Substrate assembly and electronic device comprising same

Abstract

The present disclosure relates to an electronic device. The electronic device, according to one embodiment of the present disclosure, comprises: a housing; and a substrate assembly disposed inside the housing. The substrate assembly may comprise: a printed circuit board comprising a first surface, and a second surface facing the opposite direction to the first surface; an electronic component disposed on the first surface; a shield member disposed on the first surface so as to surround the electronic component, and comprising a shield can comprising an opening that overlaps the electronic component when viewed from above the first surface, and a shield sheet covering the opening; a heat dissipation material disposed between the electronic component and the shield sheet; and walls positioned inside the shield member and extending along the edges of the electronic component so as to at least partially surround the heat dissipation material.

Description

Substrate assembly and electronic device including the same

[0001] The present disclosure relates to electronic devices, for example, to a substrate assembly including a heat dissipating material, and an electronic device including the same.

[0002] Electronic devices can refer to devices that perform specific functions based on their embedded programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video.

[0003] As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile terminal, can now incorporate a variety of functions. For example, in addition to communication functions, entertainment functions like gaming, multimedia functions like music and video playback, communication and security functions like mobile banking, and even calendar management and electronic wallet functions are being integrated into a single electronic device. These electronic devices are also becoming smaller and more portable for users.

[0004] An electronic device according to one embodiment of the present disclosure may include a housing, and a substrate assembly disposed inside the housing, the substrate assembly including a printed circuit board having a first side and a second side facing in an opposite direction to the first side, an electronic component disposed on the first side, a shielding member disposed on the first side and surrounding the electronic component, the shielding member including a shield can having an opening overlapping the electronic component when viewed from above the first side, and a shielding sheet covering the opening, a heat dissipation material disposed between the electronic component and the shielding sheet, and a wall positioned inside the shielding member and extending along an edge of the electronic component so as to at least partially surround the heat dissipation material.

[0005] A substrate assembly according to one embodiment of the present disclosure may include a printed circuit board including a first surface and a second surface facing in an opposite direction to the first surface, an electronic component disposed on the first surface, a shielding member disposed on the first surface and surrounding the electronic component, the shielding member including a shield can including an opening overlapping the electronic component when viewed from above the first surface, and a shielding sheet covering the opening, a heat dissipation material disposed between the electronic component and the shielding sheet, and a wall positioned inside the shielding member and extending along an edge of the electronic component so as to at least partially surround the heat dissipation material.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0007] FIG. 2 is a perspective view of an electronic device showing a front side of the electronic device according to one embodiment of the present disclosure.

[0008] FIG. 3 is an exploded perspective view of an electronic device showing a front side of the electronic device according to one embodiment of the present disclosure.

[0009] FIG. 4 is a perspective view of a substrate assembly according to one embodiment of the present disclosure.

[0010] FIG. 5 is a perspective view of a substrate assembly showing a heat dissipation material applied before a shielding sheet is placed, according to one embodiment of the present disclosure.

[0011] Fig. 6 is a cross-sectional view of the substrate assembly taken along line A-A' shown in Fig. 4.

[0012] Fig. 7 is an enlarged view of a portion of the cross-sectional view of the substrate assembly illustrated in Fig. 6.

[0013] FIG. 8 is a top view of a substrate assembly before a heat dissipation material is disposed, according to one embodiment of the present disclosure.

[0014] Fig. 9 is a cross-sectional view of the substrate assembly taken along the line C-C' shown in Fig. 8.

[0015] Fig. 10 is a cross-sectional view of the substrate assembly taken along the line D-D' shown in Fig. 8.

[0016] FIG. 11 is a top view of a substrate assembly before a heat dissipation material is disposed, according to one embodiment of the present disclosure.

[0017] Fig. 12 is a cross-sectional view of the substrate assembly taken along the line C-C' shown in Fig. 11.

[0018] Figure 13 is a cross-sectional view of the substrate assembly taken along the line D-D' shown in Figure 11.

[0019] FIG. 14 is a cross-sectional view of a substrate assembly according to another embodiment of the present disclosure taken along line C-C' shown in FIG. 8.

[0020] FIG. 15 is a top view of a substrate assembly before a heat dissipation material is disposed, according to one embodiment of the present disclosure.

[0021] Figure 16 is a cross-sectional view of the substrate assembly taken along the line E-E' shown in Figure 15, illustrating the manufacturing process of the substrate assembly.

[0022] FIG. 17 is a top view of a substrate assembly before a heat dissipation material is disposed, according to one embodiment of the present disclosure.

[0023] Figure 18 is a cross-sectional view of the substrate assembly taken along the line F-F' shown in Figure 17, illustrating the manufacturing process of the substrate assembly.

[0024] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0025] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0026] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0027] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0028] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0029] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0030] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0031] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0032] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0033] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0034] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0035] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0036] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0037] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0038] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0039] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0041] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0043] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0045] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0046] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0047] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0048] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0049] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0050] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0051] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0052] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0053] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0054] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0055] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0056] The description of the electronic device (101) described with reference to FIG. 1 can be substantially equally applied to the electronic devices (101) described with reference to FIG. 2 and FIG. 3 to the extent that they are not mutually disposed.

[0057] FIG. 2 is a perspective view of an electronic device (101) showing a front side (210A) of the electronic device (101) according to one embodiment of the present disclosure.

[0058] Referring to FIG. 2, an electronic device (101) according to one embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1) may include a housing (210) including a first side (or front side) (210A), a second side (or back side) (not shown), and a side surface (210C) surrounding a space between the first side (210A) and the second side. According to one embodiment, the first side (210A) may be formed by a front plate (202) at least partially substantially transparent (e.g., a glass plate including various coating layers, or a polymer plate). The second side may be formed by a substantially opaque back plate (e.g., a back cover (380) of FIG. 3).

[0059] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate from at least a portion of an edge. In one embodiment, the front plate (202) (or the rear plate) may include only one of the curved extending regions toward the rear plate (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate may be substantially flat. For example, the curved extending region may not be included. When the curved extending region is included, the thickness of the electronic device (101) in the portion that includes the curved extending region may be less than that of the other portions.

[0060] According to one embodiment of the present disclosure, the electronic device (101) may include at least one of a display (220) (e.g., the display module (160) of FIG. 1), an audio module (203, 207, 214) (e.g., the audio module (170) of FIG. 1), a sensor module (204) (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., the camera module (180) of FIG. 1), a key input device (217) (e.g., the input module (150) of FIG. 1), a light-emitting element (206), and connector holes (208, 209) (e.g., the connection terminal (178) of FIG. 1). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light-emitting element (206)) or may additionally include other components.

[0061] According to one embodiment of the present disclosure, the display (220) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), in order to expand the area over which the display (220) is visually exposed, the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same.

[0062] In one embodiment (not shown) of the present disclosure, a recess or opening may be formed in a part of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0063] According to one embodiment of the present disclosure, the audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0064] According to one embodiment of the present disclosure, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (e.g., a fingerprint sensor) disposed on the second surface of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) (e.g., the display (220)) of the housing (210) as well as the second surface or side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0065] According to one embodiment of the present disclosure, the camera module (205, 212, 213) may include a camera module (205) disposed on a first surface (210A) of the electronic device (101), and a second camera module (e.g., camera module (307) of FIG. 3) disposed on the second surface.

[0066] According to one embodiment of the present disclosure, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as soft keys, on the display (220).

[0067] According to one embodiment of the present disclosure, the light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0068] According to one embodiment of the present disclosure, the connector hole (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0069] FIG. 3 is an exploded perspective view showing the front of an electronic device (101) according to one embodiment of the present disclosure. The description of the housing (210) described with reference to FIG. 2 can be substantially equally applied to the housing (301) described with reference to FIG. 3 to the extent that they are not mutually disposed.

[0070] Referring to FIG. 3, an electronic device (101) (e.g., the electronic device (101) of FIG. 1) according to one embodiment of the present disclosure may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320), a display (330), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) may include at least one flexible printed circuit board (340c) to electrically connect different printed circuit boards. For example, the printed circuit board (340a, 340b) may include a first circuit board (340a) positioned above the battery (350) and a second circuit board (340b) positioned below the battery (350), and a flexible printed circuit board (340c) may electrically connect the first circuit board (340a) and the second circuit board (340b).

[0071] According to one embodiment of the present disclosure, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include another component. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1, and any redundant description will be omitted below.

[0072] According to one embodiment of the present disclosure, the first support member (311) may be provided in at least a portion in a flat shape. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is at least partially formed of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340a, 340b) coupled to the other surface. The printed circuit board (340a, 340b) may be equipped with an interposer, a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0073] According to one embodiment of the present disclosure, the front plate (320) may be coupled to the support member (311) via an adhesive member. The front plate (320) may be referred to as a "cover" or a "front cover." The rear plate (380) may be referred to as a "cover" or a "rear cover." The edge of the cover (380) may be supported by the support member (311).

[0074] According to one embodiment of the present disclosure, the first support member (311) and the side structure (310) may be combined to form a front case or housing (301). The housing (301) may also be referred to as a frame (301). According to one embodiment, the housing (301) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (340a, 340b) or a battery (350).

[0075] In one embodiment of the present disclosure, the housing (301) may be understood to include structures that can be visually or tactilely perceived by a user on the exterior of the electronic device (101), for example, a side structure (310), a front plate (320), and / or a rear plate (380). The housing (301) may include the side structure (310), a first support member (311), a front plate (320), and a rear plate (380). In one embodiment of the present disclosure, the 'front or rear of the housing (301)' may refer to the front plate (320) or the rear cover (380). In one embodiment, the first support member (311) is disposed between the front plate (320) and the rear plate (380), and may function as a structure for arranging electrical / electronic components, such as printed circuit boards (340a, 340b) or a camera assembly (307).

[0076] In one embodiment of the present disclosure, the memory (e.g., memory (130) of FIG. 1) may include, for example, volatile memory or non-volatile memory.

[0077] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0078] According to one embodiment of the present disclosure, the second support member (360) may include, for example, an upper support member (360a) and a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) therebetween.

[0079] In one embodiment of the present disclosure, the lower support member (360b) of the second support member (360) may be disposed to face the first support member (311) with the second circuit board (340b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be disposed on the printed circuit boards (340a, 340b), and according to an embodiment, the printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be disposed.

[0080] In one embodiment of the present disclosure, electrical / electronic components such as a speaker module, interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board (not shown). For example, the lower support member (360b) may be arranged to surround the additional printed circuit board together with another portion of the first support member (311).

[0081] The battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit boards (340a, 340b). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0082] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or combination of the first support member (311).

[0083] According to one embodiment of the present disclosure, the electronic device (101) may include a metal cover (M). As an example, the housing (301) may include a metal cover (M) covering a shielding sheet (440). According to one embodiment of the present disclosure, the electronic device (101) may include a vapor chamber (V). The vapor chamber (V) may be disposed on the metal cover (M). Heat generated in the substrate assembly (400) may diffuse to the outside of the substrate assembly (400) through the metal cover (M) and the vapor chamber (V).

[0084] Referring to FIG. 3, an electronic device (101) according to one embodiment of the present disclosure may include a board assembly (400). The board assembly (400) may include a printed circuit board and a plurality of electronic components (e.g., a processor, a memory, an interposer, etc.) mounted on the printed circuit board. The description of the board assembly (340a) described with reference to FIG. 3 may be equally applied to the board assembly (400). The board assembly (400) may include a printed circuit board (410), a shield can (420), and / or a shielding sheet (440). The board assembly (400) will be described in detail below with reference to FIGS. 4 to 18.

[0085] FIG. 4 is a perspective view of a substrate assembly (400) according to one embodiment of the present disclosure. FIG. 5 is a perspective view of a substrate assembly (400) showing a heat dissipation material (430) applied before a shielding sheet (440) is placed according to one embodiment of the present disclosure.

[0086] Referring to FIGS. 4 and 5, a substrate assembly (400) according to one embodiment of the present disclosure may include a printed circuit board (410) including a first side (411) and a second side (412) facing in an opposite direction to the first side (411). As an example, the first side (411) and the second side (412) of the printed circuit board (410) may be understood as sides that are visually exposed to the outside.

[0087] According to one embodiment of the present disclosure, the substrate assembly (400) may include an electronic component (E) disposed on a printed circuit board (410). The electronic component (E) may be disposed on a first surface (411) of the printed circuit board (410). As an example, the electronic component (E) may be mounted on the first surface (411) of the printed circuit board (410) through soldering. The electronic component (E) may be understood as a single integrated circuit or a collection of multiple (e.g., two) integrated circuits connected to each other. Heat may be generated during the operation of the electronic component (E), and the generated heat may be transferred to the outside of the substrate assembly (400) through a heat dissipation structure (e.g., a heat dissipation material (430)).

[0088] According to one embodiment of the present disclosure, the substrate assembly (400) may include a shielding member (S) surrounding the electronic component (E). The shielding member (S) may be disposed on the first surface (411). The shielding member (S) may block a magnetic field generated from the electronic component (E) from leaking to the outside of the substrate assembly (400) or may block a magnetic field outside the substrate assembly (400) from flowing into the electronic component (E).

[0089] According to one embodiment of the present disclosure, the shielding member (S) may include a shield can (420) including an opening (426). When viewed from above the first side (411) of the printed circuit board (410), the opening (426) may overlap with the electronic component (E). As an example, the opening (426) may have a shape corresponding to the outline (e.g., a rectangle) of the electronic component (E) at a position overlapping the electronic component (E).

[0090] According to one embodiment of the present disclosure, the shield can (420) may include a cover portion (425) facing the first surface (411) of the printed circuit board (410). As an example, the cover portion (425) may be understood as a part of the shield can (420) that includes a top surface of the shield can (420). The cover portion (425) may cover the electronic component (E). The cover portion (425) may define the opening (426).

[0091] According to one embodiment of the present disclosure, the shielding member (S) may include a shielding sheet (440) covering the opening (426). An edge of the shielding sheet (440) may be supported by the shield can (420) (e.g., the cover portion (425)). As an example, the shielding sheet (440) may be bonded to the cover portion (425) of the shield can (420) via a conductive adhesive member.

[0092] According to one embodiment of the present disclosure, a shielding sheet (440) can cover an electronic component (E). The shielding sheet (440) can surround the electronic component (E) together with a shield can (420). The shielding sheet (440) can perform an electromagnetic field shielding function and provide a heat transfer path (H1, H2) that transfers heat generated from the electronic component (E) to a metal cover (M, see FIG. 7). As an example, the shielding sheet (440) can be a copper thin film.

[0093] According to one embodiment of the present disclosure, the substrate assembly (400) may include a heat dissipation material (430) disposed between the electronic component (E) and the shielding sheet (440). The heat dissipation material (430) may be at least partially in a liquid phase or a gel phase. As an example, the heat dissipation material (430) may be in a liquid phase or a gel phase at room temperature (e.g., 25 degrees Celsius). According to one embodiment of the present disclosure, the gel phase of the heat dissipation material (430) may be understood as a highly fluid state that does not maintain its shape, and as an example, may be understood as a fluid state that can be injected through an injector such as a nozzle.

[0094] According to one embodiment of the present disclosure, a heat dissipation material (430) can be disposed on an electronic component (E). The heat dissipation material (430) can be disposed on the electronic component (E) through an opening (426). As an example, the substrate assembly (400) can be manufactured by pressing a shielding sheet (440) while the heat dissipation material (430) is applied on the electronic component (E), and the fluid heat dissipation material (430) can be spread into the internal space of the shielding member (S) by the shielding sheet (440).

[0095] According to one embodiment of the present disclosure, the substrate assembly (400) may include a wall structure including walls (421, 422, 423, 424) positioned within the shielding member (S). The walls (421, 422, 423, 424) may extend along an edge of the electronic component (E) to at least partially surround the heat dissipation material (430). The plurality of members (421, 422, 423, 424) may include a first wall (421), a second wall (422), a third wall (423), and / or a fourth wall (424). The walls (421, 422, 423, 424) may be connected to a cover portion (425) of the shielding can (420). According to one embodiment of the present disclosure, the moons (421, 422, 423, 424) may be formed integrally with the cover portion (425) of the shield can (420), but are not limited thereto. The moons (421, 422, 423, 424) will be described in detail later with reference to FIGS. 6 to 18.

[0096] Fig. 6 is a cross-sectional view of the substrate assembly (400) taken along the line A-A' shown in Fig. 4. Fig. 7 is an enlarged view of a portion of the cross-sectional view of the substrate assembly (400) shown in Fig. 6.

[0097] Referring to FIGS. 6 and 7, according to one embodiment of the present disclosure, an electronic component (E) may include a first integrated circuit (E1) disposed on a first surface (411) of a printed circuit board (410). The electronic component (E) may include a second integrated circuit (E2) disposed on the first integrated circuit (E1). The second integrated circuit (E2) may be stacked on the first integrated circuit (E1). As an example, the printed circuit board (410), the first integrated circuit (E1), and the second integrated circuit (E2) may be sequentially stacked.

[0098] According to one embodiment of the present disclosure, the second integrated circuit (E2) may be electrically connected to the first integrated circuit (E1). The second integrated circuit (E2) may be operatively connected to the first integrated circuit (E1). As an example, the first integrated circuit (E1) may be a processor (e.g., the processor (120) of FIG. 1) including at least one processing core, and the second integrated circuit (E2) may be a memory (e.g., the memory (130) or the volatile memory (132) of FIG. 1) mounted on the first integrated circuit (E1) via a solder ball and storing instructions to be executed by the at least one processing core.

[0099] According to one embodiment of the present disclosure, the second integrated circuit (E2) may be disposed in a region (E13, hereinafter referred to as the first region) of the upper surface (E11, E12, E13) of the first integrated circuit (E1). As an example, the first region (E13) of the upper surface (E11, E12, E13) of the first integrated circuit (E1) may include a center area of ​​the upper surface (E11, E12, E13). The upper surface (E11, E12, E13) of the first integrated circuit (E1) may include a second region (E11, E12) in which a portion (431, 432) of the heat dissipation material (430) is disposed.

[0100] According to one embodiment of the present disclosure, the heat dissipation material (430) may include a first portion (431, 432) positioned between the first integrated circuit (E1) and the shielding sheet (440). The heat dissipation material (430) may include a second portion (433) positioned between the second integrated circuit (E2) (more specifically, the upper surface (E25) of the second integrated circuit (E2)) and the shielding sheet (440). Heat generated in the electronic component (E) may spread to the outside of the electronic component (E) through heat transfer paths (H1, H2). The first portion (431, 432) of the heat dissipation material (430) may provide the first heat transfer path (H2). The second portion (433) of the heat dissipation material (430) may provide the second heat transfer path (H1). For example, heat generated in the first integrated circuit (E1) can be dissipated to the outside through the first heat transfer path (H2) and the second heat transfer path (H1). For example, heat generated in the second integrated circuit (E2) can be dissipated through the second heat transfer path (H1).

[0101] According to one embodiment of the present disclosure, the months (421, 422, 423, 424) may include a first month (421) and a second month (422). The description of the second month (422) of the months (421, 422, 423, 424) described with reference to FIG. 7 may be substantially equally applied to the first month (421) to the extent that they are not mutually arranged. As an example, the first month (421) and the second month (422) may be understood to have structures that are symmetrical to each other with respect to the second integrated circuit (E2).

[0102] Referring to FIG. 7, according to one embodiment of the present disclosure, the second wall (422) of the walls (421, 422, 423, 424) may include a first portion (422a) connected to a cover portion (425). The first portion (422a) may be connected to an edge of the cover portion (425) of the shield can (420). As an example, the first portion (422a) may be welded to the edge of the cover portion (425) to be formed integrally with the cover portion (425). The first portion (422a) may protrude from the edge of the cover portion (425) of the shield can (420) into an opening (426).

[0103] According to one embodiment of the present disclosure, the substrate assembly (400) may include a dam member (451, 452). The dam member (451, 452) may be disposed between the walls (421, 422, 423, 424) and the shielding sheet (440). As an example, FIG. 6 illustrates a first dam member (451) and a second dam member (452), and FIG. 7 illustrates a second dam member (452) disposed between the second wall (422) of the walls (421, 422, 423, 424) and the shielding sheet (440).

[0104] According to one embodiment of the present disclosure, the dam member (451, 452) can prevent the heat dissipation material (430) from leaking between the shielding sheet (440) and the cover portion (425) of the shield can (420). As an example, the dam member (451, 452) can be rubber or sponge. As another example, the dam member (451, 452) can be a heat dissipation member including a paraffin-based phase change material that is in a solid phase at room temperature (e.g., 25 degrees Celsius) and changes from a solid phase to a liquid phase or a gel phase at a limit temperature (e.g., 45 to 65 degrees Celsius) and heat dissipation particles. The phase change material can be a thermoresponsive material depending on temperature, and as an example, can be a thermoplastic polymer. The above heat dissipating particles may be carbon fiber, graphene, boron nitride (BN), silicon carbide (SiC), magnesium oxide (MgO), or manganese oxide (ZnO).

[0105] According to one embodiment of the present disclosure, the second month (422) of the months (421, 422, 423, 424) may include a second portion (422b) bent from the first portion (422a) toward the first side (411) of the printed circuit board (410). As an example, the second portion (422b) may be bent perpendicular to the first side (422a). An end (422c) of the second portion (422b) of the second month (422) of the months (421, 422, 423, 424) may be spaced apart from the first side (411) of the printed circuit board (410).

[0106] According to one embodiment of the present disclosure, the second portion (422b) of the second wall (422) may extend along the second side (E22) of the second integrated circuit (E2). It may be spaced apart from the second side (E22) of the second integrated circuit (E2). As an example, the second portion (422b) may be positioned outside the edge of the second integrated circuit (E2).

[0107] According to one embodiment of the present disclosure, the second portion (422b) of the second wall (422) may face the second side (E22) of the second integrated circuit (E2). The second portion (421b, see FIG. 9) of the first wall (421) may face the first side (E21) of the second integrated circuit (E2). The second portion (422a) of the first wall (421) may extend along the first side (E21) of the second integrated circuit (E2).

[0108] According to one embodiment of the present disclosure, since the heat dissipation material (430) remains in the space defined by the walls (421, 422, 423, 424) (e.g., the second wall (422)), the application area and application amount of the heat dissipation material (430) can be increased, and thus, the heat dissipation performance of the electronic component (E) can be improved. When the walls (421, 422, 423, 424) are absent, the heat dissipation material (430) is partially applied to the central region of the electronic component (E) (e.g., the upper surface (E25) of the second integrated circuit (E2)) in order to prevent the heat dissipation material (430) from being separated from the surfaces of the first integrated circuit (E1) and the second integrated circuit (E2), and thus, the heat dissipation performance can be reduced compared to one embodiment of the present disclosure. Unlike the embodiment of the present disclosure, when a non-fluidic (e.g., solid) heat dissipation member (e.g., heat dissipation material (430)) for heat dissipation of an electronic component (E) is used, when the assembly of the substrate assembly (400) and / or the electronic device (101) is completed, deformation may occur in a surrounding structure (e.g., the metal cover (M) of FIG. 3, or the display (330)) due to the heat dissipation member.

[0109] According to one embodiment of the present disclosure, the substrate assembly (400) can secure a contact area with the electronic component (E) by substantially fixing the position of the liquid or gel-like heat-dissipating material (430) through the walls (421, 422, 423, 424). In addition, by calculating the area of ​​the space limited by the walls (421, 422, 423, 424), the application amount of the heat-dissipating material (430) can be precisely determined, thereby enabling optimization of material cost relative to heat-dissipating performance.

[0110] FIG. 8 is a top view of a portion of a substrate assembly (400) before a heat dissipation material (430) is disposed, according to one embodiment of the present disclosure. FIG. 9 is a cross-sectional view of the substrate assembly (400) taken along line C-C' shown in FIG. 8. FIG. 10 is a cross-sectional view of the substrate assembly (400) taken along line D-D' shown in FIG. 8.

[0111] Referring to FIG. 8, a second integrated circuit (E2) according to an embodiment of the present disclosure may include a plurality of sides (E21, E22, E23, E24). Two adjacent sides among the plurality of sides (E21, E22, E23, E24) may intersect each other, and as an example, may be orthogonal to each other. For convenience of explanation, the plurality of sides (E21, E22, E23, E24) may be named a first side (E21), a second side (E22), a third side (E23), and a fourth side (E24).

[0112] According to one embodiment of the present disclosure, the first month (421) of the months (421, 422, 423, 424) may extend along the first side (E21) of the second integrated circuit (E2). The first month (421) may be spaced apart from the first side (E21) of the second integrated circuit (E2). The first month (421) may face the first side (E21) of the second integrated circuit (E2).

[0113] According to one embodiment of the present disclosure, the second month (422) of the months (421, 422, 423, 424) may extend along the second side (E22) of the second integrated circuit (E2). The second month (422) may be spaced apart from the second side (E22) of the second integrated circuit (E2). The second month (422) may face the second side (E22) of the second integrated circuit (E2).

[0114] According to one embodiment of the present disclosure, the third wall (423) of the walls (421, 422, 423, 424) may extend along the third side (E23) of the second integrated circuit (E2). The third wall (423) may be spaced apart from the third side (E23) of the second integrated circuit (E2). The third wall (423) may face the third side (E23) of the second integrated circuit (E2).

[0115] According to one embodiment of the present disclosure, the fourth month (424) of the months (421, 422, 423, 424) may extend along the fourth side (E24) of the second integrated circuit (E2). The fourth month (424) may be spaced apart from the fourth side (E24) of the second integrated circuit (E2). The fourth month (424) may face the fourth side (E24) of the second integrated circuit (E2).

[0116] Referring to FIGS. 8 and 9 , according to one embodiment of the present disclosure, the first month (421) of the months (421, 422, 423, 424) may include a second portion (421b) bent from the first portion (421a) toward the first side (411) of the printed circuit board (410). As an example, the second portion (421b) may be bent perpendicular to the first side (421a). An end (421c) of the second portion (421b) of the first month (421) of the months (421, 422, 423, 424) may be spaced apart from the first side (411) of the printed circuit board (410).

[0117] According to one embodiment of the present disclosure, the second portion (421b) of the first wall (421) may extend along the second side (E22) of the second integrated circuit (E2). The second portion (421b) may be spaced apart from the second side (E22) of the second integrated circuit (E2). As an example, the second portion (421b) may be positioned outside the edge of the first integrated circuit (E1).

[0118] According to one embodiment of the present disclosure, the second portion (421b) of the first wall (421) may face the first side (E21) of the second integrated circuit (E2). The second portion (421b, see FIG. 9) of the first wall (421) may face the first side (E21) of the second integrated circuit (E2). The second portion (421b) of the first wall (421) may extend along the first side (E21) of the second integrated circuit (E2).

[0119] According to one embodiment of the present disclosure, the end (421c) of the first month (421) of the months (421, 422, 423, 424) may be spaced apart from the edge of the electronic component (E). As an example, the end (421c) of the first month (421) may be spaced apart from the edge of the first integrated circuit (E1) toward the outside of the first integrated circuit (E1). A first gap (C1) may be formed between the end (421c) of the first month (421) and the edge of the first integrated circuit (E1).

[0120] According to one embodiment of the present disclosure, the end (422c) of the second month (422) of the months (421, 422, 423, 424) may be spaced apart from the edge of the electronic component (E). As an example, the end (422c) of the second month (422) may be spaced apart from the edge of the first integrated circuit (E1) toward the outside of the first integrated circuit (E1). A second gap (C2) may be formed between the end (422c) of the second month (422) and the edge of the first integrated circuit (E1).

[0121] Referring to FIGS. 8 and 10, according to one embodiment of the present disclosure, the walls (421, 422, 423, 424) may include a third wall (423) formed integrally with a cover portion (425) of a shield can (420). The third wall (423) may be connected to an edge of the cover portion (425) of the shield can (420). As an example, the third wall (423) may be formed by bending a portion of an edge of the shield can (420). The third wall (423) may include a first portion (423a) connected to the cover portion (425). The first portion (423a) of the third wall (423) may be connected to an edge of the cover portion (425).

[0122] According to one embodiment of the present disclosure, the third month (423) of the months (421, 422, 423, 424) may include a second portion (423b) bent from the first portion (423a) toward the first side (411) of the printed circuit board (410). As an example, the second portion (423b) may be bent perpendicular to the first portion (423a). An end (423c) of the second portion (423b) may be spaced apart from the first side (411) of the printed circuit board (410).

[0123] According to one embodiment of the present disclosure, the second portion (423b) of the third wall (423) may extend along the third side (E23) of the second integrated circuit (E2). It may be spaced apart from the third side (E23) of the second integrated circuit (E2). As an example, the second portion (423b) may be positioned outside the edge of the second integrated circuit (E2).

[0124] According to one embodiment of the present disclosure, the second portion (423b) of the third wall (423) may face the third side (E23) of the second integrated circuit (E2). The second portion (423b, see FIG. 9) of the third wall (423) may face the third side (E23) of the second integrated circuit (E2). The second portion (423b) of the third wall (423) may extend along the third side (E23) of the second integrated circuit (E2).

[0125] According to one embodiment of the present disclosure, the end (423c) of the third month (423) of the months (421, 422, 423, 424) may be spaced apart from the edge of the electronic component (E). As an example, the end (423c) of the third month (423) may be spaced apart from the edge of the first integrated circuit (E1) toward the outside of the first integrated circuit (E1). A third gap (C3) may be formed between the end (423c) of the third month (423) and the edge of the first integrated circuit (E1).

[0126] According to one embodiment of the present disclosure, the walls (421, 422, 423, 424) may include a fourth wall (424) formed integrally with a cover portion (425) of a shield can (420). The fourth wall (424) may be connected to an edge of the cover portion (425) of the shield can (420). As an example, the fourth wall (424) may be formed by bending a portion of an edge of the shield can (420). The fourth wall (424) may include a first portion (424a) connected to the cover portion (425). The first portion (424a) of the fourth wall (424) may be connected to an edge of the cover portion (425).

[0127] According to one embodiment of the present disclosure, the fourth month (424) of the months (421, 422, 423, 424) may include a second portion (424b) bent from the first portion (424a) toward the first side (411) of the printed circuit board (410). As an example, the second portion (424b) may be bent perpendicular to the first portion (424a). An end (424c) of the second portion (424b) may be spaced apart from the first side (411) of the printed circuit board (410).

[0128] According to one embodiment of the present disclosure, the second portion (424b) of the fourth month (424) may extend along the fourth side (E24) of the second integrated circuit (E2). It may be spaced apart from the fourth side (E24) of the second integrated circuit (E2). As an example, the second portion (424b) may be positioned outside the edge of the second integrated circuit (E2).

[0129] According to one embodiment of the present disclosure, the second portion (424b) of the fourth wall (424) may face the fourth side (E24) of the second integrated circuit (E2). The second portion (424b, see FIG. 9) of the fourth wall (424) may face the fourth side (E24) of the second integrated circuit (E2). The second portion (424b) of the fourth wall (424) may extend along the fourth side (E24) of the second integrated circuit (E2).

[0130] According to one embodiment of the present disclosure, the end (424c) of the fourth month (424) of the months (421, 422, 423, 424) may be spaced apart from the edge of the electronic component (E). As an example, the end (424c) of the fourth month (424) may be spaced apart from the edge of the first integrated circuit (E1) toward the outside of the first integrated circuit (E1). A fourth gap (C4) may be formed between the end (424c) of the third member (424) and the edge of the first integrated circuit (E1).

[0131] Referring to FIG. 5, according to one embodiment of the present disclosure, a substrate assembly (400) can be manufactured by applying a heat dissipation material (430) on top of an electronic component (E), and then placing a shielding sheet (440) in a shield can (420) to cover an opening (426). The heat dissipation material (430) can flow within a space surrounded by the walls (421, 422, 423, 424) by the placed shielding sheet (440). At this time, the air existing in the space surrounded by the walls (421, 422, 423, 424) can escape from the space surrounded by the walls (421, 422, 423, 424) through the first gap (C1), the second gap (C2), the third gap (C3), and / or the fourth gap (C4) during the process of arranging the shielding sheet (440). Accordingly, by minimizing the amount of air with low thermal conductivity in the space surrounded by the walls (421, 422, 423, 424), heat dissipation performance can be increased.

[0132] Referring to FIGS. 8 to 10, according to one embodiment of the present disclosure, a distance between a first wall (421) of a wall (421, 422, 423, 424) and a first side (E21) of a second integrated circuit (E2) and / or a distance between a second wall (422) of a wall (421, 422, 423, 424) and a second side (E22) of a second integrated circuit (E2) may be greater than a distance between a third wall (423) of a wall (421, 422, 423, 424) and a third side (E23) of a second integrated circuit (E2) and / or a distance between a fourth member (424) of a wall (421, 422, 423, 424) and a fourth side (E24) of a second integrated circuit (E2).

[0133] According to one embodiment of the present disclosure, two adjacent members (e.g., the first wall (421) and the third wall (423)) of the walls (421, 422, 423, 424) may have different structures. As an example, the first wall (421) may be joined to the shield can (420) by welding, and the third wall (423) (or the fourth wall (424)) may be formed by bending a portion of the shield can (420) (e.g., an edge of the cover portion (425)). As another example, the second wall (422) may be joined to the shield can (420) by welding, and the third wall (423) (or the fourth wall (424)) may be formed by bending a portion of the shield can (420) (e.g., an edge of the cover portion (425)).

[0134] FIGS. 8 to 10 illustrate a case where the first month (421) and the second month (422) of the months (421, 422, 423, 424) are positioned on both sides of the opening (426), and the third month (423) and the fourth month (424) of the months (421, 422, 423, 424) are positioned on both sides of the opening (426). However, according to another embodiment (not shown), the first month (421) or the second month (422) may be positioned at the positions of the third month (423) and the fourth month (424).

[0135] FIG. 11 is a top view of a portion of a substrate assembly (400) before a heat dissipating material (430, see FIG. 5) is disposed, according to one embodiment of the present disclosure. FIG. 12 is a cross-sectional view of the substrate assembly (400) taken along line C-C' shown in FIG. 11. FIG. 13 is a cross-sectional view of the substrate assembly (400) taken along line D-D' shown in FIG. 11. The embodiments illustrated in FIGS. 11 to 13 can be understood as embodiments in which the position of the second integrated circuit (E2) with respect to the first integrated circuit (E1) is changed, compared to the embodiments illustrated in FIGS. 8 to 10.

[0136] The description of the components described with reference to FIGS. 8 to 10 (e.g., the first region (E13), the second region (E11, E12), the second integrated circuit (E2), the first side (E21), the second side (E22), the third side (E23), the fourth side (E24) of the second integrated circuit (E2)) can be substantially identically applied to the components of the same name described with reference to FIGS. 11 to 13 (e.g., the first region (E013), the second region (E011), the second integrated circuit (E02), the first side (E021), the second side (E022), the third side (E023), the fourth side (E024)) to the extent that they are not arranged with each other.

[0137] Referring to FIGS. 11 to 13, according to one embodiment of the present disclosure, the upper surface (E011, E013) of the first integrated circuit (E1) may include a first region (E013) and a second region (E011). A second integrated circuit (E02) may be disposed on the first region (E013). A heat dissipation material (430, see FIG. 5) may be disposed on the second region (E011).

[0138] According to one embodiment of the present disclosure, the second integrated circuit (E02) may be arranged offset from the edge of the first integrated circuit (E1). The distance between the first side (E021) of the second integrated circuit (E02) and the first wall (421) may be greater than the distance between the second side (E022) of the second integrated circuit (E02) and the second wall (422). Accordingly, the second integrated circuit (E02) may be arranged offset toward the second wall (422). The embodiments illustrated in FIGS. 11 to 13 are exemplary, and according to other embodiments (not illustrated), the distance between the first side (E021) of the second integrated circuit (E02) and the first wall (421) may be less than the distance between the second side (E022) of the second integrated circuit (E02) and the second wall (422). Therefore, the second integrated circuit (E02) can be placed toward the first month (421).

[0139] Fig. 14 is a cross-sectional view of a substrate assembly according to another embodiment of the present disclosure taken along the line C-C' illustrated in Fig. 8. The description of the ends (421c, 422c) described with reference to Figs. 6 to 10 can be substantially equally applied to the ends (421c', 422c') described with reference to Fig. 14 to the extent that they are not aligned with each other.

[0140] Referring to FIGS. 8 and 14, according to another embodiment of the present disclosure, the ends (421c', 422c') of the first month (421) and / or the second month (422) of the months (421, 422, 423, 424) may be supported by the first side (411) of the printed circuit board (410). As an example, the ends (421c', 422c') of the first month (421) and / or the second month (422) may contact the first side (411) of the printed circuit board (410). As another example, the ends (421c', 422c') of the first month (421) and / or the second month (422) may be joined to the first side (411) of the printed circuit board (410) through soldering. Although not shown, the description regarding the end (421c', 422c') of the first month (421) and / or the second month (422) can be substantially equally applied to the end (423c, 424c, see FIG. 10) of the third month (423) and / or the fourth month (424).

[0141] According to another embodiment of the present disclosure, the ends (421c', 422c') of the months (421, 422, 423, 424) are supported by the printed circuit board (410), thereby improving the structural stability of the board assembly (400).

[0142] FIG. 15 is a top view of a portion of a substrate assembly (400) before a heat dissipation material (430) is disposed, according to one embodiment of the present disclosure. FIG. 16 is a cross-sectional view of the substrate assembly (400) taken along line E-E' illustrated in FIG. 15, illustrating a manufacturing process of the substrate assembly. The description of the walls (421, 422, 423, 424) described with reference to FIGS. 6 to 10 can be substantially equally applied to the walls (510, 520) described with reference to FIGS. 15 and 16, to the extent that they are not disposed with each other.

[0143] Referring to FIGS. 15 and 16 , a substrate assembly (400) according to one embodiment of the present disclosure may include a wall (510, 520) attached to a shield can (420). The wall (510, 520) may be attached to an edge of a cover portion (425) defining an opening (426). As an example, the wall (510, 520) may extend in a loop shape along the edge of the opening (426). As another example, the wall (510, 520) may include a plurality of members (510, 520) extending along the edge of the opening (426), such as the walls (421, 422, 423, 424) described with reference to FIGS. 6 to 10 .

[0144] According to one embodiment of the present disclosure, the wall (510, 520) may be supported by an edge of the first integrated circuit (E1). The wall (510, 520) may at least partially surround the heat dissipation material (430). The wall (510, 520) may contact the shielding sheet (440). The wall (510, 520) allows the heat dissipation material (430) to remain between the shielding sheet (440) and the electronic component (E), more specifically, between the shielding sheet (440) and the first integrated circuit (E1) and the second integrated circuit (E2).

[0145] According to one embodiment of the present disclosure, the wall (510, 520) may include, for example, rubber or sponge. As another example, the wall (510, 520) may be a heat dissipating member including a phase change material of a paraffin series that is in a solid phase at room temperature (e.g., 25 degrees Celsius) and changes from a solid phase to a liquid phase or a gel phase at a limit temperature (e.g., 45 to 65 degrees Celsius) and heat dissipating particles. The phase change material may be a heat-responsive material depending on temperature, and may be, for example, a thermoplastic polymer. The heat dissipating particles may be carbon fiber, graphene, boron nitride (BN), silicon carbide (SiC), magnesium oxide (MgO), or manganese oxide (ZnO).

[0146] Referring to FIG. 16, a manufacturing process of a substrate assembly (400) according to one embodiment of the present disclosure may include a process of placing an electronic component (E) on a circuit board (410), and then placing a shield can (420) on the printed circuit board (410) to surround the electronic component (E). The walls (510, 520) attached to the shield can (420) may be supported by the edges of the first integrated circuit (E1). The heat dissipation material (430) may remain on the second region (E11, E12) of the upper surface (E11, E12, E13) of the first integrated circuit (E1) by the walls (510, 520).

[0147] A process for manufacturing a substrate assembly (400) according to one embodiment of the present disclosure may include applying a heat dissipation material (430) onto an electronic component (E) through an opening (426) of a shield can (420) and covering the opening (426) of the shield can (420) with a shielding sheet (440). As the shielding sheet (440) is placed on the shield can (420), the heat dissipation material (430) may spread into a space surrounded by the walls (510, 520).

[0148] FIG. 17 is a top view of a substrate assembly (400) before a heat dissipation material (430) is disposed, according to one embodiment of the present disclosure. FIG. 18 is a cross-sectional view of the substrate assembly (400) taken along the line F-F' illustrated in FIG. 17, illustrating a manufacturing process of the substrate assembly (400). The description of the walls (421, 422, 423, 424) described with reference to FIGS. 6 to 10 can be substantially equally applied to the walls (610, 620, 630, 640) described with reference to FIGS. 17 and 18, to the extent that they are not disposed with each other.

[0149] Referring to FIGS. 17 and 18, a substrate assembly (400) according to one embodiment of the present disclosure may include a wall (600) disposed on an electronic component (E). The wall (600) may include a first wall (610), a second wall (620), a third wall (630), and / or a fourth wall (640). For example, the wall (600) may be disposed on an edge of a first integrated circuit (E1) of the electronic component (E). As an example, the walls (610, 620, 630, 640) may be rubber or sponge bonded to an edge of the first integrated circuit (E1). As another example, the month (610, 620, 630, 640) may be a heat dissipating member including a phase change material of a paraffin series that is in a solid phase at room temperature (e.g., 25 degrees Celsius) and changes from a solid phase to a liquid phase or a gel phase at a limit temperature (e.g., 45 to 65 degrees Celsius) and heat dissipating particles. The phase change material may be a heat-responsive material depending on temperature, and may be, for example, a thermoplastic polymer. The heat dissipating particles may be carbon fiber, graphene, boron nitride (BN), silicon carbide (SiC), magnesium oxide (MgO), or manganese oxide (ZnO).

[0150] According to one embodiment of the present disclosure, the months (610, 620, 630, 640) can contact an edge of a cover portion (425) defining an opening (426). The months (610, 620, 630, 640) can extend in a loop shape along the edge of the opening (426). As another example, the months (610, 620, 630, 640) can include a plurality of members (610, 620, 630, 640) extending along the edge of the opening (426), such as the months (421, 422, 423, 424) described with reference to FIGS. 6 to 10.

[0151] According to one embodiment of the present disclosure, the walls (610, 620, 630, 640) can at least partially surround the heat dissipation material (430). The walls (610, 620, 630, 640) can contact the shielding sheet (440). The walls (610, 620, 630, 640) allow the heat dissipation material (430) to remain between the shielding sheet (440) and the electronic component (E), more specifically, between the shielding sheet (440) and the first integrated circuit (E1) and the second integrated circuit (E2).

[0152] Referring to FIG. 18, a manufacturing process of a substrate assembly (400) according to one embodiment of the present disclosure may include a process of placing an electronic component (E) on a circuit board (410) and then placing a shield can (420) on the printed circuit board (410) to surround the electronic component (E).

[0153] A manufacturing process of a substrate assembly (400) according to one embodiment of the present disclosure may include a process of placing the walls (610, 620, 630, 640) on an edge of an electronic component (E). The walls (610, 620, 630, 640) may be fixed to an edge of a first integrated circuit (E1). As an example, the walls (610, 620, 630, 640) may be adhered to an edge of the first integrated circuit (E1) through an adhesive member (e.g., double-sided tape).

[0154] A process for manufacturing a substrate assembly (400) according to one embodiment of the present disclosure may include applying a heat dissipation material (430) onto an electronic component (E) through an opening (426) of a shield can (420) and covering the opening (426) of the shield can (420) with a shielding sheet (440). As the shielding sheet (440) is placed on the shield can (420), the heat dissipation material (430) may spread into a space surrounded by the walls (610, 620, 630, 640). According to one embodiment of the present disclosure, the walls (600) may be attached to an edge of the first integrated circuit (E1) and may contact the shielding sheet (440).

[0155] As electronic components (e.g., processors, memory, etc.) become more integrated and their performance becomes more advanced, the amount of heat generated by these components is increasing. Failure to reduce the temperature of these components due to heat generation can impact the operation of electronic devices (e.g., performance degradation due to throttling). Consequently, extensive research is being conducted on the heat dissipation structures of electronic components.

[0156] A problem to be solved in the present disclosure may be minimizing the flow of a fluid heat-dissipating material within an electronic device.

[0157] The problem to be solved in the present disclosure may be to improve heat dissipation performance through a fluid heat dissipation material.

[0158] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0159] An electronic device according to various embodiments of the present disclosure can minimize the flow of a heat-dissipating material within the electronic device by placing a wall surrounding a space in which the heat-dissipating material is placed to limit the flow of the heat-dissipating material.

[0160] Electronic devices according to various embodiments of the present disclosure can improve the heat dissipation performance of electronic components by restricting the flow of heat dissipation materials by arranging a wall surrounding a space where heat dissipation materials are arranged.

[0161] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0162] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (301) and a substrate assembly (400) disposed inside the housing (301).

[0163] According to one embodiment of the present disclosure, the substrate assembly (400) may include a printed circuit board (410) including a first side (411) and a second side (412) facing in an opposite direction of the first side (411).

[0164] According to one embodiment of the present disclosure, the substrate assembly (400) may include an electronic component (E) disposed on the first surface (411).

[0165] According to one embodiment of the present disclosure, the substrate assembly (400) may include a shielding member (S) disposed on the first surface (411) and surrounding the electronic component (E).

[0166] According to one embodiment of the present disclosure, the shielding member (S) may include a shield can (420) including an opening (426) overlapping the electronic component (E) when viewed from above the first surface (411), and a shielding sheet (440) covering the opening (426).

[0167] According to one embodiment of the present disclosure, the substrate assembly (400) may include a heat dissipating material (430) disposed between the electronic component (E) and the shielding sheet (440).

[0168] According to one embodiment of the present disclosure, the substrate assembly (400) may include a wall (421, 422, 423, 424) positioned within the shielding member (S) and extending along an edge of the electronic component (E) to at least partially surround the heat dissipation material (430).

[0169] According to one embodiment of the present disclosure, the shield can (420) may include a cover portion (425) that covers the electronic component (E), defines the opening (426), and is formed integrally with the walls (421, 422, 423, 424).

[0170] According to one embodiment of the present disclosure, the month (421, 422) may include a first portion (421a, 422a) connected to the cover portion (425).

[0171] According to one embodiment of the present disclosure, the month (421, 422) may include a second portion (421b, 422b) bent from the first portion (421a, 422a) toward the first surface (411) of the printed circuit board (410).

[0172] According to one embodiment of the present disclosure, the second portion (421b, 422b) of the month (421, 422) may be supported by the first surface (411) of the printed circuit board (410).

[0173] According to one embodiment of the present disclosure, the electronic component (E) may include a first integrated circuit (E1) disposed on a first surface (411) of the printed circuit board (410).

[0174] According to one embodiment of the present disclosure, the electronic component (E) may include a second integrated circuit (E2) stacked on top of the first integrated circuit (E1) and operatively connected to the first integrated circuit (E1).

[0175] According to one embodiment of the present disclosure, the months (421, 422, 423, 424) may extend along the side (E21, E22, E23, E24) of the second integrated circuit (E2).

[0176] According to one embodiment of the present disclosure, the months (421, 422, 423, 424) may be spaced apart from the side surfaces (E21, E22, E23, E24) of the second integrated circuit (E2) and may face the side surfaces (E21, E22) of the second integrated circuit (E2).

[0177] According to one embodiment of the present disclosure, the moons (421, 422, 423, 424) may be bent from the shield can (420) toward the first surface (411) of the printed circuit board (410), and the ends (421c, 422c, 423c, 424c) may be spaced apart from the edge of the electronic component (E).

[0178] According to one embodiment of the present disclosure, the month (421, 422, 423, 424) may include a first member (421, 422) extending along a first side (E21, E22) of the second integrated circuit (E2).

[0179] According to one embodiment of the present disclosure, the month (421, 422, 423, 424) may include a second member (423, 424) extending along a second side (E23, E24) of the second integrated circuit (E2) intersecting the first side (E21, E22).

[0180] According to one embodiment of the present disclosure, the distance between the first member (421, 422) and the first side (E21, E22) may be greater than the distance between the second member (423, 424) and the second side (E23, E24).

[0181] According to one embodiment of the present disclosure, one of the first member (421, 422) and the second member (423, 424) may be coupled to the shield can (420), and the other may be formed by bending a portion of the shield can (420).

[0182] According to one embodiment of the present disclosure, the moon (510, 520) is attached to an edge (425) of the shield can (420) defining the opening (426) and can contact the shielding sheet (440).

[0183] According to one embodiment of the present disclosure, the moon (510, 520) may be supported by an edge of the first integrated circuit (E1).

[0184] According to one embodiment of the present disclosure, the moon (600) is attached to an edge of the first integrated circuit (E1) and can contact the shielding sheet (440).

[0185] According to one embodiment of the present disclosure, the upper surface (E11, E12, E13) of the first integrated circuit (E1) may include a first area (E13) in which the second integrated circuit (E2) is arranged.

[0186] According to one embodiment of the present disclosure, the upper surface (E11, E12, E13) of the first integrated circuit (E1) may include a second area (E11, E12) in which a portion (431, 432) of the heat dissipation material (430) is disposed.

[0187] According to one embodiment of the present disclosure, a portion (431, 432) of the heat dissipating material (431, 432) may be positioned between the second integrated circuit (E2) and the wall (421, 422).

[0188] According to one embodiment of the present disclosure, the heat dissipating material (430) may be configured to have at least a partial liquid phase or a gel phase.

[0189] According to one embodiment of the present disclosure, the month (510, 520; 600) may include a phase change material that is in a solid phase at room temperature and changes from a solid phase to a liquid phase or a gel phase at a limit temperature.

[0190] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In an electronic device (101), Housing (301); and Includes a substrate assembly (400) placed inside the housing (301), The above substrate assembly (400): A printed circuit board (410) comprising a first side (411) and a second side (412) facing in the opposite direction of the first side (411); Electronic components (E) arranged on the first surface (411); A shielding member (S) disposed on the first surface (411) and surrounding the electronic component (E), comprising a shield can (420) including an opening (426) overlapping the electronic component (E) when viewed from above the first surface (411), and a shielding sheet (440) covering the opening (426); A heat dissipation material (430) placed between the electronic component (E) and the shielding sheet (440); and An electronic device comprising a wall (421, 422, 423, 424) positioned inside the shielding member (S) and extending along the edge of the electronic component (E) to at least partially surround the heat dissipation material (430).

2. In paragraph 1, The above shield can (420) is An electronic device comprising a cover portion (425) formed integrally with the above-described months (421, 422, 423, 424) and defining the opening (426).

3. In paragraph 2, The above months (421, 422) are: A first part (421a, 422a) connected to the above cover part (425); and An electronic device comprising a second portion (421b, 422b) extending from the first portion (421a, 422a) toward the first surface (411) of the printed circuit board (410).

4. In either of paragraph 2 or paragraph 3, The second part (421b, 422b) of the above month (421, 422) is An electronic device placed on the first side (411) of the above printed circuit board (410).

5. In any one of paragraphs 1 to 4, The above electronic component (E) is: A first integrated circuit (E1) arranged on a first surface (411) of the printed circuit board (410); and A second integrated circuit (E2) is stacked on top of the first integrated circuit (E1) and is operatively connected to the first integrated circuit (E1), The above-mentioned months (421, 422, 423, 424) are electronic devices extending along the side (E21, E22, E23, E24) of the second integrated circuit (E2).

6. In paragraph 5, The above months (421, 422, 423, 424) are An electronic device spaced apart from the side surfaces (E21, E22, E23, E24) of the second integrated circuit (E2) and facing the side surfaces (E21, E22) of the second integrated circuit (E2).

7. In any one of paragraphs 5 to 6, The above months (421, 422, 423, 424) are An electronic device extending from the shield can (420) toward the first surface (411) of the printed circuit board (410), and having ends (421c, 422c, 423c, 424c) spaced apart from the edge of the electronic component (E).

8. In any one of paragraphs 5 to 7, The above months (421, 422, 423, 424) are: A first wall (421, 422) extending along the first side (E21, E22) of the second integrated circuit (E2); and A second wall (423, 424) extending along the second side (E23, E24) of the second integrated circuit (E2) intersecting the first side (E21, E22), An electronic device in which the distance between the first month (421, 422) and the first side (E21, E22) is greater than the distance between the second month (423, 424) and the second side (E23, E24).

9. In paragraph 8, An electronic device in which one of the first month (421, 422) and the second month (423, 424) is coupled to the shield can (420), and the other of the first month (421, 422) and the second month (423, 424) is bent from the shield can (420).

10. In either of paragraphs 5 or 6, The above months (510, 520) are An electronic device bonded to the edge (425) of the shield can (420) defining the opening (426) and in contact with the shielding sheet (440).

11. In paragraph 10, The above-mentioned month (510, 520) is an electronic device arranged at the edge of the first integrated circuit (E1).

12. In either of paragraphs 5 or 6, The above month (600) An electronic device attached to the edge of the first integrated circuit (E1) and in contact with the shielding sheet (440).

13. In any one of paragraphs 5 to 12, The upper surface (E11, E12, E13) of the first integrated circuit (E1) is: A first area (E13) in which the second integrated circuit (E2) is placed; and It includes a second area (E11, E12) in which a part (431, 432) of the above heat dissipating material (430) is arranged, The second region (E11, E12) is an electronic device located between the second integrated circuit (E2) and the wall (421, 422).

14. In any one of paragraphs 1 to 13, The above heat dissipating material (430) is An electronic device comprising a material that is at least partially in a liquid phase or gel phase.

15. In paragraph 14, The above months (510, 520; 600) are, An electronic device comprising a phase change material configured to be a solid phase at room temperature and a liquid phase or gel phase at a limiting temperature.

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