The invention discloses a preparation method of a carbon fiber uniformly-electroplated copper layer. The method comprises the steps: (1) desizing carbon fibers; (2) fixing the carbon fibers; and (3) taking the carbon fibers as a cathode and a phosphor copper plate as an anode, connecting a circuit, putting the connected circuit into an electroplating bath containing an electroplating liquid, adjusting the distance between the cathode and the anode to be 4-10 cm, keeping the current density to be 0.80-1.00 mA / cm<2>, the voltage to be 1.5-3.0 V and the electroplating temperature to be 10-30 DEGC, and electroplating for 60-90 min, wherein the electroplating liquid comprises CuSO4.5H2O, C4H4O6KNa.4H2O, C6H5Na3O7.2H2O, KNO3, polyethylene glycol, NaCl and water. According to the method, by controlling the components, the concentration and the current density of the electroplating liquid, the thickness, the uniformity and the surface appearance of the electroplated carbon fiber copper plating layer can be changed, the binding force of the plating layer is good and uniform, and the carbon fibers cannot be bonded.