveyor 19 by supporting it from below with the support mechanism 17, and clamps the substrate PB from both sides in the X-axis direction with the clamp mechanism 18. In this way, the substrate PB is positioned and fixed at a predetermined position on the lift-up table 15.

[0024] The printer 1 includes a printing unit PU disposed above the printing stage 3. The printing unit PU is a unit for printing solder paste at a plurality of printing positions set on the substrate PB, and includes a mask 4, a solder supply unit 5, and a squeegee unit 6.

[0025] The mask 4 is positioned approximately horizontally above the printing stage 3. The mask 4 is replaceably positioned above the substrate PB on the printing stage 3. The mask 4 is a plate-like member, for example made of stainless steel, in which a printing opening is formed. The mask 4 is stretched over a predetermined frame and is replaceably incorporated into the printing machine 1 via the frame. The mask 4 is replaced by a mask replacement unit 7. A movable cleaning device 9 is disposed directly below the mask 4. As the printing operation progresses, the cleaning device 9 slides along the underside of the mask 4 at regular intervals to remove solder paste adhering to the underside of the mask 4 and the printing opening. During the printing operation, the cleaning device 9 is positioned in a predetermined retracted position outside the mask 4.

[0026] A detection unit 8 is disposed below the mask 4. The detection unit 8 is supported movably in the X-axis direction and is driven by a servo motor or the like. The detection unit 8 is equipped with a detection section 8a. The detection section 8a detects the mask 4 from below. The position of the mask 4 is recognized based on the detection result of the detection section 8a. In the printing press 1, the relative position of the substrate PB with respect to the mask 4 is recognized based on the detection result of the detection section 8a, and then the relative position of the substrate PB with respect to the mask 4 is accurately positioned by driving the X-axis table 12, the Y-axis table 13, and the R-axis table 14 in the four-axis unit 10 of the printing stage 3. Then, in the printing press 1, with the relative position of the substrate PB with respect to the mask 4 accurately positioned, the lift table 15 in the four-axis unit 10 is driven to lift the substrate PB and bring it into contact with the underside of the mask 4.

[0027] The solder supply unit 5 is disposed above the mask 4. The solder supply unit 5 supplies solder paste onto the mask 4. The solder supply unit 5 is attached to a unit support member 21 that supports the squeegee unit 6. The solder supply unit 5 is driven by drive mechanisms 22, 23, and 24 supported by the unit support member 21.

[0028] The squeegee unit 6 is disposed above the mask 4. The squeegee unit 6 is a unit for printing solder paste at multiple printing positions set on the substrate PB through the printing openings of the mask 4 by moving the solder paste along the mask 4. The squeegee unit 6 is supported movably in the X-axis direction and driven by a servo motor or the like. More specifically, above the mask 4, there are disposed a pair of fixed rails 20 extending in the X-axis direction, unit support members 21 extending in the Y-axis direction and movably supported on each fixed rail 20, and a drive mechanism such as a screw feed mechanism that drives the unit support member 21 using a servo motor 20A as a drive source. The squeegee unit 6 is supported by the unit support member 21. The squeegee unit 6 can move in the X-axis direction together with the unit support member 21 by driving the servo motor 20A.

[0029] The squeegee unit 6 is equipped with a squeegee 6a. The squeegee 6a is connected to a drive mechanism, such as a screw feed mechanism, that drives the squeegee 6a using a drive source such as a servo motor. This allows the squeegee 6a to move up and down in the Z-axis direction relative to the squeegee unit 6. The squeegee 6a spreads the solder paste on the mask 4 while moving along the mask 4, and is made of, for example, a plate member made of hard urethane or metal such as stainless steel that is elongated in the Y-axis direction. The squeegee 6a is pressed against the mask 4 by lowering in the Z-axis direction relative to the squeegee unit 6, and in this state, the squeegee unit 6 moves in the X-axis direction together with the unit support member 21, sliding along the mask 4.

[0030] Printing conditions related to the pressing force, contact angle, and movement speed of the squeegee 6a against the mask 4 are set in advance in the board data BD. The pressing force is the pressure when the squeegee 6a is pressed against the mask 4. The contact angle is the angle formed between the squeegee 6a and the mask 4 when the squeegee 6a is pressed against the mask 4. The movement speed is the speed at which the squeegee 6a moves over the mask 4.

[0031] In the printing unit PU, the squeegee 6a slides along the mask 4 in accordance with the substrate data BD in which the printing conditions are set, moving the solder paste supplied onto the mask 4 in the X-axis direction, thereby printing the solder paste at multiple printing positions set on the substrate PB through the printing openings in the mask 4.

[0032] The board data BD will be described with reference to FIG. 4 . The board data BD is data that includes, for example, production date information BD1, solder classification information BD2, printing component type information BD3, and printing condition information BD4. The production date information BD1 is information indicating the date on which the mounted board is produced on the production line PL. In other words, the production date information BD1 is information indicating the date on which solder paste is printed on the board PB by the printing unit PU. The solder paste used by the printing unit PU is classified into lead-free solder and eutectic solder. Lead-free solder is solder that does not contain lead, such as solder containing tin, silver, and copper. Eutectic solder is solder that contains lead, such as solder containing tin and lead. The solder classification information BD2 is solder classification information that indicates the classification of the solder paste used by the printing unit PU. The printing component type information BD3 is printing component type information that indicates the types of mask 4, squeegee 6a, and solder paste used by the printing unit PU. The printing condition information BD4 is information indicating printing conditions related to the pressing force, contact angle, and movement speed of the squeegee 6a against the mask 4.

[0033] <About the Identification Unit> The identification unit IDU is a unit used during setup work to prepare the printing unit PU of the printing press 1. The setup work involves preparing printing materials, including the mask 4, squeegee 6a, and solder paste, to be used in the printing unit PU depending on the type of substrate PB to be printed. The setup work is performed by an operator or a work robot. As shown in FIG. 1 , the identification unit IDU includes a mask recording unit MREC attached to the mask 4, a squeegee recording unit SREC attached to the squeegee 6a, a solder recording unit PREC attached to a solder container SPB containing solder paste, and a reading unit REA.

[0034] The mask recording unit MREC records mask identification information J1M for identifying the mask 4. The mask recording unit MREC is configured, for example, as a barcode, two-dimensional code, or RFID (radio frequency identification) tag in which the mask identification information J1M is coded and recorded. The squeegee recording unit SREC records squeegee identification information J1S for identifying the squeegee 6a. The squeegee recording unit SREC is configured, for example, as a barcode, two-dimensional code, or RFID tag in which the squeegee identification information J1S is coded and recorded. The solder recording unit PREC records solder identification information J1P for identifying the solder paste in the solder container SPB. The solder recording unit PREC is configured, for example, as a barcode, two-dimensional code, or RFID tag in which the solder identification information J1P is coded and recorded.

[0035] The reading unit REA reads the mask identification information J1M from the mask recording unit MREC, reads the squeegee identification information J1S from the squeegee recording unit SREC, and reads the solder identification information J1P from the solder recording unit PREC. In the setup work of preparing the mask 4, squeegee 6a, and solder paste to be used in the printing unit PU, the worker or work robot performs the work of reading the mask identification information J1M from the mask recording unit MREC attached to the mask 4 using the reading unit REA, the work of reading the squeegee identification information J1S from the squeegee recording unit SREC attached to the squeegee 6a using the reading unit REA, and the work of reading the solder identification information J1P from the solder recording unit PREC attached to the solder container SPB using the reading unit REA.

[0036] <About the Server Device> The server device SM is a device that stores various information related to the masks 4, squeegees 6a, and solder paste used in the printing unit PU. The server device SM includes a storage unit SM1. The storage unit SM1 stores mask information JM for each of the multiple masks 4, squeegee information JS for each of the multiple squeegees 6a, and solder information JP for each of the multiple solder pastes.

[0037] As shown in Figure 5, the mask information JM includes mask type information JM1, printing condition appropriate range information JA, current print count information JB, limited print count information JC, and solder use history information JF. Mask type information JM1 is mask type information indicating the type of mask 4. Print condition appropriate range information JA is information indicating the appropriate range of printing conditions related to the pressing force, contact angle, and movement speed of the squeegee 6a against the mask 4. Current print count information JB is information indicating the current value of the number of prints of the mask 4 used by the printing unit PU. Limited print count information JC is information indicating the number of prints at which the use of the mask 4 should be limited. Solder use history information JF is solder use history information indicating the history of the types of solder paste used on the mask 4.

[0038] As shown in FIG. 6 , the squeegee information JS includes squeegee type information JS1, printing condition optimum range information JA, current print count information JB, limited print count information JC, condition change print count information JD, appropriate change range information JE, and solder usage history information JF. The squeegee type information JS1 indicates the type of squeegee 6a. The printing condition optimum range information JA indicates the appropriate range of printing conditions related to the pressing force, contact angle, and movement speed of the squeegee 6a against the mask 4. The current print count information JB indicates the current value of the number of prints of the squeegee 6a used by the printing unit PU. The limited print count information JC indicates the number of prints for which the use of the squeegee 6a should be limited. The condition change print count information JD is condition change print count information indicating the number of prints for which the appropriate range of printing conditions of the squeegee 6a indicated by the printing condition optimum range information JA should be changed. The appropriate change range information JE is information on the appropriate change range that has been changed relative to the appropriate printing condition range in accordance with the number of condition-change printing times indicated by the condition-change printing count information JD. The solder use history information JF is information on the solder use history that indicates the history of the types of solder paste used on the squeegee 6a.

[0039] As shown in Figure 7, the solder information JP includes solder type information JP1, solder classification information JP2, printing condition proper range information JA, and solder expiration date information JG. Solder type information JP1 is solder type information indicating the type of solder paste. Solder classification information JP2 is information indicating the classification of solder paste as lead-free solder or eutectic solder. Printing condition proper range information JA is information indicating the proper range of printing conditions related to the pressing force, contact angle, and movement speed of the squeegee 6a against the mask 4 when using solder paste. Solder expiration date information JG is solder expiration date information indicating the expiration date of the solder paste.

[0040] The storage unit SM1 may be incorporated into each of the mask recording unit MREC, squeegee recording unit SREC, and solder recording unit PREC of the identification unit IDU. In this case, the server device SM is omitted. The mask recording unit MREC records the mask identification information J1M and mask information JM, the squeegee recording unit SREC records the squeegee identification information J1S and squeegee information JS, and the solder recording unit PREC records the solder identification information J1P and solder information JP.

[0041] 8, the printing condition appropriate range information JA set in the mask information JM, squeegee information JS, and solder information JP, and the change appropriate range information JE set in the squeegee information JS, may be set in the judgment management data MD. In the judgment management data MD, the printing condition appropriate range information JA and the change appropriate range information JE are set according to combination information MD1 that indicates information on the combination of the mask 4, squeegee 6a, and solder paste used in the printing unit PU. In other words, in the judgment management data MD, the printing condition appropriate range indicated by the printing condition appropriate range information JA and the change appropriate range indicated by the change appropriate range information JE are set for each combination of the mask 4, squeegee 6a, and solder paste indicated in the combination information MD1.

[0042] <Regarding the Printing Management Device> The printing management device PM is, for example, configured as a personal computer. As shown in FIG. 1, the printing management device PM includes a management unit PM1 configured as a processor capable of information processing, a management memory unit PM2 that stores various information, and a display unit PM3 that displays various information. The management unit PM1 manages the printing unit PU, which uses printing members including a mask 4, a squeegee 6a, and solder paste. The management memory unit PM2 stores, for example, board data BD that the printing unit PU references when printing solder paste on the board PB. The display unit PM3 is a display that displays various information output by the management unit PM1.

[0043] The management unit PM1 may be provided in the printing machine 1. In this case, the printing machine 1 performs the work of printing solder paste on the board PB in the printing unit PU, and manages the printing unit PU in which the mask 4, the squeegee 6a, and printing members including the solder paste are used.

[0044] The management unit PM1 performs each process of a management method for managing the printing unit PU in accordance with a program for managing the printing unit PU. In this case, the program causes the management unit PM1, which is made up of a processor, to perform each process for managing the printing unit PU. The program may be stored in a portable storage medium such as an SD card, CD, BD, or memory card.

[0045] Each step of the management method performed by the management unit PM1 when managing the mask 4, squeegee 6a, and solder paste used in the printing unit PU will be described with reference to the flowcharts of FIGS.

[0046] (Mask Management) The processing performed by the management unit PM1 when managing the mask 4 used by the printing unit PU will be described with reference to Figures 9 and 10. The management unit PM1 performs an acquisition processing S1, a usability determination processing S2, and a printing condition determination processing S3.

[0047] In the acquisition process S1, the management unit PM1 receives input of mask identification information J1M read by the reading unit REA from the mask recording unit MREC attached to the mask 4 (step a1). The management unit PM1 identifies the mask 4 to be read by the reading unit REA based on the mask identification information J1M, and acquires mask information JM related to the mask 4 to be read from the storage unit SM1 (step a2).

[0048] In a usability determination process S2 following the acquisition process S1, the management unit PM1 compares the mask information JM acquired in the acquisition process S1 with the board data BD to determine whether the mask 4 to be read by the reading unit REA is usable for the printing unit PU. Specifically, the management unit PM1 determines whether the mask type indicated by the mask type information JM1 set in the mask information JM matches the mask type indicated by the printing material type information BD3 set in the board data BD (step a3). This allows the management unit PM1 to determine whether the mask 4 to be read by the reading unit REA is usable for the printing unit PU.

[0049] If the mask type set in the mask information JM does not match the mask type set in the board data BD (NO in step a3), the management unit PM1 determines that the mask 4 to be read by the reading unit REA is unusable for the printing unit PU (step a61), and outputs replacement guide information J4 that advises replacing the mask 4 to be read (step a62). The replacement guide information J4 output from the management unit PM1 is an example of the suitability information output from the management unit PM1, and is displayed, for example, on the display unit PM3. Based on the replacement guide information J4 output from the management unit PM1, a worker or a work robot can confirm whether the mask 4 to be read by the reading unit REA is suitable for use in the printing unit PU, and can replace the mask 4 to be read if it is unusable.

[0050] If the mask type set in the mask information JM matches the mask type set in the board data BD (YES in step a3), the management unit PM1 compares the solder use history indicated in the solder use history information JF set in the mask information JM for the mask 4 to be read by the reading unit REA with the solder classification indicated in the solder classification information BD2 set in the board data BD. As described above, solder paste is classified into lead-free solder, which does not contain lead, and eutectic solder, which does contain lead. In this case, the mask 4 used by the printing unit PU must be classified into a mask 4 that permits the use of lead-free solder and a mask 4 that permits the use of eutectic solder. Therefore, the management unit PM1 determines whether the solder use history indicated in the solder use history information JF, which relates to the history of the classification of solder paste used on the mask 4 to be read by the reading unit REA, includes any solder use history other than the solder classification indicated in the solder classification information BD2 set in the board data BD (step a4). This allows the management unit PM1 to determine whether or not the mask 4 to be read by the reading unit REA is usable for the printing unit PU, taking into account the solder classification of the solder paste.

[0051] If the solder usage history of the mask 4 to be read by the reading unit REA contains a solder usage history other than the solder classification indicated by the solder classification information BD2 set in the board data BD (NO in step a4), the management unit PM1 determines that the mask 4 to be read by the reading unit REA cannot be used by the printing unit PU (step a61), and outputs replacement guidance information J4 to guide the replacement of the mask 4 to be read (step a62).

[0052] If the solder usage history of the mask 4 to be read by the reading unit REA does not include any solder usage history other than that of the solder classification indicated in the solder classification information BD2 set in the board data BD (YES in step a4), the management unit PM1 determines whether the current print count indicated in the current print count information JB in the mask information JM related to the mask 4 to be read by the reading unit REA is within the limited print count indicated in the limited print count information JC (step a5). This allows the management unit PM1 to determine whether the mask 4 to be read by the reading unit REA is usable by the printing unit PU.

[0053] If the current number of prints in the mask information JM regarding the mask 4 to be read by the reading unit REA is not within the limited number of prints (NO in step a5), the management unit PM1 determines that the mask 4 to be read by the reading unit REA cannot be used by the printing unit PU (step a61), and outputs replacement guidance information J4 to guide the replacement of the mask 4 to be read (step a62).

[0054] If the current number of prints in the mask information JM regarding the mask 4 to be read by the reading unit REA is within the limited number of prints (YES in step a5), the management unit PM1 determines that the mask 4 to be read by the reading unit REA is usable by the printing unit PU (step a6).

[0055] If the mask 4 to be read by the reading unit REA is usable by the printing unit PU, in the printing condition determination process S3 following the usability determination process S2, the management unit PM1 determines whether the printing conditions indicated in the printing condition information BD4 set in the board data BD are within an appropriate range. Specifically, the management unit PM1 determines whether the printing conditions indicated in the printing condition information BD4 set in the board data BD are within the appropriate range of printing conditions indicated in the printing condition appropriate range information JA set in the mask information JM related to the mask 4 to be read by the reading unit REA (step a7).

[0056] If the printing conditions set in the board data BD are within the appropriate range of printing conditions set in the mask information JM (YES in step a7), the management unit PM1 determines that the printing conditions indicated by the printing condition information BD4 set in the board data BD are appropriate (step a8). In this case, it is determined that the printing conditions set in the board data BD are appropriate for the mask 4, and the worker or robot completes the setup work of preparing the mask 4 to be read by the reading unit REA as the mask 4 to be used in the printing unit PU.

[0057] On the other hand, if the printing conditions set in the board data BD are outside the appropriate range of printing conditions set in the mask information JM (NO in step a7), the management unit PM1 determines that the printing conditions indicated by the printing condition information BD4 set in the board data BD are inappropriate (step a9), and outputs correction guide information J2 that guides the user to correct the printing conditions, as well as appropriate range information J3 that indicates the appropriate range of the printing conditions (step a10). The correction guide information J2 and appropriate range information J3 output from the management unit PM1 are examples of appropriateness information output from the management unit PM1, and are displayed, for example, on the display unit PM3. Based on the correction guide information J2 output from the management unit PM1, the worker can confirm whether the printing conditions set in the board data BD are appropriate, and if they are inappropriate, can correct the printing conditions set in the board data BD by referring to the appropriate range information J3.

[0058] (Squeegee Management) The processing performed by the management unit PM1 when managing the squeegee 6a used in the printing unit PU will be described with reference to Figures 11 and 12. The management unit PM1 performs an acquisition processing S1, a usability determination processing S2, and a printing condition determination processing S3.

[0059] In the acquisition process S1, the management unit PM1 receives input of squeegee identification information J1S read by the reading unit REA from the squeegee recording unit SREC attached to the squeegee 6a (step b1). The management unit PM1 identifies the squeegee 6a to be read by the reading unit REA based on the squeegee identification information J1S, and acquires squeegee information JS related to the squeegee 6a to be read from the storage unit SM1 (step b2).

[0060] In a usability determination process S2 following the acquisition process S1, the management unit PM1 compares the squeegee information JS acquired in the acquisition process S1 with the substrate data BD to determine whether the squeegee 6a to be read by the reading unit REA is usable for the printing unit PU. Specifically, the management unit PM1 determines whether the squeegee type indicated in the squeegee type information JS1 set in the squeegee information JS matches the squeegee type indicated in the printing member type information BD3 set in the substrate data BD (step b3). This allows the management unit PM1 to determine whether the squeegee 6a to be read by the reading unit REA is usable for the printing unit PU.

[0061] If the squeegee type set in the squeegee information JS does not match the squeegee type set in the board data BD (NO in step b3), the management unit PM1 determines that the squeegee 6a being read by the reading unit REA is unusable for the printing unit PU (step b61) and outputs replacement guidance information J4 that advises replacing the squeegee 6a being read (step b62). The replacement guidance information J4 output from the management unit PM1 is an example of the suitability information output from the management unit PM1 and is displayed, for example, on the display unit PM3. Based on the replacement guidance information J4 output from the management unit PM1, a worker or a work robot can confirm whether the squeegee 6a being read by the reading unit REA is suitable for use with the printing unit PU, and if it is unusable, can perform the task of replacing the squeegee 6a being read.

[0062] If the squeegee type set in the squeegee information JS matches the squeegee type set in the board data BD (YES in step b3), the management unit PM1 compares the solder usage history indicated in the solder usage history information JF set in the squeegee information JS for the squeegee 6a read by the reading unit REA with the solder classification indicated in the solder classification information BD2 set in the board data BD. As described above, solder paste is classified into lead-free solder, which does not contain lead, and eutectic solder, which does contain lead. In this case, the squeegees 6a used by the printing unit PU must be classified into squeegees 6a that allow the use of lead-free solder and squeegees 6a that allow the use of eutectic solder. Therefore, the management unit PM1 determines whether or not there is any solder usage history other than the solder classification indicated by the solder classification information BD2 set in the board data BD as the solder usage history indicated in the solder usage history information JF relating to the history of the classification of solder paste used for the squeegee 6a to be read by the reading unit REA (step b4). This allows the management unit PM1 to determine whether or not the squeegee 6a to be read by the reading unit REA is usable by the printing unit PU, taking into account the solder classification of the solder paste.

[0063] If the solder usage history of the squeegee 6a to be read by the reading unit REA contains a solder usage history other than the solder classification indicated by the solder classification information BD2 set in the board data BD (NO in step b4), the management unit PM1 determines that the squeegee 6a to be read by the reading unit REA cannot be used by the printing unit PU (step b61) and outputs replacement guidance information J4 to guide the replacement of the squeegee 6a to be read (step b62).

[0064] If the solder usage history of the squeegee 6a to be read by the reading unit REA does not include any solder usage history other than that of the solder classification indicated in the solder classification information BD2 set in the board data BD (YES in step b4), the management unit PM1 determines whether the current print count indicated in the current print count information JB in the squeegee information JS for the squeegee 6a to be read by the reading unit REA is within the limited print count indicated in the limited print count information JC (step b5). This allows the management unit PM1 to determine whether the squeegee 6a to be read by the reading unit REA is usable by the printing unit PU.

[0065] If the current number of prints in the squeegee information JS for the squeegee 6a to be read by the reading unit REA is not within the limited number of prints (NO in step b5), the management unit PM1 determines that the squeegee 6a to be read by the reading unit REA cannot be used by the printing unit PU (step b61), and outputs replacement guidance information J4 to guide the user to replace the squeegee 6a to be read (step b62).

[0066] If the current number of prints in the squeegee information JS for the squeegee 6a to be read by the reading unit REA is within the limited number of prints (YES in step b5), the management unit PM1 determines that the squeegee 6a to be read by the reading unit REA is usable for the printing unit PU (step b6).

[0067] If the squeegee 6a to be read by the reading unit REA is usable for the printing unit PU, in the printing condition determination process S3 following the usability determination process S2, the management unit PM1 determines whether the printing conditions indicated in the printing condition information BD4 set in the board data BD are within an appropriate range. Specifically, the management unit PM1 determines whether the printing conditions indicated in the printing condition information BD4 set in the board data BD are within the appropriate range of printing conditions indicated in the printing condition appropriate range information JA set in the squeegee information JS related to the squeegee 6a to be read by the reading unit REA (step b7).

[0068] If the printing conditions set in the board data BD are outside the appropriate range of printing conditions set in the squeegee information JS (NO in step b7), the management unit PM1 determines that the printing conditions indicated by the printing condition information BD4 set in the board data BD are inappropriate (step b11), and outputs correction guide information J2 that guides the user in correcting the printing conditions, as well as appropriate range information J3 that indicates the appropriate range of the printing conditions (step b12). The correction guide information J2 and appropriate range information J3 output from the management unit PM1 are examples of appropriateness information output from the management unit PM1 and are displayed, for example, on the display unit PM3. Based on the correction guide information J2 output from the management unit PM1, the worker can confirm whether the printing conditions set in the board data BD are appropriate, and if they are inappropriate, the worker can correct the printing conditions set in the board data BD by referring to the appropriate range information J3.

[0069] If the printing conditions set in the substrate data BD are within the appropriate range of printing conditions set in the squeegee information JS (YES in step b7), the management unit PM1 determines whether the current number of prints indicated by the current print count information JB in the squeegee information JS for the squeegee 6a to be read by the reading unit REA has reached the condition-change print count indicated by the condition-change print count information JD (step b8). As the number of prints increases, the squeegee 6a may wear or deform, which can cause printing defects. To prevent printing defects caused by such wear or deformation of the squeegee 6a, it is necessary to change the appropriate range of printing conditions for the squeegee 6a depending on the number of prints for the squeegee 6a. Therefore, if the current number of prints in the squeegee information JS related to the squeegee 6a to be read by the reading unit REA has reached the condition change print number (YES in step b8), the management unit PM1 determines whether the printing conditions indicated in the printing condition information BD4 set in the board data BD are within the appropriate change range indicated in the appropriate change range information JE set in the squeegee information JS (step b9). This allows the management unit PM1 to determine whether the printing conditions set in the board data BD are appropriate so as to prevent printing defects caused by wear or deformation of the squeegee 6a.

[0070] If the printing conditions set in the board data BD are within the appropriate range of printing conditions set in the squeegee information JS and are also within the appropriate change range (YES in step b9), the management unit PM1 determines that the printing conditions indicated by the printing condition information BD4 set in the board data BD are appropriate (step b10). In this case, it is determined that the printing conditions set in the board data BD are appropriate for the squeegee 6a, and the worker or robot completes the setup work of preparing the squeegee 6a to be read by the reading unit REA as the squeegee 6a to be used in the printing unit PU.

[0071] On the other hand, if the printing conditions set in the board data BD are outside the appropriate change range set in the squeegee information JS (NO in step b9), the management unit PM1 determines that the printing conditions indicated by the printing condition information BD4 set in the board data BD are inappropriate (step b11), and outputs correction guide information J2 that guides the user to correct the printing conditions, as well as appropriate range information J3 that indicates the appropriate range of the printing conditions (step b12). The correction guide information J2 and appropriate range information J3 output from the management unit PM1 are displayed on the display unit PM3, for example.

[0072] (Solder Paste Management) The processing performed by the management unit PM1 when managing the solder paste used in the printing unit PU will be described with reference to Fig. 13 and Fig. 14. The management unit PM1 performs an acquisition processing S1, a usability determination processing S2, and a printing condition determination processing S3.

[0073] In the acquisition process S1, the management unit PM1 receives input of solder identification information J1P read by the reading unit REA from the solder recording unit PREC attached to the solder container SPB (step c1). The management unit PM1 identifies the solder paste to be read by the reading unit REA based on the solder identification information J1P, and acquires solder information JP related to the solder paste to be read from the storage unit SM1 (step c2).

[0074] In the usability determination process S2 following the acquisition process S1, the management unit PM1 compares the solder information JP acquired in the acquisition process S1 with the board data BD to determine whether the solder paste to be read by the reading unit REA is usable for the printing unit PU. Specifically, the management unit PM1 determines whether the solder type indicated in the solder type information JP1 set in the solder information JP matches the solder type indicated in the printing member type information BD3 set in the board data BD (step c3). This allows the management unit PM1 to determine whether the solder paste to be read by the reading unit REA is usable for the printing unit PU.

[0075] If the solder type set in the solder information JP does not match the solder type set in the board data BD (NO in step c3), the management unit PM1 determines that the solder paste read by the reading unit REA is unusable for the printing unit PU (step c51) and outputs replacement guide information J4 that advises replacing the solder paste read (step c52). The replacement guide information J4 output from the management unit PM1 is an example of the suitability information output from the management unit PM1 and is displayed on the display unit PM3, for example. Based on the replacement guide information J4 output from the management unit PM1, a worker or a work robot can confirm whether the solder paste read by the reading unit REA is suitable for use in the printing unit PU, and can replace the solder paste read if it is unusable.

[0076] If the solder type set in the solder information JP matches the solder type set in the board data BD (YES in step c3), the management unit PM1 determines whether the solder paste to be read is within its solder expiration date based on the solder expiration date indicated in the solder expiration date information JG set in the solder information JP related to the solder paste to be read by the reading unit REA (step c4). This allows the management unit PM1 to determine whether the solder paste to be read by the reading unit REA is usable by the printing unit PU.

[0077] If the solder paste to be read by the reading unit REA is not within the solder expiration date (NO in step c4), the management unit PM1 determines that the solder paste to be read by the reading unit REA cannot be used by the printing unit PU (step c51), and outputs replacement guidance information J4 to guide the user to replace the solder paste to be read (step c52).

[0078] If the solder paste to be read by the reading unit REA is within the solder use period (YES in step c4), the management unit PM1 determines that the solder paste to be read by the reading unit REA is usable by the printing unit PU (step c5).

[0079] If the solder paste read by the reading unit REA is usable by the printing unit PU, in the printing condition determination process S3 following the usability determination process S2, the management unit PM1 determines whether the printing conditions indicated in the printing condition information BD4 set in the board data BD are within an appropriate range. Specifically, the management unit PM1 determines whether the printing conditions indicated in the printing condition information BD4 set in the board data BD are within the appropriate range of printing conditions indicated in the printing condition appropriate range information JA set in the solder information JP related to the solder paste read by the reading unit REA (step c6).

[0080] If the printing conditions set in the board data BD are within the appropriate range of printing conditions set in the solder information JP (YES in step c6), the management unit PM1 determines that the printing conditions indicated by the printing condition information BD4 set in the board data BD are appropriate (step c7). In this case, it is determined that the printing conditions set in the board data BD are appropriate for the solder paste, and the worker or robot completes the setup work of preparing the solder paste to be read by the reading unit REA as the solder paste to be used in the printing unit PU.

[0081] On the other hand, if the printing conditions set in the board data BD are outside the appropriate range of printing conditions set in the solder information JP (NO in step c6), the management unit PM1 determines that the printing conditions indicated by the printing condition information BD4 set in the board data BD are inappropriate (step c8), and outputs correction guide information J2 that guides the user to correct the printing conditions, as well as appropriate range information J3 that indicates the appropriate range of the printing conditions (step c9). The correction guide information J2 and appropriate range information J3 output from the management unit PM1 are examples of appropriateness information output from the management unit PM1 and are displayed, for example, on the display unit PM3. Based on the correction guide information J2 output from the management unit PM1, the worker can confirm whether the printing conditions set in the board data BD are appropriate, and if they are inappropriate, the worker can correct the printing conditions set in the board data BD by referring to the appropriate range information J3.

[0082] As described above, the management unit PM1 can determine whether the mask 4, squeegee 6a, and solder paste to be read are usable by the printing unit PU in the usability determination process S2 based on the mask information JM, squeegee information JS, and solder information JP related to each printing member, including the mask 4, squeegee 6a, and solder paste, read by the reading unit REA, and can also determine whether the printing conditions set in the board data BD are within the appropriate range of printing conditions in the printing condition determination process S3. This allows the management unit PM1 to accurately manage the printing unit PU, including the printing conditions set in the board data BD that the printing unit PU references when printing solder paste on the board PB.

[0083] Furthermore, the appropriate range of printing conditions indicated by the printing condition information BD4 set in the board data BD may change depending on the combination of the mask 4, squeegee 6a, and solder paste used by the printing unit PU. Therefore, in the printing condition determination process S3, the management unit PM1 may determine, based on the determination management data MD shown in FIG. 8, whether the printing conditions indicated by the printing condition information BD4 set in the board data BD are within the printing condition appropriate range indicated by the printing condition appropriate range information JA, and whether they are within the change appropriate range indicated by the change appropriate range information JE. As described above, the determination management data MD sets the printing condition appropriate range indicated by the printing condition appropriate range information JA and the change appropriate range indicated by the change appropriate range information JE for each combination of the mask 4, squeegee 6a, and solder paste indicated in the combination information MD1. Based on the judgment management data MD, the management unit PM1 can determine whether the printing conditions set in the substrate data BD are within the appropriate range of printing conditions for each combination of mask 4, squeegee 6a and solder paste used in the printing unit PU, and can determine whether they are within the appropriate range of changes.

[0084] [Modified Embodiments] Although the embodiments of the present invention have been described above, the present invention is not limited to these, and the following modified embodiments are possible, for example.

[0085] In the above embodiment, the printing system PS is described as being configured such that the storage unit SM1 for storing the mask information JM, squeegee information JS, and solder information JP is provided in the server device SM. However, this configuration is not limited to this. The storage unit SM1 may be incorporated into each of the mask recording unit MREC, squeegee recording unit SREC, and solder recording unit PREC of the identification unit IDU. In this case, the installation of the server device SM is omitted. The mask recording unit MREC records the mask identification information J1M and mask information JM, the squeegee recording unit SREC records the squeegee identification information J1S and squeegee information JS, and the solder recording unit PREC records the solder identification information J1P and solder information JP.

[0086] Furthermore, in the above embodiment, the management unit PM1 is provided in the printing management device PM, but the present invention is not limited to this configuration. The management unit PM1 may be provided in the printing machine 1. In this case, the printing machine 1 performs the operation of printing solder paste on the board PB in the printing unit PU, and also performs an acquisition process S1 that acquires mask information JM, squeegee information JS, and solder information JP from the storage unit SM1, a usability determination process S2 that determines whether the mask 4, squeegee 6a, and solder paste to be read by the reading unit REA are usable for the printing unit PU, and a printing condition determination process S3 that determines whether the printing conditions set in the board data BD are within an appropriate range of printing conditions.

[0087] [Inventions Included in the Above-Described Embodiments] The above-described embodiments include inventions having the following configurations.

[0088] According to one aspect of the present invention, there is provided a printing system for printing solder paste on a substrate, the printing system including: a printing unit that includes a mask disposed above the substrate and a squeegee that slides on the mask to which the solder paste is supplied, and that prints the solder paste on the substrate in accordance with substrate data that sets printing conditions related to the contact angle, pressing force, and movement speed of the squeegee with respect to the mask; a storage unit that stores information that sets appropriate printing condition ranges indicating appropriate ranges of the printing conditions, the information including mask information for each of the masks, squeegee information for each of the squeegees, and solder information for each of the solder pastes; an identification unit that is attached to each of the masks, the squeegee, and a solder container that contains the solder paste, the identification unit including a recording unit that records identification information for identifying each of the components, and a reading unit that reads the identification information from the recording unit; and a management unit that manages the printing unit. The management unit performs an acquisition process to acquire from the memory unit the mask information, the squeegee information, and the solder information relating to each of the mask, the squeegee, and the solder paste to be read, whose identification information has been read by the reading unit, and a printing condition determination process to determine whether the printing conditions set in the board data are within the appropriate range of printing conditions set for the mask information, the squeegee information, and the solder information acquired in the acquisition process.

[0089] According to this printing system, the reading unit reads identification information for the mask, squeegee, and solder paste used by the printing unit, which prints solder paste on the board according to the board data. When the reading unit reads the identification information, the management unit acquires, from the storage unit, mask information related to the mask to be read by the reading unit, squeegee information related to the squeegee to be read, and solder information related to the solder paste to be read. The management unit then determines whether the printing conditions set in the board data are within the appropriate printing condition ranges set in the mask information, squeegee information, and solder information. In this case, the management unit can confirm whether each printing component is appropriate for use in the printing unit based on the mask information, squeegee information, and solder information related to each printing component, including the mask, squeegee, and solder paste, read by the reading unit, and can determine whether the printing conditions set in the board data are within the appropriate printing condition ranges. This allows the management unit to accurately manage the printing unit, including the printing conditions set in the board data that the printing unit references when printing solder paste on the board.

[0090] In the printing system, the management unit may output suitability information regarding the determination result of the printing condition determination process. In this case, based on the suitability information output from the management unit, it is possible to confirm whether the mask, squeegee, and solder paste to be read by the reading unit are suitable as printing materials to be used in the printing unit, and it is also possible to confirm whether the printing conditions set in the board data are suitable.

[0091] In the above printing system, the optimum range of printing conditions may be set according to a combination of the mask, the squeegee, and the solder paste used in the printing unit.

[0092] In this aspect, the appropriate range of printing conditions set in the board data may change depending on the combination of the mask, squeegee, and solder paste used in the printing unit. Therefore, the appropriate range of printing conditions set in the mask information, squeegee information, and solder information stored in the storage unit is set depending on the combination of the mask, squeegee, and solder paste used in the printing unit. In this case, the management unit can determine whether the printing conditions set in the board data are within the appropriate range of printing conditions for each combination of the mask, squeegee, and solder paste used in the printing unit.

[0093] In the above printing system, the management unit may be configured to perform a usability determination process to determine whether the mask, the squeegee, and the solder paste to be read by the reading unit are usable for the printing unit prior to the printing condition determination process.

[0094] In this aspect, the management unit can determine whether the mask, squeegee, and solder paste to be read by the reading unit are usable by the printing unit based on the mask information, squeegee information, and solder information related to the mask, squeegee, and solder paste to be read by the reading unit. If the mask, squeegee, and solder paste to be read by the reading unit are usable by the printing unit, the management unit can determine whether the printing conditions set in the board data are within the appropriate range of printing conditions.

[0095] In the above printing system, the board data may further include information on printing material types indicating the types of the mask, the squeegee, and the solder paste used in the printing unit, the mask information may further include information on mask type indicating the type of the mask, the squeegee information may further include information on squeegee type indicating the type of the squeegee, and the solder information may further include information on solder type indicating the type of the solder paste. In this case, in the usability determination process, the management unit determines whether the mask type in the mask information, the squeegee type in the squeegee information, and the solder type in the solder information acquired in the acquisition process match the printing material types set in the board data, thereby determining whether the mask, the squeegee, and the solder paste to be read by the reading unit are usable for the printing unit.

[0096] In this aspect, the management unit checks whether the mask type set in the mask information related to the mask to be read by the reading unit, the squeegee type set in the squeegee information related to the squeegee to be read, and the solder type set in the solder information related to the solder paste to be read match the printing material type set in the board data, thereby enabling the management unit to determine whether the mask, squeegee, and solder paste to be read by the reading unit are usable by the printing unit.

[0097] In the above printing system, the mask information and the squeegee information may further include information on the current number of prints indicating the current value of the number of prints of the mask and the squeegee and information on the limited number of prints indicating the number of prints to be limited for the use of the mask and the squeegee, and the solder information may further include information on a solder expiration date indicating an expiration date for the use of the solder paste. In this case, in the usability determination process, the management unit determines whether the mask and the squeegee to be read by the reading unit are usable for the printing unit by confirming whether the current number of prints is within the limited number of prints in the mask information and the squeegee information acquired in the acquisition process, and determines whether the solder paste to be read by the reading unit is usable for the printing unit based on the solder expiration date in the solder information acquired in the acquisition process.

[0098] In this aspect, the management unit checks whether the current number of prints is within the limit of the number of prints by referencing the mask information about the mask to be read by the reading unit and the squeegee information about the squeegee to be read. This allows the management unit to determine whether the mask and squeegee to be read by the reading unit are usable for the printing unit. Furthermore, the management unit can determine whether the solder paste to be read is usable for the printing unit based on the solder expiration date set in the solder information about the solder paste to be read by the reading unit.

[0099] In the above printing system, the squeegee information may further include information on the number of condition-change printings indicating the number of printings for which the appropriate printing condition range of the squeegee should be changed, and information on the appropriate change range changed for the appropriate printing condition range in accordance with the number of condition-change printings. In this case, in the printing condition determination process, if the current number of printings in the squeegee information acquired in the acquisition process has reached the condition-change printing number, the management unit determines whether the printing conditions set in the board data are within the appropriate change range.

[0100] In this aspect, the squeegee may wear or deform as the number of prints increases, resulting in printing defects. To prevent printing defects caused by such squeegee wear or deformation, it is necessary to change the squeegee's optimum printing condition range according to the number of prints. Therefore, the squeegee information includes information on the number of condition-change prints, which indicates the number of prints for which the squeegee's optimum printing condition range should be changed, and information on the appropriate change range, which is the change to the optimum printing condition range according to the number of condition-change prints. In this case, if the current number of prints in the squeegee information for the squeegee being read by the reading unit reaches the condition-change prints, the management unit determines whether the printing conditions set in the board data are within the appropriate change range. This allows the management unit to determine whether the printing conditions set in the board data are appropriate, thereby preventing printing defects caused by squeegee wear or deformation.

[0101] In the printing system described above, the solder paste may be classified into lead-free solder and eutectic solder. The board data may further include information on solder classification indicating the classification of the solder paste used in the printing unit, and the mask information and squeegee information may further include information on solder usage history indicating the history of the classification of the solder paste used on the mask and the squeegee. In this case, in the usability determination process, the management unit compares the solder usage history set in the mask information and the squeegee information acquired in the acquisition process with the solder classification set in the board data to determine whether the mask and the squeegee to be read by the reading unit are usable for the printing unit.

[0102] In this embodiment, solder paste is classified into lead-free solder, which does not contain lead, and eutectic solder, which does contain lead. In this case, the masks and squeegees used in the printing unit must be classified into components that allow the use of lead-free solder and components that allow the use of eutectic solder. Therefore, solder classification information indicating the type of solder paste used in the printing unit is set in the board data, and solder usage history information indicating the history of the type of solder paste used on the mask and squeegee is set in the mask information and squeegee information. In this case, the management unit can determine whether the mask and squeegee read by the reading unit are usable for the printing unit by comparing the solder usage history set in the mask information and squeegee information with the solder classification set in the board data.

[0103] A management method according to another aspect of the present invention is a management method for managing a printing unit that includes a mask placed above a substrate and a squeegee that slides on the mask to which solder paste has been supplied, and that prints the solder paste on the substrate in accordance with substrate data that sets printing conditions related to the contact angle, pressing force, and movement speed of the squeegee with respect to the mask. In this management method, when identification information recorded in recording units attached to each of the mask, the squeegee, and a solder container that contains the solder paste is read by a reading unit, information that sets an appropriate printing condition range indicating an appropriate range of the printing conditions, mask information related to the mask to be read by the reading unit, squeegee information related to the squeegee, and solder information related to the solder paste, is obtained, and it is determined whether the printing conditions set in the substrate data are within the appropriate printing condition range set in the mask information, the squeegee information, and the solder information.

[0104] According to another aspect of the present invention, there is provided a program for causing a processor to execute processes for managing a printing unit that includes a mask placed above a substrate and a squeegee that slides on the mask to which solder paste has been supplied, and that prints the solder paste on the substrate in accordance with substrate data that sets printing conditions related to the contact angle, pressing force, and movement speed of the squeegee with respect to the mask. When identification information recorded in recording units attached to the mask, the squeegee, and the solder container that contains the solder paste is read by a reading unit, the program causes the processor to execute processes for acquiring mask information related to the mask, squeegee information related to the squeegee, and solder information related to the solder paste that are read by the reading unit, the mask information being information that sets an appropriate printing condition range indicating an appropriate range of the printing conditions, and determining whether the printing conditions set in the substrate data are within the appropriate printing condition range set in the mask information, the squeegee information, and the solder information.

[0105] As described above, according to the present invention, it is possible to provide a printing system capable of accurately managing printing units, including printing conditions, a management method for managing printing units, and a program that causes a processor to execute processing for managing printing units.

Claims

1. A printing system for printing solder paste on a substrate, comprising: a printing unit including a mask arranged above the substrate and a squeegee that slides on the mask to which the solder paste has been supplied, and printing the solder paste on the substrate in accordance with substrate data in which printing conditions related to the contact angle of the squeegee with respect to the mask, the pressing force, and the movement speed have been set; a storage unit that stores information in which an optimum printing condition range indicating an optimum range of the printing conditions has been set, the information including mask information for each of the masks, squeegee information for each of the squeegees, and solder information for each of the solder pastes; an identification unit that is attached to each of the masks, the squeegee, and a solder container that contains the solder paste, and includes a recording unit that records identification information for identifying each of the components, and a reading unit that reads the identification information from the recording unit; and a management unit that manages the printing unit, wherein the management unit A printing system that performs an acquisition process that acquires from the storage unit the mask information, the squeegee information, and the solder information related to each of the mask, the squeegee, and the solder paste to be read, whose identification information has been read by the reading unit; and a printing condition determination process that determines whether the printing conditions set in the board data are within the appropriate ranges of printing conditions set in the mask information, the squeegee information, and the solder information acquired in the acquisition process.

2. The printing system according to claim 1, wherein the management unit outputs suitability information regarding the determination result of the printing condition determination process.

3. A printing system according to claim 1, wherein the suitable range of printing conditions is set according to the combination of the mask, the squeegee, and the solder paste used in the printing unit.

4. A printing system according to any one of claims 1 to 3, wherein the management unit performs a usability determination process to determine whether the mask, squeegee, and solder paste to be read by the reading unit are usable for the printing unit prior to the printing condition determination process.

5. The printing system described in claim 4, wherein the substrate data further includes information on printing material types indicating the types of the mask, squeegee, and solder paste used in the printing unit, the mask information further includes information on mask type indicating the type of the mask, the squeegee information further includes information on squeegee type indicating the type of the squeegee, and the solder information further includes information on solder type indicating the type of the solder paste, and wherein in the usability determination process, the management unit determines whether the mask type of the mask information, the squeegee type of the squeegee information, and the solder type of the solder information acquired in the acquisition process match the printing material types set in the substrate data, thereby determining whether the mask, squeegee, and solder paste to be read by the reading unit are usable for the printing unit.

6. The printing system described in claim 4, wherein the mask information and the squeegee information further include information on the current number of prints indicating the current value of the number of prints for the mask and the squeegee, and information on the limited number of prints indicating the number of prints until which use of the mask and the squeegee should be limited; the solder information further includes information on a solder expiration date indicating the expiration date for use of the solder paste; and the management unit, in the usability determination process, determines whether the mask and the squeegee to be read by the reading unit are usable for the printing unit by confirming whether the current number of prints is within the limited number of prints in the mask information and the squeegee information acquired in the acquisition process, and determines whether the solder paste to be read by the reading unit is usable for the printing unit based on the solder expiration date in the solder information acquired in the acquisition process.

7. The printing system described in claim 6, wherein the squeegee information further includes information on the number of condition-change printings indicating the number of printings for which the optimum printing condition range of the squeegee should be changed, and information on the appropriate change range changed for the optimum printing condition range in accordance with the number of condition-change printings, and wherein the management unit, in the printing condition determination process, determines whether the printing conditions set in the substrate data are within the appropriate change range if the current number of printings in the squeegee information acquired in the acquisition process has reached the condition-change printing number.

8. The printing system described in claim 4, wherein the solder paste is classified into lead-free solder and eutectic solder, the substrate data further includes solder classification information indicating the classification of the solder paste used in the printing unit, the mask information and the squeegee information further include solder usage history information indicating the history of the classification of the solder paste used for the mask and the squeegee, and the management unit, in the usability determination process, compares the solder usage history set in the mask information and the squeegee information acquired in the acquisition process with the solder classification set in the substrate data to determine whether the mask and the squeegee to be read by the reading unit are usable for the printing unit.

9. A management method for managing a printing unit that includes a mask placed above a substrate and a squeegee that slides on the mask to which solder paste is supplied, and that prints the solder paste on the substrate in accordance with substrate data in which printing conditions related to the contact angle, pressing force, and movement speed of the squeegee with respect to the mask are set, wherein, when identification information recorded in recording units attached to each of the mask, the squeegee, and a solder container that contains the solder paste is read by a reading unit, the management method obtains mask information related to the mask to be read by the reading unit, squeegee information related to the squeegee, and solder information related to the solder paste, which information sets a printing condition optimum range that indicates an optimum range of the printing conditions, and determines whether the printing conditions set in the substrate data are within the printing condition optimum range set in the mask information, the squeegee information, and the solder information.

10. A program that causes a processor to execute a process for managing a printing unit that includes a mask placed above a substrate and a squeegee that slides on the mask to which solder paste is supplied, and that prints the solder paste on the substrate in accordance with substrate data in which printing conditions related to the contact angle, pressing force, and movement speed of the squeegee with respect to the mask are set, and that, when identification information recorded in recording units attached to each of the mask, the squeegee, and a solder container containing the solder paste is read by a reading unit, acquires mask information related to the mask to be read by the reading unit, squeegee information related to the squeegee, and solder information related to the solder paste, which information sets the appropriate range of printing conditions that indicates the appropriate range of the printing conditions, and determines whether the printing conditions set in the substrate data are within the appropriate range of printing conditions set in the mask information, squeegee information, and solder information.

Images