The application provides a
temperature control device for
semiconductor process, which comprises a compressor
temperature control unit, a Peltier
temperature control unit and a medium circulation unit. The compressor temperature
control unit comprises a compressor, a condenser and an
evaporator. The Peltier temperature
control unit comprises a Peltier sheet, a circulating medium
heat exchanger connected with the
cold side of the Peltier sheet and a
refrigerant heat exchanger connected with the hot side of the Peltier sheet. The medium circulation unit circulates medium, and the medium flows through the circulating medium
heat exchanger. The exhaust port of the compressor is connected with the inlet of the condenser, the outlet of the condenser is divided into a first
refrigerant branch and a second
refrigerant branch, the first refrigerant
branch is connected with the refrigerant inlet of the
evaporator, the second refrigerant branch is connected with the refrigerant inlet of the refrigerant heat exchanger, and the refrigerant outlet of the
evaporator and the refrigerant outlet of the refrigerant heat exchanger are combined and connected with the suction port of the compressor. The device greatly improves the heat dissipation capacity of the hot side of the Peltier sheet, thereby reducing the
working temperature of the Peltier sheet and improving the
refrigeration efficiency.