This disclosure provides a
cutting head, a
cutting device, a substrate glass
cutting system, and a
glass production system. The cutting head includes a base, a driving
assembly, a buffer frame, a buffer driving
assembly, and a cutting wheel
assembly. A movable part is slidably disposed on the base along a first direction. The driving assembly is connected to the movable part to drive the movable part to reciprocate relative to the base along the first direction. The buffer frame is disposed on the movable part to be able to reciprocate relative to the base along the first direction with the movable part. The buffer driving assembly is disposed on the buffer frame, and the driving end of the buffer driving assembly is disposed along the first direction. The cutting wheel assembly is fixed to the driving end of the buffer driving assembly and is used to
cut the workpiece to be
cut. During the movement of the cutting wheel assembly along the buffer frame along the first direction, a first driving space is formed in the buffer driving assembly to have a first driving tendency along the first direction. When the cutting wheel assembly moves along the first direction to contact the workpiece to be
cut, the first driving space is compressed in the opposite direction of the first direction.