This invention discloses a water-based cleaning solution comprising: an
organic solvent that is poorly soluble in water, a water-soluble co-
solvent, a pH adjuster, and water. The
organic solvent that is poorly soluble in water is an
aromatic hydrocarbon, a halogenated
hydrocarbon, or an ester. This cleaning solution, rich in a highly dissolving
organic solvent, can rapidly and efficiently remove organic residues and polymers after
polishing, while exhibiting excellent stability. Thanks to its unique formulation and efficient cleaning capabilities, the cleaning solution of this invention shows broad application prospects in fields such as
semiconductor wafer cleaning.