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A cleaning solution after chemical mechanical polishing

PendingCN122278562AAchieve homogeneous stabilitySolve the problem of homogeneous stabilityOrganic solventWafering
This invention discloses a water-based cleaning solution comprising: an organic solvent that is poorly soluble in water, a water-soluble co-solvent, a pH adjuster, and water. The organic solvent that is poorly soluble in water is an aromatic hydrocarbon, a halogenated hydrocarbon, or an ester. This cleaning solution, rich in a highly dissolving organic solvent, can rapidly and efficiently remove organic residues and polymers after polishing, while exhibiting excellent stability. Thanks to its unique formulation and efficient cleaning capabilities, the cleaning solution of this invention shows broad application prospects in fields such as semiconductor wafer cleaning.
Owner:NINGBO ANJI MICROELECTRONICS TECHNOLOGY CO LTD

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